Defect detection method, storage medium and terminal

Abstract

A defect detection method, a storage medium and a terminal. The method comprises: providing a wafer to be subjected to detection (100), wherein said wafer (100) comprises several rows of chips to be subjected to detection that are arranged in a first direction (X), chips to be subjected to detection in each row are arranged in a second direction (Y), and the first direction (X) is perpendicular to the second direction (Y) (S101); acquiring the number of chips to be subjected to detection in each row, and determining whether a detection number threshold is reached (S102); acquiring image data to be subjected to detection of each chip to be subjected to detection (S103); when it is determined that the number of chips to be subjected to detection in any row A is smaller than the detection number threshold, copying, into any row B other than the row A, the image data to be subjected to detection of the chips to be subjected to detection in the row A, and generating in the row B virtual image data to be subjected to detection, the number of pieces of which is equal to the number of chips to be subjected to detection in the row A (S104); and on the basis of the virtual image data to be subjected to detection and the image data to be subjected to detection in the row B, and the image data to be subjected to detection in each row other than the row B, determining whether the chips to be subjected to detection that correspond to the image data to be subjected to detection have defects (S105). In this way, regions, for which detection is missed, on a wafer to be subjected to detection (100) are effectively avoided, so as to eliminate detection blind spots; moreover, additional redundant data comparison is not added, so that the time for data processing can be effectively reduced, thereby improving the detection efficiency.

Description

Defect detection method, storage medium and terminal

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 29, 2024, with application number 202410126428.4 and invention name “Defect Detection Method, Storage Medium and Terminal”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a defect detection method, a storage medium and a terminal. Background Art

[0003] Semiconductor integrated circuit chips are mass-produced, forming a large number of various types of semiconductor devices on the same substrate and interconnecting them to provide complete electronic functionality. Defects generated in any step can lead to circuit failure. Therefore, during the manufacturing process, it is often necessary to perform defect detection and analysis on the manufacturing structure of each step to identify the cause of the defects and eliminate them. However, with the rapid development of ultra-large-scale integrated circuits (ULSI), the integration of chips is getting higher and higher, and the size of devices is getting smaller and smaller. Correspondingly, the size of defects generated during the manufacturing process that are sufficient to affect the device yield is also getting smaller and smaller, placing higher demands on defect detection of semiconductor devices.

[0004] However, there are still many problems in the defect detection process in the existing technology.

[0005] Summary of the Invention

[0006] The technical problem solved by the present invention is to provide a defect detection method, a storage medium and a terminal to prevent missed detection in the edge area of ​​the wafer and eliminate detection blind spots.

[0007] To solve the above problems, the present invention provides a defect detection method, comprising: providing a wafer to be inspected, the wafer to be inspected comprising several rows of chips to be inspected arranged along a first direction, the chips to be inspected in each row being arranged along a second direction, the first direction being perpendicular to the second direction; obtaining the number of chips to be inspected in each row, and judging whether the number of chips to be inspected in each row reaches a detection number threshold; obtaining image data to be inspected of each chip to be inspected; when it is judged that the number of chips to be inspected in any row A is less than the detection number threshold, copying the image data to be inspected of each chip to be inspected in row A to any row B that is not located in row A, and generating virtual image data to be inspected in row B for the number of chips to be inspected in row A; judging whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B, as well as the image data to be inspected in each row that is not located in row B.

[0008] Optionally, each of the image data to be detected has pixels with the same arrangement and number, and each pixel has a pixel value to be detected.

[0009] Optionally, the number of the chips to be detected in row A is 1 or 2.

[0010] Optionally, when the number of chips to be inspected in row A is 2, a method for determining whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B includes: obtaining a first pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the image data to be inspected of the chip to be inspected b adjacent to the chip to be inspected along the first direction at corresponding pixel values ​​at the same position, where the chip to be inspected a is the starting chip to be inspected in row B; obtaining a second pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the pixel values ​​to be inspected of the virtual image data to be inspected c at corresponding pixel values ​​at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be inspected corresponding to the image data to be inspected has defects.

[0011] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip to be detected a has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip to be detected b has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data c to be detected has a defect.

[0012] Optionally, when the number of chips to be inspected in row A is 2, the method for judging whether the chip to be inspected corresponding to the image data to be inspected is defective based on the virtual image data to be inspected and the image data to be inspected in row B also includes: obtaining the third pixel deviation absolute value between the image data to be inspected of the chip to be inspected d in row B and the image data to be inspected of the chip to be inspected e adjacent to the chip to be inspected along the first direction at the corresponding pixel values ​​at the same position, and the chip to be inspected e is the terminal chip to be inspected in row B; obtaining the fourth pixel deviation absolute value between the image data to be inspected of the chip to be inspected e in row B and the pixel values ​​to be inspected of the virtual image data to be inspected f at the corresponding pixel values ​​at the same position; providing a pixel detection threshold; comparing each of the third pixel deviation absolute values ​​and each of the fourth pixel deviation absolute values ​​with the pixel detection threshold respectively to judge whether the chip to be inspected corresponding to the image data to be inspected is defective.

[0013] Optionally, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data f to be detected has a defect.

[0014] Optionally, when the number of the chips to be detected in row A is 1, a method for determining whether the chip to be detected corresponding to the image data to be detected has defects based on the virtual image data to be detected and the image data to be detected in row B includes: obtaining a first pixel deviation absolute value between the image data to be detected of the chip to be detected a in row B and the image data to be detected of the chip to be detected b adjacent to the chip to be detected along the first direction at corresponding pixel values ​​at the same position, wherein the chip to be detected a is the starting chip to be detected in row B; obtaining a second pixel deviation absolute value between the image data to be detected of the chip to be detected a in row B and the pixel values ​​to be detected of the virtual image data to be detected c at corresponding pixel values ​​at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the image data. The method comprises the following steps: comparing the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects; or obtaining the third pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data of the chip to be detected d in row B and the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects; or obtaining the third pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data of the chip to be detected d in row B and the pixel detection threshold with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects. The method comprises the following steps:

[0015] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip a to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data to be detected c has a defect; or, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data to be detected c has a defect.

[0016] Optionally, the method for judging whether the chip to be detected corresponding to the image data to be detected has defects based on the image data to be detected in each row that is not located in row B includes: obtaining the first pixel deviation absolute value between the pixel values ​​to be detected at the same position corresponding to the image data of the chip to be detected a, the chip to be detected b and the chip to be detected c arranged arbitrarily in succession in each row; the second pixel deviation absolute value between the pixel values ​​to be detected at the same position corresponding to the image data of the chip to be detected c and the pixel values ​​to be detected of the image data to be detected b; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to judge whether the chip to be detected corresponding to the image data to be detected has defects.

[0017] Optionally, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip b to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip a to be detected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip c to be detected has a defect.

[0018] Optionally, the method for obtaining the number of chips to be detected in each row includes: obtaining the number of chips to be detected in each row through a first scanning process.

[0019] Optionally, the method for obtaining the image data to be detected of each chip to be detected includes: obtaining the image data to be detected of each chip to be detected through a second scanning process.

[0020] Optionally, when it is determined that the number of the chips to be inspected in each row is greater than or equal to the detection number threshold, it is determined whether the chips to be inspected corresponding to the image data to be inspected have defects based on each row of the image data to be inspected.

[0021] Optionally, after determining whether the chip to be inspected corresponding to the image data to be inspected has defects, it also includes: restoring the virtual image data to be inspected in row B to row A; forming a scanned image based on the image data to be inspected in each row, and marking the defect position of the chip to be inspected in the scanned image.

[0022] Correspondingly, the technical solution of the present invention further provides a storage medium on which computer instructions are stored, characterized in that when the computer instructions are executed, the steps of the method described in any of the above technical solutions are executed.

[0023] Correspondingly, the technical solution of the present invention also provides a terminal, including a memory and a processor, wherein the memory stores computer instructions that can be run on the processor, and is characterized in that when the processor runs the computer instructions, it executes the steps of the method described in any of the above technical solutions.

[0024] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0025] In the defect detection method of the technical solution of the present invention, when it is detected that the number of chips to be inspected in any row A is less than the detection number threshold, the image data to be inspected of each chip to be inspected in row A is copied to any row B not located in row A, and virtual image data to be inspected is generated in row B for the same number of chips to be inspected in row A. This effectively prevents the presence of areas of the wafer to be inspected that are missed during inspection and eliminates detection blind spots. In addition, by copying the image data to be inspected in row A to row B for data comparison, no additional redundant data comparison is added during this process, which can effectively reduce data processing time and improve detection efficiency.

[0026] Furthermore, after determining whether the chip to be inspected corresponding to the image data to be inspected has a defect, the method further includes: restoring the virtual image data to be inspected in row B to row A; forming a scanned image based on each row of the image data to be inspected, and marking the defect location of the chip to be inspected in the scanned image. By printing out the physical scanned image, the detected defect location is more intuitively presented. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figures 1 to 3 are schematic structural diagrams of various steps of a defect detection method;

[0028] FIG4 is a flow chart of a defect detection method according to an embodiment of the present invention;

[0029] 5 to 10 are schematic structural diagrams of the steps of a defect detection method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] As described in the background art, the defect detection process in the prior art still has many problems, which will be described in detail below with reference to the accompanying drawings.

[0031] 1 to 3 are schematic diagrams of the structure of each step of a defect detection method.

[0032] Please refer to Figure 1, a wafer 100 to be inspected is provided, and the wafer 100 to be inspected includes several rows of chips to be inspected arranged along a first direction X, and each row of the chips to be inspected is arranged along a second direction Y, and the first direction X is perpendicular to the second direction Y. The several chips to be inspected include: a first chip to be inspected 101, a second chip to be inspected 102, and a third chip to be inspected 103 arranged and adjacent to each other along the first direction X.

[0033] Please refer to Figure 2, and obtain the first image data 101a to be detected of the first chip to be detected 101, the second image data 102a to be detected of the second chip to be detected 102, and the third image data 103a to be detected of the third chip to be detected 103 respectively. The first image data 101a to be detected, the second image data 102a to be detected and the third image data 103a to be detected have the same arrangement and number of pixels, wherein each pixel point of the first image data 101a to be detected has a first pixel value to be detected, each pixel point of the second image data 102a to be detected has a second pixel value to be detected, and each pixel point of the third image data 103a to be detected has a third pixel value to be detected.

[0034] Please refer to Figure 3. Compare the first image data to be detected 101a with the second image data to be detected 102a to obtain the first pixel value to be detected for each pixel point in the first image data to be detected 101a, and the first pixel deviation absolute value between the first pixel value to be detected and the second pixel value to be detected corresponding to the pixel point at the same position in the second image data to be detected 102a; compare the second image data to be detected 102a with the third image data to be detected 103a to obtain the second pixel value to be detected for each pixel point in the second image data to be detected 102a, and the second pixel deviation absolute value between the third pixel value to be detected corresponding to the pixel point at the same position in the third image data to be detected 103a; provide a pixel detection threshold; compare each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to determine whether the first chip to be detected 101, the second chip to be detected 102 and the third chip to be detected 103 have defects.

[0035] 3 , in one embodiment, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the second chip to be inspected 102 has a defect.

[0036] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold and the second pixel deviation value is less than the pixel detection threshold, it is determined that the first chip to be inspected 101 has a defect (not shown).

[0037] In one embodiment, when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the third chip to be inspected 103 has a defect (not shown).

[0038] For defect scanning of the wafer 100 to be inspected, current scanning machines in the industry detect defects by comparing the inspected chip with the adjacent chips on both sides arranged along the first direction X. To meet current wafer defect detection methods, the number of inspected chips in each row must be greater than or equal to three.

[0039] However, when approaching the edge area of ​​the wafer to be inspected, the number of chips in a row to be inspected is often less than 3 and cannot be scanned and compared, resulting in no defect information for the chips to be inspected in this row, which in turn increases the risk of low wafer yield.

[0040] On this basis, the present invention provides a defect detection method, storage medium, and terminal. When it is detected that the number of chips to be detected in any row A is less than the detection number threshold, the method copies the image data to be detected of each chip to be detected in row A to any row B that is not in row A, and generates virtual image data to be detected in row B for the same number of chips to be detected in row A. This effectively prevents the presence of areas of the wafer to be detected that are missed, eliminating detection blind spots. In addition, by copying the image data to be detected in row A to row B for data comparison, no additional redundant data comparison is added in this process, which can effectively reduce data processing time and improve detection efficiency.

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0042] FIG4 is a flow chart of a defect detection method according to an embodiment of the present invention.

[0043] Referring to FIG4 , the defect detection method includes:

[0044] Step S101, providing a wafer to be inspected, wherein the wafer to be inspected includes a plurality of rows of chips to be inspected arranged along a first direction, and each row of chips to be inspected is arranged along a second direction, and the first direction is perpendicular to the second direction;

[0045] Step S102, obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection number threshold;

[0046] Step S103, obtaining the image data to be inspected of each chip to be inspected;

[0047] Step S104: When it is determined that the number of chips to be inspected in any row A is less than the inspection number threshold, the image data to be inspected of each chip to be inspected in row A is copied to any row B that is not in row A, and virtual image data to be inspected is generated in row B for the same number of chips to be inspected in row A.

[0048] Step S105 , judging whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B, and the image data to be inspected in each row not in row B.

[0049] The following will describe in detail the various steps of the defect detection method with reference to the accompanying drawings.

[0050] 5 to 10 are schematic structural diagrams of the steps of a defect detection method according to an embodiment of the present invention.

[0051] 5 , a wafer 200 to be inspected is provided. The wafer 200 to be inspected includes several rows of chips 201 to be inspected arranged along a first direction X. Each row of chips 201 to be inspected is arranged along a second direction Y. The first direction X is perpendicular to the second direction Y.

[0052] It should be noted that, in this embodiment, the plurality of chips to be inspected 201 are divided by cutting lanes. After the chips to be inspected 201 are defect-detected, the cutting lanes are subsequently cut so that the wafer to be inspected 200 is divided into the plurality of chips to be inspected 201 .

[0053] 6 , the number of the chips to be detected 201 in each row is obtained, and it is determined whether the number of the chips to be detected 201 in each row reaches a detection number threshold.

[0054] In this embodiment, the method for obtaining the number of the chips to be detected 201 in each row includes: obtaining the number of the chips to be detected 201 in each row through a first scanning process 202 .

[0055] In this embodiment, the path of the first scanning process 202 is scanned according to the "S"-shaped path as shown in the figure. The first scanning process 202 is only used to detect the number of the chips 201 to be detected in each row, and is not used to obtain image data of each chip 201 to be detected.

[0056] It should be noted that since the wafer 200 to be inspected is a circular structure, the width of the wafer 200 to be inspected decreases gradually from the center to the edge. Therefore, in the edge area of ​​the wafer 200 to be inspected, the number of chips 201 to be inspected is often less than the detection number threshold.

[0057] In this embodiment, it is shown that the number of the chips 201 to be detected in the edge areas on both sides of the wafer 200 to be detected is less than the detection number threshold. Specifically, it is shown that the number of the chips 201 to be detected in row A is 1.

[0058] In other embodiments, there may be two chips 201 to be detected in row A.

[0059] In other embodiments, the number of the chips 201 to be detected in each row may be greater than or equal to 3.

[0060] In this embodiment, the detection threshold is 3. This is because the subsequent scanning machine uses a row detection principle when performing defect detection. Defects are detected by comparing the chips 201 to be detected in the middle of each row with the chips 201 to be detected on both sides of the scanner. In other words, the chips 201 to be detected are compared with two adjacent chips 201 to be detected along the first direction X. Therefore, the number of chips 201 to be detected in each row must be greater than or equal to 3; otherwise, comparison detection cannot be performed.

[0061] Please refer to FIG. 7 , and obtain the image data to be inspected of each of the chips to be inspected 201 .

[0062] In this embodiment, the method for obtaining the image data to be detected of each chip to be detected 201 includes: obtaining the image data to be detected of each chip to be detected 201 through a second scanning process 203 .

[0063] In this embodiment, the path of the second scanning process 203 is also scanned according to the "S"-shaped path shown above. The second scanning process 203 is used to obtain image data of each chip to be detected 201, and after obtaining the image data of each chip to be detected 201, it is stored in sequence.

[0064] It should be noted that, in this embodiment, each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected, so that it can be used for subsequent comparison between different image data to be detected.

[0065] Please refer to Figure 8. When it is determined that the number of the chips 201 to be detected in any row A is less than the detection number threshold, the image data to be detected of each chip 201 to be detected in row A is copied to any row B that is not in row A, and virtual image data to be detected are generated in row B for the number of chips 201 to be detected in row A.

[0066] In this embodiment, one piece of image data to be detected in row A is copied to row B, so as to generate one piece of virtual image data to be detected in row B.

[0067] In other embodiments, when the number of the chips 201 to be inspected in row A is two, the two image data to be inspected in row A are copied to row B to generate two virtual image data to be inspected in row B.

[0068] In other embodiments, when the number of the chips 201 to be inspected in each row is greater than or equal to 3, it is not necessary to perform compensation processing on the virtual image data to be inspected for any row.

[0069] 9 , based on the virtual image data to be detected and the image data to be detected in row B, as well as the image data to be detected in each row not in row B, it is determined whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0070] In this embodiment, when it is detected that the number of chips 201 to be inspected in any row A is less than the detection number threshold, the image data to be inspected for each chip 201 to be inspected in row A is copied to any row B not located in row A, thereby generating virtual image data to be inspected in row B equal to the number of chips 201 to be inspected in row A. This effectively prevents areas of the wafer 200 to be inspected from being missed and eliminates inspection blind spots. In addition, by copying the image data to be inspected in row A to row B for data comparison, no additional redundant data comparison is added during this process, effectively reducing data processing time and improving inspection efficiency.

[0071] Please continue to refer to Figure 9. In this embodiment, the number of the chips to be detected 201 in row A is 1. According to the virtual image data to be detected and the image data to be detected in row B, the method for determining whether the chip to be detected 201 corresponding to the image data to be detected has defects includes: obtaining a first pixel deviation absolute value between the image data to be detected of the chip to be detected a201 in row B and the image data to be detected of the chip to be detected b201 adjacent to the chip to be detected along the first direction X at corresponding pixel values ​​at the same position, where the chip to be detected a201 is the starting chip to be detected 201 in row B; obtaining a second pixel deviation absolute value between the image data to be detected of the chip to be detected a201 in row B and the pixel values ​​to be detected of the virtual image data to be detected c at corresponding pixel values ​​at the same position; providing a pixel detection threshold; and comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0072] Please continue to refer to FIG. 9 . Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip a201 to be detected has a defect.

[0073] When the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be inspected has a defect (not shown).

[0074] When the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be detected corresponding to the virtual image data c to be detected has a defect (not shown).

[0075] Alternatively, obtain the third pixel deviation absolute value between the pixel values ​​to be detected at the same pixel position corresponding to the image data of the chip to be detected d in row B and the pixel values ​​to be detected of the chip to be detected e adjacent to the chip to be detected along the first direction, and the chip to be detected e is located at the terminal chip to be detected in row B; obtain the fourth pixel deviation absolute value between the pixel values ​​to be detected of the image data to be detected e in row B and the pixel values ​​to be detected of the virtual image data c at the same pixel position corresponding to the pixel point; provide a pixel detection threshold; compare each of the third pixel deviation absolute values ​​and each of the fourth pixel deviation absolute values ​​with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected has a defect (not shown). Correspondingly, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data c to be detected has a defect (not shown).

[0076] In other embodiments, when the number of the chips to be inspected in row A is 2, a method for determining whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B includes: obtaining a first pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the image data to be inspected of the chip to be inspected b adjacent to the chip to be inspected along the first direction at corresponding pixel values ​​at the same position, where the chip to be inspected a is the starting chip to be inspected in row B; obtaining a second pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the pixel values ​​to be inspected of the virtual image data to be inspected c at corresponding pixel values ​​at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be inspected corresponding to the image data to be inspected has defects. Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip to be detected a has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is judged that the chip to be detected b has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data c to be detected has a defect (not shown).

[0077] When the number of chips to be inspected in row A is 2, the method for judging whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B also includes: obtaining the third pixel deviation absolute value between the image data to be inspected of the chip to be inspected d in row B and the image data to be inspected of the chip to be inspected e adjacent to the chip to be inspected along the first direction at the corresponding pixel values ​​at the same position, and the chip to be inspected e is the terminal chip to be inspected in row B; obtaining the fourth pixel deviation absolute value between the image data to be inspected of the chip to be inspected e in row B and the pixel values ​​to be inspected of the virtual image data to be inspected f at the corresponding pixel values ​​at the same position; providing a pixel detection threshold; comparing each of the third pixel deviation absolute values ​​and each of the fourth pixel deviation absolute values ​​with the pixel detection threshold respectively to judge whether the chip to be inspected corresponding to the image data to be inspected has defects. Correspondingly, when the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is judged that the chip e to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is judged that the chip d to be detected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the fourth pixel deviation value is greater than the pixel detection threshold, it is judged that the chip to be detected corresponding to the virtual image data f to be detected has a defect (not shown).

[0078] Please continue to refer to Figure 9. In this embodiment, based on the image data to be detected in each row that is not located in row B, the method for determining whether the chip to be detected 201 corresponding to the image data to be detected has defects includes: obtaining the first pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data to be detected of the chip to be detected a201, the chip to be detected b201 and the chip to be detected c201 arranged arbitrarily in succession in each row; the second pixel deviation absolute value between the pixel values ​​to be detected at the same position of the image data to be detected of the chip to be detected c201 and the pixel values ​​to be detected of the image data to be detected of the chip to be detected b201; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be detected 201 corresponding to the image data to be detected has defects.

[0079] Please continue to refer to FIG. 9 . Correspondingly, when the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip b201 to be detected has a defect.

[0080] When the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a201 to be detected has a defect (not shown).

[0081] When the first pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the second pixel deviation value is larger than the pixel detection threshold, it is determined that the chip to be detected c201 has a defect (not shown).

[0082] In other embodiments, when the number of chips to be inspected in each row is determined to be greater than or equal to 3, a determination is made based on each row of the image data to be inspected to determine whether the chip to be inspected corresponding to the image data to be inspected is defective. The specific comparison process is the same as the method for determining whether the chip to be inspected corresponding to the image data to be inspected is defective based on each row of the image data to be inspected that is not in row B, and will not be further described here.

[0083] Please refer to Figure 10. After determining whether the chip to be inspected corresponding to the image data to be inspected has defects, the virtual image data to be inspected in row B is restored to row A; a scanned image is formed based on the image data to be inspected in each row, and the defect position of the chip to be inspected is marked in the scanned image.

[0084] In this embodiment, the detected defect position is presented more intuitively by printing out the physical scan image 300 .

[0085] Correspondingly, an embodiment of the present invention further provides a storage medium on which computer instructions are stored, characterized in that when the computer instructions are executed, the steps of the method described in any of the above embodiments are executed.

[0086] Correspondingly, an embodiment of the present invention also provides a terminal, including a memory and a processor, wherein the memory stores computer instructions that can be run on the processor, and is characterized in that when the processor runs the computer instructions, it executes the steps of the method described in any of the above embodiments.

[0087] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A defect detection method, characterized in that: include: Providing a wafer to be inspected, the wafer to be inspected comprising a plurality of rows of chips to be inspected arranged along a first direction, each row of chips to be inspected arranged along a second direction, the first direction being perpendicular to the second direction; Obtaining the number of chips to be detected in each row, and determining whether the number of chips to be detected in each row reaches a detection number threshold; Acquiring the image data to be inspected of each chip to be inspected; When it is determined that the number of the chips to be inspected in any row A is less than the detection number threshold, the image data to be inspected of each chip to be inspected in row A is copied to any row B that is not in row A, and virtual image data to be inspected is generated in row B for the number of the chips to be inspected in row A; Based on the virtual image data to be inspected and the image data to be inspected in row B, and each row of image data to be inspected that is not in row B, it is determined whether the chip to be inspected corresponding to the image data to be inspected has defects.

2. The defect detection method according to claim 1, wherein: Each of the image data to be detected has the same arrangement and number of pixels, and each pixel has a pixel value to be detected.

3. The defect detection method according to claim 2, wherein: The number of the chips to be detected in row A is 1 or 2.

4. The defect detection method according to claim 3, wherein: When the number of chips to be inspected in row A is 2, a method for determining whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B includes: obtaining a first pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the image data to be inspected of the chip to be inspected b adjacent to the chip to be inspected along the first direction at corresponding pixel values at the same position, where the chip to be inspected a is the starting chip to be inspected in row B; obtaining a second pixel deviation absolute value between the image data to be inspected of the chip to be inspected a in row B and the pixel values to be inspected of the virtual image data to be inspected c at corresponding pixel values at the same position; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be inspected corresponding to the image data to be inspected has defects.

5. The defect detection method according to claim 4, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip a to be inspected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be inspected has a defect; When the first pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the second pixel deviation value is larger than the pixel detection threshold, it is determined that the chip to be inspected corresponding to the virtual image data c to be inspected has a defect.

6. The defect detection method according to claim 5, wherein: When the number of chips to be inspected in row A is 2, the method for judging whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B also includes: obtaining the third pixel deviation absolute value between the image data to be inspected of the chip to be inspected d in row B and the image data to be inspected of the chip to be inspected e adjacent to the chip to be inspected along the first direction at the corresponding pixel values at the same position, and the chip to be inspected e is the terminal chip to be inspected in row B; obtaining the fourth pixel deviation absolute value between the image data to be inspected of the chip to be inspected e in row B and the pixel values to be inspected of the virtual image data to be inspected f at the corresponding pixel values at the same position; providing a pixel detection threshold; comparing each of the third pixel deviation absolute values and each of the fourth pixel deviation absolute values with the pixel detection threshold respectively to judge whether the chip to be inspected corresponding to the image data to be inspected has defects.

7. The defect detection method according to claim 6, wherein: When the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip e to be inspected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is determined that the chip d to be inspected has a defect; When the third pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the fourth pixel deviation value is larger than the pixel detection threshold, it is determined that the chip to be inspected corresponding to the virtual image data f to be inspected has a defect.

8. The defect detection method according to claim 3, wherein: When the number of the chips to be inspected in row A is 1, a method for determining whether the chip to be inspected corresponding to the image data to be inspected has defects based on the virtual image data to be inspected and the image data to be inspected in row B includes: obtaining a first pixel deviation absolute value between the pixel values to be inspected at the same pixel position corresponding to the image data to be inspected of the chip to be inspected a in row B and the pixel values to be inspected of the image data to be inspected of the chip to be inspected b adjacent to the chip to be inspected along the first direction, wherein the chip to be inspected a is the starting chip to be inspected in row B; obtaining a second pixel deviation absolute value between the pixel values to be inspected of the image data to be inspected of the chip to be inspected a in row B and the pixel values to be inspected of the virtual image data to be inspected c at the same pixel position corresponding to the chip to be inspected; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively, to determine whether the chip to be inspected corresponding to the image data to be inspected has defects; or, Obtain the third pixel deviation absolute value between the pixel values of the to-be-detected image data of the to-be-detected chip d in row B and the pixel values of the to-be-detected image data of the to-be-detected chip e adjacent to the to-be-detected chip along the first direction at the pixel points corresponding to the same position, wherein the to-be-detected chip e is located at the end of the to-be-detected chip in row B; obtain the fourth pixel deviation absolute value between the pixel values of the to-be-detected image data of the to-be-detected chip e in row B and the pixel values of the to-be-detected image data c at the pixel points corresponding to the same position; provide a pixel detection threshold; and set each third pixel deviation absolute value. The absolute value and each fourth pixel deviation absolute value are respectively compared with the pixel detection threshold to determine whether the chip to be detected corresponding to the image data to be detected has defects.

9. The defect detection method according to claim 8, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip a to be inspected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip b to be inspected has a defect; When the first pixel deviation value corresponding to the pixel point at the same position is less than the pixel detection threshold, and the second pixel deviation value is greater than the pixel detection threshold, it is determined that the chip to be inspected corresponding to the virtual image data c to be inspected has a defect; or When the third pixel deviation value and the fourth pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip e to be inspected has a defect; when the third pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the fourth pixel deviation value is less than the pixel detection threshold, it is determined that the chip d to be inspected has a defect; When the third pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the fourth pixel deviation value is larger than the pixel detection threshold, it is determined that the chip to be inspected corresponding to the virtual image data c to be inspected has a defect.

10. The defect detection method according to claim 2, wherein: A method for determining whether a chip to be detected corresponding to the image data to be detected has defects based on the image data to be detected in each row that is not located in row B includes: obtaining a first pixel deviation absolute value between the pixel values to be detected at the same position of the image data to be detected of the chip to be detected and the pixel values to be detected of the image data to be detected of the chip to be detected and the chip to be detected b in each row of the arbitrarily arranged chips to be detected a, the chip to be detected b and the chip to be detected c; a second pixel deviation absolute value between the pixel values to be detected at the same position of the image data to be detected of the chip to be detected and the pixel values to be detected of the image data to be detected of the chip to be detected b; providing a pixel detection threshold; comparing each of the first pixel deviation absolute value and each of the second pixel deviation absolute value with the pixel detection threshold respectively to determine whether the chip to be detected corresponding to the image data to be detected has defects.

11. The defect detection method according to claim 10, wherein: When the first pixel deviation value and the second pixel deviation value corresponding to the pixel point at the same position are both greater than the pixel detection threshold, it is determined that the chip b to be inspected has a defect; when the first pixel deviation value corresponding to the pixel point at the same position is greater than the pixel detection threshold, and the second pixel deviation value is less than the pixel detection threshold, it is determined that the chip a to be inspected has a defect; When the first pixel deviation value corresponding to the pixel point at the same position is smaller than the pixel detection threshold, and the second pixel deviation value is larger than the pixel detection threshold, it is determined that the chip c to be inspected has a defect.

12. The defect detection method according to claim 1, wherein: The method for obtaining the number of the chips to be detected in each row includes: obtaining the number of the chips to be detected in each row through a first scanning process.

13. The defect detection method according to claim 1, wherein: The method for acquiring the image data to be detected of each chip to be detected includes: acquiring the image data to be detected of each chip to be detected through a second scanning process.

14. The defect detection method according to claim 1, wherein: When it is determined that the number of the chips to be inspected in each row is greater than or equal to the detection number threshold, it is determined whether the chips to be inspected corresponding to the image data to be inspected have defects based on each row of the image data to be inspected.

15. The defect detection method according to claim 1, wherein: After determining whether the chip to be inspected corresponding to the image data to be inspected has defects, it also includes: restoring the virtual image data to be inspected in row B to row A; forming a scanned image based on the image data to be inspected in each row, and marking the defect position of the chip to be inspected in the scanned image.

16. A storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed, the steps of the method according to any one of claims 1 to 15 are executed.

17. A terminal comprising a memory and a processor, wherein the memory stores computer instructions that can be executed on the processor, characterized in that: When the processor runs the computer instructions, the steps of the method according to any one of claims 1 to 15 are performed.

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