Backlight module and display apparatus

Abstract

Embodiments of the present application disclose a backlight module and a display apparatus. In the backlight module, a support member is arranged between a flexible printed circuit and a backplane, and the elastic modulus of the support member is greater than the elastic modulus of the flexible printed circuit.

Description

Backlight module and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a backlight module and a display device. Background Art

[0002] A display device in the related art includes a backlight module and a liquid crystal panel. The backlight module comprises a back frame, a light guide plate disposed within the back frame, and a light bar. The light bar is disposed on one side of the light guide plate. A flexible circuit board is connected to the light bar and disposed on the side of the light guide plate near the back frame bottom plate. The flexible circuit board and light guide plate are connected by adhesive, and the light guide is fixed as a whole. This reduces the gap between the light guide plate and the light bar after aging, thereby reducing light loss.

[0003] During the research and practice of related technologies, the inventors of this application discovered that in the above-mentioned structure, during aging tests (TST, etc.), the flexible circuit board expands and contracts with the light guide plate, causing local bulging, which in turn causes the light guide plate to be partially lifted up, thereby affecting the light extraction efficiency. SUMMARY OF THE INVENTION

[0004] The embodiments of the present application provide a backlight module and a display device, which can reduce the risk of local bulging of a flexible circuit board.

[0005] The present invention provides a backlight module, which includes:

[0006] Back panel;

[0007] A light-emitting assembly, the light-emitting assembly being arranged on the back panel, the light-emitting assembly comprising a flexible circuit board and a light-emitting device connected to and arranged on a side of the flexible circuit board away from the back panel;

[0008] a light guide plate, wherein a portion of the light guide plate is disposed on a side of the flexible circuit board away from the back plate and is fixedly connected to the flexible circuit board, and the light emitting device is disposed on one side of the light guide plate;

[0009] A support member is provided between the flexible circuit board and the back plate, and an elastic modulus of the support member is greater than an elastic modulus of the flexible circuit board.

[0010] Accordingly, an embodiment of the present application further provides a display device, comprising:

[0011] Backlight module;

[0012] A liquid crystal panel, the liquid crystal panel being arranged on the light-emitting side of the backlight module;

[0013] The backlight module includes:

[0014] Back panel;

[0015] A light-emitting assembly, the light-emitting assembly being arranged on the back panel, the light-emitting assembly comprising a flexible circuit board and a light-emitting device connected to and arranged on a side of the flexible circuit board away from the back panel;

[0016] a light guide plate, wherein a portion of the light guide plate is disposed on a side of the flexible circuit board away from the back plate and is fixedly connected to the flexible circuit board, and the light emitting device is disposed on one side of the light guide plate;

[0017] A support member is provided between the flexible circuit board and the back plate, and an elastic modulus of the support member is greater than an elastic modulus of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a bottom view schematic diagram of the backlight module provided in an embodiment of the present application;

[0019] FIG2 is a schematic diagram of the cross-sectional structure along line QQ in FIG1 ;

[0020] FIG3 is a schematic diagram of the cross-sectional structure along line MM in FIG1 ;

[0021] FIG4 is a bottom view schematic diagram of the display device provided in an embodiment of the present application;

[0022] FIG5 is a schematic diagram of the cross-sectional structure along line RR in FIG4 ;

[0023] FIG6 is a schematic diagram of the cross-sectional structure along line NN in FIG4 . Modes for Carrying Out the Invention

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as labels and do not impose numerical requirements or establish an order.

[0025] The embodiments of the present application provide a backlight module and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0026] 1-3 , an embodiment of the present application provides a backlight module BL, which includes a back plate 11 , a light emitting component 12 , a light guide plate 13 and a support member 14 .

[0027] The light emitting assembly 12 is disposed on the back plate 11 . The light emitting assembly 12 includes a flexible circuit board 121 and a light emitting device 122 connected to a side of the flexible circuit board 121 away from the back plate 11 .

[0028] A portion of the light guide plate 13 is disposed on a side of the flexible circuit board 121 away from the back plate 11 and is fixedly connected to the flexible circuit board 121. The light emitting device 122 is disposed on one side of the light guide plate 13.

[0029] The support member 14 is disposed between the flexible circuit board 121 and the back plate 11 . The elastic modulus of the support member 14 is greater than that of the flexible circuit board 121 .

[0030] The backlight module BL of the embodiment of the present application adopts a support member 14 provided between the flexible circuit board 121 and the back plate 11. The elastic modulus of the support member 14 is greater than the elastic modulus of the flexible circuit board 121. The greater rigidity of the support member 14 is utilized to support the flexible circuit board 121 or to improve the stiffness of the flexible circuit board 121, thereby reducing the risk of local bulging of the flexible circuit board 121 due to the expansion and contraction of the light guide plate.

[0031] In some embodiments of the present application, the backlight module further includes a frame, the frame including a frame body and a hanging ear portion, the frame body is connected to the periphery of the back plate, and the hanging ear portion is connected to a side of the frame body away from the light guide plate;

[0032] An opening is formed on a side of the back plate close to the ear hanging portion, and the side of the opening close to the ear hanging portion passes through the frame, and the width of the opening is greater than or equal to the width of the ear hanging portion;

[0033] In the orthographic projection pattern of the backlight module, the support member at least covers the area of ​​the flexible circuit board corresponding to the opening.

[0034] In some embodiments of the present application, a side of the support member close to the flexible circuit board is fixedly connected to the flexible circuit board, and a side of the support member away from the flexible circuit board is overlapped with the back plate.

[0035] In some embodiments of the present application, a side of the support member close to the flexible circuit board is overlapped with the flexible circuit board, and a side of the support member away from the flexible circuit board is fixedly connected to the back plate.

[0036] In some embodiments of the present application, the backlight module further includes a filling body, and the filling body is disposed in the opening.

[0037] In some embodiments of the present application, the support members are at least overlapped on opposite sides of the same opening.

[0038] In some embodiments of the present application, the support member is further extended and connected to the back panel on a side of the opening away from the ear hanging portion.

[0039] In some embodiments of the present application, the backlight module further includes a reflective sheet, which is disposed on a side of the light guide plate close to the back plate, and extends to cover a portion of the support member;

[0040] The flexible circuit board is fixedly connected to the light guide plate via an adhesive layer, and the thickness of the reflective sheet is equal to the sum of the thicknesses of the adhesive layer and the flexible circuit board.

[0041] In some embodiments of the present application, the backplane is arranged on the entire surface of the area corresponding to the flexible circuit board, the side of the support member close to the flexible circuit board is fixedly connected to the flexible circuit board, and the side of the support member away from the flexible circuit board is overlapped with the backplane.

[0042] In some embodiments of the present application, the support member is provided on the entire surface, and in the orthographic projection pattern of the backlight module, the support member completely covers the flexible circuit board.

[0043] In some embodiments of the present application, the elastic modulus of the support member is greater than or equal to 50 GPa.

[0044] In some embodiments of the present application, the thermal conductivity of the support member is greater than or equal to 10 W / (m·K).

[0045] In some embodiments of the present application, the thickness of the support member is between 0.1 mm and 0.3 mm.

[0046] In some embodiments of the present application, the material of the support member is curing glue, and the support member is directly formed on the surface of the flexible circuit board away from the light guide plate.

[0047] Optionally, the material of the back plate 11 includes metal or other materials. Further, the material of the back plate 11 includes metal.

[0048] The light emitting device 122 includes a light emitting diode or other light sources and is disposed on one side of the light incident surface of the light guide plate 13 .

[0049] In one embodiment of the present application, the backlight module BL further includes a frame 15, which includes a frame 151 and a hook portion 152. The frame 151 is connected to the periphery of the back plate 11. The hook portion 152 is connected to the side of the frame 151 away from the light guide plate 13.

[0050] An opening k1 is formed on one side of the back panel 11 near the ear hook portion 152 . The opening k1 extends through the frame 151 near the ear hook portion 152 . The width of the opening k1 is greater than or equal to the width of the ear hook portion 152 .

[0051] It's important to understand that, before assembly, the opening k1 accommodates the ear hook 152. During assembly, the ear hook 152 bends from the opening k1 to the side of the frame 151 away from the light guide plate 13, thereby facilitating a secure connection between the ear hook 152 and the display panel's circuit board. Placing the ear hook 152 within the opening k1 before assembly facilitates its accommodation, conserves design space, and protects it.

[0052] Optionally, the frame 15 and the back plate 11 are integrally formed to improve the stability of the connection between the two and save the time of assembling the two. Of course, the frame 15 and the back plate 11 can also be set separately and connected by physical means.

[0053] In one embodiment, the frame 151 and the back plate 11 are arranged to form a receiving groove 15a. The light emitting assembly 12 and the light guide plate 13 are both disposed in the receiving groove 15a.

[0054] The frame 15 further includes a lap portion 153 connected to a side of the frame 151 away from the back plate 11 and extending above the edge of the receiving groove 15a. The lap portion 153 is used to support the liquid crystal panel.

[0055] In one embodiment, the backlight module BL may further include a light shielding adhesive 16 , which is bonded to a surface of the overlapping portion 153 close to the light guide plate 13 . Part of the light shielding adhesive 16 is extended onto the light guide plate 13 .

[0056] The backlight module BL may further include an optical film 17 , which is disposed on a side of the light guide plate 13 away from the back plate 11 . An edge of the optical film 17 is overlapped on the light shielding adhesive 16 .

[0057] In one embodiment of the present application, the elastic modulus (Young's modulus) of the support member 14 is greater than or equal to 50 GPa. For example, the elastic modulus of the support member 14 can be 50 GPa, 60 GPa, 70 GPa, 80 GPa, 90 GPa, 100 GPa, 110 GPa, 120 GPa, 130 GPa, 140 GPa, 150 GPa, 160 GPa, 170 GPa, 180 GPa, 190 GPa, 200 GPa, 210 GPa, 220 GPa, 230 GPa, 240 GPa, or 250 GPa.

[0058] The elastic modulus of the support member 14 is selected to be greater than or less than 50 GPa to ensure that the support member 14 has sufficient support and stiffness to resist the deformation force of the flexible circuit board 121 .

[0059] In one embodiment of the present application, the thickness h of the support member 14 is between 0.1 mm and 0.3 mm.

[0060] It is understood that if the thickness h of the support member 14 is too small, its support strength for the flexible circuit board 121 will be insufficient, while if the thickness h is too large, assembly will be difficult due to space constraints. Therefore, considering the required stiffness of the support member 14, the thickness h of the support member 14 is selected to be between 0.1 mm and 0.3 mm to ensure the support strength of the support member 14 for the flexible circuit board 121 and reduce the difficulty of assembly.

[0061] Optionally, the thickness of the support member 14 may be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm or 0.3 mm, etc.

[0062] Optionally, the support member 14 has a good heat conduction function to transfer the heat on the flexible circuit board 121 to the back plate 11 for heat dissipation, so as to improve the heat dissipation efficiency of the flexible circuit board 121 and the light guide plate 13, thereby reducing the thermal expansion degree of the light guide plate 13, so that the deformation force of the flexible circuit board 121 is weakened, thereby further reducing the risk of local bulge of the flexible circuit board 121.

[0063] In one embodiment of the present application, the thermal conductivity of the support member 14 is greater than or equal to 10 W / (m·K). For example, the thermal conductivity of the support member 14 is 10 W / (m·K), 20 W / (m·K), 30 W / (m·K), 40 W / (m·K), 50 W / (m·K), 60 W / (m·K), 70 W / (m·K), 80 W / (m·K), 90 W / (m·K), 100 W / (m·K), 110 W / (m·K), 120 W / (m·K), 130 W / (m·K), 140 W / (m·K), 150 W / (m·K), 160 W / (m·K), 170 W / (m·K), 180 W / (m·K), 190 W / (m·K), or 200 W / (m·K).

[0064] Optionally, the support member 14 is made of metal. The elastic modulus of the metal support member 14 is between 71 GPa and 193 GPa, for example, 71 GPa, 72 GPa, 73 GPa, 74 GPa, 75 GPa, 76 GPa, 77 GPa, 78 GPa, 79 GPa, 80 GPa, 90 GPa, 100 GPa, 110 GPa, 120 GPa, 130 GPa, 140 GPa, 150 GPa, 160 GPa, 170 GPa, 180 GPa, 190 GPa, 191 GPa, 192 GPa, or 193 GPa, etc.

[0065] Optionally, the thermal conductivity of the metal support member 14 is between 16.3 W / (m· K) and 110 W / (m· K), for example, it can be 16.3 W / (m· K), 16.4 W / (m· K), 16.5 W / (m· K), 17 W / (m· K), 18 W / (m· K), 19 W / (m· K), 20 W / (m· K), 30 W / (m· K), 40 W / (m· K), 50 W / (m· K), 60 W / (m· K), 70 W / (m· K), 80 W / (m· K), 90 W / (m· K), 100 W / (m· K) or 110 W / (m· K), etc.

[0066] It is understandable that the metal support member 14 has both strong rigidity and stiffness as well as strong heat conduction performance, which can better reduce the risk of local bulge of the flexible circuit board 121.

[0067] In one embodiment, the support member 14 may also be made of a non-metallic rigid material, such as carbon fiber, fiberglass, or ceramic.

[0068] In one embodiment of the present application, a surface of the support member 14 close to the flexible circuit board 121 is fixedly connected to the flexible circuit board 121 , and a surface of the support member 14 away from the flexible circuit board 121 overlaps with the back plate 11 .

[0069] In the orthographic projection pattern of the backlight module BL, the support member 14 at least covers the area of ​​the flexible circuit board 121 corresponding to the opening k1 , that is, the support member 14 can be provided partially or entirely.

[0070] The support member 14 is fixed on the flexible circuit board 121 to improve the stiffness of the flexible circuit board 121 , thereby reducing the risk of local bulging of the flexible circuit board 121 due to the expansion and contraction of the light guide plate.

[0071] Optionally, in an embodiment of the present application, the backlight module BL further includes a filling body 18 , and the filling body 18 is disposed in the opening k1 .

[0072] The filler 18 is filled in the opening k1 to improve the support of the flexible circuit board 121 in the opening k1 area, thereby reducing the risk of large differences in the support strength of the flexible circuit board 121 and further reducing the risk of local bulging of the flexible circuit board 121.

[0073] Optionally, the filler 18 may be a tape or a gasket.

[0074] Optionally, the filling body 18 and the support member 14 are integrally formed to improve the connection between the two and to improve assembly efficiency by using the filling body 18 as a positioning block and cooperating with the opening k1.

[0075] Optionally, the thickness of the filling body 18 is equal to the depth of the opening k1 .

[0076] The support member 14 is arranged on the filling body 18 .

[0077] Optionally, in one embodiment of the present application, the support member 14 is provided on the entire surface, and in the orthographic projection pattern of the backlight module BL, the support member 14 completely covers the flexible circuit board 121. The support member 14 completely covering the flexible circuit board 121 can improve the overall stiffness of the flexible circuit board 121 and / or improve the overall support strength of the flexible circuit board 121.

[0078] Optionally, in the embodiment where the support member 14 is fixed to the flexible circuit board 121 , the material of the support member 14 may also be glue, which has strong rigidity and stiffness after curing, such as hot melt glue or diamond glue.

[0079] For example, the support member 14 is made of curing adhesive and is formed directly on the surface of the flexible circuit board 121 away from the light guide plate 13. The support member 14 is made of curing adhesive, which allows the support member 14 to be formed directly on the flexible circuit board 121, thus saving an adhesive layer.

[0080] Optionally, in one embodiment of the present application, the back plate 11 is provided entirely over the area corresponding to the flexible circuit board 121. The side of the support member 14 close to the flexible circuit board 121 is fixedly connected to the flexible circuit board 121, and the side of the support member 14 away from the flexible circuit board 121 overlaps the back plate 11.

[0081] That is, compared to the above embodiment, the back plate 11 does not have an opening k1 or groove in the area corresponding to the flexible circuit board 121, thereby eliminating the need for filler 18. Alternatively, the back plate 11 may be entirely flat. In this case, the support member 14 entirely covers and is secured to the flexible circuit board 121.

[0082] In one embodiment of the present application, a surface of the support member 14 close to the flexible circuit board 121 overlaps the flexible circuit board 121 , and a surface of the support member 14 away from the flexible circuit board 121 is fixedly connected to the back plate 11 .

[0083] In the orthographic projection pattern of the backlight module BL, the support member 14 at least covers the area of ​​the flexible circuit board 121 corresponding to the opening k1 .

[0084] That is, compared to some embodiments, the support member 14 is fixed on the back plate 11 and at least covers part of the opening k1 so that the flexible circuit board 121 is not exposed by the opening k1. In other words, the support member 14 can be provided partially or entirely.

[0085] It can be understood that the support member 14 is used to block the opening k1 so that the support strength of the portion of the flexible circuit board 121 corresponding to the opening k1 area and the portion not corresponding to the opening k1 area are as consistent as possible, thereby reducing the risk of local bulge of the flexible circuit board 121 and avoiding the risk of light leakage.

[0086] In one embodiment, the elastic modulus of the support member 14 is greater than that of the back plate 11 , thereby largely compensating for the support strength of the flexible circuit board 121 corresponding to the opening k1 area, further reducing the risk of the flexible circuit board 121 bulging due to the expansion and contraction of the light guide plate 13 .

[0087] In the embodiment where the support member 14 is fixed to the back plate 11 , the support member 14 may be fixedly connected to the back plate 11 by physical means such as welding, gluing, or interference fit.

[0088] Optionally, in one embodiment of the present application, the support member 14 is overlapped at least on opposite sides of the same opening k1.

[0089] The support member 14 is used to overlap at least the opposite sides of the opening k1 , thereby improving the stability of the support member 14 connected to the back plate 11 .

[0090] In one embodiment of the present application, the support member 14 is further extended and connected to the back panel 11 on the side of the opening k1 away from the ear hook portion 152. That is, the support member 14 overlaps three sides of the opening k1, further improving the stability of the connection between the support member 14 and the back panel 11.

[0091] In one embodiment of the present application, the backlight module BL further includes a reflective sheet 19 . The reflective sheet 19 is disposed on a side of the light guide plate 13 close to the back plate 11 . The reflective sheet 19 extends to cover a portion of the support member 14 .

[0092] The flexible circuit board 121 is fixedly connected to the light guide plate 13 via the adhesive layer 123. The thickness of the reflective sheet 19 is equal to the sum of the thicknesses of the adhesive layer 123 and the flexible circuit board 121.

[0093] The reflective sheet 19 is used to reflect the light radiated toward the back plate 11 , so as to improve the light extraction efficiency of the backlight module BL.

[0094] In addition, the thickness of the reflective sheet 19 is equal to the sum of the thicknesses of the adhesive layer 123 and the flexible circuit board 121 , so that the light guide plate 13 can be arranged flatly.

[0095] Optionally, the reflective sheet 19 is fixedly connected to the back plate 11 via an adhesive layer.

[0096] 4-6 , accordingly, the embodiment of the present application further provides a display device 1000 , which includes: a liquid crystal panel Pn and a backlight module BL as in any of the above embodiments.

[0097] The liquid crystal panel Pn is disposed on the light-emitting side of the backlight module BL.

[0098] Optionally, the liquid crystal panel Pn is fixed on a side of the overlapping portion 153 away from the backlight module BL by means of a fixing adhesive 21 .

[0099] It should be noted that the structure of the backlight module BL of the display device 1000 is similar or identical to that of the backlight module BL of any of the above embodiments, and therefore will not be described in detail here.

[0100] Optionally, the display device 1000 may include a COF 22 and a PCB 23 , wherein one end of the COF 22 is connected to the liquid crystal panel Pn, and the other end thereof is connected to the PCB 23 . The PCB 23 is fixed to the ear hook 152 via screws 24 .

[0101] Optionally, the display device 1000 further includes a light shielding tape 25 , which covers the binding area of ​​the liquid crystal panel Pn, the chip-on-film 22 , the printed circuit board 23 , the ear hook 152 and the side of the back panel 11 away from the light guide plate 13 .

[0102] The display device 1000 of the embodiment of the present application adopts a support member 14 provided between the flexible circuit board 121 and the back plate 11, and the elastic modulus of the support member 14 is greater than the elastic modulus of the flexible circuit board 121. The greater rigidity of the support member 14 is used to support the flexible circuit board 121 or improve the stiffness of the flexible circuit board 121, thereby reducing the risk of local bulging of the flexible circuit board due to the expansion and contraction of the light guide plate.

[0103] The above is a detailed introduction to a backlight module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A backlight module, comprising: Back panel; A light-emitting assembly, the light-emitting assembly being arranged on the back panel, the light-emitting assembly comprising a flexible circuit board and a light-emitting device connected to and arranged on a side of the flexible circuit board away from the back panel; a light guide plate, wherein a portion of the light guide plate is disposed on a side of the flexible circuit board away from the back plate and is fixedly connected to the flexible circuit board, and the light emitting device is disposed on one side of the light guide plate; A support member is provided between the flexible circuit board and the back plate, and an elastic modulus of the support member is greater than an elastic modulus of the flexible circuit board.

2. The backlight module according to claim 1, wherein: The backlight module further includes a frame, which includes a frame body and a hanging ear portion, wherein the frame body is connected to the periphery of the back plate, and the hanging ear portion is connected to a side of the frame body away from the light guide plate; An opening is formed on a side of the back plate close to the ear hanging portion, and the side of the opening close to the ear hanging portion passes through the frame, and the width of the opening is greater than or equal to the width of the ear hanging portion; Wherein, in the orthographic projection pattern of the backlight module, the support member at least covers the area of the flexible circuit board corresponding to the opening.

3. The backlight module according to claim 2, wherein: A side of the support member close to the flexible circuit board is fixedly connected to the flexible circuit board, and a side of the support member away from the flexible circuit board is overlapped with the back plate.

4. The backlight module according to claim 2, wherein: A side of the support member close to the flexible circuit board is overlapped with the flexible circuit board, and a side of the support member away from the flexible circuit board is fixedly connected to the back plate.

5. The backlight module according to claim 2, wherein: The backlight module further includes a filling body, and the filling body is arranged in the opening.

6. The backlight module according to claim 5, wherein: The support members are at least overlapped on opposite sides of the same opening.

7. The backlight module according to claim 6, wherein: The support member is further extended and connected to the back plate on a side of the opening away from the ear hanging portion.

8. The backlight module according to claim 7, wherein: The backlight module further includes a reflective sheet, which is arranged on a side of the light guide plate close to the back plate, and the reflective sheet extends to cover a portion of the support member; The flexible circuit board is fixedly connected to the light guide plate via an adhesive layer, and the thickness of the reflective sheet is equal to the sum of the thicknesses of the adhesive layer and the flexible circuit board.

9. The backlight module according to claim 1, wherein: The back plate is arranged on the entire surface of the area corresponding to the flexible circuit board. The side of the support member close to the flexible circuit board is fixedly connected to the flexible circuit board, and the side of the support member away from the flexible circuit board is overlapped with the back plate.

10. The backlight module according to claim 9, wherein: The supporting member is provided on the entire surface, and in the orthographic projection pattern of the backlight module, the supporting member completely covers the flexible circuit board.

11. The backlight module according to claim 9, wherein: The support member is made of curing glue, and the support member is directly formed on the surface of the flexible circuit board away from the light guide plate.

12. The backlight module according to claim 1, wherein: The elastic modulus of the support member is greater than or equal to 50 GPa.

13. The backlight module according to claim 1, wherein: The thermal conductivity of the support member is greater than or equal to 10 W / (m·K).

14. A display device comprising: Backlight module; A liquid crystal panel, the liquid crystal panel being arranged on the light-emitting side of the backlight module; The backlight module includes: Back panel; A light-emitting assembly, the light-emitting assembly being arranged on the back panel, the light-emitting assembly comprising a flexible circuit board and a light-emitting device connected to and arranged on a side of the flexible circuit board away from the back panel; a light guide plate, wherein a portion of the light guide plate is disposed on a side of the flexible circuit board away from the back plate and is fixedly connected to the flexible circuit board, and the light emitting device is disposed on one side of the light guide plate; A support member is provided between the flexible circuit board and the back plate, and an elastic modulus of the support member is greater than an elastic modulus of the flexible circuit board.

15. The display device according to claim 14, wherein The backlight module further includes a frame, which includes a frame body and a hanging ear portion, wherein the frame body is connected to the periphery of the back plate, and the hanging ear portion is connected to a side of the frame body away from the light guide plate; An opening is formed on a side of the back plate close to the ear hanging portion, and the side of the opening close to the ear hanging portion passes through the frame, and the width of the opening is greater than or equal to the width of the ear hanging portion; Wherein, in the orthographic projection pattern of the backlight module, the support member at least covers the area of the flexible circuit board corresponding to the opening.

16. The display device according to claim 15, wherein A side of the support member close to the flexible circuit board is fixedly connected to the flexible circuit board, and a side of the support member away from the flexible circuit board is overlapped with the back plate.

17. The display device according to claim 15, wherein: A side of the support member close to the flexible circuit board is overlapped with the flexible circuit board, and a side of the support member away from the flexible circuit board is fixedly connected to the back plate.

18. The display device according to claim 15, wherein The backlight module further includes a filling body, and the filling body is arranged in the opening.

19. The display device according to claim 18, wherein The support members are at least overlapped on opposite sides of the same opening.

20. The display device according to claim 19, wherein The support member is further extended and connected to the back plate on a side of the opening away from the ear hanging portion.

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