Heat dissipation housing, liquid cooling device, and vehicle

Abstract

Embodiments of the present application provide a heat dissipation housing, a liquid cooling device, and a vehicle. The heat dissipation housing comprises a cold plate, a first heat dissipation boss, and a housing; a flow channel used for circulating a heat exchange working medium is formed in the cold plate; and the first heat dissipation boss protrudes from the cold plate. The housing comprises a side wall and a top wall, and the side wall and the top wall define an accommodating space used for accommodating a first chip. The top wall is provided with a first opening communicated with the accommodating space. The first heat dissipation boss passes through the first opening. The first heat dissipation boss is used for transferring heat of the first chip to the cold plate. The heat emitted by the first chip is transmitted to the heat exchange working medium in the flow channel by means of the first heat dissipation boss for heat dissipation, so that the heat transfer path is shortened, thereby improving the heat dissipation efficiency of the heat dissipation housing, the liquid cooling device, and the vehicle.

Description

Radiating housing, liquid cooling device and vehicle

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 7, 2024, with application number 202410175984.0 and application name “Heat dissipation housing, liquid cooling device and vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of liquid cooling technology, and in particular to a heat dissipation housing, a liquid cooling device and a vehicle. Background Art

[0003] High-computing-power computing modules are widely used in fields such as intelligent driving and intelligent cockpits. As the power consumption of chip heat dissipation continues to increase, a heat dissipation structure with high heat dissipation power is required. Due to the characteristics of large specific heat capacity and strong heat absorption of liquid cooling, liquid cooling solutions are now increasingly used in high-computing-power computing modules for heat dissipation. In a high-computing-power computing module, a liquid cooling plate is provided on the shell, a heat-conducting layer is provided between the liquid cooling plate and the shell, and the chip is accommodated in the shell. When the liquid cooling plate dissipates heat for the chip, the heat generated by the chip needs to pass through the shell, the heat-conducting layer and other structures before it is transferred to the liquid cooling plate. As a result, the heat path for the chip to transfer heat is longer, affecting the heat dissipation efficiency. Summary of the Invention

[0004] Embodiments of the present application provide a heat dissipation housing, a liquid cooling device, and a vehicle that are conducive to improving heat dissipation efficiency.

[0005] In a first aspect, embodiments of the present application provide a heat dissipation housing comprising a cold plate, a first heat dissipation boss, and a housing. The cold plate is provided with a flow channel for circulating a heat exchange medium, and the first heat dissipation boss is protruding from the cold plate. The housing comprises side walls and a top wall. The side walls and the top wall define a storage space for accommodating a first chip. The top wall is provided with a first opening communicating with the storage space. The first heat dissipation boss is disposed through the first opening. The first heat dissipation boss is configured to transfer heat from the first chip to the cold plate.

[0006] The heat dissipation shell provided in the present application has a first heat dissipation boss that is used to pass through the first opening to directly fit with the first chip. The heat emitted by the first chip is transferred to the heat exchange medium in the flow channel through the first heat dissipation boss for dissipation, shortening the heat transfer path, which is beneficial to improving the heat dissipation efficiency of the heat dissipation shell and the liquid cooling device having the heat dissipation shell.

[0007] According to the first aspect, in this possible implementation, the cold plate and the first heat dissipation boss are welded into an integrated structure.

[0008] In this possible implementation, the cold plate and the first heat dissipation boss are welded into an integrated structure, and there is no filler such as colloid or thermal conductive material between the cold plate and the first heat dissipation boss, which is beneficial to further shorten the heat transfer path and improve the heat dissipation efficiency and temperature uniformity of the heat dissipation housing.

[0009] According to the first aspect, in this possible implementation, the cold plate is made by a sheet metal process.

[0010] In conventional technology, metal parts can be made by die casting and forging. Die casting is a metal casting process, which is characterized by applying high pressure to the molten metal in the inner cavity of the mold. The mold is usually made of a higher strength alloy. Forging is a processing method that uses a forging machine to apply pressure to a metal blank to cause it to undergo plastic deformation to obtain forgings with certain mechanical properties, a certain shape and size. It is one of the two major components of forging (forging and stamping). However, due to the limitations of the die casting process, the density of the metal parts obtained by the die casting process is not high. If the required strength is to be achieved, the plate thickness of the metal part or the wall thickness of the flow channel will be thicker. In this way, the overall weight of the cold plate obtained by the die casting process and the shell with the cold plate will increase. Compared with the die casting process, although the wall thickness of the metal parts obtained by the forging process will be reduced, it is still difficult to meet the lightweight requirements of the system that requires the application of the cold plate.

[0011] In this possible implementation, the cold plate is manufactured using a sheet metal process. Sheet metal is sometimes also called sheet metal. Sheet metal is formed by plastically deforming thin metal sheets by hand or die stamping to create the desired shape and size. This can then be further formed into more complex parts through welding or minimal machining. Because sheet metal is used in sheet metal processing, the thickness or wall thickness of the cold plate manufactured using this process is thinner than that of cold plates made using die-casting or forging processes, which helps reduce the weight of the cold plate and, therefore, the overall weight of the heat sink housing.

[0012] In addition, since the wall thickness of the cold plate is thinner, it is beneficial to increase the flow channel volume, thereby increasing the flow rate of the circulating heat exchange medium and improving the heat dissipation efficiency of the heat dissipation shell.

[0013] In addition, the sheet metal process to produce cold plates can reduce the difficulty and cost of the process compared to die casting and forging.

[0014] According to the first aspect, in this possible implementation, the heat dissipation housing also includes a second heat dissipation boss, the second heat dissipation boss is protruded from the cold plate, the top wall of the accommodating space is also provided with a second opening connected to the accommodating space, the second heat dissipation boss is passed through the second opening, and the second heat dissipation boss is used to transfer the heat of the second chip accommodated in the accommodating space to the cold plate.

[0015] In this possible implementation, the accommodating space can accommodate one or more chips, so that the heat dissipation housing can support the heat dissipation of multiple chips.

[0016] According to the first aspect, in this possible implementation, a first boss is provided on a side of the shell facing the cold plate. The first boss is arranged around the first opening and is sealed to the side of the cold plate facing the shell.

[0017] In this possible implementation, the first boss is sealed against the side of the cold plate facing the housing, reducing the ingress of dust, moisture, and other debris into the housing space through the gap between the cold plate and the housing, thereby improving the sealing performance of the housing space. Furthermore, if both the cold plate and the housing are metal, they form a metal shield that protects the housing space and reduces the possibility of electromagnetic interference.

[0018] According to the first aspect, in this possible implementation, a first receiving groove is recessed on the first boss, and the first receiving groove is arranged around the first opening; the heat dissipation housing also includes a sealing colloid, which is received in the first receiving groove and bonded between the inner wall of the first receiving groove and the cold plate.

[0019] In this possible implementation, since the sealing colloid is contained in the first receiving groove, the possibility of the sealing colloid overflowing is reduced.

[0020] According to the first aspect, in this possible implementation, the first heat dissipation boss includes at least one of a copper block, a heat pipe, and a heat spreader.

[0021] In this possible implementation, the first heat dissipation boss includes at least one of a copper block, a heat pipe and a heat spreader. The copper block, the heat pipe and the heat spreader all have excellent thermal conductivity, which is beneficial to improving the heat dissipation efficiency and temperature uniformity of the heat dissipation housing.

[0022] According to the first aspect, in this possible implementation, the housing is a die-cast housing.

[0023] In this possible implementation, since the die-casting process uses a mold to shape the molten metal, it is more convenient to form a shell with a complex structure compared to sheet metal and forging processes, and can reduce manufacturing costs.

[0024] In a second aspect, an embodiment of the present application further provides a liquid cooling device, which includes a circuit board, a first chip, and a heat dissipation housing according to the first aspect. The first chip is arranged on the circuit board and is accommodated in the accommodating space.

[0025] The liquid cooling device provided in the present application has a first heat dissipation boss of the heat dissipation shell that can pass through the first opening and directly fit with the first chip. The heat dissipated by the first chip is exchanged with the heat exchange medium in the flow channel through the first heat dissipation boss, thereby shortening the heat transfer path and improving the heat dissipation efficiency of the liquid cooling device.

[0026] According to the second aspect, in this possible implementation, the liquid cooling device further includes a heat conducting layer, and the heat conducting layer is located between the first chip and the first heat dissipation boss.

[0027] In this possible implementation, the heat conducting layer is used to transfer the heat of the first chip to the first heat dissipation boss, and then transfer it to the heat exchange medium in the flow channel by the first heat dissipation boss, which is beneficial to improving the heat dissipation efficiency of the liquid cooling device.

[0028] According to the second aspect, in this possible implementation, the circuit board covers an end of the accommodating space away from the cold plate and is located outside the accommodating space, and the first chip is located between the first heat dissipation boss and the circuit board.

[0029] In this possible implementation, the circuit board is located outside the storage space, allowing the first chip and other electronic components to share the same circuit board, which helps reduce the cost of the liquid cooling device. Furthermore, the circuit board cover is placed at the end of the storage space away from the top wall, creating a sealed storage space and reducing the impact of heat generated by the first chip on other components on the circuit board.

[0030] According to the second aspect, in this possible implementation, a circuit board is accommodated in the accommodating space, and the first chip is located between the first heat dissipation boss and the circuit board.

[0031] In this possible implementation, the circuit board is accommodated in the accommodating space, which reduces the thickness of the cold plate and the shell in the stacking direction.

[0032] In a third aspect, the present application provides a vehicle comprising a vehicle body and a liquid cooling device according to the second aspect, wherein the liquid cooling device is provided on the vehicle body. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] FIG1 is a schematic diagram of a vehicle provided in some embodiments of the present application;

[0034] FIG2A is a schematic diagram of a liquid cooling device provided in some embodiments of the present application;

[0035] FIG2B is a top view of the liquid cooling device shown in FIG2A ;

[0036] FIG2C is a side view of the liquid cooling device shown in FIG2A ;

[0037] FIG3 is a cross-sectional view of the liquid cooling device taken along line II shown in FIG2A;

[0038] FIG4 is a perspective schematic diagram of the cold plate, the first heat dissipation boss, and the second heat dissipation boss assembled together;

[0039] FIG5 is a perspective exploded schematic diagram of the cold plate, the first heat dissipation boss, and the second heat dissipation boss;

[0040] FIG6 is a perspective exploded schematic diagram of the liquid cooling device shown in FIG2A ;

[0041] FIG7 is a perspective exploded schematic diagram of the liquid cooling device shown in FIG2A from another perspective;

[0042] FIG8 is a perspective schematic diagram of the housing, the cold plate, the first heat dissipation boss, and the second heat dissipation boss assembled together;

[0043] FIG9 is an enlarged schematic diagram of a portion of FIG3 ;

[0044] FIG10 is a schematic diagram of a liquid cooling device provided in some embodiments of the present application.

[0045] Figure markings: 100-vehicle; 101-vehicle body; 102-liquid cooling device; 10-heat dissipation housing; 12-cold plate; 122-flow channel; 124-sheet metal body; 1242-first groove; 1244-second groove; 126-heat dissipation teeth; 128-plate body; 1282-liquid inlet; 1284-liquid outlet; 14-first heat dissipation boss; 15-second heat dissipation boss; 16-housing; 162-side wall; 164-top wall; 1642-first opening; 1644-second opening; 1646-first boss; 1648-first receiving groove; 1649-first extending protrusion; 1650-first connecting hole; 166-accommodating space; 20-first chip; 30-second chip; 40-circuit board; 50-bottom shell; 60-first fastener; 70-sealing colloid; 80-thermal conductive layer. DETAILED DESCRIPTION

[0046] Referring to FIG. 1 , some embodiments of the present application provide a vehicle 100 comprising a vehicle body 101 and a liquid cooling device 102, wherein the liquid cooling device 102 is disposed on the vehicle body 101. The vehicle 100 may be a fuel vehicle 100 or a new energy vehicle 100. The liquid cooling device 102 may be disposed in a location such as the cabin of the vehicle body 101, and the present application does not limit the location of the liquid cooling device 102 on the vehicle body 101. The present application does not limit the application of the liquid cooling device 102 to the vehicle 100; the liquid cooling device 102 may also be used in other fields, such as data centers.

[0047] Referring to Figures 2A, 2B, 2C, and 3, the liquid cooling device 102 includes a heat dissipation housing 10, a first chip 20, a second chip 30, a circuit board 40, and a bottom case 50. The heat dissipation housing 10 houses and dissipates heat from the first and second chips 20, 30. Both the first and second chips 20, 30 are mounted on the circuit board 40, which supports the first and second chips 20, 30. Since the first and second chips 20, 30 share the same circuit board 40, the structure of the liquid cooling device 102 is simplified and assembly and disassembly of the liquid cooling device 102 is facilitated. The bottom case 50 is located on the side of the circuit board 40 facing away from the first chip 20 to protect and support the circuit board 40. The bottom case 50 can be fixedly connected to the housing 16. Through holes can be provided in the bottom case 50 to facilitate heat dissipation from components on the circuit board 40. In other embodiments of the present application, the bottom case 50 can be omitted, and the circuit board 40 can be mounted directly on the housing 16.

[0048] The heat dissipation housing 10 includes a cold plate 12, a first heat dissipation boss 14, a second heat dissipation boss 15, and a housing 16. A flow channel 122 is provided within the cold plate 12 for circulating a heat exchange medium. The first and second heat dissipation bosses 14, 15 protrude from the cold plate 12 and extend through the housing 16. The first heat dissipation boss 14 transfers heat generated by the first chip 20 to the cold plate 12 for dissipation. The second heat dissipation boss 15 transfers heat generated by the second chip 30 to the cold plate 12 for dissipation.

[0049] The heat exchange working fluid can be a coolant, such as water, ethylene glycol solution, propylene glycol solution, or fluorinated liquid. The heat exchange working fluid can also include a gas. The working fluid can be a single component or a mixture of at least two heat exchange working fluids (for example, a mixed liquid formed by mixing at least two coolants). The heat exchange working fluid can maintain a single phase (i.e., no phase change) during the flow process, or it can be two-phase (i.e., converting between a liquid phase and a gas phase). It is understood that the desired type of heat exchange working fluid can be selected according to needs.

[0050] Metal parts can be made through die casting and forging. Die casting is a metal casting process characterized by applying high pressure to molten metal within a die cavity. The die is typically made of a higher-strength alloy. Forging is a machining process that uses a forging press to apply pressure to a metal blank, causing it to plastically deform, resulting in forgings with specific mechanical properties, shapes, and dimensions. It is one of the two main components of forging (forging and stamping). However, due to the limitations of the die casting process, the density of the cold plate produced by the die casting process is insufficient or low. To achieve the required strength, the cold plate thickness or the wall thickness of the flow channel must be thicker, which increases the overall weight of the cold plate produced by the die casting process and the device incorporating the cold plate. Although the thickness of the cold plate or the wall thickness of the flow channel can be reduced compared to the die casting process, it still cannot meet the lightweight requirements of the device requiring the cold plate. In addition, forging has limited forming capacity, is heavy, and requires additional machining and cleaning processes, resulting in high mass production costs and long process times.

[0051] In some embodiments of the present application, the cold plate 12 is made by a sheet metal process. Sheet metal is sometimes also called sheet metal. Sheet metal is a process in which some thin metal plates are plastically deformed by hand or die stamping to form a desired shape and size, and can be further formed into more complex parts by welding or a small amount of machining. Since thin metal plates are required in the sheet metal process, the plate thickness of the cold plate 12 or the wall thickness of the flow channel 122 made by the sheet metal process will be thinner than the plate thickness of the cold plate 12 or the wall thickness of the flow channel 122 made by die casting or forging, which is beneficial to reducing the weight of the cold plate 12, thereby reducing the overall weight of the heat dissipation housing 10 and the liquid cooling device 102.

[0052] Please refer to Figures 3, 4 and 5 in combination. The cold plate 12 includes a sheet metal body 124, a plurality of heat dissipation teeth 126 and a plate body 128. The sheet metal body 124 and the plate body 128 are stacked and fixedly connected. The plurality of heat dissipation teeth 126 are located between the sheet metal body 124 and the plate body 128. The sheet metal body 124, the plurality of heat dissipation teeth 126 and the plate body 128 form a plurality of flow channels 122. The sheet metal body 124 is generally a curved structure. In some embodiments of the present application, the sheet metal body 124 forms a first groove 1242 (as shown in Figure 3) and a second groove 1244 (as shown in Figure 3) spaced apart on one side facing the shell 16, and the first groove 1242 and the second groove 1244 are both used to accommodate the plurality of heat dissipation teeth 126.

[0053] The plate body 128 is provided with a liquid inlet 1282 and a liquid outlet 1284 connected to the flow channel 122. The liquid inlet 1282 is used to input a heat exchange medium, and the liquid outlet 1284 is used to output the heat exchange medium. In this embodiment, when the cold plate 12 performs liquid cooling and heat dissipation, the liquid inlet 1282 inputs a heat exchange medium at a first temperature, and the liquid outlet 1284 is used to output a heat exchange medium at a second temperature. The first temperature is lower than the second temperature. After the heat exchange medium at the first temperature enters the flow channel 122, it absorbs the heat emitted by the first chip 20 and the second chip 30, and the temperature of the heat exchange medium rises to the second temperature. It will be understood that this application does not limit the first temperature to be lower than the second temperature.

[0054] The sheet metal body 124 and the plurality of heat dissipating teeth 126 are both manufactured using a sheet metal process. The plate body 128 can also be manufactured using a sheet metal process. When manufacturing the cold plate 12, a sheet metal sheet can be formed into the sheet metal body 124 having a curved structure using a sheet metal process, and the plurality of heat dissipating teeth 126 can be formed into the sheet metal body 126 using a sheet metal process. In the process of manufacturing the sheet metal body 124 and the plurality of heat dissipating teeth 126 using a sheet metal process, cold extrusion, stamping, brazing, or other processes can also be used for forming. The plurality of heat dissipating teeth 126 are welded between the sheet metal body 124 and the plate body 128 using a welding process, and the sheet metal body 124 and the plate body 128 are welded together using a welding process, so that the sheet metal body 124, the plurality of heat dissipating teeth 126, and the plate body 128 form an integral structure of the cold plate 12. For example, the plurality of heat dissipating teeth 126 are welded between the plate body 128 and the sheet metal body 124 using a brazing process, and the sheet metal body 124 and the plate body 128 are welded together using a brazing process. Since the cold plate 12 is thinner, the diameter or width of the heat dissipation teeth 126 is smaller, and the spacing between the heat dissipation teeth 126 is larger, it is beneficial to increase the volume of the flow channel 122 that accommodates the heat exchange medium, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the heat dissipation housing 10.

[0055] Furthermore, the cold plate 12 is manufactured by a sheet metal process, which can reduce the difficulty and cost of the manufacturing process compared to die casting and forging processes.

[0056] Furthermore, the density of the cold plate 12 manufactured by the sheet metal process is higher than that of the cold plate 12 manufactured by die casting or forging, thereby reducing the risk of leakage of the heat exchange medium in the cold plate 12 .

[0057] It is understood that the present application does not limit the heat dissipation teeth 126 to being welded between the plate body 128 and the sheet metal body 124 by a brazing process. The heat dissipation teeth 126 can be fixed by means of colloid, clamping, etc. It is understood that the present application does not limit the structure and manufacturing process of the cold plate 12. The cold plate 12 only needs to form a flow channel 122 for circulating the heat exchange medium.

[0058] In some embodiments of the present application, the plate body 128 of the cold plate 12 and the first heat dissipation boss 14, as well as the plate body 128 and the second heat dissipation boss 15, are welded together to form an integral structure. The absence of fillers such as colloids or thermally conductive materials between the plate body 128 and the first heat dissipation boss 14, or between the plate body 128 and the second heat dissipation boss 15, further shortens the heat transfer path and improves the heat dissipation efficiency and temperature uniformity of the heat dissipation housing 10.

[0059] Since the cold plate 12 of the present application is made by sheet metal processing, the cold plate 12 has good density and high strength. Compared with metal parts obtained by die casting and forging, the cold plate 12 can withstand first heat dissipation bosses 14 and second heat dissipation bosses 15 with larger areas and thicker thicknesses, which is beneficial to increase the fitting area between the first heat dissipation boss 14 and the first chip 20, and between the second heat dissipation boss 15 and the second chip 30, thereby helping to improve the temperature uniformity of the heat dissipation housing 10.

[0060] In some embodiments of the present application, the first heat dissipation boss 14 includes at least one of a copper block, a heat pipe, and a vapor chamber, and the second heat dissipation boss 15 includes at least one of a copper block, a heat pipe, and a vapor chamber. The copper block, heat pipe, and vapor chamber all have excellent thermal conductivity, which helps improve the heat dissipation efficiency and temperature uniformity of the heat dissipation housing 10.

[0061] In some embodiments of the present application, the housing 16 may be a die-cast housing 16. Because the die-casting process uses a mold to shape molten metal, it is more convenient to form housings 16 with complex structures compared to sheet metal and forging processes. It is understood that the present application does not limit the housing 16 to a die-cast housing 16.

[0062] Referring to Figures 6, 7, and 8, the housing 16 includes sidewalls 162 and a top wall 164, which enclose a housing space 166. The housing space 166 is used to accommodate the first chip 20 and the second chip 30. The top wall 164 defines a first opening 1642 and a second opening 1644, both of which communicate with the housing space 166. The first opening 1642 is used to pass through the first heat dissipation boss 14, and the second opening 1644 is used to pass through the second heat dissipation boss 15. The first heat dissipation boss 14 is inserted through the first opening 1642 and is used to transfer heat from the first chip 20 to the cold plate 12. The second heat dissipation boss 15 is inserted through the second opening 1644 and is used to transfer heat from the second chip 30 to the cold plate 12.

[0063] In the heat dissipation housing 10 provided herein, the first heat dissipation boss 14 is configured to pass through the first opening 1642 to directly engage the first chip 20. Heat dissipated from the first chip 20 is transferred via the first heat dissipation boss 14 to the heat exchange medium in the flow channel 122 for dissipation, shortening the heat transfer path and facilitating improved heat dissipation efficiency of the heat dissipation housing 10 and the liquid cooling device 102 incorporating the heat dissipation housing 10. The second heat dissipation boss 15 is configured to pass through the second opening 1644 to directly engage the second chip 30. Heat dissipated from the second chip 30 is transferred via the first heat dissipation boss 14 to the heat exchange medium in the flow channel 122, shortening the heat transfer path and facilitating improved heat dissipation efficiency of the heat dissipation housing 10 and the liquid cooling device 102 incorporating the heat dissipation housing 10.

[0064] Referring to Figure 9 , the top wall 164 of the housing 16 is fixedly connected to the cold plate 12. In some embodiments of the present application, a first extending protrusion 1649 is provided on a surface of the top wall 164 facing the accommodating space 166. The housing 16 also includes a first connecting hole 1650. The first connecting hole 1650 is provided on a surface of the top wall 164 facing the cold plate 12 and extends to the first extending protrusion 1649. A first fastener 60 is provided through the sheet metal body 124 and the plate body 128 and is fixed to the first extending protrusion 1649. The cold plate 12 and the housing 16 are connected together by the first fastener 60 to improve the connection strength and stability between the housing 16 and the cold plate 12. The first connecting hole 1650 has an internal thread, and the first fastener 60 has an external thread. The first fastener 60 is threadedly connected to the first connecting hole 1650.

[0065] A first boss 1646 is further defined on the surface of the top wall 164 of the housing 16 that faces the cold plate 12. The first boss 1646 surrounds the first opening 1642 and is sealed to the surface of the cold plate 12 that faces the housing 16. The sealed connection between the first boss 1646 and the surface of the cold plate 12 that faces the housing 16 reduces the entry of debris, such as dust and moisture, into the accommodating space 166 through the gap between the cold plate 12 and the housing 16, thereby improving the sealing performance of the accommodating space 166.

[0066] The first boss 1646 is recessed with a first receiving groove 1648. The first receiving groove 1648 is arranged around the first opening 1642 and is used to receive the sealing colloid 70. The sealing colloid 70 is received in the first receiving groove 1648 and is bonded between the inner wall of the receiving groove and the cold plate 12. Since the sealing colloid 70 is contained in the receiving groove, the possibility of the sealing colloid 70 overflowing is reduced. The sealing colloid 70 can be made of liquid sealant, such as CIPG (cured in place gasket) glue, FIPG (formed in palce gasket) glue, etc. The first connecting hole 1650 is provided on the first boss 1646 and is located on the side of the first receiving groove 1648 away from the first opening 1642 to reduce the impact of the interconnection between the first fastener 60, the housing 16, and the cold plate 12 on the sealing performance of the accommodating space 166.

[0067] In some embodiments of the present application, a second extending protrusion is further provided on a surface of the top wall 164 facing the accommodating space 166. The housing 16 further includes a second connecting hole, which is provided on a surface of the top wall 164 facing the cold plate 12 and extends to the second extending protrusion. A second fastener is provided through the sheet metal body 124 and the plate body 128 and is secured to the second extending protrusion. The cold plate 12 and the housing 16 are connected together by the first fastener 60, further enhancing the connection strength and stability between the housing 16 and the cold plate 12. The second connecting hole has an internal thread, and the second fastener has an external thread, which is threadedly connected to the connecting hole 1650.

[0068] A second boss is further provided on the surface of the top wall 164 of the housing 16 that faces the cold plate 12. The second boss is disposed around the second opening 1644 and is sealed to the surface of the cold plate 12 that faces the housing 16. The sealed connection between the second boss and the surface of the cold plate 12 that faces the housing 16 reduces the entry of debris, such as dust and moisture, into the accommodating space 166 through the gap between the cold plate 12 and the housing 16, thereby improving the sealing performance of the accommodating space 166.

[0069] The second boss is recessed into a second receiving groove, which is arranged around the second opening 1644 and is used to accommodate the sealing colloid 70. The sealing colloid 70 is accommodated in the second receiving groove and adhered between the inner wall of the receiving groove and the cold plate 12. Since the sealing colloid 70 is contained in the receiving groove, the possibility of the sealing colloid 70 overflowing is reduced. The sealing colloid 70 can be made of a liquid sealant, such as CIPG (cured in place gasket) glue, FIPG (formed in place gasket) glue, etc. A second connecting hole is provided in the second boss and is located on the side of the second receiving groove away from the second opening 1644 to reduce the impact of the interconnection between the second fastener, the housing 16, and the cold plate 12 on the sealing performance of the accommodating space 166.

[0070] In some other embodiments of the present application, referring to FIG. 10 , the circuit board 40 may also be accommodated in the accommodating space 166 , which can reduce the thickness of the liquid cooling device 102 in the stacking direction of the cold plate 12 and the shell 16 , thereby facilitating a thinner and lighter liquid cooling device 102 .

[0071] In some embodiments of the present application, a thermally conductive layer 80 is provided between the first heat dissipation boss 14 and the first chip 20. The thermally conductive layer 80 on the first chip 20 is used to transfer heat from the first chip 20 to the first heat dissipation boss 14, which is then transferred from the first heat dissipation boss 14 to the heat exchange medium in the flow channel 122, thereby improving the heat dissipation efficiency of the liquid cooling device 102. A thermally conductive layer 80 is provided between the second heat dissipation boss 15 and the second chip 30. The thermally conductive layer 80 on the second chip 30 is used to transfer heat from the second chip 30 to the second heat dissipation boss 15, which is then transferred from the second heat dissipation boss 15 to the heat exchange medium in the flow channel 122, thereby improving the heat dissipation efficiency of the liquid cooling device 102.

[0072] The present application does not limit the number of heat dissipation bosses on the cold plate 12. For example, the cold plate 12 can also be provided with a third heat dissipation boss, and the top wall 164 can also have a third opening, and the third heat dissipation boss is passed through the third opening. The liquid cooling device 102 also includes a third chip, and the third chip is located between the circuit board 40 and the third heat dissipation boss.

[0073] In some embodiments of the present application, the circuit board 40 covers the end of the side wall 162 away from the top wall 164, the first chip 20 is located between the first heat dissipation boss 14 and the circuit board 40, and the second chip 30 is located between the second heat dissipation boss 15 and the circuit board 40. The circuit board 40 is located outside the accommodating space 166, and the first chip 20, the second chip 30, and other electronic components can share the same circuit board 40, which helps reduce the cost of the liquid cooling device 102. In addition, the circuit board 40 covers the end of the accommodating space 166 away from the top wall 164, which helps form a sealed accommodating space 166, reducing the heat generated by the first chip 20 and the second chip 30 from dissipating from the side of the housing 16 near the circuit board 40 and affecting other components of the vehicle 100.

[0074] In some embodiments of the present application, the second chip 30, the second heat dissipation boss 15, and the second opening 1644 can be omitted, that is, the heat dissipation shell 10 of the liquid cooling device 102 includes a cold plate 12, a first heat dissipation boss 14 and a shell 16, and a flow channel 122 for circulating a heat exchange medium is provided in the cold plate 12, and the first heat dissipation boss 14 is protruded from the cold plate 12; the shell 16 includes a side wall 162 and a top wall 164, and the side wall 162 and the top wall 164 form a accommodating space 166 for accommodating the first chip 20, and the top wall 164 is provided with a first opening 1642 connected to the accommodating space 166, and the first heat dissipation boss 14 is passed through the first opening 1642, and the first heat dissipation boss 14 is used to transfer the heat of the first chip 20 to the cold plate 12.

[0075] As shown in FIG10 , the circuit board 40 can also be housed in the accommodating space 166 and fixed to the housing 16. The housing 16, the circuit board 40, and the cold plate 12 can enclose a space for accommodating the first chip 20. It is understood that the circuit board 40 can be directly supported by the bottom case 50 or other structures without being fixed to the housing 16.

[0076] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0077] In addition, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0078] In this application, expressions including ordinal numbers such as "first" and "second" may modify various elements. However, such elements are not limited by the above expressions. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used to distinguish one element from other elements. For example, a first user device and a second user device indicate different user devices, even though the first user device and the second user device are both user devices. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0079] When a component is referred to as being "connected" or "accessed" to another component, it should be understood that the component is not only directly connected to or accessed to the other component, but also that another component may exist between the component and the other component. On the other hand, when a component is referred to as being "directly connected to" or "directly accessed" to another component, it should be understood that no component exists between them.

[0080] The above descriptions are merely specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be readily conceived by a person skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation housing, characterized in that: The heat dissipation housing includes a cold plate, a first heat dissipation boss and a housing. The cold plate is provided with a flow channel for circulating a heat exchange medium. The first heat dissipation boss is protruding from the cold plate. The shell includes side walls and a top wall, the side walls and the top wall enclose a accommodating space for accommodating a first chip, the top wall is provided with a first opening connected to the accommodating space, the first heat dissipation boss is passed through the first opening, and the first heat dissipation boss is used to transfer heat of the first chip in the accommodating space to the cold plate.

2. The heat dissipation housing according to claim 1, characterized in that: The cold plate and the first heat dissipation boss are welded into an integrated structure.

3. The heat dissipation housing according to claim 1, wherein: The cold plate is made by a sheet metal process.

4. The heat dissipation housing according to any one of claims 1 to 3, characterized in that: The heat dissipation housing further includes a second heat dissipation boss, which is protruding from the cold plate. The top wall of the accommodating space further includes a second opening communicating with the accommodating space. The second heat dissipation boss is penetrated through the second opening, and is used for transferring heat of the second chip accommodated in the accommodating space to the cold plate.

5. The heat dissipation housing according to any one of claims 1 to 4, characterized in that: A first boss is provided on a side of the shell facing the cold plate. The first boss is arranged around the first opening and is sealed to a side of the cold plate facing the shell.

6. The heat dissipation housing according to claim 5, characterized in that: The first boss is provided with a first receiving groove, which is arranged around the first opening; the heat dissipation housing further comprises a sealing colloid, which is received in the first receiving groove and bonded between the inner wall of the first receiving groove and the cold plate.

7. The heat dissipation housing according to any one of claims 1 to 6, characterized in that: The first heat dissipation boss includes at least one of a copper block, a heat pipe and a heat spreader.

8. The heat dissipation housing according to any one of claims 1 to 7, characterized in that: The housing is a die-cast housing.

9. A liquid cooling device, characterized in that: The liquid cooling device includes a circuit board, a first chip, and a heat dissipation housing according to any one of claims 1 to 8, wherein the first chip is arranged on the circuit board and is accommodated in the accommodating space.

10. The liquid cooling device according to claim 9, characterized in that: The liquid cooling device further includes a heat conducting layer, and the heat conducting layer is located between the first chip and the first heat dissipation boss.

11. The liquid cooling device according to claim 9 or 10, characterized in that: The circuit board covers one end of the accommodating space away from the cold plate and is located outside the accommodating space. The first chip is located between the first heat dissipation boss and the circuit board.

12. The liquid cooling device according to claim 9 or 10, characterized in that: The circuit board is accommodated in the accommodating space, and the first chip is located between the first heat dissipation boss and the circuit board.

13. A vehicle, characterized in that: It comprises a vehicle body and a liquid cooling device according to any one of claims 9 to 12, wherein the liquid cooling device is arranged on the vehicle body.

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