Electronic unit
The electronics unit with integrated cooling channels and heat-conducting elements addresses inefficiencies in vehicle cooling, enhancing heat dissipation and reducing costs by direct component cooling medium contact, thus improving performance and reducing component weight.
Patent Information
- Application Number
- PCT/EP2025/053418
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-02-19
- Filing Date
- 2025-02-10
- Publication Date
- 2025-08-28
AI Technical Summary
Existing cooling methods for electronic components in vehicles are inefficient and costly, failing to meet the increasing demands of cooling multiple components with reduced weight and cost pressure.
An electronics unit with a housing unit containing channels for precise cooling medium guidance, integrated heat-conducting elements, and adaptable channel heights to enhance heat dissipation, allowing direct contact between electronic components and cooling medium.
Enhances current carrying capacity, reduces production costs, and improves cooling performance by integrating cooling systems into the housing, enabling efficient heat transfer without the need for high-performance heat-conducting elements.
Smart Images
Figure EP2025053418_28082025_PF_FP_ABST
Abstract
Description
[0001] Description
[0002] title
[0003] Electronics unit
[0004] State of the art
[0005] The present invention relates to an electronic unit and a vehicle.
[0006] There are currently a variety of different solutions for cooling electronic components in vehicles. Due to the increasing number of components to be cooled and the increased cooling requirements, the need for innovative and robust cooling methods is continuously growing.
[0007] The constant weight reduction in the vehicle sector to reduce fuel consumption as well as increasing competition are creating cost pressure, so that cheaper and more efficient components for vehicles are in greater demand.
[0008] Disclosure of the invention
[0009] The electronics unit according to the invention with the features of claim 1 has the advantage over the known unit that the current carrying capacity can be increased by precise cooling. For example, a cooling medium can be guided precisely to all relevant points by means of the housing of the inverter or the electronics unit. It can also be advantageous if the current supply of the electronics unit is guided, for example, through a printed circuit board unit, which can also be supplied with cooling water or cooling medium by means of a specific cooling channel in the housing, so that the printed circuit board unit can also be actively cooled. By integrating the cooling system into the housing of the electronics unit, the current supply is simplified and production costs are significantly reduced. A further advantage is that by guiding the current through the printed circuit board unit, a large number of sensors for current measurement can be integrated into the housing orthe electronics unit can be integrated.
[0010] This is achieved according to the invention in that the electronic unit has a housing unit and a first electronic component, wherein the housing unit has at least one channel, wherein the channel is connectable to a cooling system, wherein the electronic component at least partially rests against a wall of the channel, so that thermal energy originating from the first electronic component is dissipated to a cooling medium in the channel, wherein the first electronic component has a first outer contour, wherein the wall of the channel has a first contour, wherein the first outer contour and the first contour are at least partially substantially the same.
[0011] In other words, by specifically adapting the channel in the housing, a cooling medium flowing through the channel can be guided directly past the first electronic component, thus enabling cooling to be achieved on the first electronic component. Preferably, with the aid of the first outer contour of the first electronic component, a contour is formed in the housing which is configured to position the first electronic component directly on the cooling medium or the wall of the channel. Thus, the housing can be configured to transfer heat from the first electronic component to the cooling medium. In this context, "essentially equal" means in particular a deviation of plus or minus 15%, in particular production-related tolerances. More preferably, the outer contour and the contour can only be the same for one section.
[0012] The subclaims show preferred developments of the invention.
[0013] Preferably, the wall has at least one opening in which a heat-conducting element is arranged, wherein the heat-conducting element at least partially rests against the outer contour, wherein the heat-conducting element is designed to increase a heat flow from the first electronic component to the cooling medium.
[0014] One advantage of this design is that the large-scale use of expensive, high-performance heat-conducting elements can be avoided. Furthermore, the targeted use of high-performance heat-conducting elements can achieve higher local cooling performance, meaning that fewer cooling elements or surfaces need to be provided for the elements to be cooled. A further advantage is that higher cooling performance can increase the performance of electronic components, such as cooled PCBs or EMC filters. In addition, high-performance heating elements can be mechanically a standard part and used wherever necessary. The carrier or carrier material into which they can be inserted can be easily adapted in terms of shape, such as a plastic. For example, the heat-conducting element can be a metal insert or similar that can replace the wall of the channel for a predetermined section.Thus, a heat flow between the first electronic component and the cooling medium can be increased by means of the heat conducting element.
[0015] Further preferably, the first heat-conducting element has a plurality of pins, wherein the plurality of pins protrude at least partially into the channel.
[0016] An advantage of this embodiment is that with the aid of the plurality of pins, a surface of the heat-conducting element can be increased in order to thus improve heat transfer between the first electronic component and the cooling medium.
[0017] More preferably, the plurality of pins has an extension length, wherein the extension length is substantially equal to a width of the channel.
[0018] An advantage of this embodiment is that when the plurality of pins extend across the entire width of the channel, the cooling medium can no longer flow past the plurality of pins, so that the heat transfer between the plurality of pins and the cooling medium can be improved.
[0019] The electronics unit further preferably has a second electronic component, the wall of the channel having a first section and a second section, the first section having a first channel height which is designed such that the first electronic component rests against the first section, the second section having a second channel height which is designed such that the second electronic component rests against the second section. An advantage of this embodiment is that by adapting the respective channel heights in the first and second sections, the material thickness between the first electronic component or the second electronic component and the cooling medium remains the same. This can be particularly advantageous if the channel can be adapted to existing electronic units, since by adapting the channel, for exampleBy adapting a shaping tool, the channel guide can be adapted to the respective electronic component. Further preferably, the channel or housing can have a plurality of sections, each of which contains an electronic component, wherein the channel has a plurality of channel heights for each of the sections, wherein each channel height is adapted to the respective electronic component in the respective section.
[0020] Further preferably, the first electronic component has a first side and a second side, wherein the first side is arranged on the wall, wherein a printed circuit board unit is arranged on the second side, wherein the first electronic component and the wall are configured to dissipate thermal energy generated at the heat-conducting plate to the cooling medium.
[0021] An advantage of this embodiment is that a further component for cooling the printed circuit board unit can be saved, since the first electronic component can provide a sufficiently large heat dissipation in which the first electronic component can dissipate heat to the cooling medium in the channel via the wall.
[0022] Further preferably, the printed circuit board unit has a third side and a fourth side, wherein the third side of the printed circuit board unit is arranged on the second side of the first electronic component, wherein a cooling structure is arranged on the fourth side, which is connectable to the cooling system, so that the cooling medium cools the printed circuit board unit.
[0023] An advantage of this embodiment is that if the thermal design indicates that the printed circuit board unit requires increased cooling, a cooling structure can be arranged on a side of the printed circuit board unit facing away from the first electronic components. Thus, the printed circuit board unit can be cooled from two sides to increase the cooling performance of the printed circuit board unit.
[0024] A further aspect of the invention relates to a method for assembling an electronic unit, comprising the steps:
[0025] - Providing a housing unit,
[0026] - Arranging a first electronic component in the housing unit such that the first electronic component rests against a wall of a channel of the housing unit,
[0027] - Connecting a printed circuit board unit to the housing unit such that thermal energy emanating from the printed circuit board unit and / or the first electronic component is cooled by means of a cooling medium in the channel of the housing unit.
[0028] An advantage of this embodiment is that the housing unit forms recesses in which the first electronic component can be arranged so that it can rest against the wall of the channel. This simplifies assembly of the electronic component by means of the housing unit and, at the same time, provides a cooling option. Further preferably, the pre-positioned first electronic component in the housing unit can simplify assembly of the printed circuit board unit, since a contour of the housing unit already brings the first electronic component into a predetermined position. Further preferably, cooling of the printed circuit board unit can be provided by means of the first electronic component, so that the total number of components can be reduced.
[0029] More preferably, the method further comprises the steps:
[0030] - Placing a heat-conducting element in an opening in the wall of the duct,
[0031] - Connecting the first electronic component to the heat-conducting element so that heat flow between the first electronic component and the cooling medium is improved.
[0032] An advantage of this embodiment is that the first electronic component does not have to be modified, but at the same time a heat flow between the first electronic component and the cooling medium can be improved due to the heat-conducting element. For example, an opening can be provided in the wall of the channel during a primary forming process of the housing unit. The heat-conducting element can then be introduced into the opening in the wall, for example by adhesive bonding. More preferably, the heat-conducting element can be applied to the first electronic component if the heat-conducting element is already arranged in the opening. More preferably, the heat-conducting element can also be applied to the first electronic component and then the combination of both components can be arranged in the opening in the wall of the channel.
[0033] More preferably, the method further comprises the steps:
[0034] - forming a first section of the channel with a first channel height,
[0035] - forming a second section of the channel with a second channel height, wherein the first channel height and the second channel height are different.
[0036] An advantage of this embodiment is that an individual channel height can be provided for each electronic component to be arranged in the housing unit. For example, a first channel height can be formed in a first section of the channel using a slider or the like during a primary forming process of the housing unit. More preferably, a second channel height can be formed in the second section of the channel during a primary forming process using a second slider or a different orientation of the first slider. Preferably, a plurality of channel heights can also be formed, each of which is adapted to an adjacent electronic component.
[0037] A further aspect of the invention relates to a vehicle which has an electronic unit as described above and below and / or has an electronic unit which was manufactured by means of the method as described above and below.
[0038] Short description of the drawings
[0039] Embodiments of the invention are described in detail below with reference to the accompanying drawings. In the drawing:
[0040] Figures 1 to 3 show an electronic unit according to an embodiment Figures 4a to 5 show a vehicle according to an embodiment
[0041] Figures 6 and 7 show a flow chart illustrating steps of the method according to an embodiment
[0042] Embodiments of the invention
[0043] Preferably, all identical elements, units and / or steps in all figures are provided with the same reference numerals.
[0044] Figure 1 shows an electronic unit 10 according to one embodiment. The electronic unit 10 preferably has a housing unit 12 and a first electronic component 14, wherein the housing unit 12 has at least one channel 16, wherein the channel 16 is connectable to a cooling system 18, wherein the first electronic component 14 at least partially rests against a wall 20 of the channel 16, so that thermal energy originating from the first electronic component 14 is dissipated to a cooling medium in the channel 16, wherein the first electronic component 14 has a first outer contour 22, wherein the wall 20 of the channel 16 has a first contour 24, wherein the first outer contour 22 and the first contour 24 are at least partially substantially identical.
[0045] As shown in Figure 1, the wall 20 preferably has an opening 26 in which a heat-conducting element 28 is arranged. Further preferably, the heat-conducting element 28 bears at least partially against the outer contour 22 of the first electronic component 14, so that heat flow from the first electronic component 14 to the cooling medium is improved by means of the heat-conducting element 28. The heat-conducting element 28 can preferably have a plurality of pins 30. The plurality of pins 30 can, in particular, protrude at least into the channel 16 and also extend across the entire width of the channel 16.Further preferably, the electronics unit 10 has a second electronic component 32, wherein the wall 20 of the channel 16 has a first section 34 and a second section 36, wherein the first section 34 has a first channel height 38 which is configured such that the first electronic component 14 rests against the first section 34, wherein the second section 36 has a second channel height 40 which is configured such that the second electronic component 32 rests against the second section 36. As shown in Figure 1, the channel 16 can also have a plurality of sections, each with different channel heights, in order to thus keep a thickness of the wall 20 substantially constant over the extended length of the channel 16.Further preferably, the first electronic component 14 has a first side 42 and a second side 44, wherein the first side 42 is arranged on the wall 20, wherein a printed circuit board unit 46 is arranged on the second side 44, wherein the first electronic component 14 and the wall 20 are configured to dissipate thermal energy generated at the printed circuit board 46 to the cooling medium. As shown in Figure 1, the printed circuit board unit 46 borders the first electronic component 14, such that a heat flow can be provided from the printed circuit board unit 46 via the electronic component 14 to the wall 20 into the cooling medium.
[0046] Figure 2 shows an electronics unit 10 according to one embodiment. The electronics unit 10 has a housing unit 12. The housing unit 12 preferably comprises a channel 16, which can be connected to a cooling system, for example of a vehicle 200. In particular, a coolant can flow or be guided through the channel 16 in order to thus be able to cool a plurality of electronic components of the electronics unit 10 as well as components that are connected to the electronic components. For example, the wall 20 on the housing unit 12 can have an opening 26 in order to arrange the heat-conducting element 28 there. The first electronic component 14 can preferably be arranged on the heat-conducting element. The printed circuit board unit 46 can then be arranged on the first electronic component 14.
[0047] Figure 3 shows an embodiment of the electronics unit 10. The electronics unit 10 preferably has a printed circuit board unit 46, wherein the printed circuit board unit 46 preferably has a third side 48 and a fourth side 50. More preferably, the third side 48 of the printed circuit board unit 46 is arranged on the second side 44 of the first electronic component 14. More preferably, a cooling structure 52 is arranged on the fourth side 50, which can be connected to the cooling system 18 so that the cooling medium cools the printed circuit board unit 46.
[0048] Figure 4a shows a vehicle 200 according to one embodiment. The vehicle 200 preferably has a drive unit 202. The electronics unit 10 can preferably be connected to the drive unit 202 at least in a signal- and / or power-conducting manner. Further preferably, a cooling system of the vehicle 200 can be configured to supply the electronics unit 10 or the channel 16 with a cooling medium.
[0049] Figure 4b shows an embodiment of the vehicle 200. The vehicle 200 preferably has, as shown in Figure 4b, two drive units 202, each with an electronic unit 10.
[0050] Figure 4c shows a vehicle 200 according to one embodiment. The vehicle 200 has a drive unit 202, each of which is connected to an electronic unit 10. Preferably, the vehicle 200 can be driven on both the front axle and the rear axle, with two drive units 202 being arranged on one of the two axles.
[0051] Figure 4d shows a vehicle 200 according to one embodiment. The vehicle 200 has a drive unit 202, which has two electronic units 10 or is connected to them.
[0052] Figure 4e shows a vehicle 200 according to one embodiment. The vehicle 200 preferably has a drive unit 202 with an electronics unit 10 for each wheel.
[0053] Figure 4f shows a vehicle 200 according to one embodiment. The vehicle 200 preferably has a drive unit 202 for each wheel, each with two electronic units 10 that can be connected to the drive unit 202.
[0054] Figure 5 shows a vehicle 200 according to one embodiment. The vehicle 200 preferably has an electronics unit 10, as described above and below, and / or has an electronics unit 10 that was manufactured using the method 100, as described above and below.
[0055] Figure 6 shows a flowchart illustrating steps of the method 100 according to one embodiment. The method 100 for assembling an electronic unit 10 preferably comprises the following steps:
[0056] - Providing S1 a housing unit 12, - Arranging S2 a first electronic component 14 in the housing unit 12, so that the first electronic component 14 rests against a wall 20 of a channel 16 of the housing unit 12,
[0057] - Connecting S3 a printed circuit board unit 46 to the housing unit 10, so that thermal energy emanating from the printed circuit board unit 46 and / or the first electronic component 14 is cooled by means of a cooling medium in the channel 16 of the housing unit 12.
[0058] Figure 7 shows a flowchart illustrating steps of the method 100 according to an embodiment. The method 100 has the same
[0059] The method 100 further comprises steps S1 to S3, as already explained with reference to Figure 6. Further preferably, the method 100 comprises the steps S4 of arranging a heat-conducting element 28 and connecting S5 the first electronic component 14. Further preferably, the method 100 further comprises the steps of forming S6 a first section 34 and forming S7 a second section 36.
Claims
Claims 1 . Electronics unit (10) comprising: a housing unit (12), a first electronic component (14), wherein the housing unit (12) has at least one channel (16), wherein the channel (16) is connectable to a cooling system (18), wherein the first electronic component (14) is at least partially in contact with a wall (20) of the channel (16) such that thermal energy originating from the first electronic component (14) is dissipated to a cooling medium in the channel (16), wherein the first electronic component (14) has a first outer contour (22), wherein the wall (20) of the channel (16) has a first contour (24), wherein the first outer contour (22) and the first contour (24) are at least partially substantially identical.
2. Electronic unit (10) according to claim 1, wherein the wall (20) has at least one opening (26) in which a heat-conducting element (28) is arranged, wherein the heat-conducting element (28) bears at least partially against the outer contour (22), wherein the heat-conducting element (28) is designed to increase a heat flow from the first electronic component (14) to the cooling medium.
3. Electronic unit (10) according to claim 2, wherein the first heat conducting element (28) has a plurality of pins (30), the plurality of pins (30) protruding at least partially into the channel (16).
4. The electronics unit (10) of claim 3, wherein the plurality of pins (30) has an extension length, the extension length being substantially equal to a width of the channel (16).
5. Electronic unit (10) according to one of the preceding claims, wherein the electronic unit (10) comprises a second electronic component (32), wherein the wall (20) of the channel (16) has a first portion (34) and a second section (36), wherein the first section (34) has a first channel height (38) which is configured such that the first electronic component (14) bears against the first section (34), wherein the second section (36) has a second channel height (40) which is configured such that the second electronic component (32) bears against the second section (36) 6. Electronic unit (10) according to one of the preceding claims, wherein the first electronic component (14) has a first side (42) and a second side (44), wherein the first side (42) is arranged on the wall (20), wherein a printed circuit board unit (46) is arranged on the second side (44), wherein the first electronic component (14) and the wall (20) are configured to dissipate thermal energy generated at the printed circuit board unit (46) to the cooling medium.
7. Electronic unit (10) according to claim 6, wherein the printed circuit board unit (46) has a third side (48) and a fourth side (50), wherein the third side (48) of the printed circuit board unit (46) is arranged on the second side (44) of the first electronic component (14), wherein a cooling structure (52) is arranged on the fourth side (50), which is connectable to the cooling system (18) so that the cooling medium cools the printed circuit board unit (46) 8. Method (100) for assembling an electronic unit (10) comprising the steps: Providing (S1) a housing unit (12), Arranging (S2) a first electronic component (14) in the housing unit (12) such that the first electronic component (14) rests against a wall (20) of a channel (16) of the housing unit (12), Connecting (S3) a printed circuit board unit (46) to the housing unit (10) such that thermal energy emanating from the printed circuit board unit (46) and / or the first electronic component (14) is cooled by means of a cooling medium in the channel (16) of the housing unit (12).
9. The method (100) of claim 8, further comprising the steps: - arranging (S4) a heat-conducting element (28) in an opening (26) in the wall (20) of the channel (16), - Connecting (S5) the first electronic component (14) to the heat-conducting element (28) so that a heat flow between the first electronic component (14) and the cooling medium is improved.
10. The method (100) according to any one of claims 8 to 9, further comprising the Steps: - forming (S6) a first section (34) of the channel (14) with a first channel height (38), - forming (S7) a second section (36) of the channel (16) with a second channel height (40), wherein the first channel height (38) and the second Channel height (40) may differ.
11. Vehicle (200) comprising an electronic unit (10) according to one of claims 1 to 7 and / or comprising an electronic unit (10) which was manufactured by means of the method (100) according to one of claims 8 to 10.
Citation Information
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Power inverter device, arrangement and corresponding operating method
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