Additive processing head and processing machine

Abstract

An additive processing head (200) supplies a metal, projects laser light, and thereby melts the metal to perform additive processing. The additive processing head (200) comprises: a head unit (211) that can move relative to a workpiece; a surface light-emitting unit (300) that is mounted on the head unit (211) and that includes a plurality of photonic-crystal surface-emitting laser (PCSEL) elements; and a condenser lens (221) that is disposed on a straight line (210), which is the emission direction of the laser light, so as to condense the laser light from the surface light-emitting unit (300) onto the surface of the workpiece.

Description

Additive machining heads and machines

[0001] The present invention relates to an additional machining head and a machining machine.

[0002] For example, Japanese Patent Laid-Open Publication No. 2018-24006 (Patent Document 1) discloses a processing machine equipped with an additional processing head that can move relatively while supplying material powder to a workpiece and irradiating it with laser light. The laser light is guided to the additional processing head through an optical fiber.

[0003] Furthermore, Japanese Patent No. 6132995 (Patent Document 2), Japanese Patent No. 7384349 (Patent Document 3), and Japanese Patent No. 7086501 (Patent Document 4) disclose various laser processing machines equipped with multiple PCSEL (Photonic-Crystal Surface-Emitting Laser) elements.

[0004] Japanese Patent Publication No. 2018-24006 Japanese Patent No. 6132995 Japanese Patent No. 7384349 Japanese Patent No. 7086501

[0005] In the processing machine disclosed in Patent Document 1, a fiber laser, a fiber-coupled semiconductor laser, or a CO ２ A large laser oscillator such as a laser is installed outside the machine, and the laser light is transmitted to the additional processing head inside the processing area using an optical fiber. In addition, because the laser light used has poor beam quality (large beam spread), the additional processing head is equipped with optical components such as a collimating lens to properly shape the laser light. In these cases, there is a problem that the structure of the additional processing head becomes complicated.

[0006] An object of the present invention is to provide an additional machining head and a machining machine having a simple configuration.

[0007] The additional processing head according to the present invention supplies metal and irradiates it with laser light to melt the metal and perform additional processing. The additional processing head includes a head section that is movable relative to the workpiece, a surface light-emitting section that is mounted on the head section and includes a plurality of photonic-crystal surface-emitting laser (PCSEL) elements, and a focusing lens that is arranged on a straight line that is the emission direction of the laser light to focus the laser light from the surface light-emitting section on the surface of the workpiece.

[0008] A processing machine according to the present invention includes the above-described additional processing head and a tool spindle that is movable within a processing area and rotates the tool. Either the tool or the additional processing head is selectively attached to the tool spindle. The additional processing head is provided on a head portion and has a shank portion that is clamped by the tool spindle.

[0009] According to the present invention, it is possible to provide an additional machining head and a machining machine having a simple configuration.

[0010] 8 is a front view showing a processing machine. FIG. 1 is a front view showing an additional machining head held by the tool spindle in FIG. 1. FIG. 2 is a cross-sectional view showing the tool spindle and additional machining head in the area surrounded by two-dot chain line III in FIG. 2. FIG. 3 is a view showing irradiation of laser light from the additional machining head in FIG. 2 toward a workpiece. FIG. 4 is a plan view of the surface light-emitting unit in FIG. 2 as seen from the light-emitting surface side. FIG. 5 is a circuit diagram showing the surface light-emitting unit in FIG. 2. FIG. 6 is a cross-sectional view showing a PCSEL element. FIG. 7 is a view showing the relative positions of the surface light-emitting unit, the condenser lens, and the workpiece. FIG. 8 is a view showing laser light in the vicinity of the focus surrounded by the two-dot chain line IX in FIG. 8. FIG. 9 is a front view showing a modified example of the additional machining head in FIG. 2. FIG. 10 is a top view showing the relationship between the shank portion, the surface light-emitting unit, the condenser lens, and the spot of laser light in the additional machining head in FIG. 10. FIG. 11 is a top view showing the relationship between the shank portion, the surface light-emitting unit, the condenser lens, and the spot of laser light in the additional machining head in FIG. 10. FIG. 12 is a plan view showing a modified example of the surface light-emitting unit in FIG. 5. FIG. 13 is a circuit diagram showing the surface light-emitting unit in FIG. 13. FIG. 14 is a front view showing an additional machining head in a reference example. 15. A top view showing an additional machining head in a reference example, as seen in the direction of the arrows on line XVI-XVI in FIG. 15. A view of the surface light-emitting unit as seen from the light-emitting surface side. A cross-sectional view showing the surface light-emitting unit as seen in the direction of the arrows on line XVIII-XVIII in FIG. 17. A perspective view showing the electrode stack in FIG. 17. A perspective view showing a surface light-emitting device in embodiment 2 of the present invention. A circuit diagram showing the surface light-emitting device in FIG. 20. A plan view showing one mode of light emission in the surface light-emitting device in FIG. 21. A plan view showing another mode of light emission in the surface light-emitting device. A plan view showing yet another mode of light emission in the surface light-emitting device. A plan view showing the surface light-emitting device within the area surrounded by the two-dot chain line XXV in FIG. 20. A side view showing the surface light-emitting device as seen in the direction indicated by the arrow XXVII in FIG. 25. A cross-sectional view showing the surface light-emitting device as seen in the direction of the arrows on line XXVII-XXVII in FIG. 26. A cross-sectional view showing the surface light-emitting device as seen in the direction of the arrows on line XXVIII-XXVIII in FIG. 26. 27 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on the line XXIX-XXIX in Fig. 26. FIG. 28 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on the line XXX-XXX in Fig. 25.31 is a diagram schematically showing wiring between the electrode stack and the switching element in FIG. 30. FIG.

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the accompanying drawings, in which the same or corresponding elements are designated by the same reference numerals.

[0012] (Embodiment 1) Fig. 1 is a front view showing a processing machine, in which the interior of the processing machine is shown through a cover body that forms the exterior of the processing machine.

[0013] 1, the processing machine 100 is an AM / SM hybrid processing machine capable of additive manufacturing (AM) processing of a workpiece and subtractive manufacturing (SM) processing of a workpiece. The processing machine 100 has, as SM processing functions, a turning function using a fixed tool and a milling function using a rotary tool.

[0014] The processing machine 100 is an NC (Numerically Controlled) processing machine in which various operations for processing a workpiece are automated by computer numerical control.

[0015] In this specification, an axis that is parallel to the left-right direction (width direction) of the processing machine 100 and extends horizontally is referred to as the "Z axis," an axis that is parallel to the front-rear direction (depth direction) of the processing machine 100 and extends horizontally is referred to as the "Y axis," and an axis that extends vertically is referred to as the "X axis." The X axis, Y axis, and Z axis are three axes that are perpendicular to one another.

[0016] First, a description will be given of the overall structure of the processing machine 100. The processing machine 100 has a cover body 161. The cover body 161 forms the processing area 150 and also forms the external appearance of the processing machine 100.

[0017] The processing area 150 is a space where the workpiece is processed. The processing area 150 is sealed by a cover body 161 so that chips and coolant (mist) generated during the removal processing of the workpiece and fumes generated during additional processing of the workpiece do not leak out of the processing area 150.

[0018] The processing machine 100 has a bed 141 , a first work spindle 111 , a second work spindle 116 , a tool spindle 121 , and a tool rest 131 .

[0019] The bed 141 is a base member for supporting the first work spindle 111, the second work spindle 116, the tool spindle 121, the tool rest 131, etc., and is installed on the floor of a factory or the like.

[0020] The first work spindle 111 and the second work spindle 116 are arranged opposite each other in the Z-axis direction. Each of the first work spindle 111 and the second work spindle 116 is capable of holding a workpiece. Each of the first work spindle 111 and the second work spindle 116 is provided with a chuck mechanism for detachably holding a workpiece. The first work spindle 111 rotates the held workpiece about a rotation center axis 101 parallel to the Z-axis. The second work spindle 116 rotates the held workpiece about a rotation center axis 102 parallel to the Z-axis.

[0021] The first workpiece spindle 111 is fixed to the bed 141. The second workpiece spindle 116 is movable in the Z-axis direction by various feed mechanisms, guide mechanisms, servo motors, etc. The second workpiece spindle 116 may be configured to be fixed to the bed 141.

[0022] In addition, instead of the second work spindle 116, a tailstock may be provided to support the center of rotation of the work held by the first work spindle 111, or a work vibration prevention device may be provided to support the work held by the first work spindle 111 from its outer periphery and prevent the work from vibrating.

[0023] The tool spindle 121 is provided in the machining area 150. The tool spindle 121 can hold a tool for removal machining of the workpiece. The tool spindle 121 can hold a rotary tool for milling the workpiece. The tool spindle 121 is provided with a clamping mechanism 126 (see FIG. 3 described later) for detachably holding the tool. When milling the workpiece using the rotary tool, the tool spindle 121 rotates the held rotary tool about a rotation center axis 105 that is parallel to the X-axis-Z-axis plane.

[0024] The tool spindle 121 can also rotate around a predetermined axis 104 (B-axis rotation). The predetermined axis 104 is parallel to the Y-axis. As an example, the rotation range of the tool spindle 121 is within a range of ±120° from a reference position (the position shown in FIG. 1 ) in which a spindle end surface 123 of the tool spindle 121 faces downward.

[0025] The tool spindle 121 is supported on a bed 141 by a column or the like (not shown). The tool spindle 121 is movable within a machining area 150. The tool spindle 121 is movable in the X-axis, Y-axis, and Z-axis directions by various feed mechanisms, guide mechanisms, servo motors, and the like provided on the column or the like. The machining position of a rotary tool attached to the tool spindle 121 moves three-dimensionally.

[0026] Although not shown in FIG. 1 , an automatic tool changer (ATC) for automatically changing the tools held by the tool spindle 121 and a tool magazine for storing replacement tools held by the tool spindle 121 are provided around the first work spindle 111.

[0027] A plurality of fixed tools for turning are attached to the tool rest 131. The tool rest 131 is a so-called turret type, and a plurality of fixed tools are attached radially and perform turning indexing.

[0028] The tool rest 131 has a swivel unit 132. The swivel unit 132 is swivelable around a swivel central axis 106 that is parallel to the Z axis. Tool holders for holding fixed tools are attached to positions spaced apart in the circumferential direction around the swivel central axis 106. When the swivel unit 132 swivels around the swivel central axis 106, the fixed tool held in the tool holder moves in the circumferential direction, and the fixed tool to be used in the turning process is indexed.

[0029] The tool rest 131 is supported on a bed 141 by a saddle or the like (not shown). The tool rest 131 can be moved in the X-axis direction and the Z-axis direction by various feed mechanisms, guide mechanisms, servo motors, etc. provided on the saddle or the like. The tool rest 131 may also have a milling function for rotating a rotary tool.

[0030] Next, the structure of the additional machining head 200 will be described. Fig. 2 is a front view showing the additional machining head held by the tool spindle in Fig. 1. With reference to Figs. 1 and 2, the processing machine 100 further has an additional machining head 200.

[0031] The additional processing head 200 supplies metal and irradiates it with laser light to melt the metal and perform additional processing (Directed Energy Deposition). The additional processing head 200 supplies material powder to the workpiece and irradiates it with laser light to perform additional processing. Metal powder such as stainless steel, nickel-based alloy, cobalt-based alloy, or titanium is used as the material powder. The material supplied from the additional processing head 200 to the workpiece may be any metal, and may be, for example, a linear metal wire.

[0032] The additional processing head 200 has a head portion 211. The head portion 211 is movable relative to the workpiece. The head portion 211 is made of a housing that forms the external appearance of the additional processing head 200. The head portion 211 is made of metal.

[0033] Either a tool or an additional machining head 200 is selectively attached to the tool spindle 121. Figures 1 and 2 show the tool spindle 121 to which the additional machining head 200 is attached. During additional machining of the workpiece, the additional machining head 200 is held by the tool spindle 121 and moves integrally with the tool spindle 121 in the X-axis, Y-axis and Z-axis directions and rotates about the predetermined axis 104. During removal machining of the workpiece, the additional machining head 200 is detached from the tool spindle 121.

[0034] Although not shown in FIG. 1, a head stocker for accommodating the additional machining head 200 detached from the tool spindle 121 is provided around the second work spindle 116 .

[0035] Figure 3 is a cross-sectional view showing the tool spindle and additional machining head in the area surrounded by the two-dot chain line III in Figure 2. Referring to Figure 3, the tool spindle 121 has a spindle body 122. The spindle body 122 is made of a cylindrical body centered on the central rotation axis 105. The spindle body 122 is supported so as to be rotatable about the central rotation axis 105. The spindle body 122 has the aforementioned spindle end surface 123. The spindle end surface 123 is made of a plane perpendicular to the central rotation axis 105.

[0036] The tool spindle 121 (spindle body 122) is provided with a tool insertion hole 125. The tool insertion hole 125 extends in the axial direction of the rotation center axis 105 and has a hole shape that opens to the spindle end face 123. When a tool is attached to the tool spindle 121 during removal processing of the workpiece, the tool (the shank portion of the tool) is inserted into the tool insertion hole 125.

[0037] The tool spindle 121 further has a clamping mechanism 126. The clamping mechanism 126 is provided on the spindle body 122. The clamping mechanism 126 is a mechanism for holding a tool on the tool spindle 121 during removal machining of a workpiece. The clamping mechanism 126 is operable between a clamped state in which the tool is clamped and an unclamped state in which the tool is unclamped. In this embodiment, the shack specification of the tool that can be held by the clamping mechanism 126 is a polygonal tapered shank.

[0038] The additional machining head 200 further has a shank portion 231. The shank portion 231 has a shack shape that corresponds to the shank specifications (polygonal tapered shank) of a tool that can be held by the clamping mechanism 126. When the additional machining head 200 is attached to the tool spindle 121 during additional machining of a workpiece, the shank portion 231 is inserted into the tool insertion hole 125.

[0039] The clamping mechanism 126 includes a draw bar 128, a collet 127, a spring member 129, and an unclamping cylinder (not shown).

[0040] Draw bar 128 is provided on the axis of rotation central shaft 105. Draw bar 128 is provided so as to be able to slide in the axial direction of rotation central shaft 105 (in the axial direction of rotation central shaft 105, the side on which spindle end surface 123 is located is referred to as the "front side," and the opposite side is referred to as the "rear side").

[0041] Collet 127 is attached to the front end of draw bar 128. Collet 127 is disposed inside shank portion 231 having a cylindrical shape. Collet 127 deforms so as to contract or expand its diameter around rotation center shaft 105 as draw bar 128 slides in the axial direction of rotation center shaft 105. Spring member 129 is provided on the outer periphery of draw bar 128. Spring member 129 applies an elastic force to draw bar 128 toward the rear in the axial direction of rotation center shaft 105. An unclamping cylinder is provided at the rear end of draw bar 128. When hydraulic pressure is supplied to the unclamping cylinder, it operates to slide draw bar 128 forward in the axial direction of rotation center shaft 105.

[0042] In this configuration, when the additional machining head 200 is attached to the tool spindle 121, the elastic force of the spring member 129 causes the draw bar 128 to slide rearward in the axial direction of the rotation center shaft 105. The collet 127 deforms so as to expand in diameter around the rotation center shaft 105, and pulls the shank portion 231 rearward in the axial direction of the rotation center shaft 105. This results in a clamped state of the shank portion 231 by the clamp mechanism 126.

[0043] On the other hand, when the additional machining head 200 is detached from the tool spindle 121, hydraulic pressure is supplied to the unclamping cylinder, causing the draw bar 128 to slide forward in the axial direction of the rotation center shaft 105. While the collet 127 deforms so as to reduce in diameter around the rotation center shaft 105, the draw bar 128 pushes the shank portion 231 forward in the axial direction of the rotation center shaft 105. This results in an unclamped state of the shank portion 231 by the clamping mechanism 126.

[0044] The shack specifications of the tool that can be held by the clamping mechanism in the tool spindle are not limited to a polygonal tapered shank, but may also be, for example, a hollow tapered shank.

[0045] As shown in Fig. 2, the additive machining head 200 further has a material powder discharge portion 217. The material powder discharge portion 217 is provided in the head portion 211. The material powder discharge portion 217 is made of a tubular member through which material powder can flow. The material powder discharge portion 217 opens at a position spaced apart radially outward from the central axis 201, which will be described later. The material powder discharge portion 217 discharges material powder toward the workpiece.

[0046] Fig. 4 is a diagram showing irradiation of laser light from the additional processing head in Fig. 2 toward a workpiece. Fig. 5 is a plan view of the surface light-emitting unit in Fig. 2 as viewed from the light-emitting surface side. Fig. 6 is a circuit diagram showing the surface light-emitting unit in Fig. 2. In Fig. 6 and Figs. 14 and 21 described later, two arrows are attached to the PCSEL element 331 that emits laser light. Fig. 7 is a cross-sectional view showing a PCSEL element.

[0047] 2 to 7, the additional processing head 200 further includes a surface light-emitting unit 300 (300A). The surface light-emitting unit 300 is mounted on the head unit 211. The surface light-emitting unit 300 is fixed inside the head unit 211.

[0048] The surface light-emitting unit 300 has a plurality of photonic-crystal surface-emitting laser (PCSEL) elements 331 (331-1 to 331-36).

[0049] As shown in FIG. 7, a PCSEL element 331 has an element body 310 , a front electrode 321 , a rear electrode 326 , and an AR (Anti Reflection) coating layer 322 .

[0050] The element body 310 is formed of, for example, GaAs (gallium arsenide). The element body 310 has a substrate 311, an n-type cladding layer 312, an active layer 313, a carrier block layer 314 which is a p-type doped layer, a photonic crystal layer 315, a p-type cladding layer 317, a back surface reflector (distributed Bragg reflector) 319, and a p-type contact layer 318. The substrate 311, the n-type cladding layer 312, the active layer 313, the carrier block layer 314, the photonic crystal layer 315, the p-type cladding layer 317, the back surface reflector 319, and the p-type contact layer 318 are stacked in the listed order in the thickness direction of the element body 310. The photonic crystal layer 315 has a plurality of holes 316 formed as a periodic structure approximately equal to the oscillation wavelength.

[0051] The order in which active layer 313, carrier block layer 314 and photonic crystal layer 315 are stacked may be reversed.

[0052] The element body 310 has an emission surface 310a and a back surface 310b. The emission surface 310a is the surface of the element body 310 on the substrate 311 side. The back surface 310b is the surface of the element body 310 on the p-type contact layer 318 side, and is located on the opposite side of the emission surface 310a.

[0053] The surface electrode 321 is provided along the periphery of the emission surface 310a. The surface electrode 321 has a frame shape with a circular opening. The AR coating layer 322 is provided in the opening of the surface electrode 321. The back surface electrode 326 is provided on the back surface 310b. When a voltage is applied between the surface electrode 321 and the back surface electrode 326, light is emitted in the active layer 313. The light resonates in the photonic crystal layer 315 and is emitted as laser light from the opening of the surface electrode 321 through the emission surface 310a.

[0054] The direction of emission of laser light from PCSEL element 331 is perpendicular to element body 310 (photonic crystal layer 315). Laser light generated in PCSEL element 331 travels toward emission surface 310 a and back surface 310 b, and the laser light directed toward back surface 310 b is reflected backward by back surface reflector 319 and is emitted from the opening of front surface electrode 321 through emission surface 310 a together with the laser light directed toward emission surface 310 a.

[0055] The lattice shape of the photonic crystal layer 315 (the arrangement of the plurality of holes 316) may be any shape, such as a square lattice, a triangular lattice, or an orthogonal lattice. The opening shape of the holes 316 is not particularly limited and may be, for example, circular, elliptical, or triangular. Each hole 316 may also be configured by a pair of a circular hole and an elliptical hole (a double-lattice photonic crystal).

[0056] The opening size of the surface electrode 321 that forms the laser light emitting surface is not particularly limited and may be, for example, 1 mm, 3 mm, or 10 mm in diameter. The opening size of the surface electrode 321 may be in the range of 3 mm to 10 mm in diameter. The opening size of the surface electrode 321 may also be in the range of more than 10 mm in diameter.

[0057] For example, by focusing the laser light from the PCSEL element 331 (the opening size of the surface electrode 321 is 1 mm in diameter), it is possible to irradiate a laser with an output of 10 W and a spot diameter of approximately 10 μm, and by focusing the laser light from the PCSEL element 331 (the opening size of the surface electrode 321 is 3 mm in diameter), it is possible to irradiate a laser with an output of 50 W and a spot diameter of approximately 50 μm.

[0058] 5, the multiple PCSEL elements 331 are arranged in a planar shape. The multiple PCSEL elements 331 are arranged in a plane. The multiple PCSEL elements 331 are arranged at intervals from each other. The multiple PCSEL elements 331 are arranged at equal intervals. The multiple PCSEL elements 331 are arranged in a matrix shape. The multiple PCSEL elements 331 are arranged in an area having a square planar shape.

[0059] The multiple PCSEL elements 331 (331-1 to 331-36) are arranged in a 6 x 6 matrix. PCSEL elements 331-1 to 331-6 are arranged in a row vertically on the surface of the paper showing Figure 5, PCSEL elements 331-12 to 331-7 are arranged in a row vertically, PCSEL elements 331-13 to 331-18 are arranged in a row vertically, PCSEL elements 331-24 to 331-19 are arranged in a row vertically, PCSEL elements 331-25 to 331-30 are arranged in a row vertically, and PCSEL elements 331-36 to 331-31 are arranged in a row vertically.

[0060] Each PCSEL element 331 is electrically connected to an electrode stack 371 made up of a p-side electrode 372 and an n-side electrode 373 .

[0061] The PCSEL element 331-1 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-36 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL elements 331 adjacent to each other in the vertical direction are electrically connected to each other via a plurality of wires 361. PCSEL elements 331-6 and 331-7, which are adjacent in the horizontal direction of the paper on which Figure 5 is shown, are electrically connected via multiple wires 361, PCSEL elements 331-12 and PCSEL elements 331-13, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, PCSEL elements 331-18 and PCSEL elements 331-19, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, PCSEL elements 331-24 and PCSEL elements 331-25, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, and PCSEL elements 331-30 and PCSEL elements 331-31, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361.

[0062] The p-side general terminal 351 is electrically connected to the positive side of the power supply 341, and the n-side general terminal 352 is electrically connected to the negative side of the power supply 341. With this configuration, the multiple PCSEL elements 331 are electrically connected in series. The PCSEL elements 331-1 to 331-36 are arranged in the listed order on the series electrical circuit.

[0063] The electrode structure for connecting adjacent PCSEL elements 331 will be described in detail later.

[0064] The emission directions of the laser beams from the plurality of PCSEL elements 331 are parallel to each other and perpendicular to the imaginary plane on which the plurality of PCSEL elements 331 are arranged.

[0065] Theoretically, a single PCSEL element 331 can output 50 to 100 W. Assuming that the output of a single PCSEL element 331 is 80 W, the above 6 x 6 PCSEL element array can output approximately 3 kW. This output value satisfies the laser output performance required for additive processing using directed energy deposition (DED).

[0066] 2 and 4, the additional processing head 200 further includes a condenser lens 221. The condenser lens 221 is mounted on the head portion 211. The condenser lens 221 is fixed inside the head portion 211.

[0067] The condensing lens 221 is disposed on a straight line 210, which is the emission direction of the laser light, in order to condense the laser light from the surface light-emitting unit 300 onto the surface of the workpiece W. The straight line 210 is the optical axis of the laser light from each PCSEL element 331. The straight line 210 is an imaginary straight line that passes through the center of the opening of the surface electrode 321 of each PCSEL element 331 and extends in the emission direction of the laser light from each PCSEL element 331 (the direction of the arrow indicated by the straight line 210). The condensing lens 221 is disposed at a position intersecting with the straight line 210. The condensing lens 221 is disposed at a position intersecting with a plurality of straight lines 210 that extend from the plurality of PCSEL elements 331, respectively.

[0068] The condensing lens 221 condenses the laser light from the surface light-emitting unit 300 (plurality of PCSEL elements 331) onto the surface of the workpiece W. The laser light directed from the condensing lens 221 toward the workpiece W travels around a central axis 201. The central axis 201 is the optical axis of the laser light directed from the condensing lens 221 toward the workpiece W. The central axis 201 is parallel to the straight line 210.

[0069] The condensing lens 221 is a convex lens having a convex surface 223 and a flat surface 222. The condensing lens 221 is arranged so that the flat surface 222 is perpendicular to the straight line 210. The condensing lens 221 is arranged around the central axis 201. The convex surface 223 is arranged on the side of the surface light-emitting unit 300 on the path of the laser light from the surface light-emitting unit 300 toward the workpiece W, and the flat surface 222 is arranged on the side of the workpiece W on the path of the laser light from the surface light-emitting unit 300 toward the workpiece W.

[0070] The condenser lens 221 faces the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300. The condenser lens 221 directly faces the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300. The emission direction of the laser light from the surface light-emitting unit 300 is parallel to the axial direction of the central axis 201. The laser light emitted from the surface light-emitting unit 300 enters the condenser lens 221 without passing through an optical component such as a reflecting mirror or a collimating lens.

[0071] In the present embodiment, a configuration has been described in which one condenser lens 221 is provided for a plurality of PCSEL elements 331, but the present invention is not limited to this, and a condenser lens may be provided for each of a plurality of PCSEL elements 331. For example, 36 condenser lenses 221 may be disposed opposite the surface light-emitting unit 300 having PCSEL elements 331-1 to 331-36.

[0072] 1, 2, and 4, the additional processing head 200 further has a laser light emitting unit 216. The laser light emitting unit 216 is provided in the head unit 211. The laser light emitting unit 216 has an opening facing the workpiece W. The laser light from the condenser lens 221 passes through the laser light emitting unit 216 and travels toward the workpiece W.

[0073] The surface light-emitting unit 300, the condenser lens 221, and the laser light emitting unit 216 are arranged side by side on the central axis 201. The condenser lens 221 is disposed between the surface light-emitting unit 300 and the laser light emitting unit 216.

[0074] When the additional machining head 200 is attached to the tool spindle 121, the central axis 201 is arranged on the same straight line as the rotational center axis 105 of the tool spindle 121. In this configuration, the shank portion 231 is arranged around the central axis 201. The shank portion 231, the surface light-emitting portion 300, the condensing lens 221, and the laser light emitting portion 216 are arranged side by side on the axis of the central axis 201. The surface light-emitting portion 300 is arranged between the shank portion 231 and the condensing lens 221 in the axial direction of the central axis 201.

[0075] The shank portion 231 is disposed on the opposite side of the condenser lens 221 in the axial direction of the central axis 201 , with the surface light-emitting portion 300 interposed therebetween.

[0076] Fig. 8 is a diagram showing the relative positions of the surface light emitting unit, the condenser lens, and the workpiece, and Fig. 9 is a diagram showing the laser light near the focal point surrounded by the two-dot chain line IX in Fig. 8.

[0077] Next, specific examples of the size of the surface light-emitting unit 300, the mutual distance between the surface light-emitting unit 300, the condenser lens 221 and the workpiece W, and the spot diameter of the laser light formed on the surface of the workpiece W will be described.

[0078] As shown in FIG. 5, it is assumed that the opening dimension D of the surface electrode 321 that forms the laser light emitting surface is 3 mm in diameter.

[0079] In this case, each PCSEL element 331 has a square planar shape with a side length E of 4.5 mm. The electrode stack 371 provided corresponding to each PCSEL element 331 has a square planar shape with a side length B of 8 mm. The multiple PCSEL elements 331 are arranged so that the spacing C between adjacent electrode stacks 371 in the vertical and horizontal directions is 1 mm. In this configuration, the surface light-emitting unit 300 has a square planar shape with a side length L of 53 mm.

[0080] 8 , the distance Sa between the surface light-emitting unit 300 and the condenser lens 221 (convex surface 223) in the emission direction of the laser light from the surface light-emitting unit 300 (axial direction of the central axis 201) is 50 mm. The distance Sb between the condenser lens 221 (flat surface 222) and the focal position F of the laser light in the emission direction of the laser light from the surface light-emitting unit 300 (axial direction of the central axis 201) is 200 mm.

[0081] 8 and 9, the diameter of the laser light from the condenser lens 221, centered on the central axis 201, decreases with increasing distance from the condenser lens 221, reaches a minimum at the focal position F, and increases with increasing distance from the focal position F. The spot diameter d of the laser light at the focal position F is 3 mm.

[0082] The length L of one side of the surface light-emitting unit 300 using the PCSEL element 331 whose surface electrode 321 has an opening dimension D of 3 mm in diameter may be in the range of 50 mm to 55 mm. The length L of one side of the surface light-emitting unit 300 using the PCSEL element 331 whose surface electrode 321 has an opening dimension D of 3 mm or more in diameter may be in the range of 50 mm to 100 mm, or in the range of 50 mm to 75 mm.

[0083] The distance Sa between the surface light-emitting unit 300 and the condenser lens 221 is preferably smaller than the distance Sb between the condenser lens 221 and the focal position F of the laser light (Sa<Sb). The distance Sa between the surface light-emitting unit 300 and the condenser lens 221 may be equal to or smaller than ½ the distance Sb between the condenser lens 221 and the focal position F of the laser light (Sa≦½Sb). The spot diameter d of the laser light at the focal position F may be in the range of 0.5 mm to 5 mm, or in the range of 1.5 mm to 3 mm.

[0084] The distance Sa between the surface light-emitting unit 300 and the condensing lens 221 may be equal to or less than the distance between the shank portion 231 and the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300 (the axial direction of the central axis 201), or may be greater than the distance between the shank portion 231 and the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300 (the axial direction of the central axis 201). The distance between the shank portion 231 and the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300 (the axial direction of the central axis 201) may be equal to or less than the distance Sb between the condensing lens 221 and the focal position F of the laser light, or may be greater than the distance Sb between the condensing lens 221 and the focal position F of the laser light.

[0085] Fig. 10 is a front view showing a modified example of the additional machining head in Fig. 2. Referring to Fig. 10, in this modified example, when the additional machining head 200 is attached to the tool spindle 121, a central axis 201 corresponding to the optical axis of the laser light from the condenser lens 221 is disposed so as to be offset from the rotational central axis 105 of the tool spindle 121. The central axis 201 is parallel to the rotational central axis 105 of the tool spindle 121.

[0086] Figure 11 is a top view showing the relationship between the shank portion, surface light-emitting portion, condenser lens, and laser light spot in the additional processing head in Figure 2. Figure 12 is a top view showing the relationship between the shank portion, surface light-emitting portion, condenser lens, and laser light spot in the additional processing head in Figure 10.

[0087] 2 and 11, when viewed in the axial direction of central axis 201, laser light spot SP, shank portion 231, and surface light-emitting portion 300 are arranged inside the outer shape of condenser lens 221. Spot SP and shank portion 231 are arranged inside the outer shape of surface light-emitting portion 300. Spot SP is arranged inside the outer shape of shank portion 231 (the portion with the maximum diameter centered on rotation central axis 105).

[0088] When viewed in the axial direction of the central axis 201, the surface light-emitting unit 300 may be configured to be positioned inside the outer shape of the shank portion 231, or a portion of the surface light-emitting unit 300 and a portion of the shank portion 231 may be configured to overlap each other.

[0089] The diameter of the condenser lens 221 centered on the central axis 201 is equal to or greater than the diagonal length of the surface light-emitting unit 300. The diagonal length of the surface light-emitting unit 300 is equal to or greater than the maximum diameter of the shank portion 231 centered on the rotation central axis 105. The diagonal length of the surface light-emitting unit 300 may be less than the maximum diameter of the shank portion 231 centered on the rotation central axis 105.

[0090] 10 and 12 , in this modification, the central axis 201 is offset in the Z-axis direction and the Y-axis direction from the rotational center axis 105 of the tool spindle 121. The central axis 201 may be configured to be offset from the rotational center axis 105 of the tool spindle 121 only in the Z-axis direction or only in the Y-axis direction.

[0091] Fig. 13 is a plan view showing a modification of the surface light-emitting unit in Fig. 5. Fig. 14 is a circuit diagram showing the surface light-emitting unit in Fig. 13.

[0092] 13 and 14 , in the surface light-emitting unit 300B of this modification, the PCSEL element 331-1 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-12 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL element 331-13 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-24 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL element 331-25 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-36 is electrically connected to the n-side general terminal 352 via a plurality of wires 367.

[0093] Vertically adjacent PCSEL elements 331 are electrically connected to each other via multiple wires 361. Horizontally adjacent PCSEL elements 331-6 and 331-7 are electrically connected to each other via multiple wires 361, horizontally adjacent PCSEL elements 331-18 and 331-19 are electrically connected to each other via multiple wires 361, and horizontally adjacent PCSEL elements 331-30 and 331-31 are electrically connected to each other via multiple wires 361.

[0094] The three p-side general terminals 351 are electrically connected to the positive side of the power supply 341, and the three n-side general terminals 352 are electrically connected to the negative side of the power supply 341. With this configuration, the PCSEL elements 331-1 to 331-12 are electrically connected in series in the listed order, the PCSEL elements 331-13 to 331-24 are electrically connected in series in the listed order, and the PCSEL elements 331-25 to 331-36 are electrically connected in series in the listed order. The PCSEL elements 331-1 to 331-12, the PCSEL elements 331-1 to 331-12, and the PCSEL elements 331-13 to 331-24 are electrically connected in parallel with one another.

[0095] Fig. 15 is a front view showing the additional machining head in the reference example. Fig. 16 is a top view showing the additional machining head in the reference example as seen in the direction of the arrows on line XVI-XVI in Fig. 15.

[0096] 15 and 16 , in this reference example, a laser beam is oscillated by a laser oscillator installed outside the processing machine 100, and the laser beam is introduced into the additional processing head 600 through an optical fiber 611. The laser beam is converted into parallel beams by passing through a collimating lens 612. The laser beam from the collimating lens 612 travels toward the condenser lens 221 while being reflected by a first reflecting mirror 613, a second reflecting mirror 614, a third reflecting mirror 615, a fourth reflecting mirror 616, and a fifth reflecting mirror 617 inside the additional processing head 600. The laser beam condensed by the condenser lens 221 is emitted toward the workpiece through the laser beam emitting unit 216.

[0097] In the above reference examples, a fiber laser, a fiber-coupled semiconductor laser, or a CO ２ A large laser oscillator such as a laser is installed outside the processing area, and laser light is transmitted to an additional processing head 600 within the processing area using an optical fiber 611. In addition, by providing a collimating lens 612 in the additional processing head 600, the laser light from the optical fiber 611 is converted into parallel light, and further by providing a plurality of reflecting mirrors 613 to 617 in the additional processing head 600, the laser light introduced into the additional processing head 600 by the optical fiber 611 is guided to a condenser lens 221.

[0098] 1 to 14, in contrast to this, in the additional processing head 200 of the present embodiment, a head section 211 that is movable relative to the workpiece is equipped with a surface light-emitting section 300 that includes a plurality of PCSEL elements 331, and a focusing lens 221 that can focus laser light from the surface light-emitting section 300 onto the surface of the workpiece W.

[0099] In this configuration, the surface light-emitting unit 300 using the PCSEL element 331 as the light-emitting element is small and capable of emitting high-power laser light, so the surface light-emitting unit 300 can be directly mounted on the additional processing head 200. This makes it possible to omit an optical fiber for transmitting laser light to the additional processing head 200 and simplify the configuration of the additional processing head 200. In addition, the PCSEL element 331 has the characteristic of high beam quality (small beam divergence). Therefore, optical components for shaping laser light, such as a collimating lens, can be omitted, further simplifying the configuration of the additional processing head 200.

[0100] The condenser lens 221 is disposed opposite the surface light-emitting unit 300 in the direction in which the laser light is emitted from the surface light-emitting unit 300 .

[0101] As described above, the surface light-emitting unit 300 is small. Therefore, when the surface light-emitting unit 300 is mounted on the additional processing head 200, the surface light-emitting unit 300 and the condenser lens 221 can be arranged opposite each other, regardless of the space constraints within the head unit 211. This makes it possible to omit optical components for guiding the laser light, such as a reflecting mirror, and further simplify the configuration of the additional processing head 200.

[0102] Furthermore, if the distance Sa between the surface light-emitting unit 300 and the focusing lens 221 is smaller than the distance Sb between the focusing lens 221 and the focal position F of the laser light, the surface light-emitting unit 300 and the focusing lens 221 can be arranged in a more compact space within the head unit 211.

[0103] Furthermore, in the processing machine 100 of this embodiment, the additional processing head 200 has a shank portion 231 that is clamped by the tool spindle 121. In this configuration, the additional processing head 200 is attached to the tool spindle 121 by clamping the shank portion 231 with the tool spindle 121. This makes it possible to irradiate the workpiece W with laser light from the additional processing head 200 while moving the additional processing head 200 integrally with the tool spindle 121.

[0104] Moreover, the shank portion 231 is disposed on the opposite side of the condenser lens 221 across the surface light-emitting portion 300 in the axial direction of the central axis 201. With this configuration, the shank portion 231 can be provided on the head portion 211 without affecting the progression of the laser light emitted from the surface light-emitting portion 300.

[0105] Next, the electrode structure for electrically connecting the plurality of PCSEL elements 331 to each other will be described.

[0106] Fig. 17 is a view of the surface light-emitting unit as viewed from the light-emitting surface side. Fig. 18 is a cross-sectional view showing the surface light-emitting unit as viewed in the direction of the arrows on line XVIII-XVIII in Fig. 17. For simplification, Figs. 17 and 18 show two PCSEL elements 331A and 331B electrically connected in series. Fig. 19 is a perspective view showing the electrode stack in Fig. 17.

[0107] 17 to 19 , the surface light-emitting unit 300 further includes an electrode stack 371 (371A, 371B). The electrode stack 371A and the electrode stack 371B are provided corresponding to the PCSEL element 331A and the PCSEL element 331B, respectively. The electrode stack 371A and the electrode stack 371B are provided with a gap between them.

[0108] The electrode laminate 371 has a p-side electrode 372 and an n-side electrode 373. Each of the p-side electrode 372 and the n-side electrode 373 is made of, for example, a copper frame.

[0109] The p-side electrode 372 is disposed around the PCSEL element 331 when the emission surface 310a of the element body 310 is viewed in a plan view (when viewed in the thickness direction of the element body 310). The p-side electrode 372 extends in a frame shape around the PCSEL element 331 when the emission surface 310a of the element body 310 is viewed in a plan view (when viewed in the thickness direction of the element body 310). The n-side electrode 373 is disposed around the PCSEL element 331 when the emission surface 310a of the element body 310 is viewed in a plan view (when viewed in the thickness direction of the element body 310). The n-side electrode 373 extends in a frame shape around the PCSEL element 331 when the emission surface 310a of the element body 310 is viewed in a plan view. The p-side electrode 372 and the n-side electrode 373 are stacked in the thickness direction of the element body 310 with an insulating layer 374 interposed therebetween.

[0110] The p-side electrode 372 is provided at a position perpendicular to the thickness direction of the element body 310 and intersects with an imaginary plane on which the element body 310 is disposed. The p-side electrode 372 extends in a rectangular shape along the outer periphery of the PCSEL element 331, with a gap between the p-side electrode 372 and the PCSEL element 331. The n-side electrode 373 is provided at a position perpendicular to the thickness direction of the element body 310 and protrudes beyond the imaginary plane on which the element body 310 is disposed in the direction in which laser light is emitted from the PCSEL element 331.

[0111] The cross-sectional area of ​​the p-side electrode 372 when cut along a plane perpendicular to the thickness direction of the element body 310 is larger than the cross-sectional area of ​​the n-side electrode 373 when cut along a plane perpendicular to the thickness direction of the element body 310. When viewed in the thickness direction of the element body 310, the outer peripheral edge of the p-side electrode 372 protrudes in a direction away from the element body 310 more than the outer peripheral edge of the n-side electrode 373. When viewed in the thickness direction of the element body 310, the inner peripheral edge of the p-side electrode 372 and the inner peripheral edge of the n-side electrode 373 are aligned.

[0112] The surface light-emitting unit 300 further includes a submount 381 (381A, 381B) and a conductive layer 382 (382A, 382B).

[0113] The submounts 381A and 381B are provided corresponding to the PCSEL elements 331A and 331B, respectively. The conductive layers 382A and 382B are provided corresponding to the PCSEL elements 331A and 331B, respectively.

[0114] The conductive layer 382 is provided in a layered form so that the direction of laser light emission from the element body 310 is the thickness direction. The conductive layer 382 is formed of a conductive material. The PCSEL element 331 and the electrode stack 371 are mounted on the submount 381 via the conductive layer 382. The back electrode 326 of the PCSEL element 331 and the p-side electrode 372 of the electrode stack 371 are joined to the conductive layer 382, ​​which is a plated layer. The submount 381 is formed of a material with high thermal conductivity. The submounts 381A and 381B are provided with a gap between them.

[0115] The surface light-emitting unit 300 further includes a heat sink 386. A refrigerant such as cooling oil is circulated through the heat sink 386. The submount 381 (381A, 381B) is connected to the heat sink 386 via a solder layer 383. The heat sink 386 functions to promote heat dissipation from the PCSEL elements 331 and to hold the multiple PCSEL elements 331 together.

[0116] In each PCSEL element 331, the p-side electrode 372 is electrically connected to the PCSEL element 331. The p-side electrode 372 is electrically connected to the backside electrode 326 via a conductive layer 382. The p-side electrode 372 is bonded to the conductive layer 382 along the entire periphery that extends in a frame shape around the PCSEL element 331. The entire surface of the backside electrode 326 is bonded to the conductive layer 382.

[0117] In each PCSEL element 331, the n-side electrode 373 is electrically connected to the PCSEL element 331. The n-side electrode 373 is electrically connected to the surface electrode 321 via a plurality of wires 362. The wires 362 are connected to the n-side electrode 373 and the surface electrode 321. The plurality of wires 362 are provided at intervals from one another on the n-side electrode 373. The plurality of wires 362 are provided at intervals from one another in the circumferential direction of the n-side electrode 373 that extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided around the entire periphery of the n-side electrode 373 that extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided on the four sides of the n-side electrode 373 that extends in a rectangular shape.

[0118] The multiple wires 362 may be provided in a partial section in the circumferential direction of the n-side electrode 373. The multiple wires 362 may be provided, for example, on two opposing sides of the n-side electrode 373 extending in a rectangular shape.

[0119] The adjacent PCSEL elements 331A and 331B are electrically connected to each other via multiple wires 361. The wires 361 are connected to an n-side electrode 373 of the electrode stack 371A and a p-side electrode 372 of the electrode stack 371B. The multiple wires 361 are provided at intervals from each other in the circumferential direction of the p-side electrode 372 and n-side electrode 373 that extend in a frame shape around the PCSEL element 331. The multiple wires 361 are provided on one side of the n-side electrode 373 and on one side of the p-side electrode 372 that extends adjacent to and parallel to one side of the n-side electrode 372.

[0120] The p-side electrode 372 of the electrode laminate 371A is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The n-side electrode 373 of the electrode laminate 371B is electrically connected to the n-side general terminal 352 via a plurality of wires 367.

[0121] 18 , current from the p-side main terminal 351 flows through the wire 366 to the p-side electrode 372 of the electrode laminate 371A. The current flows from the p-side electrode 372 of the electrode laminate 371A through the conductive layer 382A to the back electrode 326 of the PCSEL device 331A. The current that has flowed through the PCSEL device 331A flows from the front electrode 321 through the multiple wires 362 to the n-side electrode 373 of the electrode laminate 371A.

[0122] Current from the n-side electrode 373 of the electrode stack 371A flows to the p-side electrode 372 of the electrode stack 371B through multiple wires 361. The current flows through the electrode stack 371B and the PCSEL element 331B in the same order as the current flow through the electrode stack 371A and the PCSEL element 331A. The current from the n-side electrode 373 of the electrode stack 371B flows to the n-side general terminal 352 through multiple wires 367.

[0123] In the surface light-emitting unit 300 of this embodiment, in order to achieve the high output required for metal melting, a PCSEL element 331 having a large area when the emission surface 310a is viewed in a plan view is used. In this case, it is necessary to pass a current uniformly across the large-area PCSEL element 331.

[0124] In contrast, in the present embodiment, an electrode stack 371 made up of a p-side electrode 372 and an n-side electrode 373 stacked via an insulating layer 374 is disposed around the PCSEL element 331 when the emission surface 310a is viewed in plan, and the p-side electrode 372 and the n-side electrode 373 are electrically connected to the PCSEL element 331. This configuration allows current to flow from the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan toward the PCSEL element, and current to flow from the PCSEL element 331 toward the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan. This allows current to flow uniformly across the entire surface even in the large-area PCSEL element 331.

[0125] Furthermore, the stacked structure of the p-side electrode 372 and the n-side electrode 373 can further reduce the distance between the multiple PCSEL elements 331. This allows the surface emitting unit 300 to be further miniaturized.

[0126] The PCSEL element 331 also has a surface electrode 321 provided along the periphery of the emission surface 310a. The PCSEL element 331 and the n-side electrode 373 are provided on the n-side electrode 373 at intervals from each other and are electrically connected by a plurality of wires 362 extending between the n-side electrode 373 and the surface electrode 321. With this configuration, current can be made to flow from the PCSEL element 331 through the plurality of wires 362 toward the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan.

[0127] The PCSEL element 331 also has a back electrode 326 provided on the back surface 310b of the element body 310. The PCSEL element 331 and the p-side electrode 372 are electrically connected by a conductive layer 382 to which the back electrode 326 and the p-side electrode 372 are bonded. With this configuration, a current can flow from the periphery of the PCSEL element 331, when the emission surface 310a is viewed in plan, toward the PCSEL element 331 through the conductive layer 382.

[0128] In the present embodiment, the p-side electrode 372 and the n-side electrode 373 have a frame structure surrounding the PCSEL element on all four sides. However, the p-side electrode and the n-side electrode of the present invention may be disposed in at least a portion of the area surrounding the PCSEL element. For example, the p-side electrode and the n-side electrode may have a shape that surrounds the PCSEL element on three sides. Furthermore, the p-side electrode and the n-side electrode may have a divided structure consisting of two parts facing each other across the PCSEL element, or a divided structure consisting of four parts located at the four corners of the PCSEL element.

[0129] From another perspective, the additional processing head described above is an additional processing head that is detachable from a processing machine and that supplies metal and irradiates it with laser light to melt the metal and perform additional processing. The additional processing head includes a head section that is movable relative to a workpiece while attached to the processing machine, a surface light-emitting section mounted on the head section and having (i) a plurality of photonic-crystal surface-emitting laser (PCSEL) elements arranged in a plane and (ii) a heat sink that holds the plurality of PCSEL elements together and dissipates heat from the PCSEL elements, and a focusing lens that is arranged on a straight line that is the emission direction of the laser light to focus the laser light from the surface light-emitting section on the surface of the workpiece.

[0130] The additional processing head further includes a plurality of switching elements electrically connected to the plurality of PCSEL elements, respectively. When viewed along the direction of emission of the laser light from the surface light-emitting portion, at least a portion of the heat sink overlaps with a first region in which the plurality of PCSEL elements are arranged in a plane, and the plurality of switching elements are arranged in a second region adjacent to the first region.

[0131] The additional processing head is detachable from a processing machine and supplies metal and irradiates it with laser light to melt the metal and perform additional processing. The additional processing head includes a head section that is movable relative to a workpiece when attached to the processing machine, a surface light-emitting section mounted on the head section and having multiple photonic-crystal surface-emitting laser (PCSEL) elements, a focusing lens arranged on a straight line that is the direction of laser light emission to focus the laser light from the surface light-emitting section on the surface of the workpiece, and a holding section that is attached to the head section and held by the processing machine when the head section is attached to the processing machine. The multiple PCSEL elements are arranged in a planar manner in a predetermined area, and when viewed along the direction of laser light emission from the surface light-emitting section, the center of the predetermined area and the holding section are separated from each other.

[0132] (Embodiment 2) Fig. 20 is a perspective view showing a surface light emitting device in embodiment 2 of the present invention. Fig. 21 is a circuit diagram showing the surface light emitting device in Fig. 20.

[0133] Surface light emitting device 300C in the present embodiment has a configuration basically similar to that of surface light emitting unit 300A in Embodiment 1. Hereinafter, description of the overlapping structure will not be repeated.

[0134] 20 and 21, a surface light-emitting device 300C in this embodiment corresponds to the surface light-emitting unit 300 (300A, 300B) in the first embodiment. The surface light-emitting device 300C is used for additional processing of a workpiece. More specifically, the surface light-emitting device 300C is used for additional processing of a workpiece by directed energy deposition. The surface light-emitting device 300C has a plurality of PCSEL elements 331 (331-1 to 331-36). The plurality of PCSEL elements 331 are electrically connected in series with one another. The PCSEL elements 331-1 to 331-36 are arranged in a series electrical circuit in the order listed.

[0135] The multiple PCSEL elements 331 (331-1 to 331-36) are arranged in a 6 × 6 matrix. The multiple PCSEL elements 331 are arranged in a plane including a first direction 510 and a second direction 520. The multiple PCSEL elements 331 are aligned in the first direction 510 and a second direction 520 that is perpendicular to the first direction 510.

[0136] In this specification, the right direction on the paper surface showing Fig. 21 corresponds to the positive direction in first direction 510, and the left direction on the paper surface showing Fig. 21 corresponds to the negative direction in first direction 510. In addition, the upward direction on the paper surface showing Fig. 21 corresponds to the positive direction in second direction 520, and the downward direction on the paper surface showing Fig. 21 corresponds to the negative direction in second direction 520.

[0137] The PCSEL elements 331-1, 331-2, and 331-3 are arranged in the listed order from the positive side to the negative side of the first direction 510. The PCSEL elements 331-4, 331-5, and 331-6 are arranged in the listed order from the positive side to the negative side of the first direction 510. The PCSEL elements 331-1 and 331-4 are arranged in the listed order from the positive side to the negative side of the second direction 520, the PCSEL elements 331-2 and 331-5 are arranged in the listed order from the positive side to the negative side of the second direction 520, and the PCSEL elements 331-3 and 331-6 are arranged in the listed order from the positive side to the negative side of the second direction 520.

[0138] In the same order as above, PCSEL elements 331-7 to 331-9, PCSEL elements 331-10 to 331-12, PCSEL elements 331-13 to 331-15, and PCSEL elements 331-16 to 331-18 are arranged in a first direction 510 and a second direction 520.

[0139] The PCSEL elements 331-19 to 331-36 are provided at positions obtained by moving the PCSEL elements 331-1 to 331-18 point-symmetrically with respect to the center of the light-emitting surface of the surface light-emitting device 300C.

[0140] The multiple PCSEL elements 331 are mounted on the heat sink 386 in groups of PCSEL elements 331-1 to 331-9, PCSEL elements 331-10 to 331-18, PCSEL elements 331-19 to 331-27, and PCSEL elements 331-28 to 331-36.

[0141] The surface light emitting device 300C further includes a plurality of switching elements 431 (431-1 to 431-36) and a plurality of gate drivers 440.

[0142] The multiple switching elements 431 are electrically connected in parallel to the multiple PCSEL elements 331. The switching elements 431-1 to 431-36 are provided corresponding to the PCSEL elements 331-1 to 331-36, respectively. The switching elements 431 are made up of transistors capable of handling large currents. The switching elements 431 are made up of, for example, GaN-Field Effect Transistors (FETs).

[0143] The multiple switching elements 431 are arranged adjacent to the multiple PCSEL elements 331 arranged in a matrix. The multiple PCSEL elements 331 are arranged in a planar manner within a plane including the first direction 510 and the second direction 520. The multiple switching elements 431 are arranged linearly along the periphery of the multiple PCSEL elements 331 arranged in a matrix.

[0144] The switching elements 431-1 to 431-36 are provided corresponding to the PCSEL elements 331-1 to 331-36, respectively. The switching elements 431-1 to 431-18 are arranged in the second direction 520 along the PCSEL element 331-1, PCSEL element 331-4, PCSEL element 331-7, PCSEL element 331-10, PCSEL element 331-13, and PCSEL element 331-16, in the listed order. Switching elements 431-1 to 431-3 face PCSEL element 331-1 in the second direction 520, switching elements 431-4 to 431-6 face PCSEL element 331-4 in the second direction 520, switching elements 431-7 to 431-9 face PCSEL element 331-7 in the second direction 520, switching elements 431-10 to 431-12 face PCSEL element 331-10 in the second direction 520, switching elements 431-13 to 431-15 face PCSEL element 331-13 in the second direction 520, and switching elements 431-16 to 431-18 face PCSEL element 331-16 in the second direction 520.

[0145] The switching elements 431-19 to 431-36 are provided at positions obtained by moving the switching elements 431-1 to 431-18 point-symmetrically with respect to the center of the light-emitting surface of the surface light-emitting device 300C.

[0146] The plurality of gate drivers 440 are provided corresponding to the plurality of switching elements 431, respectively. The gate drivers 440 apply voltages to the gates of the switching elements 431 to drive and control the switching elements 431.

[0147] The multiple gate drivers 440 are arranged facing the multiple switching elements 431 in the first direction 510. The multiple switching elements 431 and the multiple gate drivers 440 are mounted on the printed circuit board 441 in groups of two: a group of multiple gate drivers 440 corresponding to the switching elements 431-1 to 431-18 and the switching elements 431-1 to 431-18, and a group of multiple gate drivers 440 corresponding to the switching elements 431-19 to 431-36 and the switching elements 431-19 to 431-36.

[0148] Fig. 22 is a plan view showing one mode of light emission in the surface light-emitting device in Fig. 21. The two arrows attached to each PCSEL element 331 in Fig. 21 correspond to the mode of light emission shown in Fig. 22. Also, in Fig. 21, the current flow is indicated by the arrows. With reference to Figs. 20 to 22, when a switching element 431 is turned off, no current flows through that switching element 431, and the PCSEL element 331 electrically connected in parallel with that switching element 431 is energized. On the other hand, when a switching element 431 is turned on, current flows through that switching element 431, and the PCSEL element 331 electrically connected in parallel with that switching element 431 is de-energized.

[0149] 21 and 22, switching element 431-1, switching element 431-9, switching element 431-12, switching element 431-16, switching element 431-19, switching element 431-27, switching element 431-30, and switching element 431-34 are turned on, and the remaining switching elements 431 are turned off. As a result, PCSEL element 331-1, PCSEL element 331-9, PCSEL element 331-12, PCSEL element 331-16, PCSEL element 331-19, PCSEL element 331-27, PCSEL element 331-30, and PCSEL element 331-34 are not emitting light, and the remaining PCSEL elements 331 are emitting light. The light emission patterns of the multiple PCSEL elements 331 are symmetrical with respect to each of the lines that pass through the center of the light emitting surface of the surface emitting device 300C and extend in the first direction 510 and the second direction 520.

[0150] 23 and 24 are plan views showing another mode of light emission in a surface light emitting device. Referring to Fig. 23, all of the switching elements 431-1 to 431-36 are turned off. As a result, all of the PCSEL elements 331-1 to 331-36 emit light.

[0151] 24, switching element 431-12, switching element 431-15, switching element 431-17, switching element 431-18, switching element 431-20, switching element 431-21, switching element 431-24, and switching element 431-27 are turned on, and the remaining switching elements 431 are turned off. As a result, PCSEL element 331-12, PCSEL element 331-15, PCSEL element 331-17, PCSEL element 331-18, PCSEL element 331-20, PCSEL element 331-21, PCSEL element 331-24, and PCSEL element 331-27 are not emitting light, and the remaining PCSEL elements 331 are emitting light. The light emission behavior of the multiple PCSEL elements 331 is asymmetric with respect to a line passing through the center of the light-emitting surface of the surface-emitting device 300C and extending in the first direction 510, while it is symmetric with respect to a line passing through the center of the light-emitting surface of the surface-emitting device 300C and extending in the second direction 52.

[0152] As described above, in the surface light-emitting device 300C of the present embodiment, any of the multiple PCSEL elements 331 can be made to emit light by selectively controlling the on / off of the multiple switching elements 431. This makes it possible to change the spot shape of the laser light formed on the workpiece surface in accordance with various processing conditions for additional processing, such as the shape of the workpiece surface, the range in which the workpiece is to be melted, or the scanning direction of the additional processing head 200 relative to the workpiece.

[0153] The spot shape of the laser light emitted from the condenser lens 221 changes depending on the distance from the focal position. For example, at a position 15 mm closer to the condenser lens 221 from the focal position, a spot shape similar to the light emission mode of the surface light-emitting device 300C is obtained. As the laser light spot gets smaller closer to the condenser lens 221 from the focal position, the corners of the spot shape become rounded, and at the focal position, a single-peaked spot shape is obtained.

[0154] Fig. 25 is a plan view showing the surface light emitting device in the area surrounded by the two-dot chain line XXV in Fig. 20. Fig. 26 is a side view showing the surface light emitting device as viewed in the direction indicated by the arrow XXVI in Fig. 25. Fig. 27 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXVII-XXVII in Fig. 26. Fig. 28 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXVIII-XXVIII in Fig. 26. Fig. 29 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXIX-XXIX in Fig. 26.

[0155] Fig. 30 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on the line XXX-XXX in Fig. 25. Fig. 31 is a diagram schematically showing wiring between the electrode stack and the switching elements in Fig. 30.

[0156] 25 to 31, the surface light-emitting device 300C further includes an electrode stack 461. The following describes the structure of the electrode stack 461 provided for the PCSEL elements 331-1, 331-2, and 331-3 that are arranged in the first direction 510, but the electrode stacks 461 provided for the PCSEL elements 331-4 to 331-36 also have a similar structure.

[0157] The electrode stack 461 forms a current path for the PCSEL element 331-1, a current path for the PCSEL element 331-2, and a current path for the PCSEL element 331-3. The electrode stack 461 has a layer structure in a third direction 530 that is perpendicular to the first direction 510 and the second direction 520. The third direction 530 is the direction in which laser light is emitted from the PCSEL element 331 (the thickness direction of the element body 310).

[0158] The electrode stack 461 has a first layer 471 (471A, 471B, 471C) and a second layer 472 (472A, 472B, 472C).

[0159] The first layer 471 forms a current path flowing into the PCSEL element 331. The second layer 472 forms a current path flowing out from the PCSEL element 331. The first layer 471 and the second layer 472 are provided in pairs corresponding to the PCSEL elements 331-1, 331-2, and 331-3.

[0160] The first layer 471 has a p-side electrode portion 471p and a first extension portion 471e. The p-side electrode portion 471p has a configuration corresponding to the p-side electrode 372 described in the first embodiment. When viewed in the third direction 530, the p-side electrode portion 471p extends in a frame shape around the PCSEL element 331. When viewed in the third direction 530, the p-side electrode portion 471p extends in a rectangular shape along the outer periphery of the PCSEL element 331.

[0161] The p-side electrode portion 471p is electrically connected to the PCSEL element 331. The p-side electrode portion 471p is joined to the conductive layer 382, ​​which is a plated layer, via the conductive layer 456. The back electrode 326 of the PCSEL element 331 is joined to the conductive layer 382, ​​which is a plated layer. The p-side electrode 372 is electrically connected to the back electrode 326 via the conductive layer 456 and the conductive layer 382.

[0162] The first extending portion 471e extends in the first direction 510 from the p-side electrode portion 471p toward the switching element 431. The first extending portion 471e extends in the first direction 510 at a position offset in the second direction 520 from the PCSEL element 331. The first extending portion 471e extends in the first direction 510 on both sides of the PCSEL element 331 in the second direction 520.

[0163] The second layer 472 has an n-side electrode portion 472n and a second extension portion 472e. The n-side electrode portion 472n has a configuration corresponding to the n-side electrode 373 described in the first embodiment. When viewed in the third direction 530, the n-side electrode portion 472n extends in a frame shape around the PCSEL element 331. When viewed in the third direction 530, the n-side electrode portion 472n extends in a rectangular shape along the outer periphery of the PCSEL element 331. The n-side electrode portion 472n forms a layered structure with the p-side electrode portion 471p with the insulating layer 481 interposed therebetween in the third direction 530.

[0164] The n-side electrode portion 472n is electrically connected to the PCSEL element 331. The n-side electrode portion 472n is electrically connected to the surface electrode 321 via a plurality of wires 362. The wires 362 are connected to the n-side electrode portion 472n and the surface electrode 321. The plurality of wires 362 are provided at intervals from one another in the circumferential direction of the n-side electrode 373 that extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided on two sides of the n-side electrode portion 472n that extend in a rectangular shape, facing each other in the first direction 510.

[0165] The second extending portion 472e extends in the first direction 510 from the n-side electrode portion 472n toward the switching element 431. The second extending portion 472e extends in the first direction 510 at a position offset in the second direction 520 from the PCSEL element 331. The second extending portion 472e extends in the first direction 510 on both sides of the PCSEL element 331 in the second direction 520. The second extending portion 472e forms a layered structure with the n-side electrode portion 472n in the third direction 530, with the insulating layer 481 interposed therebetween.

[0166] The first layer 471A and the second layer 472A are provided corresponding to the PCSEL element 331-1. The first layer 471B and the second layer 472B are provided corresponding to the PCSEL element 331-2. The first layer 471C and the second layer 472C are provided corresponding to the PCSEL element 331-3.

[0167] The p-side electrode portion 471p of the first layer 471A extends in a frame shape around the PCSEL element 331-1 when viewed in the third direction 530. The first extension portion 471e of the first layer 471A extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471A toward the switching elements 431-1 to 431-3. The p-side electrode portion 471p of the first layer 471B extends in a frame shape around the PCSEL element 331-2 when viewed in the third direction 530. The first extension portion 471e of the first layer 471B extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471B toward the switching elements 431-1 to 431-3. The p-side electrode portion 471p of the first layer 471C extends in a frame shape around the PCSEL element 331-3 when viewed in the third direction 530. The first extension portion 471e of the first layer 471C extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471C toward the switching elements 431-1 to 431-3.

[0168] 27 and 30 , in the range from PCSEL element 331-1 toward switching elements 431-1 to 431-3 in first direction 510, first layer 471A, first layer 471B, first layer 471C, second layer 472A, second layer 472B, and second layer 472C form a layer structure in third direction 530 with insulating layer 481 interposed therebetween. 28 and 30 , in the range from PCSEL element 331-2 to just before PCSEL element 331-1 in first direction 510, first layer 471B, first layer 471C, second layer 472B, and second layer 472C form a layer structure in third direction 530 with insulating layer 481 interposed therebetween. As shown in FIGS. 29 and 30, in the range from the PCSEL element 331-3 to just before the PCSEL element 331-2 in the first direction 510, the first layer 471C and the second layer 472C form a layer structure in the third direction 530 with the insulating layer 481 interposed therebetween.

[0169] 31 , the surface light-emitting device 300C further includes a first wiring 551, a second wiring 552, a third wiring 553, a fourth wiring 554, a fifth wiring 556, a sixth wiring 557, and a seventh wiring 558. The first wiring 551, the second wiring 552, the third wiring 553, the fourth wiring 554, the fifth wiring 556, the sixth wiring 557, and the seventh wiring 558 are provided on the printed circuit board 441 in FIG.

[0170] The first wiring 551 extends from the positive side of the power supply 341 in FIG. 21 and is connected to the first layer 471A. The second wiring 552 is connected to the second layer 472A and the first layer 471B. The third wiring 553 is connected to the second layer 472B and the first layer 471C. The fourth wiring 554 is connected to the second layer 472C and the first layer 471A provided corresponding to the PCSEL element 331-4 in FIG. 21.

[0171] The fifth wiring 556 is connected to the first wiring 551 and the second wiring 552. A switching element 431-1 is provided on the path of the fifth wiring 556. The sixth wiring 557 is connected to the second wiring 552 and the third wiring 553. A switching element 431-2 is provided on the path of the sixth wiring 557. The seventh wiring 558 is connected to the third wiring 553 and the fourth wiring 554. A switching element 431-3 is provided on the path of the seventh wiring 558.

[0172] With this configuration, the PCSEL elements 331-1, 331-2, and 331-3 are electrically connected in series by the first wiring 551, the second wiring 552, the third wiring 553, and the electrode stack 461. The switching element 431-1 is electrically connected in parallel to the PCSEL element 331-1, the switching element 431-2 is electrically connected in parallel to the PCSEL element 331-2, and the switching element 431-3 is electrically connected in parallel to the PCSEL element 331-3.

[0173] In this embodiment, a plurality of PCSEL elements 331 are arranged in a matrix so as to be aligned in a first direction 510 and a second direction 520 perpendicular to the first direction 510. In such a configuration, by causing any of the plurality of PCSEL elements 331 to emit light, the spot shape of the laser light formed on the workpiece surface can be freely changed to a shape that matches the conditions for additional processing of the workpiece.

[0174] Furthermore, the multiple switching elements 431 are arranged linearly along the periphery of the multiple PCSEL elements 331 extending in the second direction 520. With this configuration, the distance between the multiple PCSEL elements 331 can be kept small compared to when the switching elements 431 are installed in an area where the multiple PCSEL elements 331 are arranged.

[0175] The electrode stack 461 has a first layer 471 having a p-side electrode portion 471p and a first extending portion 471e and a second layer 472 having an n-side electrode portion 472n and a second extending portion 472e, the p-side electrode portion 471p and the n-side electrode portion 472n forming a layer structure in the third direction 530, and the first extending portion 471e and the second extending portion 472e forming a layer structure in the third direction 530. With this configuration, it is possible to keep the installation area of ​​the electrode stack 461 small in the planar direction in which the multiple PCSEL elements 331 are arranged, while enabling electrical connection between the PCSEL elements 331 and the switching elements 431 through the electrode stack 461.

[0176] Furthermore, first layers 471 and second layers 472 are provided corresponding to each PCSEL element 331 of the plurality of PCSEL elements 331-1 to 331-3 aligned in the first direction 510, and these plurality of sets of first layers 471 and second layers 472 form a layer structure in the third direction 530. With this configuration, it is possible to keep the installation area of ​​the electrode stack 461 small in the planar direction in which the plurality of PCSEL elements 331 are arranged, while enabling electrical connection between the PCSEL elements 331-1 to 331-3 and the switching elements 431-1 to 431-3 through the electrode stack 461.

[0177] In the present embodiment, the multiple switching elements 431 are arranged linearly along the peripheries of the multiple PCSEL elements 331 extending in the second direction 520, but this is not limiting. By changing the structure of the electrode stack, the multiple switching elements 431 may be arranged linearly along the peripheries of the multiple PCSEL elements 331 extending in the first direction 510, or some of the multiple switching elements 431 may be arranged linearly along the first direction 510 and the other parts of the multiple switching elements 431 may be arranged linearly along the second direction 520.

[0178] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0179] 100 Processing machine, 101, 102, 105 Rotation center axis, 104 Predetermined axis, 106 Swivel center axis, 111 First work spindle, 116 Second work spindle, 121 Tool spindle, 122 Spindle body, 123 Spindle end surface, 125 Tool insertion hole, 126 Clamping mechanism, 127 Collet, 128 Draw bar, 129 Spring member, 131 Tool rest, 132 Swivel part, 141 Bed, 150 Processing area, 161 Cover body, 200, 600 Additional processing head, 201 Center axis, 210 Straight line, 211 Head part, 216 Laser light emission part, 217 Material powder discharge part, 221 Condenser lens, 222 Plane, 223 Convex surface, 231 Shank portion, 300, 300A, 300B: surface light emitting portion, 300C: surface light emitting device, 310: element body, 310a: light emitting surface, 310b: back surface, 311: substrate, 312: n-type cladding layer, 313: active layer, 314: carrier block layer, 315: photonic crystal layer, 316: holes, 317: p-type cladding layer, 318: p-type contact layer, 319: back surface reflector, 321: front surface electrode, 322: AR coating layer, 326: back surface electrode, 331, 331A, 331B: PCSEL element, 341: power supply, 351: p-side terminal, 352: n-side terminal, 361, 362, 366, 367: wire, 371, 371A, 371B, 461: electrode stack, 372: p-side electrode, 373 n-side electrode, 374, 481 insulating layer, 381, 381A, 381B submount, 382, ​​382A, 382B, 456 conductive layer, 383 solder layer, 386 heat sink, 431 switching element, 440 gate driver, 441 printed circuit board, 471, 471A, 471B, 471C first layer, 471e first extension portion, 471p p-side electrode portion, 472n n-side electrode portion, 472, 472A, 472B, 472C second layer, 472e second extension portion, 510 first direction, 520 second direction, 530 third direction, 551 first wiring, 552 second wiring, 553 third wiring, 554 fourth wiring, 556 fifth wiring, 557 sixth wiring, 558 Seventh wiring, 611 optical fiber, 612 collimating lens, 613 first reflecting mirror, 614 second reflecting mirror, 615 third reflecting mirror, 616 fourth reflecting mirror, 617 fifth reflecting mirror.

Claims

1. An additional processing head that supplies metal and irradiates it with laser light to melt the metal and perform additional processing, comprising: a head section that is movable relative to a workpiece; a surface light-emitting section that is mounted on the head section and includes a plurality of PCSEL (Photonic-Crystal Surface-Emitting Laser) elements; and a focusing lens that is arranged on a straight line that is the emission direction of the laser light in order to focus the laser light from the surface light-emitting section on the surface of the workpiece.

2. An additional processing head as set forth in claim 1, wherein the condenser lens is positioned opposite the surface light-emitting unit in the direction in which the laser light is emitted from the surface light-emitting unit.

3. An additional processing head as described in claim 2, wherein the distance between the surface light-emitting unit and the focusing lens in the direction of emission of the laser light from the surface light-emitting unit is smaller than the distance between the focusing lens and the focal position of the laser light in the direction of emission of the laser light from the surface light-emitting unit.

4. An additional processing head according to any one of claims 1 to 3, wherein the PCSEL element includes an element body having an emission surface that emits the laser light, and the surface light-emitting portion further includes: a p-side electrode that is arranged around the PCSEL element when the emission surface is viewed in a plane and is electrically connected to the PCSEL element; and an n-side electrode that is arranged around the PCSEL element when the emission surface is viewed in a plane, is stacked with the p-side electrode via an insulating layer, and is electrically connected to the PCSEL element.

5. The additional processing head according to claim 4, wherein the PCSEL element further includes a surface electrode provided along the periphery of the light-emitting surface, and the surface light-emitting portion further includes a plurality of wires provided on the n-side electrode at intervals from one another, each wire extending between the n-side electrode and the surface electrode.

6. The additional processing head according to claim 4, wherein the element body further has a back surface disposed on the back side of the light-emitting surface, the PCSEL element further includes a back electrode provided on the back surface, and the front surface light-emitting portion further has a conductive layer to which the back electrode and the p-side electrode are joined.

7. A processing machine comprising the additional processing head according to any one of claims 1 to 3, and a tool spindle that is movable in a processing area and rotates a tool, wherein either the tool or the additional processing head is selectively attached to the tool spindle, and the additional processing head is provided on the head portion and has a shank portion that is clamped by the tool spindle.

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