Middle frame and electronic device

Abstract

Provided in the present application are a middle frame and an electronic device. The middle frame comprises: a composite metal frame, wherein the composite metal frame comprises an outer metal frame, and the outer metal frame is made of a first metal that may be an aluminum alloy; and a non-metal base plate made of carbon fiber, the density of the carbon-fiber base plate being smaller than that of the outer metal frame. The composite metal frame may further comprise a metal skeleton made of a second metal that may be a magnesium alloy, wherein the metal skeleton may be embedded into the outer metal frame. By means of the middle frame provided in the present application, the weight of the middle frame is reduced while the strength thereof is maintained, and lightweight of the middle frame and an electronic device can be achieved.

Description

Midframe and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 29, 2024, with application number 202420396180.9 and utility model name “Middle frame and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of terminal device hardware, and in particular, to a middle frame and an electronic device. Background Art

[0003] The midframe is a key component in current electronic devices, securing components and maintaining appropriate clearances between them, protecting the device's internal components from external impact. Aluminum alloy is used in most electronic devices due to its low density, rich color options, and metallic texture after anodizing. However, with the trend toward lightweight high-end and foldable electronics, aluminum alloy can no longer meet these demands. The need to reduce midframe weight while maintaining strength is crucial. Reducing midframe weight without sacrificing strength is a crucial consideration.

[0004] Summary of the Invention

[0005] The present application provides a middle frame and an electronic device, which can reduce the weight of the middle frame while ensuring the strength of the middle frame.

[0006] In a first aspect, a middle frame is provided, comprising: a composite metal frame, the composite metal frame comprising a metal outer frame, the metal outer frame being made of a first metal material; and a non-metallic bottom plate, the non-metallic bottom plate being made of a carbon fiber material, the density of the carbon fiber material being less than the density of the first metal material.

[0007] Based on the above technical solution, by introducing a bottom plate made of low-density and high-hardness carbon fiber material into the middle frame, the weight of the middle frame can be effectively reduced while ensuring the strength of the middle frame, thereby improving the user experience when using electronic devices.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the composite metal frame further includes a metal skeleton, the metal skeleton is made of a second metal material, and the density of the second metal material is less than the density of the first metal material.

[0009] Based on the above technical solution, by introducing a metal skeleton with a lower density than the metal outer frame into the middle frame, it is possible to provide support for other structural components in the electronic device, improve the practicality of the middle frame, and reduce the weight of the middle frame.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the metal skeleton is embedded in the metal outer frame.

[0011] Based on the above technical solution, the increase in thickness caused by simply stacking the metal skeleton and the metal outer frame is avoided, thereby reducing the thickness of the middle frame, which is beneficial to reducing the thickness of the entire electronic device.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the metal skeleton further includes cross beams and / or longitudinal beams and supporting parts connected to the cross beams and / or longitudinal beams.

[0013] Based on the above technical solution, the metal frame has crossbeams and / or longitudinal beams, which can improve the firmness and strength of the middle frame. The supporting part can provide effective support for other structural parts of the electronic device, thereby improving the practicality of the middle frame.

[0014] In combination with the first aspect, in certain implementations of the first aspect, a first glue dispensing layer is provided between the composite metal frame and the non-metallic base plate.

[0015] Based on the above technical solution, the composite metal frame and the non-metallic bottom plate are connected by glue spotting, which effectively improves the firmness of the middle frame and reduces the complexity of the process when preparing the middle frame.

[0016] In combination with the first aspect, in certain implementations of the first aspect, a first glue groove is provided on a surface of the composite metal frame facing the non-metallic base plate, and the first glue dispensing layer is accommodated in the first glue groove.

[0017] Based on the above technical solution, providing the first glue groove can reduce the increase in the thickness of the middle frame caused by the thickness of the first glue layer itself, thereby thinning the thickness of the middle frame, which is beneficial to reducing the thickness of the entire electronic device.

[0018] In combination with the first aspect, in certain implementations of the first aspect, a second glue layer is provided between the metal outer frame and the metal skeleton.

[0019] Based on the above technical solution, the metal outer frame and the metal skeleton are connected by glue dispensing, which effectively improves the firmness of the middle frame and reduces the complexity of the process when preparing the middle frame.

[0020] In combination with the first aspect, in certain implementations of the first aspect, a second glue groove is provided on the surface of the metal skeleton facing the metal outer frame, and the second glue layer is accommodated in the second glue groove.

[0021] Based on the above technical solution, providing the second glue groove can reduce the increase in the thickness of the middle frame caused by the thickness of the second glue layer itself, thereby thinning the thickness of the middle frame, which is conducive to reducing the thickness of the entire electronic device.

[0022] In combination with the first aspect, in certain implementations of the first aspect, a first threaded hole is further provided on the surface of the metal outer frame, and a second threaded hole corresponding to the position of the first threaded hole is further provided on the surface of the metal skeleton facing the metal outer frame; the middle frame also includes a fastener, which passes through the first threaded hole and the second threaded hole to connect the metal outer frame and the metal skeleton.

[0023] Based on the above technical solution, the metal outer frame and the metal skeleton are further connected through threaded holes and fasteners, which can improve the stability of the connection with the middle frame and make the middle frame more reliable.

[0024] In combination with the first aspect, in certain implementations of the first aspect, a silver paste layer is further provided on the surface of the non-metallic base plate facing the composite metal frame, and a conductive adhesive layer is provided at a position of the composite metal frame corresponding to the silver paste layer, and the silver paste layer is in contact with the conductive adhesive layer.

[0025] Based on the above technical solution, the composite metal frame and the non-metallic base plate can be electrically connected in a simple manner, thereby improving the practicality of the middle frame.

[0026] In combination with the first aspect, in certain implementations of the first aspect, a recessed area is provided on the surface of the non-metallic base plate, and the recessed area is used to accommodate at least one of a heat sink, a flexible circuit board FPC, an adhesive component or a conductive foam.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the first metal material is an aluminum alloy.

[0028] Based on the above technical solution, the metal outer frame is made of aluminum alloy material, which can ensure the stability of the metal outer frame.

[0029] In combination with the first aspect, in certain implementations of the first aspect, the second metal material is a magnesium alloy.

[0030] Based on the above technical solution, the metal frame is made of a magnesium alloy with lower density, which can effectively reduce the weight of the middle frame.

[0031] In combination with the first aspect, in certain implementations of the first aspect, the surface of the metal outer frame has an anodized layer.

[0032] Based on the above technical solution, the metal outer frame can present a variety of colors and metallic textures after anodizing, thereby improving the aesthetics of the middle frame.

[0033] In a second aspect, an electronic device is provided, comprising the middle frame described in the first aspect and any one of its implementations, wherein the middle frame is used to fix parts of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is an exploded view of a middle frame 100 provided in an embodiment of the present application.

[0035] FIG2 is a schematic structural diagram of a middle frame 100 provided in an embodiment of the present application.

[0036] FIG3 is a cross-sectional structural diagram of area A in FIG2 along the X direction.

[0037] FIG4 is an exploded view of the structure of a middle frame 200 provided in an embodiment of the present application.

[0038] FIG5 is a schematic structural diagram of a middle frame 200 provided in an embodiment of the present application.

[0039] FIG6 is a cross-sectional structural diagram of region B in FIG5 along the X direction. DETAILED DESCRIPTION

[0040] The technical solution in this application will be described below with reference to the accompanying drawings.

[0041] The following describes embodiments of the present application in detail, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present application and are not to be construed as limiting the present application.

[0042] In the description of this application, it should be understood that the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of the described features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting this application.

[0045] The midframe is a key structural component in current electronic devices, securing components and maintaining appropriate clearances between them, protecting the device's internal components from external impact damage. Aluminum alloy is used in most electronic devices due to its low density, rich anodized color palette, and shiny metallic finish. However, with the trend toward lightweight high-end and foldable electronics, aluminum alloy is no longer sufficient. The need to reduce midframe weight while maintaining strength is crucial. Reducing midframe weight without sacrificing strength is a critical consideration.

[0046] To address the aforementioned issues, embodiments of the present application provide a middle frame comprising a composite metal frame and a non-metallic base plate. The composite metal frame includes a metal outer frame made of a first metal material. The composite metal frame provides structural strength to the middle frame. The non-metallic base plate is made of a carbon fiber material, providing support for the screen or other components of the electronic device. It is thin and has high rigidity. The carbon fiber material has a lower density than the first metal material, reducing the overall weight of the middle frame while maintaining its strength.

[0047] In some possible implementations, the composite metal frame further includes a metal skeleton, where the metal skeleton is made of a second metal material, and the density of the second metal material is less than that of the first metal material.

[0048] Based on the above technical solution, the weight of the middle frame can be reduced without reducing the strength of the middle frame, thereby achieving lightweight electronic equipment and improving user experience.

[0049] The shape of the metal frame, metal skeleton and non-metallic bottom plate can be rectangular or other shapes. The embodiments of the present application do not limit this. The following embodiments are described when the shape of the metal frame, metal skeleton and non-metallic bottom plate is rectangular.

[0050] Figure 1 is a structural exploded diagram of a middle frame 100 provided in an embodiment of the present application. The middle frame 100 includes a composite metal frame 101 and a non-metallic base plate 120. The composite metal frame 101 includes a metal outer frame 110. A first glue layer (not shown in Figure 1) is arranged around the composite metal frame 101 and the non-metallic base plate 120 to achieve connection between the metal outer frame 110 and the non-metallic base plate 120.

[0051] It should be understood that in the middle frame 100 , the metal outer frame 110 can be regarded as a composite metal frame 101 .

[0052] In some possible implementations, a first adhesive groove (not shown in FIG. 1 ) is provided around the surface of the metal outer frame 110 facing the non-metallic bottom plate 120. This first adhesive groove can accommodate the first adhesive layer. When the first adhesive layer is disposed within the first adhesive groove, it can prevent the first adhesive layer from occupying excess thickness, thereby further reducing the thickness of the middle frame 100.

[0053] A recessed area 121 is provided on the surface of the non-metallic base plate 120 facing the metal outer frame 110. This recessed area 121 can accommodate structural components such as a heat sink, a flexible printed circuit (FPC), an adhesive component, or conductive foam. The heat sink can be a graphite sheet, which can be used to dissipate heat from heating components in electronic devices; the adhesive component can be adhesive backing, which can be used to secure structural components such as batteries and circuit boards; and the conductive foam can provide shock absorption and cushioning. The shape of the recessed area 121 can be determined based on the shape of the structural component to be accommodated, and is not limited in the embodiments of this application.

[0054] The number of the recessed areas 121 may be one or more, which is not limited in the embodiment of the present application.

[0055] In some embodiments, the recessed area 121 may also be provided on the surface of the non-metallic bottom plate 120 away from the metal outer frame 110 , which is not limited in the embodiments of the present application.

[0056] The first metal material may be an aluminum alloy, and the density of the aluminum alloy may be 2.7 g / cm 3 The aluminum alloy frame has a good metal texture and beautiful appearance, which can improve the user experience when using electronic devices.

[0057] The metal outer frame 110 may be provided with a first threaded hole 110a, which may be used to fix other components in the electronic device, such as a display screen or a circuit board. The first threaded hole 110a may be used to fix other components by bolt connection.

[0058] The number of the first threaded holes 110a can be multiple, for example, four. A first threaded hole 110a is set on each border of the metal outer frame 110 (as shown in Figure 1). The four first threaded holes 210a can also be set at the four corners of the metal outer frame 110. The embodiment of the present application does not limit the number and position of the first threaded holes 110a.

[0059] When the middle frame further includes a metal frame, the first threaded hole can also be used to connect with the metal frame.

[0060] The non-metallic base plate 120 is made of carbon fiber material, and the density of the carbon fiber material can be 1.5g / cm 3 -2g / cm 3 For example, the density of the carbon fiber material can be 1.5 g / cm 3 , 1.6g / cm 3 , 1.7g / cm 3 , 1.8g / cm 3 , 1.9g / cm 3 or 2g / cm 3 Since carbon fiber material has a lower density than aluminum alloy and a higher hardness, it can reduce the weight of the middle frame 100 while ensuring that the strength of the middle frame 100 does not decrease. At the same time, it can also reduce the thickness of the non-metallic bottom plate 120, which is conducive to reducing the overall thickness of the electronic device.

[0061] The metal outer frame 110 can be processed by a computer numerical control (CNC) machine tool.

[0062] In some possible implementations, the metal outer frame 110 may be anodized to form an anodized layer on the surface of the metal outer frame 110 , thereby enriching the color variety of the metal outer frame 110 and improving the overall metallic texture of the middle frame 100 .

[0063] A first glue layer may be formed between the metal outer frame 110 and the non-metal bottom plate 120 through a glue dispensing process, for example, by using a glue dispensing machine to set the first glue layer, thereby achieving connection between the metal outer frame 110 and the non-metal bottom plate 120 .

[0064] The non-metallic base plate 120 can be manufactured by a molding method, and the above-mentioned recessed area 121 can be formed integrally during the molding process. Alternatively, a non-metallic base plate 120 without the recessed area 121 can be first manufactured, and then grooved by CNC or other methods to obtain the recessed area 121.

[0065] Figure 2 is a schematic structural diagram of the middle frame 100 provided in an embodiment of the present application, and Figure 3 is a cross-sectional structural diagram of area A in Figure 2 along the X direction. In conjunction with Figure 2, further referring to Figure 3, a silver paste layer 1201 is provided on the surface of the non-metallic bottom plate 120 facing the metal outer frame 110. The silver paste layer 1201 can be engraved on the surface of the non-metallic bottom plate 120 by laser engraving. A conductive adhesive layer 1101 is provided at a position corresponding to the contact between the metal outer frame 110 and the silver paste layer 1201. The conductive adhesive layer 1101 can be a non-woven conductive adhesive. After the silver paste layer 1201 contacts the conductive adhesive layer 1101, electrical connection can be achieved between the metal outer frame 110 and the non-metallic bottom plate 120.

[0066] It should be understood that the position of the silver paste layer 1201 is not fixed. For example, the silver paste layer 1201 can be set at a partial contact position between the non-metallic base plate 120 and one of the frames of the metal outer frame 110 .

[0067] In some embodiments, the area of ​​the conductive adhesive layer 1101 may be equal to or unequal to the area of ​​the silver paste layer 1201. When the conductive adhesive layer 1101 and the silver paste layer 1201 are in contact, an electrical connection between the metal outer frame 110 and the non-metallic base plate 120 can be achieved. The embodiments of the present application do not limit this.

[0068] It should be understood that area A in FIG2 is merely an example of an optional area for disposing the conductive adhesive layer 1101 and the silver paste layer 1201, and does not necessarily mean that the conductive adhesive layer 1101 and the silver paste layer 1201 must be disposed in area A. The silver paste layer 1201 can also be disposed at other locations on the surface of the non-metallic base plate 120 that contacts one side of the metal outer frame 110, with the conductive adhesive layer 1101 correspondingly disposed on the metal outer frame 110.

[0069] In some electronic devices, there are a large number of structural parts inside the electronic devices, and the composition structure may also be relatively complex. Relying solely on the non-metallic bottom shell and the metal outer frame is not enough to provide sufficient support for the structural parts in the electronic devices. Therefore, in other embodiments provided in this application, the composite metal frame may further include a metal skeleton, which is used to provide support for the structural parts in the electronic device, and can also further strengthen the overall structural strength of the middle frame.

[0070] FIG4 is an exploded view of the structure of another middle frame 200 provided in an embodiment of the present application. The middle frame 200 includes a composite metal frame 201 and a non-metallic base plate 220. The composite metal frame 201 includes a metal outer frame 210 and a metal skeleton 230. The metal outer frame 210 is made of a first metal material, the metal skeleton 230 is made of a second metal material, and the non-metallic base plate 220 is made of a carbon fiber material. The density of the carbon fiber material and the density of the second metal material are both less than the density of the first metal material. A second adhesive layer 2101 (not shown in FIG4 , refer to FIG6 ) is disposed between the metal outer frame 210 and the metal skeleton 230. A first adhesive layer is disposed between the composite metal frame 201 and the non-metallic base plate 220. The two adhesive layers achieve connection between the metal outer frame 210, the metal skeleton 230, and the non-metallic base plate 220.

[0071] In some possible implementations, a first glue groove (not shown in FIG. 4 ) is provided around the surface of the composite metal frame 201 facing the metal skeleton 230, and a second glue groove (not shown in FIG. 4 ) is provided around the surface of the metal skeleton 230 facing the metal outer frame 210. The first glue groove and the second glue groove can be used to accommodate a first glue layer and a second glue layer, respectively. When the first glue layer and the second glue layer are respectively arranged in the first glue groove and the second glue groove, the first glue layer and the second glue layer can be prevented from occupying excess thickness, thereby further reducing the thickness of the middle frame 200.

[0072] A recessed area 221 is provided on the surface of the non-metallic base plate 220 facing the composite metal frame 201. This recessed area 221 can accommodate structural components such as heat sinks, FPCs, adhesive components, or conductive foam. Heat sinks can be graphite sheets, which can dissipate heat from heating components in electronic devices; adhesive components can be adhesive backing, which can be used to secure components such as batteries and circuit boards; and conductive foam can provide shock absorption and cushioning. The shape of recessed area 221 can be determined based on the shape of the structural components to be accommodated, and is not limited in the embodiments of this application.

[0073] The number of the recessed areas 221 may be one or more, which is not limited in the embodiments of the present application.

[0074] In some embodiments, the recessed area 221 may also be provided on the surface of the non-metallic bottom plate 220 away from the metal outer frame 210 , which is not limited in the embodiments of the present application.

[0075] The first metal material may be an aluminum alloy material, and the second metal material may be a magnesium alloy material. The density of the magnesium alloy material and the carbon fiber material is lower than that of the aluminum alloy material, thereby effectively reducing the weight of the middle frame 200. The densities of the above-mentioned different materials can be referred to the description of the middle frame 100. For the sake of brevity, they will not be repeated here.

[0076] In some embodiments, the second metal material may also be other types of metal materials other than magnesium alloys, which have a density lower than that of the first metal material.

[0077] The metal frame 230 can be manufactured through CNC machining. It includes crossbeams and / or longitudinal beams 231 and support portions 232 connected to the crossbeams and / or longitudinal beams 231. The various structures on the metal frame 230 are also manufactured through a single CNC process. The crossbeams and / or longitudinal beams 231 connect to the support portions 232. The support portions 232 can be provided with features such as bosses 232a and positioning posts 232b. The support portions 232 can be used to secure other components of the electronic device, such as circuit boards.

[0078] In some possible implementations, the metal outer frame 210 may be anodized to form an anodized layer on the surface of the metal outer frame 210 , thereby enriching the color variety of the metal outer frame 210 and improving the overall metallic texture of the middle frame 200 .

[0079] In some possible implementations, the size of the metal outer frame 210 is slightly larger than the metal skeleton 230, and the border of the metal outer frame 210 can be set as an L-shaped border, so that the metal skeleton 230 can be embedded in the metal outer frame 210. By adopting this solution, the increase in thickness caused by simply stacking the metal outer frame 210 and the metal skeleton 230 can be avoided, and the thickness of the middle frame 200 can be reduced.

[0080] It should be understood that in the middle frame 200, the composite metal frame 201 is composed of a metal outer frame 210 and a metal skeleton 230. Therefore, the first glue layer may be glued to the metal outer frame 210, or may be glued to the metal skeleton 230, or may be glued to the metal outer frame 210 and the metal skeleton 230 at the same time. The embodiment of the present application does not limit this.

[0081] After the metal outer frame 210 and the metal skeleton 230 are simply overlapped, further connection reinforcement is required to improve the tightness of the connection between the two. For example, a second glue layer is provided through a glue dispensing process so that the metal outer frame 210 and the metal skeleton 230 are overlapped and then glued together to achieve the connection between the metal outer frame 210 and the metal skeleton 230.

[0082] Figure 5 is a structural schematic diagram of the middle frame 200 provided in an embodiment of the present application. Combined with Figure 4 and Figure 5, in order to make the connection between the metal outer frame 210 and the metal skeleton 230 more firm and reliable, a first threaded hole 210a can also be provided on the surface of the metal outer frame 210 facing the metal skeleton 230, and a second threaded hole 230a corresponding to the first threaded hole 210a is provided on the metal skeleton 230. Fasteners (not shown in the figure) are used to pass through the first threaded hole 210a and the second threaded hole 230a in sequence to connect the metal outer frame 210 and the metal skeleton 230.

[0083] The fastener may be a screw, through which the metal outer frame 210 and the metal skeleton 230 are connected; the fastener may also be connected in a matching manner using a nut and a bolt, thereby achieving further reinforcement of the connection between the metal outer frame 210 and the metal skeleton 230 .

[0084] Based on the above solution, compared with welding different types of metals, the connection and assembly between two different types of metals using mature technology such as dispensing and / or bolt locking has higher reliability and durability.

[0085] The embodiment of the present application does not limit the number and position of the first threaded holes 210a and the second threaded holes 230a. For example, the number of first threaded holes 210a can be four, and a first threaded hole 210a can be provided on each of the four sides of the metal outer frame 210 (as shown in Figures 4 and 5). The four first threaded holes 210a can also be provided at the four corners of the metal outer frame 210. The number and position of the second threaded holes 230a can correspond to the number and position of the first threaded holes 210a.

[0086] Figure 6 is a cross-sectional structural diagram of area B in Figure 5 along the X-axis. Referring to Figure 6 in conjunction with Figure 5, a silver paste layer 2201 is provided on the surface of the non-metallic base plate 220 facing the composite metal frame 201. This silver paste layer 2201 can be laser engraved onto the surface of the non-metallic base plate 220. A conductive adhesive layer 2301 is provided at the location where the composite metal frame 201 contacts the silver paste layer 2201. This conductive adhesive layer 2301 can be a non-woven conductive adhesive. Once the silver paste layer 2201 contacts the conductive adhesive layer 2301, an electrical connection is established between the composite metal frame 201 and the non-metallic base plate 220.

[0087] It should be understood that the position of the silver paste layer 2201 is not fixed. For example, the silver paste layer 2201 can be set at the contact position between the non-metallic base plate 220 and one of the frames of the metal outer frame 210.

[0088] In some embodiments, the area of ​​the conductive adhesive layer 2301 may be equal to or unequal to the area of ​​the silver paste layer 2201. When the conductive adhesive layer 2301 is in contact with the silver paste layer 2201, an electrical connection between the composite metal frame 201 and the non-metallic base plate 220 can be achieved. The embodiments of the present application do not limit this.

[0089] It should be understood that Area B in FIG5 is merely an example of an optional area for disposing the conductive adhesive layer 2301 and the silver paste layer 2201, and does not necessarily mean that the conductive adhesive layer 2301 and the silver paste layer 2201 must be disposed in Area B. The silver paste layer 2201 may also be disposed at other locations on the surface of the non-metallic base plate 220 that contacts one side of the composite metal frame 201, with the conductive adhesive layer 2301 correspondingly disposed on the composite metal frame 201.

[0090] It should be understood that, unlike the middle frame 100, the composite metal frame 201 in the middle frame 200 is composed of a metal outer frame 210 and a metal skeleton 230. Therefore, when the non-metallic base plate 220 contacts the composite metal frame 201, it can be the metal skeleton 230 that contacts the non-metallic base plate 220, the metal outer frame 210 that contacts the non-metallic base plate 220, or both the metal outer frame 210 and the metal skeleton 230. In other words, the conductive adhesive layer 2301 can be disposed on the metal outer frame 210, the metal skeleton 230, or both. As shown in FIG6 , the conductive adhesive layer 2301 is disposed on the surface of the metal skeleton 230 facing the non-metallic base plate 220.

[0091] In some embodiments, the metal outer frame 210 and the metal skeleton 230 can be connected only by setting a second glue layer through a glue dispensing process, or they can be connected by fasteners in conjunction with the first threaded holes 210a and the second threaded holes 230a after setting the second glue layer.

[0092] The present application also provides an electronic device, which may be a mobile phone, a tablet computer or a laptop computer. The electronic device includes a middle frame provided in any embodiment of the present application, and the middle frame can be used to connect and fix other components in the electronic device.

[0093] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A middle frame, characterized in that: include: a composite metal frame, the composite metal frame comprising a metal outer frame made of a first metal material; The non-metallic base plate is made of a carbon fiber material, and the density of the carbon fiber material is lower than the density of the first metal material.

2. The middle frame according to claim 1, characterized in that: The composite metal frame further includes a metal skeleton made of a second metal material having a density less than that of the first metal material.

3. The middle frame according to claim 2, characterized in that: The metal skeleton is embedded in the metal outer frame.

4. The middle frame according to claim 2, characterized in that: The metal frame further comprises cross beams and / or longitudinal beams and supporting parts connected to the cross beams and / or longitudinal beams.

5. The middle frame according to claim 1, characterized in that: A first glue dispensing layer is provided between the composite metal frame and the non-metallic bottom plate.

6. The middle frame according to claim 5, characterized in that: A first glue groove is provided on the surface of the composite metal frame facing the non-metallic bottom plate, and the first glue-dispensing layer is accommodated in the first glue groove.

7. The middle frame according to claim 2, characterized in that: A second glue dispensing layer is provided between the metal outer frame and the metal skeleton.

8. The middle frame according to claim 7, characterized in that: A second glue groove is provided on the surface of the metal skeleton facing the metal outer frame, and the second glue-dispensing layer is accommodated in the second glue groove.

9. The middle frame according to claim 7, characterized in that: A first threaded hole is also provided on the surface of the metal outer frame, and a second threaded hole corresponding to the position of the first threaded hole is also provided on the surface of the metal skeleton facing the metal outer frame; the middle frame also includes a fastener, which passes through the first threaded hole and the second threaded hole to connect the metal outer frame and the metal skeleton.

10. The middle frame according to claim 1, characterized in that: A silver paste layer is further provided on the surface of the non-metallic bottom plate facing the composite metal frame. A conductive adhesive layer is provided at a position of the composite metal frame corresponding to the silver paste layer, and the silver paste layer is in contact with the conductive adhesive layer.

11. The middle frame according to claim 1, wherein: A recessed area is provided on the surface of the non-metallic base plate, and the recessed area is used to accommodate at least one of a heat sink, a flexible circuit board (FPC), an adhesive component or a conductive foam.

12. The middle frame according to any one of claims 1 to 11, characterized in that: The first metal material is aluminum alloy.

13. The middle frame according to any one of claims 2-4 or 7-9, characterized in that: The second metal material is a magnesium alloy.

14. The middle frame according to any one of claims 1 to 11, characterized in that: The surface of the metal outer frame has an anodized layer.

15. An electronic device, characterized in that: The middle frame comprises the middle frame according to any one of claims 1 to 14, and the middle frame is used to fix the parts of the electronic device.

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