Electronic component and component-embedded board comprising same

Abstract

[Problem] To ensure electrodes of suitable area in an electronic component with an embedded coil portion. [Solution] An electronic component 100 comprises: a coil portion 111 embedded in a magnetic element portion M, with terminal electrodes 121, 122 exposed on main surfaces 101, 102, respectively; and an interlayer dielectric 130 located between the coil portion 111 and the magnetic element portion M. A conductor layer L1 of the coil portion 111 includes terminal patterns 141, 142 exposed on the main surfaces 101, 102, respectively, and a coil pattern C11. A conductor layer L2 of the coil portion 111 includes terminal patterns 143, 144 exposed on the main surfaces 101, 102, respectively. The interlayer dielectric 130 includes an insulating portion 131 covering the conductor layer L1 from the X direction and an insulating portion 132 covering the conductor layer L2 from the XY plane direction. At least one of the thicknesses t2X, t2Y of the insulating portion 132 is greater than the thickness t1X of the insulating portion 131.

Description

Electronic component and component-embedded substrate equipped with the same

[0001] The present disclosure relates to an electronic component and a component-embedded substrate including the electronic component.

[0002] Patent Document 1 discloses a laminated coil array having a built-in coil conductor.

[0003] Japanese Patent Application Laid-Open No. 2006-032425

[0004] In the laminated coil array described in Patent Document 1, both ends of the coil conductor are connected to external electrodes provided on the surfaces of the magnetic layers. However, if external electrodes are not added, the area of ​​both ends of the coil conductor exposed on the surfaces of the magnetic layers is small, making it difficult to ensure a sufficient connection area when the array is embedded in a component-embedded substrate, for example.

[0005] This disclosure describes a technique for forming electrodes with an appropriate area in an electronic component that incorporates a coil portion.

[0006] An electronic component according to one aspect of the present disclosure includes a magnetic body portion having first and second main surfaces located opposite to each other in a first direction, a coil portion embedded in the magnetic body portion and having a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface, and an interlayer insulating film located between the coil portion and the magnetic body portion, wherein the coil portion includes first and second conductor layers stacked in a second direction perpendicular to the first direction, and the first conductor layer has an end face exposed on the first main surface and a first end constituting a first exposed portion of the first terminal electrode. the second conductor layer includes a third terminal pattern whose end face is exposed on the first main surface and which constitutes the second exposed portion of the first terminal electrode, and a fourth terminal pattern whose end face is exposed on the second main surface and which constitutes the second exposed portion of the second terminal electrode, and the first terminal pattern and the third terminal pattern are connected to the first the second terminal pattern and the fourth terminal pattern are connected to each other through the via conductor, and the interlayer insulating film includes a first insulating portion disposed between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions, and a second insulating portion covering the second conductor layer from at least the first and third directions, and a thickness in the first direction of a first portion of the second insulating portion covering the third terminal pattern from the first direction and a thickness in the second direction of a second portion covering the third terminal pattern from the third direction are At least one of the thickness in the third direction of the fourth portion of the second insulating portion that covers the fourth terminal pattern from the first direction and the thickness in the third direction of the fifth portion of the second insulating portion that covers the fourth terminal pattern from the first direction is thicker than the thickness in the third direction of the sixth portion of the first insulating portion that covers the second terminal pattern from the third direction.

[0007] According to the present disclosure, a technique for forming electrodes with an appropriate area in an electronic component that incorporates a coil portion is provided.

[0008] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to a first embodiment of the technology disclosed herein. FIG. 2 is a schematic cross-sectional view taken along line A-A in FIG. 1 . FIG. 3 is a schematic cross-sectional view taken along line B-B in FIG. 1 . FIGS. 4( a) and 4(b) are schematic plan views illustrating the structures of terminal electrodes 121 and 122, respectively. FIG. 5 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 incorporating an electronic component 100. FIG. 6 is a schematic cross-sectional view illustrating a first modified example of the coil portion 111. FIG. 7 is a schematic plan view illustrating the structure of the terminal electrode 121 in the first modified example. FIG. 8 is a schematic cross-sectional view illustrating a second modified example of the coil portion 111. FIG. 9 is a schematic plan view illustrating the structure of the terminal electrode 121 in the second modified example. FIG. 10 is a schematic plan view illustrating an example in which the width W8 is smaller than the widths W1 and W4 in the second modified example. FIG. 11 is a schematic cross-sectional view illustrating a third modified example of the coil portion 111. FIG. 12 is a schematic plan view illustrating the structure of a terminal electrode 121 in a third modified example. FIG. 13 is a schematic plan view illustrating an example in which the width W4 is smaller than the width W1 and the width W10 in the third modified example. FIG. 14 is a schematic cross-sectional view illustrating a fourth modified example of the coil portion 111. FIG. 15 is a schematic plan view illustrating the structure of the terminal electrode 121 in the fourth modified example. FIG. 16 is a schematic cross-sectional view illustrating a fifth modified example of the coil portion 111. FIG. 17 is a schematic perspective view illustrating the appearance of an electronic component 200 in accordance with a second embodiment of the technology disclosed herein. FIG. 18 is a schematic cross-sectional view taken along line A-A in FIG. 17. FIG. 19 is a schematic perspective view illustrating the appearance of an electronic component 300 in accordance with a third embodiment of the technology disclosed herein. FIG. 20 is a schematic cross-sectional view taken along line B-B in FIG. 19. FIGS. 21(a) to 21(c) are schematic plan views illustrating the shapes of conductor patterns located on the conductor layers L1 to L3, respectively, in the third embodiment.

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings. For the sake of explanation, the X, Y, and Z directions, which are orthogonal (or substantially orthogonal) to one another, will be defined as illustrated in the drawings. Furthermore, a plane extending in the X and Y directions may be referred to as an XY plane, a plane extending in the X and Z directions as an XZ plane, and a plane extending in the Y and Z directions as a YZ plane.

[0010] First Embodiment Fig. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to a first embodiment of the technology disclosed herein. Fig. 2 is a schematic cross-sectional view taken along line A-A shown in Fig. 1, and Fig. 3 is a schematic cross-sectional view taken along line B-B shown in Fig. 1.

[0011] 1 to 3 , an electronic component 100 according to a first embodiment includes a magnetic body M, multiple coils 111 to 114 embedded in the magnetic body M, and an interlayer insulating film 130 located between the magnetic body M and the coils 111 to 114. The magnetic body M may be made of a composite magnetic material in which magnetic particles made of a high-permeability material such as ferrite or permalloy are solidified with a resin binder. The magnetic body M has main surfaces 101 and 102 that form an XZ plane and are opposite each other in the Y direction, side surfaces 103 and 104 that form an XY plane and are opposite each other in the Z direction, and side surfaces 105 and 106 that form a YZ plane and are opposite each other in the X direction. In this specification, the X direction may be referred to as the third direction, the Y direction as the first direction, and the Z direction as the second direction. For the sake of explanation, the direction from main surface 102 to 101 may be referred to as the +Y direction (the opposite direction is the −Y direction), the direction from side surface 103 to 104 as the +Z direction (the opposite direction is the −Z direction), and the direction from side surface 105 to 106 as the +X direction (the opposite direction is the −X direction). Details will be described later, but in electronic component 100 according to the first embodiment, interlayer insulating film 130 includes insulating portions 131 to 135.

[0012] The coil portions 111 to 114 are arranged in the X direction in this order. The coil portions 111 to 114 each have a terminal electrode 121 that forms one end exposed from the main surface 101 of the magnetic body portion M, and a terminal electrode 122 that forms the other end exposed from the main surface 102 of the magnetic body portion M. In the embodiment shown in Fig. 1, the coil portions 111 to 114 have the same structure, and therefore the following description will focus on the coil portion 111 and describe its structure.

[0013] In the electronic component 100 according to the first embodiment, the coil portion 111 has two conductor layers L1 and L2 stacked in the Z direction. The conductor layers L1 and L2 are covered with insulating portions 131 to 135 that constitute the interlayer insulating film 130 so as not to come into contact with the magnetic base portion M. In other words, the insulating portions 131 to 135 are disposed between the conductor patterns formed on the conductor layers L1 and L2 and the magnetic base portion M. The conductor layers L1 and L2 are made of a good conductor such as copper (Cu). The interlayer insulating film 130 is made of an insulating material such as resin.

[0014] The conductor layer L1 is a conductor layer located at one end side in the Z direction in the coil portion 111. The conductor layer L1 may be formed first during manufacturing, for example. In the example shown in FIG. 3 , the conductor layer L1 includes terminal patterns 141 and 142 and a coil pattern C11. The terminal pattern 141 is a conductor pattern whose XZ end face in the +Y direction is exposed on the main surface 101 of the magnetic body portion M, and has a width W1 in the X direction. The terminal pattern 142 is a conductor pattern whose XZ end face in the -Y direction is exposed on the main surface 102 of the magnetic body portion M, and has a width W2 in the X direction. The widths W1 and W2 may be the same. The coil pattern C11 is a linear conductor pattern that connects the terminal patterns 141 and 142 within the conductor layer L1, and its width W3 in the X direction may be smaller than the widths W1 and W2, or may be the same as the widths W1 and W2. The inductance and DC resistance of the coil pattern C11 can be adjusted by its width W3. For example, reducing the width W3 can increase the inductance, and increasing the width W3 can decrease the DC resistance. The coil pattern C11 is not limited to a linear conductor pattern, and may have a shape with a bent or curved portion, such as a meandering conductor pattern.

[0015] The conductor layer L2 is a conductor layer located on the other end side in the Z direction in the coil portion 111. For example, the conductor layer L2 may be formed next to the conductor layer L1 during manufacturing. In the example shown in FIG. 3, the conductor layer L2 includes terminal patterns 143 and 144. In the embodiment shown in FIGS. 1 to 4, the conductor layer L2 does not have a conductor pattern corresponding to the coil pattern C11. In this case, the terminal patterns 143 and 144 are not connected to other conductor patterns within the layer on which the conductor layer L2 is formed (hereinafter referred to as within the plane of the conductor layer L2; the same applies to other conductor layers).

[0016] Terminal patterns 141 and 143 are connected to each other via via conductor 151 provided to penetrate insulating portion 134 of interlayer insulating film 130. Similarly, terminal patterns 142 and 144 are connected to each other via via conductor 152 provided to penetrate insulating portion 134 of interlayer insulating film 130. Via conductors 151 and 152 may be formed simultaneously with conductor layer L2, or may be formed after conductor layer L1 is formed and before conductor layer L2 is formed. In the former case, via conductor 151 is formed integrally with terminal pattern 143, and via conductor 152 is formed integrally with terminal pattern 144.

[0017] 4A and 4B are schematic plan views illustrating the structures of the terminal electrodes 121 and 122. In the examples shown in Fig. 4A and 4B, via conductors 151 and 152 are formed integrally with terminal patterns 143 and 144, respectively.

[0018] In the example shown in FIG. 4A , the terminal electrode 121 includes a portion consisting of the XZ end faces of the terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic body part M, and a portion consisting of the XZ end face of the via conductor 151 exposed from the main surface 101 of the magnetic body part M. The portions of the terminal electrode 121 consisting of the XZ end faces of the terminal patterns 141 and 143 constitute exposed portions A1 and A2, respectively. The portion of the terminal electrode 121 consisting of the XZ end face of the via conductor 151 constitutes exposed portion A3. The terminal electrode 121 having such a structure is surrounded by insulating portions 131 to 135 that constitute the interlayer insulating film 130 on the main surface 101 of the magnetic body part M. The width of the exposed portion A1 in the X direction is W1, and the width of the exposed portion A2 in the X direction is W4. The widths W1 and W4 may be the same or different from each other. The width W6 of the exposed portion A3 in the X direction may be ¾ or more of the width W1 or the width W4. This allows the area of ​​the terminal electrode 121 to be sufficiently secured.

[0019] In the example shown in FIG. 4( b), the terminal electrode 122 includes a portion consisting of the XZ end faces of the terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic body part M, and a portion consisting of the XZ end face of the via conductor 152 exposed from the main surface 102 of the magnetic body part M. The portions of the terminal electrode 122 consisting of the XZ end faces of the terminal patterns 142 and 144 constitute exposed portions B1 and B2, respectively. The portion of the terminal electrode 122 consisting of the XZ end face of the via conductor 152 constitutes exposed portion B3. The terminal electrode 122 having such a structure is surrounded by insulating portions 131 to 135 that constitute the interlayer insulating film 130 on the main surface 102 of the magnetic body part M. The width of the exposed portion B1 in the X direction is W2, and the width of the exposed portion B2 in the X direction is W5. The widths W2 and W5 may be the same or different from each other. Widths W4 and W5 may be the same or different. Width W7 in the X direction of exposed portion B3 may be ¾ or more of width W2 or width W5. This makes it possible to ensure a sufficient area for terminal electrode 122. Widths W6 and W7 may be the same or different.

[0020] The surface of the terminal electrode 121 may be flush with the main surface 101 of the magnetic body part M, or may be recessed from the main surface 101 of the magnetic body part M. Similarly, the surface of the terminal electrode 122 may be flush with the main surface 102 of the magnetic body part M, or may be recessed from the main surface 102 of the magnetic body part M.

[0021] The thickness of the conductor layer L1 in the Z direction is T1, and the thickness of the conductor layer L2 in the Z direction is T2. Thickness T2 may be thicker than thickness T1, thereby increasing the area of ​​the terminal electrodes 121, 122. Thickness T2 may be two times or more the thickness T1. This allows the area of ​​the terminal electrodes 121, 122 to be further increased. Thickness T2 may be four times or less the thickness T1. This makes it easier to form the conductor layer L2.

[0022] The conductor layer L1 is covered with the insulating portion 131 in the XY plane, i.e., in a direction perpendicular to the Z direction. In other words, the insulating portion 131 is arranged between the X-direction end faces of the conductor patterns (terminal patterns 141, 142 and coil pattern C11) formed on the conductor layer L1 and the magnetic base body portion M. When the width W3 in the X direction of the coil pattern C11 is smaller than the widths W1, W2 in the X direction of the terminal patterns 141, 142, the insulating portion 131 is arranged between the −Y-direction end face of the terminal pattern 141 (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M. Furthermore, the insulating portion 131 is arranged between the +Y-direction end face of the terminal pattern 142 (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M.

[0023] The conductor layer L2 is covered with the insulating portion 132 in the XY plane direction, i.e., in the direction perpendicular to the Z direction. In other words, an insulating portion 132 is arranged between the X-direction end faces of the conductor patterns (terminal patterns 143, 144) formed on the conductor layer L2 and the magnetic base body portion M. An insulating portion 132 is arranged between the -Y-direction end face of the terminal pattern 143 (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M. An insulating portion 132 is also arranged between the +Y-direction end face of the terminal pattern 144 (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M.

[0024] The conductor layer L1 is covered by an insulating portion 133 from the -Z direction. In other words, the insulating portion 133 is arranged between the magnetic base portion M and the end face in the -Z direction of the conductor pattern formed on the conductor layer L1. An insulating portion 134 is arranged between the conductor layer L1 and the conductor layer L2. The conductor layer L2 is covered by an insulating portion 135 from the +Z direction. In other words, the insulating portion 135 is arranged between the magnetic base portion M and the end face in the +Z direction of the conductor pattern formed on the conductor layer L2.

[0025] When the width W3 of the coil pattern C11 in the X direction is the same as the widths W1 and W2 of the terminal patterns 141 and 142 in the X direction, the conductor layer L1 is covered by the insulating portion 131 from the X direction but not from the Y direction.

[0026] The insulating portion 131 has a thickness in the XY plane (direction perpendicular to the Z direction) of t1. More specifically, the insulating portion 131 disposed between the X-direction end face of the terminal pattern 141 (or 142) and the magnetic base portion M has a thickness of t1X in the X direction. Furthermore, when the width W3 of the coil pattern C11 in the X direction is smaller than the widths W1 and W2 of the terminal patterns 141 and 142 in the X direction, the insulating portion 131 disposed between the Y-direction end face of the terminal pattern 141 (or 142) (the surface facing the inside of the magnetic base portion M) and the magnetic base portion M has a thickness of t1Y in the Y direction (see FIG. 2 ). The thickness t1 may be substantially constant, i.e., the thickness t1X and the thickness t1Y may be substantially the same. Alternatively, the thickness t1X and the thickness t1Y may be different.

[0027] The insulating portion 132 has a thickness in the XY plane direction (direction perpendicular to the Z direction) of t2. More specifically, the insulating portion 132 arranged between the X-direction end face of the terminal pattern 143 (or 144) and the magnetic base body portion M has a thickness of t2X in the X direction. The insulating portion 132 arranged between the Y-direction end face of the terminal pattern 143 (or 144) (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M has a thickness of t2Y in the X direction (see FIG. 3). The thickness t2 may be substantially constant, that is, the thickness t2X and the thickness t2Y may be substantially the same. Alternatively, the thickness t2X and the thickness t2Y may be different.

[0028] At least one of the thickness t2X and the thickness t2Y of the insulating portion 132 is greater than the thickness t1X of the insulating portion 131, which allows the insulating portion 132 to function as a buffer against an external force in the Y direction applied to the terminal patterns 143 and 144. In other words, the terminal patterns 143 and 144 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L2, and the magnetic base portion M is present between the terminal patterns 143 and 144. When an external force in the Y direction (e.g., an external force that presses the terminal patterns 143 and 144 in the Y direction) is applied to the terminal patterns 143 and 144, the external force is transmitted to the insulating portion 132. In this embodiment, by forming at least one of the thicknesses t2X and t2Y of the insulating portion 132 to be greater than the thickness t1X of the insulating portion 131, it is possible to ensure insulation between the terminal patterns 143 and 144 and the magnetic base portion M even when such an external force is applied. This makes it possible to ensure high reliability for the terminal electrodes 121, 122. Note that the areas of the exposed portions A1, B1 of the terminal patterns 141, 142 are smaller than the areas of the exposed portions A2, B2, making them less susceptible to external force. Therefore, by making the thickness t1X of the insulating portion 131 thinner than at least one of the thicknesses t2X, t2Y, it is possible to arrange more magnetic base body portions M around the insulating portion 131.

[0029] Furthermore, both the thickness t2X and the thickness t2Y of the insulating portion 132 may be greater than the thickness t1X of the insulating portion 131. This further improves the function of the insulating portion 132 as a buffer material, thereby further improving the reliability of the product.

[0030] The thickness t1X(141) of the insulating portion 131 that covers the terminal pattern 141 from the X direction and the thickness t1X(142) of the insulating portion 131 that covers the terminal pattern 142 from the X direction may be the same or different. The thickness t1Y(141) of the insulating portion 131 that covers the terminal pattern 141 from the Y direction and the thickness t1Y(142) of the insulating portion 131 that covers the terminal pattern 142 from the Y direction may be the same or different.

[0031] The thickness t2X(143) of the insulating portion 132 that covers the terminal pattern 143 from the X direction may be the same as or different from the thickness t2X(144) of the portion that covers the terminal pattern 144 from the X direction. The thickness t2Y(143) of the insulating portion 132 that covers the terminal pattern 143 from the Y direction may be the same as or different from the thickness t2Y(144) of the portion that covers the terminal pattern 144 from the Y direction.

[0032] The thickness t2 of the insulating portion 132 may be two or more times the thickness t1 of the insulating portion 131. This makes it possible to improve the function of the insulating portion 132 as a buffer against external forces. The thickness t2 of the insulating portion 132 may be three or less times the thickness t1 of the insulating portion 131. This makes it possible to arrange a magnetic base body portion M with a sufficient volume around the insulating portions 131 and 132, depending on the characteristics required of the electronic component 100.

[0033] The insulating portion 133 has a thickness in the Z direction of t3, the insulating portion 134 has a thickness in the Z direction of t4, and the insulating portion 135 has a thickness in the Z direction of t5. Thicknesses t3 to t5 may be the same as each other, or some or all of them may be different from each other. For example, thickness t3 may be thicker than thicknesses t4 and t5. Thicknesses t3 to t5 may be thinner than thickness t1. This makes it possible to arrange a magnetic base body portion M of sufficient volume around each insulating portion according to the characteristics required of the electronic component 100.

[0034] As described above, the electronic component 100 according to this embodiment forms a coil array incorporating four coil portions 111 to 114. The arrangement pitch of the coil portions 111 to 114 in the X direction may be constant, or, as shown in Figures 1 and 2, the spacing between the coil portions 112 and 113 in the X direction may be wider than the spacing between the coil portions 111 and 112 in the X direction and the spacing between the coil portions 113 and 114 in the X direction. By widening the spacing between the coil portions 112 and 113 in the X direction, it is possible to reduce the coupling between the coil portions 112 and 113.

[0035] FIG. 5 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 incorporating an electronic component 100 according to this embodiment.

[0036] 5 includes insulating layers 11 to 15 stacked in this order, a plurality of wiring patterns 20 formed on the surfaces of insulating layers 11 to 15, and an electronic component 100 embedded in insulating layer 13. Wiring pattern 20 includes four wiring patterns 21 positioned between insulating layer 13 and insulating layer 14, and four wiring patterns 22 positioned between insulating layer 12 and insulating layer 13. Each of the four wiring patterns 21 is positioned to overlap a terminal electrode 121 of coil portions 111 to 114, and is connected to the corresponding terminal electrode 121 via a substrate via conductor 31. Similarly, each of the four wiring patterns 22 is positioned to overlap a terminal electrode 122 of coil portions 111 to 114, and is connected to the corresponding terminal electrode 122 via a substrate via conductor 32.

[0037] As described above, the electronic component 100 according to this embodiment can be built into the component-embedded substrate 10 for use. When the electronic component 100 is built into the component-embedded substrate 10 for use, the end faces of the terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic body portion M are used as the terminal electrode 121, and the end faces of the terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic body portion M are used as the terminal electrode 122. In this embodiment, not only the end face of the conductor layer L1 having the coil pattern C11 but also the end face of the conductor layer L2 having no coil pattern are exposed, thereby ensuring sufficient area for the terminal electrodes 121 and 122. Furthermore, when the thickness T2 of the conductor layer L2 is thicker than the thickness T1 of the conductor layer L1, the number of conductor layers can be reduced compared to stacking multiple thin conductor layers. In other words, it is possible to form the terminal electrodes 121 and 122 with sufficient area while reducing the number of steps in the manufacturing process. Furthermore, when the thickness T1 of the conductor layer L1 is thinner than the thickness T2 of the conductor layer L2, it is possible to reduce the size in the Z direction of the electronic component 100. Furthermore, by adjusting the shape of the coil pattern C11 formed on the conductor layer L1, it is possible to adjust the inductance of each coil portion according to the characteristics required of the electronic component 100.

[0038] When not only the end faces of the terminal patterns 141 and 143 but also the end face of the via conductor 151 are exposed from the main surface 101 of the magnetic body part M, the terminal electrode 121 is not divided into multiple parts by the insulating part 134 of the interlayer insulating film 130 on the main surface 101 of the magnetic body part M. Similarly, when not only the end faces of the terminal patterns 142 and 144 but also the end face of the via conductor 152 are exposed from the main surface 102 of the magnetic body part M, the terminal electrode 122 is not divided into multiple parts by the insulating part 134 of the interlayer insulating film 130 on the main surface 102 of the magnetic body part M. In other words, in this embodiment, the terminal electrodes 121 and 122 are each formed as a continuous terminal surface.

[0039] Furthermore, because the terminal electrodes 121, 122 are surrounded by the interlayer insulating film 130 on the main surfaces 101, 102 of the magnetic body part M, it is possible to improve the dielectric strength voltage between the terminal electrodes 121 adjacent in the X direction, as well as the dielectric strength voltage between the terminal electrodes 122 adjacent in the X direction. Furthermore, if the surface of the terminal electrode 121 is recessed relative to the main surface 101 of the magnetic body part M, the connection reliability between the terminal electrode 121 and the substrate via conductor 31 is improved. Similarly, if the surface of the terminal electrode 122 is recessed relative to the main surface 102 of the magnetic body part M, the connection reliability between the terminal electrode 122 and the substrate via conductor 32 is improved.

[0040] Furthermore, at least one of the thicknesses t2X and t2Y of the insulating portion 132 covering the conductor layer L2 is greater than the thickness t1X of the insulating portion 131 covering the conductor layer L1, which reduces the effects of stress (external force) applied to the terminal electrodes 121 and 122 when forming the board via conductors 31 and 32. This also improves product reliability.

[0041] Fig. 6 is a schematic cross-sectional view illustrating a first modified example of the coil portion 111, and corresponds to the cross section taken along line B-B in Fig. 1. Fig. 7 is a schematic plan view illustrating the structure of the terminal electrode 121 in the first modified example.

[0042] 6 and 7 differs from the coil portion 111 described with reference to FIGS. 3, 4(a), and 4(b) in that a conductor layer L3 is added. The conductor layer L3 is a conductor layer located on the other end side in the Z direction. The conductor layer L3 may be formed next to the conductor layer L2 during manufacturing.

[0043] In the example shown in FIGS. 6 and 7 , the conductor layer L3 includes terminal patterns 145 and 146. The terminal patterns 145 and 146 are provided independently without being connected to other conductor patterns within the plane of the conductor layer L3. In other words, the conductor layer L3 does not include a conductor pattern corresponding to the coil pattern C11; only the terminal patterns 145 and 146 are present. The conductor layer L3 is covered in the XY plane by an insulating portion 136 of the interlayer insulating film 130. In other words, an insulating portion 136 is disposed between the X-direction end faces of the conductor patterns (terminal patterns 145 and 146) formed on the conductor layer L3 and the magnetic body portion M. An insulating portion 136 is disposed between the −Y-direction end face of the terminal pattern 145 (the surface facing the inside of the magnetic body portion M) and the magnetic body portion M. An insulating portion 136 is arranged between the +Y-direction end face of terminal pattern 146 (the face facing the inside of magnetic body portion M) and magnetic body portion M. Conductor layer L3 is covered from the +Z direction by an insulating portion 137 of interlayer insulating film 130. In other words, an insulating portion 137 is arranged between the +Z-direction end faces of terminal pattern 145 and terminal pattern 146 and magnetic body portion M, respectively.

[0044] Terminal patterns 143 and 145 are connected to each other through via conductors 153 provided to penetrate insulating portion 135 of interlayer insulating film 130. Similarly, terminal patterns 144 and 146 are connected to each other through via conductors 154 provided to penetrate insulating portion 135 of interlayer insulating film 130. Via conductors 153 and 154 may be formed simultaneously with conductor layer L3, or may be formed after conductor layer L2 is formed and before conductor layer L3 is formed. In the former case, via conductor 153 is formed integrally with terminal pattern 145, and via conductor 154 is formed integrally with terminal pattern 146.

[0045] The XZ end faces of terminal pattern 145 and via conductor 153 may be exposed from main surface 101 of magnetic body part M to form part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 146 and via conductor 154 may be exposed from main surface 102 of magnetic body part M to form part of terminal electrode 122. The portion of terminal electrode 121 consisting of the XZ end face of terminal pattern 145 forms exposed portion A4. The portion of terminal electrode 121 consisting of the XZ end face of via conductor 151 forms exposed portion A5. The same applies to terminal electrode 122.

[0046] The width of the exposed portion A4 in the X direction is W8. The width W8 may be the same as or different from the widths W1 and W4. The width of the exposed portion A5 in the X direction is W9. The width W9 may be the same as or different from the width W6.

[0047] The thickness of the conductor layer L3 in the Z direction is T3. Thickness T3 is thicker than thickness T1, thereby increasing the area of ​​the terminal electrode 121. Thickness T3 may be the same as or different from thickness T2.

[0048] The insulating part 136 has a thickness in the XY plane direction (direction perpendicular to the Z direction) of t6. More specifically, the insulating part 136 arranged between the X-direction end face of the terminal pattern 145 (or 146) and the magnetic base part M has a thickness of t6X in the X direction. Furthermore, the insulating part 136 arranged between the Y-direction end face of the terminal pattern 145 (or 146) (the surface facing the inside of the magnetic base part M) and the magnetic base part M has a thickness of t6Y in the Y direction. At least one of the thicknesses t6X and t6Y is greater than the thickness t1X, which allows the insulating part 136 to function as a buffer against external forces applied to the terminal pattern 145 in the Y direction.

[0049] Furthermore, both thicknesses t6X and t6Y of the insulating portion 136 may be greater than thickness t1X of the insulating portion 131. This further enhances the buffer function of the insulating portion 136, thereby further improving product reliability. Thicknesses t6X and t6Y may be the same. Thickness t6X may be the same as or different from thickness t2X. Thickness t6Y may be the same as or different from thickness t2Y. The thickness of the portion of the insulating portion 136 that covers the terminal pattern 145 from the X direction may be the same as or different from the thickness of the portion of the insulating portion 136 that covers the terminal pattern 146 from the X direction. The thickness of the portion of the insulating portion 136 that covers the terminal pattern 145 from the Y direction may be the same as or different from the thickness of the portion of the insulating portion 136 that covers the terminal pattern 146 from the Y direction. The thickness of the insulating portion 137 in the Z direction is t7. The thickness t7 may be the same as or different from the thicknesses t3 to t5.

[0050] 6 and 7, the number of conductor layers L2 and L3 on which no coil pattern is formed may be greater than the number of conductor layers L1 on which the coil pattern C11 is formed, which allows the areas of the terminal electrodes 121 and 122 to be further increased.

[0051] Fig. 8 is a schematic cross-sectional view illustrating a second modified example of the coil portion 111, and corresponds to the cross section taken along line B-B in Fig. 1. Fig. 9 is a schematic plan view illustrating the structure of the terminal electrode 121 in the second modified example.

[0052] The second modified example shown in FIGS. 8 and 9 differs from the first modified example shown in FIGS. 6 and 7 in that the thickness T2 of the conductor layer L2 is thinner than the thickness T3 of the conductor layer L3. The thickness T2 of the conductor layer L2 may be the same as or different from the thickness T1 of the conductor layer L1. As illustrated in the second modified example shown in FIGS. 8 and 9, when a conductor layer L3 having a thicker thickness T3 is added, the thickness T2 of the conductor layer L2 may be smaller than the thickness T3 of the conductor layer L3. The thickness T2 of the conductor layer L2 may be approximately the same as the thickness T1 of the conductor layer L1. Furthermore, as shown in FIG. 10, the widths W1 and W4 may be approximately the same, and the width W8 may be smaller than the widths W1 and W4. This allows the X-direction thickness t6X of the insulating portion 136 to be increased.

[0053] Fig. 12 is a schematic cross-sectional view illustrating a third modified example of the coil portion 111, and corresponds to the cross section taken along line B-B in Fig. 1. Fig. 13 is a schematic plan view illustrating the structure of a terminal electrode 121 in the third modified example.

[0054] The third modified example shown in Figures 12 and 13 differs from the coil portion 111 described using Figures 3, 4(a), and 4(b) in that a conductor layer L0 is added. The conductor layer L0 is a conductor layer located on one end side in the Z direction. The conductor layer L0 may be formed first during manufacturing, for example. Note that the conductor layer L0 may be formed so as to substantially overlap the conductor layer L1 after the conductor layers L1 and L2 described above are formed and the magnetic material on the end face side of the conductor layer L1 in the -Z direction is removed.

[0055] 12 and 13, the conductor layer L0 includes terminal patterns 147 and 148 and a coil pattern C12. The terminal pattern 147 is a conductor pattern whose XZ end face in the +Y direction is exposed on the main surface 101 of the magnetic body part M. The terminal pattern 148 is a conductor pattern whose XZ end face in the -Y direction is exposed on the main surface 102 of the magnetic body part M. The coil pattern C12 is a linear conductor pattern that connects the terminal patterns 147 and 148 within the conductor layer L0. The planar shape of the coil pattern C12 may be the same as or different from the planar shape of the coil pattern C11. Note that the coil pattern C12 is not limited to a linear conductor pattern, and may be a meandering conductor pattern or other shape that has a bent or curved portion in part.

[0056] The conductor layer L0 is covered by an insulating portion 138 of the interlayer insulating film 130 in the XY plane direction (direction perpendicular to the Z direction). In other words, an insulating portion 138 is arranged between the magnetic element portion M and the X-direction end faces of the conductor patterns (terminal patterns 147, 148, coil pattern C12) formed on the conductor layer L0. When the width of the coil pattern C12 in the X direction is smaller than the width of the terminal patterns 147, 148 in the X direction, an insulating portion 138 is arranged between the −Y-direction end face of the terminal pattern 147 (the surface facing the inside of the magnetic element portion M) and the magnetic element portion M. In addition, an insulating portion 138 is arranged between the +Y-direction end face of the terminal pattern 148 (the surface facing the inside of the magnetic element portion M) and the magnetic element portion M. The conductor layer L0 is covered by an insulating portion 139 of the interlayer insulating film 130 in the −Z direction. In other words, the insulating portion 139 is disposed between the magnetic body portion M and the end face in the −Z direction of the conductor pattern formed on the conductor layer L0.

[0057] Terminal pattern 141 and terminal pattern 147 are connected to each other through via conductor 155 provided to penetrate insulating portion 133 of interlayer insulating film 130. Similarly, terminal pattern 142 and terminal pattern 148 are connected to each other through via conductor 156 provided to penetrate insulating portion 133 of interlayer insulating film 130. Via conductors 155 and 156 may be formed simultaneously with conductor layer L1, or may be formed after conductor layer L0 is formed and before conductor layer L1 is formed. In the former case, via conductor 155 is formed integrally with terminal pattern 141, and via conductor 156 is formed integrally with terminal pattern 142.

[0058] The XZ end faces of terminal pattern 147 and via conductor 155 may be exposed from main surface 101 of magnetic body part M, thereby constituting part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 148 and via conductor 156 may be exposed from main surface 102 of magnetic body part M, thereby constituting part of terminal electrode 122. The portion of terminal electrode 121 consisting of the XZ end face of terminal pattern 147 constitutes exposed portion A4. The portion of terminal electrode 121 consisting of the XZ end face of via conductor 155 constitutes exposed portion A5. The same is true for terminal electrode 122.

[0059] The width of the exposed portion A4 in the X direction is W10. The width W10 may be the same as the widths W1 and W4, or may be different. For example, as shown in FIG. 13, the widths W1 and W10 may be approximately the same, and the width W4 may be smaller than the widths W1 and W10. The width of the exposed portion A5 in the X direction is W11. The width W11 may be the same as the width W6, or may be different.

[0060] The thickness of the conductor layer L0 in the Z direction is T4. Thickness T4 is thinner than thickness T2. Thickness T4 may be the same as or different from thickness T1.

[0061] The insulating portion 138 has a thickness in the XY plane direction (direction perpendicular to the Z direction) of t8. More specifically, the insulating portion 138 arranged between the X-direction end face of the terminal pattern 147 (or 148) and the magnetic base body portion M has a thickness of t8X in the X direction. Furthermore, when the width of the coil pattern C12 in the X direction is smaller than the width of the terminal pattern 147 (or 148) in the X direction, the insulating portion 138 arranged between the Y-direction end face of the terminal pattern 147 (or 148) (the surface facing the inside of the magnetic base body portion M) and the magnetic base body portion M has a thickness of t8Y (not shown) in the Y direction. Thickness t8X and thickness t8Y may be the same or different.

[0062] The thickness t8 is thinner than at least one of the thicknesses t2X and t2Y. The thickness t8 may be the same as the thickness t1, or may be different. The thickness t8 may be thinner than both the thicknesses t2X and t2Y. The thickness of the insulating portion 139 in the Z direction is t9. The thickness t9 may be the same as the thicknesses t3 to t5, or may be different.

[0063] 12 and 13, coil patterns C11 and C12 may be formed on a plurality of conductor layers L1 and L0, respectively. Furthermore, the number of conductor layers L2 on which no coil patterns are formed may be fewer than the number of conductor layers L1 and L0 on which coil patterns are formed. This allows the DC resistance of the coil portion 111 to be reduced.

[0064] Fig. 14 is a schematic cross-sectional view illustrating a fourth modified example of the coil portion 111, and corresponds to the cross section taken along line B-B in Fig. 1. Also, Fig. 15 is a schematic plan view illustrating the structure of the terminal electrode 121 in the fourth modified example.

[0065] The fourth modified example shown in FIGS. 14 and 15 differs from the coil portion 111 described with reference to FIGS. 3 , 4(a), and 4(b) in that a conductor layer L0 is added. The conductor layer L0 is a conductor layer located on one end side in the Z direction. For example, the conductor layer L0 may be formed first during manufacturing. Note that the conductor layer L0 may be formed, for example, after the above-described conductor layers L1 and L2 are formed, by removing the magnetic body portion M on the end surface side of the conductor layer L1 in the -Z direction, and then forming the conductor layer L0 so that it generally overlaps the conductor layer L1. In the example shown in FIGS. 14 and 15, the conductor layer L0 includes terminal patterns 149 and 1410. The terminal patterns 149 and 1410 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L0. In other words, the conductor layer L0 does not have a conductor pattern corresponding to the coil pattern C11; only the terminal patterns 149 and 1410 are present.

[0066] The conductor layer L0 is covered in the XY plane by an insulating portion 1310 of the interlayer insulating film 130. In other words, an insulating portion 1310 is arranged between the magnetic element portion M and the X-direction end faces of the conductor patterns (terminal patterns 149, 1410) formed on the conductor layer L0. An insulating portion 1310 is arranged between the magnetic element portion M and the -Y-direction end face of the terminal pattern 149 (the surface facing the inside of the magnetic element portion M). An insulating portion 1310 is also arranged between the magnetic element portion M and the +Y-direction end face of the terminal pattern 1410 (the surface facing the inside of the magnetic element portion M). The conductor layer L0 is covered in the -Z direction by an insulating portion 1311 of the interlayer insulating film 130. In other words, an insulating portion 1311 is arranged between the magnetic element portion M and the -Z-direction end faces of the conductor patterns formed on the conductor layer L0.

[0067] Terminal pattern 141 and terminal pattern 149 are connected to each other through via conductor 157 provided to penetrate insulating portion 133 of interlayer insulating film 130. Similarly, terminal pattern 142 and terminal pattern 1410 are connected to each other through via conductor 158 provided to penetrate insulating portion 133 of interlayer insulating film 130. Via conductors 157 and 158 may be formed simultaneously with conductor layer L1, or may be formed after conductor layer L0 is formed and before conductor layer L1 is formed. In the former case, via conductor 157 is formed integrally with terminal pattern 141, and via conductor 158 is formed integrally with terminal pattern 142.

[0068] The XZ end faces of terminal pattern 149 and via conductor 157 may be exposed from main surface 101 of magnetic body part M to form part of terminal electrode 121. Similarly, the XZ end faces of terminal pattern 1410 and via conductor 158 may be exposed from main surface 102 of magnetic body part M to form part of terminal electrode 122. The portion of terminal electrode 121 consisting of the XZ end face of terminal pattern 149 forms exposed portion A4. The portion of terminal electrode 121 consisting of the XZ end face of via conductor 157 forms exposed portion A5. The same is true for terminal electrode 122.

[0069] The width of the exposed portion A4 in the X direction is W12. The width W12 may be the same as or different from the widths W1 and W4. The width of the exposed portion A5 in the X direction is W13. The width W13 may be the same as or different from the width W6.

[0070] The conductor layer L0 has a thickness T5 in the Z direction. Thickness T5 is thicker than thickness T1, thereby increasing the area of ​​the terminal electrode 121. Thickness T5 may be the same as or different from thickness T2.

[0071] The insulating part 1310 has a thickness in the XY plane direction (direction perpendicular to the Z direction) of t10. More specifically, the insulating part 1310 arranged between the X-direction end face of the terminal pattern 149 (or 1410) and the magnetic base body part M has a thickness of t10X in the X direction. Furthermore, the insulating part 1310 arranged between the Y-direction end face of the terminal pattern 149 (or 1410) (the surface facing the inside of the magnetic base body part M) and the magnetic base body part M has a thickness of t10Y in the Y direction. At least one of the thicknesses t10X and t10Y is larger than the thickness t1X, which allows the insulating part 1310 to function as a buffer against an external force applied to the terminal pattern 149 in the Y direction.

[0072] Furthermore, both thicknesses t10X and t10Y of the insulating portion 1310 may be greater than thickness t1X of the insulating portion 131. This further enhances the buffer function of the insulating portion 1310, thereby further improving product reliability. Thicknesses t10X and t10Y may be the same. Thickness t10X may be the same as or different from thickness t2X. Thickness t10X may be the same as or different from thickness t10Y. The thickness of the portion of the insulating portion 1310 that covers the terminal pattern 149 from the X direction and the thickness of the portion of the insulating portion 1310 that covers the terminal pattern 1410 from the X direction may be the same as or different from each other. The thickness of the portion of the insulating portion 1310 that covers the terminal pattern 149 from the Y direction and the thickness of the portion of the insulating portion 1310 that covers the terminal pattern 1410 from the Y direction may be the same as or different from each other. The insulating portion 1311 has a thickness t11 in the Z direction. The thickness t11 may be the same as or different from the thicknesses t3 to t5.

[0073] 14 and 15, the conductor layer L1 on which the coil pattern C11 is formed may be sandwiched between conductor layers L0 and L2 on which no coil pattern is formed, which allows the coil pattern C11 to be positioned closer to the center in the Z direction of the magnetic base body part M.

[0074] FIG. 16 is a schematic cross-sectional view for explaining a fifth modified example of the coil portion 111, and corresponds to the cross section taken along line BB shown in FIG.

[0075] 16 differs from the first modified example shown in FIG. 6 in that the terminal pattern 146 is omitted. That is, only the terminal pattern 145 is present on the conductor layer L3. As a result, the terminal electrode 121 exposed from the main surface 101 of the magnetic body part M is composed of three layers of terminal patterns 141, 143, and 145 and two via conductors 151 and 153 connecting them, whereas the terminal electrode 122 exposed from the main surface 102 of the magnetic body part M is composed of two layers of terminal patterns 142 and 144 and one via conductor 152 connecting them. As a result, in the fifth modified example, the size of the terminal electrode 121 in the Z direction is larger than the size of the terminal electrode 122 in the Z direction.

[0076] As illustrated in the fifth modified example shown in FIG. 16, the terminal electrodes 121 and 122 do not need to have the same size, and may be designed to have different sizes depending on the required characteristics, etc.

[0077] Second Embodiment Fig. 17 is a schematic perspective view showing the appearance of an electronic component 200 according to a second embodiment of the technology disclosed herein. Fig. 18 is a schematic cross-sectional view taken along line A-A shown in Fig. 17. The cross-section taken along line B-B shown in Fig. 17 is the same as Fig. 3.

[0078] 17 and 18 , electronic component 200 according to the second embodiment differs from electronic component 100 according to the first embodiment in that coil patterns C11 included in coil portions 111 and 112 are offset in the −X direction, and coil patterns C11 included in coil portions 113 and 114 are offset in the +X direction. Since the other basic configurations are the same as those of electronic component 100 according to the first embodiment, the same elements are denoted by the same reference numerals, and redundant explanations will be omitted.

[0079] 17 and 18, the edge positions in the −X direction of the coil pattern C11 included in the coil portions 111 and 112 coincide with the edge positions in the −X direction of the terminal patterns 141 to 144. In contrast, the edge positions in the +X direction of the coil pattern C11 included in the coil portions 113 and 114 coincide with the edge positions in the +X direction of the terminal patterns 141 to 144.

[0080] As exemplified by electronic component 200 according to the second embodiment, it is not necessary for coil portions 111 to 114 to all have the same shape. Furthermore, with the configuration of electronic component 200 according to the second embodiment, it is possible to further reduce the coupling between coil portion 112 and coil portion 113.

[0081] The configurations of the various modifications of the electronic component 100 described in the first embodiment are applicable to the electronic component 200 according to the second embodiment.

[0082] 19 is a schematic perspective view showing the appearance of an electronic component 300 according to a third embodiment of the technology disclosed herein. Also, Fig. 20 is a schematic cross-sectional view taken along line BB shown in Fig. 19.

[0083] 19 and 20 , electronic component 300 according to the third embodiment differs from electronic component 100 according to the first embodiment in that conductor layer L1 includes terminal patterns 1411 and 1412 and coil pattern C21, conductor layer L2 includes terminal patterns 1413 and 1414 and coil pattern C22, and conductor layer L3 includes terminal patterns 1415 and 1416. Since the other basic configuration is the same as that of electronic component 100 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant description will be omitted.

[0084] 21A to 21C are schematic plan views showing the shapes of conductor patterns located on the conductor layers L1 to L3, respectively, in the third embodiment.

[0085] 21(a), the conductor layer L1 includes terminal patterns 1411 and 1412 and a coil pattern C21 having one end connected to the terminal pattern 1411. The terminal pattern 1412 is provided independently without being connected to other conductor patterns within the surface of the conductor layer L1. The coil pattern C21 is a loop-shaped conductor pattern that wraps around for approximately 3 / 4 of a turn.

[0086] In the example shown in FIG. 21( b), the conductor layer L2 includes terminal patterns 1413 and 1414 and a coil pattern C22 having one end connected to the terminal pattern 1414. The terminal pattern 1413 is provided independently on the surface of the conductor layer L2 without being connected to other conductor patterns. The coil pattern C22 is a loop-shaped conductor pattern that wraps around for approximately 3 / 4 turns. The other end of the coil pattern C22 is connected to the other end of the coil pattern C21 via the via conductor 161. As a result, the coil patterns C21 and C22 are connected in series between the terminal patterns 1411 and 1414.

[0087] 21(c), the conductor layer L3 includes terminal patterns 1415 and 1416. The terminal patterns 1415 and 1416 are provided independently without being connected to other conductor patterns within the surface of the conductor layer L3. In other words, the conductor layer L3 does not include conductor patterns corresponding to the coil patterns C21 and C22, and only includes the terminal patterns 1415 and 1416.

[0088] Terminal pattern 1413 is connected to terminal pattern 1411 through via conductor 159. Terminal pattern 1414 is connected to terminal pattern 1412 through via conductor 1510. Terminal pattern 1415 is connected to terminal pattern 1413 through via conductor 1511. Terminal pattern 1416 is connected to terminal pattern 1414 through via conductor 1512. The terminal patterns 1411, 1413, 1415 and the via conductors 159, 1511 are exposed from the main surface 101 of the magnetic body part M to form a terminal electrode 121. The terminal patterns 1412, 1414, 1416 and the via conductors 1510, 1512 are exposed from the main surface 102 of the magnetic body part M to form a terminal electrode 122.

[0089] In this embodiment, the thickness in the Z direction of the conductor layer L3 having no coil pattern is also greater than the thickness in the Z direction of the conductor layers L1 and L2 having the coil patterns C21 and C22, respectively, thereby increasing the area of ​​the terminal electrodes 121 and 122.

[0090] In this embodiment, the interlayer insulating film 130 includes insulating portions 1312 to 1318. The conductor layer L1 is covered in the XY plane by the insulating portion 1312. In other words, the insulating portions 1312 are disposed between the X-direction end faces and the magnetic body portion M of the conductor patterns (terminal patterns 1411, 1412 and coil pattern C21) formed on the conductor layer L1, and between the Y-direction end faces and the magnetic body portion M.

[0091] The conductor layer L2 is covered in the XY plane by the insulating portion 1313. In other words, the insulating portion 1313 is disposed between the magnetic body portion M and the X-direction end faces of the conductor patterns (terminal patterns 1413, 1414 and coil pattern C22) formed on the conductor layer L2, and between the magnetic body portion M and the Y-direction end faces thereof.

[0092] The conductor layer L3 is covered in the XY plane by the insulating portion 1314. In other words, the insulating portion 1314 is disposed between the magnetic body portion M and the X-direction end faces of the conductor patterns (terminal patterns 1415, 1416) formed on the conductor layer L3, and between the magnetic body portion M and the Y-direction end faces thereof.

[0093] The conductor pattern formed on the conductor layer L1 is covered by an insulating portion 1315 from the -Z direction. An insulating portion 1316 exists between the conductor layer L1 and the conductor layer L2. An insulating portion 1317 exists between the conductor layer L2 and the conductor layer L3. The conductor pattern formed on the conductor layer L3 is covered by an insulating portion 1318 from the +Z direction.

[0094] In this embodiment, the thickness of the insulating portion 1314 in the XY plane is also greater than the thicknesses of the insulating portions 1312 and 1313 in the XY plane. This allows the insulating portion 1314 to function as a buffer against external forces acting on the terminal patterns 1415 and 1416 in the Y direction.

[0095] As exemplified by the electronic component 300 according to the third embodiment, the coil pattern included in the coil portion does not need to be linear and may be loop-shaped. In addition, in this embodiment, the coil patterns C21 and C22 formed on the two conductor layers L1 and L2 are connected in series, which makes it possible to obtain a larger inductance.

[0096] The configurations of the various modifications of the electronic component 100 described in the first embodiment are applicable to the electronic component 300 according to the second embodiment.

[0097] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0098] For example, in each of the aspects described above, the end faces (XZ end faces) of the via conductors (e.g., via conductors 151 to 159, 1510 to 1512) that connect the terminal patterns in the Z direction are exposed from the main surfaces (101, 102) of the magnetic body part M, but the technology disclosed herein is not limited to this. In other words, the end faces of the via conductors may be formed so as not to be exposed from the main surfaces of the magnetic body part M.

[0099] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0100] An electronic component according to one aspect of the present disclosure includes a magnetic body portion having first and second main surfaces located opposite to each other in a first direction, a coil portion embedded in the magnetic body portion and having a first terminal electrode exposed on the first main surface and a second terminal electrode exposed on the second main surface, and an interlayer insulating film located between the coil portion and the magnetic body portion, wherein the coil portion includes first and second conductor layers stacked in a second direction perpendicular to the first direction, and the first conductor layer has an end face exposed on the first main surface and a first end constituting a first exposed portion of the first terminal electrode. the second conductor layer includes a third terminal pattern whose end face is exposed on the first main surface and which constitutes the second exposed portion of the first terminal electrode, and a fourth terminal pattern whose end face is exposed on the second main surface and which constitutes the second exposed portion of the second terminal electrode, and the first terminal pattern and the third terminal pattern are connected to the first the second terminal pattern and the fourth terminal pattern are connected to each other through the via conductor, and the interlayer insulating film includes a first insulating portion disposed between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions, and a second insulating portion covering the second conductor layer from at least the first and third directions, and a thickness in the first direction of a first portion of the second insulating portion covering the third terminal pattern from the first direction and a thickness in the second direction of a second portion covering the third terminal pattern from the third direction are At least one of the thickness in the third direction of the fourth portion of the second insulating portion that covers the fourth terminal pattern from the first direction and the thickness in the third direction of the fifth portion of the second insulating portion that covers the fourth terminal pattern from the third direction is thicker than the thickness in the third direction of the sixth portion of the first insulating portion that covers the second terminal pattern from the third direction. This makes it possible to increase the areas of the first and second terminal electrodes and improve product reliability.

[0101] In the electronic component, the thickness of the second conductor layer in the second direction may be greater than the thickness of the first conductor layer in the second direction, thereby enabling the areas of the first and second terminal electrodes to be further increased.

[0102] In the electronic component, both the thickness of the first portion in the first direction and the thickness of the second portion in the third direction may be greater than the thickness of the third portion in the third direction, thereby further improving the reliability of the product.

[0103] In the electronic component, the thickness of the first portion in the first direction may be equal to the thickness of the second portion in the third direction, which makes it easier to fabricate the second insulating portion.

[0104] In the electronic component, the thickness of the first portion in the first direction may be equal to the thickness of the fourth portion in the first direction, which makes it easier to fabricate the second insulating portion.

[0105] In the electronic component, the thickness of the second portion in the third direction may be equal to the thickness of the fifth portion in the third direction, which makes it easier to fabricate the second insulating portion.

[0106] In the electronic component, the end faces of the first via conductors may be exposed on the first principal surface, and the end faces of the second via conductors may be exposed on the second principal surface, thereby enabling the areas of the first and second terminal electrodes to be further increased.

[0107] In the electronic component, one end of the first coil pattern may be connected to the first terminal pattern in the first conductor layer, and the other end of the first coil pattern may be connected to the second terminal pattern in the first conductor layer, which allows the first coil pattern to have, for example, a linear shape.

[0108] In the electronic component, the third terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the second conductor layer, whereby the third terminal pattern functions as an auxiliary pattern.

[0109] In the electronic component, the fourth terminal pattern may be provided independently without being connected to other conductor patterns within the plane of the second conductor layer, whereby the fourth terminal pattern functions as an auxiliary pattern.

[0110] In the electronic component, the second conductor layer may be formed only of the third terminal pattern and the fourth terminal pattern, with the third and fourth terminal patterns functioning as auxiliary patterns.

[0111] In the electronic component described above, the coil portion further includes a third conductor layer, the second conductor layer is located between the first conductor layer and the third conductor layer in the second direction, the third conductor layer includes a fifth terminal pattern having an end surface exposed on the first main surface and a sixth terminal pattern having an end surface exposed on the second main surface, the third terminal pattern and the fifth terminal pattern are connected to each other via a third via conductor having an end surface exposed on the first main surface, and the fourth terminal pattern and the sixth terminal pattern are connected to each other via a fourth via conductor having an end surface exposed on the second main surface, and the interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the first and third directions, and the third conductor The thickness of the seventh insulating layer in the second direction is greater than the thickness of the first conductor layer in the second direction, and at least one of the thickness in the first direction of a seventh portion of the third insulating portion covering the fifth terminal pattern from the first direction and the thickness in the third direction of an eighth portion of the third insulating portion covering the fifth terminal pattern from the third direction may be greater than the thickness of the third portion in the third direction, and at least one of the thickness in the first direction of a ninth portion of the third insulating portion covering the sixth terminal pattern from the first direction and the thickness in the third direction of a tenth portion of the third insulating portion covering the sixth terminal pattern from the third direction may be greater than the thickness in the third direction of the sixth portion. This allows the areas of the first and second terminal electrodes to be further increased. In this case, the second conductor layer may be composed only of the third and fourth terminal patterns, and the third conductor layer may be composed only of the fifth and sixth terminal patterns. This allows the third to sixth terminal patterns to function as auxiliary patterns.

[0112] In this case, both the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction may be greater than the thickness of the third portion in the third direction. This further improves product reliability. Furthermore, in this case, the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction may be equal. This makes it easier to fabricate the third insulating portion. Furthermore, the thickness of the third conductor layer in the second direction may be greater than the thickness of the second conductor layer in the second direction. This makes it possible to further increase the areas of the first and second terminal electrodes.

[0113] In the electronic component described above, the coil portion further includes a third conductor layer, the first conductor layer is located between the second conductor layer and the third conductor layer in the second direction, the third conductor layer includes a fifth terminal pattern having an end surface exposed on the first main surface and a sixth terminal pattern having an end surface exposed on the second main surface, the first terminal pattern and the fifth terminal pattern are connected to each other via a third via conductor having an end surface exposed on the first main surface, and the second terminal pattern and the sixth terminal pattern are connected to each other via a fourth via conductor having an end surface exposed on the second main surface, and the interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the first and third directions, and the third conductor The thickness of the seventh insulating layer in the second direction is greater than the thickness of the first conductor layer in the second direction, and at least one of the thickness in the first direction of a seventh portion of the third insulating portion covering the fifth terminal pattern from the first direction and the thickness in the third direction of an eighth portion of the third insulating portion covering the fifth terminal pattern from the third direction may be greater than the thickness of the third portion in the third direction, and at least one of the thickness in the first direction of a ninth portion of the third insulating portion covering the sixth terminal pattern from the first direction and the thickness in the third direction of a tenth portion of the third insulating portion covering the sixth terminal pattern from the third direction may be greater than the thickness in the third direction of the sixth portion. This allows the areas of the first and second terminal electrodes to be further increased. In this case, the second conductor layer may be composed only of the third and fourth terminal patterns, and the third conductor layer may be composed only of the fifth and sixth terminal patterns. This allows the third to sixth terminal patterns to function as auxiliary patterns.

[0114] In this case, both the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction may be greater than the thickness of the third portion in the third direction. This further improves product reliability. Furthermore, in this case, the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction may be equal. This makes it easier to fabricate the third insulating portion.

[0115] In the above electronic component, the coil portion further includes a third conductor layer, the first conductor layer is located between the second conductor layer and the third conductor layer in the second direction, the third conductor layer includes a fifth terminal pattern having an end surface exposed on the first main surface, a sixth terminal pattern having an end surface exposed on the second main surface, and a second coil pattern having one end connected to the first terminal electrode and the other end connected to the second terminal electrode, the first terminal pattern and the fifth terminal pattern are connected to each other through a third via conductor having an end surface exposed on the first main surface, and the second terminal pattern and the sixth terminal pattern are connected to each other through a fourth via conductor having an end surface exposed on the second main surface, and the interlayer insulating film is The third insulating portion may further include a third insulating portion covering the third conductor layer at least from a third direction, wherein the thickness of the second conductor layer in the second direction is greater than the thickness of the third conductor layer in the second direction, at least one of the thickness of the first portion in the first direction and the thickness of the second portion in the third direction is greater than the thickness of a seventh portion of the third insulating portion covering the fifth terminal pattern in the third direction, and at least one of the thickness of the fourth portion in the first direction and the thickness of the fifth portion in the third direction is greater than the thickness of an eighth portion of the third insulating portion covering the sixth terminal pattern in the third direction. This increases the design freedom of the coil portion. In this case, both the thickness of the first portion in the first direction and the thickness of the second portion in the third direction may be greater than the thickness of the seventh portion in the third direction. This further improves product reliability.

[0116] In this case, one end of the first coil pattern may be connected to the first terminal pattern in the first conductor layer, the other end of the first coil pattern may be connected to the second terminal pattern in the first conductor layer, one end of the second coil pattern may be connected to the fifth terminal pattern in the third conductor layer, and the other end of the second coil pattern may be connected to the sixth terminal pattern in the third conductor layer. This can further reduce the DC resistance of the coil section. Alternatively, one end of the first coil pattern may be connected to the first terminal pattern in the first conductor layer, the other end of the first coil pattern may be connected to the other end of the second terminal pattern, and one end of the second coil pattern may be connected to the fifth terminal pattern in the third conductor layer. This can further increase the inductance of the coil section.

[0117] In the electronic component, a plurality of coils arranged in a third direction may be embedded in the magnetic body, thereby providing a so-called coil array.

[0118] In the electronic component, the width of the third terminal pattern in the third direction may be smaller than the width of the first terminal pattern in the third direction, thereby further improving the reliability of the product.

[0119] According to one aspect of the present disclosure, a component-embedded substrate includes the electronic component embedded therein, and includes a first wiring pattern, a second wiring pattern, a first substrate via conductor connecting the first wiring pattern and the first terminal electrode, and a second substrate via conductor connecting the second wiring pattern and the second terminal electrode. This ensures a sufficient contact area between the first terminal electrode and the first substrate via conductor, and also ensures a sufficient contact area between the second terminal electrode and the second substrate via conductor.

[0120] This application claims the benefit of Japanese Patent Application No. 2024-011756, filed on January 30, 2024, the entire disclosure of which is incorporated herein by reference.

[0121] 10 Component-embedded substrate 11 to 15 Insulating layer 20 to 22 Wiring pattern 31, 32 Substrate via conductor 100, 200, 300 Electronic component 101, 102 Main surface 103 to 106 Side surface 111 to 114 Coil portion 121, 122 Terminal electrode 130 Interlayer insulating film 131 to 139, 1310 to 1318 Insulating portion 141 to 149, 1410 to 1416 Terminal pattern 151 to 159, 1510 to 1512, 161 Via conductor A1 to A5, B1 to B3 Exposed portion C11, C12, C21, C22 Coil pattern L0 to L3 Conductor layer M Magnetic base portion

Claims

1. A magnetic element having first and second main surfaces located on opposite sides in a first direction; a coil portion embedded in the magnetic element, the first terminal electrode being exposed on the first main surface and the second terminal electrode being exposed on the second main surface; and an interlayer insulating film located between the coil portion and the magnetic element, wherein the coil portion includes first and second conductor layers stacked in a second direction perpendicular to the first direction, the first conductor layer including: a first terminal pattern having an end surface exposed on the first main surface and constituting the first exposed portion of the first terminal electrode; a second terminal pattern having an end surface exposed on the second main surface and constituting the first exposed portion of the second terminal electrode; and a first coil pattern having one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode; the second conductor layer including: a third terminal pattern having an end surface exposed on the first main surface and constituting the second exposed portion of the first terminal electrode; and a fourth terminal pattern having an end surface exposed on the second main surface and constituting the second exposed portion of the second terminal electrode. the first terminal pattern and the third terminal pattern are connected to each other via a first via conductor, the second terminal pattern and the fourth terminal pattern are connected to each other via a second via conductor, the interlayer insulating film includes a first insulating portion arranged between the first conductor layer and the magnetic body portion in a third direction orthogonal to the first and second directions, and a second insulating portion covering the second conductor layer from at least the first and third directions, and at least one of a thickness in the first direction of a first portion of the second insulating portion covering the third terminal pattern from the first direction and a thickness in the third direction of a second portion of the second insulating portion covering the third terminal pattern from the third direction is thicker than a thickness in the third direction of a third portion of the first insulating portion covering the first terminal pattern from the third direction, an electronic component, wherein at least one of a thickness in the first direction of a fourth portion of the second insulating portion that covers the fourth terminal pattern from the first direction and a thickness in the third direction of a fifth portion of the second insulating portion that covers the fourth terminal pattern from the third direction is thicker than a thickness in the third direction of a sixth portion of the first insulating portion that covers the second terminal pattern from the third direction.

2. The electronic component according to claim 1, wherein the thickness of the second conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction.

3. The electronic component according to claim 1, wherein both the thickness of the first portion in the first direction and the thickness of the second portion in the third direction are greater than the thickness of the third portion in the third direction.

4. The electronic component according to claim 3, wherein the thickness of the first portion in the first direction is equal to the thickness of the second portion in the third direction.

5. The electronic component according to claim 1, wherein the thickness of the first portion in the first direction is equal to the thickness of the fourth portion in the first direction.

6. The electronic component according to claim 1, wherein the thickness of the second portion in the third direction is equal to the thickness of the fifth portion in the third direction.

7. The electronic component according to claim 1, wherein an end face of the first via conductor is exposed on the first principal surface, and an end face of the second via conductor is exposed on the second principal surface.

8. The electronic component according to claim 1, wherein the one end of the first coil pattern is connected to the first terminal pattern within the first conductor layer, and the other end of the first coil pattern is connected to the second terminal pattern within the first conductor layer.

9. The electronic component according to claim 8, wherein the third terminal pattern is provided independently without being connected to other conductor patterns within the surface of the second conductor layer.

10. The electronic component according to claim 9, wherein the fourth terminal pattern is provided independently without being connected to other conductor patterns within the surface of the second conductor layer.

11. The electronic component according to claim 10, wherein the second conductor layer consists of only the third terminal pattern and the fourth terminal pattern.

12. The coil portion further includes a third conductor layer, the second conductor layer being located between the first conductor layer and the third conductor layer in the second direction, the third conductor layer including a fifth terminal pattern having an end surface exposed on the first main surface and a sixth terminal pattern having an end surface exposed on the second main surface, the third terminal pattern and the fifth terminal pattern being connected to each other via a third via conductor having an end surface exposed on the first main surface, the fourth terminal pattern and the sixth terminal pattern being connected to each other via a fourth via conductor having an end surface exposed on the second main surface, the interlayer insulating film further including a third insulating portion covering the third conductor layer from at least the first and third directions, the thickness of the third conductor layer in the second direction being thicker than the thickness of the first conductor layer in the second direction, 2. The electronic component according to claim 1, wherein at least one of a thickness in the first direction of a seventh portion of the third insulating portion that covers the fifth terminal pattern from the first direction and a thickness in the third direction of an eighth portion of the third insulating portion that covers the fifth terminal pattern from the third direction is thicker than a thickness of the third portion in the third direction; and wherein at least one of a thickness in the first direction of a ninth portion of the third insulating portion that covers the sixth terminal pattern from the first direction and a thickness in the third direction of a tenth portion of the third insulating portion that covers the sixth terminal pattern from the third direction is thicker than a thickness of the sixth portion in the third direction.

13. The electronic component according to claim 12, wherein the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction are both greater than the thickness of the third portion in the third direction.

14. The electronic component according to claim 13, wherein the thickness of the seventh portion in the first direction is equal to the thickness of the eighth portion in the third direction.

15. The electronic component according to claim 12, wherein the second conductor layer consists only of the third terminal pattern and the fourth terminal pattern, and the third conductor layer consists only of the fifth terminal pattern and the sixth terminal pattern.

16. The electronic component according to claim 12, wherein the thickness of the third conductor layer in the second direction is greater than the thickness of the second conductor layer in the second direction.

17. The coil portion further includes a third conductor layer, the first conductor layer is located between the second conductor layer and the third conductor layer in the second direction, the third conductor layer includes a fifth terminal pattern having an end surface exposed on the first main surface and a sixth terminal pattern having an end surface exposed on the second main surface, the first terminal pattern and the fifth terminal pattern are connected to each other through a third via conductor having an end surface exposed on the first main surface, and the second terminal pattern and the sixth terminal pattern are connected to each other through a fourth via conductor having an end surface exposed on the second main surface, the interlayer insulating film further includes a third insulating portion covering the third conductor layer from at least the first and third directions, the thickness of the third conductor layer in the second direction is thicker than the thickness of the first conductor layer in the second direction, 2. The electronic component according to claim 1, wherein at least one of a thickness in the first direction of a seventh portion of the third insulating portion that covers the fifth terminal pattern from the first direction and a thickness in the third direction of an eighth portion of the third insulating portion that covers the fifth terminal pattern from the third direction is thicker than a thickness of the third portion in the third direction; and wherein at least one of a thickness in the first direction of a ninth portion of the third insulating portion that covers the sixth terminal pattern from the first direction and a thickness in the third direction of a tenth portion of the third insulating portion that covers the sixth terminal pattern from the third direction is thicker than a thickness of the sixth portion in the third direction.

18. The electronic component according to claim 17, wherein the thickness of the seventh portion in the first direction and the thickness of the eighth portion in the third direction are both greater than the thickness of the third portion in the third direction.

19. The electronic component according to claim 18, wherein the thickness of the seventh portion in the first direction is equal to the thickness of the eighth portion in the third direction.

20. The electronic component according to claim 17, wherein the second conductor layer consists only of the third terminal pattern and the fourth terminal pattern, and the third conductor layer consists only of the fifth terminal pattern and the sixth terminal pattern.

21. The coil portion further includes a third conductor layer, the first conductor layer being located between the second conductor layer and the third conductor layer in the second direction, the third conductor layer including a fifth terminal pattern having an end surface exposed on the first main surface, a sixth terminal pattern having an end surface exposed on the second main surface, and a second coil pattern having one end electrically connected to the first terminal electrode and the other end electrically connected to the second terminal electrode, the first terminal pattern and the fifth terminal pattern being connected to each other through a third via conductor having an end surface exposed on the first main surface, and the second terminal pattern and the sixth terminal pattern being connected to each other through a fourth via conductor having an end surface exposed on the second main surface, the interlayer insulating film further including a third insulating portion covering the third conductor layer at least from the third direction, the thickness of the second conductor layer in the second direction being thicker than the thickness of the third conductor layer in the second direction, 2. The electronic component according to claim 1, wherein at least one of a thickness of the first portion in the first direction and a thickness of the second portion in the third direction is thicker than a thickness of a seventh portion of the third insulating portion that covers the fifth terminal pattern from the third direction, and at least one of a thickness of the fourth portion in the first direction and a thickness of the fifth portion in the third direction is thicker than a thickness of an eighth portion of the third insulating portion that covers the sixth terminal pattern from the third direction.

22. The electronic component according to claim 21, wherein both the thickness of the first portion in the first direction and the thickness of the second portion in the third direction are greater than the thickness of the seventh portion in the third direction.

23. The electronic component according to claim 21, wherein one end of the first coil pattern is connected to the first terminal pattern in the first conductor layer, the other end of the first coil pattern is connected to the second terminal pattern in the first conductor layer, one end of the second coil pattern is connected to the fifth terminal pattern in the third conductor layer, and the other end of the second coil pattern is connected to the sixth terminal pattern in the third conductor layer.

24. The electronic component according to claim 21, wherein the one end of the first coil pattern is connected to the first terminal pattern in the first conductor layer, the other end of the first coil pattern is connected to the other end of the second terminal pattern, and the one end of the second coil pattern is connected to the fifth terminal pattern in the third conductor layer.

25. The electronic component according to claim 1, wherein a plurality of the coil portions arranged in the third direction are embedded in the magnetic base portion.

26. The electronic component according to claim 1, wherein the width of the third terminal pattern in the third direction is smaller than the width of the first terminal pattern in the third direction.

27. A component-embedded substrate having an electronic component according to any one of claims 1 to 26 embedded therein, comprising: a first wiring pattern; a second wiring pattern; a first substrate via conductor connecting the first wiring pattern and the first terminal electrode; and a second substrate via conductor connecting the second wiring pattern and the second terminal electrode.

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