Heat-generating conductive structure and window structure comprising same

Abstract

A heat-generating conductive structure and a window structure comprising same are provided. The heat-generating conductive structure comprises: a conductive layer including a heat-generating layer and a feeding unit coupled to a side portion of the heat-generating layer; and an antenna unit spaced apart from the conductive layer and overlapping the feeding unit. The window structure comprises the heat-generating conductive structure disposed between a first glass sheet and a second glass sheet. Provided is a structure in which a heat-generating function and a communication function are implemented together.

Description

A heat-generating challenge structure and a window structure including the same

[0001] The present invention relates to a heat-generating conductive structure and a window structure including the same. More specifically, the present invention relates to a heat-generating conductive structure including a heat-generating conductive layer and a metal pattern, and a window structure including the same.

[0002] Heating elements can be attached or embedded in windows of automobiles, subways, trains, buildings, etc. to remove frost. For example, the heating elements may include a metal pattern, and the heat generated by applying electricity to the metal pattern can remove frost. However, the metal pattern may be visually noticeable, thus compromising the transparency or aesthetics of the window.

[0003] With the recent advancement of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are becoming widely used. Accordingly, antennas for such wireless communication can be incorporated into windows of vehicles, subways, trains, buildings, and the like.

[0004] When the above antenna is included in a window together with the above-described heating element, the radiation characteristics of the antenna may be disturbed by the heating element. For example, in the case of an antenna in a high-frequency or ultra-high-frequency band corresponding to 3G to 5G or higher, the radiation characteristics may be easily disturbed by surrounding conductive materials.

[0005] For example, Korean Patent Publication No. 2023-0110477 discloses a heating window for an automobile. However, it does not disclose how to suppress the heat generation of the heating element or implement communication functions.

[0006] An object of the present invention is to provide a heat-generating conductive structure having improved heat-generating characteristics, optical characteristics, and electromagnetic wave characteristics.

[0007] One object of the present invention is to provide a window structure including the above-described heat-generating conductive structure.

[0008] 1. A heating conductive structure comprising a heating layer and a feeding part coupled to a side of the heating layer; and an antenna unit spaced apart from the conductive layer and overlapping the feeding part.

[0009] 2. In the above 1, the heating layer is a heating conductive structure having a mesh structure.

[0010] 3. In the above 2, the power supply part is a heat-generating conductive structure having a solid structure.

[0011] 4. In the above 3, the antenna unit is a heat-generating conductive structure having an entirely solid structure.

[0012] 5. In the above 1, the antenna unit is a heat-generating conductive structure including a radiator, a transmission line extending from the radiator, and a signal pad formed at an end of the transmission line.

[0013] 6. In the above 5, the heat-generating conductive structure is completely contained within the power supply section when observed in a planar direction.

[0014] 7. In the above 6, the signal pad is a heat-generating conductive structure arranged outside the conductive layer when observed in a planar direction.

[0015] 8. In the above 5, the heat-generating conductive structure includes a first transmission line and a second transmission line extending in different directions from the radiator.

[0016] 9. In the above 5, the radiator overlaps with the heating layer, and the signal pad overlaps with the power supply portion, a heating conductive structure.

[0017] 10. In the above 9, the heating layer and the radiator each include a first conductive line and a second conductive line including a wave line shape,

[0018] The second challenge line has a shape that is the reverse of the first challenge line or is shifted from the first challenge line,

[0019] The first conductive line and the second conductive line are alternately and repeatedly arranged in a heating conductive structure.

[0020] 11. In the above 10, the first conductive line and the second conductive line are physically separated from each other within the heating layer,

[0021] A heating conductive structure in which the first conductive line and the second conductive line are in contact with each other within the radiator.

[0022] 12. In the above 1, the antenna unit is a heat-generating conductive structure that is completely included in the feeding section when observed in a planar direction.

[0023] 13. In the above 1, the heating layer is a heating conductive structure having a double-layer structure.

[0024] 14. In the above 13, the heat-generating conductive structure includes a metal layer and a blackening layer laminated on the metal layer.

[0025] 15. In the above 14, the heat-generating conductive structure further includes a transparent conductive oxide layer formed on the blackening layer.

[0026] 16. A heat-generating conductive structure further comprising a first dielectric layer disposed on the lower surface of the conductive layer and a second dielectric layer disposed on the upper surface of the conductive layer in the above 1.

[0027] 17. A heat-generating conductive structure according to the above 16, further comprising a substrate layer laminated on the second dielectric layer, and wherein the antenna unit is disposed on the substrate layer.

[0028] 18. In the above 16, the antenna unit is a heat-generating conductive structure inserted or embedded in the upper part of the second dielectric layer.

[0029] 19. A heat-generating conductive structure according to the above 16, further comprising an antenna dielectric layer on which the antenna unit is arranged, the antenna dielectric layer being attached on the feeding portion, and the second dielectric layer covering the antenna unit and the conductive layer together.

[0030] 20. A window structure including a heat-generating conductive structure according to the embodiments described above.

[0031] A heat-generating conductive structure according to embodiments of the present invention may include a heat-generating layer and an antenna unit. Accordingly, a heat-generating conductive structure and a window structure that implement heat-generating functions and communication functions in a single conductive structure and prevent visual recognition can be implemented.

[0032] According to exemplary embodiments, the antenna unit may be arranged to overlap with a feed portion connected to a heating layer. The feed portion may be substantially provided as a ground layer of the antenna unit. Accordingly, the radiation directivity and antenna gain of the antenna unit may be stably secured without substantially interfering with the heating characteristics of the heating layer.

[0033] The above antenna unit is laminated on a dielectric layer included in the above heat-generating conductive structure to secure high-frequency or ultra-high-frequency antenna radiation characteristics while securing an appropriate antenna permittivity.

[0034] In some embodiments, the heating layer has a multi-layer structure including a metal layer and a blackening layer, and can additionally suppress visual perception due to light reflection.

[0035] FIG. 1 is a schematic plan view showing a heat-generating conductive structure according to exemplary embodiments.

[0036] FIG. 2 is a schematic plan view showing a heat-generating conductive structure according to exemplary embodiments.

[0037] FIG. 3 is a schematic plan view illustrating a heat-generating conductive structure according to some exemplary embodiments.

[0038] FIGS. 4 and 5 are partial enlarged plan views showing a conductive layer of a heat-generating conductive structure according to some exemplary embodiments.

[0039] FIG. 6 is a schematic plan view showing a conductive layer of a heat-generating conductive structure according to some exemplary embodiments.

[0040] FIGS. 7 and 8 are schematic plan views illustrating a conductive layer of a heat-generating conductive structure according to some exemplary embodiments.

[0041] FIGS. 9 to 12 are schematic cross-sectional views showing heat-generating conductive structures according to exemplary embodiments.

[0042] FIG. 13 is a schematic plan view of an antenna unit included in a heat-generating conductive structure in some exemplary embodiments.

[0043] FIGS. 14 and 15 are schematic cross-sectional views illustrating a method for manufacturing a heat-generating conductive structure according to exemplary embodiments.

[0044]

[0045] Embodiments of the present invention provide a heat-generating conductive structure including an antenna unit and a heat-generating layer. In addition, a window structure including the heat-generating conductive structure is provided.

[0046] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0047] The terms “first”, “second”, “one side”, “the other side”, “one side”, “the other side”, “top side”, “bottom side”, “upper part”, “lower part”, etc. used in this specification do not limit absolute positions or orders, but are used in a relative sense to distinguish different components or parts.

[0048] FIG. 1 is a schematic plan view showing a heat-generating conductive structure according to exemplary embodiments.

[0049] Referring to FIG. 1, the heat-generating conductive structure may include a conductive layer including a heat-generating layer (120) and a power supply unit (130).

[0050] The heating layer (120) may include a metal layer having heating properties by electric energy. For example, the heating layer (120) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0051] According to exemplary embodiments, the heating layer (120) may have a mesh structure. The mesh structure is defined by intersecting conductive lines, and corresponds to spaces or openings between the conductive lines, and may include, for example, rhombus-shaped mesh unit cells.

[0052] A power supply unit (130) for supplying power to the heat generating layer (120) may be formed on the side of the heat generating layer (120). For example, the power supply unit (130) may be provided as a bus bar for supplying power to the heat generating layer (120). According to exemplary embodiments, the power supply unit (130) may include the above-described metal or alloy and may have a solid structure. For example, the power supply unit (130) may have a metal plate shape.

[0053] As illustrated in Fig. 1, a power supply unit (130) may be connected to each of the two sides of the heating layer (120). For example, the heating layer (120) may be placed between a pair of power supply units (130) including a first power supply unit (130a) and a second power supply unit (130b). Accordingly, the variation in power supplied and heat generation across the entire area of ​​the heating layer (120) may be reduced.

[0054] According to exemplary embodiments, the heat-generating conductive structure may include an antenna unit (200). The antenna unit (200) may be positioned over the conductive layer so as to overlap with the feeding portion (130) in a planar direction.

[0055] The antenna unit (200) may include a radiator (210) and a transmission line (220). The radiator (210) and the transmission line (220) may be provided as a solid conductive pattern. The radiator (210) and the transmission line (220) may be formed as a substantially integral single member.

[0056] The radiator (210) may have, for example, a polygonal plate shape, and the transmission line (220) may have a width smaller than the radiator (210) and may extend from one side of the radiator (210). The size of the radiator (210) may be adjusted according to the target frequency of the antenna unit (200). As a non-limiting example, the radiator (210) may have a resonant frequency for high-frequency or ultra-high-frequency (e.g., 3G, 4G, 5G or higher) mobile communications, and may have a size that enables implementation of the resonant frequency.

[0057] For example, the resonant frequency of the radiator (210) may be 0.1 GHz or more, 1 GHz or more, 5 GHz or more, 10 GHz or more, 20 GHz or more, or 30 GHz or more.

[0058] In some embodiments, a signal pad (230) may be connected to the terminal end of the transmission line (220). The signal pad (230) may be directly connected to the terminal end of the transmission line (220) at the same layer or level. In one embodiment, the signal pad (230) may be formed as a single, integral part with the transmission line (220).

[0059] In one embodiment, a ground pad (240) may be placed around a signal pad (230). For example, a pair of ground pads (240) may be placed facing each other with the signal pad (230) interposed therebetween.

[0060] The ground pad (240) may be provided in a co-planar waveguide (CPW) pattern that absorbs / blocks noise around the signal pad (230) and promotes electric field generation to the transmission line (220).

[0061] A signal pad (230) may be provided as a feed portion of the antenna unit (200). For example, an anisotropic conductive film (ACF) may be used to connect a feed circuit board to the signal pad (230). In this case, a ground pad (240) may also be attached to the anisotropic conductive film together with the signal pad (230), thereby improving the bonding stability of the feed circuit board.

[0062] The antenna unit (200) may include the metal or alloy described above. In one embodiment, the antenna unit (200) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) for low-resistance implementation and fine-line width patterning.

[0063] In some embodiments, the antenna unit (200) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or the like.

[0064] In some embodiments, the antenna unit (200) may include a laminated structure of a transparent conductive oxide layer and a metal layer, and may have, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexible characteristics may be improved by the metal layer, while the resistance may be lowered, thereby improving the signal transmission speed, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0065] The antenna unit (200) may include a blackening treatment portion. Accordingly, the reflectivity on the surface of the antenna unit (200) may be reduced, thereby reducing pattern visibility due to light reflection.

[0066] In one embodiment, the surface of the metal layer included in the antenna unit (200) may be converted into a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer may be formed on the antenna unit or the metal layer. The black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.

[0067] The composition and thickness of the blackening layer can be adjusted taking into account the reflectivity reduction effect and antenna radiation characteristics.

[0068] As illustrated in FIG. 1, when observed in a planar direction (when projected or observed in a plan view such as FIG. 1), the radiator (210) of the antenna unit (200) can completely overlap with the feeding portion (130). Accordingly, the radiator (210) of the antenna unit (200) can be substantially completely contained within the feeding portion (130) in the planar direction.

[0069] In some embodiments, the antenna unit (200) may partially overlap the feed unit (130). In one embodiment, the signal pad (230) may be covered or not overlapped by the feed unit (130) in a planar direction. The ground pad (240) may also be covered or not overlapped by the feed unit (130) in a planar direction. In this case, the transmission line (220) may at least partially protrude outside the feed unit (130) in a planar direction.

[0070] Accordingly, space for implementing a power supply connection through a signal pad (230) to the antenna unit (200) can be secured more freely from the power supply unit (130).

[0071] A plurality of antenna units (200) may be arranged over the feeding portion (130) to overlap with the feeding portion (130). In some embodiments, a plurality of antenna units (200) may be arranged over the first feeding portion (130a), and a plurality of antenna units (200) may be arranged over the second feeding portion (130b).

[0072] In some embodiments, a plurality of antenna units (200) may be arranged on the lower portion of the first feed portion (130a) in FIG. 1, and a plurality of antenna units (200) may be arranged on the upper portion of the second feed portion (130b) in FIG. 1.

[0073] By arranging the antenna units (200) as described above, the radiation range through the antenna units (200) can be expanded without impairing the heat generation and visual characteristics of the heat-generating conductive structure.

[0074] As described above, the antenna unit (200) and the power supply unit (130) may each include a solid metal layer. Accordingly, the power supply efficiency through the power supply unit (130) can be increased and power / heat loss can be suppressed. In addition, signal loss from the radiator (210) can be prevented and antenna gain and antenna power supply efficiency can be improved.

[0075] The power supply unit (130) can be positioned in a non-visible area of ​​the user or in a peripheral area of ​​the object to prevent interference with the visual characteristics of the object. Accordingly, the antenna unit (200) overlapping the power supply unit (130) can also adopt a solid structure, as this reduces the possibility of being visible to the user.

[0076] Since the radiator (210) is completely overlapped within the feeder (130), the feeder (130) can serve as a ground for the radiator (210). According to exemplary embodiments, the feeder (130) is provided as a vertical ground, so that vertical antenna radiation above the upper surface of the radiator (210) can be substantially implemented. Accordingly, the radiation directivity of the antenna unit (200) is improved, and signal loss due to radiation direction dispersion in the high-frequency / ultra-high-frequency band can be suppressed.

[0077] FIG. 2 is a schematic plan view showing a heat-generating conductive structure according to exemplary embodiments.

[0078] Referring to FIG. 2, the antenna unit (200) may overlap the feed section (130) as a whole. For example, the antenna unit (200) may be completely included within the feed section (130) in a planar direction. In this case, the feed section (130) may also serve as a vertical ground for the signal pad (230) and the transmission line (220). Accordingly, the electric field concentration toward the radiator (210) via the transmission line (220) may be enhanced.

[0079] FIG. 3 is a schematic plan view illustrating a heat-generating conductive structure according to some exemplary embodiments.

[0080] Referring to FIG. 3, the radiator (210) of the antenna unit (200) (e.g., the first antenna unit (AU1)) may overlap with the heating layer (120) in the vertical direction. In some embodiments, the transmission line (220) may also at least partially overlap with the heating layer (120) in the vertical direction.

[0081] The radiator (210) may have a mesh structure substantially identical to or similar to the heating layer (120). At least a portion of the transmission line (220) may also have the mesh structure.

[0082] The pad of the antenna unit (200) may overlap with the feeding portion (130). According to exemplary embodiments, the signal pad (230) and the ground pad (240) of the antenna unit (200) may overlap with the feeding portion (130). The signal pad (230) and the ground pad (240) may be formed of a solid metal pattern or an alloy pattern.

[0083] As described above, the signal pad (230) and the ground pad (240) can be overlapped with the power supply unit (130) in a solid structure to promote antenna power supply efficiency and electric field generation. The radiator (210) can be formed in a mesh structure that overlaps with the heating layer (120), thereby expanding the formation area of ​​the antenna unit (200) without deforming the heating layer (120).

[0084] In some embodiments, an antenna unit having different radiation characteristics and / or polarization characteristics than the first antenna unit (AU1) may be added.

[0085] As illustrated in FIG. 3, for example, the antenna unit (200) may be included as a first antenna unit (AU1). The first antenna unit (AU1) may be a vertical radiating antenna that radiates upward or in a vertical direction above the upper surface of the heating layer (120).

[0086] A second antenna unit (AU2) provided as a dipole antenna and / or a third antenna unit (AU3) provided as a monopole antenna may be further included.

[0087] In some embodiments, the second antenna unit (AU2) and the third antenna unit (AU3) may have a mesh structure substantially identical to or similar to the heating layer (120) and may include a radiator overlapping the heating layer (120).

[0088] A second signal pad (233) and a third signal pad (235), which are provided as antenna feed portions, may be connected to the ends of the second antenna unit (AU2) and the third antenna unit (AU3), respectively. The second signal pad (233) and the third signal pad (235) may overlap with the feed portion (130) and may be formed of a solid metal / alloy pattern.

[0089] FIGS. 4 and 5 are enlarged plan views of portions of a conductive layer of a heat-generating conductive structure according to some exemplary embodiments. Specifically, FIG. 4 is an enlarged plan view of a portion of a heat-generating layer (120) indicated by area A in FIG. 3. FIG. 5 is an enlarged plan view of a portion of an antenna unit (200) or a radiator (210) indicated by area B in FIG. 3.

[0090] Referring to FIG. 4, the heating layer (120) may include a first conductive line (70a) and a second conductive line (70b). For example, the heating layer (120) may have a mesh structure formed by repeating the first conductive line (70a) and the second conductive line (70b).

[0091] The first challenge line (70a) and the second challenge line (70b) may each have a wave or wavy line shape. The first challenge line (70a) and the second challenge line (70b) may each have a line shape in which peaks and valleys are repeated at a regular, constant cycle and extend in the first direction.

[0092] The first conductive line (70a) and the second conductive line (70b) may be arranged alternately and repeatedly along the second direction. According to exemplary embodiments, the first conductive line (70a) and the second conductive line (70b) may be arranged to face each other in the opposite direction. For example, the second conductive line (70b) may have a shape that is substantially shifted by half a wavelength (λ / 2) from the first conductive line (70a).

[0093] Accordingly, the crest of the first challenge line (70a) can face the valley of the second challenge line (70b) in the second direction. The valley of the first challenge line (70a) can face the crest of the second challenge line (70b) in the second direction.

[0094] According to exemplary embodiments, the first conductive line (70a) and the second conductive line (70b) included in the heating layer (120) may be physically spaced apart or separated from each other. The peaks and valleys of the first conductive line (70a) and the second conductive line (70b) may be adjacent to each other in the first adjacent area (C1). In the first adjacent area (C1), the peaks and valleys may be physically spaced apart or separated from each other.

[0095] As described above, by introducing a wave line into the heating layer (120), pattern visibility and the starburst phenomenon due to pattern repetition of the conductive lines can be prevented. In addition, pattern irregularity can be added within the heating layer (125) by including a first conductive line (70a) and a second conductive line (70b) that are shifted from each other. Therefore, the pattern visibility and the starburst phenomenon can be more effectively suppressed.

[0096] Additionally, by spacing out the crests and valleys of the challenge lines in the first adjacent region (C1), pattern recognition due to light reflection occurring at the contact point of the challenge lines can be avoided.

[0097] Referring to FIG. 5, the antenna unit (200) or radiator (210) may also include a first conductive line (70a) and a second conductive line (70b). As described above, the first conductive line (70a) and the second conductive line (70b) may have a phase or arrangement shifted from each other.

[0098] Within the radiator (210), the first conductive line (70a) and the second conductive line (70b) may physically contact each other. According to exemplary embodiments, the crest of the first conductive line (70a) and the valley of the second conductive line (70b), or the valley of the first conductive line (70a) and the crest of the second conductive line (70b), may contact each other in the second adjacent area (C2) within the radiator (210).

[0099] Accordingly, a closed unit cell (CUC) can be defined by the first conductive line (70a) and the second conductive line (70b) that contact each other and are adjacent to each other in the second adjacent areas (C2). Accordingly, the radiator (210) can have a mesh structure in which the closed unit cells (CUC) are repeated.

[0100] The transmission line (220) of the antenna unit (200) may also share a mesh structure substantially identical or similar to that of the radiator (210).

[0101] According to the above-described embodiments, the antenna unit (200) includes an array of conductive lines having a structure substantially identical to or similar to that of the heating layer (120), and is spaced apart from the heating layer (120) and can bring the conductive lines into contact with each other. Accordingly, the radiation characteristics and signal transmission characteristics of the antenna unit (200) can be maintained without impairing the thermal and optical characteristics of the heating layer (120).

[0102] FIG. 6 is a schematic plan view showing a conductive layer of a heat-generating conductive structure according to some exemplary embodiments.

[0103] Referring to FIG. 6, the shift wavelengths of the first conductive line (70a) and the second conductive line (70b) within the heating layer (120) may be appropriately modified. For example, the second conductive line (70b) may be shifted by a quarter wavelength (λ / 4) in the first direction relative to the first conductive line (70a).

[0104] As described above, the first conductive line (70a) and the second conductive line (70b) may be spaced apart from each other within the heating layer (120). Within the antenna unit (200), the first conductive line (70a) and the second conductive line (70b) may contact each other in an area corresponding to the most adjacent area of ​​the first conductive line (70a) and the second conductive line (70b) of the heating layer (120).

[0105] The shift wavelength of the second conductive line (70b) described with reference to FIGS. 4 and 6 is exemplary and may be appropriately changed. For example, the second conductive line (70b) may be shifted in the first direction by N wavelengths (λ / N) (N is a natural number, for example, 2, 3, 4, 5, 6, etc.) with respect to the first conductive line (70a).

[0106] FIGS. 7 and 8 are schematic plan views illustrating a conductive layer of a heat-generating conductive structure according to some exemplary embodiments.

[0107] Referring to FIG. 7, the heating layer (120) indicated by area A of FIG. 3 includes a first conductive line (80a) and a second conductive line (80b) that face each other in the second direction in an opposite direction, and the first conductive line (80a) and the second conductive line (80b) may each have a wave line shape including repeated bends. For example, crests and troughs of the wave may be repeated between adjacent bends included in the first conductive line (80a) and the second conductive line (80b).

[0108] An open unit cell (OUC) can be defined by the first conductive line (80a) and the second conductive line (80b) adjacent to each other in the second direction. The open unit cell (OUC) has a rhombus cell shape with both corners open in the first direction, and each side of the rhombus cell can have a wavy line shape.

[0109] In the first adjacent region (D1) where the first conductive line (80a) and the second conductive line (80b) are closest to each other within the heating layer (120), the first conductive line (80a) and the second conductive line (80b) can be physically spaced or separated from each other.

[0110] Referring to FIG. 8, within the antenna unit (200) or radiator (210) indicated by area B of FIG. 3, the first conductive line (80a) and the second conductive line (80b) share substantially the same or similar shape and arrangement as within the heating layer (120), but can be in contact with each other. The first conductive line (80a) and the second conductive line (80b) can be in contact with each other at the bend portions of the first conductive line (80a) and the second conductive line (80b) in the second adjacent area (D2).

[0111] According to exemplary embodiments, a closed unit cell (CUC) may be defined by the first conductive line (80a) and the second conductive line (80b) adjacent to each other in the second direction within the radiator (210). The closed unit cell (CUC) may have a rhombus shape with each side having a wavy line shape.

[0112] FIGS. 9 to 12 are schematic cross-sectional views showing heat-generating conductive structures according to exemplary embodiments.

[0113] Referring to FIGS. 9 to 12, the conductive layer including the power supply unit (130) and the heating layer (120) may be formed on the first dielectric layer (110). In some embodiments, the first dielectric layer (110) may be disposed on the first substrate layer (100a).

[0114] A second dielectric layer (140) may be formed on the heating layer (120). A second substrate layer (100b) may be arranged on the second dielectric layer (140).

[0115] The first dielectric layer (110) and the second dielectric layer (140) may be provided as the lower insulating layer and the upper insulating layer of the heat-generating conductive structure, respectively. The first substrate layer (100a) and the second substrate layer (100b) may be provided as the lower substrate and the upper substrate of the heat-generating conductive structure, respectively.

[0116] In some embodiments, the first dielectric layer (110) and the second dielectric layer (140) may include an adhesive layer including an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0117] In some embodiments, the first dielectric layer (110) may serve as a separation layer that promotes peeling or lift-off of the carrier substrate (90), as described below.

[0118] The first dielectric layer (110) and the second dielectric layer (140) may include a polymer organic film. The first dielectric layer (110) and the second dielectric layer (140) may be, as non-limiting examples, a polyimide-based polymer, a polyvinyl alcohol-based polymer, a polyamic acid-based polymer, a polyamide-based polymer, a polyethylene-based polymer, a polystyrene-based polymer, a polynorbornene-based polymer, a phenylmaleimide copolymer-based polymer, a polyazobenzene-based polymer, a polyphenylenephthalamide-based polymer, a polyester-based polymer, a polymethyl methacrylate-based polymer, a polyarylate-based polymer, a cinnamate-based polymer, a coumarin-based polymer, a phthalimidine-based polymer, or a chalcone-based polymer. It may include polymer materials such as polymers, aromatic acetylene polymers, etc. These may be used alone or in combination of two or more.

[0119] In some embodiments, the second dielectric layer (140) may include a dielectric material that can be provided as an antenna dielectric layer. The second dielectric layer (140) forms an impedance or inductance for the antenna unit (AU), so that a frequency band that the antenna unit (200) can drive or sense can be adjusted. In some embodiments, the dielectric constant of the second dielectric layer (140) may be adjusted to a range of about 1.5 to 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a high-frequency band may not be realized.

[0120] The first substrate layer (100a) and the second substrate layer (100b) may include a base layer or film-type substrate capable of supporting the heating layer (120). The first substrate layer (100a) and the second substrate layer (100b) may include glass, polymer, and / or inorganic insulating materials. For example, the first substrate layer (100a) and the second substrate layer (100b) may include a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose-based resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate-based resin; an acrylic resin such as polymethyl (meth) acrylate or polyethyl (meth) acrylate; a styrene-based resin such as polystyrene or an acrylonitrile-styrene copolymer; It may include a transparent resin film including polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide-based resins such as nylon and aromatic polyamides; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; sulfated polyphenylene-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; allylate-based resins; polyoxymethylene-based resins; epoxy-based resins; urethane-based or acrylic-urethane-based resins; silicone-based resins, etc. These may be used alone or in combination of two or more.

[0121] Examples of the above inorganic insulating material include silicon oxide, silicon nitride, silicon oxynitride, metal oxide, etc.

[0122] In some embodiments, the first substrate layer (100a) and the second substrate layer (100b) may each include a glass substrate.

[0123] The antenna unit (200) may be placed on the second dielectric layer (140). The antenna unit (200) overlaps the feeding portion (130) with the second dielectric layer (140) interposed therebetween, and the second dielectric layer (140) may be provided as an antenna dielectric layer.

[0124] As illustrated in FIG. 10 and described with reference to FIG. 3, the radiator (210) of the antenna unit (200) may be vertically overlapped with the heating layer (120) with the second dielectric layer (140) interposed therebetween. The transmission line (220) may also at least partially overlap with the heating layer (120) in the vertical direction.

[0125] The pad including the signal pad (230) of the antenna unit (200) can overlap the feeding portion (130) with the second dielectric layer (140) therebetween.

[0126] In some embodiments, as illustrated in FIG. 9, the antenna unit (200) may be laminated on a second substrate layer (100b) laminated on a second dielectric layer (140). In this case, the second substrate layer (100b) serves as an antenna dielectric layer together with the second dielectric layer (140), and the antenna unit (200) may be exposed to the outside of the heat-generating conductive structure or the external atmosphere. Accordingly, the frequency reception sensitivity of the antenna unit (200) may be enhanced.

[0127] In some embodiments, as illustrated in FIG. 11, the antenna unit (200) may be disposed between the second substrate layer (100b) and the second dielectric layer (140). In one embodiment, the antenna unit (200) may be inserted or partially embedded in the upper portion of the second dielectric layer (140). In this case, the upper surface of the antenna unit (200) and the upper surface of the second dielectric layer (140) may be positioned substantially on the same plane.

[0128] In some embodiments, as illustrated in FIG. 12, the antenna unit (200) may be formed on a separate antenna dielectric layer (250). According to exemplary embodiments, an antenna element including the antenna dielectric layer (250) and the antenna unit (200) may be attached to the upper surface of the feeding portion (130). Accordingly, the antenna unit (200) may overlap the feeding portion (130) with the antenna dielectric layer (250) therebetween.

[0129] A second dielectric layer (140) can be formed on the heating layer (120) to cover the antenna element.

[0130] For example, a plurality of antenna units (200) can be formed together on an antenna dielectric layer (250), and the antenna dielectric layer (250) on which the plurality of antenna units (200) are formed can be attached on a feeding portion (130).

[0131] FIG. 13 is a schematic plan view of an antenna unit included in a heat-generating conductive structure in some exemplary embodiments.

[0132] Referring to FIG. 13, the antenna unit (205) may include a plurality of transmission lines extending in different directions from one radiator (215).

[0133] In one embodiment, the radiator (215) may have a rhombus shape. According to exemplary embodiments, the transmission lines may include a first transmission line (225a) extending from one side of the radiator (215) and a second transmission line (225b) extending from the other side of the radiator (215) that meets the one side.

[0134] The first transmission line (225a) and the second transmission line (225b) may extend in different directions intersecting each other. In some embodiments, the first transmission line (225a) and the second transmission line (225b) may each extend toward the center of the radiator (215). In one embodiment, the extension direction of the first transmission line (225a) and the extension direction of the second transmission line (225b) may be substantially perpendicular to each other.

[0135] A first signal pad (235a) may be connected to the end of the first transmission line (225a), and a second signal pad (235b) may be connected to the end of the second transmission line (225b). The end of the first transmission line (225a) and the end of the second transmission line (225b) may be provided as the first signal pad (235a) and the second signal pad (235b), respectively.

[0136] A first ground pad (245a) and a second ground pad (245b) may be arranged around the first signal pad (235a) and the second signal pad (235b), respectively. For example, a pair of first ground pads (245a) may be arranged to face each other with the first signal pad (235a) therebetween. A pair of second ground pads (245b) may be arranged to face each other with the second signal pad (235b) therebetween.

[0137] As described above, transmission lines (225a, 225b) extending in different directions can be connected to a single radiator (215) to provide power in multiple directions. Accordingly, dual polarization characteristics can be achieved from a single radiator (215), and radiation coverage through the antenna unit (205) can be enhanced.

[0138] As described with reference to FIGS. 1 and 2, the radiator (215) has a solid structure and can be substantially completely covered in the plane direction by the feeder (130). Accordingly, the radiation gain can be increased and vertical radiation characteristics can be implemented with high reliability.

[0139] In some embodiments, the signal pads (235a, 235b) and the ground pads (245a, 245b) may be exposed outside the feed portion (130). In some embodiments, the signal pads (235a, 235b) and the ground pads (245a, 245b) may also completely overlap the feed portion (130) together with the radiator (215).

[0140] The structure of the antenna unit (200, 205) illustrated in FIGS. 1 and 13 corresponds to some embodiments of the present invention, and the structure of the antenna unit is not necessarily limited thereto. For example, as described with reference to FIG. 3, various types of antenna units, such as a monopole antenna, a dipole antenna, etc., may be placed on the feeding section (130).

[0141] FIGS. 14 and 15 are schematic cross-sectional views illustrating a method for manufacturing a heat-generating conductive structure according to exemplary embodiments. For example, FIGS. 14 and 15 are schematic cross-sectional views illustrating a mesh structure included in a heat-generating layer (120) and a method for forming the same.

[0142] Referring to FIG. 14, a first dielectric layer (110) can be formed on a carrier substrate (90), and a preliminary conductive layer (120a) can be formed on the first dielectric layer (110).

[0143] According to exemplary embodiments, the preliminary conductive layer (120a) may be formed in a multi-layer structure. In some embodiments, a metal layer (120b) and a blackening layer (120c) may be sequentially formed on the first dielectric layer (110).

[0144] The metal layer (120b) may include the metal or alloy described above. In one embodiment, the metal layer (120b) may include copper or a copper alloy to achieve low resistance. For example, the copper alloy may include silver-palladium-copper (APC) or copper-calcium (CuCa).

[0145] In one embodiment, the surface of the metal layer (120b) may be converted into a metal oxide or metal sulfide to form a blackening layer (120c). In one embodiment, a blackening layer (120c), such as a black material coating layer or plating layer, may be formed on the metal layer (120b). The black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.

[0146] The composition and thickness of the blackening layer (120c) can be adjusted in consideration of the reflectivity reduction effect and antenna radiation characteristics. In one embodiment, the blackening layer (120c) may include copper oxide.

[0147] The reflectivity of the surface of the preliminary conductive layer (120a) or the heating layer (120) is reduced by the blackening layer (120c), thereby additionally preventing visual recognition of the heating layer (120).

[0148] In some embodiments, a transparent conductive oxide layer (120d) may be further formed on the blackening layer (120c). The transparent conductive oxide layer (120d) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx).

[0149] The corrosion resistance and transparency of the surface of the preliminary conductive layer (120a) or the heating layer (120) can be improved by the transparent conductive oxide layer (120d). In one embodiment, the transparent conductive oxide layer (120d) can be formed to include IZO in consideration of the overall resistance reduction of the preliminary conductive layer (120a) or the heating layer (120).

[0150] As described above, by forming the preliminary conductive layer (120a) in a multi-layer structure, the electrical conductivity and radiation characteristics of the preliminary conductive layer (120a) or the heating layer (120) can be maintained, and corrosion resistance, chemical resistance, and transparency can be improved.

[0151] Referring to FIG. 15, a photoresist pattern (95) can be formed on a preliminary conductive layer (120a). The photoresist pattern (95) can be formed by forming a photoresist layer and then patterning it through an exposure and development process.

[0152] The preliminary conductive layer (120a) can be partially removed using the photoresist pattern (95) as an etching mask. Accordingly, a heat-generating layer (120) can be formed from the preliminary conductive layer (120a). Through the etching process, first and second conductive lines (50a, 50b) intersecting with each other can be formed, thereby forming a heat-generating layer (120) in the form of a mesh layer. An unetched portion of the preliminary conductive layer (120a) can be provided as a power supply unit (130) having a solid structure.

[0153] After the above etching process, the photoresist pattern (95) can be removed. The photoresist pattern (95) can be removed through an ashing and / or strip process.

[0154] After the etching process / stacking process described above, as shown in FIG. 9, a second dielectric layer (140) covering the heating layer (120) can be formed, and the antenna unit (200) can be combined with the heating layer (120) so as to overlap with the feeding part (130).

[0155] The carrier substrate (90) can be peeled or removed from the first dielectric layer (110). Thereafter, the heating layer (120) to which the antenna unit (200) is coupled can be coupled between the first substrate layer (100a) and the second substrate layer (100b).

[0156] For example, the first substrate layer (100a) and the second substrate layer (100b) may be provided as first and second glasses facing each other, respectively. The first and second glasses may be laminated with the heat-conducting structure according to the exemplary embodiments described above interposed therebetween. Accordingly, a window structure having a laminated double-sided glass structure may be provided.

[0157] For example, the heat-generating conductive structure can be attached to the inner surfaces of the first glass and / or the second glass using an adhesive layer.

[0158] According to exemplary embodiments, the above window structure can be applied to a vehicle window. Accordingly, a thin window can be provided that implements both defogging and communication functions without compromising the transparency of the window.

[0159] The above window structure can be applied without any special limitations to windows for buildings and windows for signs / billboards.

Claims

1. A conductive layer including a heating layer and a power supply unit coupled to a side of the heating layer; and A heat-generating conductive structure comprising an antenna unit spaced apart from the conductive layer and overlapping the feeding portion.

2. A heat-generating conductive structure according to claim 1, wherein the heat-generating layer has a mesh structure.

3. In claim 2, the power supply unit is a heat-generating conductive structure having a solid structure.

4. In claim 3, the antenna unit is a heat-generating conductive structure having an entirely solid structure.

5. In claim 1, the antenna unit is a heat-generating conductive structure including a radiator, a transmission line extending from the radiator, and a signal pad formed at an end of the transmission line.

6. A heat-generating conductive structure according to claim 5, wherein the radiator is completely contained within the power supply section when observed in a planar direction.

7. A heat-generating conductive structure according to claim 6, wherein the signal pad is disposed outside the conductive layer when observed in a planar direction.

8. A heat-generating conductive structure according to claim 5, wherein the transmission line includes a first transmission line and a second transmission line extending in different directions from the radiator.

9. A heat-generating conductive structure according to claim 5, wherein the radiator overlaps with the heat-generating layer, and the signal pad overlaps with the power supply portion.

10. In claim 9, the heating layer and the radiator each include a first conductive line and a second conductive line having a wave line shape, The second challenge line has a shape that is the reverse of the first challenge line or is shifted from the first challenge line, The first conductive line and the second conductive line are alternately and repeatedly arranged in a heating conductive structure.

11. In claim 10, the first conductive line and the second conductive line are physically separated from each other within the heating layer, A heating conductive structure in which the first conductive line and the second conductive line are in contact with each other within the radiator.

12. In claim 1, the antenna unit is a heat-generating conductive structure that is completely included in the feeding section when observed in a planar direction.

13. A heat-generating conductive structure according to claim 1, wherein the heat-generating layer has a multi-layer structure.

14. A heat-generating conductive structure according to claim 13, wherein the multi-layer structure includes a metal layer and a blackening layer laminated on the metal layer.

15. A heat-generating conductive structure according to claim 14, wherein the multi-layer structure further includes a transparent conductive oxide layer formed on the blackening layer.

16. A heat-generating conductive structure according to claim 1, further comprising a first dielectric layer disposed on the lower surface of the conductive layer and a second dielectric layer disposed on the upper surface of the conductive layer.

17. A heat-generating conductive structure according to claim 16, further comprising a substrate layer laminated on the second dielectric layer, wherein the antenna unit is disposed on the substrate layer.

18. In claim 16, the antenna unit is a heat-generating conductive structure inserted or embedded in the upper portion of the second dielectric layer.

19. In claim 16, the antenna unit further comprises an antenna dielectric layer on which the antenna unit is arranged, A heat-generating conductive structure in which the antenna dielectric layer is attached on the feeding portion, and the second dielectric layer covers the antenna unit and the conductive layer together.

20. A window structure including the heat-generating conductive structure of claim 1.

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