Cartridge module and multi-wafer test apparatus using same

Abstract

The present invention relates to a cartridge module capable of maintaining its own position through the modularization of a probe card and a wafer, and to a multi-wafer test apparatus capable of testing multiple wafers in a single test by using the cartridge module. The multi-wafer test apparatus according to the present invention includes: at least two chambers (120) connected to a tester (110) and each provided with a test head (121) for electrically connecting the tester (110) to a probe card; a cartridge module (200) including a first body part (210) provided with a probe card (211), and a second body part (220) provided with a wafer chuck (221), on which a wafer (10) is to be seated, and detachably assembled with the first body part (210); a wafer loading part (130) configured to perform unclamping of the first body part (210) and the second body part (220) to detach the first body part (210) from the second body part (220) to load a wafer (10) onto the second body part (220), and to perform a clamping operation to assemble the first body part (210) and the second body part (220); and a transfer part (150) configured to transfer the cartridge module (200) between the wafer loading unit (130) and the chambers (120).

Description

Cartridge module and multi-wafer test device using the same

[0001] The present invention relates to a cartridge module capable of maintaining a magnetic position by modularizing a probe card and a wafer, and a multi-wafer test device capable of performing a test on multiple wafers at once using the cartridge module.

[0002] Generally, semiconductor devices can be formed by repeatedly performing a series of processing processes on a wafer. For example, semiconductor devices can be formed on a wafer by repeatedly performing a deposition process to form a film on the wafer, an etching process to form patterns with electrical characteristics on the deposited wafer, an ion implantation process or diffusion process to implant or diffuse impurities into the patterns, and a cleaning and rinsing process to remove impurities from the wafer on which the patterns have been formed.

[0003] Semiconductor devices manufactured through this series of processes can undergo a wafer inspection process to examine their electrical characteristics. This inspection process is performed by a probe station including a probe card with multiple probes and a tester connected to the probe card to provide electrical signals.

[0004] Typically, a probe station includes an inspection chamber, a chuck positioned within the inspection chamber to support a wafer, a chuck transport device for driving the chuck, a probe card having a plurality of probes configured to contact semiconductor elements formed on the wafer, and a tester connected to the probe card to perform a test.

[0005] In this conventional technology, a chuck transport device transports a chuck on which a wafer is mounted to an inspection chamber, and uses a vision sensor such as a CCD camera to identify the positions of a contact electrode on the wafer and a probe of a probe card, and controls the chuck transport device based on the identified position information to electrically connect the contact electrode of the wafer to the probe by bringing it into contact.

[0006] Typically, these wafer tests are single probe tests that inspect only one wafer at a time. The present invention, by breaking away from the wafer inspection process of the conventional single probe test, develops a cartridge module capable of efficiently inspecting multiple wafers, and a multi-wafer test device utilizing the cartridge module, and files a patent for the same.

[0007] [Prior Art Literature]

[0008] [Patent Document]

[0009] Korean Patent Publication No. 10-2010-0130540 (Publication date: December 13, 2010)

[0010] The present invention aims to provide a cartridge module that modularizes a probe card and a wafer into one for wafer inspection and is capable of maintaining the magnetic position of the probe card and the wafer, and a multi-wafer test device utilizing the cartridge module.

[0011] In order to achieve the above object, a multi-wafer test device according to an embodiment of the present invention comprises: at least two chambers in which a tester is connected and a test head for electrically connecting a probe card and the tester is provided; a cartridge module including a first body part in which a probe card is provided and a second body part in which a wafer chuck for seating a wafer is provided and is detachably assembled with the first body part; a wafer loading part for unclamping the first body part and the second body part to perform a detachable operation of attaching and detaching the first body part and the second body part, loading a wafer into the second body part, and assembling the first body part and the second body part by clamping the first body part; and a transport part for transporting and delivering the cartridge module between the wafer loading part and the chamber.

[0012] Preferably, the chamber includes a guide rail on which the cartridge module is positioned; a temperature control device for temperature control provided at the bottom of the cartridge module mounted on the guide rail; an elevation unit for elevating the temperature control device; and a drive source supply unit for supplying a drive source to the cartridge module mounted on the guide rail.

[0013] Preferably, the apparatus further includes a cartridge module storage unit capable of storing at least two cartridge modules.

[0014] Preferably, the cartridge module includes a magnet holder provided in the second body part corresponding to a guide hole formed through the first body part, a magnet chuck inserted into the guide hole and capable of being fixed by magnetic force with the magnet holder, a weight ring assembled with the second body part at the upper portion of the first body part, and a clamping part provided between the first body part and the weight ring to fix the gap between the first body part and the weight ring.

[0015] Next, a cartridge module according to an embodiment of the present invention is a cartridge module that is provided with a probe card for inspecting a wafer and is modularized and transportable by modularizing the wafer and the probe card, and includes a first body part having a probe card and a guide hole formed vertically through the first body part; a second body part having a wafer chuck on which a wafer is mounted and a magnet holder corresponding to the guide hole so that the probe card and the wafer are electrically connected, and is detachably assembled with the first body part; a weight ring having a magnet chuck that is inserted into the guide hole and can be fixed by magnetic force with the magnet holder, and is assembled with the second body part at an upper portion of the first body part; and a clamping member that clamps / unclamps the first body part and the second body part to fix / detach the first body part and the second body part.

[0016] Preferably, the magnet chuck further includes a friction pad provided between the contact surface with the magnet holder.

[0017] Preferably, the clamping portion includes a shaft, one end of which is fixed to one of the weight ring and the first body portion; and a pneumatic driving portion fixed to the other of the weight ring and the first body portion and fixed to the shaft by a pneumatic signal.

[0018] More preferably, the pneumatic actuator is of a normally closed type.

[0019] Preferably, the second body part includes a saddle body of a heat conductor that comes into contact with the wafer chuck, and the saddle body includes an inner saddle body that is partitioned by an insulating member and comes into direct contact with the wafer chuck, and an outer saddle body that forms the periphery of the inner saddle body.

[0020] More preferably, the inner saddle body further includes a plurality of heat-conducting members formed vertically through the saddle body and having a higher thermal conductivity than the saddle body.

[0021] Preferably, at least two of the magnetic chucks are provided at the lower portion of the weight ring, and more preferably, at least two of the clamping portions are provided between the first body portion and the weight ring.

[0022] More preferably, at least one of the clamping members is provided between adjacent magnet chucks.

[0023] Preferably, the device further includes a guide member interposed between the first body part and the weight ring to guide the assembly position of the first body part and the weight ring.

[0024] The multi-wafer test device of the present invention comprises a cartridge module including at least two chambers, a first body (210) equipped with a probe card, and a second body equipped with a wafer chuck on which a wafer is placed and detachably assembled with the first body, a wafer loading unit for unclamping the first body and the second body to perform a detachable operation for loading a wafer into the second body, and assembling the first body and the second body by clamping the first body and the second body, and a transfer unit for transferring and delivering the cartridge module between the wafer loading unit and the chamber, so that a plurality of wafers can be tested at one time, thereby having the effect of maximizing test efficiency.

[0025] In addition, the cartridge module of the present invention is a cartridge module that is equipped with a probe card for inspecting a wafer, and is modularized and transportable by modularizing the wafer and the probe card, and comprises a first body part having a probe card and a guide hole formed vertically through the first body part, a second body part having a wafer chuck on which a wafer is seated and a magnet holder corresponding to the guide hole so that the probe card and the wafer are electrically connected and detachably assembled with the first body part, a weight ring having a magnet chuck that is inserted into the guide hole and can be fixed by magnetic force with the magnet holder, and assembled with the second body part at the upper part of the first body part, and a clamping member that clamps / unclamps the first body part and the second body part to fix / detach the first body part and the second body part, thereby modularizing and integrally configuring the wafer and the probe card, thereby having the effect of maintaining a precise magnetic position of the probe card and the wafer during the transport of the cartridge module.

[0026] Figure 1 is a planar layout diagram of a multi-wafer test device according to an embodiment of the present invention.

[0027] Figure 2 is a perspective view of a cartridge module according to an embodiment of the present invention.

[0028] Figure 3 is a perspective view showing the attachment / detachment state of a cartridge module according to an embodiment of the present invention.

[0029] Figure 4 is an exploded perspective view of a cartridge module according to an embodiment of the present invention.

[0030] Figure 5 is a plan view of a cartridge module according to an embodiment of the present invention.

[0031] Figures 6 (a) and (b) are front and side views, respectively, of a cartridge module according to an embodiment of the present invention.

[0032] Figure 7 is a cross-sectional diagram of line AA of Figure 2.

[0033] Figure 8 is a cross-sectional diagram of the BB line of Figure 5.

[0034] (a)(b) of FIG. 9 are cross-sectional views showing another embodiment of a cartridge module according to an embodiment of the present invention, and are cross-sectional views taken along the CC line.

[0035] Fig. 10 is a cross-sectional diagram showing another modified example of the second body part in the cartridge module according to an embodiment of the present invention.

[0036] Figure 11 is a front view of a multi-chamber configuration in a multi-wafer test device according to an embodiment of the present invention.

[0037] FIG. 12 is a front view diagram showing an enlarged portion of a multi-chamber in a multi-wafer test device according to an embodiment of the present invention.

[0038] Figure 13 is a schematic diagram showing a cartridge module stacking device in a multi-wafer test device according to an embodiment of the present invention.

[0039] The specific structural and functional descriptions presented in the embodiments of the present invention are merely illustrative for the purpose of explaining embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention may be implemented in various forms. Furthermore, they should not be construed as being limited to the embodiments described herein, but should be understood to include all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention.

[0040] Hereinafter, the present invention will be described in detail with reference to the attached drawings.

[0041] FIG. 1 is a planar layout diagram of a multi-wafer test device according to an embodiment of the present invention, FIG. 2 is a perspective diagram of a cartridge module according to an embodiment of the present invention, and FIG. 3 is a perspective diagram showing a mounting / demounting state of a cartridge module according to an embodiment of the present invention.

[0042] Referring to FIGS. 1 to 3, a multi-wafer test device according to an embodiment of the present invention includes a tester (110), a chamber (120), a wafer loading unit (130), an aligner (140), a transport device (150), and a cartridge module (200).

[0043] The cartridge module (200) includes a first body part (210) equipped with a probe card (211), and a second body part (220) equipped with a wafer chuck (221) and detachably assembled with the first body part (210), and a clamping member is provided between the first body part (210) and the second body part (220), so that the first body part (210) and the second body part (220) are clamped or unclamped by clamping / unclamping of the clamping member, thereby being fixed to or detached from each other. In the present embodiment, the clamping member may be provided by a clamping mechanism in which a clamping operation is performed by a pneumatic signal together with a magnetic force. This cartridge module (200) is mechanically assembled with a first body part (210) and a second body part (220) that can be detachably attached, and a clamping member allows for precise self-positioning between the probe card and the wafer, thereby enabling inspection of multiple wafers at once. A specific embodiment of this cartridge module is described again in the relevant drawings.

[0044] The chamber (120) is a multi-chamber composed of at least two chambers, which provides a test space for a wafer (10), and auxiliary equipment for generating conditions such as an inspection temperature may be provided. Each chamber (120) is equipped with a test head (121) electrically connected to a tester (110), and the test head (121) is connected to a probe card (211) of a cartridge module (200), so that a wafer (10) loaded into the cartridge module (200) is tested. The tester (110) generates a test signal, and the generated test signal is transmitted to the wafer (10) through the test head (121) and the probe card (211).

[0045] The wafer loading section (130) places the wafer (10) to be inspected, and the wafer (10) is loaded into the cartridge module (200). Specifically, the wafer (10) to be inspected is loaded into the second body section (220) separated from the cartridge module (200).

[0046] The aligner (140) is positioned with a cartridge module (200), and first, the first body part (210) and the second body part (220) of the cartridge module (200) are unclamped so that the first body part (210) and the second body part (220) are detached from each other, and the second body part (220) is transferred to the wafer loading part (130). The second body part (220) transferred to the wafer loading part (130) is loaded with a wafer (10) to be inspected on a wafer chuck (221), and the second body part (220) loaded with the wafer (10) is returned to the aligner (140). The second body part (220) returned to the aligner (140) is assembled with the first body part (210) while the wafer (10) is secured therein, and the first body part (210) and the second body part (220) are assembled by clamping operation of the clamping member, and the assembled cartridge module (200) is transferred to the chamber (120) by the transfer part (150) and tested. Meanwhile, although not shown, a loader for loading the wafers that have completed inspection may be further included.

[0047] Meanwhile, in this embodiment, the wafer loading process of the cartridge module (200) is described by dividing it into a wafer loading unit (130) and an aligner (140), but the two processes may not be separate distinct processes but may be one continuous process, and in order to perform this, auxiliary equipment such as a known robot arm, aligner, vision inspection device, or transport device for attaching or detaching or assembling the first body part (210) and the second body part (220) of the cartridge module (200) may be included.

[0048] Preferably, the cartridge module (200) is provided with a utility supply unit for supplying a driving source (power / air) for clamping / unclamping operation, and the cartridge module (200) installed in the wafer loading unit (130) and the aligner (140) can be supplied with a driving source from the outside through the utility supply unit to perform a clamping / unclamping operation.

[0049] Preferably, it further includes a cartridge module storage unit (160) capable of storing a plurality of cartridge modules (200), and the cartridge module storage unit (160) stores probe cards or cartridge modules that require replacement, or stores spare cartridge modules such as new (repaired) probe cards or cartridge modules for replacement.

[0050] Below, each of the above-described components is described in detail with reference to the relevant drawings.

[0051] FIG. 4 is an exploded perspective view of a cartridge module according to an embodiment of the present invention, FIG. 5 is a plan view of a cartridge module according to an embodiment of the present invention, FIG. 6 (a) and (b) are a front view and a side view, respectively, of a cartridge module according to an embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line AA of FIG. 2.

[0052] Referring to FIGS. 4 to 7, the cartridge module (200) of the present embodiment includes a first body part (210), a second body part (220), a weight ring (230), and a clamping part (240).

[0053] The first body part (210) is provided with a probe card (211) at the center, and guide holes (212) are formed vertically through the periphery of the probe card (211). In the present embodiment, the first body part (210) is shown as a member having approximately four sides in a square shape, and the guide holes (212) are arranged at each of the four corners of the first body part (210), but the shape of the first body part and the number and positions of the guide holes can be variously modified. Preferably, the first body part (210) is formed with at least two or more guide holes (212).

[0054] The first body part (210) may be provided with a plurality of freely rotatable rollers (213) at both ends for transport, and these rollers (213) may be provided by a cam follower having a low coefficient of friction and excellent rotational performance, but are not limited thereto.

[0055] The first body part (210) further includes a utility supply part (215) for receiving a driving source from the outside for the clamping / unclamping operation of the cartridge module (200), and in this embodiment, the utility supply part (215) shows a brush (215a) to which power is supplied and an auto coupler (215a) to which compressed air (clean dry air, CDA) is supplied.

[0056] The second body part (220) is provided with a wafer chuck (221) in the center on which a wafer is seated, and a magnet holder (222) is provided corresponding to the guide hole (212) of the first body part (210). The magnet holder (222) may be provided by a magnet chuck (231) provided in a weight ring (230) and a known material (e.g., a ferromagnetic material) that can exert an attractive force by magnetic force. In the present embodiment, four magnet holders (222) are provided at positions corresponding to the guide holes (212). The wafer chuck (221) may be provided with an air fitting (221a) for fixing the seated wafer by vacuum suction.

[0057] The weight ring (230) has a square ring shape and is provided with a magnet chuck (231) at the bottom. The magnet chuck (231) corresponds to the magnet holder (222) of the second body part (220) and is provided with the same number. The magnet chuck (231) may be provided by a permanent magnet or an electromagnet, and is preferably provided by a permanent magnet.

[0058] Preferably, the magnet chuck (231) further includes a friction pad (233) capable of providing frictional force between the contact surface with the magnet holder (222). As illustrated in FIG. 7, the magnet chuck (231) and the magnet holder (222) are fixed by magnetic force and are strongly fixed in the vertical direction (z-axis direction), whereas the fixation in the horizontal direction (xy plane) may be relatively weak, and the friction pad (233) is compressed between the magnet chuck (231) and the magnet holder (222) to provide a frictional force in the horizontal direction, thereby maintaining a precise magnetic position even against a horizontal external force during the movement of the cartridge module (200). This friction pad (233) may be provided by a material having a high coefficient of friction, and may be provided by, for example, a silicon pad, but is not limited thereto.

[0059] Preferably, a plurality of guide pins (232) may be provided at the lower portion of the weight ring (230), and a hole (214) may be formed on the upper surface of the first body part (210) corresponding to each guide pin (232), so that when each guide pin (232) is inserted into the hole (214) during the assembly process of the weight ring (230) and the first body part (210), the assembly positions of the weight ring (230) and the first body part (210) may be aligned. Meanwhile, although the guide pin (232) is illustrated as being provided on the weight ring (230) in the present embodiment, a guide member may be provided in which a plurality of guide pins are provided on the first body part and a plurality of holes are formed corresponding to each guide pin on the weight ring to guide the assembly positions of the first body part (210) and the weight ring (230).

[0060] The clamping part (240) is provided between the first body part (210) and the weight ring (230) to fix the gap between the first body part (210) and the weight ring (230). Preferably, a plurality of clamping parts (240) are provided between the first body part (210) and the weight ring (230).

[0061] This clamping part (240) includes a shaft whose upper end is fixed to the lower part of the weight ring (230), and a pneumatic driving part that is fixed to the first body part (210) and fixes the shaft by an external pneumatic signal. Drawing reference numeral 243 is an air fitting for supplying pneumatic pressure to the clamping part (240).

[0062] Fig. 8 is a cross-sectional diagram of the BB line of Fig. 5, showing the cross-sectional configuration of the clamping part. To aid understanding, only the first body part, weight ring, and clamping part are shown, and the sizes and ratios of the components are exaggerated.

[0063] Referring to FIG. 8, the clamping part (240) includes a shaft (241) whose upper end is fixed by a weight ring (230) and a first bolt (244), and a pneumatic driving part (242) whose lower end is fixed by a first body part (210) and a second bolt (245) to fix the shaft (241), and the shaft (241) moves up and down within the pneumatic driving part (242) or its position (height) is fixed according to a pneumatic signal applied to the pneumatic driving part (242).

[0064] Preferably, the pneumatic drive unit (242) is a clamping mechanism driven by a pneumatic signal of the normal close (NC) type, and while pneumatic pressure is applied to the pneumatic drive unit (242), the shaft (241) can move up and down in the pneumatic drive unit (142). On the other hand, when pneumatic pressure is not applied to the pneumatic drive unit (242), the shaft (241) is clamped and fixed by the pneumatic drive unit (242), and the gap between the first body part (210) and the weight ring (230) is fixed.

[0065] This clamping part (240) can be provided by a clamping mechanism of the RBPS series sold as a 'clamping and braking element' by Zimmer, but is not limited thereto.

[0066] The cartridge module (200) configured in this manner is assembled such that the wafer is placed on the wafer chuck (221) and the first body part (210) and the weight ring (230) are stacked on the upper part of the second body part (220), and the magnet chuck (231) and the magnet holder (222) are fixed by magnetic force, so that the first body part (210), the second body part (220), and the weight ring (230) are fixed to each other. Meanwhile, during the assembly process of the first body part (210), the second body part (220), and the weight ring (230), air pressure is applied to the clamping part (240), so that the shaft (241) can move up and down in the air pressure driving part (242). Afterwards, when the air pressure supplied to the clamping part (240) is finally cut off, the gap between the first body part (210) and the weight ring (230) is fixed by the clamping part (240), so that the magnetic positions of the wafer and the probe card can be fixed.

[0067] In this way, the probe card and wafer can be transported while maintaining their precise magnetic position by the cartridge module (200), and are transferred to the chamber for inspection.

[0068] In Fig. 5, the distances (H1-H4) at each position between the first body part (210) and the weight ring (230) fixed by four clamping parts are shown as an example with arrows. To help understanding, the distances (H1-H4) at each position are expressed exaggeratedly, and it was confirmed that the present invention can maintain the magnetic position within a precise range of less than 10㎛ not only in a horizontal state but also in an inclined state by employing a magnetic chuck and a clamping part using a pneumatic signal.

[0069] Meanwhile, in the embodiment of the present invention, a probe card holder having four magnetic chucks and four clamping parts is described as an example, but the arrangement and number of the magnetic chucks and clamping parts may vary depending on the size of the wafer.

[0070] Fig. 9 (a)(b) is a cross-sectional diagram showing another embodiment of the cartridge module of the present invention and a cross-sectional diagram along the CC line. Duplicate descriptions of the same configuration as the previous embodiment are omitted and the differences are explained.

[0071] Referring to FIG. 9, in the present embodiment, the second body part (320) includes a wafer chuck (321) on which a wafer (10) is mounted, and a saddle body (322)(323) that contacts the wafer chuck (321) to transfer heat generated in the temperature control device (400). Preferably, the saddle body (322)(323) includes an inner saddle body (322) and an outer saddle body (323) partitioned by an insulating member (324). The saddle body (322)(323) is provided by a heat conductor such as aluminum (Al) that transfers heat generated in the temperature control device (400) to the wafer chuck (321). In particular, by partitioning the area that comes into direct contact with the wafer chuck (321) by the insulating member (324) so ​​that heat conduction is achieved through the inner saddle body (322), temperature control of the wafer can be performed more quickly.

[0072] Preferably, the inner saddle body (322) further includes a plurality of heat-conducting members (322a) that penetrate vertically, and the heat-conducting members (322a) may be made of a material having a higher thermal conductivity than the saddle body (322). For example, such heat-conducting members may be silver (Ag), copper (Cu), or an alloy.

[0073] In this way, in the present embodiment, the second body part (320) is provided with an inner saddle body (322) that is in direct contact with the wafer chuck (321) by dividing the saddle body (322)(323) with an insulating member (324), and the inner saddle body (322) is provided with a plurality of heat-conducting members (322a) formed therethrough, so that, compared to a saddle body made of a single material, conductive heat for temperature control of the wafer (10) can be transferred more quickly. In addition, this configuration allows rapid heat dissipation through the outer saddle body (323), thereby preventing heat energy from being concentrated on the wafer (10), and thus maintaining a uniform temperature distribution of the wafer (10).

[0074] Fig. 10 is a cross-sectional diagram showing another modified example of the second body part in the cartridge module according to an embodiment of the present invention.

[0075] The second body part (420) of the present embodiment includes a wafer chuck (thin chuck) (421) on which a wafer (10) is mounted, and a saddle body (422) (423) that contacts the wafer chuck (421) and transfers heat generated from the temperature control device (400).

[0076] In particular, the saddle body (422)(423) includes an inner saddle body (422) and an outer saddle body (423) partitioned by an insulating member (424), and the inner saddle body (422) that comes into direct contact with the wafer chuck (421) includes a plurality of heat-conducting members (422a) that vertically penetrate therethrough, and these heat-conducting members (322a) are made of a material having a higher thermal conductivity than the saddle body (322), so that rapid temperature control and uniform temperature distribution of the wafer can be maintained as described above.

[0077] FIG. 11 is a front view of a multi-chamber in a multi-wafer test device according to an embodiment of the present invention, and FIG. 12 is a front view showing an enlarged portion of a multi-chamber in a multi-wafer test device according to an embodiment of the present invention.

[0078] Referring to FIG. 11, the chamber (120) of the present embodiment is provided by a multi-chamber composed of at least two or more chambers, and the cartridge module (200) can be placed in the chamber (120) by a transfer unit and automatically connected to a tester, and the utility supply unit of the cartridge module (200) can be connected to a drive supply unit provided in the chamber to supply power and air.

[0079] Fig. 12 shows a state in which a cartridge module (200) is installed within a chamber (120), and a roller (213) of the cartridge module (200) is positioned along a guide rail (122), and a temperature control device composed of a heating block (123) and a cooling block (124) is provided at the bottom of the second body part (220). The wafer is heated or cooled to a target temperature by the heating block (123) and the cooling block (124). Reference numeral 124a denotes a cooling manifold through which a refrigerant for cooling is supplied, and reference numeral 126 denotes an air manifold (CDA manifold) for supplying compressed air to the cartridge module (200). A lifting unit (215) for height adjustment may be provided at the bottom of the cooling block (124), and the cartridge module (200) is placed in the chamber, and the heating / cooling block (123) (124) is brought into contact with the second body part (220) by the lifting unit (215), and the temperature of the wafer to be inspected is controlled by a conductive method.

[0080] Figure 13 is a schematic diagram showing a cartridge module stacking device in a multi-wafer test device according to an embodiment of the present invention.

[0081] Referring to Fig. 13, the cartridge module storage unit (160) can accommodate at least two cartridge modules (200) and can be placed adjacent to the chamber.

[0082] The cartridge module storage unit (160) stores probe cards or cartridge modules that require replacement, and is intended for replacement with new (repaired) probe cards or cartridge modules.

[0083] For example, a probe card or cartridge module (200A) that has malfunctioned is moved to the cartridge module loading platform (160) by the transport unit (150) and waits to be taken out for repair, and a probe card or cartridge module (200B) that has been repaired externally is stored in the cartridge module loading platform (160) by the transport cart (170).

[0084] These cartridge module racks (160) can store normal probe cards and cartridge modules that can be used when replacement is required, and the drawing symbol '200C' shows a normal cartridge module, and the drawing symbol '200D' shows an assembly of a first body part (210) and a second body part (230) equipped with a probe card, excluding a second body part (220) equipped with a wafer chuck in a normal cartridge module.

[0085] The present invention described above is not limited to the above-described embodiments and the attached drawings, and it will be apparent to a person skilled in the art to which the present invention pertains that various substitutions, modifications, and changes are possible within a scope that does not depart from the technical spirit of the present invention.

[0086] [Explanation of symbols]

[0087] 110: Tester 120: Chamber

[0088] 130: Wafer loading section 140: Aligner

[0089] 150: Transport section 160: Cartridge module loading platform

[0090] 200: Cartridge module 210: First body part

[0091] 211: Probe Card 112: Guide Ball

[0092] 220, 320, 420: Second body part

[0093] 221: Wafer chuck 222: Magnet holder

[0094] 230: Weight ring 240: Clamping part

[0095] 231: Magnet chuck 232: Friction pad

Claims

1. At least two chambers in which a tester is connected and a test head is provided for electrically connecting the probe card and the tester; A cartridge module including a first body part having a probe card and a second body part having a wafer chuck on which a wafer is mounted and detachably assembled with the first body part; The first body part and the second body part are unclamped to perform a detachment operation of the first body part and the second body part, a wafer is loaded into the second body part, and the first body part and the second body part are assembled by a clamping operation, and a wafer loading unit; A multi-wafer test device including a transport unit for transporting and delivering the cartridge module between the wafer loading unit and the chamber.

2. In the first paragraph, the chamber A guide rail on which the cartridge module is positioned; A temperature control device for temperature control is provided at the bottom of the cartridge module mounted on the above guide rail; An elevating unit for elevating the above temperature control device; A multi-wafer test device including a drive source supply unit for supplying a drive source to a cartridge module mounted on the above guide rail.

3. A multi-wafer test device according to claim 1, further comprising a cartridge module storage unit capable of storing at least two cartridge modules.

4. In the first paragraph, the cartridge module, A magnet holder is provided in the second body part corresponding to the guide hole formed through the first body part. A weight ring that is inserted into the guide hole and has a magnet chuck that can be fixed by magnetic force with the magnet holder, and is assembled with the second body part at the upper part of the first body part; A multi-wafer test device including a clamping part provided between the first body part and the weight ring to fix the gap between the first body part and the weight ring.

5. A multi-wafer test device in accordance with claim 4, wherein the magnet chuck further includes a friction pad provided between a contact surface with the magnet holder.

6. A multi-wafer test device according to claim 4, characterized in that at least two magnetic chucks are provided at the lower portion of the weight ring.

7. A multi-wafer test device, characterized in that in the 6th paragraph, at least two clamping parts are provided between the first body part and the weight ring.

8. A multi-wafer test device according to claim 7, characterized in that at least one clamping member is provided between adjacent magnet chucks.

9. In the fourth paragraph, the clamping part, A shaft having one end fixed to one of the weight ring and the first body portion; A multi-wafer test device comprising a pneumatic drive unit fixed to the other of the weight ring and the first body part and fixed to the shaft by a pneumatic signal.

10. A multi-wafer test device according to claim 9, characterized in that the pneumatic driving unit is of a normally closed type.

11. A multi-wafer test device in claim 4, further comprising a guide member interposed between the first body part and the weight ring to guide the assembly position of the first body part and the weight ring.

12. A cartridge module that is equipped with a probe card for inspecting wafers and can be transported by modularizing the wafer and probe card. A first body part having a probe card and a guide hole formed vertically through it; A second body part that is detachably assembled with the first body part, wherein a wafer chuck is provided on which a wafer is mounted, and a magnet holder is provided corresponding to the guide hole so that the probe card and the wafer are electrically connected; A weight ring that is inserted into the guide hole and has a magnet chuck that can be fixed by magnetic force with the magnet holder, and is assembled with the second body part at the upper part of the first body part; A cartridge module including a clamping member that clamps / unclamps the first body part and the second body part to fix / detach the first body part and the second body part.

13. In the 12th paragraph, the cartridge module further includes a friction pad provided between the contact surface of the magnet chuck and the magnet holder.

14. In the 12th paragraph, the clamping part, A shaft having one end fixed to one of the weight ring and the first body portion; A cartridge module comprising a pneumatic drive unit fixed to the other of the weight ring and the first body part and fixed to the shaft by a pneumatic signal.

15. A cartridge module according to claim 14, characterized in that the pneumatic driving unit is of a normally closed type.

16. In the 12th paragraph, the second body part It includes a saddle body of a heat conductor that comes into contact with the above wafer chuck, A cartridge module including an inner saddle body that is partitioned by an insulating material and comes into direct contact with the wafer chuck, and an outer saddle body that forms the periphery of the inner saddle body.

17. A cartridge module in accordance with claim 16, wherein the inner saddle body further includes a plurality of heat-conducting members formed vertically through the saddle body and having a higher thermal conductivity than the saddle body.

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