Resin supply apparatus, apparatus for manufacturing resin molded article, method for manufacturing resin molded article, and resin supply method

Abstract

Provided is a resin supply apparatus capable of supplying a resin material on a application surface as uniformly as possible in a short supply time. In this resin supply apparatus, a resin material (13) in a storage part is pushed out from a discharge part (12a), and the resin material (13) lands at a discharge start point (A1) in an application surface (60s). A control unit (70) is configured to control, after the resin material (13) has landed at the discharge start point (A1), a movement mechanism (20) in a first mode in which the discharge part (12a) moves relative to the application surface (60s) at a first speed (V1), and a second mode in which the discharge part (12a) moves relative to the application surface (60s) at a second speed (V2) faster than the first speed (V1). The control unit (70) switches from the first mode to the second mode at a point in time when the linear distance between a predetermined reference position (A0) and the discharge part (12a) exceeds a predetermined value (L1), or at a point in time after a predetermined time has elapsed since the point in time when a pressing part (32) started moving in order to push out the resin material (13) from the discharge part (12a).

Description

Resin supplying device, resin molded product manufacturing device, resin molded product manufacturing method, and resin supplying method

[0001] The present specification relates to a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method.

[0002] As disclosed in Japanese Patent Laid-Open Publication No. 2018-134846 (Patent Document 1), a resin supplying device that supplies a resin material to a supply target is known. Patent Document 1 states that if air is contained in the resin material supplied to the supply target, the presence of air can cause voids to occur. Patent Document 1 also states that by increasing the movement speed of the discharge unit (nozzle), the amount of resin material supplied at that position can be reduced compared to other positions, which in turn makes it easier to discharge air from the resin material during the compression process.

[0003] Japanese Patent Application Laid-Open No. 2018-134846

[0004] When resin material is to be widely applied onto the surface of an object to be sprayed, a discharge unit (nozzle) is positioned above the surface and moved relative to the surface. By continuously discharging the resin material from the discharge unit while scanning the surface, the resin material can be widely applied onto the surface. Here, we focus on the situation immediately after the resin material is discharged from the discharge unit.

[0005] 9 shows the state immediately after resin material 73 contained in storage section 71 is discharged from discharge section 72a onto spray surface 75 and discharge section 72a begins to move. After resin material 73 is discharged from discharge section 72a, it advances downward, drooping from discharge section 72a, and then lands on spray surface 75 of the object to be supplied. Resin material 73 is continuously discharged from discharge section 72a. In this state, discharge section 72a begins to move (arrow AR). Starting from the position on spray surface 75 where resin material 73 lands, resin material 73 begins to trace a predetermined trajectory on spray surface 75.

[0006] Immediately after the resin material 73 lands on the spraying surface 75 of the object to be supplied, the resin material 73 is not sufficiently fixed to the spraying surface 75. If the movement of the discharge part 72a is started in this state, the resin material 73 will be dragged along with the movement of the discharge part 72a, and there is a possibility that the resin material 73 will shift from the position on the spraying surface 75 where it first landed. In this case, it becomes difficult to supply the resin material 73 uniformly onto the spraying surface 75.

[0007] This phenomenon is more likely to occur when a liquid resin material with high viscosity is dispensed from a dispensing unit with a narrow nozzle diameter. As shown in Figure 10, when a resin material 73 with high viscosity lands on a spraying surface 75, the contact angle θ becomes large. When the contact angle θ is large, the contact area AA between the resin material 73 and the spraying surface 75 becomes relatively small. The adhesive force between the resin material 73 and the spraying surface 75 also becomes weaker, so as the dispensing unit moves, the resin material 73 is more likely to move away from the position on the spraying surface 75 where it first landed.

[0008] One possible solution to prevent the resin material 73 from shifting is to reduce the movement speed of the discharge section 72a, but if the discharge section 72a moves at a slow speed while supplying the resin material 73, it may take time to supply the resin material 73 over a wide area of ​​the spraying surface 75, or there may be insufficient resin material 73 (in the cartridge set in the storage section 71) before the resin material 73 is supplied to the entire specified area, which may result in the resin material 73 not being able to be supplied evenly over the spraying surface 75.

[0009] The present specification aims to disclose a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method that are capable of supplying resin material as uniformly as possible onto a spraying surface in as short a supply time as possible.

[0010] The resin supplying device disclosed herein is a resin supplying device that supplies a resin material onto a spraying surface of an object to be supplied, and comprises: a storage section that stores the resin material and has a discharge section that discharges the resin material; a pressing mechanism that has a pressing section inserted into the storage section; a moving mechanism that scans the discharge section over the spraying surface by moving the discharge section relative to the spraying surface; and a control section that controls the moving mechanism, wherein the resin material in the storage section is pushed out from the discharge section as the pressing section moves within the storage section, and the resin material lands at a discharge start point within the spraying surface, and the control section is configured to control the moving mechanism in a first mode in which the discharge section moves relative to the spraying surface at a first speed after the resin material lands at the discharge start point, and a second mode in which the discharge section moves relative to the spraying surface at a second speed faster than the first speed, and the control section is configured to: When a predetermined time has elapsed since the pressing portion started to move in order to extrude the resin material from the discharge portion, the first mode is switched to the second mode.

[0011] The present disclosure relates to a resin molding manufacturing apparatus that includes the resin supply device described above. The present disclosure also relates to a resin molding manufacturing method that uses the resin molding manufacturing apparatus described above, and includes a step of supplying the resin material to a supply target by the resin supply device, and a step of resin molding the supply target using the resin material.

[0012] The resin supply method disclosed herein is a resin supply method for supplying resin material onto a spraying surface of an object to be supplied, comprising: a pressing portion moving within a storage portion, causing the resin material extruded from the discharge portion to land at a spraying start point within the spraying surface; a first mode being implemented in which the discharge portion moves relative to the spraying surface at a first speed to supply the resin material to the spraying surface after the resin material has landed at the spraying start point; and a second mode being implemented in which the discharge portion moves relative to the spraying surface at a second speed faster than the first speed to supply the resin material to the spraying surface; and the first mode being switched to the second mode when the straight-line distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or when a predetermined time has elapsed since the pressing portion started to move to extrude the resin material from the discharge portion.

[0013] According to the technical concept disclosed in this specification, it is possible to obtain a resin supplying device, a resin molded product manufacturing device, a resin molded product manufacturing method, and a resin supplying method that are capable of supplying resin material as uniformly as possible onto a spraying surface in as short a supplying time as possible.

[0014] 1 is a diagram showing functional blocks of an apparatus 1000 for manufacturing a resin molded product. FIG. 2 is a cross-sectional view showing a state before mold clamping of a molding unit 80 provided in the apparatus 1000 for manufacturing a resin molded product. FIG. 3 is a cross-sectional view showing a state after mold clamping of a molding unit 80 provided in the apparatus 1000 for manufacturing a resin molded product. FIG. 4 is a flowchart of a method for manufacturing a resin molded product using the apparatus 1000 for manufacturing a resin molded product. FIG. 5 is a cross-sectional view showing a resin supplying apparatus 100 provided in the apparatus 1000 for manufacturing a resin molded product. FIG. 6 is a perspective view showing a state in which resin material 13 is being supplied from a discharge unit 12a of the resin supplying apparatus 100 onto a spraying surface 60s. FIG. 7 is a plan view showing an aspect of resin material 13 formed when the discharge unit 12a is operated along a spiral trajectory on the spraying surface 60s. FIG. 8 is a flowchart of a resin supplying method using the resin supplying apparatus 100. FIG. 9 is a diagram showing a state immediately after resin material 73 stored in a storage unit 71 is discharged from the discharge unit 72a onto a spraying surface 75 and the discharge unit 72a starts moving. 10 is a diagram for explaining that the contact angle θ becomes large when a resin material 73 having a high viscosity lands on a spray surface 75. FIG.

[0015] The following describes embodiments of the present disclosure. In the embodiments described below, when numbers, quantities, etc. are mentioned, the scope of the present disclosure is not necessarily limited to those numbers, quantities, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numbers are used for the same and corresponding components, and redundant descriptions may not be repeated.

[0016] [Apparatus 1000 for manufacturing resin molded products] Fig. 1 is a diagram showing functional blocks of apparatus 1000 for manufacturing resin molded products. Fig. 2 is a cross-sectional view showing a state before mold clamping of molding unit 80 provided in apparatus 1000 for manufacturing resin molded products. Fig. 3 is a cross-sectional view showing a state after mold clamping of molding unit 80 provided in apparatus 1000 for manufacturing resin molded products.

[0017] As shown in Fig. 1, the resin molded product manufacturing apparatus 1000 includes a substrate module 101, a press module 102, a discharge module 103, and a film module 104. The substrate 90 (Fig. 2) is discharged from the substrate module 101, and the film 60 (Fig. 2) is discharged from the film module 104. The discharge module 103 supplies a thermosetting resin material 13 onto the film 60. The press module 102 resin-forms the substrate 90 using the liquid resin material 13 supplied onto the film 60 (Fig. 3).

[0018] In the resin molded product manufacturing apparatus 1000, the substrate module 101, press module 102, discharge module 103, and film module 104 are illustrated as separate modules. Each module may be detachable from the other modules, and the number of modules may be increased or decreased. For example, two or three discharge modules 103 may be disposed between the press module 102 and the film module 104.

[0019] The resin molded product manufacturing apparatus 1000 further includes transfer mechanisms 91 and 92. The transfer mechanism 91 transfers the substrate 90 removed from the substrate module 101 to an upper mold 81 (FIG. 2) of a molding die in a molding section 80 (FIG. 2) of the press module 102. The molding die includes an upper mold 81 and a lower mold 87, and uses the resin material 13 supplied to the film 60 (supply object) to perform resin molding on a silicon wafer (substrate 90) on which a chip is mounted. In other words, the molding object is, for example, a so-called thin wafer-level package.

[0020] The conveying mechanism 92 conveys the film 60 onto which the resin material 13 has been discharged by the discharge module 103 to the lower mold 87 ( FIG. 2 ) of the molding mold in the molding section 80 of the press module 102. The conveying mechanism 92 further conveys the film 60 that has been discharged from the film module 104 and does not have the resin material 13 thereon to the discharge module 103.

[0021] [Method for manufacturing resin molded product] Fig. 4 is a diagram showing a flowchart of a method for manufacturing a resin molded product using the apparatus 1000 for manufacturing a resin molded product. Fig. 5 is a cross-sectional view showing the resin supplying apparatus 100 provided in the apparatus 1000 for manufacturing a resin molded product. The method for manufacturing a resin molded product will be described here, and the detailed configuration and operation of the resin supplying apparatus 100 will be described later.

[0022] 1 to 5, in the method for manufacturing a resin molded product, first, resin supplying device 100 (FIG. 5) supplies resin material 13 onto film 60 (step S101). For example, conveying mechanism 92 conveys film 60 and frame-shaped tray cover 54 (FIG. 5) placed on film 60 from film module 104 to discharge module 103.

[0023] Next, the resin supply device 100 of the discharge module 103 supplies the resin material 13 onto the film 60 in the tray cover 54. Details of this operation will be described later. Next, the transport mechanism 91 transports the substrate 90 from the substrate module 101 to the press module 102, and places it on the underside of the upper mold 81 of the molding die of the press module 102 (step S102).

[0024] The transport mechanism 91 places the film 60, on which the resin material 13 has been supplied, on the upper surface of the lower mold 87 (step S103). The transport mechanism 92 transports the film 60, on which the resin material 13 has been supplied, from the discharge module 103 together with the tray cover 54 to the press module 102, and places the film 60 on which the resin material 13 is placed on the upper surface of the lower mold 87 of the forming mold of the press module 102. The transport mechanism 92 transports the tray cover 54 to the film module 104 without placing the tray cover 54 in the press module 102.

[0025] 2, in the forming section 80, a block-shaped stationary platen 88 is supported by tie bars or a hold frame. An upper mold 81 is installed below the stationary platen 88. A movable platen 86 is arranged below the stationary platen 88. A lower mold 87 is installed above the movable platen 86.

[0026] The lower mold 87 includes a bottom member 82, a side member 83, a plurality of elastic members 84, and a base plate 85. A recess that is recessed downward is formed in the lower mold 87. The transport mechanism 92 places the film 60 on the upper surface of the lower mold 87 so that the resin material 13 on the film 60 is located on the bottom surface of the recess. The transport mechanism 91 places the substrate 90 on the lower surface of the upper mold 81, as shown in FIG. 2 .

[0027] The upper mold 81 and the lower mold 87 are clamped together by moving the lower mold 87 upward toward the upper mold 81 (step S104). For example, a clamping mechanism (not shown) moves the movable platen 86 upward. This causes the lower mold 87 to move upward toward the upper mold 81. As the movable platen 86 moves upward, the frame-shaped side member 83 first comes into contact with the substrate 90 via the film 60.

[0028] Thereafter, the upward movement of the movable platen 86 continues. With the upward movement of the side members 83 stopped, the bottom member 82 moves upward, and the multiple elastic members 84 contract. When the position of the upper surface of the side members 83 reaches a predetermined position, the upward movement of the movable platen 86 stops, and the mold clamping in step S104 ends.

[0029] After the movement of the lower mold 87 is stopped to close the mold, the temperature of the molding mold is increased (step S105). The resin material 13 is thermosetting. Therefore, when the temperature of the resin material 13 increases, the resin material 13 hardens to become hardened resin 18 ( FIG. 3 ) (step S106). After waiting until the resin material 13 hardens, the base plate 85 is moved downward, thereby moving the lower mold 87 downward. This opens the mold, and a resin molded product is produced in which the underside of the substrate 90 is sealed with resin (step S107).

[0030] In the above, for example, as shown in Figures 2 and 3, a case has been described in which the discharge module 103 of the resin molded product manufacturing apparatus 1000 shown in Figure 1, which is equipped with a press module 102 that places a substrate 90 on an upper mold 81 to manufacture a resin molded product, is equipped with the resin supply device 100 of the above embodiment. However, for example, the discharge module 103 of the resin molded product manufacturing apparatus 1000 shown in Figure 1, which is equipped with a press module 102 that places a substrate 90 on a lower mold 87 to manufacture a resin molded product, may also be equipped with the resin supply device 100 of the above embodiment.

[0031] 5 , the resin supplying device 100 supplies liquid resin material 13 onto a spray surface 60s of a supplying object such as a film 60. Specifically, the resin supplying device 100 includes, for example, a cartridge 10, a moving mechanism 20, a pressing mechanism 30, an opening / closing mechanism 40, a detecting unit 50, a mounting table 52, and a control unit 70.

[0032] (Cartridge 10) The cartridge 10 has a lid 11, a storage section 12, and a resin material 13. The storage section 12 stores the resin material 13, and the lid 11 is disposed on the surface of the resin material 13. The lid 11 seals the resin material 13 so that the resin material 13 does not leak out of the storage section 12. The storage section 12 of the cartridge 10 is disposed inside a cylindrical section 23 of a moving mechanism 20, which will be described later. A discharge section 12a is provided at the end of the storage section 12. The cartridge 10 discharges the resin material 13 through the discharge section 12a.

[0033] (Detection Unit 50) A mounting table 52 is disposed below the discharge unit 12a, and the film 60 transported from the film module 104 is placed on the mounting table 52. A frame-shaped tray cover 54 is disposed on the film 60. The upper surface of the film 60 is a spray surface 60s onto which the resin material 13 is supplied, and the resin material 13 is supplied to the inside of the tray cover 54 on the spray surface 60s. A detection unit 50 is connected to the mounting table 52, and detects the weight of the resin material 13 extruded from the discharge unit 12a and supplied onto the film 60.

[0034] (Moving mechanism 20) The moving mechanism 20 has a peripheral wall 21, locking members 22, and a cylindrical portion 23, and holds the cartridge 10. A plurality of locking members 22 are provided on the inner periphery of the peripheral wall 21, and the cylindrical portion 23 is locked to the plurality of locking members 22. The cartridge 10 is detachably installed inside the cylindrical portion 23.

[0035] The moving mechanism 20 is supported by a drive system (not shown) so that the position of the discharge unit 12a can be changed, and can move the discharge unit 12a, for example, in the left-right and up-down directions within the plane of Fig. 5, and in a direction perpendicular to the plane of Fig. 5. By moving the discharge unit 12a relative to the spray surface 60s of the film 60, the discharge unit 12a can scan over the spray surface 60s.

[0036] (Pressing mechanism 30) The pressing mechanism 30 has a servo motor 31 and a pressing unit 32. The pressing unit 32 is inserted inside the storage unit 12 of the cartridge 10 and is disposed so as to contact the lid body 11. When the pressing unit 32 moves, the pressing unit 32 presses the resin material 13 via the lid body 11, and the resin material 13 is extruded from the discharge unit 12 a of the cartridge 10.

[0037] (Opening / Closing Mechanism 40) The opening / closing mechanism 40 has a drive unit 41 and a pair of chucks 42, 43. The chucks 42, 43 are arranged to open and close the discharge unit 12a. The chucks 42, 43 are configured to be able to form an open state and a closed state, and are driven by the drive unit 41 to switch between these states.

[0038] Discharge unit 12a has a structure such as a tube made of a soft material through which resin material 13 can pass, and chucks 42, 43 press against the tube to switch from a state in which resin material 13 can pass through the tube (open state) to a state in which resin material 13 cannot pass through (closed state). Opening / closing mechanism 40 allows resin material 13 extruded from discharge unit 12a to reach film 60 when chucks 42, 43 are in the open state, and blocks resin material 13 extruded from discharge unit 12a from reaching film 60 when chucks 42, 43 are in the closed state.

[0039] The control unit 70 is connected to the moving mechanism 20, the pressing mechanism 30 (servo motor 31), the opening / closing mechanism 40 (drive unit 41), the detection unit 50, etc., and can control the operating state of these devices by sending instruction signals to them, and can also perform sensing, servo control, etc. by receiving signals from these devices.

[0040] 6 is a perspective view showing the state in which the resin material 13 is being supplied onto the spraying surface 60s from the discharge unit 12a of the resin supplying device 100. The moving mechanism 20, for example, causes the discharge unit 12a to scan along a spiral trajectory on the spraying surface 60s. FIG. 6 shows the state in which the discharge unit 12a scans from the center of the spiral toward the outside.

[0041] 7 is a plan view showing the state of the resin material 13 formed when the discharge portion 12a is operated along a spiral trajectory TR on the spraying surface 60s. The trajectory TR is formed to extend spirally around a center point A0 at a predetermined spiral pitch. As will be described in detail later, in the inner region of the spiral trajectory TR (the range from the discharge start point A1 to the mode switching point A2), the trajectory TR extends spirally with a spiral pitch P1. In the outer region of the spiral trajectory TR (the range from the mode switching point A2 to the supply end point A3), the trajectory TR extends spirally with a spiral pitch P2.

[0042] As described above, the resin material 13 in the storage unit 12 is pushed out from the discharge unit 12a by the pressing unit 32 (FIG. 5) moving within the storage unit 12. The resin material 13 lands at the discharge start point A1 (FIG. 7) within the spray surface 60s. In other words, the control unit 70 controls the moving mechanism 20, the pressing mechanism 30, and the like so that the resin material 13 discharged from the discharge unit 12a lands at the discharge start point A1.

[0043] Here, the control unit 70 is configured to control the moving mechanism 20 in a first mode in which the discharge portion 12a moves relative to the spraying surface 60s at a first speed V1 after the resin material 13 lands at the discharge starting point A1, and a second mode in which the discharge portion 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1.

[0044] 7, a spiral trajectory TR is formed by the resin material 13. The spiral trajectory TR starts from the discharge start point A1, and extends in a spiral shape to the mode switching point A2, and then to the supply end point A3. In other words, the control unit 70 controls the moving mechanism 20, the pressing mechanism 30, and the like so that the resin material 13 from the discharge unit 12a traces a spiral shape as shown in FIG. 7 from the discharge start point A1 to the mode switching point A2, and then traces a spiral shape as shown in FIG. 7 from the mode switching point A2 to the supply end point A3.

[0045] After the resin material 13 lands at the discharge start point A1, the control unit 70 drives the moving mechanism 20 in the first mode until the resin material 13 discharged from the discharge unit 12a moves from the discharge start point A1 to the mode switching point A2. In the first mode, the discharge unit 12a moves relative to the spraying surface 60s at a first velocity V1. The first velocity V1 is a value calculated, for example, as the velocity in the tangential direction of the spiral trajectory TR.

[0046] The control unit 70 further drives the moving mechanism 20 in the second mode from the mode switching point A2 until the resin material 13 discharged from the discharge unit 12a reaches the final supply point A3. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1. The second speed V2 is also a value calculated, for example, as the speed in the tangential direction of the spiral trajectory TR.

[0047] Here, the control unit 70 switches from the first mode to the second mode when the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined value L1 ( FIG. 7 ). The mode switching point A2 is set at such a location. The configuration is not limited to this, and the control unit 70 may switch from the first mode to the second mode when a predetermined time has elapsed since the pressing unit 32 started to move to extrude the resin material 13 from the discharge unit 12a.

[0048] EXAMPLES Various parameters applicable to the above-described embodiment are exemplified as follows: The diameter of the silicon wafer package to be molded is 290 mm, and the thickness is 0.05 mm.

[0049] The nozzle diameter of the discharge unit 12a is 4 mm. The amount of resin material 13 required to form the spiral trajectory TR is 6 g to 10 g. For example, a high-viscosity resin material (one whose linear expansion coefficient is similar to that of a silicon wafer) can be used as the liquid resin material 13. High viscosity refers to a viscosity exceeding 500 Pa·s (Pascal seconds). The weight of the resin material 13 discharged from the discharge unit 12a per unit time (discharge rate) is 0.1 g / sec. The discharge rate can be set to a constant value from the start to the end of discharge. The time required to form the spiral trajectory TR (resin amount / discharge rate) is 100 seconds.

[0050] The time (T0) from when the pressing unit 32 starts moving to extrude the resin material 13 from the discharge unit 12a to when the discharge unit 12a starts moving in the first mode (first speed V1) is 10 seconds. The execution time of the first mode, i.e., the time from when the discharge unit 12a starts moving in the first mode (first speed V1) to when it transitions to the second mode (second speed V2), is 57.5 seconds. The time from when the discharge unit 12a starts moving in the second mode (second speed V2) to when the discharge unit 12a reaches the final supply point A3 is 32.5 seconds.

[0051] The distance between the center point A0 of the spiral trajectory TR and the discharge start point A1 is 10 mm. The spiral trajectory TR may be, for example, an Archimedes spiral. The distance (predetermined value L1) between the center point A0 and the mode switching point A2 is 30 mm (equivalent to 60 mm in diameter). The distance L2 between the center point A0 and the supply end point A3 is 130 mm (equivalent to 260 mm in diameter).

[0052] Furthermore, the first speed V1 is 4.3 mm / sec, and the second speed V2 is 309.5 mm / sec. The helical pitch P1 is 10 mm, and the helical pitch P2 is 5 mm. That is, the helical pitch P1 when the control unit 70 controls the moving mechanism 20 in the first mode is larger than the helical pitch P2 when the control unit 70 controls the moving mechanism 20 in the second mode. The larger the helical pitch, the smaller the amount of resin supplied per unit area. The faster the movement speed of the discharge unit 12a, the smaller the amount of resin supplied per unit area.

[0053] For example, if the amount of resin is small, the length of resin that can be dispensed will be short. Furthermore, if the nozzle diameter of the discharging unit 12a is large, the length of resin that can be dispensed will be short. If the length of resin that can be dispensed is shorter than the spiral length, discharging will end midway through the spiral, making it difficult to supply resin outside the desired range. If the resin distribution becomes uneven between the center and outer parts of the resin supply area, the margins for package thickness and flatness will decrease, potentially resulting in wire sweep due to resin flow, poor appearance (flow marks), component segregation, and other product defects. Therefore, various parameters are optimized to ensure uniform spraying of the resin material 13 within the spraying surface 60s. For example, if the discharging unit 12a moves at high speed, it is recommended to narrow the spiral pitch.

[0054] (Resin Supplying Method) Fig. 8 is a flowchart of a resin supplying method using the resin supplying device 100. The resin supplying device 100 (Fig. 5) first reads setting values ​​from a reference table or the like that has been prepared in advance (step t101 in Fig. 8).

[0055] For example, the above-mentioned various parameters differ when using a resin material 13 having a first viscosity and when using a second viscosity higher than the first viscosity. Alternatively, the above-mentioned various parameters differ not only depending on the type of resin material 13 but also on the nozzle diameter of the discharge portion 12a, the distance between the discharge portion 12a and the spraying surface 60s, the area of ​​the spraying surface 60s, etc. These various parameters are optimized based on past resin supply implementation status and the like, and are stored as a lookup table.

[0056] For example, when a resin material 13 having a first viscosity is supplied onto the spraying surface 60s, the time from when the resin material 13 lands on the discharge start point A1 until the first mode is switched to the second mode is defined as the first time interval. When a resin material 13 having a second viscosity higher than the first viscosity is supplied onto the spraying surface 60s, the time from when the resin material 13 lands on the discharge start point A1 until the first mode is switched to the second mode is defined as the second time interval. In this case, various parameters can be set so that the second time interval is shorter than the first time interval. In the above example, the first time interval (the length of time during which the first mode is performed) is 57.5 seconds, and the second time interval (the length of time during which the second mode is performed) is 32.5 seconds.

[0057] After the necessary setting values ​​are read, the pressing unit 32 starts moving (step t102 in FIG. 8). As the movement of the pressing unit 32 increases, the resin material 13 is extruded from the discharge unit 12a. When the resin material 13 has not yet reached the spray surface 60s of the film 60, the value detected by the detection unit 50 (FIG. 5) does not change.

[0058] The fact that the resin material 13 has landed on the spray surface 60s (discharge start point A1) of the film 60 may be obtained, for example, from the detection result (increase in detected weight) of the detection unit 50 (step t103 in FIG. 8 ). Alternatively, the resin material 13 may be considered to have landed on the spray surface 60s of the film 60 when a predetermined time has elapsed since the pressing unit 32 started to move to extrude the resin material 13 from the discharge unit 12a. Alternatively, the resin material 13 may be detected to have landed on the spray surface 60s of the film 60 by optical means or the like.

[0059] Thereafter, the discharge unit 12a is driven to operate in the first mode, and starts moving at the first velocity V1 (step t104 in FIG. 8). Starting from the discharge start point A1, the resin material 13 starts to draw a spiral trajectory TR.

[0060] When the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined radius (predetermined value L1 shown in FIG. 7), the first mode is switched to the second mode (step t105 in FIG. 8). This switching can be performed based on a value output from, for example, an encoder. As a result, the discharge unit 12a is driven to operate in the second mode, and the discharge unit 12a starts moving at a second velocity V2 (step t106 in FIG. 8).

[0061] When the discharge unit 12a reaches the outermost periphery of the spiral trajectory TR (the final supply point A3) (YES in step t107 in FIG. 8 ), the movement of the pressing unit 32 is stopped (step t108). Even after the movement of the pressing unit 32 has stopped, the resin material 13 continues to drip from the discharge unit 12a, so a predetermined draining operation is performed (step t109). In the draining operation, the discharge unit 12a is displaced up or down to stop further dripping. If necessary, the weight is detected by the detection unit 50 or the like, and a correction operation for the weight deficiency is performed (step t110). This completes the resin supply. If necessary, the next resin supply is performed on another film 60.

[0062] (Actions and Effects) As explained at the beginning, immediately after the resin material 13 lands on the spraying surface 60s of the object to be supplied, the resin material 13 is not sufficiently fixed to the spraying surface 60s. If the movement of the discharge unit 12a begins in this state, the resin material 13 may be dragged along with the movement of the discharge unit 12a, and the resin material 13 may shift from the position on the spraying surface 60s where the resin material 13 first landed (the spraying start point A1). In this case, it becomes difficult to supply the resin material 13 uniformly onto the spraying surface 60s.

[0063] One possible solution to prevent the resin material 13 from shifting is to reduce the movement speed of the discharge section 12a, but if the discharge section 12a continues to supply the resin material 13 while moving at a slow speed, it may take time to supply the resin material 13 over a wide area of ​​the spraying surface 60s, or there may be insufficient resin material 13 (in the cartridge set in the storage section 12) before the resin material 13 is supplied to the entire specified area, which may result in the resin material 13 not being able to be supplied evenly over the spraying surface 60s.

[0064] In contrast, in the present embodiment, after the resin material 13 lands at the discharge start point A1, the control unit 70 drives the moving mechanism 20 in the first mode until the resin material 13 discharged from the discharge unit 12a moves from the discharge start point A1 to the mode switching point A2. In the first mode, the discharge unit 12a moves relative to the spraying surface 60s at a first speed V1.

[0065] The control unit 70 then switches from the first mode to the second mode when the linear distance between a predetermined reference position (here, the center point A0 of the spiral trajectory TR) and the discharge unit 12a exceeds a predetermined value L1 ( FIG. 7 ). The control unit 70 drives the movement mechanism 20 in the second mode until the resin material 13 discharged from the discharge unit 12a reaches the supply end point A3 from the mode switching point A2. In the second mode, the discharge unit 12a moves relative to the spraying surface 60s at a second speed V2 that is faster than the first speed V1.

[0066] That is, by moving the discharge unit 12a at a low speed immediately after dispensing, the resin material 13 is allowed to settle sufficiently on the spray surface 60s, and after settling, the discharge unit 12a is moved at a high speed. This makes it possible to supply the resin material 13 as uniformly as possible onto the spray surface 60s in as short a supply time as possible. In addition to the two modes, the first and second modes, the control unit 70 may be configured to control the movement mechanism 20 in a third mode in which the discharge unit 12a moves relative to the spray surface 60s at a third speed different from the second speed V2. Resin supply can also be performed in three or more modes.

[0067] Although the embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the scope of the claims, and it is intended to include all modifications within the meaning and scope of the claims.

[0068] 10 Cartridge, 11 Lid, 12, 71 Storage section, 12a, 72a Discharge section, 13, 73 Resin material, 18 Hardened resin, 20 Moving mechanism, 21 Peripheral wall, 22 Locking member, 23 Cylindrical section, 30 Pressing mechanism, 31 Servo motor, 32 Pressing section, 40 Opening and closing mechanism, 41 Drive section, 42, 43 Chuck, 50 Detection section, 52 Placement table, 54 Tray cover, 60 Film, 60s, 75 Spraying surface, 70 Control section, 80 Molding section, 81 Upper mold, 82 Bottom member, 83 Side member, 84 Elastic member, 85 Base plate, 86 Movable platen, 87 Lower mold, 88 Fixed platen, 90 Substrate, 91, 92 Conveying mechanism, 100 Resin supply device, 101 Substrate module, 102 Press module, 103 Discharge module, 104 Film module, 1000 Resin molded product manufacturing apparatus, A0 Center point, A1 Discharge start point, A2 Mode switching point, A3 Supply end point, AA Contact area, AR Arrow, L1 Predetermined value, L2 Distance, P1, P2 Helical pitch, TR Trajectory, V1 First speed, V2 Second speed.

Claims

1. A resin supplying device for supplying a resin material onto a spraying surface of an object to be supplied, comprising: a storage section for storing the resin material and having a discharge section for discharging the resin material; a pressing mechanism having a pressing section inserted into the storage section; a moving mechanism for moving the discharge section relative to the spraying surface, thereby causing the discharge section to scan the spraying surface; and a control section for controlling the moving mechanism, wherein as the pressing section moves within the storage section, the resin material within the storage section is pushed out from the discharge section, and the resin material lands at a discharge start point within the spraying surface, and the control section is configured to control the moving mechanism in a first mode in which, after the resin material lands at the discharge start point, the discharge section moves relative to the spraying surface at a first speed, and a second mode in which the discharge section moves relative to the spraying surface at a second speed faster than the first speed, and the control section is configured to: the resin supplying device switches from the first mode to the second mode when a predetermined time has elapsed since the pressing portion started to move to extrude the resin material from the discharge portion.

2. A resin supplying device as described in claim 1, wherein, when the resin material having a first viscosity is supplied onto the spraying surface, the time from when the resin material lands on the discharge start point until the first mode is switched to the second mode is defined as a first time interval, and when the resin material having a second viscosity higher than the first viscosity is supplied onto the spraying surface, the time from when the resin material lands on the discharge start point until the first mode is switched to the second mode is defined as a second time interval, and the second time interval is shorter than the first time interval.

3. The resin supplying device according to claim 1 or 2, wherein the movement mechanism causes the discharge part to scan along a spiral trajectory on the spraying surface.

4. The resin supply device described in claim 3, wherein the control unit switches from the first mode to the second mode when the linear distance between the predetermined reference position and the discharge unit exceeds a predetermined value, and the predetermined reference position is the center point of the spiral trajectory.

5. A resin supplying device as described in claim 3 or 4, wherein the spiral pitch when the control unit controls the movement mechanism in the first mode is larger than the spiral pitch when the control unit controls the movement mechanism in the second mode.

6. The resin supply device according to claim 5, wherein the control unit is configured to control the movement mechanism in a third mode in which the discharge unit moves relative to the spray surface at a third speed different from the second speed.

7. A resin molding manufacturing device comprising the resin supply device according to any one of claims 1 to 6.

8. The resin molded product manufacturing device according to claim 7, further comprising a molding die for molding resin onto a silicon wafer having a chip mounted thereon, using the resin material supplied to the supply object.

9. A method for manufacturing a resin molded product using the resin molded product manufacturing device according to claim 7 or 8, comprising: a step of supplying the resin material to an object to be supplied by the resin supply device; and a step of resin molding the object to be supplied using the resin material.

10. A resin supplying method for supplying resin material onto a spraying surface of an object to be supplied, comprising: a pressing portion moving within a storage portion, causing the resin material extruded from a discharge portion to land at a discharge start point within the spraying surface; a first mode being implemented in which, after the resin material has landed at the discharge start point, the discharge portion moves relative to the spraying surface at a first speed while supplying the resin material to the spraying surface; and a second mode being implemented in which the discharge portion moves relative to the spraying surface at a second speed faster than the first speed while supplying the resin material to the spraying surface; wherein the resin supplying method switches from the first mode to the second mode when the linear distance between a predetermined reference position and the discharge portion exceeds a predetermined value, or when a predetermined time has elapsed since the pressing portion started to move to extrude the resin material from the discharge portion.

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