Banding device having reduced band friction

Abstract

The purpose of the present application is to resolve issues in the conventional banding devices and to provide a banding device that can facilitate smooth supply of bands by reducing friction between the band and a band guide by sanding, coating, and heat-treating the latter.

Description

Banding device that reduces friction with the band

[0001] The present application relates to a banding device for packaging a product using a band, and relates to a banding device in which friction between the band guide and the band is reduced by performing a predetermined treatment on the band guide.

[0002]

[0003] Typically, products for sale are packaged and transported to prevent damage. Specifically, products are stored in paper boxes or their exteriors are wrapped in plastic or other materials to protect their appearance.

[0004] Wrapped or boxed products can be automatically transported by conveyor belts or rollers. This is for loading the finished product onto a vehicle or other transport vehicle, or for additional packaging operations.

[0005] To provide secondary packaging for transported products, banding is performed around the product or the box containing it, using materials such as polypropylene bands (PP bands) or polyester bands (PET bands). Banding can also be performed in a manner that enhances packaging strength, such as by aligning the bands in a cross or well-like pattern.

[0006] At this time, the band is released from the reel and placed in an arch, which is a structure that surrounds the product, to prepare banding. The band is released from the arch and placed in close contact with the outer surface of the product, and the ends are cut and joined by heat fusion or the like.

[0007] In this case, a feeding roller is provided to supply the band to the arch, and a tension roller is provided to allow the band to come out of the arch and wrap around the outer surface of the product.

[0008] However, conventional systems require separate drive motors to drive the feeding roller and tension roller, resulting in inefficient electricity consumption. Furthermore, when performing rapid, continuous packaging using bands, conventional designs can cause band detachment during the feeding and tension transitions, preventing sufficient packaging speed.

[0009] Therefore, it is time for various studies to solve these problems.

[0010] [Prior Art Literature]

[0011] [Patent Document]

[0012] (Patent Document 1) Registered Patent No. 10-1615717

[0013] (Patent Document 2) Registered Patent No. 10-1627948

[0014] (Patent Document 3) Registered Patent No. 10-0030939

[0015] (Patent Document 4) Registered Patent No. 10-2393252

[0016]

[0017] The present application was created to solve the problems of the prior art as described above, and the purpose of the present application is to provide a banding device that can smoothly supply a band by reducing friction between the band guide and the band by sanding, coating, and heat treating the band guide.

[0018]

[0019] One aspect of the present application relates to a banding device.

[0020] As an example, a banding device for wrapping and banding a product using a band comprises: a table portion on which a product requiring banding is positioned; an arch portion positioned on an upper portion of the table portion; a bandway formed and connected on the inner sides of the table portion and the arch portion respectively, and for accommodating a band; a control portion for controlling the overall operation so that the band is provided from the bandway onto the product and performs banding by wrapping the product; and a tension portion for providing tension to the band on which banding is performed by wrapping the product, wherein the bandway may include a band guide portion having one surface sanded and a tape portion or a coating portion formed on one surface of the sanded band guide portion and for reducing a coefficient of friction between the band guide portion and the band.

[0021] As an example, the thickness of the tape portion or coating portion may be 30 to 60 μm.

[0022] As an example, the tape portion or coating portion may be a heat-treated tape portion or coating portion formed on a sanded surface of a banding guide.

[0023] As an example, the tape portion or coating portion may comprise polytetrafluoroethylene.

[0024] As an example, the banding guide portion may include unevenness on one surface due to sanding.

[0025]

[0026] Another aspect of the present application relates to a banding method using a banding device.

[0027] As an example, a method for banding a product using the aforementioned banding device may include a feeding step in which the feeding of the band is controlled by a control unit, and the band is supplied onto the product along a bandway to wrap the product; a tension step in which tension is provided to the band wrapping the product so that the band fits the product; a cutting and sealing step in which the band is cut and both ends of the cut band are bonded; and a feeding step in which the band is re-supplied along the bandway.

[0028]

[0029] The box banding device of the present invention for solving the above-mentioned problem has the following effects.

[0030] According to one embodiment of the present application, a banding device can be provided.

[0031] According to one embodiment of the present application, a band can be smoothly provided from a bandway.

[0032] According to one embodiment of the present application, band detachment can be prevented and the structure can be simplified.

[0033] According to one embodiment of the present application, it is possible to control the band surrounding the product to be smoothly supplied so as to minimize the occurrence of errors in the banding device.

[0034] According to one embodiment of the present application, coating can be appropriately performed on such a banding guide.

[0035] According to one embodiment of the present application, a banding device can be provided in which a band through a Teflon coating can smoothly pass through a bandway.

[0036] The effects of the present application are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0037]

[0038] FIG. 1 is a schematic perspective view of a banding device according to one embodiment of the present application.

[0039] Figure 2 is a partial expanded view of a banding device according to one embodiment of the present application.

[0040] FIG. 3 is an image of a band guide of a bandway according to one embodiment of the present application.

[0041] FIG. 4 is a schematic diagram of a band guide of a bandway according to one embodiment of the present application.

[0042] FIG. 5 is a flow chart for explaining a banding method according to one embodiment of the present application.

[0043]

[0044] The terminology used in this application is solely for the purpose of describing specific embodiments and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" indicate the presence of features, components, etc. described in the specification, but do not imply that one or more other features, components, etc. are not present or cannot be added.

[0045] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0046] The purpose, specific advantages, and novel features of the present application will become more apparent from the following detailed description and preferred embodiments, taken in conjunction with the accompanying drawings. It should be noted that, when referencing components in each drawing in this specification, identical components are assigned the same reference numerals, as much as possible, even if they appear in different drawings. Furthermore, in describing the present application, a detailed description of a related known technology will be omitted if it is determined that such a detailed description may unnecessarily obscure the gist of the present application.

[0047]

[0048] Hereinafter, the banding device of the present application will be described in detail with reference to the attached drawings. However, the attached drawings are for illustrative purposes only, and the scope of the banding device of the present application is not limited by the attached drawings.

[0049]

[0050] FIG. 1 is a schematic perspective view of a banding device according to one embodiment of the present application.

[0051]

[0052] As illustrated in FIG. 1, the banding device (1) can wrap and band a product (100) using a band. Specifically, the banding device (1) may include a table portion (10) on which a product requiring banding is positioned, an arch portion (20) positioned on the upper portion of the table portion, a bandway (30) formed and connected on the inner sides of the table portion and the arch portion respectively and in which a band is received, a control portion (not shown) that controls the overall operation so that a band is provided from the bandway onto the product to wrap and band the product, and a tension portion (not shown) that provides tension to the band on which banding is performed by wrapping the product.

[0053]

[0054] The table portion is not particularly limited in shape or material, but may have a flat shape, and a product may be positioned on the upper portion of the table portion. As an example, the table portion may be composed of a rectangular plate formed at a certain distance from the ground, and a frame formed at the bottom of the plate to support the plate.

[0055]

[0056] The arch portion may be positioned above the table portion. The shape of the arch portion is a structure having an arch structure, and generally, the arch is a vertical curved structure and includes a structure used to support the weight above the arch. However, the present application may include various structures as described below. As another example, the arch portion may be composed of two support members extending upward from the table portion and a connecting member connecting the distal ends of the two support members, as illustrated in FIG. 1. As illustrated in FIG. 1, the support members and the connecting member are vertically connected, but in the present application, such a configuration is also collectively referred to as an arch portion.

[0057] The larger the arch, the greater the likelihood of power loss due to friction between the band and the bottom of the arch. Feeding and backfeeding are time-controlled, but errors can occasionally occur. To minimize friction, the present application may employ a tape or coating, as described below.

[0058]

[0059] Fig. 2 is a partially expanded view of a banding device according to one embodiment of the present application. Specifically, the portion illustrated in Fig. 2 represents a portion of the bandway within the central portion and the arch portion. That is, the one-way groove in the central portion of the table portion illustrated in Fig. 1 and the groove in the arch portion are connected and communicate with each other as a single groove, and the interior of the groove is referred to as a bandway (30).

[0060]

[0061] In addition, as shown in Fig. 2, within the bandway (30), a band guide part (31) and a tape part or coating part (33) formed on the upper portion of the band guide part (31) are positioned, and a band (35) is positioned on the tape part or coating part.

[0062]

[0063] That is, the center of the table portion and the arch portion are provided with a through-hole, for example, a rectangular through-hole through which a band can pass, and a bandway is provided on the upper portion of the through-hole with a band guide portion formed on the inside to accommodate the band.

[0064] The bandway includes a band guide portion (31) having one side sanded and a tape portion or coating portion (33) formed on one side of the sanded band guide portion to reduce the coefficient of friction between the band guide portion and the band.

[0065]

[0066] In the present application, the bandway may include a tape portion formed by bonding an integral tape-type material onto a band guide portion or a coating portion formed by spraying a liquid-type coating solution onto the band guide portion.

[0067] Previously, techniques for banding devices have been disclosed that inject air into one corner of a bandway to ensure smooth band passage, or employ a roller to transmit force. The present application eliminates these additional devices and forms a tape or coating on the band guide portion of the bandway, thereby reducing friction between the band and the band guide portion, thereby enabling smooth band passage.

[0068]

[0069] FIG. 3 is an image of a band guide of a bandway according to one embodiment of the present application.

[0070] As shown in Fig. 3, the band guide part, the band guide part after sanding, and the coating part formed on the sanded surface each have different colors.

[0071]

[0072] FIG. 4 is a schematic diagram of a band guide of a bandway according to one embodiment of the present application.

[0073] The adhesion between the band guide portion and the tape portion or coating portion can be improved through sanding. In particular, the band guide portion can include unevenness (37) on one surface through sanding.

[0074]

[0075] The tape portion or coating portion may be a heat-treated tape portion or coating portion formed on a sanded surface of the banding guide. That is, by bonding the tape portion onto the banding guide portion or forming a coating layer on the banding guide portion and then performing heat treatment, the bond between the banding guide portion and the tape portion or coating portion can be further strengthened.

[0076] High-performance fluoropolymers Teflon (TEFLON (trade name) PTFE, PFA, FEP and TEFZEL ETFE can provide the properties described below that cannot be found in other resins.

[0077] Among Teflon's many properties, heat resistance, chemical inertness, excellent electrical properties, and non-stickiness are all due to the unique molecular structure of fluoropolymer. The ability to combine these exceptionally superior and unique properties in a single material is what makes Teflon so unique.

[0078]

[0079] The high temperature continuous use temperature, which is the standard for heat resistance, is 260℃ for PTFE and PFA, 200℃ for FEP, and 160℃ for ETFE.

[0080] Additionally, it is stable to most chemicals and solvents.

[0081] Additionally, it has the lowest coefficient of friction among solid materials. Wear resistance can be improved by adding inorganic fillers such as glass resin, carbon fiber, and metal powders like graphite, allowing it to be used even in harsh environmental conditions.

[0082] Additionally, it is a flame-retardant material with a limiting oxygen index (LOI) of over 95%. Because its combustion energy is extremely low, it does not cause secondary fires, even in the event of a fire.

[0083] Additionally, Teflon is generally chemically inert and pure, except for some items containing purity fillers.

[0084] Additionally, it does not contain any additives such as plasticizers, stabilizers, lubricants, or antioxidants that may cause contamination.

[0085] Additionally, it elongates by about 5% even at very low temperatures (-196˚C), and its impact resistance under such conditions is superior to that of any other resin.

[0086] In addition, it has the lowest dielectric constant and loss factor among solid insulating materials, is stable over a wide range of frequencies and temperatures, and exhibits maximum volume and resistivity.

[0087] Additionally, it has the lowest surface energy among solid materials, resulting in excellent adhesiveness and releasability.

[0088] In addition, it has excellent weather resistance, so even if used outdoors for a long time, there will be no degradation in performance due to oxidation, surface contamination, or discoloration.

[0089] Additionally, it is inert to enzymes and microorganisms. Pure Teflon does not provide the nutrients and sites necessary for enzyme and microorganism growth.

[0090] Additionally, the tape or coating portion may contain polytetrafluoroethylene. Teflon, also known as Teflon resin, fluororesin, or fluororesin, is a general term for synthetic resins obtained by polymerizing olefins containing fluorine. They are characterized by excellent heat resistance, chemical resistance, and a low coefficient of friction. Among them, the most widely produced fluororesin is polytetrafluoroethylene.

[0091] Additionally, the thickness of the tape portion or coating portion may be 30 ㎛ to 60 ㎛. The lower limit may be 31 ㎛, 32 ㎛, 33 ㎛, 34 ㎛, 35 ㎛, 36 ㎛, 37 ㎛, 38 ㎛, 39 ㎛, 40 ㎛, 41 ㎛, 42 ㎛, 43 ㎛, 44 ㎛, or 45 ㎛, and the upper limit may be 60 ㎛, 59 ㎛, 58 ㎛, 57 ㎛, 56 ㎛, 55 ㎛, 54 ㎛, 53 ㎛, 52 ㎛, 51 ㎛, 50 ㎛, 49 ㎛, 48 ㎛, 47 ㎛, or 46 ㎛. In this range, it can be optimally combined with the banding guide section, and frictional force can be reduced when the band moves.

[0092]

[0093] Additionally, the banding device of the present application may include a control unit that controls the overall operation so that the band is provided from the bandway over the product and wraps around the product to perform banding.

[0094]

[0095] Additionally, the banding device of the present application may include a tension member that provides tension to a band on which banding is performed around the product.

[0096]

[0097] In addition, the banding device of the present application may include a switch portion, and the switch portion may be a button switch located on the upper surface of the table portion that a user can press with a hand, or a foot switch located on the ground below the table portion that a user can step on with a foot to operate the banding device. The button switch and the foot switch are for operating the banding device, and when the user uses the foot switch with his or her foot to operate the banding device, both hands are freed up during the process of operating the switch portion, making the product packaging work much easier.

[0098]

[0099] Additionally, the banding device of the present application may additionally include a conveying section. As an example, the conveying section may be formed of a conveyor belt with a plurality of rotating rollers, and may move a product placed on top of the conveying section in one direction.

[0100]

[0101] FIG. 5 is a flow chart for explaining a banding method according to one embodiment of the present application.

[0102] As illustrated in FIG. 5, the banding method of the present application may include a backfeeding step of the band (S10), a tensioning step of the band (S20), a cutting and sealing step of the band (S30), and a feeding step of the band (S40).

[0103]

[0104] Specifically, the method for banding a product using the aforementioned banding device may include a back feeding step in which the back feeding of the band is controlled by a control unit, and the band is supplied onto the product along a bandway to wrap the product; a tension step in which tension is provided to the band wrapping the product so that the band fits the product; a cutting and sealing step in which the band is cut and both ends of the cut band are bonded; and a feeding step in which the band is re-supplied along the bandway.

[0105]

[0106] In the backfeeding stage, when a start signal is given to the banding device, the band descends from the arch and wraps around the product.

[0107]

[0108] In addition, in the tension step, after wrapping the product, tension is applied to the band to tighten the product once more to suit the task intended by the worker. The maximum tension of the thermal bonding banding device of the present application is 700 to 800 N, preferably about 760 N. The tension adjustment volume may be a dial-type volume from 0 to 10. The volume from 0 to 10 can relatively adjust the tension value of 760 N. For example, if the tension volume is set to 2, a tension of 760 / 10*2=152 N is applied, tightening the product with a force of 152 N.

[0109]

[0110] Additionally, during the cutting and sealing stage, the band is cut and both ends are joined. The joining process is prone to errors. Furthermore, three major factors determine the bond strength: heater temperature, bonding time, and the bonding ratio of the bonded area.

[0111]

[0112] Additionally, during the feeding stage, the band rotates through the bandway inside the arch and table sections, preparing for the next operation. Feeding can also determine the bonding ratio. If the feeding is not 100% perfect, bonding can result in a lower transverse bonding ratio.

[0113]

[0114] Although the above has been described with reference to preferred embodiments of the present application, it will be understood by those skilled in the art that various modifications and changes can be made to the present application without departing from the spirit and scope of the present invention as set forth in the claims below.

[0115]

[0116] [Explanation of symbols]

[0117] 1: Banding device

[0118] 10: Table section

[0119] 20: Arch section

[0120] 30: Bandway

[0121] 31: Band Guide Section

[0122] 33: Tape portion or coating portion

[0123] 35: Band

[0124] 37: Bumps

[0125] 100: Product

Claims

1. A banding device that wraps and bands a product using a band. The table section where the product requiring banding is positioned; Arch portion located at the upper part of the table portion; A bandway formed and connected on the inner side of the table and arch sections, respectively, and in which a band is accommodated; A control unit that controls the overall operation so that a band is provided from the bandway over the product and wraps the product to perform banding; and Includes a tension member that provides tension to a band on which banding is performed around the product, The above bandway is a banding device including a band guide part having one side sanded and a tape part or coating part formed on one side of the sanded band guide part, which reduces the coefficient of friction between the band guide part and the band.

2. In paragraph 1, A banding device wherein the thickness of the tape portion or coating portion is 30 ㎛ to 60 ㎛.

3. In paragraph 1, A banding device in which a tape portion or coating portion is formed on a sanded surface of a banding guide and then heat-treated.

4. In paragraph 1, A banding device comprising a tape portion or a coating portion made of polytetrafluoroethylene.

5. In paragraph 1, The banding guide part is a banding device that includes unevenness on one side through sanding.

6. A banding method for a product using the banding device of Article 1, The feeding of the band is controlled by the control unit, and the feeding step is where the band is supplied along the bandway onto the product and wraps the product; A tension step that provides tension to the band that wraps the product to fit the product; A cutting and sealing step of cutting the band and bonding both ends of the cut band; and A method comprising a feeding step of re-supplying the band along the bandway.

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