Antenna package

Abstract

An antenna package according to embodiments of the present invention comprises: a first transparent base material extending in a first direction; an antenna element arranged on the first transparent base material and comprising a bonding portion spaced apart from one end portion of the first transparent base material in the first direction; a circuit board connected to the antenna element at the bonding portion; and a margin portion which is arranged between the bonding portion and a virtual line extending from one end portion of the first transparent base material in a second direction that is perpendicular to the first direction on the cross-section.

Description

antenna package

[0001] The present invention relates to an antenna package. More specifically, the present invention relates to an antenna package including an antenna element and a circuit board.

[0002]

[0003] With the recent development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, and buildings.

[0004] In addition, as mobile communication technology has evolved recently, antennas for performing high-frequency or ultra-high-frequency communication are being applied to public transportation such as buses and subways, building structures, and various mobile devices.

[0005] Accordingly, the antenna needs to be protected from external impacts such as wind and dust.

[0006] However, when the antenna is placed between the substrates for antenna protection, the antenna may be exposed to moisture at the connection between the antenna and the circuit substrate, or air bubbles may form in the antenna device, which may deteriorate the antenna performance.

[0007]

[0008] An object of the present invention is to provide an antenna package having improved radiation characteristics and driving reliability.

[0009]

[0010] 1. An antenna package comprising: a first transparent substrate extending in a first direction; an antenna element disposed on the first transparent substrate and including a bonding portion spaced apart from one end of the first transparent substrate in the first direction; a circuit board connected to the antenna element at the bonding portion; and a margin portion disposed between an imaginary line extending from the bonding portion and the one end of the first transparent substrate in a second direction perpendicular to the first direction in a cross-section.

[0011] 2. An antenna package according to the above 1, further comprising a protective layer disposed on the first transparent substrate and covering at least a portion of the antenna element and the circuit board.

[0012] 3. An antenna package further comprising a second transparent substrate disposed on the protective layer in the above 2.

[0013] 4. An antenna package according to the above 1, wherein the antenna element comprises an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator.

[0014] 5. An antenna package according to the above 4, wherein the antenna unit further includes a transmission line electrically connected to the radiator, and a signal pad electrically connected to the transmission line and disposed on the bonding portion.

[0015] 6. An antenna package according to the above 1, further comprising a reinforcing structure disposed on the margin portion, wherein at least a portion of the circuit board is disposed on the reinforcing structure.

[0016] 7. In the above 1, the antenna element includes an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator, wherein the antenna dielectric layer and the antenna unit are spaced apart from the virtual line in the first direction, an antenna package.

[0017] 8. An antenna package further comprising a reinforcing structure disposed on the margin portion in the above 7, wherein the reinforcing structure is directly disposed on the first transparent substrate and is in contact with one end of the antenna element.

[0018] 9. In the above 1, the antenna element includes an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator, wherein one end of the antenna dielectric layer is in contact with the virtual line, and the antenna unit is spaced apart from the virtual line in the first direction, an antenna package.

[0019] 10. An antenna package further comprising a reinforcing structure disposed on the margin portion in the above 9, wherein the reinforcing structure is disposed around the antenna unit on the antenna dielectric layer.

[0020] 11. An antenna package according to the above 1, wherein the circuit board includes a core layer, circuit wiring arranged on one surface of the core layer, and a wiring protection layer covering the circuit wiring, and at least a portion of the wiring protection layer is arranged in the margin portion.

[0021] 12. An antenna package according to 11 above, wherein at least a portion of the wiring protection layer is directly disposed on the first transparent substrate and is in contact with one end of the antenna element.

[0022] 13. An antenna package according to the above 1, wherein the length of the margin portion in the first direction is greater than the length of the bonding portion in the first direction.

[0023] 14. An antenna package in the above 1, wherein the ratio of the length of the margin portion in the first direction to the length of the bonding portion in the first direction is 1 to 30.

[0024] 15. An antenna package according to the above 1, wherein the circuit board includes a core layer, a circuit wiring disposed on one surface of the core layer, a wiring protection layer covering the circuit wiring, a wiring ground layer disposed on the other surface of the core layer, and a ground protection layer covering the wiring ground layer, wherein the ground protection layer does not overlap the margin portion in the second direction.

[0025] 16. An antenna package comprising: a first transparent substrate extending in a first direction; an antenna element disposed on the first transparent substrate and including a bonding portion spaced apart from one end of the first transparent substrate in the first direction; a second transparent substrate disposed on the antenna element; and a circuit board inserted between the first transparent substrate and the second transparent substrate and connected to the antenna element at the bonding portion, wherein a ratio of a distance in the first direction between the bonding portion and the one end of the first transparent substrate to a length of the bonding portion in the first direction is 1 to 30.

[0026] 17. Antenna package provided as a relay antenna in the above 1.

[0027]

[0028] According to exemplary embodiments, an antenna package includes an antenna element disposed on a first transparent substrate, and a circuit board. The antenna element may include a bonding portion electrically connecting the antenna unit and the circuit board. The bonding portion may be spaced apart from one end of the first transparent substrate. Accordingly, the antenna unit may be protected from external moisture, and the operational reliability of the antenna package may be improved.

[0029] In exemplary embodiments, a margin portion may be positioned between the bonding portion and an imaginary line extending from the first end of the first transparent substrate in a second direction perpendicular to the first direction in the cross-section. Through the margin portion, the antenna unit may be spaced from the outside, thereby improving antenna gain and reducing reflection loss.

[0030] In some embodiments, a reinforcing structure may be placed on the margin portion. The reinforcing structure may block contact between the antenna unit and external moisture or contamination, thereby improving antenna performance.

[0031]

[0032] FIG. 1 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

[0033] FIGS. 2 and 3 are schematic cross-sectional and plan views, respectively, illustrating antenna packages according to exemplary embodiments.

[0034] FIG. 4 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

[0035] FIG. 5 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

[0036] FIG. 6 is a schematic plan view illustrating an antenna unit according to exemplary embodiments.

[0037] FIG. 7 is a schematic plan view illustrating an antenna element according to exemplary embodiments.

[0038] FIG. 8 is a drawing illustrating an example in which an antenna package according to exemplary embodiments is applied as a relay antenna.

[0039] Fig. 9 is a cross-sectional view showing an antenna package according to a comparative example.

[0040] Fig. 10 is a graph showing antenna return loss according to frequency in examples and comparative examples.

[0041] Fig. 11 is a graph showing antenna peak gain according to frequency in the examples and comparative examples.

[0042] Fig. 12 is a graph showing the antenna average gain according to frequency in the examples and comparative examples.

[0043]

[0044] Embodiments of the present invention provide an antenna package including an antenna element and a circuit board.

[0045] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0046] The terms “first,” “second,” “one end,” “the other end,” “top surface,” “bottom surface,” etc. used in this application do not limit absolute positions or orders, but are used in a relative sense to distinguish different components or parts.

[0047] Fig. 1 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments. For convenience of explanation, detailed configuration / structure of the antenna unit is omitted in Fig. 1.

[0048] The above antenna package may include a first transparent substrate (50) extending in a first direction, an antenna element (100) disposed on the first transparent substrate (50), and a circuit board (200) electrically connected to the antenna element (100).

[0049] The term "first direction" as used herein may refer to the longitudinal direction of the first transparent substrate (50) and / or the antenna package. The first direction may refer to the first direction in FIGS. 1 to 7 and FIG. 9.

[0050] In some embodiments, the antenna package may further include a protective layer (60) disposed on the first transparent substrate (50). The protective layer (60) may cover at least a portion of the antenna element (100) and the circuit board (200). Accordingly, the durability of the connection structure of the antenna element (100) and the circuit board (200) and the operating stability of the antenna package may be improved.

[0051] According to one embodiment, the circuit board (200) may be a printed circuit board (PCB) board including a flexible printed circuit board (FPCB), etc.

[0052] According to one embodiment, the protective layer (60) may include polyvinyl butyral (PVB).

[0053] In some embodiments, the antenna package may further include a second transparent substrate (70) disposed on the protective layer (60).

[0054] For example, the antenna element (100) may be sandwiched or embedded between the first transparent substrate (50) and the second transparent substrate (70). Accordingly, the antenna element (100) may be protected from external impact and its durability may be improved.

[0055] According to one embodiment, the first transparent substrate (50) and the second transparent substrate (70) may each include glass. In this case, the antenna element (100) may be provided as an in-glass antenna inserted into the glass.

[0056] The antenna element (100) may include an antenna dielectric layer (105) and an antenna unit (110) disposed on the antenna dielectric layer (105) and including a radiator (120).

[0057] The antenna dielectric layer (105) may include, for example, a transparent resin material. For example, the antenna dielectric layer (105) may include a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth) acrylate or polyethyl (meth) acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a sulfated polyphenylene resin; It may include vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; allylate-based resins; polyoxymethylene-based resins; epoxy-based resins; urethane-based or acrylic urethane-based resins; silicone-based resins, etc. These may be used alone or in combination of two or more.

[0058] In some embodiments, an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like may also be included in the antenna dielectric layer (105).

[0059] In some embodiments, the antenna dielectric layer (105) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0060] In one embodiment, the antenna dielectric layer (105) may be provided as a substantially single layer.

[0061] In some embodiments, the antenna dielectric layer (105) may include a multi-layer structure of at least two layers. For example, the antenna dielectric layer (105) may include a substrate layer and a dielectric layer, and may include an adhesive layer between the substrate layer and the dielectric layer.

[0062] The antenna dielectric layer (105) forms an impedance or inductance for the antenna unit, so that the frequency band that the antenna package can drive or sense can be adjusted. In some embodiments, the dielectric constant of the antenna dielectric layer (105) can be adjusted to a range of about 1.5 to 12. If the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a high-frequency band may not be realized.

[0063] The antenna element (100) may include a bonding portion (BR) through which the antenna unit (110) and the circuit board (200) are electrically connected. For example, the circuit board (200) may be inserted into the protective layer (60) so that the antenna element (100) and the circuit board (200) are electrically connected at the bonding portion (BR).

[0064] In exemplary embodiments, the bonding portion (BR) may be spaced apart from one end (50a) of the first transparent substrate in the first direction. Accordingly, the antenna unit (110) may be protected from external moisture, and the operational reliability of the antenna package may be improved.

[0065] In exemplary embodiments, the antenna package may include a margin portion (MR) disposed between a bonding portion (BR) and a virtual line (VL) extending in a second direction from one end (50a) of the first transparent substrate.

[0066] The above second direction may represent a direction perpendicular to the first direction in the cross section.

[0067] The term "second direction" as used herein may refer to the thickness direction of the first transparent substrate (50) and / or the antenna package. The second direction may refer to the second direction in FIGS. 1 to 7 and FIG. 9.

[0068] For example, the margin (MR) may represent a gap space between one end of the antenna unit (110) and the protective layer (60).

[0069] The antenna unit (110) can be sufficiently spaced from the outside through the margin (MR), thereby improving the antenna gain and reducing the return loss.

[0070] In some embodiments, the length (L2) of the margin portion (MR) in the first direction may be greater than or equal to the length (L1) of the bonding portion (BR) in the first direction. Accordingly, the antenna unit (110) can be sufficiently spaced from the outside, and the antenna element (100) and the circuit board (200) can be stably connected.

[0071] In some embodiments, the ratio (L2 / L1) of the length (L2) of the margin portion (MR) in the first direction to the length (L1) of the bonding portion (BR) in the first direction may be 1 to 30, and in one embodiment, 2 to 7.5. In this range, the resistance in the bonding portion (BR) may be sufficiently reduced while the antenna unit (110) may be protected from external moisture and the structural stability of the antenna package may be improved.

[0072] In one embodiment, the L2 may increase within a range that does not exceed, for example, the black bezel of a windshield of a car.

[0073] In one embodiment, the L2 may increase in a range that does not contact a portion where the circuit wiring (210) is connected to a relay structure such as a connector, for example.

[0074] In one embodiment, no separate structure may be placed in the margin (MR).

[0075] Figures 2 and 3 are schematic cross-sectional views and plan views, respectively, showing an antenna package according to exemplary embodiments. Figure 2 is a cross-sectional view taken along line II' of Figure 3 in the thickness direction.

[0076] Referring to FIGS. 2 and 3, a reinforcing structure (150) may be placed on the margin portion (MR). For example, at least a portion of the circuit board (200) may be placed on the reinforcing structure (150). Through the reinforcing structure (150), contact between the antenna unit (110) and external moisture or contamination may be blocked, thereby improving antenna performance.

[0077] In one embodiment, the reinforcing structure (150) may include an adhesive film, such as an optically clear adhesive (OCA), an optically clear resin (OCR), or an organic insulating film.

[0078] In some embodiments, the antenna element (100) may further include a point-adhesive layer (103) disposed between the first transparent substrate (50) and the antenna dielectric layer (105). Accordingly, even if the first transparent substrate (50) includes glass, the antenna element (100) may be stably fixed on the first transparent substrate (50).

[0079] According to one embodiment, the adhesive layer (103) can be placed directly on the upper surface of the first transparent substrate (50).

[0080] For example, the adhesive layer (103) may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), etc.

[0081] In some embodiments, the antenna element (100) may further include an auxiliary dielectric layer (107) disposed between the antenna unit (110) and the antenna dielectric layer (105). Accordingly, the impedance matching of the antenna unit (110) may be improved and damage to the antenna dielectric layer (105) due to patterning of the antenna unit (110) may be prevented.

[0082] For example, the auxiliary dielectric layer (107) may include substantially the same type of material as the antenna dielectric layer (105) described above.

[0083] In some embodiments, the antenna element (100) may further include an insulating layer (109) disposed on the antenna unit (110). Accordingly, the antenna unit (110) may be further protected from external impact and stably fixed within the antenna package.

[0084] For example, the insulating layer (109) may include substantially the same type of material as the antenna dielectric layer (105) described above. According to one embodiment, the insulating layer (109) may include an organic insulating film.

[0085] In some embodiments, the antenna unit (110) may include a radiator (120), a transmission line (130) electrically connected to the radiator (120), and a signal pad (132) electrically connected to the transmission line (130) and disposed on a bonding portion (BR).

[0086] For example, one end of the transmission line (130) may be directly connected to the radiator (120), and the other end of the transmission line (130) may be directly connected to the signal pad (132). The signal pad (132) may be electrically connected to a driver integrated circuit (IC) chip via a circuit board (200). Accordingly, signal transmission and reception and power supply from the driver IC chip to the radiator (120) may be performed.

[0087] According to one embodiment, the other end of the transmission line (130) may be provided as a signal pad (132).

[0088] In one embodiment, the transmission line (130) may be formed substantially integrally with the radiator (120) using the same material.

[0089] In some embodiments, the antenna unit (110) may further include a ground pad (142) disposed spaced apart from the signal pad (132) around the signal pad (132). In one embodiment, a pair of ground pads (142) may be disposed facing each other with the signal pad (132) interposed therebetween.

[0090] The detailed configuration / structure of the antenna unit (110) is described later with reference to FIG. 6.

[0091] In exemplary embodiments, the circuit board (200) may include a core layer (205), a circuit wiring (210) disposed on one surface of the core layer (205), a wiring protection layer (220) covering the circuit wiring (210), a wiring ground layer (230) disposed on the other surface of the core layer (205), and a ground protection layer (240) covering the wiring ground layer (230). For example, the antenna unit (110) and the driving IC chip may be electrically connected through the circuit wiring (210).

[0092] For example, the core layer (205) may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. For example, the core layer (205) may include an internal insulating layer included in the circuit board (200).

[0093] In some embodiments, a conductive bonding structure (135), such as an anisotropic conductive film (ACF), may be attached on the signal pad (132) and / or the ground pad (142), and one end of the circuit wiring (210) may be placed on the conductive bonding structure (135). Thereafter, the circuit board (200) and the antenna unit (110) may be electrically connected through a heat treatment / pressure process.

[0094] For example, the length at which the circuit board (200) is inserted into the protective layer (60) through the margin (MR) can be increased. Accordingly, damage to the antenna package due to attachment, bending, and placement of the circuit board (200) can be prevented.

[0095] For example, the impact resistance of the circuit wiring (210) and the operating stability of the circuit board (200) can be improved through the wiring protection layer (220).

[0096] For example, the electric field concentration of a signal transmitted to the circuit wiring (210) through the wiring ground layer (230) can be improved and noise can be shielded.

[0097] For example, the impact resistance of the wiring ground layer (230) and the driving stability of the circuit board (200) can be improved through the ground protection layer (240).

[0098] As shown in FIGS. 1 and 2, the antenna dielectric layer (105) and the antenna unit (110) can be spaced apart in the first direction from a virtual line (VL) extending in the second direction from one end (50a) of the first transparent substrate.

[0099] In this case, the reinforcing structure (150) is placed directly on the first transparent substrate (50) and can be in contact with one end of the antenna element (100).

[0100] According to one embodiment, the upper surface of the reinforcing structure (150) may be in contact with the circuit wiring (210), one side may be in contact with the antenna element (100), the other side may be in contact with the virtual line (VL), and the lower surface may be in contact with the upper surface of the first transparent substrate (50). Accordingly, the margin portion (MR) may be filled with the reinforcing structure (150), so that the antenna unit (110) may be further protected from external moisture or contamination.

[0101] For example, the reinforcing structure (150) may include substantially the same type of material as the adhesive layer (103).

[0102] FIG. 4 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

[0103] Referring to FIG. 4, one end of the antenna dielectric layer (105) may be in contact with the virtual line (VL), and the antenna unit (110) may be spaced apart from the virtual line (VL) in the first direction. For example, the length of the antenna unit (110) in the first direction may be smaller than the length of the antenna dielectric layer (105) in the first direction. Accordingly, the antenna element (100) may be relatively more stably fixed on the first transparent substrate (50).

[0104] In this case, the reinforcing structure (150) may be placed around the antenna unit (110) on the antenna dielectric layer (105). For example, the reinforcing structure (150) and the antenna unit (110) may be placed on substantially the same layer or at the same level.

[0105] According to one embodiment, the upper surface of the reinforcing structure (150) may be in contact with the circuit wiring (210), one side may be in contact with the antenna element (100), the other side may be in contact with the virtual line (VL), and the lower surface may be in contact with the upper surface of the antenna dielectric layer (105) or the auxiliary dielectric layer (107).

[0106] For example, the reinforcing structure (150) may include substantially the same type of material as the insulating layer (109).

[0107] FIG. 5 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

[0108] Referring to FIG. 5, at least a portion of the wiring protection layer (220) of the circuit board (200) may be placed in the margin portion (MR).

[0109] In some embodiments, at least a portion of the wiring protection layer (220) may be inserted into the margin portion (MR) to serve as a reinforcing structure. Accordingly, the antenna unit (110) can be protected from external moisture or contamination without the installation of a separate reinforcing structure. In addition, the bonding stability of the circuit board (200) and the antenna element (100) can be further improved.

[0110] In one embodiment, at least a portion of the wiring protection layer (220) may be disposed directly on the first transparent substrate (50) and in contact with one end of the antenna element (100).

[0111] In one embodiment, the upper surface of the wiring protection layer (220) disposed in the margin portion (MR) may be in contact with the circuit wiring (210), one side may be in contact with the antenna element (100), the other side may be in contact with the virtual line (VL), and the lower surface may be in contact with the first transparent substrate (50).

[0112] In some embodiments, the ground protection layer (240) may not overlap the margin portion (MR) in the second direction. For example, since the ground protection layer (240) is not inserted into the protection layer (60), the thickness of the circuit board (200) inserted into the protection layer (60) may be reduced. Accordingly, the stability of the connection structure of the circuit board (200) and the antenna element (100) may be further improved.

[0113] Fig. 6 is a schematic plan view illustrating an antenna unit according to exemplary embodiments. Hereinafter, the detailed structure of the antenna unit (110) will be described with reference to Fig. 6.

[0114] Referring to FIG. 6, the antenna unit (110) may include a radiator (120) and an auxiliary radiator (160) spaced apart from each other on the antenna dielectric layer (105).

[0115] The radiator (120) may include a first radiating portion (122) whose length in the first direction decreases in the third direction, and a second radiating portion (126) connected to the first radiating portion (122) and whose length in the first direction increases in the third direction. Accordingly, even when the antenna unit (110) is inserted into a dielectric layer or arranged between dielectric layers of a two-layer structure, radiation performance may be improved.

[0116] The term "third direction" as used herein may refer to a direction perpendicular to the first direction and the second direction. The third direction may refer to the thickness direction of the antenna element (100) and / or the antenna package. The third direction may refer to the third direction in FIGS. 1 to 7 and FIG. 9 .

[0117] In some embodiments, the first radiating portion (122) may include a plurality of radiating portions whose lengths in the first direction sequentially decrease in the third direction. Accordingly, a multi-band antenna in which signal transmission and reception in multiple bands are performed from a single radiating portion may be implemented.

[0118] In some embodiments, the first radiating portion (122) may include a first portion (123) and a second portion (125) whose length in the first direction sequentially decreases in the third direction.

[0119] For example, the first portion (123) can be directly connected to a transmission line (130) or a signal pad (132).

[0120] For example, the first part (123) may include a protrusion (123a) formed on the upper surface.

[0121] In some embodiments, the upper surface of the first portion (123) and the side surface of the protrusion (123a) may form a concave space (CS). By forming the concave space (CS), the resonant frequency of the first radiating portion (122) can be appropriately adjusted and impedance matching can be improved. Accordingly, the radiation characteristics and operating reliability of the radiator (120) can be improved.

[0122] In some embodiments, the second portion (125) may be directly connected to the second radiating portion (126). For example, the second radiating portion (126) may extend from one side of the second portion (125).

[0123] For example, the second radiating portion (126) may be directly connected to one side of the second portion (125), and the first portion (123) may be directly connected to the other side of the second portion (125).

[0124] For example, the length of the second portion (125) in the second direction may be greater than that of the first portion (123).

[0125] According to one embodiment, the first portion (123) and the second portion (125) may be formed substantially integrally.

[0126] The length of the second radiating portion (126) in the first direction may increase in the third direction. For example, all internal angles of the second radiating portion (126) provided as the outer portion of the radiator (120) may be formed as obtuse angles. Accordingly, the current inside the radiator (120) may be smoothly transmitted to the outer portion of the radiator (120) (e.g., the second radiating portion (126)). Accordingly, the antenna gain characteristics of the radiator (120) may be improved.

[0127] For example, the length of the second radiating portion (126) in the first direction may be smaller than the length of the second portion (125) in the first direction.

[0128] In some embodiments, the second radiating portion (126) may include a polygonal shape, a semi-circle shape, or a semi-elliptical shape.

[0129] In one embodiment, the first radiating portion (122) and the second radiating portion (126) may be formed substantially integrally.

[0130] In exemplary embodiments, the radiator (120) and the auxiliary radiator (160) may have an asymmetrical shape with respect to the first direction.

[0131] For example, the radiator (120) and the auxiliary radiator (160) may extend in the first direction and have an asymmetrical shape with respect to a first virtual line (VL1) passing between the radiator (120) and the auxiliary radiator (160). Accordingly, signal interference and signal disturbance can be prevented.

[0132] In some embodiments, the antenna unit (110) may have an asymmetrical shape with respect to a second virtual line (VL2) extending in a third direction and passing through the radiator (120) and the auxiliary radiator (160). Accordingly, the antenna unit (110) may have an asymmetrical shape with respect to the first direction and may also have an asymmetrical shape with respect to the third direction. Accordingly, radiation characteristics in the driving frequency band may be improved.

[0133] In some embodiments, the auxiliary radiator (160) may include a first auxiliary radiator (162) whose length in the first direction increases in the third direction, and a second auxiliary radiator (166) connected to the first auxiliary radiator (162) and whose length in the first direction decreases in the third direction. Accordingly, radiation performance may be improved even when the antenna unit (110) is inserted into a dielectric layer or arranged between dielectric layers of a two-layer structure.

[0134] In some embodiments, the first auxiliary radiator (162) may include a plurality of auxiliary radiators whose lengths in the first direction sequentially increase in the third direction. Accordingly, radiation performance in multiple bands may be further improved.

[0135] In some embodiments, the first auxiliary radiating portion (162) may include a third portion (163) and a fourth portion (165) whose lengths in the first direction sequentially increase in the third direction.

[0136] For example, the third part (163) and the fourth part (165) may have substantially symmetrical shapes with respect to the first direction with respect to the first part (123) and the second part (125), respectively.

[0137] The above “symmetrical shape” may represent a mirror reflection shape.

[0138] For example, the third portion (163) may include an auxiliary protrusion (163a) formed on the upper surface.

[0139] In some embodiments, the upper surface of the third portion (163) and the side surface of the auxiliary protrusion (163a) may form a concave space (CS). By forming the concave space (CS), the resonant frequency of the first auxiliary radiator (162) can be appropriately adjusted and impedance matching can be improved. Accordingly, the radiation characteristics and operating reliability of the auxiliary radiator (160) can be improved.

[0140] In some embodiments, the fourth portion (165) may be directly connected to the second auxiliary radiator (166). For example, the second auxiliary radiator (166) may extend from one side of the fourth portion (165).

[0141] For example, a second auxiliary radiator (166) may be directly connected to one side of the fourth part (165), and a third part (163) may be directly connected to the other side of the fourth part (165).

[0142] For example, the length of the fourth portion (165) in the first direction may be greater than the length of the third portion (163) in the first direction.

[0143] According to one embodiment, the third portion (163) and the fourth portion (165) may be formed substantially integrally.

[0144] The length of the second auxiliary radiator (166) in the first direction may be reduced in the third direction. For example, all internal angles of the second auxiliary radiator (166) provided as the outer portion of the auxiliary radiator (160) may be formed as obtuse angles. Accordingly, the current inside the auxiliary radiator (160) may be smoothly transmitted to the outer portion of the auxiliary radiator (160) (e.g., the second auxiliary radiator (166)). Accordingly, the radiation performance of the auxiliary radiator (160) may be improved.

[0145] For example, the length of the second auxiliary radiating portion (166) in the first direction may be smaller than the length of the fourth portion (165) in the first direction.

[0146] In some embodiments, the second auxiliary radiator (166) may include a polygonal shape, a semi-circle shape, or a semi-elliptical shape.

[0147] In one embodiment, the first auxiliary radiator (162) and the second auxiliary radiator (166) may be formed substantially integrally.

[0148] In some embodiments, the second radiating portion (126) and the second auxiliary radiating portion (166) may have an asymmetrical shape with respect to the first direction. For example, the length of the second radiating portion (126) in the third direction may be greater than the length of the second auxiliary radiating portion (166) in the third direction. Accordingly, signal interference or signal disturbance may be suppressed.

[0149] Signal transmission and reception in multiple frequency bands can be implemented from the first radiating unit (122), the second radiating unit (126), the first auxiliary radiating unit (162), and the second auxiliary radiating unit (166) described above.

[0150] For example, a radiation band corresponding to Sub-6 5G can be obtained from the radiator (120) and the auxiliary radiator (160). According to one embodiment, the resonant frequencies of the radiator (120) and the auxiliary radiator (160) can range from about 3 GHz to 6 GHz, from about 3.1 GHz to 3.8 GHz, or from about 5 GHz to 6 GHz.

[0151] For example, radiation bands corresponding to the LTE1, LTE2, LTE3, and LTE7 bands can be obtained from the radiator (120) and the auxiliary radiator (160). According to one embodiment, the resonant frequencies of the radiator (120) and the auxiliary radiator (160) can range from about 1.5 GHz to 3.0 GHz.

[0152] For example, radiation bands corresponding to the LTE5, LTE8, LTE12, LTE17, and LTE20 bands can be obtained from the radiator (120) and the auxiliary radiator (160). According to one embodiment, the resonant frequencies of the radiator (120) and the auxiliary radiator (160) can range from about 0.7 GHz to 1.0 GHz.

[0153] In some embodiments, the ground pattern (140) may include a bend (145) that bends from the second direction to the first direction or from the first direction to the second direction. Accordingly, the radiation characteristics may be further improved.

[0154] For example, the ground pattern (140) may include a step portion (147). Accordingly, impedance matching can be further improved.

[0155] In some embodiments, the ground pattern (140) may be provided as a ground radiator by electrical coupling with the radiator (120) and / or the transmission line (130).

[0156] For example, a pair of ground pads (142) may be arranged with a signal pad (132) between them. For example, one of the pair of ground pads (142) may be electrically connected to the ground pattern (140), and the other may be electrically connected to the first auxiliary radiator (162).

[0157] In one embodiment, the ground pad (142) may include a recess (142a) to allow for fine matching of impedance.

[0158] In some embodiments, the antenna unit may include a ground connection (170) connecting the first auxiliary radiator (162) and the ground pad (142).

[0159] According to one embodiment, the extension direction of the ground connection portion (170) may be parallel to the extension direction of the transmission line (130).

[0160] One end of the ground connection portion (170) may be connected to the third portion (163), and the other end may be connected to the ground pad (142). The ground pad (142) may not be electrically connected to the driving IC chip. For example, power or signals may not be transmitted to the auxiliary radiator (160). Accordingly, driving between antenna units may be performed independently, and antenna beam characteristics may be improved.

[0161] According to one embodiment, the other end of the ground connection portion (170) may be provided as a ground pad (142).

[0162] In some embodiments, the shortest distance between the transmission line (130) and the ground connection (170) may be about 1 mm to 5 mm, for example, about 2 mm to 4 mm. In this range, antenna gain and impedance matching may be improved.

[0163] According to one embodiment, the length of the antenna unit (110) in the third direction may be about 80 mm to 120 mm, and the length of the antenna unit (110) in the first direction may be about 25 mm to 50 mm.

[0164] According to one embodiment, the length of the radiator (120) in the third direction may be about 90 mm to 95 mm, and the length of the radiator (120) in the first direction may be about 20 mm to 22 mm.

[0165] For example, the antenna unit (110), the circuit wiring (210), and / or the wiring ground layer (230) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more.

[0166] In one embodiment, the antenna unit (110), circuit wiring (210), and / or wiring ground layer (230) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) for low resistance implementation and fine linewidth patterning.

[0167] In some embodiments, the antenna unit (110), circuit wiring (210), and / or wiring ground layer (230) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx).

[0168] In some embodiments, the antenna unit (110), the circuit wiring (210), and / or the wiring ground layer (230) may include a laminated structure of a transparent conductive oxide layer and a metal layer, and may have, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. Accordingly, the flexible characteristics may be improved by the metal layer, while the resistance may be lowered to improve the signal transmission speed, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0169] The antenna unit (110) may include a blackening treatment portion. Accordingly, the reflectivity on the surface of the antenna unit (110) may be reduced, thereby reducing pattern visibility due to light reflection.

[0170] In one embodiment, the surface of the metal layer included in the antenna unit (110) may be converted into a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer may be formed on the antenna unit (110) or the metal layer. The black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.

[0171] The composition and thickness of the blackening layer can be adjusted taking into account the reflectivity reduction effect and antenna radiation characteristics.

[0172] FIG. 7 is a schematic plan view illustrating an antenna element according to exemplary embodiments.

[0173] Referring to FIG. 7, the antenna element (100) may further include a dummy mesh pattern (180) arranged around the antenna unit (110). For example, the dummy mesh pattern (180) may be electrically and physically separated from the antenna unit (110) through a separation region (185).

[0174] For example, a conductive layer including the above-described metal or alloy can be formed on the antenna dielectric layer (105) or the auxiliary dielectric layer (107). A mesh structure can be formed by etching the conductive layer along the profile of the above-described antenna unit (110). Accordingly, an antenna unit (110) and a dummy mesh pattern (180) spaced apart from each other by a separation region (185) can be formed.

[0175] In some embodiments, the antenna unit (110) may also share a mesh structure. Accordingly, the transmittance of the antenna unit (110) is improved, and the optical characteristics around the antenna unit (110) may be uniformized as the dummy mesh pattern (180) is distributed. Accordingly, the antenna unit (110) may be prevented from being visually recognized.

[0176] In one embodiment, the antenna unit (110) may include the mesh structure as a whole. In one embodiment, for power supply efficiency, at least a portion of the transmission line (130) (e.g., signal pad (132)) and at least a portion of the ground pattern (140) and / or the ground connection portion (170) (e.g., ground pad (142)) may include a solid structure.

[0177] In one embodiment, when the ground pattern (140) is placed in an area of ​​the object that is not visible to the user, the ground pattern (140) may have a solid structure.

[0178] For example, when the antenna unit (110) is placed in an area not visible to the user on the object to which the antenna element (100) is applied, the antenna unit (110) may include a solid structure.

[0179] The dummy mesh pattern (180) may include intersecting conductive lines forming a mesh structure therein. In some embodiments, the dummy mesh pattern (180) may include segmented regions where the conductive lines are cut. Accordingly, the dummy mesh pattern (180) may prevent the radiation characteristics of the antenna unit from being disturbed.

[0180] In some embodiments, the antenna element (100) may include two or more antenna units (110). For example, a plurality of antenna units (110) may be arranged to form an array. Alternatively, a plurality of antenna units (110) may be arranged without forming an array. Accordingly, the overall gain of the antenna element (100) may be increased, and multi-band radiation may be sufficiently implemented.

[0181] According to further exemplary embodiments of the present invention, the antenna package may include a circuit board (200) inserted between the first transparent substrate (50) and the second transparent substrate (70) described above and connected to the antenna element (100) at the bonding portion (BR). The bonding portion (BR) is spaced apart from one end of the first transparent substrate (50) in the first direction so that the connection portion (e.g., the bonding portion (BR)) of the circuit board (200) and the antenna element (100) can be sufficiently inserted into the laminated structure of the first transparent substrate (50) and the second transparent substrate (70). Accordingly, the structural stability and operating reliability of the in-glass antenna structure can be improved.

[0182] In exemplary embodiments, the ratio (L2 / L1) of the distance (L2) in the first direction between the bonding portion (BR) and one end of the first transparent substrate (50) to the length (L1) of the bonding portion (BR) in the first direction may be 1 to 30, and in one embodiment, 2 to 7.5. In the above range, the resistance in the bonding portion (BR) may be sufficiently reduced while the antenna unit (110) may be protected from external moisture and the structural stability of the antenna package may be improved.

[0183] For example, the above L2 may represent the distance at which the circuit board (200) is inserted into the laminated structure of the first transparent substrate (50) and the second transparent substrate (70).

[0184] In some embodiments, the antenna package may further include a protective layer (60) disposed between the first transparent substrate (50) and the second transparent substrate (70) and covering at least a portion of the first transparent substrate (50), the antenna element (100), and the circuit board (200).

[0185] FIG. 8 is a drawing illustrating an example in which an antenna package according to exemplary embodiments is applied as a relay antenna.

[0186] For example, FIG. 8 is a schematic drawing showing a router form in which an antenna package is attached to a target object (300) (e.g., a car such as a private car, public transportation such as a bus or subway) or inserted into a window.

[0187] Referring to FIG. 8, the antenna package may have a structure that can be fixed to, for example, the glass of an automobile such as a private car, a window of public transportation, a building structure such as a wall or ceiling, a window, a vehicle, a sign, etc. For example, the antenna unit (110) may be inserted or attached to a substrate.

[0188] As described with reference to FIG. 1, a first transparent substrate (50) and a second transparent substrate (70) are provided together as a substrate, a protective layer (60) is disposed within the substrate, and an antenna element (100) can be embedded in the protective layer (60). In this case, a deterioration in the radiation performance of the antenna unit (110) due to the embedding can be prevented through the second radiation portion (126) and the second auxiliary radiation portion (166).

[0189] The substrate can be provided as glass for automobiles such as private cars, windows for public transportation, buildings, various decorative structures, signage, windows, etc.

[0190] According to some embodiments, the antenna package may be embedded in at least one of a sunroof, a side window, a rear window, and a windshield of the vehicle in an in-glass form. In one embodiment, the antenna package may be embedded in the upper portion of the windshield of the vehicle.

[0191] In some embodiments, as described above, a dummy mesh pattern (180) may be formed around the antenna unit (110) to suppress the antenna unit (110) from being visually recognized. At least a portion of the antenna unit (110) may also have a mesh pattern structure.

[0192] As illustrated in FIG. 8, the antenna unit (110) can be inserted into the glass of a target object (300) (e.g., the glass of a car) to transmit and receive signals within the car, for example, via a flexible printed circuit board. Accordingly, a multi-band wireless communication network can be implemented within the car.

[0193] Example 1

[0194] An OCA adhesive layer (thickness: 10 μm) and a COP substrate (thickness: 50 μm) were sequentially formed on a glass substrate (thickness: 1500 μm).

[0195] An antenna unit was formed by patterning conductive lines containing copper on the COP substrate as shown in Fig. 5. The conductive lines had a line width of 2 μm and a thickness of 0.5 μm.

[0196] An organic insulating layer (thickness: 2 μm) was formed on the above antenna unit to form an antenna element.

[0197] An OCA film was attached as a reinforcing structure on the glass substrate as shown in Fig. 1.

[0198] An ACF (length in the first direction: 2 mm) was attached on the signal pad of the antenna unit, and the ends of the signal wires of the circuit board were placed on the ACF. The signal pad, ACF, and the ends of the signal wires were heat-treated / pressurized to connect the circuit board and the antenna unit as shown in Fig. 1.

[0199] A protective layer (thickness: 760 μm) was formed by applying polyvinyl butyral (PVB) on the antenna element and circuit board.

[0200] Glass (thickness: 1500 ㎛) was attached on the above protective layer to form an antenna package having a three-layer structure (in-glass antenna structure) of glass-antenna element-glass.

[0201] The ratio (L2 / L1) of the length (L2) of the margin portion in the first direction to the length (L1) of the ACF in the first direction of Example 1 was adjusted to 7.5.

[0202] Example 2

[0203] An antenna package was manufactured in the same manner as in Example 1, except that the antenna element and reinforcing structure were manufactured in the shape shown in Fig. 4.

[0204] Example 3

[0205] An antenna package was manufactured in the same manner as in Example 1, except that instead of the reinforcing structure, a portion of the wiring protection layer was placed on a glass substrate as shown in Fig. 5.

[0206] Example 4

[0207] An antenna package was manufactured in the same manner as in Example 1, except that L2 / L1 was adjusted to 1.

[0208] Example 5

[0209] An antenna package was manufactured in the same manner as in Example 1, except that L2 / L1 was adjusted to 30.

[0210] Example 6

[0211] An antenna package was manufactured in the same manner as in Example 1, except that L2 / L1 was adjusted to 0.8.

[0212] Example 7

[0213] An antenna package was manufactured in the same manner as in Example 1, except that L2 / L1 was adjusted to 31.

[0214] Comparative example

[0215] Fig. 9 is a cross-sectional view showing an antenna package according to a comparative example.

[0216] An antenna package was manufactured in the same manner as in Example 1, except that one end of the antenna element was formed to contact one end of the protective layer without forming a margin portion as shown in Fig. 9.

[0217]

[0218] Experimental example

[0219] The antenna return loss and antenna peak gain of the antenna packages of the examples and comparative examples were measured using the HFSS simulator (Ansys).

[0220] Figure 10 is a graph showing antenna return loss according to frequency in Example 1 and Comparative Example.

[0221] Figure 11 is a graph showing the antenna peak gain according to frequency in Example 1 and Comparative Example.

[0222] Referring to FIGS. 10 and 11, in Example 1 including a margin portion, the reflection loss was reduced and the antenna peak gain was improved compared to the comparative example not including a margin portion.

[0223] Fig. 12 is a graph showing the antenna average gain according to frequency in the examples and comparative examples.

[0224] Referring to FIG. 12, in Examples 1, 4 and 5 where L2 / L1 is 1 to 30, the antenna average gain is relatively improved compared to Examples 6 and 7 where L2 / L1 is outside the range of 1 to 30.

Claims

1. A first transparent substrate extending in a first direction; An antenna element disposed on the first transparent substrate and including a bonding portion spaced apart from one end of the first transparent substrate in the first direction; a circuit board connected to the above antenna element and the bonding portion; and An antenna package comprising a margin portion arranged between the bonding portion and the virtual line extending from the first end of the first transparent substrate in a second direction perpendicular to the first direction in the cross-section.

2. An antenna package according to claim 1, further comprising a protective layer disposed on the first transparent substrate and covering at least a portion of the antenna element and the circuit board.

3. An antenna package according to claim 2, further comprising a second transparent substrate disposed on the protective layer.

4. An antenna package according to claim 1, wherein the antenna element comprises an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator.

5. An antenna package according to claim 4, wherein the antenna unit further includes a transmission line electrically connected to the radiator, and a signal pad electrically connected to the transmission line and disposed on the bonding portion.

6. An antenna package according to claim 1, further comprising a reinforcing structure disposed on the margin portion, wherein at least a portion of the circuit board is disposed on the reinforcing structure.

7. In claim 1, the antenna element includes an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator, An antenna package, wherein the antenna dielectric layer and the antenna unit are spaced apart from the virtual line in the first direction.

8. In claim 7, further comprising a reinforcing structure arranged in the margin portion, An antenna package wherein the reinforcing structure is directly disposed on the first transparent substrate and is in contact with one end of the antenna element.

9. In claim 1, the antenna element includes an antenna dielectric layer, and an antenna unit disposed on the antenna dielectric layer and including a radiator, An antenna package, wherein one end of the antenna dielectric layer is in contact with the virtual line, and the antenna unit is spaced apart from the virtual line in the first direction.

10. In claim 9, further comprising a reinforcing structure arranged in the margin portion, An antenna package wherein the reinforcing structure is arranged around the antenna unit on the antenna dielectric layer.

11. In claim 1, the circuit board includes a core layer, circuit wiring arranged on one surface of the core layer, and a wiring protection layer covering the circuit wiring. An antenna package, wherein at least a portion of the above wiring protection layer is disposed in the margin portion.

12. An antenna package according to claim 11, wherein at least a portion of the wiring protection layer is directly disposed on the first transparent substrate and is in contact with one end of the antenna element.

13. An antenna package according to claim 1, wherein the length of the margin portion in the first direction is greater than or equal to the length of the bonding portion in the first direction.

14. An antenna package according to claim 1, wherein the ratio of the length of the margin portion in the first direction to the length of the bonding portion in the first direction is 1 to 30.

15. In claim 1, the circuit board includes a core layer, circuit wiring arranged on one surface of the core layer, a wiring protection layer covering the circuit wiring, a wiring ground layer arranged on the other surface of the core layer, and a ground protection layer covering the wiring ground layer. An antenna package wherein the ground protection layer does not overlap the margin portion in the second direction.

16. A first transparent substrate extending in a first direction; An antenna element disposed on the first transparent substrate and including a bonding portion spaced apart from one end of the first transparent substrate in the first direction; A second transparent substrate disposed on the antenna element; and A circuit board inserted between the first transparent substrate and the second transparent substrate and connected to the antenna element and the bonding portion, An antenna package, wherein a ratio of the distance in the first direction between the bonding portion and the one end of the first transparent substrate to the length of the bonding portion in the first direction is 1 to 30.

17. An antenna package provided as a relay antenna according to claim 1.

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