Inspection device

Abstract

This inspection device comprises: a measurement unit that acquires shape data of an object; and a processing unit that refers to substrate data, in which information of an inspection portion indicating an inspection subject in the mounting substrate is set, and generates three-dimensional information of the inspection portion on the basis of the shape data of the object acquired by the measurement unit, the object being the mounting substrate. The processing unit sets, as the substrate data, information of a specific region in which superimposition of noise is assumed in the shape data of the mounting substrate, and when generating the three-dimensional information of the inspection portion, the processing unit performs mask processing for excluding specific data corresponding to the specific region in the shape data, or performs correction processing for correcting the specific data.

Description

Inspection Equipment

[0001] The present invention relates to an inspection device that inspects a mounting board on which components are mounted.

[0002] Patent Literature 1 discloses a three-dimensional measuring device used to inspect the mounting state of components on a mounting board. The three-dimensional measuring device acquires three-dimensional data of an object using both a phase shift method and a light section method, and generates three-dimensional information about the object based on the three-dimensional data.

[0003] A mounting board has through-holes through which lead terminals connected to components are inserted, silk screen printing, and clamps that hold the board in place. These through-holes, silk screen printing, and clamps are areas where noise is likely to be superimposed on the three-dimensional data. When generating three-dimensional information about an inspection area on a mounting board based on three-dimensional data with noise superimposed on it, accurate three-dimensional information about the inspection area may not be generated. In this case, the inspection area on the mounting board may not be inspected accurately.

[0004] International Publication No. 2020-065850

[0005] An object of the present invention is to provide an inspection apparatus that can inspect an inspection portion of a mounting board with high precision.

[0006] According to one aspect of the present invention, an inspection apparatus is provided in a production line that produces mounted boards having components mounted on printed circuit boards, and inspects the mounted boards. The inspection apparatus includes a measurement unit that acquires shape data of an object, and a processing unit that references board data that includes information about an inspection portion indicating an inspection target on the mounted board, and generates three-dimensional information of the inspection portion based on the shape data acquired by the measurement unit, using the mounted board as the object. The processing unit sets information about a specific region on the mounted board where noise is expected to be superimposed on the shape data in the board data, and when generating the three-dimensional information of the inspection portion, performs a masking process to exclude specific data corresponding to the specific region in the shape data, or performs a correction process to correct the specific data.

[0007] The objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

[0008] FIG. 1 is a diagram showing the configuration of a production line to which an inspection apparatus according to an embodiment of the present invention is applied. FIG. 2 is a block diagram showing the configuration of the inspection apparatus. FIG. 3 is a cross-sectional view showing a measurement unit provided in the inspection apparatus, showing the configuration of a first measurement unit that acquires two-dimensional data. FIG. 4 is a diagram showing the configuration of a second measurement unit in the measurement unit that acquires three-dimensional data. FIG. 5 is a diagram explaining the processing content of a processing unit provided in the inspection apparatus. FIG. 6 is a flowchart showing the flow of a board data creation process executed by the processing unit. FIG. 7 is a flowchart showing the flow of a specific area setting process based on three-dimensional data executed by the processing unit. FIG. 8 is a flowchart showing the flow of a specific area setting process based on two-dimensional data and three-dimensional data executed by the processing unit. FIG. 9 is a flowchart showing the flow of a trained model creation process executed by the processing unit. FIG. 10 is a flowchart showing the flow of a specific area setting process based on design data executed by the processing unit. FIG. 11 is a flowchart showing the flow of an inspection process executed by the processing unit. FIG. 12 is a flowchart showing the flow of a new specific area setting process executed by the processing unit.

[0009] An inspection device according to an embodiment of the present invention will be described below with reference to the drawings.

[0010] [Configuration of a production line to which an inspection device is applied] Figure 1 is a diagram showing the configuration of a production line 1 to which an inspection device 2M according to this embodiment is applied. The production line 1 is a line that produces mounted boards P2 in which components B are mounted on printed circuit boards P1, and includes a board transport path TR and multiple operating devices. The board transport path TR is a transport path along which boards are transported. The multiple operating devices are arranged on the board transport path TR and perform predetermined operations on the boards. The multiple operating devices include a printing machine 11, a print inspection machine 12, a mounting machine 13, a board inspection machine 14, a reflow oven 15, and a visual inspection machine 16, which are arranged in tandem from upstream to downstream in the board transport direction along the board transport path TR.

[0011] The printer 11 applies solder to the pads of the printed circuit board P1. The print inspection machine 12 takes an image of the printed circuit board P1 to which solder has been applied, and inspects whether the position, amount, and height of the solder are appropriate. The mounter 13 is equipped with a component mounting head and produces a mounted board P2 by mounting required components B on the printed circuit board P1. The reflow furnace 15 heats the mounted board P2 to melt the solder and fix the components B to the board.

[0012] The board inspection machine 14 takes an image of the mounted board P2 produced by the mounting machine 13, and inspects the mounting state of the components B on the mounted board P2, such as misalignment of the components B, lead misalignment, component floating, soldering defects, etc. The appearance inspection machine 16 takes an image of the mounted board P2 after heat treatment in the reflow furnace 15, and inspects the mounting state of the components B on the mounted board P2 in the same way as the board inspection machine 14.

[0013] The inspection device 2M according to this embodiment is applied to the board inspection machine 14 and the appearance inspection machine 16. In this case, the inspection device 2M acquires shape data of the mounting board P2 in order to inspect the mounting state of the component B on the mounting board P2, and generates three-dimensional information of the mounting board P2 based on the shape data.

[0014] The printed circuit boards P1 and the mounted circuit boards P2 transported along the board transport path TR of the production line 1 are provided with fiducial marks M and include through-hole portions A1 into which lead terminals connected to components B are inserted, silk portions A21 with silk printing, and clamp portions A22 that serve as holding portions when the boards are held. The through-hole portions A1 can be a specific area A on the boards P1 and P2 where noise is expected to be superimposed on the shape data acquired by the inspection device 2M. The silk portions A21 and the clamp portions A22 are included in a noise superimposition area A2 other than the through-hole portions A1 where noise is expected to be superimposed. In other words, the printed circuit boards P1 and the mounted circuit boards P2 include the through-hole portions A1 and the noise superimposition area A2 including the silk portions A21 and the clamp portions A22 as specific areas A where noise is expected to be superimposed on the shape data acquired by the inspection device 2M.

[0015] [Configuration of Inspection Apparatus] Fig. 2 is a block diagram showing the configuration of the inspection apparatus 2M. The inspection apparatus 2M is an apparatus that inspects the mounting board P2 produced on the production line 1. The mounting board P2 is carried into the inspection stage of the inspection apparatus 2M while placed on a conveyor 202, and is carried out after inspection. The inspection apparatus 2M includes a measurement unit 2 and a processing unit 5. The measurement unit 2 is a unit that acquires shape data D1 of the object. The measurement unit 2 is movable in the X, Y, and Z directions by a movement mechanism 201. The processing unit 5 performs processing to analyze the shape data D1 acquired by the measurement unit 2, and also performs processing to control the operation of the measurement unit 2.

[0016] <Regarding the Measurement Unit> The measurement unit 2 is configured to be able to acquire two-dimensional data D2 and three-dimensional data D3 of an object as shape data D1. When the object is a mounting substrate P2, the measurement unit 2 acquires two-dimensional data D2 and three-dimensional data D3 of the mounting substrate P2 as shape data D1. The measurement unit 2 includes a first measurement unit 3 that acquires the two-dimensional data D2 of the object, and a second measurement unit 4 that acquires three-dimensional data D3 of the object by a phase shift method.

[0017] FIG. 3 is a cross-sectional view of the measurement unit 2. The measurement unit 2 includes a first camera 21. The first camera 21 is shared by the first measurement unit 3 and the second measurement unit 4. The first camera 21 includes a camera body 22 and a lens barrel 23. The camera body 22 includes an image sensor 24 that captures images. The image sensor 24 is a sensor in which pixels made of photoelectric conversion elements are arranged in a matrix. The image sensor 24 can be, for example, a CMOS sensor. The lens barrel 23 includes multiple optical lenses that form an optical image of the object on the light receiving surface of the image sensor 24. A half mirror 25 that forms the measurement optical path of the first measurement unit 3 is arranged on the optical path within the lens barrel 23.

[0018] The first measurement unit 3 includes a coaxial illumination unit 31 and a multi-directional illumination unit 32 as illumination systems, and a camera body 22 as an imaging system. The coaxial illumination unit 31 irradiates a mounting substrate P2 as an object with coaxial illumination light L11. The coaxial illumination unit 31 includes an LED light-emitting unit and is attached to the side surface of the lens barrel 23. The coaxial illumination light L11 emitted from the coaxial illumination unit 31 is reflected by the half mirror 25 and irradiated onto the mounting substrate P2 along the imaging optical axis of the first camera 21. The reflected light RL from the mounting substrate P2 enters the camera body 22 through the lens barrel 23 and is received by the imaging sensor 24.

[0019] The multi-directional illumination unit 32 includes an upper illumination unit 34, a middle illumination unit 35, and a lower illumination unit 36, all of which are composed of LED light-emitting units. The upper illumination unit 34 is attached to the lower end of the first camera 21 and irradiates the mounting substrate P2 with upper illumination light L12 at an illumination angle close to the vertical direction. The upper illumination light L12 is, for example, white light or a combination of white light and infrared light. Reflected light RL of the upper illumination light L12 along the imaging optical axis is also received by the imaging sensor 24.

[0020] The middle-level illumination unit 35 irradiates the mounting substrate P2 with middle-level illumination light L13 at an illumination angle that is more inclined with respect to the vertical direction than the upper-level illumination light L12. The middle-level illumination light L13 is, for example, white light. A dome reflector 331 with a hemispherical reflective surface is attached to the lower end of the first camera 21. The middle-level illumination unit 35 is disposed facing upward, and the middle-level illumination light L13 is reflected by the dome reflector 331 and irradiated onto the mounting substrate P2.

[0021] The lower illumination unit 36 ​​irradiates the mounting substrate P2 with lower illumination light L14 at an illumination angle that is even more tilted with respect to the vertical direction than the middle illumination light L13. The lower illumination light L14 is, for example, white light. A holding dish 332 having a larger diameter than the dome reflector 331 is attached to the lower end of the dome reflector 331. The lower illumination unit 36 ​​is attached to the holding dish 332 at a predetermined inclination. Reflected light RL of the middle illumination light L13 and the lower illumination light L14 along the imaging optical axis is also received by the imaging sensor 24.

[0022] The camera body 22 of the first camera 21 functions as a camera that captures a two-dimensional image of the mounting substrate P2 in the first measurement unit 3 that acquires the two-dimensional data D2. When the first measurement unit 3 acquires the two-dimensional data D2, one or more of the coaxial illumination unit 31, the upper illumination unit 34, the middle illumination unit 35, and the lower illumination unit 36 ​​are selected. As in the present embodiment, by enabling irradiation with the coaxial illumination light L11, the upper illumination light L12, the middle illumination light L13, and the lower illumination light L14, the mounting substrate P2 can be illuminated from multiple angles. This allows the first measurement unit 3 to acquire two-dimensional data D2 that is represented by a clear two-dimensional image of the mounting substrate P2 as the target.

[0023] FIG. 4 is a diagram showing the configuration of the second measurement unit 4 that acquires three-dimensional data D3 in the measurement unit 2. In FIG. 4, the configuration related to the first measurement unit 3 is omitted from the measurement unit 2 shown in FIG. 3. The second measurement unit 4 includes multiple projectors 41 as an illumination system and a camera body 22 as an imaging system. The projectors 41 are arranged at a predetermined inclination around the imaging optical axis of the first camera 21. In other words, the projection axis of the projector 41 is inclined at a predetermined angle with respect to the imaging optical axis. For example, four projectors 41 or eight projectors 41 are arranged at equal distances and evenly spaced apart in the circumferential direction surrounding the imaging optical axis.

[0024] The second measurement unit 4 employs the phase shift method, capturing images while varying the phase of light irradiating a mounting substrate P2 as an object, and acquiring three-dimensional data D3 of the surface of the mounting substrate P2. A projector 41 irradiates the mounting substrate P2 with patterned light L2, such as a sine wave pattern or a stripe pattern. Reflected light RL1 of the patterned light L2 along the imaging optical axis is incident on the first camera 21. An imaging sensor 24 of the camera body 22 receives the reflected light RL1.

[0025] The projector 41 emits pattern light L2 with different phases per field of view, for example, four times. The first camera 21 captures an image each time the pattern light L2 is emitted. The second measurement unit 4 analyzes the phase change resulting from the surface shape of the mounting substrate P2 based on the brightness change in the four acquired images. Then, based on the analysis results, the second measurement unit 4 acquires three-dimensional data D3, such as the height of the component B on the mounting substrate P2.

[0026] <Regarding the Processing Unit> Returning to Fig. 2 , the processing unit 5 is realized by a processor that operates by loading a predetermined program. The processing unit 5 performs processing to analyze the shape data D1 including the two-dimensional data D2 and three-dimensional data D3 acquired by the measurement unit 2, and also performs processing to control the operation of the measurement unit 2. The processing unit 5 functionally includes an axis processing unit 51, an imaging processing unit 52, a measurement processing unit 53, a memory unit 54, a display unit 55, an operation unit 56, and an overall processing unit 57.

[0027] The overall processing unit 57 performs processing to comprehensively control the operations of the axis processing unit 51 , the image capturing processing unit 52 , the measurement processing unit 53 , the storage unit 54 , the display unit 55 , and the operation unit 56 .

[0028] The display unit 55 is a display that displays various information and data. The operation unit 56 is composed of a keyboard, a mouse, or a touch panel provided on the display unit 55. The operation unit 56 accepts input operations of various commands by an operator.

[0029] The storage unit 54 stores various data, setting values, and the like necessary for the operation of the inspection device 2M. For example, the storage unit 54 stores board data BD. The board data BD contains information about the position and shape of an inspection portion indicating an inspection target on the mounting board P2, information about the position and shape of a specific area A on the mounting board P2, and the like. Note that if design data for the mounting board P2 exists that specifies the mounting position of the component B, the position of the specific area A, and the like, the design data may be stored in the storage unit 54.

[0030] The axis processing unit 51 controls the movement mechanism 201 to move the measurement unit 2 in the X, Y, and Z directions. The movement mechanism 201 has an X-axis drive motor, a Y-axis drive motor, and a Z-axis drive motor for moving the measurement unit 2. The axis processing unit 51 controls these drive motors to move the measurement unit 2 to the imaging positions of the first measurement unit 3 and the second measurement unit 4.

[0031] The imaging processing unit 52 controls the first measurement unit 3 and the second measurement unit 4 mounted on the measurement unit 2 to acquire shape data D1 including two-dimensional data D2 and three-dimensional data D3 of the mounting board P2.

[0032] The measurement processing unit 53 performs a setting process to set various information in the board data BD, and also performs an inspection process to inspect the mounting board P2. The board data BD in which various information has been set by the measurement processing unit 53 is stored in the storage unit 54. The measurement processing unit 53 performs an inspection process to inspect the mounting board P2 while referring to the board data BD. The setting process and inspection process performed by the measurement processing unit 53 will be described below with reference to FIG. 5.

[0033] The measurement processing unit 53 sets, for the board data BD, inspection portion information BD1 relating to the inspection portion on the mounting board P2, and also sets specific area information BD2 relating to the specific area A on the mounting board P2.

[0034] The inspection portion information BD1 is information including the shape and position of the inspection portion on the mounting board P2. This inspection portion information BD1 is associated with inspection item information BD11 indicating the inspection item of the inspection portion, inspection method information BD12 indicating the inspection method for the inspection item, and the like. In the example shown in FIG. 5 , the inspection portion indicated by the inspection portion information BD1 is component B, the inspection item indicated by the inspection item information BD11 is component height, and the inspection method indicated by the inspection method information BD12 is three-dimensional data analysis. In this case, when performing an inspection process for inspecting the mounting board P2 while referencing the board data BD, the measurement processing unit 53 generates three-dimensional information DA representing the height of component B on the mounting board P2 based on the three-dimensional data D3 of the mounting board P2 acquired by the measurement unit 2. Then, the measurement processing unit 53 inspects whether the condition of the inspection portion on the mounting board P2 is normal based on the generated three-dimensional information DA.

[0035] The specific area information BD2 is information about a specific area A on the mounting board P2 where noise is expected to be superimposed on the shape data D1 acquired by the measurement unit 2. The measurement processing unit 53 sets information about the through-hole portion A1 formed on the mounting board P2 as the specific area information BD2 in the board data BD, and also sets information about the noise superimposition portion A2 including the silk portion A21 and the clamp portion A22 in the board data BD as the specific area information BD2. As described above, on the mounting board P2, the through-hole portion A1 is a portion that can be the specific area A where noise is expected to be superimposed on the shape data D1 acquired by the measurement unit 2, and the silk portion A21 and the clamp portion A22 are included in the noise superimposition portion A2 other than the through-hole portion A1 where noise is expected to be superimposed.

[0036] The specific area information BD2 is associated with detection item information BD21 indicating detection items such as the shape and position of the specific area A on the mounting board P2, detection method information BD22 indicating detection methods for the detection items, and countermeasure method information BD23 indicating a countermeasure method for the data values ​​of the shape data D1 corresponding to the specific area A. In the example shown in Figure 5, the information associated with the through-hole portion A1 indicated by the specific area information BD2 includes the detection items indicated by the detection item information BD21 being shape and position, the detection methods indicated by the detection method information BD22 being two-dimensional data analysis and three-dimensional data analysis, and the countermeasure method indicated by the countermeasure method information BD23 being masking. Also, the information associated with the noise superimposition portion A2 indicated by the specific area information BD2 includes the detection items indicated by the detection item information BD21 being shape and position, the detection method indicated by the detection method information BD22 being three-dimensional data analysis, and the countermeasure method indicated by the countermeasure method information BD23 being correction processing.

[0037] In this case, the measurement processing unit 53 extracts the through-hole portion A1 based on the two-dimensional data D2 and three-dimensional data D3 acquired by the measurement unit 2, and extracts the noise superimposed portion A2 based on the three-dimensional data D3, and sets information on the shapes and positions of the extracted through-hole portion A1 and noise superimposed portion A2 as specific area information BD2 in the board data BD. Then, when generating three-dimensional information DA of the inspection portion of the mounting board P2 in the inspection process, the measurement processing unit 53 classifies the three-dimensional data D3 of the mounting board P2 acquired by the measurement unit 2 into normal data D31 corresponding to areas other than the specific area A and specific data D32 corresponding to the specific area A. Furthermore, the measurement processing unit 53 classifies the specific data D32 into first data D321 corresponding to the through-hole portion A1 and second data D322 corresponding to the noise superimposed portion A2. The measurement processing unit 53 then references the countermeasure technique information BD23 associated with the specific region information BD2 set in the board data BD, performs a masking process to remove the first data D321 corresponding to the through-hole portion A1, and performs a correction process to correct the second data D322 corresponding to the noise superimposition portion A2 to, for example, "0," an ideal height value measured with the board surface as the reference. As a result, the measurement processing unit 53 can generate three-dimensional information DA of the inspection portion of the mounting board P2 based on the three-dimensional data D3 obtained by excluding data corresponding to the through-hole portion A1, where noise superimposition is expected, and correcting data corresponding to the noise superimposition portion A2. In this case, accurate three-dimensional information DA of the inspection portion can be generated, allowing the inspection portion to be inspected with high precision.

[0038] (Board Data Creation Processing) In this embodiment, the processing unit 5 is capable of performing board data creation processing that creates board data BD in the measurement processing unit 53. The measurement processing unit 53 performs the board data creation processing prior to the inspection processing that inspects the inspection portion of the mounting board P2 in conjunction with the production of the mounting board P2 in the production line 1. The board data creation processing performed by the measurement processing unit 53 will be described with reference to the flowchart of FIG.

[0039] The measurement processing unit 53 converts, for example, board data for the mounting machine used in the mounting machine 13 into data for the inspection device, and causes the measurement unit 2 to acquire an overall image of the prototype board via the imaging processing unit 52 (step s1). The prototype board is a board prototyped by the mounting machine 13 before the production of the mounting board P2, and is a board on which components B are mounted in the same way as the mounting board P2. The measurement processing unit 53 sets information about the fiducial marks M of the board in the board data BD based on the overall image of the prototype board (step s2).

[0040] Next, the measurement processing unit 53 causes the measurement unit 2 to acquire shape data D1 including two-dimensional data D2 and three-dimensional data D3 for each field of view of the prototype board via the imaging processing unit 52 (step s3).The measurement processing unit 53 then sets inspection portion information BD1 in the board data BD based on the shape data D1 of the prototype board (step s4), and sets inspection item information BD11 and inspection technique information BD12 in the board data BD in association with the inspection portion information BD1 (step s5).

[0041] Next, the measurement processing unit 53 determines whether or not a through-hole portion A1 exists based on the prototype board shape data D1 (step s6), and if so, recognizes the shape and position of the through-hole portion A1 (step s7). The measurement processing unit 53 also determines whether or not a noise superimposition portion A2 including a silk portion A21 and a clamp portion A22 exists based on the prototype board shape data D1 (step s8), and if so, recognizes the shape and position of the noise superimposition portion A2 (step s9). The measurement processing unit 53 then performs a specific area setting process to set specific area information BD2, which is information about the specific area A including the through-hole portion A1 and the noise superimposition portion A2, in the board data BD (step s10).

[0042] (Specific Area Setting Process) The measurement processing unit 53 performs specific area setting process when creating the board data BD. In the specific area setting process, the measurement processing unit 53 extracts a specific area A based on the shape data D1 acquired by the measurement unit 2 using the printed circuit board P1 as the target, and sets information about the extracted specific area A as specific area information BD2 in the board data BD. That is, the measurement processing unit 53 sets information about the specific area A in the board data BD in advance when creating the board data BD, prior to the inspection process that generates and inspects three-dimensional information DA of the inspection portion of the mounted board P2. In this case, when the measurement processing unit 53 performs the inspection process to inspect the inspection portion of the mounted board P2, the process of setting information about the specific area A in the board data BD can be omitted. This simplifies the inspection process for the mounted board P2 by the measurement processing unit 53 and improves the takt time.

[0043] Alternatively, the measurement processing unit 53 may perform the specific area setting process during setup before production of the mounted board P2 on the production line 1. In this case, the measurement processing unit 53 can extract the specific area A based on the shape data D1 acquired by the measurement unit 2 using the printed board P1 as the target during setup for production on the production line 1, and set information about the extracted specific area A in the board data BD as specific area information BD2.

[0044] The measurement processing unit 53 may extract the specific area A based only on the three-dimensional data D3 acquired by the measurement unit 2, and set information about the extracted specific area A in the substrate data BD as specific area information BD2. The specific area setting process by the measurement processing unit 53 in this case will be described with reference to the flowchart of FIG.

[0045] The measurement processing unit 53 causes the measurement unit 2 to acquire three-dimensional data D3 of the printed circuit board P1 via the imaging processing unit 52 (step a1). The measurement processing unit 53 then determines whether the data value H of the three-dimensional data D3 is less than a lower limit value Thlo of a predetermined determination range (step a2). The predetermined determination range indicates the range of the three-dimensional data D3 in which the three-dimensional information DA generated based on the three-dimensional data D3 is the ideal "0 (zero)," and is indicated by the range from the lower limit value Thlo to the upper limit value Thhi. The measurement processing unit 53 extracts a region of the printed circuit board P1 in which the data value H of the three-dimensional data D3 is less than the lower limit value Thlo of the determination range as a specific region A corresponding to the through-hole portion A1, and sets information about the extracted through-hole portion A1 in the board data BD (step a3).

[0046] Next, the measurement processing unit 53 determines whether the data value H of the three-dimensional data D3 exceeds the upper limit value Thhi of a predetermined determination range (step a4). The measurement processing unit 53 extracts an area on the printed circuit board P1 where the data value H of the three-dimensional data D3 exceeds the upper limit value Thhi of the determination range as a specific area A corresponding to the noise superimposition area A2, and sets information about the extracted noise superimposition area A2 in the board data BD (step a5).

[0047] As described above, the measurement processing unit 53 can appropriately extract an area on the printed circuit board P1 where the data value H of the three-dimensional data D3 is outside a predetermined judgment range as a specific area A, and set information about the extracted specific area A in the board data BD.

[0048] Furthermore, the measurement processing unit 53 may extract a specific area A based on both the two-dimensional data D2 and the three-dimensional data D3 acquired by the measurement unit 2, and set information about the extracted specific area A as specific area information BD2 in the substrate data BD. The specific area setting process by the measurement processing unit 53 in this case will be described with reference to the flowchart of FIG.

[0049] The measurement processing section 53 causes the measurement unit 2 to acquire two-dimensional data D2 and three-dimensional data D3 of the printed circuit board P1 via the image capturing processing section 52 (step b1).

[0050] The measurement processing unit 53 performs a binarization process to binarize the brightness values ​​of the pixels that make up the two-dimensional image represented by the two-dimensional data D2, thereby distinguishing the two-dimensional image into high-brightness areas and the remaining areas (step b2). The measurement processing unit 53 acquires contour data of the high-brightness areas in the two-dimensional image (step b3) and extracts high-brightness areas whose contour shapes satisfy predetermined shape conditions (step b4). For example, the measurement processing unit 53 extracts high-brightness areas whose contour shapes satisfy predetermined circularity conditions.

[0051] Next, the measurement processing unit 53 recognizes the three-dimensional data D3 corresponding to the extracted high-brightness portion (step b5) and determines whether the data value H of the three-dimensional data D3 is less than the lower limit Thlo of a predetermined judgment range (step b6). The measurement processing unit 53 extracts an area on the printed circuit board P1 where the data value H of the three-dimensional data D3 is less than the lower limit Thlo of the judgment range as a specific area A corresponding to the through-hole portion A1, and sets information about the extracted through-hole portion A1 in the board data BD (step b7). The measurement processing unit 53 also determines whether the data value H of the three-dimensional data D3 exceeds the upper limit Thhi of the predetermined judgment range (step b8). The measurement processing unit 53 extracts an area on the printed circuit board P1 where the data value H of the three-dimensional data D3 exceeds the upper limit Thhi of the judgment range as a specific area A corresponding to the noise superimposition portion A2, and sets information about the extracted noise superimposition portion A2 in the board data BD (step b9).

[0052] As described above, the measurement processing unit 53 can appropriately extract as a specific area A an area on the printed circuit board P1 where the contour shape based on the two-dimensional data D2 satisfies predetermined shape conditions and the data value H of the three-dimensional data D3 is outside a predetermined judgment range, and set the information of the extracted specific area A in the board data BD.

[0053] Furthermore, when the measurement processing unit 53 sets information about the specific region A as the specific region information BD2 in the substrate data BD, and extracts the specific region A based on the three-dimensional data D3 acquired by the measurement unit 2, the measurement processing unit 53 may extract the specific region A using a trained model that has learned examples of the three-dimensional data D3 in the specific region A. The measurement processing unit 53 can appropriately extract the specific region A using the trained model.

[0054] The measurement processing unit 53 is capable of performing a process for creating a trained model. The measurement processing unit 53 learns examples of three-dimensional data D3 in the specific area A through machine learning using a neural network. The measurement processing unit 53 then uses the three-dimensional data D3 as input data and generates a trained model that outputs information about the specific area A. This trained model creation process will be described with reference to the flowchart of FIG. 9 .

[0055] The measurement processing unit 53 causes the measurement unit 2 to acquire two-dimensional data D2 and three-dimensional data D3 of the universal board via the imaging processing unit 52 (step c1). The universal board is a sample board for creating a trained model, and is a board having a plurality of through-holes formed therein similar to the printed board P1 and the mounting board P2.

[0056] The measurement processing unit 53 performs a binarization process to binarize the brightness values ​​of pixels constituting the two-dimensional image represented by the two-dimensional data D2 of the universal board, thereby distinguishing the two-dimensional image into high-brightness areas and the remaining areas (step c2). The measurement processing unit 53 acquires contour data of the high-brightness areas in the two-dimensional image of the universal board (step c3) and extracts high-brightness areas whose contour shapes satisfy predetermined shape conditions (step c4). The measurement processing unit 53 then recognizes three-dimensional data D3 corresponding to the extracted high-brightness areas (step c5). This allows the measurement processing unit 53 to create a trained model that has learned an example of the three-dimensional data D3 for the through-hole portion A1 as the specific area A (step c6). The trained model created in this way uses the three-dimensional data D3 as input data and outputs information about the specific area A.

[0057] Furthermore, the measurement processing unit 53 may extract a specific area A based on the design data CAD of the mounting board P2, and set information about the extracted specific area A in the board data BD. The design data CAD is stored in, for example, the storage unit 54. When multiple specific areas A are extracted based on the design data CAD, the measurement processing unit 53 sets information about all or part of the multiple specific areas A in the board data BD. The specific area setting process by the measurement processing unit 53 in this case will be described with reference to the flowchart in FIG.

[0058] The measurement processing unit 53 acquires design data CAD for the mounting board P2 from the storage unit 54 (step d1). The measurement processing unit 53 recognizes the position and shape of the through-hole portion A1 based on the design data CAD (step d2), and sets the recognized information for the through-hole portion A1 in the board data BD as information for the specific area A (step d3). The measurement processing unit 53 also recognizes the position and shape of the noise superimposition portion A2 based on the design data CAD (step d4), and sets the recognized information for the noise superimposition portion A2 in the board data BD as information for the specific area A (step d5).

[0059] As described above, the measurement processing unit 53 sets the information of the specific area A in the board data BD based on the design data CAD of the mounting board P2. In this case, when the measurement processing unit 53 performs the process of setting the information of the specific area A in the board data BD, it is possible to omit the operation of acquiring the shape data D1 by the measurement unit 2. This simplifies the process of setting the information of the specific area A by the measurement processing unit 53 and improves the takt time.

[0060] Furthermore, the measurement processing unit 53 may extract a specific area A based on the shape data D1 acquired by the measurement unit 2 using the mounting board P2 as the object during production of the mounting board P2 on the production line 1, and set information about the extracted specific area A in the board data BD. According to this aspect, the measurement processing unit 53 can perform an inspection process that generates three-dimensional information DA of an inspection portion of the mounting board P2 and inspects it, while performing a process of setting information about the specific area A in the board data BD based on the shape data D1 of the mounting board P2 acquired by the measurement unit 2, so as to be linked to the production of the mounting board P2 on the production line 1. The inspection process by the measurement processing unit 53 in this case will be described with reference to the flowcharts of FIGS.

[0061] In the inspection process, the measurement processing unit 53 causes the measurement unit 2 to acquire shape data D1 including two-dimensional data D2 and three-dimensional data D3 of the mounting substrate P2 via the imaging processing unit 52 (step e1). The measurement processing unit 53 analyzes the state of noise superposition in the shape data D1 of the mounting substrate P2 (step e2).

[0062] The measurement processing unit 53 determines whether data corresponding to the noise superimposed portion A2 is present in the shape data D1 of the mounting board P2 (step e3). If data corresponding to the noise superimposed portion A2 is present, the measurement processing unit 53 sets the information of the noise superimposed portion A2 as information of the specific region A in the board data BD (step e4) and performs a correction process to correct the data corresponding to the noise superimposed portion A2 to, for example, an ideal "0 (zero)" (step e5). The measurement processing unit 53 also determines whether data corresponding to the through-hole portion A1 is present in the shape data D1 of the mounting board P2 (step e6). If data corresponding to the through-hole portion A1 is present, the measurement processing unit 53 sets the information of the through-hole portion A1 as information of the specific region A in the board data BD (step e7) and performs a mask process to exclude the data corresponding to the through-hole portion A1 (step e8).

[0063] Next, the measurement processing unit 53 determines whether a new noise-superimposed portion not included in the board data BD exists based on the shape data D1 of the mounting board P2 (step e9). If a new noise-superimposed portion exists, the measurement processing unit 53 performs a new specific area setting process to set information about the new noise-superimposed portion in the board data BD (step e10). After the new specific area setting process, the measurement processing unit 53 generates three-dimensional information DA of the inspection portion on the mounting board P2 based on three-dimensional data D3 in which data corresponding to the through-hole portion A1 where noise is expected to be superimposed has been excluded and data corresponding to the noise-superimposed portion A2 has been corrected. The measurement processing unit 53 then inspects whether the condition of the inspection portion on the mounting board P2 is normal based on the generated three-dimensional information DA (step e11). In this case, the measurement processing unit 53 can generate accurate three-dimensional information DA about the inspection portion, thereby enabling accurate inspection of the inspection portion.

[0064] The measurement processing unit 53 performs the following process for the new specific area setting process. That is, if a new noise superimposition portion is present on the mounting board P2, the measurement processing unit 53 temporarily suspends the inspection process (step f1) and displays an image of the new noise superimposition portion on the display unit 55 (step f2). Then, the measurement processing unit 53 outputs request information requesting the operator to determine whether or not a new noise superimposition portion needs to be set for the board data BD (step f3).

[0065] In response to the request information, the measurement processing unit 53 determines whether a command to set a new noise superimposition portion has been input to the operation unit 56 (step f4). If a setting command has been input to the operation unit 56, the measurement processing unit 53 causes the display unit 55 to display a setting screen for setting information about the new noise superimposition portion in the board data BD (step f5). In response to an input operation on the setting screen, the measurement processing unit 53 sets the information about the new noise superimposition portion in the board data BD as information about a new specified area (step f6). Then, the measurement processing unit 53 performs correction processing or masking processing on data corresponding to the new noise superimposition portion in the shape data D1 of the mounting board P2 (step f7) and resumes the inspection processing (step f8).

[0066] [Other Embodiments] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, the following modified embodiments may be adopted.

[0067] The mounting substrate P2 includes a double-sided mounting substrate having components mounted on both the first and second surfaces in the thickness direction. In this case, the inspection device 2M may be applied to an apparatus for inspecting double-sided mounting substrates. When inspecting the mounting state of components on the second surface of a double-sided mounting substrate after components have already been mounted on the first surface, noise may be superimposed on the shape data D1 related to the area on the second surface corresponding to the mounting position of the component on the first surface. Therefore, when inspecting a double-sided mounting substrate, the measurement processing unit 53 of the processing unit 5 simply sets information about the area on the second surface corresponding to the mounting position of the component on the first surface as information about the specific area A in the substrate data BD.

[0068] In this case, the measurement processing unit 53 references the information on the specific area A on the second surface set in the board data BD, and performs masking or correction processing on the data corresponding to the specific area A on the second surface in the shape data D1 of the double-sided mounted board acquired by the measurement unit 2. As a result, the measurement processing unit 53 can generate three-dimensional information DA of the inspection portion on the second surface of the double-sided mounted board based on three-dimensional data D3 from which data corresponding to the specific area A on the second surface where noise is expected to be superimposed has been removed or corrected during the inspection process. In this case, accurate three-dimensional information DA about the inspection portion can be generated, allowing the inspection portion to be inspected with high precision.

[0069] [Inventions Included in the Above-Described Embodiments] The above-described embodiments include the following inventions.

[0070] According to one aspect of the present invention, an inspection apparatus is provided in a production line that produces mounted boards having components mounted on printed circuit boards, and inspects the mounted boards. The inspection apparatus includes a measurement unit that acquires shape data of an object, and a processing unit that references board data that includes information about an inspection portion indicating an inspection target on the mounted board, and generates three-dimensional information of the inspection portion based on the shape data acquired by the measurement unit, using the mounted board as the object. The processing unit sets information about a specific region on the mounted board where noise is expected to be superimposed on the shape data in the board data, and when generating the three-dimensional information of the inspection portion, performs a masking process to exclude specific data corresponding to the specific region in the shape data, or performs a correction process to correct the specific data.

[0071] According to this inspection apparatus, when generating three-dimensional information of an inspection portion of a mounting board, the processing unit refers to information on a specific region set in the board data and performs masking or correction on specific data corresponding to the specific region in the shape data of the mounting board acquired by the measurement unit. This allows the processing unit to generate three-dimensional information of the inspection portion of the mounting board based on shape data from which data corresponding to the specific region where noise is expected to be superimposed has been removed or corrected. In this case, accurate three-dimensional information about the inspection portion can be generated, allowing the inspection portion to be inspected with high precision.

[0072] In the above-mentioned inspection device, the processing unit may set information on at least one area of ​​a through-hole portion formed in the mounting board and a noise superposition portion other than the through-hole portion where noise superposition is expected to occur in the board data as information on the specific area.

[0073] In this aspect, when generating three-dimensional information of the inspection portion of the mounting board, the processing unit performs masking or correction on specific data corresponding to through-hole portions and noise superimposed portions set as specific regions in the board data in the shape data of the mounting board acquired by the measurement unit, thereby enabling the processing unit to generate three-dimensional information of the inspection portion of the mounting board based on shape data from which data corresponding to through-hole portions and noise superimposed portions where noise is expected to be superimposed has been removed or corrected.

[0074] In the above-mentioned inspection device, the processing unit is capable of performing a process to create the board data, and when creating the board data, the measurement unit may extract the specific area based on the shape data acquired using the printed circuit board as the object, and set information about the extracted specific area in the board data.

[0075] In this aspect, the processing unit, when creating the board data, sets information about the specific area in the board data based on the shape data of the printed circuit board acquired by the measurement unit. That is, the processing unit sets information about the specific area in advance when creating the board data, prior to the process of generating and inspecting three-dimensional information about the inspection portion of the mounted board. In this case, when the processing unit performs the process of inspecting the inspection portion of the mounted board, the process of setting information about the specific area in the board data can be omitted. This makes it possible to simplify the inspection process of the mounted board by the processing unit and improve the takt time.

[0076] In the above-mentioned inspection device, the processing unit is capable of performing a process for creating the board data, and when creating the board data, the processing unit may extract the specific area based on design data of the mounting board, and set information about the extracted specific area in the board data.

[0077] In the above inspection apparatus, when a plurality of the specific regions are extracted, the processing unit may set information on all or part of the plurality of specific regions in the substrate data.

[0078] In this aspect, when creating the board data, the processing unit sets the information about the specific area in the board data based on the design data of the mounting board. In this case, when the processing unit performs the process of setting the information about the specific area in the board data, the work of acquiring shape data by the measurement unit can be omitted. This simplifies the process of setting the information about the specific area by the processing unit and improves the takt time.

[0079] In the above-described inspection device, the processing unit may extract the specific area based on the shape data acquired by the measurement unit using the mounting board as the target object during production of the mounting board on the production line, and set information about the extracted specific area in the board data.

[0080] In this aspect, the processing unit can perform processing to set information about a specific area in the board data based on the shape data of the mounting board acquired by the measurement unit, in conjunction with the production of mounting boards on the production line, while also performing processing to generate three-dimensional information about the inspection area of ​​the mounting board and perform inspection.

[0081] In the above-mentioned inspection device, the processing unit may extract the specific area based on the shape data acquired by the measurement unit using the printed circuit board as the target object during production setup on the production line, and set information about the extracted specific area in the board data.

[0082] In this aspect, the processing unit can perform processing to set information about the specific area in the board data based on the shape data of the printed circuit board acquired by the measurement unit when setting up production on the production line.

[0083] In the above-mentioned inspection device, the measurement unit is capable of acquiring two-dimensional data and three-dimensional data of the object as the shape data, and the processing unit may extract the specific area of ​​the mounting board based on the three-dimensional data acquired by the measurement unit or both the two-dimensional data and the three-dimensional data, and set information about the extracted specific area in the board data.

[0084] In this aspect, the processing unit can perform processing to set information about a specific area in the substrate data based on three-dimensional data acquired by the measurement unit, or both two-dimensional data and three-dimensional data.

[0085] In the above inspection apparatus, the processing unit may extract, as the specific area, an area on the mounting board where the data value of the three-dimensional data is outside a predetermined determination range.

[0086] In addition, in the above-mentioned inspection device, the processing unit may extract, as the specific area, an area on the mounting board where the contour shape based on the two-dimensional data satisfies a predetermined shape condition and where the data value of the three-dimensional data is outside a predetermined judgment range.

[0087] In this aspect, the processing unit can appropriately extract the specific region based on the three-dimensional data acquired by the measurement unit, or on both the two-dimensional data and the three-dimensional data.

[0088] In the above-described inspection device, the processing unit may extract the specific region of the mounting board using a trained model that has been trained on examples of the three-dimensional data in the specific region.

[0089] In this manner, the processing unit can appropriately extract specific regions using the trained model.

[0090] In the above inspection device, the mounting board includes a double-sided mounting board on which components are mounted on both a first surface and a second surface in the thickness direction.

[0091] In this aspect, the inspection device can be used as an apparatus for inspecting double-sided mounted boards. For example, when inspecting the mounting state of components on the second side of a double-sided mounted board after components have already been mounted on the first side, noise may be superimposed on the shape data related to the area on the second side corresponding to the mounting position of the components on the first side. Therefore, when inspecting a double-sided mounted board, the processing unit may set information about the area on the second side corresponding to the mounting position of the components on the first side as information about the specific area in the board data.

[0092] As described above, according to the present invention, it is possible to provide an inspection device that can inspect an inspection portion of a mounting board with high precision.

Claims

1. An inspection device that is installed in a production line that produces mounted boards having components mounted on printed circuit boards, and that inspects the mounted boards, comprising: a measurement unit that acquires shape data of an object; and a processing unit that references board data in which information of an inspection area indicating an inspection target on the mounted board is set, and generates three-dimensional information of the inspection area based on the shape data acquired by the measurement unit with the mounted board as the object, wherein the processing unit sets, in the board data, information on a specific area on the mounted board where noise is expected to be superimposed on the shape data, and when generating the three-dimensional information of the inspection area, performs a masking process to exclude specific data in the shape data that corresponds to the specific area, or performs a correction process to correct the specific data.

2. An inspection device according to claim 1, wherein the processing unit sets information on at least one area of a through-hole portion formed on the mounting board and a noise superimposition area other than the through-hole portion where noise is expected to be superimposed in the board data as information on the specific area.

3. An inspection device according to claim 1, wherein the processing unit is capable of performing processing to create the board data, and when creating the board data, the measurement unit extracts the specific area based on the shape data acquired using the printed circuit board as the object, and sets information about the extracted specific area in the board data.

4. An inspection device according to claim 1, wherein the processing unit is capable of performing processing to create the board data, and when creating the board data, extracts the specific area based on design data of the mounting board, and sets information about the extracted specific area in the board data.

5. An inspection device according to claim 4, wherein, when a plurality of the specific regions are extracted, the processing unit sets information on all or part of the plurality of specific regions in the substrate data.

6. An inspection device according to claim 1, wherein the processing unit extracts the specific area based on the shape data acquired by the measurement unit using the mounting board as the target object during production of the mounting board on the production line, and sets information about the extracted specific area in the board data.

7. An inspection device according to claim 1, wherein the processing unit extracts the specific area based on the shape data acquired by the measurement unit using the printed circuit board as the target object during production setup on the production line, and sets information about the extracted specific area in the board data.

8. An inspection device according to claim 1, wherein the measurement unit is capable of acquiring two-dimensional data and three-dimensional data of the object as the shape data, and the processing unit extracts the specific area of the mounting board based on the three-dimensional data acquired by the measurement unit or both the two-dimensional data and the three-dimensional data, and sets information about the extracted specific area in the board data.

9. An inspection device according to claim 8, wherein the processing unit extracts, as the specific area, an area on the mounting board where the data value of the three-dimensional data is outside a predetermined judgment range.

10. An inspection device according to claim 8, wherein the processing unit extracts as the specific area an area on the mounting board where the contour shape based on the two-dimensional data satisfies predetermined shape conditions and where the data value of the three-dimensional data is outside a predetermined judgment range.

11. An inspection device according to claim 8, wherein the processing unit extracts the specific area of the mounting board using a trained model that has been trained on examples of the three-dimensional data in the specific area.

12. An inspection device according to claim 1, wherein the mounting board includes a double-sided mounting board having components mounted on both a first surface and a second surface in the thickness direction.

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