Foldable device and flexible printed circuit

Abstract

The embodiments of the present application relate to the field of electronic devices. Provided are a foldable device and a flexible printed circuit. The present application aims to reduce the space of a hinge for accommodating interconnecting wires and save on hinge-crossing resources. In the specific solution, the foldable device comprises a radio-frequency integrated circuit, a system on chip, a first power management chip, a second power management chip, a first main body and a second main body. The radio-frequency integrated circuit and the first power management chip are disposed on the first main body; the system on chip and the second power management chip are disposed on the second main body; and the second power management chip does not supply power to the radio-frequency integrated circuit and the first power management chip. Electrical components on the second main body are powered by a second battery, and electrical components on the first main body are powered by a first battery. Hinge-crossing power lines are reduced and hinge-crossing resources are saved on. A cellular antenna is disposed on the first main body, and a short-range antenna is disposed on the second main body. A radio-frequency power amplifier and the system on chip are disposed on different main bodies, thereby avoiding heat concentration.

Description

Folding devices and flexible circuit boards

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 4, 2024, with application number 202410163446.X and application name “Folding Device and Flexible Circuit Board”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of electronic devices, and in particular to a folding device and a flexible circuit board. Background Art

[0003] Foldable devices (such as foldable phones) are becoming a trend in future mobile electronic products. When unfolded, foldable devices offer a larger display area, enhancing viewing experience. When folded, the terminal device is compact, making it easier for users to carry. Foldable devices primarily include a first body, a hinge, and a second body, arranged in sequence. The components on the first body and the components on the second body are interconnected via interconnects. The number of interconnects affects the space available on the hinge to accommodate the interconnects.

[0004] Summary of the Invention

[0005] Embodiments of the present application provide a folding device and a flexible circuit board, which are intended to reduce the size of the space in which the hinge accommodates interconnecting wires.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions.

[0007] In a first aspect, embodiments of the present application provide a foldable device. The foldable device includes a first body, a hinge, and a second body. When the foldable device is in a flattened state, the first body, the hinge, and the second body are arranged in sequence. The foldable device also includes a radio frequency integrated circuit (RFIC), a system-on-chip (SoC), a flexible printed circuit (FPCB), a first battery, a second battery, a first power management chip (PMC), and a second power management chip. The RFIC is configured to perform RF processing on data sent by the SoC to generate RF signals, and is disposed in the first body. The SoC is configured to receive and transmit data with the RFIC. The SoC is disposed in the second body; the RFIC and the SoC are electrically connected via the FPCB. A first battery is disposed in the first body; a second battery is disposed in the second body. A first PMC is electrically connected to the first battery for powering the RFIC. A second PMC is electrically connected to the second battery for powering the SoC and not the first PMC. Thus, the SoC and RFIC are disposed in different bodies of the foldable device. This avoids the congestion of devices on the main body caused by the system single chip and the radio frequency integrated circuit being arranged in the same main body, which is conducive to making the device distribution on the two main bodies more reasonable. More space can be made for other devices (such as batteries). In addition, since the system single chip and the radio frequency integrated circuit have relatively high power, the system single chip and the radio frequency integrated circuit are arranged in two main bodies to avoid large local heat when the folding device is working, thereby improving the heat dissipation performance of the folding device. Because the second power management chip arranged in the second main body does not supply power to the first power management chip arranged in the first main body, the power line for supplying power to the first power management chip can be arranged only on the first main body. In other words, the power line for supplying power to the first power management chip does not need to extend from the second main body across the shaft to the first main body. The number of power lines that need to extend from the second main body to the first main body is reduced. For example, it can be set as a power line only for charging the first battery, saving space on the shaft for accommodating the power line and reducing the volume of space on the shaft for accommodating the power line.

[0008] In conjunction with the first aspect, in some achievable embodiments, the second power management chip does not power the RFIC. Thus, the power cord that powers the RFIC does not need to extend to the rotating shaft and the second body, thereby saving space on the rotating shaft that would otherwise be used to accommodate the power cord.

[0009] In conjunction with the first aspect, in some possible implementations, the first battery is configured to output a power supply voltage, which is used to provide the power supply voltage to the first power management chip. The foldable device further includes a voltage regulation circuit. The voltage regulation circuit is disposed within the first body and electrically connected to the first battery. The voltage regulation circuit is configured to reduce the power supply voltage and supply the reduced voltage to the first power management chip and the radiofrequency integrated circuit. Since the first battery, voltage regulation circuit, first power management chip, and radiofrequency integrated circuit are all disposed within the first body, the power lines electrically connecting the first battery and the voltage regulation circuit, the power lines electrically connecting the voltage regulation circuit and the first power management chip, and the power lines electrically connecting the voltage regulation circuit and the radiofrequency integrated circuit are all located within the first body. These power lines do not need to extend to the hinge and the second body, nor do they need to be electrically connected to components on the hinge and the second body. This reduces the number and length of power lines on the second body. This also reduces the space on the hinge required to accommodate the power lines. This facilitates miniaturization of the foldable device.

[0010] In conjunction with the first aspect, in some achievable embodiments, the voltage adjustment circuit includes: a first voltage-reducing device, a second voltage-reducing device, and a first voltage-stabilizing device. The first voltage-reducing device is disposed on the first body; it is electrically connected to the first battery, and is used to reduce the power supply voltage to a first voltage and to provide the first voltage to the first power management chip. The second voltage-reducing device is disposed on the first body; it is electrically connected to the first battery, and is used to reduce the power supply voltage to a second voltage and to provide the second voltage to the first power management chip. The first voltage-stabilizing device is disposed on the first body; it is electrically connected to the first voltage-reducing device, and is used to reduce the first voltage to a third voltage and to provide the third voltage to the first power management chip and the radio frequency integrated circuit. Thus, the power lines for providing the first, second, and third voltages are all disposed on the first body, and the power lines do not need to extend to the hinge and the second body, making the layout of the power lines more compact and facilitating the miniaturization of the folding device.

[0011] In combination with the first aspect, in some feasible embodiments, the folding device further includes: a radio frequency switch. The radio frequency switch is arranged on the first body. The voltage adjustment circuit further includes a third step-down device and a second voltage stabilizing device. The third step-down device is arranged on the first body, electrically connected to the first battery, and is used to reduce the power supply voltage to a fourth voltage and to provide the fourth voltage to the second voltage stabilizing device. The second voltage stabilizing device is arranged on the first body, electrically connected to the third step-down device, and is used to reduce the fourth voltage to a fifth voltage and to provide the fifth voltage to the radio frequency switch. Thus, the radio frequency switch and the power lines providing the fourth and fifth voltages are all arranged on the first body. The aforementioned power line does not need to extend to the rotating shaft, and the rotating shaft does not need to provide an accommodation space for the power line, so as to avoid the accommodation space causing a reduction in the supporting strength of the rotating shaft and an increase in the process difficulty of the rotating shaft.

[0012] In conjunction with the first aspect, in some achievable embodiments, the foldable device further includes: a radio frequency power amplifier disposed within the first body; a third step-down device and the first battery are both electrically connected to the radio frequency power amplifier, the third step-down device further configured to provide the fourth voltage to the radio frequency power amplifier; and the first battery further configured to provide the power supply voltage to the radio frequency power amplifier. Thus, the power line supplying electricity to the radio frequency power amplifier can be located solely within the first body, without extending to the hinge and the second body. The hinge does not require a space to accommodate the power line, which prevents the hinge from reducing its support strength and increasing its manufacturing complexity. Furthermore, the radio frequency power amplifier and the system-on-chip (SoC) have relatively high power requirements, and both generate significant heat when the foldable device is operating. Disposing the radio frequency power amplifier and the SoC, respectively, within the first and second bodies prevents the concentration of heat released by the RF power amplifier and the SoC, thereby improving the heat dissipation performance of the foldable device.

[0013] In conjunction with the first aspect, in some possible implementations, the foldable device further includes a charging manager. The charging manager is disposed in the second body; the first battery and the second battery are both electrically connected to the charging manager. The charging manager is configured to obtain the voltage of the first battery and the voltage of the second battery; and output a control instruction based on the difference between the voltages of the first and second batteries. The control instruction is configured to: when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery, control the first battery to charge the second battery; or, when the difference is greater than or equal to a threshold and the voltage of the first battery is less than the voltage of the second battery, control the second battery to charge the first battery. In this way, the charging manager can control the difference between the voltages of the first and second batteries to be smaller, less than the aforementioned threshold, thereby avoiding the problem of one battery having a low charge while the other has a high charge.

[0014] In combination with the first aspect, in some feasible embodiments, the folding device further includes a hardware module, a first aggregate chip, a first signal line, and a second signal line. The hardware module is provided on the first body. The first aggregate chip is provided on the first body. The hardware module is electrically connected to the first aggregate chip via the first signal line. The system single chip is electrically connected to the first aggregate chip via the second signal line. The number of the first signal lines is greater than the number of the second signal lines. Because the transmission hardware module and the first aggregate chip are both provided on the first body, the first signal line is also located on the first body. The system single chip is provided on the second body, and the second signal line extends from the first body to the second body. Because the number of the first signal lines is greater than the number of the second signal lines, reducing the number of signal lines can save space on the shaft for accommodating the signal lines while satisfying the signal interaction between the hardware module and the system single chip, thereby making the shaft have a higher supporting strength.

[0015] In conjunction with the first aspect, in some possible implementations, the foldable device further includes: a second aggregate chip and third signal lines; the second aggregate chip is disposed on the second body; the second aggregate chip is electrically connected to the first aggregate chip via the second signal lines; and the second aggregate chip is electrically connected to the system-on-chip via the third signal lines. The number of the third signal lines is equal to the number of the first signal lines. This reduces the number of signal lines on the second body.

[0016] In conjunction with the first aspect, in some achievable embodiments, the flexible circuit board has a first region and a bending region. When the folding device is in a flattened state, a vertical projection of the rotating shaft on the flexible circuit board overlaps the bending region. The flexible circuit board includes: a shielding layer, a first layer structure, a second layer structure, and a third layer structure stacked sequentially along the thickness direction of the flexible circuit board. In the bending region, a first gap is defined between the first layer structure and the second layer structure, and a second gap is defined between the second layer structure and the third layer structure. The flexible circuit board also includes: a fourth signal line for connecting the RFIC and the system-on-chip. The fourth signal line includes a first conductive segment and a second conductive segment that are electrically connected. The first conductive segment is located in the first region and formed in the second layer structure, and the second conductive segment is located in the bending region and formed in the first layer structure. The vertical projection of the shielding layer on the first layer structure overlaps the second conductive segment. As a result, during folding of the folding device, the first layer structure, the second layer structure, and the third layer structure located in the first region experience little or no relative movement. Because the first conductive segment is located in the first region, the distance between the first conductive segment and the first conductive layer along the first direction remains virtually unchanged. Similarly, the distance between the first conductive segment and the third conductive layer along the first direction remains virtually unchanged. The first conductive segment experiences little signal loss due to relative movement of the first and third conductive layers, resulting in minimal signal loss within the first conductive segment. During folding of the foldable device, the distance between the first and second conductive layers, as well as the distance between the third and second conductive layers, in the bending region continuously changes. If the second conductive segment were also formed on the second conductive layer, these distance changes would result in significant signal loss within the second conductive segment. In the embodiments of the present application, the second conductive segment is formed on the first conductive layer, effectively alleviating the aforementioned signal loss within the second conductive segment caused by distance changes. Furthermore, the shielding layer is bonded to the first covering layer, ensuring that the distance between the shielding layer and the second conductive segment remains virtually unchanged. The vertical projection of the shielding layer on the first conductive layer overlaps with the second conductive segment. The shielding layer prevents interference with the signal within the second conductive segment and has minimal impact on signal loss within the second conductive segment.

[0017] In some embodiments, the first layer structure includes a first covering layer, a first conductive layer, and a first protective layer stacked along the thickness direction of the flexible circuit board. The second layer structure includes a second covering layer, a second conductive layer, and a second protective layer stacked in sequence along the thickness direction of the flexible circuit board; the second covering layer is located between the first protective layer and the second conductive layer. The third layer structure includes a third covering layer, a third conductive layer, and a third protective layer stacked in sequence along the thickness direction of the flexible circuit board; the third covering layer is located between the second protective layer and the third conductive layer. The first conductive segment is formed in the second conductive layer, and the second conductive segment is formed in the first conductive layer.

[0018] In combination with the first aspect, in some feasible embodiments, the fourth signal line further includes a conductive via, which penetrates the first layer structure and the second layer structure along the thickness direction of the flexible circuit board; the first conductive segment and the second conductive segment are electrically connected through the conductive via.

[0019] In conjunction with the first aspect, in some possible implementations, the flexible circuit board further includes a first adhesive layer and a second adhesive layer. The first adhesive layer and the second adhesive layer are located in the first region, with the first adhesive layer located between the first and second layers; and the second adhesive layer is located between the second and third layers. The first adhesive layer connects the first and second layers, thereby preventing relative movement between the first and second layers located in the first region. The second adhesive layer connects the second and third layers, thereby preventing relative movement between the second and third layers located in the first region.

[0020] In conjunction with the first aspect, in some achievable embodiments, the shielding layer's vertical projection on the first layer covers the second conductive segment. In this manner, the shielding layer provides improved shielding performance for the second conductive segment, reducing the impact of other wiring on the signal of the second conductive segment and similarly reducing the impact of the second conductive segment on other wiring.

[0021] In conjunction with the first aspect, in some achievable embodiments, the flexible printed circuit board further includes a second region, wherein the first region, the bending region, and the second region are sequentially connected. The fourth signal line further includes a third conductive segment, which is located in the second region and electrically connected to the second conductive segment, and is formed in the second layer structure. During folding of the folding device, along the first direction, the distance between the third conductive segment and the first conductive layer does not change or changes only slightly, and the distance between the third conductive segment and the third layer structure does not change or changes only slightly. Signal loss within the third conductive segment formed in the second region is minimal.

[0022] In conjunction with the first aspect, in some achievable embodiments, the flexible printed circuit board further includes a clock signal line, which is formed in the second layer structure and is electrically isolated from the fourth signal line; the fourth signal line's vertical projection on the second layer structure does not overlap with the clock signal line. Thus, the fourth signal line and the clock signal line do not overlap in the thickness direction of the flexible printed circuit board, effectively reducing interference between the fourth signal line and the clock signal line, increasing the isolation of the clock signal line, and ensuring a more accurate clock signal transmitted within the clock signal line.

[0023] In conjunction with the first aspect, in some achievable embodiments, the distance between the clock signal line and the fourth signal line is greater than or equal to 0.4 mm. In this way, the fourth signal line and the clock signal line are farther apart, and interference between the two is reduced, which is conducive to improving the isolation of the clock signal line.

[0024] In conjunction with the first aspect, in some possible implementations, the foldable device further includes: a cellular antenna and a short-range antenna, wherein the cellular antenna is disposed on the first body and electrically connected to the radio frequency integrated circuit; and the short-range antenna is disposed on the second body and electrically connected to the system single chip.

[0025] In a second aspect, an embodiment of the present application provides a flexible circuit board. The flexible circuit board has a first region and a bending region. The flexible circuit board includes a first layer structure, a second layer structure, a third layer structure, a signal line, and a shielding layer. The second layer structure is stacked with the first layer structure; in the bending region, a first gap is defined between the first layer structure and the second layer structure. The second layer structure is located between the third layer structure and the first layer structure; in the bending region, a second gap is defined between the second layer structure and the third layer structure. The signal line includes a first conductive segment and a second conductive segment that are electrically connected, the first conductive segment being located in the first region and formed in the second layer structure, and the second conductive segment being located in the bending region and formed in the first layer structure. The first layer structure is located between the second layer structure and the shielding layer, and the vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] FIG1a is a schematic structural diagram of the folding device in a flattened state.

[0027] FIG1 b is a schematic structural diagram of the folding device in a folded state.

[0028] FIG2 is a schematic diagram of the exploded structure of the folding device.

[0029] FIG3 is a structural diagram of the antenna distribution of the folding device provided in an embodiment of the present application.

[0030] FIG4 a is a schematic structural diagram of a battery circuit of a folding device provided in an embodiment of the present application.

[0031] FIG4 b is a control diagram of a charging manager provided in an embodiment of the present application.

[0032] Figure 5a is a schematic diagram of the wiring structure of the hardware module on the folding device provided in an embodiment of the present application.

[0033] FIG5 b is a schematic diagram of another wiring structure of a hardware module on a folding device provided in an embodiment of the present application.

[0034] FIG6 is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of the present application.

[0035] FIG7 a is a schematic diagram of a partial structure of a flexible circuit board provided in an embodiment of the present application.

[0036] FIG7 b is a schematic diagram of the exploded structure of the flexible circuit board provided in an embodiment of the present application.

[0037] FIG8 a is a cross-sectional schematic diagram of a flexible circuit board provided in an embodiment of the present application.

[0038] FIG8 b is a schematic diagram of an exploded view of a first conductive layer, a second conductive layer, and a third conductive layer provided in an embodiment of the present application.

[0039] FIG8 c is another cross-sectional schematic diagram of the flexible circuit board provided in an embodiment of the present application.

[0040] FIG9 is a schematic structural diagram of an electrical connector provided in an embodiment of the present application.

[0041] In the figure: 001-folding device; 10-first body; 20-second body; 30-rotating shaft; 110-first middle frame; 120-first back cover; 111-first frame; 112-first middle plate; 140-first printed circuit board; 210-second middle frame; 211-second frame; 212-second middle plate; 220-second back cover; 240-second printed circuit board; 50-flexible circuit board; 40-flexible display; 31-first door panel; 32-second door panel; 33-axis; 101-RFIC; 102-first power management chip; 103-first battery; 104-cellular antenna; 104a-first cellular Antenna; 104b - second cellular antenna; 104c - third cellular antenna; 104d - fourth cellular antenna; 104e - fifth cellular antenna; 105 - RF switch; 106 - RF power amplifier; 107a - hardware module; 107b - hardware module; 108 - first aggregation chip; 109 - second aggregation chip; 60 - voltage adjustment circuit; 601 - first buck device; 602 - second buck device; 603 - first voltage regulator; 604 - third buck device; 605 - second voltage regulator; V0 - power supply voltage; V1 - first voltage; V2 - second voltage; V3 - third voltage; V4 - fourth voltage; V5 - fifth voltage; 201 - system on chip; 202 - second power management chip; 203 - second battery; 204 - short-range antenna; 204a - first short-range antenna; 204b - second short-range antenna; 205 - charging manager; 501 - first area; 502 - bending area; 503 - second area; 504 - conductive via; 51 - first gap; 52 - second gap; 510 - first layer structure; 511 - first covering layer; 512 - first conductive layer; 513 - first protective layer; 520 - second layer structure; 521 - second covering layer; 522 - second conductive layer; 523 - second protective layer; 530 - third layer structure; 5 31-third covering layer; 532-third conductive layer; 533-third protective layer; 540-shielding layer; 550-fourth signal line; 551-first conductive segment; 552-second conductive segment; 553-third conductive segment; 554-clock signal line; 555-isolated conductive structure; 561-first adhesive layer; 562-second adhesive layer; 70a-first electrical connector; 70b-second electrical connector; 71-male connector; 72-female connector; 73-first shielding cover; 74-second shielding cover; 01-first signal line; 02-second signal line; 03-third signal line; 555-isolated conductive structure; 556-fifth signal line. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0043] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0044] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0045] The present application provides a foldable device, which may be, for example, a mobile phone, a tablet computer (pad), a personal digital assistant (PDA), or a television, etc. For the sake of convenience, the following description will take the mobile phone as an example.

[0046] Figure 1a is a schematic diagram of the structure of the foldable device 001 in a flattened state. Figure 1b is a schematic diagram of the structure of the foldable device 001 in a folded state. Referring to Figures 1a and 1b, the foldable device 001 can be folded or unfolded, thereby changing the size of the foldable device 001 according to actual needs and usage scenarios. For example, when it is necessary to view the screen, the foldable device 001 can be unfolded to the state shown in Figure 1a, and the flexible display screen of the foldable device 001 can be unfolded to provide a better viewing experience. When it is necessary to answer or make a call, the foldable device 001 can be folded to the state shown in Figure 1b, which is convenient for the user to hold and improves the user experience.

[0047] It is understood that the folding state of the folding device 001 is not limited to the state shown in Figure 1b. The folding device 001 can have multiple folding states, for example, the folding device 001 can have multiple folding states between the flat state of Figure 1a and the folded state of Figure 1b.

[0048] As shown in Figure 1a, folding device 001 includes a first body 10, a second body 20, and a hinge 30. Both the first body 10 and the second body 20 are connected to the hinge 30. When folding device 001 is in an unfolded state, the first body 10, the second body 20, and the hinge 30 are in a flattened state, and the first body 10, the second body 20, and the hinge 30 are arranged sequentially along the x-direction.

[0049] For the sake of convenience of description, the thickness direction of the folding device 001 is defined as the first direction, which is indicated by the z direction in the following text and figures, and the axial extension direction of the rotating shaft 30 is defined as the second direction, which is indicated by the y direction in the following text and figures, wherein the x direction, the y direction and the z direction are perpendicular to each other.

[0050] It is understood that the aforementioned perpendicularity allows for assembly and manufacturing errors. For example, the perpendicularity between the x-direction and the z-direction is not limited to a 90° angle between the x-direction and the z-direction. For example, the angle between the x-direction and the z-direction can be 85° to 95°. For example, it can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, or 95°. The same applies to the rest of the description of perpendicularity in this article.

[0051] FIG2 is a schematic diagram of the exploded structure of the folding device 001. Referring to FIG2 , the first body 10 includes a first middle frame 110 and a first rear cover 120. The first middle frame 110 includes a first side frame 111 and a first middle plate 112. The first side frame 111 is connected to the hinge 30.

[0052] The first middle plate 112 is located within the area surrounded by the first frame 111 and is connected to the inner wall of the first frame 111. For example, the first frame 111 and the first middle plate 112 are connected as a single piece. The first back cover 120 is connected to the first frame 111, and the first back cover 120 and the first middle plate 112 are stacked along the z-direction.

[0053] In some embodiments, there is a gap between the first rear cover 120 and the first middle plate 112, and the first rear cover 120, the first middle plate 112 and the first frame 111 together form a receiving space in which components such as the circuit board and battery of the folding device 001 are received.

[0054] For example, the first body 10 may further include a first printed circuit board (PCB) 140. In some embodiments, the first PCB 140 is located between the first back cover 120 and the first mid-plate 112. In some embodiments, the first mid-plate 112 is located between the first PCB 140 and the first back cover 120.

[0055] It is understandable that the first middle frame 110, the first back cover 120 and the first printed circuit board 140 are merely examples of some components on the first body 10. The first body 10 may also be provided with components such as a camera, an antenna or a sensor.

[0056] The second body 20 may include a second middle frame 210 and a second back cover 220. The second middle frame 210 may include a second side frame 211 and a second middle plate 212. The second side frame 211 is connected to the hinge 30. The second body 20 may also include a second printed circuit board 240. For a description of the structure of the second body 20, please refer to the description of the first body 10.

[0057] It is understandable that the components contained in the aforementioned receiving space of the first body 10 and the components contained in the receiving space of the second body 20 may not be exactly the same. The shapes of the first middle plate 112 and the second middle plate 212 may be different. This embodiment of the application does not limit this.

[0058] In some embodiments, the folding device 001 further includes a flexible printed circuit (FPC) 50, one end of which is located on the first body 10, and the other end of which is located on the second body 20. Devices on the first body 10 and devices on the second body 20 can communicate via signal lines formed on the flexible printed circuit 50. For example, one end of the flexible printed circuit 50 is electrically connected to the first printed circuit board 140, and the other end of the flexible printed circuit board 50 is electrically connected to the second printed circuit board 240.

[0059] In some embodiments, the flexible circuit board 50 is passed through the rotating shaft 30, which can fully utilize the thickness of the rotating shaft 30 along the z direction to save the thickness of the folding device 001. In addition, during the folding or unfolding of the folding device 001, the rotating shaft 30 can also constrain the space for the flexible circuit board 50 to move, thereby preventing the flexible circuit board 50 from moving too much along the z direction.

[0060] The embodiments of the present application do not limit the structure of the rotating shaft 30. For example, the rotating shaft 30 includes a first door panel 31, a second door panel 32, and a shaft 33. When the folding device 001 is in the flattened state, the first door panel 31, the second door panel 32, and the shaft 33 are arranged along the x-direction. The first door panel 31 and the shaft 33 are rotatably connected, for example, by an arcuate groove and a slider. In embodiments where the flexible circuit board 50 is inserted into the rotating shaft 30, the flexible circuit board 50 is inserted into the arcuate groove. Alternatively, the first door panel 31 and the shaft 33 are rotatably connected via a hinge. Similarly, the second door panel 32 and the shaft 33 are rotatably connected, for example, by an arcuate groove and a slider, or alternatively, by a hinge. The first frame 111 is connected to the first door panel 31, for example, by screwing or snapping. The second frame 211 is connected to the second door panel 32 , for example, by screwing or snapping.

[0061] In some embodiments, the folding device 001 may further include a flexible display 40. The first body 10, the second body 20, and the hinge 30 jointly support the flexible display 40. When the folding device 001 is in the folded state, the angle between the surface of the first body 10 facing the flexible display 40 and the surface of the second body 20 facing the flexible display 40 may be -10° to 10°, with the opening of the angle facing the flexible display 40 being, for example, ±10°, ±9°, ±8°, ±7°, ±6°, ±5°, ±4°, ±3°, ±2°, ±1°, or 0°. When the folding device 001 is in a flattened state, the angle between the surface of the first body 10 facing the flexible display screen 40 and the surface of the second body 20 facing the flexible display screen 40 can be 170° to 190°, and the opening of the angle faces the flexible display screen 40, for example, it can be 170°, 172°, 175°, 178°, 179°, 180°, 181°, 182°, 185°, 188° or 190°.

[0062] The present embodiment does not limit the folding type of the folding device 001. In some embodiments, the folding device 001 has an inward-folding structure, that is, when the folding device 001 is in the folded state, the flexible display 40 is located between the first body 10 and the second body 20. In other embodiments, the folding device 001 has an outward-folding structure, that is, when the folding device 001 is in the folded state, the first body 10 and the second body 20 are both located between opposite ends of the flexible display 40.

[0063] Exemplarily, the flexible display screen 40 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a MiniLED display screen, a MicroLED display screen, a Micro-OLED display screen, a quantum dot light-emitting diode (QLED) display screen, etc.

[0064] FIG3 is a schematic diagram of the antenna distribution structure of the foldable device 001 provided in an embodiment of the present application. Referring to FIG3 , in an embodiment of the present application, the foldable device 001 further includes a radio frequency integrated circuit (RFIC) 101, a first power management chip 102, a first battery 103, a system on chip (SOC) 201, a second power management chip 202, and a second battery 203. The RFIC 101 is used to perform RF processing on data sent by the SOC 201 and generate an RF signal. The SOC 201 is used to receive and transmit data with the RFIC 101.

[0065] In some embodiments, the power management chip is also called a power management unit (PMU). The RF integrated circuit 101 may include a radio frequency transceiver (RF transceiver) and a radio frequency system (RF system).

[0066] For example, the system-on-chip 201 may include an application processor (AP) and a modem. The AP is used to control application programs, while the modem is used to control network standards, Internet access, and download speeds.

[0067] The RFIC 101, first power management chip 102, and first battery 103 are all disposed in the first body 10. The SoC 201, second power management chip 202, and second battery 203 are all disposed in the second body 20. The RFIC 101 and SoC 201 are both electrically connected to the flexible printed circuit board 50. The SoC 201 and the RF transceiver in the RFIC 101 exchange signals via the flexible printed circuit board 50.

[0068] The first battery 103 is electrically connected to the first power management chip 102. The first battery 103 is used to power the first power management chip 102, and the first power management chip 102 is used to power the radio frequency integrated circuit 101. The second battery 203 is electrically connected to the second power management chip 202. The second battery 203 is used to power the second power management chip 202, and the second power management chip 202 is used to power the system-on-chip 201. The second power management chip 202 does not power the first power management chip 102.

[0069] In this way, the system-on-chip 201 and the radio frequency integrated circuit 101 are respectively arranged on different main bodies of the foldable device 001. This avoids the system-on-chip 201 and the radio frequency integrated circuit 101 being arranged on the same main body, which would lead to device crowding on the main body, and is conducive to a more reasonable distribution of devices on the two main bodies. More space can be made for other components (such as batteries). In addition, since the system-on-chip 201 and the radio frequency integrated circuit 101 have relatively high power, the system-on-chip 201 and the radio frequency integrated circuit 101 are arranged separately on two main bodies. This can avoid localized high heat when the foldable device 001 is in operation, thereby improving the heat dissipation performance of the foldable device 001.

[0070] Because the second power management chip 202 disposed in the second body 20 does not power the first power management chip 102 disposed in the first body 10, the power cord supplying the first power management chip 102 can be located solely on the first body 10. In other words, the power cord supplying the first power management chip 102 does not need to extend to the hinge 30 and the second body 20. This reduces the number of power cords required to extend from the second body 20 to the first body 10. For example, only a charging cord for the first battery 103 can be provided. This saves space on the hinge 30 for accommodating the power cord and reduces the volume of the space required to accommodate the power cord. This increases the support strength of the hinge 30 and facilitates the miniaturization of the foldable device 001.

[0071] The aforementioned requirement that the power cord extend to the hinge 30 and the second body 20 means that the power cord does not need to be directly connected to the components on the hinge 30 and the second body 20. In some scenarios, the power cord can be stacked with the hinge 30. In other words, the projection of the power cord on the hinge 30 can overlap the hinge 30. For example, depending on the device layout requirements on the first body 10, the power cord can partially cover the hinge 30.

[0072] For example, the flexible circuit board 50 (as shown in FIG. 2 ) does not need to include the aforementioned power line extending from the second body 20 across the hinge 30 to the first body 10. For example, the number of pins on the flexible circuit board 50 can be reduced by 25 to 40, which helps reduce the size of the flexible circuit board 50 along the y-direction. In the embodiment where the flexible circuit board 50 is inserted through the hinge 30, the size of the flexible circuit board 50 is reduced, and the space on the hinge 30 for accommodating the flexible circuit board 50 is reduced. This saves space on the hinge 30 while avoiding the problem of reduced mechanical strength of the hinge 30 caused by the increased space.

[0073] Furthermore, the second power management chip 202 does not supply power to the RFIC 101. Thus, the power line supplying power to the RFIC 101 does not need to extend to the shaft 30 and the second body 20. This saves space on the shaft 30 for accommodating the power line.

[0074] In the embodiments of the present application, the power line refers to a line used to supply power to the device, which is arranged on the discharge path of the power supply. Its function is different from the signal line that transmits signals to the device. The rest of the description of the power line in this article is similar.

[0075] In some embodiments, the foldable device 001 further includes: a cellular antenna 104 and a short-range antenna 204. The cellular antenna 104 is disposed on the first body 10 and electrically connected to the RFIC 101. The short-range antenna 204 is disposed on the second body 20 and electrically connected to the system-on-chip 201. After receiving third data sent by the system-on-chip 201, the short-range antenna 204 can transmit data using short-range communication technology. The RFIC 101 receives the data sent by the system-on-chip 201, performs RF processing on the data sent by the system-on-chip 201, and generates an RF signal. The RFIC 101 then transmits the RF signal to the cellular antenna 104. The cellular antenna 104 receives and transmits RF signals based on mobile cellular communication technology.

[0076] Compared to installing both the cellular antenna 104 and the short-range antenna 204 in the same body, the cellular antenna 104 and the short-range antenna 204 are installed in two separate bodies. This allows for more optional placement locations for the cellular antenna 104, more space for placement, and more optional placement shapes for the cellular antenna 104, allowing for optimal placement and improved functionality of the cellular antenna 104. Similarly, the space for placement of the short-range antenna 204 is larger, allowing for more optional placement locations and shapes for the short-range antenna 204, allowing for optimal placement and improved functionality of the short-range antenna 204.

[0077] For example, the cellular antenna 104 can be located on the first frame 111, and the short-range antenna 204 can be located on the second frame 211. The cellular antenna 104 and the short-range antenna 204 are located on two separate bodies. In embodiments where the cellular antenna 104 and the short-range antenna 204 are slot antennas, the first frame 111 and the second frame 211 can have fewer slots, resulting in a more complete appearance for the first and second frames 111, 211. In all scenarios, this meets common industry standards and provides a superior communication experience.

[0078] Exemplarily, the cellular antenna 104 is an antenna that supports mobile cellular communication technology. There may be multiple cellular antennas 104. For example, in FIG3 , the cellular antennas 104 include a first cellular antenna 104a, a second cellular antenna 104b, a third cellular antenna 104c, a fourth cellular antenna 104d, a fifth cellular antenna 104e, and a sixth cellular antenna 104f.

[0079] In some embodiments, the cellular antenna 104 may include a parasitic module, and the parasitic module may be a medium and high frequency (MHF) parasitic module or a low frequency (LF) parasitic module. The parasitic module of the cellular antenna 104 may be disposed on the second body 20, for example, on the second frame 211 of the second body 20.

[0080] The short-range antenna 204 is an antenna for short-range communication technology. The short-range antenna 204 may include a first short-range antenna 204a and a second short-range antenna 204b. For example, the short-range antenna 204 may include a global positioning system (GPS), wireless fidelity (WIFI), a Bluetooth module (BT), etc.

[0081] Figure 4a is a simplified circuit diagram of the foldable device 001 provided in an embodiment of the present application. Referring to Figure 4a, a first battery 103 is used to power the first power management chip 102 and the radio frequency integrated circuit 101. A second battery 203 is used to power the system-on-chip 201 and the second power management chip 202.

[0082] Typically, the SoC 201 and the second PMC 202 have multiple operating voltages, and the voltage levels of the multiple operating voltages are not identical. The first PMC 102 and the RFIC 101 also have multiple operating voltages, and the voltage levels of the multiple operating voltages are not identical.

[0083] Illustratively, the first battery 103 is configured to provide a power supply voltage V0. In some embodiments, the foldable device 001 further includes a voltage regulator circuit 60 disposed within the first body 10. The voltage regulator circuit 60 is electrically connected to the first battery 103. The voltage regulator circuit 60 is configured to reduce the power supply voltage V0 and supply the reduced voltage to the first power management chip 102 and the RFIC 101.

[0084] Since the first battery 103, voltage regulation circuit 60, first power management chip 102, and RFIC 101 are all located in the first body 10, the power lines electrically connecting the first battery 103 and the voltage regulation circuit 60, the power lines electrically connecting the voltage regulation circuit 60 and the first power management chip 102, and the power lines electrically connecting the voltage regulation circuit 60 and the RFIC 101 are all located in the first body 10. These power lines do not need to extend to the hinge 30 and the second body 20, nor do they need to be electrically connected to components on the hinge 30 and the second body 20. This reduces the number and length of power lines on the second body 20. It also reduces the space on the hinge 30 required to accommodate the power lines, facilitating miniaturization of the foldable device 001.

[0085] The embodiment of the present application does not limit the magnitude of the power supply voltage V0. It can be set according to the usage scenario of the foldable device 001. For example, the power supply voltage V0 can be 3.0V (volts) to 4.53V; for example, the power supply voltage V0 can be 3.8V, 3.9V, 4.0V, 4.1V, or 4.2V.

[0086] In some embodiments, the voltage regulation circuit 60 may include a first buck device 601, a second buck device 602, and a first voltage stabilizing device 603. The first buck device 601, the second buck device 602, and the first voltage stabilizing device 603 are all disposed in the first body 10. For example, the first buck device 601, the second buck device 602, and the first voltage stabilizing device 603 are all disposed on the first printed circuit board 140 (as shown in FIG2 ). The first buck device 601 and the second buck device 602 are both electrically connected to the first battery 103. The first battery 103 is configured to provide a power supply voltage V0 to the first power management chip 102, the first buck device 601, and the second buck device 602. The first buck device 601 is configured to reduce the power supply voltage V0 to a first voltage V1 and provide the first voltage V1 to the first power management chip 102. The second buck device 602 is configured to reduce the power supply voltage V0 to a second voltage V2 and provide the second voltage V2 to the first power management chip 102. The first voltage regulator 603 is electrically connected to the first voltage-down device 601. The first voltage regulator 603 is configured to reduce the first voltage V1 to a third voltage V3, which is then provided to the first power management chip 102 and the RFIC 101. In this manner, the voltage regulator circuit 60 reduces the power supply voltage V0 to obtain a first voltage V1, a second voltage V2, and a third voltage V3; and provides the first voltage V1, the second voltage V2, and the third voltage V3 to the first power management chip 102 and the third voltage V3 to the RFIC 101. The power lines providing the first voltage V1, the second voltage V2, and the third voltage V3 are all located within the first body 10. These power lines do not need to extend to the hinge 30 and the second body 20, making the layout of the power lines more compact and facilitating miniaturization of the foldable device.

[0087] The magnitudes of the first voltage V1, the second voltage V2, and the third voltage V3 are set according to the requirements of the first power management chip 102 and the RFIC 101. For example, the magnitude of the first voltage V1 can be 1.8V-2.0V, and the magnitude of the first voltage V1 can be, for example, 1.8V, 1.85V, 1.90V, 1.95V, or 2.0V. The magnitude of the second voltage V2 can be 0.8V-1.0V, and the magnitude of the second voltage V2 can be, for example, 0.8V, 0.85V, 0.90V, 0.95V, or 1.0V. The third voltage V3 is lower than the first voltage V1, and the magnitude of the third voltage V3 can be 1.7V-1.9V, and the magnitude of the third voltage V3 can be, for example, 1.7V, 1.75V, 1.8V, 1.85V, or 1.90V.

[0088] The aforementioned voltage-reducing devices and voltage-stabilizing devices both have the function of reducing voltage. For example, voltage-reducing devices can be used in scenarios where the current is large and the voltage fluctuation requirement is not high, while voltage-stabilizing devices can be used in scenarios where the current is small and the voltage fluctuation is small.

[0089] The embodiment of the present application does not limit the type of the first step-down device 601. For example, the first step-down device 601 may include an external step-down switching power supply (external buck). The embodiment of the present application does not limit the type of the first voltage regulator device 603. For example, the first voltage regulator device 603 may include an external voltage regulator chip (external low-dropout device).

[0090] Illustratively, the first power management chip 102 is used to supply power to the RFIC 101 . The voltage supplied by the first power management chip 102 to the RFIC 101 can be set according to the operating voltage of components within the RFIC 101 .

[0091] In some embodiments, the folding device 001 may further include a radio frequency switch 105, which is disposed on the first body 10. The voltage adjustment circuit 60 may further include a third step-down device 604 and a second voltage regulator 605. The third step-down device 604 and the second voltage regulator 605 are both disposed on the first body 10. The third step-down device 604 is electrically connected to the first battery 103, which is used to provide a power supply voltage V0 to the third step-down device 604. The third step-down device 604 is used to reduce the power supply voltage V0 to a fourth voltage V4 and to provide the fourth voltage V4 to the second voltage regulator 605. The second voltage regulator 605 is electrically connected to the third step-down device 604, which is used to reduce the fourth voltage V4 to a fifth voltage V5 and to provide the fifth voltage V5 to the radio frequency switch 105.

[0092] Similar to the above, the RF switch 105 and the power lines providing the fourth voltage V4 and the fifth voltage V5 are all disposed on the first body 10. The power lines do not need to extend to the shaft 30, and the shaft 30 does not need to provide a space for the power lines, thereby avoiding the space reducing the support strength of the shaft 30 and increasing the manufacturing difficulty of the shaft 30.

[0093] For example, the fourth voltage V4 may be 3.3V-3.6V, 3.3V, 3.4V, 3.45V, 3.5V, 3.55V, or 3.6V. The fifth voltage V5 may be 2.70V-3.0V, 2.75V, 2.8V, 2.85V, 2.90V, 2.95V, or 3.0V.

[0094] In some embodiments, the foldable device 001 may further include a radio frequency power amplifier (PA) 106, which is disposed on the first body 10. For example, the RF power amplifier 106 is disposed on the first printed circuit board 140. The third step-down device 604 and the first battery 103 are both electrically connected to the RF power amplifier 106. The third step-down device 604 is further configured to provide a fourth voltage V4 to the RF power amplifier 106; the first battery 103 is further configured to provide a power supply voltage V0 to the RF power amplifier 106.

[0095] Similarly, the power line for supplying power to the RF power amplifier 106 can be provided only on the first body 10, without extending to the shaft 30 and the second body 20. The shaft 30 does not need to provide a space for accommodating the power line, as this space may reduce the support strength of the shaft 30 and increase the manufacturing difficulty of the shaft 30.

[0096] Furthermore, the RF power amplifier 106 and the system-on-chip 201 have relatively high power, and when the foldable device 001 is operating, both will release a significant amount of heat. The RF power amplifier 106 and the system-on-chip 201 are separately located in the first body 10 and the second body 20, preventing the concentration of heat released by the RF power amplifier 106 and the system-on-chip 201. This improves the heat dissipation performance of the foldable device 001. Compared to installing the RF power amplifier 106 and the system-on-chip 201 in the same body, the RF power amplifier 106 and the system-on-chip 201 are located in separate bodies. The heat dissipation performance of the foldable device 001 is significantly improved in both scenarios with good communication signals and in scenarios with poor communication signals (such as when a user is using the foldable device underground, where the signal is poor). In scenarios with good communication signals, the heat dissipation performance of the foldable device 001 in the folded state is improved by 2mA / °C (milliamperes per degree Celsius) to 5mA / °C; the heat dissipation performance of the foldable device 001 in the flat state is improved by 6mA / °C to 9mA / °C. In scenarios with poor communication signals, the heat dissipation performance of the folding device 001 in the folded state is improved by 6mA / ℃-9mA / ℃; the heat dissipation performance of the folding device 001 in the flat state is improved by 10mA / ℃-13mA / ℃.

[0097] The present embodiment does not limit the position of the RF power amplifier 106 on the first body 10. For example, the RF power amplifier 106 is located on an edge of the first body 10 away from the hinge 30. This reduces the distance between the RF power amplifier 106 and the cellular antenna 104 (shown in FIG. 3 ) located on the first frame 111 (shown in FIG. 3 ), shortening the signal transmission distance between the RF power amplifier 106 and the cellular antenna 104.

[0098] In addition, the RF power amplifier 106 is disposed on an edge of the first body 10 away from the rotation axis 30. A first printed circuit board 140, which supports the RF power amplifier 106, is also disposed near the edge of the first body 10 away from the rotation axis 30. The first battery 103 can be disposed between the rotation axis 30 and the first printed circuit board 140. This increases the space on the first body 10 for accommodating the first battery 103, allowing for a larger first battery 103 with a higher energy storage capacity.

[0099] In the embodiments of the present application, the voltage adjustment circuit 60 is not limited to the first step-down device 601, the second step-down device 602, the first voltage stabilizing device 603, the third step-down device 604, and the second voltage stabilizing device 605 described above. In some embodiments, the voltage adjustment circuit 60 may further include a fourth step-down device, a fifth step-down device, a sixth step-down device, etc. The voltage adjustment circuit 60 may further include a third voltage stabilizing device, a fourth voltage stabilizing device, a fifth voltage stabilizing device, etc. The voltage adjustment circuit 60 may be configured according to the operating voltage of the first power management chip 102 and the operating voltage of the RFIC 101.

[0100] It is understood that in the embodiments of the present application, the first battery 103 is not limited to powering the RF power amplifier 106, the RF switch 105, the first power management chip 102, and the RF integrated circuit 101. In some embodiments, the first body 10 may further include a hardware module 107a, and the first battery 103 provides power to the hardware module 107a. The voltage supplied to the hardware module 107a is set according to the operating voltage of the hardware module 107a.

[0101] As described above, the second battery 203 supplies power to the second power management chip 202, which in turn supplies power to the system-on-chip 201. In some embodiments, the second power management chip 202 and the system-on-chip 201 may be integrated together. In some embodiments, the second power management chip 202 and the system-on-chip 201 may be independently configured.

[0102] Likewise, the second battery 203 is not limited to supplying power only to the second power management chip 202 and the system-on-chip 201 . The second battery 203 can also supply power to the hardware module 107 b provided in the second body 20 .

[0103] Exemplarily, the hardware module 107a (107b) may include, for example, an audio module, an audio module, a speaker, a receiver, a microphone, a sensor, a storage device, a button, a front camera, a rear camera, a display screen, an antenna chip, a secure digital (SD) memory card, and a subscriber identification module (SIM). The antenna chip may include a WIFI antenna chip, a BT antenna chip, a near field communication (NFC) antenna chip, and the like. The storage device may include, for example, double data rate synchronous dynamic random access memory (DDR SDRAM) and universal flash storage (UFS).

[0104] The aforementioned hardware module 107a (107b) can be installed in the first body 10 or in the second body 20 as required. In some embodiments, the rear camera is installed in the second body 20 to avoid signal quality degradation due to the signal line connecting the rear camera and the system-on-chip 201 passing through the hinge 30.

[0105] In some embodiments, the foldable device 001 may further include a charger 205. The charger 205 is disposed on the second body 20. The first battery 103 and the second battery 203 are both electrically connected to the charger 205. The charger 205 is electrically connected to the first battery 103 and the second battery 203 via a charging cable. For example, the second body 20 is further provided with charging terminals, which are electrically connected to the charger 205 via the charging cable. When charging the foldable device 001, the charging terminals are connected to a power source, and current flows through the charging terminals to the charger 205, which then charges the first battery 103 and the second battery 203.

[0106] For example, the charging terminal may include a universal serial bus (USB) interface. The USB interface may be a Mini USB interface, a Micro USB interface, a USB Type-C interface, etc. Furthermore, the present application does not limit the function of the charging terminal to charging only. For example, the charging terminal may also be used to transfer data between the foldable device 001 and other devices (e.g., a mobile phone, a computer, a mobile hard drive, etc.).

[0107] In the embodiment of the present application, the first battery 103 provides power to the first power management chip 102 and the RFIC 101, while the second battery 203 provides power to the second power management chip 202 and the SoC 201. Due to the different power consumptions of the components on the first body 10 and the second body 20, in some usage scenarios, the charge level of the first battery 103 may be lower than that of the second battery 203, or vice versa. In this way, the charge manager 205 can control the battery with more charge to charge the battery with less charge.

[0108] In some embodiments of the present application, the second body 20 may also be provided with a charging manager. For example, the charging terminals are electrically connected to the charging manager 205 provided on the first body 10 and the charging manager provided on the second body 20 .

[0109] Figure 4b is a control diagram of a charging manager 205 provided in an embodiment of the present application. Referring to Figure 4b , illustratively, the charging manager 205 is configured to obtain the voltage of the first battery 103 and the voltage of the second battery 203 and output a control instruction based on the difference between the voltages of the first battery 103 and the second battery 203. The control instruction is configured to control the first battery 103 to charge the second battery 203 when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery. Alternatively, the control instruction is configured to control the second battery 203 to charge the first battery 103 when the difference is greater than or equal to a threshold and the voltage of the first battery is less than the voltage of the second battery. In this way, the charging manager 205 can control the difference between the voltages of the first battery 103 and the second battery 203 to be smaller, less than the threshold, thereby avoiding the problem of one battery 103 having a low charge while the other has a high charge.

[0110] The threshold value can be set as required. Furthermore, the charging manager 205 controls the second battery 203 to charge the first battery 103 until the voltage difference between the second battery 203 and the first battery 103 is small.

[0111] For example, when the difference is greater than or equal to a first threshold, and the voltage of the first battery is greater than the voltage of the second battery, the first battery 103 is controlled to charge the second battery 203 until the difference is less than or equal to a second threshold. The second threshold is less than the first threshold. The difference between the second threshold and the first threshold can be set as needed. Similarly, when the difference is greater than or equal to the first threshold, and the voltage of the first battery is less than the voltage of the second battery, the second battery 203 is controlled to charge the first battery 103 until the difference is less than or equal to the second threshold.

[0112] It is understandable that the second power management chip 202 does not supply power to the first power management chip 102, nor does it supply power to the RFIC 101. This does not limit the second power management chip 202 to not being electrically connected to the first power management chip 102, nor does it limit the second power management chip 202 to not being electrically connected to the second power management chip 202.

[0113] As shown in FIG4a , in some embodiments, the RFIC 101, the first buck device 601, the second buck device 602, and the third buck device 604 are all electrically connected to the second power management chip 202 via a signal line (e.g., a fifth signal line described below). The second power management chip 202 is electrically connected to the enable terminal of the RFIC 101. The enable terminal is a control terminal that turns a function of the RFIC 101 on or off.

[0114] As described above, the SoC 201 disposed in the second body 20 exchanges signals with the RF transceiver in the RFIC 101 disposed in the first body 10 via the flexible printed circuit board 50 (as shown in FIG3 ). It will be appreciated that the SoC 201 may not be limited to the RFIC 101 on the first body 10. For example, some or all of the hardware modules 107a disposed in the first body 10 may also exchange signals with the SoC 201. Therefore, the signal lines used for the hardware modules 107a to exchange signals with the SoC 201 need to extend from the first body 10 to the second body 20.

[0115] Figure 5a is a schematic diagram of the wiring structure of the hardware module 107a on the folding device 001 provided in an embodiment of the present application. Referring to Figure 5a, the hardware module 107b includes an antenna chip, an SD card, a SIM card, an audio module, a storage, a rear camera and a sensor. The hardware module 107b is arranged on the second body 20. The hardware module 107a includes a front camera and a flexible display screen 40. It can be understood that the distribution relationship of the hardware modules 107a (b) in Figure 5a is only an example, and the embodiment of the present application does not limit the types of hardware modules arranged on the first body 10 and the second body 20. For example, the antenna chip, SD card, SIM card, audio module, storage, etc. can also be arranged on the first body 10.

[0116] In some embodiments, in order to reduce the number of signal lines used for signal interaction between the hardware module 107a and the system single chip 201, a first aggregation chip 108 can be set on the first body 10. The first aggregation chip 108 is used to aggregate signals to reduce the number of signal lines electrically connecting and transmitting the hardware module 107a and the system single chip 201.

[0117] Illustratively, the foldable device 001 may further include a first signal line 01 and a second signal line 02. The transmission hardware module 107a is electrically connected to the first aggregate chip 108 via the first signal line 01. The system-on-chip 201 is electrically connected to the first aggregate chip 108 via the second signal line 02. Illustratively, the second signal line 02 is provided on the flexible printed circuit board 50. The number of first signal lines 01 is greater than the number of second signal lines 02. Because both the transmission hardware module 107a and the first aggregate chip 108 are provided in the first body 10, the first signal line 01 is also located in the first body 10. The system-on-chip 201 is provided in the second body 20, and the second signal line 02 extends from the first body 10 to the second body 20. Because the number of first signal lines 01 is greater than the number of second signal lines 02, while ensuring signal exchange between the hardware module 107a and the system-on-chip 201, reducing the number of signal lines can save space on the hinge 30 for accommodating the signal lines, thereby increasing the support strength of the hinge 30.

[0118] Figure 5b is a simplified diagram of another wiring structure for hardware module 107a on a folding device 001 provided in an embodiment of the present application. Referring to Figure 5b, the difference between Figure 5b and Figure 5a is that in Figure 5b, folding device 001 also includes third signal lines 03 and a second aggregation chip 109. The second aggregation chip 109 is disposed on the second body 20. The second aggregation chip 109 is electrically connected to the first aggregation chip 108 via the second signal lines 02. The second aggregation chip 109 is electrically connected to the system-on-chip 201 via the third signal lines 03. The number of third signal lines 03 is equal to the number of first signal lines 01.

[0119] The present embodiment does not limit the type of first aggregate chip 108. For example, first aggregate chip 108 may be an input / output die. In some embodiments, data communication and control signals for first aggregate chip 108 are performed using the Peripheral Component Interconnect Express (PCIE) standard, a high-speed serial bus. In some embodiments, first aggregate chip 108 utilizes the SerDes-to-SerDes standard.

[0120] The present embodiment does not limit the number of first signal lines 01 and second signal lines 02. They can be set based on the signal interaction requirements between the hardware module 107a and the system-on-chip 201. The difference in the number of first signal lines 01 and second signal lines 02 is also not limited; the number of first signal lines 01 can be greater than the number of second signal lines 02.

[0121] As described above, the SoC 201 and the RFIC 101 exchange signals via the flexible circuit board 50. By reducing the signal loss through the flexible circuit board 50, the loss on the link between the SoC 201 and the RFIC 101 can be reduced.

[0122] Figure 6 is a schematic diagram of the structure of a flexible circuit board 50 provided in an embodiment of the present application. Referring to Figure 6 , the flexible circuit board 50 has a first region 501 and a bending region 502. The first region 501 and the bending region 502 are connected. When the foldable device is flattened, the vertical projection of the hinge 30 (shown in Figure 2 ) on the flexible circuit board 50 overlaps with the bending region 502.

[0123] The vertical projection mentioned above refers to the area enclosed by the projection of the outer contour of the rotating shaft 30 on the plane where the flexible circuit board 50 is located in the direction perpendicular to the flexible circuit board 50. The rest of the description of the vertical projection in the text is similar.

[0124] In the embodiment where the flexible circuit board 50 is disposed inside the shaft 30 (as shown in FIG5a ), the bending area 502 is disposed inside the shaft 30. The thickness direction of the flexible circuit board 50 is the thickness direction of the folding device, which is the first direction (z direction in FIG7a ).

[0125] The embodiment of the present application does not limit the length of the bending zone 502 along the x-direction. In some embodiments, when the folding device 001 is in the unfolded state, the length of the bending zone 502 along the x-direction is greater than or equal to the length of the rotating shaft 30 along the x-direction. In some embodiments, when the folding device 001 is in the unfolded state, the length of the bending zone 502 along the x-direction can be less than the length of the rotating shaft 30 along the x-direction.

[0126] When the folding device is adjusted from the folded state to the flattened state, the bending area 502 is unfolded. The bending area 502 can compensate for the length change of the flexible circuit board 50 during the adjustment process from the folded state to the flattened state, thereby reducing the internal stress of the flexible circuit board 50.

[0127] The "bend" of the bending zone 502 means that the bending zone 502 has a bendable property, and does not limit the bending zone 502 to always be in a bent state. For example, in Figure 6, the bending zone 502 has multiple wrinkles, and the multiple wrinkles can be flattened or gathered.

[0128] Figure 7a is a schematic diagram of a portion of the structure of a flexible circuit board 50 according to an embodiment of the present application. Referring to Figure 7a, flexible circuit board 50 includes a fourth signal line 550 (as shown in Figure 8a), a shielding layer 540, a first layer structure 510, a second layer structure 520, and a third layer structure 530. The RFIC 101 and the SoC 201 are electrically connected via the fourth signal line 550.

[0129] Figure 7b is a schematic diagram of the exploded structure of a flexible circuit board 50 according to an embodiment of the present application. Referring to Figure 7b , a shielding layer 540, a first layer structure 510, a second layer structure 520, and a third layer structure 530 are stacked along the z-direction. Shielding layer 540 is bonded to first layer structure 510 and positioned in bend region 502.

[0130] In the bending region 502 of the flexible circuit board 50, a first gap 51 is defined between the first layer 510 and the second layer 520, and a second gap 52 is defined between the second layer 520 and the third layer 530. Because the first, second, and third layers 510, 520, and 530 are stacked along the z-direction and positioned at different distances from the rotating axis 30, the first, second, and third layers 510, 520, and 530 move along different arc lengths in the bending region 502 during folding. Adjacent layers of the first, second, and third layers 510, 520, and 530 exhibit a tendency for relative movement. The first and second gaps 51, 52 relieve this tendency, allowing the first, second, and third layers 510, 520, and 530 to bend more smoothly while also relieving internal stress and preventing tearing.

[0131] In addition, when the folding device is adjusted from the folded state to the flat state, the first area 501 does not move or moves a small distance. The first layer structure 510, the second layer structure 520 and the third layer structure 530 in the first area 501 do not move relative to each other or move a small distance.

[0132] In the embodiment of the present application, the length of the first gap 51 along the x-direction is greater than or equal to the length of the bending zone 502 along the x-direction. In other words, the first gap 51 may be partially located in the first zone 501. In some embodiments, the length of the first gap 51 along the x-direction is greater than or equal to the length of the bending zone 502 along the x-direction. The same applies to the size of the second gap 52.

[0133] Figure 8a is a schematic cross-sectional view of a flexible circuit board 50 provided in an embodiment of the present application. Referring to Figure 8a, a first layer structure 510 includes a first covering layer 511, a first conductive layer 512, and a first protective layer 513, stacked sequentially along the z-direction. A shielding layer 540 is bonded to the first covering layer 511, with the first covering layer 511 positioned between the shielding layer 540 and the first conductive layer 512. A second layer structure 520 includes a second covering layer 521, a second conductive layer 522, and a second protective layer 523, stacked sequentially along the z-direction. The second covering layer 521 is positioned between the first protective layer 513 and the second conductive layer 522. A first gap 51 is positioned between the second covering layer 521 and the first protective layer 513. A third layer structure 530 includes a third covering layer 531, a third conductive layer 532, and a third protective layer 533, stacked sequentially along the z-direction. The third covering layer 531 is positioned between the second protective layer 523 and the third conductive layer 532. The second gap 52 is located between the third covering layer 531 and the second protection layer 523 .

[0134] Figure 8b is an exploded schematic diagram of a first conductive layer 512, a second conductive layer 522, and a third conductive layer 532 according to an embodiment of the present application. Referring to Figure 8b, the fourth signal line 550 includes a first conductive segment 551 and a second conductive segment 552 that are electrically connected. The first conductive segment 551 is located in the first region 501, and the second conductive segment 552 is located in the bend region 502. The first conductive segment 551 is formed in the second layer structure 520, and the second conductive segment 552 is formed in the first layer structure 510.

[0135] Returning to FIG. 8 a , the vertical projection of the shielding layer 540 on the first conductive layer 512 overlaps with the second conductive segment 552 .

[0136] During the folding process of the foldable device, the first layer structure 510, the second layer structure 520, and the third layer structure 530 located in the first region 501 experience little or no relative movement. Because the first conductive segment 551 is located in the first region 501, the distance along the z-direction between the first conductive segment 551 and the first conductive layer 512 remains substantially constant. Similarly, the distance along the z-direction between the first conductive segment 551 and the third conductive layer 532 remains substantially constant. This results in minimal signal loss within the first conductive segment 551 due to relative motion of the first conductive layer 512 and the third conductive layer 532.

[0137] As described above, the first layer structure 510, the second layer structure 520, and the third layer structure 530 located in the bending region 502 undergo relative motion. During folding of the foldable device, the distance between the first conductive layer 512 and the second conductive layer 522, as well as the distance between the third conductive layer 532 and the second conductive layer 522, continuously changes. If the second conductive segment 552 is also formed on the second conductive layer 522, this distance change would result in significant signal loss in the second conductive segment 552. In the embodiment of the present application, the second conductive segment 552 is formed on the first conductive layer 512, which can effectively alleviate the signal loss in the second conductive segment 552 caused by the aforementioned distance change. In addition, the shielding layer 540 is bonded to the first cover layer 511, and the distance between the shielding layer 540 and the second conductive segment 552 remains substantially unchanged. The vertical projection of the shielding layer 540 on the first conductive layer 512 overlaps with the second conductive segment 552. The shielding layer 540 prevents interference with the signal in the second conductive segment 552 and has minimal impact on signal loss in the second conductive segment 552.

[0138] Exemplarily, the fourth signal line 550 is used to transmit high-speed RF signals between the RF integrated circuit 101 and the system on a chip 201. The fourth signal line 550 can be regarded as a high-speed RF signal line connecting the transmission RF integrated circuit 101 and the system on a chip 201. Connectors (such as BTBs mentioned later) are provided at both ends of the high-speed RF signal line. The aforementioned high-speed RF signal may include a serializer signal and a deserializer signal. Exemplarily, the operating frequency of the aforementioned high-speed RF signal can be, for example, in the range of 1 GHz (gigahertz) to 5.5 GHz. In some embodiments, the fourth signal line 550 is a differential signal line.

[0139] The vertical projection of the shielding layer 540 on the first conductive layer 512 overlaps the second conductive segment 552, including: the vertical projection of the shielding layer 540 on the first conductive layer 512 partially covers the second conductive segment 552. Alternatively, the vertical projection of the shielding layer 540 on the first conductive layer 512 covers the entire second conductive segment 552. In this manner, the shielding layer 540 provides excellent shielding performance for the second conductive segment 552, reducing the impact of other wiring on the signal of the second conductive segment 552 and similarly reducing the impact of the second conductive segment 552 on other wiring. In some embodiments, the shielding layer 540 covers the entire bending region 502.

[0140] In some embodiments, the vertical projection of the shielding layer 540 on the first conductive layer 512 does not completely cover the first region 501 because the first conductive layer 512 and the third conductive layer 532 in the first region 501 provide shielding. The fact that the shielding layer 540 does not completely cover the first region 501 reduces the thickness of the first region 501, thereby improving the flexibility of the flexible circuit board 50. For example, the vertical projection of the shielding layer 540 on the first conductive layer 512 is located outside the first region 501.

[0141] It is understood that in the embodiments of the present application, the flexible circuit board 50 is not limited to a three-layer structure. For example, the flexible circuit board 50 may also include a fourth layer structure, a fifth layer structure, etc. The fourth layer structure, the fifth layer structure, etc. are located on the side of the third layer structure 530 away from the second layer structure 520.

[0142] The embodiment of the present application does not limit the structure of the shielding layer 540. For example, the shielding layer 540 is an electromagnetic interference (EMI) shielding film. The shielding layer 540 may include a conductive film. In some embodiments, the shielding layer 540 may also include a polymer film covering the surface of the conductive film. In some embodiments, the polymer film of the shielding layer 540 and the first covering layer 511 may be made of the same material, that is, the polymer film of the shielding layer 540 and the first covering layer 511 may be shared, or the polymer film of the shielding layer 540 and the first covering layer 511 may be regarded as one film layer. For example, the shielding layer 540 and the first covering layer 511 may be connected by an adhesive layer.

[0143] Illustratively, the first conductive segment 551 and the second conductive segment 552 are electrically connected via a conductive via 504. The conductive via 504 extends through the first protective layer and the second cover layer. In some embodiments, the conductive via 504 is located in the first region 501. Because the first region 501 barely bends during folding of the foldable device, the conductive via 504 also barely deforms, resulting in a better connection between the first conductive segment 551 and the second conductive segment 552. In some embodiments, the conductive via 504 can also be located in the bending region 502.

[0144] The present embodiment of the present application does not limit the materials of the first conductive layer 512, the second conductive layer 522, and the third conductive layer 532. For example, the material of the first conductive layer 512 may include at least one of copper and its alloys, aluminum and its alloys, titanium and its alloys, carbon fiber, or graphene. For example, the material of the first conductive layer 512 may be rolled copper foil or electrodeposited copper foil. The same applies to the second conductive layer 522 and the third conductive layer 532.

[0145] The first cover layer 511 can prevent the first conductive layer 512 from being oxidized. The same applies to the second cover layer 521 and the third cover layer 531. The present embodiment does not limit the materials of the first cover layer 511, the second cover layer 521, and the third cover layer 531. For example, the material of the first cover layer 511 can include at least one of polyimide (PI) or polyester (PET). The same applies to the second cover layer 521 and the third cover layer 531.

[0146] The first protective layer 513 can support the first conductive layer 512 while preventing the first conductive layer 512 from being exposed on the surface. The same applies to the second protective layer 523 and the third protective layer 533. The embodiment of the present application does not limit the materials of the first protective layer 513, the second protective layer 523 and the third protective layer 533. For example, the material of the first protective layer 513 may include at least one of polyimide (PI), polyester (PET) or polytetrafluoroethylene (PTFE). The same applies to the second protective layer 523 and the third protective layer 533.

[0147] Exemplarily, the shielding layer 540, the second conductive layer 522, the first conductive layer 512, and the conductors in the third conductive layer 532 that are not electrically connected to the fourth signal line 550 are all electrically connected to the floor of the foldable device. For example, the third conductive layer 532 and the shielding layer 540 are both electrically connected to the floor.

[0148] The aforementioned ground layer can generally refer to at least a portion of any ground layer, ground plate, or ground metal layer within the foldable device 001, or at least a portion of any combination of any of the aforementioned ground layers, ground plates, or ground components. The "ground / ground layer" can be used for grounding components within the electronic device. For example, the ground layer of the first printed circuit board 140 or the second printed circuit board 240, the ground metal layer formed by the metal film on the backlight side of the flexible display, the conductive ground layer of the battery, and conductive or metal parts electrically connected to the aforementioned ground layer / ground plate / metal layer.

[0149] In some embodiments of the present application, as shown in FIG8 a , the flexible circuit board 50 may further include a first adhesive layer 561 and a second adhesive layer 562. Both the first adhesive layer 561 and the second adhesive layer 562 are located in the first region 501, with the first adhesive layer 561 located between the first protective layer 513 and the second cover layer 521. The first adhesive layer 561 connects the first protective layer 513 and the second cover layer 521, thereby preventing relative movement between the first protective layer 513 and the second cover layer 521 located in the first region 501. The second adhesive layer 562 is located between the second protective layer 523 and the third cover layer 531. Similarly, the second protective layer 523 and the third cover layer 531 are connected by the second adhesive layer 562, thereby preventing relative movement between the second protective layer 523 and the third cover layer 531 located in the first region 501.

[0150] In some embodiments of the present application, the flexible circuit board 50 may further include a second area 503 , and the first area 501 , the bending area 502 , and the second area 503 are connected in sequence.

[0151] Figure 8c is another schematic cross-sectional view of the flexible printed circuit board 50 provided in an embodiment of the present application. Referring to Figure 8c , the fourth signal line 550 may further include a third conductive segment 553. The third conductive segment 553 is located in the second region 503 and electrically connected to the second conductive segment 552. The third conductive segment 553 is formed in the second conductive layer 522. In other words, the third conductive segment 553 is formed in the second conductive layer 522 in the second region 503.

[0152] Similar to the first conductive segment 551, during the folding process of the foldable device, the distance between the third conductive segment 553 and the first conductive layer 512 along the z-direction does not change or changes only slightly, and the distance between the third conductive segment 553 and the third conductive layer 532 does not change or changes only slightly. Signal loss within the third conductive segment 553 formed in the second region 503 is minimal.

[0153] The description of the third conductive segment 553 and the second region 503 may refer to the description of the first conductive segment 551 and the first region 501 , which will not be repeated here.

[0154] In addition, shortening the distance of the fourth signal line 550 can also reduce the loss of the high-speed RF signal transmitted in the fourth signal line 550. For example, the extension direction of the fourth signal line 550 is a straight line, which can shorten the distance of the fourth signal line 550. Exemplarily, the vertical projection of the fourth signal line 550 on the second conductive layer 522 is a straight line. The straight line is perpendicular to the y-direction. In addition, shortening the distance of the fourth signal line 550 can be achieved by adjusting the placement of the system single chip 201 and the radio frequency integrated circuit 101. For example, the distance between the system single chip 201 and the radio frequency integrated circuit 101 along the y-direction is relatively close, and adjusting the distance between the system single chip 201 and the radio frequency integrated circuit 101 and the bending area 502 to be relatively close can shorten the distance of the fourth signal line 550, so as to achieve the purpose of reducing the loss of the high-speed RF signal transmitted in the fourth signal line 550.

[0155] The signals transmitted between the SoC 201 and the RFIC 101 are not limited to the aforementioned high-speed RF signals. In some embodiments, the signals transmitted between the SoC 201 and the RFIC 101 also include a clock signal. The SoC 201 and the RFIC 101 transmit this clock signal via a clock signal line. Due to the high accuracy requirements for the clock signal, the isolation requirements for the clock signal line are correspondingly increased.

[0156] In FIG8b , the flexible printed circuit board 50 further includes a clock signal line 554, which is electrically isolated from the fourth signal line 550. The clock signal line 554 is formed on the second conductive layer 522. The vertical projection of the fourth signal line 550 on the second conductive layer 522 does not overlap with the clock signal line 554. As a result, the fourth signal line 550 and the clock signal line 554 do not overlap in the thickness direction (i.e., the z-direction) of the flexible printed circuit board 50. This effectively reduces interference between the fourth signal line 550 and the clock signal line 554, increases the isolation of the clock signal line 554, and ensures a more accurate clock signal transmitted within the clock signal line 554.

[0157] The aforementioned electrical isolation of the clock signal line 554 and the fourth signal line 550 means that the clock signal line 554 and the fourth signal line 550 are not directly electrically connected, nor are they electrically connected through other conductors (such as wires). The same applies to the rest of the descriptions about electrical isolation in the text.

[0158] For example, the signal transmitted in the aforementioned clock signal line 554 may be a radio frequency integrated circuit clock signal.

[0159] In some embodiments, the distance between the fourth signal line 550 and the clock signal line 554 is greater than or equal to 0.4 mm. This allows for greater distance between the fourth signal line 550 and the clock signal line 554, minimizing interference between the two and improving isolation of the clock signal line 554. For example, the distance between the fourth signal line 550 and the clock signal line 554 can be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.5 mm, 3 mm, 3.5 mm, or 4 mm. For example, the clock signal line 554 is located at an edge of the flexible printed circuit board 50. Compared to the other wiring on the flexible printed circuit board 50, the clock signal line 554 is the smallest distance from the edge of the flexible printed circuit board 50.

[0160] In the embodiments of the present application, the flexible circuit board 50 is not limited to being provided with the aforementioned fourth signal line 550 and clock signal line 554. For example, the aforementioned second signal line 02 may also be provided on the flexible circuit board 50. For example, the aforementioned second signal line 02 is formed on the second conductive layer 522. The second signal line 02, the fourth signal line 550, and the clock signal line 554 are electrically isolated from each other. For example, the fourth signal line 550 is located between the clock signal line 554 and the second signal line 02. Since the second signal line 02 is farther from the clock signal line 554 than the fourth signal line 550, the second signal line 02 will have less interference with the signal within the clock signal line 554.

[0161] In some embodiments, an isolation conductive structure 555 is further provided between the clock signal line 554 and the second signal line 02. The isolation conductive structure 555 is formed on the second conductive layer 522 and is located on one side of the clock signal line 554. The isolation conductive structure 555 is located between the fourth signal line 550 and the second signal line 02. The isolation conductive structure 555 is electrically connected to the ground plane. The electrical isolation provided by the isolation conductive structure 555 can improve the isolation between the fourth signal line 550 and the second signal line 02, thereby preventing interference between the signals therebetween. For example, the isolation conductive structure 555 can be a conductive plate or a conductive wire, which is electrically connected to the ground plane.

[0162] In the embodiment of the present application, in addition to the aforementioned fourth signal line 550, second signal line 02, and clock signal line 554, the flexible circuit board 50 may also be provided with other signal lines, such as a fifth signal line 556. The fifth signal line 556 is formed on the second conductive layer 522. The fifth signal line 556 may be a signal line of the flexible display screen 40. The fifth signal line 556 may be a signal line electrically connecting the second power management chip 202 and the RFIC 101, the first buck device 601, the second buck device 602, and the third buck device 604.

[0163] It will be appreciated that, in the embodiments of the present application, the configuration of the remaining signal lines on the flexible circuit board 50 may also adopt the configuration of the fourth signal line 550. For example, if other signal lines require reduced loss, a portion of the conductive segments may be formed in the second conductive layer 522 of the first region 501, and a portion of the conductive segments may be formed in the first conductive layer 512 of the bend region 502. In other words, the embodiments of the present application are not limited to the fourth signal line 550 for transmitting high-speed RF signals being formed partially in the second conductive layer 522 of the first region 501 and partially in the first conductive layer 512 of the bend region 502. The configuration of the remaining signal lines may also be similar to that of the fourth signal line 550.

[0164] As described above, the RFIC 101 is disposed on the first printed circuit board 140 and is electrically connected to the fourth signal line 550 formed on the flexible printed circuit board 50. In some embodiments, the flexible printed circuit board 50 and the first printed circuit board 140 are electrically connected via a first electrical connector 70a (shown in FIG. 3 ) and a second electrical connector 70b. For example, the first electrical connector 70a and the second electrical connector 70b each comprise a board-to-board connector (BTB).

[0165] Illustratively, the first electrical connector 70a is used to transmit radio frequency signals, for example, the fourth signal line 550 and the clock signal line 554 described above are electrically connected to the first electrical connector 70a. The second electrical connector 70b is used to transmit non-radio frequency signals, for example, the second signal line 02 and the fifth signal line 556 described above are electrically connected to the second electrical connector 70b.

[0166] FIG9 is a schematic diagram of the structure of a first electrical connector 70a provided in an embodiment of the present application. Referring to FIG9 , the first electrical connector 70a may include a male connector 71 and a female connector 72, which are capable of interlocking. In some embodiments, the male connector 71 is disposed on the flexible circuit board 50, and the female connector 72 is disposed on the first printed circuit board 140. In other embodiments, the male connector 71 is disposed on the first printed circuit board 140, and the female connector 72 is disposed on the flexible circuit board 50. When the male connector 71 and the female connector 72 are interlocked, electrical connectivity between the first printed circuit board 140 and the flexible circuit board 50 is achieved.

[0167] The present embodiment of the present invention does not limit the connection method between the male connector 71 or the female connector 72 and the flexible circuit board 50, and welding is possible, for example. Similarly, the connection method between the male connector 71 or the female connector 72 and the first printed circuit board 140 is not limited, and welding is possible, for example.

[0168] In some embodiments, the first electrical connector 70a may further include a first shielding cover 73 and a second shielding cover 74. The first shielding cover 73 is connected to the connector male connector 71 and is arranged on the outer periphery of the connector male connector 71. The second shielding cover 74 is connected to the connector female connector 72 and is arranged on the outer periphery of the connector female connector 72. When the connector male connector 71 and the connector female connector 72 are snapped together, the first shielding cover 73 and the second shielding cover 74 are also snapped together, for example, the first shielding cover 73 extends into the second shielding cover 74, or the second shielding cover 74 extends into the first shielding cover 73. The snapping together of the first shielding cover 73 and the second shielding cover 74 can improve the isolation of the first electrical connector 70a. At an operating frequency of 0 GHz to 8 GHz, the external isolation of the first electrical connector 70a can reach less than or equal to -50 dB (decibels).

[0169] The present embodiment does not limit the structure of the first shielding cover 73 and the second shielding cover 74. For example, the first shielding cover 73 and the second shielding cover 74 can both be annular structures. Similarly, the structure of the electrical connector connecting the second printed circuit board 240 and the flexible circuit board 50 can also adopt the first electrical connector 70a shown in Figure 9.

[0170] It is understandable that in some embodiments of the present application, the first shielding cover 73 and the second shielding cover 74 on the first electrical connector 70a are not necessary and may not be provided.

[0171] The structure of the second electrical connector 70a can be similar to the description of the first electrical connector 70a. In some embodiments, the second electrical connector 70a is used to transmit non-RF signals. If the isolation requirements for the non-RF signals are not high, the first shielding cover 73 and the second shielding cover 74 may not be provided on the second electrical connector 70a.

[0172] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A folding device, characterized in that: The folding device comprises: a first body, a rotating shaft, and a second body; when the folding device is in a flattened state, the first body, the rotating shaft, and the second body are arranged in sequence; A radio frequency integrated circuit, configured to perform radio frequency processing on data sent by the system single chip and generate a radio frequency signal; and provided in the first body; The system single chip is used to receive and send data with the radio frequency integrated circuit; it is provided in the second body; A flexible circuit board, through which the radio frequency integrated circuit and the system-on-chip are electrically connected; a first battery, disposed in the first body; a second battery, disposed in the second body; a first power management chip, disposed in the first body, electrically connected to the first battery, and configured to supply power to the radio frequency integrated circuit; The second power management chip is provided in the second body, is electrically connected to the second battery, and is used to supply power to the system single chip but does not supply power to the first power management chip.

2. The folding device according to claim 1, characterized in that The second power management chip does not supply power to the radio frequency integrated circuit.

3. The folding device according to claim 1 or 2, characterized in that: The first battery is used to output a power supply voltage, and the first battery is used to provide the power supply voltage to the first power management chip; The folding device further comprises: The voltage regulating circuit is provided in the first main body and is electrically connected to the first battery, and is used for reducing the power supply voltage and supplying the reduced voltage to the first power management chip and the radio frequency integrated circuit.

4. The folding device according to claim 3, characterized in that The voltage adjustment circuit includes: a first voltage-reducing device, disposed in the first body; electrically connected to the first battery, configured to reduce the power supply voltage to a first voltage and to provide the first voltage to the first power management chip; a second voltage-reducing device, disposed in the first body; electrically connected to the first battery, for reducing the power supply voltage to a second voltage and for providing the second voltage to the first power management chip; A first voltage stabilizing device is provided in the first main body; it is electrically connected to the first voltage reducing device, and is used to reduce the first voltage to a third voltage and to provide the third voltage for the first power management chip and the radio frequency integrated circuit.

5. The folding device according to claim 4, characterized in that The folding device further includes: a radio frequency switch, disposed on the first body; The voltage regulating circuit further includes a third voltage-reducing device and a second voltage-stabilizing device, wherein the third voltage-reducing device is disposed on the first body and electrically connected to the first battery, and is configured to reduce the power supply voltage to a fourth voltage and provide the fourth voltage to the second voltage-stabilizing device; The second voltage stabilizing device is provided on the first body and is electrically connected to the third voltage reducing device, and is used to reduce the fourth voltage to a fifth voltage and provide the fifth voltage for the radio frequency switch.

6. The folding device according to claim 5, characterized in that The folding device also includes: a radio frequency power amplifier, which is arranged on the first body; the third buck device and the first battery are both electrically connected to the radio frequency power amplifier, and the third buck device is also used to provide the fourth voltage for the radio frequency power amplifier; the first battery is also used to provide the power supply voltage for the radio frequency power amplifier.

7. The folding device according to any one of claims 1 to 6, characterized in that: The folding device further comprises: a charging manager, provided in the second body; the first battery and the second battery are both electrically connected to the charging manager; The charging manager is used to obtain the voltage of the first battery and the voltage of the second battery; outputting a control instruction based on a difference between a voltage of the first battery and a voltage of the second battery; The control instruction is used to: when the difference is greater than or equal to a threshold and the voltage of the first battery is greater than the voltage of the second battery, control the first battery to charge the second battery; Alternatively, the control instruction is used to: when the difference is greater than or equal to a threshold and the voltage of the first battery is less than the voltage of the second battery, control the second battery to charge the first battery.

8. The folding device according to any one of claims 1 to 7, characterized in that: The folding device further comprises: A hardware module, provided in the first body; A first polymer chip, disposed on the first body; a first signal line, through which the hardware module is electrically connected to the first aggregation chip; a second signal line, the system single chip is electrically connected to the first aggregate chip via the second signal line; The number of the first signal lines is greater than the number of the second signal lines.

9. The folding device according to claim 8, characterized in that The folding device further includes: a second polymer chip and a third signal line; the second polymer chip is disposed on the second body; the second polymer chip is electrically connected to the first polymer chip via the second signal line; the second polymer chip is electrically connected to the system single chip via the third signal line; The number of the third signal lines is equal to the number of the first signal lines.

10. The folding device according to any one of claims 1 to 9, characterized in that: The flexible circuit board has a first area and a bending area, and when the folding device is in a flattened state, a vertical projection of the rotating shaft on the flexible circuit board overlaps with the bending area; The flexible circuit board comprises: a shielding layer, a first layer structure, a second layer structure, and a third layer structure stacked in sequence along the thickness direction of the flexible circuit board; in the bending region, a first gap is formed between the first layer structure and the second layer structure, and a second gap is formed between the second layer structure and the third layer structure; The flexible circuit board also includes: a fourth signal line for connecting the radio frequency integrated circuit and the system single chip; the fourth signal line includes a first conductive segment and a second conductive segment that are electrically connected, the first conductive segment is located in the first area and formed in the second layer structure, and the second conductive segment is located in the bending area and formed in the first layer structure; the vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment.

11. The folding device according to claim 10, characterized in that The fourth signal line further includes a conductive via, which penetrates the first layer structure and the second layer structure along the thickness direction of the flexible circuit board; the first conductive segment and the second conductive segment are electrically connected through the conductive via.

12. The folding device according to claim 10 or 11, characterized in that: The flexible circuit board also includes a first glue layer and a second glue layer; the first glue layer and the second glue layer are located in the first area, and the first glue layer is located between the first layer structure and the second layer structure; the second glue layer is located between the second layer structure and the third layer structure.

13. The folding device according to any one of claims 10 to 12, characterized in that: A vertical projection of the shielding layer on the first layer structure covers the second conductive segment.

14. The folding device according to any one of claims 10 to 13, characterized in that: The flexible circuit board further has a second area, and the first area, the bending area and the second area are connected in sequence; The fourth signal line further includes a third conductive segment. The third conductive segment is located in the second region and electrically connected to the second conductive segment. The third conductive segment is formed in the second layer structure.

15. The folding device according to claim 14, characterized in that The flexible circuit board also includes a clock signal line, which is formed in the second layer structure and is electrically isolated from the fourth signal line; a vertical projection of the fourth signal line on the second layer structure does not overlap with the clock signal line.

16. The folding device according to claim 15, characterized in that A distance between the clock signal line and the fourth signal line is greater than or equal to 0.4 mm.

17. The folding device according to any one of claims 1 to 16, characterized in that: The folding device further includes: a cellular antenna and a short-range antenna, wherein the cellular antenna is arranged on the first body and electrically connected to the radio frequency integrated circuit; the short-range antenna is arranged on the second body and electrically connected to the system single chip.

18. A flexible circuit board, characterized in that: The flexible circuit board has a first area and a bending area; the flexible circuit board includes: First level structure; a second layer structure, stacked with the first layer structure; and a first gap is formed between the first layer structure and the second layer structure in the bending region; a third layer structure, wherein the second layer structure is located between the third layer structure and the first layer structure; and a second gap is provided between the second layer structure and the third layer structure in the bending region; and a signal line, the signal line comprising a first conductive segment and a second conductive segment electrically connected, the first conductive segment being located in the first region and formed in the second layer structure, and the second conductive segment being located in the bending region and formed in the first layer structure; The shielding layer, the first layer structure is located between the second layer structure and the shielding layer, and a vertical projection of the shielding layer on the first layer structure overlaps with the second conductive segment.

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