Electronic device including USB connector and power control method

Abstract

An electronic device according to an embodiment of the present disclosure comprises: a USB connector; a sensing circuit having an output voltage which is changed according to a temperature; and a configuration channel (CC) control circuit connected between a pull-down resistor of a CC of the USB connector and a ground, wherein the sensing circuit changes a voltage level of a first voltage according to a temperature change and outputs, as a first control signal, the first voltage having the changed voltage level, and the CC control circuit may block a connection between the pull down resistor and the ground when the voltage level of the first control signal reaches a first level.

Description

Electronic device including USB connector and power control method

[0001] The present disclosure relates to an electronic device including a USB connector and a power control method.

[0002] USB-C type enables bidirectional power transmission and reception by negotiating between devices through a configuration channel (CC). The CC pin is used for cable detection, power direction determination, and current capacity detection. Based on the resistance connected to the CC pin, cable connection can be detected and charging direction can be determined.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device according to one embodiment of the present disclosure may include a USB connector.

[0005] An electronic device according to one embodiment of the present disclosure may include a sensing circuit whose output voltage varies depending on temperature.

[0006] An electronic device according to one embodiment of the present disclosure may include a CC (configuration channel) control circuit connected between a pull down resistor of the CC (configuration channel) of the USB connector and ground.

[0007] According to one embodiment, the sensing circuit can output a first voltage as a first control signal by changing the voltage level according to a temperature change.

[0008] According to one embodiment, the CC control circuit can cut off the connection between the pull-down resistor and the ground when the voltage level of the first control signal reaches a first level.

[0009] A method for controlling power of an electronic device including a USB connector according to one embodiment of the present disclosure may include an operation of connecting to a CC control circuit of the USB connector and connecting to an external electronic device or a power supply device. The method may include an operation of confirming a CC through the CC control circuit and receiving power from the external electronic device or the power supply device. The method may include an operation of changing a power level of a first detection signal when a temperature of the electronic device rises while receiving power from the external electronic device or the power supply device. The method may include an operation of outputting the first detection signal when the power level of the first detection signal exceeds a specific voltage level. The method may include an operation of changing the pull-down resistor connected to the CC to an open state based on the first detection signal. The method may include an operation of cutting off power supplied from the external electronic device or the power supply device when the pull-down resistor connected to the CC is changed to an open state.

[0010] In one embodiment, a non-transitory computer-readable recording medium may have recorded thereon a computer program that is executed by an electronic device to cause the electronic device to perform the method described above.

[0011] An electronic device including a USB connector and a power control method according to one embodiment of the present disclosure can improve the safety of the electronic device by detecting heat and foreign substances in the USB connector and cutting off power supplied from an external source.

[0012] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0013] FIG. 1A is a block diagram of an exemplary electronic device capable of performing the operations described within the present disclosure.

[0014] FIG. 1b is a block diagram of an electronic device within a network environment according to various embodiments.

[0015] FIG. 2 is a drawing showing an electronic device including a USB connector according to one embodiment of the present disclosure.

[0016] FIG. 3 is a flowchart illustrating an operation of controlling a pull-down resistor connected to CC in the electronic device of FIG. 2 according to one embodiment of the present disclosure.

[0017] FIG. 4 is a drawing showing an electronic device including a USB connector according to one embodiment of the present disclosure.

[0018] FIG. 5 is a drawing showing an electronic device including a USB connector according to one embodiment of the present disclosure.

[0019] FIG. 6 is a flowchart illustrating an operation of controlling a pull-down resistor connected to a CC in the electronic device of FIG. 4 or the electronic device of FIG. 5 according to one embodiment of the present disclosure.

[0020] FIG. 7 is a graph showing a change in temperature and a change in resistance of a thermistor according to pull-down resistance control connected to a USB connector of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 8 is a graph showing a change in resistance of a pull-down resistor, a change in voltage of a control signal, and a change in voltage of a CC control circuit according to pull-down resistor control connected to a USB connector of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 9 is a diagram illustrating a foreign substance detection circuit connected to a USB connector of an electronic device according to one embodiment of the present disclosure.

[0023] Typically, the CC pin is terminated by connecting a power delivery (PD) IC or a resistor. However, if a resistor is connected to terminate the connector, it can be difficult to determine that the load is normal and to shut off the power even if overcurrent or overheating occurs.

[0024] An electronic device including a USB connector according to one embodiment of the present disclosure can block a pull-down resistor connection connected to CC of the USB connector when a foreign substance or a voltage change due to heat generation is detected by heat detection.

[0025] An electronic device including a USB connector according to one embodiment of the present disclosure can improve the safety of the electronic device by detecting heat and foreign substances in the USB connector and cutting off power supplied from an external source.

[0026] FIG. 1A is a block diagram of an exemplary electronic device (100) capable of performing the operations described within the present disclosure.

[0027] Referring to FIG. 1A, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1A are exemplary only and do not limit the implementations described or claimed within the present disclosure. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0028] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0029] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0030] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0031] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0032] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0033] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0034] FIG. 1b is a block diagram of an electronic device (100) within a network environment (101), according to various embodiments.

[0035] Referring to FIG. 1B, in a network environment (101), an electronic device (100) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (100) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (100) may include a processor (110), a memory (120), an input assembly (181), an audio output assembly (182), a display (140), an audio assembly (183), a sensor (170), an interface (177), a connection terminal (178), a haptic assembly (179), a camera assembly (180), a power management circuit (188), a battery (189), a communication circuit (160), a subscriber identification circuit (196), or an antenna assembly (197). In some embodiments, the electronic device (100) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor (170), the camera assembly (180), or the antenna assembly (197)) may be integrated into one component (e.g., the display (140)).

[0036] The processor (110) may, for example, execute software (e.g., a program (130)) to control at least one other component (e.g., a hardware or software component) of the electronic device (100) connected to the processor (110) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (110) may store commands or data received from other components (e.g., a sensor (170) or a communication circuit (160)) in a volatile memory (121), process the commands or data stored in the volatile memory (121), and store result data in a non-volatile memory (122). According to one embodiment, the processor (110) may include a main processor (110_1) (e.g., a central processing unit or processor) or an auxiliary processor (110_2) (e.g., a graphics processing unit, a neural processing unit (NPU) (113), an image signal processor, a sensor hub processor, or a communication processor (118)) that can operate independently or together with the main processor (110_1). For example, when the electronic device (100) includes a main processor (110_1) and an auxiliary processor (110_2), the auxiliary processor (110_2) may be configured to use lower power than the main processor (110_1) or to be specialized for a given function. The auxiliary processor (110_2) may be implemented separately from the main processor (110_1) or as a part thereof.

[0037] The auxiliary processor (110_2) may control at least a portion of functions or states associated with at least one component (e.g., a display (140), a sensor (170), or a communication circuit (160)) of the electronic device (100), for example, on behalf of the main processor (110_1) while the main processor (110_1) is in an inactive (e.g., sleep) state, or together with the main processor (110_1) while the main processor (110_1) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (110_2) (e.g., an image signal processor or a communication processor (118)) may be implemented as a part of another functionally related component (e.g., a camera assembly (180) or a communication circuit (160)). In one embodiment, the auxiliary processor (110_2) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. An artificial intelligence model can be generated through machine learning. This learning can be performed, for example, within the electronic device (100) where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0038] The memory (120) can store various data used by at least one component (e.g., a processor (110) or a sensor (170)) of the electronic device (100). The data can include, for example, software (e.g., a program (130)) and input data or output data for commands related thereto. The memory (120) can include a volatile memory (121) or a non-volatile memory (122).

[0039] The program (130) may be stored as software in the memory (120) and may include, for example, an operating system (132), middleware (134), or an application (136).

[0040] The input assembly (181) can receive commands or data to be used in a component of the electronic device (100) (e.g., a processor (110)) from an external source (e.g., a user) of the electronic device (100). The input assembly (181) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0041] The audio output assembly (182) can output audio signals to the outside of the electronic device (100). The audio output assembly (182) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0042] The display (140) can visually provide information to an external party (e.g., a user) of the electronic device (100). The display (140) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display (140) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the strength of a force generated by the touch.

[0043] The audio assembly (183) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio assembly (183) can acquire sound through the input assembly (181), or output sound through the sound output assembly (182), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (100).

[0044] The sensor (170) can detect the operating status (e.g., power or temperature) of the electronic device (100) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor (170) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (100) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (100) may be physically connected to an external electronic device (e.g., the electronic device (102)). In one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic assembly (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic assembly (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera assembly (180) can capture still images and moving images. In one embodiment, the camera assembly (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management circuit (188) can manage the power supplied to the electronic device (100). According to one embodiment, the power management circuit (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (100). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication circuit (160) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (100) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and the performance of communication through the established communication channel. The communication circuit (160) may operate independently from the processor (110) (e.g., an application processor) and may include one or more communication processors (118) that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication circuit (160) may include a wireless communication circuit (152) (e.g., a cellular communication circuit, a short-range wireless communication circuit, or a global navigation satellite system (GNSS) communication circuit) or a wired communication circuit (154) (e.g., a local area network (LAN) communication circuit, or a power line communication circuit). Any of these communication circuits may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication circuits may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication circuit (152) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification circuit (196) to verify or authenticate the electronic device (100) within a communication network such as the first network (198) or the second network (199).

[0052] The wireless communication circuit (152) can support a 5G network and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication circuit (152) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication circuit (152) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication circuit (152) can support various requirements specified in the electronic device (100), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication circuit (152) can support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0053] The antenna assembly (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna assembly (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna assembly (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication circuit (160). A signal or power may be transmitted or received between the communication circuit (160) and the external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna assembly (197).

[0054] According to various embodiments, the antenna assembly (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0055] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0056] According to one embodiment, commands or data may be transmitted or received between the electronic device (100) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (100). According to one embodiment, all or part of the operations executed in the electronic device (100) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (100) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (100) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (100). The electronic device (100) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (100) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (100) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0057] FIG. 2 is a drawing illustrating an electronic device (100) including a USB connector according to one embodiment of the present disclosure. For example, it is a drawing illustrating an electronic device (100) including a USB connector capable of receiving a first voltage (V1) from an external electronic device or power supply device.

[0058] In one embodiment, the electronic device (100) may include a processor (210) (e.g., CPU (111) or processor (110) of FIG. 1A), a first sensing circuit (220), and a USB connector (250).

[0059] In one embodiment, the processor (210) may include a micro controller unit (MCU) or a power management integrated circuit (PMIC).

[0060] In one embodiment, the USB connector (250) may include a C-type USB connector. The USB connector (250) may be supplied with a first voltage (approximately 5 V) from an external electronic device or power supply.

[0061] In one embodiment, the electronic device (100) can receive power from an external electronic device or power supply through the USB connector (250). The electronic device (100) can receive power from the external electronic device or power supply through the VBUS of the USB connector (250). The USB connector (250) can include a plurality of configuration channel (CC) pins (e.g., CC1, CC2). Each of the plurality of CC pins can be connected to a pull-down resistor (Rd1, Rd2). The external electronic device or power supply can recognize that it is connected to the electronic device (100) based on the states of the plurality of pull-down resistors. For example, if the pull-down resistor connected to CC1 is in an open state and the pull-down resistor connected to CC2 is connected to ground, the external electronic device or power supply can recognize that the electronic device (100) is connected based on the states of the plurality of pull-down resistors. Additionally, if the pull-down resistor connected to CC1 and the pull-down resistor connected to CC2 are in an open state, an external electronic device or power supply may not recognize the connected electronic device (100) and may cut off the supplied power.

[0062] In one embodiment, the USB connector (250) may be connected to a configuration channel (CC) control circuit (260). The CC control circuit (260) may include a first switch (261) and a second switch (262). The first switch (261) and the second switch (262) may block the connection between the pull-down resistors (e.g., Rd1, Rd2) and ground when receiving a first control signal (ctr1) having a specific voltage level. The first switch (261) and the second switch (262) may change the pull-down resistors (e.g., Rd1, Rd2) to an open state when receiving a first control signal (ctr1) having a specific voltage level. When the first control signal (ctr1) is not received or the output is blocked, the first switch (261) and the second switch (262) can connect between the pull-down resistors (e.g., Rd1, Rd2) and the ground. The first switch (261) and the second switch (262) can include, for example, a MOS semiconductor. However, the present invention is not limited thereto, and the first switch (261) and the second switch (262) can connect between the pull-down resistors (e.g., Rd1, Rd2) and the ground when the first control signal (ctr1) is received. When the first switch (261) and the second switch (262) do not receive the first control signal (ctr1), the first switch (261) and the second switch (262) can change the pull-down resistors (e.g., Rd1, Rd2) to an open state.

[0063] In one embodiment, the CC control circuit (260) may include a first switch (261). When an external electronic device or power supply is connected to the electronic device (100), the second pull-down resistor (Rd2) may be in an open state, and the first pull-down resistor (Rd1) may be connected to ground through the first switch (261). The first pull-down resistor (Rd1) may be opened or connected to ground depending on the operation of the first switch (261). The first switch (261) may block the connection between the pull-down resistor (e.g., Rd1) and ground upon receiving the first control signal (ctr1). The first switch (261) may change the pull-down resistor (e.g., Rd1) to an open state upon receiving the first control signal (ctr1). When the first control signal (ctr1) is not received or the output is blocked, the first switch (261) can connect between the pull-down resistor (e.g., Rd1) and ground.

[0064] In one embodiment, the first detection circuit (220) can output a first detection signal (d1) having a power level. When the power level of the first detection signal (d1) reaches a specified level, the first control signal (ctr1) can be transmitted to the CC control circuit (260).

[0065] In one embodiment, the processor (210) and the first sensing circuit (220) may operate based on the second voltage (V2).

[0066] In one embodiment, the first detection circuit (220) can output the first detection signal (d1) by changing the voltage level of the second voltage (V2).

[0067] In one embodiment, the processor (210) can output the first control signal (ctr1) by changing the voltage level of the second voltage (V2).

[0068] For example, the second voltage (V2) may include power supplied from the electronic device (100). The electronic device (100) includes a battery (189) and may supply power stored in the battery (189) to the processor (210) and the first detection circuit (220) as the second voltage (V2).

[0069] In one embodiment, the electronic device (100) may include a power control circuit (e.g., power management circuit (188) of FIG. 1B) that changes and outputs power stored in a battery (189) to a second voltage (V2).

[0070] In one embodiment, the first sensing circuit (220) may include a first resistor (r1) connected between a second voltage (V2) and a first node (N1), a first capacitor (c1) connected between the first node (N1) and ground, and a first thermistor (tm1) connected between the first node (N1) and ground. The resistance of the first thermistor (tm1) may increase or decrease depending on temperature.

[0071] In one embodiment, the first capacitor (c1) may form an RC circuit together with the first resistor (r1) to mitigate the sensitivity of the first thermistor (tm1) to temperature. By mitigating the sensitivity of the first thermistor (tm1), the response stability of the first detection signal (d1) or the first control signal (ctr1) may be improved. However, the present invention is not limited thereto, and the capacitor may be omitted from the first detection circuit (220).

[0072] For example, if a fixed resistor is configured on the pull-up side and a thermistor (e.g., the first thermistor (tm1)) is configured on the pull-down side, and the characteristic is that the temperature-resistance relationship is inversely proportional, the voltage level of the first detection signal (d1) can be inversely proportional to the temperature.

[0073] For example, if a fixed resistor is configured on the pull-up side and a thermistor (e.g., the first thermistor (tm1)) is configured on the pull-down side, and the characteristic is proportional to the temperature-resistance relationship, the voltage level of the first detection signal (d1) can be proportional to the temperature.

[0074] For example, if a thermistor (e.g., the first thermistor (tm1)) is configured on the pull-up side and a fixed resistor is configured on the pull-down side, and the characteristic is that the temperature-resistance relationship is inversely proportional, the voltage level of the first detection signal (d1) can be proportional to the temperature.

[0075] For example, if the pull-up side is configured with a thermistor (e.g., the first thermistor (tm1)) and the pull-down side is configured with a fixed resistor, and the characteristic is that the temperature-resistance relationship is proportional, the voltage level of the first detection signal (d1) can be inversely proportional to the temperature.

[0076] For example, if the first thermistor (tm1) includes an element whose resistance increases with temperature, the resistance may increase as the temperature of the electronic device (100) increases, and thus the voltage level of the first detection signal (d1) may increase. If the first thermistor (tm1) includes an element whose resistance increases with temperature, the voltage level of the first detection signal (d1) may increase as the temperature of the electronic device (100) increases.

[0077] For example, if the first thermistor (tm1) includes an element whose resistance decreases with temperature, the resistance may decrease as the temperature of the electronic device (100) increases, and thus the voltage level of the first detection signal (d1) may decrease. If the first thermistor (tm1) includes an element whose resistance decreases with temperature, the voltage level of the first detection signal (d1) may decrease as the temperature of the electronic device (100) increases.

[0078] In one embodiment, the first detection circuit (220) can divide the second voltage (V2) into voltages to output a first detection signal (d1) having a specific voltage level through the first node (N1). The first detection signal (d1) has a specific voltage level, and the voltage level of the first detection signal (d1) can change depending on the temperature of the electronic device (100).

[0079] In one embodiment, the electronic device (100) may include a memory (120). The memory (120) may store instructions. The instructions, when executed by the processor (210), may cause the electronic device (100) to perform operations. The memory (120) may be configured separately from the processor (210), but is not limited thereto. The processor (210) may include the memory (120).

[0080] In one embodiment, when the first detection signal (d1) reaches or exceeds a specific voltage level, the processor (210) may transmit a first control signal (ctr1) having the specific voltage level to the CC control circuit (260).

[0081] In one embodiment, if the first detection signal (d1) does not reach a specific voltage level, the processor (210) may block the output of the first control signal (ctr1).

[0082] In one embodiment, when the first detection signal (d1) reaches or exceeds a particular voltage level, the instructions, when executed by the processor (210), may cause the electronic device (100) to transmit a first control signal (ctr1) having the particular voltage level to the CC control circuit (260).

[0083] In one embodiment, if the first detection signal (d1) does not reach a particular voltage level, the instructions, when executed by the processor (210), may cause the electronic device (100) to block the output of the first control signal (ctr1).

[0084] For example, if the first detection circuit (220) is designed so that the voltage level of the first detection signal (d1) increases as the temperature of the electronic device (100) rises, when the voltage level of the first detection signal (d1) reaches a first specific voltage, the processor (210) can transmit a first control signal (ctr1) having a specific voltage level to the CC control circuit (260). If the first detection circuit (220) is designed so that the voltage level of the first detection signal (d1) decreases as the temperature of the electronic device (100) rises, when the voltage level of the first detection signal (d1) reaches a second specific voltage, the processor (210) can transmit a first control signal (ctr1) having a specific voltage level to the CC control circuit (260). The first specific voltage may be higher than the second specific voltage.

[0085] In one embodiment, the electronic device (100) may include a speaker, a light emitting diode (LED), or a communication circuit (160). The instructions, when executed by the processor (210), may cause the electronic device (100) to output an audible indicator via the speaker and / or a visual indicator via the LED when the power supply from the external electronic device is cut off by the first control signal (ctr1). The instructions, when executed by the processor (210), may cause the electronic device (100) to transmit an alarm to a connected external electronic device via the communication circuit (160) when the power supply from the external electronic device is cut off by the first control signal (ctr1).

[0086] FIG. 3 is a flowchart illustrating an operation of controlling a pull-down resistor connected to CC in the electronic device (100) of FIG. 2 according to one embodiment of the present disclosure.

[0087] In operation 301, the electronic device (100) can be connected to an external electronic device or power supply through the CC control circuit (260) of the USB connector (250).

[0088] In operation 302, the instructions, when executed by the processor (210), cause the electronic device (100) to check the CC (configuration channel) through the CC control circuit (260).

[0089] In operation 303, an external electronic device or power supply may supply power to the electronic device (100).

[0090] In operation 304, if there is a foreign substance on the power supply path, the current of the power supplied to the electronic device (100) from the external electronic device or power supply device may increase due to the foreign substance.

[0091] In operation 305, if the current of the power supplied to the electronic device (100) from an external electronic device or power supply increases, the temperature of the electronic device (100) may rise.

[0092] In operation 306, when the temperature of the electronic device (100) rises, the input value of the first detection circuit (220) may change. The input value may include the power level of the first detection signal (d1).

[0093] In operation 306, if the temperature of the electronic device (100) rises while receiving power from an external electronic device or power supply, the input value of the first detection circuit (220) may change. The input value may include the power level of the first detection signal (d1).

[0094] In operation 307, if the input value exceeds a threshold value, the instructions, when executed by the processor (210), may cause the electronic device (100) to output a control signal (e.g., a first control signal (ctr1)) from the processor (210). The threshold value may include a specific voltage level.

[0095] In operation 307, if the power level of the first detection signal (d1) exceeds a specific voltage level, the instructions, when executed by the processor (210), may cause the electronic device (100) to output a control signal (e.g., the first control signal (ctr1)) from the processor (210) to the CC control circuit (260).

[0096] In operation 308, the CC control circuit (260) can change the pull-down resistor connected to the CC to an open state based on a control signal (e.g., the first control signal (ctr1)).

[0097] In operation 309, when the pull-down resistor connected to CC is changed to an open state, an external electronic device or power supply can cut off power supplied to the electronic device (100).

[0098] In operation 310, when the external electronic device or power supply device cuts off the power supplied to the electronic device (100), the temperature of the electronic device (100) may drop.

[0099] In operation 311, the input value of the first detection circuit (220) may change. The input value may include the power level of the first detection signal (d1).

[0100] In operation 312, if the input value is less than (or less than or equal to) the threshold value, the instructions, when executed by the processor (210), may cause the electronic device (100) to block the output of a control signal (e.g., the first control signal (ctr1)) from the processor (210). If the control signal (e.g., the first control signal (ctr1)) is blocked, the CC control circuit (260) may connect the pull-down resistor connected to the CC to ground.

[0101] However, this is not limited thereto, and in operation 312, if the power level of the first detection signal (d1) is less than, less than, or equal to a specific voltage level, the instructions, when executed by the processor (210), may cause the electronic device (100) to block the output of a control signal (e.g., the first control signal (ctr1)) from the processor (210).

[0102] In operation 313, the electronic device (100) can restore the CC connection through the CC control circuit (260).

[0103] In operation 314, when the CC connection is restored, the external electronic device or power supply can supply power to the electronic device (100).

[0104] FIG. 4 is a drawing showing an electronic device (100) including a USB connector according to one embodiment of the present disclosure.

[0105] Unlike the electronic device (100) of FIG. 2, the electronic device (100) of FIG. 4 does not include a processor (210), and can output a second control signal (ctr2) that controls the CC control circuit (260) from the second detection circuit (410).

[0106] In one embodiment, the electronic device (100) may include a second sensing circuit (410) and a USB connector (250).

[0107] In one embodiment, the USB connector (250) may include a C-type USB connector. The USB connector (250) may be supplied with a first voltage (approximately 5 V) from an external electronic device or power supply.

[0108] In one embodiment, the electronic device (100) can receive power from an external electronic device or power supply through the USB connector (250). The electronic device (100) can receive power from the external electronic device or power supply through the VBUS of the USB connector (250). The USB connector (250) can include a plurality of configuration channel (CC) pins (e.g., CC1, CC2). Each of the plurality of CC pins can be connected to a pull-down resistor (Rd1, Rd2). The external electronic device or power supply can recognize that the electronic device (100) is connected based on the states of the plurality of pull-down resistors. For example, if the pull-down resistor connected to CC1 is in an open state and the pull-down resistor connected to CC2 is connected to ground, the external electronic device or power supply can recognize that the electronic device (100) is connected based on the states of the plurality of pull-down resistors. Additionally, if the pull-down resistor connected to CC1 and the pull-down resistor connected to CC2 are in an open state, an external electronic device or power supply may not recognize the connected electronic device (100) and may cut off the power being supplied.

[0109] In one embodiment, the USB connector (250) may be connected to a configuration channel (CC) control circuit (260). The CC control circuit (260) may include a first switch (261) and a second switch (262). The first switch (261) and the second switch (262) may block the connection between the pull-down resistors (e.g., Rd1, Rd2) and ground when receiving a second control signal (ctr2) having a first voltage level or higher. The first switch (261) and the second switch (262) may change the pull-down resistors (e.g., Rd1, Rd2) to an open state when receiving a second control signal (ctr2) having a first voltage level or higher. If the second control signal (ctr2) is below the first voltage level, the first switch (261) and the second switch (262) can be connected between the pull-down resistor (e.g., Rd1, Rd2) and ground.

[0110] The first switch (261) and / or the second switch (262) may include, for example, a metal oxide semiconductor field effect transistor (MOSFET) (e.g., PMOS or NMOS). The first switch (261) and / or the second switch (262) may include, for example, an NPN bipolar junction transistor (BJT) or a PNP BJT.

[0111] In one embodiment, the CC control circuit (260) may include a first switch (261). When the electronic device (100) is connected to an external electronic device or a power supply, the second pull-down resistor (Rd2) may be in an open state, and the first pull-down resistor (Rd1) may be connected to ground through the first switch (261). The first pull-down resistor (Rd1) may be opened or connected to ground depending on the operation of the first switch (261). The first switch (261) may block the connection between the pull-down resistor (e.g., Rd1) and ground when the second control signal (ctr2) has a first voltage level or higher. The first switch (261) may change the pull-down resistor (e.g., Rd1) to an open state when the second control signal (ctr2) has a first voltage level or higher. If the second control signal (ctr2) is below the first voltage level, the first switch (261) can connect between the pull-down resistor (e.g., Rd1) and ground.

[0112] In one embodiment, the first voltage level may include a turn-on voltage of the first switch (261) or the second switch (262).

[0113] In one embodiment, the second sensing circuit (410) can output a second control signal (ctr2) having a power level. The second sensing circuit (410) is connected to the CC control circuit (260) and can output the second control signal (ctr2) to the CC control circuit (260).

[0114] In one embodiment, the second sensing circuit (410) may operate based on the first voltage (V1).

[0115] In one embodiment, the second sensing circuit (410) can output a second control signal (ctr2) by changing the voltage level of the first voltage (V1).

[0116] In one embodiment, the second sensing circuit (410) may include a second thermistor (tm2) connected between a first voltage (V1) and a second node (N2), a second capacitor (c2) connected between the second node (N2) and ground, and a second resistor (r2) connected between the second node (N2) and ground. The resistance of the second thermistor (tm2) may increase or decrease depending on temperature.

[0117] In one embodiment, the second capacitor (c2) may form an RC circuit together with the second resistor (r2) to mitigate the sensitivity of the second thermistor (tm2) to temperature. By mitigating the sensitivity of the second thermistor (tm2), the response stability of the second control circuit (ctr2) may be improved. However, the present invention is not limited thereto, and the capacitor may be omitted from the second sensing circuit (410).

[0118] For example, the second thermistor (tm2) can be connected to a power source unlike the first thermistor (tm1).

[0119] For example, if the second thermistor (tm2) includes an element whose resistance increases with temperature, the resistance may increase as the temperature of the electronic device (100) increases, thereby lowering the voltage level of the second control signal (ctr2). If the second thermistor (tm2) includes an element whose resistance increases with temperature, the voltage level of the second control signal (ctr2) may lower as the temperature of the electronic device (100) increases.

[0120] For example, if the second thermistor (tm2) includes an element whose resistance decreases with temperature, the resistance may decrease as the temperature of the electronic device (100) increases, and thus the voltage level of the second control signal (ctr2) may increase. If the second thermistor (tm2) includes an element whose resistance decreases with temperature, the voltage level of the second control signal (ctr2) may increase as the temperature of the electronic device (100) increases.

[0121] In one embodiment, the second sensing circuit (410) can divide the first voltage (V1) into voltages and output a second control signal (ctr2) having a specific voltage level through the second node (N2). The second control signal (ctr2) has a specific voltage level, and the voltage level of the second control signal (ctr2) can be changed depending on the temperature of the electronic device (100).

[0122] FIG. 5 is a drawing showing an electronic device (100) including a USB connector according to one embodiment of the present disclosure.

[0123] The third detection circuit (510) of FIG. 5 may include more switches (sw) than the second detection circuit (410) of FIG. 4. The second detection circuit (410) of FIG. 4 may output a voltage level of the second control signal (ctr2) by linearly changing it. In contrast, the third detection circuit (510) of FIG. 5 may have a discrete change in the voltage level of the third control signal (ctr1).

[0124] In one embodiment, the electronic device (100) may include a third sensing circuit (510) and a USB connector (250).

[0125] In one embodiment, the USB connector (250) may include a C-type USB connector. The USB connector (250) may be supplied with a first voltage (approximately 5 V) from an external electronic device or power supply.

[0126] In one embodiment, the electronic device (100) can receive power from an external electronic device or power supply through the USB connector (250). The electronic device (100) can receive power from the external electronic device or power supply through the VBUS of the USB connector (250). The USB connector (250) can include a plurality of configuration channel (CC) pins (e.g., CC1, CC2). Each of the plurality of CC pins can be connected to a pull-down resistor (Rd1, Rd2). The external electronic device or power supply can recognize that the electronic device (100) is connected based on the states of the plurality of pull-down resistors. For example, if the pull-down resistor connected to CC1 is in an open state and the pull-down resistor connected to CC2 is connected to ground, the external electronic device or power supply can recognize that the electronic device (100) is connected based on the states of the plurality of pull-down resistors. Additionally, if the pull-down resistor connected to CC1 and the pull-down resistor connected to CC2 are in an open state, an external electronic device or power supply may not recognize the connected electronic device (100) and may cut off the power being supplied.

[0127] In one embodiment, the USB connector (250) may be connected to a configuration channel (CC) control circuit (260). The CC control circuit (260) may include a first switch (261) and a second switch (262). The first switch (261) and the second switch (262) may block the connection between the pull-down resistors (e.g., Rd1, Rd2) and ground when receiving a third control signal (ctr3) having a specific voltage level or higher. The first switch (261) and the second switch (262) may change the pull-down resistors (e.g., Rd1, Rd2) to an open state when receiving a third control signal (ctr3) having a specific voltage level or higher. When the output of the third control signal (ctr3) is blocked, the first switch (261) and the second switch (262) can be connected between the pull-down resistor (e.g., Rd1, Rd2) and the ground.

[0128] The first switch (261) and the second switch (262) may include, for example, MOSFETs.

[0129] In one embodiment, the CC control circuit (260) may include a first switch (261). When the electronic device (100) is connected to an external electronic device or a power supply, the second pull-down resistor (Rd2) may be in an open state, and the first pull-down resistor (Rd1) may be connected to ground through the first switch (261). The first pull-down resistor (Rd1) may be opened or connected to ground depending on the operation of the first switch (261). When the first switch (261) receives a third control signal (ctr3), the first switch (261) may block the connection between the pull-down resistor (e.g., Rd1) and ground. When the third control signal (ctr3) has a first voltage level or higher, the first switch (261) may change the pull-down resistor (e.g., Rd1) to an open state. When the output of the third control signal (ctr3) of the third control signal (ctr3) is blocked, the first switch (261) can connect between the pull-down resistor (e.g., Rd1) and the ground.

[0130] In one embodiment, the third sensing circuit (510) can output a third control signal (ctr3) having a power level. The third sensing circuit (510) is connected to the CC control circuit (260) and can output the third control signal (ctr3) to the CC control circuit (260).

[0131] In one embodiment, the third sensing circuit (510) may operate based on the first voltage (V1).

[0132] In one embodiment, the third sensing circuit (510) can output a third control signal (ctr3) by changing the voltage level of the first voltage (V1).

[0133] In one embodiment, the third sensing circuit (510) may include a third resistor (r3) connected between a first voltage (V1) and a third node (N3), a third capacitor (c3) connected between the third node (N3) and ground, a third thermistor (tm3) connected between the third node (N3) and ground, a fourth resistor (r4) connected between the first voltage (V1) and a fourth node (N4), and a switch (sw) receiving a second sensing signal (d2) output from the third node (N3) and connected between the fourth node (N3) and ground. The third sensing circuit (510) may output a third control signal (ctr3) through the fourth node (N4). The resistance of the third thermistor (tm3) may increase or decrease depending on temperature.

[0134] In one embodiment, the third capacitor (c3) may form an RC circuit together with the third resistor (r3) to mitigate the sensitivity of the third thermistor (tm3) to temperature. By mitigating the sensitivity of the third thermistor (tm3), the response stability of the third control circuit (ctr3) or the second detection signal (d2) may be improved. However, the present invention is not limited thereto, and the capacitor may be omitted from the third detection circuit (510).

[0135] For example, if the third thermistor (tm3) includes an element whose resistance increases with temperature, the resistance increases as the temperature of the electronic device (100) rises, and thus the voltage level of the second detection signal (d2) output from the third node (N3) may increase. If the third thermistor (tm3) includes an element whose resistance increases with temperature, the voltage level of the second detection signal (d2) may increase as the temperature of the electronic device (100) rises.

[0136] For example, if the third thermistor (tm3) includes an element whose resistance decreases with temperature, the resistance may decrease as the temperature of the electronic device (100) increases, thereby lowering the voltage level of the second detection signal (d2). If the third thermistor (tm3) includes an element whose resistance decreases with temperature, the voltage level of the second detection signal (d2) may decrease as the temperature of the electronic device (100) increases.

[0137] In one embodiment, when the voltage level of the second detection signal (d2) reaches (or exceeds) a specific voltage level, the switch (sw) is turned on to connect the fourth node (N4) and ground to allow current to flow. The third detection circuit (510) can output the third control signal (ctr3) through the fourth node (N4) when the switch (sw) is turned on.

[0138] In one embodiment, if the voltage level of the second detection signal (d2) does not reach (or is less than or equal to) a specific voltage level, the switch (sw) may be turned off to disconnect the fourth node (N4) from the ground, thereby keeping it in an off state. The third detection circuit (510) may block the output of the third control signal (ctr3) when the switch (sw) is turned off.

[0139] In one embodiment, the switch (sw) may include an NPN bipolar junction transistor (BJT). The base of the switch (sw) may be connected to a third node (N3) to input the second detection signal (d2), the collector of the switch (sw) may be connected to a fourth node (N4), and the emitter of the switch (sw) may be connected to ground.

[0140] However, it is not limited thereto, and the switch (sw) may include a PNP BJT, an n-type metal oxide semiconductor (NMOS), or a p-type metal oxide semiconductor (PMOS). The gate of the switch (sw) may be connected to a third node (N3) to input the second detection signal (d2), the drain of the switch (sw) may be connected to a fourth node (N4), and the source of the switch (sw) may be connected to ground.

[0141] In one embodiment, the electronic device (100) may include a speaker, a light emitting diode (LED), or a communication circuit (160). When the power supply from the external electronic device is cut off by the second control signal (ctr2) (see FIG. 4) or the third control signal (ctr3) (see FIG. 5), the electronic device (100) may output an audible indicator through the speaker and / or a visual indicator through the LED. When the power supply from the external electronic device is cut off by the second control signal (ctr2) or the third control signal (ctr3), the electronic device (100) may transmit an alarm to the connected external electronic device through the communication circuit (160).

[0142] FIG. 6 is a flowchart illustrating an operation of controlling a pull-down resistor connected to a CC in the electronic device (100) of FIG. 4 or the electronic device of FIG. 5 according to one embodiment of the present disclosure.

[0143] In operation 601, the electronic device (100) can be connected to an external electronic device or power supply through the CC control circuit (260) of the USB connector (250).

[0144] In operation 602, the instructions, when executed by the processor (210), cause the electronic device (100) to check the CC (configuration channel) through the CC control circuit (260).

[0145] In operation 603, an external electronic device or power supply may supply power to the electronic device (100).

[0146] In operation 604, if there is a foreign substance on the power supply path, the current of the power supplied to the electronic device (100) from the external electronic device or power supply device may increase due to the foreign substance.

[0147] In operation 605, if the current of the power supplied to the electronic device (100) from an external electronic device or power supply increases, the temperature of the electronic device (100) may rise.

[0148] In one embodiment, when the temperature of the electronic device (100) rises, the voltage level of the second control signal (ctr2) may increase. When the voltage level of the second control signal (ctr2) increases, the first switch (261) or the second switch (262) may be turned on. When the voltage level of the second control signal (ctr2) exceeds a specific voltage level, the first switch (261) or the second switch (262) may be turned on. When the voltage level of the second control signal (ctr2) is less than or equal to the specific voltage level, the first switch (261) or the second switch (262) may be turned off. When the first switch (261) and / or the second switch (262) are turned on, the pull-down resistors (e.g., Rd1, Rd2) may be in an open state.

[0149] In one embodiment, when the temperature of the electronic device (100) rises, the voltage level of the second detection signal (d2) may be changed to output the third control signal (ctr3).

[0150] When the third control signal (ctr3) is output, the first switch (261) or the second switch (262) may be turned on. When the first switch (261) and / or the second switch (262) are turned on, the pull-down resistors (e.g., Rd1, Rd2) may be in an open state.

[0151] In operation 606, when the temperature of the electronic device (100) rises, the voltage level of the second control signal (ctr2) output from the second detection circuit (410) may change.

[0152] In operation 606, when the temperature of the electronic device (100) rises, the voltage level of the second detection signal (d2) may change, so that the third control signal (ctr3) may be output from the third detection circuit (510).

[0153] In operation 607, the CC control circuit (260) can change the pull-down resistor connected to the CC to an open state based on the second control signal (ctr2).

[0154] In operation 607, the CC control circuit (260) can change the pull-down resistor connected to the CC to an open state based on the third control signal (ctr3).

[0155] In operation 608, when the pull-down resistor connected to CC is changed to an open state, an external electronic device or power supply can cut off power supplied to the electronic device (100).

[0156] In operation 609, when the external electronic device or power supply device cuts off the power supplied to the electronic device (100), the temperature of the electronic device (100) may drop.

[0157] In operation 610, the electronic device (100) can restore the CC connection through the CC control circuit (260).

[0158] In one embodiment, when the temperature of the electronic device (100) decreases, the voltage level of the second control signal (ctr2) may decrease. When the voltage level of the second control signal (ctr2) decreases, the first switch (261) or the second switch (262) may be turned off. When the first switch (261) and / or the second switch (262) are turned off, the pull-down resistors (e.g., Rd1, Rd2) may be connected to ground.

[0159] In one embodiment, when the temperature of the electronic device (100) decreases, the output of the third control signal (ctr3) may be blocked. When the output of the third control signal (ctr3) is blocked, the first switch (261) or the second switch (262) may be turned off. When the first switch (261) and / or the second switch (262) are turned off, the pull-down resistors (e.g., Rd1, Rd2) may be connected to ground.

[0160] In operation 611, when the CC connection is restored, the external electronic device or power supply can supply power to the electronic device (100).

[0161] FIG. 7 is a graph showing a change in temperature and a change in resistance of a thermistor according to pull-down resistance control connected to a USB connector of an electronic device (100) according to one embodiment of the present disclosure.

[0162] In the graph of Fig. 7, the horizontal axis may represent time and the vertical axis may represent the amount of change. 701 may represent the amount of change in temperature of the electronic device (100) over time, and 703 may represent the amount of change in the resistance value of the thermistor (e.g., the first thermistor (tm1), the second thermistor (tm2), the third thermistor (tm3)) over time.

[0163] In graph 701, if a foreign substance is included in the power supply path between the electronic device (100) and the external electronic device, the temperature of the electronic device (100) may increase. In graph 703, if the temperature of the electronic device (100) increases, the resistance value of the thermistor (e.g., the first thermistor (tm1), the second thermistor (tm2), and the third thermistor (tm3)) may decrease.

[0164] In one embodiment, when the thermistors (e.g., the first thermistor (tm1), the second thermistor (tm2), and the third thermistor (tm3)) reach a specific resistance value (approximately 20), the CC control circuit (260) can change the pull-down resistors (e.g., Rd1, Rd2) to an open state based on a control signal (e.g., the first control signal (ctr1), the second control signal (ctr2), and the third control signal (ctr3)). When the pull-down resistors (e.g., Rd1, Rd2) are changed to an open state, the electronic device (100) can cut off the power supply from the external electronic device.

[0165] In graph 701, when the power supply between the electronic device (100) and the external electronic device is cut off, the temperature of the electronic device (100) may decrease. In graph 703, when the temperature of the electronic device (100) increases, the resistance value of the thermistor (e.g., the first thermistor (tm1), the second thermistor (tm2), and the third thermistor (tm3)) may increase.

[0166] In one embodiment, when the thermistors (e.g., the first thermistor (tm1), the second thermistor (tm2), and the third thermistor (tm3)) reach a certain resistance value (approximately 80), the CC control circuit (260) may connect the pull-down resistors (e.g., Rd1, Rd2) to ground based on a control signal (e.g., the first control signal (ctr1), the second control signal (ctr2), and the third control signal (ctr3)). When the pull-down resistors (e.g., Rd1, Rd2) are connected to ground, the electronic device (100) may be powered from an external electronic device.

[0167] FIG. 8 is a graph showing a change in resistance of a pull-down resistor, a change in voltage of a control signal, and a change in voltage of a CC control circuit according to pull-down resistor control connected to a USB connector of an electronic device (100) according to one embodiment of the present disclosure.

[0168] In the graph of Fig. 8, the horizontal axis may represent time and the vertical axis may represent the amount of change. 801 may represent the voltage change of a control signal (e.g., a first control signal (ctr1), a second control signal (ctr2), a third control signal (ctr3)) over time, 803 may represent the voltage change of a CC control circuit (260) over time, and 805 may represent the resistance value of a pull-down resistor (e.g., Rd1, Rd2) over time.

[0169] In one embodiment, if a foreign substance is included in the power supply path between the electronic device (100) and the external electronic device, the temperature of the electronic device (100) may rise.

[0170] In the 801 graph, when the temperature of the electronic device (100) rises, the control signals (e.g., the first control signal (ctr1), the second control signal (ctr2), the third control signal (ctr3)) may reach a specific voltage level (approximately 1).

[0171] In the 803 graph, when a control signal (e.g., a first control signal (ctr1), a second control signal (ctr2), a third control signal (ctr3)) reaches a specific voltage level, the CC control circuit (260) can be turned on.

[0172] In the 805 graph, when the CC control circuit (260) is turned on, the pull-down resistors (e.g., Rd1, Rd2) can be changed to an open state. When the pull-down resistors (e.g., Rd1, Rd2) are changed to an open state, the electronic device (100) can cut off the power supply from the external electronic device.

[0173] FIG. 9 is a diagram illustrating a foreign substance detection circuit (1050) connected to a USB connector (1010) of an electronic device (100) according to one embodiment of the present disclosure.

[0174] In one embodiment, the USB connector (1010) may include a plurality of VBUS pins, a plurality of SBU pins, and a plurality of grounds (GND). The VBUS pins may include power lines. The electronic device (100) may receive power from an external electronic device or supply power to an external electronic device through the VBUS pins or the VBUS. The SBU pins (sideband use) may include data lines. The electronic device (100) may transmit and receive video signals and / or audio signals to and from the external electronic device through the SBU pins or the SBU pins.

[0175] In one embodiment, if there is a foreign substance (e.g., moisture) in the USB connector (1010), the VBUS pin and the SBU pin may be electrically connected to each other, and a micro voltage may be generated. A multiplexer (1030) connected to the USB connector (1010) may transmit signals input through multiple VBUSs and / or multiple SBUs to the foreign substance detection circuit (1050). The foreign substance detection circuit (1050) may include an analog to digital converter (ADC). The foreign substance detection circuit (1050) may convert a micro voltage generated by a foreign substance (e.g., moisture) in the USB connector (1010) into a digital signal and transmit the digital signal to the processor (210) as a third detection signal (d3).

[0176] Referring to FIGS. 2 and 9, the instructions, when executed by the processor (210), may cause the electronic device (100) to determine the output of the first control signal (ctr1) (e.g., the first control signal (ctr1) of FIG. 2) based on the first detection signal (d1) (e.g., the first detection signal (d1) of FIG. 2) and the third detection signal (d3).

[0177] In one embodiment, the instructions, when executed by the processor (210), may cause the electronic device (100) to output a first control signal (ctr1) when a third detection signal (d3) is received, even if the voltage level of the first detection signal (d1) does not reach a specific voltage level.

[0178] In one embodiment, the instructions, when executed by the processor (210), may cause the electronic device (100) to output a first control signal (ctr1) when the voltage level of the first detection signal (d1) reaches a specific voltage level, if the third detection signal (d3) is not received.

[0179] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0180] In one embodiment, the electronic device (100) may include a USB connector (250), a detection circuit whose output voltage varies depending on temperature, and a CC (configuration channel) control circuit (260) connected between a pull down resistor of the CC (configuration channel) of the USB connector (250) and ground.

[0181] In one embodiment, a sensing circuit (e.g., a second sensing circuit (410) of FIG. 4) can output a first voltage as a first control signal (e.g., a second control signal (ctr2) of FIG. 4) by changing the voltage level according to a temperature change.

[0182] In one embodiment, the CC control circuit (260) may cut off the connection between the pull-down resistor and ground when the voltage level of the first control signal (e.g., the second control signal (ctr2) of FIG. 4) reaches the first level.

[0183] In one embodiment, when the connection between the pull-down resistor and ground is interrupted, the external voltage supplied through the USB connector (250) can be interrupted.

[0184] In one embodiment, the CC control circuit (260) connects between the pull-down resistor and the ground when the voltage level of the first control signal (e.g., the second control signal (ctr2) of FIG. 4) is less than the first level, and when the pull-down resistor and the ground are connected, the CC control circuit (260) can receive an external voltage supplied through the USB connector (250).

[0185] In one embodiment, the sensing circuit (e.g., the second sensing circuit (410) of FIG. 4) may include a thermistor whose resistance value varies with temperature changes.

[0186] In one embodiment, the first voltage may comprise an external voltage supplied via a USB connector (250).

[0187] In one embodiment, a sensing circuit (e.g., a third sensing circuit (510) of FIG. 5) may change a voltage level of a first voltage according to a temperature change and output a first sensing signal (e.g., a second sensing signal (d2) of FIG. 5), and when the voltage level of the first sensing signal (e.g., the second sensing signal (d2) of FIG. 5) reaches a second level, a second control signal (e.g., a third control signal (ctr3) of FIG. 5) may be output.

[0188] In one embodiment, the CC control circuit (260) can disconnect the connection between the pull-down resistor and ground based on the second control signal.

[0189] In one embodiment, the detection circuit (e.g., the third detection circuit (510) of FIG. 5) can block the output of the second control signal (e.g., the third control signal (ctr3) of FIG. 5) when the voltage level of the first detection signal (e.g., the second detection signal (d2) of FIG. 5) is less than the second level.

[0190] In one embodiment, a sensing circuit (e.g., a first sensing circuit (220) of FIG. 2) can output a second sensing signal (e.g., a first sensing signal (d1) of FIG. 2) by changing a voltage level of a second voltage (e.g., a second voltage (V2) of FIG. 2) according to a temperature change.

[0191] In one embodiment, the electronic device (100) may include a memory (120) for storing instructions, and a processor (210).

[0192] In one embodiment, the instructions, when executed by the processor (210), may cause the electronic device (100) to output a third control signal (e.g., the first control signal (ctr1) of FIG. 2) having a particular voltage level when the voltage level of the second detection signal (e.g., the first detection signal (d1) of FIG. 2) reaches a third level.

[0193] In one embodiment, the CC control circuit (260) can disconnect the connection between the pull-down resistor and ground based on a third control signal (e.g., the first control signal (ctr1) of FIG. 2).

[0194] In one embodiment, the instructions, when executed by the processor (210), may cause the electronic device (100) to block output of a third control signal (e.g., the first control signal (ctr1) of FIG. 2) if the voltage level of the second detection signal (e.g., the first detection signal (d1) of FIG. 2) is less than a third level.

[0195] In one embodiment, the electronic device (100) may include a battery (189).

[0196] In one embodiment, the electronic device (100) may include a power control circuit (e.g., power management circuit (188) of FIG. 1B) that outputs a second voltage based on a battery (189).

[0197] In one embodiment, the electronic device (100) may include a foreign object detection circuit (1050) connected to the SBU pin, the VBUS pin, and the ground pin of the USB connector (250).

[0198] In one embodiment, the foreign matter detection circuit (1050) can detect the voltage of the SBU pin, the VBUS pin, and the ground pin, and if the detected voltage is above a certain level, output a third detection signal to the processor (210).

[0199] In one embodiment, the instructions, when executed by the processor (210), may cause the electronic device (100) to control the output of a third control signal (e.g., the first control signal (ctr1) of FIG. 2) based on a second detection signal (e.g., the first detection signal (d1) of FIG. 2) and a third detection signal (e.g., the third detection signal (d3) of FIG. 9), and, when the third detection signal is received, to output a third control signal (e.g., the first control signal (ctr1) of FIG. 2) having a specific voltage level even if the voltage level of the second detection signal (e.g., the first detection signal (d1) of FIG. 2) is less than the third level.

[0200] In one embodiment, a sensing circuit (e.g., the second sensing circuit (410) of FIG. 4) may include a first node outputting a first control signal (e.g., the second control signal (ctr2) of FIG. 4), a first resistor connected between the first node and ground, a first capacitor connected between the first node and ground, and a first thermistor connected between a first voltage and the first node.

[0201] In one embodiment, the sensing circuit (e.g., the third sensing circuit (510) of FIG. 5) may include a second node outputting a second control signal (e.g., the third control signal (ctr3) of FIG. 5), a second capacitor connected between the second node and ground, a second thermistor connected between the second node and ground, a second resistor connected between the first voltage and the second node, and a first switch outputting a second control signal (e.g., the third control signal (ctr3) of FIG. 5) having the same voltage level as the first voltage when the voltage level of the first sensing signal (e.g., the second sensing signal (d2) of FIG. 5) reaches the second level.

[0202] In one embodiment, the sensing circuit (e.g., the first sensing circuit (220) of FIG. 2) may include a third node outputting a second sensing signal (e.g., the first sensing signal (d1) of FIG. 2), a third capacitor connected between the third node and ground, a third thermistor connected between the third node and ground, and a third resistor connected between the second voltage and the third node.

[0203] In one embodiment, the foreign matter detection circuit (1050) may include an analog to digital converter (ADC) that converts the detected voltage change into a third detection signal.

[0204] In one embodiment, a method for controlling power of an electronic device (100) including a USB connector (250) may include an operation of connecting to a CC control circuit (260) of the USB connector (250) and connecting to an external electronic device or a power supply, an operation of checking the CC through the CC control circuit (260) and supplying power through the external electronic device or the power supply, an operation of changing a power level of a first detection signal when the temperature of the electronic device (100) rises while supplying power through the external electronic device or the power supply, an operation of outputting a first detection signal when the power level of the first detection signal exceeds a specific voltage level, an operation of changing a pull-down resistor connected to the CC to an open state based on the first detection signal, and an operation of cutting off power supplied from the external electronic device or the power supply when the pull-down resistor connected to the CC is changed to an open state.

[0205] In one embodiment, a method for controlling power of an electronic device (100) including a USB connector (250) may include: when the temperature of the electronic device (100) decreases, changing a power level of a first detection signal; when the power level of the first detection signal is less than or equal to a specific voltage level, blocking output of the first detection signal; and when the output of the first detection signal is blocked, connecting a pull-down resistor connected to CC to ground.

[0206] In one embodiment, a method for controlling power of an electronic device (100) including a USB connector (250) may include an operation of changing a power level of a second control signal when the temperature of the electronic device (100) rises while being supplied with power through an external electronic device or a power supply device, an operation of changing a pull-down resistor connected to a CC to an open state when the power level of the second control signal exceeds a specific voltage level, an operation of cutting off power supplied from the external electronic device or the power supply device when the pull-down resistor connected to the CC changes to an open state, an operation of changing a power level of the second control signal when the temperature of the electronic device (100) decreases, and an operation of connecting a pull-down resistor connected to the CC to ground when the power level of the second control signal is less than or equal to a specific voltage level.

[0207] In one embodiment, a method for controlling power of an electronic device (100) including a USB connector (250) may include: an operation of changing a power level of a second detection signal when the temperature of the electronic device (100) rises while being supplied with power through an external electronic device or a power supply; an operation of outputting a third control signal when the power level of the second detection signal reaches a specific voltage level; an operation of changing a pull-down resistor connected to a CC to an open state based on the third control signal; an operation of cutting off power supplied from the external electronic device or the power supply when the pull-down resistor connected to the CC changes to an open state; an operation of changing a power level of the second detection signal when the temperature of the electronic device (100) decreases; an operation of cutting off output of a third control signal when the power level of the second detection signal is less than or equal to a specific voltage level; and an operation of connecting a pull-down resistor connected to the CC to ground when the output of the third control signal is cut off.

[0208] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0209] As used herein, the term "if" will be understood to mean "when, upon," "in response to determining," or "in response to detecting," depending on the context. Similarly, "if it is determined to," or "if [the stated condition or event] is detected," will optionally be understood to mean "upon determining," or "in response to determining," "upon detecting [the stated condition or event]," or "in response to detecting [the stated condition or event]."

[0210] The devices described above may be implemented as hardware components, software components, and / or a combination of hardware components and software components. For example, the devices and components described in the embodiments may be implemented using one or more general-purpose computers or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing instructions and responding to them. A processing device (or processing circuit) may execute an operating system (OS) and one or more software applications running on the operating system. In addition, the processing device may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing device is sometimes described as being used alone; however, one of ordinary skill in the art will recognize that the processing device may include multiple processing elements and / or multiple types of processing elements. For example, a processing unit may include multiple processors, or a processor and a controller. Other processing configurations, such as parallel processors, are also possible.

[0211] Software may include a computer program, code, instructions, or a combination of one or more of these, which may configure a processing device to perform a desired operation or may independently or collectively command the processing device. The software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device for interpretation by the processing device or for providing instructions or data to the processing device. The software may also be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored on one or more computer-readable recording media.

[0212] According to one embodiment, the method may be implemented in the form of program instructions that can be executed by various computer means and recorded on a computer-readable medium. The medium may continuously store a computer-executable program or temporarily store it for execution or download. Furthermore, the medium may be a variety of recording or storage means in the form of a single or multiple hardware devices combined. It is not limited to media directly connected to a computer system, but may also be distributed across a network.

[0213] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0214] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0215] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0216] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (126) or an external memory (128)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (110)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0217] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0218] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, USB connector; A sensing circuit whose output voltage varies depending on temperature; It includes a CC (configuration channel) control circuit connected between the pull down resistor of the CC (configuration channel) of the above USB connector and the ground, The above detection circuit The first voltage is output as a first control signal by changing the voltage level according to the temperature change. The above CC control circuit An electronic device that disconnects the connection between the pull-down resistor and the ground when the voltage level of the first control signal reaches the first level.

2. In paragraph 1, An electronic device that blocks external voltage supplied through the USB connector when the connection between the pull-down resistor and the ground is cut off.

3. In paragraph 1, The above CC control circuit If the voltage level of the first control signal is less than the first level, the connection between the pull-down resistor and the ground is made, An electronic device that receives an external voltage supplied through the USB connector when the pull-down resistor and the ground are connected.

4. In paragraph 1, The above detection circuit An electronic device containing a thermistor whose resistance value varies with temperature changes.

5. In paragraph 1, The above first voltage is An electronic device comprising an external voltage supplied through the above USB connector.

6. In paragraph 1, The above detection circuit The first voltage is output as a first detection signal by changing the voltage level according to the temperature change, When the voltage level of the first detection signal reaches the second level, a second control signal is output, If the voltage level of the first detection signal is lower than the second level, the second control signal is output and blocked. The above CC control circuit An electronic device that disconnects the connection between the pull-down resistor and the ground based on the second control signal.

7. In paragraph 1, The above detection circuit The second voltage changes the voltage level according to the temperature change and outputs it as a second detection signal. The above CC control circuit Based on the third control signal, the connection between the pull-down resistor and the ground is cut off, The above electronic device battery; Memory that stores instructions; processor; and A power control circuit for outputting the second voltage based on the battery is included, The above instructions, when executed by the processor, cause the electronic device to: When the voltage level of the second detection signal reaches the third level, a third control signal having a specific voltage level is output, An electronic device that blocks the output of the third control signal when the voltage level of the second detection signal is lower than the third level.

8. In paragraph 7, Further comprising a foreign object detection circuit connected to the SBU pin, VBUS pin and ground pin of the above USB connector, The above foreign substance detection circuit It includes an analog to digital converter (ADC) that changes the detected voltage change into a third detection signal, Detecting the voltage of the SBU pin, the VBUS pin and the ground pin, and if the detected voltage is above a specific level, outputting the third detection signal to the processor; The above instructions, when executed by the processor, cause the electronic device to: Control the output of the third control signal based on the second detection signal and the third detection signal, An electronic device that outputs a third control signal having a specific voltage level when the third detection signal is received, even if the voltage level of the second detection signal is lower than the third level.

9. In paragraph 1, The above detection circuit A first node outputting the first control signal, a first resistor connected between the first node and the ground; a first capacitor connected between the first node and the ground; and An electronic device comprising a first thermistor connected between the first voltage and the first node.

10. In paragraph 6, The above detection circuit A second node outputting the second control signal, a second capacitor connected between the second node and the ground; A second thermistor connected between the second node and the ground; a second resistor connected between the first voltage and the second node; and An electronic device comprising a first switch that outputs a second control signal having the same voltage level as the first voltage when the voltage level of the first detection signal reaches a second level.

11. In paragraph 7, The above detection circuit A third node outputting the second detection signal, a third capacitor connected between the third node and the ground; a third thermistor connected between the third node and the ground; and An electronic device comprising a third resistor connected between the second voltage and the third node.

12. A method for controlling power of an electronic device including a USB connector, An operation connected to the CC control circuit of the above USB connector and connected to an external electronic device or power supply; An operation of confirming CC through the CC control circuit and supplying power through the external electronic device or the power supply device; An operation in which the power level of the first detection signal is changed when the temperature of the electronic device rises while being powered through the external electronic device or the power supply device; An operation of outputting the first detection signal when the power level of the first detection signal exceeds a specific voltage level; An operation of changing the pull-down resistor connected to the CC to an open state based on the first detection signal; and A method comprising an action of cutting off power supplied from the external electronic device or the power supply device when the pull-down resistor connected to the CC changes to an open state.

13. In paragraph 12, An operation in which the power level of the first detection signal changes when the temperature of the electronic device decreases; An operation of blocking the output of the first detection signal when the power level of the first detection signal is less than or equal to a specific voltage level; and A method comprising an action of connecting the pull-down resistor connected to the CC to ground when the output of the first detection signal is blocked.

14. In paragraph 12, An operation in which the power level of the second control signal is changed when the temperature of the electronic device rises while being powered through the external electronic device or the power supply device; An operation of changing the pull-down resistor connected to the CC to an open state when the power level of the second control signal exceeds a specific voltage level; An action of cutting off power supplied from the external electronic device or the power supply when the pull-down resistor connected to the CC changes to an open state; An operation in which the power level of the second control signal is changed when the temperature of the electronic device decreases; and A method comprising an operation of connecting the pull-down resistor connected to CC to ground when the power level of the second control signal is less than or equal to a specific voltage level.

15. In paragraph 12, An operation in which the power level of the second detection signal is changed when the temperature of the electronic device rises while being powered through the external electronic device or the power supply device; An operation of outputting a third control signal when the power level of the second detection signal reaches a specific voltage level; An operation of changing the pull-down resistor connected to the CC to an open state based on the third control signal; An action of cutting off power supplied from the external electronic device or the power supply when the pull-down resistor connected to the CC changes to an open state; An operation in which the power level of the second detection signal changes when the temperature of the electronic device decreases; An operation of blocking the output of the third control signal when the power level of the second detection signal is less than or equal to a specific voltage level; and A method comprising an operation of connecting the pull-down resistor connected to the CC to ground when the output of the third control signal is blocked.

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