Light-emitting module and heater block comprising same

Abstract

The present invention relates to a light-emitting module applied to a heater block, and the heater block comprising same, and to a light-emitting module and a heater block comprising same, the light-emitting module comprising: a heat radiation unit (110) including an upper surface (110a), a lower surface (110b) and a side surface (110c), and having a first cooling flow path (111) therein; a substrate (120) which is disposed on the upper surface of the heat radiation unit (110) and which has at least a portion of a semiconductor light-emitting device (121) and of an upper electrode (122) thereon; a power distribution unit (130) disposed on the lower surface of the heat radiation unit (110); and a connection electrode (140) electrically connecting the upper electrode (122) to the power distribution unit (130) while enabling the substrate (120) and the power distribution unit (130) to be detachably fixed to the upper surface and the lower surface of the heat radiation unit (110), respectively, wherein the connection electrode (140) electrically connects the upper electrode (122) to the power distribution unit (130) by passing through the power distribution unit (130) and the lower surface (110b) of the heat dissipation unit (110), thereby improving heat dissipation characteristics and maintenance efficiency and simplifying an electrode connection structure.

Description

Light-emitting module and heater block including same

[0001] The present invention relates to a light-emitting module applied to a heater block and a heater block including the same, and more specifically, to a light-emitting module having improved heat dissipation characteristics and maintenance efficiency and a simplified electrode connection structure and a heater block including the same.

[0002] Flat substrates such as semiconductor wafers or glass substrates can undergo heat treatment processes such as silicon thin film crystallization processes, ion implantation processes, and activation processes.

[0003] Recently, a flat substrate heating device using a VCSEL (Vertical Cavity Surface Emitting Laser) has been developed. A flat substrate heating device using a VCSEL is formed by arranging a VCSEL module containing multiple VCSELs in a flat shape to irradiate a laser beam over a large area.

[0004] A flat substrate heating device using VCSELs has the problem that the number of power lines increases and the wiring becomes complicated because power must be supplied independently to each VCSEL module. In addition, if one VCSEL breaks down, it is difficult to separate the VCSEL module and the power line. In addition, cooling water must be supplied to each VCSEL module, but the power lines create a complex structure.

[0005] [Prior Art Literature]

[0006] (Patent Document 1) Republic of Korea Patent No. 10-2147379 (August 18, 2020)

[0007] The purpose of the present invention is to provide a light-emitting module having improved heat dissipation characteristics and maintenance efficiency and a simplified electrode connection structure, and a heater block including the same.

[0008] The present invention is a light emitting module (100) applied to a heater block in one aspect, comprising: a heat dissipation part (110) having an upper surface (110a), a lower surface (110b), and a side surface (110c) and having a first cooling path (111) provided therein; a substrate (120) disposed on an upper surface of the heat dissipation part (110) and having a semiconductor light emitting element (121) and at least a part of an upper electrode (122) provided thereon; a power distribution part (130) disposed on a lower surface of the heat dissipation part (110); And a connecting electrode (140) that electrically connects the upper electrode (122) and the power distribution unit (130) while detachably fixing the substrate (120) and the power distribution unit (130) to the upper and lower surfaces of the heat dissipation unit (110), respectively; and the connecting electrode (140) provides a light emitting module that electrically connects the upper electrode (122) and the power distribution unit (130) by penetrating the lower surface (110b) of the power distribution unit (130) and the heat dissipation unit (110).

[0009] In another aspect, the present invention provides a heater block comprising a cooling plate (210) including an upper surface, a lower surface, and a side surface and having a second cooling channel (220) provided therein; and a light emitting module (100) having at least a portion disposed on an upper surface of the cooling plate (210) and having a first cooling channel (111) provided therein; wherein the second cooling channel (220) and the first cooling channel (111) are fluidly connected to each other.

[0010] The light-emitting module according to the present invention has a cooling path provided in the light-emitting module itself, so that heat dissipation characteristics can be improved and the structure can be simplified.

[0011] The light-emitting module according to the present invention can also be easily maintained as an independent modular type having a power expansion connector that is individually connected to an external power source.

[0012] FIG. 1 is a schematic diagram showing a perspective view of a light-emitting module according to an embodiment of the present invention.

[0013] FIG. 2 is a drawing schematically showing a cross-sectional view of a light-emitting module according to an embodiment of the present invention.

[0014] FIG. 3 is a drawing schematically showing a cross-sectional view of a portion of a light-emitting module according to an embodiment of the present invention.

[0015] FIG. 4 is a schematic drawing of a portion of a heater block according to an embodiment of the present invention.

[0016] FIG. 5 is a schematic cross-sectional view of a portion of a heater block according to an embodiment of the present invention.

[0017] The present invention will be described in detail with reference to the attached drawings below.

[0018] The attached drawings are intended to illustrate embodiments of the present invention, and the sizes of each component may be under- or over-represented.

[0019] The present invention provides a light emitting module applied to a heater block in one aspect.

[0020] Fig. 1 is a schematic perspective view of a light-emitting module according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of a light-emitting module according to an embodiment of the present invention. Specifically, Fig. 2 is a schematic cross-sectional view taken along line A of Fig. 1. Fig. 3 is a schematic cross-sectional view of a portion of a light-emitting module according to an embodiment of the present invention. Specifically, Fig. 3 is a schematic cross-sectional view taken along line B of Fig. 1.

[0021] Referring to FIGS. 1 to 3, a light-emitting module (100) according to one embodiment of the present invention is a light-emitting module applied to a heater block (200) described in detail below. The light-emitting module (100) can function as a light source or heat source that irradiates light toward a heated object to heat the heated object for heat treatment. The light-emitting module (100) can be a VCSEL module.

[0022] A light emitting module (100) according to one embodiment of the present invention includes a heat dissipation unit (110), a substrate (120), a power distribution unit (130), and a connection electrode (140).

[0023] The heat dissipation unit (110) includes an upper surface (110a), a lower surface (110b), and a side surface (110c), and a first cooling passage (111) is provided therein. That is, the first cooling passage (111) is surrounded by the upper surface (110a), the lower surface (110b), and the side surface (110c) of the heat dissipation unit (110).

[0024] In one embodiment, the heat sink (110) includes a first coolant inlet (112a) and a first coolant outlet (112b) provided on the lower surface (110b) or the side surface (110c). Accordingly, as illustrated in FIG. 2, coolant flows into the first coolant passage (111) through the first coolant inlet (112a) and the first coolant outlet (112b). Specifically, the coolant flows into the first coolant passage (111) through the first coolant inlet (112a) and flows out from the first coolant passage (111) through the first coolant outlet (112b).

[0025] The heat dissipation unit (110) may be formed of a thermally conductive ceramic material or metal material. This configuration can improve the heat dissipation characteristics of the light-emitting module.

[0026] In one embodiment, the heat dissipation member (110) further includes a cooling protrusion (113) protruding from the inside toward the first cooling passage (111). In FIG. 2, for example, a cooling protrusion (113) protruding from the inside of the upper surface (110a) of the heat dissipation member (110) toward the first cooling passage (111) is presented. The cooling protrusion (113) may protrude from the inside of the lower surface (110b) and / or the side surface (110c) toward the first cooling passage (111) as well as the upper surface (110a). The formation of the cooling protrusion (113) increases the surface area of ​​the heat dissipation member (110) that can come into contact with the cooling water, thereby improving the heat dissipation characteristics of the light emitting module.

[0027] The substrate (120) is placed on the upper surface (110a) of the heat dissipation unit (110). At least a portion of the semiconductor light-emitting element (121) and the upper electrode (122) are provided on the upper portion of the substrate (120).

[0028] The substrate (120) may be formed as a general substrate used for mounting electronic components. The substrate (120) may be, for example, a PCB substrate, a ceramic substrate, etc. The substrate (120) may be divided into a region where a semiconductor light-emitting component (121) is mounted and a region where an upper electrode (122) is mounted.

[0029] In one embodiment, the substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b) arranged adjacently in a predetermined direction. FIG. 1 exemplarily shows a state in which the first unit substrate (120a) and the second unit substrate (120b) are arranged in a hexagonal shape.

[0030] Specifically, FIG. 1 presents a substrate (120) composed of four unit substrates, 1st to 4th unit substrates (120a to 120d). Here, the heat dissipation unit (110) may be configured as an integral body to support a plurality of unit substrates (120a to 120d). As illustrated in FIG. 1, a plurality of unit substrates (120a to 120d) are arranged on top of a heat dissipation unit (110) formed as an integral body.

[0031] Conventionally, a light-emitting module comprising only one unit substrate (120a) of the present invention has been used, resulting in a complex wiring structure for power supply and a structure for fastening to a heat dissipation plate, as described below. The present invention simplifies the wiring structure and fastening structure by proposing a single light-emitting module comprising multiple unit substrates.

[0032] The semiconductor light emitting element (121) and the upper electrode (122) can be electrically connected by a plurality of conductive patterns provided on the substrate (120).

[0033] The semiconductor light-emitting element (121) is a semiconductor element that emits light when electrons provided through an n-type semiconductor layer and holes provided through a p-type semiconductor layer combine in an active layer, and may include a light-emitting diode (LED) or a laser diode (LD). The semiconductor light-emitting element (121) may be, for example, a general VCSEL element that irradiates a laser beam. A plurality of semiconductor light-emitting elements (121) may be arranged in a grid shape in a predetermined direction on the upper surface of the substrate (120).

[0034] The upper electrode (122), in one embodiment, includes an upper electrode head (123) exposed on the upper surface of the substrate (120), as shown in FIG. 3, and an electrode extension (124) extending from the upper electrode head (123) and protruding downward through the upper surface (110a) of the substrate (120) and the heat dissipation portion (110).

[0035] The electrode extension (124) may have a screw thread at the end.

[0036] The electrode extension (124) may also be at least partially surrounded by an insulator. By being surrounded by an insulator, the electrode extension (124) may be electrically insulated from the heat dissipation portion (110).

[0037] In one embodiment, the upper electrode (122) includes a first upper electrode (122a) at least partially provided on a first substrate (120a) and a second upper electrode (122b) at least partially provided on a second substrate (120b).

[0038] The power distribution unit (130) is placed on the lower surface of the heat dissipation unit (110). The power distribution unit (130) distributes external power to the connection electrode (140) and supplies it to the semiconductor light-emitting element (121). The power distribution unit (130) may be made of a material with excellent electrical conductivity, for example, a metal material.

[0039] In one embodiment, when the substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b), as described above, the heat dissipation unit (110) may be configured as an integral part to support the first unit substrate (120a) and the second unit substrate (120b). Here, the power distribution unit (130) may also be configured as an integral part to be disposed on the lower surface of the heat dissipation unit (110) that supports the first unit substrate (120a) and the second unit substrate (120b).

[0040] Referring to FIG. 3, the connecting electrode (140) is configured to electrically connect the upper electrode (122) and the power distribution unit (130) while removably fixing the substrate (120) and the power distribution unit (130) to the upper and lower surfaces of the heat dissipation unit (110), respectively. The connecting electrode (140) may be formed of a material with excellent electrical conductivity, for example, a metal material.

[0041] Referring to FIG. 3, the connecting electrode (140) is configured to electrically connect the upper electrode (122) and the power distribution unit (130) by penetrating the power distribution unit (130) and the lower surface (110b) of the heat dissipation unit (110), and optionally the side surface (110c) of the heat dissipation unit (110). FIG. 3 schematically presents a state in which the connecting electrode (140) sequentially penetrates the power distribution unit (130), the lower surface (110b) of the heat dissipation unit (110), and the side surface (110c) of the heat dissipation unit (110). Meanwhile, the connecting electrode (140) may be arranged so as to be exposed to the first cooling channel (111) without penetrating the side surface (110c) of the heat dissipation unit (110).

[0042] Meanwhile, the connecting electrode (140) may be at least partially surrounded by an insulator. When the connecting electrode (140) penetrates the heat dissipation portion (100), the connecting electrode (140) and the heat dissipation portion (100) may be electrically insulated by the insulator surrounding the connecting electrode (140).

[0043] In one embodiment, the connecting electrode (140) includes a connecting electrode load portion (141) and a connecting electrode end portion (142). Here, the upper end of the connecting electrode load portion (141) is configured to be connected to the electrode extension portion (124) of the upper electrode (122), and the lower end of the connecting electrode load portion (141) is configured to be connected to the connecting electrode end portion (142).

[0044] Meanwhile, the connecting electrode end portion (142) is configured to penetrate the power distribution portion (130) and support the power distribution portion (130). Specifically, the lower end of the connecting electrode load portion (141) and the connecting electrode end portion (142) are connected, so that the power distribution portion (130) is detachably fixed to the lower surface of the heat dissipation portion (110).

[0045] In one embodiment, the upper end of the connecting electrode load portion (141) is screw-connected with an electrode extension portion (124) having a thread at one end, and the lower end of the connecting electrode load portion (141) is screw-connected with a connecting electrode end portion (142) having a thread at one end. This configuration simplifies the coupling structure for detachably fixing the substrate (120) and the power distribution portion (130) to the upper and lower surfaces of the heat dissipation portion (110), respectively.

[0046] In one embodiment, as described above, when the substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b), the upper electrode (122) includes a first upper electrode (122a) and a second upper electrode (122b). In this case, the connection electrode (140) includes a first connection electrode electrically connecting the first upper electrode (122a) and the power distribution unit (130) and a second connection electrode electrically connecting the second upper electrode (122b) and the power distribution unit (130).

[0047] In another embodiment, the light emitting module according to the present invention further includes a power expansion connector (150). The power expansion connector (150) is connected to the power distribution unit (130) and is configured to supply external power to the power distribution unit (130).

[0048] In one embodiment, as described above, when the substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b), the upper electrode (122) includes a first upper electrode (122a) and a second upper electrode (122b). Here, the connection electrode (140) includes a first connection electrode electrically connecting the first upper electrode (122a) and the power distribution unit (130) and a second connection electrode electrically connecting the second upper electrode (122b) and the power distribution unit (130). Here, the power distribution unit (130) is configured to distribute external power supplied through the power expansion connector (150) to the first connection electrode and the second connection electrode, and then supply the power to the first upper electrode (122a) and the second upper electrode (122b), respectively.

[0049] Meanwhile, the light emitting module (100) of the present invention may further include a first insulating layer (161) disposed between the heat dissipation unit (110) and the power distribution unit (130), and a second insulating layer (162) disposed below the power distribution unit (130).

[0050] Additionally, the light emitting module (100) may further include a light emitting module cover (163) that is arranged at the lower end of the light emitting module (100) and surrounds the power distribution unit (130), the first insulating layer (161), and the second insulating layer (162).

[0051] The first insulating layer (161) can serve to electrically insulate the heat dissipation unit (110) and the power distribution unit (130).

[0052] The second insulating layer (162) can protect the lower surface of the power distribution unit (130) and serve to insulate it from other components.

[0053] In another aspect, the present invention provides a heater block.

[0054] Fig. 4 is a schematic drawing of a portion of a heater block according to an embodiment of the present invention. Specifically, Fig. 4 schematically illustrates a state in which a light-emitting module (100) is separated from a cooling plate (210). Fig. 5 is a schematic drawing of a cross-sectional view of a portion of a heater block according to an embodiment of the present invention.

[0055] Referring to FIGS. 4 and 5, a heater block (200) according to the present invention includes a light emitting module (100) and a cooling plate (210).

[0056] The light emitting module (100) is a light emitting module (100) according to the present invention described above.

[0057] The cooling plate (210) includes an upper surface, a lower surface, and a side surface, and includes a second cooling passage (220) therein. Here, at least a portion of the light emitting module (100) is disposed on the upper surface of the cooling plate (210).

[0058] As illustrated in Fig. 5, the light emitting module (100) may have a first cooling channel (111) therein as described above. At this time, the second cooling channel (220) and the first cooling channel (111) are connected to each other in a fluid communication manner.

[0059] In one embodiment, the light emitting module (100) includes a power expansion connector (150) that receives external power as described above. Meanwhile, the cooling plate (210) has a through hole (213) into which the power expansion connector (150) is inserted.

[0060] Referring to FIG. 4 for more detailed explanation, the power expansion connector (150) of the light emitting module (100) is inserted into a through hole (213) provided in the cooling plate (210). The power expansion connector (150) is inserted into the through hole (213) and extends to the lower portion of the cooling plate (210). The power expansion connector (150) inserted into the through hole (213) of the cooling plate (210) and extending to the lower portion of the cooling plate (210) can be electrically connected to a power supply unit (not shown).

[0061] This configuration can simplify the structure in which the light-emitting module (100) is fastened to the cooling plate (210). In addition, the power supply structure for supplying external power to the light-emitting module (100) can be simplified.

[0062] In one embodiment, the cooling plate (210) includes a second cooling water inlet (231) and a second cooling water outlet (232) provided on the lower surface or the side surface. With this configuration, the cooling water, as illustrated in FIG. 5, flows into the second cooling water inlet (231), passes through the second cooling channel (220), flows into the first cooling channel (111), and then flows out of the cooling plate (210) through the second cooling channel (220) and the second cooling water outlet (232).

[0063] In one embodiment, the second cooling channel (220) includes a seconda cooling channel (220a) through which cooling water introduced from the second cooling water inlet (231) flows, and a secondb cooling channel (220b) through which cooling water discharged from the second cooling water outlet (232) flows. With this configuration, the cooling water sequentially flows through the second cooling water inlet (231), the seconda cooling channel (220a), the first cooling channel (111), the secondb cooling channel (220b), and the second cooling water outlet (232) and flows out of the cooling plate (210).

[0064] Specifically, the cooling plate (210) may include a first cooling water flow unit (211) and a second cooling water flow unit (212) that are connected to the first cooling water inlet (112a) and the first cooling water outlet (112b) of the heat dissipation unit (110) so as to be in fluid communication with each other, respectively. Here, the first cooling water inlet (112a) and the first cooling water flow unit (211) are connected so that cooling water flows from the seconda cooling channel (220a) into the first cooling channel (111) without leakage. Similarly, the first cooling water outlet (112b) and the second cooling water flow unit (212) are connected so that cooling water flows from the first cooling channel (111) into the secondb cooling channel (220b) without leakage.

[0065] Hereinafter, various embodiments of the present invention will be described.

[0066] Specific example 1. A light-emitting module (100) applied to a heater block, comprising: a heat dissipation unit (110) including an upper surface (110a), a lower surface (110b), and a side surface (110c) and having a first cooling path (111) provided therein; a substrate (120) disposed on an upper surface of the heat dissipation unit (110) and having a semiconductor light-emitting element (121) and at least a portion of an upper electrode (122) provided thereon; a power distribution unit (130) disposed on a lower surface of the heat dissipation unit (110); A light emitting module comprising a connecting electrode (140) that electrically connects the upper electrode (122) and the power distribution unit (130) while detachably fixing the substrate (120) and the power distribution unit (130) to the upper and lower surfaces of the heat dissipation unit (110), respectively, and the connecting electrode (140) electrically connects the upper electrode (122) and the power distribution unit (130) by penetrating the lower surface (110b) of the power distribution unit (130) and the heat dissipation unit (110).

[0067] Specific example 2. In specific example 1, the upper electrode (122) includes an upper electrode head portion (123) exposed on the upper portion of the substrate (120) and an electrode extension portion (124) extending from the upper electrode head portion (123) and protruding downward through the upper surface (110a) of the substrate (120) and the heat dissipation portion (110), and the connecting electrode (140) includes a connecting electrode load portion (141) and a connecting electrode end portion (142), and the upper end of the connecting electrode load portion (141) is connected to the electrode extension portion (124), the lower end of the connecting electrode load portion (141) is connected to the connecting electrode end portion (142), and the connecting electrode end portion (142) is configured to penetrate the power distribution portion (130) and support the power distribution portion (130).

[0068] Specific example 3. A light emitting module according to Specific example 1, further comprising a power expansion connector (150) configured to be connected to a power distribution unit (130) and to supply external power to the power distribution unit (130).

[0069] Specific example 4. In specific example 1, the heat dissipation unit (110) includes a first cooling water inlet (112a) and a first cooling water outlet (112b) provided on the lower surface or the side surface, and the cooling water flows into the first cooling path (111) through the first cooling water inlet (112a) and the first cooling water outlet (112b), a light emitting module.

[0070] Specific example 5. A light emitting module according to Specific example 1, wherein the heat dissipation portion (110) further includes a cooling protrusion (113) protruding from the inside toward the first cooling path (111).

[0071] Specific example 6. In Specific example 2, the upper end of the connecting electrode rod portion (141) is screw-connected with an electrode extension portion (124) having a thread at one end, and the lower end of the connecting electrode rod portion (141) is screw-connected with a connecting electrode finishing portion (142) having a thread at one end, a light-emitting module.

[0072] Concrete example 7. In concrete example 3, the substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b) arranged adjacently in a predetermined direction, the upper electrode (122) includes a first upper electrode (122a) at least partly provided on the first unit substrate (120a) and a second upper electrode (122b) at least partly provided on the second unit substrate (120b), the connection electrode (140) includes a first connection electrode electrically connecting the first upper electrode (122a) and the power distribution unit (130) and a second connection electrode electrically connecting the second upper electrode (122b) and the power distribution unit (130), and the power distribution unit (130) supplies external power supplied through the power expansion connector (150) to the first upper electrode (122a) and the second upper electrode (122b), respectively, through the first connection electrode and the second connection electrode. A light emitting module configured to supply light to an electrode (122b).

[0073] Specific example 8. A heater block comprising a cooling plate (210) including an upper surface, a lower surface, and a side surface and having a second cooling channel (220) provided therein; and a light emitting module (100) having at least a portion disposed on the upper surface of the cooling plate (210) and having a first cooling channel (111) provided therein; wherein the second cooling channel (220) and the first cooling channel (111) are fluidly connected to each other.

[0074] Specific example 9. In specific example 8, the light emitting module (100) includes a power expansion connector (150) that receives external power, and the cooling plate (210) has a through hole (212) into which the power expansion connector (150) is inserted, a heater block.

[0075] Concrete example 10. In concrete example 8, the cooling plate (210) includes a second cooling water inlet (231) and a second cooling water outlet (232) provided on the lower surface or the side surface, and the heater block is configured such that the cooling water flows into the second cooling water inlet (231), passes through the second cooling channel (220), flows to the first cooling channel (111), and then flows again through the second cooling channel (220) and the second cooling water outlet (232) to the outside of the cooling plate (210).

[0076] Concrete example 11. In concrete example 10, the second cooling channel (220) includes a seconda cooling channel (220a) through which cooling water flowing from a second cooling water inlet (231) flows, and a secondb cooling channel (220b) through which cooling water flowing out of a second cooling water outlet (232) flows, and the cooling water is configured to sequentially flow through the second cooling water inlet (231), the seconda cooling channel (220a), the first cooling channel (111), the secondb cooling channel (220b), and the second cooling water outlet (232) and flow out of the cooling plate (210), a heater block.

[0077] Specific example 12. In specific example 8, the light-emitting module (100) is a heater block according to any one of specific examples 1 to 7.

[0078] Description of the symbol

[0079] 100: light emitting module, 110: heat dissipation unit, 120: substrate, 130: power distribution unit, 140: connecting electrode, 150: power expansion connector, 200: heater block, 210: cooling plate, 220: second cooling path

Claims

1. As a light emitting module (100) applied to a heater block, A heat dissipation unit (110) including an upper surface (110a), a lower surface (110b), and a side surface (110c) and having a first cooling passage (111) provided therein; A substrate (120) disposed on the upper surface of a heat dissipation portion (110) and having at least a portion of a semiconductor light-emitting element (121) and an upper electrode (122) provided thereon; A power distribution unit (130) arranged on the lower surface of the heat dissipation unit (110); and A connecting electrode (140) that electrically connects the upper electrode (122) and the power distribution unit (130) while detachably fixing the substrate (120) and the power distribution unit (130) to the upper and lower surfaces of the heat dissipation unit (110), respectively; Includes, A light emitting module in which the connecting electrode (140) electrically connects the upper electrode (122) and the power distribution unit (130) by penetrating the lower surface (110b) of the power distribution unit (130) and the heat dissipation unit (110).

2. In claim 1, The upper electrode (122) includes an upper electrode head (123) exposed on the upper surface of the substrate (120) and an electrode extension (124) extending from the upper electrode head (123) and protruding downward through the upper surface (110a) of the substrate (120) and the heat dissipation portion (110). The connecting electrode (140) includes a connecting electrode load portion (141) and a connecting electrode end portion (142). The upper part of the connecting electrode load part (141) is connected to the electrode extension part (124), and the lower part of the connecting electrode load part (141) is connected to the connecting electrode end part (142). A light emitting module in which the connecting electrode termination (142) penetrates the power distribution unit (130) but is configured to support the power distribution unit (130).

3. In claim 1, A light emitting module further comprising a power expansion connector (150) connected to a power distribution unit (130) and configured to supply external power to the power distribution unit (130).

4. In claim 1, The heat dissipation unit (110) includes a first cooling water inlet (112a) and a first cooling water outlet (112b) provided on the lower surface or side surface. A light emitting module in which coolant flows into a first cooling channel (111) through a first coolant inlet (112a) and a first coolant outlet (112b).

5. In claim 1, A light emitting module, wherein the heat dissipation portion (110) further includes a cooling protrusion (113) protruding from the inside toward the first cooling passage (111).

6. In claim 2, The upper end of the connecting electrode load portion (141) is screw-connected to an electrode extension portion (124) having a screw thread at the end. A light emitting module in which the lower end of the connecting electrode load portion (141) is screw-connected to a connecting electrode end portion (142) having a screw thread at one end.

7. In claim 3, The substrate (120) includes a first unit substrate (120a) and a second unit substrate (120b) arranged adjacently in a predetermined direction, The upper electrode (122) includes a first upper electrode (122a) at least partially provided on the first unit substrate (120a) and a second upper electrode (122b) at least partially provided on the second unit substrate (120b). The connecting electrode (140) includes a first connecting electrode electrically connecting the first upper electrode (122a) and the power distribution unit (130) and a second connecting electrode electrically connecting the second upper electrode (122b) and the power distribution unit (130). A light emitting module configured so that the power distribution unit (130) supplies external power supplied through the power expansion connector (150) to the first upper electrode (122a) and the second upper electrode (122b) through the first connecting electrode and the second connecting electrode, respectively.

8. A cooling plate (210) including an upper surface, a lower surface, and a side surface and having a second cooling passage (220) provided therein; and A light emitting module (100) having at least a portion disposed on the upper surface of a cooling plate (210) and having a first cooling path (111) provided therein; Includes, A heater block in which the second cooling channel (220) and the first cooling channel (111) are fluidly connected to each other.

9. In claim 8, The light emitting module (100) includes a power expansion connector (150) that receives external power. A heater block having a cooling plate (210) and a through hole (212) into which a power expansion connector (150) is inserted.

10. In claim 8, The cooling plate (210) includes a second cooling water inlet (231) and a second cooling water outlet (232) provided on the bottom or side. A heater block configured so that coolant flows into the second coolant inlet (231), passes through the second cooling channel (220), flows into the first cooling channel (111), and then flows again through the second cooling channel (220) and through the second coolant outlet (232) to the outside of the cooling plate (210).

11. In claim 10, The second cooling channel (220) includes a second a cooling channel (220a) through which cooling water flowing from the second cooling water inlet (231) flows, and a second b cooling channel (220b) through which cooling water flowing out of the second cooling water outlet (232) flows. A heater block configured so that the coolant flows sequentially through the second coolant inlet (231), the second a cooling channel (220a), the first cooling channel (111), the second b cooling channel (220b), and the second coolant outlet (232) to the outside of the cooling plate (210).

12. In claim 8, A heater block, wherein the light-emitting module (100) is a light-emitting module (100) according to any one of claims 1 to 7.

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