Defect detection method, storage medium and terminal

Abstract

A defect detection method, a storage medium and a terminal. The method comprises: providing a wafer to be subjected to detection, wherein said wafer comprises several rows of chips to be subjected to detection that are arranged in a first direction; acquiring the number of chips to be subjected to detection in each row, and determining whether a detection number threshold is reached; when it is determined that the number of chips to be subjected to detection in any row A is smaller than the detection number threshold, acquiring a compensation difference between the detection number threshold and the number of chips to be subjected to detection in the row A; acquiring image data to be subjected to detection of each chip to be subjected to detection; copying into the row A the image data to be subjected to detection of any chips to be subjected to detection, which are not located in the row A and the number of which is equal to the compensation difference, so as to generate virtual image data to be subjected to detection, the number of pieces of which is equal to the compensation difference; and on the basis of the virtual image data to be subjected to detection and the image data to be subjected to detection in the row A, and the image data to be subjected to detection in each row other than the row A, determining whether the chips to be subjected to detection that correspond to the image data to be subjected to detection have defects. In this way, regions, for which detection is missed, on a wafer to be subjected to detection are effectively avoided, so as to eliminate detection blind spots.

Description

Defect detection method, storage medium and terminal

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 29, 2024, with application number 202410123575.6 and invention name “Defect Detection Method, Storage Medium and Terminal”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a defect detection method, a storage medium, and a terminal. Background Art

[0003] Semiconductor integrated circuit chips are mass-produced, forming a large number of various types of semiconductor devices on the same substrate and interconnecting them to provide complete electronic functionality. Defects generated in any step can lead to circuit failure. Therefore, during the manufacturing process, it is often necessary to perform defect detection and analysis on the manufacturing structure of each step to identify the cause of the defects and eliminate them. However, with the rapid development of ultra-large-scale integrated circuits (ULSI), the integration of chips is getting higher and higher, and the size of devices is getting smaller and smaller. Correspondingly, the size of defects generated during the manufacturing process that are sufficient to affect the device yield is also getting smaller and smaller, placing higher demands on defect detection of semiconductor devices.

[0004] However, there are still many problems in the defect detection process in the existing technology.

[0005] Summary of the Invention

[0006] The technical problem solved by the present invention is to provide a defect detection method, a storage medium and a terminal to prevent missed detection in the edge area of ​​the wafer and eliminate detection blind spots.

[0007] To solve the above problems, the present invention provides a defect detection method, comprising: providing a wafer to be inspected, the wafer to be inspected comprising several rows of chips to be inspected arranged along a first direction, the chips to be inspected in each row arranged along a second direction, the first direction being perpendicular to the second direction; obtaining the number of chips to be inspected in each row, and judging whether the number of chips to be inspected in each row reaches a detection number threshold; when it is judged that the number of chips to be inspected in any row A is less than the detection number threshold, obtaining a compensation difference between the detection number threshold and the number of chips to be inspected in row A; obtaining image data to be inspected of each chip to be inspected; copying the image data to be inspected of any chip to be inspected that is not located in row A by the compensation difference to row A, generating virtual image data to be inspected by the compensation difference in row A; judging whether the chip to be inspected corresponding to the image data to be inspected has a defect based on the virtual image data to be inspected and the image data to be inspected in row A, as well as the image data to be inspected in each row that is not located in row A.

[0008] Optionally, each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected.

[0009] Optionally, the detection quantity threshold is 3, and the compensation difference is 1 or 2.

[0010] Optionally, when the number of chips to be detected in row A is 2 and the compensation difference is 1, the method for judging whether the chip to be detected corresponding to the image data to be detected is defective based on the virtual image data to be detected and the image data to be detected in row A includes: obtaining the first pixel deviation absolute value between the image data to be detected of the chip to be detected a in row A and the image data to be detected of the chip to be detected b at the corresponding pixel points at the same position; obtaining the second pixel deviation absolute value between the image data to be detected of the chip to be detected b in row A and the pixel values ​​to be detected of the virtual image data to be detected at the corresponding pixel points at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected corresponding to the image data to be detected is defective.

[0011] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect.

[0012] Optionally, when the number of chips to be detected in row A is 1 and the compensation difference is 2, the method for judging whether the chip to be detected corresponding to the image data to be detected is defective based on the virtual image data to be detected and the image data to be detected in row A includes: obtaining the first pixel deviation absolute value between the image data to be detected of the chip to be detected in row A and the pixel values ​​to be detected of the virtual image data to be detected c at corresponding pixel points at the same position; obtaining the second pixel deviation absolute value between the image data to be detected of the chip to be detected in row A and the pixel values ​​to be detected of the virtual image data to be detected d at corresponding pixel points at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected corresponding to the image data to be detected is defective.

[0013] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip to be inspected has a defect; when at least one of the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, it is judged that the chip to be inspected does not have a defect.

[0014] Optionally, the method for judging whether the chip to be detected corresponding to the image data to be detected is defective based on the image data to be detected in each row that is not located in row A includes: obtaining the first pixel deviation absolute value between the pixel values ​​to be detected at the same position corresponding to the pixel points of the image data to be detected of the chip to be detected a, the chip to be detected b and the chip to be detected c arranged arbitrarily in succession in each row; the second pixel deviation absolute value between the pixel values ​​to be detected at the same position corresponding to the pixel points of the image data to be detected of the chip to be detected c and the image data to be detected of the chip to be detected b; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected corresponding to the image data to be detected is defective.

[0015] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip c to be detected has a defect.

[0016] Optionally, the method for obtaining the number of chips to be detected in each row includes: obtaining the number of chips to be detected in each row through a first scanning process.

[0017] Optionally, the method for obtaining the image data to be detected of each chip to be detected includes: obtaining the image data to be detected of each chip to be detected through a second scanning process.

[0018] Optionally, when it is determined that the number of the chips to be inspected in each row is greater than or equal to the detection number threshold, it is determined whether the chips to be inspected corresponding to the image data to be inspected have defects based on each row of the image data to be inspected.

[0019] Optionally, after determining whether the chip to be inspected corresponding to the image data to be inspected has defects, it also includes: deleting the virtual image data to be inspected in row A; forming a scanned image based on the image data to be inspected in each row, and marking the defect position of the chip to be inspected in the scanned image.

[0020] Correspondingly, the technical solution of the present invention further provides a storage medium on which computer instructions are stored, characterized in that when the computer instructions are executed, the steps of the method described in any of the above technical solutions are executed.

[0021] Correspondingly, the technical solution of the present invention also provides a terminal, including a memory and a processor, wherein the memory stores computer instructions that can be run on the processor, and is characterized in that when the processor runs the computer instructions, it executes the steps of the method described in any of the above technical solutions.

[0022] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0023] In the defect detection method of the technical solution of the present invention, when it is detected that the number of the chips to be detected in any row A is less than the detection number threshold, the image data to be detected of any chip to be detected with the compensation difference that is not in row A is copied to row A, and virtual image data to be detected with the compensation difference is generated in row A, thereby effectively preventing the existence of areas where detection is missed in the wafer to be detected and eliminating detection blind spots.

[0024] Furthermore, after determining whether the chip to be inspected corresponding to the image data to be inspected has a defect, the method further includes: deleting the virtual image data to be inspected in row A; forming a scanned image based on each row of the image data to be inspected, and marking the defect location of the chip to be inspected in the scanned image. By printing the physical scanned image, the detected defect location is more intuitively presented. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figures 1 to 3 are schematic structural diagrams of various steps of a defect detection method;

[0026] FIG4 is a flow chart of a defect detection method according to an embodiment of the present invention;

[0027] 5 to 10 are schematic structural diagrams of the steps of a defect detection method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] As described in the background art, the defect detection process in the prior art still has many problems, which will be described in detail below with reference to the accompanying drawings.

[0029] 1 to 3 are schematic diagrams of the structure of each step of a defect detection method.

[0030] Please refer to Figure 1, a wafer 100 to be inspected is provided, and the wafer 100 to be inspected includes several rows of chips to be inspected arranged along a first direction X, and each row of the chips to be inspected is arranged along a second direction Y, and the first direction X is perpendicular to the second direction Y. The several chips to be inspected include: a first chip to be inspected 101, a second chip to be inspected 102, and a third chip to be inspected 103 arranged and adjacent to each other along the first direction X.

[0031] Please refer to Figure 2, and obtain the first image data 101a to be detected of the first chip to be detected 101, the second image data 102a to be detected of the second chip to be detected 102, and the third image data 103a to be detected of the third chip to be detected 103 respectively. The first image data 101a to be detected, the second image data 102a to be detected and the third image data 103a to be detected have the same arrangement and number of pixels, wherein each pixel point of the first image data 101a to be detected has a first pixel value to be detected, each pixel point of the second image data 102a to be detected has a second pixel value to be detected, and each pixel point of the third image data 103a to be detected has a third pixel value to be detected.

[0032] Please refer to Figure 3. Compare the first image data to be detected 101a with the second image data to be detected 102a to obtain the first pixel value to be detected for each pixel point in the first image data to be detected 101a, and the first pixel deviation absolute value between the first pixel value to be detected and the second pixel value to be detected corresponding to the pixel point at the same position in the second image data to be detected 102a; compare the second image data to be detected 102a with the third image data to be detected 103a to obtain the second pixel value to be detected for each pixel point in the second image data to be detected 102a, and the second pixel deviation absolute value between the third pixel value to be detected corresponding to the pixel point at the same position in the third image data to be detected 103a; provide a pixel detection threshold; compare each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to determine whether the first chip to be detected 101, the second chip to be detected 102 and the third chip to be detected 103 have defects.

[0033] 3 , in one embodiment, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the second chip to be inspected 102 has a defect.

[0034] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the first chip to be inspected 101 has a defect (not shown).

[0035] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the third chip to be inspected 103 has a defect (not shown).

[0036] For defect scanning of the wafer 100 to be inspected, current scanning machines in the industry detect defects by comparing the inspected chip with the adjacent chips on both sides arranged along the first direction X. To meet current wafer defect detection methods, the number of inspected chips in each row must be greater than or equal to three.

[0037] However, when approaching the edge area of ​​the wafer to be inspected, the number of chips in a row to be inspected is often less than 3 and cannot be scanned and compared, resulting in no defect information for the chips to be inspected in this row, which in turn increases the risk of low wafer yield.

[0038] On this basis, the present invention provides a defect detection method, storage medium and terminal. When it is detected that the number of the chips to be detected in any row A is less than the detection number threshold, the image data to be detected of any chip to be detected with the compensation difference that is not in row A is copied to row A, and virtual image data to be detected with the compensation difference is generated in row A, thereby effectively preventing the existence of areas where detection is missed in the wafer to be detected and eliminating detection blind spots.

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0040] FIG4 is a flow chart of a defect detection method according to an embodiment of the present invention.

[0041] Referring to FIG4 , the defect detection method includes:

[0042] Step S101, providing a wafer to be inspected, wherein the wafer to be inspected includes a plurality of rows of chips to be inspected arranged along a first direction, and each row of chips to be inspected is arranged along a second direction, and the first direction is perpendicular to the second direction;

[0043] Step S102, obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection number threshold;

[0044] Step S103, when it is determined that the number of the chips to be detected in any row A is less than the detection number threshold, obtaining a compensation difference between the detection number threshold and the number of the chips to be detected in row A;

[0045] Step S104, obtaining the image data to be inspected of each chip to be inspected;

[0046] Step S105 , copying the image data to be inspected of any chip to be inspected that is not in row A and has the compensated difference value to be inspected into row A, and generating virtual image data to be inspected that has the compensated difference value in row A;

[0047] Step S106 , judging whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row A, and the image data to be inspected in each row not in row A.

[0048] The following will describe in detail the various steps of the defect detection method with reference to the accompanying drawings.

[0049] 5 to 10 are schematic structural diagrams of the steps of a defect detection method according to an embodiment of the present invention.

[0050] 5 , a wafer 200 to be inspected is provided. The wafer 200 to be inspected includes several rows of chips 201 to be inspected arranged along a first direction X. Each row of chips 201 to be inspected is arranged along a second direction Y. The first direction X is perpendicular to the second direction Y.

[0051] It should be noted that, in this embodiment, the plurality of chips to be inspected 201 are divided by cutting lanes. After the chips to be inspected 201 are defect-detected, the cutting lanes are subsequently cut so that the wafer to be inspected 200 is divided into the plurality of chips to be inspected 201 .

[0052] Please refer to FIG. 6 , the number of the chips to be detected 201 in each row is obtained, and it is determined whether the number of the chips to be detected 201 in each row reaches a detection number threshold.

[0053] In this embodiment, the method for obtaining the number of the chips to be detected 201 in each row includes: obtaining the number of the chips to be detected 201 in each row through a first scanning process 202 .

[0054] In this embodiment, the path of the first scanning process 202 is scanned according to the "S"-shaped path as shown in the figure. The first scanning process 202 is only used to detect the number of the chips 201 to be detected in each row, and is not used to obtain image data of each chip 201 to be detected.

[0055] 6 , when it is determined that the number of the chips 201 to be detected in any row A is less than the detection number threshold, a compensation difference between the detection number threshold and the number of the chips 201 to be detected in row A is obtained.

[0056] It should be noted that since the wafer 200 to be inspected is a circular structure, the width of the wafer 200 to be inspected decreases gradually from the center to the edge. Therefore, in the edge area of ​​the wafer 200 to be inspected, the number of chips 201 to be inspected is often less than the detection number threshold.

[0057] In this embodiment, it is shown that the number of the chips 201 to be detected in the edge areas on both sides of the wafer 200 to be detected is less than the detection number threshold. Specifically, it is shown that the number of the chips 201 to be detected in row A is 1.

[0058] In other embodiments, there may be two chips 201 to be detected in row A.

[0059] In other embodiments, the number of the chips 201 to be detected in each row may be greater than or equal to 3.

[0060] In this embodiment, the detection threshold is 3. This is because the subsequent scanning machine uses a row detection principle when performing defect detection. Defects are detected by comparing the chips 201 to be detected in the middle of each row with the chips 201 to be detected on both sides of the scanner. In other words, the chips 201 to be detected are compared with two adjacent chips 201 to be detected along the first direction X. Therefore, the number of chips 201 to be detected in each row must be greater than or equal to 3; otherwise, comparison detection cannot be performed.

[0061] In this embodiment, since the number of the chip to be detected 201 in row A is 1 and the detection quantity threshold is 3, the compensation difference is 2.

[0062] In other embodiments, when the number of the chips 201 to be detected in row A is 2, the compensation difference is 1.

[0063] In other embodiments, when the number of the chips 201 to be inspected in each row is greater than or equal to 3, it is not necessary to obtain the compensation difference.

[0064] Please refer to FIG. 7 , and obtain the image data to be inspected of each of the chips to be inspected 201 .

[0065] In this embodiment, the method for obtaining the image data to be detected of each chip to be detected 201 includes: obtaining the image data to be detected of each chip to be detected 201 through a second scanning process 203 .

[0066] In this embodiment, the path of the second scanning process 203 is also scanned according to the "S"-shaped path shown above. The second scanning process 203 is used to obtain image data of each chip to be detected 201, and after obtaining the image data of each chip to be detected 201, it is stored in sequence.

[0067] It should be noted that, in this embodiment, each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected, so that it can be used for subsequent comparison between different image data to be detected.

[0068] 8 , the image data to be detected of any chip to be detected 201 with the compensation difference that is not in row A is copied to row A, and virtual image data to be detected with the compensation difference is generated in row A.

[0069] In this embodiment, two corresponding image data to be detected are randomly selected from the chips to be detected 201 that are not located in row A and copied to row A, so as to generate two virtual image data to be detected in row A.

[0070] In other embodiments, when the number of the chips 201 to be detected in row A is 2, one corresponding image data to be detected is randomly selected from the chips 201 to be detected that are not in row A and copied to row A to generate one virtual image data to be detected in row A.

[0071] In other embodiments, when the number of the chips 201 to be inspected in each row is greater than or equal to 3, it is not necessary to perform compensation processing on the virtual image data to be inspected for any row.

[0072] 9 , based on the virtual image data to be detected and the image data to be detected in row A, as well as the image data to be detected in each row not in row A, it is determined whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0073] In this embodiment, when it is detected that the number of the chips to be detected 201 in any row A is less than the detection number threshold, the image data to be detected of any chip to be detected 201 with the compensation difference that is not located in row A is copied to row A, and virtual image data to be detected with the compensation difference is generated in row A, thereby effectively preventing the existence of areas where detection is missed in the wafer to be detected 200 and eliminating detection blind spots.

[0074] Please continue to refer to Figure 9. In this embodiment, the number of chips 201 to be detected in row A is 1, and the compensation difference is 2. The method for judging whether the chip 201 to be detected corresponding to the image data to be detected has defects based on the virtual image data to be detected and the image data to be detected in row A includes: obtaining the first pixel deviation absolute value between the image data to be detected of the chip 201 to be detected in row A and the pixel values ​​to be detected of the virtual image data to be detected c at the corresponding pixel points at the same position; obtaining the second pixel deviation absolute value between the image data to be detected of the chip 201 to be detected in row A and the pixel values ​​to be detected of the virtual image data to be detected d at the corresponding pixel points at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to judge whether the chip 201 to be detected corresponding to the image data to be detected has defects.

[0075] Please continue to refer to FIG. 9 . Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip to be detected 201 a has a defect.

[0076] When at least one of the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, it is determined that the chip to be inspected does not have defects (not shown).

[0077] In other embodiments, when the number of chips to be inspected in row A is 2 and the compensation difference is 1, the method for judging whether the chip to be inspected corresponding to the image data to be inspected is defective based on the virtual image data to be inspected and the image data to be inspected in row A includes: obtaining the first pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row A and the image data to be inspected of the chip to be inspected b at the corresponding pixel points at the same position; obtaining the second pixel deviation absolute value between the image data to be inspected of the chip to be inspected b in row A and the pixel values ​​to be inspected of the virtual image data to be inspected; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be inspected corresponding to the image data to be inspected is defective. Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect (not shown).

[0078] In this embodiment, the method for judging whether the chip to be detected 201 corresponding to the image data to be detected has defects based on the image data to be detected in each row that is not located in row A includes: obtaining the first pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data to be detected of the chip to be detected a201, the chip to be detected b201 and the chip to be detected c201 arranged arbitrarily in succession in each row; the second pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data to be detected of the chip to be detected c201 and the pixel values ​​to be detected of the image data to be detected of the chip to be detected b201; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0079] Please continue to refer to FIG. 9 . Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip b201 to be detected has a defect.

[0080] When the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a201 to be detected has a defect (not shown).

[0081] When the first pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the second pixel deviation value is larger than the pixel detection threshold, it is determined that the chip to be detected c201 has a defect (not shown).

[0082] In other embodiments, when the number of chips to be inspected in each row is determined to be greater than or equal to 3, a determination is made based on each row of the image data to be inspected to determine whether the chip to be inspected corresponding to the image data to be inspected is defective. The specific comparison process is the same as the method for determining whether the chip to be inspected corresponding to the image data to be inspected is defective based on each row of the image data to be inspected that is not in row A, and will not be further described here.

[0083] Please refer to Figure 10. After determining whether the chip to be inspected 201 corresponding to the image data to be inspected has defects, delete the virtual image data to be inspected in row A; a scanned image 300 is formed based on the image data to be inspected in each row, and the defect position 301 of the chip to be inspected 201 is marked in the scanned image 300.

[0084] In this embodiment, the detected defect position is presented more intuitively by printing out the physical scan image 300 .

[0085] Correspondingly, an embodiment of the present invention further provides a storage medium on which computer instructions are stored, characterized in that when the computer instructions are executed, the steps of the method described in any of the above embodiments are executed.

[0086] Correspondingly, an embodiment of the present invention also provides a terminal, including a memory and a processor, wherein the memory stores computer instructions that can be run on the processor, and is characterized in that when the processor runs the computer instructions, it executes the steps of the method described in any of the above embodiments.

[0087] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A defect detection method, characterized in that: include: Providing a wafer to be inspected, the wafer to be inspected comprising a plurality of rows of chips to be inspected arranged along a first direction, each row of chips to be inspected arranged along a second direction, the first direction being perpendicular to the second direction; Obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection number threshold; When it is determined that the number of the chips to be detected in any row A is less than the detection number threshold, obtaining a compensation difference between the detection number threshold and the number of the chips to be detected in row A; Acquiring the image data to be inspected of each chip to be inspected; Copying the image data to be detected of any chip to be detected by the compensation difference value that is not in row A to row A, and generating virtual image data to be detected by the compensation difference value in row A; According to the virtual image data to be inspected and the image data to be inspected in row A, and each row of image data to be inspected not located in row A, it is determined whether the chip to be inspected corresponding to the image data to be inspected has defects.

2. The defect detection method according to claim 1, wherein: Each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected.

3. The defect detection method according to claim 2, wherein: The detection quantity threshold is 3, and the compensation difference is 1 or 2.

4. The defect detection method according to claim 3, wherein: When the number of chips to be detected in row A is 2 and the compensation difference is 1, the method for judging whether the chip to be detected corresponding to the image data to be detected has defects based on the virtual image data to be detected and the image data to be detected in row A includes: obtaining the first pixel deviation absolute value between the pixel values to be detected at the corresponding pixel points at the same position of the image data to be detected of the chip to be detected a in row A and the image data to be detected of the chip to be detected b; obtaining the second pixel deviation absolute value between the pixel values to be detected at the corresponding pixel points at the same position of the image data to be detected of the chip to be detected b in row A and the virtual image data to be detected; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to judge whether the chip to be detected corresponding to the image data to be detected has defects.

5. The defect detection method according to claim 4, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect.

6. The defect detection method according to claim 3, wherein: When the number of chips to be detected in row A is 1 and the compensation difference is 2, the method for judging whether the chip to be detected corresponding to the image data to be detected has defects based on the virtual image data to be detected and the image data to be detected in row A includes: obtaining the first pixel deviation absolute value between the image data to be detected of the chip to be detected in row A and the pixel values to be detected of the virtual image data to be detected c at corresponding pixel points at the same position; obtaining the second pixel deviation absolute value between the image data to be detected of the chip to be detected in row A and the pixel values to be detected of the virtual image data to be detected d at corresponding pixel points at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to judge whether the chip to be detected corresponding to the image data to be detected has defects.

7. The defect detection method according to claim 6, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip to be inspected a has a defect; when at least one of the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, it is judged that the chip to be inspected does not have a defect.

8. The defect detection method according to claim 2, wherein: A method for determining whether a chip to be detected corresponding to the image data to be detected has defects based on the image data to be detected in each row that is not located in row A includes: obtaining a first pixel deviation absolute value between the pixel values to be detected at the same position of the image data to be detected of the chip to be detected and the pixel values to be detected of the image data to be detected of the chip to be detected and the chip to be detected b in each row of the arbitrarily arranged chips to be detected, and obtaining a second pixel deviation absolute value between the pixel values to be detected at the same position of the image data to be detected of the chip to be detected and the pixel values to be detected of the image data to be detected of the chip to be detected; providing a pixel detection threshold; and comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects.

9. The defect detection method according to claim 8, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip b to be inspected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a to be inspected has a defect; When the first pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the second pixel deviation value is larger than the pixel detection threshold, it is determined that the chip c to be inspected has a defect.

10. The defect detection method according to claim 1, wherein: The method for obtaining the number of the chips to be detected in each row includes: obtaining the number of the chips to be detected in each row through a first scanning process.

11. The defect detection method according to claim 1, wherein: The method for acquiring the image data to be detected of each chip to be detected includes: acquiring the image data to be detected of each chip to be detected through a second scanning process.

12. The defect detection method according to claim 1, wherein: When it is determined that the number of the chips to be inspected in each row is greater than or equal to the detection number threshold, it is determined whether the chips to be inspected corresponding to the image data to be inspected have defects based on each row of the image data to be inspected.

13. The defect detection method according to claim 1, wherein: After determining whether the chip to be inspected corresponding to the image data to be inspected has defects, it also includes: deleting the virtual image data to be inspected in row A; forming a scanned image based on the image data to be inspected in each row, and marking the defect position of the chip to be inspected in the scanned image.

14. A storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed, the steps of the method according to any one of claims 1 to 13 are executed.

15. A terminal comprising a memory and a processor, wherein the memory stores computer instructions that can be executed on the processor, characterized in that: When the processor runs the computer instructions, the steps of the method according to any one of claims 1 to 13 are performed.

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