Driving mother board, light-emitting mother board, manufacturing method and light-emitting substrate

Abstract

A driving mother board, having a plurality of light-emitting areas, every two adjacent light-emitting areas having a spacing area therebetween. The driving mother board comprises a substrate mother board, a plurality of bonding pads and at least one support member. The plurality of bonding pads are arranged on the substrate mother board and in the light-emitting areas, and are configured to be connected to light-emitting devices. The at least one support member is arranged on the side of the substrate mother board close to the plurality of bonding pads, the support member being arranged in a spacing area. In a first direction, there is at least one support member of which the size is greater than or equal to the sum of the size of a bonding pad and the size of the light-emitting device connected to the bonding pad, the first direction being perpendicular to the substrate mother board.

Description

Driving motherboard, light-emitting motherboard and preparation method, light-emitting substrate Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a driving motherboard, a light-emitting motherboard and a preparation method thereof, and a light-emitting substrate. Background Art

[0002] Micro LEDs (Micro Light Emitting Diodes) or sub-millimeter LEDs (Mini LEDs) are gaining increasing attention due to their advantages, including high resolution, low power consumption, high brightness, high color saturation, fast response, thinness, long lifespan, and splicing capabilities.

[0003] Summary of the Invention

[0004] In one aspect, a driving motherboard is provided. The driving motherboard has multiple light-emitting areas, with a spacer area between two adjacent light-emitting areas. The driving motherboard includes a substrate motherboard, multiple solder pads, and at least one support member. The multiple solder pads are disposed on the substrate motherboard and disposed in the light-emitting areas; the solder pads are configured to connect to light-emitting devices. At least one support member is disposed on a side of the substrate motherboard near the multiple solder pads; the support member is disposed in the spacer area; along a first direction, at least one of the support members has a size greater than or equal to the sum of the size of the solder pad and the size of the light-emitting device connected to the solder pad; the first direction is perpendicular to the substrate motherboard.

[0005] In some embodiments, the light-emitting colors of the multiple light-emitting devices connected to the multiple pads are the same; the driven motherboard includes multiple support members; the multiple pads in the light-emitting area and the multiple support members in the spacing area adjacent to the light-emitting area are arranged into multiple rows and columns; at least one row includes pads and support members arranged along the second direction; and / or, at least one column includes pads and support members arranged along a third direction; wherein, the second direction intersects with the third direction; along the second direction and / or the third direction, the spacing between two adjacent pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are approximately equal.

[0006] In some embodiments, multiple support members belonging to the same spacer area are connected to form a continuous whole-layer structure.

[0007] In some embodiments, the multiple pads within the light-emitting area include multiple first pads, multiple second pads, and multiple third pads; the first pads are configured to be connected to a red light-emitting device, the second pads are configured to be connected to a blue light-emitting device, and the third pads are configured to be connected to a green light-emitting device; the driving motherboard includes multiple support members, and along the second direction, the multiple support members in the spacing area adjacent to the light-emitting area include multiple first support members, multiple second support members, and multiple third support members; wherein the size of the first support member is larger than the size of the second support member, and the size of the second support member is equal to the size of the third support member.

[0008] In some embodiments, the multiple pads of the light-emitting area are arranged in multiple rows and columns, and each row includes the first pad, the second pad and the third pad arranged along the second direction. In the orthographic projection to the substrate motherboard, the geometric center of the first pad, the geometric center of the second pad and the geometric center of the third pad in each row are located on a first straight line; the multiple support members of the spacing area adjacent to the light-emitting area are arranged in multiple rows and columns, and each row includes the first support member, the second support member and the third support member arranged along the second direction. In the orthographic projection to the substrate motherboard, the geometric center of the first support member, the geometric center of the second support member and the geometric center of the third support member in each row are located on a second straight line; wherein, at least one of the first straight lines coincides with one of the second straight lines and / or there is a gap between the first straight line and the second straight line.

[0009] In some embodiments, at least one first straight line coincides with a second straight line; wherein, along the second direction, the spacing between two adjacent first pads is equal to the spacing between two adjacent first support members; and / or, along the second direction, the spacing between two adjacent second pads is equal to the spacing between two adjacent second support members; and / or, along the second direction, the spacing between two adjacent third pads is equal to the spacing between two adjacent third support members.

[0010] In some embodiments, the geometric center of the orthographic projection of each column of the first solder pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the third straight line and the fourth straight line; and / or, the geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or, the geometric center of the orthographic projection of each column of the third solder pads on the substrate motherboard is located on a seventh straight line, and the geometric center of the orthographic projection of each column of the third support members on the substrate motherboard is located on an eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a gap between the seventh straight line and the eighth straight line.

[0011] In some embodiments, at least one third straight line coincides with a fourth straight line, and along the third direction, the spacing between two adjacent first pads is equal to the spacing between two adjacent first support members; and / or, at least one fifth straight line coincides with a sixth straight line, and along the third direction, the spacing between two adjacent second pads is equal to the spacing between two adjacent second support members; and / or, at least one seventh straight line coincides with an eighth straight line, and along the third direction, the spacing between two adjacent third pads is equal to the spacing between two adjacent third support members.

[0012] In some embodiments, the light-emitting devices connected to the pads belonging to the same column emit the same color, and the multiple support members belonging to the same column are connected to form a strip structure.

[0013] In some embodiments, the support member is elastic, and a size of the support member is larger than the sum of a size of a same type of pad and a size of a light-emitting device connected to the pad.

[0014] In some embodiments, the driving motherboard further has a first peripheral area; the first peripheral area is arranged around the multiple light-emitting areas, and the support member is also arranged in the first peripheral area.

[0015] In another aspect, a light-emitting motherboard is provided. The light-emitting motherboard comprises: a driving motherboard as described in any of the above embodiments; and a plurality of light-emitting devices. The plurality of light-emitting devices are disposed on a side of the driving motherboard that is away from the substrate and has a plurality of solder pads, with one light-emitting device connected to one solder pad.

[0016] On the other hand, a light-emitting substrate is provided. The light-emitting substrate has a light-emitting area and a second peripheral area arranged on at least one side of the light-emitting area. The light-emitting substrate includes a substrate, a plurality of solder pads, a plurality of light-emitting devices and at least one support member. The plurality of solder pads are arranged on the substrate and in the light-emitting area; the plurality of light-emitting devices are arranged on a side of the plurality of solder pads away from the substrate and in the light-emitting area, and one light-emitting device is connected to one solder pad; the at least one support member is arranged on a side of the substrate close to the plurality of solder pads and in the second peripheral area; along the first direction, there is at least one support member whose size is greater than or equal to the sum of the size of the solder pad and the size of the light-emitting device connected to the solder pad; wherein the light-emitting devices connected to the same type of solder pads emit the same color, and the first direction is perpendicular to the substrate.

[0017] In some embodiments, the light-emitting colors of the multiple light-emitting devices connected to the multiple pads are the same; the light-emitting substrate includes multiple support members; the multiple pads and the multiple support members are arranged into multiple rows and columns, at least one row includes pads and support members arranged along the second direction; and / or, at least one column includes pads and support members arranged along a third direction; along the second direction and / or the third direction, the spacing between two adjacent pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are equal; wherein, the second direction intersects with the third direction.

[0018] In some embodiments, a plurality of support members located on one side of the light-emitting area are connected to form a continuous whole-layer structure.

[0019] In some embodiments, the multiple light-emitting devices include multiple red light-emitting devices, multiple blue light-emitting devices and multiple green light-emitting devices; the multiple solder pads in the light-emitting area include a first solder pad, multiple second solder pads and multiple third solder pads; the first solder pad is connected to the red light-emitting device, the second solder pad is connected to the blue light-emitting device, and the third solder pad is connected to the green light-emitting device; the light-emitting substrate includes multiple support members; the multiple support members include at least one of multiple first support members, multiple second support members and multiple third support members.

[0020] In some embodiments, the multiple pads of the light-emitting area are arranged in multiple rows and columns, and each row includes the first pad, the second pad and the third pad arranged along the second direction. In the orthographic projection to the substrate motherboard, the geometric center of the first pad, the geometric center of the second pad and the geometric center of the third pad in each row are located on a first straight line; the multiple support members are arranged in multiple rows and columns, and each row includes the first support member, the second support member and the third support member arranged along the second direction. In the orthographic projection to the substrate motherboard, the geometric center of the first support member, the geometric center of the second support member and the geometric center of the third support member in each row are located on a second straight line; wherein, at least one of the first straight lines coincides with one of the second straight lines and / or there is a gap between the first straight line and the second straight line.

[0021] In some embodiments, at least one first straight line coincides with a second straight line; wherein, along the second direction, the spacing between two adjacent first pads is equal to the spacing between two adjacent first support members; and / or, along the second direction, the spacing between two adjacent second pads is equal to the spacing between two adjacent second support members; and / or, along the second direction, the spacing between two adjacent third pads is equal to the spacing between two adjacent third support members.

[0022] In some embodiments, the geometric center of the orthographic projection of each column of the first solder pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the first straight line and the second straight line; and / or, the geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or, the geometric center of the orthographic projection of each column of the third solder pads on the substrate motherboard is located on a seventh straight line, and the geometric center of the orthographic projection of each column of the third support members on the substrate motherboard is located on an eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a gap between the seventh straight line and the eighth straight line.

[0023] In some embodiments, at least one third straight line coincides with a fourth straight line, and along the third direction, the spacing between two adjacent first solder pads is equal to the spacing between two adjacent first support members; and / or, at least one fifth straight line coincides with a sixth straight line, and along the third direction, the spacing between two adjacent second solder pads is equal to the spacing between two adjacent second support members; and / or, at least one seventh straight line coincides with an eighth straight line, and along the third direction, the spacing between two adjacent third solder pads is equal to the spacing between two adjacent third support members.

[0024] In some embodiments, the light-emitting devices connected to the pads belonging to the same column emit the same color, and multiple support members belonging to the same column are connected to form a strip structure.

[0025] In some embodiments, the support member is elastic, and a size of the support member is larger than a sum of a size of the same type of solder pad and a size of the light emitting device connected to the solder pad.

[0026] In another aspect, a method for preparing a light-emitting motherboard is provided. The method comprises providing a transfer substrate and a driver motherboard; the driver motherboard has multiple light-emitting areas, with a spacer area between two adjacent light-emitting areas; the driver motherboard comprises a base motherboard and multiple solder pads; the multiple solder pads are disposed on the base motherboard and disposed in the light-emitting areas; the transfer substrate comprises a transfer substrate and multiple light-emitting devices; the multiple light-emitting devices are disposed on one side of the transfer substrate and connected to the transfer substrate; one of the transfer substrate and the driver motherboard comprises at least one support member; the light-emitting devices on the transfer substrate are connected to the solder pads on the driver motherboard; the transfer substrate and the driver motherboard are disposed opposite each other, with the support member of one of the transfer substrate and the driver motherboard abutting against the other, and the support member is located in the spacer area; and the transfer substrate is removed.

[0027] In some embodiments, the driving motherboard includes at least one supporting member; the at least one supporting member is disposed on a side of the substrate motherboard close to the plurality of pads; the supporting member is disposed in the spacer area;

[0028] In some embodiments, the transfer substrate has multiple transfer areas, and there is a support area between two adjacent transfer areas. When the transfer substrate and the driving motherboard are arranged relative to each other, the positive projection of the transfer area on the driving motherboard coincides with the light-emitting area; the transfer substrate includes a second substrate and at least one support member; the at least one support member is arranged on the second substrate; and the support member is arranged in the support area. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0030] FIG1 is a structural diagram of a display device according to some embodiments;

[0031] FIG2 is another structural diagram of a display device according to some embodiments;

[0032] FIG3 is a cross-sectional view along the cutting line AA in FIG1 ;

[0033] FIG4 is another cross-sectional view along the cutting line AA in FIG1 ;

[0034] FIG5 is a structural diagram of a driving motherboard according to some embodiments;

[0035] FIG6 is a cross-sectional view along the cutting line BB in FIG5;

[0036] FIG7 is another cross-sectional view along the cutting line BB in FIG5;

[0037] FIG8 is a structural diagram of a support member, a pad, and a light emitting device according to some embodiments;

[0038] FIG9 is a structural diagram of a plurality of support members forming a continuous whole-layer structure according to some embodiments;

[0039] FIG10 is another structural diagram of a driving motherboard according to some embodiments;

[0040] FIG11 is a cross-sectional view along the cutting line CC in FIG10;

[0041] FIG12 is another cross-sectional view along the cutting line CC in FIG10;

[0042] FIG13 is another structural diagram of a light-emitting motherboard according to some embodiments;

[0043] FIG14 is a structural diagram of a plurality of support members forming a strip-shaped structure according to some embodiments;

[0044] FIG15 is a structural diagram of a light-emitting substrate according to some embodiments;

[0045] FIG16 is a cross-sectional view along the cutting line DD in FIG15;

[0046] FIG17 is another cross-sectional view along the cutting line DD in FIG15;

[0047] FIG18 is a structural diagram of a plurality of support members forming a continuous whole-layer structure according to some embodiments;

[0048] FIG19 is another structural diagram of a light-emitting substrate according to some embodiments;

[0049] FIG20 is another structural diagram of a light emitting substrate according to some embodiments;

[0050] FIG21 is another structural diagram of a light emitting substrate according to some embodiments;

[0051] FIG22 is another structural diagram of a light-emitting substrate according to some embodiments;

[0052] FIG23 is another structural diagram of a light-emitting substrate according to some embodiments;

[0053] FIG24 is a cross-sectional view along the cutting line EE in FIG23;

[0054] FIG25 is another cross-sectional view along the cutting line EE in FIG23;

[0055] FIG26 is another structural diagram of a light-emitting substrate according to some embodiments;

[0056] FIG27 is a structural diagram of a plurality of support members forming a strip-shaped structure according to some embodiments;

[0057] FIG28 is a flow chart of a method for preparing a light-emitting motherboard according to some embodiments;

[0058] FIG29 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments;

[0059] FIG30 is a diagram showing steps of another method for preparing a light-emitting motherboard according to some embodiments;

[0060] FIG. 31 is a flow chart of another method for preparing a light-emitting motherboard according to some embodiments. DETAILED DESCRIPTION

[0061] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0062] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0063] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0064] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0065] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0066] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0067] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0068] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0069] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0070] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0071] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0072] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0073] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0074] It should be noted that the directional terms such as "upper" and "lower" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also indirectly connected to the other element "on" or "under" through an intermediate element.

[0075] As shown in FIG1 , some embodiments of the present disclosure provide a display device 1000 . The display device 1000 may be any device that displays either moving (eg, video) or fixed (eg, still image) content, and either text or images.

[0076] Exemplarily, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a vehicle display, or an aircraft display.

[0077] In some examples, as shown in FIG1 , the display device 1000 may be a portable display product, such as the mobile phone shown in FIG1 .

[0078] In some other examples, as shown in FIG2 , the display device 1000 may be a wearable device. For example, the display device 1000 may be a watch as shown in FIG2 .

[0079] In some embodiments, as shown in FIG. 3 and FIG. 4 , the display device 1000 includes a light emitting substrate 100 , a driving circuit board 200 , a housing 300 , and a cover plate 400 .

[0080] The cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100. The driving circuit board 200 is disposed on the non-light-emitting side of the light-emitting substrate 100 and is connected to the light-emitting substrate 100 to provide a light-emitting signal to the light-emitting substrate 100.

[0081] Among them, the light-emitting substrate 100 has a relative light-emitting side and a non-light-emitting side. The light-emitting side refers to the side of the light-emitting substrate 100 that can emit light (the upper side of the light-emitting substrate 100 in Figures 3 and 4), and the non-light-emitting side refers to the other side opposite to the light-emitting side (the lower side of the light-emitting substrate 100 in Figures 3 and 4).

[0082] In addition, the shell 300 can be a box-shaped structure with an opening, the light-emitting substrate 100 and the driving circuit board 200 can be arranged in the shell 300, and the cover plate 400 is arranged on the light-emitting side of the light-emitting substrate 100 and is located at the opening of the shell 300.

[0083] It is understandable that the display device 1000 may be a liquid crystal display (LCD) or a mini / micro light emitting display (MLED), which is not specifically limited in the embodiments of the present disclosure.

[0084] In some embodiments, as shown in FIG3 , the display device 1000 may be a liquid crystal display device. In this case, the light-emitting substrate 100 may serve as a backlight source in the liquid crystal display device, providing backlight for the display panel 500. The display panel 500 may adjust the intensity (grayscale) of light passing through the display panel 500 to display an image.

[0085] 3 , the display device 1000 further includes a display panel 500 and a plurality of optical films 600 . The display panel 500 is disposed on the light emitting side of the light emitting substrate 100 , and the plurality of optical films 600 are disposed between the display panel 500 and the light emitting substrate 100 .

[0086] The light-emitting substrate 100 can directly emit white light, which is then homogenized by the multiple optical films 600 and then emitted toward the display panel 500. Alternatively, the light-emitting substrate 100 can also emit light of other colors (e.g., blue light), which is then color-converted and homogenized by the multiple optical films 600 and then emitted toward the display panel 500.

[0087] In other embodiments, referring to FIG4 , the display device 1000 may be a micro-luminescent display device. In this case, the light-emitting substrate 100 may serve as the display panel of the micro-luminescent display device, directly providing a display. The light-emitting substrate 100 may emit light of multiple colors (e.g., red, blue, and green) to achieve full-color display.

[0088] The following uses the display device 1000 as a micro-luminescent display device as an example to exemplify some embodiments of the present disclosure, but the implementation of the present disclosure is not limited thereto, and any other display device can also be considered as long as the same technical concept is applied.

[0089] In order to reduce the preparation cost of the light-emitting substrate, currently, the light-emitting substrate is prepared by first preparing a light-emitting motherboard and then cutting the light-emitting motherboard into multiple light-emitting substrates (for example, four light-emitting substrates).

[0090] In some embodiments, as shown in FIG. 5 , FIG. 6 and FIG. 7 , the light-emitting motherboard 10 includes a driving motherboard 11 and a plurality of light-emitting devices 12 .

[0091] In some embodiments, as shown in FIG5 , the driving motherboard 11 has a plurality of light-emitting areas 101, and the plurality of light-emitting areas 101 are arranged in a plurality of rows and columns, each row including at least two light-emitting areas 101 arranged along a second direction Y, and each column including at least two light-emitting areas 101 arranged along a third direction Z. The second direction Y and the third direction Z intersect, for example, the second direction Y and the third direction Z are perpendicular.

[0092] There is a spacer 102 between two adjacent light-emitting areas 101. Exemplarily, the size of the spacer 102 is 3 mm to 10 mm, for example, the size of the spacer 102 is 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm or 10 mm.

[0093] In some embodiments, the driving motherboard 11 includes a substrate motherboard 111 and a plurality of pads 112 .

[0094] The substrate motherboard 111 may be a flexible substrate motherboard 111 or a rigid substrate motherboard 111. The material used for the substrate motherboard 111 may include polymer resin or glass. For example, the substrate motherboard 111 may be flexible, and the material used for the substrate motherboard 111 includes a polymer resin, such as polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate two formal acid glycol ester (PEN), polyethylene terephthalate (PET), polyphenylene sulfide granula (PPS), polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). For example, the substrate motherboard 111 may be rigid, and include a glass material containing SiO2 as a main component.

[0095] It should be noted that the substrate motherboard 111 can be a single-layer structure or a multi-layer structure. For example, in the case where the substrate motherboard 111 is a multi-layer structure, the substrate motherboard 111 can include a base and a buffer layer provided on the base. The buffer layer is provided on the base. The material used for the buffer layer can include inorganic insulating materials such as silicon nitride (SiNx, x>0), silicon oxynitride (SiON) and silicon oxide (SiOx, x>0). The buffer layer is used to provide a good foundation for the formation of the thin film when the thin film is formed on the substrate motherboard 111.

[0096] As shown in Figures 5, 6, and 7, a plurality of solder pads 112 are disposed on a substrate motherboard 111 and disposed in the light-emitting area 101. Exemplarily, the plurality of second solder pads 1122 are arranged in multiple rows and columns, with each row including at least two solder pads 112 disposed along the second direction Y, and each column including at least two solder pads 112 disposed along the third direction Z. Exemplarily, the distance between two adjacent solder pads is 20 μm to 30 μm. For example, the distance between two adjacent solder pads is 20 μm, 25 μm, or 30 μm.

[0097] The material of the pad 112 may include metal. For example, the material of the pad 112 includes copper or silver. In this case, the pad 112 has good conductivity and low resistance.

[0098] As shown in Figures 5, 6 and 7, multiple light emitting devices 12 are disposed on a side of multiple solder pads 112 away from the substrate motherboard 111. One light emitting device 12 is connected to one solder pad 112. Exemplarily, one light emitting device 12 is bonded to one solder pad 112.

[0099] The light emitting device 12 may include, for example, a Micro LED and / or a Mini LED. For example, the size (eg, length) of a Micro LED is less than 50 μm; the size (eg, length) of a Mini LED is 50 μm to 200 μm.

[0100] In related technologies, the light-emitting device can be transferred to the driving motherboard through the ODF mass bonding process and connected to the pad. The preparation method of the light-emitting motherboard including the ODF mass bonding process includes:

[0101] A transfer substrate and a driver motherboard are provided; the transfer substrate includes a transfer substrate and a plurality of light-emitting devices, and the plurality of light-emitting devices are disposed on the transfer substrate. The transfer substrate and the driver motherboard are bonded together. The transfer substrate and the driver motherboard are disposed opposite each other, with the plurality of light-emitting devices located between the transfer substrate and the driver motherboard. Air between the transfer substrate and the driver motherboard is extracted, and the light-emitting devices and the pads are bonded. The transfer substrate and the sealant are removed. The transfer substrate protrudes above the edge of the light-emitting area, resulting in a large distance between at least a portion of the plurality of pads at the edge of the light-emitting area and the light-emitting devices disposed opposite the pads. This prevents bonding between the pads and the light-emitting devices, resulting in a low bonding yield.

[0102] To address the above technical issues, as shown in Figures 5, 6, and 7, some embodiments of the present disclosure provide a driver motherboard 11 that further includes at least one support member 113. For example, the driver motherboard 11 further includes one support member 113, ten support members 113, or one hundred support members 113. At least one support member 113 (or all support members 113) is disposed on a side of the substrate motherboard 111 near the plurality of pads 112, and the support member 113 is disposed in the spacer area 102.

[0103] In the first direction X, at least one support member 113 has a size greater than or equal to the sum of the size of the solder pad 112 and the size of the light-emitting device 12 connected to the solder pad 112. As shown in FIG8 , the size of the support member 113 refers to the distance h1 between the support member 113 and the surface of the substrate motherboard 111. The size of the solder pad 112 refers to the distance h2 between the solder pad 112 and the surface of the substrate motherboard 111. The size of the light-emitting device 12 refers to the distance h3 between the light-emitting device 12 and the surface of the substrate motherboard 111.

[0104] Based on this, in the process of bonding the light-emitting device 12 and the pad 112, the support member 113 can abut against the transfer substrate. The support member 113 is used to support the transfer substrate above the spacer area 102, thereby reducing the risk of the transfer substrate above the spacer area 102 being recessed, causing the transfer substrate above the edge of the light-emitting area 101 to bulge, reducing the distance between the pad 112 and the light-emitting device 12 arranged opposite to the pad 112, and helping to improve the bonding yield.

[0105] It should be noted that the transfer substrate includes a second substrate and a transfer block, and a plurality of transfer blocks are arranged on the second substrate. At least a portion of the transfer block is configured to be connected to the light emitting device. Exemplarily, the light emitting device and the transfer block are bonded.

[0106] In some examples, as shown in FIG6 , during the bonding process of the light-emitting device 12 and the pad 112, a support member 113 abuts against a transfer block, thereby supporting the transfer substrate above the spacer 102. At this time, along the first direction X, the size of the support member 113 is equal to the sum of the size of the pad 112 and the size of the light-emitting device 12 bonded to the pad 112.

[0107] For example, the material of the support member 113 may include an organic resin, for example, the material of the support member 113 includes polyimide. The material of the transfer block may include polydimethylsiloxane (English: Polydimethylsiloxane, abbreviated: PDMS).

[0108] In other examples, as shown in Figure 7, during the process of bonding the light-emitting device 12 and the pad 112, the support member 113 abuts against the second substrate, so that the support member 113 supports the transfer substrate above the spacer 102, and along the first direction X, the size of the support member 113 is equal to the sum of the size of the pad 112, the size of the light-emitting device 12 bonded to the pad 112, and the size of the transfer block, that is, the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light-emitting device 12 bonded to the pad 112.

[0109] For example, the material of the support member 113 may include polystyrene (English: Polystyrene, abbreviated: PS).

[0110] In some embodiments, as shown in Figures 6 and 7, the driver motherboard 11 further includes a driver circuit stack 114. The driver circuit stack 114 is disposed between the substrate motherboard 111 and the plurality of solder pads 112. At least one support member 113 is disposed on a side of the driver circuit stack 114 away from the substrate motherboard 111 and connected to the driver circuit stack 114. The driver circuit stack 114 is connected to the plurality of solder pads 112. In this manner, the circuit board can provide signals to the plurality of light-emitting devices 12 via the driver circuit stack 114, thereby driving the light-emitting devices 12 to emit light.

[0111] In some embodiments, as shown in FIG. 5 and FIG. 6 , the light emitting devices 12 connected to the plurality of pads 112 emit the same light color.

[0112] In this case, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 only emits light of one color. At this time, the light-emitting substrate 100 serves as a backlight source in the liquid crystal display device, and is used to provide backlight for the display panel 500 .

[0113] As shown in Figures 5, 6, and 7, the driver motherboard 11 includes multiple support members 113. The multiple solder pads 112 within the light-emitting area 101 and the multiple support members 113 in the spacer area 102 adjacent to the light-emitting area 101 are arranged in multiple rows and columns. At least one row includes solder pads 112 and support members 113 arranged along the second direction Y; and / or at least one column includes solder pads 112 and support members 113 arranged along the third direction Z.

[0114] Along the second direction Y and / or the third direction Z, the spacing between two adjacent pads 112 is a first spacing d1, the spacing between two adjacent support members 113 is a second spacing d2, and the spacing between adjacent pads 112 and support members 113 is a third spacing d3. The first spacing d1, the second spacing d2, and the third spacing d3 are substantially equal.

[0115] In this manner, the plurality of pads 112 and the plurality of support members 113 are arranged at equal intervals in the second direction Y. Furthermore, the plurality of pads 112 and the plurality of support members 113 are arranged at equal intervals in the third direction Z. This improves the force uniformity applied to the driving motherboard 11 and further enhances the bonding yield.

[0116] The first spacing d1 refers to the distance between the geometric centers of two adjacent pads 112. The second spacing d2 refers to the distance between the geometric centers of two adjacent support members 113. The third spacing d3 refers to the distance between the geometric centers of adjacent pads 112 and support members 113.

[0117] In some embodiments, as shown in FIG9 , multiple support members 113 belonging to the same spacer 102 are connected to form a continuous layer structure. Arranged in this manner, the difficulty of preparing the support members 113 can be reduced.

[0118] It should be noted that a first connecting member 6 is provided between two adjacent supporting members 113, and the two adjacent supporting members 113 are connected by the first connecting member 6. The material of the first connecting member 6 is the same as that of the supporting members 113.

[0119] In some embodiments, as shown in Figures 10, 11, and 12, the multiple light-emitting devices 12 within the light-emitting area 101 include multiple red light-emitting devices 121, multiple blue light-emitting devices 122, and multiple green light-emitting devices 123. The red light-emitting devices 121 emit red light, the blue light-emitting devices 122 emit blue light, and the green light-emitting devices 123 emit green light. The red light-emitting devices 121 are larger than the blue light-emitting devices 122, and the blue light-emitting devices 122 are equal to the green light-emitting devices 123. For example, the difference between the sizes of the red light-emitting devices 121 and the blue light-emitting devices 122 is 2.5 μm.

[0120] The plurality of solder pads 112 within the light-emitting area 101 include a plurality of first solder pads 1121, a plurality of second solder pads 1122, and a plurality of third solder pads 1123. The first solder pads 1121 are connected to the red light-emitting device 121, the second solder pads 1122 are connected to the blue light-emitting device 122, and the third solder pads 1123 are connected to the green light-emitting device 123. The sizes of the first solder pads 1121, the second solder pads 1122, and the third solder pads 1123 are equal.

[0121] In this way, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 can emit light of multiple colors to achieve full-color display.

[0122] In this case, the driving circuit stack 114 may include a plurality of pixel circuits. The plurality of pixel circuits are located in the light-emitting area 101. The plurality of pixel circuits are arranged in multiple rows and columns, with each row including at least two pixel circuits arranged along the second direction Y, and each column including at least two pixel circuits arranged along the third direction Z.

[0123] The pixel circuit includes a plurality of thin-film transistors (TFTs) and at least one storage capacitor (C), wherein the plurality of transistors include at least one of amorphous silicon transistors, low-temperature polysilicon transistors, and oxide transistors.

[0124] The transistors used in the circuits provided in the embodiments of the present disclosure may be thin film transistors, field effect transistors, or other switching devices with the same characteristics.

[0125] 10 , the driving motherboard 11 includes a plurality of support members 113 . Along the second direction Y, the plurality of support members 113 in the spacer area 102 adjacent to the light emitting area 101 include a plurality of first support members 1131 , a plurality of second support members 1132 , and a plurality of third support members 1133 .

[0126] The size of the first support member 1131 is greater than or equal to the sum of the size of the first pad 1121 and the size of the red light-emitting device 121 connected to the first pad 1121. The size of the second support member 1132 is greater than or equal to the sum of the size of the second pad 1122 and the size of the blue light-emitting device 122 connected to the second pad 1122. The size of the third support member 1133 is greater than or equal to the sum of the size of the third pad 1123 and the size of the green light-emitting device 123 connected to the third pad 1123. The size of the first support member 1131 is greater than the size of the second support member 1132, and the size of the second support member 1132 is equal to the size of the third support member 1133.

[0127] In this way, the first support member 1131 is used to support the transfer substrate during the bonding process of the red light-emitting device 121. The second support member 1132 is used to support the transfer substrate during the bonding process of the blue light-emitting device 122. The third support member 1133 is used to support the transfer substrate during the bonding process of the green light-emitting device 123.

[0128] It should be understood that when the size of the support member 113 is equal to the sum of the size of the pad 112 and the size of the light-emitting device 12 connected to the pad 112, the size of the transfer block along the first direction X is greater than or equal to the size difference between the size of the red light-emitting device 121 and the size of the blue light-emitting device 122.

[0129] Exemplarily, the size difference between the red light emitting device 121 and the blue light emitting device 122 is 2.5 μm, and the size of the transfer block 2 is greater than 2.5 μm.

[0130] In this way, during the bonding process of the blue light-emitting device 122 or the green light-emitting device 123, a gap is created between the first support member 1131 and the transfer substrate. This reduces the risk of the transfer substrate protruding above the first support member 1131, thereby reducing the risk of the transfer substrate protruding above the edge of the light-emitting area 101. This also reduces the distance between the outermost second pads 1122 or third pads 1123 of the light-emitting area 101 and the light-emitting devices 12 connected thereto, thereby improving the bonding yield.

[0131] In the case where the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light emitting device 12 connected to the pad 112 , the support member 113 has elasticity.

[0132] In this way, during the process of bonding the blue light-emitting device 122 or the green light-emitting device 123, the first support member 1131 can be deformed, enabling the second soldering pad 1122 or the third soldering pad 1123 to contact the light-emitting device 12 arranged opposite thereto, so that the second soldering pad 1122 or the third soldering pad 1123 and the light-emitting device 12 arranged opposite thereto are bonded, which can improve the bonding yield.

[0133] In some embodiments, as shown in FIG13 , the plurality of pads 112 of the light-emitting area 101 are arranged into multiple rows and columns, and each row includes a first pad 1121, a second pad 1122, and a third pad 1123 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first pad 1121, the geometric center of the second pad 1122, and the geometric center of the third pad 1123 in each row are located on the first straight line L1.

[0134] The multiple support members 113 of the spacing area 102 adjacent to the light-emitting area 101 are arranged in multiple rows and columns, and each row includes a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first support member 1131, the geometric center of the second support member 1132 and the geometric center of the third support member 1133 in each row are located on the second straight line L2.

[0135] Therein, at least one first straight line L1 coincides with one second straight line L2 and / or there is a distance between the first straight line L1 and the second straight line L2.

[0136] In some embodiments, at least one first straight line L1 coincides with a second straight line L2, that is, at least one row includes a first solder pad 1121, a second solder pad 1122, a third solder pad 1123, a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y, for example, one, five or ten first straight lines L1 coincide with a second straight line L2.

[0137] In some examples, along the second direction Y, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0138] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0139] It should be noted that, along the second direction Y, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0140] In some other examples, along the second direction Y, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0141] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0142] It should be noted that, along the second direction Y, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0143] In some other examples, along the second direction Y, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0144] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0145] It should be noted that, along the second direction Y, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0146] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of first solder pads 1121 on the substrate motherboard 111 is located on the third straight line L3, and the geometric center of the orthographic projection of each column of first support members 1131 on the substrate motherboard 111 is located on the fourth straight line L4, wherein at least one third straight line L3 coincides with one fourth straight line L4 and / or there is a gap between the third straight line L3 and the second straight line L4.

[0147] Exemplarily, at least one third straight line L3 coincides with a fourth straight line L4, that is, at least one column includes the first pads 1121 and the first support members 1131 arranged along the third direction Z. For example, one, five or ten third straight lines L3 coincide with a fourth straight line L4.

[0148] In some examples, along the third direction Z, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0149] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0150] It should be noted that, along the third direction Z, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0151] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of second solder pads 1122 on the substrate motherboard 111 is located on the fifth straight line L5, and the geometric center of the orthographic projection of each column of second support members 1132 on the substrate motherboard 111 is located on the sixth straight line L6, wherein at least one fifth straight line L5 coincides with one sixth straight line L6 and / or there is a gap between the fifth straight line L5 and the sixth straight line L6.

[0152] Exemplarily, at least one fifth straight line L5 coincides with one sixth straight line L6, that is, at least one column includes second pads 1122 and second support members 1132 arranged along the third direction Z. For example, one, five, or ten fifth straight lines L5 coincide with one sixth straight line L6.

[0153] In some examples, along the third direction Z, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0154] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0155] It should be noted that, along the third direction Z, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0156] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of third solder pads 1123 on the substrate motherboard 111 is located on the seventh straight line L7, and the geometric center of the orthographic projection of each column of third support members 1133 on the substrate motherboard 111 is located on the eighth straight line L8, wherein at least one seventh straight line L7 coincides with one eighth straight line L8 and / or there is a gap between the seventh straight line L7 and the eighth straight line L8.

[0157] Exemplarily, at least one seventh straight line L7 coincides with one eighth straight line L8, that is, at least one column includes third pads 1123 and third support members 1133 arranged along the third direction Z. For example, one, five, or ten seventh straight lines L7 coincide with one eighth straight line L8.

[0158] In some examples, along the third direction Z, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0159] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0160] It should be noted that, along the third direction Z, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0161] In some embodiments, as shown in FIG14 , the light emitting devices 12 connected to the pads 112 in the same column emit the same color, and multiple support members 113 in the same column are connected to form a strip structure. This arrangement can reduce the difficulty of manufacturing the support members 113.

[0162] It should be noted that, along the third direction Z, a second connecting member 7 is provided between two adjacent support members 113 , and the two adjacent support members 113 are connected by the second connecting member 7 . The material of the second connecting member 7 is the same as that of the support members 113 .

[0163] In some embodiments, as shown in FIG. 5 , the driving motherboard 11 further has a first peripheral area 103 . The first peripheral area 103 is disposed around the plurality of light-emitting areas 101 , and the support member 113 is also disposed in the first peripheral area 103 .

[0164] In this manner, the support member 113 can support the transfer substrate above the first peripheral region 103 , thereby reducing the risk of the transfer substrate above the first peripheral region 103 being recessed and improving the bonding yield.

[0165] In some examples, as shown in Figure 5, multiple support members 113 located in the first peripheral area 103 are arranged into multiple rows and columns, each row includes at least two support members 113 arranged along the second direction Y, and each column includes at least two support members 113 arranged along the third direction Z.

[0166] In the orthographic projection onto the substrate motherboard 111 , the distance between the outermost support member 113 among the plurality of support members 113 arranged in the array and the plurality of light-emitting areas 101 is greater than or equal to 10 mm.

[0167] In this manner, a larger number of support members 113 can be provided in the first peripheral area 103 , thereby improving the force uniformity of the driving motherboard 11 located in the first peripheral area 103 and improving the bonding yield.

[0168] In some embodiments, the support member 113 is elastic, and a size of the support member 113 is larger than a sum of a size of the pad 112 and a size of the light emitting device 12 connected to the pad 112 .

[0169] In some embodiments, as shown in FIG5 , the driving motherboard 11 further includes a glue-coated area 104 disposed around the first peripheral area 103. The glue-coated area 104 is configured to be provided with a sealant. For example, the distance between the outer boundary of the glue-coated area 104 and the inner boundary of the glue-coated area 104 is greater than 5 mm.

[0170] In some embodiments, as shown in FIG. 5 , a plurality of cutting lines L are provided on the light-emitting motherboard 10 , and a cutting device can cut along the plurality of cutting lines to form a plurality of light-emitting substrates 100 .

[0171] For example, a cutter wheel cutting device or a laser cutting device can be used to cut the light-emitting motherboard 10 along a cutting line L to form the light-emitting substrate 100. The width of the cutter wheel and the diameter of the laser are generally 100 μm to 200 μm. The cutting line is located in the spacer region 102 and / or the first peripheral region 103, and the distance between the cutting line and the light-emitting region 101 is greater than 200 μm.

[0172] In this manner, during the process of forming the light-emitting substrate 100 , there is a gap between the cutter wheel or the laser and the light-emitting area 101 , which can reduce the risk of the cutter wheel or the laser cutting into the light-emitting area 101 .

[0173] The structure of the light emitting substrate 100 obtained by cutting is described below by way of example.

[0174] As shown in Figures 15, 16 and 17, the light-emitting substrate 100 includes a light-emitting area 101 and a second peripheral area 1002 disposed on at least one side of the light-emitting area 101. Figure 15 illustrates an example in which the second peripheral area B surrounds the light-emitting area 101.

[0175] The second peripheral region 1002 includes the light-emitting region 101 and a spacing region 102 between the cutting lines L adjacent to the light-emitting region 101 .

[0176] As shown in FIG. 15 , FIG. 16 and FIG. 17 , the light emitting substrate 100 includes a substrate 110 , a plurality of pads 112 , a plurality of light emitting devices 12 and at least one support member 113 .

[0177] The material and structure of the substrate 110 are the same as those of the substrate motherboard 111 mentioned above, and are not described in detail here.

[0178] A plurality of pads 112 are disposed on the substrate 110 and disposed in the light emitting area 101. For example, the plurality of second pads 1122 are arranged in a plurality of rows and columns, each row including at least two pads 112 disposed along the second direction Y, and each column including at least two pads 112 disposed along the third direction Z.

[0179] The plurality of light emitting devices 12 are disposed on a side of the plurality of solder pads 112 away from the substrate 110 and in the light emitting region 101 , with one light emitting device 12 being connected to one solder pad 112 .

[0180] At least one support member 113 is disposed on a side of the substrate 110 near the plurality of pads 112 and in the second peripheral region 1002. Along a first direction X, at least one support member 113 has a size greater than or equal to the sum of the size of the pads 112 and the size of the light-emitting device 12 connected to the pads 112. The first direction X is perpendicular to the substrate 110.

[0181] In some embodiments, as shown in FIG. 15 , FIG. 16 , and FIG. 17 , the light emitting devices 12 connected to the plurality of pads 112 emit the same light color.

[0182] In this case, the light emitting substrate 100 only emits light of one color. At this time, the light emitting substrate 100 serves as a backlight source in the liquid crystal display device, and is used to provide backlight for the display panel 500 .

[0183] As shown in Figures 15, 16, and 17, the light-emitting substrate 100 includes a plurality of support members 113. The plurality of pads 112 and the plurality of support members 113 are arranged in multiple rows and columns. At least one row includes pads 112 and support members 113 arranged along the second direction Y; and / or at least one column includes pads 112 and support members 113 arranged along the third direction Z.

[0184] Along the second direction Y and / or the third direction Z, the spacing between two adjacent pads 112 is a first spacing d1, the spacing between two adjacent support members 113 is a second spacing d2, and the spacing between adjacent pads 112 and support members 113 is a third spacing d3. The first spacing d1, the second spacing d2 and the third spacing d3 are equal.

[0185] In some embodiments, as shown in FIG18 , multiple support members 113 located on one side of the light-emitting area 101 are connected to form a continuous layer structure. This arrangement can reduce the difficulty of preparing the support members 113 .

[0186] It should be noted that a first connecting member 6 is provided between two adjacent supporting members 113, and the two adjacent supporting members 113 are connected by the first connecting member 6. The material of the first connecting member 6 is the same as that of the supporting members 113.

[0187] In some embodiments, as shown in Figures 19, 20, and 21, the plurality of light-emitting devices 12 include a plurality of red light-emitting devices 121, a plurality of blue light-emitting devices 122, and a plurality of green light-emitting devices 123. The red light-emitting devices 121 emit red, the blue light-emitting devices 122 emit blue, and the green light-emitting devices 123 emit green. In this way, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 can emit light of multiple colors, achieving a full-color display. The plurality of solder pads 112 include a first solder pad 1121, a plurality of second solder pads 1122, and a plurality of third solder pads 1123. The first solder pad 1121 is connected to the red light-emitting device 121, the second solder pad 1122 is connected to the blue light-emitting device 122, and the third solder pad 1123 is connected to the green light-emitting device 123.

[0188] The light emitting substrate 100 includes a plurality of support members 113. The plurality of support members 113 includes at least one of a plurality of first support members 1131, a plurality of second support members 1132, and a plurality of third support members 1133.

[0189] 19 , the plurality of support members 113 include a plurality of first support members 1131. Along the second direction Y, the plurality of first support members 1131 are located on one side of the light emitting area 101. Along the third direction Z, the plurality of first support members 1131 are arranged at intervals.

[0190] 20 , the plurality of support members 113 include a plurality of third support members 1133. Along the second direction Y, the plurality of third support members 1133 are located on one side of the light emitting area 101. Along the third direction Z, the plurality of third support members 1133 are arranged at intervals.

[0191] In yet other examples, as shown in FIG21 , the plurality of support members 113 include a plurality of first support members 1131 and a plurality of second support members 1132. Along the second direction Y, the plurality of first support members 1131 and the plurality of second support members 1132 are located on one side of the light-emitting area 101. Along the third direction Z, the plurality of first support members 1131 are arranged at intervals, and the plurality of second support members 1132 are arranged at intervals. The plurality of first support members 1131 are located on the side of the plurality of second support members 1132 that is closer to the light-emitting area 101.

[0192] In yet other examples, as shown in FIG22 , the plurality of support members 113 include a plurality of second support members 1132 and a plurality of third support members 1133. Along the second direction Y, the plurality of second support members 1132 and the plurality of third support members 1133 are located on one side of the light-emitting area 101. Along the third direction Z, the plurality of second support members 1132 are arranged at intervals, and the plurality of third support members 1133 are arranged at intervals. The plurality of second support members 1132 are located on a side of the plurality of third support members 1133 that is away from the light-emitting area 101.

[0193] In still other examples, as shown in FIG. 23 , FIG. 24 , and FIG. 25 , the plurality of support members 113 include a plurality of first support members 1131 , a plurality of second support members 1132 , and a plurality of third support members 113 .

[0194] In some embodiments, as shown in FIG26 , the plurality of pads 112 of the light-emitting area 101 are arranged into multiple rows and columns, and each row includes a first pad 1121, a second pad 1122, and a third pad 1123 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first pad 1121, the geometric center of the second pad 1122, and the geometric center of the third pad 1123 in each row are located on the first straight line L1.

[0195] Multiple support members 113 are arranged in multiple rows and columns, each row includes a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first support member 1131, the geometric center of the second support member 1132 and the geometric center of the third support member 1133 in each row are located on the second straight line L2.

[0196] Therein, at least one first straight line L1 coincides with one second straight line L2 and / or there is a distance between the first straight line L1 and the second straight line L2.

[0197] In some embodiments, at least one first straight line L1 coincides with a second straight line L2, that is, at least one row includes a first solder pad 1121, a second solder pad 1122, a third solder pad 1123, a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y, for example, one, five or ten first straight lines L1 coincide with the second straight line L2.

[0198] In some examples, along the second direction Y, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0199] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0200] It should be noted that, along the second direction Y, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0201] In some other examples, along the second direction Y, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0202] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0203] It should be noted that, along the second direction Y, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0204] In some other examples, along the second direction Y, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0205] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123 .

[0206] It should be noted that, along the second direction Y, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0207] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of first solder pads 1121 on the substrate motherboard 111 is located on the third straight line L3, and the geometric center of the orthographic projection of each column of first support members 1131 on the substrate motherboard 111 is located on the fourth straight line L4, wherein at least one third straight line L3 coincides with one fourth straight line L4 and / or there is a gap between the third straight line L3 and the second straight line L4.

[0208] Exemplarily, at least one third straight line L3 coincides with a fourth straight line L4, that is, at least one column includes the first pads 1121 and the first support members 1131 arranged along the third direction Z. For example, one, five or ten third straight lines L3 coincide with a fourth straight line L4.

[0209] In some examples, along the third direction Z, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0210] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0211] It should be noted that, along the third direction Z, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0212] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of second solder pads 1122 on the substrate motherboard 111 is located on the fifth straight line L5, and the geometric center of the orthographic projection of each column of second support members 1132 on the substrate motherboard 111 is located on the sixth straight line L6, wherein at least one fifth straight line L5 coincides with one sixth straight line L6 and / or there is a gap between the fifth straight line L5 and the sixth straight line L6.

[0213] Exemplarily, at least one fifth straight line L5 coincides with one sixth straight line L6, that is, at least one column includes second pads 1122 and second support members 1132 arranged along the third direction Z. For example, one, five, or ten fifth straight lines L5 coincide with one sixth straight line L6.

[0214] In some examples, along the third direction Z, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0215] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0216] It should be noted that, along the third direction Z, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0217] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of third solder pads 1123 on the substrate motherboard 111 is located on the seventh straight line L7, and the geometric center of the orthographic projection of each column of third support members 1133 on the substrate motherboard 111 is located on the eighth straight line L8, wherein at least one seventh straight line L7 coincides with one eighth straight line L8 and / or there is a gap between the seventh straight line L7 and the eighth straight line L8.

[0218] Exemplarily, at least one seventh straight line L7 coincides with one eighth straight line L8, that is, at least one column includes third pads 1123 and third support members 1133 arranged along the third direction Z. For example, one, five, or ten seventh straight lines L7 coincide with one eighth straight line L8.

[0219] In some examples, along the third direction Z, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0220] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0221] It should be noted that, along the third direction Z, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0222] In some embodiments, as shown in FIG27 , the light emitting devices 12 connected to the pads 112 in the same column emit the same color, and multiple support members 113 in the same column are connected to form a strip structure. This arrangement can reduce the difficulty of manufacturing the support members 113.

[0223] It should be noted that, along the third direction Z, a second connecting member 7 is provided between two adjacent support members 113 , and the two adjacent support members 113 are connected by the second connecting member 7 . The material of the second connecting member 7 is the same as that of the support members 113 .

[0224] In some embodiments, as shown in FIG. 25 , the support member 113 is elastic, and a size of the support member 113 is larger than a sum of a size of the pad 112 and a size of the light emitting device 12 connected to the pad 112 .

[0225] In some embodiments, as shown in FIG23 , the second peripheral region 1002 is disposed around the light-emitting region 101 and includes a first boundary, a second boundary, a third boundary, and a fourth boundary that are sequentially connected. A row of support members 113 is disposed between the first boundary and the light-emitting region 101. Four rows of support members 113 are disposed between the third boundary and the light-emitting region 101. Three columns of support members 113 are disposed between the second boundary and the light-emitting region 101. Four columns of support members 113 are disposed between the fourth boundary and the light-emitting region 101.

[0226] Some embodiments of the present disclosure further provide a method for preparing a light-emitting motherboard 10. As shown in FIG28 , the preparation method includes: S100 to S300.

[0227] As shown in FIG. 29 and FIG. 30 , S100 : providing a transfer substrate 5 and a driving motherboard 11 .

[0228] In the above steps, the driving motherboard 11 has multiple light-emitting areas 101, and there is a spacer 102 between two adjacent light-emitting areas 101. The driving motherboard 11 includes a substrate motherboard 111 and multiple pads 112. The multiple pads 112 are arranged on the substrate motherboard 111 and arranged in the light-emitting areas 101.

[0229] The transfer substrate 5 includes a transfer substrate 1 and a plurality of light-emitting devices 12. The light-emitting devices 12 are disposed on one side of the transfer substrate 1 and connected to the transfer substrate 1. For example, the transfer substrate 1 includes a second substrate 3 and a plurality of transfer blocks 2, which are disposed on the second substrate 3. The light-emitting devices 12 are disposed on a side of the transfer blocks 2 away from the second substrate 3, with each light-emitting device 12 bonded to each transfer block 2.

[0230] At least one of the transfer substrate 1 and the driving motherboard 11 includes at least one supporting member 113 .

[0231] As shown in FIG. 29 and FIG. 30 , S200 : connecting the light emitting device 12 on the transfer substrate 5 to the soldering pad 112 on the driving motherboard 11 .

[0232] In the above steps, the transfer substrate 5 and the driving motherboard 11 are disposed opposite to each other, and the support member 113 of one of the transfer substrate 1 and the driving motherboard 11 abuts against the other, and the support member is located in the spacer area 102 .

[0233] Exemplarily, as shown in FIG31 , S200 may include S210 to S230 .

[0234] S210 : Bonding the transfer substrate 5 and the driving motherboard 11 .

[0235] In the above steps, the transfer substrate 5 and the driver motherboard 11 are positioned opposite each other, a light-emitting device 12 is positioned opposite a soldering pad 112, and the sealant 8 is disposed between the transfer substrate 1 and adhered to the transfer substrate 5 and the transfer substrate 1. The sealant 8 surrounds the soldering pads 112 of the plurality of light-emitting regions 101 (all light-emitting regions 101) and the plurality of transfer blocks 2. The transfer substrate 5, the driver motherboard 11, and the sealant 8 form a first cavity.

[0236] S220 : extracting the air in the first cavity and bonding the light emitting device 12 and the pad 112 .

[0237] In the above steps, one light emitting device 12 is bonded to one pad 112 , and the support member 113 abuts against the other of the transfer substrate 1 and the driving motherboard 11 .

[0238] S230: Peeling off the sealant 8.

[0239] In the above steps, the sealant 8 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding, and mechanical debonding. For example, the sealant 8 can be debonded by laser, whereby the sealant 8 absorbs the laser light, thereby eroding the interface between the sealant 8 and the driver motherboard 11, thereby removing the sealant 8.

[0240] As shown in FIG. 29 and FIG. 30 , S300 : removing the transfer substrate 1 .

[0241] 29 , the driving motherboard 11 includes at least one support member 113 . The at least one support member 113 is disposed on a side of the substrate motherboard 111 close to the plurality of pads 112 , and the support member 113 is disposed in the spacer 102 .

[0242] In other embodiments, as shown in FIG30 , the transfer substrate 5 has multiple transfer regions 501, with a support region 502 between adjacent transfer regions 501. The transfer substrate 5 includes a second substrate 3 and at least one support member 113. The at least one support member 113 is disposed on the second substrate 3, and the support member 113 is disposed in the support region 502. When the transfer substrate 5 and the driver motherboard 11 are positioned relative to each other, the orthographic projection of the transfer region 501 on the driver motherboard 11 overlaps with the light-emitting region 101.

[0243] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0244] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A driving motherboard having multiple light-emitting areas, with a spacer area between two adjacent light-emitting areas; The driving motherboard includes: substrate motherboard; A plurality of pads are provided on the substrate motherboard and in the light emitting area; The solder pad is configured to be connected to the light emitting device; At least one supporting member is provided on a side of the substrate motherboard close to the plurality of pads; the supporting member is provided in the spacer area; Along a first direction, there is at least one support member whose size is greater than or equal to the sum of the size of the pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate motherboard.

2. The driving motherboard according to claim 1, wherein: The light emitting colors of the plurality of light emitting devices connected to the plurality of pads are the same; the driving motherboard includes a plurality of supporting members; The plurality of solder pads within the light-emitting area and the plurality of support members in the spacer area adjacent to the light-emitting area are arranged in multiple rows and columns; at least one row includes solder pads and support members arranged along a second direction; and / or at least one column includes solder pads and support members arranged along a third direction; wherein the second direction intersects the third direction; Along the second direction and / or the third direction, the spacing between two adjacent pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are equal.

3. The driving motherboard according to claim 2, wherein: A plurality of support members belonging to the same spacer area are connected to form a continuous whole-layer structure.

4. The driving motherboard according to claim 1, wherein: The plurality of pads in the light-emitting area include a plurality of first pads, a plurality of second pads, and a plurality of third pads; the first pads are configured to be connected to a red light-emitting device, the second pads are configured to be connected to a blue light-emitting device, and the third pads are configured to be connected to a green light-emitting device; The driving motherboard includes a plurality of supporting members, and along the second direction, the plurality of supporting members in the spacing area adjacent to the light-emitting area include a first supporting member, a second supporting member and a third supporting member; The size of the first support member is greater than that of the second support member, and the size of the second support member is equal to that of the third support member.

5. The driving motherboard according to claim 4, wherein: The plurality of pads in the light-emitting area are arranged in a plurality of rows and columns, each row including the first pad, the second pad, and the third pad arranged along a second direction, and in an orthographic projection onto the substrate motherboard, the geometric centers of the first pad, the second pad, and the third pad in each row are located on a first straight line; The plurality of support members in the spacer area adjacent to the light-emitting area are arranged in multiple rows and columns, each row including the first support member, the second support member, and the third support member arranged along the second direction, and in an orthographic projection onto the substrate motherboard, the geometric centers of the first support member, the second support member, and the third support member in each row are located on a second straight line; Here, at least one of the first straight lines coincides with one of the second straight lines and / or there is a distance between the first straight line and the second straight line.

6. The driving motherboard according to claim 5, wherein: At least one first straight line coincides with one second straight line; Wherein, along the second direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, Along the second direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, Along the second direction, the distance between two adjacent third pads is equal to the distance between two adjacent third support members.

7. The driving motherboard according to claim 5 or 6, wherein: The geometric center of the orthographic projection of each column of the first pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the third straight lines and the fourth straight lines; and / or, The geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or, The geometric center of the positive projection of each column of the third solder pads on the substrate motherboard is located on the seventh straight line, and the geometric center of the positive projection of each column of the third support members on the substrate motherboard is located on the eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a distance between the seventh straight line and the eighth straight line.

8. The driving motherboard according to claim 7, wherein: At least one third straight line coincides with a fourth straight line, and along the third direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, At least one fifth straight line coincides with one sixth straight line, and along the third direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, At least one seventh straight line coincides with one eighth straight line, and along the third direction, a distance between two adjacent third pads is equal to a distance between two adjacent third support members.

9. The driving motherboard according to any one of claims 5 to 8, wherein: The light-emitting devices connected to the pads belonging to the same column emit the same color, and the multiple supporting members belonging to the same column are connected to form a strip structure.

10. The driving motherboard according to any one of claims 1 to 9, wherein: The support member is elastic, and a size of the support member is larger than the sum of a size of the same type of solder pad and a size of a light emitting device connected to the solder pad. 11 . The driving motherboard according to claim 1 , further comprising a first peripheral area; the first peripheral area is arranged around the plurality of light-emitting areas, and the support member is also arranged in the first peripheral area.

12. A light-emitting motherboard, comprising: The driving motherboard according to any one of claims 1 to 11; A plurality of light emitting devices are arranged on a side of the plurality of pads of the driving motherboard away from the substrate, and one light emitting device is connected to one pad.

13. A light-emitting substrate comprising a light-emitting area and a second peripheral area disposed on at least one side of the light-emitting area; The light-emitting substrate comprises: substrate; a plurality of pads disposed on the substrate and in the light emitting area; A plurality of light-emitting devices are arranged on a side of the plurality of pads away from the substrate and in the light-emitting area, with one light-emitting device being connected to one pad; At least one support member is arranged on a side of the substrate close to the multiple pads and is arranged in the second peripheral area; along the first direction, there is at least one support member whose size is greater than or equal to the sum of the size of the pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate. The light-emitting substrate according to claim 13 , wherein: The light emitting devices connected to the plurality of pads emit light of the same color; the light emitting substrate includes a plurality of supporting members; The multiple solder pads and the multiple support members are arranged into multiple rows and columns, at least one row includes solder pads and support members arranged along the second direction; and / or, at least one column includes solder pads and support members arranged along a third direction; along the second direction and / or the third direction, the spacing between two adjacent solder pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent solder pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are equal; wherein, the second direction intersects with the third direction.

15. The light-emitting substrate according to claim 14, wherein A plurality of support members located on one side of the light emitting area are connected to form a continuous whole-layer structure.

16. The light-emitting substrate according to claim 13, wherein The plurality of light-emitting devices include a plurality of red light-emitting devices, a plurality of blue light-emitting devices, and a plurality of green light-emitting devices; the plurality of pads in the light-emitting area include a first pad, a plurality of second pads, and a plurality of third pads; the first pad is connected to the red light-emitting device, the second pad is connected to the blue light-emitting device, and the third pad is connected to the green light-emitting device; The light emitting substrate includes a plurality of support members; the plurality of support members include at least one of a plurality of first support members, a plurality of second support members, and a plurality of third support members.

17. The light-emitting substrate according to claim 16, wherein The plurality of pads in the light-emitting area are arranged in a plurality of rows and columns, each row including the first pad, the second pad, and the third pad arranged along a second direction, and in an orthographic projection onto the substrate motherboard, the geometric centers of the first pad, the second pad, and the third pad in each row are located on a first straight line; The plurality of support members are arranged in multiple rows and columns, and each row includes the first support members arranged along the second direction, The second support members and the third support members, in an orthographic projection onto the substrate motherboard, the geometric centers of the first support members, the second support members, and the third support members in each row are located on a second straight line; Here, at least one of the first straight lines coincides with one of the second straight lines and / or there is a distance between the first straight line and the second straight line.

18. The light-emitting substrate according to claim 17, wherein At least one first straight line coincides with one second straight line; Wherein, along the second direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, Along the second direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, Along the second direction, the distance between two adjacent third pads is equal to the distance between two adjacent third support members.

19. The light-emitting substrate according to claim 17 or 18, wherein The geometric center of the orthographic projection of each column of the first pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the first straight line and the second straight line; and / or, The geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or, The geometric center of the positive projection of each column of the third solder pads on the substrate motherboard is located on the seventh straight line, and the geometric center of the positive projection of each column of the third support members on the substrate motherboard is located on the eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a distance between the seventh straight line and the eighth straight line.

20. The light-emitting substrate according to claim 19, wherein At least one third straight line coincides with a fourth straight line, and along the third direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, At least one fifth straight line coincides with one sixth straight line, and along the third direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, At least one seventh straight line coincides with one eighth straight line, and along the third direction, a distance between two adjacent third pads is equal to a distance between two adjacent third support members.

21. The light emitting substrate according to any one of claims 17 to 20, wherein The light-emitting devices connected to the pads belonging to the same column emit the same color, and a plurality of support members belonging to the same column are connected to form a strip structure.

22. The light emitting substrate according to any one of claims 13 to 21, wherein The support member is elastic, and a size of the support member is larger than a sum of a size of the solder pad and a size of the light emitting device connected to the solder pad.

23. A method for preparing a light-emitting motherboard, comprising: Provide transfer substrate and driver motherboard; The driving motherboard has a plurality of light-emitting areas, with a spacer area between two adjacent light-emitting areas; the driving motherboard includes a substrate motherboard and a plurality of solder pads; the plurality of solder pads are arranged on the substrate motherboard and are arranged in the light-emitting areas; the transfer substrate includes a transfer substrate and a plurality of light-emitting devices; the plurality of light-emitting devices are arranged on one side of the transfer substrate and connected to the transfer substrate; at least one of the transfer substrate and the driving motherboard includes at least one supporting member; The light emitting device on the transfer substrate is connected to the pad on the driving motherboard; the transfer substrate and the driving motherboard are arranged opposite to each other, and the support member of one of the transfer substrate and the driving motherboard abuts against the other, and the support member is located in the spacer area; Remove the transfer substrate.

24. The method for preparing a light-emitting motherboard according to claim 23, wherein: The driving motherboard includes at least one supporting member; the at least one supporting member is arranged on a side of the substrate motherboard close to the plurality of pads; and the supporting member is arranged in the spacer area.

25. The method for preparing a light-emitting motherboard according to claim 23 or 24, wherein: The transfer substrate has multiple transfer areas, and a support area is provided between two adjacent transfer areas. When the transfer substrate and the driving motherboard are arranged relative to each other, the orthographic projection of the transfer area on the driving motherboard coincides with the light-emitting area; the transfer substrate includes a second substrate and at least one support member; the at least one support member is arranged on the second substrate; and the support member is arranged in the support area.

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