Electronic device

Abstract

An electronic device according to the present invention comprises: a display layer; a sensor layer disposed on the display layer; and a lower conductive layer disposed under the sensor layer. The lower conductive layer includes: first coils spaced apart from each other in a first direction; second coils spaced apart from each other in the first direction and each crossing two of the first coils that are adjacent to each other; and connection pins connecting ends of the first coils and ends of the second coils.

Description

electronic devices

[0001] The present invention relates to an electronic device capable of sensing input by a pen.

[0002] Multimedia electronic devices, such as televisions, mobile phones, tablet computers, laptops, navigation systems, and game consoles, include display devices for displaying images. In addition to conventional input methods such as buttons, keyboards, and mice, these devices may include a sensor layer (or input sensor) that provides a touch-based input method that allows users to intuitively and conveniently input information or commands. The sensor layer can sense the user's touch or pressure. Meanwhile, there is a growing demand for pens for users accustomed to inputting information using writing instruments or for precise touch input for specific applications (e.g., sketching or drawing applications).

[0003] An object of the present invention is to provide an electronic device capable of sensing input by a pen.

[0004] An electronic device according to the present invention includes a display layer, a sensor layer disposed on the display layer, and a lower conductive layer disposed under the sensor layer. The lower conductive layer includes first coils disposed spaced apart in a first direction, second coils disposed spaced apart in the first direction, each of which intersects two adjacent first coils, and a connecting pin connecting ends of the first coils to ends of the second coils.

[0005] An electronic device according to the present invention includes a display layer, a sensor layer disposed on the display layer, a lower conductive layer disposed under the sensor layer, and a sensor driving unit configured to drive the sensor layer and the lower conductive layer and operate in a pen sensing mode.

[0006] The lower conductive layer includes first coils spaced apart in a first direction, second coils spaced apart in the first direction and each intersecting two adjacent first coils, and a connecting pin connecting ends of the first coils to ends of the second coils, and the pen sensing mode includes a sensing driving mode that senses input of the pen using the sensor layer, and a charging driving mode that charges the pen using the lower conductive layer.

[0007] According to an embodiment of the present invention, by overlappingly arranging two coils on the lower conductive layer and connecting one connecting pin in common to the two coils, the number of connecting pins provided on the lower conductive layer can be reduced overall.

[0008] Additionally, as the number of connecting pins decreases, the number of elements connected to the lower conductive layer and the size of the components can be reduced, thereby simplifying the configuration of the electronic device.

[0009] FIG. 1A is a perspective view of an electronic device according to one embodiment of the present invention.

[0010] FIG. 1b is a rear perspective view of an electronic device according to one embodiment of the present invention.

[0011] Figure 2 is a perspective view of an electronic device according to one embodiment of the present invention.

[0012] Figure 3 is a perspective view of an electronic device according to one embodiment of the present invention.

[0013] FIGS. 4A to 4D are cross-sectional views of an electronic device according to one embodiment of the present invention.

[0014] Figure 5 is a schematic cross-sectional view of a display panel according to one embodiment of the present invention.

[0015] FIGS. 6A to 6C are drawings for explaining the operation of an electronic device according to one embodiment of the present invention.

[0016] Figure 7 is a cross-sectional view of a display panel according to one embodiment of the present invention.

[0017] FIG. 8a is a plan view schematically illustrating a lower conductive layer according to one embodiment of the present invention.

[0018] Fig. 8b is a cross-sectional view of the first part shown in Fig. 8a.

[0019] Figure 8c is a cross-sectional view of a lower conductive layer and a sensor layer according to one embodiment of the present invention.

[0020] FIG. 9 is a diagram illustrating the operation of a pen sensing mode according to one embodiment of the present invention.

[0021] FIG. 10a is a drawing for explaining the lower conductive layer operating in the charge driving mode illustrated in FIG. 9.

[0022] FIG. 10b are graphs illustrating waveforms of a first signal and a second signal according to one embodiment of the present invention.

[0023] FIG. 10c are graphs illustrating waveforms of a first signal and a second signal according to one embodiment of the present invention.

[0024] FIG. 11 is a drawing for explaining the lower conductive layer operating in the sensing driving mode illustrated in FIG. 9.

[0025] FIG. 12 is a plan view schematically illustrating a lower conductive layer according to one embodiment of the present invention.

[0026] FIGS. 13a and 13b are plan views schematically illustrating a lower conductive layer according to one embodiment of the present invention.

[0027] FIGS. 14a and 14b are plan views showing the effective area and ineffective area of ​​the lower conductive layer according to one embodiment of the present invention.

[0028] Figure 15 is a plan view showing a lower conductive layer according to one embodiment of the present invention.

[0029] Fig. 16 is a plan view of a sensor layer according to one embodiment of the present invention.

[0030] FIG. 17 is an enlarged plan view of one sensing unit according to one embodiment of the present invention.

[0031] FIG. 18A is a plan view illustrating a first conductive layer of a sensing unit according to one embodiment of the present invention.

[0032] FIG. 18b is a plan view illustrating a second conductive layer of a sensing unit according to one embodiment of the present invention.

[0033] FIG. 19 is a cross-sectional view of a sensor layer according to one embodiment of the present invention taken along line II' shown in FIGS. 18a and 18b, respectively.

[0034] FIG. 20A is a plan view illustrating a first conductive layer of a sensing unit according to one embodiment of the present invention.

[0035] FIG. 20b is a plan view illustrating a second conductive layer of a sensing unit according to one embodiment of the present invention.

[0036] FIG. 20c is a cross-sectional view of a sensor layer according to one embodiment of the present invention taken along line II-II' shown in FIGS. 20a and 20b, respectively.

[0037] Figure 21a is an enlarged plan view of the AA' area shown in Figure 18a.

[0038] Figure 21b is an enlarged plan view of the BB' area shown in Figure 18b.

[0039] FIG. 22 is an enlarged plan view of one sensing unit according to one embodiment of the present invention.

[0040] FIG. 23a is a plan view illustrating a first conductive layer of a sensing unit according to one embodiment of the present invention.

[0041] FIG. 23b is a plan view illustrating a second conductive layer of a sensing unit according to one embodiment of the present invention.

[0042] Fig. 24 is a drawing showing the operation of a sensor driving unit according to one embodiment of the present invention.

[0043] Fig. 25 is a drawing showing the operation of a sensor driving unit according to one embodiment of the present invention.

[0044] In this specification, when it is said that a component (or region, layer, portion, etc.) is “on,” “connected to,” or “coupled to” another component, it means that it can be directly disposed / connected / coupled to the other component, or a third component may be disposed between them.

[0045] Identical drawing numbers indicate identical components. Furthermore, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the purpose of effectively illustrating the technical content. "And / or" encompasses any combination of one or more of the associated components.

[0046] While terms such as "first" and "second" may be used to describe various components, these components should not be limited by these terms. These terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a "second component," and similarly, a second component may also be referred to as a "first component." Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0047] Additionally, terms such as "below," "below," "above," and "upper" are used to describe the relationships between components depicted in the drawings. These terms are relative concepts and are explained based on the directions indicated in the drawings.

[0048] It should be understood that terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0049] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an overly idealistic or overly formal sense unless explicitly defined herein.

[0050] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0051] FIG. 1A is a perspective view of an electronic device (1000) according to one embodiment of the present invention. FIG. 1B is a rear perspective view of the electronic device (1000) according to one embodiment of the present invention.

[0052] Referring to FIGS. 1A and 1B , the electronic device (1000) may be a device activated by an electrical signal. For example, the electronic device (1000) may display an image and sense externally applied inputs. The external input may be a user input. The user input may include various forms of external inputs, such as a part of the user's body, a pen (PN), light, heat, or pressure.

[0053] An electronic device (1000) may include a first display panel (DP1) and a second display panel (DP2). The first display panel (DP1) and the second display panel (DP2) may be separate panels. The first display panel (DP1) may be referred to as a main display panel, and the second display panel (DP2) may be referred to as an auxiliary display panel or an external display panel.

[0054] The first display panel (DP1) includes a first display portion (DA1-F) (also referred to as a display area) and a first non-display portion (NDA1) (also referred to as a non-display area) surrounding the first display portion (DA1-F). The second display panel (DP2) includes a second display portion (DA2-F) and a second non-display portion (NDA2) surrounding the second display portion (DA2-F). The area of ​​the second display panel (DP2) may be smaller than the area of ​​the first display panel (DP1). Depending on the sizes of the first display panel (DP1) and the second display panel (DP2), the area of ​​the first display portion (DA1-F) may be larger than the area of ​​the second display portion (DA2-F).

[0055] When the electronic device (1000) is unfolded, the first display portion (DA1-F) may have a plane that is substantially parallel to the first direction (DR1) and the second direction (DR2). The thickness direction of the electronic device (1000) may be parallel to a third direction (DR3) that intersects the first direction (DR1) and the second direction (DR2). Accordingly, the front (or upper surface) and the back (or lower surface) of the components constituting the electronic device (1000) may be defined based on the third direction (DR3).

[0056] The first display panel (DP1) or the first display unit (DA1-F) may include a folding area (FA) that folds and unfolds, and a plurality of non-folding areas (NFA1, NFA2) spaced apart from the folding area (FA). The second display panel (DP2) may overlap any one of the plurality of non-folding areas (NFA1, NFA2). For example, the second display panel (DP2) may overlap the first non-folding area (NFA1).

[0057] The display direction of a first image (IM1a) displayed on a portion of a first display panel (DP1), for example, a first non-folding area (NFA1), and the display direction of a second image (IM2a) displayed on a second display panel (DP2) may be opposite directions. For example, the first image (IM1a) may be displayed in a third direction (DR3), and the second image (IM2a) may be displayed in a fourth direction (DR4) that is opposite to the third direction (DR3).

[0058] In one embodiment of the present invention, the folding area (FA) can be bent based on a folding axis extending in a direction parallel to a long side of the electronic device (1000), for example, in a direction parallel to the second direction (DR2). When the electronic device (1000) is folded, the folding area (FA) has a predetermined curvature and a curvature radius. The first non-folding area (NFA1) and the second non-folding area (NFA2) face each other, and the electronic device (1000) can be inner-folded so that the first display unit (DA1-F) is not exposed to the outside.

[0059] In one embodiment of the present invention, the electronic device (1000) may be outer-folded so that the first display portion (DA1-F) is exposed to the outside. In one embodiment of the present invention, the electronic device (1000) may be capable of both in-folding and out-folding in an unfolded state, but is not limited thereto.

[0060] In FIG. 1A, an example in which a single folding area (FA) is defined in the electronic device (1000) is illustrated, but the present invention is not limited thereto. For example, the electronic device (1000) may have a plurality of folding axes and a plurality of folding areas corresponding thereto defined, and the electronic device (1000) may be infolded or outfolded in an unfolded state in each of the plurality of folding areas.

[0061] According to one embodiment of the present invention, at least one of the first display panel (DP1) and the second display panel (DP2) can sense an input by a pen (PN) even if it does not include a digitizer. Therefore, since the digitizer for sensing the pen (PN) is omitted, an increase in the thickness, an increase in the weight, and a decrease in the flexibility of the electronic device (1000) due to the addition of the digitizer may not occur. Accordingly, not only the first display panel (DP1) but also the second display panel (DP2) can be designed to sense the pen (PN).

[0062] Fig. 2 is a perspective view of an electronic device (1000-1) according to one embodiment of the present invention. Fig. 3 is a perspective view of an electronic device (1000-2) according to one embodiment of the present invention.

[0063] In FIG. 2, it is exemplarily illustrated that the electronic device (1000-1) is a mobile phone, and the electronic device (1000-1) may include a display panel (DP). In FIG. 3, it is exemplarily illustrated that the electronic device (1000-2) is a laptop, and the electronic device (1000-2) may include a display panel (DP).

[0064] In one embodiment of the present invention, the display panel (DP) can sense externally applied inputs. The external inputs may be user inputs. The user inputs may include various forms of external inputs, such as a part of the user's body, a pen (PN, see FIG. 1a), light, heat, or pressure.

[0065] According to one embodiment of the present invention, the display panel (DP) can sense input by the pen (PN) even without including a digitizer. Accordingly, since the digitizer for sensing the pen (PN) is omitted, an increase in the thickness and weight of the electronic device (1000-1 or 1000-2) due to the addition of the digitizer may not occur.

[0066] In FIG. 1A, a foldable type electronic device (1000) is illustrated as an example, and in FIG. 2, a bar type electronic device (1000-1) is illustrated as an example, but the present invention described below is not limited thereto. For example, the descriptions described below can be applied to various electronic devices such as a rollable type electronic device, a slideable type electronic device, and a stretchable type electronic device.

[0067] FIGS. 4A to 4D are cross-sectional views of an electronic device (1000) according to one embodiment of the present invention. The cross-sectional views illustrated in FIGS. 4A to 4D may be cross-sectional views illustrating a portion of an electronic device (1000) including a first display panel (DP1) of the electronic device (1000) illustrated in FIG. 1A.

[0068] Referring to FIG. 4A, the electronic device (1000) may include a first display panel (DP1), upper functional layers, and lower functional layers. The upper functional layers may include components arranged on the upper side of the first display panel (DP1), and the lower functional layers may include components arranged on the lower side of the first display panel (DP1).

[0069] The first display panel (DP1) may be configured to generate an image and sense an externally applied input. For example, the first display panel (DP1) may include a display layer (100, see FIG. 5) and a sensor layer (200, see FIG. 5).

[0070] The upper functional layers may include a protective layer (PL), a window (WD), a shock-absorbing layer (DL), and first to third adhesive layers (PSA1, PSA2, PSA3). The components included in the upper functional layers are not limited to the components described above. At least some of the components described above may be omitted, and other components may be added.

[0071] The protective layer (PL) can protect the components disposed beneath the protective layer (PL). The thickness of the protective layer (PL) can be 60 micrometers to 70 micrometers, for example, 65 micrometers, but the thickness of the protective layer (PL) is not limited thereto.

[0072] The protective layer (PL) may additionally be provided with a hard coating layer, an anti-fingerprint layer, etc. to improve properties such as chemical resistance and wear resistance. For example, the hard coating layer may be a functional layer for improving the usability of the electronic device (1000) and may be provided by being coated on the protective layer (PL). For example, the anti-fingerprint properties, anti-contamination properties, anti-scratch properties, etc. may be improved by the hard coating layer. For example, the thickness of the hard coating layer may be 5 micrometers, but is not particularly limited thereto.

[0073] The window (WD) may be disposed under the protective layer (PL). A first adhesive layer (PSA1) may be disposed between the window (WD) and the protective layer (PL). The thickness of the first adhesive layer (PSA1) may be 30 micrometers to 40 micrometers, for example, 35 micrometers, but the thickness of the first adhesive layer (PSA1) is not limited thereto. In one embodiment of the present invention, a bezel pattern may be disposed between the first adhesive layer (PSA1) and the protective layer (PL).

[0074] The window (WD) may include an optically transparent insulating material. For example, the window (WD) may include a glass substrate or a synthetic resin film. The window (WD) may have a multilayer structure or a single-layer structure. For example, the window (WD) may include a plurality of synthetic resin films bonded with an adhesive, or may include a glass substrate and a synthetic resin film bonded with an adhesive. When the window (WD) is a glass substrate, the thickness of the window (WD) may be 80 micrometers or less, for example, 30 micrometers, but the thickness of the window (WD) is not limited thereto.

[0075] A shock absorbing layer (DL) may be disposed under the window (WD). A second adhesive layer (PSA2) may be disposed between the window (WD) and the shock absorbing layer (DL). The thickness of the second adhesive layer (PSA2) may be 70 to 80 micrometers, for example, 75 micrometers, but the thickness of the second adhesive layer (PSA2) is not limited thereto.

[0076] The shock absorbing layer (DL) can absorb shock applied to the first display panel (DP1) and protect the first display panel (DP1). The shock absorbing layer (DL) can be manufactured in the form of a stretched film. For example, the shock absorbing layer (DL) can include a flexible plastic material. The flexible plastic material can be defined as a synthetic resin film. For example, the shock absorbing layer (DL) can include a flexible plastic material such as polyimide or polyethylene terephthalate. The thickness of the shock absorbing layer (DL) can be 18 micrometers to 28 micrometers, for example, 23 micrometers, but the thickness of the shock absorbing layer (DL) is not limited thereto. In one embodiment of the present invention, the shock absorbing layer (DL) may be omitted.

[0077] A third adhesive layer (PSA3) may be disposed between the shock absorbing layer (DL) and the first display panel (DP1). The thickness of the third adhesive layer (PSA3) may be 45 micrometers to 55 micrometers, for example, 50 micrometers, but the thickness of the third adhesive layer (PSA3) is not limited thereto.

[0078] The lower functional layers may include a protective film (PF), a lower conductive layer (300), a plate (PLT), a cover layer (CVL), a shielding layer (MMP), a lower sheet (CUS), an insulating film (PET), step compensation members (ARS1, ARS2, ARS3), and fourth to sixth adhesive layers (PSA4, PSA5, PSA6). The components included in the lower functional layers are not limited to the components described above. At least some of the components described above may be omitted, and other components may be added.

[0079] The protective film (PF) may be bonded to the back surface of the first display panel (DP1) via a fourth adhesive layer (PSA4). The thickness of the fourth adhesive layer (PSA4) may be 20 micrometers to 30 micrometers, for example, 25 micrometers, but the thickness of the fourth adhesive layer (PSA4) is not limited thereto.

[0080] The protective film (PF) can prevent scratches from occurring on the back surface of the first display panel (DP1) during the manufacturing process of the first display panel (DP1). The protective film (PF) may be a colored polyimide film. For example, the protective film (PF) may be an opaque yellow film, but is not limited thereto. The thickness of the protective film (PF) may be 45 micrometers to 55 micrometers, for example, 50 micrometers, but the thickness of the protective film (PF) is not limited thereto.

[0081] The plate (PLT) may be disposed under the protective film (PF). A fifth adhesive layer (PSA5) may be disposed between the plate (PLT) and the protective film (PF). The thickness of the fifth adhesive layer (PSA5) may be 11 micrometers to 21 micrometers, for example, 16 micrometers, but the thickness of the fifth adhesive layer (PSA5) is not limited thereto.

[0082] The plate (PLT) may include carbon fiber reinforced plastic (CFRP), metal, or a metal alloy. The plate (PLT) may support components arranged thereon. Openings (PH) may be defined (formed or provided) in a portion of the plate (PLT). For example, the plate (PLT) may include openings (PH) having a shape that penetrates from the upper surface to the lower surface of the plate (PLT). The openings (PH) may be defined in an area overlapping the folding area (FA). In a plane, for example, when viewed in the third direction (DR3) or the thickness direction of the plate (PLT), the openings (PH) may overlap the folding area (FA). The shape of a portion of the plate (PLT) may be more easily deformed by the openings (PH). The thickness of the plate (PLT) may be 160 micrometers to 180 micrometers, for example 170 micrometers, but the thickness of the plate (PLT) is not limited thereto.

[0083] The lower conductive layer (300) may be disposed on the lower portion of the first display panel (DP1) and the upper portion of the shielding layer (MMP). In one embodiment, the lower conductive layer (300) may be disposed on the upper surface (U_PLT) of the plate (PLT). The lower conductive layer (300) may include patterned electrodes (also referred to as coils) and / or wires. The lower conductive layer (300) may form a sensor module (SM, see FIGS. 6A to 6C) together with the sensor layer (200, see FIG. 5) included in the first display panel (DP1). A detailed description thereof will be provided below. Although not illustrated, the lower functional layers may further include an insulating layer disposed between the lower conductive layer (300) and the plate (PLT). Although not illustrated, the lower functional layers may further include an insulating layer covering the lower conductive layer (300).

[0084] A cover layer (CVL) can be attached to a plate (PLT). The cover layer (CVL) can cover the openings (PH) of the plate (PLT). Therefore, the cover layer (CVL) can prevent foreign substances from entering the openings (PH). The cover layer (CVL) can include, but is not particularly limited to, thermoplastic polyurethane. The thickness of the cover layer (CVL) can be 11 micrometers to 21 micrometers, for example, 16 micrometers, but the thickness of the cover layer (CVL) is not limited thereto.

[0085] The shielding layer (MMP) may be disposed under the plate (PLT) and the cover layer (CVL). The sixth adhesive layer (PSA6) may be disposed between the shielding layer (MMP) and the plate (PLT). The thickness of the sixth adhesive layer (PSA6) may be 15 micrometers to 25 micrometers, for example, 20 micrometers, but the thickness of the sixth adhesive layer (PSA6) is not limited thereto.

[0086] The shielding layer (MMP) may include magnetic metal powder. The shielding layer (MMP) may be referred to as a ferrite sheet, a magnetic metal powder layer, a magnetic layer, a magnetic circuit layer, or a magnetic path layer. The shielding layer (MMP) may shield a magnetic field transmitted through the first display panel (DP1). For example, the shielding layer (MMP) may serve to guide the direction of the transmitted magnetic field in a different direction. Accordingly, the magnetic field reaching the shielding layer (MMP) may be shielded without leaking to the outside, for example, to the lower portion of the shielding layer (MMP). The thickness of the shielding layer (MMP) may be 53 micrometers to 63 micrometers, for example, 58 micrometers, but the thickness of the shielding layer (MMP) is not limited thereto.

[0087] The lower sheet (CUS) may be positioned below the shielding layer (MMP). The lower sheet (CUS) may be a sheet that reflects a magnetic field toward the shielding layer (MMP). The lower sheet (CUS) may include a metal or a metal alloy, for example, the lower sheet (CUS) may include aluminum, copper, or a copper alloy. The thickness of the lower sheet (CUS) may be 15 micrometers to 25 micrometers, for example, 20 micrometers, but the thickness of the lower sheet (CUS) is not limited thereto.

[0088] An insulating film (PET) may be placed under the lower sheet (CUS). The insulating film (PET) may include, but is not particularly limited to, polyethylene terephthalate. The insulating film (PET) may prevent the inflow of static electricity. For example, the insulating film (PET) may prevent electrical interference between components placed on the insulating film (PET) and components placed under the insulating film (PET). The thickness of the insulating film (PET) may be 3 micrometers to 9 micrometers, for example, 6 micrometers, but the thickness of the insulating film (PET) is not limited thereto.

[0089] The step compensation members (ARS1, ARS2, ARS3) may include a first step compensation member (ARS1) attached to an insulating film (PET), a second step compensation member (ARS2) attached to a shielding layer (MMP), and a third step compensation member (ARS3) attached to the shielding layer (MMP). The thickness of each of the first to third step compensation members (ARS1, ARS2, ARS3) may be variously set according to the product structure or component arrangement relationship. For example, the thickness of the first step compensation member (ARS1) may be 90 micrometers, the thickness of the second step compensation member (ARS2) may be 87 micrometers, and the thickness of the third step compensation member (ARS3) may be 87 micrometers, but is not particularly limited thereto.

[0090] In addition, in one embodiment of the present invention, each of the sixth adhesive layer (PSA6), the shielding layer (MMP), the lower sheet (CUS), and the insulating film (PET) may have a structure that is separated at a portion overlapping the folding area (FA). For example, each of the sixth adhesive layer (PSA6), the shielding layer (MMP), the lower sheet (CUS), and the insulating film (PET) may be divided into two structures spaced apart with a predetermined gap at a portion overlapping the folding area (FA). The gap may be 0.6 mm to 1.7 mm, but is not particularly limited thereto.

[0091] Referring to FIG. 4b, the lower conductive layer (300) according to one embodiment may be disposed on the lower surface (L_PLT) of the plate (PLT). Although not illustrated, the lower functional layers may further include an insulating layer disposed between the plate (PLT) and the lower conductive layer (300). Although not illustrated, the lower functional layers may further include an insulating layer covering the lower conductive layer (300).

[0092] Referring to FIG. 4c, the lower functional layers according to one embodiment may include a protective film (PF), a plate (PLT), a cover layer (CVL), a lower conductive layer (300), a lower plate (PLTu), a shielding layer (MMP), a lower sheet (CUS), an insulating film (PET), step compensation members (ARS1, ARS2, ARS3), and fourth to seventh adhesive layers (PSA4, PSA5, PSA6u, PSA7u).

[0093] The lower plate (PLTu) can be disposed between the plate (PLT) and the shielding layer (MMP). The lower plate (PLTu) can be disposed under the plate (PLT) and the cover layer (CVL). The sixth adhesive layer (PSA6u) can be disposed between the plate (PLT) and the lower plate (PLTu). The seventh adhesive layer (PSA7u) can be disposed between the lower plate (PLTu) and the shielding layer (MMP). In one embodiment, the lower plate (PLTu) can include a first lower plate and a second lower plate that are spaced apart from each other and overlap each other in a first non-folding area (NFA1) and a second non-folding area (NFA2). In one embodiment, the lower plate (PLTu) can include a non-metallic material such as a fiber-reinforced plastic. The fiber-reinforced plastic can be carbon fiber-reinforced plastic (CFRP) or glass fiber-reinforced plastic (GFRP).

[0094] In one embodiment, the lower conductive layer (300) may be disposed on the upper surface of the lower plate (PLTu). Although not illustrated, the lower functional layers may further include an insulating layer disposed between the lower plate (PLTu) and the lower conductive layer (300). Although not illustrated, the lower functional layers may further include an insulating layer covering the lower conductive layer (300). In another embodiment of the present invention, the lower conductive layer (300) may be disposed on the lower surface of the lower plate (PLTu).

[0095] Referring to FIG. 4d, the lower conductive layer (300) according to one embodiment may be disposed between the protective film (PF) and the plate (PLT). For example, the lower conductive layer (300) may be disposed between the protective film (PF) and the fifth adhesive layer (PSA5), and the fifth adhesive layer (PSA5) may be disposed between the lower conductive layer (300) and the plate (PLT). Although not illustrated, the lower functional layers may further include an insulating layer disposed between the protective film (PF) and the lower conductive layer (300) and / or between the lower conductive layer (300) and the fifth adhesive layer (PSA5). Although not illustrated, an adhesive layer may further be disposed between the protective film (PF) and the lower conductive layer (300).

[0096] FIG. 5 is a schematic cross-sectional view of a display panel (DP) according to one embodiment of the present invention.

[0097] Referring to FIG. 5, the display panel (DP) may include a display layer (100) and a sensor layer (200).

[0098] The display layer (100) may be a configuration that actually generates an image. The display layer (100) may be a light-emitting display layer, and for example, the display layer (100) may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer. The display layer (100) may include a base layer (110), a circuit layer (120), a light-emitting element layer (130), and an encapsulation layer (140).

[0099] The base layer (110) may be a member that provides a base surface on which the circuit layer (120) is arranged. The base layer (110) may have a multilayer structure or a single-layer structure. The base layer (110) may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, or the like, but is not particularly limited thereto.

[0100] The circuit layer (120) may be disposed on the base layer (110). The circuit layer (120) may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer (110) by a coating, deposition, or the like, and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through multiple photolithography processes.

[0101] The light-emitting element layer (130) may be disposed on the circuit layer (120). The light-emitting element layer (130) may include a light-emitting element. For example, the light-emitting element layer (130) may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0102] The encapsulating layer (140) can be placed on the light-emitting element layer (130). The encapsulating layer (140) can protect the light-emitting element layer (130) from foreign substances such as moisture, oxygen, and dust particles.

[0103] The sensor layer (200) may be disposed on the display layer (100). The sensor layer (200) may sense an external input applied from the outside. The sensor layer (200) may be an integrated sensor continuously formed during the manufacturing process of the display layer (100), or the sensor layer (200) may be an external sensor attached to the display layer (100). The sensor layer (200) may be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0104] According to one embodiment of the present invention, the sensor layer (200) can sense inputs from both a passive type input means such as a user's body and an input device that generates a magnetic field of a predetermined resonant frequency, together with the lower conductive layer (300). The input device may be referred to as a pen, an input pen, a magnetic pen, a stylus pen, or an electromagnetic resonance pen.

[0105] FIGS. 6A to 6C are drawings for explaining the operation of an electronic device (1000) according to one embodiment of the present invention.

[0106] Referring to FIG. 6A, the electronic device (1000) may include a display layer (100), a sensing module (SM), a display driver (100C), a sensor driver (200C), a main driver (1000C), and a power circuit (1000P). The sensing module (SM) may include a sensor layer (200) and a lower conductive layer (300).

[0107] The sensing module (SM) can sense a first input (2000) or a second input (3000) applied from the outside. Each of the first input (2000) and the second input (3000) may be an input means capable of providing a change in the electrostatic capacitance of the sensor layer (200) or an input means capable of causing an induced current in the sensor layer (200) and / or the lower conductive layer (300). For example, the first input (2000) may be a passive type input means, such as a user's body. The second input (3000) may be an input by a pen (PN) or an input by an RFIC tag. For example, the pen (PN) may be a passive type pen or an active type pen.

[0108] In one embodiment of the present invention, the pen (PN) may be a device that generates a magnetic field of a predetermined resonant frequency. The pen (PN) may be configured to transmit an output signal based on an electromagnetic resonance method. The pen (PN) may be referred to as an input device, an input pen, a magnetic pen, a stylus pen, or an electromagnetic resonance pen.

[0109] The pen (PN) may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor (L) and a capacitor (C). In one embodiment of the present invention, the RLC resonant circuit may be a variable resonant circuit that varies the resonant frequency. In this case, the inductor (L) may be a variable inductor and / or the capacitor (C) may be a variable capacitor, but is not particularly limited thereto.

[0110] The inductor (L) generates a current by a magnetic field formed in the lower conductive layer (300). However, it is not particularly limited thereto. For example, when the pen (PN) operates in an active type, the pen (PN) may generate a current even if a magnetic field is not provided from the outside. The generated current is transmitted to the capacitor (C). The capacitor (C) charges the current input from the inductor (L) and discharges the charged current to the inductor (L). Thereafter, the inductor (L) can emit a magnetic field of a resonant frequency. An induced current may flow in the lower conductive layer (300) by the magnetic field emitted by the pen (PN), and the induced current may be transmitted to the sensor driving unit (200C) as a reception signal (or sensing signal, signal).

[0111] The main driving unit (1000C) can control the overall operation of the electronic device (1000). For example, the main driving unit (1000C) can control the operation of the display driving unit (100C) and the sensor driving unit (200C). The main driving unit (1000C) can include at least one microprocessor and can further include a graphics controller. The main driving unit (1000C) can be referred to as an application processor, a central processing unit, or a main processor.

[0112] The display driver (100C) can drive the display layer (100). The display driver (100C) can receive image data and control signals from the main driver (1000C). The control signals can include various signals. For example, the control signals can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, and a data enable signal.

[0113] The sensor driving unit (200C) can drive the sensor layer (200) and the lower conductive layer (300). The sensor driving unit (200C) can receive a control signal from the main driving unit (1000C). The control signal can include a clock signal of the sensor driving unit (200C). In addition, the control signal can further include a mode determination signal that determines the driving mode of the sensor driving unit (200C) and the sensing module (SM).

[0114] The sensor driving unit (200C) may be implemented as an integrated circuit (IC) and may be electrically connected to the sensor layer (200) and the lower conductive layer (300). For example, the sensor driving unit (200C) may be directly mounted on a predetermined area of ​​the display panel or may be mounted on a separate printed circuit board in a chip on film (COF) manner and may be electrically connected to the sensor layer (200).

[0115] The sensor driving unit (200C) and the sensing module (SM) can selectively operate in a first mode or a second mode. For example, the first mode may be a mode for sensing a touch input, for example, a first input (2000). The second mode may be a mode for sensing a pen (PN) input, for example, a second input (3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0116] In one embodiment, the sensor driving unit (200C) can drive the sensor layer (200) in a first mode, drive the sensor layer (200) and the lower conductive layer (300) in a second mode, or drive only the lower conductive layer (300) in the second mode.

[0117] The switching between the first mode and the second mode can be accomplished in various ways. For example, the sensor driver (200C) and the sensing module (SM) can be time-divisionally driven in the first mode and the second mode and sense the first input (2000) and the second input (3000). Alternatively, the switching between the first mode and the second mode can occur by a user's selection or a specific action of the user, or either of the first mode and the second mode can be activated or deactivated, or can be switched from one to the other, by the activation or deactivation of a specific application. Alternatively, the sensor driver (200C) and the sensing module (SM) can be alternately operated in the first mode and the second mode, and when the first input (2000) is sensed, the first mode can be maintained, or when the second input (3000) is sensed, the second mode can be maintained.

[0118] The sensor driving unit (200C) can calculate input coordinate information based on signals received from the sensor layer (200) and / or the lower conductive layer (300) and provide a coordinate signal having the coordinate information to the main driving unit (1000C). The main driving unit (1000C) executes an operation corresponding to the user input based on the coordinate signal. For example, the main driving unit (1000C) can operate the display driving unit (100C) so that a new application image is displayed on the display layer (100).

[0119] The power circuit (1000P) may include a power management integrated circuit (PMIC). The power circuit (1000P) may generate a plurality of driving voltages for driving the display layer (100), the sensor layer (200), the display driver (100C), and the sensor driver (200C). For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., an ELVSS voltage), a second driving voltage (e.g., an ELVDD voltage), an initialization voltage, etc., but are not particularly limited to the above examples.

[0120] Although FIG. 6a illustrates a structure in which a lower conductive layer (300) is provided under a display layer (100), the present invention is not limited thereto. As illustrated in FIG. 6b, the lower conductive layer (300) may be positioned under a sensor layer (200). For example, the lower conductive layer (300) may be positioned between the sensor layer (200) and the display layer (100).

[0121] Referring to FIG. 6C, an electronic device (1000) according to one embodiment may include a display layer (100), a sensing module (SM), a display driver (100C), a first sensor driver (200C1), a second sensor driver (200C2), a main driver (1000C), and a power circuit (1000P). The sensing module (SM) may include a sensor layer (200) and a lower conductive layer (300). The main driver (1000C) may control the operations of the display driver (100C), the first sensor driver (200C1), and the second sensor driver (200C2).

[0122] The first sensor driver (200C1) can drive the sensor layer (200) in the first mode. The first sensor driver (200C1) can sense the first input (2000) in the first mode. The second sensor driver (200C2) can drive the lower conductive layer (300) in the second mode. The second sensor driver (200C2) can sense the second input (3000) in the second mode. In one embodiment, the first mode and the second mode can be driven by different drivers and thus can operate independently.

[0123] In a structure in which the sensor layer (200) and the lower conductive layer (300) are independently driven by the first and second sensor driving units (200C1, 200C2), the position of the lower conductive layer (300) is not limited thereto, and it may also be placed below the sensor layer (200).

[0124] FIG. 7 is a cross-sectional view of a display panel (DP) according to one embodiment of the present invention.

[0125] Referring to FIG. 7, at least one buffer layer (BFL) is formed on the upper surface of the base layer (110). The buffer layer (BFL) can improve the bonding strength between the base layer (110) and the semiconductor pattern. The buffer layer (BFL) can be formed as a multilayer. Alternatively, the display layer (100) may further include a barrier layer. The buffer layer (BFL) can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer (BFL) can include a structure in which silicon oxide layers and silicon nitride layers are alternately laminated.

[0126] The semiconductor pattern (SC, AL, DR, SCL) may be disposed on a buffer layer (BFL). The semiconductor pattern (SC, AL, DR, SCL) may include polysilicon. However, the present invention is not limited thereto, and the semiconductor pattern (SC, AL, DR, SCL) may also include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductor.

[0127] Fig. 7 only illustrates some semiconductor patterns (SC, AL, DR, SCL), and more semiconductor patterns may be arranged in other areas. The semiconductor patterns (SC, AL, DR, SCL) may be arranged in a specific rule across the pixels. The semiconductor patterns (SC, AL, DR, SCL) may have different electrical properties depending on doping. The semiconductor patterns (SC, AL, DR, SCL) may include a first region (SC, DR, SCL) with high conductivity and a second region (AL) with low conductivity. The first region (SC, DR, SCL) may be doped with an N-type dopant or a P-type dopant. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. The second region (AL) may be an undoped region or a region doped at a lower concentration than the first region.

[0128] The conductivity of the first region (SC, DR, SCL) is greater than that of the second region (AL), and can substantially function as an electrode or a signal line. The second region (AL) may substantially correspond to an active region (AL) (or channel) of the transistor (100PC). In other words, a part (AL) of the semiconductor pattern (SC, AL, DR, SCL) may be the active region (AL) of the transistor (100PC), another part (SC, DR) may be the source region (SC) or drain region (DR) of the transistor (100PC), and another part (SCL) may be a connection electrode or a connection signal line (SCL).

[0129] Each pixel may have an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, and the equivalent circuit diagram of the pixel may be modified in various forms. FIG. 7 illustrates an example of one transistor (100PC) and a light-emitting element (100PE) included in a pixel.

[0130] A source region (SC), an active region (AL), and a drain region (DR) of a transistor (100PC) can be formed from semiconductor patterns (SC, AL, DR, SCL). The source region (SC) and the drain region (DR) can extend in opposite directions from the active region (AL) in a cross-section. Fig. 7 illustrates a portion of a connection signal line (SCL) formed from the semiconductor patterns (SC, AL, DR, SCL). Although not illustrated separately, the connection signal line (SCL) can be connected to the drain region (DR) of the transistor (100PC) in a plane.

[0131] The first insulating layer (10) may be disposed on a buffer layer (BFL). The first insulating layer (10) may overlap a plurality of pixels in common and cover semiconductor patterns (SC, AL, DR, SCL). The first insulating layer (10) may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer (10) may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer (10) may be a single-layer silicon oxide layer. Not only the first insulating layer (10), but also the insulating layer of the circuit layer (120) described below may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above-described materials, but is not limited thereto.

[0132] The gate (GT) of the transistor (100PC) is positioned on the first insulating layer (10). The gate (GT) may be a part of a metal pattern. The gate (GT) overlaps the active area (AL). In a process of doping or reducing a semiconductor pattern (SC, AL, DR, SCL), the gate (GT) may function as a mask.

[0133] The second insulating layer (20) is disposed on the first insulating layer (10) and can cover the gate (GT). The second insulating layer (20) can be commonly overlapped with pixels. The second insulating layer (20) can be an inorganic layer and / or an organic layer, and can have a single-layer or multi-layer structure. The second insulating layer (20) can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer (20) can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0134] The third insulating layer (30) may be disposed on the second insulating layer (20). The third insulating layer (30) may have a single-layer or multi-layer structure. For example, the third insulating layer (30) may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0135] The first connection electrode (CNE1) may be placed on the third insulating layer (30). The first connection electrode (CNE1) may be connected to the connection signal line (SCL) through a contact hole (CNT-1) penetrating the first, second, and third insulating layers (10, 20, 30).

[0136] The fourth insulating layer (40) may be disposed on the third insulating layer (30). The fourth insulating layer (40) may be a single-layer silicon oxide layer. The fifth insulating layer (50) may be disposed on the fourth insulating layer (40). The fifth insulating layer (50) may be an organic layer.

[0137] The second connection electrode (CNE2) may be placed on the fifth insulating layer (50). The second connection electrode (CNE2) may be connected to the first connection electrode (CNE1) through a contact hole (CNT-2) penetrating the fourth insulating layer (40) and the fifth insulating layer (50).

[0138] The sixth insulating layer (60) is placed on the fifth insulating layer (50) and can cover the second connection electrode (CNE2). The sixth insulating layer (60) may be an organic layer.

[0139] The light-emitting element layer (130) may be disposed on the circuit layer (120). The light-emitting element layer (130) may include a light-emitting element (100PE). For example, the light-emitting element layer (130) may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. Hereinafter, the light-emitting element (100PE) is described as an example of an organic light-emitting element, but is not particularly limited thereto.

[0140] The light-emitting element (100PE) may include a first electrode (AE), a light-emitting layer (EL), and a second electrode (CE).

[0141] The first electrode (AE) may be placed on the sixth insulating layer (60). The first electrode (AE) may be connected to the second connection electrode (CNE2) through a contact hole (CNT-3) penetrating the sixth insulating layer (60).

[0142] The pixel defining film (70) is disposed on the sixth insulating layer (60) and can cover a portion of the first electrode (AE). An opening (70-OP) is defined in the pixel defining film (70). The opening (70-OP) of the pixel defining film (70) exposes at least a portion of the first electrode (AE).

[0143] The first display unit (DA1-F, see FIG. 1A) may include a light-emitting area (PXA) and a non-light-emitting area (NPXA) adjacent to the light-emitting area (PXA). The non-light-emitting area (NPXA) may surround the light-emitting area (PXA). In the present embodiment, the light-emitting area (PXA) is defined to correspond to a portion of the first electrode (AE) exposed by the opening (70-OP).

[0144] The light-emitting layer (EL) may be disposed on the first electrode (AE). The light-emitting layer (EL) may be disposed in an area corresponding to the opening (70-OP). That is, the light-emitting layer (EL) may be formed separately for each pixel. When the light-emitting layer (EL) is formed separately for each pixel, each of the light-emitting layers (EL) may emit light of at least one color among blue, red, and green. However, the present invention is not limited thereto, and the light-emitting layer (EL) may be connected to the pixels and included in common. In this case, the light-emitting layer (EL) may provide blue light or white light.

[0145] The second electrode (CE) may be disposed on the light-emitting layer (EL). The second electrode (CE) may have an integral shape and may be commonly included in a plurality of pixels.

[0146] In one embodiment of the present invention, a hole control layer may be disposed between the first electrode (AE) and the light emitting layer (EL). The hole control layer may be commonly disposed in the light emitting area (PXA) and the non-light emitting area (NPXA). The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be disposed between the light emitting layer (EL) and the second electrode (CE). The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels using an open mask or inkjet process.

[0147] The encapsulating layer (140) may be disposed on the light-emitting element layer (130). The encapsulating layer (140) may include sequentially laminated inorganic layers, organic layers, and inorganic layers, but the layers constituting the encapsulating layer (140) are not limited thereto. The inorganic layers may protect the light-emitting element layer (130) from moisture and oxygen, and the organic layers may protect the light-emitting element layer (130) from foreign substances such as dust particles. The inorganic layers may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic-based organic layer, but is not limited thereto.

[0148] The sensor layer (200) may include a sensor base layer (201), a first conductive layer (202), an intermediate insulating layer (203), a second conductive layer (204), and a cover insulating layer (205).

[0149] The sensor base layer (201) may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the sensor base layer (201) may be an organic layer including an epoxy resin, an acrylic resin, or an imide-based resin. The sensor base layer (201) may have a single-layer structure or a multi-layer structure laminated along the third direction (DR3).

[0150] Each of the first conductive layer (202) and the second conductive layer (204) may have a single-layer structure or a multi-layer structure laminated along the third direction (DR3).

[0151] Each of the first conductive layer (202) and the second conductive layer (204) of the single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, or the like.

[0152] Each of the first conductive layer (202) and the second conductive layer (204) of the multilayer structure may include metal layers. The metal layers may have a three-layer structure of, for example, titanium / aluminum / titanium. The conductive layer of the multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0153] At least one of the intermediate insulating layer (203) and the cover insulating layer (205) may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0154] At least one of the intermediate insulating layer (203) and the cover insulating layer (205) may include an organic film. The organic film may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0155] As previously described, the sensor layer (200) includes a first conductive layer (202) and a second conductive layer (204), i.e., two conductive layers in total. However, this is not particularly limited. For example, the sensor layer (200) may include three or more conductive layers.

[0156] FIG. 8a is a plan view schematically illustrating a lower conductive layer according to one embodiment of the present invention, and FIG. 8b is a cross-sectional view of the first portion (A1) illustrated in FIG. 8a. FIG. 8c is a cross-sectional view of the lower conductive layer and the sensor layer according to one embodiment of the present invention.

[0157] Referring to FIG. 8A, the lower conductive layer (300) includes first coils (COL11, COL12, COL13, COL14) and second coils (COL21, COL22, COL23). The first coils (COL11, COL12, COL13, COL14) are arranged spaced apart from each other in a first direction (DR1), and the second coils (COL21, COL22, COL23) are arranged spaced apart from each other in the first direction (DR1). Each of the second coils (COL21, COL22, COL23) can intersect two adjacent first coils. FIG. 8a illustrates, by way of example, that four first coils (COL11, COL12, COL13, COL14) are provided and three second coils (COL21, COL22, COL23) are provided, but the number of first coils (COL11, COL12, COL13, COL14) and the number of second coils (COL21, COL22, COL23) are not particularly limited. The four first coils (COL11, COL12, COL13, COL14) may be referred to as the 1-1 coil (COL11), the 1-2 coil (COL12), the 1-3 coil (COL13), and the 1-4 coil (COL14), respectively, and the two coils arranged at the outermost ends (i.e., the 1-1 coil (COL11) and the 1-4 coil (COL14)) may be referred to as the first and second outermost coils, respectively. The three second coils (COL21, COL22, COL23) may be referred to as the 2-1 coil (COL21), the 2-2 coil (COL22), and the 2-3 coil (COL23), respectively.

[0158] The coil (COL11) includes a first-first extension portion (EP11), a first-second extension portion (EP12), and a first-first connection portion (CP11). The first-first extension portion (EP11) extends in a second direction (DR2) intersecting the first direction (DR1), and the first-second extension portion (EP12) is spaced apart from the first-first extension portion (EP11) in the first direction (DR1). The first-first connection portion (CP11) connects the first-first extension portion (EP11) and the first-second extension portion (EP12).

[0159] The coil (COL12) includes a second-first extension portion (EP21), a second-second extension portion (EP22), and a first-second connection portion (CP12). The second-first extension portion (EP21) extends in the second direction (DR2), and the second-second extension portion (EP22) is spaced apart from the second-first extension portion (EP21) in the first direction (DR1). The first-second connection portion (CP12) connects the second-first extension portion (EP21) and the second-second extension portion (EP22). That is, each of the first-first coil (COL11) and the first-second coil (COL12) may have an n-shape.

[0160] Each of the coils (COL21, COL22, COL23) includes a third extension portion (EP3), a fourth extension portion (EP4), and a second connection portion (CP21). The third extension portion (EP3) extends in a second direction (DR2), and the fourth extension portion (EP4) is spaced apart from the third extension portion (EP3) in the first direction (DR1). The second connection portion (CP21) connects the third extension portion (EP3) and the fourth extension portion (EP4). The second connection portion (CP21) intersects the first-second extension portion (EP12) and the second-first extension portion (EP21). Each of the second coils (COL21, COL22, COL23) may have an n-shape.

[0161] As illustrated in FIGS. 8A and 8B , the second connecting portion (CP21) includes a plurality of body portions (BDP) and a bridge portion (BRP) electrically connecting the body portions (BDP). The body portions (BDP) may be spaced apart from each other in the first direction (DR1). In one embodiment of the present invention, the body portions (BDP), the first-second extension portion (EP12) and the second-first extension portion (EP21) are disposed on a first layer (301), and the bridge portion (BRP) is disposed on a second layer (302) different from the first layer (301). In FIG. 8B , the first layer (301) is exemplarily illustrated as being disposed on the second layer (302), but the present invention is not limited thereto. For example, the second layer (302) may also be disposed on the first layer (301).

[0162] The first layer (301) is provided with contact holes (CNT31) for exposing the bridge portion (BRP), and the body portions (BDP) are connected to the bridge portions (BRP) through the contact holes (CNT31). The bridge portions (BRP) overlap the first-second extension portion (EP12) and the second-first extension portion (EP21) on a plane, but may be arranged on different layers to be electrically insulated from each other.

[0163] The lower conductive layer (300) may further include a third layer. As illustrated in FIG. 8B, when the first layer (301) is disposed on the second layer (302), the third layer may be disposed on the first layer (301) to cover the body portions (BDP), the first-second extension portion (EP12), and the second-first extension portion (EP21). Meanwhile, when the second layer (302) is disposed on the first layer (301), the third layer may be disposed on the second layer (302) to cover the bridge portion (BRP).

[0164] Alternatively, when the sensor layer (200) is disposed on the lower conductive layer (300), the bridge portion (BRP) may be disposed within the sensor layer (200). Referring to FIG. 8c, the lower conductive layer (300) includes a first layer (301) and body portions (BDP) disposed on the first layer (301), a first-second extension portion (EP12), and a second-first extension portion (EP21). The sensor layer (200) includes a sensor base layer (201), a first conductive layer (202, see FIG. 7), an intermediate insulating layer (203), and a second conductive layer (204, see FIG. 7).

[0165] The body parts (BDP), the first-second extension part (EP12) and the second-first extension part (EP21) are covered by a sensor base layer (201), and a contact hole (CNT21) exposing the body parts (BDP) may be provided on the sensor base layer (201). A bridge part (BRP) is provided on the sensor base layer (201) and is connected to the body parts (BDP) through the contact hole (CNT21).

[0166] When the bridge portion (BRP) is placed within the sensor layer (200), the bridge portion (BRP) can be formed by utilizing the first conductive layer (202), thereby simplifying the process.

[0167] Referring again to FIG. 8A, the lower conductive layer (300) further includes connection pins (P1 to P6, MOP1, MOP2) connecting one end of the first coils (COL11, COL12, COL13, COL14) and one end of the second coils (COL21, COL22, COL23). In one example of the present invention, the connection pins (P1 to P6, MOP1, MOP2) include first to sixth connection pins (P1 to P6), and first and second outermost connection pins (MOP1, MOP2).

[0168] The first connection pin (P1) is connected to the 1-2 extension portion (EP12) and the 3rd extension portion (EP3), and the second connection pin (P2) is connected to the 2-1 extension portion (EP21) and the 4th extension portion (EP4). The first outermost connection pin (MOP1) is connected to the 1-1 extension portion (EP11), and the second outermost connection pin (MOP2) is connected to the 4-2 extension portion (EP42) of the 1-4 coil (COL14). When the 1-1 coil (COL11) is the first outermost coil and the 1-4 coil (COL14) is the second outermost coil, the 1-1 extension portion (EP11) and the 1-2 extension portion (EP12) may be referred to as the 1-1 outermost extension portion and the 1-2 outermost extension portion, respectively. The 4-1 extension portion and the 4-2 extension portion (EP42) of the 1-4 coil (COL14) may be referred to as the 2-1 outermost extension portion and the 2-2 outermost extension portion, respectively.

[0169] The first gap (d1) between the extension portion (EP11) and the first-second extension portion (EP12) may be equal to or different from the second gap (d2) between the second-first extension portion (EP21) and the second-second extension portion (EP22). FIG. 8A illustrates an example where the first and second gaps (d1, d2) are equal to each other, but the first gap (d1) may be smaller than the second gap (d2). The third gap (d3) between the third extension portion (EP3) and the fourth extension portion (EP4) may be equal to or different from the first gap (d1) and / or the second gap (d2). FIG. 8A illustrates an example where the third gap (d3) is equal to the first and second gaps (d1, d2), but the third gap (d3) may be smaller than or larger than the first gap (d1) and / or the second gap (d2).

[0170] The first sub-interval (ds1) between the extension portion (EP12) and the third extension portion (EP3) may be the same as or different from the second sub-interval (ds2) between the second-first extension portion (EP21) and the fourth extension portion (EP4). The interval (ds3) between the first-second extension portion (EP12) and the second-first extension portion (EP21) may be the same as the first and second sub-intervals (ds1, ds2). Meanwhile, the interval (ds4) between the first-first extension portion (EP11) and the third extension portion (EP3) may be different from the first and second sub-intervals (ds1, ds2).

[0171] In this way, by overlappingly arranging two coils and connecting one connecting pin to the two coils in common, the number of connecting pins (P1 to P6, MOP1, MOP2) provided in the lower conductive layer (300) can be reduced overall. In addition, as the number of connecting pins (P1 to P6, MOP1, MOP2) is reduced, the number of elements connected to the lower conductive layer (300) and the size of the components can be reduced, and as a result, the configuration of the electronic device can be simplified.

[0172] FIG. 9 is a diagram illustrating the operation of the pen sensing mode according to one embodiment of the present invention. FIG. 10a is a diagram for explaining the lower conductive layer operating in the charge driving mode illustrated in FIG. 9. FIG. 10b is a graph illustrating waveforms of a first charging signal and a second charging signal according to one embodiment of the present invention, and FIG. 10c is a graph illustrating waveforms of the first charging signal and the second charging signal according to one embodiment of the present invention. FIG. 11 is a diagram for explaining the lower conductive layer operating in the sensing driving mode illustrated in FIG. 9.

[0173] Referring to FIGS. 9 and 10A, the pen sensing mode (PSM) may include a charge driving mode (CDM) and a sensing driving mode (SDM). The charge driving mode (CDM) is a mode for charging the pen (PN), and in the charge driving mode (CDM), a current path may be formed in the lower conductive layer (300) to charge the resonant circuit of the pen (PN). The sensing driving mode (SDM) may be a mode for sensing the input of the pen. The position of the pen may be sensed in the sensing driving mode (SDM).

[0174] In the pen sensing mode (PSM), a plurality of pen sensing frames (PSF) can be generated sequentially. Each pen sensing frame (PSF) can include a section in which it operates in the charge driving mode (CDM) and a section in which it operates in the sensing driving mode (SDM). Therefore, in the pen sensing mode (PSM), the charge driving mode (CDM) and the sensing driving mode (SDM) can be generated alternately.

[0175] Referring to FIGS. 10A to 11, the sensor driving unit (200C) (see FIG. 6A) includes a charging circuit (2CC), a sensor circuit (2SC), a first switching circuit (2SE1), a second switching circuit (2SE2), and a third switching circuit (2SE3). The charging circuit (2CC) may be connected to the lower conductive layer (300) through the first and second switching circuits (2SE1, 2SE2). The charging circuit (2CC) may include a first terminal (OT1) for outputting a first charging signal (SG1) and a second terminal (OT2) for outputting a second charging signal (SG2).

[0176] The first switching circuit (2SE1) includes a plurality of first switching elements (ST1) that switch the connection between the connection pins (P1 to P6, MOP1, MOP2) of the lower conductive layer (300) and the first terminal (OT1). The second switching circuit (2SE2) may include a plurality of second switching elements (ST2) that switch the connection between the connection pins (P1 to P6, MOP1, MOP2) of the lower conductive layer (300) and the second terminal (OT2).

[0177] In the charge driving mode (CDM), when charging the pen (PN) using the first and second coils (COL12), the second and third connection pins (P2, P3) can be connected to the charging circuit (2CC) through the first and second switching circuits (2SE1, 2SE2). Specifically, among the first switching elements (ST1), only the first switching element (ST1) connected to the third connection pin (P3) can be turned on, and the first switching elements (ST1) connected to the remaining connection pins (P1 to P2, P4 to P6, MOP1, MOP2) can be turned off. Accordingly, the first charging signal (SG1) output from the first terminal (OT1) of the charging circuit (2CC) can be provided to the third connection pin (P3) through the first switching element (ST1) connected to the third connection pin (P3). Among the second switching elements (ST2), only the second switching element (ST2) connected to the second connection pin (P2) can be turned on, and the second switching elements (ST2) connected to the remaining connection pins (P1, P3 to P6, MOP1, MOP2) can be turned off. Accordingly, the second charging signal (SG2) output from the second terminal (OT2) of the charging circuit (2CC) can be provided to the second connection pin (P2) through the second switching element (ST2) connected to the second connection pin (P2).

[0178] Referring to Fig. 10b, the first and second charging signals (SG1, SG2) may be AC ​​signals that are opposite in phase to each other. For example, each of the first and second charging signals (SG1, SG2) may be a sinusoidal signal. Since the first and second charging signals (SG1, SG2) are opposite-phase signals, a current path may be formed in the first-second coil (COL12). In addition, since the first charging signal (SG1) and the second charging signal (SG2) are opposite-phase sinusoidal signals, the direction of the current path may change periodically.

[0179] Referring to Fig. 10c, each of the first charging signal (SG1a) and the second charging signal (SG2a) may be a square wave signal. The second charging signal (SG2a) may be a reverse signal of the first charging signal (SG1a). Since the first and second charging signals (SG1a, SG2a) are reverse signals, a current path may be formed in the first-second coil (COL12). In addition, since the first charging signal (SG1a) and the second charging signal (SG2a) are square wave signals with reverse phases, the direction of the current path may change periodically.

[0180] FIG. 10a illustrates an example of charging the pen (PN) using the first-second coil (COL12), but the coil used for charging the pen (PN) (hereinafter referred to as a charging coil) may be selected based on the position at which the pen (PN) is sensed.

[0181] The switching circuit (2SE3) includes a plurality of third switching elements (ST3) arranged between the sensor circuit (2SC) and the connection pins (P1 to P6, MOP1, MOP2). In the charge driving mode (CDM), the third switching elements (ST3) may be in a turn-off state. Thereafter, in the sensing driving mode (SDM), all of the third switching elements (ST3) may be turned on. In the sensing driving mode (SDM), both of the first and second switching elements (ST1, ST2) may be turned off.

[0182] In the sensing drive mode (SDM), the sensor circuit (2SC) can be electrically connected to the connection pins (P1 to P6, MOP1, MOP2) through the third switching circuit (2SE3). An induced current can flow in the coils arranged in the lower conductive layer (300) due to a magnetic field generated from the pen (PN). The generated induced current can be provided to the sensor circuit (2SC) through the third switching circuit (2SE3). The sensor circuit (2SC) can detect the position (or coordinates) of the pen using the sensed induced current.

[0183] The direction of the current path flowing in the coils located on the left side of the pen (PN) and the direction of the current path flowing in the coils located on the right side may be opposite to each other. Therefore, the pen (PN) may exist between two connection pins with opposite current path directions. In this case, the charging coil of the next pen sensing frame may be selected as the coil connected to the two connection pins with opposite current path directions.

[0184] Meanwhile, if the pen (PN) is not located at the center between two connecting pins whose current path directions are opposite to each other, the absolute current values ​​of the current paths may be different. Among these, the absolute current value of the current path closer to the pen (PN) may be greater than the absolute current value of the current path farther from the pen (PN). In this case, the sensor driving unit (200C) (see FIG. 6a) may select a connecting pin with a larger absolute current value among the two connecting pins, and select a coil connected to the selected connecting pin and one of its adjacent pins as a charging coil.

[0185] FIG. 12 is a plan view schematically illustrating a lower conductive layer according to one embodiment of the present invention.

[0186] Referring to FIG. 12, the lower conductive layer (300a) according to one embodiment of the present invention includes first x-axis coils (COL11, COL12, COL13, COL14), second x-axis coils (COL21, COL22, COL23), first y-axis coils (COL31, COL32, COL33) (or referred to as third coils) and second y-axis coils (COL41, COL42) (or referred to as fourth coils).

[0187] The first x-axis coils (COL11, COL12, COL13, COL14) are arranged spaced apart in the first direction (DR1), and the second x-axis coils (COL21, COL22, COL23) are arranged spaced apart in the first direction (DR1). Each of the second x-axis coils (COL21, COL22, COL23) can intersect with two adjacent first x-axis coils. FIG. 12 illustrates, by way of example, that four first x-axis coils (COL11, COL12, COL13, COL14) are provided and three second x-axis coils (COL21, COL22, COL23) are provided, but the number of first x-axis coils (COL11, COL12, COL13, COL14) and the number of second x-axis coils (COL21, COL22, COL23) are not particularly limited. The four first x-axis coils (COL11, COL12, COL13, COL14) may be referred to as a 1-1 x-axis coil (COL11), a 1-2 x-axis coil (COL12), a 1-3 x-axis coil (COL13), and a 1-4 x-axis coil (COL14). The three second x-axis coils (COL21, COL22, COL23) may be referred to as the second-first x-axis coil (COL21), the second-second x-axis coil (COL22), and the second-third x-axis coil (COL23).

[0188] The first y-axis coils (COL31, COL32, COL33) are arranged to be spaced apart in the second direction (DR2), and the second y-axis coils (COL41, COL42) are arranged to be spaced apart in the second direction (DR2). Each of the second y-axis coils (COL41, COL42) can intersect with two adjacent first y-axis coils. FIG. 12 exemplarily illustrates that three first y-axis coils (COL31, COL32, COL33) are provided, and two second y-axis coils (COL41, COL42) are provided, but the number of the first y-axis coils (COL31, COL32, COL33) and the number of the second y-axis coils (COL41, COL42) are not particularly limited. The three first y-axis coils (COL31, COL32, COL33) may be referred to as the third-first y-axis coil (COL31), the third-second y-axis coil (COL32), and the third-third y-axis coil (COL33). The two second y-axis coils (COL41, COL42) may be referred to as the fourth-first y-axis coil (COL41) and the fourth-second y-axis coil (COL42).

[0189] The lower conductive layer (300a) further includes x-axis connection pins (XP1 to XP6, XMOP1, XMOP2) connecting the ends of the first x-axis coils (COL11, COL12, COL13, COL14) and the ends of the second x-axis coils (COL21, COL22, COL23). In one example of the present invention, the x-axis connection pins (XP1 to XP6, XMOP1, XMOP2) include first to sixth connection pins (XP1 to XP6), and first and second outermost connection pins (XMOP1, XMOP2).

[0190] The lower conductive layer (300a) further includes y-axis connection pins (YP1 to YP4, YMOP1, YMOP2) connecting the ends of the first y-axis coils (COL31, COL32, COL33) and the ends of the second y-axis coils (COL41, COL42). In one example of the present invention, the y-axis connection pins (YP1 to YP4, YMOP1, YMOP2) include seventh to tenth connection pins (YP1 to YP4), and third and fourth outermost connection pins (YMOP1, YMOP2).

[0191] The sensor driving unit (200C) (see FIG. 6a) is connected to the x-axis coils (COL11 to COL14, COL21 to COL23) through the x-axis connection pins (XP1 to XP6, XMOP1, XMOP2), and to the y-axis coils (COL31 to COL33, COL41, COL42) through the y-axis connection pins (YP1 to YP4, YMOP1, YMOP2).

[0192] In the charge driving mode (CDM), the sensor driver (200C) may select one of the first x-axis coils (COL11, COL12, COL13, COL14) and the second x-axis coils (COL21, COL22, COL23) as a charging coil and perform a charging operation to charge the pen (PN). That is, the first y-axis coils (COL31, COL32, COL33) and the second y-axis coils (COL41, COL42) may not be utilized for the charging operation.

[0193] Meanwhile, in the sensing drive mode, the sensor drive unit (200C) can detect the x-axis coordinate of the pen (PN) using the first x-axis coils (COL11, COL12, COL13, COL14) and the second x-axis coils (COL21, COL22, COL23), and can detect the y-axis coordinate of the pen (PN) using the first y-axis coils (COL31, COL32, COL33) and the second y-axis coils (COL41, COL42).

[0194] Figures 13a and 13b are schematic plan views illustrating lower conductive layers (300b, 300c) according to one embodiment of the present invention. In Figures 13a and 13b, the first and second coils (COL11 to COL14, COL21 to COL23) have the same structure as the first and second coils (COL11 to COL14, COL21 to COL23) illustrated in Figure 8a, and therefore, descriptions of the first and second coils (COL11 to COL14, COL21 to COL23) are omitted.

[0195] Referring to FIGS. 8A and 13A, the lower conductive layer (300b) according to one embodiment of the present invention includes first coils (COL11, COL12, COL13, COL14), second coils (COL21, COL22, COL23) and a dummy electrode.

[0196] As an example of the present invention, the dummy electrode includes a plurality of dummy bar patterns (DBP1) extending in a second direction (DR2) and arranged in a first direction (DR1). The plurality of dummy bar patterns (DBP1) are arranged in a space between the first and second coils (COL11 to COL14, COL21 to COL23) to improve the surface flatness of the lower conductive layer (300b). That is, by providing the dummy bar patterns (DBP1), the step difference caused by the first and second coils (COL11 to COL14, COL21 to COL23) on the surface of the lower conductive layer (300b) can be eliminated or reduced. The phenomenon of the visibility of the electronic device (1000) being deteriorated due to the surface step difference of the lower conductive layer (300b) can be prevented.

[0197] At least one dummy bar pattern (e.g., two dummy bar patterns (DBP1)) is arranged between the first-second extension portion (EP12) and the second-first extension portion (EP21). In addition, at least one dummy bar pattern (e.g., two dummy bar patterns (DBP1)) is arranged between the first-second extension portion (EP12) and the third extension portion (EP3), and at least one dummy bar pattern (e.g., two dummy bar patterns (DBP1)) is arranged between the second-first extension portion (EP21) and the fourth extension portion (EP4).

[0198] FIG. 13a exemplarily illustrates a structure in which the same number of dummy bar patterns (DBP1) are provided between the first-second extension portion (EP12) and the second-first extension portion (EP21), between the first-second extension portion (EP12) and the third extension portion (EP3), and between the second-first extension portion (EP21) and the fourth extension portion (EP4), but the present invention is not limited thereto.

[0199] At least one dummy bar pattern (e.g., four dummy bar patterns (DBP1)) is arranged between the extension portion (EP11) and the third extension portion (EP3). The number of dummy bar patterns (DBP1) arranged between the 1-1 extension portion (EP11) and the third extension portion (EP3) may be different from the number of dummy bar patterns (DBP1) arranged between the 1-2 extension portion (EP12) and the third extension portion (EP3). Alternatively, the width of the dummy bar pattern (DBP1) arranged between the 1-1 extension portion (EP11) and the third extension portion (EP3) in the first direction (DR1) may be different from the width of the dummy bar pattern (DBP1) arranged between the 1-2 extension portion (EP12) and the third extension portion (EP3) in the first direction (DR1).

[0200] As an example of the present invention, the dummy bar patterns (DBP1) may be arranged on the first layer (301, see FIG. 8b). That is, the dummy bar patterns (DBP1), the first-second extension portion (EP12), and the second-first extension portion (EP21) may be arranged on the same layer.

[0201] The dummy bar patterns (DBP1) are arranged in an island configuration and may be electrically floating. However, the present invention is not limited thereto. For example, the dummy bar patterns (DBP1) may be electrically connected to each other. In this case, the dummy bar patterns (DBP1) may be grounded or receive a voltage having a specific potential.

[0202] FIG. 13a illustrates an example of a structure in which a dummy electrode includes dummy bar patterns (DBP1), but the shape of the dummy electrode is not limited thereto and may be modified in various ways.

[0203] Referring to FIG. 13b, a dummy electrode (DDE) according to an embodiment of the present invention includes a plurality of dummy electrode patterns (DEPa) and at least one dummy bar pattern (DBPa). The plurality of dummy electrode patterns (DEPa) and at least one dummy bar pattern (DBPa) are arranged in a space between the first and second coils (COL11 to COL14, COL21 to COL23) to improve the surface flatness of the lower conductive layer (300c).

[0204] A plurality of dummy electrode patterns (DEPa) can be arranged in a matrix form in the first direction (DR1) and the second direction (DR2). Each of the dummy electrode patterns (DEPa) can have a polygonal shape, but is not particularly limited thereto.

[0205] Dummy electrode patterns (e.g., 11 dummy electrode patterns DEPa) arranged in the second direction (DR2) are arranged between the extension portion (EP12) and the second-first extension portion (EP21), between the first-second extension portion (EP12) and the third extension portion (EP3), and between the second-first extension portion (EP21) and the fourth extension portion (EP4). Dummy electrode patterns DEPa arranged in two rows and one dummy bar pattern DBPa may be arranged between the first-first extension portion (EP11) and the third extension portion (EP3).

[0206] FIG. 14a is a plan view showing the effective area (EA) and the non-effective area (NEA) of the lower conductive layer (300) according to one embodiment of the present invention, and FIG. 14b is a plan view showing the effective area (EA) and the non-effective area (NEA) of the lower conductive layer (300a) according to one embodiment of the present invention.

[0207] Referring to FIGS. 8A and 14A, the lower conductive layer (300) may include an active area (EA) and an inactive area (NEA) adjacent to the active area (EA). The active area (EA) may be an area substantially used for pen (PN) sensing, and the inactive area (NEA) may be an area substantially not used for pen sensing. In one example of the present invention, the inactive area (NEA) may be provided to surround the active area (EA).

[0208] The effective area (EA) may be an area corresponding to the first display portion (DA1-F) illustrated in FIG. 1A, and the non-effective area (NEA) may be an area corresponding to the first non-display portion (NDA1) illustrated in FIG. 1A.

[0209] As an example of the present invention, the connection portions of the first coils (COL11 to COL14) and the connection portions of the second coils (COL21 to COL23) may not overlap with the effective area (EA) on a plane. That is, the first-first connection portion (CP11) and the first-second connection portion (CP12) may be arranged outside the effective area (EA) (i.e., the non-effective area (NEA)). In addition, the second connection portion (CP21) of the second coils (COL21 to COL23) may also be arranged outside the effective area (EA) (i.e., the non-effective area (NEA)).

[0210] Among the first coils, the first-first coil (COL11) may be defined as the first outermost coil adjacent to the first side (e.g., the left side) of the effective area (EA). The first-first extension portion (EP11) (or referred to as the first-first outermost extension portion) of the first-first coil (COL11) may not overlap with the effective area (EA), and the first-second extension portion (EP12) (or referred to as the first-second outermost extension portion) of the first-first coil (COL11) may overlap with the effective area (EA).

[0211] Among the first coils, the 1-4th coil (COL14) may be defined as a second outermost coil adjacent to the second side (e.g., the right side) of the effective area (EA). The 1-4th extension portion (EP14) (or referred to as the 2-1st outermost extension portion) of the 1-4th coil (COL14) may not overlap with the effective area (EA), and the 4-2nd extension portion (EP42) (or referred to as the 2-2nd outermost extension portion) of the 1-4th coil (COL14) may overlap with the effective area (EA). That is, the first-first outermost extension portion (EP11) of the first outermost coil (COL11) and the first-second outermost extension portion (EP42) of the second outermost coil (COL14) are arranged in the non-effective area (NEA) and can be used for charging the pen (PN) in the charge driving mode (CDM), but may not be used for detecting the pen (PN) coordinates in the sensing driving mode (SDM).

[0212] The connecting pins (P1 to P6, MOP1, MOP2) do not overlap on the plane with the effective area (EA). The connecting pins (P1 to P6, MOP1, MOP2) can be arranged in the non-effective area (NEA). The connecting pins (P1 to P6, MOP1, MOP2) can be electrically connected to the sensor driver (200C) (see FIG. 6a) through a flexible circuit film attached to the non-effective area (NEA) of the lower conductive layer (300).

[0213] Referring to FIG. 14b, the lower conductive layer (300a) may include an effective area (EA) and a non-effective area (NEA) adjacent to the effective area (EA).

[0214] The connection portions of the first x-axis coils (COL11 to COL14) and the connection portions of the second x-axis coils (COL21 to COL23) may not overlap with the effective area (EA) on a plane. In addition, the connection portions of the first y-axis coils (COL31 to COL33) and the connection portions of the second y-axis coils (COL41, COL42) may not overlap with the effective area (EA) on a plane.

[0215] A portion of a first outermost coil (COL11) adjacent to a first side (e.g., a left side) of an effective area (EA) among the first x-axis coils is disposed in a non-effective area (NEA). A portion of a second outermost coil (COL14) adjacent to a second side (e.g., a right side) of an effective area (EA) among the first x-axis coils may overlap with the non-effective area (NEA). A portion of a third outermost coil (COL31) adjacent to a third side (e.g., a lower side) of an effective area (EA) among the first y-axis coils may be disposed in a non-effective area (NEA), and a portion of a fourth outermost coil (COL33) adjacent to a fourth side (e.g., an upper side) of an effective area (EA) among the first y-axis coils may overlap with the non-effective area (NEA).

[0216] The x-axis connection pins (XP1 to XP6, XMOP1, XMOP2) and the y-axis connection pins (YP1 to YP4, YMOP1, YMOP2) do not overlap on the plane with the effective area (EA). The x-axis connection pins (XP1 to XP6, XMOP1, XMOP2) and the y-axis connection pins (YP1 to YP4, YMOP1, YMOP2) can be arranged in the non-effective area (NEA). The x-axis connection pins (XP1 to XP6, XMOP1, XMOP2) and the y-axis connection pins (YP1 to YP4, YMOP1, YMOP2) can be electrically connected to the sensor driver (200C) (see FIG. 6a) through a flexible circuit film attached to the non-effective area (NEA) of the lower conductive layer (300a).

[0217] Fig. 15 is a plan view showing a lower conductive layer (300d) according to one embodiment of the present invention.

[0218] Referring to FIG. 15, the lower conductive layer (300d) includes first coils (COL1a, COL1b, COL1c, COL1d) and second coils (COL2a, COL2b, COL2c). The first coils (COL1a, COL1b, COL1c, COL1d) are arranged to be spaced apart in the first direction (DR1), and the second coils (COL2a, COL2b, COL2c) are arranged to be spaced apart in the first direction (DR1). Each of the second coils (COL2a, COL2b, COL2c) can intersect two adjacent first coils.

[0219] Among the first coils (COL1a, COL1b, COL1c, COL1d), the 1-1 coil (COL1a) includes a 1-1 extension portion (EP11a), a 1-2 extension portion (EP12a), a 1-1 connection portion (CP11a), a 1-3 extension portion (EP11b), a 1-3 extension portion (EP12b), a 1-2 connection portion (CP11b), and a 1-3 connection portion (CP11c). The 1-1 to 1-4 extension portions (EP11a, EP12a, EP11b, EP12b) extend in the second direction (DR2). The 1-1 coil (COL1a) may have a loop shape wound by one or more turns. The 1-1 coil (COL1a) may have a similar shape to the remaining 1-1 coils (COL1b, COL1c, COL1d). In this way, when the 1-1 coil (COL1a) has a loop shape wound more than once, the size of the current induced in the 1-1 coil (COL1a) can increase.

[0220] Among the coils (COL2a, COL2b, COL2c), the 2-1 coil (COL2a) includes a 3-1 extension portion (EP31), a 4-1 extension portion (EP41), a 2-1 connection portion (CP21a), a 3-2 extension portion (EP32), a 4-2 extension portion (EP42), a 2-2 connection portion (CP21b), and a 2-3 connection portion (CP21c). The 2-1 coil (COL2a) may have a loop shape wound with one or more turns. The 2-1 coil (COL2a) may have a shape similar to that of the remaining 2-1 coils (COL2b, COL2c). In this way, when the 2-1 coil (COL2a) has a loop shape wound with one or more turns, the magnitude of the current induced in the 2-1 coil (COL2a) may increase.

[0221] Fig. 16 is a plan view of a sensor layer (200) according to one embodiment of the present invention. Fig. 17 is an enlarged plan view of one sensing unit (SU) according to one embodiment of the present invention. Fig. 18a is a plan view illustrating a first conductive layer (202SU) of a sensing unit (SU) according to one embodiment of the present invention. Fig. 18b is a plan view illustrating a second conductive layer (204SU) of a sensing unit (SU) according to one embodiment of the present invention. Fig. 19 is a cross-sectional view of a sensor layer (200) according to one embodiment of the present invention taken along line II' illustrated in Figs. 18a and 18b, respectively.

[0222] Referring to FIG. 16, a sensor layer (200) may be defined with a sensing area (200A) and a peripheral area (200NA) adjacent to the sensing area (200A).

[0223] The sensor layer (200) may include a plurality of first electrodes (210), a plurality of second electrodes (220), a plurality of third electrodes (230), and a plurality of fourth electrodes (240) arranged in a sensing area (200A).

[0224] Each of the first electrodes (210) may intersect with the second electrodes (220). Each of the first electrodes (210) may extend along the second direction (DR2), and the first electrodes (210) may be arranged to be spaced apart from each other in the first direction (DR1). Each of the second electrodes (220) may extend along the first direction (DR1), and the second electrodes (220) may be arranged to be spaced apart from each other in the second direction (DR2). A sensing unit (SU) of the sensor layer (200) may be an area where one first electrode (210) and one second electrode (220) intersect.

[0225] In FIG. 16, six first electrodes (210) and ten second electrodes (220) are illustrated as examples, and 60 sensing units (SU) are illustrated as examples, but the number of first electrodes (210) and the number of second electrodes (220) are not limited thereto.

[0226] Referring to FIGS. 16 and 17, each of the first electrodes (210) may include first segmented electrodes (210dv1, 210dv2). The first segmented electrodes (210dv1, 210dv2) may extend along the second direction (DR2) and may be spaced apart from each other in the first direction (DR1). The first segmented electrodes (210dv1, 210dv2) may have a shape that is line-symmetrical with respect to a line extending in the second direction (DR2).

[0227] Each of the electrodes (220) may include second segmented electrodes (220dv1, 220dv2). The second electrodes (220) may extend along the first direction (DR1) and be spaced apart from each other in the second direction (DR2). The second segmented electrodes (220dv1, 220dv2) may have a shape that is symmetrical with respect to a line extending in the first direction (DR1).

[0228] Referring to FIGS. 17, 18a, 18b, and 19, each of the second segmented electrodes (220dv1, 220dv2) may include a sensing pattern (221) and a bridge pattern (222). The sensing pattern (221) and the bridge pattern (222) may be disposed on different layers, and the sensing pattern (221) and the bridge pattern (222) may be electrically connected to each other through a first contact (CNa). For example, the bridge pattern (222) may be included in the first conductive layer (202SU), and the sensing pattern (221) and the first segmented electrodes (210dv1, 210dv2) may be included in the second conductive layer (204SU). The first conductive layer (202SU) may be included in the first conductive layer (202) of FIG. 7, and the second conductive layer (204SU) may be included in the second conductive layer (204) of FIG. 7.

[0229] Each of the electrodes (230) may extend along the second direction (DR2), and the third electrodes (230) may be arranged to be spaced apart from each other in the first direction (DR1). In one embodiment of the present invention, each of the third electrodes (230) may include a plurality of first auxiliary electrodes (230s) connected in parallel. The number of first auxiliary electrodes (230s) included in each of the third electrodes (230) may vary. For example, as the number of first auxiliary electrodes (230s) included in each of the third electrodes (230) increases, the resistance of each of the third electrodes (230) may decrease, thereby improving power efficiency and sensing sensitivity. Conversely, as the number of first auxiliary electrodes (230s) included in each of the third electrodes (230) decreases, the loop coil pattern formed using the third electrodes (230) may be implemented in more diverse forms.

[0230] In Fig. 16, it is exemplarily illustrated that one third electrode (230) includes two first auxiliary electrodes (230s), but this is not particularly limited. The first auxiliary electrodes (230s) may be arranged in one-to-one correspondence with the first electrodes (210). Accordingly, one sensing unit (SU) may include a portion of one first auxiliary electrode (230s).

[0231] A coupling capacitor may be defined between one first electrode (210) and one first auxiliary electrode (230s). In this case, the induced current generated during pen sensing may be transmitted from the first auxiliary electrode (230s) to the first electrode (210) through the coupling capacitor. That is, the first auxiliary electrode (230s) may play a role of complementing the signal transmitted from the first electrode (210) to the sensor driver (200C). Therefore, the greatest effect may be obtained when the phase of the signal induced in the first auxiliary electrode (230s) and the phase of the signal induced in the first electrode (210) are identical. Accordingly, the center of the second direction (DR2) of each of the first electrodes (210) and the center of the second direction (DR2) of each of the first auxiliary electrodes (230s) may overlap each other. Additionally, the center of the first direction (DR1) of each of the first electrodes (210) and the center of the first direction (DR1) of each of the first auxiliary electrodes (230s) may overlap each other.

[0232] In one embodiment of the present invention, since one third electrode (230) includes two first auxiliary electrodes (230s), one third electrode (230) may correspond to (or overlap) two first electrodes (210). Accordingly, the number of first electrodes (210) included in the sensor layer (200) may be greater than the number of third electrodes (230). For example, the number of first electrodes (210) may be equal to the product of the number of third electrodes (230) included in the sensor layer (200) and the number of first auxiliary electrodes (230s) included in each of the third electrodes (230). In FIG. 16, the number of first electrodes (210) may be six, the number of third electrodes (230) may be three, and the number of first auxiliary electrodes (230s) included in each of the third electrodes (230) may be two.

[0233] The electrodes (240) may be arranged along the second direction (DR2), and the fourth electrodes (240) may extend along the first direction (DR1). In one embodiment of the present invention, each of the fourth electrodes (240) may include second auxiliary electrodes (240s1 or 240s2) connected in parallel. The second auxiliary electrodes (240s1 or 240s2) may be referred to as the 2-1 auxiliary electrode (240s1) and the 2-1 auxiliary electrode (240s2).

[0234] The routing directions of the auxiliary electrode (240s1) and the second auxiliary electrode (240s2) may be different from each other. In Fig. 9, two fourth electrodes (240) and five second auxiliary electrodes (240s1 or 240s2) included in each of the fourth electrodes (240) are illustrated as examples.

[0235] In this specification, the meaning of different routing directions is that the connection positions of the electrodes and the trace lines are different. For example, the first connection position of the fourth trace line (240t2) electrically connected to the second auxiliary electrode (240s1) and the second connection position of the fourth trace line (240t2) electrically connected to the second auxiliary electrode (240s2) may be different. The first connection position may be the left end with respect to the second auxiliary electrode (240s1), and the second connection position may be the right end of the second auxiliary electrode (240s2).

[0236] In another embodiment of the present invention, the sensor layer (200) may include a fourth electrode. In this case, the fourth electrode may include ten second auxiliary electrodes connected in parallel with each other. The number of second auxiliary electrodes is only described in the drawing illustrated in FIG. 16, and the number of second auxiliary electrodes included in the fourth electrode is not limited to the above-described example.

[0237] In Fig. 16, five second auxiliary electrodes (240s1) are electrically connected to each other, and five second auxiliary electrodes (240s2) are electrically connected to each other. That is, the area ratio of the two fourth electrodes (240) or the number ratio of the second auxiliary electrodes included in each of the two fourth electrodes (240) may have a ratio of 1 to 1. However, this is not particularly limited thereto. For example, the number of the second auxiliary electrodes (240s1) and the number of the second auxiliary electrodes (240s2) may be different from each other.

[0238] In one embodiment of the present invention, when each of the fourth electrodes (240) includes second auxiliary electrodes (240s1 or 240s2) connected in parallel, the area of ​​one fourth electrode may be increased. In addition, the resistance of each of the fourth electrodes (240) may be lowered, thereby improving the sensing sensitivity for the second input (3000, see FIG. 6A).

[0239] A coupling capacitor may be defined between one second electrode (220) and one second auxiliary electrode (240s1). In this case, the induced current generated during pen sensing may be transmitted from the second auxiliary electrode (240s1) to the second electrode (220) through the coupling capacitor. That is, the second auxiliary electrode (240s1) may play a role of supplementing the signal transmitted from the second electrode (220) to the sensor driver (200C). Therefore, the greatest effect may be obtained when the phase of the signal induced in the second auxiliary electrode (240s1) and the phase of the signal induced in the second electrode (220) are identical. Accordingly, the center of the first direction (DR1) of each of the second electrodes (220) and the center of the first direction (DR1) of each of the second auxiliary electrodes (240s1) may overlap with each other. Additionally, the center of the second direction (DR2) of each of the second electrodes (220) and the center of the second direction (DR2) of each of the second auxiliary electrodes (240s1) may overlap each other.

[0240] Referring to FIGS. 16, 18a, and 18b, each of the first auxiliary electrodes (230s) included in the third electrode (230) may include a 3-1 pattern (231) and a 3-2 pattern (232). The 3-1 pattern (231) and the 3-2 pattern (232) are disposed on different layers, and the 3-1 pattern (231) and the 3-2 pattern (232) may be electrically connected to each other through a second contact (CNb). The 3-1 pattern (231) may be included in the first conductive layer (202SU), and the 3-2 pattern (232) may be included in the second conductive layer (204SU).

[0241] In one embodiment of the present invention, a portion of the third-first pattern (231) may overlap a portion of each of the first segmented electrodes (210dv1, 210dv2). Accordingly, a coupling capacitance may be provided (or formed) between the first electrode (210) and the third electrode (230).

[0242] Referring to FIGS. 16, 18a, and 18b, each of the second auxiliary electrodes (240s1 or 240s2) included in the fourth electrode (240) may include a 4-1 pattern (241), a 4-2 pattern (242), and a 4-3 pattern (243). The 4-2 pattern (242) and the 4-3 pattern (243) may be disposed on the same layer, and the 4-1 pattern (241) may be disposed on a different layer from the 4-2 pattern (242) and the 4-3 pattern (243). The 4-1 pattern (241) and the 4-2 pattern (242) may be electrically connected to each other through a third contact (CNc), and the 4-1 pattern (241) and the 4-3 pattern (243) may be electrically connected to each other through a fourth contact (CNd). The 4-2 pattern (242) and the 4-3 pattern (243) may be included in the first conductive layer (202SU), and the 4-1 pattern (241) may be included in the second conductive layer (204SU).

[0243] In one embodiment of the present invention, a portion of the 4-2 pattern (242) may overlap with the sensing pattern (221) of each of the second segmented electrodes (220dv1, 220dv2). Accordingly, a coupling capacitor may be defined (or provided, formed) between the second electrode (220) and the fourth electrode (240).

[0244] In one embodiment of the present invention, the first conductive layer (202SU) may further include dummy patterns (DMP). Each of the dummy patterns (DMP) may be electrically floated or electrically grounded. In one embodiment of the present invention, the dummy patterns (DMP) may be omitted. Since the dummy patterns (DMP) are arranged in empty spaces, the probability that specific patterns are visible due to external light reflection may be reduced. In other words, an electronic device (1000, see FIG. 1A) with improved visibility due to external light reflection may be provided.

[0245] The sensor layer (200) may further include a plurality of first trace lines (210t) arranged in a peripheral area (200NA), a plurality of first pads (PD1) connected in a one-to-one correspondence to the first trace lines (210t), a plurality of second trace lines (220t), and a plurality of second pads (PD2) connected in a one-to-one correspondence to the second trace lines (220t).

[0246] The first trace lines (210t) may be electrically connected to the first electrodes (210) in a one-to-one correspondence, respectively. Two first segmented electrodes (210dv1, 210dv1) included in one first electrode (210) may be connected to one first trace line among the first trace lines (210t). Each of the first trace lines (210t) may include a plurality of branches for connecting to the two first segmented electrodes (210dv1, 210dv1). In one embodiment of the present invention, the two first segmented electrodes (210dv1, 210dv1) may be connected to each other within the sensing region (200A).

[0247] The trace lines (220t) may be electrically connected to each of the second electrodes (220) in a one-to-one correspondence. Two second segmented electrodes (220dv1, 220dv1) included in one second electrode (220) may be connected to one second trace line among the second trace lines (220t). Each of the second trace lines (220t) may include a plurality of branches for connecting to the two second segmented electrodes (220dv1, 220dv2). In one embodiment of the present invention, the two second segmented electrodes (220dv1, 220dv2) may be connected to each other within the sensing region (200A).

[0248] The sensor layer (200) may further include a third trace line (230rt1) arranged in a peripheral area (200NA), a plurality of third pads (PD3) connected to one end and the other end of the third trace line (230rt1), fourth trace lines (240t-1, 240t-2), and fourth pads (PD4) connected in one-to-one correspondence to the fourth trace lines (240t-1, 240t-2).

[0249] The trace line (230rt1) may be electrically connected to at least one first auxiliary electrode (230s) among the first auxiliary electrodes (230s). In one embodiment of the present invention, the third trace line (230rt1) may be electrically connected to all of the first auxiliary electrodes (230s). That is, the third trace line (230rt1) may be electrically connected to all of the third electrodes (230). The third trace line (230rt1) may include a first line portion (231t) extending along a first direction (DR1) and electrically connected to the third electrodes (230), a second line portion (232t) extending along a second direction (DR2) from a first end of the first line portion (231t), and a third line portion (233t) extending along the second direction (DR2) from a second end of the first line portion (231t).

[0250] In one embodiment of the present invention, the resistance of the second line portion (232t) and the resistance of the third line portion (233t) may each be substantially equal to the resistance of the third electrode of one of the third electrodes (230). Therefore, the second line portion (232t) and the third line portion (233t) may function as the third electrodes (230), and the same effect as if the third electrodes (230) were also disposed in the peripheral area (200NA) may be obtained. For example, either one of the second line portion (232t) and the third line portion (233t) or one of the third electrodes (230) may form a coil. Therefore, a pen located in an area adjacent to the peripheral area (200NA) may also be sufficiently charged by a loop including the second line portion (232t) or the third line portion (233t).

[0251] In one embodiment of the present invention, in order to adjust the resistance of the second line portion (232t) and the resistance of the third line portion (233t), the width of each of the second line portion (232t) and the third line portion (233t) in the first direction (DR1) may be adjusted. However, this is merely an example, and the first to third line portions (231t, 232t, 233t) may have substantially the same width.

[0252] The trace lines (240t-1, 240t-2) may be spaced apart from each other with the sensing area (200A) therebetween. The fourth trace line (240t-1) may be electrically connected to at least one second auxiliary electrode (240s1) among the second auxiliary electrodes (240s1). For example, one end of each of the second auxiliary electrodes (240s1) may be connected to the fourth trace line (240t-1). The fourth trace line (240t-2) may be electrically connected to at least one second auxiliary electrode (240s2) among the second auxiliary electrodes (240s2). For example, one end of each of the second auxiliary electrodes (240s2) may be connected to the fourth trace line (240t-2).

[0253] Referring to FIGS. 18A and 18B, the area occupied by the components included in the first electrode (210) and the second electrode (220) in the second conductive layer (204SU) within one sensing unit (SU) may be larger than the area occupied by the components included in the third electrode (230) and the fourth electrode (240). The change in capacitance due to the first input (2000, see FIG. 6A) may be larger as the distance becomes closer. Accordingly, the components for detecting the first input (2000, see FIG. 6A) may be arranged in a larger area in a layer relatively adjacent to the surface of the electronic device (1000, see FIG. 1A). As a result, touch performance may be improved.

[0254] As previously shown in FIGS. 18a and 18b, a structure in which each of the first to fourth electrodes (210, 220, 230, 240) is divided and arranged on two conductive layers (202SU, 204SU) is exemplarily illustrated, but the present invention is not particularly limited thereto. For example, the first to fourth electrodes (210, 220, 230, 240) may be divided and arranged on three or four conductive layers.

[0255] In one embodiment of the present invention, the third electrode (230) to which a signal is applied in the charge driving mode may be included in a third conductive layer disposed below the first and second conductive layers (202SU, 204SU). For example, the third conductive layer may be provided below the sensor base layer (201). The third conductive layer may be disposed between the sensor base layer (201) and the display layer (100), disposed below the display layer (100), or included within the display layer (100).

[0256] The first, second, and fourth electrodes (210, 220, 240) may be included in the first and second conductive layers (202SU, 204SU). For example, when the third electrode (230) is implemented as a separate conductive layer such as the third conductive layer, the shape of the third electrode (230) can be designed more freely. For example, the third electrode (230) may be provided in a form including a plurality of coils. In addition, by using the third conductive layer, the third electrodes (230) may be provided more densely, and in this case, the pen sensing sensitivity may be improved. In another embodiment of the present invention, the third conductive layer may include a fourth electrode (240) instead of the third electrode (230).

[0257] FIG. 20A is a plan view illustrating a first conductive layer (202SUa) of a sensing unit according to an embodiment of the present invention. FIG. 20B is a plan view illustrating a second conductive layer (204SUa) of a sensing unit according to an embodiment of the present invention. FIG. 20C is a cross-sectional view of a sensor layer according to an embodiment of the present invention taken along the line II-II' illustrated in FIGS. 20A and 20B, respectively.

[0258] Referring to FIGS. 17, 20A, 20B, and 20C, each of the first electrode groups (210G) may include a plurality of first sensing patterns (211) and a plurality of first bridge patterns (212). The first sensing patterns (211) may be spaced apart in the second direction (DR2), and the first bridge patterns (212) may extend in the second direction (DR2) and be electrically connected to the first sensing patterns (211) through a first contact (CNa1). In FIGS. 20A and 20B, two adjacent first sensing patterns (211) are electrically connected to each other by two first bridge patterns (212), but the present invention is not particularly limited thereto. For example, two adjacent first sensing patterns (211) may be electrically connected to each other by one first bridge pattern (212), or may be electrically connected to each other by three or more first bridge patterns (212).

[0259] In Fig. 20b, among the first split electrode (220-D1) and the second split electrode (220-D2), the first split electrode (220-D1) is exemplarily illustrated. The first sensing patterns (211) adjacent in the second direction (DR2) with the first split electrode (220-D1) interposed therebetween may be spaced apart. In one embodiment of the present invention, the first sensing patterns (211), the first split electrode (220-D1), and the second split electrode (220-D2) may be included in the second conductive layer (204SUa), and the first bridge patterns (212) may be included in the first conductive layer (202SUa). The first bridge patterns (212) may insulate and intersect the first split electrode (220-D1) or the second split electrode (220-D2) overlapping therewith.

[0260] Each of the first auxiliary electrodes (230S) included in the electrode group (230G) may extend in the second direction (DR2). The first auxiliary electrodes (230S) may be included in the first conductive layer (202SUa). One or more holes may be defined in each of the first auxiliary electrodes (230S). One first bridge pattern (212) may be arranged in one hole. Accordingly, the first bridge pattern (212) may be electrically insulated from the first auxiliary electrodes (230S).

[0261] Each of the second auxiliary electrodes (240S) included in the electrode group (240G) may include a plurality of second sensing patterns (241a) and a plurality of second bridge patterns (242a). The second sensing patterns (241a) are spaced apart in the first direction (DR1), and the second bridge patterns (242a) extend in the first direction (DR1) and may be electrically connected to the second sensing patterns (241a) through a second contact (CNb1).

[0262] Although FIGS. 20A and 20B illustrate an example in which two adjacent second sensing patterns (241a) are electrically connected to each other by two second bridge patterns (242a), the present invention is not particularly limited thereto. For example, two adjacent second sensing patterns (241a) may be electrically connected to each other by one second bridge pattern (242a), or may be electrically connected to each other by three or more second bridge patterns (242a).

[0263] In one embodiment of the present invention, the second sensing patterns (241a) and the first auxiliary electrodes (230S) may be included in the first conductive layer (202SUa), and the second bridge patterns (242a) may be included in the second conductive layer (204SUa). The second bridge patterns (242a) may insulate and intersect with the first auxiliary electrodes (230S) that overlap therewith.

[0264] Referring to FIGS. 20A and 20B, the area occupied by the components included in the first electrode group (210G) and the second electrode group (220G) in the second conductive layer (204SU) within one sensing unit (SU) may be larger than the area occupied by the components included in the third electrode group (230G) and the fourth electrode group (240G). The change in capacitance due to the first input (2000, see FIG. 6A) may be larger as the distance becomes closer. Accordingly, the components for detecting the first input (2000, see FIG. 6A) may be arranged in a larger area in a layer relatively adjacent to the surface of the electronic device (1000, see FIG. 6A). As a result, touch performance may be improved.

[0265] In one embodiment of the present invention, the first conductive layer (202SUa) may further include first dummy patterns (DMP1), and the second conductive layer (204SUa) may further include second dummy patterns (DMP2). Each of the first dummy patterns (DMP1) and the second dummy patterns (DMP2) may be floated or electrically floated. Each of the first dummy patterns (DMP1) and the second dummy patterns (DMP2) may be divided into a plurality of conductive patterns. For example, one first dummy pattern (DMP1) may include a plurality of floating dummy patterns that are separated or electrically separated from each other.

[0266] Referring to FIG. 20c, the area of ​​the first auxiliary electrode (230S) and the area of ​​the first sensing pattern (211) can be adjusted. For example, the position of the boundary between the first auxiliary electrode (230S) and the first dummy patterns (DMP1) and the position of the boundary between the first sensing pattern (211) and the second dummy patterns (DMP2) can be adjusted. In this case, the area of ​​the overlapping region where the first auxiliary electrode (230S) and the first sensing pattern (211) overlap can be adjusted, so that the capacitance size of the coupling capacitor (C-CP) between the first auxiliary electrode (230S) and the first sensing pattern (211) can be adjusted.

[0267] Fig. 21a is an enlarged plan view of area AA' shown in Fig. 18a. Fig. 21b is an enlarged plan view of area BB' shown in Fig. 18b.

[0268] Referring to FIGS. 18a, 18b, 21a, and 21b, each of the first electrodes (210), the second electrodes (220), the third electrodes (230), the fourth electrodes (240), and the dummy patterns (DMP) may have a mesh structure. Each of the mesh structures may include a plurality of mesh lines. Each of the plurality of mesh lines has a straight shape extending in a predetermined direction and may be connected to each other. Openings in which the mesh structure is not arranged may be defined (provided or formed) in each of the first electrodes (210), the second electrodes (220), the third electrodes (230), the fourth electrodes (240), and the dummy patterns (DMP).

[0269] FIGS. 21A and 21B illustrate that the mesh structure includes mesh lines extending along a first cross direction (CDR1) intersecting the first direction (DR1) and the second direction (DR2), and mesh lines extending along a second cross direction (CDR2) intersecting the first cross direction (CDR1). However, the extension directions of the mesh lines constituting the mesh structure are not particularly limited to those illustrated in FIGS. 21A and 21B. For example, the mesh structure may include only mesh lines extending in the first direction (DR1) and the second direction (DR2), or may include mesh lines extending in the first direction (DR1), the second direction (DR2), and the first cross direction (CDR1) and the second cross direction (CDR2). That is, the mesh structure may be changed into various forms.

[0270] Fig. 22 is an enlarged plan view of one sensing unit (SUa) according to one embodiment of the present invention. Fig. 23a is a plan view illustrating a first conductive layer (202SUa) of the sensing unit (SUa) according to one embodiment of the present invention. Fig. 23b is a plan view illustrating a second conductive layer (204SUa) of the sensing unit (SUa) according to one embodiment of the present invention.

[0271] According to the embodiments illustrated in FIGS. 22, 23a, and 23b, the dummy patterns (DMP) illustrated in FIG. 18a may be electrically connected to the first electrode (210) or the second electrode (220). For example, first electrode auxiliary patterns (210au) and second electrode auxiliary patterns (220au) may be arranged on the first conductive layer (202SUa). The first electrode auxiliary patterns (210au) may overlap the first segmented electrodes (210dv1, 210dv2) and may be electrically connected to each other through the fifth contacts (CNe). The second electrode auxiliary patterns (220au) may overlap the sensing patterns (221) and may be electrically connected to each other through the sixth contacts (CNf).

[0272] FIG. 24 is a drawing showing the operation of a sensor driving unit (200C, see FIG. 6a) according to one embodiment of the present invention.

[0273] Referring to FIG. 7a and FIG. 24, the sensor driving unit (200C) can be configured to be selectively driven in any one of the first operation mode (DMD1), the second operation mode (DMD2), and the third operation mode (DMD3).

[0274] The first operation mode (DMD1) may be referred to as a touch and pen standby mode, the second operation mode (DMD2) may be referred to as a touch activation and pen standby mode, and the third operation mode (DMD3) may be referred to as a pen activation mode. The first operation mode (DMD1) may be a mode that stands by for a first input (2000) and a second input (3000). The second operation mode (DMD2) may be a mode that senses the first input (2000) and stands by for a second input (3000). The third operation mode (DMD3) may be a mode that senses the second input (3000).

[0275] In one embodiment of the present invention, the sensor driving unit (200C) may first be driven in a first operation mode (DMD1). When the first input (2000) is sensed in the first operation mode (DMD1), the sensor driving unit (200C) may be switched (or changed) to a second operation mode (DMD2). Alternatively, when the second input (3000) is sensed in the first operation mode (DMD1), the sensor driving unit (200C) may be switched (or changed) to a third operation mode (DMD3).

[0276] In one embodiment of the present invention, when the second input (3000) is sensed in the second operation mode (DMD2), the sensor driving unit (200C) can be switched to the third operation mode (DMD3). When the first input (2000) is released (or not detected) in the second operation mode (DMD2), the sensor driving unit (200C) can be switched to the first operation mode (DMD1). When the second input (3000) is released (or not detected) in the third operation mode (DMD3), the sensor driving unit (200C) can be switched to the first operation mode (DMD1).

[0277] FIG. 25 is a drawing showing the operation of a sensor driving unit (200C, see FIG. 6a) according to one embodiment of the present invention.

[0278] Referring to FIG. 7a, FIG. 24, and FIG. 25, the operations in the first to third operation modes (DMD1, DMD2, DMD3) are exemplarily illustrated in time (t) order.

[0279] In the first operation mode (DMD1), the sensor driving unit (200C) can be repeatedly driven in the second mode (MD2-d) and the first mode (MD1-d). During the second mode (MD2-d), the sensor layer (200) can be scan-driven to detect the second input (3000). During the first mode (MD1-d), the sensor layer (200) can be scan-driven to detect the first input (2000). In Fig. 24, it is exemplarily illustrated that the sensor driving unit (200C) operates in the first mode (MD1-d) consecutively after the second mode (MD2-d), but the order is not limited thereto.

[0280] In the second operation mode (DMD2), the sensor driving unit (200C) can be repeatedly driven in the second mode (MD2-d) and the first mode (MD1). During the second mode (MD2-d), the sensor layer (200) can be scan-driven to detect the second input (3000). During the first mode (MD1), the sensor layer (200) can be scan-driven to detect the coordinates by the first input (2000).

[0281] In the third operation mode (DMD3), the sensor driving unit (200C) may be driven in the second mode (MD2). During the second mode (MD2), the sensor layer (200) may be scan-driven to detect coordinates by the second input (3000). In the third operation mode (DMD3), the sensor driving unit (200C) may not be driven in the first mode (MD1-d or MD1) until the second input (3000) is released (or not detected).

[0282] Referring to FIG. 16 together, in the first mode (MD1-d) and the first mode (MD1), both the third electrodes (230) and the fourth electrodes (240) can be grounded. Accordingly, touch noise can be prevented from being introduced through the third electrodes (230) and the fourth electrodes (240).

[0283] In the second mode (MD2-d) of the first operation mode (DMD1) or the second operation mode (DMD2) and the second mode (MD2) of the third operation mode (DMD3), one end of each of the third electrodes (230) and the fourth electrodes (240) can be floated. In addition, in the second mode (MD2-d) and the second mode (MD2), the other ends of each of the third electrodes (230) and the fourth electrodes (240) can be grounded or floated. Therefore, compensation of the sensing signal can be maximized by the coupling between the first electrodes (210) and the third electrodes (230) and the coupling between the second electrodes (220) and the fourth electrodes (240).

[0284] While the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

[0285] Recently, display devices equipped with a function to detect external inputs such as pens are being developed. By overlapping two coils in the lower conductive layer arranged for pen detection and connecting a single connection pin to both coils, the overall number of connection pins provided in the lower conductive layer can be reduced, thereby simplifying the configuration of electronic devices. Therefore, the present invention has high industrial applicability.

Claims

1. Display layer; a sensor layer disposed on the display layer; and including a lower conductive layer disposed under the sensor layer, The above lower conductive layer is, First coils spaced apart in the first direction; Second coils spaced apart in the first direction and each intersecting with two adjacent first coils; and An electronic device comprising connecting pins connecting the ends of the first coils and the ends of the second coils.

2. In the first paragraph, the first-1 coil among the two first coils is A first-first extension portion extending in a second direction intersecting the first direction; The first-1 extension portion and the first-2 extension portion spaced apart in the first direction; and Including a 1-1 connecting portion connecting the 1-1 extension portion and the 1-2 extension portion, Among the two first coils above, the first and second coils are, A second-1 extension portion extending in the second direction intersecting the first direction; The 2-1 extension portion and the 2-2 extension portion spaced apart in the first direction; and Includes a 1-2 connecting portion connecting the 2-1 extension portion and the 2-2 extension portion, Each of the above second coils, A third extension portion extending in the second direction intersecting the first direction; a fourth extension portion spaced apart from the third extension portion in the first direction; and An electronic device comprising a second connecting portion connecting the third extension portion and the fourth extension portion.

3. In the second paragraph, the first and second extension portions and the third extension portion are connected to the first connection pin among the connection pins, An electronic device in which the second-first extension portion and the fourth extension portion are connected to the second connection pin among the connection pins.

4. In the second paragraph, the second connecting portion is an electronic device that intersects the first-second extension portion and the second-first extension portion.

5. In the fourth paragraph, the second connecting portion, multiple body parts; and Including a bridge portion that electrically connects the above body parts, The above body parts, the first-second extension part and the second-first extension part are arranged on the first layer, An electronic device in which the above bridge portion is placed on a second layer different from the first layer.

6. In the fifth paragraph, the sensor layer, sensor base layer; and Including a conductive layer disposed on the above sensor base layer, The above bridge portion is an electronic device placed on the sensor base layer.

7. An electronic device in which the gap between the 2-1 extension portion and the 2-2 extension portion is the same as the gap between the 3rd extension portion and the 4th extension portion in the 4th paragraph.

8. In the fourth paragraph, an electronic device in which the gap between the first-first extension portion and the first-second extension portion is equal to at least one of the gap between the third extension portion and the fourth extension portion and the gap between the second-first extension portion and the second-second extension portion.

9. An electronic device in accordance with claim 4, wherein the first sub-interval between the first-second extension portion and the third extension portion is the same as the second sub-interval between the second-first extension portion and the fourth extension portion.

10. In the 9th paragraph, the third sub-interval between the 1-2 extension portion and the 2-1 extension portion is the same as each of the first and second sub-intervals.

11. In the second paragraph, the lower conductive layer is Valid area; and Includes an invalid area surrounding the above valid area, The above 1-1 connecting portion, the above 1-2 connecting portion and the above 2nd connecting portion do not overlap on the effective area and plane, The above connecting pins are an electronic device that does not overlap on the effective area and plane.

12. In the 11th paragraph, the first outermost coil adjacent to the first side of the effective area among the first coils includes a 1-1 outermost extension portion and a 1-2 outermost extension portion, wherein the 1-1 outermost extension portion does not overlap with the effective area and the 1-2 outermost extension portion overlaps with the effective area. An electronic device wherein the second outermost coil adjacent to the second side of the effective area among the first coils includes a second-first outermost extension portion and a second-second outermost extension portion, wherein the second-first outermost extension portion overlaps the effective area, and the second-second outermost extension portion does not overlap the effective area.

13. In the 12th paragraph, the connecting pins are A first outermost connecting pin connected to the first outermost extension portion; and An electronic device comprising a second outermost connecting pin connected to the second outermost extension portion.

14. In the first paragraph, the lower conductive layer is An electronic device further comprising a dummy electrode arranged so as not to overlap with the first coils and the second coils.

15. In the 14th paragraph, the dummy electrode, An electronic device comprising a plurality of dummy bar patterns extending in a second direction intersecting the first direction and arranged in the first direction.

16. In the 14th paragraph, the dummy electrode, An electronic device comprising a plurality of dummy electrode patterns arranged in a matrix form in the first direction and a second direction intersecting the first direction.

17. In paragraph 14, The above dummy electrode is an electronic device that is electrically floating.

18. In the first paragraph, the lower conductive layer is Third coils arranged spaced apart in a second direction intersecting the first direction; Fourth coils spaced apart in the second direction and each intersecting with two adjacent third coils; and An electronic device further comprising connecting pins connecting the ends of the third coils and the ends of the fourth coils.

19. In the 18th paragraph, the electronic device in which the third coils and the fourth coils intersect with the first coils and the second coils.

20. In paragraph 1, An electronic device wherein the lower conductive layer is disposed below the display layer.

21. In paragraph 1, An electronic device wherein the lower conductive layer is disposed between the display layer and the sensor layer.

22. In the first paragraph, the sensor layer, A plurality of first electrodes arranged along the first direction and extending along a second direction intersecting the first direction; A plurality of second electrodes arranged along the second direction and extending along the first direction; A plurality of third electrodes arranged along the first direction, extending along the second direction, and overlapping the plurality of first electrodes; and An electronic device comprising a plurality of fourth electrodes arranged along the second direction, extending along the first direction, and overlapping the plurality of second electrodes.

23. In paragraph 22, Further comprising a sensor driving unit configured to drive the above sensor layer and selectively operate in a first mode for sensing touch input or a second mode for sensing pen input, The second mode is, A sensing driving mode that senses the input of the pen using the sensor layer; and An electronic device comprising a charging driving mode for charging the pen using the lower conductive layer.

24. In paragraph 1, It further includes a sensor driving unit configured to drive the lower conductive layer and operate in a sensing driving mode for sensing the input of the pen and a charging driving mode for charging the pen. An electronic device in which the lower conductive layer is alternately driven in the sensing driving mode and the charging driving mode by the sensor driving unit.

25. In paragraph 24, the sensor driving unit, In the above charging driving mode, a charging circuit that applies a first charging signal to one of two selected connection pins among the connection pins and applies a second charging signal to the remaining one; In the sensing driving mode, a sensor circuit electrically connected to the connection pins to sense current induced in the first and second coils by the pen; First switching elements arranged between the connecting pins and the charging circuit; and An electronic device comprising second switching elements disposed between the connecting pins and the sensor circuit.

26. An electronic device according to claim 25, wherein the first and second charging signals are AC signals having opposite phases.

27. Display layer; A sensor layer disposed on the above display layer; a lower conductive layer disposed below the sensor layer; and A sensor driving unit configured to drive the sensor layer and the lower conductive layer and operate in a pen sensing mode, The above lower conductive layer is, First coils spaced apart in the first direction; Second coils spaced apart in the first direction and each intersecting with two adjacent first coils; and It includes connecting pins connecting the ends of the first coils and the ends of the second coils, The above pen sensing mode is, A sensing driving mode that senses the input of the pen using the above sensor layer; and An electronic device comprising a charging driving mode for charging the pen using the lower conductive layer.

28. In paragraph 27, the sensor layer, A plurality of first electrodes arranged along the first direction and extending along a second direction intersecting the first direction; A plurality of second electrodes arranged along the second direction and extending along the first direction; A plurality of third electrodes arranged along the first direction, extending along the second direction, and overlapping the plurality of first electrodes; and An electronic device comprising a plurality of fourth electrodes arranged along the second direction, extending along the first direction, and overlapping the plurality of second electrodes.

29. In the 28th paragraph, the sensor driving unit is configured to further operate in a touch sensing mode for sensing touch input, The sensor driving unit senses the touch input using the first and second electrodes in the touch sensing mode, An electronic device that senses input of the pen using the third and fourth electrodes in the sensing driving mode.

30. In paragraph 27, the sensor driving unit, In the above charging driving mode, a charging circuit that applies a first charging signal to one of two selected connection pins among the connection pins and applies a second charging signal to the remaining one; In the sensing driving mode, a sensor circuit electrically connected to the connection pins to sense current induced in the first and second coils by the pen; First switching elements arranged between the connecting pins and the charging circuit; and An electronic device comprising second switching elements disposed between the connecting pins and the sensor circuit.

31. In paragraph 27, the first coil among the two first coils is A first-first extension portion extending in a second direction intersecting the first direction; The first-1 extension portion and the first-2 extension portion spaced apart in the first direction; and Including a 1-1 connecting portion connecting the 1-1 extension portion and the 1-2 extension portion, Among the two first coils above, the first and second coils are, A second-1 extension portion extending in the second direction intersecting the first direction; The 2-1 extension portion and the 2-2 extension portion spaced apart in the first direction; and Includes a 1-2 connecting portion connecting the 2-1 extension portion and the 2-2 extension portion, Each of the above second coils, A third extension portion extending in the second direction intersecting the first direction; a fourth extension portion spaced apart from the third extension portion in the first direction; and An electronic device comprising a second connecting portion connecting the third extension portion and the fourth extension portion.

32. In paragraph 31, the first and second extension portions and the third extension portion are connected to the first connection pin among the connection pins, An electronic device in which the second-first extension portion and the fourth extension portion are connected to the second connection pin among the connection pins.

Images