Antenna substrate and antenna module including same

Abstract

An antenna substrate according to an embodiment may include: a plurality of wiring layers stacked spaced apart from each other in the vertical direction; a plurality of build-up layers disposed between the plurality of wiring layers; and a plurality of through-electrodes for connecting at least some of the plurality of wiring layers to each other. The antenna substrate may include an antenna region, and the antenna region may include a first build-up layer, a second build-up layer below the first build-up layer, a third build-up layer below the second build-up layer, and a fourth build-up layer below the third build-up layer. The insulation constant (Dk) of the third build-up layer may be greater than the insulation constant of the second build-up layer. The thickness of the third build-up layer may be greater than the thickness of the second build-up layer.

Description

Antenna substrate and antenna substrate module including the same

[0001] The present invention relates to an antenna substrate and an antenna substrate module including the same.

[0002] Recently, efforts are being made to develop improved 5G (5th generation) communication systems or pre-5G communication systems to meet the demand for wireless data traffic.

[0003] 5G offers the advantages of high data speeds and a stable network. 5G frequency bands can be divided into sub-6 GHz and mmWave (e.g., 24 GHz and above). Due to its radio characteristics, the sub-6 GHz range is more suitable for large, low-density cells in suburban areas.

[0004] Achieving high data rates requires significant bandwidth available at high frequencies, such as mmWave. Urban areas with high mobile traffic—those with high demand for capacity per subscriber and a large subscriber base—demand high data rates, leading to a demand for large bandwidth. This requires increasing frequencies up to mmWave, which allows for the use of a large amount of frequency spectrum. Because these frequencies have high path loss and high mobile traffic, dense cellular networks with numerous pico- and femtocells must be deployed to deliver high throughput to a large number of users. To mitigate the impact of mmWave path loss and reduce interference in dense cellular networks, high-gain antennas with narrow beamwidths are necessary.

[0005] Meanwhile, while 5G commercialization is underway worldwide, rapidly increasing data speeds and growing demands for ultra-high-speed communication are accelerating demand and development for 6th-generation wireless communication technologies. 6G wireless communication systems are expected to emerge around 2030, at which point the number of connected devices is expected to increase by 500 billion. 6G is expected to enable ultra-reliable, low-latency communications emphasizing the Internet of Things, the application of artificial intelligence to wireless communications, and enhanced mobile broadband. To meet these demands, communication systems are moving to higher bands, such as millimeter waves and terahertz (THz).

[0006] Furthermore, the antenna substrate that radiates signals having such a frequency band may increase in size, but miniaturization of the antenna substrate is required for mounting in smartphones, etc., and various studies are being conducted to increase the bandwidth of the antenna substrate without increasing the size.

[0007] Patch antennas can support single or multiple frequency bands, and various antenna design techniques and technologies exist. Design factors for patch antennas include patch size, shape, placement, and thickness, all of which can affect the antenna's performance and characteristics.

[0008] Patch antennas are one of the most widely used antennas in the wireless communication field, and can be utilized in various applications due to their advantages such as small size, light weight, low price, and easy installation.

[0009]

[0010] Meanwhile, conventional circuit boards are manufactured by building up insulating materials with high dielectric constants in a vertical direction, and such circuit boards can be applied to various product groups, and in particular, can be applied to AiP (Antenna in Package).

[0011] A conventional circuit board may be composed of a core layer, an upper build-up layer disposed on the core layer, and a lower build-up layer disposed under the core layer, and such a conventional circuit board has a structure in which the upper build-up layer and the lower build-up layer are symmetrical with respect to the core layer.

[0012] However, due to the structure of a circuit board having a symmetrical structure, there is a problem that in order to improve the antenna characteristics, the warpage characteristics are deteriorated as the properties of each build-up layer are different, and in order to improve the warpage characteristics, the antenna characteristics are deteriorated.

[0013]

[0014] One of the technical challenges of the embodiment is to provide an antenna substrate and an antenna substrate module including the same, wherein warpage characteristics and antenna characteristics can be improved together.

[0015] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0016] An antenna substrate according to an embodiment may include a plurality of wiring layers stacked vertically spaced apart from each other, a plurality of build-up layers arranged between the plurality of wiring layers, and a plurality of through electrodes connecting at least some of the plurality of wiring layers to each other.

[0017] The antenna substrate may include an antenna region, and the antenna region may include a first build-up layer, a second build-up layer under the first build-up layer, a third build-up layer under the second build-up layer, and a fourth build-up layer under the third build-up layer.

[0018] The insulation constant (Dk) of the third build-up layer may be greater than the insulation constant of the second build-up layer.

[0019] The thickness of the third build-up layer may be thicker than the thickness of the second build-up layer.

[0020] The insulation constant (Dk) of the third build-up layer may be greater than the insulation constant of the first build-up layer.

[0021] The thickness of the third build-up layer may be thicker than the thickness of the first build-up layer.

[0022] The insulation constant (Dk) of the third build-up layer may be greater than the insulation constant of the fourth build-up layer.

[0023] The thickness of the third build-up layer may be thicker than the thickness of the fourth build-up layer.

[0024] The thickness of the second build-up layer may be thicker than the thickness of the first build-up layer.

[0025] The thickness of the second build-up layer may be thicker than the thickness of the fourth build-up layer.

[0026] The resin content of the third build-up layer may be lower than the resin content of the second build-up layer.

[0027] The second build-up layer may include a 2-1 build-up layer, a 2-2 build-up layer, a core layer, and a 2-3 build-up layer sequentially arranged below the first build-up layer.

[0028] The above 2-3 build-up layer may include a first build-up buffer layer and a second build-up buffer layer sequentially arranged under the core layer.

[0029] The thickness of each of the first build-up buffer layer and the second build-up buffer layer may be half the thickness of the second-third build-up layer.

[0030] The thickness of the core layer of the second build-up layer may be thicker than the thickness of each of the second-first build-up layer, the second-second build-up layer, and the second-third build-up layer.

[0031] The third build-up layer may include a 3-1 build-up layer, a 3-2 build-up layer, a 3-3 build-up layer, and a 3-4 build-up layer sequentially arranged below the second build-up layer.

[0032] The above 3-1 build-up layer, 3-2 build-up layer, 3-3 build-up layer and 3-4 build-up layer may each have the same thickness.

[0033] The thickness of the core layer of the second build-up layer may correspond to the thickness of each of the third-first build-up layer, the third-second build-up layer, the third-third build-up layer, and the third-fourth build-up layer.

[0034]

[0035] Additionally, the antenna substrate module according to the embodiment may include any one of the antenna substrates described above.

[0036] According to an embodiment, an antenna substrate and an antenna substrate module including the same can be provided in which both warpage characteristics and antenna characteristics can be improved.

[0037] For example, in the embodiment, there is a composite technical effect that can prevent the circuit board from being bent in a specific direction while improving the antenna characteristics by relatively lowering the resin content in the third build-up layer, which functions as an antenna, among the first to fourth build-up layers sequentially arranged from top to bottom, and increasing the thickness compared to the other build-up layers.

[0038] The technical effects of the embodiments are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0039]

[0040] Fig. 1 is a cross-sectional view showing a circuit board (200) according to an embodiment.

[0041] Fig. 2 is an exemplary diagram of a first antenna area (200A1) in a circuit board (200) according to an embodiment.

[0042] FIG. 3 is an example diagram of a second antenna area (200A2) in a circuit board (200) according to an embodiment.

[0043] Fig. 4 is an example diagram of a third antenna area (200A3) in a circuit board (200) according to an embodiment.

[0044]

[0045] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0046] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0047] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0048] In addition, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when it is described as “and (and) at least one (or more) of B, C,” it may include one or more of all combinations that can be combined with A, B, and C.

[0049] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0050] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0051] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," it can also include the meaning of a downward direction as well as an upward direction based on one component.

[0052] Hereinafter, an antenna substrate according to an embodiment is described with reference to the attached drawings. Here, the antenna substrate may mean a hybrid antenna substrate, an antenna in package (AIP), an antenna array substrate, an antenna array, etc.

[0053] For convenience, the antenna substrate (100) is described using the Cartesian coordinate system (x-axis, y-axis, z-axis), but it is obvious that it can also be described using other coordinate systems. In addition, according to the Cartesian coordinate system, the x-axis, y-axis, and z-axis are orthogonal to each other, but the embodiment is not limited thereto. That is, the x-axis, y-axis, and z-axis may intersect each other. Hereinafter, for convenience of description, the x-axis direction is referred to as the 'first direction', the y-axis direction is referred to as the 'second direction', the z-axis direction is referred to as the 'third direction' or the 'vertical direction', and at least one of the x-axis direction or the y-axis direction is referred to as the 'horizontal direction'.

[0054]

[0055] (Example)

[0056]

[0057] Fig. 1 is a cross-sectional view showing a circuit board (200) according to an embodiment.

[0058] A circuit board (200) according to an embodiment may include a single or multiple antenna areas (200A).

[0059] An antenna region (200A) according to an embodiment may include an antenna portion and a driving portion (or a routing portion). According to another embodiment, the antenna region (200A) may further include a core portion. According to an embodiment, the core portion may be disposed between the antenna portion and the routing portion. According to another embodiment, the antenna portion and the routing portion may be disposed on the same horizontal plane. According to another embodiment, the routing portion and the antenna portion may be disposed to be spaced apart from each other, and the routing portion and the antenna portion may be electrically connected to each other through a connecting member, such as a solder ball or a metal bump.

[0060]

[0061] Meanwhile, the antenna section may include a plurality of wiring layers (hereinafter referred to as "antenna layers") and an insulation layer (hereinafter also referred to as "antenna insulation layer") that are stacked and spaced apart from each other in the vertical direction. Here, the wiring layer may mean a patch, an antenna patch, a patch antenna, or a patch layer. The plurality of antenna layers may be sequentially stacked on the core section, and the antenna insulation layer may be disposed between the plurality of antenna layers.

[0062] Hereinafter, the antenna area (200A) will be described in detail with reference to FIG. 2.

[0063]

[0064] Referring to FIG. 1, the circuit board (200) of the embodiment includes a build-up insulator including an insulating layer (210) and a build-up wiring body arranged on the build-up insulator. For example, the circuit board (200) of the embodiment may mean that a mounting position of each semiconductor device is predetermined for mounting at least one semiconductor device, and a build-up wiring body connected to the semiconductor device is arranged on the build-up insulator. The build-up wiring body includes a circuit layer (220) arranged on the surface of each insulating layer (210) and a through electrode (230) for vertically connecting each circuit layer (220). The semiconductor device is mounted on the circuit board and can transmit and receive signals through the build-up wiring body.

[0065]

[0066] First, the insulating layer (210) of the circuit board (200) of the embodiment may have a multi-layer structure. For example, the insulating layer (210) may include a first insulating layer (211) and a second insulating layer (212) disposed on the first insulating layer (211).

[0067] At this time, the circuit board (200) of the embodiment may be a core board. For example, the insulating layer (210) may include a third insulating layer (213) disposed between the first insulating layer (211) and the second insulating layer (212). The third insulating layer (213) may be a core layer.

[0068] Accordingly, the circuit board (200) of the embodiment may have a structure in which a first insulating layer (211) and a second insulating layer (212) are laminated in the thickness direction on both sides of a third insulating layer (213).

[0069] Hereinafter, the circuit board (200) of the embodiment is described as a core board, and accordingly, the third insulating layer (213) is a core layer. However, the embodiment is not limited thereto. For example, the circuit board (200) of the embodiment may be a coreless board that does not include a core layer.

[0070] The third insulating layer (213) may be a core layer, the first insulating layer (211) may be a lower insulating layer disposed under the third insulating layer (213), and the second insulating layer (212) may be an upper insulating layer disposed on the third insulating layer (213).

[0071] Each of the first insulating layer (211) and the second insulating layer (212) may have a different thickness from the third insulating layer (213).

[0072] The third insulating layer (213) may include a prepreg. For example, the third insulating layer (213) may increase the physical strength of the circuit board to improve the warpage characteristics of the circuit board. The third insulating layer (213) may have a structure in which a fiber layer in the form of a fabric sheet, such as a glass fabric woven with glass fiber yarn, is impregnated with an epoxy resin or the like. However, the third insulating layer (213) of the embodiment may include a fiber layer in the form of a fabric sheet woven with carbon fiber yarn.

[0073] Specifically, the third insulating layer (213) may include a resin and reinforcing fibers disposed within the resin. The resin may be an epoxy resin, but is not limited thereto.

[0074] Meanwhile, the above glass fiber, carbon fiber, aramid fiber (e.g., an organic material of the aramid series), nylon, an inorganic material of the silica series, or an inorganic material of the titania series can be used.

[0075]

[0076] Next, the circuit board (200) of the embodiment includes a circuit layer (220) disposed on an insulating layer (210). The circuit layer may be referred to as a wiring layer.

[0077] For example, the circuit board (200) may include a first circuit layer (221) disposed on a lower surface of a first insulating layer (211). For example, the circuit board (200) of the embodiment may include a second circuit layer (222) disposed on a upper surface of a second insulating layer (212). In addition, the circuit board (200) of the embodiment may include a third circuit layer (223) disposed between the second insulating layer (212) and the third insulating layer (213), and may include a fourth circuit layer (224) disposed between the first insulating layer (211) and the third insulating layer (213).

[0078] The above circuit layer (220) may be formed using an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi-additive process (SAP).

[0079] Additionally, the circuit layer (220) may be formed of at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn).

[0080] In addition, the circuit layer (220) may be formed of a paste or solder paste containing at least one metal material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding strength.

[0081]

[0082] Next, the circuit board of the embodiment may include a through-hole electrode (230). The through-hole electrode may be referred to as a via electrode.

[0083] Specifically, the through electrode (230) can penetrate the insulating layer (210). Preferably, the through electrode includes a first through electrode (231) penetrating the first insulating layer (211). In addition, the through electrode includes a second through electrode (232) penetrating the second insulating layer (212). In addition, the through electrode may include a third through electrode (233) penetrating the third insulating layer (213).

[0084] The first through-hole electrode (231), the second through-hole electrode (232), and the third through-hole electrode (233) may be positioned within through-holes penetrating the respective insulating layers. For example, the first through-hole electrode (231), the second through-hole electrode (232), and the third through-hole electrode (233) may be formed by filling the through-holes with a conductive material.

[0085] The above through hole may be formed by any one of mechanical, laser, and chemical processing methods. The through hole may be formed by mechanical processing methods such as milling, drilling, and routing. In addition, the through hole may be formed using UV or CO2 laser methods. In addition, the first through hole may be formed by chemical processing using chemicals such as minosilane and ketones.

[0086] When the above through hole is formed, the inside of the through hole can be filled with any one metal material selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd) to form the first through electrode (231), the second through electrode (232), and the third through electrode (233). At this time, the filling of the conductive material can use any one of electroless plating, electrolytic plating, screen printing, sputtering, evaporation, inkjetting, and dispensing, or a combination thereof.

[0087]

[0088] Next, the circuit board (200) of the embodiment includes a protective layer (not shown).

[0089] Specifically, a first protective layer (not shown) may be disposed on the lower surface of the first insulating layer (211). The first protective layer may include at least one opening. Specifically, the first protective layer may include at least one opening that vertically overlaps the first circuit layer (221).

[0090] Additionally, the circuit board may include a second protective layer (not shown) disposed on an upper surface of the second insulating layer (212). The second protective layer may include at least one opening. Specifically, the second protective layer may include at least one opening that vertically overlaps the second circuit layer (222).

[0091] The first protective layer and the second protective layer may include an insulating material. The first protective layer and the second protective layer may include various materials that can be applied and then cured by heating to protect the surfaces of the insulating layer and the circuit layer.

[0092] The first protective layer and the second protective layer may be solder resist layers containing an organic polymer material. For example, the first protective layer and the second protective layer may contain an epoxy acrylate-based resin. Specifically, the first protective layer and the second protective layer may contain a resin, a curing agent, a photoinitiator, a pigment, a solvent, a filler, an additive, an acrylic-based monomer, and the like. However, the embodiment is not limited thereto, and the first protective layer and the second protective layer may of course be any one of a photo solder resist layer, a cover-lay, and a polymer material.

[0093]

[0094] Next, FIG. 2 is an exemplary diagram of a first antenna area (200A1) in a circuit board (200) according to an embodiment.

[0095]

[0096] In a circuit board (200) according to an embodiment, a first antenna region (200A1) may include first to fourth build-up layers (210a, 210b, 210c, 210d) from the top to the bottom. The first to fourth build-up layers (210a, 210b, 210c, 210d) may be a plurality of insulating layers that are stacked and spaced apart from each other in the vertical direction, and may be 'antenna insulating layers'.

[0097] In the following example, the second build-up layer (210b) is described as functioning as a 'routing section' and the third build-up layer (210c) is described as functioning as an 'antenna section', but the example is not limited thereto. For example, the antenna section may be located at the very top or the very bottom.

[0098] In addition, the first antenna region (200A1) may include first to fourth wiring layers (210ma, 210mb, 210mc, 210md) that are stacked and spaced apart from each other in the vertical direction, and the first to fourth wiring layers (210ma, 210mb, 210mc, 210md) may be 'antenna layers'.

[0099] The first to fourth wiring layers (210ma, 210mb, 210mc, 210md) may refer to patches, antenna patches, patch antennas, or patch layers. In addition, the first to fourth wiring layers (210ma, 210mb, 210mc, 210md) may include other configurations such as power supply pads or parasitic pads that supply power to antenna patches, etc.

[0100] The first wiring layer (210ma) may include a first-first wiring layer (210ma1) and a first-second wiring layer (210ma2). In addition, the second wiring layer (210mb) may include a second-first wiring layer (210mb1), a second-second wiring layer (210mb2), a second-third wiring layer (210mb3), and a second-fourth wiring layer (210mb3). In addition, the third wiring layer (210mc) may include a third-first wiring layer (210mc1), a third-second wiring layer (210mc2), a third-third wiring layer (210mc3), and a third-fourth wiring layer (210mc4). In addition, the fourth wiring layer (210md) may include a fourth-first wiring layer (210md1) and a fourth-second wiring layer (210md2).

[0101] As shown in FIG. 2, each of the first to fourth build-up layers (210a, 210b, 210c, 210d) can be placed between the first to fourth wiring layers (210ma, 210mb, 210mc, 210md), which are multiple antenna layers.

[0102]

[0103] In the embodiment, the first to fourth build-up layers (210a, 210b, 210c, 210d) may have different insulating materials and thus may have different physical properties.

[0104] For example, by controlling the amount of resin, each build-up layer can have different properties.

[0105] Additionally, an example of the above properties may include CTE.

[0106] For example, the first build-up layer (210a) may have a first property, the second build-up layer (210b) may have a second property different from the first property, the third build-up layer (210c) may have a third property different from the first and second properties, and the fourth build-up layer (210d) may have a fourth property different from the first to third properties.

[0107]

[0108] For example, the first build-up layer (210a), the second build-up layer (210b), and the fourth build-up layer (210d) may include a Low Dk insulating layer, and the third build-up layer (210c) may include a High Dk insulating layer, but is not limited thereto.

[0109] In an embodiment, the low Dk insulating layer may have a dielectric constant (Dk) of about 6 or less, preferably 3 to 4, but is not limited thereto.

[0110] Additionally, in the embodiment, the High Dk insulating layer may have a dielectric constant (Dk) of about 7 or more, preferably 9 or more, but is not limited thereto.

[0111]

[0112] The first build-up layer (210a) may include each Low Dk insulating layer. For example, the first build-up layer (210a) may include PPG, but is not limited thereto.

[0113] The first thickness (T1) of the first build-up layer (210a) may have a thickness of about 40 ㎛ or less, preferably about 20 to 30 ㎛.

[0114] In addition, the first build-up layer (210a) may include multiple layers. For example, the first build-up layer (210a) may include a 1-1 build-up layer (210a1) and a 1-2 build-up layer (210a2). The first thickness (T1) of each of the 1-1 build-up layer (210a1) and the 1-2 build-up layer (210a2) may be about 40 μm or less, preferably about 20 to 30 μm.

[0115]

[0116] Next, the second build-up layer (210b) may include each Low Dk insulating layer. For example, the second build-up layer (210b) may include PPG, but is not limited thereto.

[0117] For example, the second build-up layer (210b) may include, but is not limited to, a plurality of Low Dk PPG insulating layers.

[0118] The second thickness (T2) of the second build-up layer (210b) may be greater than the first thickness (T1) of the first build-up layer (210a).

[0119] The second build-up layer (210b) may include multiple layers. For example, the second build-up layer (210b) may include a 2-1 build-up layer (210b1), a 2-2 build-up layer (210b2), a core layer (210bc), and a 2-3 build-up layer (210b3).

[0120] The second thickness (T2) of each of the above-mentioned 2-1 build-up layer (210b1), 2-2 build-up layer (210b2), and 2-3 build-up layer may be about 50 ㎛ or more, preferably about 60 to 80 ㎛, but is not limited thereto.

[0121] The second build-up layer (210b) may include a core layer (210bc). The core layer (210bc) may include, but is not limited to, a copper cladding layer (CCL).

[0122] The thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may be thicker than the second thickness (T2) of each of the second-first build-up layer (210b1), the second-second build-up layer (210b2), and the second-third build-up layer, thereby improving the rigidity of the circuit board.

[0123] In addition, the thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may correspond to the third thickness (T3) of each layer of the third build-up layer (210c) described later, but is not limited thereto.

[0124] The thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may be about 80 ㎛ or more, preferably about 90 to 110 ㎛, but is not limited thereto.

[0125]

[0126] Additionally, although not illustrated in the embodiment, each of the routing section and the antenna section may include a transmission line. Current supplied through the port may be fed to a corresponding antenna layer among the plurality of antenna layers through the transmission lines arranged in the routing section and the antenna section.

[0127] For example, in the embodiment, the core layer (210bc) of the second build-up layer (210b) may function as a transmission line, but is not limited thereto.

[0128]

[0129] If each second thickness (T2) of the second build-up layer (210b) exceeds 80 μm (excluding the core layer), the overall thickness of the circuit board (200) may increase, thereby increasing the thickness of the semiconductor package. In addition, if the thickness of the second build-up layer (210b) exceeds 80 μm, the thickness of the circuit layer and the thickness of the through electrode may increase correspondingly. In addition, if the thickness of the circuit layer and the thickness of the through electrode increase, it may be difficult to implement miniaturization, which may reduce the circuit integration, and the signal transmission distance may increase, which may increase signal transmission loss.

[0130] In addition, if each second thickness (T2) of the second build-up layer (210b) exceeds 80 μm, the second build-up layer (210b) of the circuit board may not satisfy the required properties. The required properties may include at least one of the dielectric constant, dielectric loss, thermal expansion coefficient, and glass transition temperature required for the second build-up layer (210b).

[0131]

[0132] Next, the third build-up layer (210c) can function as an antenna unit.

[0133] Accordingly, the third build-up layer (210c) may be formed of an insulating material having a high dielectric constant (High Dk). For example, the third build-up layer (210c) may include PPG, but is not limited thereto.

[0134] At this time, the higher the resin content in the third build-up layer (210c), the more severe warpage of the circuit board may occur.

[0135] Therefore, in the embodiment, there is a special technical effect that can prevent the circuit board from being significantly bent in a specific direction while improving the antenna characteristics by increasing the thickness while lowering the resin content in the third build-up layer (210c).

[0136]

[0137] In an embodiment, each of the first to fourth build-up layers (210a, 210b, 210c, 210d) may have different thicknesses.

[0138] Among these, the third build-up layer (210c) may have the largest thickness to prevent the circuit board from bending while improving antenna characteristics.

[0139] And, based on the thickness, the second build-up layer (210b), the first build-up layer (210a), and the fourth build-up layer (210d) may be provided in that order, but are not limited thereto.

[0140]

[0141] The thickness of each layer of the third build-up layer (210c) may range from 300% to 600% of the thickness of each layer of the first build-up layer (210a) and the fourth build-up layer (210d).

[0142]

[0143] The Low Dk PPG of the second build-up layer (210b) may have a thickness in the range of 50% to 85% of the thickness of the third build-up layer (210c), and may have a thickness in the range of 250% to 350% of the thickness of the first build-up layer (210a) or the fourth build-up layer (210d), but is not limited thereto.

[0144]

[0145] The third thickness (T3) of the third build-up layer (210c) may be greater than the second thickness (T2) of the third build-up layer (210b).

[0146] The third build-up layer (210c) may include multiple layers. For example, the third build-up layer (210c) may include, but is not limited to, a 3-1 build-up layer (210c1), a 3-2 build-up layer (210c2), a 3-3 build-up layer (210c3), and a 3-4 build-up layer (210c4).

[0147]

[0148] The third thickness (T3) of each of the above-mentioned 3-1 build-up layer (210c1), 3-2 build-up layer (210c2), 3-3 build-up layer (210c3), and 3-4 build-up layer (210c4) may be about 80 ㎛ or more, preferably about 90 to 110 ㎛, but is not limited thereto.

[0149]

[0150] If the resin content in the third build-up layer (210c) is high, warpage of the circuit board may become more severe.

[0151] Therefore, in the embodiment, there is a special technical effect that can prevent the circuit board from being significantly bent in a specific direction while improving the antenna characteristics by increasing the thickness while lowering the resin content in the third build-up layer (210c).

[0152]

[0153] For example, if each third thickness (T3) of the third build-up layer (210c) is less than 80 μm, the rigidity of the circuit board may be reduced. Furthermore, as the performance of semiconductor packages progresses, the number of insulating layers of the circuit board is also increasing. For example, the number of insulating layers of the circuit board may be 10 or more, 12 or more, 16 or more, or 20 or more. In addition, as the number of insulating layers of the circuit board increases, warping of the circuit board must be minimized.

[0154] And if each third thickness (T3) of the third build-up layer (210c) is less than 80 μm, it is difficult to prevent the circuit board from warping, and thus the quality of the circuit board may deteriorate. For example, if the circuit board warps, it may be difficult to form the through electrode included in the circuit board at the correct position, and antenna performance may also deteriorate.

[0155] In addition, if the circuit board is bent, problems such as the position of the semiconductor elements being misaligned during the process of mounting the semiconductor elements on the circuit board may occur.

[0156]

[0157] Next, the fourth build-up layer (210d) may include a low Dk insulating layer. For example, the fourth build-up layer (210d) may include PPG, but is not limited thereto.

[0158] The fourth thickness (T4) of the fourth build-up layer (210d) may have a thickness of about 40 ㎛ or less, preferably about 20 to 30 ㎛, but is not limited thereto.

[0159]

[0160] (Example 2)

[0161] Next, FIG. 3 is an example diagram of a second antenna area (200A2) in a circuit board (200) according to an embodiment.

[0162] The second antenna area (200A2) of the embodiment may adopt the technical features of the first antenna area (200A1) described above.

[0163] For example, the second antenna area (200A2) of the embodiment may include first to fourth build-up layers (210a, 210b, 210c, 210d) from the top to the bottom.

[0164] The first to fourth build-up layers (210a, 210b, 210c, 210d) may be a plurality of insulating layers stacked vertically spaced apart from each other, and may be 'antenna insulating layers'.

[0165] In addition, the second antenna region (200A2) may include first to fourth wiring layers (210ma, 210mb, 210mc, 210md) that are vertically spaced apart from each other and stacked, and the first to fourth wiring layers (210ma, 210mb, 210mc, 210md) may be 'antenna layers'.

[0166] The above first to fourth wiring layers (210ma, 210mb, 210mc, 210md) may also mean a patch, an antenna patch, a patch antenna, or a patch layer.

[0167] Each of the first to fourth build-up layers (210a, 210b, 210c, 210d) may be placed between the first to fourth wiring layers (210ma, 210mb, 210mc, 210md), which are multiple antenna layers.

[0168]

[0169] In the embodiment, the first to fourth build-up layers (210a, 210b, 210c, 210d) may have different insulating materials and thus may have different physical properties.

[0170] For example, the first build-up layer (210a), the second build-up layer (210b), and the fourth build-up layer (210d) may include a Low Dk insulating layer, and the third build-up layer (210c) may include a High Dk insulating layer, but is not limited thereto.

[0171] The first build-up layer (210a) may include each Low Dk insulating layer. For example, the first build-up layer (210a) may include PPG, but is not limited thereto.

[0172]

[0173] Next, the second build-up layer (210b) may include each Low Dk insulating layer. For example, the second build-up layer (210b) may include PPG, but is not limited thereto.

[0174] For example, the second build-up layer (210b) may include, but is not limited to, a plurality of Low Dk PPG insulating layers.

[0175] The second thickness (T2) of the second build-up layer (210b) may be greater than the first thickness (T1) of the first build-up layer (210a).

[0176] The second build-up layer (210b) may include multiple layers. For example, the second build-up layer (210b) may include a 2-1 build-up layer (210b1), a 2-2 build-up layer (210b2), a core layer (210bc), and a 2-3 build-up layer (210b3).

[0177] The second thickness (T2) of each of the above-mentioned 2-1 build-up layer (210b1), 2-2 build-up layer (210b2), and 2-3 build-up layer may be about 50 ㎛ or more, preferably about 60 to 80 ㎛, but is not limited thereto.

[0178] The second build-up layer (210b) may include a core layer (210bc). The core layer (210bc) may include, but is not limited to, a copper cladding layer (CCL).

[0179] The thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may be thicker than the second thickness (T2) of each of the second-first build-up layer (210b1), the second-second build-up layer (210b2), and the second-third build-up layer, thereby improving the rigidity of the circuit board.

[0180] In addition, the thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may correspond to the third thickness (T3) of each layer of the third build-up layer (210c) described later, but is not limited thereto.

[0181] The thickness (T2C) of the core layer (210bc) of the second build-up layer (210b) may be about 80 ㎛ or more, preferably about 90 to 110 ㎛, but is not limited thereto.

[0182]

[0183] Although not illustrated in the embodiment, each of the routing section and the antenna section may include a transmission line. Current supplied through the port may be fed to a corresponding antenna layer among the plurality of antenna layers through the transmission lines arranged in the routing section and the antenna section.

[0184] For example, in the embodiment, the core layer (210bc) of the second build-up layer (210b) may function as a transmission line, but is not limited thereto.

[0185]

[0186] Meanwhile, in the second antenna area (200A2) of the embodiment, a buffer layer capable of alleviating bending of the circuit board can be placed on one of the second build-up layers (210b) based on the direction in which the circuit board bends.

[0187]

[0188] For example, the 2nd-3rd build-up layer (210b3) located between the 2nd build-up layer (210b) and the 3rd build-up layer (210c) can function as a buffer layer.

[0189] For example, the 2-3 build-up layer (210b3) may include a first build-up buffer layer (201b23a) and a second build-up buffer layer (201b23b).

[0190] The thickness of each of the first build-up buffer layer (201b23a) and the second build-up buffer layer (201b23b) may be half the thickness of the second thickness (T2) of the second-third build-up layer (210b3).

[0191] For example, the 2-3 build-up layer (210b3) may include a first build-up buffer layer (201b23a) and a second build-up buffer layer (201b23b), each having a thickness that is half the thickness of the second thickness (T2).

[0192] Accordingly, the second antenna area (200A2) of the embodiment has a special technical effect that can further prevent the circuit board from being bent in a specific direction while satisfying the required characteristics that the second build-up layer (210b) must have.

[0193]

[0194] Next, the third build-up layer (210c) can function as an antenna section. Accordingly, the third build-up layer (210c) can be formed of an insulating material having a high dielectric constant (High Dk). For example, the third build-up layer (210c) can include PPG, but is not limited thereto.

[0195] In an embodiment, each of the first to fourth build-up layers (210a, 210b, 210c, 210d) may have different thicknesses, and among them, the third build-up layer (210c) may have the largest thickness to prevent the circuit board from bending while improving antenna characteristics.

[0196] The third thickness (T3) of the third build-up layer (210c) may be greater than the second thickness (T2) of the third build-up layer (210b).

[0197] The third build-up layer (210c) may include multiple layers. For example, the third build-up layer (210c) may include, but is not limited to, a 3-1 build-up layer (210c1), a 3-2 build-up layer (210c2), a 3-3 build-up layer (210c3), and a 3-4 build-up layer (210c4).

[0198] The third thickness (T3) of each of the above-mentioned 3-1 build-up layer (210c1), 3-2 build-up layer (210c2), 3-3 build-up layer (210c3), and 3-4 build-up layer (210c4) may be about 80 ㎛ or more, preferably about 90 to 110 ㎛, but is not limited thereto.

[0199] If the resin content in the third build-up layer (210c) is high, warpage of the circuit board may become more severe.

[0200] Therefore, in the embodiment, there is a special technical effect that can prevent the circuit board from being significantly bent in a specific direction while improving the antenna characteristics by increasing the thickness while lowering the resin content in the third build-up layer (210c).

[0201]

[0202] Next, the fourth build-up layer (210d) may include a low Dk insulating layer. For example, the fourth build-up layer (210d) may include PPG, but is not limited thereto.

[0203] The fourth thickness (T4) of the fourth build-up layer (210d) may have a thickness of about 40 ㎛ or less, preferably about 20 to 30 ㎛, but is not limited thereto.

[0204]

[0205]

[0206] Next, FIG. 4 is an example diagram of a third antenna area (200A3) in a circuit board (200) according to an embodiment.

[0207] The above third antenna region (200A3) can adopt the characteristics of the first antenna region (200A1) or the second antenna region (200A2) described above, and the characteristics of the third antenna region (200A3) will be described below.

[0208]

[0209] The circuit board of the embodiment is provided with a plurality of layers, and the plurality of layers may include an asymmetrical structure with respect to each other.

[0210] For example, the third antenna region (200A3) may include, from above, an RF layer (RF), a first signal feedline layer (FL1), an antenna layer (200a), and a second signal feedline layer (FL2).

[0211] Each of the RF layer (RF), the first signal feedline layer (FL1), the antenna layer (200a), and the second signal feedline layer (FL2) of the third antenna area (200A3) according to the embodiment may correspond to the first build-up layer (210a), the second build-up layer (210b), the third build-up layer (210c), and the fourth build-up layer (210d) of FIG. 2 or FIG. 3.

[0212] For example, the RF layer (RF) of the third antenna area (200A3) according to one embodiment may correspond to the first build-up layer (210a) in the embodiment of FIG. 2 or 3, the first signal feedline layer (FL1) may correspond to the second build-up layer (210b) in the embodiment of FIG. 2 or 3, the antenna layer (200a) may correspond to the third build-up layer (210c) in the embodiment of FIG. 2 or 3, and the second signal feedline layer (FL2) may correspond to the fourth build-up layer (210d) in the embodiment of FIG. 2 or 3.

[0213] In an embodiment, the RF layer (RF), the first signal feedline layer (FL1), the antenna layer (200a), and the second signal feedline layer (FL2) may each include different insulating materials and thus have different physical properties.

[0214] For example, the RF layer (RF), the first signal feedline layer (FL1) and the second signal feedline layer (FL2) may include a Low Dk insulating layer, and the antenna layer (200a) may include a High Dk insulating layer, but is not limited thereto.

[0215] In the embodiment, each of the insulating layers of the RF layer (RF), the first signal feedline layer (FL1), the antenna layer (200a), and the second signal feedline layer (FL2) may be respectively arranged between the fifth to eighth wiring layers (not shown), which are a plurality of antenna layers.

[0216]

[0217] In the embodiment, the RF layer (RF), the first signal feedline layer (FL1), the antenna layer (200a), and the second signal feedline layer (FL2) may each have different thicknesses, but are not limited thereto.

[0218] For example, the thickness of each of the first and second signal feedline layers (FL1, FL2) may be greater than the thickness of the RF layer (RF). For example, the thickness of the RF layer (RF) and the thickness of the first and second signal feedline layers (FL1, FL2) may have a ratio of 1:3 to 1:6, but is not limited thereto.

[0219] Additionally, the thickness of the antenna layer (200a) may be thicker than the thickness of the RF layer (RF). For example, the thickness of the RF layer (RF) and the thickness of the antenna layer (200a) may have a ratio of 1:7 to 1:14.

[0220] Additionally, the thickness of the antenna layer (200a) may be greater than the thicknesses of each of the first and second signal feedline layers (FL1, FL2). For example, the thicknesses of each of the first and second signal feedline layers (FL1, FL2) and the thickness of the antenna layer (200a) may have a ratio of 1:2 to 1:4.

[0221] Additionally, the antenna layer (200a) may be provided with a plurality of insulating layers having different thicknesses. For example, the antenna layer (200a) may include a first antenna layer (200a1), a second antenna layer (200a2), and a third antenna layer (200a3) arranged from top to bottom. The thickness of the second antenna layer (200a2) may be thicker than that of the first antenna layer (200a1) or the third antenna layer (200a3).

[0222] Through this, the third antenna area (200A3) has a technical effect of preventing the circuit board from being significantly bent in a specific direction while improving the antenna characteristics.

[0223]

[0224] Meanwhile, although the third build-up layer (210c) or antenna layer (200a) of FIGS. 2 to 4 is illustrated and described as being arranged in the middle of the circuit board, the present disclosure is not limited thereto. For example, the third build-up layer (210c) or antenna layer (200a) may be arranged at the top or bottom of the circuit board. In addition, in this case, depending on the embodiment, either the second build-up layer (210b) or the fourth build-up layer (210d) may be omitted, or either the first signal feedline layer (FL1) or the second signal feedline layer (FL2) may be omitted.

[0225]

[0226] The antenna substrate and antenna substrate module according to the above-described embodiment can be applied to modules for mobile devices, base stations, repeaters, etc. to enable short-range or medium-range ultra-high-speed broadband communication of mobile devices and mobility devices, but the embodiment is not limited to a specific application example.

[0227]

[0228] Although the above description focuses on examples, these are merely examples and do not limit the present invention. Those skilled in the art will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present invention. For example, each component specifically shown in the examples can be modified and implemented. In addition, differences related to such modifications and applications should be construed as being included within the scope of the present invention defined in the appended claims.

Claims

1. On the antenna substrate, A plurality of wiring layers stacked vertically spaced apart from each other; a plurality of build-up layers arranged between the plurality of wiring layers; and comprising a plurality of through electrodes connecting at least some of the plurality of wiring layers to each other; The above antenna substrate includes an antenna area, The above antenna area is 1st build-up layer; A second build-up layer beneath the first build-up layer; a third build-up layer below the second build-up layer; and A fourth build-up layer is included below the third build-up layer; The insulation constant (Dk) of the third build-up layer is greater than the insulation constant of the second build-up layer, The thickness of the third build-up layer is thicker than the thickness of the second build-up layer. Antenna board.

2. In paragraph 1, The insulation constant (Dk) of the third build-up layer is greater than the insulation constant of the first build-up layer, An antenna substrate wherein the thickness of the third build-up layer is thicker than the thickness of the first build-up layer.

3. In paragraph 1, The insulation constant (Dk) of the third build-up layer is greater than the insulation constant of the fourth build-up layer, An antenna substrate wherein the thickness of the third build-up layer is thicker than the thickness of the fourth build-up layer.

4. In paragraph 1, An antenna substrate wherein the thickness of the second build-up layer is thicker than the thickness of the first build-up layer.

5. In paragraph 1, An antenna substrate wherein the thickness of the second build-up layer is thicker than the thickness of the fourth build-up layer.

6. In paragraph 1, An antenna substrate, wherein the resin content of the third build-up layer is lower than the resin content of the second build-up layer.

7. In paragraph 1, The above second build-up layer is, An antenna substrate comprising a 2-1 build-up layer, a 2-2 build-up layer, a core layer, and a 2-3 build-up layer sequentially arranged below the first build-up layer.

8. In paragraph 7, The above 2-3 build-up layers are: An antenna substrate comprising a first build-up buffer layer and a second build-up buffer layer sequentially arranged under the core layer.

9. In paragraph 8, The thickness of each of the first build-up buffer layer and the second build-up buffer layer is An antenna substrate having a thickness that is half the thickness of the above 2-3 build-up layer.

10. In paragraph 7, The thickness of the core layer of the second build-up layer is An antenna substrate thicker than the thickness of each of the 2-1 build-up layer, the 2-2 build-up layer, and the 2-3 build-up layer.

11. In paragraph 7, The above third build-up layer It includes a 3-1 build-up layer, a 3-2 build-up layer, a 3-3 build-up layer, and a 3-4 build-up layer sequentially arranged below the above 2nd build-up layer, An antenna substrate, wherein the 3-1 build-up layer, the 3-2 build-up layer, the 3-3 build-up layer, and the 3-4 build-up layer each have the same thickness.

12. In paragraph 11, The thickness of the core layer of the second build-up layer is An antenna substrate corresponding to the thickness of each of the 3-1 build-up layer, the 3-2 build-up layer, the 3-3 build-up layer, and the 3-4 build-up layer.

13. An antenna substrate module comprising any one of the antenna substrates of claims 1 to 12.

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