Sealed transfer chamber for controlling oxygen content, and semiconductor packaging system

Abstract

The present invention relates to the technical field of semiconductor packaging, and specifically to a sealed transfer chamber for controlling the oxygen content, and a semiconductor packaging system. The sealed transfer chamber comprises a case (1), a gate mechanism (7), a conveying line (2), an air curtain assembly (3) and an air extraction box (4), wherein a cavity (13) is provided inside the case (1); a first transfer port (11) is provided at one end of the case (1), and a second transfer port (12) is provided at the other end of the case (1); the air curtain assembly (3) is provided with several air curtains (31) distributed at intervals; the air extraction box (4) is disposed below the cavity bottom of the cavity (13); the air curtain assembly (3) forms a plurality of barriers for preventing an airflow from flowing, so that most of air entering the cavity (13) through the first transfer port (11) can be confined near the first transfer port (11); and a lower air cavity (41) is disposed below the first transfer port (11), so that a relatively large accumulation space is provided for the air near the first transfer port (11), making oxygen accumulate in the lower air cavity (41), and helping to extract more air in a short time. Therefore, the oxygen control effect of the cavity can be significantly improved, thus realizing low-oxygen and even oxygen-free transfer of a semiconductor product into a sintering cavity.

Description

Sealed transfer chamber and semiconductor packaging system for controlling oxygen content Technical Field

[0001] The present invention relates to the field of semiconductor packaging technology, in particular to a sealed transfer chamber for controlling oxygen content, and also to a semiconductor packaging system comprising the sealed transfer chamber for controlling oxygen content. Background Art

[0002] As semiconductor power density increases and operating temperature rises, higher requirements are placed on the thermal and electrical conductivity of packaging materials. The excellent performance of the sintering process of silver / copper solder paste with micron / nano-sized particles just meets this demand, allowing chips to operate stably in high power density and high temperature environments.

[0003] Preheating, sintering, and cooling are three crucial processes in semiconductor packaging. During the preheating and sintering stages, the heated semiconductor products will oxidize when exposed to oxygen, affecting the quality and reliability of the semiconductor packaging. However, when semiconductor products are added to the preheating and sintering zones from outside, oxygen will inevitably enter, affecting the sintering quality of the semiconductor products. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: in order to solve the problem in the prior art that when semiconductor products are added from the outside into the preheating zone and sintering zone, oxygen will inevitably enter, resulting in affected sintering quality of the semiconductor products, a sealed transfer chamber for controlling oxygen content is provided, and a semiconductor packaging system including the above-mentioned sealed transfer chamber for controlling oxygen content is also provided.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a sealed transfer chamber for controlling oxygen content, comprising:

[0006] A chassis has a cavity inside, a first transfer port is provided at one end of the chassis, and a second transfer port is provided at the other end, wherein the first transfer port and the second transfer port are both connected to the cavity;

[0007] a gate mechanism, disposed at the first transfer port, for opening or blocking the first transfer port, wherein the second transfer port is for communicating with the process chamber;

[0008] a conveying line having a conveying area located in the cavity, the conveying area being used to convey products between the first transfer port and the second transfer port;

[0009] An air curtain assembly comprising a plurality of air curtains spaced apart from each other in a direction from the first transfer port to the second transfer port, wherein the air curtains are located above the conveying area and above the first transfer port;

[0010] And an exhaust box is arranged below the bottom of the cavity, the exhaust box forms a lower air cavity separated from the cavity and located below the first transfer port, the top of one end of the lower air cavity is blocked, and the top of the other end is provided with an air flow port connected to it, the air flow port is located at the end of the first transfer port of the cavity and at the bottom of the cavity, and the end of the lower air cavity with the blocked top is provided with an exhaust port for connecting to the exhaust device.

[0011] Furthermore, an air curtain box is fixed above the cavity, the air curtain box has an upper air cavity, the top of the cavity has an opening, the upper air cavity is connected to the cavity through the opening, the upper end of the air curtain is fixedly connected to the top of the upper air cavity, and the lower end of the air curtain is a free end.

[0012] Furthermore, a partition extends downward from the top of the upper air cavity, the fixing portions are distributed at intervals along the direction from the first transfer port to the second transfer port, and the upper end of the air curtain is fixedly connected to the partition.

[0013] Furthermore, a plurality of strip-shaped gaps are provided on the air curtain at intervals.

[0014] Furthermore, the air curtain is a bendable air curtain.

[0015] Furthermore, it also includes an air blowing assembly, the air blowing assembly including a first air blowing pipe and a second air blowing pipe, the first air blowing pipe and the second air blowing pipe are both used to communicate with a gas source for supplying protective gas;

[0016] The first air blowing pipe is arranged in the cavity at the end where the first transfer port is located, and the first air blowing pipe is provided with a plurality of first air holes facing the first transfer port;

[0017] The second air blowing pipe is arranged in the cavity at the end where the second transfer port is located, and the second air blowing pipe is provided with a plurality of second air holes;

[0018] The height of the first air blowing pipe is higher than that of the second air blowing pipe.

[0019] Furthermore, the first air blowing pipe is located between the first transfer port and the conveying area, and the first air hole is inclined toward the first transfer port.

[0020] Furthermore, the gas source is a gas source that supplies nitrogen.

[0021] Furthermore, the gate mechanism includes a lifting assembly and a gate, the lifting assembly is fixed on the chassis, and a window is passed through the gate;

[0022] The output end of the lifting assembly is fixedly connected to the gate to drive the gate to rise or fall. When the first transfer port is opened, the gate moves until the window is aligned with the first transfer port. When the first transfer port is closed, the gate moves until the window is completely offset from the first transfer port.

[0023] The present invention also provides a semiconductor packaging system, comprising the above-mentioned sealed transfer chamber for controlling oxygen content.

[0024] The beneficial effects of the present invention are as follows: the sealed transfer chamber for controlling oxygen content of the present invention works in coordination with the wind curtain assembly and the lower air cavity. The wind curtain assembly forms multiple barriers that hinder the flow of air, so that most of the air entering the cavity from the first transfer port will be restricted to the vicinity of the first transfer port. The lower air cavity arranged below the first transfer port provides a larger accumulation space for the air near the first transfer port, so that oxygen accumulates in the lower air cavity and helps to extract more gas in a short time. Once oxygen enters the lower air cavity from the air flow port, it will flow toward the exhaust port. The top of the lower air cavity at the end where the exhaust port is located is blocked to prevent oxygen from returning to the cavity, thereby significantly improving the oxygen control effect of the cavity, and further enabling semiconductor products to be transferred into the sintering cavity with low oxygen or even without oxygen.

[0025] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings and examples.

[0027] FIG1 is a three-dimensional schematic diagram of a sealed transfer chamber for controlling oxygen content according to the present invention;

[0028] FIG2 is a schematic top view of a sealed transfer chamber for controlling oxygen content according to the present invention;

[0029] FIG3 is a schematic cross-sectional view taken along the line AA in FIG2 ;

[0030] FIG4 is a partial enlarged schematic diagram of B in FIG3 ;

[0031] FIG5 is a partial enlarged schematic diagram of C in FIG3 ;

[0032] FIG6 is a schematic diagram of an air curtain assembly of a sealed transfer bin for controlling oxygen content according to the present invention being fixed in an air curtain box;

[0033] FIG7 is a schematic front view of an air curtain of a sealed transfer bin for controlling oxygen content according to the present invention;

[0034] FIG8 is a schematic diagram of a gate mechanism of a sealed transfer chamber for controlling oxygen content according to the present invention.

[0035] In the figure: 1, chassis, 11, first transfer port, 12, second transfer port, 13, cavity, 14, opening;

[0036] 2. Conveyor line, 21. Conveyor area;

[0037] 3. Air curtain assembly, 31. Air curtain, 311. Strip notch;

[0038] 4. Air extraction box, 41. Lower air cavity, 42. Air flow outlet, 43. Air extraction outlet;

[0039] 5. Air curtain box, 51. Upper air cavity, 52. Partition;

[0040] 6. First air blowing pipe, 61. First air hole,;

[0041] 7. Gate mechanism, 71. Lifting assembly, 72. Gate, 721. Window, 73. Limiting plate, 74. Limiting slot;

[0042] 8. Second air blowpipe;

[0043] 9. Process cavity. DETAILED DESCRIPTION

[0044] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams that illustrate the basic structure of the present invention only in a schematic manner. Therefore, they only show components relevant to the present invention, and directions and references (e.g., up, down, left, right, etc.) may be used solely to facilitate the description of features in the drawings. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the claimed subject matter is defined solely by the appended claims and their equivalents.

[0045] As shown in Figures 1-8, a sealed transfer chamber for controlling oxygen content includes a chassis 1, a gate mechanism 7, a conveyor line 2, an air curtain assembly 3, and an exhaust box 4;

[0046] The chassis 1 has a cavity 13 inside. A first transfer port 11 is provided at one end of the chassis 1, and a second transfer port 12 is provided at the other end. The first transfer port 11 and the second transfer port 12 are both connected to the cavity 13. The first transfer port 11 and the second transfer port 12 can be arranged opposite each other.

[0047] The gate mechanism 7 is arranged at the first transfer port 11 and is used to open or block the first transfer port 11. The second transfer port 12 is used to communicate with the process chamber 9. The process chamber 9 can be a preheating chamber and / or a sintering chamber and / or a cooling chamber.

[0048] The conveyor line 2 has a conveying area 21 located in the cavity 13, and the conveying area 21 is used to convey products between the first transfer port 11 and the second transfer port 12; the conveyor line 2 can be but is not limited to a chain conveyor line, a roller conveyor line 2 or a synchronous belt conveyor line, etc. Taking the conveyor line 2 as an example of a synchronous belt conveyor line, the conveyor line has a driving pulley, a driven pulley and a synchronous belt, the driving pulley is connected to the driven pulley through a synchronous belt, the driving pulley is connected to the output end of the motor, and the area between the top of the driving pulley and the top of the driven pulley is the conveying area 21; the semiconductor product is placed on the tooling in advance, and the tooling carrying the semiconductor product in the cavity 13 is transferred from the first transfer port 11 to the second transfer port 12 via the conveyor line 2, and enters the process chamber 9 (preheating chamber and / or sintering chamber and / or cooling chamber) through the second transfer port 12;

[0049] The air curtain assembly 3 has a plurality of air curtains 31 spaced apart from each other along the direction from the first transfer port 11 to the second transfer port 12. The air curtains 31 are located above the conveying area 21 and above the first transfer port 11.

[0050] The vacuum box 4 is arranged below the bottom of the cavity 13. The vacuum box 4 forms a lower air cavity 41 separated from the cavity 13 and located below the first transfer port 11. The top of one end of the lower air cavity 41 is sealed, and the top of the other end is provided with an air flow port 42 connected thereto. The air flow port 42 is located at the end where the first transfer port 11 of the cavity 13 is located, and is located at the bottom of the cavity 13. An air suction port 43 for connecting to an air suction device is provided at the end where the top of the lower air cavity 41 is sealed. The air suction port 43 can be specifically located at the end of the lower air cavity 41 away from the first transfer port 11. The air suction device extracts the gas in the lower air cavity 41 through the air suction port 43. The air suction device can be, but is not limited to, an exhaust fan or a vacuum pump.

[0051] In the sealed transfer bin for controlling oxygen content in this embodiment, when the first transfer port 11 does not need to transfer products, the gate mechanism 7 will block the first transfer port 11, thereby preventing external air from entering the cavity 13 through the first transfer port 11;

[0052] When the first transfer port 11 is opened for product transfer, outside air will enter the cavity 13 through the first transfer port 11. At this time, the design of the air curtain assembly 3 is the key to preventing air from diffusing from the first transfer port 11 to the second transfer port 12. The air curtains 31 spaced apart along the direction from the first transfer port 11 to the second transfer port 12 form multiple barriers that hinder the flow of air, thereby extending the path for air to diffuse from the first transfer port 11 to the second transfer port 12 and limiting most of the air entering the first transfer port 11 to the vicinity of the first transfer port 11, especially preventing air from diffusing to the area where the second transfer port 12 is located.

[0053] The lower air chamber 41 is disposed below the first transfer port 11, providing a larger accumulation space for air near the first transfer port 11, allowing oxygen to accumulate in the lower air chamber 41 and facilitating the extraction of more gas in a shorter period of time. Once oxygen enters the lower air chamber 41 from the air flow port 42, it flows toward the air extraction port 43. The top of the lower air chamber 41 at the end where the air extraction port 43 is located is blocked, preventing the oxygen from returning to the cavity 13, thereby enhancing the oxygen control effect.

[0054] The air flow port 42 is located at the end of the first transfer port 11 of the cavity 13, and the air flow port 42 is designed to be close to the bottom of the cavity 13, so that when air is pumped out, a negative pressure will be formed at the air flow port 42, thereby guiding the gas at the bottom of the cavity 13 to flow toward the air flow port 42, and then discharged from the lower air cavity 41. This design helps to remove oxygen and other impurities at the bottom of the cavity 13, thereby achieving effective control of the oxygen content in the chassis 1.

[0055] In some examples, an air curtain box 5 is fixed above the cavity 13. The air curtain box 5 has an upper air cavity 51. The top of the cavity 13 has an opening 14. The upper air cavity 51 is connected to the cavity 13 through the opening 14. The upper end of the air curtain 31 is fixedly connected to the top of the upper air cavity 51, and the lower end of the air curtain 31 is a free end.

[0056] The air curtain box 5 can be fixedly connected to the chassis 1 by screws, or the air curtain box 5 can be fixedly connected to the chassis 1 by snapping, for example, the air curtain box 5 is fixedly connected to the chassis 1 by snapping;

[0057] The air curtain box 5 can increase the space above the conveying area 21. During assembly, the air curtain assembly 3 can be pre-fixed in the air curtain box 5 to form an integrated module for easy assembly and maintenance.

[0058] In some examples, as shown in Figure 5, a partition 52 extends downward from the top of the upper air cavity 51, and the fixing parts are spaced apart along the direction from the first transfer port 11 to the second transfer port 12, and the upper end of the air curtain 31 is fixedly connected to the partition 52.

[0059] In some examples, as shown in FIG7 , a plurality of strip-shaped gaps 311 are provided on the air curtain 31 at intervals. The strip-shaped gaps 311 may be straight or curved to prevent a small amount of air from accumulating between two adjacent air curtains 31 for a long time and not being drawn away in time by the lower air cavity 41 ; the strip-shaped gaps 311 may extend to the lower end of the air curtain 31 .

[0060] In some examples, the wind curtain 31 is a flexible wind curtain, so that the wind curtain 31 can swing under the blowing of the airflow. For example, the airflow at the end of the second transfer port 12 in the cavity 13 can cause the wind curtain 31 to swing toward the first transfer port 11. The material of the wind curtain 31 can be high-temperature resistant cloth or polymer material, and the material of the wind curtain 31 can specifically be Teflon cloth.

[0061] In some examples, a gas blowing assembly is further included, the gas blowing assembly including a first gas blowing pipe 6 and a second gas blowing pipe 8, both of which are used to be connected to a gas source for supplying a protective gas; the protective gas can be an inert gas, and in this embodiment, the protective gas is specifically nitrogen, and the gas source is a gas source for supplying nitrogen;

[0062] The first blowing pipe 6 is disposed in the cavity 13 at the end where the first transfer port 11 is located. The first blowing pipe 6 has a plurality of first air holes 61 facing the first transfer port 11. Specifically, the first air holes 61 extend from the outer wall of the first blowing pipe 6 to the inner wall of the first blowing pipe 6. To maintain uniform nitrogen blowing, the first air holes 61 are spaced apart along the axis of the first blowing pipe 6. The sum of the cross-sectional areas of all the first air holes 61 is less than the cross-sectional area of ​​the first blowing pipe 6.

[0063] The second blowing pipe 8 is disposed in the cavity 13 at the end where the second transfer port 12 is located. The second blowing pipe 8 is provided with a plurality of second air holes. Specifically, the second air holes extend from the outer wall of the second blowing pipe 8 to the inner wall of the second blowing pipe 8. To maintain uniform nitrogen blowing, the second air holes may be spaced apart along the axis of the second blowing pipe 8. The sum of the cross-sectional areas of all the second air holes is less than the cross-sectional area of ​​the second blowing pipe 8.

[0064] The height of the first air blowing pipe 6 is higher than that of the second air blowing pipe 8; it is worth noting that the height of the first air blowing pipe 6 may also be lower than that of the second air blowing pipe 8, and there is no special limitation on this;

[0065] The second air blowing pipe 8 can be specifically located below the conveying area 21, or below the second transfer port 12. The second air hole can be tilted downward or downward toward the end of the first transfer port 11 of the cavity 13. The second air hole can also face downward, which is not particularly limited in this embodiment.

[0066] The blowing assembly blows nitrogen into the cavity 13 through the first blowing pipe 6 and the second blowing pipe 8. The nitrogen can effectively replace or dilute the oxygen in the cavity 13, thereby ensuring that the oxygen content in the cavity 13 is maintained at a low level, thereby preventing oxygen from entering the process chamber 9 (preheating chamber and / or sintering chamber and / or cooling chamber) from the second transfer port 12, thereby avoiding oxygen from adversely affecting the sintering of the semiconductor product;

[0067] The first air blowing pipe 6 and the second air blowing pipe 8 are respectively positioned near the first transfer port 11 and the second transfer port 12, so that the shielding gas blown in can directly act on these two key areas. The nitrogen blown out through the first air hole 61 can form an airflow barrier, preventing external oxygen from entering the cavity 13 through the first transfer port 11. Especially when the first transfer port 11 is opened for product transfer, the first air blowing pipe 6 can quickly blow away any air that may enter, ensuring that the oxygen content in the cavity 13 remains stable.

[0068] The height of the first blowing pipe 6 is higher than that of the second blowing pipe 8. The second blowing pipe 8 can blow nitrogen from the bottom of the cavity 13 near the end where the second transfer port 12 is located, helping to further replace the oxygen in the cavity 13, so as to ensure that the oxygen content at the end where the second transfer port 12 is located is effectively controlled and improve the utilization efficiency of nitrogen.

[0069] In some examples, as shown in FIG4 , the first air blowing pipe 6 is located between the first transfer port 11 and the conveying area 21 , and the first air hole 61 is inclined toward the first transfer port 11 . The first air hole 61 may be inclined toward the first transfer port 11 from top to bottom, or from bottom to bottom. In this embodiment, the first air hole 61 may be inclined toward the first transfer port 11 from bottom to top.

[0070] The design of the first blowing pipe 6 being located between the first transfer port 11 and the conveying area 21 allows the tooling carrying the semiconductor product to be flushed by the nitrogen blown out of the first air hole 61 before reaching the conveying area 21. This can blow away the air carried in the gaps inside the tooling, and then the tooling will reach the conveying area 21, further improving the oxygen content in the cavity 13.

[0071] In some examples, as shown in Figures 1, 3, 4 and 8, the gate mechanism 7 includes a lifting assembly 71 and a gate 72, the lifting assembly 71 is fixed to the chassis 1, and a window 721 is passed through the gate 72;

[0072] The output end of the lifting assembly 71 is fixedly connected to the gate 72 to drive the gate 72 to rise or fall. When the first transfer port 11 is opened, the gate 72 moves to the window 721 and is aligned with the first transfer port 11. When the first transfer port 11 is closed, the gate 72 moves to the window 721 and is completely offset from the first transfer port 11, thereby realizing automatic opening or closing of the gate 72.

[0073] The lifting assembly 71 can be, but is not limited to, an electric push rod, a linear module, or a cylinder. For example, the lifting assembly 71 is a cylinder. The cylinder body of the cylinder of the lifting assembly 71 is fixedly mounted on the upper end of the chassis 1, and the piston rod of the cylinder faces upward and is fixedly connected to the gate 72.

[0074] As shown in Figures 1 and 4, the chassis 1 can be fixedly installed with a limiting plate 73, and a limiting groove 74 is formed between the limiting plate 73 and the chassis 1. The gate 72 is slidably installed in the limiting groove 74, thereby improving the stability and sealing effect of the gate 72.

[0075] It is worth noting that the window 721 may not be provided on the gate 72, as long as the first transfer port 11 can be blocked or unblocked during the ascending or descending process;

[0076] The gate mechanism 7 may also be a gate 72 that is manually opened or closed, and the present invention does not impose any special limitation on this.

[0077] In some examples, a semiconductor packaging system includes the aforementioned sealed transfer chamber for controlling oxygen content.

[0078] The principle of the sealed transfer chamber for controlling oxygen content is as follows:

[0079] As shown in FIG3 , when a tooling containing semiconductor products needs to enter the cavity 13 from the outside through the first transfer port 11, the gate mechanism 7 drives the gate 72 to move to open the first transfer port 11, and then the tooling is sent into the cavity 13 through the first transfer port 11. When the tooling reaches the conveyor line 2, it will be flushed by the nitrogen gas blown out by the first blowing pipe 6 to eliminate the air that may be carried by the gap inside the tooling. At the same time, the nitrogen gas blown out by the first blowing pipe 6 through the first air hole 61 can form an airflow barrier to prevent external oxygen from entering the cavity 13 through the first transfer port 11.

[0080] The multiple barriers formed by the air curtain assembly 3 that hinder the flow of air prolong the path of air diffusion from the first transfer port 11 to the second transfer port 12, so that most of the air entering the cavity 13 from the first transfer port 11 is confined to the vicinity of the first transfer port 11, especially preventing the air from diffusing into the area where the second transfer port 12 is located.

[0081] The lower air chamber 41 is disposed below the first transfer port 11, creating a larger accumulation space for air near the first transfer port 11. This allows oxygen to accumulate in the lower air chamber 41, facilitating the extraction of more gas in a shorter period of time. Once oxygen enters the lower air chamber 41 from the air flow port 42, it flows toward the air extraction port 43. The top of the lower air chamber 41 at the end where the air extraction port 43 is located is blocked, preventing oxygen from returning to the chamber 13, thereby enhancing the oxygen control effect.

[0082] The blowing assembly blows protective gas into the cavity 13 through the first blowing pipe 6 and the second blowing pipe 8. The protective gas can effectively replace or dilute the oxygen in the cavity 13, thereby ensuring that the oxygen content in the cavity 13 is maintained at a low level, thereby preventing oxygen from entering the process chamber 9 (preheating chamber and / or sintering chamber and / or cooling chamber) from the second transfer port 12, thereby avoiding adverse effects of oxygen on the sintering of semiconductor products;

[0083] After the tooling enters the cavity 13, the gate mechanism 7 drives the gate 72 to move, closing the first transfer port 11. After the first transfer port 11 is closed, the first blowing pipe 6 and / or the second blowing pipe 8 can continue to flow nitrogen into the cavity 13, and the exhaust device also continues to exhaust the lower air cavity 41;

[0084] The tooling carrying the semiconductor product first passes through the cavity 13, and then enters the preheating cavity or / and the sintering cavity or / and the cooling cavity from the second transfer port 12, which can effectively avoid the problem of the outside air entering the process cavity 9 when the tooling carrying the semiconductor product is directly placed in the preheating cavity or / and the sintering cavity or / and the cooling cavity; after the tooling carrying the semiconductor product arrives at the preheating cavity or / and the sintering cavity or / and the cooling cavity, the semiconductor product is preheated, sintered and cooled.

[0085] It is worth noting that after the preheating chamber and / or the sintering chamber and / or the cooling chamber completes the sintering of the semiconductor product, the semiconductor product can also first enter the cavity 13 from the second transfer port 12, and then reach the outside from the cavity 13 through the first transfer port 11.

[0086] The above description of the preferred embodiments of the present invention is intended to serve as a guide. Based on the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A sealed transfer chamber for controlling oxygen content, characterized by: include: A chassis (1) has a cavity (13) therein, wherein one end of the chassis (1) is provided with a first transfer port (11), and the other end is provided with a second transfer port (12), and both the first transfer port (11) and the second transfer port (12) are in communication with the cavity (13); a gate mechanism (7) disposed at the first transfer port (11) for opening or blocking the first transfer port (11); and the second transfer port (12) for communicating with the process chamber (9); A conveying line (2) having a conveying area (21) located in the cavity (13), wherein the conveying area (21) is used to convey products between a first transfer port (11) and a second transfer port (12); An air curtain assembly (3) comprises a plurality of air curtains (31) spaced apart from each other in a direction from the first transfer port (11) to the second transfer port (12), wherein the air curtains (31) are located above the conveying area (21) and above the first transfer port (11); And an air extraction box (4) is arranged below the bottom of the cavity (13), the air extraction box (4) is formed with a lower air cavity (41) separated from the cavity (13) and located below the first transfer port (11), the top of one end of the lower air cavity (41) is blocked, and the top of the other end is provided with an air flow port (42) connected thereto, the air flow port (42) is located at the end where the first transfer port (11) of the cavity (13) is located, and is located at the bottom of the cavity (13), and the end of the lower air cavity (41) with the blocked top is provided with an air extraction port (43) for connecting to an air extraction device.

2. The sealed transfer chamber for controlling oxygen content according to claim 1, characterized in that: An air curtain box (5) is fixed above the cavity (13), and the air curtain box (5) has an upper air cavity (51). The top of the cavity (13) has an opening (14), and the upper air cavity (51) is connected to the cavity (13) through the opening (14). The upper end of the air curtain (31) is fixedly connected to the top of the upper air cavity (51), and the lower end of the air curtain (31) is a free end.

3. The sealed transfer chamber for controlling oxygen content according to claim 2, characterized in that: A partition (52) extends downward from the top of the upper air cavity (51), the fixing portions are spaced apart in a direction from the first transfer port (11) to the second transfer port (12), and the upper end of the air curtain (31) is fixedly connected to the partition (52).

4. The sealed transfer chamber for controlling oxygen content according to claim 2, characterized in that: The air curtain (31) is provided with a plurality of strip-shaped notches (311) at intervals.

5. The sealed transfer chamber for controlling oxygen content according to claim 4, characterized in that: The air curtain (31) is a bendable air curtain (31).

6. The sealed transfer chamber for controlling oxygen content according to claim 1, characterized in that: The device also includes an air blowing assembly, wherein the air blowing assembly includes a first air blowing pipe (6) and a second air blowing pipe (8), wherein the first air blowing pipe (6) and the second air blowing pipe (8) are both used to communicate with a gas source for supplying protective gas; The first air blowing pipe (6) is arranged in the cavity (13) at the end where the first transfer port (11) is located, and the first air blowing pipe (6) is provided with a plurality of first air holes (61) facing the first transfer port (11); The second air blowing pipe (8) is arranged in the cavity (13) at the end where the second transfer port (12) is located, and the second air blowing pipe (8) is provided with a plurality of second air holes; The height of the first air blowing pipe (6) is higher than the height of the second air blowing pipe (8).

7. The sealed transfer chamber for controlling oxygen content according to claim 6, characterized in that: The first air blowing pipe (6) is located between the first transfer port (11) and the conveying area (21), and the first air hole (61) is inclined toward the first transfer port (11).

8. The sealed transfer chamber for controlling oxygen content according to claim 6, characterized in that: The gas source is a gas source that supplies nitrogen.

9. The sealed transfer chamber for controlling oxygen content according to claim 1, characterized in that: The gate mechanism (7) comprises a lifting assembly (71) and a gate (72), wherein the lifting assembly (71) is fixed on the chassis (1), and a window (721) is passed through the gate (72); The output end of the lifting assembly (71) is fixedly connected to the gate (72) to drive the gate (72) to rise or fall. When the first transfer port (11) is opened, the gate (72) moves to the window (721) and is aligned with the first transfer port (11). When the first transfer port (11) is closed, the gate (72) moves to the window (721) and is completely offset from the first transfer port (11).

10. A semiconductor packaging system, characterized in that: The invention comprises a sealed transfer chamber for controlling oxygen content as described in any one of claims 1 to 9.

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