Electronic module, electronic module control system, and imaging device

Abstract

The present technology relates to an electronic module, and the main purpose is to provide a technology capable of suppressing the deformation of the electronic module while ensuring good air permeability even with a simple configuration of a package constituting the electronic module. As a result of intensive research, the present inventors have discovered that by forming a frame body which has a porous structure and is provided to an electronic module, it is possible to suppress the deformation of the electronic module while ensuring good air permeability, even with a simple configuration of a package constituting the electronic module.

Description

Electronic module, control system for electronic module, and imaging device

[0001] The present technology relates to an electronic module, a control system for the electronic module, and an imaging device. More specifically, the present technology relates to an electronic module including: a substrate having a first main surface and a second main surface; an electronic device attached to the first main surface; a frame attached to the first main surface so as to surround the electronic device; and a lid attached to the frame so as to face the electronic device.

[0002] 2. Description of the Related Art Conventionally, a technique has been known in which communication holes are provided in an electronic module to prevent deformation or damage to the module.

[0003] For example, Patent Document 1 below discloses a technology for a camera module having a closed internal space facing a wiring board, in which at least a part of the base material of the wiring board is a porous part having communicating pores, and the internal space is in communication with the outside of the camera module via the communicating pores. However, since the board is formed from two types of materials, the manufacturing process can be complicated.

[0004] WO2016031332 publication

[0005] The present technology relates to an electronic module, and its main objective is to provide a technology that can suppress deformation of the electronic module while ensuring good breathability even when the package that constitutes the electronic module has a simple configuration.

[0006] As a result of extensive research, the inventors have discovered that by forming the frame of an electronic module from a porous structure, good breathability can be ensured even if the package that constitutes the electronic module has a simple structure, and deformation of the electronic module can be suppressed.

[0007] That is, the present technology provides an electronic module including a substrate having a first main surface and a second main surface, an electronic device attached to the first main surface, a frame body arranged to surround the electronic device, and a lid body attached to the frame body to face the electronic device, wherein one or more holes having a diameter of 10 μm or less are provided in any of the substrate, the frame body, or the lid body. In the electronic module of the present technology, the diameter of the holes may be 5 μm or less. In the electronic module of the present technology, it is preferable that the holes are not blocked. In the electronic module of the present technology, when the holes are provided in the lid body, at least a portion of the holes may be formed by holes in a porous structure. In the electronic module of the present technology, when the holes are provided in the frame body, at least a portion of the holes may be formed by holes in a porous structure. In this case, the frame body may be formed of a porous structure. In the electronic module of the present technology, the lid body may be supported by the frame body from a surface facing the electronic device. The electronic module of the present technology may further include a sealing layer provided on the first principal surface so as to surround the electronic device, and the frame body may be attached to the sealing layer. Furthermore, the electronic module may further include a wire electrically connecting the electronic device to an external power supply electrode, and the sealing layer may cover the wire. In the electronic module of the present technology, at least a portion of an adhesive layer fixing the frame body may have moisture adsorption ability. In the electronic module of the present technology, the frame body may be attached to the first principal surface so as to surround the electronic device, and when the frame body of the electronic module of the present technology is formed of a porous structure, the porous structure may be porous ceramic. In this case, in the electronic module of the present technology, it is preferable that the linear expansion coefficient of the porous ceramic is smaller than the expansion coefficient of the substrate. Furthermore, it is preferable that the linear expansion coefficient of the porous ceramic is 0.5 to 15 ppm / °C.The electronic device included in the electronic module of the present technology is preferably an image sensor. When the electronic device included in the electronic module of the present technology is an image sensor, the frame is preferably formed of a porous structure, and the porous structure is preferably a black porous ceramic. When the frame included in the electronic module of the present technology is formed of a porous structure, the frame is preferably formed of a single porous structure. When the frame included in the electronic module of the present technology is formed of a porous structure, the porous structure is preferably a conductive porous structure. Furthermore, when the porous structure is a porous ceramic, the porous ceramic is preferably SiC. When the frame included in the electronic module of the present technology is formed of a porous structure, the electronic module may further include one or more sets of external power supply electrodes and electrodes connected to the respective external power supply electrodes, and electricity may be supplied from the electrodes to the porous structure. In this case, the electrodes are preferably bonded to the substrate and the lid. Furthermore, there may be two or more sets of external power supply electrodes. When the electronic module of the present technology includes one or more sets of external power supply electrodes, the frame and the substrate included in the electronic module of the present technology are preferably bonded with a conductive adhesive. In this case, an internal thermoelectric conversion element may be provided inside the electronic module, or an external thermoelectric conversion element may be provided outside the electronic module. A humidity sensor may also be provided inside or outside the electronic module. When the frame of the electronic module according to the present technology is formed of a porous structure, it is preferable that at least a portion of the porous structure is subjected to a water-repellent treatment. Furthermore, the porous structure may be in contact with or bonded to a heat dissipating or absorbing member.

[0008] Next, the present technology provides a control system for an electronic module of the present technology, which includes an internal thermoelectric conversion element inside the electronic module, and compares a temperature measured by the internal thermoelectric conversion element with a preset temperature, and supplies electricity to the porous structure from the electrode if the measured temperature is equal to or lower than the preset temperature. In this case, the comparison may be performed at predetermined time intervals. The present technology also provides a control system for an electronic module of the present technology, which includes an internal thermoelectric conversion element and an external thermoelectric conversion element in the electronic module, and further includes a humidity sensor, which determines a dew point temperature from the external measured temperature measured by the external thermoelectric conversion element and the humidity measured by the humidity sensor, compares the dew point temperature with the internal measured temperature measured by the internal thermoelectric conversion element, and supplies electricity to the porous structure from the electrode if the internal measured temperature is equal to or lower than the dew point temperature. In this case, the comparison may be performed at predetermined time intervals. Furthermore, the present technology provides an imaging device including the electronic module of the present technology.

[0009] 1 is an image diagram of an example of an electronic module according to the present technology, viewed from a side; FIG. 1 is an image diagram of an example of a second embodiment in which an electronic module according to the present technology includes an external power supply electrode and an electrode, viewed from a side; FIG. 2 is an image diagram of an example of a second embodiment in which an electronic module according to the present technology includes an external power supply electrode and an electrode, viewed from a top surface; FIG. 3 is an image diagram of a modified example of the second embodiment in which an electronic module according to the present technology includes an external power supply electrode and an electrode, viewed from a top surface; FIG. 4 is an image diagram of an example of a third embodiment in which an electronic module according to the present technology includes a thermoelectric conversion element and a humidity sensor, viewed from a side; FIG. 5 is a flowchart showing an example of control of an electronic module according to the present technology; FIG. 6 is a flowchart showing a modified example of control of an electronic module according to the present technology; FIG. 7 is an image diagram of an example of a fourth embodiment in which an electronic module according to the present technology includes a plurality of electrodes and thermoelectric conversion elements; FIG. 8 is an image diagram of an example of a fifth embodiment in which porous ceramic of an electronic module according to the present technology is in contact with or joined to a heat dissipation or heat absorption member, viewed from a side; 10 is a conceptual diagram of a step of mounting an electronic device on a substrate in a manufacturing method for an electronic module according to the present technology. FIG. 11 is a conceptual diagram of a step of applying an adhesive to bond a substrate and a frame body in a manufacturing method for an electronic module according to the present technology. FIG. 12 is a conceptual diagram of a step of mounting a frame body and temporarily curing the adhesive in a manufacturing method for an electronic module according to the present technology. FIG. 13 is a conceptual diagram of a step of forming an electrode on an electrode formation portion provided on a frame body arranged at the position of an external power supply electrode of a substrate in a manufacturing method for an electronic module according to the present technology. FIG. 14 is a conceptual diagram of a step of mounting a lid body using an adhesive and performing main curing in a manufacturing method for an electronic module according to the present technology. FIG. 15 is a conceptual diagram of an example of a sixth embodiment of an electronic module according to the present technology as viewed from the side. FIG. 16 is a conceptual diagram of an example of an electronic module according to the present technology as viewed from the top. FIG. 17 is a conceptual diagram of an example of an electronic module according to a conventional technology as viewed from the side. FIG. 18 is a conceptual diagram of an example of an electronic module according to the present technology as viewed from the side. FIG. 19 is a conceptual diagram of an example of an electronic module according to the present technology as viewed from the side.10 is an image diagram of an example of a ninth embodiment of the electronic module according to the present technology, viewed from the side; FIG. 11 is an image diagram of a substrate preparation step in a manufacturing method for an electronic module according to a sixth embodiment of the present technology; FIG. 12 is an image diagram of a step of mounting an electronic device on a substrate in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 13 is an image diagram of a step of installing a wire in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 14 is an image diagram of a step of attaching a release film to an electronic device in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 15 is an image diagram of a step of forming a sealing layer by molding in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 16 is an image diagram of a step of peeling off a release film in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 17 is an image diagram of a step of providing an adhesive layer on a sealing layer in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 18 is an image diagram of a step of providing an adhesive layer on a lid body in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; FIG. 19 is an image diagram of a step of bonding a porous structure to a lid body in a manufacturing method for an electronic module according to the sixth embodiment of the present technology; 10 is an image diagram of an example of a tenth embodiment of an electronic module according to the present technology as seen from the side; FIG. 11 is an image diagram of an example of an electronic module according to the present technology as seen from the top; FIG. 12 is an image diagram of an example of an electronic module according to the present technology as seen from the side; FIG. 13 is an image diagram of an example of an electronic module according to the present technology as seen from the side; FIG. 14 is an image diagram of an example of an electronic module according to the present technology as seen from the side;13A and 13B are conceptual diagrams of a process of mounting an electronic device on a substrate in a method for manufacturing an electronic module according to an eleventh embodiment of the present technology; a conceptual diagram of a process of providing wires 17 in a method for manufacturing an electronic module according to the eleventh embodiment of the present technology; a conceptual diagram of a process of forming a frame in a method for manufacturing an electronic module according to the eleventh embodiment of the present technology; a conceptual diagram of a process of mounting a lid on a substrate in a method for manufacturing an electronic module according to the eleventh embodiment of the present technology; a conceptual diagram of a process of forming a sealing layer in a method for manufacturing an electronic module according to the eleventh embodiment of the present technology; a conceptual diagram of a process of providing solder bumps in a method for manufacturing an electronic module according to the eleventh embodiment of the present technology; a conceptual diagram of a process of mounting an electronic device on a substrate in a method for manufacturing an electronic module according to a thirteenth embodiment of the present technology; a conceptual diagram of a process of providing wires 17 and a process of attaching a release film to the electronic device in a method for manufacturing an electronic module according to the thirteenth embodiment of the present technology; a conceptual diagram of a process of forming a sealing layer by molding in a method for manufacturing an electronic module according to the thirteenth embodiment of the present technology; and a conceptual diagram of a process of peeling off a release film in a method for manufacturing an electronic module according to the thirteenth embodiment of the present technology. 13A to 13C are conceptual diagrams illustrating a process of processing a substrate and a lid body in order to mount the lid body on the substrate, in the method for manufacturing an electronic module according to the thirteenth embodiment of the present technology; FIG. 14A to 14C are conceptual diagrams illustrating a process of mounting the lid body on the substrate, in the method for manufacturing an electronic module according to the thirteenth embodiment of the present technology; and FIG. 14B are conceptual diagrams illustrating a process of providing metal balls, in the method for manufacturing an electronic module according to the thirteenth embodiment of the present technology.

[0010] Preferred embodiments of the present technology will be described below. However, the embodiments shown below are examples of typical embodiments of the present technology, and the present technology is not limited to only the preferred embodiments below and can be freely modified within the scope of the present technology.

[0011] [Electronic Module] An electronic module according to the present technology includes a substrate having a first main surface and a second main surface, an electronic device attached to the first main surface, a frame body arranged to surround the electronic device, and a lid body attached to the frame body to face the electronic device.

[0012] The electronic module of the present technology has a frame body that surrounds the outer periphery of an electronic device such as an image sensor attached to a first main surface of a substrate, and a cavity that is a semi-enclosed space that surrounds the electronic device by attaching a lid body to the frame body.

[0013] As described above, the electronic module of the present technology has a cavity formed therein, which physically protects electronic devices such as image sensors from the outside and prevents foreign matter such as dust from entering the electronic module, thereby suppressing failure and deterioration of the electronic devices.

[0014] The electronic module of the present technology can suppress deformation of the electronic module while ensuring good ventilation by providing one or more holes in the substrate, frame, or lid that constitutes the cavity, thereby maintaining a constant volume inside the cavity even when the electronic module experiences sudden changes in air pressure or temperature in the usage environment.

[0015] Furthermore, in the electronic module of the present technology, the hole diameter can be set to 10 μm or less to prevent water from entering the cavity. In the electronic module of the present technology, the hole diameter in any of the substrate, frame, or lid constituting the cavity can be set to 10 μm or less, ensuring good ventilation while favorably preventing water from entering the cavity. Furthermore, the hole diameter may be designed to be small to match the pixel size of the electronic device included in the electronic module. For example, in an electronic device having pixels of 3 μm in size, the hole diameter can be set to 5 μm or less to prevent the intrusion of dust particles large enough to cause defects in three consecutive pixels. Similarly, the hole diameter may be designed to be any diameter, such as 4.5 μm or less, 4.0 μm or less, to match the pixel size of the electronic device.

[0016] The lower limit of the diameter of the holes in the electronic module of the present technology is not particularly limited. When the holes are formed by processing, any size that can be formed by processing can be set as the lower limit. For example, the holes can be designed in a range of 0.5 μm or more, 1.0 μm or more, etc. Furthermore, when the holes are formed by processing, the positions at which the holes are formed can be easily adjusted so as not to affect the signal response of the pixels of the electronic device. Furthermore, complex processing is not required in the manufacturing process of the electronic module, and good breathability can be ensured with simple processing. When the holes are formed by processing, multiple holes may be formed as long as they do not affect the signal response of the image of the electronic device.

[0017] The shape of the hole in the electronic module of the present technology is not particularly limited, and may be any shape, such as a circle, a polygon, or a slit.

[0018] In addition, since the electronic module of the present technology is also suitable for use in imaging devices and the like that can be used in environments where sudden changes in air pressure or temperature may occur, the above-mentioned holes are not blocked during the manufacturing process.

[0019] <Substrate> In the electronic module of the present technology, the term "substrate" refers to a printed circuit board for mounting and wiring electronic components such as elements of an electronic device and a frame. As a material for forming the substrate, for example, known synthetic resins that can be used as materials for forming substrates used in electronic modules, such as epoxy resin, phenolic resin, polyimide, and glass cloth, can be suitably used.

[0020] The substrate included in the electronic module of the present technology may have solder bumps (or metal balls) or connector terminals arranged as external connection terminals on the back side (second main surface side) of the substrate opposite to the surface on which the electronic device is mounted. Furthermore, the substrate included in the electronic module of the present technology may have through vias formed therein. This allows elements such as electronic devices to be electrically connected to the external connection terminals such as solder bumps arranged on the back side (second main surface side) of the substrate.

[0021] <Electronic Device> An "electronic device" is an element that constitutes a part of the electronic circuit of the electronic module of the present technology, and in the electronic module of the present technology, it is attached to the front surface side (first main surface side) of the substrate. The "electronic device" that can be used in the electronic module of the present technology is not particularly limited, and examples thereof include an integrated circuit (IC).

[0022] In particular, the electronic module of the present technology can suppress deformation of the electronic module while ensuring good breathability even with a simple configuration, so that even when an image sensor or the like is used as an electronic device, distortion of the image acquired by the image sensor can be suppressed.

[0023] Here, an "image sensor" is a device that receives light and converts the amount of light into an electrical signal. Examples of image sensors include a CCD (Charge-Coupled Device) and a CMOS image sensor.

[0024] <Lid> In the electronic module of the present technology, the "lid" is a cover for protecting the electronic devices and substrates placed inside the electronic module, and can protect the inside of the electronic module from external physical influences and the environment.

[0025] In the electronic module of the present technology, when an image sensor is used as the electronic device, the cover is preferably formed of a transparent material so that the image sensor receives light from outside. Suitable examples of the transparent material include glass such as silica glass, quartz glass, and sapphire glass, acrylic resin, polycarbonate resin, and polymethyl methacrylate resin (PMMA), and other known transparent materials that can be used in electronic modules.

[0026] By applying a light-shielding treatment to the side surfaces of the lid body of the electronic module of the present technology (when the light-receiving surface of the electronic module is the upper surface of the lid body, the side surfaces of the lid body located on the left and right of the upper surface of the lid body), it is possible to suppress unintended incidence of light from the side surfaces of the lid body. In particular, when the electronic device is an image sensor, it is possible to reduce the occurrence of input of optical signals due to unintended incidence of light.

[0027] The method for light-shielding the side surface of the lid is not particularly limited, and any method can be used. For example, light can be suitably shielded by a method such as forming a light-shielding film on the side surface of the lid. In this case, examples of materials constituting the light-shielding film include metals such as Al, polyimide, and carbon black.

[0028] In the electronic module of the present technology, a hole may be provided in the lid to ensure ventilation within the cavity. When providing a hole in the lid, good ventilation can be ensured by, for example, performing a simple process to form a hole in a position of the transparent material forming the lid that does not affect the signal response of the pixel of the electronic device. Such a processing method is not particularly limited, but examples include irradiating the position of the lid where the hole is to be formed with a laser to modify the material at that position, and then forming the hole by etching using hydrogen fluoride (HF) or the like.

[0029] In the electronic module of the present technology, when a hole is provided in the lid, at least a portion of the hole may be formed by a hole in a porous structure. For example, the porous structure described below may be disposed at the end of a hole formed in the lid by processing. In this way, by combining the hole formed by processing with the hole in the porous structure, even with a simple processing method, it is possible to achieve both suppression of water intrusion into the cavity and good breathability, and more effectively suppress the intrusion of dust. Furthermore, in the above case, the position of the porous structure may be located inside the cavity of the hole formed by processing, outside the cavity, or on both sides. The design can be modified as appropriate depending on the purpose of the electronic module and the manufacturing process.

[0030] In the electronic module of the present technology, among the configurations in which a porous structure is disposed at the end of a hole formed in a lid by processing, when the porous structure is disposed inside the cavity, a frame formed of the porous structure described below may be used as the porous structure. Furthermore, when the porous structure is disposed outside the cavity, a porous film or the like may be used as the porous structure. Any material that can be used as a material for constituting an electronic module may be used as the porous film. Furthermore, the porous film may have a shape that covers the entire surface of the hole formed in the lid. For example, the porous film may be processed into a shape that can cover the front surface of the hole and then bonded to the lid so as to cover the hole.

[0031] In the electronic module of the present technology, the holes in the porous structure constitute at least a part of the holes, but the holes may be entirely formed by the holes in the porous structure. However, when holes are provided in the lid, from the viewpoint of facilitating the processing, it is preferable that at least a part of the holes be formed by processing.

[0032] In the electronic module of the present technology, when a hole is formed in the lid by processing, the shape of the hole is not particularly limited, and the design can be changed as appropriate depending on the purpose of the electronic module and the manufacturing process. For example, the hole may be formed so as to penetrate the lid linearly, or so as to bend midway through the lid. Note that when the hole penetrates the lid linearly, the hole may be formed so as to penetrate perpendicular to the surface of the lid toward the interior of the cavity, or so as to penetrate in a direction other than perpendicular (diagonal).

[0033] <Frame body> In the electronic module of the present technology, the "frame body" is a body that is attached to surround the electronic device and supports the lid body so that the electronic device does not come into contact with any surface other than the first main surface of the substrate, and together with the lid body, can protect the inside of the electronic module from external physical influences and the environment.

[0034] In the electronic module of the present technology, holes may be provided in the frame to ensure ventilation within the cavity. When providing holes in the frame, good ventilation can be ensured by, for example, performing a simple process to form holes in the material of the frame at positions that do not affect the signal response of pixels of the electronic device, as in the case of providing holes in the lid described above.

[0035] In the electronic module of the present technology, when holes are provided in the frame, at least some of the holes may be formed by holes in a porous structure, as in the case of providing holes in the lid described above. In this case, a configuration in which a porous structure, as described below, is disposed on at least one end of the hole provided by processing the frame, may be adopted. Furthermore, when holes are provided in the frame, as described below, the frame surrounding the electronic device may be simply formed from a porous structure to ensure breathability tailored to the purpose of the electronic module. In this case, all of the holes for ensuring breathability within the cavity are formed by holes in the porous structure, but by forming the entire frame surrounding the electronic device from a porous structure, good breathability may be ensured without complex processing.

[0036] As described above, when the frame body of the electronic module of the present technology is formed from a porous structure, the frame body surrounding the electronic device is formed from a porous material with interconnected pores, ensuring good ventilation of the cavity of the electronic module of the present technology. This allows the volume inside the cavity to be maintained constant even when sudden changes in air pressure or temperature occur. At the same time, the intrusion of dust from the outside can be suppressed, thereby suppressing contamination inside the cavity due to air inflow and out.

[0037] Here, "the frame body is disposed so as to surround the electronic device" means that the frame body is disposed so as to surround the electronic device so as to form the aforementioned cavity. Therefore, this is not limited to the case where the frame body is disposed on the substrate so as to surround the outside of the outer edge of the electronic device on the substrate, as in the example of the electronic module shown in Fig. 1 described later, but also includes the case where the frame body is disposed along the outer edge of the electronic device, on the electronic device or on the resin (curable resin) constituting the sealing layer, as in the example of the electronic module shown in Fig. 17.

[0038] Furthermore, in the electronic module of the present technology, the high air permeability between the inside and outside of the cavity makes it easy to replace the gas inside the cavity. This allows the inside of the cavity to be replaced with any gas, such as dry air or an inert gas, depending on the purpose and application of the electronic module. In addition, the presence of numerous pores reduces the weight per unit volume, making it possible to make the electronic module lighter than ordinary ceramic components.

[0039] Furthermore, when the frame body is formed from a porous structure, the present technology can be implemented favorably by replacing the current frame body, which is a conventional technology, with the frame body of the present technology, thereby avoiding major changes to the manufacturing line due to the replacement of components.

[0040] When an electronic module includes a sealing layer, the sealing layer may surround the sides of the lid to support the lid, as in the example of the electronic module shown in FIG. 19 described below. In contrast, the electronic module of the present technology supports the lid so as to ensure good ventilation of the cavity. Therefore, in the electronic module of the present technology, the lid is supported by the frame from the side facing the electronic device. This prevents lateral force from being applied to the lid during the manufacturing process of the electronic module, thereby reducing the risk of cracks in the lid.

[0041] As used herein, the term "porous structure" refers to a component having a large number of holes (pores) therein. In the porous structure, the pores are distributed throughout the component. The material constituting the "porous structure" capable of forming the frame of the electronic module of the present technology is not particularly limited as long as it is a porous material that can be used as a material for the electronic module. Examples of such materials include inorganic compounds such as porous ceramics, and polymeric compounds capable of forming a porous structure. Examples of polymeric compounds capable of forming a porous structure include fluororesins that can be made porous by adjusting the conditions of a stretching process, and polyamide or polyimide resins that can be made porous by adjusting the conditions of the heat drying performed during the synthesis reaction. The porous structure may be formed using one type of compound alone, or multiple types of compounds may be combined to form the porous structure.

[0042] In the electronic module of the present technology, the frame may be formed by placing a porous structure previously manufactured using the material at a desired position such as a substrate, an electronic device, or a sealing layer, or by polymerizing raw materials of the material to synthesize the material at a desired position such as a substrate, an electronic device, or a sealing layer. Furthermore, these materials may contain compounds other than the material as necessary.

[0043] Here, "fluororesin" refers to a polymer material containing fluorine atoms. Examples of fluororesins include (PTFE / polytetrafluoroethylene). In the electronic module of the present technology, the porous structure forming the frame can be formed using a fluororesin that has been stretched to produce a sheet (including a film) by adjusting the conditions of the stretching process to make it porous. In the electronic module of the present technology, when the fluororesin sheet is used as the porous structure, the sheet, which is a pre-fabricated porous structure, is placed at a desired position on a substrate, an electronic device, a sealing layer, or the like using an adhesive or the like. This forms a frame for the porous structure.

[0044] When a fluororesin sheet is used as the porous structure, the breathability of the frame can be adjusted by adjusting the thickness and fiber diameter of the sheet. The thickness of the sheet can be, for example, 10 μm or more, 15 μm or more, or 20 μm or more. The upper limit of the thickness of the sheet is not particularly limited. For example, a thickness of 50 μm or less, 40 μm or less, etc. can be used. The fiber diameter of the fluororesin constituting the sheet can be, for example, 0.2 μm or less, 0.15 μm or less, or 0.1 μm or less. The lower limit of the fiber diameter of the fluororesin constituting the sheet is not particularly limited. For example, a thickness of 0.01 μm or more, 0.05 μm or more, etc. can be used.

[0045] A "polyamide resin" is a polymeric material containing an amide group (-CO-NH-), and a "polyimide resin" is a polymeric material containing an imide group (-CO-N-CO-). When a porous structure of polyamide resin or polyimide resin is used in the electronic module of the present technology, the raw materials for these resins are synthesized by applying monomers to the desired position on a substrate, electronic device, sealing layer, or the like, and polymerizing the raw materials. After this synthesis reaction, by adjusting the conditions for a heat drying treatment (baking treatment) to remove unnecessary moisture, these resins can be separated into layers and made porous. This forms the frame of the porous structure.

[0046] The porous structure made of polyamide resin or polyimide resin can also adjust the breathability of the frame by adjusting the amount of coating and adjusting the film thickness. The thickness of the porous structure made of polyamide resin or polyimide resin can be adjusted to, for example, 150 μm or more, 160 μm or more, 170 μm or more, etc. Furthermore, there is no particular upper limit to the thickness of the porous structure made of polyamide resin or polyimide resin. For example, it can be adjusted to 200 μm or less, 190 μm or less, 180 μm or less, etc.

[0047] When a porous ceramic is used as the porous structure forming the frame of the electronic module of the present technology, the porous ceramic may contain materials other than the porous ceramic as needed, including impurities derived from raw materials and manufacturing processes.

[0048] It is preferable that the linear expansion coefficient of the porous ceramic used in the electronic module of the present technology is smaller than the expansion coefficient of the substrate or the lid, since this can prevent the frame portion of the electronic module from being relatively deformed.

[0049] Furthermore, the frame may be made of a material whose linear expansion coefficient is closer to that of a silicon substrate that is preferably used in an electronic device than that of a glass fiber reinforced epoxy resin that forms a printed circuit board, such as FR4 (Flame Resistant 4), which can be preferably used as a material for the substrate of an electronic module.

[0050] In particular, while the camera module described in Patent Document 1 has a substrate formed from two types of material, namely, a porous material having communicating pores and a normal substrate material, it does not suggest reducing the linear expansion coefficient of the cover body, which corresponds to the frame body, to match the materials constituting the module, such as the substrate material and the light-shielding portion.

[0051] The linear expansion coefficient of the porous ceramic used in the present technology is, for example, 0.5 ppm / ° C. or more, preferably 2.0 ppm / ° C. or more. The upper limit of the linear expansion coefficient of the porous ceramic used in the present technology is, for example, 15 ppm / ° C. or less, preferably 12 ppm / ° C. or less, and more preferably 10 ppm / ° C. or less.

[0052] The porous ceramic used in this technology is not particularly limited as long as it is a porous ceramic, and can be manufactured using, for example, alumina, SiC, etc. In particular, porous ceramics made of alumina, SiC, etc. have advantages over resins used in electronic module substrates, such as epoxy resins, in terms of resistance to composite stress, thermal deformation, and package destruction. Furthermore, by using these as a frame, the linear expansion coefficient can be suitably adjusted to the above range. These may be used as a single porous ceramic, or multiple porous ceramics may be used in combination.

[0053] For example, when SiC is used as the porous ceramic in this technology, the porous ceramic formed from the SiC has fine pores of several micrometers to several tens of micrometers. By using this as the frame of the electronic module in this technology, the pores connect the inside and outside of the frame, ensuring breathability of the electronic module. This reduces the rate of change in the volume of the cavity when a sudden change in air pressure or temperature occurs.

[0054] Here, a "single material" refers to a material with the same chemical composition, and a "single porous ceramic" refers to a porous ceramic with the same chemical composition. Also, "ceramic" refers to a non-metallic inorganic material obtained through processes such as molding and firing. The porous ceramic used in this technology is not limited to a single crystal form of a single porous ceramic, but may also include cases where a single porous ceramic contains multiple crystalline structures, such as polycrystals, and may even contain crystalline structures of multiple porous ceramics.

[0055] Furthermore, "multiple materials" refers to a combination of multiple materials with the same chemical composition. When the porous structure used in this technology is made of a combination of multiple materials, the frame formed by the porous structure may be made of a mixture of the multiple materials, or may be made by combining multiple types of independent porous structure components, such as a frame with a laminated structure formed by multiple layers or a frame formed by multiple components.

[0056] Furthermore, when the electronic device included in the electronic module of the present technology is an image sensor, in order to avoid or reduce the image sensor from receiving unintended light, it is preferable that the porous structure used in the present technology suppresses reflection of light from the cavity-side surface of the frame. In particular, in a configuration in which the internal electrodes and the wires connecting the internal electrodes to the electronic device are not covered with a sealing layer, as in the example of the electronic module shown in Figure 1, it is preferable that light reflection from the cavity-side surface of the frame can be suppressed.

[0057] As a means for the porous structure to suppress reflection from the cavity-side surface of the frame body, for example, methods such as roughening the cavity-side surface of the porous structure or using a black material (black porous ceramic if the porous structure is porous ceramic) can be mentioned.

[0058] When the porous structure used in the present technology is made of a black material such as black porous ceramic, the black color is not particularly limited as long as it is black enough to avoid or reduce the unintended reception of light by the image sensor due to light reflection from the cavity-side surface of the frame. For example, an RGB value of 10 or less may be selected. In particular, since porous ceramic has low surface gloss due to the surface irregularities caused by the porous material, setting the RGB values ​​within the above ranges can effectively reduce light reflection and favorably reduce the unintended reception of light.

[0059] For example, alumina, SiC, etc. can be suitably prepared as black porous ceramics. In addition, when a composition containing a polymer compound is used as a black material, it can be suitably prepared by a method such as adding a black pigment to the composition.

[0060] By subjecting at least a portion of the surface of the porous structure such as porous ceramic used in the present technology to a water-repellent treatment, the porous structure can reduce the effects of condensation and maintain good breathability. In particular, even in situations where condensation may occur on the surface of the porous structure, such as when the electronic module of the present technology is exposed to short-term changes in air pressure, the impact of condensation on the breathability of the porous structure can be reduced.

[0061] The areas of the surface of the porous structure that are particularly preferably subjected to the water-repellent treatment are the surface that is exposed to the outside of the electronic module as a frame and the surface that is exposed to the inside of the electronic module, from the viewpoint of maintaining the breathability of the cavity. The water-repellent treatment may be applied to the entire surface of the porous structure, but the water-repellent treatment may also be applied to these areas of the entire surface of the porous structure that are preferably subjected to the water-repellent treatment, taking into account the characteristics of the electronic module and its manufacturing process.

[0062] In order to reduce the influence of condensation on the breathability of the porous structure, the frame of the electronic module of the present technology may be configured to have moisture adsorption ability, which may be combined with the water-repellent treatment on the surface of the porous structure.

[0063] Examples of configurations in which the frame body of the electronic module of the present technology has moisture adsorption ability include a configuration in which the frame body itself has moisture adsorption ability, and a configuration in which at least a portion of the adhesive layer that fixes the frame body has moisture adsorption ability.

[0064] A configuration in which the frame itself has moisture adsorption ability can be envisioned in which a substance having moisture adsorption ability is contained in the porous structure forming the frame. For example, when the porous structure is formed from a resin composition containing a polymer compound, a configuration in which a substance having moisture adsorption ability is contained in the resin composition can be envisioned.

[0065] As a configuration in which at least a portion of the adhesive layer that fixes the frame body has moisture adsorption ability, it is possible to imagine a form in which either the adhesive layer that fixes the frame body to the desired position, such as a substrate, electronic device, or sealing layer, or the adhesive layer that fixes the frame body and the lid body, or both, contain a substance that has moisture adsorption ability.

[0066] The substance having moisture adsorption ability is not particularly limited, but examples thereof include molecular sieves. Here, molecular sieves are porous materials with nanometer-level pores, primarily composed of zeolite (natural or synthetic crystalline aluminosilicate). The moisture adsorption ability of molecular sieves is enhanced by a combination of physical adsorption due to van der Waals forces and adsorption due to electrostatic attraction of metal cations present in the crystals. Therefore, even if the crystal lattice loses water of crystallization, it is unlikely to collapse or deliquesce. In the present technology, by incorporating these substances into the frame itself or into the adhesive layer that fixes the frame, the frame can be suitably endowed with moisture adsorption ability, thereby reducing the impact of condensation on breathability.

[0067] In the electronic module of the present technology, the molecular sieve that can be used as the moisture adsorbent material is not particularly limited in particle size, and any particle size can be used depending on the object to be contained. The particle size of the molecular sieve can be suitably adjusted, for example, within a range of 20 μm or less, 10 μm or less, etc. Furthermore, the lower limit of the particle size of the molecular sieve is not particularly limited, and any particle size range that can be adjusted can be used.

[0068] In the electronic module of the present technology, the molecular sieve that can be used as the substance having moisture adsorption ability is preferably one that has a moisture adsorption ability of, for example, 15 wt% or more, 20 wt% or more, 25 wt% or more, relative to 100 wt% of the molecular sieve.

[0069] The electronic module of the present technology may include a sealing layer provided on the first main surface of the substrate so as to surround the electronic device. In the case where the electronic module of the present technology includes the sealing layer, the frame may be disposed on the sealing layer.

[0070] Here, the "sealing layer" is a layer that is provided to cover at least a part of the electronic module to prevent foreign matter such as dust from entering the cavity and to suppress breakdowns and deterioration of the electronic device.

[0071] The material constituting the sealing layer is not particularly limited as long as it is a material that can cover the electronic module and seal the electronic device. For example, any material that can be used as a sealing layer for an electronic module, such as a liquid sealing resin (liquid compound), can be suitably used. The method for forming the sealing layer in the electronic module of the present technology is not particularly limited, and any method that can form a sealing layer in the electronic module can be used. For example, the sealing layer can be suitably formed by a jetting method in which a liquid material such as a liquid sealing resin is sprayed at a target position at high speed, a dispensing method in which a liquid material such as a liquid sealing resin is extruded from a nozzle or dispenser and placed at a specific position, or a molding method in which a sealing material is molded using a mold.

[0072] In the electronic module of the present technology, the frame may be configured to be installed on the sealing layer. By installing the frame on the sealing layer and supporting the lid from the surface facing the electronic device, good ventilation of the cavity can be ensured, and since force from the side direction is not applied to the lid during the manufacturing process of the electronic module, the occurrence of cracks in the lid can be reduced.

[0073] 17 , when the electronic module of the present technology includes an internal electrode and a wire that connects the internal electrode to an electronic device and electrically connects the electronic device to an external power supply electrode, the sealing layer can cover the wire, thereby suppressing light reflection from the cavity-side surface by the wire. In particular, when the electronic device is an image sensor, the occurrence of input of an optical signal due to unintended light reflection can be reduced.

[0074] In the electronic module of the present technology, when the sealing layer covers the wires as described above, the frame can be placed above the wire installation position by configuring the frame to be placed on the sealing layer as in the example of the electronic module shown in Fig. 17 or by configuring the frame to be placed on the electronic device as in the example of the electronic module shown in Fig. 22. This reduces the area required per electronic module and can make the electronic module smaller.

[0075] <Electrodes> The electronic module of the present technology may further include one or more sets of external power supply electrodes and electrodes connected to the respective external power supply electrodes, and may be configured to supply electricity from the electrodes to the porous structure such as the porous ceramic.

[0076] Here, the term "external power supply electrode" refers to an electrode for supplying electricity to the electronic module from outside the electronic module, and the term "electrode" refers to an electrode for supplying electricity supplied from the external power supply electrode to the porous structure.

[0077] In this embodiment, the electronic module of the present technology includes one or more sets of external power supply electrodes, where "set" refers to a constituent unit, and one set of external power supply electrodes refers to a constituent unit consisting of two or more external power supply electrodes that form one circuit.

[0078] The material constituting the external power supply electrode is not particularly limited as long as it is a conductive material, and for example, materials that can be formed into a film on a substrate by a method such as plating, such as metals such as Au, Pt, Cu, Ag, Ni, and Al, and semimetals such as graphene, can be suitably used.

[0079] The material constituting the electrode is not particularly limited as long as it is a material having electrical conductivity. For example, a resin-hardening conductive paste material capable of forming an electrode on an electrode forming portion provided on a frame body joined to a substrate, or a conductive resin such as a conductive adhesive can be suitably used.

[0080] When the electronic module of the present technology is equipped with the external power supply electrode and electrode, the porous structure can be made of a conductive porous structure such as a conductive porous ceramic, and by supplying electricity to the porous structure, the porous structure can generate heat and the temperature of the cavity can be controlled.

[0081] This means that, for example, if the electronic module of the present technology is exposed to changes in air pressure over a short period of time, the temperature of the cavity can be controlled using the above method, and water vapor can be released to the outside through the pores of the porous structure, thereby preventing condensation from forming inside the cavity.

[0082] The electrodes are bonded to the substrate and the lid, so that the width of the electrodes in the direction perpendicular to the substrate matches the width of the frame in the direction perpendicular to the substrate, thereby supplying electricity to the entire porous structure present between a pair of electrodes, causing the entire porous structure to generate heat, and controlling the temperature of the cavity.

[0083] In the embodiment in which the electronic module of the present technology includes the external power supply electrode and the electrode, by providing two or more sets of external power supply electrodes, the temperature of the cavity can be precisely controlled for each region sandwiched between the electrodes. This makes it possible to suitably control the temperature of the cavity even when the heat generation amount for each region differs, for example, when the electronic device included in the electronic module of the present technology has multiple regions with different functions, such as an image sensor region and a logic region.

[0084] In the above-described embodiment, the external power supply electrodes included in the electronic module of the present technology may be any number of sets of two or more, for example, in accordance with the area of ​​the electronic device.

[0085] Here, "joining" refers to joining, and the electrode and the porous ceramic may be joined directly or indirectly via another component.

[0086] The electrical conductivity of the porous structure such as porous ceramic used in the present technology is, for example, 0.1 Ω cm or more when expressed as electrical conductivity. The upper limit of the electrical conductivity of the porous structure used in the present technology is, for example, 100 Ω cm or less, preferably 10 Ω cm or less.

[0087] For example, alumina, SiC, etc. can be suitably adjusted to have the above-mentioned electrical conductivity, and therefore can be suitably used as the conductive porous structure.

[0088] <Wire> The electronic module of the present technology may include a wire. The wire is a conductive member that electrically connects the electronic device and an external power supply electrode and functions as a path for an electrical signal. The electronic module of the present technology may include a plurality of wires corresponding to the number of terminals of the electronic device. Note that, in this specification, the term "wire" includes not only a metal wire formed independently of a substrate that can be used for wire bonding or the like, but also a conductive wire such as a conductive pattern or line formed on a substrate.

[0089] The wires included in the electronic module of the present technology are not particularly limited as long as they can electrically connect the electronic device and the external power supply electrode. The wires may be made of any highly conductive material, such as Au, Pt, Cu, Ag, Ni, or Al, either alone or in combination. Furthermore, the wires may be coated with any insulating material, such as polyurethane, enamel, or polytetrafluoroethylene (PTFE), to prevent short-circuiting with adjacent wires or with terminals within the electronic module.

[0090] In an embodiment of the present technology, the electronic module includes the external power supply electrode and the electrode. Therefore, even if the adhesive overflows onto the electrode portion of the substrate during the manufacturing process of the electronic module, the adhesive is conductive and therefore has little effect on the electrical characteristics of the circuit formed by the external power supply electrode and the electrode. Therefore, it is expected that the area where the adhesive is applied during the manufacturing process of the electronic module of the present technology will be easily controlled.

[0091] The conductive adhesive that can be used in the electronic module of the present technology is not particularly limited, and any conductive adhesive can be suitably used. Also, as described above, in the electronic module of the present technology, the conductive adhesive may contain a substance having moisture adsorption ability to form an adhesive layer having moisture adsorption ability.

[0092] <Thermoelectric Conversion Element> In the embodiment in which the electronic module of the present technology includes the external power supply electrode and the electrode, the electronic module of the present technology may include a thermoelectric conversion element. In this case, the electronic module of the present technology may include the thermoelectric conversion element inside and / or outside the electronic module.

[0093] Here, a "thermoelectric conversion element" is an element that converts thermal energy into electrical energy and vice versa, and in the electronic module of the present technology, the thermoelectric conversion element is used to measure the temperature of a target area. In the electronic module of the present technology, the thermoelectric conversion element installed inside the electronic module is referred to as an internal thermoelectric conversion element, and the thermoelectric conversion element installed outside the electronic module is referred to as an external thermoelectric conversion element.

[0094] The thermoelectric conversion element that can be used in the electronic module of the present technology is not particularly limited, and known thermoelectric conversion elements can be suitably used depending on the structure of the electronic module and the materials used. Known thermoelectric conversion elements include, for example, thermocouples such as alumel-chromel, nicrosil-nisil, platinum-platinum-rhodium, chromel-constantan, iron-constantan, and copper-constantan, thermal resistance change elements such as thermistors, and thermoelectric power generation elements utilizing the Seebeck effect such as bismuth tellurite (Bi2Te3).

[0095] When the electronic module of the present technology includes an internal thermoelectric conversion element, the electronic module can compare the temperature measured by the internal thermoelectric conversion element with a preset temperature, and when the measured temperature is equal to or lower than the preset temperature, control the supply of electricity from the electrodes to the porous structure such as porous ceramic, thereby efficiently controlling the temperature of the cavity.

[0096] In this case, the comparison may be performed at predetermined time intervals, and by setting the predetermined time to a short period, the temperature of the cavity can be controlled more precisely.

[0097] When the electronic module of the present technology further includes an external thermoelectric conversion element on the outside of the electronic module, the dew-point temperature can be determined from the measured values ​​of the external temperature and humidity by using the internal measured temperature measured by the internal thermoelectric conversion element, the external measured temperature measured by the external thermoelectric conversion element, and the humidity measured by a humidity sensor (described later), and the dew-point temperature can be compared with the internal measured temperature. When the internal measured temperature is equal to or lower than the dew-point temperature, the supply of electricity from the electrodes to the porous structure can be controlled. This can more efficiently control the temperature of the cavity.

[0098] In this case, the comparison may be performed at predetermined time intervals, and by setting the predetermined time to a short period, the temperature of the cavity can be controlled more precisely.

[0099] In particular, when the porous structure forming the frame of the electronic module of the present technology is made of SiC, the thermal conductivity is superior to that of molded resin, etc., and therefore the heat dissipation is excellent, the heat distribution is reduced, and the distortion of the electronic module due to the heat distribution can be suppressed. Therefore, by combining the above-mentioned thermoelectric conversion element, the above-mentioned properties of SiC can be suitably utilized.

[0100] <Humidity Sensor> In an embodiment in which the electronic module of the present technology includes the external power supply electrode and the electrode, the electronic module of the present technology may include a humidity sensor inside or outside the electronic module. By including a humidity sensor in the electronic module of the present technology, it is possible to determine the dew point temperature along with the measured temperature, and when the internal measured temperature is equal to or lower than the dew point temperature, it is possible to control the supply of electricity from the electrode to the porous structure. In this case, the electronic module of the present technology may include the humidity sensor inside and / or outside the electronic module.

[0101] Here, the "humidity sensor" is a sensor for measuring the humidity around the sensor. In the electronic module of the present technology, the humidity sensor may be provided inside or outside the electronic module, but from the viewpoint of manufacturing the electronic module, it is easier to provide the humidity sensor outside the electronic module.

[0102] The humidity sensor that can be used in the electronic module of the present technology is not particularly limited, and any known humidity sensor can be suitably used, such as a resistive humidity sensor, a capacitive humidity sensor, an optical humidity sensor, or a surface acoustic wave humidity sensor.

[0103] In the electronic module of the present technology, the porous structure such as porous ceramic that forms the frame may be in contact with or bonded to a heat dissipating or absorbing member. In particular, alumina, SiC, etc. that can be used as the porous structure of the present technology are materials with excellent thermal conductivity, so that the porous structure may be in contact with or bonded to a heat dissipating or absorbing member to suitably control the temperature of the cavity.

[0104] As a result, for example, when the electronic module of this technology is exposed to short-term changes in air pressure, the temperature of the cavity can be controlled using the above method, and water vapor can be released to the outside through the pores of the porous structure, thereby preventing condensation from forming inside the cavity.

[0105] In addition, in order to make it easier for the porous structure to come into contact with or bond to a heat dissipation or absorption member, the shape of the frame body may be expanded, etc., to provide an area on a part of the surface of the frame body that comes into contact with or bonds to the heat dissipation or absorption member.

[0106] Here, the heat dissipation member is a member that can release thermal energy to the outside (radiate heat), and is made of, for example, a material with high thermal conductivity, etc. Examples of materials with high thermal conductivity include metals such as aluminum and copper, graphite, and ceramic materials with high thermal conductivity.

[0107] The heat-absorbing member is a member that can absorb (absorb) thermal energy, and is made of, for example, a material with low thermal conductivity, such as metals such as aluminum and copper, graphite, and ceramic materials with high thermal conductivity.

[0108] "Contact" refers to a state in which the surfaces of the objects in question are in direct contact with each other, and "bonding" refers to a state in which the objects in question are bonded and fixed together.

[0109] The heat dissipating or absorbing member that can be used in the electronic module of the present technology is not particularly limited, and in addition to the examples given above, known heat dissipating or absorbing members can be suitably used. Examples of known heat dissipating or absorbing members include Peltier elements, heating media such as heaters, heat dissipating members such as heat sinks, fans, and heat radiation plates, and heat absorbing members such as heat storage materials, heat absorption agents, and heat exchangers.

[0110] The porous structure and the heat dissipating or absorbing member may be directly bonded or indirectly bonded via another component depending on the characteristics of the heat dissipating or absorbing member used in the electronic module of the present technology. Furthermore, the heat dissipating or absorbing member may be either a heat dissipating member or a heat absorbing member, or a combination of both, depending on the intended use of the electronic module of the present technology. Although a single heat dissipating or absorbing member may be used, multiple heat dissipating or absorbing members may be used depending on the intended use of the electronic module.

[0111] In the electronic module of the present technology, the method of controlling the temperature of the cavity using the heat dissipation or heat absorption member may be employed in combination with the method of controlling the temperature of the cavity by using the external power supply electrode and electrodes to generate heat in a porous structure such as a porous ceramic, or may be employed independently without being combined with the method of controlling the temperature of the cavity using the external power supply electrode and electrodes.

[0112] <Solder Bumps or Metal Balls> The electronic module of the present technology may further have a so-called ball grid array (BGA) configuration in which a plurality of solder bumps or metal balls are formed on the second main surface of the substrate. Here, "solder bumps" refer to solder having a spherical or other shape provided for electrically connecting the semiconductor module to an external terminal. Similarly, "metal balls" refer to metal having a spherical or other shape provided for electrically connecting the semiconductor module to an external terminal.

[0113] The solder bumps or metal balls formed on the second main surface of the substrate of the electronic module can electrically connect the external terminals to the electronic module and also mechanically connect them, thereby transmitting electrical signals and power from the external terminals to the electronic devices within the electronic module.

[0114] <Other Configurations> The electronic module of the present technology may have other configurations in addition to the configurations described above, as necessary, as long as the other configurations do not significantly impair the desired physical properties. Furthermore, for example, a configuration in which multiple electronic modules are formed on a single substrate may be used.

[0115] [Control system for electronic module] When the electronic module of the present technology is equipped with a thermoelectric conversion element and a humidity sensor, as described above, it has good breathability due to a porous structure such as porous ceramic, and can also function as a control system for the electronic module that can suitably control the temperature of the cavity.

[0116] Here, the term "control system" is not limited to a method for controlling the temperature of the cavity, but also includes a device that realizes the temperature control. The control system for the electronic module according to the present technology may be integrated into a finished product such as a device, or may be detachably incorporated into the finished product like a component incorporated into the device.

[0117] [Imaging device] The electronic module of the present technology can suppress deformation of the electronic module while ensuring good ventilation even with a simple configuration, and therefore, even when an image sensor or the like is used as an electronic device, distortion of an image acquired by the image sensor can be suppressed. For this reason, the electronic module of the present technology can be suitably used in an imaging device.

[0118] Examples of imaging devices that may use electronic modules of the present technology include, for example, cameras, sensors, and the like.

[0119] Specific embodiments of an electronic module according to the present technology will be described below with reference to the drawings. Note that the embodiments described below are examples of embodiments of the present technology, and the present technology should not be interpreted as being limited to the contents of these embodiments.

[0120] 1 is a side view of an example of an electronic module according to a first embodiment. An electronic module 10 according to this embodiment includes a substrate 11 having a first main surface and a second main surface, an electronic device (image sensor) 12 attached to the first main surface, a frame 13 attached to the first main surface so as to surround the electronic device 12, and a lid 14 attached to the frame 13 so as to face the electronic device 12.

[0121] The electronic module 10 shown in Figure 1 has a frame body 13 that surrounds the outer periphery of an electronic device 12 attached to a first main surface of a substrate 11, and a cavity 15 that is a semi-enclosed space that surrounds the electronic device by attaching a lid body 14 to the frame body 13.

[0122] 1, the frame 13 surrounding the electronic device 12 is made of porous ceramic, a porous material with numerous interconnected pores, ensuring good ventilation within the cavity of the electronic module of the present technology. This allows the volume within the cavity to remain constant even in the event of sudden changes in air pressure or temperature. At the same time, the intrusion of dust from the outside can be prevented, thereby preventing contamination of the cavity due to air inflow and outflow.

[0123] Furthermore, the high breathability of the frame facilitates the replacement of gas within the cavity. This allows the cavity to be replaced with any gas, such as dry air or an inert gas, depending on the intended use and application of the electronic module. Furthermore, the presence of numerous pores reduces the weight per unit volume, potentially making the product lighter than ordinary ceramic components.

[0124] Furthermore, by using a porous ceramic such as alumina or SiC, which has a linear expansion coefficient smaller than that of the substrate or lid of the electronic module, as the frame body 13 surrounding the electronic device 12, it is possible to suppress relative deformation of the frame body portion of the electronic module.

[0125] When SiC is used as the porous ceramic forming the frame, the inner side surface of the frame becomes black and rough, which suppresses light reflection inside the electronic module, thereby preventing or reducing the image sensor from receiving unintended light due to light reflection from the surface of the frame on the cavity side.

[0126] SiC has high heat resistance and low reactivity, which is expected to reduce the possibility of reactions with the external atmosphere (oxidation, reduction, and deterioration). This allows electronic modules to maintain their initial characteristics even in various environments. In addition, SiC's high hardness makes it easy to ensure flatness and parallelism through polishing.

[0127] Furthermore, SiC has superior thermal conductivity compared to molding resins and the like, and therefore has excellent heat dissipation properties, reduces heat distribution, and can suppress distortion of the electronic module due to heat distribution.

[0128] In the example of the electronic module 10 shown in FIG. 1, the electronic device 12 is connected to the internal electrode 16 via a connection wire 17 .

[0129] Here, the internal electrodes 16 are electrodes that supply electricity to the electronic device 12 from outside the electronic module, and the electronic device 12 forms an electronic circuit intended by the electronic module of the present technology by being connected to the internal electrodes 16 via connection wires 17. Note that in the example of the electronic module shown in Fig. 1 , the electronic device 12 forms an electronic circuit by being connected to the internal electrodes 16 via the connection wires 17, but the form of the connection wires 17 is not limited to the form shown in Fig. 1 and may take any form that can form an electronic circuit, such as flip-chip bonding using solder balls.

[0130] In the example of the electronic module 10 shown in Fig. 1, the electronic device 12 is attached to the substrate 11 with adhesive 18. Note that, although the electronic device 12 is attached to the substrate with adhesive 18 in the example of the electronic module shown in Fig. 1, the means for attaching the electronic device to the substrate is not limited to this, and any means capable of attaching the electronic device can be used.

[0131] In the example of the electronic module 10 shown in FIG. 1 , the frame 13 and the lid 14 are bonded together with adhesive 18-2. Furthermore, the frame 13 and the substrate 11 are bonded together with adhesive 18-3. Note that any adhesive can be used for the adhesives 18, 18-2, and 18-3 depending on the characteristics of the materials to be bonded and the required characteristics of the bonding surfaces. Note that the adhesive 18-2 or adhesive 18-3 used to bond the frame 13 and the substrate 11 or the lid 14 may contain the aforementioned moisture-adsorbing substance. By including a substance with moisture-adsorbing ability in either or both of the adhesives 18-2 and 18-3, the frame 13 of the electronic module 10 can be suitably provided with moisture-adsorbing ability, thereby reducing the impact of condensation on breathability. Furthermore, the bonding means between the frame 13 and the lid 14 and the bonding means between the frame 13 and the substrate 11 are not limited to the form shown in FIG. 1 , and any means capable of bonding the frame 13 and the lid 14 or the frame 13 and the substrate 11 can be used.

[0132] In the first embodiment, other configurations that can be used in other embodiments described later can also be suitably used in this embodiment.

[0133] 2 is a conceptual side view of an example of a second embodiment in which an electronic module according to the present technology includes external power supply electrodes and electrodes. In addition to the configuration of the electronic module shown in the first embodiment, the electronic module 10 according to this embodiment includes one or more sets of external power supply electrodes 21 and electrodes 19 connected to each of the external power supply electrodes 21.

[0134] The electronic module shown in Figure 2 is equipped with one or more sets of external power supply electrodes 21 and electrodes 19 connected to each external power supply electrode 21, making it possible to supply electricity from the electrodes 19 to the frame body 13 formed of porous ceramic, causing the frame body to generate heat.

[0135] As described above, by generating heat from the frame, the temperature inside the electronic module 10 can be adjusted. Furthermore, moisture adsorbed to the frame 13 itself can be volatilized, making it possible to maintain the condition of the electronic module 10. Furthermore, the components that make up the electronic module 10, such as the substrate 11, frame 13, and lid 14, can be heated, which can prevent condensation from forming on the surfaces of these components even when the electronic module 10 is exposed to short-term changes in air pressure. Even if condensation does occur, the heat can volatilize the condensation and other surface deposits.

[0136] In particular, when SiC is used as the porous ceramic forming the frame, it has excellent thermal conductivity and can effectively conduct heat, thereby maintaining the electronic module 10 in a favorable condition.

[0137] Furthermore, in this embodiment, a conductive adhesive is used as the adhesive 18-3 that bonds the frame 13 and the substrate 11. Therefore, even if the adhesive overflows onto the portion of the substrate 11 where the electrode 19 is to be disposed during the manufacturing process of the electronic module 10, the adhesive is conductive and therefore has little effect on the electrical characteristics of the circuit formed by the external power supply electrode 21 and the electrode 19. This is expected to make it easier to control the area where the adhesive is applied during the manufacturing process of the electronic module 10.

[0138] Fig. 3 is a conceptual diagram illustrating an example of a second embodiment in which an electronic module according to the present technology includes an external power supply electrode and an electrode, as viewed from above. In the example of the electronic module shown in Fig. 3, a pair of electrodes 19 are arranged diagonally across the electronic module 10. As a result, as shown in Fig. 3, when electricity is supplied from the external power supply electrode 21 to the electrodes 19, an electric path 22, which is an electrical path, is formed within the frame 13 from one electrode 19 to the other electrode 19, and the frame 13 on the electric path generates heat. As a result, the temperature inside the electronic module 10 can be adjusted, as described above.

[0139] In the example of the electronic module shown in Figure 3, the electrodes are arranged diagonally across the electronic module, but the positions at which the electrodes are arranged are not limited to the diagonal across the electronic module, and they can be arranged at any position depending on the purpose of use and target characteristics of the electronic module.

[0140] Fig. 4 is a conceptual diagram showing a modification of the second embodiment of the electronic module according to the present technology, in which the electronic module includes an external power supply electrode and an electrode, as viewed from above. The example of the electronic module shown in Fig. 4 is similar to the example of the electronic module shown in Fig. 3, except that two sets of electrodes 19 are arranged diagonally across the electronic module 10. Increasing the number of electrodes makes it possible to generate heat in the frame body 13 more efficiently.

[0141] 4, by adjusting the positions of the electrodes, the heat generation area can be controlled, for example, to create a thermal gradient within the electronic module. This makes it possible to adjust the temperature according to the heat generation position of the electronic device, for example, when the heat generation is not uniform across the surface of the electronic device.

[0142] Furthermore, although the example of the electronic module shown in Figure 4 is provided with two sets of electrodes, the number of electrodes is not limited to two, and any number of electrodes may be provided depending on the purpose of use of the electronic module and the target characteristics.

[0143] In the second embodiment, other configurations can be suitably used that are similar to those that can be used in the first embodiment.

[0144] 5 is a side view of an example of a third embodiment in which an electronic module according to the present technology includes a thermoelectric conversion element and a humidity sensor. The electronic module 10 according to this embodiment includes an internal thermoelectric conversion element 23 and an external thermoelectric conversion element 24, which are thermoelectric conversion elements, and a humidity sensor 25, in addition to the configuration of the electronic module shown in the second embodiment.

[0145] By equipping these sensors, it is possible to grasp changes in the environment, adjust the internal temperature of the electronic module 10 in real time in response to changes in the environment, and change the internal temperature of the electronic module depending on the situation or keep it constant.

[0146] First, the electronic module 10 according to this embodiment is provided with an internal thermoelectric conversion element 23 inside the cavity 15 of the electronic module 10, and is capable of comparing the internal measured temperature measured by the internal thermoelectric conversion element 23 with a preset temperature, and controlling the supply of electricity from the electrode 19 to the frame body 13 formed of porous ceramic when the internal measured temperature is equal to or lower than the preset temperature.

[0147] This makes it possible to realize the control of the electronic modules shown in the flowchart of FIG.

[0148] That is, in the control system of the electronic module according to the flowchart of Figure 6, a signal indicating the timing of sampling, which is emitted at a preset timing, is used as a trigger to compare the internal measured temperature measured by the internal thermoelectric conversion element 23 with a preset temperature.

[0149] If the measured internal temperature is equal to or higher than the set temperature, no current is supplied from the external power supply electrode 21. On the other hand, if the measured internal temperature is equal to or lower than the set temperature, current is supplied from the external power supply electrode 21 to the frame 13 via the electrode 19, causing the frame 13 to generate heat. This current supply continues until the measured internal temperature becomes equal to or higher than the set temperature at the timing of the subsequent sampling, at which point the current supply stops.

[0150] The timing of the sampling may be set, for example, at predetermined time intervals. Setting the predetermined time interval to a shorter interval allows for more precise control of the cavity temperature. Although not shown in the example of the electronic module control system shown in the flowchart of FIG. 6, a margin temperature can also be set, as in the example shown in FIG. 7 (described later). Setting the margin temperature allows for gentler temperature control.

[0151] Next, the electronic module 10 according to this embodiment further includes an external thermoelectric conversion element 24 and a humidity sensor 25 outside the electronic module 10, thereby determining the dew point temperature from the external measured temperature measured by the external thermoelectric conversion element 24 and the humidity measured by the humidity sensor 25, comparing the dew point temperature with the internal measured temperature measured by the internal thermoelectric conversion element 23, and controlling the supply of electricity from the electrode 19 to the frame body 13 formed of porous ceramic when the internal measured temperature is equal to or lower than the dew point temperature.

[0152] This makes it possible to realize the control of the electronic modules shown in the flowchart of FIG.

[0153] 7, the control system for the electronic module determines the dew-point temperature based on the external temperature measured by the external thermoelectric conversion element 24 and the humidity measured by the humidity sensor 25, triggered by a signal indicating the timing of sampling, which is generated at a preset timing.Then, the determined dew-point temperature is compared with the internal temperature measured by the internal thermoelectric conversion element 23.

[0154] When the measured internal temperature is equal to or higher than the dew point temperature, no current is supplied from the external power supply electrode 21. On the other hand, when the measured internal temperature is equal to or lower than the dew point temperature, current is supplied from the external power supply electrode 21 to the frame 13 via the electrode 19, causing the frame 13 to generate heat. This current supply continues until the measured internal temperature becomes equal to or higher than the dew point temperature at the timing of the subsequent sampling, and when the measured internal temperature becomes equal to or higher than the dew point temperature, the current supply stops.

[0155] The sampling timing may be set, for example, at predetermined time intervals. Setting the predetermined time interval to a shorter interval allows for more precise control of the cavity temperature. Alternatively, as shown in FIG. 7 , a margin temperature may be set between the dew-point temperature and the internally measured temperature, and the current supply state or the current supply stop state may be maintained when the difference between the dew-point temperature and the internally measured temperature is within the margin temperature range.

[0156] Setting the margin temperature enables gentle temperature control. Note that although the example of the electronic module control system shown in Fig. 7 shows an example in which a margin temperature is set, it is not necessary to set a margin temperature, as shown in the example of Fig. 6.

[0157] In the example of the electronic module of the third embodiment shown in Figure 5, the humidity sensor 25 is provided externally, but the humidity sensor 25 may also be provided internally depending on the purpose of use and target characteristics of the electronic module.

[0158] Furthermore, in the example of the electronic module of the third embodiment shown in Figure 5, an example is shown in which the electronic module is provided with the internal thermoelectric conversion element 23, the external thermoelectric conversion element 24, and the humidity sensor 25, but the electronic module may be configured to include any number of sensors at any positions depending on the purpose of use and target characteristics of the electronic module.

[0159] In the third embodiment, other configurations can be suitably used that are similar to those that can be used in the second embodiment.

[0160] 8 is a conceptual diagram of an example of a fourth embodiment in which an electronic module according to the present technology includes a plurality of electrodes and thermoelectric conversion elements. The electronic module 10 according to this embodiment is the same as the configuration of the electronic module shown in the third embodiment, except that the electronic device 12 includes, for example, a logic section or the like, and the region constituting the logic section or the like includes a region in which the temperature is relatively high compared to other regions (hereinafter referred to as the "electronic device high temperature region"), and includes a plurality of internal thermoelectric conversion elements 23 and a plurality of pairs of external power supply electrodes 21 and electrodes 19 around the electronic device high temperature region.

[0161] In the example of the electronic module shown in Figure 8, the electronic device 12 has an electronic device high temperature region 26. By providing multiple internal thermoelectric conversion elements 23 around the electronic device high temperature region, which is relatively hotter than other regions of the electronic device, it is possible to grasp local environmental changes within the cavity. Furthermore, by providing multiple pairs of external power supply electrodes 21 and electrodes 19, it is possible to control the heat-generating area within the cavity and adjust the internal temperature of the electronic module 10 to be uniform in real time in response to the local environmental changes.

[0162] In the example of the electronic module of the fourth embodiment, as shown in FIG. 8, local temperature control can be used to adjust the temperature throughout the package to be uniform, thereby suppressing or correcting distortion or distortion throughout the entire electronic module.

[0163] 8 are examples of the electronic module of the fourth embodiment, and are not limited to these. The numbers and positions of the internal thermoelectric conversion elements and electrodes can be adjusted as desired depending on the characteristics of the electronic device used, the purpose of use of the electronic module, and the target characteristics.

[0164] In the fourth embodiment, other configurations can be suitably used that are similar to those that can be used in the third embodiment.

[0165] 9 is a conceptual diagram showing a side view of an example of a fifth embodiment in which a porous ceramic included in an electronic module according to the present disclosure is in contact with or bonded to a heat dissipation or absorption member. In addition to the configuration of the electronic module shown in the first embodiment, the electronic module 10 according to this embodiment has a porous ceramic forming a frame 13 that is in contact with or directly or indirectly bonded to a heat dissipation or absorption member 27.

[0166] In the example of the electronic module of the embodiment shown in Figure 9, the porous ceramic forming the frame 13 of the electronic module 10 is in direct or indirect contact with or bonded to a heat dissipation or absorption member 27 located outside the cavity 15. When a heat dissipation member is used, the heat dissipation member 27 can efficiently dissipate thermal energy inside the cavity to the outside, thereby lowering the temperature inside the cavity. When a heat absorption member is used, the heat absorption member 27 can efficiently absorb thermal energy inside the cavity, thereby lowering the temperature inside the cavity.

[0167] 9, the shape of the frame 13 made of porous ceramic is expanded outward to facilitate contact or bonding with the heat dissipation or absorption member 27 on a portion of the surface of the frame 13. The shape that facilitates contact or bonding of the frame 13 with the heat dissipation or absorption member 27 is not limited to the example shown in FIG. 9, and any shape can be used to ensure the contact or bonding surface.

[0168] In addition, alumina, SiC, etc., which can be used as porous ceramics in this technology, are materials with excellent thermal efficiency, so when these are used as porous ceramics, the thermal energy inside the cavity can be efficiently transferred to the heat dissipation or heat absorption member 27.

[0169] In the electronic module of this embodiment, the porous ceramic forming the frame body 13 and the heat dissipation or absorption member 27 may be in contact with each other, may be directly bonded to each other, or may be indirectly bonded to each other via other members, etc., depending on the characteristics of the heat dissipation or absorption member used.

[0170] In the electronic module of this embodiment, the heat dissipating or absorbing member may be either a heat dissipating member or a heat absorbing member, or a combination of both, depending on the intended use of the electronic module, etc. Furthermore, one heat dissipating or absorbing member may be used, but multiple heat dissipating or absorbing members may also be used depending on the intended use of the electronic module, etc.

[0171] Although not explicitly shown in the example shown in Figure 9, the heat dissipation or absorption member that can be used in the electronic module of this embodiment can be any heat dissipation or absorption member, such as the known heat dissipation or absorption members described in this specification, depending on the intended use of the electronic module, etc.

[0172] Furthermore, at least a portion of the surface of the porous ceramic used in the electronic module of this embodiment may be subjected to a water-repellent treatment. This water-repellent treatment can effectively prevent large particles of water, water droplets, etc. from being introduced into the cavity 15, reduce the effects of condensation, etc., and maintain the breathability of the porous ceramic. In particular, even in situations where condensation may occur on the surface of the porous ceramic, such as when the electronic module of the present technology is exposed to short-term changes in air pressure, the impact of condensation on the breathability of the porous ceramic can be reduced.

[0173] The electronic module of this embodiment may also be combined with a configuration in which the temperature of the cavity is controlled by heating the porous ceramic using the external power supply electrodes and electrodes shown in the second embodiment, etc. In this case, it is expected that the volatilization effect will be enhanced by heating. Furthermore, by subjecting at least a portion of the surface of the porous ceramic to a water-repellent treatment, adhesion of moisture to the inner walls of the pores of the porous ceramic can be suppressed, further enhancing the volatilization effect by heating.

[0174] In the fifth embodiment, other configurations may be suitably used that are similar to those that may be used in the first embodiment. Furthermore, although not shown in Fig. 9, the fifth embodiment may also be suitably combined with configurations that may be used in the other embodiments.

[0175] 6 Sixth Embodiment FIG. 17 is a schematic diagram of an example of an electronic module according to a sixth embodiment, viewed from the side, and FIG. 18 is a schematic diagram of an example of an electronic module according to the sixth embodiment, viewed from the top. The electronic module 10 according to the sixth embodiment, illustrated as an example in FIGS. 17 and 18, includes a sealing layer 29 provided on the first main surface of the substrate 11 so as to surround the electronic device 12. In the example illustrated in FIG. 17, it can be seen that the sealing layer 29 covers the wires 17. As a result, as shown in FIG. 18, the wires 17 are not exposed within the cavity 15. This prevents unintended light reflection from the surface on the cavity 15 side due to the wires 17, thereby reducing the possibility of unintended light being incident on the light-receiving surface 12-1 of the electronic device and resulting in the input of an erroneous signal.

[0176] Furthermore, in the electronic module 10 according to this embodiment, the frame 13 is placed on the sealing layer 29 and supports the lid 14 from the surface facing the electronic device 12. With this configuration, the frame 13 can be placed above the installation position of the wires 17, thereby reducing the area required per electronic module and enabling the electronic module to be made smaller.

[0177] FIG. 19 is an image of an example of an electronic module according to the prior art, viewed from the side, in which the lid body 14 is supported by a sealing layer 29 surrounding the side surfaces of the lid body 14. In the electronic module configuration shown in FIG. 19, a force may be applied to the lid body 14 from the side during the manufacturing process of the electronic module, which may cause cracks in the lid body 14. In contrast, in the electronic module according to this embodiment shown in FIG. 17, the frame 13 supports the lid body 14 from the surface facing the electronic device 12, so that a force is not applied to the lid body 14 from the side during the manufacturing process of the electronic module 10. This reduces the likelihood of cracks occurring in the lid body 14 during the manufacturing process of the electronic module.

[0178] In addition, in the electronic module 10 according to the sixth embodiment shown as an example in Figure 17, the porous structure forming the frame body 13 may be a pre-manufactured porous structure that is placed at the desired position on the sealing layer 29, or may be formed by polymerizing the raw materials of the porous structure at the desired position on the sealing layer 29 to synthesize the material.

[0179] 17, one or both of the adhesive layers 18-2 and 18-3 that bond the frame 13 to the substrate 11 or the lid 14 may contain a substance that has moisture adsorption ability. This allows the frame 13 of the electronic module 10 to preferably have moisture adsorption ability, thereby reducing the impact of condensation on breathability.

[0180] 17 shows an example of an electronic module 10 according to a sixth embodiment. The lid 14 has a light-shielding film 14-1 formed on its side surface, which prevents unintended light from entering through the side surface of the lid 14.

[0181] 17, the electronic module according to this embodiment may have a so-called ball grid array (BGA) configuration in which a plurality of solder bumps 31 are formed on the second main surface of the substrate 11. The substrate 11 included in the electronic module according to this embodiment may also be a substrate on which electrical paths are pre-wired, as shown in FIG.

[0182] In the sixth embodiment, other configurations may be preferably the same as those that can be used in the other embodiments. Also, the sixth embodiment may be preferably provided with a combination of configurations that can be used in the other embodiments.

[0183] 7 Seventh Embodiment Fig. 20 is a conceptual diagram showing an example of an electronic module according to a seventh embodiment, viewed from the side. In the electronic module 10 according to the seventh embodiment, the frame 13 is formed from a porous sheet (porous structure) made by stretching a fluororesin or the like to make it porous. The electronic module of the seventh embodiment shown in Fig. 20 is identical in configuration to the electronic module of the sixth embodiment shown in Fig. 17 , except that the frame 13 is formed from the sheet. In the electronic module according to the seventh embodiment, the breathability of the frame 13 can be adjusted by adjusting the thickness and fiber diameter of the sheet, ensuring good breathability and suppressing deformation of the electronic module 10.

[0184] The seventh embodiment may also suitably include other configurations similar to those that can be used in the other embodiments.Furthermore, the seventh embodiment may also be provided with a suitable combination of configurations that can be used in the other embodiments.

[0185] 8 Eighth Embodiment Fig. 21 is a conceptual diagram showing an example of an electronic module according to an eighth embodiment, viewed from the side. In the electronic module 10 according to the eighth embodiment, the frame body 13 is formed from porous ceramic. The electronic module according to the eighth embodiment shown in Fig. 21 is identical in configuration to the electronic module according to the sixth embodiment shown in Fig. 17 , except that the frame body 13 is formed from porous ceramic. In the electronic module according to the present technology, even when porous ceramic is used as the porous structure as shown in Fig. 21 , the frame body 13 may be placed on a sealing layer 29 that covers the wires 17, as in the electronic module according to the sixth embodiment shown as an example in Fig. 17 .

[0186] In this embodiment, the porous ceramic forming the frame 13 may be, for example, a black porous ceramic such as SiC. In this case, the inner side surface of the frame is black and rough, which suppresses light reflection inside the electronic module. This can prevent or reduce unintended light reception by the light receiving surface of the electronic device due to light reflection from the surface of the frame 13 on the cavity 15 side.

[0187] The eighth embodiment may also preferably include other configurations similar to those that can be used in the other embodiments.Furthermore, the eighth embodiment may also include a suitable combination of configurations that can be used in the other embodiments.

[0188] 9 Ninth Embodiment Fig. 22 is an image diagram showing an example of an electronic module according to a ninth embodiment, viewed from the side. The electronic module 10 according to the ninth embodiment shown in Fig. 22 differs from the electronic module shown in Fig. 17 in that a frame 13 formed from a porous structure is placed on the electronic device. In the electronic module shown in Fig. 22, the frame 13 is bonded to the surface of the electronic device 12 by an adhesive layer 18-3. Therefore, in the electronic module shown in Fig. 22, the frame 13 mainly functions as a rib member that reinforces the structure of the electronic module 10.

[0189] When a substance having moisture adsorption ability is contained in the adhesive layer that fixes the frame body 13 of the electronic module shown in Figure 22, in order to ensure moisture adsorption ability, it is preferable that the substance having moisture adsorption ability be contained in the adhesive layer 18-2 that is exposed to the outside due to its structure.

[0190] The ninth embodiment may also preferably include other configurations similar to those that can be used in the other embodiments.Furthermore, the ninth embodiment may also include a suitable combination of configurations that can be used in the other embodiments.

[0191] 10. Tenth Embodiment Fig. 33 shows an image of an example of an electronic module according to a tenth embodiment as viewed from the side, and Fig. 34 shows an image of an example of an electronic module according to this embodiment as viewed from the top. Note that Fig. 33 is an image of a cross section X shown in Fig. 34 as viewed from the direction of the arrow.

[0192] 33 and 34 show an example of an electronic module 10 according to a tenth embodiment. Holes 35 for ensuring ventilation within the cavity 15 are formed by processing the transparent material that constitutes the lid 14. In the electronic module according to this embodiment, as described above, the diameter of the holes 35 formed in the lid 14 is set to 10 μm or less, thereby ensuring good ventilation and maintaining a constant volume within the cavity even in the event of a sudden change in air pressure or temperature in the electronic module, thereby effectively preventing water from entering the cavity. As described above, the diameter of the holes 35 formed in the lid 14 may be designed to be 10 μm or less to match the size of the pixels of the electronic device included in the electronic module.

[0193] 33 and 34 , it can be seen that the holes 35 provided in the cover 14 are located away from the light-receiving surface 12-1 of the electronic device 12. By providing the holes 35 in such a position, it is possible to prevent them from affecting the signal response of the pixels provided on the light-receiving surface 12-1 of the electronic device 12.

[0194] In addition, in the electronic module 10 according to this embodiment shown in Figure 34, an example of a round shape is shown as the shape of the hole 35 provided in the lid body 14, but the shape of the hole provided in the electronic module of the present technology is not limited to this and can be any shape.

[0195] 33 and 34, the lid 14 has one hole 35, but the design can be modified appropriately to accommodate the purpose of the electronic module and the manufacturing process, and the number of holes can be increased to multiple. Furthermore, the hole provided in the lid 14 of the electronic module 10 is provided so as to penetrate perpendicularly to the surface of the lid 14 toward the inside of the cavity 15, but it may also be designed to penetrate in a direction other than perpendicular (diagonal).

[0196] In the electronic module 10 according to this embodiment shown in FIGS. 33 and 34, the frame 13 disposed so as to surround the electronic device 12 also functions as a rib member.

[0197] The tenth embodiment may also suitably include other configurations similar to those that can be used in the other embodiments.Furthermore, the tenth embodiment may also be provided with a suitable combination of configurations that can be used in the other embodiments.

[0198] Next, Fig. 35 shows an image diagram of a modified electronic module according to the tenth embodiment, viewed from the side. While Figs. 33 and 34 show an example of an electronic module 10 equipped with solder bumps 31, this modified electronic module 10 has a metal ball grid array (MBGA) configuration equipped with metal balls 31-1 instead of solder bumps. In the modified electronic module according to MBGA shown in Fig. 35, the frame 13 also functions as a sealing layer.

[0199] In the tenth embodiment shown in FIG. 35, other configurations may suitably be similar to those that may be used in the electronic module shown in FIGS.

[0200] <11 Eleventh Embodiment> In Fig. 36, <36A> shows an image of an example of an electronic module according to an eleventh embodiment as viewed from the side, and <36B> shows an image of an example of an electronic module according to this embodiment as viewed from the top. Note that <36A> is an image of <36B> as viewed from the same direction as the cross section X shown in Fig. 34 described above.

[0201] The electronic module according to the eleventh embodiment shown in Fig. 36 shows an example of a configuration in which a porous structure is disposed at the end of a hole formed by processing a transparent material that forms a lid. The electronic module according to the eleventh embodiment shown in Fig. 36 is an embodiment in which, among the above configurations, the porous structure is disposed inside the cavity.

[0202] In the electronic module 10 according to this embodiment shown in Figure 36, a frame 13 formed of a porous structure is disposed at the cavity 15-side end of a hole 35 formed by processing the lid 14. In this way, by combining the holes formed by processing with the holes in the porous structure, it is possible to suppress the intrusion of water into the cavity while providing good breathability, and to more effectively suppress the intrusion of dust. Note that the porous structure that can be used as the frame 13 of this embodiment may suitably be the same as the porous structure that can be used as the frame in other embodiments.

[0203] In the eleventh embodiment, other configurations may be preferably the same as those that can be used in the other embodiments. Also, the eleventh embodiment may be preferably provided with a combination of configurations that can be used in the other embodiments.

[0204] <12 Twelfth Embodiment> In Fig. 37, <37A> shows an image of an example of an electronic module according to a twelfth embodiment as viewed from the side, and <37B> shows an image of an example of an electronic module according to this embodiment as viewed from the top. Note that <37A> is an image of <37B> as viewed from the same direction as the cross section X shown in Fig. 34 described above.

[0205] 37 , an electronic module according to a twelfth embodiment has a porous film 36 formed of a porous structure disposed at the end of a hole 35 formed by processing the lid 14, the end facing the cavity 15. In this embodiment, as in the eleventh embodiment, by combining the holes formed by processing with the holes in the porous structure, it is possible to both inhibit water from entering the cavity and provide good breathability, and to more effectively inhibit dust from entering.

[0206] Any porous structure that can be used as a material constituting an electronic module can be adopted as the porous structure that can be used as the porous film 36 of this embodiment. The porous film included in the electronic module of this embodiment may be, for example, a film-like material bonded to the lid 14 so as to cover the hole 35, or the porous film may be formed by hardening a porous material applied to the periphery of the hole 35 of the lid 14.

[0207] The electronic module 10 shown in Figure 37 shows an example in which a porous film 36 processed into a shape that covers the entire surface of the hole 35 is bonded to the lid body 14, but the porous film used in this embodiment can have any shape that covers the entire surface of the hole 35 as long as it does not affect the signal response of the pixels provided on the light-receiving surface 12-1 of the electronic device 12.

[0208] The twelfth embodiment may also suitably include other configurations similar to those that can be used in the other embodiments.Furthermore, the twelfth embodiment may also be provided with a suitable combination of configurations that can be used in the other embodiments.

[0209] 13. Thirteenth Embodiment. Figure 38 shows a side view of an example of an electronic module according to a thirteenth embodiment. In this electronic module, a metal ball grid array (MBGA) is configured with metal balls 31-1. A porous film 36 formed of a porous structure is disposed at the outer end of a hole 35 formed by processing the lid 14, facing the cavity 15. In this embodiment, as in the eleventh and twelfth embodiments, the combination of the processed holes and the holes in the porous structure can effectively prevent water from entering the cavity while providing good breathability, and can also effectively prevent dust from entering. Note that the porous film 36 of this embodiment can be suitably used in the twelfth embodiment.

[0210] The thirteenth embodiment may also suitably include other configurations similar to those that can be used in the other embodiments.Furthermore, the thirteenth embodiment may also be provided with a suitable combination of configurations that can be used in the other embodiments.

[0211] 14 Fourteenth Embodiment Figure 39 is a side view of an example of an electronic module according to a fourteenth embodiment. In the electronic module according to this embodiment, the hole 35 is provided so as to bend midway through the cover 14. Note that Figure 39 shows an example in which a porous film 36 formed of a porous structure is disposed at the outer end of the cavity 15 of the hole 35 formed by processing the cover 14. However, this embodiment may also be configured such that a porous structure is not disposed at the end of the hole. Also, while Figure 39 shows an example of an electronic module having a metal ball grid array (MBGA) configuration including metal balls 31-1, this embodiment may also be suitably applied to an electronic module having a ball grid array (BGA) configuration including solder bumps.

[0212] Figure 40 is an enlarged view of the area surrounded by a dotted line in Figure 39 (the area around hole 35). In this embodiment, the processing of lid body 14 to provide hole 35 can be performed, for example, as shown in Figure 40, from both the outlet side and the inlet side of hole 35 as viewed from the inside of the cavity of lid body 14, and the holes 35 can be formed by connecting them inside lid body 14. In this case, the connecting parts only need to be connected, and may be connected in a branched shape as shown in Figure 40.

[0213] In this case, the diameter of the outlet-side hole 35 (the hole passing toward the side of the lid 14 in FIG. 40 ) as viewed from inside the cavity does not have to be the same as the diameter of the inlet-side hole 35 (the hole passing up and down through the lid 14 in FIG. 40 ). For example, as shown in FIG. 40 , by making the diameter of the outlet-side hole 35 as viewed from inside the cavity smaller than the diameter of the inlet-side hole 35, it is possible to more effectively prevent water, dust, etc. from entering the cavity.

[0214] In addition, in the electronic module according to this embodiment shown in Figures 39 and 40, the hole 35 on the exit side as seen from inside the cavity is provided on the side of the lid body 14, but the exit of the hole 35 as seen from inside the cavity may be provided at any position on the lid body 14 depending on the purpose of the electronic module, etc.

[0215] As the porous film 36 used in the example of the electronic module of FIG. 39 or FIG. 40, a porous film that can be used in the twelfth or thirteenth embodiment can also be suitably used in this embodiment.

[0216] The thirteenth embodiment may also suitably include other configurations similar to those that can be used in the other embodiments.Furthermore, the thirteenth embodiment may also be provided with a suitable combination of configurations that can be used in the other embodiments.

[0217] <Method for manufacturing electronic module according to the present technology> Next, an example of a specific method for manufacturing an electronic module according to the present technology will be described with reference to the drawings. Note that the example of the manufacturing method shown below is an example of a method for manufacturing an electronic module according to the present technology, and the manufacturing method of an electronic module according to the present technology should not be interpreted as being limited to these details. Furthermore, although the drawings show the electronic module of the second embodiment as the electronic module to be manufactured, the electronic module to be manufactured is not limited to this.

[0218] 10A and 10B are conceptual diagrams illustrating a substrate fabrication process in a method for manufacturing an electronic module according to the present technology. 10A is a conceptual diagram illustrating the substrate 11 as viewed from the side, and 10B is a conceptual diagram illustrating the substrate 11 as viewed from above.

[0219] 10 shows an example in which the external power supply electrode 21 is wired to the substrate 11, but the present invention is not limited to this example. Suitable substrates for use as the substrate 11 include, for example, a printed circuit board such as FR4 (Flame Resistant 4) made of glass fiber reinforced epoxy resin, a ceramic substrate, and other known substrates. The method for manufacturing the substrate 11 is not particularly limited, and any known manufacturing method can be used.

[0220] Furthermore, depending on the specifications of the electronic module to be manufactured, necessary wiring, pads, etc. may be formed on the substrate 11. Fig. 10 shows an example in which an external power supply electrode 21 is formed. For these wiring and pads, any method, such as a known method for forming wiring, etc., may be suitably used.

[0221] 11A and 11B are conceptual diagrams of the frame manufacturing process, in which FIG. 11A is a diagram of the frame 13 as seen from the side, and FIG. 11B is a diagram of the frame 13 as seen from above.

[0222] In the example of the manufacturing method of the electronic module of the present technology shown here, the frame body 13 is formed separately from the substrate 11. Note that the outer edge portion of the frame body 13 shown in Fig. 11 is provided with a groove (electrode formation portion 28) for forming an electrode 19 at a location corresponding to the position of the external power supply electrode 21 of the substrate shown in Fig. 10. Note that the manufacturing method of the frame body 13 is not particularly limited, and any manufacturing method such as a known manufacturing method can be suitably used. The frame body 13 may be polished, parallelized, etc. as necessary.

[0223] 12A and 12B are conceptual diagrams illustrating a step of mounting an electronic device on a substrate in a manufacturing method of an electronic module according to the present technology, in which FIG. 12A is a conceptual diagram illustrating the substrate 11 as viewed from the side, and FIG. 12B is a conceptual diagram illustrating the substrate 11 as viewed from above.

[0224] In Fig. 12, an electronic device 12 is attached to the substrate 11 shown in Fig. 10. The electronic device 12 can be attached by any suitable attachment means such as an adhesive.

[0225] Although not shown in the figure, the electronic device 12 is electrically connected to internal electrodes or the like provided on the substrate 11 by any means. This connection can be made by any method, and suitable methods include, for example, wire bonding or flip-chip bonding using solder balls or metal balls.

[0226] 13 is an image diagram of a process of applying an adhesive 18-3 onto the substrate 11 to bond the substrate 11 to the frame 13 in the manufacturing method of the electronic module of the present technology. The adhesive 18-3 used is not particularly limited as long as it is an adhesive that can bond the substrate 11 to the frame 13. For example, if a conductive adhesive is used as the adhesive 18-3, even if the adhesive 18-3 overflows onto the electrode 19 portion on the substrate 11, the adhesive 18-3 is conductive, and therefore has little effect on the electrical characteristics of the circuit formed by the external power supply electrode 21 and the electrode 19. This is expected to make it easier to control the range in which the adhesive is applied in the manufacturing process of the electronic module 10 of the present technology.

[0227] 14 is a conceptual diagram of a process of mounting the frame 13 on the substrate 11 and temporarily curing the adhesive 18-3 in the manufacturing method of the electronic module of the present technology. In this process, adjustment may be made as necessary so that the surfaces of the substrate 11 and the frame 13 are substantially parallel to each other.

[0228] 15A and 15B are conceptual diagrams illustrating a process of forming an electrode 19 on an electrode forming portion 28 of a frame 13 disposed on an external power supply electrode 21 of a substrate 11 in a manufacturing method of an electronic module according to the present technology. 15A is a conceptual diagram illustrating the substrate 11 as viewed from the side, and 15B is a conceptual diagram illustrating the substrate 11 as viewed from above.

[0229] 15 , a conductive resin is supplied to the electrode formation portion 28 of the frame 13, which is disposed on the external power supply electrode 21 of the substrate 11, using any means such as a dispenser, and then cured to form the electrode 19. At this time, the grooves in the electrode formation portion 28 provided in the frame 13 are filled with the conductive resin, thereby increasing the contact area between the frame 13 and the electrode 19. This allows electricity to be effectively supplied from the electrode 19 to the frame 13, which is formed of a porous structure such as porous ceramic, and makes it possible to heat the frame in the manufactured electronic module. Furthermore, since a lid will be mounted in the next step, the conductive resin supplied in this step is preferably adjusted so that it does not overflow into the portion of the frame 13 that will be joined to the lid 14.

[0230] 16A and 16B are conceptual diagrams illustrating a process of mounting the lid 14 using adhesive 18-2 and performing main curing in the manufacturing method of the electronic module of the present technology. 16A is a conceptual diagram of the electronic module 10 viewed from the side, and 16B is a conceptual diagram of the electronic module 10 viewed from above.

[0231] In this step, the lid 14 (seal glass) which has been cut to a predetermined size is bonded to the frame 13 with the adhesive 18-2, and the adhesive is fully hardened to form the electronic module 10.

[0232] The curing method and timing of supplying the conductive resin that forms the electrode 19 are not limited to the above example, and any curing method and timing of supplying may be adopted. For example, after joining the lid 14 and the frame 13, the conductive resin may be supplied to the electrode forming portion 28 of the frame 13 using any means such as a dispenser, and then cured to form the electrode 19.

[0233] <First Variation of the Manufacturing Method of the Electronic Module of the Present Technology> Next, a specific example of a manufacturing method of an electronic module according to the present technology, which includes a sealing layer and has a configuration in which the sealing layer covers wires, will be described. Note that the example of the manufacturing method described below is one example of a manufacturing method of the electronic module, and the manufacturing method of the electronic module should not be interpreted as being limited to these details. Furthermore, although the drawings show the electronic module of the sixth embodiment as the electronic module to be manufactured, the electronic module to be manufactured is not limited to this.

[0234] 23 is an image diagram of a substrate preparation process in a manufacturing method of an electronic module according to a sixth embodiment of the present disclosure. Note that the substrate 11 shown in the example of FIG. 23 is a substrate in which electrical paths are pre-wired and which includes solder bumps 31, but is not limited to the substrate shown in this example.

[0235] 24 is an image diagram of a process for mounting the electronic device 12 on the substrate 11. The electronic device 12 is suitably joined to the substrate 11 by any suitable attachment means such as an adhesive.

[0236] 25 is an image diagram of the process of installing the wires 17. The electronic device 12 can be electrically connected to an external power supply electrode by the wires 17. In this process, a plurality of wires are installed in accordance with the number of terminals provided on the electronic device.

[0237] 26 is an image diagram of a process for covering light-receiving surface 12-1 of the electronic device and its vicinity by adhering release film 33. Then, as shown in FIG. 27, a mold 34 is used to inject resin for sealing layer 29, and sealing layer 29 is formed by molding. As a result, wire 17 is suitably covered with sealing layer 29.

[0238] After the sealing layer 29 is formed on the substrate 11, the release film 33 is peeled off from the electronic device 12, as shown in Fig. 28. After the release film 33 is peeled off, the light-receiving surface 12-1 of the electronic device may be cleaned.

[0239] 29, an adhesive layer 18-3 for bonding the sealing layer 29 to the frame body is provided by any means such as coating on the formed sealing layer 29 at a position where the frame body is to be installed. At this time, the adhesive layer 18-3 may be formed using an adhesive containing a substance capable of adsorbing moisture.

[0240] In addition, a process for bonding the frame to the lid is carried out in parallel with the processing of the substrate 11. In Fig. 30, an adhesive layer 18-2 for bonding the frame to the lid 14 is provided at the position where the frame is to be installed by any means such as coating. In this case, the adhesive layer 18-2 may also be formed using an adhesive containing a substance capable of adsorbing moisture.

[0241] 31 is an image diagram of a process for bonding a porous structure to a lid 14 to form a frame 13. When the porous structure forming the frame 13 shown in the example of FIG. 31 is made of a polyamide resin or a polyimide resin, for example, a monomer serving as a raw material for these resins is applied to the adhesive layer 18-2 provided on the lid 14 to a desired film thickness, and the raw material is polymerized to synthesize these resins. After this synthesis reaction, by adjusting the conditions for a heat-drying treatment (baking treatment) to remove unnecessary moisture, these resins are separated into layers, and the porous structure frame 13 is formed.

[0242] Fig. 32 is an image diagram of the process of mounting the lid and completing the electronic module. Specifically, the lid 14 shown in Fig. 31 is turned upside down, and the frame 13 joined to the lid 14 is joined to the adhesive layer 18-3 provided on the sealing layer 29 on the substrate shown in Fig. 29, thereby completing the electronic module 10.

[0243] <Variation 2 of the Manufacturing Method of the Electronic Module of the Present Technology> Next, a specific example of a manufacturing method of an electronic module having one or more holes with a diameter of 10 μm or less among the electronic modules according to the present technology will be described. Note that the example of the manufacturing method described below is one example of a manufacturing method of the electronic module, and the manufacturing method of the electronic module should not be interpreted as being limited to these details. Furthermore, the drawings show an electronic module of an eleventh embodiment in which a porous structure is disposed at an end of a hole formed by processing a transparent material that forms a lid body, on the inner side of the cavity, as the electronic module to be manufactured, but the electronic module to be manufactured is not limited to this.

[0244] Fig. 41 is a conceptual diagram of a step of mounting an electronic device 12 on a substrate 11 in a manufacturing method for an electronic module according to the eleventh embodiment of the present technology. As shown in Fig. 41 , the electronic device 12 is suitably bonded to the substrate 11 by any attachment means such as an adhesive 18.

[0245] 42 is a conceptual diagram of a step of installing wires 17 in a manufacturing method for an electronic module according to an eleventh embodiment of the present disclosure. The wires 17 used in this example of the manufacturing method may be wires that can be used in other examples of manufacturing methods, and can also be suitably used in this manufacturing method. The wires 17 allow the electronic device 12 to be electrically connected to an external power supply electrode. In this step, a plurality of wires are installed in accordance with the number of terminals provided on the electronic device.

[0246] Fig. 43 is an image diagram of a step of forming a frame body in a manufacturing method for an electronic module according to an eleventh embodiment of the present technology. Note that the manufacturing method shown in Fig. 43 uses a frame body formed of a porous structure as an example. Furthermore, the example shown in Fig. 43 uses a porous structure formed by hardening an applied porous material as the porous structure.

[0247] In Fig. 43, <43A> shows a porous material that will become a porous structure applied to the substrate 11 side, and <43B> shows a porous material that will become a porous structure applied to the lid 14 at a position corresponding to the porous structure provided on the substrate 11 side. As shown in <43B>, the porous material of the lid 14 is applied so as to cover the end of the hole 35 provided in the lid 14 that is on the inside of the cavity.

[0248] The holes 35 provided in the lid 14 shown in <43B> can be formed, for example, by irradiating the position of the lid 14 where the holes 35 are to be formed with a laser, modifying the material at that position, and then forming the holes by etching using hydrogen fluoride (HF) or the like. Note that, although the example of this manufacturing method shows a case where a plurality of holes 35 are provided, the present invention is not limited to this, and the number of holes provided can be changed as desired depending on the purpose of the electronic module.

[0249] Fig. 44 is an image diagram of a step of mounting a lid 14 on a substrate 11 in a manufacturing method for an electronic module according to an eleventh embodiment of the present technology. In the example shown in Fig. 44, the porous materials applied to the substrate 11 and the lid 14 are bonded together and hardened to form a frame made of a porous structure that supports the lid.

[0250] 45 is an image diagram of a step of forming a sealing layer 29 in a manufacturing method for an electronic module according to the eleventh embodiment of the present technology. As a result, the wires 17 are suitably covered with the sealing layer 29. Note that, as for the material constituting the sealing layer 29 used in this example of the manufacturing method, materials that can be used as materials constituting sealing layers in other examples of manufacturing methods can also be suitably used in this manufacturing method.

[0251] 46 is a conceptual diagram of a step of providing solder bumps 31 in a manufacturing method for an electronic module according to the eleventh embodiment of the present disclosure. As shown in Fig. 46 , the electronic module 10 is completed by providing the solder bumps 31 on the surface of the substrate 11 opposite to the surface on which the electronic device 12 is provided.

[0252] In this manufacturing method, the method for providing the solder bumps is not particularly limited, and any method can be used. Furthermore, the solder bumps used in this manufacturing method example can also be used in other manufacturing methods. Furthermore, although this manufacturing method shows an electronic module with solder bumps as an example of a ball grid array (BGA) configuration, this manufacturing method may also be applied to an electronic module with an MBGA configuration that uses metal balls instead of solder bumps.

[0253] <Variation 3 of the Manufacturing Method of the Electronic Module of the Present Technology> Next, a specific example of a manufacturing method of an electronic module according to the present technology, which has a metal ball grid array (MBGA) configuration with metal balls and one or more holes with a diameter of 10 μm or less, will be described. Note that the example of the manufacturing method described below is one example of a manufacturing method of the electronic module, and the manufacturing method of the electronic module is not to be interpreted as being limited to these contents. Furthermore, the drawings show an electronic module according to a thirteenth embodiment, which is configured such that a porous film formed of a porous structure is disposed at the outer end of a cavity of a hole formed by processing a lid body, but the electronic module to be manufactured is not limited to this.

[0254] Fig. 47 is an image diagram of a step of mounting an electronic device 12 on a substrate 11 in a manufacturing method for an electronic module according to a thirteenth embodiment of the present technology. As shown in Fig. 47, the electronic device 12 is suitably joined to the substrate 11 by any attachment means such as an adhesive 18. Note that the substrate 11 shown in the example of Fig. 47 is one in which electrical paths are pre-wired, but substrates that can be used in this manufacturing method are not limited to the substrate shown in this example.

[0255] 48 is an image diagram illustrating, in a manufacturing method for an electronic module according to the thirteenth embodiment of the present technology, a step of installing wires 17 and a step of covering light receiving surface 12-1 of the electronic device and its vicinity by attaching release film 33. Note that, as for release film 33 used in this example of the manufacturing method, a release film that can be used in other examples of manufacturing methods can also be suitably used in this manufacturing method.

[0256] The wires 17 used in this example of manufacturing method can be wires that can be used in other examples of manufacturing methods, and can also be used in this manufacturing method. The wires 17 allow the electronic device 12 to be electrically connected to an external power supply electrode. In this process, multiple wires are installed according to the number of terminals provided on the electronic device.

[0257] 49 , a resin for the sealing layer 29 is injected using a mold 34, and the sealing layer 29 is formed by molding. This allows the wires 17 to be suitably covered with the sealing layer 29. Note that the material for the sealing layer 29 and the mold 34 used in this example of the manufacturing method are the same as those that can be used as materials for the sealing layer in other manufacturing methods, and the same molds that can be used can also be suitably used in this manufacturing method.

[0258] After the sealing layer 29 is formed on the substrate 11, the release film 33 is peeled off from the electronic device 12, as shown in Fig. 50. After the release film 33 is peeled off, the light-receiving surface 12-1 of the electronic device may be cleaned.

[0259] Next, FIG. 51 is an image diagram of a process of processing the substrate and the lid body in order to mount the lid body 14 on the substrate 11 in the manufacturing method of the electronic module according to the thirteenth embodiment of the present technology.

[0260] 51, <51A> shows an adhesive 18-4 applied to the substrate 11 side for bonding the lid body, and <51B> shows an adhesive 18-4 similarly applied to the lid body 14 at a position corresponding to the adhesive 18-4 applied to the substrate 11 side. Furthermore, as shown in <51B>, a porous material is applied to the lid body 14 so as to cover the end of the hole 35 formed in the lid body 14 that faces the outside of the cavity, and the porous material is cured to form a porous film 36. The hole 35 formed in the lid body 14 can also be suitably formed in this manufacturing method by the method described in Variation 2 of the manufacturing method for an electronic module of the present technology, for example.

[0261] Fig. 52 is a conceptual diagram of a step of mounting a lid body 14 on a substrate 11 in a manufacturing method of an electronic module according to the thirteenth embodiment of the present technology. Fig. 53 is a conceptual diagram of a step of providing metal balls 31-1 in a manufacturing method of an electronic module according to the thirteenth embodiment of the present technology. As shown in Fig. 53, the electronic module 10 is completed by providing the metal balls 31-1 on the surface of the substrate 11 opposite to the side on which the electronic device 12 is provided.

[0262] In this manufacturing method, the method for providing the metal balls is not particularly limited, and any method can be used. Furthermore, the metal balls used in this manufacturing method example can be metal balls that can be used in other manufacturing methods. Furthermore, although this manufacturing method shows an electronic module with metal balls as an example of a metal ball grid array (MBGA) configuration, this manufacturing method may also be applied to an electronic module with a BGA configuration that includes solder bumps instead of metal balls.

[0263] As mentioned above, the manufacturing method of the electronic module of the present technology shown in this specification is only one example, and the processes described in the manufacturing method shown here may be combined, or any steps known as a manufacturing method of an electronic module may be combined.

[0264] The present technology can have the following configurations. [1] An electronic module comprising: a substrate having a first main surface and a second main surface; an electronic device attached to the first main surface; a frame disposed so as to surround the electronic device; and a lid attached to the frame so as to face the electronic device, wherein one or more holes having a diameter of 10 μm or less are provided in any of the substrate, the frame, or the lid. [2] The electronic module according to [1], wherein the diameter of the holes is 5 μm or less. [3] The electronic module according to [1] or [2], wherein the holes are not blocked. [4] The electronic module according to any of [1] to [3], wherein the holes are provided in the lid. [5] The electronic module according to [4], wherein at least some of the holes are formed by holes in a porous structure. [6] The electronic module according to any of [1] to [5], wherein the holes are provided in the frame. [7] The electronic module according to [6], wherein at least some of the holes are formed by holes in a porous structure. [8] The electronic module according to [7], wherein the frame is formed of the porous structure. [9] The electronic module according to any one of [1] to [8], wherein the lid is supported by the frame from a surface facing the electronic device.

[10] The electronic module according to any one of [1] to [9], wherein the first main surface includes a sealing layer provided so as to surround the electronic device, and the frame is attached to the sealing layer.

[11] The electronic module according to

[10] , wherein the first main surface includes a wire electrically connecting the electronic device to an external power supply electrode, and the sealing layer covers the wire.

[12] The electronic module according to any one of [1] to

[11] , wherein at least a portion of an adhesive layer fixing the frame has moisture adsorption ability.

[13] The electronic module according to any one of [1] to

[12] , wherein the frame is attached to the first main surface so as to surround the electronic device.

[14] The electronic module according to any one of [1] to

[13] , wherein the porous structure is a porous ceramic.

[15] The electronic module according to

[14] , wherein the linear expansion coefficient of the porous ceramic is smaller than the linear expansion coefficient of the substrate.

[16] The electronic module according to

[14] or

[15] , wherein the linear expansion coefficient of the porous ceramic is 0.5 to 15 ppm / °C.

[17] The electronic module according to any one of [1] to

[16] , wherein the electronic device is an image sensor.

[18] The electronic module according to any one of

[14] to

[17] , wherein the porous ceramic is a black porous ceramic.

[19] The electronic module according to any one of [1] to

[18] , wherein the frame is formed of a single porous structure.

[20] The electronic module according to any one of [1] to

[19] , wherein the porous structure is a conductive porous structure.

[21] The electronic module according to any one of [1] to

[20] , further comprising one or more sets of external power supply electrodes and electrodes connected to the respective external power supply electrodes, wherein the electrodes supply electricity to the porous structure.

[22] The electronic module according to

[21] , wherein the electrodes are bonded to the substrate and the lid.

[23] The electronic module according to

[21] or

[22] , wherein the number of external power supply electrodes is two or more.

[24] The electronic module according to any one of

[14] to

[23] , wherein the porous ceramic is SiC.

[25] The electronic module according to any one of

[21] to

[24] , wherein the frame and the substrate are bonded with a conductive adhesive.

[26] The electronic module according to any one of [1] to

[25] , wherein an internal thermoelectric conversion element is provided inside the electronic module.

[27] The electronic module according to any one of [1] to

[26] , wherein an external thermoelectric conversion element is further provided outside the electronic module.

[28] The electronic module according to any one of [1] to

[27] , wherein a humidity sensor is provided inside or outside the electronic module.

[29] The electronic module according to any one of [1] to

[28] , wherein at least a portion of the surface of the porous structure is treated to be water-repellent.

[30] The electronic module according to any one of [1] to

[29] , wherein the porous structure is in contact with or bonded to a heat dissipating or absorbing member.

[31] A control system for an electronic module according to any one of

[26] to

[30] , comprising: comparing a temperature measured by the internal thermoelectric conversion element with a preset temperature; and supplying electricity from the electrode to the porous structure when the measured temperature is equal to or lower than the preset temperature.

[32] A control system for an electronic module according to

[31] , wherein the comparison is performed at predetermined time intervals.

[33] A control system for an electronic module according to any one of

[28] to

[30] , determining a dew-point temperature from the external measured temperature measured by the external thermoelectric conversion element and the humidity measured by the humidity sensor, comparing the dew-point temperature with the internal measured temperature measured by the internal thermoelectric conversion element, and supplying electricity from the electrode to the porous structure when the internal measured temperature is equal to or lower than the dew-point temperature.

[34] A control system for an electronic module according to

[33] , wherein the comparison is performed at predetermined time intervals.

[35] An imaging device comprising the electronic module according to any one of [1] to

[30] .

[0265] 10 Electronic module 11 Substrate 12 Electronic device (image sensor) 12-1 Light receiving surface of electronic device 13 Frame 14 Lid 14-1 Light-shielding film 15 Cavity 16 Internal electrode 17 Connecting line (wire) 18, 18-2, 18-3, 18-4 Adhesive (adhesive layer) 19 Electrode 21 External power supply electrode 22 Electrical path 23 Internal thermoelectric conversion element (internal temperature sensor) 24 External thermoelectric conversion element (external temperature sensor) 25 Humidity sensor 26 High-temperature region of electronic device (logic section) 27 Heat dissipation or heat absorption member 28 Electrode formation section 29 Sealing layer 31 Solder bump 31-1 Metal ball 32 Rib 33 Release film 34 Mold 35 Hole 36 Porous film X Cut surface

Claims

1. An electronic module comprising: a substrate having a first main surface and a second main surface; an electronic device attached to the first main surface; a frame body arranged to surround the electronic device; and a lid body attached to the frame body so as to face the electronic device, wherein one or more holes having a diameter of 10 μm or less are provided in either the substrate, the frame body or the lid body.

2. The electronic module according to claim 1, wherein the diameter of said holes is 5 μm or less.

3. The electronic module of claim 1, wherein said holes are unblocked.

4. The electronic module according to claim 1, wherein the hole is provided in the lid.

5. The electronic module according to claim 4, wherein at least some of the pores are formed by pores in a porous structure.

6. The electronic module according to claim 1, wherein the hole is provided in the frame.

7. The electronic module according to claim 6, wherein at least some of the pores are formed by pores in a porous structure.

8. The electronic module according to claim 7, wherein said frame is formed from said porous structure.

9. The electronic module according to claim 1, wherein the cover is supported by the frame from a surface facing the electronic device.

10. The electronic module according to claim 1, further comprising a sealing layer provided on the first main surface so as to surround the electronic device, and the frame body is attached to the sealing layer.

11. The electronic module according to claim 10, further comprising a wire electrically connecting the electronic device to an external power supply electrode, the sealing layer covering the wire.

12. The electronic module according to claim 1, wherein at least a portion of the adhesive layer that fixes the frame has a moisture adsorption ability.

13. The electronic module according to claim 1, wherein the frame is attached to the first main surface so as to surround the electronic device.

14. The electronic module of claim 8, wherein the porous structure is a porous ceramic.

15. The electronic module according to claim 14, wherein the linear expansion coefficient of the porous ceramic is smaller than the expansion coefficient of the substrate.

16. The electronic module according to claim 14, wherein the linear expansion coefficient of the porous ceramic is 0.5 to 15 ppm / °C.

17. The electronic module of claim 1, wherein the electronic device is an image sensor.

18. The electronic module of claim 14, wherein the porous ceramic is a black porous ceramic.

19. The electronic module of claim 8, wherein the frame is formed from a single porous structure.

20. The electronic module of claim 8, wherein the porous structure is an electrically conductive porous structure.

21. The electronic module according to claim 20, further comprising: one or more sets of external power supply electrodes; and electrodes connected to each of the external power supply electrodes, for supplying electricity from the electrodes to the porous structure.

22. The electronic module of claim 21, wherein the electrodes are bonded to the substrate and the lid.

23. The electronic module according to claim 21, wherein the external power supply electrodes are two or more sets.

24. The electronic module of claim 14, wherein the porous ceramic is SiC.

25. The electronic module according to claim 21, wherein the frame and the substrate are bonded together with a conductive adhesive.

26. The electronic module of claim 21, further comprising an internal thermoelectric conversion element within the electronic module.

27. The electronic module of claim 26, further comprising an external thermoelectric conversion element external to the electronic module.

28. An electronic module according to claim 27, comprising a humidity sensor inside or outside the electronic module.

29. The electronic module according to claim 8, wherein at least a portion of the surface of the porous structure is treated to be water-repellent.

30. The electronic module of claim 8, wherein the porous structure is in contact with or bonded to a heat dissipating or absorbing member.

31. A control system for an electronic module according to claim 26, which compares a preset temperature with a measured temperature measured by the internal thermoelectric conversion element, and supplies electricity from the electrodes to the porous structure when the measured temperature is equal to or lower than the preset temperature.

32. The control system for an electronic module according to claim 31, wherein the comparison is performed at predetermined time intervals.

33. A control system for an electronic module according to claim 28, which determines a dew point temperature from the external measured temperature measured by the external thermoelectric conversion element and the humidity measured by the humidity sensor, compares the dew point temperature with the internal measured temperature measured by the internal thermoelectric conversion element, and supplies electricity from the electrodes to the porous structure when the internal measured temperature is equal to or lower than the dew point temperature.

34. The control system for an electronic module according to claim 33, wherein the comparison is performed at predetermined time intervals.

35. An imaging device comprising an electronic module according to claim 1.

Images