Battery and electronic device comprising same

Abstract

A battery according to the present invention comprises: an electrode; an electrode tab extending from the electrode; and a lead tab including a first material and coupled to the electrode tab. The electrode tab includes: a first portion including a coupling surface that is coupled to the lead tab and including the first material; and a second portion spaced apart from the lead tab and including a first layer including the first material, a second layer including the first material, and a third layer interposed between the first layer and the second layer and including a second material different from the first material.

Description

Batteries and electronic devices containing them

[0001] The present disclosure relates to a battery and an electronic device including the same.

[0002] An electronic device may include various electronic components. The electronic device may include a battery for providing power to the electronic components. The battery may include a separator positioned between a positive electrode and a negative electrode. An electrode tab extending from the electrode may be coupled to a lead tab. Power provided from the battery may be provided to the outside of the battery through the lead tab.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] A battery is provided. The battery may include an electrode. The battery may include an electrode tab extending from the electrode. The battery may include a lead tab coupled to the electrode tab. The electrode tab may be formed from a first material. The electrode tab may include a coupling surface coupled to the lead tab and a first portion formed of the first material. The electrode tab may include a second portion comprising a first layer, a second layer, and a third layer. The first layer may be spaced apart from the lead tab. The first layer may be formed of the first material. The second layer may be formed of the first material. The third layer may be interposed between the first layer and the second layer. The third layer may be formed of a second material different from the first material.

[0005] A battery is provided. The battery may include an electrode. The battery may include an electrode tab extending from the electrode. The electrode tab may include a first layer comprising the first material, a second layer comprising the first material, and a second material different from the first material. The battery may include a third layer interposed between the first layer and the second layer. The battery may include a lead tab comprising the first material and coupled to the electrode tab. The electrode tab may include a first portion comprising a coupling surface coupled to the lead tab and a second portion spaced from the lead tab and thinner than the first portion. A thickness of the third layer included in the first portion may be thinner than a thickness of the third layer included in the second portion.

[0006] An electronic device is provided. The electronic device may include an electronic component. The electronic device may include a battery for providing power for the operation of the electronic component. The battery may include an electrode. The battery may include an electrode tab extending from the electrode. The battery may include a lead tab coupled to the electrode tab. The electrode tab may be formed from a first material. The electrode tab may include a coupling surface coupled to the lead tab and a first portion formed of the first material. The electrode tab may include a second portion comprising a first layer, a second layer, and a third layer. The first layer may be spaced apart from the lead tab. The first layer may be formed of the first material. The second layer may be formed of the first material. The third layer may be interposed between the first layer and the second layer. The third layer may be formed of a second material different from the first material.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2 is a block diagram of a power management module and a battery according to one embodiment.

[0009] FIG. 3A is a perspective view of a battery according to one embodiment.

[0010] Figure 3b is an exploded perspective view of the battery of Figure 3a.

[0011] Figure 3c is a cross-sectional view of the battery of Figure 3a taken along line A-A'.

[0012] Fig. 4 is an enlarged view of the X portion of the battery in Fig. 3c.

[0013] FIG. 5 is a flowchart illustrating a process for manufacturing an electrode tab of a battery according to one embodiment.

[0014] FIG. 6A is a drawing illustrating a process for manufacturing an electrode tab of a battery according to one embodiment.

[0015] Figure 6b is a drawing illustrating a process for manufacturing an electrode tab of a battery according to a comparative example.

[0016] FIG. 7A illustrates an example of an electrode tab of a battery according to one embodiment.

[0017] Figure 7b is a drawing illustrating a manufacturing process of the electrode tab of Figure 7a.

[0018] FIG. 8A is a drawing illustrating an electrode tab of a battery according to one embodiment.

[0019] Figure 8b is a drawing illustrating a process for manufacturing the electrode tab of Figure 8a.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2 is a block diagram of a power management module and a battery according to one embodiment.

[0044] Referring to FIG. 2, the power management module (188) may include a charging circuit (210), a power regulator (220), or a power gauge (230). The charging circuit (210) may charge the battery (189) using power supplied from an external power source for the electronic device (101). According to one embodiment, the charging circuit (210) may select a charging method (e.g., normal charging or rapid charging) based on at least some of the type of the external power source (e.g., power adapter, USB, or wireless charging), the amount of power that can be supplied from the external power source (e.g., about 20 watts or more), or the properties of the battery (189), and may charge the battery (189) using the selected charging method. The external power source may be connected to the electronic device (101) by a wire, for example, through a connection terminal (178), or may be connected wirelessly through an antenna module (197).

[0045] The power regulator (220) can generate a plurality of powers having different voltages or different current levels by adjusting the voltage level or current level of the power supplied from, for example, an external power source or a battery (189). The power regulator (220) can adjust the power of the external power source or the battery (189) to a voltage or current level suitable for each of the components included in the electronic device (101). According to one embodiment, the power regulator (220) can be implemented in the form of an LDO (low drop out) regulator or a switching regulator. The power gauge (230) can measure usage status information for the battery (189) (e.g., capacity, number of charge / discharge cycles, voltage, or temperature of the battery (189).

[0046] The power management module (188) can determine charging state information (e.g., lifespan, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheat, short circuit, or swelling) related to charging of the battery (189) based at least in part on the measured usage state information, for example, using the charging circuit (210), the voltage regulator (220), or the power gauge (230). The power management module (188) can determine whether the battery (189) is normal or abnormal based at least in part on the determined charging state information. If the state of the battery (189) is determined to be abnormal, the power management module (188) can adjust charging of the battery (189) (e.g., reducing the charging current or voltage, or stopping charging). According to one embodiment, at least some of the functions of the power management module (188) can be performed by an external control device (e.g., the processor (120)).

[0047] The battery (189) may, according to one embodiment, include a battery protection circuit module (PCM) (240). The battery protection circuit (240) may perform one or more of various functions (e.g., a pre-cut function) to prevent performance degradation or damage to the battery (189). The battery protection circuit (240) may additionally or alternatively be configured as at least a part of a battery management system (BMS) that may perform various functions including cell balancing, capacity measurement of the battery, charge / discharge cycle measurement, temperature measurement, or voltage measurement.

[0048] According to one embodiment, at least a portion of the usage status information or the charging status information of the battery (189) may be measured using a corresponding sensor (e.g., a temperature sensor) among the sensor modules (276), a power gauge (230), or a power management module (188). According to one embodiment, the corresponding sensor (e.g., a temperature sensor) among the sensor modules (176) may be included as part of the battery protection circuit (240), or may be placed near the battery (189) as a separate device.

[0049] According to an embodiment, the electronic device (101) may include a battery (e.g., battery (300) of FIG. 3A). The battery (300) may be referred to as the battery (189) described above. For example, the battery (300) may be a lithium ion battery, which may be a rechargeable secondary battery. The lithium ion battery may include a case (e.g., case (340) of FIG. 3A) forming an exterior, and a positive electrode (e.g., positive electrode (311) of FIG. 3B), a negative electrode (e.g., negative electrode (312) of FIG. 3B), a separator (e.g., separator (350) of FIG. 3B), and an electrolyte included within the case (340). The battery (300) may include a lead tab (e.g., lead tab (330) of FIG. 3A) for electrical connection with an electronic component. For example, the lead tab (330) can be coupled to an electrode tab (e.g., the electrode tab (320) of FIG. 3C) extending from an electrode (310) (e.g., the positive electrode (311) and the negative electrode (312)) and can be electrically connected to an electronic component. For example, the lead tab (330) can be electrically connected to an electric circuit, such as a protection circuit module (PCM) of the battery (300). Power stored in the battery (300) can be provided to the outside through the lead tab (330) (discharging), and power provided from the outside to charge the battery (300) can be provided to the battery (300) through the lead tab (330) (charging). Since the lead tab (330) provides an electrical connection between the electronic components located on the upper portion of the battery (300) and the battery (300) and provides a power transmission path, it may be required that the lead tab (330) be stably coupled to the electrode tab (320). For example, if the bonding tensile strength of the lead tab (330) and the electrode tab (320) is weak, a leakage current may occur during charging and / or discharging of the battery (300), thereby deteriorating the quality of the battery (300) and causing a safety accident.

[0050] A battery (300) according to one embodiment may have a structure capable of providing a stable connection between a lead tab (330) and an electrode tab (320). Hereinafter, the battery (300) according to one embodiment is described as a lithium ion battery, but is not limited thereto.

[0051] Fig. 3a is a perspective view of a battery according to one embodiment. Fig. 3b is an exploded perspective view of the battery of Fig. 3a. Fig. 3c is a cross-sectional view of the battery of Fig. 3a taken along line A-A'.

[0052] Referring to FIG. 3A, a battery (300) according to one embodiment may include a case (340). The case (340) may form an exterior of the battery (300). Components of the battery (300) (e.g., the positive electrode (311), the negative electrode (312), the separator (350), and the electrolyte of FIG. 3B) may be accommodated within the case (340). The case (340) may protect the components accommodated therein. The case (340) may include a pouch-type case or a cylindrical-type case. The case (340) illustrated in FIG. 3A is illustrated as a pouch-type case, but is not limited thereto.

[0053] According to one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) may include electronic components (e.g., a processor (e.g., a processor (120) of FIG. 1), an audio module (e.g., an audio module (170) of FIG. 1), a camera module (e.g., a camera module (180) of FIG. 1), and / or an antenna module (e.g., an antenna module (197) of FIG. 1)) for implementing various functions. A battery (300) of the electronic device (101) may be configured to provide power for the operation of the electronic components. The electronic device (101) may include a power management integrated circuit (PMIC) to manage power provided from the battery (300) to the electronic components. The PMIC may be configured to convert power provided from the battery (300) into power required by each of the electronic components and distribute the converted power to each of the electronic components.

[0054] According to one embodiment, the battery (300) may include a lead tab (330). The lead tab (330) may provide an electrical connection between an electrode (310) disposed within a case (340) and an electronic component outside the battery (300). For example, power provided from the battery (300) to each of the electronic components may be provided through the lead tab (330). For example, power provided from a charging device to the battery (300) may be provided to the battery (300) through the lead tab (330). The lead tab (330) may be coupled to an electrode tab of an electrode (310) disposed within the case (340) (e.g., an electrode tab (320) of FIG. 3B ). The lead tab (330) may include a first lead tab (331) that contacts a first electrode tab (e.g., the first electrode tab (321) of FIG. 3B) and a second lead tab (332) that contacts a second electrode tab (e.g., the second electrode tab (322) of FIG. 3B). A portion of the lead tab (330) may be exposed to the outside of the case (340). A portion of the lead tab (330) that extends from the inside of the case (340) to the outside of the case (340) may be exposed to a side surface of the case (340). In order to seal the case (340) to which the lead tab (330) is exposed, a terrace seal (341) that includes an insulating material may be formed on the side surface of the case (340).

[0055] Referring to FIG. 3B, components of a battery (300) may be arranged inside a case (340). For example, a positive electrode (311), a negative electrode (312), a separator (350), and an electrolyte may be arranged inside the case (340). The battery (300) illustrated in FIG. 3B may be a stack-type battery in which positive electrodes (311) and negative electrodes (312) are alternately laminated, but is not limited thereto. Each of the positive electrode (311) and the negative electrode (312) may also be referred to as a cathode and an anode, respectively, based on the discharge of the battery (300).

[0056] According to one embodiment, the electrode (310) may include a cathode (312) and a cathode (311) having electrically opposite characteristics. The electrode (310) may include an electrode substrate and an electrode active material layer coated on the electrode substrate. For example, the cathode (312) may include an anode substrate and an anode active material layer coated on the anode substrate. The anode substrate may collect electrons generated in the anode active material layer according to an electrochemical reaction of the battery (300) or provide electrons required for the electrochemical reaction to the anode active material layer. For example, the anode substrate may be electrically connected to an external circuit, and may provide electrons generated in the anode active material layer to the external circuit during discharge, or may provide electrons supplied through the external circuit to the anode active material layer during charge. For example, the anode substrate may include a second metal. For example, the second metal may include copper. The cathode substrate may be implemented in the form of a copper foil, but is not limited thereto.

[0057] In one embodiment, the negative electrode active material layer can generate or consume electrons based on an electrochemical reaction. For example, during charging, electrons transferred from the negative electrode substrate can be combined with lithium ions in the negative electrode active material layer and consumed. During discharge, electrons can be generated as lithium ions and electrons separate from the negative electrode active material layer.

[0058] According to one embodiment, the negative electrode active material layer may include a negative electrode active material involved in the electrochemical reaction of the above-described negative electrode (312), a conductive material for improving electrical conductivity within the negative electrode (312), and a binder for easily attaching the negative electrode active material layer to the negative electrode substrate. In one embodiment, the negative electrode active material may include, but is not limited to, graphite, lithium titanate (LTO), silicon (Si), germanium (Ge), tin (Sn), or lithium oxide (Li2O). For example, a polymer material such as polyvinylidene fluoride (PVDF), polyacrylic acid (PAA), styrene-butadiene rubber (SBR), and carboxymethylcellulose (CMC) may be used as the binder of the negative electrode active material layer.

[0059] According to one embodiment, a separator (350) may be interposed between the negative electrode (312) and the positive electrode (311). The separator (350) may provide a passage for lithium ions to pass through and may prevent physical contact (or direct electrical short circuit) between the positive electrode (311) and the negative electrode (312).

[0060] According to one embodiment, the positive electrode (311) may include a positive electrode substrate and a positive electrode active material layer. For example, the positive electrode substrate may be connected to the external circuit to supply electrons generated during a charging or discharging process to the outside or inside of the positive electrode active material layer. For example, the positive electrode substrate may be electrically connected to the external circuit to provide electrons generated in the positive electrode active material layer to the external circuit during charging, or to provide electrons supplied through the external circuit to the positive electrode active material layer during discharging. For example, the positive electrode substrate may include a first metal. For example, the first metal may include aluminum. The positive electrode substrate may be implemented in the form of an aluminum foil, but is not limited thereto.

[0061] In one embodiment, the positive electrode active material layer can generate or consume electrons according to an electrochemical reaction of the battery (300). For example, when charging, electrons may be generated as lithium compounds are ionized in the positive electrode active material layer, and when discharging the battery (300), electrons supplied through the external circuit may be combined with lithium ions in the positive electrode active material layer and consumed.

[0062] According to one embodiment, the positive electrode active material layer may include a positive electrode active material involved in the electrochemical reaction of the positive electrode (311) described above, a conductive material for improving electrical conductivity within the positive electrode (311), and a binder for easily attaching the positive electrode active material layer to the positive electrode substrate. For example, the positive electrode active material may include, but is not limited to, LiCoO2, LiNiCoMnO2, LiNiCoAlO2, LiTiS2, LiCoO2, LiNiO2, LiMnO2, LiMn2O4, LiCo2O4, LiFePO4, LiMnPO4, LiCoPO4, LiFeSO4F, or LiVPO4F. According to one embodiment, a polymer material such as polyvinylidene fluoride (PVDF) may be used as the binder of the positive electrode active material layer.

[0063] According to one embodiment, the electrolyte may provide a path through which lithium ions can move between the negative electrode (312) and the positive electrode (311). For example, the electrolyte may include a liquid electrolyte or a gel electrolyte. For example, when the battery (300) is charged, lithium ions may be deintercalated from the positive electrode active material layer and may move to the negative electrode active material layer through the electrolyte and the separator (350). The lithium ions that have moved to the negative electrode active material layer may be intercalated into the negative electrode active material layer as a reduction reaction occurs. Electrons generated during the deintercalation of lithium ions may move to the negative electrode active material layer through the external circuit. For example, when the battery (300) is discharged, lithium ions inserted into the negative electrode active material layer are deintercalated and ionized into the electrolyte, and the ionized lithium ions may move to the positive electrode active material layer through the electrolyte and the separator (350). Electrons generated in the negative active material layer by the desorption of lithium ions can move to the positive active material layer through the external circuit. Lithium ions can be inserted into the positive active material layer by combining with electrons to cause a reduction reaction. When the battery (300) is discharged, electrons passing through the external circuit can perform work.

[0064] According to one embodiment, the electrode (310) may include an electrode tab (320). For example, the electrode tab (320) may include a first electrode tab (321) extending from the anode (311) and a second electrode tab (322) extending from the cathode (312). The first electrode tab (321) may be referred to as an anode (311) tab, and the second electrode tab (322) may be referred to as a cathode (312) tab.

[0065] Referring to FIG. 3C, the battery (300) may include a lead tab (330) connected to an electrode (310). The lead tab (330) may extend through a terrace seal (341) of the case (340) to be exposed to the outside of the case (340). The lead tab (330) may be electrically connected to an external circuit, or may be electrically connected to another battery to form a battery module or a battery pack. As described above, the lead tab (330) may include a conductive material so that power may be transmitted through the lead tab (330). For example, the lead tab (330) may include a metal. A portion of the lead tab (330) may be exposed to the outside of the case (340), and an electrode tab (320) extending from the electrode (310) may extend toward another portion of the lead tab (330) located within the case (340). The electrode tab (320) may be at least partially bent so as to be coupled with the lead tab (330).

[0066] According to one embodiment, the electrode (310) may include an electrode tab (320). The electrode tab (320) may extend from the electrode (310) and be coupled to a lead tab (330). When the battery (300) is discharged, power provided from the electrode (310) may be transmitted to the lead tab (330) through the electrode tab (320) and may be provided to an external circuit electrically connected to the lead tab (330) through the lead tab (330). When the battery (300) is charged, power provided from a charging device may be transmitted to the electrode tab (320) through the lead tab (330) and may be transmitted to the electrode (310) through the electrode tab (320).

[0067] According to one embodiment, the methods of joining the lead tab (330) and the electrode tab (320) may vary. For example, a method of welding the lead tab (330) to the electrode tab (320) using ultrasonic waves may be used. Alternatively, a method of welding the lead tab (330) to the electrode tab (320) using a laser may be used. Alternatively, a method of adding a separate substrate and welding the lead tab (330) in advance in the electrode process for manufacturing the electrode (310) may be used.

[0068] Referring to FIG. 3C, when a plurality of electrodes (310) are stacked, the electrode tabs (320) of each of the plurality of electrodes (310) may be coupled to a lead tab (330). According to one embodiment, the bonding force between the lead tab (330) and the electrode tab (320) may be affected by the difference in the physical properties of the lead tab (330) and the electrode tab (320). As described above, the lead tab (330) may include a conductive material (e.g., metal). If the electrode tab (320) coupled to the lead tab (330) includes a non-conductive material (e.g., polymer), the bonding force may be weakened due to the difference in the physical properties of the conductive material of the lead tab (330) and the non-conductive material of the electrode tab (320).

[0069] According to one embodiment, the electrode tab (320) may include a material having the same properties as the lead tab (330) in a portion that is coupled with the lead tab (330). For example, when the lead tab (330) includes a first material (e.g., metal), the electrode tab (320) may include only the first material in a portion (e.g., the first portion (410) of FIG. 4) that includes a coupling surface (e.g., the coupling surface (440) of FIG. 4) that is coupled with the lead tab (330). For example, a second material (e.g., a polymer) having different properties from the first material may be omitted, removed, excluded, or not included in the first portion (410), thereby improving the coupling force between the lead tab (330) and the first portion (410). As the bonding force between the lead tab (330) and the electrode tab (320) is improved, power can be stably provided when charging and / or discharging the battery (300).

[0070] Fig. 4 is an enlarged view of the X portion of the battery in Fig. 3c.

[0071] Referring to FIG. 4, the electrode tab (320) may include a first portion (410) and a second portion (420). According to one embodiment, the first portion (410) may be a portion of the electrode tab (320) that includes a coupling surface (440) that is coupled with a lead tab (330). The lead tab (330) may be coupled to the electrode tab (320) by being welded onto the coupling surface (440). The portion of the lead tab (330) that includes the coupling surface (440) to which the lead tab (330) is coupled may be defined as the first portion (410). For example, the lead tab (330) and the coupling surface (440) may be melted and fused by frictional heat generated by ultrasonic vibration, and then the lead tab (330) may be welded onto the coupling surface (440) through a cooling process. Alternatively, the lead tab (330) and the bonding surface (440) may be melted and fused by the high heat generated by the laser, and then the lead tab (330) may be welded onto the bonding surface (440) through a cooling process.

[0072] In one embodiment, the second portion (420) may be a portion of the electrode tab (320) that is distinct from the first portion (410). For example, the second portion (420) may be the remaining portion of the electrode tab (320) excluding the first portion (410) coupled with the lead tab (330) and may be spaced apart from the lead tab (330). For example, when the electrode tab (320) is viewed from above while the lead tab (330) is coupled, the first portion (410) may at least partially overlap the lead tab (330), and the second portion (420) may not overlap the lead tab (330).

[0073] In one embodiment, the lead tab (330) may include a first material. For example, the lead tab (330) may include a conductive material to provide an electrical connection between the electrode (310) and an external circuit. For example, the first material may include a metal.

[0074] In one embodiment, the first portion (410) including the bonding surface (440) may include a first material. The first portion (410) including the first material may refer to the first portion (410) including a material substantially identical to the first material and not including a second material having properties different from those of the first material. For example, the first portion (410) may include a metal having electrical conductivity. The first portion (410) may not include a material that does not have electrical conductivity. Within the present disclosure, the second material may be used as a term indicating a material having properties different from those of the first material. For example, when the first material is a metal having electrical conductivity, the second material may be, but is not limited to, a polymer that does not have electrical conductivity.

[0075] For example, when a second material is at least partially included in the first portion (410), a strong bond cannot be formed at the atomic level due to the difference in the properties of the second material included in the first portion (410) and the first material included in the lead tab (330). For example, when the first material included in the lead tab (330) and the second material included in the electrode tab (320) come into contact at the bonding surface (440), the interface resistance may increase due to the different properties of the atoms of the first material and the atoms of the second material located on the bonding surface (440). The increase in the interface resistance may cause a weakening of the bonding strength between the lead tab (330) and the electrode tab (320). When the bonding strength is weak, power may not be smoothly provided through the lead tab (330), which may cause a deterioration in the performance of the battery (300). In addition, if the bonding force between the lead tab (330) and the electrode tab (320) is weak, the bonding tensile force is weak, so cracks may occur in the bonding surface (440). As the time of using the battery (300) elapses, the cracks increase, which may cause leakage current during charging and / or discharging of the battery (300), or deteriorate the charging efficiency and / or discharging efficiency.

[0076] According to one embodiment, since the first portion (410) does not include a second material but includes a first material, the bonding force between the lead tab (330) and the first portion (410) can be strengthened. For example, since the physical properties of the lead tab (330) including the first material and the physical properties of the electrode tab (320) including the first material are substantially the same, the lead tab (330) and the electrode tab (320) can be strongly bonded at the atomic level. As the lead tab (330) and the electrode tab (320) are firmly bonded, power can be stably supplied when charging and / or discharging the battery (300).

[0077] In one embodiment, the second portion (420) may include a plurality of layers. For example, the second portion (420) may include a first layer (431), a second layer (432), and a third layer (433). The first layer (431) and the second layer (432) may include a first material. The third layer (433) is interposed between the first layer (431) and the second layer (432) and may include a second material different from the first material. For example, the first material may include a metal, and the second material may include a polymer. When the electrode tab (320) is a first electrode tab extending from the positive electrode (311) (e.g., the first electrode tab (321) of FIG. 3B), the first material may include a first metal (e.g., aluminum). When the electrode tab (320) is a second electrode tab extending from the cathode (312) (e.g., the second electrode tab (322) of FIG. 3B), the first material may include a second metal (e.g., copper). The polymer may include polyethylene terephthalate (PET), but is not limited thereto.

[0078] In one embodiment, the third thickness (T3) of the third layer (433) may be thicker than the first thickness (T1) of the first layer (431) and the second thickness (T2) of the second layer (432). The first thickness (T1) may correspond to the second thickness (T2) of the second layer (432). For example, the third thickness (T3) may be about 5 um to about 7 um. The first thickness (T1) and the second thickness (T2) may be about 1 um to about 2 um. In the embodiment illustrated in FIG. 4, the thickness of the first portion (410) and the thickness of the second portion (420) may be substantially the same. For example, when the first thickness (T1) and the second thickness (T2) are about 1 um and the third thickness (T3) is about 6 um, the thickness of the second portion (420) including the first layer (431), the second layer (432), and the third layer (433) may be about 8 um. The thickness of the first portion (410) may be about 8 um, which is substantially the same as the thickness of the second portion (420). The above-described numerical range is merely an example of one of various embodiments, and the embodiments are not limited to the above-described numerical ranges of the thicknesses. The first thickness (T1), the second thickness (T2), and / or the third thickness (T3) are not limited to the values ​​of the above-described embodiments and may be formed with other values. According to one embodiment, the thickness of the first portion (410) is not adjusted, and the first portion (410) having the same physical properties as the second portion (420) may be formed. As the thickness of the electrode tab (320) is formed to be substantially constant, the physical stability of the electrode tab (320) can be secured. Hereinafter, a method for manufacturing the electrode tab (320) illustrated in FIG. 4 is described.

[0079] FIG. 5 is a flowchart illustrating a process for manufacturing an electrode tab of a battery according to one embodiment. FIG. 6a is a diagram illustrating a process for manufacturing an electrode tab of a battery according to one embodiment. FIG. 6b is a diagram illustrating a process for manufacturing an electrode tab of a battery according to a comparative example.

[0080] Referring to FIG. 5, in operation 501, a laminate (e.g., the laminate (610) of FIG. 6A) including a first material may be bonded to a third layer (e.g., the third layer (433) of FIG. 4) including a second material. For example, an adhesive member (e.g., double-sided tape, a binder) may be inserted between the laminate (610) and the third layer (433). The laminate (610) may be bonded to the third layer (433) through the adhesive member. However, the bonding method of the laminate (610) and the third layer (433) is not limited thereto. According to one embodiment, a conductive pattern may be formed as the laminate (610) is bonded to the third layer (433). The conductive pattern may be referred to as a pattern formed by a combination of some areas formed as conductive portions and other some areas formed as non-conductive portions. For example, the conductive pattern may be referred to as a conductive pattern formed by fusing a contact surface after a laminate (610) including a first material and a third layer (433) including a second material are combined.

[0081] Step 601 of FIG. 6A may correspond to operation 501 of FIG. 5. Referring to step 601, in step 601, a third layer (433) including a second material may be prepared. A laminate (610) including a first material may be bonded to one side of the third layer (433). As the laminate (610) is bonded to one side of the third layer (433), the electrode tab (320) may have a pattern. For example, a conductive pattern may be formed in the form of a third layer (433) including a second material and a laminate (610) including a first material being bonded together. For example, the conductive pattern may be referred to as a conductive pattern formed by a laminate (610) formed of a first material having conductive properties and a third layer (433) formed of a second material having non-conductive properties.

[0082] Referring back to FIG. 5 , at operation 503, a first material may be deposited on the third layer (433) and the laminate (610). In one embodiment, as the first material is deposited, an electrode tab (e.g., electrode tab (320) of FIG. 4 ) including a first portion (e.g., first portion (410) of FIG. 4 ) and a second portion (e.g., second portion (420) of FIG. 4 ) may be formed. For example, a conductive pattern may be formed by the first portion (e.g., first portion (410) of FIG. 6A ) including the first material and the second portion (e.g., second portion (420) of FIG. 6A ) including the first material and the second material.

[0083] Steps 603 and 605 of FIG. 6A may correspond to operation 503 of FIG. 5. Referring to step 603, a first material may be deposited on the third layer (433) and the laminate (610) forming the conductive pattern. For example, a first material (e.g., metal) in a gaseous state may be deposited on both surfaces of the third layer (433) and the laminate (610). The deposition method may include, but is not limited to, a physical vapor deposition (PVD) method in which the first material is heated to a high temperature to vaporize or the first material is exposed to plasma to vaporize, or a chemical vapor deposition (CVD) method in which a metal is deposited by heating a chemical substance including the first material or exposing a chemical substance including the first material to plasma. For example, when the electrode tab (320) is a first electrode tab (321) extending from the anode (311), the first material may be aluminum. A laminate (610) including aluminum may be bonded to a third layer (433) including a second material (e.g., a polymer), and vaporized aluminum may be deposited on both surfaces of the third layer (433) and the laminate (610). For example, if the electrode tab (320) is a second electrode tab (322) extending from the cathode (312), the first material may be copper. A laminate (610) including copper may be bonded to a third layer (433) including a second material, and vaporized copper may be deposited on both surfaces of the third layer (433) and the laminate (610).

[0084] Referring to process 605, as the first material is deposited on the third layer (433) and the laminate (610), an electrode tab (320) including a first portion (410) and a second portion (420) can be formed. The first material deposited on both surfaces of the laminate (610) can form the first portion (410) by being substantially integrally formed with the laminate (610). The first material deposited on the upper surface of the third layer (433) can form the first layer (431). The first material deposited on the lower surface of the third layer (433) can form the second layer (432). The first portion (410) and the second portion (420) that are distinct from each other can be formed by the deposition of the first material.

[0085] Referring again to FIG. 5, at operation 505, a lead tab (e.g., lead tab (330) of FIG. 4) may be coupled to the first portion (410). In one embodiment, the lead tab (330) may be coupled to the first portion (410) and spaced apart from the second portion (420).

[0086] Step 607 of FIG. 6A may correspond to step 505 of FIG. 5. Referring to step 607, the lead tab (330) may be coupled to the first portion (410). For example, the lead tab (330) may be welded to at least a portion of the upper surface of the first portion (410), thereby forming a coupling surface (440) between the first portion (410) and the lead tab (330). The first portion (410) to which the lead tab (330) is coupled may include only a first material (e.g., metal) and may not include a second material, and the lead tab (330) may include the first material (e.g., metal). Since the lead tab (330) and the electrode tab (320) to be coupled to each other have substantially the same physical properties, the coupling tensile force between the lead tab (330) and the electrode tab (320) may be high. By virtue of the bonding surface (440) having high bonding tensile strength, even when an external impact is applied, the bonding surface (440) between the lead tab (330) and the electrode tab (320) can be stably maintained without being separated or damaged. The third layer (433) including the second material can be included in a second portion (420) that is distinct from the first portion (410) bonded to the lead tab (330). The second portion (420) can be spaced apart from the lead tab (330).

[0087] Unlike the above manufacturing method of depositing the first material after forming the conductive pattern, when the first material is deposited on the third layer (433), the first portion (410) may not be formed. Fig. 6b is a drawing illustrating a manufacturing method of an electrode tab (650) according to a comparative example. Referring to Fig. 6b, in process 602, the first material may be deposited on the third layer (433). The first material may be deposited on both surfaces of the third layer (433).

[0088] In process 604, as the first material is deposited on the third layer (433), an electrode tab (650) according to a comparative example including a first layer (431), a second layer (432), and a third layer (433) can be formed. Since the first material is deposited on the third layer (433), the electrode tab (650) according to the comparative example can include only a second portion (420) without including a first portion (e.g., the first portion (410) of FIG. 4) including only the first material.

[0089] In process 606, a lead tab (330) may be joined to an electrode tab (650). The lead tab (330) may be welded to a portion of the electrode tab (650). For example, the lead tab (330) may be welded onto a first layer (431). As described above, since the first thickness of the first layer (431) is relatively thin, a difference in the properties of a second material (e.g., a polymer) included in a third layer (433) positioned below the first layer (431) and a first material (e.g., a metal) included in the lead tab (330) may cause a weakening of the bonding force between the lead tab (330) and the electrode tab (650). According to the manufacturing method illustrated in FIG. 6b, since the electrode tab (650) is manufactured to include only the second portion (420) and not the first portion (410), the bonding force between the lead tab (330) and the electrode tab (650) may be weak. As described above, the electrode tab (320) according to one embodiment may be bonded to the lead tab (330) through the first portion (410) having substantially the same physical properties as the lead tab (330), and thus the bonding force between the lead tab (330) and the electrode tab (320) may be improved. For example, the tensile bonding force between the electrode tab (650) and the lead tab (330) according to the comparative example may be about 10 N. For example, in the electrode tab (650) according to the comparative example, when the width of the first portion (410) is about 1.3 mm, the tensile bonding force may be about 9.8 N, and when the width of the first portion (410) is about 2.4 mm, the tensile bonding force may be about 11.3 N. For example, in the electrode tab (330) according to one embodiment, the tensile bonding force between the lead tab (330) and the electrode tab (320) may be about 20 N. For example, in the electrode tab (330) according to one embodiment, when the width of the first portion (410) is about 1.3 mm, the tensile bonding force may be about 20.2 N, and when the width of the first portion (410) is about 2.4 mm, the tensile bonding force may be about 21.8 N.According to one embodiment, when only the first material is included in the first portion (410), the tensile bonding strength can be improved by about two times or more.

[0090] Fig. 7a illustrates an example of an electrode tab of a battery according to one embodiment. Fig. 7b is a drawing illustrating a manufacturing process of the electrode tab of Fig. 7a.

[0091] In the above-described embodiment, the electrode tab (320) including a first portion (e.g., the first portion (410) of FIG. 4) and a second portion (e.g., the second portion (420) of FIG. 4) has been described, but is not limited thereto. For example, even if a third layer (433) including a second material is included within the first portion (410) including a bonding surface (440) that is bonded to the lead tab (330), the weakening of the bonding force can be reduced.

[0092] Referring to FIG. 7A, a battery (300) according to one embodiment may include an electrode tab (320) including a first portion (410) and a second portion (420). The first portion (410) may be a portion of the electrode tab (320) that includes a coupling surface (440) coupled with a lead tab (330). The second portion (420) may be a portion of the electrode tab (320) that is distinct from the first portion (410) and may be spaced apart from the lead tab (330). According to one embodiment, the first portion (410) and the second portion (420) may include a first layer (431), a second layer (432), and a third layer (433). The third layer (433) may be interposed between the first layer (431) and the second layer (432). For example, a first layer (431) may be placed on the upper surface of a third layer (433), and a second layer (432) may be placed on the lower surface of the third layer (433).

[0093] According to one embodiment, the thickness of the first portion (410) may be thinner than the thickness of the second portion (420). According to one embodiment, the first thickness (T1) of the first layer (431) and the second thickness (T2) of the second layer (432) may be substantially constant within the first portion (410) and the second portion (420). For example, the first thickness (T1) and the second thickness (T2) may be about 1 um. According to one embodiment, the thickness of the third layer (433) within the first portion (410) may not be constant. The thickness of the third layer (433) included within the first portion (410) may be thinner than the thickness of the third layer (433) included within the second portion (420). For example, the fifth thickness (T5) of the third layer (433) in the first portion (410) may be about 1 um to about 2 um, and the fourth thickness (T4) of the third layer (433) in the second portion (420) may be about 5 um to about 7 um. For example, when the fifth thickness (T5) is about 1 um, the thickness of the first portion (410) may be about 3 um, and when the fourth thickness (T4) is about 6 um, the thickness of the second portion (420) may be about 8 um. The above-described numerical ranges are merely examples of various embodiments, and the embodiments are not limited to the above-described numerical ranges of the thicknesses. The first thickness (T1), the second thickness (T2), the fourth thickness (T4), and / or the fifth thickness (T5) are not limited to the numerical values ​​of the above-described embodiments, and may be formed with other numerical values.

[0094] According to one embodiment, the lead tab (330) can be bonded onto the first layer (431) within the first portion (410). For example, the lead tab (330) can be welded onto the first layer (431) within the first portion (410). As illustrated in FIG. 7A, since the fifth thickness (T5) of the third layer (433) included within the first portion (410) is thinner than the fourth thickness (T4) of the third layer (433) included within the second portion (420), the weakening of the bonding force due to the difference in the physical properties between the lead tab (330) and the third layer (433) can be reduced. If the thickness of the third layer (433) is constant within the first portion (410) and the second portion (420), the bonding force between the lead tab (330) and the electrode tab (320) may be weakened due to the difference in the properties between the third layer (433) included within the first portion (410) and the lead tab (330). According to one embodiment, as the fifth thickness (T5) of the third layer (433) is formed relatively thin, the weakening of the bonding force due to the difference in properties may be reduced, and thus the bonding force between the lead tab (330) and the electrode tab (320) may be relatively strengthened.

[0095] Referring to FIG. 7B, in order to manufacture the electrode tab (320) illustrated in FIG. 7A, a first material may be deposited after adjusting the thickness of the third layer (433). Referring to process 701, a third layer (433) including a second material may be prepared. The second material is a different material from the first material included in the lead tab (330), and the first material may be a metal, and the second material may be a polymer. The thickness of the third layer (433) may be about 6 μm. According to one embodiment, a portion (433a) of the third layer (433) may be formed to be thin. For example, a portion (433a) of the third layer having a thickness of about 1 μm may be bonded to the third layer (433) having a thickness of about 6 μm. However, the present invention is not limited thereto. For example, by compressing a portion (433a) of the third layer (433) of process 701, a portion of the third layer (433) having a thickness of about 1 um may be formed. As another example, the third layer (433) of process 701 may be formed by combining multiple layers to form the third layer (433) with a thickness of about 6 um and the portion (433a) having a thickness of about 1 um. The above-described numerical range is only an example of one of various embodiments, and the embodiments are not limited to the above-described numerical range of thickness. The thickness of the third layer (433) and the thickness of the portion (433a) of the third layer (433) are not limited to the values ​​of the above-described embodiments, and may be formed with other values.

[0096] Referring to process 703, an electrode tab (320) may be formed by depositing a first material on a third layer (433). For example, a first layer (431) and a second layer (432) may be formed by depositing the first material on both sides of the third layer (433). The first thickness of the first layer (431) and the second thickness of the second layer (432) may be about 1 μm. Through process 705, a first portion (410) and a second portion (420) may be formed. The first portion (410) may be a portion of the electrode tab (320) that includes the third layer (433) having a thickness of about 1 μm. The second portion (420) may be a portion of the electrode tab (320) that includes the third layer (433) having a thickness of about 6 μm.

[0097] Referring to process 705, a lead tab (330) may be coupled to a first portion (410). The lead tab (330) may be welded onto a first layer (431) of the first portion (410), thereby forming a coupling surface (440) between the first portion (410) and the lead tab (330). Since the thickness of the third layer (433) included in the first portion (410) is relatively thinner than the thickness of the third layer (433) included in the second portion (420), the difference in physical properties between the lead tab (330) and the first portion (410) may be relatively reduced. According to one embodiment, even if a third layer (433) including a second material is included in the first portion (410), the weakening of the coupling force between the lead tab (330) and the electrode tab (320) may be reduced. According to one embodiment, power can be stably provided through the electrode tab (320) and the lead tab (330).

[0098] FIG. 8A is a drawing illustrating an electrode tab of a battery according to one embodiment. FIG. 8B is a drawing illustrating a process for manufacturing the electrode tab of FIG. 8A.

[0099] Referring to FIG. 8A, the electrode tab (320) may include a first portion (410) and a second portion (420). The thickness of the first portion (410) may be thinner than the thickness of the second portion (420). According to one embodiment, the second portion (420) may include a first layer (431), a second layer (432), and a third layer (433). For example, the first thickness of the first layer (431) and the second thickness of the second layer (432) may be about 1 μm. For example, the third thickness of the third layer (433) may be about 6 μm. The thickness of the second portion (420) may be about 8 μm. The numerical values ​​for the thicknesses are not limited to the numerical ranges described above, except for the relationship between the sizes of the thicknesses. The numerical ranges described above are merely examples of various embodiments, and the embodiments are not limited to the numerical ranges of the thicknesses described above. The first thickness, the second thickness, and / or the third thickness are not limited to the values ​​of the embodiments described above, and may be formed with other values.

[0100] In one embodiment, the third layer (433) may be included only within the second portion (420) and not within the first portion (410). The expression "the third layer (433) is not included within the first portion (410)" may refer to "the third layer (433) is omitted, removed, or excluded within the first portion (410)." The thickness of the first portion (410) may be about 1 um to about 2 um.

[0101] In one embodiment, the lead tab (330) may be coupled to the first portion (410). For example, the lead tab (330) may be welded onto the first portion (410), thereby forming a bonding surface (440) between the lead tab (330) and the electrode tab (320). Since the third layer (433) is not included in the first portion (410) including the bonding surface (440), the first portion (410) may not include a second material, but may only include a first material. The lead tab (330) may include the first material. Since the first portion (410) includes only the first material, the physical properties of the lead tab (330) may be substantially the same as the physical properties of the first portion (410). In one embodiment, the bonding force between the lead tab (330) and the electrode tab (320) may be strengthened.

[0102] Referring to FIG. 8B, the electrode tab (320) illustrated in FIG. 8A can be manufactured by removing a portion of the third layer (433). Referring to process 801, the third layer (433) and the second layer (432) can be prepared. For example, the second layer (432) can be disposed on the lower surface of the third layer (433). For example, the thickness of the third layer (433) can be about 6 μm, and the thickness of the second layer (432) can be about 1 μm. According to one embodiment, a portion of the third layer (433) can be removed. For example, a portion of the third layer (433) can be etched to form a first portion (410) including only the first material. As a portion of the third layer (433) is etched, a portion of the second layer (432) may not be in contact with the third layer (433). However, the embodiments of the present disclosure are not limited to etching a portion of the third layer (433). For example, in addition to the method of etching a portion of the third layer (433), the electrode tab (320) may be formed by contacting a second layer (432) having a length longer than the length of the third layer (433) to the third layer (433). In addition, various embodiments may be possible.

[0103] Referring to process 803, a first material may be deposited on the third layer (433) and the second layer (432). For example, the first material may be deposited on the upper surface of the third layer (433) and the upper surface of the second layer (432). As the first material is deposited, a first portion (410) and a second portion (420) may be formed. For example, the first portion (410) may be formed as the first material is deposited on the second layer (432) where the removed (e.g., etched) third layer (433) was disposed. For example, the second portion (420) may be formed as the first material is deposited on the third layer (433). Since the first material is deposited on a portion of the second layer (432) after the third layer (433) within the first portion (410) is etched, the first portion (410) may include only the first material and not the second material. The first layer (431) may be formed by deposition of the first material on the third layer (433) within the second portion (420). The second portion (420) may include the first layer (431), the second layer (432), and the third layer (433).

[0104] In process 805, a lead tab (330) may be joined to the first portion (410). For example, the lead tab (330) may be welded to the upper surface of the first portion (410). Since the first portion (410) to which the lead tab (330) is joined comprises only the first material, the lead tab (330) and the first portion (410) may have substantially the same physical properties. In one embodiment, as the bonding force between the lead tab (330) and the electrode tab (320) is strengthened, the stability of the battery (300) may be improved.

[0105] A battery (300) is provided. The battery (300) may include an electrode (310). The battery (300) may include an electrode tab (320) extending from the electrode (310). The battery (300) may include a lead tab (330) coupled to the electrode tab (320). The electrode tab (320) may be formed from a first material. The electrode tab (320) may include a coupling surface (440) coupled to the lead tab (330) and a first portion (410) formed from the first material. The electrode tab (320) may include a second portion (420) including a first layer (431), a second layer (432), and a third layer (433). The first layer (431) may be spaced apart from the lead tab (330). The first layer (431) may be formed of the first material. The second layer (432) may be formed of the first material. The third layer (433) may be interposed between the first layer (431) and the second layer (432). The third layer (433) may be formed of a second material different from the first material.

[0106] In one embodiment, the first material may include a metal. The second material may include a polymer.

[0107] In one embodiment, the polymer may include polyethylene terephthalate (PET).

[0108] According to one embodiment, the electrode (310) may include an anode (311) comprising a first metal. The electrode tab (320) may include a first electrode tab (321) extending from the anode (311). The first material may include the first metal.

[0109] In one embodiment, the first metal may include aluminum.

[0110] In one embodiment, the electrode (310) may include a cathode (312) comprising a second metal. The electrode tab (320) may include a second electrode tab (322) extending from the cathode (312). The first material may include the second metal.

[0111] In one embodiment, the second metal may include copper.

[0112] According to one embodiment, the battery (300) may further include a case (340) that surrounds the electrode (310) and the electrode tab (320). A portion of the lead tab (330) may be exposed to the outside of the case (340).

[0113] According to one embodiment, the electrode tab (320) may extend from the electrode (310) toward another portion of the lead tab (330) positioned inside the case (340) and may be at least partially bent.

[0114] According to one embodiment, the lead tab (330) can be joined to the electrode tab (320) by welding to the joining surface (440).

[0115] According to one embodiment, the electrode tab (320) can be formed by bonding a laminate (610) including the first material to the third layer (433) and depositing the first material on the third layer (433) and the laminate (610).

[0116] According to one embodiment, the thickness of the third layer (433) may be thicker than the thickness of the first layer (431) and the thickness of the second layer (432).

[0117] According to one embodiment, the thickness of the third layer (433) may be 5 um to 7 um. The thickness of the first layer (431) and the thickness of the second layer (432) may be 1 um to 2 um.

[0118] According to one embodiment, the thickness of the first portion (410) may correspond to the thickness of the second portion (420).

[0119] According to one embodiment, the thickness of the first portion (410) may be thinner than the thickness of the second portion (420).

[0120] A battery (300) is provided. The battery (300) may include an electrode (310). The battery (300) may include an electrode tab (320) extending from the electrode (310). The electrode tab (320) may include a first layer (431) including the first material, a second layer (432) including the first material, and a second material different from the first material. The battery may include a third layer (433) interposed between the first layer (431) and the second layer (432). The battery (300) may include a lead tab (330) including the first material and coupled to the electrode tab (320). The electrode tab (320) may include a first portion (410) including a bonding surface (440) coupled with the lead tab (330) and a second portion (420) spaced apart from the lead tab (330) and thinner than the first portion (410). The thickness of the third layer (433) included in the first portion (410) may be thinner than the thickness of the third layer (433) included in the second portion (420).

[0121] According to one embodiment, the thickness of the third layer (433) included in the first portion (410) may be 1 um to 2 um. The thickness of the third layer (433) included in the second portion (420) may be 5 um to 7 um.

[0122] According to one embodiment, the thickness of the first layer (431) and the thickness of the second layer (432) may be substantially constant.

[0123] In one embodiment, the first material may include a metal. The second material may include a polymer.

[0124] An electronic device (101) is provided. The electronic device (101) may include an electronic component. The electronic device (101) may include a battery (300) for providing power for the operation of the electronic component. The battery (300) may include an electrode (310). The battery (300) may include an electrode tab (320) extending from the electrode (310). The battery (300) may include a lead tab (330) coupled to the electrode tab (320). The electrode tab (320) may be formed from a first material. The electrode tab (320) may include a coupling surface (440) coupled to the lead tab (330) and a first portion (410) formed from the first material. The electrode tab (320) may include a second portion (420) including a first layer (431), a second layer (432), and a third layer (433). The first layer (431) may be spaced apart from the lead tab (330). The first layer (431) may be formed of the first material. The second layer (432) may be formed of the first material. The third layer (433) may be interposed between the first layer (431) and the second layer (432). The third layer (433) may be formed of a second material different from the first material.

[0125] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0126] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0127] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0128] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0129] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0130] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. Regarding the battery, electrode; an electrode tab extending from the electrode; and comprising a first material and a lead tab coupled to the electrode tab; The above electrode tab is, A first part comprising a bonding surface coupled to the lead tab and comprising the first material, and comprising a second portion spaced apart from the lead tab; The second part of the above electrode tab, A first layer comprising the first material, A second layer comprising the first material, and A third layer interposed between the first layer and the second layer and including a second material different from the first material, battery.

2. In paragraph 1, The above first material is, Contains metal, The above second material is, containing a polymer, battery.

3. In paragraph 2, The above polymer, Containing polyethylene terephthalate (PET), battery.

4. In any one of paragraphs 1 to 3, The above electrodes are, Containing an anode containing a first metal, The above electrode tab is, comprising a first electrode tab extending from the anode; The above first material is, Containing the first metal, battery.

5. In paragraph 4, The above first metal is, Containing aluminum, battery.

6. In any one of paragraphs 1 to 5, The above electrodes are, Containing a cathode comprising a second metal, The above electrode tab is, comprising a second electrode tab extending from the cathode; The above first material is, Containing the second metal, battery.

7. In paragraph 6, The second metal is, containing copper, battery.

8. In any one of paragraphs 1 to 7, Further comprising a case surrounding the electrode and the electrode tab, Some of the above lead tabs are: Exposed to the outside of the above case, battery.

9. In paragraph 8, The above electrode tab is, extending from said electrode toward another portion of said lead tab located inside said case, and at least partially bent; battery.

10. In any one of paragraphs 1 to 9, The above lead tab is, By welding to the above bonding surface, it is joined to the electrode tab, battery.

11. In any one of paragraphs 1 to 10, The above electrode tab is, By bonding a laminate including the first material to the third layer and depositing the first material on the third layer and the laminate, battery.

12. In any one of paragraphs 1 to 11, The thickness of the third layer is Thicker than the thickness of the first layer and the thickness of the second layer, battery.

13. In paragraph 12, The thickness of the third layer is 5um to 7um, The thickness of the first layer and the thickness of the second layer are, 1um to 2um, battery.

14. In any one of paragraphs 1 to 13, The thickness of the above first part is, Corresponding to the thickness of the second part above, battery.

15. In any one of paragraphs 1 to 13, The thickness of the above first part is, Thinner than the thickness of the second part above, battery.

Images