Electronic device including support member

Abstract

The present invention relates to an electronic device. The electronic device according to an embodiment of the present invention may comprise a housing including a support member. The support member may include: a body that has a first curved surface portion including a first material; and a frame that includes a second material different from the first material and has a second curved surface portion surrounding the first curved surface portion. The first curved surface portion is configured to thermally expand toward the second curved surface portion, and the support member may include a joined portion of the first curved surface portion and the second curved surface portion.

Description

Electronic device including a support member

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including a support member.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure includes a housing including a support member, wherein the support member includes a body having a first curved portion including a first material; and a frame having a second curved portion surrounding the first curved portion, the second curved portion including a second material different from the first material, wherein the first curved portion is configured to thermally expand toward the second curved portion, and the support member may include a joint portion between the first curved portion and the second curved portion.

[0006] An electronic device according to one embodiment of the present disclosure includes a housing including a support member, wherein the support member includes a body including a first material; and a frame disposed to surround at least a portion of the body and including a second material different from the first material, wherein the body is configured to expand thermally toward the frame due to heat, and the frame may include a recess configured to have at least a portion of the body inserted therein.

[0007] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a first process of arranging a body including a first material; a second process of arranging a frame including a second material different from the first material to surround the body; a third process of arranging a jig to surround the frame; and a fourth process of applying heat to the body such that the body thermally expands toward the frame while the body and the frame are fixed in position by the jig.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is a portion of a support member according to one embodiment of the present disclosure.

[0015] FIG. 7 is a portion of a support member according to one embodiment of the present disclosure.

[0016] Figure 8 is a support member according to one embodiment of the present disclosure.

[0017] FIG. 9 is a drawing illustrating assembly of a support member according to one embodiment of the present disclosure.

[0018] FIG. 10 is a drawing illustrating a manufacturing process of a support member according to one embodiment of the present disclosure.

[0019] Fig. 11 is a cross-sectional view taken along the A-A' reference line of the structure illustrated in Fig. 9.

[0020] Fig. 12 is a cross-sectional view taken along the B-B' reference line of the structure illustrated in Fig. 9.

[0021] Figure 13 is an enlarged view of area C of the structure illustrated in Figure 9.

[0022] Figure 14 is a part of a cross-sectional view of the structure illustrated in Figure 9.

[0023] Figure 15 is a part of a cross-sectional view of the structure illustrated in Figure 9.

[0024] FIG. 16 is a drawing illustrating assembly of a support member according to one embodiment of the present disclosure.

[0025] FIG. 17 is a drawing illustrating a manufacturing process of a support member according to one embodiment of the present disclosure.

[0026] Fig. 18 is a cross-sectional view taken along the D-D' reference line shown in Fig. 17.

[0027] FIG. 19 is a part of a cross-sectional view of a support member according to one embodiment of the present disclosure.

[0028] Fig. 20 is a part of a cross-sectional view of a support member according to the prior art.

[0029] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0030] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0032] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0063] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0064] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 20.

[0065] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The back plate (211) may form the second side (210B). The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0066] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0067] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0068] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0069] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0070] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0071] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0072] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0073] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0074] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0075] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0076] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0077] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0078] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 20.

[0079] Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0080] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0081] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0082] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear side of the housing (301)' may refer to the first side (210A) of FIG. 1 or the second side (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0083] The memory may include, for example, volatile memory or non-volatile memory.

[0084] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0085] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 309) of FIG. 2.

[0086] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0087] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0088] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0089] According to one embodiment, the electronic device (101) may include camera holes (312, 313, 319). A plurality of camera holes (312, 313, 319) may be arranged spaced apart from each other. The camera assembly (307) may receive light passing through the camera holes (312, 313, 319).

[0090] In one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be disposed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward the printed circuit board (340). The battery (350) may include a battery connection member (3501) connecting the terrace (353) and the printed circuit board (340).

[0091] According to one embodiment, the electronic device (101) may include a port insertion opening (308). The port insertion opening (308) may be opened in a portion of the housing (301). The port insertion opening (308) may be in communication with an external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, a charging cable, etc.), and the external device may be inserted into the port insertion opening (308).

[0092] According to one embodiment, the electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the port insertion opening (308).

[0093] Fig. 6 is a drawing showing the body (410) of the support member (400) in a separated state. Fig. 7 is a drawing showing the frame (420) of the support member (400) in a separated state. Fig. 8 is a drawing of the support member (400) in a state where the body (410) and the frame (420) are assembled. Fig. 9 is a drawing showing the body (410) and the frame (420) placed on a jig (500). The components described with reference to Figs. 6 to 9 may be partly or entirely the same as the components described with reference to Figs. 1 to 5. The components described with reference to Figs. 6 to 9 may be partly or entirely the same as the components described with reference to Figs. 10 to 20.

[0094] According to one embodiment, the electronic device (101) may include a support member (400). The description of the support member (400) may be identical to the description of the support member (311) described with reference to FIGS. 1 to 5 . For example, the support member (400) may be disposed within a housing (e.g., the housing (301) of FIGS. 4 and 5 ). The support member (400) may form a portion of the surface of the housing (301).

[0095] According to one embodiment, the support member (400) may include a body (410). The body (410) may have at least a portion of a flat plate shape. Components (e.g., substrates (340a, 340b, 340c) and battery (350) of FIGS. 4 and 5) disposed inside a housing (e.g., housing (301) of FIGS. 4 and 5) may be disposed in the body (410). The body (410) may include a metal material. For example, the body (410) may include an aluminum material. The body (410) may include a first material.

[0096] In one embodiment, the body (410) may include a plate (411) and a body edge (412). At least a portion of the plate (411) may be flat. The body edge (412) may extend along the perimeter of the plate (411). The plate (411) and the body edge (412) may be integral.

[0097] In one embodiment, the body edge (412) may include a peripheral wall (4121). The peripheral wall (4121) may extend along the peripheral direction of the plate (411). The peripheral wall (4121) may form an outer surface of the body (410). The peripheral wall (4121) may be referred to as a "first facing portion." The peripheral wall (4121) may be referred to as a "first body portion."

[0098] According to one embodiment, the peripheral wall (4121) may include a first peripheral wall (4121a), a second peripheral wall (4121b), a third peripheral wall (4121c), and a fourth peripheral wall (4121d). The first peripheral wall (4121a) and the second peripheral wall (4121b) may be spaced apart from each other. The third peripheral wall (4121c) and the fourth peripheral wall (4121d) may be spaced apart from each other. The plate (411) may be disposed between the first peripheral wall (4121a) and the second peripheral wall (4121b), and may connect the first peripheral wall (4121a) and the second peripheral wall (4121b). The plate (411) can be placed between the third peripheral wall (4121c) and the fourth peripheral wall (4121d), and can connect the third peripheral wall (4121c) and the fourth peripheral wall (4121d). The plate (411), the first peripheral wall (4121a), the second peripheral wall (4121b), the third peripheral wall (4121c), and the fourth peripheral wall (4121d) can be integral.

[0099] In one embodiment, the body edge (412) may include a first curved portion (4122). The first curved portion (4122) may extend along the circumference of the plate (411). The first curved portion (4122) may form an outer surface of the body (410). The first curved portion (4122) may extend in a curved manner. The first curved portion (4122) may be referred to as a “body corner portion.” The first curved portion (4122) may be referred to as a “second body portion.”

[0100] According to one embodiment, the first curved portion (4122) may include a first-first curved portion (4122a), a first-second curved portion (4122b), a first-third curved portion (4122c), and a first-fourth curved portion (4122d). Each of the first-first curved portion (4122a), the first-second curved portion (4122b), the first-third curved portion (4122c), and the first-fourth curved portion (4122d) may form a corner portion of the body (410). The first-first curved portion (4122a) may connect the first peripheral wall (4121a) and the third peripheral wall (4121c). The first-second curved portion (4122b) may connect the second peripheral wall (4121b) and the third peripheral wall (4121c). The first-third curved portion (4122c) can connect the first peripheral wall (4121a) and the fourth peripheral wall (4121d). The first-fourth curved portion (4122d) can connect the second peripheral wall (4121b) and the fourth peripheral wall (4121d). The plate (411), the first-first curved portion (4121a), the first-second curved portion (4121b), the first-third curved portion (4121c), and the first-fourth curved portion (4121d) can be integral.

[0101] According to one embodiment, the support member (400) may include a frame (420). The frame (420) may be arranged to surround the body (410). The frame (420) may be coupled to the body (410). The frame (420) may include a metal material. For example, the frame (420) may include a titanium material. The frame (420) may include a second material different from the first material of the body (410). The thermal expansion coefficient of the first material may be greater than the thermal expansion coefficient of the second material. As an example, the body (410) may be located inside the electronic device (101), and the frame (420) may include an outer surface exposed to the outside of the electronic device (101).

[0102] According to one embodiment, the frame (420) may include a receiving portion (421). The body (410) may be disposed in the receiving portion (421). The frame (420) may include a frame body (422). The frame body (422) may be disposed to surround the body (410). The receiving portion (421) may be a space formed on the inside of the frame body (422). The body (410) may be surrounded by the frame body (422).

[0103] According to one embodiment, the frame body (422) may include a frame wall (4221). The frame wall (4221) may be arranged to surround at least a portion of the body (410). The frame wall (4221) may be arranged to correspond to the peripheral wall (4121) of the body (410). The frame wall (4221) may face the peripheral wall (4121) of the body (410). The frame wall (4221) may be coupled to the peripheral wall (4121) of the body (410).

[0104] In one embodiment, the frame wall (4221) may include a first frame wall (4221a) coupled with a first peripheral wall (4121a). The frame wall (4221) may include a second frame wall (4221b) coupled with a second peripheral wall (4121b). The frame wall (4221) may include a third frame wall (4221c) coupled with a third peripheral wall (4121c). The frame wall (4221) may include a fourth frame wall (4221d) coupled with a fourth peripheral wall (4121d).

[0105] According to one embodiment, the frame body (422) may include a second curved portion (4222). The second curved portion (4222) may be arranged to surround at least a portion of the body (410). The second curved portion (4222) may extend in a curved manner. The second curved portion (4222) may be arranged to correspond to the first curved portion (4122) of the body (410). The second curved portion (4222) may be coupled with the first curved portion (4122) of the body (410). The second curved portion (4222) may be referred to as a “frame corner portion.”

[0106] According to one embodiment, the second curved portion (4222) may include a second-first curved portion (4222a), a second-second curved portion (4222b), a second-third curved portion (4222c), and a second-fourth curved portion (4222d). The second-first curved portion (4222a) may connect the first frame wall (4221a) and the third frame wall (4221c). The second-first curved portion (4222a) may be coupled with the first-first curved portion (4122a). The second-second curved portion (4222b) may connect the second frame wall (4221b) and the third frame wall (4221c). The second-second curved portion (4222b) may be coupled with the first-second curved portion (4122b). The second-third curved portion (4222c) can connect the first frame wall (4221a) and the fourth frame wall (4221d). The second-third curved portion (4222c) can be combined with the first-third curved portion (4122c). The second-fourth curved portion (4222d) can connect the second frame wall (4221b) and the fourth frame wall (4221d). The second-fourth curved portion (4222d) can be combined with the first-fourth curved portion (4122d).

[0107] According to one embodiment, the support member (400) may include a body (410) and a frame (420). The support member (400) may be formed by combining the body (410) and the frame (420). The body (410) and the frame (420) may be combined by a thermal expansion bonding method. The body (410) and the frame (420) may be joined by heat.

[0108] In one embodiment, the body (410) and the frame (420) may be joined by a thermal expansion bonding method. The body (410) may be configured to thermally expand toward the frame (420). At least a portion of the body (410) may be thermally expanded toward the frame (420) and joined to the frame (420). The "thermal expansion" may include an operation in which one component is deformed toward another component due to heat. For example, the body (410) may expand toward the frame (420) by undergoing a phase change (e.g., melting) due to heat. For example, the body (410) may include a material having a coefficient of thermal expansion and may expand toward the frame (420) due to heat. The body (410) may deform toward the frame (420) due to heat. The "deformation" may include the "thermal expansion". The "deformation" may include a phase change.

[0109] According to one embodiment, the support member (400) may include a joint portion (403). The joint portion (403) may be a portion where the body (410) and the frame (420) are joined. The joint portion (403) may be a portion where the body (410) and the frame (420) are joined to each other by heat. The joint portion (403) may extend along the periphery of the support member (400). The joint portion (403) may be formed at a portion where the body (410) and the frame (420) are in contact.

[0110] According to one embodiment, the joint portion (403) may include a first joint portion (401) and a second joint portion (402). The first joint portion (401) may be formed by joining the peripheral wall (4121) and the frame wall (4221). The second joint portion (402) may be formed by joining the first curved portion (4122) and the second curved portion (4222).

[0111] According to one embodiment, the first joint portion (401) may include a first-first joint portion (401a) formed by joining the first peripheral wall (4121a) and the first frame wall (4221a). The first joint portion (401) may include a first-second joint portion (401b) formed by joining the second peripheral wall (4121b) and the second frame wall (4221b). The first joint portion (401) may include a first-third joint portion (401c) formed by joining the third peripheral wall (4121c) and the third frame wall (4221c). The first joint portion (401) may include a first-fourth joint portion (401d) formed by joining the fourth peripheral wall (4121d) and the fourth frame wall (4121d).

[0112] According to one embodiment, the second joint portion (402) may include a second-first joint portion (402a) formed by joining the first-first curved portion (4122a) and the second-first curved portion (4222a). The second joint portion (402) may include a second-second joint portion (402b) formed by joining the first-second curved portion (4122b) and the second-second curved portion (4222b). The second joint portion (402) may include a second-third joint portion (402c) formed by joining the first-third curved portion (4122c) and the second-third curved portion (4222c). The second joint portion (402) may include a second-fourth joint portion (402d) formed by joining the first-fourth curved portion (4122d) and the second-fourth curved portion (4222d).

[0113] According to one embodiment, during the manufacturing process of the support member (400), a jig (500) may surround the support member (400). The jig (500) may be arranged to surround a frame (420). The body (410) and the frame (420) may be coupled to each other on the inside of the jig (500).

[0114] FIG. 10 is a drawing illustrating a manufacturing process of a support member (400) according to one embodiment of the present disclosure. The components described with reference to FIG. 10 may be partially or entirely identical to the components described with reference to FIGS. 1 to 9. The components described with reference to FIG. 10 may be partially or entirely identical to the components described with reference to FIGS. 11 to 20.

[0115] According to one embodiment, the support member (400) can be manufactured by a manufacturing device (600). The manufacturing device (600) can include a first manufacturing device (610) and a second manufacturing device (620). The first manufacturing device (610) can heat the body (410) and the frame (420). The second manufacturing device (610) can cool the heated body (410) and the frame (420).

[0116] According to one embodiment, the manufacturing method (603) of the support member (400) may include a heating process (601) and a cooling process (602). The heating process (601) may be performed within a first manufacturing device (610). The cooling process (602) may be performed within a second manufacturing device (620). The cooling process (602) may be performed after the heating process (601).

[0117] According to one embodiment, the method (603) for manufacturing the support member (400) may include a thermal expansion process (601a). For example, the heating process (601) may include a plurality of heating processes (S1 to S10), and the thermal expansion process (601a) may be a part of the plurality of heating processes (S1 to S10). The thermal expansion process (601a) may include at least one melting step (e.g., S3) that heats the body (410) to a temperature higher than the melting point of the body (410). For example, the body (410) may include aluminum, and the thermal expansion process (601a) may include a melting step (S3) that heats the body (410) to 660 degrees Celsius or higher. The melting step (S3) may be referred to as a “semi-melting step.” For example, the body (410) may include a portion that is melted and a remaining portion that is not melted in the semi-molten step (S3). In the semi-molten step (S3), the body (410) may be heated at a temperature of 650 to 670 degrees Celsius.

[0118] Fig. 11 is a cross-sectional view taken along the line A-A' shown in Fig. 9. Fig. 12 is a cross-sectional view taken along the line B-B' shown in Fig. 9. Fig. 13 is an enlarged view of area C shown in Fig. 9. The components described with reference to Figs. 11 to 13 may be partly or entirely the same as the components described with reference to Figs. 1 to 10. The components described with reference to Figs. 11 to 13 may be partly or entirely the same as the components described with reference to Figs. 14 to 20.

[0119] In one embodiment, the support member (400) can be manufactured on the inside of the jig (500). The body (410) and the frame (420) can be arranged on the inside of the jig (500) and can be heated on the inside of the jig (500). The frame (420) can be arranged to surround the body (410). The jig (500) can be arranged to surround the frame (420). The jig (500) can press the body (410) and the frame (420) toward the center of the jig (500).

[0120] In one embodiment, the jig (500) may include a lower jig (510) and an upper jig (520). The upper jig (520) may be positioned above the lower jig (510). The lower jig (510) may support the upper jig (520). The lower jig (510) and the upper jig (520) may include different materials.

[0121] According to one embodiment, the upper jig (520) may include a jig wall (521) and a jig mounting portion (522). The jig wall (521) may be arranged to surround the frame (420). The jig mounting portion (522) may protrude from the jig wall (521) toward the inside of the jig (500). The body (410) and the frame (420) may be mounted on the jig mounting portion (522).

[0122] In one embodiment, the jig (500) may include a press device (530). The press device (530) may move toward the inside of the jig (500). The press device (530) may press the body (410). The press device (530) may be inserted into the inside of the upper jig (520) to press the body (410). The press device (530) may include a press body (531) and a press protrusion (532). The press protrusion (532) may protrude from the press body (531). The press protrusion (532) may be inserted into at least a portion of the body (410). The jig (500) may include a jig protrusion (533). The jig protrusion (533) may protrude from the upper jig (520). The jig protrusion (533) can be inserted into at least a portion of the body (410).

[0123] According to one embodiment, a gap (D1, D2) may be formed between the jig (500) and the support member (400). For example, a gap (D1, D2) may be formed between the jig (500) and the frame (420). The gap (D1) between the jig (500) and the frame (420) in the first direction may be in the range of 0.1 mm to 0.2 mm. The gap (D2) between the jig (500) and the frame (420) in the second direction may be in the range of 0.1 mm to 0.15 mm.

[0124] Fig. 14 is a part of a cross-sectional view taken along the A-A' reference line of Fig. 9. Fig. 15 is an enlarged view of a part of the structure of Fig. 14. The components described with reference to Figs. 14 and 15 may be partly or entirely identical to the components described with reference to Figs. 1 to 13. The components described with reference to Figs. 14 and 15 may be partly or entirely identical to the components described with reference to Figs. 16 to 20.

[0125] According to one embodiment, the body (410) may include a plate (411) and a body edge (412). The description of the plate (411) and the body edge (412) may be identical to the description of the plate (411) and the body edge (412) described with reference to FIGS. 6 to 9.

[0126] According to one embodiment, the plate (411) may include a first plate portion (4111) and a second plate portion (4112). The first plate portion (4111) may be mounted on the upper jig (520). The second plate portion (4112) may extend from the first plate portion (4111) toward the frame (420). The second plate portion (4112) may connect the first plate portion (4111) and the body edge (412).

[0127] According to one embodiment, the plate (411) may include a plurality of grooves (4113, 4114, 4115). The plurality of grooves (4113, 4114, 4115) may be formed by being sunken into the first plate portion (4111) or the second plate portion (4112). For example, the plurality of grooves (4113, 4114, 4115) may include a first groove (4113) sunken into the first plate portion (4111). For example, the plurality of grooves (4113, 4114, 4115) may include a second groove (4114) sunken into the second plate portion (4112). For example, a plurality of grooves (4113, 4114, 4115) may be sunken into the second plate portion (4112) and may include a third groove (4115) facing the upper jig (520).

[0128] According to one embodiment, the frame (420) may include a first frame portion (423), a second frame portion (424), and a third frame portion (425). The first frame portion (423) may be positioned between the body edge (412) and the jig (500). The second frame portion (424) may protrude inwardly from the first frame portion (423) of the jig (500). The third frame portion (425) may protrude inwardly from the first frame portion (423) of the jig (500). The second frame portion (424) and the third frame portion (425) may be spaced apart from each other. The body edge (412) may be positioned between the second frame portion (424) and the third frame portion (425).

[0129] According to one embodiment, the body edge (412) may include a first surface (412a), a second surface (412b), and a third surface (412c). The first surface (412a) may face the first frame portion (423). The first surface (412a) may be thermally expandable toward the first frame portion (423). The first surface (412a) may be joined to the first frame portion (423). The second surface (412b) may face the second frame portion (424). The second surface (412b) may be thermally expandable toward the second frame portion (424). The second surface (412b) may be joined to the second frame portion (424). The third surface (412c) may be joined to the third frame portion (425). The third surface (412c) can be thermally expanded toward the third frame portion (425). The third surface (412c) can be joined to the third frame portion (425).

[0130] According to one embodiment, the second frame portion (424) may include a first recess (424a). The first recess (424a) may be recessed in a direction away from the body edge (412). The first recess (424a) may be formed to be inclined. The first recess (424a) may be inclined with respect to the direction in which the body (410) and the frame (420) are arranged. The direction in which the body (410) and the frame (420) are arranged may be defined as a “direction in which the body (410) is thermally expanded.” The first recess (424a) may be inclined so as to be away from the body edge (412) as it moves toward the jig (500). The first recess (424a) may have an inclination angle (θ1) with respect to the direction in which the body (410) and the frame (420) are arranged.

[0131] According to one embodiment, the third frame portion (425) may include a second recess (425a). The second recess (425a) may be recessed in a direction away from the body edge (412). The second recess (425a) may be formed to be inclined. The second recess (425a) may be inclined with respect to the direction in which the body (410) and the frame (420) are arranged. The second recess (425a) may be inclined so as to be away from the body edge (412) as it moves toward the jig (500). The second recess (425a) may have an inclination angle (θ2) with respect to the direction in which the body (410) and the frame (420) are arranged.

[0132] According to one embodiment, the second groove (4114) may include a groove surface (4114a). The groove surface (4114a) may be inclined with respect to the direction in which the body (410) and the frame (420) are arranged. The press protrusion (532) may be inserted into the second groove (4114). The press protrusion (532) may include a protrusion surface (532a) that contacts the groove surface (4114a). When the press device (530) is pressed (P) toward the body (410), the press protrusion (532) may be inserted into the inside of the second groove (4114). The press protrusion (532) may push the groove surface (4114a) in the first direction (F1). The jig protrusion (533) can be inserted into the third groove (4115). The jig protrusion (533) can have the same shape as the press protrusion (532). The jig protrusion (533) can push a part of the body (410) in the first direction (F1) in the same way as the press protrusion (532). The body (410) can be pushed in the first direction (F1) toward the frame (420), and the jig (500) can push the frame (420) in the second direction (F2) opposite to the first direction (F1). The jig (500) can fix the positions of the body (410) and the frame (420). The body (410) can be supplied with heat while its position is fixed. The body edge (412) can be thermally expanded in a third direction (F3) toward the recess (424a, 425a).

[0133] According to one embodiment, the first surface (412a) of the body edge (412) can be thermally expanded toward the first frame portion (423). The first surface (412a) can be thermally bonded to the first frame portion (423).

[0134] According to one embodiment, the second surface (412b) of the body edge (412) can be thermally expanded toward the second frame portion (424). The second surface (412b) can be thermally expanded toward the first recess (424a) and can be thermally bonded to the first recess (424a). The second surface (412b) can be thermally expanded into a shape corresponding to the first recess (424a). The second surface (412b) can have an inclination angle (θ3) with respect to the horizontal direction. The first inclination angle (θ1) and the third inclination angle (θ3) can be substantially the same.

[0135] According to one embodiment, the third surface (412c) of the body edge (412) can be thermally expanded toward the third frame portion (425). The third surface (412c) can be thermally expanded toward the second recess (425a) and can be thermally bonded to the second recess (425a). The third surface (412c) can be thermally expanded into a shape corresponding to the second recess (425a). The third surface (412c) can have an inclination angle (θ4) with respect to the horizontal direction. The second inclination angle (θ2) and the fourth inclination angle (θ4) can be substantially the same.

[0136] Fig. 16 is a drawing illustrating a portion of the manufacturing process of the support member (400). The components described with reference to Fig. 16 may be partially or entirely identical to the components described with reference to Figs. 1 to 15. The components described with reference to Fig. 16 may be partially or entirely identical to the components described with reference to Figs. 17 to 20.

[0137] According to one embodiment, the body (410) and the frame (420) can be heated and cooled while being placed inside the jig (500). The jig (500) can fix the positions of the body (410) and the frame (420). When the body (410) and the frame (420) are heated, the body (410) and the frame (420) can be subjected to pressure in a direction (E) toward the jig (500). When the body (410) and the frame (420) are heated, the jig (500) can apply force in a direction (F) toward the inside of the support member (400) toward the body (410) and the frame (420). When the body (410) and the frame (420) are heated, the jig (500) can support the body (410) and the frame (420) by applying a force in a direction (F) opposite to the direction (E) of the pressure applied to the body (410) and the frame (420). The body (410) and the frame (420) can undergo a cooling process (e.g., a cooling process (602) of FIG. 10) after the heating process (e.g., a heating process (601) of FIG. 10). The body (410) and the frame (420) can have their bonding force weakened during the cooling process (602). The jig (500) can reduce the weakening of the bonding force between the body (410) and the frame (420) by applying a force (F) to bring the body (410) and the frame (420) into close contact with each other during the cooling process (602). The magnitude of the force (F) that the jig (500) applies to the body (410) and the frame (420) during the cooling process (602) may decrease as the body (410) and the frame (420) are cooled. For example, the magnitude of the first force (F) that the jig (500) applies to the body (410) and the frame (420) when the cooling process (602) begins may be greater than the magnitude of the second force (F) that the jig (500) applies to the body (410) and the frame (420) when the cooling process (602) ends.

[0138] Fig. 17 is a drawing of a body (410). Fig. 18 is a cross-sectional view taken along the D-D' reference line illustrated in Fig. 17. The components described with reference to Figs. 17 and 18 may be partially or entirely identical to the components described with reference to Figs. 1 to 16. The components described with reference to Figs. 17 and 18 may be partially or entirely identical to the components described with reference to Figs. 19 and 20.

[0139] According to one embodiment, the body (410) may include a plurality of grooves (413). The plurality of grooves (413) may be formed by being sunken into the plate (411) and the body edge (412). The description of the plurality of grooves (413) may be identical to the description of the plurality of grooves (4113, 4114, 4115) described with reference to FIGS. 14 and 15.

[0140] According to one embodiment, the body (410) may include a plurality of buffer regions (414). Each of the plurality of buffer regions (414) may be located in an area where each of the plurality of grooves (413) is formed. For example, the plurality of buffer regions (414) may include first, second, third, and fourth buffer regions (414a, 414b, 414c, 414d) spaced apart from each other along the extension direction of the body (410). The thickness of the body (410) may decrease in the plurality of buffer regions (414a, 414b, 414c, 414d). The body (410) may be thermally expanded in the direction (E1, E2) in which the body (410) extends due to heat. In the cooling process (e.g., the cooling process (602) of FIG. 10), the plurality of buffer regions (414) can reduce the phenomenon of the body edge (412) shrinking toward the center of the body (410). In the cooling process (602), the plurality of buffer regions (414) can reduce the phenomenon of the bonding force between the body edge (412) and the frame (420) being weakened.

[0141] Fig. 19 is an enlarged view of a joint portion (403) between a body (410) and a frame (420) of a support member (400) according to an embodiment of the present disclosure. Fig. 20 is an enlarged view of a joint portion (903) between a body (910) and a frame (920) according to a prior art. The components described with reference to Figs. 19 and 20 may be partially or entirely the same as the components described with reference to Figs. 1 to 18.

[0142] Referring to FIG. 19, it can be confirmed that the support member (400) according to the embodiment of the present disclosure forms a joint portion (403) through a thermal expansion process between the body (410) and the frame (420).

[0143] Referring to FIG. 20, since the body (910) and the frame (920) according to the prior art are joined by welding, a defect may occur due to weakening of the joining force between the body (910) and the frame (920) at the joining surface (903a, 903b).

[0144] Electronic devices include a housing and a supporting member that accommodates the components placed within the housing. The supporting member is manufactured by joining components of different materials. Joining components of different materials by welding or thermal diffusion bonding increases the risk of damage at the joint.

[0145] The problem to be solved in the present disclosure may be to facilitate the manufacture of a support member having heterogeneous materials.

[0146] The problem to be solved in the present disclosure may be to strengthen the bonding strength at the bonding surface of dissimilar materials.

[0147] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0148] An electronic device according to various embodiments of the present disclosure can facilitate the manufacturing of a support member by manufacturing the support member while fixing the position of the support member through a jig.

[0149] Electronic devices according to various embodiments of the present disclosure can strengthen the bonding strength between components at the joint by joining dissimilar materials using a thermal expansion method.

[0150] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0151] An electronic device (e.g., 101 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a housing (e.g., 301 of FIGS. 1 to 20) including a support member (e.g., 400 of FIGS. 1 to 20).

[0152] The support member (e.g., 400 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a body (e.g., 410 of FIGS. 1 to 20) having a first curved portion (e.g., 4122 of FIGS. 1 to 20) including a first material.

[0153] The support member (e.g., 400 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a frame (e.g., 420 of FIGS. 1 to 20) including a second material different from the first material and having a second curved portion (e.g., 4222 of FIGS. 1 to 20) surrounding the first curved portion (e.g., 4122 of FIGS. 1 to 20).

[0154] According to one embodiment of the present disclosure, the first curved portion (e.g., 4122 of FIGS. 1 to 20 ) is configured to thermally expand toward the second curved portion (e.g., 4222 of FIGS. 1 to 20 ), and the support member (e.g., 400 of FIGS. 1 to 20 ) may include a joint portion (e.g., 403 of FIGS. 1 to 20 ) between the first curved portion (e.g., 4122 of FIGS. 1 to 20 ) and the second curved portion (e.g., 4222 of FIGS. 1 to 20 ).

[0155] According to one embodiment of the present disclosure, the first curved portion (e.g., 4122 of FIGS. 1 to 20 ) may include a plurality of first curved portions (e.g., 4122a, 4122b, 4122c, 4122d of FIGS. 1 to 20 ) spaced apart from each other, and the second curved portion (e.g., 4222 of FIGS. 1 to 20 ) may include a plurality of second curved portions (e.g., 4222a, 4222b, 4222c, 4222d of FIGS. 1 to 20 ) spaced apart from each other.

[0156] The body (e.g., 410 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a peripheral wall (e.g., 4121 of FIGS. 1 to 20) connecting the plurality of first curved portions (e.g., 4122a, 4122b, 4122c, 4122d of FIGS. 1 to 20).

[0157] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a frame wall (e.g., 4221 of FIGS. 1 to 20) configured to connect the plurality of second curved portions (e.g., 4222a, 4222b, 4222c, 4222d of FIGS. 1 to 20) and be joined to the peripheral wall (e.g., 4121 of FIGS. 1 to 20).

[0158] According to one embodiment of the present disclosure, the frame (e.g., 420 of FIGS. 1 to 20) may be arranged to surround the body (e.g., 410 of FIGS. 1 to 20), and the entire circumference of the body (e.g., 410 of FIGS. 1 to 20) may be configured to be joined to the frame (e.g., 420 of FIGS. 1 to 20).

[0159] When heat is applied to the body (e.g., 410 of FIGS. 1 to 20) according to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) and the frame (e.g., 420 of FIGS. 1 to 20) can be fixed in position inside a jig (e.g., 500 of FIGS. 1 to 20).

[0160] The body (e.g., 410 of FIGS. 1 to 20) according to one embodiment of the present disclosure may be configured to be heated and thermally expanded toward the frame (e.g., 420 of FIGS. 1 to 20), and then cooled.

[0161] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a recess (e.g., 424a, 425a of FIGS. 1 to 20) inclined with respect to the direction in which the body (e.g., 410 of FIGS. 1 to 20) is thermally expanded.

[0162] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) may include a plurality of grooves (e.g., 414 of FIGS. 1 to 20) spaced apart from each other in the direction in which the body (e.g., 410 of FIGS. 1 to 20) thermally expands.

[0163] The body (e.g., 410 of FIGS. 1 to 20) according to one embodiment of the present disclosure is configured such that at least a part of a press device (e.g., 530 of FIGS. 1 to 20) that presses the body (e.g., 410 of FIGS. 1 to 20) is inserted therein, and the body (e.g., 410 of FIGS. 1 to 20) may include a groove (e.g., 4114 of FIGS. 1 to 20) that includes a groove surface (e.g., 4114a of FIGS. 1 to 20) that is inclined with respect to the direction in which the body is thermally expanded.

[0164] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a first frame portion (e.g., 423 of FIGS. 1 to 20) facing the body (e.g., 410 of FIGS. 1 to 20).

[0165] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a second frame portion (e.g., 424 of FIGS. 1 to 20) protruding from the first frame portion (e.g., 423 of FIGS. 1 to 20) to cover at least a portion of the body (e.g., 410 of FIGS. 1 to 20).

[0166] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a third frame portion (e.g., 425 of FIGS. 1 to 20) that protrudes from the first frame portion (e.g., 423 of FIGS. 1 to 20) to cover at least a portion of the body (e.g., 410 of FIGS. 1 to 20) and is spaced apart from the second frame portion (e.g., 424 of FIGS. 1 to 20).

[0167] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) may include an aluminum material, and the frame (e.g., 420 of FIGS. 1 to 20) may include a titanium material.

[0168] The support member (e.g., 400 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a body (e.g., 410 of FIGS. 1 to 20) including a first material.

[0169] The support member (e.g., 400 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a frame (e.g., 420 of FIGS. 1 to 20) arranged to surround at least a portion of the body (e.g., 410 of FIGS. 1 to 20) and including a second material different from the first material.

[0170] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) is configured to thermally expand toward the frame (e.g., 420 of FIGS. 1 to 20) by heat, and the frame (e.g., 420 of FIGS. 1 to 20) may include a recess (e.g., 424a, 425a of FIGS. 1 to 20) configured to insert at least a portion of the body (e.g., 410 of FIGS. 1 to 20).

[0171] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a first frame portion (e.g., 424 of FIGS. 1 to 20) facing the body (e.g., 410 of FIGS. 1 to 20).

[0172] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a second frame portion (e.g., 425 of FIGS. 1 to 20) that protrudes from the first frame portion (e.g., 424 of FIGS. 1 to 20) and has the recess (e.g., 424a, 425a of FIGS. 1 to 20) formed therein.

[0173] According to one embodiment of the present disclosure, the recess (e.g., 424a, 425a of FIGS. 1 to 20) may be inclined with respect to the direction in which the body (e.g., 410 of FIGS. 1 to 20) is thermally expanded.

[0174] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) may be configured to thermally expand toward the recess (e.g., 424a, 425a of FIGS. 1 to 20) and be inclined with respect to the direction in which the body (e.g., 410 of FIGS. 1 to 20) and the frame (e.g., 420 of FIGS. 1 to 20) are arranged.

[0175] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) includes a body edge (e.g., 412 of FIGS. 1 to 20) at least partially covered by the frame (e.g., 420 of FIGS. 1 to 20), and the recess (e.g., 424a, 425a of FIGS. 1 to 20) can face the body edge (e.g., 412 of FIGS. 1 to 20).

[0176] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a first process of placing a body (e.g., 410 of FIGS. 1 to 20) including a first material.

[0177] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a second process of arranging a frame (e.g., 420 of FIGS. 1 to 20) including a second material different from the first material to surround the body (e.g., 410 of FIGS. 1 to 20).

[0178] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a third process of arranging a jig (e.g., 500 of FIGS. 1 to 20) surrounding the frame (e.g., 420 of FIGS. 1 to 20).

[0179] A method for manufacturing an electronic device according to one embodiment of the present disclosure may include a fourth process of applying heat to the body (e.g., 410 of FIGS. 1 to 20) while the body (410) and the frame (420) are fixed in position by a jig (500).

[0180] In the fourth process according to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) may be thermally expanded toward the frame (e.g., 420 of FIGS. 1 to 20).

[0181] In the fourth process according to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) and the frame (e.g., 420 of FIGS. 1 to 20) can be fixed in position by a jig (e.g., 500 of FIGS. 1 to 20).

[0182] In the fourth process according to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) and the frame (e.g., 420 of FIGS. 1 to 20) may be configured to be joined by heat.

[0183] The frame (e.g., 420 of FIGS. 1 to 20) according to one embodiment of the present disclosure may include a recess (e.g., 424a, 425a of FIGS. 1 to 20) configured to be inserted at least a portion of the body (e.g., 410 of FIGS. 1 to 20).

[0184] According to one embodiment of the present disclosure, the coefficient of thermal expansion of the first material may be greater than the coefficient of thermal expansion of the second material.

[0185] According to one embodiment of the present disclosure, the body (e.g., 410 of FIGS. 1 to 20) may be located inside the electronic device (e.g., 101 of FIGS. 1 to 20), and the frame (e.g., 420 of FIGS. 1 to 20) may include an outer surface exposed to the outside of the electronic device (e.g., 101 of FIGS. 1 to 20).

[0186] According to one embodiment of the present disclosure, in the fourth process, at least a portion of the body (e.g., 410 of FIGS. 1 to 20) may be inserted into a recess (e.g., 424a, 425a of FIGS. 1 to 20) of the frame (e.g., 420 of FIGS. 1 to 20) and joined to the recess (e.g., 424a, 425a of FIGS. 1 to 20) by heat.

[0187] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0188] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101), It includes a housing (301) including a support member (400), The above support member (400) is A body (410) having a first curved portion (4122) including a first material; and A frame (420) comprising a second material different from the first material and having a second curved portion (4222) surrounding the first curved portion (4122), An electronic device in which the first curved portion (4122) is configured to thermally expand toward the second curved portion (4222), and the support member (400) includes a joint portion (403) between the first curved portion (4122) and the second curved portion (4222).

2. In paragraph 1, The first curved portion (4122) includes a plurality of first curved portions (4122a, 4122b, 4122c, 4122c) spaced apart from each other, and the second curved portion (4222) includes a plurality of second curved portions (4222a, 4222b, 4222c, 4222d) spaced apart from each other. The above body (410) is, It includes a peripheral wall (4121) connecting the plurality of first curved portions (4122a, 4122b, 4122c, 4122d), The above frame (420) is An electronic device including a frame wall (4221) configured to connect the plurality of second curved portions (4222a, 4222b, 4222c, 4222d) and be joined to the peripheral wall (4121).

3. In paragraph 1 or 2, An electronic device in which the frame (420) is arranged to surround the body (410), and the entire circumference of the body (410) is configured to be joined to the frame (420).

4. In any one of paragraphs 1 to 3, An electronic device in which, when heat is applied to the body (410), the body (410) and the frame (420) are fixed in position on the inside of the jig (500).

5. In any one of paragraphs 1 to 4, The above body (410) is, An electronic device configured to be cooled after being heated and thermally expanded toward the frame (420).

6. In any one of paragraphs 1 to 5, The above frame (420) is An electronic device comprising a recess (424a, 425a) inclined with respect to the direction in which the body (410) is thermally expanded.

7. In any one of paragraphs 1 to 6, The above body (410) is, An electronic device comprising a plurality of grooves (414) spaced apart from each other in the direction of thermal expansion of the body (410).

8. In any one of paragraphs 1 to 7, The above body (410) is, An electronic device configured such that at least a portion of a press device (530) for pressing the body (410) is inserted therein, and including a groove (4114) including a groove surface (4114a) inclined with respect to the direction in which the body (410) is thermally expanded.

9. In any one of paragraphs 1 to 8, The above frame (420) is A first frame portion (423) facing the above body (410); A second frame portion (424) protruding from the first frame portion (423) to cover at least a portion of the body (410); and An electronic device including a third frame portion (425) protruding from the first frame portion (423) to cover at least a portion of the body (410) and spaced apart from the second frame portion (424).

10. In any one of paragraphs 1 to 9, An electronic device in which the body (410) comprises aluminum material and the frame (420) comprises titanium material.

11. In any one of paragraphs 1 to 10, An electronic device in which the coefficient of thermal expansion of the first material is greater than the coefficient of thermal expansion of the second material.

12. In any one of paragraphs 1 to 11, An electronic device in which the body (410) is located inside the electronic device (101), and the frame (420) includes an outer surface exposed to the outside of the electronic device (101).

13. In paragraph 6, The above body (410) is, An electronic device comprising a body edge (412) at least partially covered by the frame (420), wherein the recess (424a, 425a) faces the body edge (412) and is at least partially joined to the body edge (412).

14. In a method for manufacturing an electronic device, A first process of placing a body (410) including a first material; A second process of arranging a frame (420) including a second material different from the first material to surround the body (410); A third process of placing a jig (500) surrounding the above frame (420); and A method for manufacturing an electronic device, including a fourth process of applying heat to the body (410) so that the body (410) thermally expands toward the frame (420) while the body (410) and the frame (420) are fixed in position by a jig (500).

15. In paragraph 14, A method for manufacturing an electronic device in which, in the fourth process, at least a part of the body (410) is inserted into a recess (424a, 425a) of the frame (420) and joined to the recess (424a, 425a) by heat.

Images