Opto-electronic device

Abstract

An opto-electronic device includes an electronic layer and an opto-mechanics layer. The electronics layer includes a printed circuit board (PCB) and a photodetector on the PCB. The opto-mechanics layer includes a substrate, an optical-input port, and a reflector on the substrate. The substrate is attached to the PCB and has a bottom substrate-surface facing the PCB, a top substrate-surface opposite the bottom substrate-surface, and a beam-aperture between the top substrate-surface and the bottom substrate-surface. The reflector is directly above the photodetector, at least partially covers the beam-aperture, and reflects an optical beam propagating from the optical-input port through the beam-aperture toward the photodetector.

Description

OPTO-ELECTRONIC DEVICECROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 553,585, filed on 14 February 2024 the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND

[0002] Atomic devices (such as atomic clocks and atomic sensors] constitute a class of technology products that can provide high accuracy, high precision, and high sensitivity measurements of electromagnetic fields, radiation, and inertial forces. Typically, atomic devices contain a spectroscopic payload (e.g., a vapor cell containing a gas of atoms or molecules) that is measured using tunable radiation (for microwave clocks or Rydberg sensors this may be an RF to THz signal, for most atomic sensors it is an optical signal / signals). The light is often pre-and post-processed to achieve a specific spectrometer configuration. One example is an atomic magnetometer that measures the polarization rotation of a laser beam detuned from resonance to measure the magnetic field via the Faraday effect. To miniaturize systems, it is often desirable to arrange optics, (the spectroscopy payload) photoreceivers, and electronics in a small enclosure.

[0003] All of these devices, when packaged into a product, require the precise cooperation of an assembly of components. The arrangement of these parts precisely within an assembly often entails the use of active alignment where small parts are joined to the assembly using adhesive bonding to fix them in place on an "optical breadboard,” which may just be a flat plate for mechanical location. This packaging step is costly, does not readily permit 3D assembly, and is usually slow, requiring high capital equipment and experienced personnel.SUMMARY OF THE EMBODIMENTS

[0004] Atomic physics packages may be produced that integrate thermal, mechanical, optical, and electrical design with 3D heterogeneous assembly of different components and materials. Optics with low tolerancing positional assembly may be assembled using injection molded components that are assembled and then actively located (such as in CD / DVD players). Optics with tight tolerancing (<200 micronplacement) often require low coefficient of expansion materials, typically ceramics, with micro optics mounted to them using UV-curing adhesives. Ceramics are challenging to machine, increasing cost and complexity. To integrate electronics for photoreceivers, the design often moves away from planar assembly to achieve the required tolerances and features.

[0005] Embodiments disclosed herein include a physics packaging method of fabrication and initial design that allows the planar assembly and integration of micro optics, fiber optics, photoreceivers, electronics, and spectroscopy payloads that is suitable for the rapid, extensible, custom, and scalable production of atomic physics packages. Using UV curable adhesives, designs may be rapidly additively manufactured using heat-resilient and mechanically robust materials with high precision (25-200 micron feature resolution). Improvement of the feature resolution is possible with elastic averaging whereby multiple low-tolerance features in conjunction can improve the average location accuracy of inserted parts. Additional improvements of location resolution enhancement may be achieved using flexures.

[0006] In a first aspect, an opto-electronic device includes an electronic layer and an opto-mechanics layer. The electronics layer includes a printed circuit board (PCB) and a photodetector on the PCB. The opto-mechanics layer includes a substrate, an optical-input port, and a reflector on the substrate. The substrate is attached to the PCB and has a bottom substrate-surface facing the PCB, a top substrate-surface opposite the bottom substrate-surface, and a beam-aperture between the top substrate-surface and the bottom substrate-surface. The reflector is directly above the photodetector, at least partially covers the beam-aperture, and reflects an optical beam propagating from the optical-input port through the beam-aperture toward the photodetector.BRIEF DESCRIPTION OF THE FIGURES

[0007] FIG. 1A is a cross-sectional view of an opto-electronic device that includes an electronics layer and an opto-mechanics layer. FIGs. IB and 1C are plan views of the opto-mechanics layer and the electronics layer, respectively.

[0008] FIGs. 2A-2C depict schematics of an opto-electric device that includes an electronics layer and an optomechanics layer, in an embodiment.

[0009] FIG. 3 is a drawing of an optomechanics layer, which is an example of the optomechanics layer of FIGs. 2A and 2B.

[0010] FIG. 4 is a schematic of an optics substrate, which is an example of a substrate of the opto-mechanics layer of the device of FIGs. 1A-1C.

[0011] FIG. 5 is a PCB layout oi a PCB of the opto-electronic device of FIGs. 2 A- 2C, in an embodiment.

[0012] FIG. 6 includes photographic examples of 3D printed microfluidic wicking structures of an example substrate of the opto-mechanics layer of the device of FIGs. 1A-1C.DETAILED DESCRIPTION OF EMBODIMENTS

[0013] FIG. 1A is a cross-sectional view of an opto-electronic device 100 that includes an electronics layer 101 and an opto-mechanics layer 102. FIGs IB and 1C are plan views of opto-mechanics layer 102 and electronics layer 101, respectively. The cross-sectional view of FIG. 1A is in a cross-sectional plane 1-1' shown in FIGs. IB and 1C. A technical benefit of stacking PCB 110 to substrate 130 as in opto-electronic device 100 is that their proximity increases bandwidth and integration density.

[0014] Electronics layer 101 includes a printed circuit board (PCB) 110. On PCB 110, electronics layer 101 may include at least one of a light source 121, a photodetector 127, a perturbator 160, and a photodetector 128. Perturbator 160 may include at least one of a microheater, an RF transmitter, a radiating field generator and a static field generator.

[0015] Opto-mechanics layer 102 includes a substrate 130, and opto-mechanics 150. One or more of opto-mechanics 150 may be mechanically attached (e.g., snap- fitted) or adhesively bonded to substrate 130. Opto-mechanics 150 includes at least one of an optical-input port 151, pre-cell optics 154, a beamsplitter 156, a reflector 157, post-cell optics 158, and reflector 159. Substrate 130 is attached to PCB 110 and has a bottom substrate-surface 131 facing PCB 110, a top substrate-surface 139 opposite bottom substrate-surface 131. At least part of bottom substrate-surface 131 may be between PCB 110 and top substrate-surface 139.

[0016] Substrate 130 has a beam-aperture 135a between bottom substratesurface 131 and top sub str ate -surface 139. An interior surface 135 of substrate 130spans between surfaces 131 and 139 and defines beam-aperture 135a. Substrate 130 may also include at least one of a cell-aperture 136a and an additional beam-aperture 137a, which are defined, respectively, by interior surfaces 136 and 137 that each span between substrate-surfaces 131 and 139.

[0017] Optics substrate 130 may be monolithic, that is, integrally formed of a single piece of material. For example, optics substrate 130 may be an additively manufactured part, such as a 3D printed part. Optical input port 151 may be integrally formed with optics substrate 130.

[0018] In embodiments, substrate 130 has a material composition that includes at least one of the following: a resin, polyurethane, thermoplastic elastomeric materials, powdered metal, powdered polymer, acrylonitrile butadiene styrene, acrylic styrene acrylonitrile, acrylonitrile styrene acrylate, polypropylene, polylactic acid, carbon fiber, aromatic polyamide, fiberglass, nylon, polystyrene (high impact or otherwise), polyethylene terephthalate glycol, polycarbonate, polyvinyl alcohol, polylactic acid, and polyethylene terephthalate.

[0019] Reflector 159 is on substrate 130, directly above photodetector 128, and at least partially covers beam-aperture 135a. Reflectors 157 and 159 may be either a mirror or a prism, in which case the optical beam incident thereon may exhibit totalinternal reflection within the prism. Reflector 159 has a surface 159s, at least part of which may be directly above photodetector 128. When reflector 159 is a mirror, surface 159s maybe a reflective surface.

[0020] FIGs. 1A and IB denote an optical beam 190 propagating that exits optical-input port 151 and an optical beam 199 reflected by reflector 159 through beam-aperture 135a toward photodetector 128. Optical beam 199 includes at least part of optical beam 190. FIGs. 1A and IB also denote optical beams 191, 192, 193, 195, 196, each of which include at least part of optical beam 190 and may propagate in a direction substantially parallel to top substrate-surface 139.

[0021] In embodiments, device 100 may include, instead of reflector 159 and photodetector 128, an output optical port, similar to optical input port 151. This output optical port may house a fiber-collimator package that couples the optical beam 196 into an optical fiber for detection and analysis with hardware that is separate from device 100.

[0022] Optical beam 190 may be coupled to optical-input port 151 via different means. For example, optical-input port 151 may include either a fiber-collimator mount 152 or an input reflector 153. Fiber-collimator mount 152 may at least one of: be integrally formed with substrate 130, protrude from a planar region of top substratesurface 139, and include one of a recess and an aperture. The recess or aperture secures a fiber collimator housing oriented in a direction parallel to the planar region. Optical input port 151 may include a collimating lens, e.g., as part of fiber-collimator mount 152.

[0023] When optical-input port 151 includes input reflector 153, electronics layer 101 may include a light source 121 attached to PCB 110. Input reflector 153 may at least partially cover an aperture 138a of substrate 130. Light source 121 emits optical beam 190 that propagates through aperture 138a and toward input reflector 153, which reflects optical beam 190 along an optical path such that at least part of optical beam 190 is incidenton reflector 159 as optical beam 196. Light source 121 may be a laser, such as a VCSEL.

[0024] Opto-electronic device 100 may include a vapor cell 125 attached to PCB 110. Vapor cell 125 extends through cell-aperture 136a into a beam path of optical beam 192 that is incident on vapor cell 125. Optical beam 192 includes at least part of optical beam 190. Vapor cell 125 transmits an optical beam 195, which includes at least part of optical beam 192.

[0025] Opto-mechanics layer 102 may include one or more pre-cell optics 154 between optical-input port 151 and vapor cell 125. Pre-cell optics 154 may include one or more of a polarizer, a waveplate, and a neutral density filter. For example, when precell optics includes, in order of distance from optical-input port 151, a polarizer and a quarter waveplate, opto-electronic device 100 may be used as an atomic magnetometer. The quarter waveplate may be followed by a neutral density filter between the quarter waveplate and vapor cell 125. One or more pre-cell optics 154 transmits optical beam 191, which includes at least part of optical beam 190. Absent pre-cell optics 154, optical beam 190 and 191 may be identical.

[0026] Opto-electronic device 100 may include a beamsplitter 156 on substrate 130. Optical beam 191 is incident on beamsplitter 156, which transmits part of optical beam 191 as optical beam 192. Vapor cell 125 is between beamsplitter 156 andreflector and beamsplitter 156. Absent beamsplitter 156, optical beams 191 and 192 may be identical. Beamsplitter 156 may be a polarizing beamsplitter or a non-polarizing beamsplitter.

[0027] Opto-electronic device 100 may include a reflector 157 on substrate 130, as shown in FIG. IB. Reflector 157 directs optical beam 193 through beam-aperture 137a toward PCB 110. Photodetector 127 may be directly beneath reflector 157 such that optical beam 193 is incident on photodetector 127.

[0028] Opto-mechanics layer 102 may include one or more post-cell optics 158 between reflector 159 and vapor cell 125. Post-cell optics 158 may be attached, e.g., mounted, on substrate 130, and may include at least one of a polarization optical element and a partially reflective optical element. Optical beam 195, transmitted beam vapor cell 125, is incident on post-cell optics 158, which transmits at least part of optical beam 195 as optical beam 196.

[0029] Post-cell optics 158 may include a quarter waveplate 158q followed by a partially-reflecting mirror 158r, which reflects part of optical beam 195 back through the quarter waveplate and toward beamsplitter 156 as a reflected beam 193. Such an embodiment may be used for saturated absorption spectroscopy. When beamsplitter 156 is a polarizing beamsplitter, the double pass through quarter waveplate 158q results in the polarization of reflected beam 193 being orthogonal to that of beam 192. Hence, beamsplitter 156 reflects optical beam 193 toward reflector 157. Additionally or alternatively, post-cell optics 158 may include a filter 158f, which may be a neutraldensity filter.

[0030] Device 100 may include a variable optical attenuator, which may be on either PCB 110 or optics substrate 130. For example, the variable optical attenuator may part of pre-cell optics 154 or post-cell optics 158. The variable optical attenuator may be a liquid crystal plate, electrically connected to PCB 110. When the variable optical attenuator is on PCB 110, device 200 may include optical elements that reflect the optical beam from the above optics substrate 130 down toward PCB 110 and through the variable optical attenuator before being directed back toward the optical path above optics substrate 130. The optical beam may be retroreflected through the variable optical attenuator. The variable optical attenuator may include a material that is one or more of birefringent, optically active, and circularly birefringent (chiral).

[0031] Photodetector 128 may have low noise equivalent power and may have a low bandwidth (e.g., <1 MHz] to achieve a high resolution scan. Such a detector is useful for an initial stage of laser frequency scans that may have large tuning bandwidths. Photodetector 128 may be connected to a log amp with a differential from a monitor photodiode (e.g., 127) to measure absorption directly (e.g., extracting the absorption cross section multiplied by the interaction length and atomic density factor endemic to Beer’s Law). Photodetector 128 may be a split detector with an attenuator in front of one lane of a split beam path to manage input dynamic range powers.

[0032] In embodiments, photodetector 127 produces a higher gain than photodetector 128 to recover smaller hyperfine features. Additionally, FM spectroscopy may be used to recover an error signal which may need high bandwidths in excess of 25 MHz (for a 15-MHz line, the modulation should be ~5-7 MHz and the recovered signal maybe as high as the 3rdharmonic. In such embodiments, 127 may be smaller than photodetector 228 to reduce the shunt capacitance and increase the bandwidth.

[0033] For the speed of assembly, adhesives / epoxies may be flowed to specific locations of optics substrate 130 in specific doses using microfluidic wicking structures and microfluidic reservoirs that maintain the ability to thermally, UV, or time-cure the micro optics, e.g., opto-mechanics 150, into location. These structures may be further modified by using specially chosen adhesives that shrink upon curing or post processing, thereby drawing parts into precision features.

[0034] PCB 110 and optics substrate 130 may be designed thermally to minimize (or enhance) conduction, convection, and radiation between elements (e.g., a hot vapor cell and a cold photodetector). Optics substrate 130 may be attached to PCB 110. Means of said attachment may include mechanical flexures and / or compliant joints / mechanisms, screws / bolts, mechanical locating pins / pegs, and adhesive, such as a low-outgassing adhesive.

[0035] Optics substrate 130 may include one or more of the following features:(1) micro optics and plate optics bonding and location(2) PCB to optics-substrate alignment features(3) collimation package integration and precision alignment(4) flexures with interdigitated fingers and screws for positioning and locking(5) an input microfluidic reservoir for precise dosing of adhesive into microfluidic features(6) a terminal microfluidic reservoir for capturing excess adhesive, which may be formed with features like a weir or a well (that may or may not be deeper than the channels) that use surface tension and volume of adhesive to prevent overflow of adhesive out of microfluidic channels(7) microfluidic wick resistors for timed and metered dispensing to various spots(8) the use of a series of precision ‘posts’ or ‘pedestals’ for elastic averaging and locating to a specific average location with high precision(9) design of the adhesive mount to keep adhesive in some zones but not others for bonding and directing light through(10) adhesive shrinkage used to 'draw in’ parts tightly to a locating feature(11) ‘pockets’ for additional materials that modify the thermal (heat some zones, cool others, apply thermal gradients especially to the vapor cell to keep condensation away from windows), mechanical (stiff, resilient, compliant, through-hole for a rod to improve stiffness, could be under tension), optical (beam blocks, light-tight enclosures), and electrical (e.g., Faraday cage / conductive coating or inclusions, magnetic shield) behaviors(12) The parts may be coated or impregnated with materials that modify the surface adhesion of adhesives locally (i.e., not necessarily total coating may enhance adhesion selectively). The parts may be coated or impregnated to change their electrical, thermal, optical, and mechanical function

[0036] FIGs. 2A, 2B, and 2C depict an opto-electronic device 200 that includes electronics layer 201 and an optomechanics layer 202. Device 200 is an example of opto-electronic device 100 and layers 201 and 202 are examples of layers 101 and 102, respectively. Electronics layer 201 includes a PCB 210, which is an example of PCB 110. Optomechanics layer 202 includes an optics substrate 230, which is an example of optics substrate 230. Example dimensions oflayer 201 are ~1.5 cm x 4 cm.

[0037] FIG. 2A is a top-down depiction of a fiber collimation package (FCP) 281 launching an optical beam 290 into opto-electronic device 200. Optical beam 290 may be generated by a laser.

[0038] On PCB 210, device 200 may include at least one of a photodetector 227 and a photodetector 228, which are respective examples of photodetectors 127 and 128. On optics substrate 230, device 200 includes opto-mechanics 250, which are examples of opto-mechanics 150. Opto-mechanics 250 includes at least one of an optical input port 251, neutral density filter 254, a beamsplitter 256, a microfabricated vapor cell 225, post-cell optics 258, a reflector 259, and a reflector 257, which are respective examples of a pre-cell optic 154, beamsplitter 156, vapor cell 125, and post-cell optics 158. Post-cell optics 258 may include at least one of a quarter waveplate 258q (QWP, A / 4J and a partially transmitting mirror 258r, which are respective examples of waveplate 158q and partially-reflecting mirror 158r.

[0039] In embodiments, after propagating through vapor cell 225, optical beam 290 is incident on partially transmitting mirror 258r. Part of optical beam 290 transmitted by reflector 259 is detected using photodetector 228 for Doppler subtraction. The part of optical beam 290 reflected by mirror 258r is rotated in polarization by 90 degrees, having passed through quarter waveplate 158q twice.

[0040] In opto-electronic device 200, optical beam 290 exits FCB 281, is transmitted through beamsplitter 256 and through vapor cell 225. Part of optical beam 290 is transmitted by mirror 258r and directed down by reflector 259 toward photodetector 228 to observe single photon spectroscopy. Mirror 258r reflects part of optical beam 290 back through waveplate 258q and vapor cell 225 to beamsplitter 256, where it is directed to reflector 257.

[0041] In embodiments, a reflector 257 reflects the light down to electronics layer 201 where it may be measured by photodetector 227 shown in FIG. 2C. For mounting optical components such as the ND filter 254, beamsplitter 256, post-cell optics 258, and reflector 259, optics substrate 230 may include microfluidic inlets for mounting via adhesive injection.

[0042] FIG. 3 is a drawing of an optomechanics layer 302, which is an example of optomechanics layer 102. Optomechanics layer 302 includes a fiber-collimator mount 352, a beamsplitter 356, reflector 357, quarter waveplate 358q, partial reflector 358r, and prism 359, which are respective examples of fiber-collimator mount 152, beamsplitter 156, reflector 157, quarter waveplate 158q, partially-reflecting mirror 158r, and reflector 159. FIG. 3 shows a vapor cell 325 extending through an aperture336a of optomechanics layer 302 Aperture 336a is an example of cell-aperture 136a. Vapor cell 325 is an example ofvapor cell 125.

[0043] FIG. 4 is a schematic of an optics substrate 430 that includes interdigitated structures 432 to enable compliant mechanisms to be adjusted and held in place. Optics substrate 430 is an example of optics substrate 130. Optics substrate 430 has fiber collimator mounts 452(1) and 452(2) that secures a respective fiber collimation package 481(1) and 481(2) therein. Fiber collimator mounts 452 are examples of fiber-collimator mount 152.

[0044] For high-precision alignment below the part tolerance, optics substrate 430 may include compliant mechanisms and flexures for providing micromotion by designing 'springs’ into these structures, using screws or alignment jigs to position the parts precisely, and affixing the deformation using structures such as interdigitated arrays to create a high-surface-area adhesive structure for bonding. Multiple of these structures may be used in sequence to provide a smaller amount of displacement.

[0045] FIG. 5 is an PCB layout of PCB 510, which is an example of PCB 110. A box 512 denotes an example footprint of optics substrate 130 mounted on PCB 510. The right hand side includes amplifiers, transducers, power supply pins, and current sources. Additional blocks may be included. The close proximity can reduce parasitic capacitances, resistances, and inductances, improving the performance of the electronics.

[0046] FIG. 6 includes photographs of example 3D printed microfluidic wicking structures that may be included in embodiments of substrate 130. Note that inlets are visible as circular holes at the bottom edge of the devices. Outlets are not visible.

[0047] In embodiments, fabrication of opto-electronic device 100 may include adhesive bonding of micro-optics to the additively manufactured part(s). Examples of micro-optics that may be bonded by this method include any optical element of optomechanics 150. A fabrication method may include one or more of the following steps.1. Use microfluidic wicks to fill a central reservoir(s) with adhesive. The central reservoir may be part of substrate 130.2. Use microfluidic wicking to deliver adhesives to a micro optic mount, e.g., of substrate 130.3. Fill the micro optic mount with a desired volume of adhesive with a controlled interface that allows light to pass through some portions while still joining the optic to the surface providing ‘grip’ and ‘locating’ structures as well.4. Provide vent and / or drain holes to prevent overflows and allow for controlled and complete filling.5. Provide optical access for UV curing.6. When curing, exploit the shrinkage of the adhesive to draw parts intimately into contact with a surface, e.g., a surface of substrate 130.7. Structures may use elastic averaging to contact a part multiple times with multiple precise surfaces that on average have a higher average location precision than the individual surfaces. Said surfaces may be those of substrate 130.8. Additional precision parts may be mounted flat to pillars, pedestals, walls, etc. (e.g., of substrate 130) such that the normal plane of a plate optic is aligned precisely to the normal plane of the flat feature such that the plate optic is not in contact with corners that may contain bevels or chamfers modifying the location accuracy. The plate optic may be one of opto-mechanics 150.9. Parts, such as one of opto-mechanics 150, may be pressed into their mating receptacle to specific mechanical location points, e.g., of substrate 130, such that intimate contact is achieved using a mating alignment jig.10. A further mitigation may include designing the printed or cast receptacle (e.g., substrate 130) such that the corners have a counter -bevel, insert, or other feature to remove the potential for a bevel to influence the final part location and re-allow the mechanical location of the micro optical components to critical locating points on the receptacle.

[0048] Alternatively, small parts may be secured into location using compliant structures (e.g., a snap joint or snap fitting) and / or locating structures. A lens is an example of such a small part, and may be located to the center of a conical subsection. Plate optics may be aligned to flat surfaces or may be held on their edges or surfaces and be slotted into place. The micro optics may be removably attached to the optics substrate.

[0049] Strain relief is often useful for managing fiber optic components and / or delicate parts. Strain relief elements may be mechanical structures. These mechanicalstructures may also use capillary action to wick adhesive into position to constrain the motion of parts to specific areas avoiding over crimping / clamping / bending. This wicking ability may be engineered for enhanced strain reliefby spatially varying the volume of strain relief viscoelastic adhesive such that a joined region will have a significant amount of adhesive in locations where the component will need to be rigidly held and regions requiring flexibility can have less adhesive. One means of achieving this is to have a conical application of adhesive where the base of the cone (e.g., the most rigidly held region) is applied at the coupling of a wire or fiber and the tip of the cone may be applied some length up the fiber or wire such that the resistance to strain is reduced linearly as distance from the coupling region increases.* * *

[0050] Features described above, as well as those claimed below, may be combined in various ways without departing from the scope hereof. The following enumerated examples illustrate some possible, non-limiting combinations.

[0051] Changes may be made in the above methods and systems without departing from the scope of the present embodiments. It should thus be noted that the matter contained in the above description or shown in the accompanying drawings should be interpreted as illustrative and not in a limiting sense. Herein, and unless otherwise indicated the phrase "in embodiments” is equivalent to the phrase "in certain embodiments,” and does not refer to all embodiments.

[0052] As used in this specification, any appendices thereto, and the appended claims, the singular forms "a,” "an,” and "the” include plural referents unless the content clearly dictates otherwise. It should also be noted that the term "or” is generally employed in its sense including "and / or” unless the content clearly dictates otherwise. Regarding instances of the terms "and / or” and "at least one of,” for example, in the cases of "A and / or B,” "at least one of A and B,” and "at least one of A or B,” such phrasing encompasses the selection of (i) A only, or (ii) B only, or fiiij both A and B. In the cases of "A, B, and / or C, " "at least one of A, B, and C,” and "at least one of A, B, or C,” such phrasing encompasses the selection of (i) A only, or (ii) B only, or (iii) C only, or (iv) A and B only, or (v) A and C only, or (vi) B and C only, or (vii) each of A and B and C. This may be extended for as many items as are listed.

[0053] The following claims are intended to cover all generic and specific features described herein, as well as all statements of the scope of the present method and system, which, as a matter of language, might be said to fall therebetween.

Claims

CLAIMSWe claim:

1. An opto-electronic device, comprising: an electronics layer including a printed circuit board [PCB] and a photodetector on the PCB; and an opto-mechanics layer including:(i) a substrate attached to the PCB and having a bottom substrate-surface facing the PCB, a top substrate-surface opposite the bottom sub str ate -surface, and a beam-aperture between the top substrate-surface and the bottom substrate-surface,(ii) an optical-input port; and(iii ) a reflector on the substrate, directly above the photodetector, and at least partially covering the beam-aperture, that reflects an optical beam propagating from the optical-input port through the beam-aperture toward the photodetector.

2. The opto-electronic device of claim 1, further comprising a vapor cell attached to the PCB that extends through a cell-aperture of the substrate into a beam path of the optical beam.

3. The opto-electronic device of claim 2, the electronics layer further comprising, on the PCB, a perturbator that applies a perturbation to species in the vapor cell, the perturbator including at least one of a microheater, an RF transmitter, a radiating field generator and a static field generator.

4. The opto-electronic device of claim 2, the opto-mechanics layer further comprising a beamsplitter on the substrate that transmits the optical beam, the vapor cell being between the reflector and the beamsplitter.

5. The opto-electronic device of claim 4, the substrate having an additional beamaperture (137a) between the top substrate-surface and the bottom substratesurface, and further comprising: an additional reflector on the substrate that directs an additional optical beam, reflected by the beamsplitter, through the additional beam-aperture toward the PCB; an additional photodetector on the PCB directly beneath the additional reflector such that the additional optical beam is incident on the photodetector.

6. The opto-electronic device of claim 2, the opto-mechanics layer further comprising at least one of a polarization optical element and a partially reflective optical element mounted on the substrate between the reflector and the vapor cell.

7. The opto-electronic device of claim 1, the optical-input port including a fibercollimator mount integrally formed with the substrate.

8. The opto-electronic device of claim 7, the top substrate-surface having a planar region, the fiber-collimator mount being a protrusion of the top substrate-surface that includes one of a recess and an aperture that secures a fiber collimator housing oriented in a direction parallel to the planar region.

9. The opto-electronic device of claim 1, the optical-input port including an input reflector that reflects the optical beam along an optical path that ends at the photodetector, and the electronics layer further comprising: a light source attached to the PCB that emits the optical beam, which propagates toward the input reflector.

10. The opto-electronic device of claim 1, the substrate having a material composition that includes at least one of a resin, polyurethane, thermoplastic elastomeric materials, powdered metal, powdered polymer, acrylonitrile butadiene styrene, acrylic styrene acrylonitrile, acrylonitrile styrene acrylate, polypropylene, polylactic acid, carbon fiber, aromatic polyamide, fiberglass, nylon, polystyrene (high impact or otherwise), polyethylene terephthalate glycol, polycarbonate, polyvinyl alcohol, polylactic acid, and polyethylene terephthalate.

11. The opto-electronic device of claim 1, the bottom substrate-surface being between the printed circuit board and the top substrate-surface.

12. The opto-electronic device of claim 1, the photodetector being directly beneath the reflector.

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