Liquid crystal display module and projector

Abstract

A liquid crystal display module (500) and a projector. The liquid crystal display module (500) comprises a liquid crystal display panel (10); the liquid crystal display panel (10) has a display area (AA) and a non-display area surrounding the display area (AA); the display area (AA) has a plurality of light-emitting areas (A1) and a non-light-emitting area (A2) located between the light-emitting areas (A1); the non-display area comprises a first bezel area (B1), a second bezel area (B2), a third bezel area (B3), and a fourth bezel area (B4) which sequentially surround the display area (AA); the first bezel area (B1) is provided with a driver IC; the liquid crystal display panel (10) comprises an array substrate (1) and a color film substrate (2) which are arranged opposite to each other; at least one of the array substrate (1) and the color film substrate (2) comprises a first Peltier device (3) located in at least one bezel area among the second bezel area (B2), the third bezel area (B3), and the fourth bezel area (B4); the first Peltier device (3) comprises a heat dissipation pad (31), a first semiconductor layer (32), and a thermally-conductive layer (33) which are sequentially stacked; and the liquid crystal display panel (10) further comprises a plurality of first heat dissipation strips (4) located in the non-light-emitting area (A2), wherein the first heat dissipation strips (4) extend to corresponding bezel areas to be electrically connected to the heat dissipation pad (31).

Description

Liquid crystal display module and projector Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a liquid crystal display module and a projector. Background Art

[0002] Liquid crystal display (LCD) is a common display technology that operates based on the optical properties of liquid crystal molecules and the radiation from a backlight source. Display panels made with this technology can be used in flat-panel televisions and LCD projectors.

[0003] Summary of the Invention

[0004] The present disclosure provides a liquid crystal display module and a projector, and the specific solutions are as follows:

[0005] An embodiment of the present disclosure provides a liquid crystal display module, comprising a liquid crystal display panel, the liquid crystal display panel having a display area and a non-display area surrounding the display area, the display area having a plurality of luminous areas and non-luminous areas located between the luminous areas, the non-display area comprising a first frame area, a second frame area, a third frame area, and a fourth frame area sequentially surrounding the display area, the first frame area being provided with a driver IC; wherein,

[0006] The liquid crystal display panel includes an array substrate and a color filter substrate arranged opposite to each other, at least one of the array substrate and the color filter substrate includes a first Peltier device located in at least one of the second frame area, the third frame area, and the fourth frame area, the first Peltier device including a heat dissipation pad, a first semiconductor layer, and a heat conductive layer stacked in sequence;

[0007] The liquid crystal display panel further includes a plurality of first heat dissipation bars located in the non-luminous area, wherein the first heat dissipation bars extend to the corresponding frame area and are electrically connected to the heat dissipation pads.

[0008] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the color filter substrate and the array substrate both include the first Peltier device, and the first Peltier device on the color filter substrate and the first Peltier device on the array substrate are located in different border areas.

[0009] In a possible implementation, in the above-mentioned liquid crystal display module provided by an embodiment of the present disclosure, the plurality of first heat dissipation bars are cross-arranged.

[0010] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the color filter substrate includes a black matrix, the multiple first heat dissipation strips are reused as the black matrix, and the first Peltier device is arranged on the color filter substrate.

[0011] In a possible implementation, in the above-mentioned liquid crystal display module provided by an embodiment of the present disclosure, the first heat dissipation bar includes an organic heat reflective layer and a metal heat conductive layer located on a side of the organic heat reflective layer facing the array substrate.

[0012] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the array substrate includes the first heat dissipation bar and a source / drain metal layer located on the side of the first heat dissipation bar facing away from the color film substrate, and the first Peltier device is arranged on the array substrate.

[0013] In a possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, the array substrate further includes: a pixel electrode electrically connected to the source / drain metal layer and located in the same film layer as the source / drain metal layer, a first passivation layer located between the source / drain metal layer and the first heat dissipation bar, a second passivation layer located on the side of the first heat dissipation bar facing the color film substrate, and a common electrode layer located on the side of the second passivation layer facing the color film substrate.

[0014] In one possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the array substrate includes the first heat dissipation bar and a source / drain metal layer located on a side of the first heat dissipation bar facing away from the color filter substrate, and a plurality of second heat dissipation bars arranged crosswise between the first heat dissipation bar and the source / drain metal layer; the second heat dissipation bar overlaps with the first heat dissipation bar;

[0015] The cross-arranged plurality of second heat dissipation bars have a plurality of overlapping areas. The array substrate further includes a second semiconductor layer located between the first heat dissipation bars and the second heat dissipation bars and located in each of the overlapping areas. The type of the second semiconductor layer is opposite to that of the first semiconductor layer.

[0016] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the array substrate further includes: a pixel electrode electrically connected to the source / drain metal layer and located in the same film layer as the source / drain metal layer, a common electrode layer located between the source / drain metal layer and the second heat dissipation bar, a first passivation layer located between the source / drain metal layer and the common electrode layer, a second passivation layer located between the common electrode layer and the second heat dissipation bar, and a third passivation layer located between the second heat dissipation bar and the first heat dissipation bar; wherein,

[0017] The third passivation layer has a through hole in each of the overlapping regions, and the second semiconductor layer is filled in the through hole.

[0018] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the array substrate further includes an active layer located on the side of the source / drain metal layer facing away from the color film substrate, and the orthographic projection of the first heat dissipation strip on the color film substrate covers the orthographic projection of the active layer on the color film substrate.

[0019] In a possible implementation, in the above-mentioned liquid crystal display module provided by an embodiment of the present disclosure, the first heat dissipation strip is multiplexed as a data line of the array substrate.

[0020] In one possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the array substrate also includes an ESD circuit located in the third border area, the ESD circuit includes a plurality of first switches connected in series, each of the data lines is electrically connected to the first poles of at least two first switches, the gate of one of the two first switches is electrically connected to the heat dissipation pad and the data line, respectively, the second poles of the two first switches are both electrically connected to the common electrode layer of the array substrate, and the gate of the other of the two first switches is electrically connected to the common electrode layer.

[0021] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, the array substrate also includes a first voltage input line located in the non-display area, the heat dissipation pad is electrically connected to one end of the first voltage input line, the other end of the first voltage input line is electrically connected to the first voltage pad on the driver IC, and the thermal conductive layer is electrically connected to the second voltage pad on the driver IC.

[0022] In a possible implementation, in the above-mentioned liquid crystal display module provided by an embodiment of the present disclosure, the heat dissipation pad and the first heat dissipation bar are made of the same layer and the same material.

[0023] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the number of the heat dissipation pads set in at least one of the second border area, the third border area and the fourth border area is multiple, and the multiple heat dissipation pads set in each border area are arranged at intervals along the length direction of the border area in which they are located.

[0024] In a possible implementation, in the above-mentioned liquid crystal display module provided by the embodiment of the present disclosure, each of the heat dissipation pads is electrically connected to a plurality of the first heat dissipation bars.

[0025] In a possible implementation, in the above-mentioned liquid crystal display module provided by an embodiment of the present disclosure, the array substrate further includes second switches corresponding one-to-one with the first heat dissipation bars, and the second switches are located in the corresponding border area;

[0026] The plurality of second switches are divided into a first group of second switches and a second group of second switches, wherein the second switches in the first group and the second group are alternately arranged;

[0027] The gate of each of the second switches in the first group is electrically connected to the first control line, and the gate of each of the second switches in the second group is electrically connected to the second control line;

[0028] The first electrode of each second switch in the first group and the first electrode of each second switch in the second group are both electrically connected to the voltage input line corresponding to the heat dissipation pad;

[0029] The second electrodes of the second switches of the first group and the second electrodes of the second switches of the second group are electrically connected to the corresponding heat dissipation pads, respectively.

[0030] In one possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, the liquid crystal display module further includes a rectangular frame, wherein the rectangular frame is a hollow structure having three side slots, wherein the slot on each side is composed of a first frame and a second frame disposed opposite to each other of the rectangular frame, and a side wall connecting the outer edges of the first frame and the second frame, and the liquid crystal display panel is engaged in the three side slots;

[0031] The heat-conducting layer of the array substrate is embedded in the first frame, and the heat-conducting layer of the color filter substrate is embedded in the second frame.

[0032] In a possible implementation, the liquid crystal display module provided in the embodiment of the present disclosure further includes: a first thermal insulation layer located between the color filter substrate and the first frame, and / or a second thermal insulation layer located between the array substrate and the second frame.

[0033] In a possible implementation, the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure further includes a whole-machine heat dissipation system located outside the rectangular frame, and the heat conductive layer of the array substrate and the heat conductive layer of the color film substrate are both electrically connected to the whole-machine heat dissipation system.

[0034] Correspondingly, an embodiment of the present disclosure also provides a projector, which includes a light source assembly, a reflective cup, a rear Fresnel lens, insulating glass, a liquid crystal display module, a front Fresnel lens, a reflector and a lens arranged in sequence along the light emission direction. The liquid crystal display module is the liquid crystal display module described in any of the above embodiments provided in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a plan view of a color filter substrate in a liquid crystal display module provided by an embodiment of the present disclosure;

[0036] FIG2 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to FIG1 ;

[0037] FIG3 is a plan view of an array substrate in a liquid crystal display module provided by an embodiment of the present disclosure;

[0038] FIG4 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to FIG3;

[0039] FIG5 is a plan view of a color filter substrate and an array substrate in a liquid crystal display module provided by an embodiment of the present disclosure;

[0040] FIG6 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to FIG5;

[0041] FIG7 is a schematic diagram of a principle of the Peltier effect;

[0042] FIG8 is another schematic diagram of the principle of the Peltier effect;

[0043] FIG9 is a schematic cross-sectional view taken along the CC' direction in FIG1;

[0044] FIG10 is a schematic diagram of the three-dimensional structure of the rectangular frame in FIG2, FIG4 and FIG6;

[0045] FIG11 is a schematic diagram of the heat dissipation principle of the color filter substrate shown in FIG9 ;

[0046] FIG12 is another schematic plan view of an array substrate in a liquid crystal display module provided by an embodiment of the present disclosure;

[0047] FIG13 is a schematic cross-sectional view taken along the CC' direction in FIG12;

[0048] FIG14 is a schematic diagram of the heat dissipation principle of the array substrate shown in FIG13;

[0049] FIG15 is another schematic plan view of an array substrate in a liquid crystal display module provided by an embodiment of the present disclosure;

[0050] FIG16 is a schematic cross-sectional view taken along the CC' direction in FIG15;

[0051] FIG17 is a schematic diagram of the heat dissipation principle of the array substrate shown in FIG16 ;

[0052] FIG18 is a schematic cross-sectional view taken along the CC' direction in FIG3;

[0053] FIG19 is a schematic diagram of a partial structure of an ESD circuit 60;

[0054] FIG20 is a schematic diagram of the heat dissipation principle of the array substrate shown in FIG18 ;

[0055] FIG21 is a schematic diagram of an equivalent circuit of a border region where a first Peltier device is provided;

[0056] FIG22 is an operation timing diagram of the first group of first Peltier devices and the second group of first Peltier devices;

[0057] FIG23 is a schematic structural diagram of a projector provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0058] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0059] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “include” or “comprise” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0060] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0061] An LCD projector typically consists of a light source assembly, a reflector cup, a rear Fresnel lens, thermally insulating glass, a liquid crystal display module (LCD) module, a front Fresnel lens, a reflector, and a lens. The light source assembly and LCD module are the core components of the projector. LCD projectors typically use a color filter substrate for light input. To ensure projection brightness and visual quality, the light source power is often set very high. High-intensity light absorbed by the LCD module generates a significant amount of heat, which creates a high-temperature environment in the LCD module and accelerates the performance degradation of various components. For the LCD module, the high light intensity of the light source impinges on the thin-film transistor (TFT) channels within the LCD module. This high temperature increases the leakage current of the TFTs, leading to adverse effects such as residual image aberration and crosstalk in the LCD projector. Although the thermally insulating glass in front of the LCD module can partially block some heat transfer to the LCD module, it also results in a certain degree of brightness loss (1% to 5%), reducing the product's competitiveness. In addition, although the whole machine is equipped with cooling units such as fans and copper tubes, most of these units are used to dissipate heat from the light source and cannot effectively dissipate the heat on the LCD display module. However, the existing solution is generally based on adding a light shielding layer to the channel of the thin-film transistor to prevent strong light from directly hitting the channel in order to improve the defect, but ignores the fact that light-induced high temperature is also an important factor affecting crosstalk. At the same time, the light source of LCD projector products is gradually being upgraded in power, and the impact of high temperature problems will become more prominent. Therefore, how to perform internal heat dissipation on the LCD display module of the LCD projector without reducing the product transmittance and increasing costs is a problem that technicians in this field urgently need to solve.

[0062] In order to solve the above problems, the embodiment of the present disclosure provides a liquid crystal display module, as shown in Figures 1 to 6, Figure 1 is a planar schematic diagram of a color filter substrate in the liquid crystal display module, Figure 2 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to Figure 1, Figure 3 is a planar schematic diagram of an array substrate in the liquid crystal display module, Figure 4 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to Figure 3, Figure 5 is a planar schematic diagram of the color filter substrate and the array substrate in the liquid crystal display module, and Figure 6 is a cross-sectional schematic diagram of the liquid crystal display module corresponding to Figure 5. The liquid crystal display module includes a liquid crystal display panel 10, the liquid crystal display panel 10 has a display area AA and a non-display area surrounding the display area AA, the display area AA has a plurality of light-emitting areas A1 and non-light-emitting areas A2 located between the light-emitting areas A1, the non-display area includes a first frame area B1, a second frame area B2, a third frame area B3 and a fourth frame area B4 surrounding the display area AA in sequence, and the first frame area B1 is provided with a driver IC; wherein,

[0063] The liquid crystal display panel 10 includes an array substrate 1 and a color filter substrate 2 arranged opposite to each other. At least one of the array substrate 1 and the color filter substrate 2 includes a first Peltier device 3 located in at least one of a second border area B2, a third border area B3, and a fourth border area B4. The first Peltier device 3 includes a heat dissipation pad 31, a first semiconductor layer 32, and a heat conductive layer 33 stacked in sequence.

[0064] The liquid crystal display panel 10 further includes a plurality of first heat dissipation bars 4 located in the non-luminescent area A2 . The first heat dissipation bars 4 extend to corresponding frame areas and are electrically connected to the heat dissipation pads 31 .

[0065] The above-mentioned liquid crystal display module provided by the embodiment of the present disclosure conducts the heat of the display area to the frame area through multiple first heat dissipation bars in the display area, that is, metal wires are used for heat conduction, which can avoid the display area of ​​the array substrate and / or color film substrate being affected by uneven temperature distribution; and a first Peltier device is set in the frame area, and the first heat dissipation bar is electrically connected to the heat dissipation pad of the first Peltier device, so that the first heat dissipation bar conducts the heat of the display area to the first Peltier device in the frame area, and the first Peltier device can create a thermal diffusion gradient to accelerate heat conduction; in this way, the heat conduction layer of the first Peltier device can be connected to the overall heat dissipation system of the liquid crystal display module, accelerating the heat dissipation of the display area, thereby alleviating the problem of increased leakage current of the thin film transistor caused by high temperature and reducing the degree of crosstalk. In addition, the first heat dissipation bar and the heat dissipation pad avoid the light-emitting area and will not affect the transmittance of the liquid crystal display module. Compared with the traditional design, the embodiment of the present disclosure has the technical characteristics of simple structure and fast heat dissipation.

[0066] As shown in Figures 7 and 8, the two ends of an N-type or P-type semiconductor are connected to a conductive layer to form a path, which can form a Peltier effect. For example, the two ends of an N-type or P-type semiconductor are connected to the heat dissipation pad and the heat conduction layer of the present disclosure. Taking the P-type semiconductor shown in Figure 8 as an example, the heat dissipation pad is the positive electrode and the heat conduction layer is the negative electrode. Under the action of an external electric field, the holes When flowing from the positive to the negative pole, the holes in the heatsink need to absorb energy from the heatsink, increasing their potential energy before they can enter the P-type semiconductor. This causes the temperature at the heatsink to drop, forming a cold spot (cold junction). However, when the holes enter the thermally conductive layer, they release energy, causing the temperature at the thermally conductive layer to rise, forming a hot spot (hot junction). When the power supply's positive and negative poles are fixed, the carrier flow direction in the N-type semiconductor is opposite to that in the P-type semiconductor, resulting in opposite cooling and hot spots. Flipping the polarity reverses the cooling and hot spots. Therefore, the embodiments of the present disclosure can utilize the Peltier effect to dissipate the heat from the display area. For example, when the first semiconductor layer adopts a P-type semiconductor, a positive voltage can be applied to the heat dissipation pad and a negative voltage can be applied to the thermal conductive layer. In this way, the heat from the display area is transferred to the heat dissipation pad through the first heat dissipation bar, and then the Peltier effect is used to accelerate the dissipation of the heat from the display area. For example, when the first semiconductor layer adopts an N-type semiconductor, a negative voltage can be applied to the heat dissipation pad and a positive voltage can be applied to the thermal conductive layer. In this way, the heat from the display area is transferred to the heat dissipation pad through the first heat dissipation bar, and then the Peltier effect is used to accelerate the dissipation of the heat from the display area.

[0067] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 1 and 2, only the color filter substrate 2 may include the first Peltier device 3; as shown in Figures 3 and 4, only the array substrate 1 may include the first Peltier device 3; as shown in Figures 5 and 6, both the color filter substrate 2 and the array substrate 1 may include the first Peltier device 3.

[0068] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 1, 2, and 9, Figure 9 is a schematic cross-sectional view taken along the CC' direction in Figure 1. The first Peltier device 3 is disposed solely on the color filter substrate 2. The color filter substrate 2 generally includes a first substrate 21 and a black matrix (BM) disposed on the side of the first substrate 21 facing the array substrate 1. The black matrix (BM) is used to define multiple light-emitting zones, each of which contains a color filter of a different color (e.g., a red color filter R, a green color filter G, and a blue color filter B). In the embodiment of the present disclosure, multiple first heat dissipation bars 4 can be arranged in a cross-pattern, thereby achieving heat dissipation in all directions of the color filter substrate; and multiple first heat dissipation bars 4 can be reused as the black matrix, i.e., in this embodiment, the first heat dissipation bars 4 are used in place of the BM to achieve pixel-level thermal insulation. The first heat dissipation bars 4 are located only in the original BM position and do not pass through the effective pixel opening area (i.e., the light-emitting area), thereby preventing transmittance loss. Furthermore, the present disclosure utilizes the first heat dissipation strips 4 to be reused as a black matrix, thereby saving the mask for making the black matrix and achieving heat dissipation for the color filter substrate without increasing the thickness of the color filter substrate.

[0069] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 1, 2, and 9, the first heat dissipation bar 4 may include an organic heat reflective layer 41 and a metal heat conductive layer 42 located on the side of the organic heat reflective layer 41 facing the array substrate 1. Specifically, when a high-intensity light source is incident from the color filter substrate 2, heat easily accumulates and is difficult to dissipate because the light shielding layer (BM) of a traditional color filter substrate is made of a black resin material. However, the embodiments of the present disclosure use the first heat dissipation bar 4 in place of the traditional BM. Due to the high thermal conductivity of the metal in the metal heat conductive layer 42, heat from the display area AA is transferred through the metal heat conductive layer 42 to the heat dissipation pad 31 in the frame area. The organic heat reflective layer 41 can reflect some of the heat from the display area AA away. In this way, the first heat dissipation bar 4 constitutes the first "line of defense" to prevent heat accumulation in the display area AA, thereby accelerating heat transfer from the display area AA.

[0070] Optionally, the material of the metal heat-conducting layer 42 may include at least one of Al, Cu, Mo, etc., and the material of the organic heat-reflecting layer 41 may be an organic material such as polyester film (PET).

[0071] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 1, 2 and 9, the heat dissipation pad 31 is in the same layer and material as the first heat dissipation bar 4. Optionally, in this embodiment, the heat dissipation pad 31 can be in the same layer and material as the metal heat conductive layer 42. In this way, it is only necessary to change the original composition pattern when forming the metal heat conductive layer 42, and the pattern of the heat dissipation pad 31 and the metal heat conductive layer 42 can be formed through a single composition process, without adding a process for preparing the heat dissipation pad 31 separately, which can simplify the preparation process flow, save production costs, and improve production efficiency. Therefore, the structure of the heat dissipation pad 31 of the first Peltier device 3 set on the color filter substrate 2 in the embodiment of the present disclosure is consistent with the process of the color filter substrate 2, and there is no need to add a mask, which reduces production costs.

[0072] Specifically, as shown in FIG1 , the plurality of first heat dissipation bars 4 arranged crosswise may be an integrated metal grid structure.

[0073] In a possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG1 , the number of heat dissipation pads 31 provided in at least one of the second frame area B2, the third frame area B3, and the fourth frame area B4 can be multiple, and the multiple heat dissipation pads 31 provided in each frame area are arranged at intervals along the length direction of the frame area in which they are located. In this way, the frame area is composed of multiple first Peltier devices 3 connected in series (because each heat dissipation pad 31 is electrically connected to the grid-shaped first heat dissipation bar 4), which can improve the heat dissipation effect of the display area AA; and the current signal for controlling the operation of the first Peltier device 3 can be controlled separately, and the voltage is input to the heat dissipation pad 31 of the first Peltier device 3 through the first heat dissipation bar 4. In order to avoid the voltage signal on the first heat dissipation bar 4 affecting the normal display, the working time of the first Peltier device 3 needs to be staggered with the display time, that is, the first Peltier device 3 only dissipates heat to the liquid crystal display panel during the non-display time to avoid affecting the normal display.

[0074] In a possible implementation, in order to further improve the heat dissipation effect of the display area, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG. 1 , each heat dissipation pad 31 can be electrically connected to multiple first heat dissipation bars 4 .

[0075] It should be noted that the color filter substrate shown in Figure 1 is based on the example of setting the first Peltier device 3 in the second border area B2 and the third border area B3. Of course, the first Peltier device 3 can also be set in the fourth border area B4 at the same time; of course, the first Peltier device 3 can also be set in the second border area B2 and the fourth border area B4, or in the third border area B3 and the fourth border area B4, or in the second border area B2 only, or in the third border area B3 only, or in the fourth border area B4 only.

[0076] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG2 , the liquid crystal display module further includes a rectangular frame 20. FIG10 is a schematic diagram of the three-dimensional structure of the rectangular frame 20 in FIG2 . The rectangular frame 20 is a hollow structure with three side slots. Each side slot is composed of a first frame 201 and a second frame 202 disposed oppositely, and a sidewall 203 connecting the outer edges of the first frame 201 and the second frame 202. The liquid crystal display panel 10 is engaged with the three side slots. The thermal conductive layer 33 of the color filter substrate 2 is embedded in the second frame 202. In this way, the thermal conductive layer 33 of the first Peltier device 3 can be prefabricated within the second frame 202. When the liquid crystal display panel 10 is engaged with the slot, the first semiconductor layer 32 in the border region of the color filter substrate 2 contacts the thermal conductive layer 33 after engagement, forming the first Peltier device 3. Since the heat conducting layer 33 of the first Peltier device 3 is formed in the slot of the rectangular frame 20 , compared with manufacturing the heat conducting layer 33 on the color filter substrate 2 , a mask can be saved, thereby reducing manufacturing costs.

[0077] Of course, in specific implementation, the heat conducting layer 33 of the first Peltier device 3 of the color filter substrate 2 can also be manufactured in the process of the color filter substrate 2, which is conducive to the electrical connection between the heat conducting layer 33 and the voltage pad on the driver IC.

[0078] It should be noted that FIG2 is a cross-sectional view along the DD′ direction after the liquid crystal display panel is engaged in the three-side slots of the rectangular frame 20 shown in FIG10 .

[0079] In one possible implementation, the liquid crystal display module provided in the embodiments of the present disclosure, as shown in FIG2 , further includes a heat dissipation system 30 located outside the rectangular frame 20. The thermal conductive layer 33 of the color filter substrate 2 can be electrically connected to the heat dissipation system 30. The thermal conductive layer 33 transfers heat to the heat dissipation system 30. Due to the formation of a certain temperature gradient between the heat dissipation pad 31 (cold end) and the thermal conductive layer 33 (hot end), the heat transfer from the display area AA to the heat dissipation pad 31 via the first heat dissipation bar 4 is accelerated.

[0080] In a possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG2 , the heat dissipation system 30 of the whole machine can be a fan or a copper pipe, etc.

[0081] It should be noted that Figure 10 is only a schematic illustration of the structure of the rectangular frame 20. The thickness of each part of the first frame 201 and the second frame 202 is determined according to the degree of engagement with the liquid crystal display panel 10. It is necessary to ensure that the thermal conductive layer 33 in the card slot can contact the first semiconductor layer 32 on the color filter substrate 2.

[0082] Optionally, the rectangular frame 20 may be made of foam material, and the heat-conducting layer 33 may be connected to the peripheral heat dissipation system 30 of the entire machine through a through hole penetrating the rectangular frame 20 .

[0083] In one possible implementation, the liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG2 , further includes a first thermal insulation layer 40 located between the color filter substrate 2 and the first frame 201. Specifically, the material of the first thermal insulation layer 40 can be thermal insulation cotton to prevent external heat from being transferred into the liquid crystal display panel.

[0084] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 1, 2 and 9, the first semiconductor layer 32 can be an N-type semiconductor layer. Since the heat dissipation pad 31 is a cold end, the heat dissipation pad 31 needs to be the negative electrode and the thermal conductive layer 33 is the positive electrode; in this way, the metal thermal conductive layer 42 of the first heat dissipation bar 4 can be led to the array substrate 1 through a conductive ball and electrically connected to the negative voltage pad of the driving IC on the array substrate 1, that is, a negative voltage is input to the metal thermal conductive layer 42 through the driving IC to the heat dissipation pad 31, and the thermal conductive layer 33 can be led to the array substrate 1 through a conductive ball and electrically connected to the positive voltage pad of the driving IC on the array substrate 1. Of course, the first semiconductor layer 32 can also be a P-type semiconductor layer. Since the heat dissipation pad 31 is the cold end, the heat dissipation pad 31 needs to be the positive electrode and the thermal conductive layer 33 needs to be the negative electrode; in this way, the metal thermal conductive layer 42 of the first heat dissipation bar 4 can be led to the array substrate 1 through the conductive ball and electrically connected to the positive voltage pad of the driving IC on the array substrate 1, that is, the positive voltage is input to the metal thermal conductive layer 42 through the driving IC to the heat dissipation pad 31, and the thermal conductive layer 33 can be led to the array substrate 1 through the conductive ball and electrically connected to the negative voltage pad of the driving IC on the array substrate 1.

[0085] As shown in Figure 11, Figure 11 is a schematic diagram of the heat dissipation principle of the color filter substrate shown in Figure 9. When strong light from the light source assembly is incident on the liquid crystal display panel, the metal heat conductive layer 42 of the first heat dissipation bar 4 in the color filter substrate 2 transfers heat from the display area AA to the heat dissipation pad 31 in the frame area. Furthermore, the organic heat reflective layer 41 can reflect some of the heat generated by the strong light (arrow F1) incident on the display area AA (arrow F2), preventing heat accumulation in the display area AA. At this time, the heat dissipation pad 31 serves as the cold end of the first Peltier device 3. Heat is transferred from the heat dissipation pad 31 to the heat conductive layer 33 in the card slot, and then to the overall heat dissipation system 30. In addition, due to the formation of a certain temperature gradient between the cold end and the hot end, the process of heat transfer from the display area AA to the heat dissipation pad 31 via the first heat dissipation bar 4 is also accelerated.

[0086] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 4, 12 and 13, Figure 12 is another planar schematic diagram of the array substrate in the liquid crystal display module, and Figure 13 is a cross-sectional schematic diagram along the CC' direction in Figure 12. The first Peltier device 3 is only arranged on the array substrate 1, that is, the array substrate 1 includes a first heat dissipation bar 4, and the array substrate 1 also includes a source-drain metal layer 11 located on the side of the first heat dissipation bar 4 away from the color filter substrate 2. Multiple first heat dissipation bars 4 can be arranged in a cross-arrangement. In this embodiment, cross-arranged first heat dissipation bars 4 are arranged above the source-drain metal layer 11 of the array substrate 1. In this way, the heat of the display area AA will be transferred to the heat dissipation pad 31 in the frame area through the cross-arranged first heat dissipation bars 4, so that heat dissipation in all directions of the array substrate can be achieved, and it is more flexible to use.

[0087] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 12, and 13, the array substrate 1 further includes an active layer 12 located on the side of the source / drain metal layer 11 facing away from the color filter substrate 2, and the orthographic projection of the first heat dissipation bar 4 on the color filter substrate 2 covers the orthographic projection of the active layer 12 on the color filter substrate 2. In this way, the first heat dissipation bar 4 can be used as a light shielding layer. Compared with a traditional BM (light shielding layer), the first heat dissipation bar 4 is closer to the active layer 12 (channel region), so the light shielding effect is better, which can effectively prevent strong light from entering the channel region of the active layer 12 and causing an increase in the leakage current of the thin film transistor. Therefore, the embodiments of the present disclosure can protect the thin film transistors of the array substrate from both light shielding and heat dissipation, thereby reducing the degree of crosstalk.

[0088] In a possible implementation, in the liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG12 , the plurality of cross-arranged first heat dissipation bars 4 are an integrated metal grid structure.

[0089] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG13 , the array substrate 1 further includes: a pixel electrode 13 electrically connected to the source / drain metal layer 11 and located in the same film layer as the source / drain metal layer 11; a first passivation layer PVX1 located between the source / drain metal layer 11 and the first heat dissipation bar 4; a second passivation layer PVX2 located on the side of the first heat dissipation bar 4 facing the color filter substrate 2; and a common electrode layer 14 located on the side of the second passivation layer PVX2 facing the color filter substrate 2. In this embodiment, only a passivation layer and the film layer where the first heat dissipation bar 4 is located need to be added to the source / drain metal layer 11 and the common electrode layer 14. Therefore, in this embodiment, only a mask for making the first heat dissipation bar 4 needs to be added.

[0090] In one possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, as shown in FIG13 , the array substrate 1 further includes: a second substrate 15 located on the side of the active layer 12 facing away from the source / drain metal layer 11 , a gate layer 16 located between the active layer 12 and the second substrate 15 , and a gate insulating layer 17 located between the gate layer 16 and the active layer 12 .

[0091] In one possible implementation, in the liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG13 , the heat dissipation pad 31 can be formed from the same layer and material as the first heat dissipation bar 4. This allows the heat dissipation pad 31 and the first heat dissipation bar 4 to be formed in a single patterning process simply by changing the original patterning pattern when forming the first heat dissipation bar 4. This eliminates the need for a separate process for preparing the heat dissipation pad 31, simplifying the manufacturing process, saving production costs, and improving production efficiency. Therefore, the structure of the heat dissipation pad 31 of the first Peltier device 3 provided on the array substrate 1 in the embodiment of the present disclosure is compatible with the array substrate 1 process, eliminating the need for a mask and reducing production costs.

[0092] Optionally, the material of the first heat dissipation bar 4 may be Cu which has a better heat dissipation effect, but is certainly not limited thereto.

[0093] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG12 , the number of heat dissipation pads 31 provided in at least one of the second border area B2, the third border area B3, and the fourth border area B4 can be multiple, and the multiple heat dissipation pads 31 provided in each border area are spaced apart along the length direction of the border area in which they are located. In this way, the border area is composed of multiple first Peltier devices 3 connected in series (because each heat dissipation pad 31 is electrically connected to the grid-shaped first heat dissipation bar 4), which can improve the heat dissipation effect of the display area AA; and the current signal for controlling the operation of the first Peltier device 3 can be controlled separately, so the first Peltier device 3 can dissipate heat for the liquid crystal display panel during both display and non-display periods.

[0094] In a possible implementation, in order to further improve the heat dissipation effect of the display area, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG12 , each heat dissipation pad 31 can be electrically connected to multiple first heat dissipation bars 4 .

[0095] It should be noted that the array substrate shown in Figure 12 takes the example of setting the first Peltier device 3 in the third border area B3 and the fourth border area B4. Of course, the first Peltier device 3 can also be set in the second border area B2 at the same time; of course, the first Peltier device 3 can also be set in the second border area B2 and the third border area B2, or the first Peltier device 3 can be set in the second border area B2 and the fourth border area B4, or the first Peltier device 3 can be set only in the second border area B2, or only in the third border area B3, or only in the fourth border area B4.

[0096] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 4, 10, 12, and 13, the liquid crystal display module further includes a rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is embedded in the first frame 201. In this way, the thermal conductive layer 33 of the first Peltier device 3 can be pre-fabricated in the first frame 201. When the liquid crystal display panel 10 is then engaged in the slot, the first semiconductor layer 32 in the border area of ​​the array substrate 1 contacts the thermal conductive layer 33, forming the first Peltier device 3. Because the thermal conductive layer 33 of the first Peltier device 3 is formed in the slot of the rectangular frame 20, compared to forming the thermal conductive layer 33 on the array substrate 1, a mask can be saved, thereby reducing production costs.

[0097] Of course, in specific implementation, the heat conducting layer 33 of the first Peltier device 3 of the array substrate 1 can also be manufactured in the process of the array substrate 1, which is conducive to the electrical connection between the heat conducting layer 33 and the voltage pad on the driver IC.

[0098] It should be noted that FIG4 is a cross-sectional view along the DD′ direction after the liquid crystal display panel is engaged in the three-side slots of the rectangular frame 20 shown in FIG10 .

[0099] In one possible implementation, the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, 12, and 13, further includes a complete heat dissipation system 30 located outside the rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is electrically connected to the complete heat dissipation system 30. Thus, the thermal conductive layer 33 transfers heat to the complete heat dissipation system 30. Due to the formation of a certain temperature gradient between the heat dissipation pad 31 (cold end) and the thermal conductive layer 33 (hot end), the process of heat transfer from the display area AA to the complete heat dissipation system 30 via the first heat dissipation bar 4 is accelerated.

[0100] In one possible implementation, the liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, 12, and 13, further includes a second thermal insulation layer 50 located between the array substrate 1 and the second frame 202. Specifically, the second thermal insulation layer 50 may be made of thermal insulation cotton to prevent external heat from being transferred into the liquid crystal display panel.

[0101] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figures 4, 12, and 13, the first semiconductor layer 32 can be an N-type semiconductor layer. Since the heat dissipation pad 31 is a cold end, the heat dissipation pad 31 needs to be the negative electrode and the thermal conductive layer 33 needs to be the positive electrode. In this way, the first heat dissipation bar 4 can be electrically connected to the negative voltage pad on the driver IC, that is, a negative voltage is input to the heat dissipation pad 31 through the driver IC, and the thermal conductive layer 33 can be connected to the positive voltage pad on the driver IC through a trace. Of course, the first semiconductor layer 32 can also be a P-type semiconductor layer. Since the heat dissipation pad 31 is a cold end, the heat dissipation pad 31 needs to be the positive electrode and the thermal conductive layer 33 needs to be the negative electrode. In this way, the first heat dissipation bar 4 can be electrically connected to the positive voltage pad on the driver IC, that is, a positive voltage is input to the heat dissipation pad 31 through the driver IC, and the thermal conductive layer 33 can be connected to the negative voltage pad on the driver IC through a trace.

[0102] As shown in Figure 14, which is a schematic diagram of the heat dissipation principle of the array substrate shown in Figure 13, when strong light from the light source assembly is incident on the liquid crystal display panel, the high thermal conductivity of the first heat dissipation bar 4 within the array substrate 1 allows heat generated by the strong light in the display area AA to be transferred to the heat dissipation pad 31 in the frame area. At this time, the heat dissipation pad 31 serves as the cold end of the first Peltier device 3. Heat is transferred from the heat dissipation pad 31 to the thermal conductive layer 33 (hot end) within the card slot, and then to the overall heat dissipation system 30. Furthermore, the formation of a certain temperature gradient between the cold end and the hot end accelerates the transfer of heat from the display area AA via the first heat dissipation bar 4 to the heat dissipation pad 31. In this embodiment, although a mask is required to be added to the heat dissipation pad 31 in the first Peltier device 3, it can also serve as a light shielding layer for the active layer 12. Therefore, the effects of both light and high temperature on the channel characteristics of the active layer 12 can be reduced simultaneously, providing a dual protection against crosstalk under high-intensity light sources, resulting in a more effective solution.

[0103] In one possible implementation, in the above-mentioned liquid crystal display module provided by the embodiment of the present disclosure, as shown in FIG4 , FIG15 , and FIG16 , FIG15 is another planar schematic diagram of the array substrate in the liquid crystal display module, and FIG16 is a cross-sectional schematic diagram along the CC' direction in FIG15 , wherein the first Peltier device 3 is disposed only on the array substrate 1, that is, the array substrate 1 includes a first heat dissipation bar 4, the array substrate 1 also includes a source-drain metal layer 11 located on a side of the first heat dissipation bar 4 facing away from the color filter substrate 2, and a plurality of second heat dissipation bars 18 cross-arranged between the first heat dissipation bar 4 and the source-drain metal layer 11; the second heat dissipation bar 18 overlaps with the first heat dissipation bar 4;

[0104] The plurality of cross-arranged second heat dissipation bars 18 have a plurality of overlapping regions. The array substrate 1 further includes a second semiconductor layer 19 located between the first heat dissipation bar 4 and the second heat dissipation bar 18 and in each overlapping region. The type of the second semiconductor layer 19 is opposite to that of the first semiconductor layer 32. In this way, a second Peltier device 3' consisting of the second heat dissipation bar 18, the second semiconductor layer 19 and the first heat dissipation bar 4 is formed in the non-luminous area of ​​the display area AA. In this way, the heat accumulation in the display area AA can first form a conduction gradient from the second heat dissipation bar 18 to the first heat dissipation bar 4. Therefore, the heat in the display area AA is first accumulated on the side away from the active layer 12 (channel area). That is, the second Peltier device 3' can promptly remove the heat from the display area AA from the active layer 12, which is more effective in preventing crosstalk under high brightness and high temperature. Therefore, the problem of increased leakage current of the thin film transistor at high temperature is directly reduced in the display area AA; and , second Peltier devices 3' can be formed in multiple overlapping areas (the overlapping areas formed by multiple second heat dissipation bars 18). Therefore, the heat dissipation design of the display area AA is pixel-level, that is, each pixel is cooled simultaneously, which also effectively improves the uniformity of the temperature distribution in the display area AA. Secondly, because the temperature of the heat dissipation pad 31 in the frame area is lower, the heat of the display area AA is transferred along the first heat dissipation bar 4 to the heat dissipation pad 31 in the frame area. Subsequently, in the frame area, the heat dissipation pad 31 serves as the cold end of the first Peltier device 3 in the frame area, and the heat is transferred from the heat dissipation pad 31 to the thermal conductive layer 33, and then to the entire device heat dissipation system 30. In this way, the heat from the display area AA is ultimately dissipated through the second heat dissipation bar 18, the first heat dissipation bar 4, the heat dissipation pad 31, and the entire device heat dissipation system 30.

[0105] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 15, and 16, the array substrate 1 further includes an active layer 12 located on the side of the source / drain metal layer 11 facing away from the color filter substrate 2. The orthographic projection of the first heat dissipation bar 4 on the color filter substrate 2 covers the orthographic projection of the active layer 12 on the color filter substrate 2. Because the second heat dissipation bar 18 overlaps with the first heat dissipation bar 4 and is located above and covers the active layer 12, the first heat dissipation bar 4 and the second heat dissipation bar 18 can function as a double-layer light shielding layer. Compared to a traditional BM (light shielding layer), the first heat dissipation bar 4 and the second heat dissipation bar 18 are closer vertically to the active layer 12 (channel region), thereby achieving a better light shielding effect, effectively preventing strong light from entering the channel region of the active layer 12 and causing an increase in the leakage current of the thin film transistors. Therefore, the embodiments of the present disclosure can protect the thin film transistors of the array substrate from both light shielding and heat dissipation, thereby reducing the degree of crosstalk.

[0106] In a possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, as shown in FIG15 and FIG16 , the array substrate 1 further includes: a pixel electrode 13 electrically connected to the source / drain metal layer 11 and located in the same film layer as the source / drain metal layer 11, a common electrode layer 14 located between the source / drain metal layer 11 and the second heat dissipation bar 18, a first passivation layer PVX1 located between the source / drain metal layer 11 and the common electrode layer 14, a second passivation layer PVX2 located between the common electrode layer 14 and the second heat dissipation bar 18, and a third passivation layer PVX3 located between the second heat dissipation bar 18 and the first heat dissipation bar 4; wherein,

[0107] The third passivation layer PVX3 has through holes in each overlapping area, and the through holes are filled with the second semiconductor layer 19. In this way, the second Peltier device 3' formed in the non-luminous area of ​​the display area AA in this embodiment does not occupy the effective pixel opening area.

[0108] In one possible implementation, in the aforementioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG16 , the heat dissipation pad 31 and the first heat dissipation bar 4 are formed from the same layer and material. This allows the heat dissipation pad 31 and the first heat dissipation bar 4 to be formed in a single patterning process simply by changing the original patterning pattern when forming the first heat dissipation bar 4. This eliminates the need for a separate process for preparing the heat dissipation pad 31, simplifying the manufacturing process, saving production costs, and improving production efficiency. Therefore, the structure of the heat dissipation pad 31 of the first Peltier device 3 provided on the array substrate 1 in the embodiment of the present disclosure is compatible with the array substrate 1 process, eliminating the need for a mask and reducing production costs.

[0109] Optionally, the material of the first heat dissipation bar 4 and the second heat dissipation bar 18 can both be Cu which has a better heat dissipation effect, but the present invention is certainly not limited thereto.

[0110] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG15 , the number of heat dissipation pads 31 provided in at least one of the second border area B2, the third border area B3, and the fourth border area B4 can be multiple, and the multiple heat dissipation pads 31 provided in each border area are arranged at intervals along the length direction of the border area in which they are located. In this way, the border area is composed of multiple first Peltier devices 3 connected in series (because each heat dissipation pad 31 is electrically connected to the grid-shaped first heat dissipation strip 4), which can improve the heat dissipation effect of the display area AA; and the current signal for controlling the operation of the first Peltier device 3 and the second Peltier device 3' can be controlled separately, so the first Peltier device 3 and the second Peltier device 3' can dissipate heat for the liquid crystal display panel during the entire display and non-display period.

[0111] In one possible implementation, in order to further improve the heat dissipation speed of the display area, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in FIG15 , each heat dissipation pad 31 can be electrically connected to multiple first heat dissipation bars 4 .

[0112] It should be noted that the array substrate shown in Figure 15 takes the example of setting the first Peltier device 3 in the third border area B3 and the fourth border area B4. Of course, the first Peltier device 3 can also be set in the second border area B2 at the same time; of course, the first Peltier device 3 can also be set in the second border area B2 and the third border area B2, or the first Peltier device 3 can be set in the second border area B2 and the fourth border area B4, or the first Peltier device 3 can be set only in the second border area B2, or only in the third border area B3, or only in the fourth border area B4.

[0113] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, 15, and 16, the liquid crystal display module further includes a rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is embedded in the first frame 201. In this way, the thermal conductive layer 33 of the first Peltier device 3 can be pre-fabricated in the first frame 201. When the liquid crystal display panel 10 is then engaged in the slot, the first semiconductor layer 32 in the border area of ​​the array substrate 1 contacts the thermal conductive layer 33, forming the first Peltier device 3. Because the thermal conductive layer 33 of the first Peltier device 3 is formed in the slot of the rectangular frame 20, compared to forming the thermal conductive layer 33 on the array substrate 1, a mask can be saved, thereby reducing production costs.

[0114] Of course, in specific implementation, the heat conducting layer 33 of the first Peltier device 3 of the array substrate 1 can also be manufactured in the process of the array substrate 1, which is conducive to the electrical connection between the heat conducting layer 33 and the voltage pad on the driver IC.

[0115] In one possible implementation, the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, 15, and 16, further includes a complete heat dissipation system 30 located outside the rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is electrically connected to the complete heat dissipation system 30. In this way, the thermal conductive layer 33 transfers heat to the complete heat dissipation system 30. Due to the formation of a certain temperature gradient between the heat dissipation pad 31 (cold end) and the thermal conductive layer 33 (hot end), the process of heat transfer from the display area AA to the heat dissipation pad 31 via the first heat dissipation bar 4 is accelerated.

[0116] In one possible implementation, the liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, 15, and 16, further includes a second thermal insulation layer 50 located between the array substrate 1 and the second frame 202. Specifically, the second thermal insulation layer 50 may be made of thermal insulation cotton to prevent external heat from being transferred into the array substrate 1.

[0117] In one possible implementation, in the above-mentioned liquid crystal display module provided by the embodiments of the present disclosure, as shown in Figures 4, 15 and 16, since the type of the second semiconductor layer 19 is opposite to that of the first semiconductor layer 32, for example, the second semiconductor layer 19 is an N-type semiconductor layer and the first semiconductor layer 32 is a P-type semiconductor layer, a negative voltage can be input to the second heat dissipation bar 18, a positive voltage can be input to the first heat dissipation bar 4, and a negative voltage can be input to the thermal conductive layer 33 through the driver IC; for the second Peltier device 3', its second heat dissipation bar 18 is a cold end and the first heat dissipation bar 4 is a hot end, and the heat of the display area AA is transferred to the first heat dissipation bar 4 through the second heat dissipation bar 18; for the first Peltier device 3, its heat dissipation pad 31 is a cold end and the thermal conductive layer 33 is a hot end; thus, the heat of the display area AA is first transferred to the first heat dissipation bar 4 through the second heat dissipation bar 18, then transferred to the heat dissipation pad 31 through the first heat dissipation bar 4, then transferred to the thermal conductive layer 33 through the heat dissipation pad 31, and finally transferred to the peripheral whole-machine heat dissipation system 30 through the thermal conductive layer 33. Of course, the second semiconductor layer 19 can be a P-type semiconductor layer, and the first semiconductor layer 32 can be an N-type semiconductor layer. In this way, it is only necessary to change the direction of the voltage input to the second heat dissipation bar 18, the first heat dissipation bar 4 and the thermal conductive layer 33, that is, through the driver IC, a positive voltage is input to the second heat dissipation bar 18, a negative voltage is input to the first heat dissipation bar 4, and a positive voltage is input to the thermal conductive layer 33, so that the heat of the display area AA can be transferred to the peripheral heat dissipation system 30 of the whole machine through the second heat dissipation bar 18, the first heat dissipation bar 4, the heat dissipation pad 31 and the thermal conductive layer 33.

[0118] As shown in FIG17 , FIG17 is a schematic diagram of the heat dissipation principle of the array substrate shown in FIG16 . When strong light from the light source assembly is incident on the liquid crystal display panel, the second Peltier device 3′ in the display area AA and the first Peltier device 3 in the frame area are controlled to operate. Based on the operating principles of the two Peltier devices, it can be seen that the second heat dissipation bar 18 is the cold end. Due to the high thermal conductivity of the second heat dissipation bar 18, the heat generated by the strong light in the display area AA can be transferred to the first heat dissipation bar 4. At this time, since the heat dissipation pad 31 in the frame area is the cold end of the first Peltier device 3, the first heat dissipation bar 4 transfers the heat to the heat dissipation pad 31 in the frame area. The heat dissipation pad 31 then transfers the heat to the heat conductive layer 33 (hot end), and then transfers the heat to the entire heat dissipation system 30. In addition, since a certain temperature gradient is formed between the cold end and the hot end, the process of heat transfer from the display area AA via the second heat dissipation bar 18 to the first heat dissipation bar 4, the first heat dissipation bar 4 to the heat dissipation pad 31, and the heat dissipation pad 31 to the heat conductive layer 33 is also accelerated. In this embodiment, it is necessary to add passivation layers on both sides, but no mask is required; although the first heat dissipation bar 4 and the second heat dissipation bar 18 set in the display area AA need to add two masks, the first heat dissipation bar 4 and the second heat dissipation bar 18 can also be used as a light shielding layer for the active layer 12, so it can simultaneously reduce the influence of light and high temperature on the channel characteristics of the active layer 12, and has a double protection effect on preventing crosstalk under high-intensity light sources, with better effect.

[0119] It should be noted that Figures 15 and 16 of the present disclosure take the first heat dissipation bar 4 connected to the heat dissipation pad 31 of the first Peltier device 3 in the border area as an example. The second heat dissipation bar 18 can also be used to connect the heat dissipation pad 31 of the first Peltier device 3 in the border area. In this case, the first heat dissipation bar 4 is required to be connected to the voltage pad on the driver IC.

[0120] It should be noted that Figures 15 and 16 of the present disclosure take the example of setting a second Peltier device 3' in the display area AA. Of course, in a specific implementation, a plurality of levels of Peltier devices can also be set in the display area. For example, a third semiconductor layer and a third heat dissipation bar are set above the second Peltier device 3'. The third semiconductor layer can overlap with the second semiconductor layer, and the third heat dissipation bar can overlap with the second heat dissipation bar. The type of the third semiconductor layer is different from the type of the second semiconductor layer. In this way, by setting a plurality of levels of Peltier devices in the display area AA, the heat dissipation speed and uniformity can be further improved.

[0121] In one possible implementation, in the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure, as shown in Figures 3, 4, and 18 (Figure 18 is a schematic cross-sectional view taken along the CC' direction in Figure 3), the first Peltier device 3 is disposed only on the array substrate 1, that is, the array substrate 1 includes a first heat dissipation bar 4, which can be reused as the data line S of the array substrate 1. In this way, this embodiment dissipates heat from the liquid crystal display panel via the data lines S in the display area AA, and the array substrate 1 does not need to separately add a mask to form the first heat dissipation bar 4, thereby reducing production costs.

[0122] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figure 4, the array substrate 1 also includes an ESD circuit 60 located in the third border area B3, as shown in Figure 19. Figure 19 is a schematic diagram of the partial structure of the ESD circuit 60. The ESD circuit 60 includes a plurality of first switches T1 connected in series, each data line S is electrically connected to the first poles of at least two first switches T1, the gate of one of the two first switches T1 is electrically connected to the heat dissipation pad 31 and the data line S, respectively, the second poles of the two first switches T1 are both electrically connected to the common electrode layer 14 of the array substrate 1, and the gate of the other first switch T1 of the two first switches T1 is electrically connected to the common electrode layer 14. In this embodiment, the data line S of the multiplexed display area AA is used as the first heat sink 4 for transferring heat from the display area AA, and the operating voltage of the first Peltier device 3 electrically connected to the data line S is a DC voltage, while the data line S transmits an AC voltage. Because the AC voltage on the data line S will affect the operation of the first Peltier device 3; in order to prevent the AC voltage on the data line S from affecting the operation of the first Peltier device 3, in the embodiment of the present disclosure, an ESD circuit 60 is used to connect the data line S and the heat dissipation pad 31. Since the ESD circuit 60 is only turned on instantaneously when the static electricity accumulated on the data line S reaches a certain level (the gate of T1 is controlled by the amount of static electricity accumulated on the data line S), the static electricity is released to the common electrode layer 4, that is, the duration of the ESD circuit 60 being turned on instantaneously is very short, and the ESD circuit 60 is always in the off state during the rest of the time. In this way, a DC voltage can be input to the heat dissipation pad 31 and the thermal conductive layer 33 through the corresponding voltage pad on the driver IC and the corresponding wiring to enable the first Peltier device 3 to operate normally. Therefore, the duration of the ESD circuit 60 being turned on instantaneously will not affect the operation of the first Peltier device 3.

[0123] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figure 4, the array substrate 1 also includes a first voltage input line located in the non-display area, the heat dissipation pad 31 is electrically connected to one end of the first voltage input line, the other end of the first voltage input line is electrically connected to the first voltage pad (not shown) on the driver IC, and the thermal conductive layer 33 is electrically connected to the second voltage pad (not shown) on the driver IC. For example, the first semiconductor layer 32 of the first Peltier device 3 is P-type, so that a positive voltage is input to the heat dissipation pad 31 through the first voltage input line through the driver IC, and a negative voltage is input to the heat dissipation pad 31 through the heat conductive layer 33 through the driver IC. In this way, the heat dissipation pad 31 is the cold end and the heat conductive layer 33 is the hot end, which accelerates the heat conduction of the display area AA to the frame area and improves the dissipation of heat in the display area AA; of course, the first semiconductor layer 32 of the first Peltier device 3 can also be N-type, so that a negative voltage is input to the heat dissipation pad 31 through the first voltage input line through the driver IC, and a positive voltage is input to the heat dissipation pad 31 through the heat conductive layer 33 through the driver IC. In this way, the heat dissipation pad 31 is the cold end and the heat conductive layer 33 is the hot end, which accelerates the heat conduction of the display area AA to the frame area and improves the dissipation of heat in the display area AA.

[0124] In one possible implementation, in the liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 3 and 18 , the heat dissipation pad 31 can be formed in the same layer and material as the data line S. This allows the heat dissipation pad 31 and the data line S patterns to be formed in a single patterning process simply by changing the original patterning pattern when forming the data line S. This eliminates the need for a separate process for preparing the heat dissipation pad 31, simplifying the manufacturing process, saving production costs, and improving production efficiency. Therefore, the structure of the heat dissipation pad 31 of the first Peltier device 3 provided on the array substrate 1 in the embodiments of the present disclosure is compatible with the array substrate 1 process, eliminating the need for a mask and reducing production costs.

[0125] In a specific implementation, in the above-mentioned liquid crystal display module provided by the embodiment of the present disclosure, as shown in FIG3 , since the first heat dissipation strip 4 of this embodiment reuses the data line S, this embodiment only provides a heat dissipation pad 31 in the third frame area B3. The number of heat dissipation pads 31 provided in the third frame area B3 can be multiple, and the multiple heat dissipation pads 31 provided in the third frame area B3 are arranged at intervals along the length direction of the third frame area B3. In this way, the third frame area B3 can be composed of multiple first Peltier devices 3 connected in series (for example, each heat dissipation pad 31 is electrically connected to the same first voltage input line), which can improve the heat dissipation effect of the display area AA; and the current signal that controls the operation of the first Peltier device 3 can be controlled separately, so the first Peltier device 3 can dissipate heat for the liquid crystal display panel during both display and non-display periods.

[0126] In one possible implementation, in order to further improve the heat dissipation effect of the display area, in the above-mentioned liquid crystal display module provided in the embodiment of the present disclosure, as shown in Figure 3, each heat dissipation pad 31 can be electrically connected to multiple first heat dissipation bars 4 (data lines S).

[0127] In one possible implementation, in the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4 and 18, the liquid crystal display module further includes a rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is embedded in the first frame 201. In this way, the thermal conductive layer 33 of the first Peltier device 3 can be pre-fabricated within the first frame 201. When the liquid crystal display panel 10 is then engaged in the slot, the first semiconductor layer 32 in the border region of the array substrate 1 contacts the thermal conductive layer 33, forming the first Peltier device 3. Because the thermal conductive layer 33 of the first Peltier device 3 is formed within the slot of the rectangular frame 20, compared to fabricating the thermal conductive layer 33 on the array substrate 1, a mask can be saved, thereby reducing manufacturing costs.

[0128] Of course, in specific implementation, the heat conducting layer 33 of the first Peltier device 3 of the array substrate 1 can also be manufactured in the process of the array substrate 1, which is conducive to the electrical connection between the heat conducting layer 33 and the voltage pad on the driver IC.

[0129] In one possible implementation, the above-mentioned liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, and 18, further includes a complete heat dissipation system 30 located outside the rectangular frame 20, and the thermal conductive layer 33 of the array substrate 1 is electrically connected to the complete heat dissipation system 30. Thus, the thermal conductive layer 33 transfers heat to the complete heat dissipation system 30. Due to the formation of a certain temperature gradient between the heat dissipation pad 31 (cold end) and the thermal conductive layer 33 (hot end), the process of heat transfer from the display area AA to the complete heat dissipation system 30 via the first heat dissipation bar 4 is accelerated.

[0130] In one possible implementation, the liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 4, 10, and 18, further includes a second thermal insulation layer 50 located between the array substrate 1 and the second frame 202. Specifically, the second thermal insulation layer 50 may be made of thermal insulation cotton to prevent external heat from being transferred into the liquid crystal display panel.

[0131] As shown in FIG20 , FIG20 is a schematic diagram of the heat dissipation principle of the array substrate shown in FIG18 . When strong light from the light source assembly is incident on the liquid crystal display panel, the heat generated by the strong light irradiation in the display area AA can be transferred to the heat dissipation pad 31 in the frame area due to the high thermal conductivity of the data line S in the array substrate 1. At this time, the heat dissipation pad 31 serves as the cold end of the first Peltier device 3. The heat will be transferred from the heat dissipation pad 31 to the heat conductive layer 33 (hot end) in the card slot, and then transferred to the whole device heat dissipation system 30. In addition, because a certain temperature gradient is formed between the cold end and the hot end, the process of heat transfer from the display area AA to the heat dissipation pad 31 via the data line S is also accelerated.

[0132] In one possible implementation, in the liquid crystal display module provided in the embodiments of the present disclosure, as shown in Figures 5 and 6 , both the color filter substrate 2 and the array substrate 1 include a first Peltier device 3. However, the first Peltier device 3 of the color filter substrate 2 and the first Peltier device 3 of the array substrate 1 need to be located in different border regions to ensure that the heat dissipation pads 31 of the array substrate 1 and the heat dissipation pads 31 of the color filter substrate 2 can both contact the thermally conductive layer 3 within the slot. For example, Figure 5 illustrates that the first Peltier device 3 of the color filter substrate 2 is located in the second border region B2, while the first Peltier device 3 of the array substrate 1 is located in the fourth border region B4, but the present invention is not limited to this. In this embodiment, the color filter substrate 2 includes the first Peltier device 3 and the first heat dissipation bar 4, as described in Figures 1, 2, and 9-11. The heat dissipation methods of the two are the same and will not be further described here. In this embodiment, the array substrate 1 includes the first Peltier device 3 and the first heat dissipation bar 4, as described in Figures 3, 4, and 12-20. The various heat dissipation methods of the two are the same and will not be further described here.

[0133] In a specific implementation, since the Peltier device has the characteristic that heat conduction changes with the direction of current, that is, changing the direction of current will cause the hot and cold ends to reverse, it is difficult to directly use an AC signal to control it (which will result in a decrease in the heat dissipation effect). In order to avoid the problem of the Peltier device being operated under DC voltage for a long time, which leads to a decrease in the life of the Peltier device, in the above-mentioned liquid crystal display module provided by the embodiment of the present disclosure, as shown in Figures 5, 6 and 21, Figure 21 is a schematic diagram of an equivalent circuit of the border area where the first Peltier device 3 is set. The array substrate 1 also includes a second switch T2 corresponding to the first Peltier device 3, and the second switch T2 is located in the corresponding border area;

[0134] The plurality of second switches T2 are divided into a first group M1 of second switches T2 and a second group M2 of second switches T2, and the second switches T2 of the first group M1 and the second switches T2 of the second group M2 are alternately arranged;

[0135] The gate of each second switch T2 of the first group M1 is electrically connected to the first control line G1, and the gate of each second switch T2 of the second group M2 is electrically connected to the second control line G2;

[0136] The first electrode of each second switch T2 of the first group M1 and the first electrode of each second switch T2 of the second group M2 are both electrically connected to the voltage input line of the corresponding heat dissipation pad 31; for example, the voltage input line of the heat dissipation pad 31 in Figures 13 and 16 is the first heat dissipation bar 4, and the voltage input line of the heat dissipation pad 31 in Figure 18 is the first voltage input line; Figure 21 of the present disclosure takes the voltage input line of the heat dissipation pad 31 shown in Figures 13 and 16 as the first heat dissipation bar 4 as an example;

[0137] The second electrodes of the second switches T2 of the first group M1 and the second electrodes of the second switches T2 of the second group M2 are electrically connected to the corresponding heat dissipation pads 31 , respectively.

[0138] As shown in FIG21 , the embodiment of the present disclosure divides a plurality of first Peltier devices 3 into a first group M1 (e.g., each first Peltier device 3 located at an odd position) and a second group M2 (e.g., each first Peltier device 3 located at an even position). All first Peltier devices 3 are connected in series, and the first group M1 and the second group M2 can be alternately turned on and off through corresponding second switches T2. As shown in FIG22 , FIG22 is a working timing diagram of the first group M1 first Peltier devices 3 and the second group M2 first Peltier devices 3, which realizes heat dissipation. The principle is as follows: when the gate signal G1 of the second switch T2 corresponding to the first group M1 is set high, the second switches T2 corresponding to the first group M1 are immediately turned on. At this time, the heat dissipation current signal M1 (4) is able to control the first Peltier device 3 of the first group M1 to work, thereby transferring the heat from the display area AA to one end of the heat conducting layer 33. At this time, the gate signal G2 of the second switch T2 corresponding to the second group M2 is set low, and the second switches T2 corresponding to the second group M2 are immediately turned off, that is, the first Peltier devices 3 of the second group M2 do not have a heat dissipation function. Similarly, when the gate signal G2 of the second switch T2 corresponding to the second group M2 is set high, the second switches T2 corresponding to the second group M2 are immediately turned on. At this time, the heat dissipation current signal M2 (4) is able to control the first Peltier devices 3 of the second group M2 to work, realizing the transfer of heat from the display area AA to one end of the heat conduction layer 33. At this time, the gate signal G1 of the second switches T2 corresponding to the first group M1 is set low, and the second switches T2 corresponding to the first group M1 are immediately turned off, that is, the first Peltier devices 3 of the first group M1 do not have a heat dissipation function. In this way, from a general perspective, there is always a group of first Peltier devices 3 working, that is, the heat dissipation function of the first Peltier devices 3 can be realized even with an AC signal, and the heat dissipation effect of the display area AA will not be reduced. More importantly, for each first Peltier device 3 of the array substrate 1, since only half of the time is the effective working time, the life of the first Peltier device 3 can be effectively extended and the power consumption of the product can be reduced.

[0139] It should be noted that FIG21 only illustrates four first Peltier devices 3 , and of course the number of the first Peltier devices 3 is not limited thereto.

[0140] In specific implementation, the above-mentioned liquid crystal display module provided by the embodiment of the present disclosure may also include other functional structures well known to those skilled in the art, such as a liquid crystal layer located between the array substrate and the color filter substrate, etc., which will not be described in detail here.

[0141] In summary, the embodiments of the present disclosure provide a solution for dissipating heat for a liquid crystal display panel by respectively arranging a first Peltier device on an array substrate and a color filter substrate. Depending on the heat dissipation requirements, it can be selected to arrange the first Peltier device only on the array substrate, or only on the color filter substrate, or on both the array substrate and the color filter substrate.

[0142] Based on the same inventive concept, an embodiment of the present disclosure also provides a projector, as shown in FIG23 , the projector includes a light source assembly 100, a reflective cup 200, a rear Fresnel lens 300, an insulating glass 400, a liquid crystal display module 500, a front Fresnel lens 600, a reflector 700 and a lens 800 arranged in sequence along the light emitting direction. The liquid crystal display module 500 is the above-mentioned liquid crystal display module provided in an embodiment of the present disclosure.

[0143] The above-mentioned projector provided by the embodiment of the present disclosure can reduce the problem of increased leakage current of the thin film transistor caused by the high temperature environment caused by the strong light from the light source component incident on the liquid crystal display panel, because the first Peltier device is set in the liquid crystal display module to dissipate heat from the display area. It can also reduce adverse phenomena such as residual image aberration and crosstalk of the liquid crystal display panel, and improve the projection picture quality of the projector.

[0144] Since the principle of solving the problem of the projector is similar to that of the aforementioned liquid crystal display module, the implementation of the projector can refer to the implementation of the aforementioned liquid crystal display module, and the repeated parts will be omitted.

[0145] Specifically, the projection screen principle of the projector provided by the present disclosure is the same as that in the related art and will not be described in detail here.

[0146] In specific implementation, the projector provided by the embodiment of the present disclosure may further include other functional structures well known to those skilled in the art, which will not be described in detail here.

[0147] The embodiment of the present disclosure provides a liquid crystal display module and a projector, which conducts heat from the display area to the frame area through multiple first heat dissipation strips in the display area, that is, uses metal wires for heat conduction, which can avoid the display area of ​​the array substrate and / or color film substrate being affected by uneven temperature distribution; and a first Peltier device is set in the frame area, and the first heat dissipation strip is electrically connected to the heat dissipation pad of the first Peltier device, so that the first heat dissipation strip conducts heat from the display area to the first Peltier device in the frame area, and the first Peltier device can create a thermal diffusion gradient to accelerate heat conduction; in this way, the heat conduction layer of the first Peltier device can be connected to the overall heat dissipation system of the liquid crystal display module, accelerating the heat dissipation of the display area, thereby alleviating the problem of increased leakage current of thin film transistors caused by high temperature and reducing the degree of crosstalk. In addition, the first heat dissipation strip and the heat dissipation pad avoid the light-emitting area and will not affect the transmittance of the liquid crystal display module. Compared with traditional designs, the embodiment of the present disclosure has the technical characteristics of simple structure and fast heat dissipation.

[0148] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0149] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such changes and modifications of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such changes and modifications.

Claims

1. A liquid crystal display module, wherein: The liquid crystal display module includes a liquid crystal display panel, the liquid crystal display panel has a display area and a non-display area surrounding the display area, the display area has a plurality of light-emitting areas and non-light-emitting areas located between the light-emitting areas, the non-display area includes a first frame area, a second frame area, a third frame area and a fourth frame area surrounding the display area in sequence, and the first frame area is provided with a driver IC; wherein, The liquid crystal display panel includes an array substrate and a color filter substrate arranged opposite to each other, at least one of the array substrate and the color filter substrate includes a first Peltier device located in at least one of the second frame area, the third frame area, and the fourth frame area, the first Peltier device including a heat dissipation pad, a first semiconductor layer, and a heat conductive layer stacked in sequence; The liquid crystal display panel further includes a plurality of first heat dissipation bars located in the non-luminous area, wherein the first heat dissipation bars extend to the corresponding frame area and are electrically connected to the heat dissipation pads.

2. The liquid crystal display module according to claim 1, wherein: The color filter substrate and the array substrate both include the first Peltier device, and the first Peltier device on the color filter substrate and the first Peltier device on the array substrate are located in different border areas.

3. The liquid crystal display module according to claim 1 or 2, wherein: The plurality of first heat dissipation strips are cross-arranged.

4. The liquid crystal display module according to any one of claims 1 to 3, wherein: The color filter substrate includes a black matrix, the plurality of first heat dissipation strips are multiplexed into the black matrix, and the first Peltier device is arranged on the color filter substrate.

5. The liquid crystal display module according to claim 4, wherein: The first heat dissipation strip includes an organic heat reflection layer and a metal heat conduction layer located on a side of the organic heat reflection layer facing the array substrate.

6. The liquid crystal display module according to any one of claims 1 to 3, wherein: The array substrate includes the first heat dissipation bar and a source / drain metal layer located on a side of the first heat dissipation bar facing away from the color filter substrate. The first Peltier device is arranged on the array substrate.

7. The liquid crystal display module according to claim 6, wherein: The array substrate also includes: a pixel electrode electrically connected to the source / drain metal layer and located on the same film layer as the source / drain metal layer, a first passivation layer located between the source / drain metal layer and the first heat dissipation bar, a second passivation layer located on the side of the first heat dissipation bar facing the color film substrate, and a common electrode layer located on the side of the second passivation layer facing the color film substrate.

8. The liquid crystal display module according to any one of claims 1 to 3, wherein: The array substrate includes a first heat dissipation bar and a source / drain metal layer located on a side of the first heat dissipation bar facing away from the color filter substrate, and a plurality of second heat dissipation bars arranged crosswise between the first heat dissipation bar and the source / drain metal layer; the second heat dissipation bars overlap with the first heat dissipation bars; The cross-arranged plurality of second heat dissipation bars have a plurality of overlapping areas. The array substrate further includes a second semiconductor layer located between the first heat dissipation bars and the second heat dissipation bars and located in each of the overlapping areas. The type of the second semiconductor layer is opposite to that of the first semiconductor layer.

9. The liquid crystal display module according to claim 8, wherein: The array substrate further includes: a pixel electrode electrically connected to the source / drain metal layer and located in the same film layer as the source / drain metal layer, a common electrode layer located between the source / drain metal layer and the second heat dissipation bar, a first passivation layer located between the source / drain metal layer and the common electrode layer, a second passivation layer located between the common electrode layer and the second heat dissipation bar, and a third passivation layer located between the second heat dissipation bar and the first heat dissipation bar; wherein, The third passivation layer has a through hole in each of the overlapping regions, and the second semiconductor layer is filled in the through hole.

10. The liquid crystal display module according to any one of claims 6 to 9, wherein: The array substrate further includes an active layer located on a side of the source / drain metal layer away from the color filter substrate, and the orthographic projection of the first heat dissipation strip on the color filter substrate covers the orthographic projection of the active layer on the color filter substrate.

11. The liquid crystal display module according to claim 1 or 2, wherein: The first heat dissipation strips are multiplexed as data lines of the array substrate.

12. The liquid crystal display module according to claim 11, wherein: The array substrate also includes an ESD circuit located in the third border area, the ESD circuit includes multiple first switches connected in series, each of the data lines is electrically connected to the first poles of at least two first switches, the gate of one of the two first switches is electrically connected to the heat dissipation pad and the data line, respectively, the second poles of the two first switches are electrically connected to the common electrode layer of the array substrate, and the gate of the other of the two first switches is electrically connected to the common electrode layer.

13. The liquid crystal display module according to claim 12, wherein: The array substrate also includes a first voltage input line located in the non-display area, the heat dissipation pad is electrically connected to one end of the first voltage input line, the other end of the first voltage input line is electrically connected to the first voltage pad on the driver IC, and the thermal conductive layer is electrically connected to the second voltage pad on the driver IC.

14. The liquid crystal display module according to any one of claims 1 to 13, wherein: The heat dissipation pad and the first heat dissipation bar are made of the same layer and the same material.

15. The liquid crystal display module according to any one of claims 1 to 14, wherein: There are multiple heat dissipation pads provided in at least one of the second frame area, the third frame area and the fourth frame area, and the multiple heat dissipation pads provided in each frame area are arranged at intervals along the length direction of the frame area where the heat dissipation pads are located.

16. The liquid crystal display module according to claim 15, wherein: Each of the heat dissipation pads is electrically connected to a plurality of the first heat dissipation bars.

17. The liquid crystal display module according to claim 16, wherein: The array substrate further includes second switches corresponding to the first heat dissipation bars one by one, and the second switches are located in the corresponding border areas; The plurality of second switches are divided into a first group of second switches and a second group of second switches, wherein the second switches in the first group and the second group are alternately arranged; The gate of each of the second switches in the first group is electrically connected to the first control line, and the gate of each of the second switches in the second group is electrically connected to the second control line; The first electrode of each second switch in the first group and the first electrode of each second switch in the second group are both electrically connected to the voltage input line corresponding to the heat dissipation pad; The second electrodes of the second switches of the first group and the second electrodes of the second switches of the second group are electrically connected to the corresponding heat dissipation pads, respectively.

18. The liquid crystal display module according to any one of claims 4 to 17, wherein: The liquid crystal display module further includes a rectangular frame, which is a hollow structure with three side slots. The slot on each side is composed of a first frame and a second frame of the rectangular frame that are oppositely arranged, and a side wall connecting the outer edges of the first frame and the second frame. The liquid crystal display panel is engaged with the three side slots. The heat-conducting layer of the array substrate is embedded in the first frame, and the heat-conducting layer of the color filter substrate is embedded in the second frame.

19. The liquid crystal display module according to claim 18, wherein: Also includes: a first heat insulation layer located between the color filter substrate and the first frame, and / or a second heat insulation layer located between the array substrate and the second frame.

20. The liquid crystal display module according to claim 18 or 19, wherein: It also includes a complete heat dissipation system located outside the rectangular frame, and the heat conduction layer of the array substrate and the heat conduction layer of the color film substrate are both electrically connected to the complete heat dissipation system.

21. A projector, wherein: The projector includes a light source assembly, a reflective cup, a rear Fresnel lens, insulating glass, a liquid crystal display module, a front Fresnel lens, a reflector and a lens arranged in sequence along the light emission direction. The liquid crystal display module is the liquid crystal display module according to any one of claims 1 to 20.

Images