Method and system for manufacturing mounting substrate, information processing device for calculating mounting target position, mounting target position calculation method, component mounting device and component mounting method, and inspection device and inspection method for solder precoat

Abstract

This method for manufacturing a component mounting substrate includes: a step for preparing a substrate having a mounting point having a plurality of lands on which a solder precoat has been formed; a representative point acquisition step for acquiring a plurality of representative points determined on the basis of a three-dimensional shape of each of the plurality of solder precoats; a setting step for setting a mounting target position of the mounting point on the basis of the plurality of representative points; and a component mounting step for mounting a component at the mounting target position.

Description

Mounting board manufacturing method and manufacturing system, information processing device and method for calculating target mounting position, component mounting device and method, and solder precoat inspection device and method CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This disclosure claims the benefit of priority to Japanese Patent Application No. 2024-034078, filed on March 6, 2024 in the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to a method and system for manufacturing a mounting substrate, an information processing device and method for calculating a target mounting position, a component mounting device and method, and a solder precoat inspection device and method.

[0003] In the manufacture of component-mounted boards, component mounting equipment is used to hold components with a mounting head and mount them on the board. Conventionally, the mainstream method has been to apply solder paste to the lands on the board and then mount the components by bringing the electrodes of the components into contact with the solder paste.

[0004] However, when mounting components on lands via solder paste, the smaller the components become, the more difficult it becomes to solder the components without causing bridges. Therefore, a method has been studied in which a pre-solidified solder precoat is formed on the lands, and components are mounted on the solder precoat to manufacture a component-mounted board (Patent Document 1).

[0005] Japanese Patent Application Publication No. 8-46349

[0006] However, the solder precoat is not necessarily formed in the same position and shape for all lands. The appropriate mounting position of a component may vary depending on the solder precoat. Therefore, it is desirable to change the position of the terminal of the component mounted on the board depending on the solder precoat. If the component mounting position is not appropriate, defects such as non-contact between the component terminal and the solder precoat, component lift-up, and component rotation may occur during the reflow process. Such defects are particularly noticeable in microcomponents (e.g., 0402 components or smaller).

[0007] One of the objects of the present disclosure is to suppress defects when mounting components to a mounting point having a plurality of lands on which solder precoats are formed.

[0008] One aspect of the present disclosure relates to a method for manufacturing a component-mounted board, which manufactures a component-mounted board having mounting points with a plurality of lands on which solder precoats are formed, and which mounts components on the substrate, the method including: a representative point acquisition step of acquiring a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a component mounting step of mounting the components at target mounting positions for the components at the mounting points determined based on the plurality of representative points.

[0009] Another aspect of the present disclosure relates to a method for manufacturing a component-mounted board, which manufactures a component-mounted board having mounting points with a plurality of lands on which solder precoats are formed, and which mounts components on the substrate, the method including: a representative point acquisition step of acquiring a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; a calculation step of determining target mounting positions of the components at the mounting points based on the plurality of representative points; and a component mounting step of mounting the components at the target mounting positions.

[0010] Yet another aspect of the present disclosure relates to a manufacturing system for component-mounted boards, the system comprising: an inspection device that acquires a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats on a board having mounting points with a plurality of lands on which solder precoats are formed; and a component mounting device that mounts the components at target mounting positions for the components at the mounting points determined based on the plurality of representative points.

[0011] Yet another aspect of the present disclosure relates to a manufacturing system for component-mounted boards, the system comprising: an inspection device that acquires a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats on a board having mounting points with a plurality of lands on which solder precoats are formed; a calculation unit that determines target mounting positions of the mounting points based on the plurality of representative points; and a component mounting device that mounts the components at the target mounting positions.

[0012] Yet another aspect of the present disclosure relates to a mounting target position setting device (or information processing device) that sets target mounting positions of components at mounting points on a substrate having a plurality of mounting points each having a land on which a solder precoat is formed, the mounting target position setting device (or information processing device) including a calculation unit that determines the target mounting positions of the mounting points based on a plurality of representative points that are determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0013] Yet another aspect of the present disclosure relates to a mounting target position setting method for setting a target mounting position of a component at a mounting point on a substrate having a plurality of mounting points each having a land on which a solder precoat is formed, the method setting the target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0014] Yet another aspect of the present disclosure relates to a component mounting device that mounts components at mounting points of a substrate having a plurality of mounting points each having a land on which a solder precoat is formed, the component mounting device including: a calculation unit that determines a target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a mounting head that mounts the component at the target mounting position.

[0015] Yet another aspect of the present disclosure relates to a component mounting method for mounting components at mounting points on a substrate, the mounting points having a plurality of lands on which solder precoats are formed, the component mounting method including: a component mounting step for mounting the components at target mounting positions at the mounting points determined based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0016] Yet another aspect of the present disclosure relates to a component mounting method for mounting components at mounting points on a substrate, the mounting points having a plurality of lands on which solder precoats are formed, the component mounting method including: a calculation step for calculating target mounting positions of the mounting points based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a component mounting step for mounting the components at the target mounting positions.

[0017] Yet another aspect of the present disclosure relates to a solder precoat inspection device that inspects a solder precoat formed on a land to which a terminal of a component is soldered, the solder precoat inspection device comprising: a data acquisition unit that acquires a two-dimensional image or three-dimensional data of the solder precoat; and a representative point identification unit that acquires a representative point determined based on the three-dimensional shape of the solder precoat identified from the two-dimensional image or the three-dimensional data.

[0018] Yet another aspect of the present disclosure relates to a solder precoat inspection method for inspecting a solder precoat formed on a land to which a terminal of a component is soldered, the solder precoat inspection method including a data acquisition step for acquiring a two-dimensional image or three-dimensional data of the solder precoat, and a representative point acquisition step for acquiring a representative point determined based on the three-dimensional shape of the solder precoat identified from the two-dimensional image or the three-dimensional data.

[0019] According to the present disclosure, it is possible to suppress defects when mounting components to a mounting point having a plurality of lands on which solder precoats are formed. The novel features of the present invention are set forth in the appended claims, but the present invention, both in terms of structure and content, together with other objects and features of the present invention, will be better understood from the following detailed description taken in conjunction with the drawings.

[0020] FIG. 1 is a schematic diagram showing examples of a normal substrate and an aggregate substrate. FIG. 1 is a schematic diagram showing the configuration of a manufacturing system for component-mounted substrates according to embodiment 1. FIG. 2 is an explanatory diagram conceptually showing steps in a manufacturing method for component-mounted substrates according to embodiment 1. FIG. 2 is a schematic diagram showing the configuration of a main part of a manufacturing system for embodiment 1. FIG. 3 is a perspective view showing an example of a solder pre-coat. FIG. 4 is a side view showing an example of a solder pre-coat. FIG. 4 is a conceptual diagram showing an example of a method for acquiring three-dimensional data of a solder pre-coat. FIG. 5 is a conceptual diagram showing another example of a method for acquiring three-dimensional data of a solder pre-coat. FIG. 5 is a conceptual diagram showing an example of a method for acquiring a two-dimensional image of a solder pre-coat. FIG. 6 is a conceptual diagram showing yet another example of a method for acquiring a two-dimensional image of a solder pre-coat. FIG. 7 is an explanatory diagram showing an example of a method for setting a target mounting position of a component. FIG. 8 is an explanatory diagram showing another example of a method for setting a target mounting position of a component. FIG. 9 is a flowchart showing the operation of a mounting device of the manufacturing system according to embodiment 1. FIG. 10 is a flowchart showing the operation of the mounting device of the manufacturing system according to embodiment 1. FIG. 11 is a schematic diagram showing the configuration of an electronic component mounting device. FIG. 12 is a schematic diagram showing the configuration of a main part of a manufacturing system according to embodiment 2. 10 is a flowchart showing the operation of a mounting device of a manufacturing system according to a second embodiment.

[0021] A method for manufacturing a component-mounted substrate according to the present disclosure (hereinafter also referred to as "manufacturing method (M)") is a method for manufacturing a component-mounted substrate that mounts components on a substrate having mounting points with a plurality of lands on which solder precoats are formed. The manufacturing method (M) includes a representative point acquisition step of acquiring a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats, and a component mounting step of mounting components at target mounting positions for the components at the mounting points determined based on the plurality of representative points.

[0022] The manufacturing method (M) may include a step of preparing a substrate (such as a circuit board) with mounting points having multiple lands on which a solder precoat is formed. Each mounting point has multiple (two or more) lands, and each land is formed with a solder precoat. That is, each mounting point has multiple (two or more) solder precoats. The manufacturing method (M) may further include a representative point acquisition step of acquiring multiple representative points determined based on the three-dimensional shapes of each of the multiple solder precoats, a calculation step of calculating target mounting positions for the mounting points based on the multiple representative points, and a component mounting step of mounting components at the target mounting positions. The manufacturing method (M) may also include a flux supply step of applying flux to the solder precoat before the component mounting step.

[0023] By determining a representative point based on the three-dimensional shape of the solder precoat, setting a target mounting position based on that representative point, and mounting the component at that target mounting position, the position of the component terminal can be appropriately changed according to the solder precoat, thereby suppressing defects such as non-contact between the component terminal and the solder precoat, component lifting, and component rotation.

[0024] The components are typically electronic components. The electronic components are not particularly limited and may be of various types and sizes. The components may be two-terminal components or components having three or more terminals. The two-terminal components may be chip components. The components having three or more terminals may be, for example, micro LEDs, resistor arrays, etc.

[0025] Electronic components may include components that are sized equal to or smaller than the 0402 size defined by the Japanese Industrial Standards (JIS). Hereinafter, components sized equal to or smaller than the 0402 size defined by the JIS may be referred to as "microcomponents." The 0402 size defined by the JIS has a planar shape with a length of 0.4 mm or less and a width of 0.2 mm or less. Microcomponents are less likely to sink into flux and exhibit a self-alignment effect. Therefore, defects when mounting components on a board are more pronounced for microcomponents. Furthermore, because microcomponents are mounted on component mounting boards at high densities with component-to-component distances of 0.1 mm or less, it is highly necessary to avoid even slight rotation in order to avoid contact between adjacent components.

[0026] The components may include components larger than 0402 size. The components mounted on the circuit board are not particularly limited and may include components mounted on general circuit boards. Examples of components include various chip components, CSPs (Chip Size Packages), BGAs (Ball Grid Arrays), connectors, and other components used in electronic devices.

[0027] The representative point obtaining step may be a step of obtaining three-dimensional data of the solder precoat and obtaining the representative point based on the three-dimensional data.

[0028] The representative point acquisition step may be a step of detecting the centroid of the top of the solder precoat based on the three-dimensional data and acquiring the centroid as the representative point. By mounting the component at the target mounting position set based on this representative point, the component terminals can be brought into contact with the top of the solder precoat with a high probability. As a result, defects such as non-contact between the component terminals and the solder precoat, component lifting, and component rotation are significantly reduced.

[0029] The representative point acquisition step may be a step of detecting the vertices of the solder precoat based on the three-dimensional data and acquiring the vertices as the representative points, which increases the probability of the component terminals coming into contact with the vertices of the solder precoat.

[0030] When detecting the vertices of the solder precoat based on three-dimensional data, if multiple vertices are detected in a single land, the position determined by the average of the coordinates of the multiple vertices may be acquired as the representative point.

[0031] The representative point obtaining step may be a step of obtaining a two-dimensional image by capturing the reflected light of illumination light irradiated onto the solder precoat, and obtaining the representative point based on the two-dimensional image.

[0032] The representative point acquisition step may be a step of identifying the area of ​​the apex in the two-dimensional image and acquiring the center of gravity of the apex as the representative point. By mounting the component at the target mounting position set based on such a representative point, it is possible to highly accurately bring the terminal of the component into contact with the apex of the solder precoat.

[0033] The manufacturing method (M) may include a calculation step of calculating a target mounting position of a component at a mounting point based on a plurality of representative points, and a determination step of determining whether a difference between an initial target position determined based on a design value or a plurality of lands and the target mounting position satisfies a predetermined criterion. In other words, the manufacturing method (M) may include a determination step of determining whether a difference between an initial target position determined based on a plurality of lands (specifically, the component mounting position (design value) specified in a design drawing, or the arrangement of a plurality of lands included in the mounting point) and the target mounting position satisfies a predetermined criterion. In the manufacturing method (M), the initial target position can be updated to a new target mounting position set in the setting step.

[0034] However, if the difference between the initial target position and the mounting target position does not meet a predetermined standard, the mounting target position may not be suitable for the position, shape, etc. In that case, component mounting on the mounting point that does not meet the standard may be canceled.

[0035] For a board having multiple mounting points, the evaluation step may be performed for each of the multiple mounting points to be evaluated. In this case, the mounting step may be performed only for a board in which all of the multiple mounting points to be evaluated satisfy the predetermined criteria.

[0036] In a board having multiple mounting points, all or some of the mounting points may be subject to evaluation. For mounting points that are not subject to evaluation, the representative point acquisition step and the calculation step may be omitted.

[0037] The manufacturing method (M) may further include a determination result notification step of notifying an operator of the determination result when the predetermined standard is not met in the determination step. The operator may be a person involved in the execution of the manufacturing method (M) or may be part of the system. The operator who is notified of the determination result can take necessary measures.

[0038] The manufacturing method (M) may further include a selection step of selecting either the initial target position or the target position calculated in the calculation step as the target position to be used in the component mounting step, based on the difference between the target position and an initial target position determined based on a design value or the plurality of lands. That is, the manufacturing method (M) may include a selection step of selecting whether to mount the component at the initial target position or the target position, based on the difference between the initial target position and the target position. For example, if the difference between the initial target position and the target position is negligible, the component may be mounted at the initial target position in the component mounting step without updating the initial target position to the target position.

[0039] Next, a manufacturing system for component-mounted boards according to the present disclosure (hereinafter also referred to as "manufacturing system (S)") may include an inspection device that acquires a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats on a board having mounting points with a plurality of lands on which solder precoats are formed, and a component mounting device that mounts components at target mounting positions for the components at the mounting points determined based on the plurality of representative points. The manufacturing system (S) may include a calculation unit that calculates target mounting positions for the mounting points based on the plurality of representative points, and the component mounting device that mounts the components at the target mounting positions. The calculation unit may be built into the component mounting device.

[0040] The manufacturing method (M) can be performed by a manufacturing system (S). The representative point acquisition step of the manufacturing method (M) can be performed by an inspection device. The calculation step of the manufacturing method (M) can be performed by a calculation unit. The component mounting step of the manufacturing method (M) can be performed by a component mounting device.

[0041] The manufacturing system for component-mounted substrates may include an information processing device. The information processing device may be provided in a server device. The "server device" may be a computer equipped with input devices such as input buttons and a touchpad, output devices such as a display and a speaker, a central processing unit (CPU), various interfaces, etc. The information processing device may be realized by a cloud server provided in a cloud computing environment. The information processing device may include an interface capable of communicating with an inspection device, one or more information storage units, a calculation unit, and a mounting device. The information processing device may include an interface capable of communicating with a determination unit and a selection unit described below. The information processing device may include at least one of an information storage unit and a calculation unit, and at least one of a determination unit and a selection unit described below.

[0042] The information storage unit stores the acquired information. The information storage unit may be configured with a ROM (Read Only Memory), a RAM (Random Access Memory), etc. A program for controlling the device may be stored in one of the information storage devices.

[0043] The inspection device may be configured to acquire three-dimensional data of the solder precoat and acquire the representative point based on the three-dimensional data.

[0044] The inspection device may be configured to detect the centroid position of the top of the solder precoat based on the three-dimensional data, and acquire the centroid position as the representative point.

[0045] The inspection device may be configured to detect the apex of the solder precoat based on the three-dimensional data and acquire the apex as the representative point.

[0046] The inspection device may be configured to, when a plurality of vertices are detected in a single land, acquire a position determined by the average of the coordinates of the plurality of vertices as the representative point.

[0047] The inspection device may be configured to capture a two-dimensional image by capturing the reflected light of illumination light irradiated onto the solder precoat, and to determine the representative point based on the two-dimensional image.

[0048] The inspection device may be configured to identify the range of the apex in the two-dimensional image and acquire the position of the center of gravity of the apex as a representative point.

[0049] The manufacturing system (S) may further include a determination unit that determines whether a difference between an initial target position determined based on a design value or a plurality of lands and a mounting target position satisfies a predetermined standard. In this case, the component mounting device or the manufacturing system (S) may be configured to stop mounting components on a mounting point that does not satisfy the predetermined standard.

[0050] The determination unit may determine whether a predetermined standard is satisfied for each of the plurality of mounting points on a board having a plurality of mounting points. In this case, the component mounting device or the manufacturing system (S) may be configured to mount components only on a board where all of the plurality of mounting points to be determined satisfy the predetermined standard.

[0051] The manufacturing system (S) may further include a judgment result notifying unit that notifies the worker of the judgment result when the judging unit judges that the predetermined standard is not satisfied.

[0052] The manufacturing system (S) may further include a selection unit that selects whether to mount the component at the initial target position or the target mounting position based on the difference between the initial target position and the target mounting position.

[0053] Next, a mounting target position setting device or information processing device (hereinafter also referred to as a "calculation device (SS)") according to the present disclosure is a device for determining a target mounting position of a component at a mounting point, which is used in a component mounting device capable of mounting components on a substrate having a mounting point with a plurality of lands on which solder precoats are formed. The calculation device (SS) may include a calculation unit that determines the target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0054] The calculation device (SS) may include a calculation unit. The calculation unit may be configured as a part of an information processing device of the manufacturing system (S), or may be provided in a component mounting device. The calculation unit may also be provided in an inspection device.

[0055] Next, a mounting target position calculation method (hereinafter also referred to as "calculation method (SM)") according to the present disclosure is a method for calculating a mounting target position of a component used in a component mounting device capable of mounting components on a substrate having mounting points with a plurality of lands on which solder precoats are formed. The calculation method (SM) includes a step of calculating the mounting target positions of the mounting points based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0056] The calculation method (SM) can be carried out by a calculation device (SS).

[0057] When the mounting point includes two lands to which the terminals of a component having two terminals are connected, the calculation unit may be configured to set the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. The calculation step may be a step of calculating the midpoint of the line segment connecting the representative points of the two lands as the target mounting position.

[0058] The calculation unit may be further configured to calculate a target component mounting angle from the angle of a line segment connecting the representative points of the two lands. The calculation step may further include calculating a target component mounting angle from the angle of a line segment connecting the representative points of the two lands.

[0059] When the mounting point includes three or more lands to which the terminals of a component having three or more terminals are connected, the calculation unit may be configured to calculate the target mounting position using an average value of the differences between the centers of the lands and the representative point. The calculation step may be a step of calculating the target mounting position using an average value of the differences between the centers of the lands and the representative point.

[0060] Next, a component mounting apparatus (hereinafter also referred to as "mounting apparatus (MS)") according to the present disclosure is a component mounting apparatus that mounts components onto mounting points of a substrate having a plurality of mounting points each having a lands on which a solder precoat is formed. The mounting apparatus (MS) includes a calculation unit that calculates a target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats, and a mounting head that mounts the component onto the target mounting position.

[0061] That is, the on-board device (MS) may be equipped with a calculation unit.

[0062] Next, a component mounting method (hereinafter also referred to as "mounting method (MM)") according to the present disclosure is a component mounting method for mounting a component at a mounting point of a substrate having a plurality of mounting points each having a land on which a solder precoat is formed. The mounting method (MM) includes a component mounting step for mounting a component at a target mounting position for the component at the mounting point determined based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats. The mounting method (MM) may also include a calculation step for calculating the target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats.

[0063] The loading method (MM) can be performed by the loading device (MS).

[0064] The mounting device (MS) may further include a determination unit that determines whether a difference between an initial target position determined based on a design value or a plurality of lands and a mounting target position satisfies a predetermined standard. In this case, the component mounting device may be configured to stop mounting a component at a mounting point that does not satisfy the predetermined standard. The mounting process (MM) may further include a determination step that determines whether a difference between an initial target position determined based on a design value or a plurality of lands and a mounting target position satisfies a predetermined standard. In this case, the component mounting process may stop mounting a component at a mounting point that does not satisfy the predetermined standard.

[0065] The determination unit may be configured to determine whether a predetermined criterion is satisfied for each of the plurality of mounting points to be determined on a board having a plurality of mounting points. In this case, the component mounting device may be configured to mount components only on a board on which all of the plurality of mounting points to be determined satisfy the predetermined criterion. The determination step may include a step of determining whether a predetermined criterion is satisfied for each of the plurality of mounting points to be determined on a board having a plurality of mounting points. In this case, the component mounting step may be a step of mounting components only on a board on which all of the plurality of mounting points to be determined satisfy the predetermined criterion.

[0066] The mounting device (MS) may further include a determination result notifying unit that notifies the operator of the determination result when the determining unit determines that the predetermined standard is not satisfied. The mounting process (MM) may further include a determination result communicating process that notifies the operator of the determination result when the determining process determines that the predetermined standard is not satisfied.

[0067] The mounting device (MS) may further include a selection unit that selects whether to mount the component at the initial target position or the target mounting position based on a difference between the initial target position determined based on a design value or a plurality of lands and the target mounting position. The mounting process (MM) may further include a selection process that selects whether to mount the component at the initial target position or the target mounting position based on a difference between the initial target position determined based on a design value or a plurality of lands and the target mounting position.

[0068] When the mounting point includes two lands to which the terminals of a component having two terminals are connected, the calculation unit of the mounting device (MS) may be configured to calculate the midpoint of a line segment connecting the representative points of the two lands as the target mounting position.When the mounting point includes two lands to which the terminals of a component having two terminals are connected, the setting step of the mounting process (MM) may be a step of calculating the midpoint of a line segment connecting the representative points of the two lands as the target mounting position.

[0069] The calculation unit of the mounting device (MS) may be further configured to calculate a target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands. The setting step of the mounting process (MM) may further include a step of calculating a target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands.

[0070] When the mounting point includes three or more lands to which the terminals of a component having three or more terminals are connected, the calculation unit of the mounting device (MS) may be configured to calculate the target mounting position using an average value of differences between the centers of the lands and the representative point.When the mounting point includes three or more lands to which the terminals of a component having three or more terminals are connected, the setting step of the mounting process (MM) may be a step of calculating the target mounting position using an average value of differences between the centers of the lands and the representative point.

[0071] Next, the solder precoat inspection device (hereinafter also referred to as the "inspection device (DS)") according to the present disclosure is a device for inspecting solder precoats formed on lands to which terminals of components are soldered. The inspection device (DS) includes a data acquisition unit that acquires two-dimensional images or three-dimensional data of the solder precoat, and a representative point identification unit that acquires representative points determined based on the three-dimensional shape of the solder precoat identified from the two-dimensional images or three-dimensional data.

[0072] Next, the solder precoat inspection method (hereinafter also referred to as "inspection method (DM)") according to the present disclosure is a method for inspecting a solder precoat formed on a land to which a terminal of a component is soldered. The inspection method (DM) includes a data acquisition step of acquiring a two-dimensional image or three-dimensional data of the solder precoat, and a representative point acquisition step of acquiring a representative point determined based on the three-dimensional shape of the solder precoat identified from the two-dimensional image or three-dimensional data.

[0073] The inspection method (DM) can be performed by a inspection device (DS).

[0074] The data acquisition unit may be configured to acquire three-dimensional data. The data acquisition step may be a step of acquiring three-dimensional data.

[0075] The representative point identifying unit may be configured to detect the area centroid position of the top of the solder precoat based on the three-dimensional data and acquire the area centroid position as the representative point. The representative point acquiring step may be a step of detecting the area centroid position of the top of the solder precoat based on the three-dimensional data and acquiring the area centroid position as the representative point.

[0076] The representative point identifying unit may be configured to detect vertices of the solder precoat based on the three-dimensional data and acquire the vertices as the representative points. The representative point acquiring step may be a step of detecting vertices of the solder precoat based on the three-dimensional data and acquiring the vertices as the representative points.

[0077] The representative point specifying unit may be configured to, when a plurality of vertices are detected in a single land, acquire a position determined by an average of the coordinates of the plurality of vertices as the representative point. The representative point acquiring step may be a step of, when a plurality of vertices are detected in a single land, acquiring a position determined by an average of the coordinates of the plurality of vertices as the representative point.

[0078] The data acquisition unit may be configured to acquire a two-dimensional image by capturing reflected light of illumination light irradiated onto the solder pre-coat. The representative point acquisition step may include a step of capturing reflected light of illumination light irradiated onto the solder pre-coat to acquire a two-dimensional image.

[0079] The representative point identification unit may be configured to identify the range of the apex in the two-dimensional image and acquire the area centroid position of the apex as the representative point. The representative point acquisition step may be a step of identifying the range of the apex in the two-dimensional image and acquiring the area centroid position of the apex as the representative point.

[0080] The illumination light may be a grid-like light emitted from a projector.

[0081] The substrates used in the manufacture of component-mounted boards include ordinary substrates and aggregate substrates formed by integrating a plurality of unit substrates. The aggregate substrate is divided into a plurality of unit substrates in an optional post-process.

[0082] 1(a) shows a normal board 100A with a solder precoat, and FIG. 1(b) shows an aggregate board 100B with a solder precoat. The normal board 100A and the aggregate board 100B have multiple mounting points 111 where components are mounted. Although there are some exceptions, one component is generally mounted to one mounting point 111.

[0083] The mounting point 111 includes lands 101 on which a solder precoat 102 is formed. The lands 101 are formed in a pattern corresponding to the shape, arrangement, and number of terminals of the component to be mounted. For simplicity of explanation, this embodiment illustrates a mounting point 111 for mounting a chip-type component having two terminals, and two lands 101 are formed at one mounting point. An initial target position 104 for mounting the component is set at the mounting point 111. The initial target position 104 is the mounting position of the component specified in the design drawing, or the mounting position of the component determined based on the arrangement of multiple lands 101 included in the mounting point.

[0084] The aggregate substrate 100B is made up of a plurality of unit substrates 100C. While the aggregate substrate 100B shown in FIG. 1(b) is made up of a plurality of unit substrates 100C of the same shape, it may also be made up of unit substrates 100C of different shapes. Each unit substrate 100C has at least one mounting point 111. At the mounting point 111, a land 101 having a solder precoat 102 is arranged, and an initial target position 104 for mounting a component is set.

[0085] In the following description, when there is no need to distinguish between the normal substrate 100A and the aggregate substrate 100B, they will be referred to as "substrate 100."

[0086] (Embodiment 1) Below, examples of a manufacturing method and manufacturing system for a component-mounted substrate according to the present disclosure will be specifically described with reference to the drawings. The above-described processes and devices can be applied to the processes and devices in the example described below. Furthermore, the processes and devices in the example described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above-described embodiment. Furthermore, in the embodiment described below, matters that are not essential for implementing the present disclosure may be omitted.

[0087] FIG. 2 schematically shows the configuration of a mounting substrate manufacturing system (manufacturing system (S)) 10 according to an embodiment of the present disclosure. FIG. 3 is an explanatory diagram conceptually showing steps of a method for manufacturing a component mounting substrate. FIG. 4 is a schematic diagram showing the configuration of a main part of the manufacturing system according to this embodiment.

[0088] The manufacturing system (S) 10 is constructed in a line from upstream to downstream along a substrate transport device 11 that transports solder-precoated substrates 100. The manufacturing system (S) 10 is managed collectively by an information processing device 20. Arranged in this order from upstream to downstream in the line-shaped manufacturing system 10 are a first inspection device (solder precoat inspection device) 300, a flux application device 400, a first component mounting device 501, a second component mounting device 502, a second inspection device (mounting state inspection device) 600, a worker station 700, a reflow device 800, and a third inspection device (substrate inspection device) 900. The third inspection device 900 inspects a substrate (component-mounted substrate) 110 on which components 200 are mounted. In FIG. 2 , the information processing device 20 is connected to each device via a communication cable 12, but may also be connected to each device via wireless communication. Hereinafter, the component mounting devices 501 and 502 may be collectively referred to as the "component mounting device 500."

[0089] 3A and 3B conceptually illustrate the process from the substrate loading process (FIG. 3A) into the upstream first inspection apparatus 300 to the reflow process (FIG. 3F) performed in the downstream reflow apparatus 800. The substrate transport apparatus 11 is configured by arranging transport units built into each apparatus in a straight line, and transports the substrate 100 (110) from the upstream first inspection apparatus 300 to the downstream third inspection apparatus 900. The substrate transport apparatus 11 includes a mechanism (e.g., a belt conveyor and a drive device) for transporting the substrate 100 (110). Such a mechanism may be a known mechanism for transporting the substrate 100 (110).

[0090] 2 , the information processing device 20 is connected to each device via a communication cable 12 or wireless communication and can communicate with each device. The information processing device 20 exchanges data with each device. In this way, the information processing device 20 manages the processes performed in the manufacturing system 10.

[0091] The flux application device 400 supplies flux 103 to the solder precoats 102 formed on the lands 101 of the substrate 100. As shown in the flux supplying step of FIG. 3( c), the flux application device 400 may supply the flux 103 in islands corresponding to the individual solder precoats 102. The flux application device 400 may also be a screen printing device. The screen printing device can efficiently apply the flux 103 to each of the n solder precoats 102 in the form of n islands that are separated from each other. Note that a dispenser may also be used as the flux application device 400.

[0092] The component mounting device 500 mounts the component 200 at the target mounting position 106 of the mounting point 111 on the board 100. Details of the component mounting device 500 will be described later.

[0093] The second inspection device (mounting state inspection device) 600 inspects the mounting state of the component 200 mounted on the board 100. The second inspection device 600 has an imaging device that images the board 100, and inspects the mounting state of the component 200 from the image obtained by the imaging device. The second inspection device 600 transmits the inspection results to the information processing device 20. At that time, if there is a component (mounting point 111) whose mounting state is determined to be defective, the second inspection device 600 sets a "board NG flag" for the board 100 that includes that mounting point 111.

[0094] The worker station 700 is a station where a worker works on the substrates 100 transported by the substrate transport device 11. When a normal substrate 100A with a "substrate NG flag" set or an aggregate substrate 100B with all unit substrates 100C with a "substrate NG flag" set has been transported, the worker station 700 stops the substrate transport device 11 and notifies the worker to remove the normal substrate 100A or aggregate substrate 100B from the substrate transport device 11. Upon receiving this notification, the worker removes the normal substrate 100A or aggregate substrate 100B from the worker station 700 to prevent defective products from being produced.

[0095] The reflow device 800 is a device that heats the board 100 transported by the board transport device 11, melts the solder precoat, and solders the components. The third inspection device (board inspection device) 900 inspects the soldered state of the components.

[0096] Next, the information processing device 20 will be described in detail with reference to Fig. 4. Fig. 4 shows an example of the configuration of the information processing device 20. The information storage unit 21 of the information processing device 20 stores programs and data required for each device in the manufacturing system 10. The information storage unit 21 in Fig. 4 includes a first information storage unit 21A and a second information storage unit 21B.

[0097] The information processing device 20 stores the representative points 105 (see FIG. 3 ) received from the first inspection device 300 (described later) in the first information storage unit 21A. The representative points 105 are stored in association with information that can identify the board 100 and the mounting points 111. As information that can identify the board 100, a serial number, a board ID, a date, a time (timestamp), or a combination of these can be used. As information that can identify the mounting points, numbers, character strings, etc. assigned to the mounting points 111 are used. Therefore, the information processing device 20 can read the representative points 105 for all mounting points 111 of the board 100 specified by the information that can identify the board 100 from the first information storage unit 21A.

[0098] In the case of the aggregate substrate 100B, the representative point 105 is stored in association with information that can identify the unit substrate 100C, and the information processing device 20 can read the representative point 105 from the first information storage unit 21A for each unit substrate 100C.

[0099] The information processing device 20 stores information (flag information) indicating the status of the mounting points 111 and the board 100 in the second information storage unit 21B. As information indicating the status of the mounting points 111, for example, a "mounting not possible flag" meaning that a component cannot be mounted is set. As information indicating the status of the board 100, for example, a "board NG flag" meaning that the board 100 is a defective product is set. The flag information is also stored in association with information that can identify the board 100 and the mounting points 111. The information processing device 20 can read flag information of the board 100 specified by the information that can identify the board from the second information storage unit 21B.

[0100] In the case of the aggregate substrate 100B, the flag information is stored in association with information that can identify the unit substrate 100C. The information processing device 20 can read flag information specified by information that can identify the unit substrate 100C from the second information storage unit 21B. In particular, a "substrate NG flag" is set for each unit substrate 100C, and the information processing device 20 can determine whether or not a "substrate NG flag" exists for each unit substrate 100C.

[0101] The information processing device 20 may be provided in a server device. The "server device" may be a computer equipped with input devices such as input buttons and a touchpad, output devices such as a display and a speaker, a central processing unit (CPU), various interfaces, etc. The information processing device 20 may be realized by a cloud server provided in a cloud computing environment. The information processing device 20 may be capable of communicating with each device via a communication cable 12 or wireless communication through a public line such as a wireless or wired intranet or the Internet, and may communicate with each device across borders.

[0102] Next, the first inspection device 300 (precoat inspection device) will be described in detail with reference to Figures 4 and 5A to 5G. The first inspection device 300 inspects the solder precoat 102 formed on the lands 101 to which the terminals 201 of the component are soldered. The first inspection device 300 includes, for example, an inspection unit 301, an imaging / measurement unit 302, and a representative point identification unit 303 (see Figure 4).

[0103] The inspection unit 301 processes the image information and measurement data acquired by the imaging and measurement unit 302 to determine the state of the solder precoat 102 and acquire information necessary to identify the representative point 105. The inspection unit 301 determines that the state of the solder precoat 102 is defective if, for example, the amount of the solder precoat 102 is not within the standard range or the shape of the solder precoat 102 is not appropriate.

[0104] The inspection unit 301 sets a "mounting impossible flag" for the mounting point 111 that is determined to be defective, and also sets a "board NG flag" for the board 100 that includes the mounting point 111. If the board 100 is an aggregate board 100B, the inspection unit 301 sets a "board NG flag" for the unit board 100C that includes the mounting point 111 for which the "mounting impossible flag" has been set. The first inspection device 300 transmits the inspection results and information necessary for identifying the representative point 105 to the information processing device 20.

[0105] The imaging and measurement unit 302 is a data acquisition unit that acquires two-dimensional images or three-dimensional data of the solder precoat. The imaging and measurement unit 302 can use, for example, an imaging device using a CCD imaging element or a C-MOS imaging element, or a three-dimensional measuring device that measures the surface shape of an object in a non-contact manner.

[0106] The representative point identifying unit 303 identifies the representative point 105 of the solder precoat 102 by analyzing the two-dimensional image or three-dimensional data of the solder precoat acquired by the imaging / measuring unit 302 using a dedicated program.

[0107] FIG. 5A is a perspective view of an example of a solder precoat. FIG. 5B is a side view of an example of a solder precoat. A typical three-dimensional shape of the solder precoat 102 is a shield-like or protruding shape with a raised center. A vertex 102MT exists at the central, high-altitude portion (top 102T) of the solder precoat 102. The three-dimensional shape of the solder precoat 102 can be represented by drawing multiple contour lines HL. For example, the region (the region surrounded by the dashed line HLA) higher than the contour line (dashed line HLA in FIG. 5A) at a predetermined height H from the land 101 can also be defined as the top 102T. The solder precoat 102 has at least one vertex 102MT. When only one vertex 102MT exists, that vertex is often the highest point of the solder precoat 102. Multiple vertices 102MT may exist on the surface of a single solder precoat 102. In either case, most of the vertices 102MT are located inside the peak 102T. In particular, when there is only one vertex 102MT, the vertex 102MT is often located in the center of the peak 102T.

[0108] The inventors have discovered that the positional relationship between the terminals 201 of the component 200 and the solder precoat 102 when the component 200 is mounted on the mounting point 111 affects the success rate of soldering in the reflow process. Specifically, if the terminals 201 and the solder precoat 102 are in contact or are close enough to be said to be in contact, soldering defects will hardly occur.

[0109] On the other hand, if the distance between the terminal 201 and the solder precoat 102 is too great due to the flux 103 present between them, defects are likely to occur. In particular, microcomponents such as 0402 components or smaller 0201 components have a lighter weight, and therefore are less able to push aside the flux 103 and bring the terminal 201 into contact with the molten solder precoat 102 during reflow than heavier components. On the other hand, the three-dimensional shape of the solder precoat 102 is not uniform, and the state of the apex 102T and the position of the vertex 102MT vary depending on the solder precoat. For this reason, when the component 200 is mounted at a target position (initial target position 104) determined based on the design data for the board 100 and the position information for the land 101, the distance between the terminal 201 and the vertex 102MT may be too great, resulting in soldering defects. The inventors have completed this invention by noticing that even if there is variation in the solder precoat 102, if the component is mounted taking into consideration the three-dimensional shape of the solder precoat 102, the terminal 201 of the component 200 can be mounted in a state where it is in contact with the solder precoat 102 or is almost in contact with it.

[0110] The vertex 102MT of the solder precoat 102 is most likely to come into contact with the terminal 201 of the component 200. It is therefore most desirable to mount the component 200 so that the position of the terminal 201 of the component 200 overlaps the vertex 102MT. For this reason, the first inspection device 300 detects the vertex 102MT of the solder precoat 102 and outputs its position as the representative point 105. The vertex 102MT is the point with the highest elevation of the solder precoat 102, and is the position most likely to come into contact with the terminal 201 of the component 200.

[0111] If only one vertex 102MT is detected, that vertex is detected as the representative point 105. If multiple vertices are detected, the positions on the substrate surface may be expressed in XY coordinates, and the position determined by the average value of the XY coordinates of each vertex may be used as the representative point 105. Furthermore, the first inspection device 300 may detect the position of the area centroid of the top 102T when viewed in plan, instead of the vertex 102MT, as the representative point. The area centroid position is the position of the center of gravity of the area surrounded by the outline of the top 102T. In the solder precoat 102, the vertex 102MT is often located near the area centroid of the top 102T, so the position of the area centroid may be estimated to be the position of the vertex 102MT and detected as the representative point.

[0112] The first inspection device 300 can be one that acquires three-dimensional data of the solder precoat and detects a representative point of the solder precoat, or one that acquires a two-dimensional image and detects a representative point. The former includes an imaging / measurement unit 302 equipped with a measuring device capable of measuring the three-dimensional shape of the solder precoat 102, such as a distance sensor or a stereo camera, while the latter includes lighting and a camera.

[0113] FIG. 5C is a conceptual diagram of an example of a first inspection device that acquires three-dimensional data of the solder precoat, in which a distance sensor is applied to the imaging and measurement unit 302. The distance sensor is composed of a light-emitting unit 310 that emits laser light and a light-receiving unit 320 that receives light reflected from the surface of the solder precoat 102. The distance sensor measures the distance to the surface of the solder precoat 102 using the principle of triangulation. The imaging and measurement unit 302 scans the entire surface of the solder precoat 102 with laser light and acquires the distances of multiple points obtained as three-dimensional data. The representative point identification unit 303 identifies a representative point 105 of the solder precoat 102 based on the acquired three-dimensional data. The representative point identification unit 303 may identify the vertex 102MT of the solder precoat 102 as the representative point 105. If multiple vertices 102MT are detected within one solder precoat 102, their positions on the substrate surface may be expressed in XY coordinates, and the position determined by the average of the XY coordinates of each vertex 102MT may be used as the representative point 105. The representative point identification unit 303 may also detect the area centroid position when the vertex 102 is viewed in plan as the representative point 105. The area centroid position is the center of gravity of the area surrounded by the outline of the vertex 102T. There is a high probability that the vertex 102MT is located at the center of the vertex 102T. Therefore, if the vertex 102MT cannot be directly identified or is difficult to identify, there is no problem in using the area centroid position as the representative point 105. In other words, the area centroid position is estimated to be the position of the vertex 102MT, and this position is used as the representative point 105.

[0114] 5D is a conceptual diagram of an example of a first inspection device that acquires three-dimensional data of the solder precoat, in which a stereo camera is applied to the imaging and measurement unit 302. The stereo camera is composed of multiple cameras 330 that capture images of the solder precoat from different angles, and in the illustrated example, it is composed of three cameras 330A, 330B, and 330C. The stereo camera determines the shape (three-dimensional data) of the surface of the solder precoat 102 from the parallax of the multiple images obtained by these cameras. As described above, the representative point identification unit 303 identifies the representative point 105 from the position of the vertex 102MT, a position determined by the average value of the XY coordinates of the multiple vertices 102MT, or the position of the center of gravity of the area.

[0115] A two-dimensional image may be obtained by irradiating the solder precoat 102 with illumination light and capturing the reflected light. When obtaining the representative point 105 based on the two-dimensional image, the range of the apex 102T may be identified from the two-dimensional image, and the position of the center of gravity of the area of ​​the apex 102T may be detected.

[0116] Fig. 5E is an explanatory diagram of a method for acquiring a two-dimensional image using a coaxial illumination method. Fig. 5F is an explanatory diagram of a method for acquiring a two-dimensional image using an oblique illumination method. Fig. 5G is an explanatory diagram of a method for acquiring a two-dimensional image using a method utilizing a lattice method or a moiré method. In each figure, (a) is a side view conceptually showing the device and solder precoat 102 used in each method, and (b) is a schematic plan view of an example of a captured two-dimensional image.

[0117] FIG. 5E is an explanatory diagram of an example of a first inspection device that acquires two-dimensional images of the solder precoat, employing coaxial lighting and a camera in the imaging and measurement unit 302. In the coaxial lighting system shown in FIG. 5E, illumination light emitted from the illumination unit 350 is reflected by a half mirror and irradiated onto the solder precoat 102, with some of the reflected light passing through the half mirror 351 and captured by the camera 340A. In the resulting two-dimensional image, image 102A of the inclined portion of the solder precoat 102 surface appears dark because less reflected light reaches the camera 340A. Image 102B of the gently inclined or horizontal portion of the solder precoat 102 appears bright because more reflected light reaches the camera 340A. Thus, the two-dimensional image reveals features based on the three-dimensional shape of the solder precoat 102. It is believed that the vertex 102MT is located within the area inside the contour of image 102B. Therefore, the representative point specifying unit 303 regards the image 102B as the top 102T, and determines the position of the center of gravity of the image 102B as the representative point 105.

[0118] FIG. 5F is an explanatory diagram of an example of a first inspection device that acquires two-dimensional images of the solder precoat, employing oblique illumination and a camera in the imaging and measurement unit 302. In the oblique illumination method shown in FIG. 5F, illumination light emitted from multiple illumination units 360 at different angles is directly irradiated onto the solder precoat 102, and some of the reflected light is captured by the camera 340B. In the resulting two-dimensional image, image 102C of the steeply inclined portion of the solder precoat 102 surface (steep slope) appears dark because less reflected light reaches the camera 340B. Image 102D of the gently inclined portion of the solder precoat 102 surface (gentle slope) appears bright because more reflected light reaches the camera 340B. On the other hand, image 102E of the very gently inclined or horizontal portion of the solder precoat 102 appears dark because less reflected light reaches the camera 340B. In this way, features based on the three-dimensional shape of the solder precoat 102 appear in the two-dimensional image. The representative point identification unit 303 can recognize the peak 102T using the bright image 102D as a clue. For example, the entire area inside the outline of the image 102D may be considered to be the peak 102T, or only the area inside the outline of the image 102E may be considered to be the peak 102T. The representative point identification unit 303 sets the position of the center of gravity of the area of ​​the peak 102T recognized from the two-dimensional image as the representative point 105.

[0119] FIG. 5G is an example of a first inspection device that acquires a two-dimensional image of the solder precoat, and is an explanatory diagram of an apparatus that applies an inspection light irradiation unit and a camera to the imaging / measurement unit 302. The example shown in FIG. 5G is a method in which grid-shaped illumination light emitted from the inspection light irradiation unit (projector) 370 is irradiated onto the solder precoat 102 to acquire a two-dimensional image corresponding to the three-dimensional shape of the solder precoat 102. A distorted stripe pattern (moiré fringes) appears in the two-dimensional image according to the three-dimensional shape of the solder precoat 102. This method is called the grid method or moiré method, and the representative point identification unit 303 analyzes the stripe pattern (moiré fringes) using a dedicated algorithm to identify the apex 102T, and the position of the center of gravity of the area is designated as the representative point 105.

[0120] The representative points 105 detected by the first inspection device 300 and associated with the mounting points 111 are transmitted to the information processing device 20 and stored in the first information storage unit 21A. The information on the representative points 105 stored in the first information storage unit 21A is then read out by the component mounting device 500.

[0121] Next, the component mounting device 500 will be described in detail with reference to Figures 4 and 9. Figure 9 schematically shows an example of the configuration of the component mounting device 500. The component mounting device 500 includes a board transport conveyor 521 that transports the board 100, a plurality of component supply units 540 arranged on the sides of the board transport conveyor 521, a mounting head 520, and a board holder 555. The board transport conveyor 521 is provided on a pair of board guides 522 that extend parallel to the X direction. The board transport conveyor 521 constitutes a part of the board transport device 11.

[0122] The board transport conveyor 521 supports both ends of the board 100 in the Y direction from below, and is driven by a drive source (not shown) to transport the board 100 in the X direction. The middle part of the board transport conveyor 521 in the X direction is a work area W where electronic components 200 are mounted on the board 100. Below this work area W, a member (part of the board holder 555) that supports the board 100 from below is arranged.

[0123] The substrate holding unit 555 includes a plurality of backup pins 552 that support the underside of the substrate 100, a lifting platform 551 on which the backup pins 552 are arranged, a lifting unit 553 that raises and lowers the lifting platform 551, and an upper surface presser 554. When the backup pin lifting unit 553 is driven after the substrate 100 has been carried into the work area W by the substrate transport conveyor 521, the backup pins 552 push up the substrate 100 and press the upper surfaces of both ends in the Y direction against the upper surface presser 554. As a result, the substrate 100 is temporarily fixed in the work area W while being sandwiched from above and below by the plurality of backup pins 552 and the pair of upper surface presser 554. The substrate transport conveyor 521 of the component mounting device 500 carries the substrate 100 received from upstream into the work area W within the device, and carries the substrate 100, on which electronic components 200 have been mounted, out to a downstream device.

[0124] The component mounting device 500 includes a moving device 550 (FIG. 4) that moves the mounting head 520 in the X and Y directions. The mounting head 520 is equipped with a plurality of suction nozzles 541 that suction-hold the electronic components 200, and incorporates a nozzle drive mechanism (not shown) that raises and lowers the suction nozzles 541 and rotates them about the Z axis. The mounting head 520 holds the components 200 supplied by the component supply unit 540 with the suction nozzles 541. The moving device 550 moves the mounting head 520 to position the components 200 at the mounting target position 106, and the nozzle drive mechanism mounts the components 200 on the solder precoat 102 to which flux has been applied (FIG. 5(e)).

[0125] 4 , the component mounting device 500 includes a control unit 510 and an operation / display unit 530. The control unit 510 includes a central processing unit (CPU) and a storage device, and executes processes such as control and calculation of the component mounting device 500 using a program. The control unit 510 includes a setting unit 514 that sets a target mounting position of a component at a mounting point. The setting unit 514 includes a calculation unit 511, a determination unit 512, and a selection unit 513. The setting unit 514, the calculation unit 511, the determination unit 512, and the selection unit 513 are processing functions realized by a program executed by the control unit 510. Furthermore, in the first embodiment, the calculation unit 511, the determination unit 512, and the selection unit 513 are included in the setting unit 514 provided in the control unit 510.

[0126] The setting unit 514 of the control unit 510 receives information about the representative points 105 from the first information storage unit 21A around the time when the board 100 is carried into the work area W by the board transport conveyor 521. The setting unit 514 sets the target mounting position 106 (see FIG. 6 ) of the component 200 at the mounting point 111 based on the plurality of representative points 105 included in the mounting point 111.

[0127] The setting unit 514 has a calculation unit 511 that calculates the target mounting position 106 of the component 200 at the mounting point based on the plurality of representative points 105. Here, an example of calculation of the target mounting position 106 by the calculation unit 511 will be described. Fig. 6 is an explanatory diagram showing an example of a method for calculating the target mounting position of the component 200. Fig. 7 is an explanatory diagram showing another example of a method for calculating the target mounting position of the component 200.

[0128] 6 shows a mounting point 111 on which a two-terminal component (typically, a chip component) is mounted. The initial target position 104 of the mounting point 111 is a position specified in a design drawing or a position determined based on the arrangement of multiple lands 101. In this embodiment, the initial target position 104 is determined based on a pair of lands 101a and 101b. Specifically, the initial target position 104 is defined as the midpoint of a line segment DL1 connecting the center position of one land 101a and the center position of the other land 101b. Representative points 105a and 105b are detected by the first inspection device 300 on the solder precoats 102a and 102b formed on the lands 101a and 101b, respectively. In this embodiment, the representative points 105a and 105b are the areal center positions of the tops of the solder precoats 102a and 102b. However, this is not limiting. For example, the vertices of the solder precoats 102a and 102b may be the representative points 105a and 105b. The calculation unit 511 calculates the target mounting position 106 based on the acquired representative points 105a and 105b. In the case of a two-terminal component, the calculation unit 511 calculates the midpoint of a line segment DL2 connecting one representative point 105a and the other representative point 105b as the target mounting position 106. The initial target position 104 and the target mounting position 106 can be specified by coordinates on an XY plane defined parallel to the board 100. The position of the target mounting position 106 can also be expressed as a difference from the initial target position 104, i.e., the difference dX in the X coordinate and the difference dY in the Y coordinate. dX and dY are also referred to as correction amounts.

[0129] The calculation unit 511 may further set a target mounting angle of the component 200 from a line segment DL2 connecting the two representative points 105 a and 105 b. The target mounting angle is determined, for example, using an angle dθ (correction angle) of the line segment DL2 with respect to a line segment DL1 connecting the center position of one land 101 a and the center position of the other land 101 b.

[0130] FIG. 7 shows a mounting point 111 where a four-terminal component is mounted. Regardless of whether the component has four terminals or three or more, the initial target position 104 is determined based on a design drawing or the layout of multiple lands. In this embodiment, the target mounting position 106 may be determined by averaging the differences between the center position C of each land and the representative point 105 of the solder precoat formed on that land. For a four-terminal component, four coordinates are determined on an XY plane defined parallel to the board 100: the coordinate C of the center position C of the first land 1011 to the fourth land 1014 and the coordinate R of the representative point 105 of the solder precoat formed on that land. The following are also determined: the difference dX1, dY1 between the coordinate C and the coordinate R of the first land 1011; the difference dX2, dY2 between the coordinate C and the coordinate R of the second land 1012; the difference dX3, dY3 between the coordinate C and the coordinate R of the third land 1013; and the difference dX3, dY4 between the coordinate C and the coordinate R of the fourth land 1014. At this time, the coordinates of the mounting target position 106 may be determined as coordinates (X0+dX, Y0+dY) shifted by dX=(dX1+dX2+dX3+dX4) / 4 and dY=(dY1+dY2+dY3+dY4) / 4 from the coordinates (X0, Y0) of the initial target position 104.

[0131] The setting unit 514 includes a determination unit 512. The determination unit 512 determines whether the difference (dX, dY) between the mounting target position 106 and the initial target position 104 calculated by the calculation unit 511 satisfies a predetermined standard. The determination unit 512 determines whether a component can be mounted on the mounting point 111 by determining whether the difference (dX, dY) is less than a second threshold T2. Even for a mounting point 111 where the first inspection device 300 did not detect any abnormalities in the solder precoat 102, the values ​​of dX and dY may be large depending on variations in the three-dimensional shape of the solder precoat 102. If a component 200 is mounted on such a mounting point 111, it may come into contact with the component 200 of an adjacent mounting point 111, increasing the possibility of soldering defects such as bridging. The determination unit 512 determines whether the component 200 can be mounted on the mounting point 111 based on the mounting target position 106 calculated by the calculation unit 511.

[0132] When the calculation unit 511 calculates the correction angle dθ, the determination unit 512 may determine whether the correction angle dθ satisfies a predetermined criterion. The determination unit 512 determines whether a component can be mounted at the mounting point 111 by determining whether the correction angle dθ is less than the second threshold value θ2. The determination unit 512 may display the determination result on the operation and display unit 530. In this case, the operation and display unit 530 may function as a determination result notification unit. However, the form of the determination result notification unit is not particularly limited. The determination result may be displayed on a mobile terminal for the worker, a light or buzzer provided in the component mounting device 500, or a monitor or loudspeaker provided outside the component mounting device 500.

[0133] If the mounting target position 106 is within a predetermined range from the initial target position 104, the determination unit 512 determines that the correction amount is within the standard. The determination unit 512 executes processing to stop component mounting on a mounting point 111 that the determination unit 512 determines does not satisfy the standard. Specifically, a "mounting not permitted flag" is set for the mounting point 111 that the determination unit 512 determines does not satisfy the standard. This causes the component mounting device 500 to stop mounting a component on that mounting point 111 in the component mounting process.

[0134] For a board having a plurality of mounting points 111, the determination unit 512 may determine whether each of the plurality of mounting points to be determined satisfies a predetermined criterion. The determination unit 512 mounts components 200 only on boards 100 for which all of the plurality of mounting points 111 to be determined satisfy the predetermined criterion, and executes processing to cancel mounting of components 200 on boards 100 for which it is determined that at least one mounting point 111 does not satisfy the criterion. Specifically, it sets a "board NG flag" on boards 100 that include mounting points 111 determined not to satisfy the criterion. As a result, the component mounting device 500 cancels mounting of components on boards 100 for which a "board NG flag" has been set in the component mounting process. In other words, components are mounted only on boards 100 that do not have any mounting points for which a "mounting not allowed flag" has been set.

[0135] The setting unit 514 includes a selection unit 513. The selection unit 513 selects whether to mount the component 200 at the initial target position 104 or at the mounting target position 106 based on the difference between the initial target position 104 and the mounting target position 106. If the difference between the initial target position 104 and the mounting target position 106 is small, the probability of defects occurring will not change even if the component 200 is mounted at the initial target position 104. Therefore, if the difference between the initial target position 104 and the mounting target position 106 is small, the selection unit 513 selects the initial target position 104. The selection unit 513 determines whether the difference is small by comparing the difference (correction amount (dX, dY)) between the X and Y coordinates of the initial target position 104 and the X and Y coordinates of the mounting target position 106 with a first threshold T1. Specifically, if the correction amount (dX, dY) is less than the first threshold T1, the selection unit 513 determines that the difference is small and selects the initial target position 104. The first threshold T1 is smaller than the second threshold T2 used in the determination unit 512.

[0136] If the selection unit 513 and the calculation unit 511 have calculated the correction angle dθ, the selection unit 513 may select whether to mount the component 200 at an initial mounting target angle based on the correction angle dθ or to mount the component 200 at a mounting target angle corrected by the correction angle dθ. The selection unit 513 compares the correction angle dθ with a first threshold value θ1 to determine whether the difference therebetween is small. Specifically, if the correction angle dθ is less than the first threshold value θ1, the selection unit 513 determines that the difference is small and selects the initial mounting target angle. Note that the first threshold value θ1 is smaller than the second threshold value θ2 used by the determination unit 512.

[0137] The configuration of the manufacturing system 10 (the system for manufacturing a mounting substrate) of this embodiment has been described above. Next, the operation and processing procedure of the manufacturing system 10 as well as the method for manufacturing a mounting substrate will be described.

[0138] In the substrate input process, the substrate 100 having the solder precoat 102 formed on the lands 101 is input into the manufacturing system 10 ((a) of FIG. 3). In this embodiment, the substrate 100 is input into the first inspection device 300 located at the head of the manufacturing system 10.

[0139] <Representative Point Acquisition Process> After receiving the supplied board 100, the first inspection device 300 inspects the solder precoat formed on the lands ((b) of FIG. 3). The first inspection device 300 acquires two-dimensional images or three-dimensional data of the solder precoat acquired by the imaging and measurement unit 302, and processes the two-dimensional images or three-dimensional data and other measurement data in the inspection unit 301 to determine the state of the solder precoat 102. For mounting points 111 determined to be defective by the inspection unit 301, a "mounting unacceptable flag" is set, and a "board NG flag" is set for the board 100 including the mounting point 111. The first inspection device 300 determines and acquires a representative point based on the three-dimensional shape of the solder precoat identified from the two-dimensional image or three-dimensional data by the representative point identification unit 303.

[0140] <Inspection Result Storage Process> The first inspection device 300 transmits the representative points 105 and flag information together with the inspection results to the information processing device 20. When the information processing device 20 receives the representative points 105 and flag information from the first inspection device 300, it associates these with information that can identify the board 100 and the mounting points 111 and stores them in the information storage unit 21. The information processing device 20 stores the coordinate data of the representative points 105 in the first information storage unit 21A, and stores the flag information in the second information storage unit 21B.

[0141] <Flux Supplying Process> The flux application device 400 performs a flux supplying process ((c) of FIG. 3) on the board 100 inspected by the first inspection device 300. The flux supplying process is a process of applying flux (solder flux) 103 so as to cover the solder precoat 102 formed on the lands 101 of the board 100. The flux application device 400 may be a screen printing device.

[0142] <Processing by Component Mounting Apparatus> Figures 8A and 8B are flowcharts showing the operation of the component mounting apparatus 500 according to embodiment 1. The component mounting apparatus 500 operates according to the flowcharts of Figures 8A and 8B.

[0143] After the flux supply process, the board 100 is sent from the flux application device 400 to the component mounting device 500. When the board 100 coated with the flux 103 is carried into the component mounting device 500 (step S1), the control unit 510 of the component mounting device 500 acquires the inspection results from the first inspection device 300 from the information processing device 20 (step S2: inspection result acquisition step ((d) of FIG. 3 )). The inspection results include coordinate data of the representative point 105 included in the multiple mounting points 111 on the carried-in board 100 and flag information set for the multiple mounting points 111.

[0144] The control unit 510 refers to the acquired inspection results and checks whether a substrate NG flag has been set for the carried-in substrate 100 (step S3). If the substrate 100 is an aggregate substrate 100B, it checks whether a substrate NG flag has been set for each unit substrate 100C. If a substrate NG flag has been set, the process branches to "Yes" in step S3 and proceeds to processing in step S17. If the control unit 510 confirms that a substrate NG flag has not been set, the process branches to "No" in step S3 and proceeds to processing in step S4 (FIG. 8B).

[0145] Next, the calculation unit 511 resets a counter (k) for counting the mounting points 111 (step S4) and sets the number (k) of the mounting point to be referenced (step S5). The calculation unit 511 references the inspection results of the (k)th mounting point 111 (step S6) and calculates the mounting target position 106 of the (k)th mounting point 111 using the representative point 105 included in the inspection results (step S7: calculation step ((d) of FIG. 3 )). In this manner, the calculation unit 511 determines the mounting target position 106 at the mounting point 111 based on the representative point 105 acquired based on the three-dimensional shape of the solder precoat 102. If the (k)th mounting point 111 is a mounting point where a two-terminal component is to be mounted, the calculation unit 511 calculates the correction angle dθ based on the representative point 105 to determine the mounting target angle at the mounting point 111 ((d) of FIG. 3 ).

[0146] Next, the determination unit 512 determines whether the set mounting target position 106 satisfies a predetermined criterion (step S8: determination step). When a position on the board surface is expressed in XY coordinates, the determination unit 512 determines in step S8 whether the difference between the XY coordinates of the initial target position 104 and the XY coordinates of the mounting target position 106, i.e., the correction amount (dX, dY) of the component mounting position, satisfies a predetermined criterion (whether it is less than the second threshold T2).

[0147] The "predetermined standard" in step S8 is the allowable error of the mounting target position 106 relative to the initial target position 104, and if this error is within a preset allowable range, the "predetermined standard" is met. In this way, the determination unit 512 determines whether the difference between the initial target position 104 and the mounting target position 106 at the mounting point 111 meets the predetermined standard. If the determination unit 512 determines that the correction amount meets the standard, it branches to "Yes" in step S8 and proceeds to step S9. On the other hand, if the determination unit 512 determines that the correction amount does not meet the predetermined standard in step S8, it branches to "No" and sets a "mounting not possible flag" for the (k)th mounting point 111 (step S81).

[0148] Next, the selection unit 513 determines whether the differences (correction amounts (dX, dY)) between the X and Y coordinates of the initial target position 104 and the X and Y coordinates of the target position 106 are both small (step S9: selection step).

[0149] If the selection unit 513 determines in step S9 that the correction amount is not small, it branches to "No" and proceeds to step S10, and if it determines that the correction amount is small, it branches to "Yes" and proceeds to step S91.

[0150] For the (k)th mounting point 111 for which it is determined in step S9 that the correction amount is not small, the setting unit 514 sets the new mounting target position 106 calculated by the calculation unit 511 as the mounting target position (step S10: setting step). That is, the mounting target position of the (k)th mounting point 111 is updated from the initial target position 104 to the new mounting target position 106.

[0151] Furthermore, the setting unit 514 does not update the mounting target position of the (k)th mounting point 111 for which the correction amount was determined to be small in step S9, and maintains the initial target position 104 (step S91: setting step). Step S9 is a selection step in which the selection unit 513 determines whether to apply the initial target position 104 to the mounting target position of the (k)th mounting point 111, or whether to apply the new mounting target position 106 calculated by the calculation unit 511. In accordance with the determination made in step S9 (selection step), the setting unit 514 executes step S12 (setting step) or step S121 (setting step).

[0152] Next, if the correction angle dθ (target mounting angle) is found in step S7, steps S11 and S12 are executed, and if the correction angle dθ (target mounting angle) is not found, steps S11, S12, S13, and S121 are skipped and the process proceeds to step S14.

[0153] The determination unit 512 determines whether the correction angle dθ satisfies a predetermined criterion (whether the correction angle dθ is less than the second threshold value θ2) (step S11: determination step). If the determination unit 512 determines that the correction angle dθ satisfies the predetermined criterion, the process branches to "Yes" in step S11 and proceeds to step S12. On the other hand, if the determination unit 512 determines that the correction angle dθ does not satisfy the predetermined criterion in step S11, the process branches to "No" and sets a "mounting unacceptable flag" for the (k)th mounting point 111 (step S81).

[0154] Next, the selection unit 513 determines whether the correction angle dθ is small (whether it is smaller than the first threshold value θ1) (step S12: selection step). If the selection unit 513 determines in step S12 that the correction angle dθ is not small, it branches to "No" and proceeds to step S13, and if it determines that the correction angle dθ is small, it branches to "Yes" in step S12 and proceeds to step S121.

[0155] The setting unit 514 sets the mounting target angle of the (k)th mounting point 111, for which it was determined in step S12 that the correction angle dθ is not small, to the mounting target angle corrected by the correction angle dθ calculated in step S7 (step S13: setting process). That is, the mounting target angle of the (k)th mounting point 111 is updated from the initial target angle to the mounting target angle corrected by the correction angle dθ. Furthermore, the setting unit 514 does not update the mounting target angle of the (k)th mounting point 111, for which it was determined in step S12 that the correction angle dθ is small, but maintains the initial target angle (dθ = 0) (step S121: setting process).

[0156] If the criteria are not met in the judgment process (steps S8 and S11), it is assumed that the solder precoat 102 has not been properly formed on the land 101. Even if a component is mounted at a mounting target position 106 that does not meet the criteria, there is a high possibility that defective soldering will occur in the subsequent reflow process. By having the judgment unit 512 of the control unit 510 determine whether the mounting target position 106 is appropriate, and controlling the controller 510 to mount the component at the mounting target position 106 if appropriate, it is possible to prevent defective soldering from occurring.

[0157] In this embodiment, the determination step (steps S8 and S11) and the selection step (steps S9 and S12) are executed, but both or either one of these steps may be eliminated (omitted). If the selection step is eliminated, the setting step (steps S10 and S13) is executed, and the mounting target position and mounting target angle calculated in the calculation step (step S7) are set as the new mounting target position 106 and mounting target angle.

[0158] In step S14, the calculation unit 511 determines whether or not there are any unprocessed mounting points 111. If the calculation unit 511 determines that there are any unprocessed mounting points 111, it branches to "Yes" in step S14, moves to step S5, and repeats the process until there are no more unprocessed mounting points 111.

[0159] Thereafter, the determination unit 512 determines whether components can be mounted on all mounting points 111 (step S15). The determination unit 512 determines whether components can be mounted based on the presence or absence of a mounting unacceptable flag. If there is even one mounting point 111 for which a mounting unacceptable flag is set, the determination unit 512 branches to "No" in step S15 and sets a board NG flag for that board (step S16). After completing the processes of steps S15 and S16, the determination unit 512 proceeds to step S17.

[0160] The control unit 510 determines whether there are any unprocessed unit substrates 100C (step S17). If there are any unprocessed unit substrates 100C, the process branches to "Yes" in step S17, and the process returns to step S3 to repeat the process for the unprocessed unit substrates 100C. If the control unit 510 determines that there are no unprocessed unit substrates 100C, or if the substrate is a normal substrate 100A, the process branches to "No" in step S17.

[0161] Next, the control unit 510 determines whether or not to perform the component mounting work (step S18). If the board is a normal board 100A and the board NG flag is set, the component mounting work is not performed. Also, if the board is a unit board 100C and the board NG flag is set for all of the unit boards 100C, the component mounting work is not performed. On the other hand, if the board is a normal board 100A and the board NG flag is not set, or if there are unit boards 100C in the aggregate board 100B for which the board NG flag is not set, the process branches to (Yes) in step S18 and the component mounting work (mounting process) is performed (step S19).

[0162] Next, the control unit 510 operates the board transport conveyor 521 built into the component mounting device 500 to carry out the board 100 on which the component mounting operation has been completed or the board 100 on which it was determined in step S18 that no components will be mounted (step S20). The control unit 510 transmits flag information to the information processing device 20 via the communication cable 12 at the timing of or before the board is carried out. The information processing device 20 stores the transmitted flag information in the second information storage unit 21B.

[0163] <Component Mounting State Inspection Process> The board unloaded from the mounting device 500 is sent to the second inspection device (mounting state inspection device) 600. The second inspection device 600 executes a second inspection process to inspect the component mounting state. The second inspection device 600 inspects the component mounting state for each mounting point 111, and if any mounting point 111 is found to be defective, it sets a board NG flag for the normal board 100A if the board is a normal board 100A, or sets a board NG flag for the unit board 100C including the mounting point 111 determined to be defective if the board is an aggregate board 100B. The inspection results are transmitted to the information processing device 20. The information processing device 20 stores the inspection results, including the transmitted "board NG flag" information, in the second information storage unit 21B. When the inspection is complete, the second inspection device 600 unloads the board.

[0164] The boards carried out from the second inspection device 600 are sent to the worker station. Here, the transport of a normal board 100A with a "board NG flag" attached or an aggregate board 100B with all unit boards 100C with a "board NG flag" attached is stopped at the worker station 700, and a worker is notified. The worker removes the board whose transport has been stopped from the worker station 700. This makes it possible to prevent the occurrence of defective mounted boards.

[0165] <Reflow Process> After passing through the operator station 700, the board 100 is sent to the reflow device 800, where the reflow process is carried out. The reflow device 800 heats the board 100 with a built-in heating device to melt the solder precoat 102 and solder the component 200 to the board 100. In the reflow process, the flux 103 softens and the solder precoat 102 melts. The board 100 is then cooled, whereby the terminals 201 of the component 200 are soldered to the lands ((f) in FIG. 3 ).

[0166] In this manner, a mounting substrate 110 on which components (electronic components) are mounted is obtained. According to the method for manufacturing the component mounting substrate 110, it is possible to mount minute components on a substrate with high yield and high productivity.

[0167] The completed component-mounted board 110 is sent from the reflow device 800 to a third inspection device (board inspection device) 900 for inspection. The third inspection device inspects the soldered state of the components.

[0168] 10 is a schematic diagram showing the configuration of the main parts of a manufacturing system 10A according to embodiment 2. In embodiment 1, the function (calculation unit 511) for calculating the target mounting position 106 at the mounting point 111 based on the representative point 105 is provided in the component mounting device 500, but in embodiment 2, this function is provided in the information processing device 20A. Note that the same parts as in embodiment 1 are designated by the same reference numerals, and redundant explanations will be omitted.

[0169] Information processing device 20A is similar to that of embodiment 1, except that it has third information storage unit 21C and calculation unit 22. Calculation unit 22 has the same function as calculation unit 511 of embodiment 1, and calculates target placement position 106 at which component 200 is to be placed based on representative point 105 detected by first inspection device 300. Third information storage unit 21C stores information such as target placement position 106, correction angle dθ, and correction amount (dX, dY) set by calculation unit 22.

[0170] The component mounting device 500A is the same as that of the first embodiment except for the control unit 510A. The component mounting device 500A acquires information such as the target mounting position 106, the correction angle dθ, and the correction amount (dX, dY) stored in the third information storage unit 21C.

[0171] The control unit 510A causes the mounting head 520 to perform a mounting operation according to a predetermined program. The control unit 510A includes a setting unit 514A that sets a target mounting position of a component at a mounting point. The setting unit 514A further includes a determination unit 512 and a selection unit 513. The setting unit 514A executes the same processing as the setting unit 514 in the first embodiment. The determination unit 512 and the selection unit 513 are the same as those in the first embodiment.

[0172] 11 is a flowchart showing the operation of the component mounting device 500A of the manufacturing system 10A according to the second embodiment. The operation is basically the same as that of the first embodiment, except that in step S2, information such as coordinate data of the mounting target position 106, the correction amount (dX, dY), and the correction angle dθ stored in the third information storage unit 21C is acquired. The component mounting device 500A does not calculate the mounting target position 106. The setting unit 514A of the control unit 510A performs a determination process and, if necessary, a selection process using the coordinate data of the mounting target position 106 calculated by the calculation unit 22 of the information processing device 20A, and sets the mounting target position of the component at the mounting point and, if necessary, the mounting target angle.

[0173] While the present invention has been described in terms of presently preferred embodiments, such disclosure is not to be interpreted as limiting. Various changes and modifications will no doubt become apparent to those skilled in the art to which the present invention pertains upon reading the above disclosure. It is therefore intended that the appended claims be interpreted to cover all changes and modifications that do not depart from the true spirit and scope of the invention.

[0174] (Additional Notes) The above disclosure discloses the following technologies. (Technology 1) A method for manufacturing a component-mounted board, which manufactures a component-mounted board having mounting points each including a plurality of lands on which a solder precoat is formed, and which mounts components on the board, the method comprising: a representative point acquisition step of acquiring a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a component mounting step of mounting the components at target mounting positions at the mounting points determined based on the plurality of representative points. (Technology 2) A method for manufacturing a component-mounted board according to Technology 1, in which the representative point acquisition step acquires three-dimensional data of the solder precoat and acquires the representative points based on the three-dimensional data. (Technology 3) A method for manufacturing a component-mounted board according to Technology 1 or 2, in which the representative point acquisition step detects the position of the center of gravity of an area of ​​a top of the solder precoat and acquires the position of the center of gravity as the representative point. (Technology 4) A method for manufacturing a component-mounted board according to Technology 1 or 2, in which the representative point acquisition step detects an apex of the solder precoat and acquires the apex as the representative point. (Technology 5) The method for manufacturing a component-mounted board according to Technology 4, wherein, when multiple vertices are detected for a single land, the representative point acquisition step acquires a position determined by the average of coordinates of the multiple vertices as the representative point. (Technology 6) The method for manufacturing a component-mounted board according to Technology 1, wherein the representative point acquisition step acquires a two-dimensional image by capturing light reflected from illumination light irradiated on the solder precoat, and acquires the representative point based on the two-dimensional image. (Technology 7) The method for manufacturing a component-mounted board according to Technology 6, wherein the representative point acquisition step identifies a range of a peak in the two-dimensional image and acquires the position of the center of gravity of the peak as the representative point. (Technology 8) The method for manufacturing a component-mounted board according to any one of Technology 1 to 7, further comprising: a calculation step of calculating the target mounting position of the component at the mounting point based on the multiple representative points; and a determination step of determining whether a difference between the target mounting position and an initial target position determined based on a design value or the multiple lands satisfies a predetermined criterion, and aborts mounting of the component at the mounting point if the criterion is not satisfied.(Technology 9) The method for manufacturing a component-mounted board according to Technology 8, wherein, on a board having a plurality of the mounting points, the judgment step is performed for each of the plurality of mounting points to be judged, and the mounting step is performed only on boards where all of the plurality of mounting points to be judged satisfy the predetermined criterion. (Technology 10) The method for manufacturing a component-mounted board according to Technology 8 or 9, further comprising a judgment result notifying step of notifying an operator of the judgment result if the predetermined criterion is not satisfied in the judgment step. (Technology 11) The method for manufacturing a component-mounted board according to any one of Technology 1 to 10, further comprising: a calculation step of calculating a target mounting position of a component at the mounting point based on the plurality of representative points; and a selection step of selecting, as the target mounting position to be used in the component mounting step, either the initial target position or the target mounting position determined in the calculation step, based on a difference between the target mounting position and an initial target position determined based on a design value or the plurality of the lands. (Technology 12) The method for manufacturing a component-mounted board according to any one of Technologies 1 to 11, further comprising a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points, wherein the component has two terminals, and the mounting point includes two lands to which the two terminals of the component are respectively connected, and the calculation step determines the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. (Technology 13) The method for manufacturing a component-mounted board according to Technology 12, further comprising a calculation step of calculating a target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands. (Technology 14) The method for manufacturing a component-mounted board according to any one of Technologies 1 to 11, further comprising a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points, wherein the component has three or more terminals, and the mounting point includes three or more lands to which the three or more terminals of the component are respectively connected, and the calculation step determines the target mounting position using an average value of differences between the centers of the lands and the representative point.(Technology 15) A component-mounted board manufacturing system comprising: an inspection device that, on a board having mounting points each including a plurality of lands on which a solder precoat is formed, acquires a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a component mounting device that mounts the components at target mounting positions at the mounting points determined based on the plurality of representative points. (Technology 16) The component-mounted board manufacturing system according to Technology 15, wherein the inspection device acquires three-dimensional data of the solder precoat and acquires the representative points based on the three-dimensional data. (Technology 17) The component-mounted board manufacturing system according to Technology 16, wherein the inspection device detects the position of the center of gravity of the top of the solder precoat based on the three-dimensional data and acquires the position of the center of gravity as the representative point. (Technology 18) The component-mounted board manufacturing system according to Technology 16, wherein the inspection device detects the apex of the solder precoat based on the three-dimensional data and acquires the apex as the representative point. (Technology 19) The component-mounted board manufacturing system according to Technology 18, wherein, when multiple vertices are detected on the single land, the inspection device acquires a position determined by the average of the coordinates of the multiple vertices as the representative point. (Technology 20) The component-mounted board manufacturing system according to Technology 15, wherein the inspection device acquires a two-dimensional image by capturing reflected light of illumination light irradiated on the solder precoat, and determines the representative point based on the two-dimensional image. (Technology 21) The component-mounted board manufacturing system according to Technology 20, wherein the inspection device identifies the range of a peak in the two-dimensional image and acquires the position of the center of gravity of the peak as the representative point. (Technology 22) The component-mounted board manufacturing system according to any one of Technology 15 to 21, further comprising: a calculation unit that calculates the mounting target position based on the multiple representative points; and a determination unit that determines whether a difference between the mounting target position and an initial target position determined based on a design value or the multiple lands satisfies a predetermined criterion, and wherein the component mounting device cancels mounting of components on the mounting points that do not satisfy the criterion.(Technology 23) The component-mounted board manufacturing system according to Technology 22, wherein the determination unit determines whether the predetermined criterion is met for each of the plurality of mounting points to be determined on a board having a plurality of the mounting points, and the component mounting device mounts the components only on a board where all of the plurality of mounting points to be determined satisfy the predetermined criterion. (Technology 24) The component-mounted board manufacturing system according to Technology 22 or 23, further comprising a determination result notifying unit that notifies an operator of the determination result when the determination unit determines that the predetermined criterion is not met. (Technology 25) The component-mounted board manufacturing system according to any one of Technology 15 to 24, further comprising a calculation unit that calculates the mounting target position based on the plurality of representative points, and a selection unit that selects whether to mount the component at the initial target position or the mounting target position based on a difference between the mounting target position and an initial target position determined based on a design value or the plurality of lands. (Technology 26) The system for manufacturing component-mounted boards according to any one of Technologies 15 to 25, further comprising a calculation unit that calculates the target mounting position based on a plurality of the representative points, wherein the mounting points include two lands to which each of the terminals of the component having two terminals is connected, and the calculation unit determines the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. (Technology 27) The system for manufacturing component-mounted boards according to Technology 26, further comprising a calculation unit that calculates the target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands. (Technology 28) The system for manufacturing component-mounted boards according to any one of Technologies 15 to 25, further comprising a calculation unit that calculates the target mounting position based on a plurality of the representative points, wherein the mounting points include three or more lands to which each of the terminals of the component having three or more terminals is connected, and the calculation unit determines the target mounting position using an average value of differences between the centers of the lands and the representative points.(Technology 29) An information processing device that determines a target mounting position of a component used in a component mounting device that can mount components on a board having a mounting point with a plurality of lands on which solder precoats are formed, the information processing device having a calculation unit that calculates the target mounting position of the component at the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats. (Technology 30) The information processing device according to Technology 29, wherein the mounting point includes two lands to which each of the terminals of the component having two terminals is connected, and the calculation unit determines the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. (Technology 31) The information processing device according to Technology 30, wherein the calculation unit further determines a target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands. (Technology 32) The information processing device according to Technology 29, wherein the mounting point includes three or more lands to which each of the terminals of the component having three or more terminals is connected, and the calculation unit determines the target mounting position using an average value of differences between the centers of the lands and the representative points. (Technology 33) A mounting target position calculation method for calculating a target mounting position of a component used in a component mounting device capable of mounting components on a board having a mounting point having a plurality of lands on which solder precoats are formed, the method calculating the target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats. (Technology 34) The mounting point includes two lands to which each of the terminals of the component having two terminals is connected, and the mounting target position calculation method according to Technology 33 calculates the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. (Technology 35) The mounting target position calculation method according to Technology 34 further calculates the target mounting angle of the component from the angle of a line segment connecting the representative points of the two lands. (Technology 36) The mounting point includes three or more lands to which each of the terminals of the component having three or more terminals is connected, and the mounting target position calculation method according to Technology 33 calculates the target mounting position using an average value of the differences between the centers of the lands and the representative points.(Technology 37) A component mounting device that mounts components at mounting points of a substrate having a plurality of mounting points each having a land on which a solder precoat is formed, the component mounting device comprising: a calculation unit that determines a target mounting position of the mounting point based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a mounting head that mounts the component at the target mounting position. (Technology 38) The component mounting device according to Technology 37 further comprises a determination unit that determines whether a difference between the target mounting position and an initial target position determined based on a design value or the plurality of lands satisfies a predetermined criterion, and the component mounting device cancels component mounting at any mounting point that does not satisfy the criterion. (Technology 39) The component mounting device according to Technology 38, wherein the determination unit determines whether the predetermined criterion is satisfied for each of the plurality of mounting points to be determined on a substrate having a plurality of the mounting points, and the component mounting device mounts the component only on a substrate where all of the plurality of mounting points to be determined satisfy the predetermined criterion. (Technology 40) The component mounting device according to Technology 38 or 39, further comprising a determination result notifying unit that notifies an operator of the determination result when the determining unit determines that the predetermined criterion is not satisfied. (Technology 41) The component mounting device according to any one of Technology 37 to 40, further comprising a selection unit that selects whether to mount the component at the initial target position or at the target mounting position based on a difference between an initial target position determined based on a design value or a plurality of the lands and the target mounting position. (Technology 42) The component mounting device according to any one of Technology 37 to 41, wherein the mounting point includes two lands to which terminals of the component having two terminals are connected, and the calculation unit calculates the midpoint of a line segment connecting the representative points of the two lands as the target mounting position. (Technology 43) The component mounting device according to Technology 42, wherein the calculation unit further calculates the target mounting angle of the component from the angle of the line segment connecting the representative points of the two lands.(Technology 44) The component mounting device according to any one of Technologies 37 to 41, wherein the mounting point includes three or more lands to which each of the terminals of the component having three or more terminals is connected, and the calculation unit calculates the target mounting position using an average value of differences between the centers of the lands and the representative point. (Technology 45) A component mounting method for mounting a component at a mounting point on a substrate, the mounting point having a plurality of lands on which solder precoats are formed, the component mounting method comprising: a component mounting step for mounting the component at a target mounting position for the component at the mounting point calculated based on a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats. (Technology 46) The component mounting method according to Technology 45, further comprising: a calculation step for calculating the target mounting position based on the plurality of representative points; and a determination step for determining whether a difference between the target mounting position and an initial target position determined based on a design value or the plurality of lands satisfies a predetermined criterion, and the component mounting at the mounting point that does not satisfy the criterion is canceled. (Technology 47) The component mounting method according to Technology 46, wherein the judging step judges whether or not the predetermined criterion is satisfied for each of the plurality of mounting points to be judged on a board having a plurality of the mounting points, and the component mounting step is executed only on boards where all of the plurality of mounting points to be judged satisfy the predetermined criterion. (Technology 48) The component mounting method according to Technology 46 or 47, further comprising a judgment result notifying step of notifying an operator of the judgment result when it is judged in the judging step that the predetermined criterion is not satisfied. (Technology 49) The component mounting method according to any one of Technology 45 to 48, further comprising: a calculation step of calculating the mounting target position based on the plurality of representative points, and a selection step of selecting whether to mount the component at the initial target position or the mounting target position based on a difference between the mounting target position and an initial target position determined based on a design value or the plurality of lands. (Technology 50) A component mounting method according to any one of Techniques 45 to 49, wherein the mounting point includes two lands to which terminals of the component having two terminals are connected, and the calculation step determines, as the target mounting position, the midpoint of a line segment connecting the representative points of the two lands.(Technology 51) A component mounting method according to Technology 50, wherein the calculation step further calculates a target mounting angle of the component from the angle of a line segment connecting the representative points of two of the lands. (Technology 52) A component mounting method according to any one of Technology 45 to 49, further comprising a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points, wherein the mounting point includes three or more lands to which terminals of the component having three or more terminals are connected, and the calculation step calculates the target mounting position using an average value of differences between the centers of the lands and the representative points. (Technology 53) A solder precoat inspection device that inspects a solder precoat formed on a land to which a terminal of a component is soldered, comprising: a data acquisition unit that acquires two-dimensional images or three-dimensional data of the solder precoat, and a representative point identification unit that acquires a representative point determined based on the three-dimensional shape of the solder precoat identified from the two-dimensional images or the three-dimensional data. (Technology 54) The solder precoat inspection device according to Technology 53, wherein the data acquisition unit acquires the three-dimensional data, and the representative point identification unit detects the centroid position of the top of the solder precoat based on the three-dimensional data and acquires the centroid position as the representative point. (Technology 55) The solder precoat inspection device according to Technology 53, wherein the data acquisition unit acquires the three-dimensional data, and the representative point identification unit detects the vertices of the solder precoat based on the three-dimensional data and acquires the vertices as the representative points. (Technology 56) The solder precoat inspection device according to Technology 55, wherein, when multiple vertices are detected in a single land, the representative point identification unit acquires a position determined by the average of the coordinates of the multiple vertices as the representative point. (Technology 57) The solder precoat inspection device according to Technology 53, wherein the data acquisition unit acquires the two-dimensional image by capturing reflected light of illumination light irradiated on the solder precoat. (Technology 58) The solder precoat inspection device according to Technology 57, wherein the representative point specifying unit specifies a range of a peak in the two-dimensional image and obtains the position of the center of gravity of the peak as the representative point.(Technology 59) The solder precoat inspection device according to Technology 57 or 58, wherein the illumination light is grid-shaped light emitted from a projector. (Technology 60) A solder precoat inspection method for inspecting a solder precoat formed on a land to which a terminal of a component is soldered, comprising: a data acquisition step of acquiring a two-dimensional image or three-dimensional data of the solder precoat; and a representative point acquisition step of acquiring a representative point determined based on a three-dimensional shape of the solder precoat identified from the two-dimensional image or the three-dimensional data. (Technology 61) The solder precoat inspection method according to Technology 60, wherein the data acquisition step acquires the three-dimensional data, and the representative point acquisition step detects the position of the center of gravity of the top of the solder precoat based on the three-dimensional data and acquires the position of the center of gravity as the representative point. (Technology 62) The solder precoat inspection method according to Technology 60, wherein the data acquisition step acquires the three-dimensional data, and the representative point acquisition step detects vertices of the solder precoat based on the three-dimensional data and acquires the vertices as the representative points. (Technology 63) The solder precoat inspection method according to Technology 62, wherein the representative point acquisition step acquires a position determined by the average of coordinates of the vertices as the representative point if multiple vertices are detected in a single land. (Technology 64) The solder precoat inspection method according to Technology 60, wherein the data acquisition step acquires the two-dimensional image by capturing reflected light of illumination light irradiated on the solder precoat. (Technology 65) The solder precoat inspection method according to Technology 64, wherein the representative point acquisition step identifies the range of vertices in the two-dimensional image and acquires the area center of gravity position of the vertices as the representative point. (Technology 66) The solder precoat inspection method according to Technology 64 or 65, wherein the illumination light is lattice-pattern light emitted from a projector.

[0175] The present disclosure can be used for a method and a system for manufacturing a component-mounted substrate. Although the present invention has been described with reference to presently preferred embodiments, such disclosure should not be interpreted as limiting. Various modifications and alterations will undoubtedly become apparent to those skilled in the art to which the present invention pertains upon reading the above disclosure. Therefore, the appended claims should be construed to cover all modifications and alterations without departing from the true spirit and scope of the present invention.

[0176] 10, 10A: Manufacturing system 11: Substrate conveying line 12: Communication cable 20, 20A: Information processing device 21: Information storage unit 21A: First information storage unit 21B: Second information storage unit 21C: Third information storage unit 22, 511: Calculation unit 100A: Solder pre-coated substrate (normal substrate) 100B: Solder pre-coated substrate (aggregate substrate) 100C: Unit substrate 101: Land 102: Solder pre-coat 103: Flux 104: Initial target position 105: Representative point 106: Mounting target position 110: Component mounting substrate 111: Mounting point 200: Component 201: Terminal 300: First inspection device 301: Inspection unit 302: Imaging and measuring unit 303: Representative point identification unit 400: Coating device 500, 501, 502, 500A: Component mounting device 510, 510A: Control unit 512: Determination unit 513: Selection unit 514, 514A: Setting unit 520: Mounting head 521: Board transport conveyor 522: Board guide 530: Operation and display unit 540: Component supply unit 541: Suction nozzle 550: Moving device 551: Lifting platform 552: Backup pin 553: Lifting unit 554: Upper surface presser 555: Board holding unit 600: Second inspection device 700: Worker station 800: Reflow device 900: Third inspection device

Claims

1. A method for manufacturing a component-mounted board, which manufactures a component-mounted board having mounting points with a plurality of lands on which solder precoats are formed, and which mounts components on the board, the method comprising: a representative point acquisition step of acquiring a plurality of representative points determined based on the three-dimensional shapes of each of the plurality of solder precoats; and a component mounting step of mounting the components at target mounting positions at the mounting points determined based on the plurality of representative points.

2. The method for manufacturing a component mounting board according to claim 1, wherein the representative point acquisition step acquires three-dimensional data of the solder precoat and acquires the representative points based on the three-dimensional data.

3. The method for manufacturing a component mounting board according to claim 2, wherein the representative point acquisition step detects the centroid position of the top of the solder precoat and acquires the centroid position as the representative point.

4. The method for manufacturing a component mounting board according to claim 2, wherein the representative point acquisition step detects a peak of the solder precoat and acquires the peak as the representative point.

5. A method for manufacturing a component mounting board as described in claim 4, wherein, when multiple vertices are detected on a single land, the representative point acquisition step acquires a position determined by the average of the coordinates of the multiple vertices as the representative point.

6. The method for manufacturing a component mounting board according to claim 1, wherein the representative point acquisition step acquires a two-dimensional image by capturing the reflected light of illumination light irradiated onto the solder precoat, and acquires the representative point based on the two-dimensional image.

7. The method for manufacturing a component mounting board according to claim 6, wherein the representative point acquisition step identifies the range of the apex in the two-dimensional image and acquires the position of the center of gravity of the apex as the representative point.

8. A method for manufacturing a component mounting board as claimed in claim 1, further comprising: a calculation step of calculating the target mounting position of the component at the mounting point based on a plurality of the representative points; and a determination step of determining whether or not a difference between the target mounting position and an initial target position determined based on a design value or a plurality of the lands satisfies a predetermined criterion; and halting the mounting of the component at the mounting point that does not satisfy the criterion.

9. A method for manufacturing a component mounting board as described in claim 8, wherein, in a board having a plurality of said mounting points, the judgment process is carried out for each of the plurality of mounting points to be judged, and the mounting process is carried out only for boards in which all of the plurality of mounting points to be judged satisfy the predetermined criteria.

10. The method for manufacturing a component mounting board according to claim 8, further comprising a determination result notifying step of notifying an operator of the determination result when the predetermined standard is not met in the determination step.

11. A method for manufacturing a component mounting board as claimed in claim 1, further comprising: a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points; and a selection step of selecting, as the target mounting position to be used in the component mounting step, either the initial target position or the target mounting position determined in the calculation step, based on the difference between the target mounting position and an initial target position determined based on a design value or a plurality of the lands.

12. A method for manufacturing a component mounting board as described in claim 1, further comprising a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points, wherein the component has two terminals, the mounting point includes two lands to which the two terminals of the component are respectively connected, and the calculation step determines the midpoint of a line segment connecting the representative points of the two lands as the target mounting position.

13. The method for manufacturing a component mounting board according to claim 12, wherein the calculation step further determines a target mounting angle for the component from the angle of a line segment connecting the representative points of the two lands.

14. A method for manufacturing a component mounting board as described in claim 1, further comprising a calculation step of calculating a target mounting position of the component at the mounting point based on a plurality of the representative points, wherein the component has three or more terminals, the mounting point includes three or more lands to which the three or more terminals of the component are respectively connected, and the calculation step determines the target mounting position using an average value of the differences between the centers of the lands and the representative points.

15. A manufacturing system for component-mounted boards, comprising: an inspection device that acquires a plurality of representative points determined based on the three-dimensional shapes of each of a plurality of solder precoats on a board having mounting points with a plurality of lands on which solder precoats are formed; and a component mounting device that mounts the components at target mounting positions at the mounting points determined based on the plurality of representative points.

16. The component mounting board manufacturing system according to claim 15, wherein the inspection device acquires three-dimensional data of the solder precoat and acquires the representative point based on the three-dimensional data.

17. The component mounting board manufacturing system according to claim 16, wherein the inspection device detects the position of the center of gravity of the top of the solder precoat based on the three-dimensional data, and acquires the position of the center of gravity as the representative point.

18. The component mounting board manufacturing system according to claim 16, wherein the inspection device detects the apex of the solder precoat based on the three-dimensional data and acquires the apex as the representative point.

19. A component mounting board manufacturing system as described in claim 18, wherein, when multiple vertices are detected on the single land, the inspection device acquires a position determined by the average of the coordinates of the multiple vertices as the representative point.

20. The component mounting board manufacturing system according to claim 15, wherein the inspection device captures the reflected light of illumination light irradiated onto the solder precoat to obtain a two-dimensional image, and determines the representative point based on the two-dimensional image.

21. The component mounting board manufacturing system according to claim 20, wherein the inspection device identifies the range of the apex in the two-dimensional image and acquires the position of the center of gravity of the apex as the representative point.

22. The system for manufacturing component mounting boards according to claim 15, further comprising: a calculation unit that calculates the target mounting position based on a plurality of the representative points; and a determination unit that determines whether a difference between the target mounting position and an initial target position determined based on a design value or a plurality of the lands satisfies a predetermined criterion, wherein the component mounting device stops mounting components at the mounting points that do not satisfy the criterion.

23. A manufacturing system for component-mounted boards as described in claim 22, wherein the judgment unit judges whether or not the predetermined criteria are met for each of the plurality of mounting points to be judged on a board having a plurality of the mounting points, and the component mounting device mounts the components only on boards where all of the plurality of mounting points to be judged meet the predetermined criteria.

24. The component mounting board manufacturing system according to claim 22, further comprising a judgment result notification unit that notifies an operator of the judgment result when the judgment unit determines that the predetermined standard is not met.

25. The component mounting board manufacturing system according to claim 15, further comprising: a calculation unit that calculates the target mounting position based on a plurality of the representative points; and a selection unit that selects whether to mount the component at the initial target position or at the target mounting position based on the difference between the target mounting position and an initial target position determined based on a design value or a plurality of the lands.

26. A component mounting board manufacturing system as described in claim 15, further comprising a calculation unit that calculates the target mounting position based on a plurality of the representative points, wherein the mounting points include two lands to which each of the terminals of the component having two terminals is connected, and the calculation unit determines the midpoint of a line segment connecting the representative points of the two lands as the target mounting position.

27. A component mounting board manufacturing system according to claim 26, wherein the calculation unit further determines a target mounting angle for the component from the angle of a line segment connecting the representative points of two of the lands.

28. A component mounting board manufacturing system as described in claim 15, further comprising a calculation unit that calculates the target mounting position based on a plurality of the representative points, wherein the mounting points include three or more lands to which each of the terminals of the component having three or more terminals is connected, and the calculation unit determines the target mounting position using an average value of the differences between the centers of the lands and the representative points.

Images