Mounting device and mounting method

Abstract

This mounting device for mounting a component by moving a head having a component collection member includes: an upper surface imaging unit for capturing an upper surface image of a specific component having a predetermined feature part formed on the upper surface thereof; a lower surface imaging unit for capturing a lower surface image of the specific component collected by the collection member; and a control unit for recognizing, from the upper surface image, the position of the feature part with respect to the position of the outer shape of the specific component, recognizing the position of the outer shape of the specific component from the lower surface image, calculating a deviation of the collection position with respect to the position of the feature part using the position of the feature part with respect to the position of the outer shape of the specific component recognized from the upper surface image, the position of the outer shape of the specific component recognized from the lower surface image, and an outer shape correction value of the specific component, and moving the head to a mounting position obtained by correcting the deviation to mount the specific component.

Description

Mounting device and mounting method

[0001] This specification discloses a mounting apparatus and a mounting method.

[0002] Conventionally, a mounting device has been proposed that recognizes the positions of characteristic features, such as light-emitting features, formed on the top surface of a component, and then picks up the component using a picking member of a head and mounts it (see, for example, Patent Document 1). In this mounting device, the positions of the characteristic features relative to the position of the component's outline are recognized based on a top-view image captured of the top surface of the component, and the component is picked up using the picking member. The positions of the component's outline are recognized based on a bottom-view image captured of the bottom surface of the component picked up by the picking member. The positions of the characteristic features on the top surface of the component picked up by the picking member are then identified based on the positions of the outline recognized from the bottom-view image and the positions of the characteristic features relative to the positions of the outline recognized from the top-view image, and the component is mounted based on the identified positions of the characteristic features.

[0003] Patent No. 6263028

[0004] The mounting device described above can deal with component misalignment that occurs between capturing an image of the component's top surface and capturing it with the capture member. However, depending on the type of component, the appearance of the component's outer shape may differ between the top-side image and the bottom-side image. In such cases, if the difference in appearance of the component's outer shape is not taken into consideration, the component may not be properly mounted.

[0005] A primary object of the present disclosure is to more appropriately mount components that are mounted using a feature portion on the top surface as a reference.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The mounting device of the present disclosure is a mounting device that mounts components by moving a head having a component collection member, and includes: a top surface imaging unit that captures a top surface image of a specific component having a predetermined characteristic portion formed on its top surface; a bottom surface imaging unit that captures a bottom surface image of the specific component collected by the collection member; and a control unit that recognizes the position of the characteristic portion relative to the position of the outline of the specific component from the top surface image, recognizes the position of the outline of the specific component from the bottom surface image, calculates a deviation of the collection position relative to the position of the characteristic portion using the position of the characteristic portion recognized from the top surface image, the position of the outline of the specific component recognized from the bottom surface image, and an outline correction value of the specific component, and moves the head to a mounting position where the deviation has been corrected to mount the specific component.

[0008] The mounting device of the present disclosure can more appropriately mount components that are mounted using the feature portions on the top surface as a reference.

[0009] 1 is a schematic configuration diagram of a mounting device 10. A block diagram showing a configuration related to control of the mounting device 10 and a management device 30. A flowchart showing an example of a specific component mounting process. An explanatory diagram showing an example of the specific component mounting process. An explanatory diagram showing an example of an upper surface image IMt. An explanatory diagram showing an example of a lower surface image IMb. An explanatory diagram showing an example of a lower surface image IMb. An explanatory diagram showing an example of outer shape correction value information 23a. An explanatory diagram showing an example of an irregular-shaped specific component Ps. An explanatory diagram showing an example of an outer shape correction value A (AX). A flowchart showing an example of an outer shape correction value registration process. A flowchart showing an example of an outer shape correction value registration process.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 is a schematic configuration diagram of a mounting apparatus 10. Fig. 2 is a block diagram showing a configuration related to control of the mounting apparatus 10 and a management apparatus 30. Note that the left-right direction in Fig. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] As shown in FIG. 1, the mounting device 10 includes a tape feeder 11, a substrate transport unit 12, a head 13, a head moving unit 15, a mark camera 17, a parts camera 18, and a control unit 20 (see FIG. 2).

[0012] The tape feeder 11 supplies components to a predetermined supply position by unwinding a tape having multiple recesses in which components are accommodated at predetermined intervals from a reel and feeding the tape backward along the Y-axis direction. The components accommodated in the recesses are protected by a film covering the surface of the tape, and the film is peeled off just before the supply position to expose them. A feeder table 25 is provided at the front of the mounting device 10. The feeder table 25 has multiple slots 25a to which the tape feeders 11 are attached and detached, and multiple connectors 25b corresponding to each slot 25a. The tape feeder 11 is attached to the feeder table 25 by inserting rails (not shown) into the slots 25a and sliding them along the Y-axis direction, electrically connecting the connectors (not shown) to the connectors 25b.

[0013] 1 with a gap therebetween and spanning the X-axis direction, and drives the conveyor belts to transport the substrate S. The substrate transport unit 12 may, for example, have two pairs of conveyor belts and can transport two substrates S simultaneously.

[0014] The head 13 is equipped with one or more nozzles 14 (picking members) that pick up (suck) components using negative pressure. The head 13 is configured, for example, as a rotary head with multiple nozzles 14 mounted so that they can rotate in the circumferential direction, and the nozzles 14 at predetermined rotation positions can be raised and lowered in the Z-axis direction (up and down direction). This head 13 picks up components supplied to a supply position by the tape feeder 11 using the nozzles 14, and mounts them at a mounting position on the board S transported by the board transport unit 12.

[0015] The head moving unit 15 includes an X-axis moving unit 15a that moves the slider to which the head 13 is attached in the X-axis direction, and a Y-axis moving unit 15b that moves the head 13 in the Y-axis direction together with the slider 16 to which the X-axis moving unit 15a is mounted. The head 13 is moved in the X and Y directions by the head moving unit 15 to a position above the supply position or above the mounting position. For example, the X-axis moving unit 15a is configured using a ball screw mechanism, and the Y-axis moving unit 15b is configured using a linear motor.

[0016] Mark camera 17 is disposed on the underside of the slider to which head 13 is attached so as to move in the X and Y directions in accordance with the movement of head 13. Note that mark camera 17 may also be disposed on the underside of head 13. The area below mark camera 17 is an imaging area, and the mark camera 17 captures images of reference marks and the upper surfaces of components attached to board S and outputs the images to control unit 20.

[0017] The parts camera 18 is disposed in front of the board transport unit 12. The parts camera 18 has an imaging range above it, and captures an image of the parts picked up by the nozzle 14 from below, and outputs the image to the control unit 20.

[0018] In this embodiment, the mounting device 10 is divided into two halves, with heads 13L and 13R and head movement units 15L and 15R disposed in each of the two halves. The left-side head 13L and head movement unit 15L are also referred to as the first head and first head movement unit, respectively, and the right-side head 13R and head movement unit 15R are also referred to as the second head and second head movement unit, respectively. Furthermore, part cameras 18L and 18R are disposed in each of the left and right sides of the mounting device 10, and mark cameras 17L and 17R are disposed on the sliders to which the heads 13L and 13R are attached. In the following description, the left and right configurations will not be distinguished from each other unless necessary.

[0019] The control unit 20 is configured as a microprocessor centered around a CPU 21, and includes a ROM 22 that stores processing programs, an HDD 23 as a storage unit that stores various data, a RAM 24 used as a work area, an input / output interface, etc. The storage unit is not limited to the HDD 23 and may be an SSD or the like. The control unit 20 outputs control signals to each tape feeder 11, the substrate transport unit 12, the heads 13 (13L, 13R), the head movement unit 15 (15L, 15R), the mark cameras 17 (17L, 17R), the part cameras 18 (18L, 18R), etc. The control unit 20 also receives inputs of various signals from the tape feeders 11, the substrate transport unit 12, the heads 13, the head movement unit 15, etc., as well as images captured by the mark camera 17 and the part camera 18.

[0020] The management device 30 is, for example, a general-purpose computer. As shown in FIG. 2 , the management device 30 is composed of a CPU 31, a ROM 32, a HDD 33, a RAM 34, and the like. It also includes an input device 35, such as a keyboard and a mouse, and a display 36, such as an LCD. The HDD 33 stores production jobs for the boards S. The production jobs are information that determines which components are to be mounted on the boards S in the mounting device 10, in what order, and how many boards S with such components mounted are to be produced. The production jobs also include information about the components to be mounted, such as the mounting order of the components, mounting position information, and component type information, such as the component shape and whether the component is a normal or specific component. A specific component is, for example, a component that has a specific feature formed on its top surface and requires recognition of the position and shape of the feature (referred to as top-surface recognition). A specific component is, for example, an LED component that has a light-emitting element on its top surface as a feature. On the other hand, a normal component is a component that does not require such top-surface recognition. The management device 30 is communicably connected to the control unit 20 of the mounting device 10, outputs a production job to the control unit 20 to start production, and receives information about the production status from the control unit 20.

[0021] The component mounting process of the mounting device 10 will be described below. When the component to be mounted is a standard component, the control unit 20 first controls the head moving unit 15 to move the head 13 above the supply position of the tape feeder 11 and lower the nozzle 14 to allow the nozzle 14 to pick up (suck) the component supplied to the supply position. The control unit 20 repeatedly moves each nozzle 14 to a predetermined rotation position and causes the nozzle 14 to pick up the component until each nozzle 14 has picked up a component. Next, the control unit 20 controls the head moving unit 15 to move the head 13 above the part camera 18 and controls the part camera 18 to capture an image of the bottom surface of the component picked up by the nozzle 14. Next, the control unit 20 determines the misalignment of the component picked up by the nozzle 14 based on the image of the bottom surface and corrects the target mounting position of the component to eliminate the misalignment. The control unit 20 then controls the head moving unit 15 to move the head 13 above the board S and lower the nozzle 14 to mount the component at the target mounting position on the board S. The control unit 20 repeats the operation of sequentially moving each nozzle 14 to a predetermined rotation position and causing the nozzle 14 to mount the component until the picked component is mounted on each nozzle 14. Furthermore, if the component to be mounted is a specific component, the above-mentioned top surface recognition is performed when the component supplied to the supply position is picked up. The mounting process for a specific component is described below.

[0022] Fig. 3 is a flowchart showing an example of the specific component mounting process. Fig. 4 is an explanatory diagram showing an example of the specific component mounting process. In the specific component mounting process, the control unit 20 first moves the head 13 above the supply position of the tape feeder 11 and causes the mark camera 17 to capture an upper surface image IMt of the specific component Ps supplied to the supply position (S100, Fig. 4(1)). Next, the control unit 20 processes the upper surface image IMt and recognizes the position P2 of the characteristic portion F relative to the position P1 of the outline of the specific component Ps from the upper surface image IMt (S110).

[0023] FIG. 5 is an explanatory diagram showing an example of a top surface image IMt. Because the top surface image IMt is an image of the top surface of a specific part Ps, the characteristic part F is also captured in the image. FIG. 5 illustrates a specific part Ps in which the center position of the characteristic part F is offset from the center position of the specific part Ps in the left-right direction. Note that, in the up-down direction, the center position of the characteristic part F is assumed to be substantially aligned with the center position of the specific part Ps and not offset from it. For example, in the top surface image IMt of FIG. 5 , the control unit 20 detects the region of the outline (outer edge) of the specific part Ps and recognizes the reference position of the lower right corner of that region as position P1. Furthermore, using position P1 as a reference, the control unit 20 recognizes the position (X1, Y1) of the lower right corner of the region of the characteristic part F as position P2. Note that position P1 of the outline of the specific part Ps and position P2 of the characteristic part F are not limited to the lower right corners of their respective regions and may be other positions.

[0024] Next, the control unit 20 sets a collection position (suction position) Pc based on the position P2 of the characteristic portion F recognized in S110 (S120). As shown in FIG. 5, the collection position Pc may be set, for example, at a position (X2, Y2) that is the center of the characteristic portion F, using position P2 as a reference. However, the collection position Pc is not limited to the center of the characteristic portion F, and may be set based on the position P2 of the characteristic portion F. The control unit 20 then moves the head 13 so that the nozzle 14 is positioned above the collection position Pc set in S120, and causes the nozzle 14 to pick up the specific component Ps (S130, FIG. 4(2)). That is, the control unit 20 aligns the center position of the nozzle 14 with the collection position Pc and causes the nozzle 14 to pick up the component.

[0025] After picking up the specific part Ps in this manner, the control unit 20 moves the head 13 above the part camera 18 and causes the part camera 18 to capture an underside image IMb of the specific part Ps picked up by the nozzle 14 (S140, FIG. 4(3)). Next, the control unit 20 processes the captured underside image IMb and recognizes the position P3 of the outline of the specific part Ps from the underside image IMb (S150).

[0026] 6 and 7 are explanatory diagrams showing an example of a bottom surface image IMb. FIG. 6 shows a bottom surface image IMb in which a specific part Ps is collected at a set collection position Pc. FIG. 7 shows a bottom surface image IMb in which a specific part Ps is collected at a position shifted from the set collection position Pc. In FIGS. 6 and 7, the center position of the nozzle 14 (not shown) collecting the specific part Ps is illustrated as the center of the bottom surface image IMb. In other words, the center position of the bottom surface image IMb is the actual collection position. Note that the bottom surface image IMb is an image of the bottom surface of the specific part Ps, and the characteristic part F is not visible, but is shown with a dotted line. For ease of explanation, in FIGS. 6 and 7, the orientation of the specific part Ps in the bottom surface image IMb is shown in the same orientation as in the top surface image IMt.

[0027] Here, between the time when the top surface image IMt is captured by the mark camera 17 and the pick-up position Pc is set, and the time when the head 13 (nozzle 14) moves to the pick-up position Pc and picks up the specific component Ps, the position of the specific component Ps may shift within the tape (recess) of the tape feeder 11. Such position shifts are caused by vibrations of the mounting device 10, for example, vibrations caused when the head 13 moves. In particular, in this embodiment, two heads 13 are provided and moved independently, so position shifts due to vibrations are likely to occur. Figure 7 shows a bottom surface image IMb in the case where the specific component Ps is picked up at a position shifted from the pick-up position Pc due to such position shifts.

[0028] When the specific part Ps is picked at the set picking position Pc, the center position of the nozzle 14 coincides with the picking position Pc, and therefore, as shown in FIG. 6 , the picking position Pc becomes the center of the bottom surface image IMb. The control unit 20 recognizes the reference position of the lower right corner of the outline (outer edge) of the specific part Ps relative to the center position (actual picking position) of the bottom surface image IMb as position P3 (X3, Y3). When the specific part Ps is picked exactly at the set picking position Pc, the following equations (1) and (2) hold. On the other hand, in FIG. 7 , the set picking position Pc and the center position of the bottom surface image IMb, which is the actual picking position, are shifted by ΔX in the X-axis direction and ΔY in the Y-axis direction. When the position of the lower right corner of the outline (outer edge) of the specific part Ps is recognized as position P3 (X3', Y3') relative to the center position (actual picking position) of the bottom surface image IMb, the following equations (3) and (4), for example, hold regarding the shifts ΔX and ΔY. In this way, the deviations ΔX and ΔY of the collection position Pc can be calculated based on the position P1 of the outline of the specific part Ps recognized in the top surface image IMt, the position P2 of the characteristic part F based on position P1, and the position P3 of the outline of the specific part Ps recognized in the bottom surface image IMb.

[0029] X3=X1+X2...(1) Y3=Y1+Y2...(2) ΔX=X3-X3'...(3) ΔY=Y3-Y3'...(4)

[0030] In the specific component mounting process of FIG. 3 , the control unit 20 next acquires the outline correction value A (AX, AY) corresponding to the component type of the specific component Ps (S160). Here, FIG. 8 is an explanatory diagram showing an example of outline correction value information 23a. This outline correction value information 23a is stored in a storage unit, such as the HDD 23. Details of the outline correction value A will be described later; an outline correction value AX in the X-axis direction and an outline correction value AY in the Y-axis direction are defined for each component type. The specific components Ps include component types B and D, for which a value other than 0 is defined as the outline correction value A, and component types A and C, for which a value of 0 is defined as the outline correction value A. First, the specific components Ps of the component type for which a value of 0 is defined as the outline correction value A will be described.

[0031] When the control unit 20 acquires the contour correction value A (here, the value is 0), it calculates the deviation Δ (ΔX, ΔY) of the picking position Pc of the specific component Ps based on the position P2 of the characteristic feature F based on the contour position P1 of the specific component Ps, the contour position P3 of the specific component Ps, and the contour correction value A (S170). When the contour correction value A is 0, the above-mentioned ΔX and ΔY are calculated as the deviation Δ (picking deviation Δ). After calculating the deviation Δ of the picking position Pc, the control unit 20 mounts the specific component Ps at a mounting position corrected for the deviation Δ (S180, FIG. 4(4)), and ends this process. In S180, the specific component Ps is mounted at a position corrected for the deviations ΔX and ΔY relative to the X and Y positions of the mounting position determined in the production job.

[0032] Here, processing when the above-mentioned outline correction value A is not 0 will be described. FIG. 9 is an explanatory diagram showing an example of an irregularly shaped specific component Ps, where the specific component Ps is viewed from the side. FIG. 10 is an explanatory diagram showing an example of the outline correction value A (AX). The specific component Ps shown in FIG. 9 is formed in a substantially parallelogram shape when viewed from the side, and the edge of the upper surface on which the characteristic portion F is formed is offset from the edge of the lower surface by a value S, for example, in the X-axis direction. This value S is obtained based on the results of measurement of the specific component Ps in advance outside the mounting apparatus 10, for example, using a three-dimensional measuring device.

[0033] FIG. 10 shows a top image IMt of such a specific part Ps captured by the mark camera 17 and a bottom image IMb of the specific part Ps captured by the parts camera 18. As shown in the figure, the specific part Ps (top surface) in the top image IMt and the specific part Ps (bottom surface) in the bottom image IMb are shifted in the image by an amount corresponding to the value S. The contour correction value A is determined to correct this shift. For example, as shown in FIG. 10, a contour correction value AX corresponding to the shift in the X-axis direction is determined. Note that this specific part Ps does not shift in the Y-axis direction, and the contour correction value AY is 0 (e.g., component type B in FIG. 8). Of course, the contour correction value AY may be determined similarly not only in the X-axis direction but also in the Y-axis direction (e.g., component type D in FIG. 8). In this way, the contour correction value A is a value for correcting the shift in the contour of the specific part Ps between the top image IMt and the bottom image IMb. The external shape correction value A is not only required for specific parts Ps that have irregular shapes when viewed from the side, as shown in Figure 9, but may also be required due to other factors, such as differences in how the specific parts Ps are depicted in the top image IMt and the bottom image IMb.

[0034] If a value other than 0 is set as the contour correction value A, in S170, the control unit 20 calculates the deviation Δ(ΔX, ΔY) of the picking position Pc of the specific component Ps based on the position P2 of the characteristic feature F based on the position P1 of the contour of the specific component Ps, the position P3 of the contour of the specific component Ps, and the contour correction value A. As a result, the control unit 20 calculates the deviation Δ of the picking position Pc after correcting the deviation of the position P3 of the contour of the specific component Ps in the bottom image IMb from the position P1 of the contour of the specific component Ps in the top image IMt using the contour correction value A. Therefore, even for a specific component Ps for which a contour deviation occurs between the top surface of the specific component Ps in the top image IMt and the bottom surface of the specific component Ps in the bottom image IMb, the deviation of the picking position Pc can be appropriately calculated and the specific component Ps can be mounted on the board S.

[0035] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. In this embodiment, the mark camera 17 corresponds to the top surface imaging unit of the present disclosure, the part camera 18 corresponds to the bottom surface imaging unit, and the control unit 20 corresponds to the control unit. Also, the HDD 23 corresponds to the storage unit. Note that in this embodiment, an example of the mounting method of the present disclosure is also clarified by explaining the operation of the mounting device 10.

[0036] In the mounting device 10 of the embodiment described above, the control unit 20 calculates the deviation Δ of the pickup position Pc from the position of the characteristic portion F using the position P2 of the characteristic portion F relative to the position P1 of the outline of the specific component Ps recognized from the top surface image IMt, the position P3 of the outline of the specific component Ps recognized from the bottom surface image IMb, and the outline correction value A of the specific component Ps. The control unit 20 then moves the head 13 to the mounting position corrected for the deviation Δ, and mounts the specific component Ps. This allows the specific component Ps to be mounted more appropriately, using the characteristic portion F of the top surface as a reference.

[0037] Furthermore, the control unit 20 uses the difference between the position P1 of the outline of the specific part Ps in the top image IMt and the position P3 of the outline of the specific part Ps in the bottom image IMb as the outline correction value A. Therefore, even if there is a deviation between the outline of the specific part Ps shown in the top image IMt and the outline of the specific part Ps shown in the bottom image IMb, the deviation of the collection position Pc can be appropriately calculated.

[0038] Furthermore, since the control unit 20 uses an outline correction value A determined for each type of specific part Ps, the deviation Δ of the collection position Pc can be appropriately calculated even if the deviation between the outline shown in the top image IMt and the outline shown in the bottom image IMb differs depending on the type of specific part Ps.

[0039] Furthermore, the control unit 20 sets a collection position Pc based on the position P2 of the characteristic portion F relative to the position P1 of the outline of the specific component Ps recognized from the top surface image IMt, and moves the head 13 to the set collection position Pc to cause the nozzle 14 to collect the specific component Ps. Therefore, even if the position of the specific component Ps is shifted due to vibrations of the mounting device 10 between the time the top surface image IMt is captured and the time the specific component Ps is collected, the shift can be appropriately corrected for mounting.

[0040] Furthermore, the control unit 20 uses a contour correction value A that is determined based on the measurement results of a specific component Ps measured in advance outside the mounting device 10, thereby improving the accuracy of correction using the contour correction value A and enabling more appropriate calculation of the deviation Δ of the collection position Pc.

[0041] The mounting device 10 also includes an HDD 23 (storage unit) that stores information (outline correction value information 23a) about the outline correction value A for each type of specific component Ps. The control unit 20 reads the outline correction value A for the specific component Ps to be mounted from the outline correction value information 23a in the HDD 23 and calculates the deviation Δ of the picking position Pc. Therefore, the control unit 20 can quickly obtain the outline correction value A corresponding to the specific component Ps to be mounted and calculate the deviation Δ of the picking position Pc.

[0042] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present disclosure.

[0043] In the above-described embodiment, the contour correction value A is determined based on measurement results outside the mounting apparatus 10. However, this is not limited to this, and the contour correction value A may be determined within the mounting apparatus 10 by the following process. For example, in the contour correction value registration process of FIG. 11 , the control unit 20 executes a specific component mounting process on a test board (S200). The specific component mounting process of S200 is executed similarly to the specific component mounting process of FIG. 3 , except that S160 is omitted and the contour correction value A is not used in S170. That is, the control unit 20 mounts the specific component Ps at a mounting position corrected for the deviation of the pickup position Pc without using the contour correction value A. Next, the control unit 20 causes the mark camera 17 to capture a top-view image IMt of the specific component Ps (test board) after mounting (S210) and obtains the deviation of the mounting position of the specific component Ps from the top-view image IMt (S220). In S220, the control unit 20 obtains the deviation of the actual mounting position from the intended mounting position in each of the X and Y directions. Then, the control unit 20 stores the acquired deviation as the contour correction value A in the contour correction value information 23a in association with the type of the specific part Ps (S230), and ends this process.

[0044] In this way, the control unit 20 mounts the specific component Ps at a mounting position where the deviation of the picking position Pc has been corrected without using the contour correction value A, then has the mark camera 17 capture an image of the specific component Ps, determines the deviation of the mounting position from the top surface image IMt after mounting, and stores the deviation as the contour correction value A. This makes it possible to use the contour correction value A that reflects the mounting results in the mounting device 10. Furthermore, the contour correction value A can be registered without preparing a three-dimensional measuring device, and the deviation of the picking position Pc can be appropriately calculated.

[0045] In the outline correction value registration process of FIG. 12 , the control unit 20 executes S100 to S120, similar to the specific component mounting process of FIG. 3 . Next, the control unit 20 moves the head 13 so that the nozzle 14 is positioned above the collection position Pc set in S120, and then lowers the nozzle 14 at a slower-than-normal speed to allow the nozzle 14 to collect the specific component Ps (S130b). This prevents the position of the specific component Ps from being shifted due to vibrations caused by the nozzle 14 descending. Note that the head 13 may also be moved at a slower-than-normal speed when moving the head 13 so that the nozzle 14 is positioned above the collection position Pc. Next, the control unit 20 executes S140 and S150. The control unit 20 then acquires the deviations (differences) between the outline positions P1 and P3 in the X and Y directions, associates the acquired deviations with the type of specific component Ps, and stores the deviations as outline correction value A in the outline correction value information 23a (S155), thereby terminating this process. After S155, the control unit 20 executes S170 and S180 to mount the specific component Ps.

[0046] In this way, the control unit 20 performs a process similar to the specific component mounting process while minimizing the effects of vibration by, for example, lowering the nozzle 14 at a slow speed, and stores the deviation (difference) between the position of the contour of the specific component Ps in the top image IMt and the position of the contour of the specific component Ps in the bottom image IMb as the contour correction value A. This allows the contour correction value A obtained in the mounting process of the specific component Ps to be applied to subsequent mounting processes of the specific component Ps. Therefore, even for a new type of specific component Ps, the contour correction value A can be obtained during the first mounting process and used in subsequent mounting processes, thereby appropriately calculating the deviation of the picking position Pc. Furthermore, the contour correction value A can be registered and the deviation of the picking position Pc can be appropriately calculated without using a three-dimensional measuring device. The contour correction value registration process of FIG. 12 may be performed with the second head stopped when performed by the first head, or may be performed with the first head stopped when performed by the second head. 12 may be performed with one head 13 stopped, the operation of the other head 13 may be stopped. Note that the outline correction value registration process of FIG. 11 described above may also be performed with the effects of vibrations minimized by, for example, lowering the nozzle 14 at a low speed, or may be performed with the operation of the other head stopped.

[0047] In the embodiment, the mounting device 10 stores the contour correction value information 23a in the HDD 23, but this is not limiting, and the contour correction value information 23a does not have to be stored in the HDD 23. The control unit 20 may acquire the contour correction value A by communicating with an external device such as the management device 30, for example.

[0048] In the embodiment, the control unit 20 uses the difference between the reference position of the outline of the specific part Ps in the top image IMt and the reference position of the outline of the specific part Ps in the bottom image IMb as the outline correction value A, but this is not limited to this. The outline correction value A may be any value that can correct the difference between the outline position of the specific part Ps in the top image IMt and the outline position of the specific part Ps in the bottom image IMb. Furthermore, although the outline correction value A is assumed to store a value other than 0 for a specific part Ps with an irregular shape, this is not limited to this. Even if the top and bottom surfaces of the specific part Ps have the same shape, the appearance of the outline in the top image IMt and the bottom image IMb may differ due to differences in the camera or imaging conditions, resulting in a discrepancy in the position of the outline within the image. Therefore, the outline correction value A may be any value that corrects the difference in the position of the outline due to differences in the appearance.

[0049] In the embodiment, the collection position Pc is set based on the position P2 of the characteristic portion F relative to the position P1 of the outline of the specific part Ps recognized from the top surface image IMt, but this is not limiting, and the collection position Pc may be set based on the recognition result in the top surface image IMt, such as setting the collection position Pc based on the position P1 of the outline of the specific part Ps. Alternatively, the collection position Pc may be set regardless of the recognition result in the top surface image IMt.

[0050] In the embodiment, the mounting device 10 includes two heads 13, and each head 13 is independently movable, but the number of heads is not limited to two, and the mounting device 10 may include three or more heads 13, and each head 13 may be independently movable. Alternatively, the mounting device 10 is not limited to one including multiple heads 13, and may include only one head 13.

[0051] Here, the mounting method of the present disclosure allows components to be mounted more appropriately using the top surface feature as a reference, similar to the above-described mounting device 10. In this mounting method, various aspects of the mounting device 10 may be employed, or configurations or steps may be added to realize the respective functions of the mounting device 10.

[0052] This specification also discloses the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claims 4 to 6 at the time of filing to "the mounting device according to any one of claims 1 to 3," respectively, and the technical idea of ​​changing "the mounting device according to claim 1 or 2" in claim 7 at the time of filing to "the mounting device according to any one of claims 1 to 6."

[0053] The present disclosure can be used in technical fields such as component mounting processing.

[0054] 10 Mounting device, 11 Tape feeder, 12 Substrate transport unit, 13 (13L, 13R) Head, 14 Nozzle, 15 (15L, 15R) Head moving unit, 15a X-axis moving unit, 15b Y-axis moving unit, 16 Slider, 17 (17L, 17R) Mark camera, 18 (18L, 18R) Parts camera, 19 Placement table, 20 Control unit, 21, 31 CPU, 22, 32 ROM, 23, 33 HDD, 23a Outline correction value information, 24, 34 RAM, 25 Feeder table, 25a Slot, 25b Connector, 30 Management device, 35 Input device, 36 Display, S Substrate.

Claims

1. A mounting device that mounts components by moving a head having a component pickup member, comprising: a top-surface imaging unit that captures a top-surface image of a specific component having a predetermined characteristic portion formed on its top surface; a bottom-surface imaging unit that captures a bottom-surface image of the specific component picked up by the pickup member; and a control unit that recognizes the position of the characteristic portion relative to the position of the outline of the specific component from the top-surface image, recognizes the position of the outline of the specific component from the bottom-surface image, calculates a deviation of the pickup position relative to the position of the characteristic portion using the position of the characteristic portion recognized from the top-surface image, the position of the outline of the specific component recognized from the bottom-surface image, and an outline correction value of the specific component, and moves the head to a mounting position where the deviation has been corrected, thereby mounting the specific component.

2. The mounting device according to claim 1, wherein the control unit uses the external shape correction value determined for each type of the specific component.

3. The mounting device according to claim 1 or 2, wherein the control unit sets a collection position based on the position of the characteristic part relative to the position of the outline of the specific component recognized from the top image, and moves the head to the set collection position to cause the collection member to collect the specific component.

4. The mounting device according to claim 1 or 2, wherein the control unit uses the external shape correction value determined based on a measurement result obtained by measuring the specific component in advance outside the mounting device.

5. The mounting device according to claim 1 or 2, wherein the control unit mounts the specific component at the mounting position where the deviation of the collection position has been corrected without using the external shape correction value, then causes the top surface imaging unit to capture an image of the specific component, determines the deviation of the mounting position from the top surface image after mounting, and uses the deviation as the external shape correction value.

6. The mounting device described in claim 1 or 2, wherein the control unit causes the top surface imaging unit to capture the top surface image of the specific component, and then causes the bottom surface imaging unit to capture the bottom surface image of the specific component that has been collected by the collection member at a speed slower than normal, determines the difference between the position of the outline of the specific component in the top surface image and the position of the outline of the specific component in the bottom surface image, and uses the difference as the outline correction value.

7. The mounting device according to claim 1 or 2, further comprising a memory unit that stores the correction values ​​for each type of specific component, and the control unit reads out the correction values ​​for the specific component to be mounted from the memory unit and calculates the deviation of the pickup position.

8. A mounting method for mounting components by moving a head having a component pickup member, comprising: (a) a step of capturing an image of a top surface of a specific component having a predetermined characteristic portion formed on its top surface; (b) a step of capturing an image of a bottom surface of the specific component that has been picked up by the pickup member; (c) a step of recognizing the position of the characteristic portion relative to the position of the outline of the specific component from the top surface image, recognizing the position of the outline of the specific component from the bottom surface image, calculating a deviation of the pickup position relative to the position of the characteristic portion using the position of the characteristic portion recognized from the top surface image, the position of the outline of the specific component recognized from the bottom surface image, and an outline correction value of the specific component, and moving the head to a mounting position where the deviation has been corrected, thereby mounting the specific component.

Images