Electronic device comprising printed circuit board

Abstract

An electronic device, according to one embodiment of the present disclosure, may comprise: a first printed circuit board comprising a first surface, a second surface which is the surface opposite the first surface, and a first conductive pad formed on the first surface; a second printed circuit board comprising a third surface of which at least a portion faces the second surface, a fourth surface which is the surface opposite the third surface, and a second conductive pad formed on the third surface; a power management circuit disposed on the first surface of the first printed circuit board and electrically connected to the first conductive pad; a power supply circuit disposed on at least one surface among the third surface and the fourth surface of the second printed circuit board and electrically connected to the second conductive pad; a conductive plate contacting the first conductive pad at a first end and contacting the second conductive pad at a second end; and an insulating member disposed on at least one portion of the conductive plate.

Description

Electronic devices including printed circuit boards

[0001] The present disclosure relates to an electronic device including a printed circuit board.

[0002] An electronic device may include a multilayer printed circuit board formed by multiple printed circuit boards. The multilayer printed circuit board may be formed by bonding multiple printed circuit boards together. The electronic device may secure space for electronic components and wiring arrangements even in a small space through the multilayer printed circuit board. In a multilayer printed circuit board, one printed circuit board may be soldered to another adjacent printed circuit board.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. None of the above is claimed to be prior art related to the present disclosure, nor can it be used to determine prior art.

[0004] An electronic device according to one embodiment of the present disclosure may include a first printed circuit board, a second printed circuit board, a power management circuit, a power supply circuit, a conductive plate, and an insulating member.

[0005] In one embodiment, the first printed circuit board may include a first side, a second side opposite the first side, and a first conductive pad formed on the first side.

[0006] In one embodiment, the second printed circuit board may include a third side, at least a portion of which faces the second side, a fourth side that is opposite the third side, and a second conductive pad formed on the third side.

[0007] In one embodiment, the power management circuit is disposed on a first surface of the first printed circuit board and can be electrically connected to the first conductive pad.

[0008] In one embodiment, the power supply circuit is disposed on at least one of the third side and the fourth side of the second printed circuit board and can be electrically connected to the second conductive pad.

[0009] In one embodiment, the challenge plate may be in contact with a first challenge pad at a first stage and in contact with a second challenge pad at a second stage.

[0010] In one embodiment, the insulating member may be disposed on at least a portion of the conductive plate.

[0011] An electronic device according to one embodiment of the present disclosure may include a first printed circuit board, a second printed circuit board, a conductive plate, and an insulating member.

[0012] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0013] FIGS. 2A, 2B, and 2C are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 3 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0015] FIGS. 4A and 4B are drawings showing a challenge pad and a dummy pad according to one embodiment of the present disclosure.

[0016] FIGS. 5A, 5B, and 5C are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 6 is a drawing showing an electronic device including a challenge plate according to one embodiment of the present disclosure.

[0018] FIGS. 7A and 7B are drawings showing a challenge plate according to one embodiment of the present disclosure.

[0019] FIG. 8 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 9A and FIG. 9B are diagrams showing an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 10A and FIG. 10B are diagrams showing an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] FIG. 2a, FIG. 2b and FIG. 2c are drawings showing an electronic device (200) according to one embodiment of the present disclosure.

[0045] FIG. 2a is a diagram showing a first printed circuit board (210) and a second printed circuit board (220) according to one embodiment. FIG. 2b is a diagram showing a state in which the first printed circuit board (210) is placed on the second printed circuit board (220) according to one embodiment. FIG. 2c is a diagram showing an electronic device (200) including a third electronic component (270).

[0046] In describing an electronic device (200) according to one embodiment of the present disclosure, the height direction of the electronic device (200) may mean the Z-axis direction. The length direction of the electronic device (200) may mean the X-axis direction.

[0047] An electronic device (200) according to one embodiment of the present disclosure may include a first printed circuit board (210), a second printed circuit board (220), a first conductive plate (230), an insulating member (240), a first electronic component (250), a second electronic component (260), a third electronic component (270), a fourth electronic component (280), and / or a second conductive plate (290).

[0048] The dotted arrows illustrated in FIG. 2A may indicate the direction in which the configuration of the electronic device (200) moves to be arranged. For example, the first printed circuit board (210), the first conductive plate (230), and the second conductive plate (290) may be arranged by moving along the direction indicated by the dotted arrows.

[0049] In one embodiment, the first printed circuit board (210) may include a first side (210A), a second side (210B), and / or a first conductive pad (211).

[0050] In one embodiment, the first side (210A) may be a side facing the positive Z-axis direction on the first printed circuit board (210). The second side (210B) may be an opposite side of the first side (210A). For example, the second side (210B) may be a side facing the negative Z-axis direction on the first printed circuit board (210).

[0051] In one embodiment, the first conductive pad (211) may be formed on a first surface (210A) of the first printed circuit board (210). The first conductive pad (211) may be a contact point electrically connected to another component of the electronic device (200).

[0052] In one embodiment, the second printed circuit board (220) may include a third side (220A), a fourth side (220B), and / or a second conductive pad (221).

[0053] In one embodiment, the third side (220A) may be a side facing the positive Z-axis direction on the second printed circuit board (220). The fourth side (220B) may be an opposite side of the third side (220A). For example, the fourth side (220B) may be a side facing the negative Z-axis direction on the second printed circuit board (220).

[0054] In one embodiment, the second conductive pad (221) may be formed on the third side (220A) of the second printed circuit board (220). The second conductive pad (221) may be a contact point electrically connected to another component of the electronic device (200).

[0055] In one embodiment, the first challenge plate (230) may serve to electrically connect the first printed circuit board (210) and the second printed circuit board (220).

[0056] In one embodiment, the first challenge plate (230) may be in contact with the first challenge pad (211) at the first end (230a) and in contact with the second challenge pad (221) at the second end (230b).

[0057] In one embodiment, the first conductive plate (230) may include a conductive material. For example, the first conductive plate (230) may include stainless steel (STS).

[0058] In one embodiment, an insulating member (240) may be disposed on at least a portion of the first conductive plate (230). In one embodiment, the insulating member (240) may include an insulating material.

[0059] In one embodiment, the insulating member (240) may serve to prevent the first conductive plate (230) from being electrically exposed. For example, the insulating member (240) may serve to prevent or reduce electrical shock that may be applied to the first conductive plate (230).

[0060] In one embodiment, a first electronic component (250) may be disposed on a first surface (210A) of a first printed circuit board (210). The first electronic component (250) may be electrically connected to a first conductive pad (211).

[0061] In one embodiment, the second electronic component (260) may be placed on the second side (210B) of the first printed circuit board (210).

[0062] In one embodiment, the first electronic component (250) may include a power management circuit. For example, the first electronic component (250) may include a power management integrated circuit (PMIC) that distributes and supplies the driving power required for each component of the electronic device (200).

[0063] In one embodiment, the second electronic component (260) may include a processor. For example, the second electronic component (260) may include an application processor capable of controlling at least one other component (e.g., a hardware or software component) of the electronic device (200).

[0064] In one embodiment, the first printed circuit board (210) may include a third conductive pad (212). The third conductive pad (212) may be formed on a second side (210B) of the first printed circuit board (210).

[0065] In one embodiment, the second printed circuit board (220) may include a fourth conductive pad (222) and / or a fifth conductive pad (223). The fourth conductive pad (222) may be formed on a third side (220A) of the second printed circuit board (220). The fifth conductive pad (223) may be formed on a fourth side (220B) of the second printed circuit board (220).

[0066] Referring to FIGS. 2A and 2B, a first printed circuit board (210) may be placed on a second printed circuit board (220). The first printed circuit board (210) may be placed on the second printed circuit board (220) such that a third conductive pad (212) is in contact with a fourth conductive pad (222).

[0067] Referring to FIGS. 2A and 2B, the third conductive pad (212) may be bonded to the fourth conductive pad (222). For example, the third conductive pad (212) may be bonded to the fourth conductive pad (222) by soldering. The third conductive pad (212) may be bonded to the fourth conductive pad (222) and electrically connected to the fourth conductive pad (222).

[0068] In one embodiment, the second challenge plate (290) may serve to electrically connect the first printed circuit board (210) and the second printed circuit board (220).

[0069] In one embodiment, the second challenge plate (290) may be in contact with the third challenge pad (212) at one end (290a) and in contact with the fifth challenge pad (223) at the other end (290b).

[0070] In one embodiment, the second conductive plate (290) may include a conductive material. For example, the second conductive plate (290) may include stainless steel (STS).

[0071] Referring to FIG. 2b, a first power flow (E1) from the upper surface (e.g., the third surface (220A)) of the second printed circuit board (220) toward the upper surface (e.g., the first surface (210A)) of the first printed circuit board (210) can be formed along the first conductive plate (230).

[0072] Referring to FIG. 2B, a second power flow (E2) from the lower surface (e.g., the fourth surface (220B)) of the second printed circuit board (220) toward the lower surface (e.g., the second surface (210B)) of the first printed circuit board (210) can be formed along the second conductive plate (290).

[0073] In one embodiment, the second printed circuit board (220) may include an opening (225) in at least a portion thereof.

[0074] In one embodiment, at least a portion of a second electronic component (260) may be inserted into an opening (225) of a second printed circuit board (220).

[0075] In one embodiment, the third electronic component (270) and the fourth electronic component (280) may be placed on the second printed circuit board (220).

[0076] In one embodiment, the third electronic component (270) and the fourth electronic component (280) may be disposed on at least one of the third side (220A) and the fourth side (220B) of the second printed circuit board (220). For example, referring to FIG. 2C, the third electronic component (270) and the fourth electronic component (280) may be disposed on the third side (220A) of the second printed circuit board (220).

[0077] In one embodiment, the third electronic component (270) and the fourth electronic component (280) may be electrically connected.

[0078] In one embodiment, the third electronic component (270) may include a power supply circuit. For example, the third electronic component (270) may include a power supply circuit for transmitting power supplied from a battery (189, see FIG. 1) to the first electronic component (250). In one embodiment, the third electronic component (270) may include a power management integrated circuit (PMIC) for supplying power to the first electronic component (250).

[0079] In one embodiment, the fourth electronic component (280) may include a battery connector electrically connected to a battery (189, see FIG. 1).

[0080] Referring to FIG. 2C, power supplied from the battery (189, see FIG. 1) can be moved along the first flow (F1). For example, power supplied from the battery (189, see FIG. 1) can be supplied from the fourth electronic component (280) to the third electronic component (270) and to the first electronic component (250) along the first flow (F1). The first conductive plate (230) can electrically connect the first printed circuit board (210) and the second printed circuit board (220) to form the first flow (F1).

[0081] Referring to FIG. 2C, the power supplied to the first electronic component (250) may be transferred along the second flow (F2). For example, the power supplied to the first electronic component (250) may be supplied to the second electronic component (260) along the second flow (F2). The second electronic component (260) may be driven using the power supplied from the first electronic component (250).

[0082] Referring to FIG. 2C, the power supplied to the first electronic component (250) may be transferred along the third flow (F3). For example, the power supplied to the first electronic component (250) may be supplied to components (e.g., memory, display) required for the operation of the electronic device (200) along the third flow (F3).

[0083] In one embodiment, the first conductive plate (230) and the second conductive plate (290) may serve to electrically connect each component of the electronic device (200). The first conductive plate (230) and the second conductive plate (290) may include a conductive material. For example, the first conductive plate (230) and the second conductive plate (290) may include stainless steel (STS).

[0084] In one embodiment, the first conductive plate (230) and the second conductive plate (290) may include a material that does not deform during the reflow process.

[0085] In one embodiment, the first conductive plate (230) and the second conductive plate (290) may each be manufactured by banding a single object or by bonding a plurality of independent objects (e.g., conductive materials).

[0086] In one embodiment, the conductors (e.g., conductive plates, conductive pads) of the electronic device (200) may be electrically connected to each other through a soldering method. For example, the first conductive plate (230) may be soldered to the first conductive pad (211). The third conductive pad (212) may be soldered to the fourth conductive pad (222).

[0087] In one embodiment, the printed circuit board (210, 220) may include a plurality of pads (e.g., first conductive pad (211), second conductive pad (221)) that are bonded to a first conductive plate (230) and a second conductive plate (290).

[0088] In one embodiment, bonding between conductors (e.g., first conductive plate (230), first conductive pad (211)) of the electronic device (200) can be performed using an automated surface mounting device (SMD).

[0089] In one embodiment, the first challenge plate (230) is placed on a surface facing the same direction on each printed circuit board (210, 220) (e.g., the first surface (210A) of the first printed circuit board (210), the third surface (220A) of the second printed circuit board (220)), so that it can be easily placed using an automated surface mounting device (SMD).

[0090] In one embodiment, the second challenge plate (290) is placed on a surface facing the same direction on each printed circuit board (210, 220) (e.g., the second surface (210B) of the first printed circuit board (210), the fourth surface (220B) of the second printed circuit board (220)), so that it can be easily placed using an automated surface mounting device (SMD).

[0091] In one embodiment, the bonding between conductors (e.g., first conductive plate (230), first conductive pad (211)) of the electronic device (200) can be performed by manual soldering.

[0092] In one embodiment, when the conductive plates (230, 290) are placed on the printed circuit boards (210, 220) by hand soldering, the conductive plates (230, 290) may be placed on faces of the respective printed circuit boards (210, 220) facing different directions (e.g., the first face (210A) of the first printed circuit board (210), the fourth face (220B) of the second printed circuit board (220)).

[0093] In one embodiment, the connection between the conductive plate (230, 290) and the pads of the printed circuit board (210, 220) may be implemented in a manner other than soldering. For example, in one embodiment, the connection between the conductive plate (230, 290) and the printed circuit board (210, 220) may be implemented in an adhesive manner. In one embodiment, the connection between the conductive plate (230, 290) and the printed circuit board (210, 220) may be implemented in a form in which the conductive plate (230, 290) is inserted into a connection opening (not shown) formed in the printed circuit board (210, 220).

[0094] FIG. 3 is a drawing showing an electronic device (300) according to one embodiment of the present disclosure.

[0095] The electronic device (300) of FIG. 3 may refer to the electronic device (200) of FIG. 2 or may include at least some of the components of the electronic device (200) of FIG. 2.

[0096] In describing an electronic device (300) according to one embodiment of the present disclosure, the length direction of the electronic device (300) may mean the X-axis direction, and the width direction of the electronic device (300) may mean the Y-axis direction. The height direction of the electronic device (300) may mean the Z-axis direction.

[0097] An electronic device (300) according to one embodiment of the present disclosure may include a first printed circuit board (310), a second printed circuit board (320), a conductive plate (330), a conductive pad (340, see FIG. 4a), a dummy pad (350, see FIG. 4b) and / or an electronic component (360).

[0098] In one embodiment, the first printed circuit board (310) may have substantially the same configuration as the first printed circuit board (210) of FIGS. 2A, 2B, and 2C. The second printed circuit board (320) may have substantially the same configuration as the second printed circuit board (220) of FIGS. 2A, 2B, and 2C. The conductive plate (330) may have substantially the same configuration as the first conductive plate (230) of FIGS. 2A, 2B, and 2C. The electronic component (360) may have substantially the same configuration as the first electronic component (250) of FIGS. 2A, 2B, and 2C.

[0099] In describing the electronic device (300) of FIG. 3, a detailed description of a configuration substantially identical to that of the electronic device (200) illustrated in FIGS. 2a, 2b, and 2c may be omitted.

[0100] In one embodiment, the first printed circuit board (310) may be disposed on a second printed circuit board (320).

[0101] In one embodiment, the conductive plate (330) may be formed to include an 'H' shape at least in part. For example, the conductive plate (330) may include an 'H' shape at least in part and may be supported by the printed circuit board (310, 320) at four ends.

[0102] In one embodiment, the conductive plate (330) can be connected to the printed circuit board (310, 320) at four ends. For example, referring to FIG. 3, the conductive plate (330) can be connected to the printed circuit board (310, 320) at the first end (330a), the second end (330b), the third end (330c), and the fourth end (330d), respectively.

[0103] In one embodiment, when the conductive plate (330) is connected to the printed circuit board (310, 320) at four ends, the conductive plate (330) can be more stably supported by the printed circuit board (310, 320) than when it is connected to the printed circuit board (310, 320) at two ends. For example, when the conductive plate (330) is connected to the printed circuit board (310, 320) at four ends, the conductive plate (330) can be supported by the printed circuit board (310, 320) at each of the four ends, so that deformation of the conductive plate (330) due to an external force or change in the arrangement position of the conductive plate (330) during a reflow process can be prevented or reduced.

[0104] In one embodiment, at least some of the ends of the conductive plate (330) may not be electrically connected to the printed circuit board (310, 320). For example, the first end (330a) and the second end (330b) of the conductive plate (330) may be in contact with and electrically connected to the conductive pad (340, see FIG. 4a), and the third end (330c) and the fourth end (330d) of the conductive plate (330) may be in contact with the dummy pad (350, see FIG. 4b). The third end (330c) and the fourth end (330d) of the conductive plate (330) that are in contact with the dummy pad (350, see FIG. 4b) may not be electrically connected to the printed circuit board (310, 320).

[0105] In one embodiment, the direction in which the first end (330a) and the second end (330b) are spaced apart may not be substantially parallel to the direction in which the second end (330b) and the third end (330c) are spaced apart. For example, referring to FIG. 3, the first end (330a) may be spaced apart in the longitudinal direction (e.g., X-axis direction) of the electronic device (300) with respect to the second end (330b). The third end (330c) may be spaced apart in the width direction (e.g., Y-axis direction) of the electronic device (300) with respect to the second end (330b).

[0106] In one embodiment, the first stage (330a) and the second stage (330b) may be spaced apart in the height direction (e.g., Z-axis direction) and length direction (e.g., X-axis direction) of the electronic device (300).

[0107] In one embodiment, the challenge plate (330) may include a horizontal region (331) and / or a vertical region (332).

[0108] In one embodiment, the horizontal region (331) may be a region of the conductive plate (330) extending substantially parallel to one side (310A, 320A) of the printed circuit board (310, 320).

[0109] In one embodiment, the vertical region (332) may be a region of the conductive plate (330) that extends substantially perpendicularly to one side (310A, 320A) of the printed circuit board (310, 320).

[0110] In one embodiment, the challenge plate (330) may include four vertical regions (332). For example, the vertical regions (332) may include a first vertical region (3321), a second vertical region (3322), a third vertical region (3323), and a fourth vertical region (3324).

[0111] In one embodiment, two of the four vertical regions (332) may extend from the horizontal region (331) toward the first printed circuit board (310), and the remaining two vertical regions (332) may extend from the horizontal region (331) toward the second printed circuit board (320). For example, the first vertical region (3321) and the third vertical region (3323) may extend toward the first printed circuit board (310), and the second vertical region (3322) and the fourth vertical region (3324) may extend toward the second printed circuit board (320).

[0112] Although the conductive plate (330) is illustrated in FIG. 3 as being in contact with the printed circuit board (310, 320) at four ends, the shape of the conductive plate (330) may not be limited thereto. For example, in one embodiment, the conductive plate (330) may be in contact with the printed circuit board (310, 320) at five or more ends.

[0113] FIGS. 4A and 4B are drawings showing a challenge pad (340) and a dummy pad (350) according to one embodiment of the present disclosure.

[0114] Fig. 4a is a drawing showing a challenge pad (340) according to one embodiment. Fig. 4b is a drawing showing a dummy pad (350) according to one embodiment.

[0115] The printed circuit board (305) illustrated in FIGS. 4a and 4b may include the first printed circuit board (310) of FIG. 3 and / or the second printed circuit board (320) of FIG. 3.

[0116] Referring to FIG. 4a, a conductive pad (340) can be formed on a printed circuit board (305).

[0117] In one embodiment, the conductive pad (340) may be connected to a wiring (370) that penetrates the interior of the printed circuit board (305). The wiring (370) may serve to electrically connect the conductive pad (340) and the printed circuit board (305).

[0118] Referring to FIG. 4b, a dummy pad (350) may be formed on a printed circuit board (305). The dummy pad (350) may not be connected to a wiring (370).

[0119] In one embodiment, the dummy pad (350) is formed on one surface of the printed circuit board (305) and may be a pad that is not electrically connected to the printed circuit board (305). In one embodiment, the dummy pad (350) may be an electrically non-polar pad.

[0120] In one embodiment, the dummy pad (350) may be a pad positioned to support a conductive plate (330, see FIG. 3). For example, the dummy pad (350) may be a pad that is not electrically connected to the printed circuit board (305) and is positioned on the printed circuit board (305) to support the conductive plate (330, see FIG. 3).

[0121] FIG. 5a, FIG. 5b, and FIG. 5c are drawings showing an electronic device (300) according to one embodiment of the present disclosure.

[0122] FIG. 5A is a diagram showing a printed circuit board (310, 320) and a shield can (380) according to one embodiment. FIG. 5B is a diagram showing a second printed circuit board (320) on which a shield can (380) according to one embodiment is arranged. FIG. 5C is a cross-sectional view showing an electronic device (300) taken along line A-A' of FIG. 5B.

[0123] Referring to FIG. 5A, an electronic device (300) according to one embodiment may include a first printed circuit board (310), a second printed circuit board (320), a conductive plate (330), an electronic component (360), a first shield can (380), a support member (391), a side member (392), a second shield can (393), and / or a connector (394).

[0124] In one embodiment, at least some of the components of the electronic device (300) may be disposed on the support member (391). For example, in one embodiment, the printed circuit board (310, 320) may be disposed on the support member (391).

[0125] In one embodiment, the side member (392) may be positioned substantially perpendicular to the support member (391). The side member (392) may be positioned to surround at least a portion of the components of the electronic device (300).

[0126] In one embodiment, the first shield can (380) may be arranged to surround the first printed circuit board (310). The second shield can (393) may be arranged to surround electronic components arranged on the second printed circuit board (320).

[0127] In one embodiment, the connector (394) may serve to electrically connect the second printed circuit board (320) to other components of the electronic device (300).

[0128] In one embodiment, the first shield can (380) may be positioned to surround the periphery of the first printed circuit board (310). For example, referring to FIGS. 5A, 5B, and 5C, the first shield can (380) may be positioned on the second printed circuit board (320) to surround the first printed circuit board (310).

[0129] In one embodiment, the first shield can (380) may be positioned to surround the conductive plate (330). For example, referring to FIGS. 5A, 5B, and 5C, the first shield can (380) may be positioned on the second printed circuit board (320) to surround the conductive plate (330).

[0130] In one embodiment, the first shield can (380) may serve to shield noise radiated from the first printed circuit board (310) and the conductive plate (330).

[0131] In one embodiment, a conductive plate (330) may be disposed on a first printed circuit board (310) and a second printed circuit board (320). The conductive plate (330) may serve to electrically connect the first printed circuit board (310) and the second printed circuit board (320).

[0132] FIG. 6 is a drawing showing an electronic device (300) including a challenge plate (630) according to one embodiment of the present disclosure.

[0133] In one embodiment, the challenge plate (630) may include a horizontal region (631) and / or a vertical region (632).

[0134] In one embodiment, the horizontal region (631) may be a region of the conductive plate (630) extending substantially parallel to one side (310A, 320A) of the printed circuit board (310, 320).

[0135] In one embodiment, the vertical region (632) may be a region of the conductive plate (630) that extends substantially perpendicularly to one side (310A, 320A) of the printed circuit board (310, 320).

[0136] In one embodiment, the challenge plate (630) may include three vertical regions (632). For example, the vertical regions (632) may include a first vertical region (6321), a second vertical region (6322), and a third vertical region (6323).

[0137] In one embodiment, two of the three vertical regions (632) may extend from the horizontal region (631) toward the first printed circuit board (310), and the remaining one vertical region (632) may extend from the horizontal region (631) toward the second printed circuit board (320). For example, the first vertical region (6321) and the third vertical region (6323) may extend toward the first printed circuit board (310), and the second vertical region (6322) may extend toward the second printed circuit board (320).

[0138] In one embodiment, the conductive plate (630) may be supported by printed circuit boards (310, 320) at three ends. For example, referring to FIG. 6, the conductive plate (630) may be supported by printed circuit boards (310, 320) at the first end (630a), the second end (630b), and the third end (630c), respectively.

[0139] In one embodiment, the challenge plate (630) may be formed such that the three ends are not positioned on the same virtual straight line. For example, the virtual straight line passing through the first end (630a) and the second end (630b) and the third end (630c) may be spaced apart from each other.

[0140] In one embodiment, one of the three ends of the conductive plate (630) may be in contact with a dummy pad (350, see FIG. 4B). For example, the first end (630a) and the second end (630b) of the conductive plate (630) may be in contact with the conductive pad (340, see FIG. 4A), and the third end (630c) of the conductive plate (630) may be in contact with the dummy pad (350, see FIG. 4B).

[0141] In one embodiment, when the conductive plate (630) is connected to the printed circuit board (310, 320) at three ends, the conductive plate (630) can be more stably supported by the printed circuit board (310, 320) than when it is connected to the printed circuit board (310, 320) at two ends. For example, when the conductive plate (630) is connected to the printed circuit board (310, 320) at three ends, the conductive plate (630) can be supported by the printed circuit board (310, 320) at each of the three ends, so that deformation of the conductive plate (630) due to an external force or change in the arrangement position of the conductive plate (330) during a reflow process can be prevented or reduced.

[0142] FIGS. 7A and 7B are drawings showing a challenge plate (730) according to one embodiment of the present disclosure.

[0143] Fig. 7a is a plan view showing a challenge plate (730) according to one embodiment. Fig. 7b is a front view showing a challenge plate (730) according to one embodiment.

[0144] In describing a conductive plate (730) according to one embodiment of the present disclosure, the longitudinal direction of the conductive plate (730) may mean the X-axis direction, and the width direction may mean the Y-axis direction. The height direction of the conductive plate (730) may mean the Z-axis direction.

[0145] The challenge plate (730) of FIGS. 7a and 7b may include at least a portion of the first challenge plate (230) of FIGS. 2a, 2b, and 2c.

[0146] In one embodiment, the challenge plate (730) may include a horizontal region (731), a vertical region (732), and / or a mounting portion (735).

[0147] In one embodiment, the challenge plate (730) can be soldered to a printed circuit board (310, 320, see FIG. 3) using a surface mounting device (SMD).

[0148] In one embodiment, the mounting portion (735) may be a portion where an external nozzle (not shown) is mounted for placing the conductive plate (730) on a printed circuit board (310, 320, see FIG. 3). For example, the external nozzle (not shown) may be mounted on the mounting portion (735) and may suck the conductive plate (730) to move the conductive plate (730) to a predetermined position.

[0149] In one embodiment, an external nozzle (not shown) may be configured to adsorb the challenge plate (730) in an air-absorbing manner.

[0150] In one embodiment, if the conductive plate (730) includes a mounting portion (735), it may be easier to place the conductive plate (730) at a predetermined location. For example, an external nozzle (not shown) may be mounted on the mounting portion (735) to absorb the conductive plate (730), making it easier to move the conductive plate (730) to a predetermined location.

[0151] In one embodiment, the mounting portion (735) may be formed in a shape corresponding to the external nozzle (not shown). For example, if the external nozzle (not shown) is formed in a circular shape, the mounting portion (735) may have a circular shape corresponding to the external nozzle (not shown).

[0152] In one embodiment, the size of the mounting portion (735) may be formed differently based on the weight of the conductive plate (730) and / or the size of the external nozzle (not shown). For example, the larger the weight of the conductive plate (730), the larger the mounting portion (735) may be formed. The larger the size of the external nozzle (not shown), the larger the mounting portion (735) may be formed.

[0153] In one embodiment, the mounting portion (735) may be formed larger than the external nozzle (not shown). For example, when the mounting portion (735) is formed in a circular shape, the diameter of the mounting portion (735) may be larger than the diameter of the external nozzle (not shown).

[0154] In one embodiment, when the mounting portion (735) is formed larger than the external nozzle (not shown), it may be easier for the external nozzle (not shown) to be mounted on the mounting portion (735).

[0155] In one embodiment, the horizontal region (731) of the conductive plate (730) may be a region extending substantially parallel to a printed circuit board (e.g., printed circuit boards (310, 320) of FIG. 3). The horizontal region (731) may extend substantially parallel to the longitudinal direction (e.g., X-axis direction) and the width direction (e.g., Y-axis direction) of the conductive plate (730).

[0156] In one embodiment, the horizontal region (731) may include a first horizontal region (7311), a second horizontal region (7312), and / or a third horizontal region (7313).

[0157] In one embodiment, the first horizontal region (7311), the second horizontal region (7312), and the third horizontal region (7313) may be connected to the mounting portion (735).

[0158] In one embodiment, the first horizontal region (7311), the second horizontal region (7312), and the third horizontal region (7313) may extend in different directions from the mounting portion (735).

[0159] In one embodiment, the horizontal region (731) may be bent and extended at least in part. For example, referring to FIG. 7A, the first horizontal region (7311) may be bent and extended at the first bend region (7311a). The second horizontal region (7312) may be bent and extended at the second bend region (7312a).

[0160] In one embodiment, the vertical region (732) of the conductive plate (730) may be a region extending substantially perpendicular to a printed circuit board (e.g., printed circuit boards (310, 320) of FIG. 3). The vertical region (732) may extend substantially parallel to a height direction (e.g., Z-axis direction) of the conductive plate (730).

[0161] In one embodiment, the challenge plate (730) may include a plurality of vertical regions (732). For example, the vertical regions (732) may include a first vertical region (7321) and / or a second vertical region (7322).

[0162] In one embodiment, the first vertical region (7321) may be a region extending from the horizontal region (731) toward the first printed circuit board (310, see FIG. 3). The second vertical region (7322) may be a region extending from the horizontal region (731) toward the second printed circuit board (320, see FIG. 3).

[0163] FIG. 8 is a drawing showing an electronic device (800) according to one embodiment of the present disclosure.

[0164] The electronic device (800) of FIG. 8 may include at least some of the components of the electronic device (200) of FIGS. 2a, 2b, and 2c.

[0165] An electronic device (800) according to one embodiment of the present disclosure may include a first printed circuit board (810), a second printed circuit board (820), a first conductive plate (830), an insulator (840), a first electronic component (850), a second electronic component (860), a shield can (870), and / or a second conductive plate (880).

[0166] In describing an electronic device (800) according to one embodiment of the present disclosure, the height direction of the electronic device (800) may mean the Z-axis direction. The length direction of the electronic device (800) may mean the X-axis direction.

[0167] In one embodiment, the first printed circuit board (810) may have substantially the same configuration as the first printed circuit board (210) of FIGS. 2A, 2B, and 2C. The second printed circuit board (820) may have substantially the same configuration as the second printed circuit board (220) of FIGS. 2A, 2B, and 2C. The first conductive plate (830) may have substantially the same configuration as the first conductive plate (230) of FIGS. 2A, 2B, and 2C. The first electronic component (850) may have substantially the same configuration as the first electronic component (250) of FIGS. 2A, 2B, and 2C. The second electronic component (860) may have substantially the same configuration as the second electronic component (260) of FIGS. 2A, 2B, and 2C. The second challenge plate (880) may have substantially the same configuration as the second challenge plate (290) of FIGS. 2a, 2b, and 2c.

[0168] In describing the electronic device (800) of FIG. 8, a detailed description of the configuration substantially identical to that of the electronic device (200) illustrated in FIGS. 2a, 2b, and 2c may be omitted.

[0169] In one embodiment, the first printed circuit board (810) may include a first side (810A), a second side (810B), and / or a first conductive pad (811).

[0170] In one embodiment, the second printed circuit board (820) may include a third side (820A), a fourth side (820B), and / or a second conductive pad (821).

[0171] In one embodiment, the first side (810A) may be a side facing the positive Z-axis direction on the first printed circuit board (810). The second side (810B) may be an opposite side of the first side (810A). For example, the second side (810B) may be a side facing the negative Z-axis direction on the first printed circuit board (810).

[0172] In one embodiment, the second challenge pad (821) may be formed on a third side (820A) of the second printed circuit board (820). In one embodiment, at least a portion of the third side (820A) may face the second side (810B).

[0173] In one embodiment, the shield can (870) may be positioned to surround the first printed circuit board (810). For example, the shield can (870) may be positioned on the second printed circuit board (820) to surround the first printed circuit board (810).

[0174] In one embodiment, the first challenge plate (830) and the shield can (870) may be formed integrally.

[0175] In one embodiment, when the first conductive plate (830) and the shield can (870) are formed integrally, both the first conductive plate (830) and the shield can (870) can be electrically connected to the printed circuit board (810, 820) through a single mounting process (e.g., a process using a surface mount device).

[0176] In one embodiment, when the first challenge plate (830) and the shield can (870) are formed integrally, the process for manufacturing the first challenge plate (830) and the shield can (870) can be simplified and the manufacturing cost can be reduced.

[0177] In one embodiment, the first challenge plate (830) may be disposed on at least a portion of a surface of the shield can (870) that faces the first printed circuit board (810).

[0178] In one embodiment, an insulator (840) may be placed between the first challenge plate (830) and the shield can (870).

[0179] In one embodiment, the insulator (840) may be attached to the shield can (870) in a coating manner.

[0180] In one embodiment, the insulator (840) may serve to prevent or reduce a short circuit between the shield can (870) and the first conductive plate (830). For example, the insulator (840) may serve to prevent or reduce a short circuit between the shield can (870) whose electrical characteristic is ground and the first conductive plate (830) whose electrical characteristic is a signal line.

[0181] In one embodiment, the first challenge plate (830) may be secured to the shield can (870) using an adhesive.

[0182] In one embodiment, the first challenge plate (830) may be coupled to the shield can (870) using a separate fixing structure (not shown) (e.g., a hook-shaped fixing structure).

[0183] In one embodiment, the insulator (840) disposed between the first conductive plate (830) and the shield can (870) may include an adhesive material. The first conductive plate (830) may be secured to the shield can (870) using the insulator (840) including the adhesive material.

[0184] In one embodiment, the second challenge pad (821) may include a second-first challenge pad (8211), a second-second challenge pad (8212), and / or a second-third challenge pad (8213).

[0185] In one embodiment, the second-first conductive pad (8211) may be a pad that contacts an end of the first conductive plate (830). The second-second conductive pad (8212) may be a pad that contacts an end of a shield can (870) that is positioned adjacent to the first conductive plate (830). The second-third conductive pad (8213) may be a pad that contacts an end of a shield can (870) that is not positioned adjacent to the first conductive plate (830).

[0186] In one embodiment, the second-first conductive pad (8211) and the second-second conductive pad (8212) may be spaced apart from each other. The second-first conductive pad (8211) and the second-second conductive pad (8212) may be spaced apart from each other, and a short circuit between the second-first conductive pad (8211) and the second-second conductive pad (8212) may be prevented or reduced.

[0187] FIG. 9A and FIG. 9B are drawings showing an electronic device (900) according to one embodiment of the present disclosure.

[0188] FIG. 9A is a diagram illustrating a first printed circuit board (910), a second printed circuit board (920), and a third printed circuit board (970) according to one embodiment. FIG. 9B is a diagram illustrating an electronic device (900) including a third printed circuit board (970) according to one embodiment.

[0189] The electronic device (900) of FIGS. 9A and 9B may include at least some of the components of the electronic device (200) of FIGS. 2A, 2B, and 2C.

[0190] In describing an electronic device (900) according to one embodiment of the present disclosure, the height direction of the electronic device (900) may mean the Z-axis direction. The length direction of the electronic device (900) may mean the X-axis direction.

[0191] An electronic device (900) according to one embodiment of the present disclosure may include a first printed circuit board (910), a second printed circuit board (920), a conductive plate (930), an insulating member (940), a first electronic component (950), a second electronic component (960), and / or a third printed circuit board (970).

[0192] In one embodiment, the first printed circuit board (910) may have substantially the same configuration as the first printed circuit board (210) of FIGS. 2A, 2B, and 2C. The second printed circuit board (920) may have substantially the same configuration as the second printed circuit board (220) of FIGS. 2A, 2B, and 2C. The first electronic component (950) may have substantially the same configuration as the first electronic component (250) of FIGS. 2A, 2B, and 2C. The second electronic component (960) may have substantially the same configuration as the second electronic component (260) of FIGS. 2A, 2B, and 2C.

[0193] In describing the electronic device (900) of FIGS. 9a and 9b, a detailed description of the configuration substantially identical to that of the electronic device (200) illustrated in FIGS. 2a, 2b, and 2c may be omitted.

[0194] The dotted arrows illustrated in FIG. 9A may indicate the direction in which the configuration of the electronic device (900) moves to be arranged. For example, the first printed circuit board (910), the third printed circuit board (970), and the conductive plate (930) may be arranged by moving along the direction indicated by the dotted arrows.

[0195] In one embodiment, the first printed circuit board (910) may include a first side (910A), a second side (910B), a first conductive pad (911), and / or a third conductive pad (912).

[0196] In one embodiment, the second printed circuit board (920) may include a third side (920A), a fourth side (920B), a second conductive pad (921), and / or a fourth conductive pad (922).

[0197] In one embodiment, the third printed circuit board (970) may include a fifth side (970A), a sixth side (970B), a fifth conductive pad (971), a sixth conductive pad (972), and / or a seventh conductive pad (973).

[0198] In one embodiment, a third printed circuit board (970) may be positioned between the first printed circuit board (910) and the second printed circuit board (920).

[0199] In one embodiment, the fifth side (970A) may have at least a portion facing the second side (910B).

[0200] In one embodiment, a third printed circuit board (970) may be positioned between the first printed circuit board (910) and the second printed circuit board (920) such that the sixth conductive pad (972) is in contact with the third conductive pad (912).

[0201] In one embodiment, a third printed circuit board (970) may be positioned between the first printed circuit board (910) and the second printed circuit board (920) such that the seventh conductive pad (973) is in contact with the fourth conductive pad (922).

[0202] In one embodiment, the challenge plate (930) may be at least partially disposed on a first side (910A) of a first printed circuit board (910), a third side (920A) of a second printed circuit board (920), and a fifth side (970A) of a third printed circuit board (970).

[0203] Referring to FIG. 9B, a third power flow (E3) may be formed along the conductive plate (930) from the upper surface (e.g., the third surface (920A)) of the second printed circuit board (920) toward the upper surface (e.g., the first surface (910A)) of the first printed circuit board (910).

[0204] In one embodiment, the challenge plate (930) may include a first plate pad (931), a second plate pad (932), and / or a third plate pad (933) disposed at the end.

[0205] In one embodiment, the first plate pad (931) may be in contact with the first conductive pad (911). The second plate pad (932) may be in contact with the second conductive pad (921). The third plate pad (933) may be in contact with the fifth conductive pad (971).

[0206] In one embodiment, an insulating member (940) may be disposed on at least a portion of the conductive plate (930). In one embodiment, the insulating member (940) may include an insulating material.

[0207] In one embodiment, the insulating member (940) may serve to prevent the conductive plate (930) from being electrically exposed. For example, the insulating member (940) may serve to prevent or reduce electrical shock that may be applied to the conductive plate (930).

[0208] In one embodiment, the first printed circuit board (910), the second printed circuit board (920), and the third printed circuit board (970) may be electrically connected to each other via the conductive plate (930). For example, referring to FIGS. 9A and 9B , the first side (910A) of the first printed circuit board (910), the third side (920A) of the second printed circuit board (920), and the fifth side (970A) of the third printed circuit board (970) may each be in contact with the conductive plate (930), and the first printed circuit board (910), the second printed circuit board (920), and the third printed circuit board (970) may be electrically connected to each other via the conductive plate (930).

[0209] The conductive plate (930) may be placed on the printed circuit boards (910, 920, 970) in a different form than that shown in FIGS. 9A and 9B. For example, in one embodiment, the second side (910B) of the first printed circuit board (910), the fourth side (920B) of the second printed circuit board (920), and the sixth side (970B) of the third printed circuit board (970) may each be in contact with the conductive plate (930) so that the printed circuit boards (910, 920, 970) are electrically connected. In this case, the second printed circuit board (920) may include an opening (not shown) in which the conductive plate (930) may be placed.

[0210] In one embodiment, the third printed circuit board (970) may include an opening (975) in at least a portion thereof.

[0211] In one embodiment, a second electronic component (960) may be inserted into an opening (975) of a third printed circuit board (970).

[0212] In one embodiment, the conductive plate (930) may be positioned so as not to contact some of the three printed circuit boards (910, 920, 970). For example, in one embodiment, the conductive plate (930) may be positioned so as to contact the first printed circuit board (910) and the second printed circuit board (920), and not to contact the third printed circuit board (970).

[0213] Although three printed circuit boards (910, 920, 970) are illustrated as being stacked in FIGS. 9A and 9B, the number of stacked printed circuit boards (910, 920, 970) may not be limited thereto. For example, in one embodiment, the electronic device (900) may include a structure in which four or more printed circuit boards (910, 920, 970) are stacked. In this case, the conductive plate (930) may be positioned to contact all four or more stacked printed circuit boards (910, 920, 970), or may be positioned to contact some of the four or more stacked printed circuit boards (910, 920, 970).

[0214] FIG. 10A and FIG. 10B are drawings showing an electronic device (1000) according to one embodiment of the present disclosure.

[0215] FIG. 10A is a diagram illustrating an electronic device (1000) including a shielding plate (1030) according to one embodiment. FIG. 10B is a cross-sectional view of the electronic device (1000) taken along line B-B' of FIG. 10A.

[0216] The electronic device (1000) of FIGS. 10A and 10B may include at least some of the components of the electronic device (200) of FIGS. 2A, 2B, and 2C.

[0217] Referring to FIGS. 10A and 10B, an electronic device (1000) according to one embodiment may include a first printed circuit board (1010), a second printed circuit board (1020), a shielding plate (1030), a shield can (1040), a joint (1050), and / or an electronic component (1060).

[0218] In one embodiment, a first printed circuit board (1010) may be disposed on a second printed circuit board (1020).

[0219] Referring to FIG. 10b, a first printed circuit board (1010) can be bonded to a second printed circuit board (1020) via a bonding portion (1050).

[0220] In one embodiment, the electronic component (1060) may be placed on a first printed circuit board (1010).

[0221] In one embodiment, the electronic component (1060) may include components necessary for the operation of the electronic device (1000) (e.g., the processor (120) of FIG. 1, the memory (130) of FIG. 1). In one embodiment, the electronic component (1060) may include the first electronic component (250) and / or the second electronic component (260) of FIGS. 2A, 2B, and 2C.

[0222] In one embodiment, the shield can (1040) may be placed on the first printed circuit board (1010).

[0223] In one embodiment, a shield can (1040) may be arranged to surround an electronic component (1060). The shield can (1040) may serve to shield noise radiated from the electronic component (1060).

[0224] Referring to FIGS. 10A and 10B, a shielding plate (1030) according to one embodiment may be formed to extend along the periphery of the first printed circuit board (1010).

[0225] In one embodiment, the shielding plate (1030) may be positioned to surround the joint (1050).

[0226] In one embodiment, the shield plate (1030) may be spaced apart from the shield can (1040). For example, the shield plate (1030) may be positioned at a distance from the perimeter of the shield can (1040).

[0227] Referring to FIG. 10b, the first printed circuit board (1010) may include a first pad (1011) formed on one surface. The second printed circuit board (1020) may include a second pad (1021) formed on one surface. The shielding plate (1030) may be in contact with the first pad (1011) at one end and in contact with the second pad (1021) at the other end.

[0228] In one embodiment, the shielding plate (1030) may include a conductive material. For example, the shielding plate (1030) may include stainless steel (STS).

[0229] In one embodiment, the shielding plate (1030) may serve to shield noise radiated from the joint (1050).

[0230] In one embodiment, the shielding plate (1030) may serve as a ground for the printed circuit board (1010, 1020).

[0231] In one embodiment, the shielding plate (1030) may include a mounting portion (1035) on which an external nozzle (not shown) may be mounted.

[0232] In one embodiment, the mounting portion (1035) of the shielding plate (1030) may be formed larger than the external nozzle (not shown). For example, the width of the mounting portion (1035) of the shielding plate (1030) may be larger than the diameter of the external nozzle (not shown). The width of the mounting portion (1035) of the shielding plate (1030) may refer to a length that the mounting portion (1035) of the shielding plate (1030) extends in the longitudinal direction (e.g., X-axis direction) or the width direction (e.g., Y-axis direction) of the electronic device (1000).

[0233] In one embodiment, when the width of the mounting portion (1035) is formed to be larger than the diameter of the external nozzle (not shown), it may be easier for the external nozzle (not shown) to be mounted on the mounting portion (1035).

[0234] Printed circuit boards, which are densely packed with electronic components and wiring, can be vulnerable to high-temperature warpage during the manufacturing process as they grow larger. Therefore, a structure may be needed to efficiently arrange electronic components and wiring within a limited printed circuit board size.

[0235] Printed circuit boards with high wiring density can be designed so that specific pins on an electronic component are connected to specific pins on an adjacent printed circuit board with the shortest possible distance. However, if a specific pin on an electronic component must be connected to a different pin on an adjacent printed circuit board, the wiring within the printed circuit board must be long, potentially resulting in wasted wiring space.

[0236] In a multilayer printed circuit board, for electrical connection between a first printed circuit board (e.g., a core printed circuit board) and a second printed circuit board (e.g., a master printed circuit board), wiring may pass through the interior of the first printed circuit board and be connected to the second printed circuit board. However, since electronic components requiring wiring connection are distributed in multiple locations on the first printed circuit board, this may result in waste of wiring space.

[0237] An electronic device (200, 300, 800, 900, 1000) according to one embodiment of the present disclosure may include a first printed circuit board (210, 310, 810, 910, 1010), a second printed circuit board (220, 320, 820, 920, 1020), a power management circuit (e.g., a first electronic component (250) of FIG. 2c), a power supply circuit (e.g., a third electronic component (270) of FIG. 2c), a conductive plate (230, 330, 830, 930), and an insulating member (240, 940).

[0238] In one embodiment, the first printed circuit board (210) may include a first surface (210A), a second surface (210B) opposite the first surface (210A), and a first conductive pad (211) formed on the first surface (210A).

[0239] In one embodiment, the second printed circuit board (220) may include a third side (220A) at least partially facing the second side (210B), a fourth side (220B) that is the opposite side of the third side (220A), and a second conductive pad (221) formed on the third side (220A).

[0240] In one embodiment, a power management circuit (e.g., the first electronic component (250) of FIG. 2C) may be disposed on a first side (210A) of a first printed circuit board (210) and electrically connected to a first conductive pad (211).

[0241] In one embodiment, a power supply circuit (e.g., the third electronic component (270) of FIG. 2c) is disposed on at least one of the third side (220A) and the fourth side (220B) of the second printed circuit board (220) and may be electrically connected to the second conductive pad (221).

[0242] In one embodiment, the challenge plate (230) may include a first stage (230a) and a second stage (230b).

[0243] In one embodiment, the challenge plate (230) may be in contact with a first challenge pad (211) at a first end (230a) and in contact with a second challenge pad (221) at a second end (230b).

[0244] In one embodiment, an insulating member (240) may be disposed on at least a portion of the conductive plate (230).

[0245] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can electrically connect an upper surface (e.g., first surface (210A)) of a first printed circuit board (210) and an upper surface (e.g., third surface (220A)) of a second printed circuit board (220) using a conductive plate (e.g., first conductive plate (230)).

[0246] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can electrically connect a lower surface (e.g., a second surface (210B)) of a first printed circuit board (210) and a lower surface (e.g., a fourth surface (220B)) of a second printed circuit board (220) using a conductive plate (e.g., a second conductive plate (290)).

[0247] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can electrically connect a first printed circuit board (210) and a second printed circuit board (220) using a conductive plate (230), so that wiring penetrating the interior of the first printed circuit board (210) and the second printed circuit board (220) may not be required.

[0248] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can improve the degree of freedom of wiring arranged on a printed circuit board by removing unnecessary wiring inside the printed circuit board and reduce the size of the printed circuit board.

[0249] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can reduce the number of pins of a joint of a multilayer printed circuit board.

[0250] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can electrically connect each printed circuit board by arranging a conductive plate using a surface mounting device (SMD) without a separate electrical assembly process.

[0251] An electronic device (200, 300, 800, 900) according to one embodiment of the present disclosure can reduce high-temperature warpage of a printed circuit board by eliminating unnecessary wiring inside the printed circuit board.

[0252] In one embodiment, the electronic device (200) may include a processor (e.g., the second electronic component (260) of FIG. 2c) that is disposed on a second side (210B) of the first printed circuit board (210) and that receives power from a power management circuit (e.g., the third electronic component (270) of FIG. 2c).

[0253] In one embodiment, the second printed circuit board (220) may include an opening (225) into which at least a portion of a processor (e.g., the second electronic component (260) of FIG. 2c) is inserted.

[0254] In one embodiment, the challenge plate (730) includes a mounting portion (735) on which an external nozzle can be mounted, and the diameter of the mounting portion (735) can be larger than the diameter of the external nozzle.

[0255] In one embodiment, the electronic device (200) may include a dummy pad (350) formed on at least one of a first side (210A, 310A) of a first printed circuit board (210, 310) and a third side (220A, 320A) of a second printed circuit board (220, 320).

[0256] In one embodiment, the challenge plate (330) may be in contact with a first challenge pad (211, 340) at a first end (330a), in contact with a second challenge pad (221, 340) at a second end (330b), and in contact with a dummy pad (350) at the remaining end.

[0257] In one embodiment, a shield can (380, 870) may be disposed on a second printed circuit board (320, 820) to surround a first printed circuit board (310, 810).

[0258] In one embodiment, the challenge plate (830) may be placed on at least a portion of a surface of the shield can (870) that faces the first printed circuit board (810).

[0259] In one embodiment, the electronic device (800) may include an insulator (840) disposed between the conductive plate (830) and the shield can (870).

[0260] In one embodiment, the second challenge pad (821) may include a third challenge pad (e.g., the 2-1 challenge pad (8211)) that contacts an end of the challenge plate (830) (e.g., the second end (230b)) and a fourth challenge pad (e.g., the 2-2 challenge pad (8212)) that contacts an end of the shield can (870).

[0261] In one embodiment, the third challenge pad (e.g., the 2-1 challenge pad (8211)) and the fourth challenge pad (e.g., the 2-2 challenge pad (8212)) may be spaced apart from each other.

[0262] In one embodiment, the electronic device (1000) may include a joint (1050) disposed between a first printed circuit board (1010) and a second printed circuit board (1020) to connect the first printed circuit board (1010) and the second printed circuit board (1020) to each other, and a shielding plate (1030) for shielding noise radiated from the joint (1050).

[0263] In one embodiment, the shielding plate (1030) may be formed to extend along the perimeter of the first printed circuit board (1010).

[0264] In one embodiment, the shielding plate (1030) may include a mounting portion (1035) on which an external nozzle may be mounted.

[0265] In one embodiment, the width of the mounting portion (1035) of the shielding plate (1030) may be larger than the diameter of the external nozzle.

[0266] An electronic device (1000) according to one embodiment of the present disclosure can include a shielding plate (1030) surrounding a joint (1050) to shield noise radiated from the joint (1050).

[0267] In one embodiment, the electronic device (900) may include a third printed circuit board (970) disposed between the first printed circuit board (910) and the second printed circuit board (920), the third printed circuit board including a fifth side (970A) at least partially facing the second side (910B) and a sixth side (970B) that is opposite the fifth side (970A).

[0268] In one embodiment, the challenge plate (930) may be at least partially disposed on a first side (910A) of a first printed circuit board (910), a third side (920A) of a second printed circuit board (920), and a fifth side (970A) of a third printed circuit board (970).

[0269] In one embodiment, a power management circuit (e.g., the first electronic component (250) of FIG. 2C) may receive power from a power supply circuit (e.g., the third electronic component (270) of FIG. 2C) to power at least one electronic component (e.g., memory, display).

[0270] An electronic device (200, 300, 800, 900, 1000) according to one embodiment of the present disclosure may include a first printed circuit board (210, 310, 810, 910, 1010), a second printed circuit board (220, 320, 820, 920, 1020), a conductive plate (230, 330, 830, 930), and an insulating member (240, 940).

[0271] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0272] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0273] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0274] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0275] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0276] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0277] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0278] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0279] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices (200, 300, 800, 900, 1000), A first printed circuit board (210, 310, 810, 910, 1010) including a first surface (210A), a second surface (210B) opposite to the first surface, and a first conductive pad (211) formed on the first surface; A second printed circuit board (220, 320, 820, 920, 1020) including a third surface (220A) at least partly facing the second surface of the first printed circuit board, a fourth surface (220B) opposite the third surface, and a second conductive pad (221) formed on the third surface; A conductive plate (230, 330, 830, 930) comprising a first stage (230a) and a second stage (230b), and in contact with a first conductive pad in the first stage and in contact with a second conductive pad in the second stage; and An electronic device comprising an insulating member (240, 940) disposed on at least a portion of the above-described challenge plate.

2. In paragraph 1, The above electronic device, An electronic device further comprising a power management circuit (250) disposed on the first surface of the first printed circuit board and electrically connected to the first conductive pad.

3. In paragraph 2, The above electronic device, An electronic device further comprising a power supply circuit (270) disposed on at least one of the third side and the fourth side of the second printed circuit board and electrically connected to the second conductive pad.

4. In paragraph 2, The above electronic device, It further includes a processor (260) disposed on the second surface of the first printed circuit board and supplied with power from the power management circuit, The above second printed circuit board, An electronic device comprising an opening (225) into which at least a portion of the processor is inserted.

5. In paragraph 4, The above challenge plate includes a mounting portion (735) on which an external nozzle can be mounted, An electronic device in which the diameter of the above-mentioned mounting portion is larger than the diameter of the above-mentioned external nozzle.

6. In paragraph 1, The above electronic device, It further includes a dummy pad (350) formed on at least one of the first surface of the first printed circuit board and the third surface of the second printed circuit board, The above challenge plate is, An electronic device that is in contact with the first conductive pad at the first end, in contact with the second conductive pad at the second end, and in contact with the dummy pad at the remaining end.

7. In paragraph 1, The above electronic device, An electronic device further comprising a shield can (380, 870) disposed on the second printed circuit board to surround the first printed circuit board.

8. In paragraph 7, The above challenge plate is, An electronic device disposed on at least a portion of a surface of the shield can facing the first printed circuit board.

9. In paragraph 8, The above electronic device, An electronic device further comprising an insulator (840) disposed between the above-described challenge plate and the above-described shield can.

10. In paragraph 8, The above second challenge pad is, A third conductive pad (8211) in contact with the second end of the conductive plate; and Includes a fourth challenge pad (8212) that comes into contact with the end of the shield can, An electronic device wherein the third challenge pad and the fourth challenge pad are spaced apart from each other.

11. In paragraph 1, The above electronic device, A joint (1050) disposed between the first printed circuit board and the second printed circuit board and connecting the first printed circuit board and the second printed circuit board to each other; and An electronic device further comprising a shielding plate (1030) for shielding noise radiated from the above joint.

12. In paragraph 11, The above shielding plate, An electronic device extending along the periphery of the first printed circuit board.

13. In paragraph 12, The above shielding plate includes a mounting portion (1035) on which an external nozzle can be mounted, An electronic device in which the width of the mounting portion of the shielding plate is larger than the diameter of the external nozzle.

14. In paragraph 1, The above electronic device, A third printed circuit board (970) is further included, which is disposed between the first printed circuit board and the second printed circuit board and includes a fifth side (970A) at least part of which faces the second side and a sixth side (970B) which is the opposite side of the fifth side, The above challenge plate is, An electronic device having at least a portion disposed on the first surface of the first printed circuit board, the third surface of the second printed circuit board, and the fifth surface of the third printed circuit board.

15. In paragraph 3, The power management circuit is an electronic device that receives power from the power supply circuit and supplies power to at least one electronic component.

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