Printed circuit board

Abstract

A printed circuit board according to an embodiment of the present invention comprises: a board unit in which first and second insulating layers are formed above and below each other and a circuit layer is formed between the first and second insulating layers; an electrical component that is mounted on an exposed region in which the circuit layer has been exposed by removing a portion of the first insulating layer; and a component reinforcement unit that is attached to the second insulating layer in the exposed region and supports the electrical component. The component reinforcement unit includes: a component reinforcement plate bonded to the second insulating layer in the exposed region; a component adhesive layer formed between the second insulating layer and the component reinforcement plate; and a fuse adhesive layer formed on the opposite side of the component reinforcement plate from the component adhesive layer. The board unit further includes a pattern fuse portion obtained by forming a portion of the circuit layer to be able to function as a fuse, the pattern fuse portion includes a melting portion that melts faster than other portions of the circuit layer at or above a certain current, and one surface of the pattern fuse portion is attached and fixed to the fuse adhesive layer. Accordingly, it is possible to maintain the flatness of a pattern fuse while firmly supporting the electrical component and achieve firm fixing to a counterpart without an increase in weight or volume.

Description

printed circuit board

[0001] The present invention relates to a printed circuit board, and more specifically, to a printed circuit board in which an internal circuit is printed and electrically connected to other components to complete a circuit.

[0002] A printed circuit board is a circuit board with internal circuits patterned and printed to fix and connect multiple electronic components in a standardized manner, and mechanically and electrically connects multiple circuits to realize miniaturization and weight reduction of electrical products.

[0003] Printed circuit boards (PCBs) offer the advantages of stable circuit characteristics, no risk of miswiring, and low production costs. These numerous advantages make them useful in a wide range of fields and a core component essential to all electronic devices. In particular, the recent trend toward miniaturization and lightweight design has led to an increase in the use of flexible PCBs.

[0004] On one side of these printed circuit boards, electrical components such as connectors and terminals are mounted and connected to each circuit, and at this time, in order to prevent damage to the printed circuit board, especially the flexible printed circuit board, a reinforcing plate is attached to the other side using an adhesive. However, when soldering to electrically connect the electrical components and each circuit, there was a problem in that the temperature increased due to soldering, causing the air bubbles in the adhesive to expand, which significantly reduced the stability of the electrical connection with the electrical components, and caused defects as the flatness decreased.

[0005] Additionally, when using reinforcement plates to secure various battlefield components, there is also the disadvantage of increased weight and volume.

[0006] Accordingly, the demand for lighter printed circuit boards that can stably install various electronic components is increasing.

[0007] The present invention has been devised to solve the above problems, and aims to provide a printed circuit board that is lightweight overall, has improved product reliability and productivity, and can reduce the defect rate during soldering of electrical components while reducing weight and volume.

[0008] The present invention provides a printed circuit board, comprising, in a first embodiment, a substrate portion having first and second insulating layers formed vertically, and a circuit layer formed between the first and second insulating layers; an electrical component mounted on an exposed area where the circuit layer is exposed by removing a portion of the first insulating layer; and a component reinforcement portion attached to a second insulating layer of the exposed area and supporting the electrical component; wherein the component reinforcement portion includes a component reinforcement plate bonded to the second insulating layer of the exposed area, a component adhesive layer formed between the second insulating layer and the component reinforcement plate, and a fuse adhesive layer formed on an opposite surface of the component adhesive layer of the component reinforcement plate, wherein the substrate portion further includes a pattern fuse portion formed in a shape in which a portion of the circuit layer can function as a fuse, the pattern fuse portion including a melting portion that melts faster than other portions of the circuit layer at a predetermined current or higher, and wherein one surface of the pattern fuse portion is attached to and fixed to the fuse adhesive layer.

[0009] It is preferable that the above-mentioned component reinforcement part further include a discharge path for discharging air bubbles within the component adhesive layer.

[0010] It is effective that the above-mentioned electric component forms a connection part that is electrically contacted by soldering with the circuit layer exposed to the exposed area, and the discharge path is formed corresponding to the position of the connection part.

[0011] It is preferable that the above discharge path be formed as a horizontal discharge path formed by removing the component adhesive layer at the location of the connecting portion, and a vertical discharge path formed by penetrating the component reinforcement plate so as to be connected to the horizontal discharge path.

[0012] It is effective that the above fuse adhesive layer is formed in a portion other than a position corresponding to the melting portion, so as to form a void in the position corresponding to the melting portion, and the vertical discharge path is formed to be in communication with the void.

[0013] The above exhaust path may be formed as an air tunnel in which the component adhesive layer is removed from the position of the connecting portion to one end of the exposed area.

[0014] The above exhaust path may be formed by an air hole penetrating the component reinforcement plate and the component adhesive layer at the location of the connecting portion.

[0015] In the above exposure area, it is preferable that a fixed circuit is formed to which the above electric component is fixed by soldering, and that the discharge path is additionally formed corresponding to the position of the fixed circuit.

[0016] It is preferable that the above-mentioned component reinforcement part further include a component reinforcement part fixing hole formed by penetrating the above-mentioned component reinforcement part.

[0017] It is effective that the above fuse adhesive layer is formed in a portion other than a portion corresponding to the melting portion, and a void is formed in a portion corresponding to the melting portion.

[0018] It is preferable that the above pattern fuse part further include a connection pad formed at both ends of the melting part.

[0019] It is effective that the width of the above-mentioned connection pad is wider than the width of the above-mentioned melting part.

[0020] At least one of the first insulating layer and the second insulating layer on which the connection pad is formed may not be formed, so that the connection pad may be exposed to the outside.

[0021] It is effective to apply a protective coating to the upper side of the above connection pad.

[0022] It is preferable that the above pattern fuse portion further include an interference prevention portion that surrounds the melting portion and from which the circuit layer is removed.

[0023] It is effective that the above pattern fuse portion further includes a concentrated melting portion in which at least one of the first insulating layer and the second insulating layer of at least a portion of the melting portion is open.

[0024] It is desirable that a protective coating liquid be applied to the open surface of the above-mentioned concentrated melting section.

[0025] It is effective that the above pattern fuse portion further includes an overflow prevention portion formed as a closed curve surrounding the above pattern fuse portion and protruding from at least one of the first insulating layer and the second insulating layer.

[0026] The above pattern fuse part may be implemented by including a connection wiring connected to one end of the melting part; and a connection pad formed in connection with the connection wiring.

[0027] As discussed above, the problem-solving means of the present invention can be expected to produce various effects, including the following. However, the present invention is not established unless it exhibits all of the following effects.

[0028] The printed circuit board of the present invention supports the electrical components and the pattern fuse portion simultaneously using a single component reinforcement plate, thereby firmly supporting the electrical components without increasing the weight and volume, while maintaining the flatness of the pattern fuse, and can be firmly fixed to a counterpart.

[0029] In addition, a discharge path is formed to discharge air bubbles within the adhesive layer corresponding to the exposed area where the electrical component is mounted, thereby preventing the electrical component from lifting and providing a more stable electrical connection with the circuit layer.

[0030] In addition, it significantly reduces the defect rate by preventing the flatness of the circuit board from being lowered due to the lifting of the electrical components, and at the same time, it secures the fixing strength of the electrical components, thereby improving durability against continuous vibration caused by vehicle operation.

[0031] In addition, in another embodiment, a discharge path penetrating the reinforcing plate is formed so that air bubbles generated in the bonding layer are immediately removed in the direction of lamination, thereby maximizing the above-described effect.

[0032] In addition, by providing a void portion, it is possible to prevent changes in melting characteristics and current-conducting characteristics that may occur by attaching a fuse adhesive layer to the melting portion.

[0033] In particular, when the melting part is melted, the fuse adhesive layer can be prevented from being carbonized due to high temperature and affecting other circuits.

[0034] Additionally, there is an advantage in that defects in the pattern fuse part can be tested in advance during the manufacturing stage through the connection pad.

[0035] In addition, by providing an interference prevention unit, a concentrated melting unit, and an overflow prevention unit, the reliability of the melting characteristics of the melting unit can be increased.

[0036] Figures 1 to 7 illustrate a printed circuit board of a first embodiment of the present invention.

[0037] Figure 1 is a perspective view of a printed circuit board with the pattern fuse portion unfolded.

[0038] Figure 2 is a bottom perspective view of Figure 1.

[0039] Figure 3 is an exploded perspective view of Figure 2.

[0040] Fig. 4 is an enlarged view of the pattern fuse part of Fig. 1.

[0041] Figure 5 is a perspective view of the printed circuit board of Figure 1 with the pattern fuse overlapping the component reinforcement portion.

[0042] Figure 6 is a bottom perspective view of Figure 5.

[0043] Fig. 7 is a cross-sectional view taken along the cutting line VII-VII of Fig. 5.

[0044] Fig. 8 is a cross-sectional view taken along the cutting line VIII-VIII of Fig. 4.

[0045] Figure 9 is a cross-sectional view taken along the cutting line IX-IX of Figure 4.

[0046] Fig. 10 is a plan view showing a modified example of the connection pad of Fig. 4.

[0047] Figures 11 and 12 illustrate a second embodiment of the exhaust path,

[0048] Figure 11 is an exploded perspective view showing a component adhesive layer and a component reinforcement plate.

[0049] Figure 12 is a plan view of Figure 11.

[0050] Figures 13 and 14 illustrate a third embodiment of the exhaust path,

[0051] Figure 13 is an exploded perspective view showing a component adhesive layer and a component reinforcement plate.

[0052] Figure 14 is a plan view of Figure 13.

[0053] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, descriptions of well-known functions or configurations will be omitted so as not to obscure the gist of the present invention.

[0054] Also, for convenience of explanation, the direction in which the printed circuit board is extended is defined as the extension direction, the direction in which the insulating layer and the circuit layer are laminated is defined as the lamination direction, the direction in which the connector is mounted is defined as the upper side of the lamination direction, and the direction in which the reinforcement is formed is defined as the lower side of the lamination direction.

[0055] FIGS. 1 to 10 illustrate a printed circuit board according to a first embodiment of the present invention, wherein FIG. 1 is a perspective view of the printed circuit board with the pattern fuse portion unfolded, FIG. 2 is a bottom perspective view of FIG. 1, FIG. 3 is an exploded perspective view of FIG. 2, FIG. 4 is an enlarged view of the pattern fuse portion of FIG. 1, FIG. 5 is a perspective view of the printed circuit board of FIG. 1 with the pattern fuse overlapping the component reinforcement portion, FIG. 6 is a bottom perspective view of FIG. 5, FIG. 7 is a cross-sectional view taken along the cutting line VII-VII of FIG. 5, FIG. 8 is a cross-sectional view taken along the cutting line VIII-VIII of FIG. 4, FIG. 9 is a cross-sectional view taken along the cutting line IX-IX of FIG. 4, and FIG. 10 is a plan view illustrating a modified example of the connection pad of FIG. 4.

[0056] As shown in these drawings, the printed circuit board of the first embodiment of the present invention includes a substrate portion (100) in which first and second insulating layers (101, 102) are formed vertically, a circuit layer (103) is formed between the first and second insulating layers (101, 102), an electrical component (200) mounted on an exposed area (131) in which a portion of the first insulating layer (101) is removed to expose the circuit layer (103), and a component reinforcement portion (300) attached to the second insulating layer (102) of the exposed area (131) and supporting the electrical component (200).

[0057] The substrate portion (100) is formed by stacking a circuit layer (103) in which internal circuits are formed in a pattern, a first insulating layer (101) is stacked on the upper side of the circuit layer (103) in the stacking direction, and a second insulating layer (102) is stacked on the lower side of the circuit layer (103) in the stacking direction, thereby electrically connecting the external components and the circuit layer (103) to complete a plurality of circuits. At this time, the first and second insulating layers (101, 102) support the circuit layer (103) formed thinly to prevent the internal circuits from being damaged, such as by short-circuiting, and protect the circuit layer (103) by preventing phenomena, such as short-circuiting, with other surrounding components. Therefore, the circuit layer (103) is formed by stacking a plurality of internal circuits in a pattern, and the first and second insulating layers (101, 102) are formed to cover the entire internal circuits on both sides in the stacking direction so that not all of the circuit layers (103) are exposed to the outside.

[0058] In the above, each component that constitutes the substrate portion (100) in the thickness direction has been described, and below, each component that is arranged on a plane according to the shape or function of the substrate portion (100) will be described in more detail.

[0059] The substrate portion (100) includes a body portion (110) formed vertically by the first and second insulating layers (101, 102) and the circuit layer (103) described above, a component mounting portion (130) on which the above-described electric component (200) is mounted according to function in the horizontal direction, and a pattern fuse portion (150) formed in a form in which a portion of the circuit layer (103) can function as a fuse.

[0060] The pattern fuse part (150) includes a melting part (151) that melts faster than other parts of the circuit layer (103) when a certain current is applied, connection pads (152) formed at both ends of the melting part (151), an interference prevention part (153) that surrounds the melting part (151) and from which the circuit layer (103) is removed, a concentrated melting part (154) in which at least one of the first insulating layer (101) and the second insulating layer (102) of at least a portion of the melting part (151) is open, and an overflow prevention part (155) that is formed as a closed curve surrounding the pattern fuse part (150) and protrudes from at least one of the first insulating layer (101) and the second insulating layer (102).

[0061] The pattern fuse unit (150) may be formed by a single melting unit (151), but may also be formed by clustering multiple melting units (151) as shown in Fig. 4. The interference prevention unit (153) and the overflow prevention unit (155) are formed in a form that surrounds the entire multiple melting units (151).

[0062] The melting portion (151) is formed to be smaller than the cross-sectional area of ​​other circuit wirings (104) of the circuit layer (103), so that when a certain current or more flows, it is fused before other circuit wirings (104). In addition, as illustrated in FIG. 4, the melting portion (151) is formed to have a thin line width to increase resistance, and is formed in a zigzag shape to increase the length. A plurality of such melting portions (151) may be formed. By forming the pattern fuse portion (150) as described above, not only can the weight be reduced compared to the chip fuse, but also the manufacturing cost can be reduced, which is an advantage.

[0063] The connection pad (152) is formed to have a size wider than the width of the melting portion (151) and is formed at each end of the melting portion (151). The connection pad (152) is necessary for performance testing of the pattern fuse and is used for resistance testing of the melting portion (151) during or after the process. Therefore, the connection pad (152) may be continuously exposed, or may be exposed only during the test stage during the manufacturing process to prevent unnecessary contamination. That is, at least one of the first insulating layer (101) and the second insulating layer (102) on which the connection pad (152) is formed may not be formed, so that the connection pad (152) is exposed to the outside, or, as shown in FIG. 8, a protective coating solution (157) may be applied to the upper side of the connection pad (152) after testing so that the connection pad (152) is not exposed after manufacturing. Alternatively, after testing with only one of the first and second insulating layers (101, 102) formed, the remaining insulating layer may be thermally bonded so that the connection pad (152) is not exposed. Since the shape of the connection pad (152) is a test point for resistance measurement, it can be formed in various shapes such as square, circular, and polygonal as needed.

[0064] In addition, as illustrated in FIG. 10, the connection pad (152) may not be formed directly at both ends of the melting portion (151), but may be formed separately. That is, the pattern fuse portion (150) may include a connection wire (1156) connected to one end of the melting portion (151), and a connection pad (1152) formed in connection with the connection wire (156). The connection pad (1152) is formed at a location away from the melting portion (151), and the connection wire (156) connects the melting portion (151) and the connection pad (1152), so that the connection pad (152), which occupies a large area, can be placed outward, which has the advantage of increasing the degree of freedom in design.

[0065] The interference prevention section (153) is the circuit layer (103) surrounding the molten section (151), i.e., the area from which the conductive conductor has been removed. By removing the conductive conductor from the area surrounding the molten section (151) in this way, the electrical characteristics of the pattern fuse can be maintained constant. When a conductor is present in the molten section (151), the electrical characteristics change due to the influence of heat dissipation, etc., and thus the interference prevention section (153) prevents such changes.

[0066] The concentrated melting section (154) is a section in which at least one of the first and second insulating layers (101, 102) of a certain area, in the present invention the central area, of the melting section (151) is opened. By being opened in this way, the melting characteristics of the melting section (151) are prevented from being changed by the first and second insulating layers (101, 102). In addition, in order to protect the opened section, a protective coating solution (157) may be applied to the open surface of the concentrated melting section (154), as shown in FIG. 9.

[0067] The overflow prevention part (155) is formed to protrude upward on one side of the first and second insulating layers (101, 102), that is, the side on which the protective coating solution (156) is applied, so as to surround the pattern fuse part (150). The manufacturing method is formed to protrude upward on the first and second insulating layers (101, 102) by a method such as silkscreen. The overflow prevention part (155) prevents the protective coating solution (157) applied to the upper side of the concentrated melting part (154) or the connection pad (152) from overflowing to other parts of the circuit board. Alternatively, when applying the coating solution to the upper surface of the pattern fuse part (150) to secure the performance of the pattern fuse part (150), it provides a guideline for the coating area, prevents coating of unnecessary areas, reduces the amount of coating solution required, and makes it easier to recognize and judge defects when the coating solution overflows.

[0068] As described above, one embodiment of the present invention can reduce the overall weight compared to when using a chip fuse by having a pattern fuse section.

[0069] Additionally, there is an advantage in that defects in the pattern fuse part can be tested in advance during the manufacturing stage through the connection pad.

[0070] In addition, by providing an interference prevention unit, a concentrated melting unit, and an overflow prevention unit, the reliability of the melting characteristics of the melting unit can be increased.

[0071] The component mounting portion (130) includes an exposed area (131) formed by removing a portion of the first insulating layer (101) of the body portion (110), an exposed circuit (132) located in the exposed area (131) and having a circuit layer (103) directly electrically connected to the electrical component (200), and a fixed circuit (133) formed in the circuit layer (103) for fixing the electrical component (200) and exposed by the exposed area (131). Here, the exposed circuit (132) is formed of copper foil and extends in the extension direction to expose a portion of the internal circuit of the body portion (110) and is electrically connected to the electrical component (200), but the fixed circuit (133) is formed of a circuit layer (103) in the form of copper foil, but is not connected to the internal circuit and is only used for fixing the electrical component (200).

[0072] Accordingly, the exposure area (131) is formed corresponding to the size of the mounted electrical component (200), and if necessary, an area where the exposed circuit (132) is exposed and an area where the fixed circuit (133) is exposed can be formed separately, and preferably, a plurality of exposure areas (131) are formed so that each of the exposed circuits (132) and the fixed circuit (133) is partitioned and exposed, thereby minimizing exposure of a part other than the part connected to the electrical component (200) and securing the stability of the circuit layer (103). In summary, the printed circuit board (10) of the present invention forms an exposure area (131) where the circuit layer (103) is exposed on the first insulating layer (101) laminated on one side of the circuit layer (103), thereby directly connecting to the electrical component (200) and easily forming a plurality of circuits with an external device.

[0073] The electrical component (200) is mounted on one side of the printed circuit board (10) and is directly electrically connected to the exposed circuit (131), and refers to a connector that relays the connection between an external device and the circuit layer (103), or a sensor, element, etc. that measures the status of the connected device. To this end, the electrical component (200) is formed of a component body (210), a connection portion (220) that is exposed on one side of the component body (210) and electrically connected to each of the exposed circuits (131) by soldering, and a fixing portion (230) that is fixed to the fixed circuit (132) by soldering. At this time, the connecting portion (220) is formed in multiple pieces so as to be connected to multiple circuits forming the circuit layer (103), thereby forming multiple circuits that serve as passages for electrical signals, and the fixed portion (230) is configured to be exposed on the outside of the electric component (200) and simply connected to the fixed circuit (132), so that even when connected to the fixed circuit (132) by soldering, no circuit is formed.

[0074] The above-described component reinforcement part (300) includes a component reinforcement plate (310) bonded to the second insulating layer (102) of the exposed area (131), a component adhesive layer (320) formed between the second insulating layer (102) and the component reinforcement plate (310), a fuse adhesive layer (340) formed on the opposite surface of the component adhesive layer (320) of the component reinforcement plate (310), and a discharge path (330) for discharging air bubbles within the component adhesive layer (320). The component reinforcement part (300) is formed on the second insulating layer (103) corresponding to the position of the exposed area (131) to support the electrical component (200) and prevent the flexible printed circuit board (10) from being damaged, such as being torn, by mounting the electrical component (200). The component reinforcement part (300) supports the mounted electrical component (200) and prevents deformation that may occur in the printed circuit board (10) during soldering, thereby significantly improving product reliability and durability.

[0075] The component reinforcement plate (310) has a hard physical property so that it stably supports electrical components (200) having a weight greater than a certain level, such as connectors, even when mounted thereon. It is preferable that it has a width that can accommodate all of the multiple exposed areas (131) so as to support the entire area of ​​the electrical components (200). A vertical discharge path (332) is formed through the component reinforcement plate (310).

[0076] The above-mentioned component adhesive layer (320) is formed of a double-sided tape material having a certain thickness, and a release liner is attached to both sides before attachment, and is attached after the release liner is removed. The component adhesive layer (320) is formed by a horizontal discharge channel (331), more specifically, a discharge channel (330) for discharging air bubbles within the component adhesive layer (320), penetrating therethrough. The horizontal discharge channel (331) is formed to be connected to the vertical discharge channel (332).

[0077] The component adhesive layer (320) is formed between the second insulating layer (102) and the component reinforcement plate (310) and serves to fix the component reinforcement plate (310) to the second insulating layer (102). At this time, when the electrical component (200) is mounted by soldering while the component reinforcement plate (310) is adhered, the temperature of the exposed area (131) rises, and accordingly, air bubbles in the component adhesive layer (320) expand, causing lifting in the mounting portion of the electrical component (200).

[0078] To explain in more detail, a printed circuit board (10) is generally printed with solder paste (20) in advance on an exposed area (131), and then a reflow soldering process is used to re-melt the solder paste (20) by supplying external heat to join the electrical components (200). The heat supplied at this time has a temperature of approximately 250°C, and in this case, the bubbles in the component bonding layer (320) expand to about twice their volume.

[0079] The discharge path (330) includes a horizontal discharge path (331) formed by removing the component adhesive layer (320) corresponding to the positions of the connection portion (220) and the fixing portion (230), and a vertical discharge path (332) formed by axially penetrating the component reinforcement plate (310) so as to be in communication with one side of the horizontal discharge path (331). The discharge path (330) is a passage for discharging expanded bubbles within the component adhesive layer (320), and is formed corresponding to the position of the connection portion (220) where the connection portion (220) of the exposed circuit (131), i.e., the electrical component (200) and the circuit layer (103) are joined by soldering, and is in communication with the outside to discharge bubbles to the outside along the discharge path (330).

[0080] More specifically, the horizontal discharge path (331) is formed by starting from the position of the connecting portion (220) and the fixing portion (230) and extending to one side by a predetermined length, and the vertical discharge path (332) is formed to communicate with the horizontal discharge path (331) corresponding to the position of the connecting portion (220) and the fixing portion (230), so that in the part where soldering is performed, air bubbles are quickly discharged in the axial direction, and at the same time, the horizontal discharge path (331) is formed to have a predetermined length, thereby reducing the movement path of air bubbles expanded around the connecting portion (220) and the fixing portion (230), thereby enabling smooth discharge.

[0081] The above fuse adhesive layer (340) is attached to the component reinforcement plate (310) and is attached to the opposite surface of the component adhesive layer (320).

[0082] When the substrate portion (100) is folded based on the folding line (Y) of FIG. 2, the pattern fuse portion (150) is bonded to the fuse adhesive layer (340), as shown in FIG. 5. In the folded state, the fuse adhesive layer (340) is formed in the remaining portion except for the position corresponding to the melting portion (151), and forms a void portion (345) in the position corresponding to the melting portion (151). That is, the fuse adhesive layer (340) includes a fuse adhesive layer body (341) in the shape of a square ring that surrounds the void portion (345), as shown in FIGS. 2 and 3. The vertical discharge path (332) is formed to be in communication with the void portion (345).

[0083] As described above, the printed circuit board of the first embodiment of the present invention has a discharge path formed to discharge air bubbles in the adhesive layer corresponding to the exposed area where the electrical component is mounted, thereby preventing the electrical component from lifting and providing a more stable electrical connection with the circuit layer.

[0084] In addition, it significantly reduces the defect rate by preventing the flatness of the circuit board from being lowered due to the lifting of the electrical components, and at the same time, it secures the fixing strength of the electrical components, thereby improving durability against continuous vibration caused by vehicle operation.

[0085] In addition, by forming a discharge path penetrating the reinforcing plate, air bubbles generated in the bonding layer are immediately removed in the direction of lamination, thereby maximizing the above-mentioned effect.

[0086] In addition, by supporting the electric component and the pattern fuse part simultaneously using a single component reinforcement plate, the flatness of the pattern fuse can be maintained and it can be firmly fixed to the counterpart. In addition, by providing a gap (345), the fuse adhesive layer (340) is attached to the melting part (151), so that changes in the melting characteristics and the current-conducting characteristics that may occur can be prevented. In particular, when the melting part (151) is melted, the fuse adhesive layer (340) is prevented from being carbonized due to the high temperature, which can affect other circuits.

[0087] Figures 11 and 12 illustrate a second embodiment of the exhaust path, where Figure 11 is an exploded perspective view illustrating a component adhesive layer and a component reinforcing plate, and Figure 12 is a plan view of Figure 8.

[0088] As shown in these drawings, the exhaust path (1330) of the second embodiment is formed as an air tunnel (1331) extending from the position of the connection portion (220) and the fixing portion (230) of the component adhesive layer (320) to one end portion of the component adhesive layer (320). That is, the air tunnel (1331) is formed by penetrating the component adhesive layer (320) and is formed in the form of a channel extending from the middle portion to the edge, so that the bubbles within the component adhesive layer (320) expand and merge with other bubbles in the vicinity, thereby gradually increasing in size.

[0089] At this time, the expanded bubbles are moved to the discharge path (1330) where the relative pressure is low because the pressure of the component reinforcement plate (310) is not generated, and are discharged to the outside through the discharge path (1330) to prevent the occurrence of lifting in the mounting portion of the electric component (200).

[0090] In addition, since the discharge path (1330) is formed by removing the component adhesive layer (320), the bonding area is reduced, so it is preferable that the discharge path (1330) be formed of a plurality of air tunnels (1331) connected to the end closest to the connection part (220) and the fixing part (230). In the case of the discharge path (1330) connected to the connection part (220), considering that expanded bubbles merge with surrounding bubbles, it is preferable that it be formed in the central part of the connection part (220) to secure a contact area while also discharging bubbles expanded in the periphery.

[0091] In addition, a component reinforcement fixing hole (311) is formed through the component reinforcement plate (310). The component reinforcement fixing hole (311) is formed through the pattern fuse part (150), the component adhesive layer (320), the fuse adhesive layer (340), and the component adhesive layer (320). The component reinforcement fixing holes (311) are formed in the number and positions required to fix the printed circuit board (10). A boss or the like formed on a counterpart to which the printed circuit board (10) is fixed is inserted into the component reinforcement fixing hole (311) and fused, thereby fixing the printed circuit board (10).

[0092] Figures 13 and 14 illustrate a third embodiment of an exhaust path, where Figure 13 is an exploded perspective view illustrating a component adhesive layer and a component reinforcing plate, and Figure 14 is a plan view of Figure 13.

[0093] As shown in these drawings, the exhaust path (2330) of the third embodiment is formed by a first air hole (2331) that simultaneously penetrates the component reinforcement plate (310) and the component adhesive layer (320) corresponding to the position of the connecting portion (220), and a second air hole (2332) that simultaneously penetrates the component reinforcement plate (310) and the component adhesive layer (320) corresponding to the position of the fixing portion (230), thereby discharging expanding air bubbles in the stacking direction.

[0094] At this time, for processability and peripheral bubble removal, it is preferable that the first and second air holes (2331, 2332) are formed to be connected to each other, and the discharge path (2330) is formed by simultaneously penetrating the component reinforcement plate (310) and the component adhesive layer (320), so that the length of the path through which bubbles are discharged can be minimized, enabling more rapid bubble discharge.

[0095] In summary, the discharge path (330, 1330, 2330) of the printed circuit board (10) of the present invention can be formed in various embodiments capable of discharging expanded bubbles within the component adhesive layer (320). In this case, the discharge path (1330) of the second embodiment is formed to have a certain length so that the component reinforcement plate (310) can support the entire exposed area (131) to maintain support, and also allows bubbles around the connection portion (220) and the fixing portion (230) to be smoothly discharged. However, since the bubbles are discharged while moving along the air tunnel (1331), it is difficult to discharge them more quickly than the discharge path (330, 2330) formed in the axial direction.

[0096] In addition, the discharge path (2330) of the third embodiment is formed with the first and second air holes (2331, 2332) that connect both the connecting portion (220) and the fixed portion (230), so that the support area of ​​the component reinforcing plate (310) is reduced the most, but the discharge of expanded air bubbles around the connecting portion (220) and the fixed portion (230) is smooth, and the entire discharge path (2330) is formed open in the axial direction, so that the air bubbles are quickly discharged.

[0097] In addition, the discharge path (330) of the first embodiment is formed by a horizontal discharge path (331) formed by removing the component adhesive layer (320) at the location of the connecting portion (220) and the fixing portion (230), and a vertical discharge path (332) connected to the horizontal discharge path (331) at the location of the connecting portion (220) and the fixing portion (230), thereby minimizing the reduction in the support area and at the same time forming a vertical discharge path (332) that is axially open at the location of the connecting portion (220) and the fixing portion (230) where soldering is directly performed, thereby allowing air bubbles to be discharged quickly.

[0098] At this time, the horizontal discharge path (331) is formed to extend a predetermined length to one side from the position of the connecting portion (220) and the fixing portion (230) so that air bubbles in the vicinity where soldering is directly performed are also smoothly discharged.

[0099] In other words, the discharge paths (330, 1330, 2330) of different embodiments have the same purpose, function, and effect, but the support area of ​​the component reinforcement plate (310) and the air bubble discharge path are different, so that the most suitable example can be selected by considering the type of the mounted electrical component (200) and the size and installation location of the printed circuit board (10).

[0100] Accordingly, the printed circuit board (10) of the present invention has a discharge path (330) for discharging air bubbles in the component adhesive layer (320) that expands during the process of mounting the electrical component (200), thereby ensuring electrical connection stability between the electrical component (200) and the circuit layer (103), and also stably fixing the component reinforcement portion (300), thereby improving the reliability and durability of the product.

[0101] Furthermore, it has the effect of preventing defects from occurring due to the flatness of the printed circuit board (10) being lowered by bubbles, and also solving problems such as a decrease in tensile strength and a decrease in electrical connection stability with the electric component (200), thereby improving the reliability of an external device connected to the printed circuit board (10).

[0102] Although the preferred embodiments of the present invention have been described above as examples, the scope of the present invention is not limited to these specific embodiments, and any modifications that may be appropriately made within the scope described in the claims fall within the scope of protection of the present invention.

Claims

1. A substrate portion (100) in which first and second insulating layers (101, 102) are formed vertically, and a circuit layer (103) is formed between the first and second insulating layers (101, 102); An electrical component (200) mounted on an exposed area (131) where the circuit layer is exposed by removing a portion of the first insulating layer (101); and It includes a component reinforcement part (300) attached to the second insulating layer (102) of the above exposure area (131) and supporting the above electric component (200); The above component reinforcement part (300) It includes a component reinforcement plate (310) bonded to the second insulating layer (102) of the above-mentioned exposure area (131), a component adhesive layer (320) formed between the second insulating layer (102) and the component reinforcement plate (310), and a fuse adhesive layer (340) formed on the opposite surface of the component adhesive layer (320) of the component reinforcement plate (310). The above substrate (100) is It further includes a pattern fuse portion (150) formed in a form that allows a portion of the above circuit layer (103) to function as a fuse. The above pattern fuse portion (150) includes a melting portion (151) that melts faster than other portions of the circuit layer (103) above a certain current. A printed circuit board characterized in that one side of the above pattern fuse portion (150) is attached and fixed to the above fuse adhesive layer (340).

2. In paragraph 1, The above component reinforcement part (300) is A discharge path (330, 1330, 2330) for discharging air bubbles within the above-mentioned component adhesive layer (320); A printed circuit board characterized by further including:

3. In paragraph 2, The above-mentioned electric component (200) A connection portion (220) is formed by soldering and electrically contacting the circuit layer (103) exposed to the above exposure area (131), The above exhaust path (330, 1330, 2330) A printed circuit board characterized in that it is formed corresponding to the position of the above connection portion (220).

4. In paragraph 3, The above exhaust path (330, 1330, 2330) A printed circuit board characterized in that the component adhesive layer (320) is formed by removing the horizontal discharge path (331) at the location of the connecting portion, and the vertical discharge path (332) is formed by penetrating the component reinforcement plate (310) so as to be in communication with the horizontal discharge path (331).

5. In paragraph 4, The above fuse adhesive layer (340) is formed in the remaining portion except for the position corresponding to the melting portion (151), and a void portion (345) is formed in the position corresponding to the melting portion (151). A printed circuit board characterized in that the vertical discharge path (332) is formed to communicate with the gap portion (421).

6. In paragraph 2, In the above exposure area (131) A fixed circuit (132) is formed in which the above-mentioned electric component (200) is fixed by soldering, The above exhaust path (330, 1330, 2330) A printed circuit board characterized in that it is additionally formed corresponding to the position of the above fixed circuit (132).

7. In paragraph 1, A printed circuit board characterized in that the above fuse bonding layer (340) is formed in a portion other than a portion corresponding to the melting portion (151), and a void portion (345) is formed in a portion corresponding to the melting portion (151).

8. In paragraph 1, The above pattern fuse part (150) is Connection pads (152) formed at both ends of the above melting portion (151); A printed circuit board characterized by further including:

9. In paragraph 8, A printed circuit board characterized in that the width of the above connection pad (152) is wider than the width of the above melting portion (151).

10. In paragraph 8, A printed circuit board characterized in that at least one of the first insulating layer (101) and the second insulating layer (102) on which the connection pad (152) is formed is not formed, so that the connection pad (152) is exposed to the outside.

11. In paragraph 10, A printed circuit board characterized in that a protective coating liquid is applied to the upper side of the above connection pad (152).

12. In paragraph 8, The above pattern fuse part (150) is An interference prevention part (153) surrounding the above melting part (151) and from which the circuit layer (103) is removed; A printed circuit board characterized by further including:

13. In paragraph 8, The above pattern fuse part (150) is A concentrated melting portion (154) in which at least one of the first insulating layer (101) and the second insulating layer (102) of at least a portion of the above melting portion (151) is open; A printed circuit board characterized by further including:

14. In paragraph 13, A printed circuit board characterized in that a protective coating liquid is applied to the open surface of the above-mentioned concentrated melting portion (154).

15. In paragraph 8, The above pattern fuse part (150) is An overflow prevention portion (155) formed as a closed curve surrounding the pattern fuse portion (150) and protruding from at least one of the first insulating layer (101) and the second insulating layer (102); A printed circuit board characterized by further including:

16. In paragraph 3, The above exhaust path (330, 1330, 2330) A printed circuit board characterized in that the above component adhesive layer (320) is formed as an air tunnel (1331) removed from the position of the connecting portion (220) to one end of the exposed area (131).

17. In paragraph 1, The above component reinforcement part (300) is A component reinforcement fixing hole (311) formed by penetrating the above component reinforcement part (300); A printed circuit board characterized by further including:

18. In paragraph 3, The above exhaust path (330, 1330, 2330) A printed circuit board characterized in that the above component reinforcement plate (310) and the above component adhesive layer (320) are formed with air holes (2331, 2332) penetrating at the location of the connecting portion (220).

Images