Optical module using embedded LDD and optical device, and light-emission rate conversion method therefor

Abstract

The present invention relates to the technical field of optical communications, and in particular to an optical module using an embedded LDD and an optical device, and a light-emission rate conversion method therefor. The optical module comprises: a circuit board and at least one BOSA optical device, wherein the BOSA optical device is connected to the circuit board; a control unit is provided in the circuit board; the BOSA optical device comprises a laser diode driver, a laser emitting unit and an optical transceiver unit; and the laser diode driver and the laser emitting unit are configured to control a transmission rate supported by the BOSA optical device. In the present invention, light of two different transmission powers can be output by means of one circuit board and one or two BOSA optical devices. Moreover, in the present invention, a laser diode driver is provided in a BOSA optical device, which saves on the area of a circuit board and reduces the types of PCBs, thereby enabling the implementation of a 25G / 50G PON ONU optical module of an SFP package.

Description

An optical module using embedded LDD and optical devices and its light output rate conversion method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from the following patent applications:

[0003] (1) A Chinese patent application, filed with the Patent Office of China on March 1, 2024, with application number 202410237518.0, entitled “An optical module with embedded LDD and optical device and its light output rate conversion method”. Technical Field

[0004] The present invention relates to the field of optical communication technology, and in particular to an optical module using embedded LDD and optical devices and a method for converting the light output rate thereof. Background Art

[0005] As the 10G Passive Optical Network (PON) industry matures, the standardization of next-generation 50G PON optical access technology is steadily progressing. Global industry chain partners, including operators, equipment manufacturers, and component vendors, have developed 50G PON-related equipment prototypes and optical module samples based on the ITU-TG.9804.3 international standard. Both upstream and downstream optical signals use the Non-Return Zero (NRZ) modulation format, while the electrical interface signal modulation format is not mandatory. The market for the next-generation, higher-speed 25G / 50G PON is expected to launch in 2024, with small-scale commercial use beginning in 2025.

[0006] In the 50G PON optical network unit (ONU) solution, the upstream laser transmitter needs to use a burst mode laser diode driver (BM-LDD) chip. Under the control of a burst enable signal, the BM-LDD chip achieves burst emission of optical signals by rapidly controlling the on / off of the laser current.

[0007] According to the ITU-T G.9804.3 standard, the uplink transmission rate of a 50G PON ONU is 25Gbps or 50Gbps NRZ signal. At 25Gbps, due to the high signal rate, the uniformity of the flexible printed circuit (FPC) and printed circuit board (PCB) wiring between the optical device and the BM-LDD, as well as the layout of the external matching inductor network, will affect the quality of the laser eye diagram, resulting in eye shape deformation or a small margin. However, at a rate of 50Gbps, the parasitic effects of the FPC and PCB wiring will rapidly deteriorate the signal quality, causing the eye diagram to close and unable to open, failing to meet the specifications of 50G PON. Therefore, at a rate of 50Gbps, the currently feasible solution is to minimize the distance between the laser driver chip and the laser and optimize the matching network on the circuit.

[0008] The current technical solution requires an electrical chip A and a bidirectional optical sub-assembly (BOSA) 1 for a 25Gbps transmission rate, while a second electrical chip B and BOSA 2 are required for a 50Gbps transmission rate. This requires the development of two different PCBs to support the two different uplink rates, resulting in a larger number of material types and PCB variations, increasing costs.

[0009] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field.

[0010] Application Contents

[0011] The technical problem to be solved by the present invention is how to overcome the problem in the prior art that two PCB circuit boards are required to achieve outputs with two different transmission rates.

[0012] The present invention adopts the following technical solutions:

[0013] In a first aspect, an optical module using an embedded LDD and an optical device is provided, comprising: a circuit board and at least one BOSA optical device, wherein the BOSA optical device is connected to the circuit board;

[0014] The circuit board is provided with a control unit, and the BOSA optical device includes a laser driver electronic chip, a laser emitting unit, and an optical transceiver unit; the laser driver electronic chip is connected to the control unit and the laser emitting unit respectively; the laser emitting unit is connected to the optical transceiver unit, and the optical transceiver unit is used to connect to the optical fiber;

[0015] The control unit is used to generate a corresponding control signal according to the transmission rate supported by the BOSA optical device, and the laser driver electronic chip is used to generate a drive signal according to the control signal; the laser emitting unit is used to generate a laser signal with a corresponding transmission rate according to the drive signal, and transmit the laser signal to the optical fiber through the optical transceiver unit.

[0016] Preferably, the BOSA optical device further includes a photoelectric conversion unit, and the photoelectric conversion unit is connected to the optical transceiver unit;

[0017] The optical transceiver unit is further configured to receive an optical signal from an optical fiber and transmit the optical signal to the photoelectric conversion unit;

[0018] The photoelectric conversion unit is used to convert the optical signal into an electrical signal.

[0019] Preferably, the BOSA optical device further comprises an amplifier unit, wherein the input end of the amplifier unit is connected to the photoelectric conversion unit, and the output end of the amplifier unit is connected to the control unit;

[0020] The amplifier unit is used to amplify the electrical signal and transmit it to the control unit.

[0021] Preferably, the dimensions of the BOSA optical device match those of the circuit board;

[0022] The interface definition and spacing between the BOSA optical device and the circuit board both meet preset conditions.

[0023] Preferably, at least three interfaces are added between the BOSA optical device and the circuit board, and BOSA type identification signals, control signals and communication protocol signals are transmitted through the at least three interfaces;

[0024] The control unit is used to send a communication protocol signal to the laser driver electronic chip, so as to read the internal register of the laser driver electronic chip through the communication protocol signal, and then obtain the BOSA type identification signal;

[0025] The control unit is used to determine the transmission rate of the BOSA optical device according to the BOSA type identification signal and generate a corresponding control signal;

[0026] The laser driver electronic chip is used to generate the driving signal according to the control signal, so as to drive the laser emitting unit to generate a laser signal with a corresponding transmission rate.

[0027] Preferably, the transmission rates supported by the BOSA optical device include 25 Gbps and 50 Gbps.

[0028] In a second aspect, a method for converting the output light rate of an optical module using an embedded LDD and an optical device is provided, comprising:

[0029] The control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device;

[0030] The laser driver electronic chip generates a driving signal according to the control signal;

[0031] The laser emitting unit generates a laser signal of a corresponding transmission rate according to the driving signal, and transmits the laser signal to the optical fiber through the optical transceiver unit.

[0032] Preferably, the control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device, including:

[0033] Selecting a BOSA optical device that supports a corresponding transmission rate according to the current transmission rate requirement, and connecting the BOSA optical device to the circuit board;

[0034] The control unit generates a corresponding control signal according to the transmission rate supported by the currently connected BOSA optical device;

[0035] The control unit sends the control signal to the laser driver electronic chip.

[0036] Preferably, the laser driver electronic chip generates a driving signal according to the control signal, including:

[0037] After receiving the control signal from the control unit, the laser driver electronic chip analyzes the control signal to obtain a first analysis result;

[0038] The laser driver electronic chip generates a corresponding driving signal according to the first analysis result.

[0039] Preferably, the laser emitting unit generates a laser signal of a corresponding transmission rate according to the driving signal, and transmits the laser signal to the optical fiber through the optical transceiver unit, including:

[0040] After receiving the driving signal from the laser driver electronic chip, the laser emitting unit analyzes the driving signal to obtain a second analysis result;

[0041] The laser emitting unit generates a corresponding laser signal according to the second analysis result. Compared with the prior art, the beneficial effects of the present invention are:

[0042] The control unit in the present invention generates a corresponding control signal to the laser driver electronic chip based on the transmission rate supported by the BOSA optical device. The laser driver electronic chip generates a drive signal to the laser emitting unit based on the control signal. The laser emitting unit generates a laser signal with a corresponding transmission rate based on the drive signal, and transmits the laser signal to the optical fiber through the optical transceiver unit. The present invention can output light with two different transmission powers through a circuit board and one or two BOSA optical devices. On the other hand, the present invention sets the laser driver electronic chip in the BOSA optical device, saving the area of ​​the circuit board and reducing the number of PCB types, thereby realizing a 25G / 50G PON ONU optical module in a small form pluggable (SFP) package. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] 1 is a schematic structural diagram of a conventional optical module using embedded LDDs and optical devices according to an embodiment of the present invention;

[0045] FIG2 is a schematic structural diagram of a conventional optical module using embedded LDDs and optical devices provided by an embodiment of the present invention;

[0046] 3 is a schematic structural diagram of a conventional optical module using embedded LDDs and optical devices according to an embodiment of the present invention;

[0047] 4 is a schematic structural diagram of an optical module using embedded LDDs and optical devices provided by an embodiment of the present invention;

[0048] 5 is another structural diagram of an optical module using embedded LDDs and optical devices provided by an embodiment of the present invention;

[0049] 6 is a schematic diagram of a specific structure of an optical module using embedded LDD and optical devices according to an embodiment of the present invention;

[0050] FIG7 is a flow chart of a method for converting the output light rate of an optical module using an embedded LDD and an optical device, provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0052] The terms "first," "second," etc., used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of such features. In the description of this disclosure, unless otherwise specified, "plurality" means two or more.

[0053] In the present invention, unless otherwise specified or limited, the term "connection" should be understood broadly. For example, "connection" can mean fixed connection, detachable connection, or integration; it can mean direct connection or indirect connection through an intermediary. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined as long as they do not conflict with each other.

[0054] Example 1:

[0055] A commonly used 50G PON ONU optical module consists of three main components: an assembled PCB (printed circuit board), a BOSA (Board of Substations) optical component, and a metal housing. The PCB is soldered with various electronic chips, including a BM-LDD chip, a digital signal processing (DSP), a microcontroller unit (MCU), a thermoelectric cooler (TEC), and a power converter, as well as discrete electronic components such as resistors, capacitors, inductors, and ferrite beads. The BOSA optical component houses components such as a 25G / 50G avalanche photodiode (APD), a trans-impedance amplifier (TIA), a 25G / 50G distributed feedback laser (DFB), a lens, an optical diaphragm, and a wavelength division multiplexer (WDM), ultimately forming a single optical module that integrates both transmission and reception, as shown in Figure 1.

[0056] Each electronic chip on a PCB requires a certain amount of PCB area. The PCB layout also needs to consider the area occupied by the BM-LDD chip, peripheral components, power supply, and signal lines. Changes to the BM-LDD chip's size or pinout require a new PCB design to accommodate it. This results in the need for multiple PCB types for the same product function, increasing inventory variety, reducing production efficiency, and ultimately increasing the cost of optical modules, as shown in Figures 2 and 3.

[0057] For BOSA optical devices, as long as the BOSA optical device's external dimensions remain unchanged and the interface definition and spacing between the BOSA optical device and the PCB remain unchanged, changes to the internal components of the BOSA optical device will not affect the assembly of the optical module. Therefore, if the internal functions of the 50G ONU are re-divided and the BM-LDD chip is embedded in the BOSA optical device, it is possible to use only one PCB and replace only the BOSA optical device to support two different types of ONU functions: 25Gbps or 50Gbps.

[0058] In this embodiment, an optical module with embedded LDD and optical devices is proposed, as shown in Figure 4, including: a circuit board and at least one BOSA optical device, the BOSA optical device is connected to the circuit board; a control unit is provided in the circuit board, and the BOSA optical device includes a laser driver electronic chip, a laser emitting unit and an optical transceiver unit; the laser driver electronic chip is connected to the control unit and the laser emitting unit respectively; the laser emitting unit is connected to the optical transceiver unit, and the optical transceiver unit is used to connect to the optical fiber; the control unit is used to generate a corresponding control signal according to the transmission rate supported by the BOSA optical device, and the laser driver electronic chip is used to generate a drive signal according to the control signal; the laser emitting unit is used to generate a laser signal with a corresponding transmission rate according to the drive signal, and transmit the laser signal to the optical fiber through the optical transceiver unit.

[0059] The circuit board provides the electronic control and signal processing functions required for the entire optical module, and the BOSA optical device is used to send and receive optical signals. The BOSA optical device can be directly connected to the circuit board, or, for cost considerations, as shown in Figure 5, the BOSA optical device can also be soldered on the circuit board, which is called BOSA on Board (BOB) to achieve the lowest cost. Specifically, after determining the transmission rate of the optical module required by the system, the corresponding BOSA optical device is selected and soldered on the circuit board; when the BOSA optical device needs to be replaced, the previously soldered BOSA optical device is directly removed and a BOSA optical device that supports the new transmission rate is re-soldered. Through a circuit board and BOSA optical devices that support different transmission rates, PON with different transmission rates can be achieved. The transmission rates supported by the BOSA optical device include 25Gbps and 50Gbps.

[0060] The control unit inside the circuit board is responsible for the overall management and control functions, including processing data signals, executing protocols, and managing the data transmission process. The control unit can be an MCU or a DSP.

[0061] The laser driver electronic chip is used to drive the laser emitting unit and can generate an appropriate driving signal according to the instructions of the control unit. The laser emitting unit is responsible for generating a laser signal according to the driving signal. The characteristics of the laser signal (such as intensity, frequency, etc.) are determined by the driving signal. The optical transceiver unit is used to transmit the laser signal to the optical fiber and can receive the signal from the optical fiber. The control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device and sends it to the laser driver electronic chip. After receiving the control signal, the laser driver electronic chip generates a driving signal to the laser emitting unit. The laser emitting unit generates a laser signal with a corresponding transmission rate according to the driving signal. The laser signal is transmitted to the optical fiber through the optical transceiver unit, and the optical transceiver unit is also responsible for receiving the signal from the optical fiber. It is worth noting that in the BOSA optical device that supports a transmission rate of 25Gbps and the BOSA optical device that supports a transmission rate of 50Gbps, the laser driver electronic chip and the laser emitting unit are different. Specifically, they will not be described in detail in this embodiment.

[0062] For BOSA optical devices, changes to their internal components will not affect the assembly of the optical module unless their dimensions, interface definition, and spacing with the circuit board remain unchanged. Therefore, it is necessary to ensure that the dimensions of the BOSA optical device match those of the circuit board, and that the interface definition and spacing between the BOSA optical device and the circuit board meet pre-set requirements.

[0063] Ensuring that the dimensions of the BOSA optical device match the circuit board is to ensure that it can be correctly installed in the designated location and work in coordination with other components. Specifically, the dimensions of BOSA optical devices supporting 25Gbps transmission rates and BOSA optical devices supporting 50Gbps transmission rates must match the circuit board. This includes considering the length, width, height, and possible shape characteristics of the device.

[0064] Defining the interface between the BOSA optical device and the circuit board is crucial, including the connector type, pin assignment, and signal definition. Ensure that the interface definition meets pre-set requirements to ensure proper connection and achieve the expected optical and electrical performance. In a preferred embodiment, at least three interfaces are added between the BOSA optical device and the circuit board, through which BOSA type identification signals, control signals, and communication protocol signals are transmitted. The control unit is configured to send a communication protocol signal to the laser driver electronic chip, which then reads the laser driver electronic chip's internal registers to obtain the BOSA type identification signal. The control unit is configured to determine the transmission rate of the BOSA optical device based on the BOSA type identification signal and generate a corresponding control signal. The laser driver electronic chip is configured to generate the drive signal based on the control signal to drive the laser emitting unit to generate a laser signal at the corresponding transmission rate. Specifically, the control unit can determine the BOSA type by reading the embedded LDD chip model through a serial control interface or by determining the voltage level of a hardware signal pin connecting the BOSA optical device to the PCB circuit board. More specific details are not provided in this embodiment. At the same time, the control unit sets one or more of the LDD drive current, equalizer value, status monitoring threshold, on / off of the internal clock recovery unit, polarity of the high-speed signal, and timing of the burst enable signal through a serial control interface or hardware signal pin.

[0065] The BOSA type identification signal is used to identify the type of BOSA optical device connected to the circuit board, including information such as its supported transmission rate, wavelength range, and power requirements. The burst control signal is used to control the laser driver electronic chip in real time, controlling the activation and deactivation of the laser emission unit and the timing of generating laser signals at a specific transmission rate. The communication protocol signal is used to communicate with the laser driver electronic chip, including setting and reading its internal registers, which includes configuring the laser driver electronic chip, such as adjusting the drive current and setting the modulation method.

[0066] The main signal control process is as follows: The control unit uses the BOSA type recognition signal to determine the type of the BOSA optical device and its supported transmission rate. Next, the control unit generates corresponding control signals based on the determination result to adjust the operating status of the laser driver electronic chip and the laser emission unit to ensure that the laser signal transmission rate matches the specifications of the BOSA optical device. Communication protocol signals enable detailed configuration of the operating parameters of the laser driver electronic chip, including but not limited to adjusting output power and modulation depth. The flexibility of this signal interface definition is crucial for optimizing the performance of the optical module and adapting to different network environments and requirements. Through these definitions and processes, the optical module can achieve efficient and flexible data transmission while adapting to changing network environments and communication requirements. This design not only improves the module's versatility and adaptability but also provides solid technical support for high-speed, efficient optical communications. It is worth noting that the interface between the BOSA optical device and the circuit board also includes definitions for other signals, such as power, ground, and high-speed TX / RX electrical signals. More specific information is not provided in this embodiment.

[0067] The spacing between the BOSA optical device and the circuit board is determined by factors such as mechanical stability and electrical performance. Ensuring that the spacing between the BOSA and the circuit board meets the preset conditions is to ensure good electrical signal transmission and reliable connection. It is usually necessary to take into account possible manufacturing deviations and environmental factors. In the actual design process, simulations and actual tests are usually carried out to verify the connection performance between the BOSA optical device and the circuit board. In addition, complying with relevant design specifications and standards is also an important step to ensure the performance of the final product. In this embodiment, the preset conditions for the spacing between the BOSA optical device and the circuit board are not explained in detail.

[0068] In a preferred embodiment, as shown in Figure 6 , the BOSA optical device further includes an optoelectronic conversion unit (APD) connected to the optical transceiver unit. The optical transceiver unit is further configured to receive optical signals from the optical fiber and transmit the optical signals to the optoelectronic conversion unit, which converts the optical signals into electrical signals. In a preferred embodiment, referring to Figure 6 , the BOSA optical device further includes an amplifier unit, the input of which is connected to the optoelectronic conversion unit (WDM) and the output of which is connected to the control unit. The amplifier unit is configured to amplify the electrical signals and transmit them to the control unit.

[0069] Among them, BM-LDD1 is a laser driver electronic chip that supports the first transmission rate, and DFB1 is a laser emitting unit that supports the first transmission rate; BM-LDD2 is a laser driver electronic chip that supports the second transmission rate, and DFB2 is a laser emitting unit that supports the second transmission rate; the first transmission rate can be 25Gbps, and the second transmission rate can be 50Gbps.

[0070] The optical transceiver unit is used not only to transmit optical signals to the optical fiber, but also to receive optical signals from the optical fiber. The photoelectric conversion unit is responsible for converting the optical signal received from the optical fiber into an electrical signal. This process is a key link in the optical communication system because it allows the optical signal transmitted in the optical fiber to be processed in the electronic equipment on the circuit board. The photoelectric conversion unit usually includes a photodetector (such as a PIN photodiode or an avalanche photodiode), which is responsible for converting light energy into electrical energy, that is, converting the optical signal into an electrical signal.

[0071] The electrical signals converted from the photoelectric conversion unit are first sent to the amplifier unit, which is used to amplify these electrical signals. This is used to improve the quality and reliability of the electrical signals in subsequent processing when they are transmitted over long distances or when the signals are weak. The amplified electrical signals are transmitted to the control unit for further processing and analysis, which may include signal demodulation, signal equalization, clock recovery, error detection and correction, and data reorganization. The specific details will not be described in detail in this embodiment.

[0072] The control unit proposed in this embodiment generates a corresponding control signal to the laser driver electronic chip based on the transmission rate supported by the BOSA optical device. The laser driver electronic chip generates a drive signal to the laser emitting unit based on the control signal. The laser emitting unit generates a laser signal with a corresponding transmission rate based on the drive signal and transmits the laser signal to the optical fiber via the optical transceiver unit. Referring to Figure 6, this embodiment can output light with two different transmission powers using a single circuit board and two BOSA optical devices. Furthermore, this embodiment places the laser driver electronic chip within the BOSA optical device, saving circuit board area and enabling the implementation of a 50G PON ONU optical module in an SFP package.

[0073] Example 2:

[0074] In Example 1, an optical module using an embedded LDD and an optical device is provided. In this embodiment, a method for converting the output light rate of an optical module using an embedded LDD and an optical device is proposed, as shown in FIG7 , including:

[0075] Step 101: The control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device.

[0076] The step 101 specifically includes selecting a BOSA optical device that supports a corresponding transmission rate according to the current transmission rate requirement, and connecting the BOSA optical device to the circuit board; the control unit generates a corresponding control signal according to the transmission rate supported by the currently connected BOSA optical device; and the control unit sends the control signal to the laser driver electronic chip.

[0077] Selecting the appropriate BOSA optical device involves choosing a BOSA optical device that supports the current transmission rate requirement. In practical applications, an optical device that best suits the current network conditions and performance requirements is selected from multiple different types of BOSA optical devices. Once the appropriate BOSA optical device is selected, the control unit generates a corresponding control signal based on the transmission rate supported by the optical device. This control signal critically affects the operating state of the optical module, including the modulation method, output power, and other related parameters of the laser driver electronic chip. Specifically, after determining the transmission rate of the optical module required by the system, the corresponding BOSA optical device is selected and soldered to the circuit board. When the BOSA optical device needs to be replaced, the previously soldered BOSA optical device is simply removed and re-soldered with a BOSA optical device that supports the new transmission rate. Using a single circuit board and BOSA optical devices that support different transmission rates, a PON with different transmission rates can be achieved. The transmission rates supported by the BOSA optical device include 25Gbps and 50Gbps.

[0078] Step 102: The laser driver chip generates a driving signal according to the control signal.

[0079] After receiving the control signal from the control unit, the laser driver electronic chip analyzes the control signal to obtain a first analysis result; and generates a corresponding driving signal according to the first analysis result.

[0080] First, the laser driver electronic chip receives a control signal from the control unit, and the control signal contains important information about how to operate the laser emitting unit, such as the required transmission rate, modulation method, power setting, etc. Next, the laser driver electronic chip parses these control signals to obtain a first parsing result. The parsing process is actually to convert the received control signal into a specific command that the electronic chip itself can understand and execute. This may include decoding the signal, extracting parameters, and determining the operating mode. More specifically, it will not be explained in detail in this embodiment. Based on the first parsing result, the laser driver electronic chip generates a corresponding drive signal. The drive signal is the actual electrical signal that controls the laser emitting unit. The drive signal is used to ensure that the laser emitting unit operates in the correct mode, such as emitting a laser signal at the correct frequency and power.

[0081] Step 103: The laser emitting unit generates a laser signal with a corresponding transmission rate according to the driving signal, and transmits the laser signal to the optical fiber through the optical transceiver unit.

[0082] After receiving the driving signal from the laser driver electronic chip, the laser emitting unit analyzes the driving signal to obtain a second analysis result; and generates a corresponding laser signal according to the second analysis result.

[0083] The laser emitting unit first receives a drive signal from the laser driver electronic chip, which contains specific instructions on how to emit a laser signal, such as the intensity, wavelength, and modulation mode of the laser. The laser emitting unit then parses these drive signals to obtain a second parsing result. This parsing process involves identifying and understanding the information in the drive signal to determine how to accurately adjust the parameters of the laser to generate the required laser signal. Based on the second parsing result, the laser emitting unit then generates a corresponding laser signal. The laser emitting unit adjusts its operation according to the received instructions, such as changing the intensity, frequency or modulation mode of the laser, to ultimately generate a laser signal that meets the transmission rate requirements.

[0084] In a preferred embodiment, the specific structure of the optical module using embedded LDD and optical devices is described in Example 1, and will not be further described in this embodiment.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An optical module using embedded LDD and optical devices, characterized in that: include: A circuit board and at least one BOSA optical device, wherein the BOSA optical device is connected to the circuit board; The circuit board is provided with a control unit, and the BOSA optical device includes a laser driver electronic chip, a laser emitting unit, and an optical transceiver unit; the laser driver electronic chip is connected to the control unit and the laser emitting unit respectively; the laser emitting unit is connected to the optical transceiver unit, and the optical transceiver unit is used to connect to the optical fiber; The control unit is used to generate a corresponding control signal according to the transmission rate supported by the BOSA optical device, and the laser driver electronic chip is used to generate a drive signal according to the control signal; the laser emitting unit is used to generate a laser signal with a corresponding transmission rate according to the drive signal, and transmit the laser signal to the optical fiber through the optical transceiver unit.

2. The optical module using embedded LDD and optical devices according to claim 1, characterized in that: The BOSA optical device further includes a photoelectric conversion unit, which is connected to the optical transceiver unit; The optical transceiver unit is further configured to receive an optical signal from an optical fiber and transmit the optical signal to the photoelectric conversion unit; The photoelectric conversion unit is used to convert the optical signal into an electrical signal.

3. The optical module using embedded LDD and optical devices according to claim 2, characterized in that: The BOSA optical device further includes an amplifier unit, wherein an input end of the amplifier unit is connected to the photoelectric conversion unit, and an output end of the amplifier unit is connected to the control unit; The amplifier unit is used to amplify the electrical signal and transmit it to the control unit.

4. The optical module using embedded LDD and optical devices according to claim 1, characterized in that: The dimensions of the BOSA optical device match those of the circuit board; The interface definition and spacing between the BOSA optical device and the circuit board both meet preset conditions.

5. The optical module using embedded LDD and optical devices according to claim 4, characterized in that: The dimensions of the BOSA optical device supporting a transmission rate of 25 Gbps and the BOSA optical device supporting a transmission rate of 50 Gbps both match the circuit board.

6. The optical module using embedded LDD and optical devices according to claim 4, characterized in that: At least three interfaces are added between the BOSA optical device and the circuit board, and BOSA type identification signals, control signals and communication protocol signals are transmitted through the at least three interfaces; The control unit is used to send a communication protocol signal to the laser driver electronic chip, so as to read the internal register of the laser driver electronic chip through the communication protocol signal, and then obtain the BOSA type identification signal; The control unit is used to determine the transmission rate of the BOSA optical device according to the BOSA type identification signal and generate a corresponding control signal; The laser driver electronic chip is used to generate the driving signal according to the control signal, so as to drive the laser emitting unit to generate a laser signal with a corresponding transmission rate.

7. The optical module using embedded LDD and optical devices according to claim 6, characterized in that: The control unit reads the embedded LDD chip model through the serial control interface, or determines the type of BOSA by the level of a hardware signal pin connecting the BOSA optical device to the circuit board.

8. The optical module using embedded LDD and optical devices according to claim 7, characterized in that: The control unit sets one or more of the LDD drive current, equalizer value, status monitoring threshold, on / off of the internal clock recovery unit, polarity of the high-speed signal, and timing of the burst enable signal through a serial control interface or hardware signal pin.

9. The optical module using embedded LDD and optical devices according to claim 1, characterized in that: The transmission rates supported by the BOSA optical device include 25Gbps and 50Gbps.

10. The optical module using embedded LDD and optical devices according to claim 1, characterized in that: The control unit may be an MCU or a DSP.

11. A method for converting the light output rate of an optical module using an embedded LDD and an optical device, characterized in that: The light output rate conversion method is applied to the optical module using the embedded LDD and optical device according to any one of claims 1 to 10, comprising: The control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device; The laser driver electronic chip generates a driving signal according to the control signal; The laser emitting unit generates a laser signal of a corresponding transmission rate according to the driving signal, and transmits the laser signal to the optical fiber through the optical transceiver unit.

12. The method for converting the light output rate of an optical module using an embedded LDD and an optical device according to claim 11, wherein: The control unit generates a corresponding control signal according to the transmission rate supported by the BOSA optical device, including: Selecting a BOSA optical device that supports a corresponding transmission rate according to the current transmission rate requirement, and connecting the BOSA optical device to the circuit board; The control unit generates a corresponding control signal according to the transmission rate supported by the currently connected BOSA optical device; The control unit sends the control signal to the laser driver electronic chip.

13. The method for converting the light output rate of an optical module using an embedded LDD and an optical device according to claim 11, wherein: The laser driver electronic chip generates a driving signal according to the control signal, comprising: After receiving the control signal from the control unit, the laser driver electronic chip analyzes the control signal to obtain a first analysis result; The laser driver electronic chip generates a corresponding driving signal according to the first analysis result.

14. The method for converting the light output rate of an optical module using an embedded LDD and an optical device according to claim 11, wherein: The laser emitting unit generates a laser signal of a corresponding transmission rate according to the driving signal, and transmits the laser signal to the optical fiber through the optical transceiver unit, including: After receiving the driving signal from the laser driver electronic chip, the laser emitting unit analyzes the driving signal to obtain a second analysis result; The laser emitting unit generates a corresponding laser signal according to the second analysis result.

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