De-cap system

Abstract

A de-cap system is disclosed. The de-cap system of the present invention comprises: a Y-axis driving unit coupled to a system body to drive a sample holding device, to which a sample member is coupled, in the Y-axis direction; and an R-axis driving unit coupled to the Y-axis driving unit to rotate the sample holding device in the R-axis direction, wherein the Y-axis driving unit moves the sample holding device in the Y-axis direction at different speeds.

Description

Decap system

[0001] The present invention relates to a decap system, and more particularly, to a stage for a decap system having dual Y-axis movement and R-axis rotation control, which can uniformly polish a sample with high precision by moving the sample along the dual Y-axis and rotating the sample along the R-axis during decap operation.

[0002] In the semiconductor and display fields, reverse engineering, monitoring, and defect analysis are performed on specific samples that have undergone processing to improve process yield and conduct research and development.

[0003] To achieve this, uniform de-cap (de-processing, hereinafter referred to as "de-cap") work is essential for the fine thin film layers formed in each process. This process involves performing a polishing operation (CMP, Chemical Mechanical Polishing) with nano-level precision while maintaining uniform flatness. Unlike wafers or flat panel displays on the production line, this polishing operation is performed on chipped, square-shaped semiconductor or display samples.

[0004] The CMP process involves placing a sample on a polishing wheel and a polishing pad, and using slurry (a chemical polishing solution) to remove material from the sample surface. This process combines chemical reaction and mechanical friction to achieve high-precision planarization. Key components of CMP include the polishing pad, slurry, sample stage, and pressure control device.

[0005] The polishing pad provides mechanical friction by contacting the sample and serves to absorb and distribute the slurry.

[0006] During the polishing process, slurry aids in the removal of material from the sample surface through chemical reactions. Slurry typically consists of ingredients such as oxidizers, abrasives, and stabilizers, and the polishing rate and surface quality vary depending on the slurry composition.

[0007] The sample stage is a device that fixes the sample and controls its relative movement with the polishing pad, thereby improving polishing uniformity through rotational and translational movements.

[0008] The pressure control device controls the pressure between the sample and the polishing pad to adjust the polishing speed and uniformity.

[0009] The existing CMP process is an essential technology in semiconductor manufacturing, but it has the following technical limitations and problems.

[0010] Dishing is a surface depression caused by excessive material removal within a patterned area, while erosion is a phenomenon in which more material is removed from areas with high pattern density. This uneven removal prevents a precision polished surface for semiconductor condition assessment, making it difficult to accurately determine manufacturing conditions and degrading decap quality.

[0011] Edge over polishing is a problem where excessive polishing occurs at the edge of the sample, resulting in thickness unevenness.

[0012] Meanwhile, the existing sample stage has a structure that allows for translational movement along the X and Y axes and rotational movement along the Z axis. In this case, the X axis can only adjust the center position. In particular, the Y axis only performs a simple reciprocating motion, which causes dishing in local areas and makes it impossible to partially control the uneven polishing surface.

[0013] The above-described technical configuration is background technology to help understand the present invention, and does not mean a conventional technology widely known in the technical field to which the present invention belongs.

[0014] Although several technologies have been developed to improve the existing decap process, the following limitations still exist.

[0015] Existing stages only provide simple rotation and lack the technology to control complex double motion. Precise control of the sample stage is essential to ensuring polishing uniformity.

[0016] The present invention aims to address the aforementioned problems and to provide technical improvements to enhance the precision, efficiency, and quality of the decap process. Specifically, the present invention provides a stage for a decap system equipped with dual Y-axis movement and R-axis rotation control, which can reduce dishing and edge over-polishing and implement double motion control of the sample stage, thereby providing a novel CMP polishing control technology.

[0017] According to one aspect of the present invention, a decap system may be provided, including a Y-axis driving unit coupled to a system body and driving a sample holding device to which a sample member is coupled in the Y-axis direction; and an R-axis driving unit coupled to the Y-axis driving unit and rotating the sample holding device in the R-axis direction, wherein the Y-axis driving unit moves the sample holding device in the Y-axis direction at different speeds.

[0018] The apparatus may further include a slurry collector having a collector base body coupled to a polishing area of ​​the sample member; and a collector body coupled to the collector base body to guide slurry moving to the edge of the polishing area during polishing of the sample member to the area of ​​the sample member.

[0019] The polishing device for the decap system may further include a polishing body arranged close to the sample member; a polishing unit arranged on the upper portion of the sample member to polish the sample member; and a polishing drive unit having one side coupled to the polishing body and the other side coupled to the polishing unit to move the polishing unit in the X-axis direction, which is the left-right direction of the sample member, and the Z-axis direction, which is the up-down direction of the sample member.

[0020] The polishing pad may further include a cleaning and storage device that includes a bath body disposed in a polishing area where the sample member is polished, the inside of the bath body is filled with liquid, and a polishing pad is placed inside the bath body filled with the liquid to prevent solidification of the slurry on the polishing pad.

[0021] The sample holding device for a decap system may further include a sample holding unit to which a sample member is detachably coupled, wherein the sample holding unit comprises: a holding base body on which the sample member is seated; a sample adsorption unit coupled to the holding base body and adsorbing the sample member from a lower portion of the sample member; and a sample support unit coupled to the holding base body and supporting a side wall of the sample member.

[0022] The present invention further includes a sample holding device for a decap system, comprising: a holder base body on which a sample member to be polished is mounted; and a sample holder unit that is movably provided on the holder base body to hold the sample member to be polished, wherein the holder base body is provided with an air hole through which air is introduced and discharged, and the sample holder unit includes: an elastic member arranged inside the holder base body; a first sample holder unit that is supported on one side of the elastic member and moves in the direction of the sample member by air introduced through the air hole to hold one side of the sample member; and a second sample holder unit that is supported on the other side of the elastic member and moves in the direction of the sample member by air introduced through the air hole to hold the other side of the sample member.

[0023] In a polishing device for a decap system for polishing the above sample member, the pressure for pressing the sample member is set based on a specific position coordinate in the Z-axis direction stored in the recipe,

[0024] By detecting the load of the polishing device for the decap system at the beginning of polishing and correcting the Z-axis coordinate to match the load stored in the recipe, the pressure applied to the sample member can be kept constant, thereby improving polishing reproducibility.

[0025] Embodiments of the present invention can uniformly polish a sample with high precision by moving a sample holding unit to which a sample member is coupled at different speeds in the Y-axis direction by a first Y-axis driving unit and a second Y-axis driving unit.

[0026] In addition, by moving the sample holding unit, to which the sample member is attached, more slowly than the second Y-axis driving unit and by increasing the reciprocating range than the second Y-axis driving unit, the uneven wear, bending, and edge over-polishing of the sample member are improved, thereby enabling the specimen member to be polished uniformly.

[0027] Furthermore, the second Y-axis driving unit reciprocates the sample holding unit to which the sample member is coupled faster than the first Y-axis driving unit and narrows the reciprocating range, thereby eliminating the local area dishing phenomenon of the sample member, thereby enabling uniform polishing of the specimen member.

[0028] Embodiments of the present invention improve the problem of slurry leaving the area of ​​the sample due to the high-speed rotation of the polishing pad and the rotational force of the holder plate during the decap operation of the sample, thereby enabling the slurry to be supplied uniformly without loss during the polishing operation of the sample member, thereby preventing overheating due to lack of slurry and significantly reducing errors occurring in the reproducibility and uniformity of the polishing thickness.

[0029] Embodiments of the present invention can improve the precision and efficiency of polishing work through the multi-directional position adjustment function of the polishing pad, and can monitor the sample member in real time, so that problems occurring during polishing can be immediately resolved.

[0030] Embodiments of the present invention can effectively prevent the problem of solidification of slurry remaining inside the polishing pad by filling the inside of the bath body with liquid and storing the polishing pad therein. By pressurizing the polishing pad using the cross-shaped bath protrusion provided at the bottom of the bath body, the residual slurry remaining inside and on the surface of the polishing pad can be easily removed. By storing the entire polishing disc portion, including the polishing pad, so as to be submerged in the liquid, contamination of the polishing pad and the polishing disc portion or performance degradation due to slurry solidification can be prevented, thereby enabling stable use for a long period of time. The cross-shaped bath protrusion and the bath body structure provide simple yet highly functional functions, allowing for easy and quick cleaning and storage of the polishing pad. Damage to the polishing pad is reduced through slurry solidification and residue removal, and the effects of maintaining performance and extending the lifespan during repeated use are achieved.

[0031] Embodiments of the present invention are designed to be applicable to cross-sectional samples, flat samples, and mounted samples with a detachable holding structure, thereby overcoming existing limitations and enhancing usability. By applying a vacuum adsorption method, samples can be automatically removed without the use of a separate wrench, thereby improving work efficiency. Furthermore, the vacuum fixation method of the sample member can improve horizontal errors that occur when applying a mechanical fixation method (existing grip fixation method) of the sample member, and can enable automation by a robot. Furthermore, after the sample member is adsorbed, the sample adsorption portion is moved below the upper surface of the holder plate by vacuum, thereby improving the horizontal error caused by the upper surface protrusion of the second sealing member during the sample member adsorption. The holder plate is manufactured from a lightweight material such as Teflon resin to reduce weight and friction, thereby preventing overload of the rotation stage. Multiple sample support portions are arranged to provide balanced support for the side walls of the sample, thereby preventing the sample from tilting or uneven wear.

[0032] Embodiments of the present invention utilize a novel fixing structure to enable decap work without shaking the sample member. The design prevents polishing interference caused by the fixture (gripper) even when fixing a thin sample member, thereby improving processing quality. Automating the fixing and releasing process of the sample member increases work speed and reduces human error. A structure supporting the sample member on both sides prevents the sample from shaking during device operation. Optimizing the fixing force prevents excessive pressure and ensures safe fixation of even thin sample members. An elastic member positioned between the first and second sample holders allows the first and second sample holders to move evenly during sample holding, thereby facilitating sample centering. Air flowing in through air holes continuously pressurizes the first and second sample holders during sample polishing, thereby safely fixing the sample member. A first breakage prevention hole provided in the first sample holder and a second breakage prevention hole provided in the second sample holder prevent the edges of the sample member from breaking. The first sample holder part and the second sample holder part that support the sample member are provided in an interchangeable manner, so that the shape can be easily changed according to the size and shape of the sample member. The slurry that has entered the interior of the holder base body through the first movement guide hole and the second movement guide hole can be removed by the reciprocating movement of the first movement body of the first sample holder part and the second movement body of the second sample holder part. The holding of the sample member can be performed more stably by the first guide flange provided on the first holder part body and supported on the outer wall of the first movement body, and the second guide flange provided on the second holder part body and supported on the outer wall of the second movement body. This improves the efficiency and stability of the decap operation, enables more reliable fixation of sample members of various sizes and thicknesses, and prevents sticking caused by the slurry.

[0033] Embodiments of the present invention can solve the problem that the pressure applied to a sample in a polishing device is set based on a specific Z-axis position coordinate stored in a recipe, but the pressure may change due to wear of the polishing pad or manufacturing processing errors of the polishing disc. In particular, by detecting the load of the servo motor at the beginning of polishing and correcting the Z-axis coordinate to match the load stored in the recipe, the pressure applied to the sample can be kept constant at all times. This can minimize frictional force and pressure changes occurring during the polishing process, thereby improving polishing reproducibility. Furthermore, by adjusting the Z-axis coordinate in real time during polishing, the target endpoint of the semiconductor layer can be accurately maintained, resulting in reduced processing errors and ensuring consistent polishing quality. Accordingly, the reliability of the semiconductor manufacturing process can be increased and the uniformity of the product can be improved.

[0034] FIG. 1 is a schematic diagram illustrating a stage for a decap system having dual Y-axis movement and R-axis rotation control of a decap system according to one embodiment of the present invention, and a state in which the stage for the decap system is coupled to a sample holding device and a drain bath.

[0035] Figure 2 is a schematic diagram illustrating a decap system to which the present embodiment is applied.

[0036] Figure 3 is a schematic internal perspective view of Figure 2.

[0037] Figure 4 is a rear perspective view of Figure 3.

[0038] FIG. 5 is a perspective view schematically illustrating the area of ​​the stage for the decap system illustrated in FIG. 3.

[0039] Figure 6 is a schematic front view of Figure 1.

[0040] Figure 7 is a schematic perspective view of the bottom of Figure 1.

[0041] Fig. 8 is a perspective view showing the R-axis drive motor and the drain bath illustrated in Fig. 7 without the bath connection plate connecting them.

[0042] Figure 9 is a drawing showing the drain bath excluded from Figure 8.

[0043] FIG. 10 is a schematic drawing showing a sample holder connected to an R-axis drive unit, with the Y-axis drive unit, holder plate, and plate wall shown in FIG. 9 excluded.

[0044] FIG. 11 illustrates movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath by the operation of the first Y-axis drive unit illustrated in FIG. 1. FIG. 11 (a) illustrates a state before movement, and FIG. 11 (b) is a drawing illustrating movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath in the direction of the arrow illustrated in FIG. 11 (a).

[0045] FIG. 12 illustrates the movement of the R-axis drive unit and the drain bath by the operation of the second Y-axis drive unit illustrated in FIG. 1. FIG. 12 (a) illustrates the state before movement, and FIG. 12 (b) is a drawing illustrating the movement of the R-axis drive unit and the drain bath in the direction of the arrow illustrated in FIG. 12 (a).

[0046] FIG. 13 is a schematic diagram illustrating a slurry collector according to one embodiment of the present invention.

[0047] Fig. 14 is a bottom perspective view of Fig. 13.

[0048] Figure 15 is a front view of Figure 13.

[0049] Figure 16 is an exploded perspective view of Figure 13.

[0050] Figure 17 is a schematic diagram illustrating the present embodiment arranged in a sample holding unit and a drain bath.

[0051] Fig. 18 is a diagram showing the usage status of the slurry collector applied to this embodiment.

[0052] FIG. 19 is a schematic drawing of a polishing device for a decap system according to one embodiment of the present invention.

[0053] Figure 20 is a rear perspective view of Figure 19.

[0054] Figure 21 is a drawing schematically illustrating the main parts of this embodiment.

[0055] Figure 22 is a rear perspective view of Figure 21.

[0056] Fig. 23 is a perspective view illustrating the polishing unit illustrated in Fig. 21.

[0057] Figure 24 is a left side view of Figure 23.

[0058] Figure 25 is a perspective view showing the spacer member and the polishing disk portion and polishing pad shown in Figure 23 separated from the motor connection flange.

[0059] Fig. 26 is a perspective view showing a plurality of spacer members shown in Fig. 25 separated from the polishing disk portion.

[0060] Fig. 27 is a perspective view showing the first polishing disc illustrated in Fig. 26 separated.

[0061] Figure 28 is an exploded perspective view of Figure 27.

[0062] Figure 29 is a front view of Figure 28.

[0063] Fig. 30 is a drawing illustrating a horizontal adjuster applied to the present embodiment.

[0064] Figure 31 is a usage status diagram of the horizontal adjuster shown in Figure 30.

[0065] Fig. 32 is a perspective view showing the nozzle section illustrated in Fig. 19.

[0066] FIG. 33 is a schematic drawing showing a cleaning and storage device for a polishing pad for a decap system according to one embodiment of the invention mounted in a polishing area.

[0067] FIG. 34 is a schematic drawing of a sample holding device for a decap system applied to a decap system according to one embodiment of the present invention.

[0068] Figure 35 is a rear perspective view of Figure 34.

[0069] Figure 36 is a cross-sectional view taken along line A-A' of Figure 34.

[0070] Figure 37 is a schematic drawing showing the sample holding portion shown in Figure 34 separated from the holder plate.

[0071] Fig. 38 is a perspective view showing the sample holding unit illustrated in Fig. 37.

[0072] Figure 39 is a bottom perspective view of Figure 38.

[0073] Fig. 40 is a cross-sectional view schematically illustrating the area of ​​the sample suction portion illustrated in Fig. 38.

[0074] Figure 41 is an enlarged view of the area of ​​the sample adsorption portion illustrated in Figure 40.

[0075] Figure 42 is a perspective view showing the sample adsorption portion and one sample support portion shown in Figure 38 separated from the holder plate.

[0076] Figure 43 is a cross-sectional view of the sample adsorption portion illustrated in Figure 42.

[0077] Fig. 44 is a perspective view schematically illustrating the first sealing member and the second sealing member in Fig. 43 separated from the holder suction body.

[0078] Figure 45 is a perspective view showing the plate sealing member, plate fastening member, and plate cover shown in Figure 37 separated from the holder plate.

[0079] Figure 46 is a schematic drawing of a sample holding device for a decap system applied to one embodiment of the present invention.

[0080] Fig. 47 is a rear perspective view of the holder base body illustrated in Fig. 46.

[0081] Fig. 48 is a central cross-sectional view of the holder base body illustrated in Fig. 46.

[0082] Figure 49 is an exploded cross-sectional view of Figure 48.

[0083] Fig. 50 is a perspective view showing the holder base body illustrated in Fig. 46.

[0084] Fig. 51 is a perspective view showing the sample holder unit illustrated in Fig. 49.

[0085] Figure 52 is an exploded perspective view of the first sample holder portion and the second sample holder portion illustrated in Figure 51.

[0086] Figure 53 is a bottom perspective view of Figure 52.

[0087] Figure 54 is an operating diagram of this embodiment.

[0088] Figure 55 is a bottom perspective view of the holder plate illustrated in Figure 46.

[0089] Figure 56 is a usage state diagram of a sample holding device for a decap system applied to this embodiment.

[0090] Figure 57 is a schematic drawing showing a state of use of the present embodiment in which a sample member coupled to a sample holding device and a polishing pad are moved in a specific direction by a Y-axis driving unit of the sample holding unit to adjust the polishing position.

[0091] Figure 58 is a schematic diagram illustrating a state of polishing a sample member with a polishing pad in a subsequent state diagram of Figure 57.

[0092] Figure 59 is an enlarged view of the area of ​​the sample holder device illustrated in Figure 58.

[0093] Figure 60 is a drawing showing a polishing unit in which polishing of a sample member has been completed in a subsequent state diagram of Figure 59 and is moved in the X-axis direction by a polishing drive unit and positioned in a cleaning and storage device for a polishing pad for a decap system.

[0094] In order to fully understand the present invention, its operational advantages, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

[0095] Hereinafter, the present invention will be described in detail by describing preferred embodiments thereof with reference to the attached drawings. The same reference numerals in each drawing represent the same components.

[0096] FIG. 1 is a schematic diagram showing a stage for a decap system having dual Y-axis movement and R-axis rotation control of a decap system according to one embodiment of the present invention, and a state in which the stage for the decap system is coupled to a sample holding device and a drain bath, FIG. 2 is a schematic diagram showing a decap system to which the present embodiment is applied, FIG. 3 is a schematic internal perspective view of FIG. 2, FIG. 4 is a rear perspective view of FIG. 3, and FIG. 5 is a schematic perspective view showing an area of ​​the stage for the decap system shown in FIG. 3.

[0097] Also, FIG. 6 is a schematic front view of FIG. 1, FIG. 7 is a schematic bottom perspective view of FIG. 1, FIG. 8 is a perspective view showing the R-axis drive motor and the drain bath shown in FIG. 7 with the bath connection plate removed, FIG. 9 is a drawing showing the drain bath removed from FIG. 8, and FIG. 10 is a drawing schematically showing the sample holder connected to the R-axis drive unit with the Y-axis drive unit, holder plate, and plate wall shown in FIG. 9 removed.

[0098] Furthermore, FIG. 11 illustrates movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath by the operation of the first Y-axis drive unit illustrated in FIG. 1. FIG. 11 (a) illustrates a state before movement, FIG. 11 (b) is a drawing illustrating movement of the second Y-axis drive unit, the R-axis drive unit, and the drain bath in the direction of the arrow illustrated in FIG. 11 (a), and FIG. 12 illustrates movement of the R-axis drive unit and the drain bath by the operation of the second Y-axis drive unit illustrated in FIG. 1. FIG. 12 (a) illustrates a state before movement, and FIG. 12 (b) is a drawing illustrating movement of the R-axis drive unit and the drain bath in the direction of the arrow illustrated in FIG. 12 (a).

[0099] As shown in these drawings, the decap system according to the present embodiment includes a stage (1) for a decap system that drives a sample member (20) in the Y-axis direction and rotates it in the R-axis direction, a slurry collector (1000) that is arranged in an area of ​​the sample member (20) and guides slurry that moves to the edge of the polishing area during polishing of the sample member (20) to the area of ​​the sample member (20), a polishing device (2000) for a decap system that polishes the sample member (20), a cleaning and storage device (3000) for a polishing pad that has a polishing pad (2250) placed inside filled with liquid to prevent solidification of the slurry on the polishing pad (2250), and a sample holding device (4000, 5000) that holds the sample member (20).

[0100] A stage (1) for a decap system having dual Y-axis movement and R-axis rotation control according to the present embodiment includes a Y-axis drive unit (100) coupled to a system body (10) of the decap system to drive a sample holding device (4000) coupled with a sample member (20) in the Y-axis direction, and an R-axis drive unit (200) coupled to the Y-axis drive unit (100) to rotate the sample holding device (4000). In the present embodiment, the R-axis direction may be a direction of rotation clockwise or counterclockwise with respect to the X-axis.

[0101] The Y-axis driving unit (100) can uniformly polish a sample with high precision by moving the sample holding device (4000) to which the sample member (20) is coupled at different speeds in the Y-axis direction.

[0102] In this embodiment, the Y-axis drive unit (100) includes, as illustrated in FIG. 1, a first Y-axis drive unit (110) and a second Y-axis drive unit (120) coupled to the upper portion of the first Y-axis drive unit (110) so as to reciprocate in the Y-axis direction.

[0103] The first Y-axis driving unit (110) of the Y-axis driving unit (100) moves the sample holding device (4000) to which the sample member (20) is coupled reciprocally in the Y-axis direction more slowly than the second Y-axis driving unit (120), and at the same time, extends the reciprocating range more than the second Y-axis driving unit (120), thereby allowing the entire upper surface area of ​​the sample member (20) to be polished. As a result, uneven wear, bending, and edge over-polishing of the sample member (20) can be improved, so that the specimen member can be polished uniformly.

[0104] In this embodiment, the first Y-axis driving unit (110), as illustrated in FIG. 1, includes a first Y-axis body (111), a first Y-axis driving motor (112) coupled to the first Y-axis body (111), and a first Y-axis moving body (113) disposed on the upper portion of the first Y-axis body (111) and connected to the first Y-axis driving motor (112) to reciprocate in the Y-axis direction.

[0105] In this embodiment, the first Y-axis body (111) can be coupled to the upper portion of the main body base plate (11), as shown in FIGS. 3 and 5.

[0106] In this embodiment, the first Y-axis driving motor (112) may be a stepping motor.

[0107] In the present embodiment, the first Y-axis moving body (113) is connected to the first Y-axis driving motor (112) by a ball screw and can reciprocate in the Y-axis direction. In the present embodiment, the second Y-axis driving unit (120), as illustrated in FIG. 1, is coupled to the first Y-axis moving body (113) and can reciprocate in the Y-axis direction like the first Y-axis moving body (113). In the present embodiment, the first Y-axis moving body (113) can move within a predetermined reciprocating range by having its movement distance limited by a sensor such as a limit switch provided on the first Y-axis body (111).

[0108] The second Y-axis driving unit (120) of the Y-axis driving unit (100) moves the sample holding device (4000) to which the sample member (20) is coupled back and forth faster than the first Y-axis driving unit (110) and narrows the reciprocating range, thereby eliminating the local area dishing phenomenon of the sample member (20) and enabling uniform polishing of the specimen member.

[0109] In this embodiment, the second Y-axis driving unit (120) includes, as illustrated in FIG. 1, a second Y-axis body (121) coupled to the first Y-axis moving body (113), a second Y-axis driving motor (122) coupled to the second Y-axis body (121), and a second Y-axis moving body (123) disposed on the upper portion of the second Y-axis body (121) and connected to the second Y-axis driving motor (122) to reciprocate in the Y-axis direction.

[0110] In the present embodiment, the second Y-axis body (121), as illustrated in FIG. 12, is coupled to the upper portion of the first Y-axis moving body (113) and can move in the Y-axis direction together with the first Y-axis moving body (113) when the first Y-axis driving motor (112) is operated. FIG. 11 (a) shows a state before the first Y-axis driving motor (112) is operated, and FIG. 11 (b) shows a state in which the second Y-axis driving unit (120), the R-axis driving unit (200), and the drain bath (40) are moved in the direction of the arrow illustrated in FIG. 11 (a) due to the operation of the first Y-axis driving motor (112). In the present embodiment, the second Y-axis driving unit (120) can reciprocate in the Y-axis direction based on FIG. 11. As a result, the R-axis driving unit (200) coupled to the second Y-axis driving unit (120) can also reciprocate in the Y-axis direction.

[0111] In this embodiment, the second Y-axis drive motor (122) may be a pneumatically operated stepping motor.

[0112] In the present embodiment, the second Y-axis moving body (123) is connected to the second Y-axis driving motor (122) by a ball screw and can reciprocate in the Y-axis direction. In the present embodiment, the R-axis driving unit (200), as illustrated in FIG. 1, is coupled to the second Y-axis moving body (123) and can reciprocate in the Y-axis direction together with the second Y-axis moving body (123). FIG. 12 (a) shows a state before the second Y-axis driving motor (122) is operated, and FIG. 12 (b) shows that the R-axis driving unit (200) and the drain bath (40) can move in the direction of the arrow illustrated in FIG. 12 (a) by the operation of the second Y-axis driving motor (122). At this time, the sample holding device (4000) coupled to the R-axis driving unit (200) can also move in the Y-axis direction together with the R-axis driving unit (200). In this embodiment, the R-axis driving unit (200) can reciprocate in the Y-axis direction based on Fig. 12. As a result, the sample holding device (4000) and drain bath (40) coupled to the R-axis driving unit (200) can also reciprocate in the Y-axis direction.

[0113] In this embodiment, the second Y-axis moving body (123) can move within a predetermined reciprocating range by limiting the movement distance by a sensor such as a limit switch provided on the second Y-axis body (121).

[0114] In this embodiment, the second Y-axis driving unit (120) can reciprocate the sample holding device (4000) in the Y-axis direction at a speed 2 to 10 times faster than the first Y-axis driving unit (110).

[0115] As shown in FIG. 6, the R-axis driving unit (200) is coupled to the second Y-axis moving body (123) of the second Y-axis driving unit (120) and can reciprocate in the Y-axis direction when the second Y-axis driving motor (122) is operated.

[0116] In addition, in this embodiment, a sample holding device (4000) and a drain bath (40) are coupled to the upper portion of the R-axis driving unit (200), and the sample holding device (4000) and the drain bath (40) can be reciprocated together with the R-axis driving unit (200).

[0117] Furthermore, in the present embodiment, the sample holding device (4000) to which the sample member (20) is detachably coupled is connected to the R-axis driving unit (200) and can rotate clockwise or counterclockwise. However, the drain bath (40) is fixedly coupled to the R-axis driving unit (200) and does not rotate.

[0118] And in the present embodiment, when the first Y-axis driving unit (110) is operated, as described above, the second Y-axis driving unit (120), the R-axis driving unit (200), the sample holding device (4000), and the drain bath (40) can reciprocate together in the Y-axis direction. In the present embodiment, when the second Y-axis driving unit (120) is operated, as described above, the R-axis driving unit (200), the sample holding device (4000), and the drain bath (40) can reciprocate together in the Y-axis direction.

[0119] In this embodiment, the R-axis drive unit (200) includes, as illustrated in FIG. 7, an R-axis body (210) having a lower portion coupled to a second Y-axis moving body (123) and an upper portion coupled to a drain bath (40), an R-axis drive motor (220) coupled to the R-axis body (210), and, as illustrated in FIG. 10, a power transmission unit (230) having a lower portion coupled to the R-axis body (210) and an upper portion coupled to a sample holding unit (4100) to transmit the rotational force of the R-axis drive motor (220) to the sample holding unit (4100) to rotate the sample holding unit (4100).

[0120] The R-axis body (210) of the R-axis drive unit (200) can be coupled to the second Y-axis moving body (123) through a plurality of R-axis fastening members (211), as illustrated in FIG. 7.

[0121] In the present embodiment, a bath connection plate (50) can be connected to the upper portion of the R-axis body (210) by an R-axis fastening member (211), as shown in FIG. 7. In the present embodiment, the bath connection plate (50) can support the bottom surface of the drain bath (40), and can be fitted to the bottom surface of the drain bath (40) by means of protrusions and grooves, or can be connected by means of screws or bolts.

[0122] The R-axis drive motor (220) of the R-axis drive unit (200) can be coupled to the R-axis body (210) as shown in FIG. 7 to provide power to rotate the sample holding device (4000) clockwise or counterclockwise.

[0123] In this embodiment, the R-axis driving motor (220) may be provided as a stepping motor.

[0124] The lower part of the power transmission part (230) of the R-axis drive part (200) is installed in the R-axis body (210), as shown in FIG. 10, and the upper part thereof is coupled with the sample holding part (4100) to transmit power transmitted from the R-axis drive motor (220) to the sample holding part (4100) so that the sample holding part (4100) can be rotated in the R-axis direction.

[0125] In the present embodiment, one side of the power transmission unit (230) is connected to the R-axis driving motor (220) and the other side is coupled to the sample holding unit (4100), so that the rotational force of the second Y-axis driving motor (122) transmitted in the Y-axis direction can be converted into the R-axis direction to rotate the sample holding unit (4100). In addition, in the present embodiment, a holder plate (4200) is coupled to the upper side of the power transmission unit (230), so that the holder plate (4200) can rotate together with the sample holding unit (4100). In the present embodiment, a plate wall (4300) is provided at the edge of the holder plate (4200), so that the plate wall (4300) can rotate together with the holder plate (4200). In the present embodiment, the sample holding device (4000) may include a sample holding unit (4100), a holder plate (4200), and a plate wall (4300).

[0126] In this embodiment, a known power transmission means such as a bevel gear can be applied as is to the power transmission unit (230).

[0127] Meanwhile, in this embodiment, the rotation speed of the sample holding unit (4100) rotated by the R-axis driving unit (200) may be slower than that of the polishing pad (2250) coupled to the polishing body (61) of the polishing device (60).

[0128] In this embodiment, the R-axis driving unit (200) can rotate the sample holding unit (4100) clockwise or counterclockwise.

[0129] The operation of this embodiment is described below.

[0130] First, in order to adjust the polishing position of the sample member (20) and polishing pad (2250) coupled to the sample holding unit (4100), the sample holding device (4000) can be moved in a specific direction by the Y-axis driving unit (100). At this time, the sample holding device (4000) can be moved to the polishing position by at least one of the first Y-axis driving unit (110) and the second Y-axis driving unit (120).

[0131] Once the polishing position of the sample member (20) is set, the sample member (20) is polished with a polishing pad (2250) as shown in Fig. 14. At this time, the polishing pad (2250) can be raised and lowered by the polishing Z-axis driving motor (2322) shown in Fig. 4.

[0132] In this embodiment, in order to prevent uneven wear, bending, and edge over-polishing of the sample member (20), the sample holding device (4000) to which the sample member (20) is coupled is reciprocated more slowly than the second Y-axis driving unit (120) by the first Y-axis driving unit (110) and the reciprocating range is wider than that of the second Y-axis driving unit (120), thereby uniformly polishing the sample member (20). In this case, the sample member (20) can be reciprocated in the Y-axis direction by the first Y-axis driving unit (110) and rotated by the R-axis driving unit (200). In addition, the polishing pad (2250) can also be rotated in the same direction as the rotational direction of the sample member (20) and can be rotated at a speed faster than the rotational speed of the sample member (20). For reference, when the first Y-axis driving unit (110) is in operation, the second Y-axis driving unit (120) may not be in operation.

[0133] In this embodiment, in order to prevent a local area dishing phenomenon in the sample member (20), the sample holding device (4000) to which the sample member (20) is coupled is reciprocated faster than the first Y-axis driving unit (110) by the second Y-axis driving unit (120) and the reciprocating range is narrowed, thereby uniformly polishing the sample member (20). In this case, the sample member (20) can be reciprocated in the Y-axis direction by the second Y-axis driving unit (120) and rotated by the R-axis driving unit (200). In addition, the polishing pad (2250) can also be rotated in the same direction as the rotational direction of the sample member (20) and can be rotated at a speed faster than the rotational speed of the sample member (20). For reference, when the second Y-axis driving unit (120) is in operation, the first Y-axis driving unit (110) may not be in operation.

[0134] FIG. 13 is a schematic drawing of a slurry collector according to one embodiment of the present invention, FIG. 14 is a bottom perspective view of FIG. 13, FIG. 15 is a front view of FIG. 13, FIG. 16 is an exploded perspective view of FIG. 13, FIG. 17 is a schematic drawing of the present embodiment arranged in a sample holding unit and a drain bath, and FIG. 18 is a diagram of a state of use of a slurry collector applied to the present embodiment.

[0135] The slurry collector (1000) according to the present embodiment is arranged in the polishing area of ​​the sample member (20) and guides the slurry moving to the edge of the polishing area during polishing of the sample member (20) to the area of ​​the sample member (20), thereby improving the problem of the slurry leaving the area of ​​the sample due to the high-speed rotation of the polishing pad and the rotational force of the holder plate (4200) during the decap operation of the sample, thereby optimizing the distribution and diffusion of the slurry.

[0136] In this embodiment, the slurry collector (1000) includes a collector base body (1100), as illustrated in FIG. 13, and a collector body (1200) coupled to the collector base body (1100) to guide the slurry to the area of ​​the sample member (20).

[0137] In this embodiment, the area of ​​the sample member (20) may be the area of ​​the sample holding unit (4100) illustrated in FIG. 17, where the sample member (20) to be polished is fixed. In this embodiment, the polishing area of ​​the sample member (20) may include the area of ​​the sample holding device (4000) illustrated in FIG. 17 and the area of ​​the drain bath (40).

[0138] The collector base body (1100) can be coupled to the drain bath (40) as shown in FIG. 17 and provided as a coupling location for the collector body (1200).

[0139] Additionally, in the present embodiment, the collector base body (1100) can support the collector body (1200) so that the collector body (1200) can move slightly in the height direction of the collector base body (1100), i.e., in the up-and-down direction (hereinafter referred to as “lifting”).

[0140] Now, looking at the collector base body (1100), in the present embodiment, the collector base body (1100) includes a first body (1110) arranged so that one side thereof is inserted into a groove of a drain bath (40) as illustrated in FIG. 17, a second body (1120) that extends from one side of the first body (1110) in the direction of a sample holding portion (4100) and is coupled so that the collector body (1200) is lifted, and a collector coupling member (1130) that detachably couples the first body (1110) to the drain bath (40).

[0141] As shown in FIG. 16, a collector coupling hole (1111) is coupled to the first body (1110) of the collector base body (1100), and the collector coupling member (1130) can be detachably coupled to the drain bath (40) through the collector coupling hole (1111).

[0142] The second body (1120) of the collector base body (1100) is provided to extend from one side of the first body (1110), as shown in FIG. 16, and may be provided to have a narrower width but a higher height than the first body (1110).

[0143] In this embodiment, most of the third body (1210) is inserted into the interior of the second body (1120), and the outer wall of the third body (1210) is supported by the inner wall of the second body (1120) and can be raised and lowered.

[0144] In this embodiment, a body coupling hole (1121) is provided in the second body (1120), as shown in FIG. 16, and a collector coupling piece (1211) provided in the third body (1210) can be hooked and coupled to the body coupling hole (1121).

[0145] In this embodiment, when the collector coupling piece (1211) is hooked and connected to the body coupling hole (1121), as shown in FIG. 13, the upper space of the body coupling hole (1121) is empty, so that the collector body (1200) can be raised and lowered in the height direction of the second body (1120). However, the raising and lowering of the collector body (1200) can be limited by the collector elastic member (1230) that is arranged on the collector body (1200) and supported by the second body (1120).

[0146] The collector coupling member (1130) of the collector base body (1100) is provided in a bolt shape, as shown in FIG. 16, so that the collector base body (1100) can be detachably coupled to the drain bath (40).

[0147] The collector body (1200), as shown in FIG. 13, is coupled to the second body (1120) of the collector base body (1100) and can guide sludge that is separated from the plate wall (4300) shown in FIG. 17 during polishing of the sample member (20) toward the direction of the sample member (20), i.e., toward the central region of the sample holding portion (4100).

[0148] In this embodiment, the collector body (1200) includes a third body (1210) coupled to the collector base body (1100), as illustrated in FIG. 15, and a fourth body (1220) provided on the third body (1210) to guide the slurry toward the sample member (20).

[0149] The third body (1210) of the collector body (1200) may have a shape corresponding to that of the second body (1120), and most of the third body (1210) may be inserted into the interior of the second body (1120), as illustrated in FIG. 15.

[0150] In the present embodiment, a pair of collector coupling pieces (1211) are spaced apart from each other on the side wall of the third body (1210), as illustrated in FIG. 16, and the pair of collector coupling pieces (1211) can be hooked to a pair of the aforementioned body coupling holes (1121). In the present embodiment, the lower part of the collector coupling piece (1211) is provided to be inclined outward so that it can be hooked to the body coupling hole (1121).

[0151] In the present embodiment, a collector cut hole (1212) is provided in the third body (1210) in the area where the collector coupling piece (1211) is provided, as shown in FIG. 16, so that the collector coupling piece (1211) has elasticity, allowing the third body (1210) to be inserted more easily into the interior of the second body (1120). In addition, the collector coupling piece (1211) is moved into the interior of the third body (1210) by the inner wall of the second body (1120) as the third body (1210) is inserted into the interior of the second body (1120), and in this state, when the collector body (1200) continues to rise and the collector coupling piece (1211) comes to a position corresponding to the body coupling hole (1121), the lower part of the collector coupling piece (1211) protrudes into the body coupling hole (1121) so that it can be automatically caught and coupled to the body coupling hole (1121).

[0152] In this embodiment, the third body (1210) is provided with a body space (1213), as shown in FIG. 16, so that the weight of the third body (1210) can be significantly reduced.

[0153] The fourth body (1220) of the collector body (1200) is provided at the lower portion of the third body (1210), as shown in FIG. 16, and is positioned at the upper portion of the holder plate (4200), as shown in FIG. 17, so as to guide the slurry moving to the plate wall (4300) to the central region of the sample holding section (4100).

[0154] In this embodiment, the fourth body (1220) can be provided integrally with the third body (1210).

[0155] In the present embodiment, the fourth body (1220) includes, as illustrated in FIG. 16, a first collector straight portion (1221) provided on a side wall of the fourth body (1220), a second collector straight portion (1222) provided on a side wall of the fourth body (1220) to be connected to one side of the first collector straight portion (1221), and a collector curved portion (1223) provided on a side wall of the fourth body (1220) to connect the first collector straight portion (1221) and the second collector straight portion (1222).

[0156] In this embodiment, the slurry moved to the plate wall (4300) can be guided to the central region of the sample holding section (4100) by the first collector straight section (1221) and the second collector straight section (1222) whether the holder plate (4200) is rotated clockwise or counterclockwise.

[0157] In the present embodiment, the collector bend (1223) is positioned close to the plate wall (4300) of the sample holding device (4000) and may have a bend corresponding to the plate wall (4300). As a result, the gap between the collector bend (1223) and the plate wall (4300) can be minimized, thereby preventing slurry from leaking out through this gap as much as possible.

[0158] In this embodiment, the fourth body (1220) may have a triangular shape with one side curved based on the bottom view, as illustrated in FIG. 14.

[0159] As illustrated in FIG. 16, the collector elastic member (1230) of the collector body (1200) can be positioned in a groove provided in the third body (1210) to support the collector body (1200) with elasticity in the height direction of the collector base body (1100). As a result, the slurry can be guided to the central region of the sample holding portion (4100) while minimizing friction between the fourth body (1220) and the holder plate (4200).

[0160] In this embodiment, the collector elastic member (1230) may be replaced with a known member having elasticity other than a spring.

[0161] Below, the operation of the slurry collector (1000) is described mainly with reference to FIG. 18.

[0162] As illustrated in FIG. 18, when the holder plate (4200) is rotated counterclockwise (indicated by A), the slurry on the upper surface of the holder plate (4200) moves toward the plate wall (4300) along the arrow B. As the holder plate (4200) is then rotated counterclockwise, the slurry moved closer to the plate wall (4300) can have its movement direction changed by the fourth body (1220) and move toward the central region of the sample holding portion (4100) along the arrow C. As a result, the slurry can be uniformly supplied without loss of slurry during the polishing operation of the sample member (20), thereby preventing overheating due to insufficient slurry and significantly reducing errors in the reproducibility and uniformity of the polishing thickness.

[0163] FIG. 19 is a schematic drawing of a polishing device for a decap system according to one embodiment of the present invention, FIG. 20 is a rear perspective view of FIG. 19, FIG. 21 is a schematic drawing of a main part of the present embodiment, FIG. 22 is a rear perspective view of FIG. 21, FIG. 23 is a perspective view of the polishing unit illustrated in FIG. 21, and FIG. 24 is a left side view of FIG. 23.

[0164] Also, FIG. 25 is a perspective view showing the spacer member and the polishing disk portion and the polishing pad shown in FIG. 23 separated from the motor connection flange, FIG. 26 is a perspective view showing the plurality of spacer members shown in FIG. 25 separated from the polishing disk portion, FIG. 27 is a perspective view showing the first polishing disk shown in FIG. 26 separated, and FIG. 28 is an exploded perspective view of FIG. 27.

[0165] Furthermore, FIG. 29 is a front view of FIG. 28, FIG. 30 is a drawing showing a horizontal adjuster applied to the present embodiment, FIG. 31 is a drawing showing the state of use of the horizontal adjuster shown in FIG. 30, and FIG. 32 is a perspective view showing the nozzle part shown in FIG. 19.

[0166] The polishing device (2000) for the decap system according to the present embodiment comprises: a polishing main body (2100) arranged close to a sample member (20) to be polished; a polishing unit (2200) arranged on the upper part of the sample member (20) to polish the sample member (20); a polishing drive unit (2300) which is coupled to the polishing main body (2100) at one end and coupled to the polishing unit (2200) at the other end to move the polishing unit (2200) in the X-axis direction, which is the left-right direction of the sample member (20), and the Z-axis direction, which is the up-down direction of the sample member (20); a nozzle unit (2400) which sprays slurry, cleaning solution, and air to the sample member (20) in independent lines; and a leveling unit (2240) which is arranged in the sample holding unit (4100) to which the sample member (20) is coupled and contacts the polishing disk unit (2240) provided in the polishing unit (2200) to measure the horizontality of the polishing disk unit (2240). Includes measuring instrument (2500).

[0167] The polishing body (2100) can be coupled to the body base plate (12) of the system body (10) as shown in FIG. 4 and provided as a mounting location for the polishing drive unit (2300) and nozzle unit (2400).

[0168] In this embodiment, the polishing body (2100) includes, as illustrated in FIG. 19, a body bottom portion (2110), a body front wall (2120) coupled to the front of the body bottom portion (2110), a pair of body side walls (2130) coupled to the left and right edges of the body bottom portion (2110), a body ceiling portion (2140) coupled to the upper portions of the body front wall (2120) and the pair of body side walls (2130), and a driving frame (2150) coupled to the body side walls (2130).

[0169] In this embodiment, the rear wall of the drive frame (2150) can be detachably connected to the polishing X-axis drive motor (2331) of the polishing drive unit (2300) using bolts, as shown in FIG. 20.

[0170] The polishing unit (2200), as illustrated in FIG. 21, is coupled to the polishing Z-axis drive unit (2320) of the polishing drive unit (2300) and can be raised and lowered in the Z-axis direction, and moved in the X-axis direction by the polishing X-axis drive unit (2330) to polish the sample member (20).

[0171] In the present embodiment, the polishing unit (2200) includes, as illustrated in FIG. 21, a motor support frame (2210) that is coupled to a Z-axis lifting block (2324) of a polishing Z-axis driving unit (2320) and is elevated together with the Z-axis lifting block (2324), a polishing drive motor (2220) coupled to the motor support frame (2210), a motor connection flange (2230) coupled to the polishing drive motor (2220), a polishing disk unit (2240) that is detachably coupled to the motor connection flange (2230) and is horizontally adjustable, a polishing pad (2250) coupled to the polishing disk unit (2240) to polish a sample member (20), and a spacer unit (2260) coupled between the motor connection flange (2230) and the polishing disk unit (2240) to adjust the horizontality of the polishing disk unit (2240).

[0172] The polishing drive motor (2220) of the polishing unit (2200) can rotate the motor connection flange (2230) clockwise or counterclockwise. In the present embodiment, the polishing pad (2250) is coupled to the polishing disk portion (2240), and the polishing disk portion (2240) is coupled to the motor connection flange (2230), so that the polishing pad (2250) can be rotated in the same direction and at the same speed as the motor connection flange (2230).

[0173] The motor connection flange (2230) of the polishing unit (2200) is coupled to the polishing drive motor (2220) and can be rotated in the same direction as the rotation axis of the polishing drive motor (2220).

[0174] In the present embodiment, the motor connection flange (2230) can be coupled to the first polishing disc (2241) of the polishing disc unit (2240) via a plurality of horizontal adjustment bolts (2231), as illustrated in FIG. 23. In the present embodiment, the horizontality of the polishing disc unit (2240) can be adjusted using the plurality of horizontal adjustment bolts (2231). In the present embodiment, four horizontal adjustment bolts (2231) can be provided, and the horizontality of the polishing disc unit (2240) can be adjusted within ±1 μm.

[0175] The upper part of the polishing disk portion (2240) of the polishing unit (2200) can be coupled to a motor connection flange (2230), as shown in FIG. 23, and a polishing pad (2250) can be coupled to the lower part.

[0176] In the present embodiment, the polishing disk portion (2240) includes, as illustrated in FIG. 23, a first polishing disk (2241) that is positioned on top of a polishing pad (2250) and coupled to a motor connection flange (2230), a second polishing disk (2242) that is positioned between the first polishing disk (2241) and the polishing pad (2250) and coupled to the first polishing disk (2241) and to which the polishing pad (2250) is coupled at the bottom, and a clamp portion (2243) that detachably couples the first polishing disk (2241) and the second polishing disk (2242).

[0177] In the present embodiment, a first disk flange (2241a) may be provided at the lower portion of the first polishing disc (2241), as illustrated in FIG. 29, and a second disk flange (2242a) corresponding to the first disk flange (2241a) may be provided at the upper portion of the second polishing disc (2242). In the present embodiment, a clamp portion (2243) may be coupled to the first disk flange (2241a) and the second disk flange (2242a), respectively, to detachably couple the first disk flange (2241a) and the second disk flange (2242a).

[0178] In this embodiment, the first disk flange (2241a) may be made thinner than the thickness of the first polishing disk (2241).

[0179] In the present embodiment, a pair of spacer fixing protrusions (221b) may be spaced apart from each other on the upper surface of the first polishing disc (2241), as illustrated in FIG. 26. In the present embodiment, a plurality of spacer members (2260) may be coupled to the pair of spacer fixing protrusions (221b), as illustrated in FIG. 25. In the present embodiment, the upper ends of the pair of spacer fixing protrusions (221b) may be inserted into and coupled to a groove provided on the lower surface of the motor connection flange (2230) illustrated in FIG. 25.

[0180] In this embodiment, a disk alignment protrusion (2242b) is coupled to the upper surface of the second polishing disc (2242), as shown in FIG. 27, and the upper end of the disk alignment protrusion (2242b) can be inserted into and coupled to a groove provided in the lower surface of the first disc flange (2241a).

[0181] In this embodiment, the second polishing disc (2242) may be made of a material that can be magnetically bonded to the polishing pad (2250), such as SUS 430, 603, etc., and is not oxidized in an alkaline slurry and is easily attached to a magnet.

[0182] In this embodiment, the second disk flange (2242a) may be made thinner than the thickness of the second polishing disk (2242).

[0183] In this embodiment, the clamp portion (2243) is coupled to the first disk flange (2241a) and the second disk flange (2242a), respectively, so that the first polishing disk (2241) and the second polishing disk (2242) can be detachably coupled. In this embodiment, the clamp part (2243) includes a first clamp body (2243a) that is fastened to one side of the first disk flange (2241a) and the second disk flange (2242a), a second clamp body (2243b) that is fastened to the other side of the first disk flange (2241a) and the second disk flange (2242a), a bar-shaped clamp fastening member (2243c) that is rotatably fastened to the first clamp body (2243a) and the other side is inserted into a groove provided in the second clamp body (2243b) to fasten the first clamp body (2243a) and the second clamp body (2243b), and a pair of clamps that rotatably fasten the first clamp body (2243a) and the second clamp body (2243b) and are fastened to the first polishing disc (2241) and the second polishing disc (2242), respectively. Includes fixed shaft (2243d).

[0184] The polishing pad (2250) of the polishing unit (2200) can be magnetically coupled to the lower surface of the second polishing disc (2242).

[0185] In this embodiment, the polishing pad (2250) can be magnetically attached to the second polishing disc (2242), thereby improving the replacement time and leveling of the polishing pad (2250). In addition, cleaning of the adhesive used in conventional bonding is unnecessary.

[0186] In this embodiment, the polishing pad (2250) may be attached with an adhesive as in the prior art.

[0187] In this embodiment, a mounting groove is provided in the second polishing disc (2242) for mounting the polishing pad (2250), thereby improving the attachment position deviation of the polishing pad (2250). This improves the polishing position error caused by the position error that occurs each time the polishing pad (2250) is replaced.

[0188] The spacer member (2260) of the polishing unit (2200) is coupled between the motor connection flange (2230) and the first polishing disc (2241) of the polishing disc section (2240), as shown in FIG. 24, to adjust the horizontality of the polishing disc section (2240).

[0189] In the present embodiment, the spacer member (2260) may be provided in multiples, as illustrated in FIG. 26. In the present embodiment, for example, three spacer members (2260) may be provided.

[0190] In this embodiment, the spacer member (2260) may be provided as a Teflon spacer and may have elasticity.

[0191] In this embodiment, the inclination of the polishing disk portion (2240) can be adjusted within a tolerance of ±1 μm using the spacer member (2260) and the horizontal adjustment bolt (2231) described above.

[0192] The polishing drive unit (2300) is coupled at one end to the drive frame (2150) of the polishing main body (2100) and at the other end to the polishing unit (2200), and can move the polishing unit (2200) in the X-axis direction, which is the left-right direction of the sample member (20), and in the Z-axis direction, which is the up-down direction of the sample member (20).

[0193] In the present embodiment, the polishing drive unit (2300) includes, as illustrated in FIG. 21, an X-axis moving body (2310) that is arranged inside a drive frame (2150) and moves in the X-axis direction, a polishing Z-axis driving unit (2320) that is coupled to the X-axis moving body (2310) on one side and moves in the X-axis direction together with the X-axis moving body (2310) and has a polishing unit (2200) coupled to the other side, and a polishing X-axis driving unit (2330) that is coupled to the drive frame (2150) and moves the X-axis moving body (2310) in the X-axis direction.

[0194] The X-axis moving body (2310) of the polishing drive unit (2300) can be moved in the X-axis direction by being connected to the X-axis driving motor of the polishing X-axis driving unit (2330), as illustrated in FIG. 22. As a result, the polishing Z-axis driving unit (2320) coupled to the X-axis moving body (2310) can also be moved in the X-axis direction like the X-axis moving body (2310).

[0195] The polishing Z-axis drive unit (2320) of the polishing drive unit (2300) includes, as shown in FIG. 21, an X-axis connecting frame (2321) coupled to the X-axis moving body (2310), a polishing Z-axis driving motor (2322) coupled to the upper part of the X-axis connecting frame (2321), a Z-axis driving screw shaft (2323) whose upper part is coupled to the polishing Z-axis driving motor (2322) and whose lower part is coupled to the lower part of the X-axis connecting frame (2321) and rotates clockwise or counterclockwise, a Z-axis lifting block (2324) coupled to the Z-axis driving screw shaft (2323) and raised and lowered when the Z-axis driving screw shaft (2323) rotates, and an upper part is coupled to the upper part of the X-axis connecting frame (2321) and whose lower part penetrates the Z-axis lifting block (2324) and is coupled to the lower part of the X-axis connecting frame (2321) and is lifted and lowered by the Z-axis lifting block The block (2324) includes at least one Z-axis support (2325) that guides the lifting.

[0196] In the present embodiment, when the polishing Z-axis drive motor (2322) is rotated in a certain direction, for example, clockwise, the Z-axis lifting block (2324) can be raised. When the Z-axis lifting block (2324) is raised, the polishing unit (2200) coupled to the Z-axis lifting block (2324) can also be raised. Conversely, when the polishing Z-axis drive motor (2322) is rotated in a certain direction, for example, counterclockwise, the Z-axis lifting block (2324) can be lowered. When the Z-axis lifting block (2324) is lowered, the polishing unit (2200) coupled to the Z-axis lifting block (2324) can also be lowered.

[0197] The polishing X-axis drive unit (2330) of the polishing drive unit (2300) comprises, as shown in FIG. 20, a polishing X-axis drive motor (2331) coupled to the rear wall of the drive frame (2150), an X-axis driven pulley (2331a) of the polishing X-axis drive motor (2331) that is connected to the X-axis drive pulley (2331a) of the polishing X-axis drive motor (2331) by a belt so as to rotate and an X-axis driven pulley (2332) coupled to the side wall of the drive frame (2150), an X-axis drive screw shaft (2333) that is connected to the X-axis driven pulley (2332) so as to rotate and penetrate the X-axis moving body (2310) and is disposed at the center of the drive frame (2150), and one side is coupled to one side wall of the drive frame (2150) and the other side is coupled to the other side wall of the drive frame (2150) so as to penetrate the X-axis moving body (2310) and the X-axis of the X-axis moving body (2310) It includes at least one X-axis support (2334) for guiding movement, and an X-axis support chain (2335) coupled to an X-axis connecting frame (2321) for supporting the X-axis direction movement of the polishing Z-axis drive unit (2320).

[0198] In the present embodiment, the X-axis driving screw shaft (2333) is screw-connected to the X-axis moving body (2310), so that when the X-axis driving body is rotated in a certain direction, for example, in the clockwise direction of the polishing unit (2200) of FIG. 21, the X-axis moving body (2310) can move in the left direction based on FIG. 21. As a result, the polishing Z-axis driving unit (2320) coupled to the X-axis moving body (2310) also moves in the left direction like the X-axis moving body (2310), so that the polishing unit (2200) coupled to the polishing Z-axis driving unit (2320) can also move in the left direction in the direction of the cleaning and storage device (3000) of the polishing pad for the decap system.

[0199] The nozzle unit (2400), as illustrated in FIG. 19, is coupled to the front wall (2120) of the polishing body (2100) and can spray slurry, cleaning liquid, and air into the sample member (20) in independent lines, respectively.

[0200] In the present embodiment, the nozzle unit (2400) includes a nozzle body (2410) coupled to the front wall (2120) of the main body, a slurry supply member (2420) provided in the nozzle body (2410) to spray slurry to a sample member (20), a cleaning solution supply member (2430) provided in the nozzle body (2410) to supply a cleaning solution to the sample member (20) to clean the sample member (20), an air supply member (2440) provided in the nozzle body (2410) to supply air to the sample member (20) to dry the sample member (20), and a slurry pump (2450) provided in the nozzle body (2410) to suction and remove slurry remaining in the slurry supply member (2420).

[0201] This embodiment can improve maintenance and work efficiency and prevent solidification problems by preventing blockage of slurry supply using a slurry pump (2450).

[0202] The horizontal measuring device (2500) is placed in a sample holding device (3000) to which a sample member (20) is coupled, and can contact the polishing disk unit (2240) provided in the polishing unit (2200) to measure the horizontality of the polishing disk unit (2240).

[0203] In the present embodiment, the horizontal measuring device (2500), as illustrated in FIG. 30, includes a measuring device body (2510), a first adjusting protrusion (2520) provided at the center of the measuring device body (2510) and in contact with the bottom surface of the second polishing disc (2242), a second adjusting protrusion (2530) provided at the edge of the measuring device body (2510) and in contact with the bottom surface of the second polishing disc (2242), and a third adjusting protrusion (2540) provided at the edge of the measuring device body (2510) and in contact with the bottom surface of the second polishing disc (2242).

[0204] In this embodiment, the first adjusting protrusion (2520), the second adjusting protrusion (2530), and the third adjusting protrusion (2540) can be arranged in parallel in the diagonal direction of the measuring device body (2510), as illustrated in FIG. 30.

[0205] In this embodiment, when the bottom surface of the second polishing disc (2242) is tested by contacting the first adjusting protrusion (2520) to the third adjusting protrusion (2540), an alarm may sound due to electrical conduction. At this time, the Z-axis coordinate is recorded, the second polishing disc (2242) is rotated 90 degrees to accurately measure the horizontality of the four sides of the second polishing disc (2242), and then the horizontality of the polishing disc portion (2240) can be adjusted within the allowable error using the horizontal adjustment bolt (2231).

[0206] In this embodiment, the polishing cover (PC) may be provided to cover the upper portion of the polishing Z-axis drive unit (2320) and the polishing unit (2200).

[0207] FIG. 33 is a schematic drawing showing a cleaning and storage device for a polishing pad for a decap system according to one embodiment of the invention mounted in a polishing area.

[0208] As shown in this drawing, the cleaning and storage device (3000) of the polishing pad according to the present embodiment includes a bath body (3100) placed in a polishing area where a sample member is polished, and a bath protrusion (3200) provided on the bottom of the bath body (3100).

[0209] In this embodiment, a liquid is filled inside a bath body (3100), and a polishing pad (2250) is stored inside the liquid-filled bath body (3100) to prevent solidification of slurry on the polishing pad (2250). In this embodiment, the liquid may be water.

[0210] In the present embodiment, the bath body (3100) may be provided with a supply hole (3110) and a drain hole (3120), as illustrated in FIG. 33. In the present embodiment, the supply hole (3110) may be provided as a passage for liquid supplied into the interior of the bath body (3100), and the drain hole (3120) may be used to discharge liquid stored in the bath body (3100) to the exterior of the bath body (3100).

[0211] In this embodiment, the slurry remaining on the polishing pad (2250) can be removed by pressing the polishing pad (2250) onto the bath protrusion (3200).

[0212] In the present embodiment, the bath protrusion (3200) may have a cross shape. In the present embodiment, the bath protrusion (3200) having a cross shape may be provided to the edge of the bottom surface of the bath body (3100), as illustrated in FIG. 33, and may be provided with a size larger than the diameter of the polishing pad (2250).

[0213] Meanwhile, in the present embodiment, the cleaning and storage method of the polishing pad (2250) can prevent the solidification of the slurry remaining in the polishing pad (2250) by placing the polishing pad (2250) inside a bath body (3100) filled with liquid and placed in a polishing area where a sample material is polished. In the present embodiment, when the polishing pad (2250) is not in use, the bottom surface of the polishing pad (2250) is pressed against the bath protrusion (3200) to remove the remaining slurry, and then the polishing pad (2250) is stored in water stored inside the bath body (3100), thereby preventing the problem of the slurry solidifying in the polishing pad (2250) or the polishing disk portion (2240).

[0214] In the present embodiment, the bath body (3100) may also store an abrasive disk portion (2240) to which a polishing pad (2250) is coupled. In the present embodiment, the abrasive disk portion (2240) includes, as described below, a first abrasive disk (2241), a second abrasive disk (2242), and a clamp portion (2243) that detachably couples the first abrasive disk (2241) and the second abrasive disk (2242) to each other. In the present embodiment, the bath body (3100) may contain the first abrasive disk (2241), the second abrasive disk (2242), and the clamp portion (2243) and may be immersed in a liquid, or the second abrasive disk (2242) or the clamp portion (2243) may be selectively immersed.

[0215] In this embodiment, the bottom surface of the polishing pad (2250) can be pressed against the bath protrusion (3200) provided on the bottom of the bath body (3100) to remove slurry remaining on the polishing pad (2250).

[0216] In this embodiment, a polishing pad (2250) from which slurry has been removed by a bath protrusion (3200) can be stored immersed in a liquid inside a bath body (3100).

[0217] In this embodiment, when the polishing pad (2250) is stored in the bath body (3100), the polishing disk portion (2240) to which the polishing pad (2250) is coupled can also be stored so as to be immersed in liquid.

[0218] In this embodiment, the polishing pad (2250) can be moved from the polishing area of ​​the sample member to the bath body (3100) by the polishing X-axis driving unit (2330) described later.

[0219] In the present embodiment, the polishing pad (2250) moved to the bath body (3100) can be lowered by the polishing Z-axis driving unit (2320) and immersed in the liquid stored in the bath body (3100). In addition, in the present embodiment, the polishing pad (2250) can be lowered by the polishing Z-axis driving unit (2320) and pressed against the bath protrusion (3200) to remove the slurry on the polishing pad (2250). In the present embodiment, the polishing pad (2250) immersed in the bath body (3100) can be rotated clockwise or counterclockwise by the R-axis driving unit (200).

[0220] FIG. 34 is a schematic drawing of a sample holding device for a decap system applied to one embodiment of the present invention, FIG. 36 is a cross-sectional view taken along line A-A' of FIG. 34, FIG. 37 is a schematic drawing of the sample holding portion illustrated in FIG. 34 separated from the holder plate, FIG. 38 is a perspective view of the sample holding portion illustrated in FIG. 37, FIG. 39 is a bottom perspective view of FIG. 38, and FIG. 40 is a cross-sectional view schematically illustrating an area of ​​the sample suction portion illustrated in FIG. 38.

[0221] FIG. 41 is an enlarged view of an area of ​​a sample adsorption unit illustrated in FIG. 40, FIG. 42 is a perspective view illustrating a sample adsorption unit and one sample support unit illustrated in FIG. 38 separated from a holder plate, FIG. 43 is a cross-sectional view of the sample adsorption unit illustrated in FIG. 42, FIG. 44 is a perspective view schematically illustrating a first sealing member and a second sealing member illustrated in FIG. 43 separated from a holder adsorption body, and FIG. 45 is a perspective view illustrating a plate sealing member, a plate fastening member, and a plate cover illustrated in FIG. 37 separated from a holder plate.

[0222] As shown in these drawings, a sample holding device (4000) for a decap system according to the present embodiment includes a sample holding portion (4100) to which a sample member (20) is detachably coupled, a holder plate (4200) to which the sample holding portion (4100) is detachably coupled and which rotates together with the sample holding portion (4100), and a plate wall (4300) provided at an edge of the holder plate (4200).

[0223] The sample holding portion (4100) is detachably coupled to the holder plate (4200) and can hold the sample member (20) by vacuum.

[0224] In this embodiment, the sample holding unit (4100) includes, as illustrated in FIG. 34, a holding base body (4110), a sample adsorption unit (4120) coupled to the holding base body (4110) and adsorbing the sample member (20) from the lower portion of the sample member (20), and a sample support unit (4130) coupled to the holding base body (4110) and supporting the side wall of the sample member (20).

[0225] The holding base body (4110) of the sample holding unit (4100) can be detachably coupled to the holder mounting groove (4210) provided in the holder plate (4200) illustrated in FIG. 37.

[0226] In the present embodiment, a pair of guide pin coupling holes (4111) may be provided spaced apart from each other on the bottom surface of the holding base body (4110), as illustrated in FIG. 39. In the present embodiment, the pair of guide pin coupling holes (4111) may be detachably fitted and coupled to the first support pin (4230) of the holder plate (4200) illustrated in FIG. 37.

[0227] In addition, in the central portion of the holding base body (4110) in this embodiment, as illustrated in FIG. 42, an adsorption unit coupling hole (4112) is provided, and a sample adsorption unit (4120) can be detachably coupled to this adsorption unit coupling hole (4112).

[0228] Furthermore, in the present embodiment, a support coupling groove (4113) may be provided in the holding base body (4110) in the area adjacent to the adsorption coupling hole (4112), as illustrated in FIG. 42. In the present embodiment, the number of support coupling grooves (4113) may correspond to the number of sample support grooves (4130). For example, in the present embodiment, four support coupling grooves (4113) may be provided. In the present embodiment, the support coupling grooves (4113) may be arranged at intervals of a constant angle of 390 degrees.

[0229] And in the present embodiment, an upper surface groove (4114) may be provided on the upper surface of the holding base body (4110), as illustrated in FIG. 37. In the present embodiment, the upper surface groove (4114) may be provided in a circular shape corresponding to the shape of the holding base body (4110). In the present embodiment, a pair of upper surface grooves (4114) may be provided spaced apart from each other, and slurry or debris generated during polishing of the sample member (20) may be temporarily accommodated in the upper surface grooves (4114).

[0230] In addition, in the present embodiment, a side groove (4115) may be provided on the side wall of the holding base body (4110), as illustrated in FIG. 37. In the present embodiment, the side groove (4115) is provided at a position corresponding to a grip groove (4240) provided on the holder plate (4200), so that a user can easily separate the sample holding unit (4100) from the holder plate (4200) through the grip groove (4240) and the side groove (4115).

[0231] The sample adsorption unit (4120) of the sample holding unit (4100) is coupled to the holding base body (4110) and can fix the sample member (20) in position during the polishing operation by vacuum-adsorbing the sample member (20) from the lower portion of the sample member (20).

[0232] In this embodiment, by applying a vacuum adsorption method, the sample member (20) can be automatically detached without using a separate wrench, thereby improving work efficiency. In addition, the vacuum fixation method of the sample member (20) can improve the horizontal error that occurs when applying the mechanical fixation method (existing grip fixation method) of the sample member (20), and automation by a robot is possible. Furthermore, after the sample member (20) is adsorbed, the sample adsorption part (4120) is moved below the upper surface of the holder plate (4200) by vacuum, thereby improving the horizontal defect problem that occurs due to the protrusion of the upper surface of the second sealing member (4123) when the sample member (20) is adsorbed.

[0233] In this embodiment, the sample adsorption unit (4120) includes, as illustrated in FIG. 41, a holder adsorption body (4121) that is coupled to the adsorption unit coupling hole (4112) to hold the sample member (20) in a vacuum, a first sealing member (4122) that is coupled to the outer wall of the holder adsorption body (4121) to prevent air leakage between the holder adsorption body (4121) and the holding base body (4110), and a second sealing member (4123) that is coupled to the upper surface of the holder adsorption body (4121) to prevent air leakage between the sample member (20) and the holder adsorption body (4121).

[0234] In this embodiment, the holder adsorption body (4121) may have a cylindrical shape, as illustrated in FIG. 44.

[0235] In the present embodiment, an adsorption unit air passage (4121a) may be provided in the central portion of the holder adsorption body (4121), as illustrated in FIG. 44. In the present embodiment, the adsorption unit air passage (4121a) may be connected to a rotary joint (RJ) coupled to the bottom portion of the holder plate (4200), as illustrated in FIG. 36, and may be in communication with the rotary joint (RJ). In the present embodiment, when a sample member (20) is adsorbed by the sample adsorption unit (4120), air in the adsorption unit air passage (4121a) may be supplied to a vacuum generator through the rotary joint (RJ), and at this time, the sample adsorption unit (4120) may be moved below the upper surface of the holder plate (4200). The state in which the movement of the sample adsorption unit (4120) is completed is illustrated in FIG. 41.

[0236] In addition, in the present embodiment, a first sealing groove (4121b) may be provided on the side wall of the holder suction body (4121), as illustrated in FIG. 44. In the present embodiment, a first sealing member (4122) may be detachably fitted into the first sealing groove (4121b). In the present embodiment, the first sealing grooves (4121b) may be provided in pairs spaced apart from each other in the height direction of the holder suction body (4121), and may be provided in a circular shape.

[0237] Furthermore, in the present embodiment, a second sealing groove (4121c) may be provided on the upper surface of the holder suction body (4121), as illustrated in FIG. 44. In the present embodiment, a second sealing member (4123) may be detachably fitted into the second sealing groove (4121c). In the present embodiment, the second sealing groove (4121c) may be provided in a circular shape. In the present embodiment, a cut groove is provided on one side of the second sealing groove (4121c), as illustrated in FIG. 44, so that the second sealing member (4123) can be easily separated from the holder suction body (4121).

[0238] In the present embodiment, the first sealing member (4122) can be detachably fitted into a pair of first sealing grooves (4121b) as illustrated in FIG. 44 to prevent air from leaking between the holder suction body (4121) and the holding base body (4110). In the present embodiment, the first sealing member (4122) can be formed as an O-ring.

[0239] In the present embodiment, the second sealing member (4123) can be coupled to the second sealing groove (4121c) as illustrated in FIG. 44 to prevent air from leaking between the sample member (20) and the holder suction body (4121). In the present embodiment, the second sealing member (4123) can be provided as an O-ring.

[0240] The sample support member (4130) of the sample holding member (4100) can be coupled to the holding base body (4110) to support the side wall of the sample member (20).

[0241] In this embodiment, the sample support member (4130) includes a sample support body (4131) that is coupled to a support coupling groove (4113) provided in a holding base body (4110) to support a side wall of a sample member (20), as illustrated in FIG. 42, and a sample fixing member (4132) that detachably couples the sample support body (4131) to the holding base body (4110).

[0242] In this embodiment, the sample support member (4130) may be arranged to surround the periphery of the adsorption member coupling hole (4112), as illustrated in FIG. 42.

[0243] In the present embodiment, the number of sample support members (4130) may correspond to the shape of the sample member (20). For example, when the sample member (20) has a rectangular planar shape as in the present embodiment, four may be provided, as illustrated in FIG. 42, to support the four sides of the sample member (20). In addition, the sample support members (4130) may be arranged at equal intervals.

[0244] In this embodiment, the sample support member (4130) may be provided in multiple numbers regardless of the shape of the sample member (20).

[0245] The holder plate (4200) can be provided as a detachable and attachable location for the sample holding portion (4100), as shown in FIG. 37.

[0246] In this embodiment, the holder plate (4200) is made of Teflon resin, which can improve the overload of the stage (1) for the decap system by reducing weight and improving friction.

[0247] In this embodiment, the holder plate (4200) is coupled to the upper part of the power transmission unit (230) (see FIG. 20) and can be rotated together with the sample holding unit (4100).

[0248] In this embodiment, a holder mounting groove (4210) is provided on the upper surface of the holder plate (4200), as shown in FIG. 37, and a sample holding portion (4100) can be detachably coupled to the holder mounting groove (4210).

[0249] In this embodiment, a plate sealing member (4220) is coupled to the holder mounting groove (4210), as shown in FIG. 37, to prevent air from leaking between the lower surface of the holder base body and the upper surface of the holder mounting groove (4210).

[0250] In the present embodiment, a pair of first support pins (4230) are provided spaced apart from each other in the holder mounting groove (4210), as shown in FIG. 37, and the pair of first support pins (4230) can be inserted into and coupled to a guide pin coupling hole (4111) provided in the lower surface of the holding base body (4110) as described above.

[0251] In this embodiment, the holder plate (4200) can be detachably screw-connected to the power transmission unit (230) by a plate fastening member (4250).

[0252] In the present embodiment, a pair of plate guide pins (4260) are spaced apart from each other on the bottom surface of the holder plate (4200), as illustrated in FIG. 35, so that the coupling position of the holder plate (4200) can be easily found. In the present embodiment, a pair of plate guide pins (4260) can be inserted and coupled into a groove provided on the upper surface of the power transmission unit (230).

[0253] In this embodiment, a holder spacer (4270) may be provided on the bottom surface of the holder plate (4200), as shown in FIG. 35.

[0254] In this embodiment, a plate cover (4280) is coupled to the upper surface of the holder plate (4200) to prevent exposure of the plate fastening member (4250).

[0255] The plate wall (4300) can be provided perpendicular to the edge of the holder plate (4200), as shown in FIG. 34.

[0256] In the present embodiment, the plate wall (4300) may be provided integrally with the holder plate (4200). In this case, the plate wall (4300) may be provided with the same material as the holder plate (4200), for example, Teflon resin.

[0257] In this embodiment, a plurality of holes are provided in the plate wall (4300), so that slurry or the like in the holder plate (4200) can be discharged to the drain bath (40) through the plurality of holes.

[0258] FIG. 46 is a schematic drawing of a sample holding device for a decap system according to one embodiment of the present invention, FIG. 47 is a rear perspective view of the holder base body illustrated in FIG. 46, FIG. 48 is a central cross-sectional view of the holder base body illustrated in FIG. 46, FIG. 49 is an exploded cross-sectional view of FIG. 48, FIG. 50 is a perspective view of the holder base body illustrated in FIG. 46, and FIG. 51 is a perspective view of the sample holder unit illustrated in FIG. 49.

[0259] Also, FIG. 52 is an exploded perspective view of the first sample holder part and the second sample holder part illustrated in FIG. 51, FIG. 53 is a bottom perspective view of FIG. 52, FIG. 54 is an operation diagram of the present embodiment, FIG. 55 is a bottom perspective view of the holder plate illustrated in FIG. 46, and FIG. 56 is a use state diagram of the present embodiment.

[0260] As shown in these drawings, the sample holding device (5000) for the decap system according to the present embodiment comprises: a holder base body (5100) on which a sample member (20) to be polished is placed; a sample holder unit (5200) that is provided to be movable on the holder base body (5100) and holds the sample member (20) to be polished; a finishing part (5600) that is coupled to both ends of the holder base body (5100); a holder plate (5700) that is removably coupled to the holder base body (5100) and rotates together with the holder base body (5100); a plate wall (5800) that is provided on the edge of the holder plate (5700); an air speed controller (5900) that is provided on an air supply line (AL) of air supplied into the interior of the holder base body (5100) and controls the speed of air passing through the air supply line (AL); and an air speed controller (5900) that is provided on the air supply line (AL) and electronically controls air to be supplied to the air speed controller (5900). It includes an on-off solenoid valve (6000) and a regulator (6100) provided in an air supply line (AL) to maintain the pressure of air supplied to the solenoid valve (6000) at a constant value.

[0261] The holder base body (5100) is installed inside the drain bath (40), as shown in FIG. 56, and a sample member (20) can be mounted on the upper surface of the holder base body (5100).

[0262] In this embodiment, the holder base body (5100) may have a circular plate shape with a certain thickness, as illustrated in FIG. 47.

[0263] In the present embodiment, a pair of air holes (5110) may be spaced apart from each other on the bottom surface of the holder base body (5100), as illustrated in FIG. 47. In the present embodiment, the pair of air holes (5110) may be connected to the air supply line (AL) illustrated in FIG. 54 to receive air. In addition, in the present embodiment, air within the holder base body (5100) may be discharged to the air supply line (AL) through the pair of air holes (5110).

[0264] In addition, in the present embodiment, a first air space (5120) and a second air space (5130) may be provided inside the holder base body (5100), as illustrated in FIG. 48. In the present embodiment, the first air space (5120) may be communicated with one of a pair of air holes (5110), and the second air space (5130) may be communicated with the remaining one of the air holes (5110).

[0265] Furthermore, in the present embodiment, a first movement guide hole (5140) and a second movement guide hole (5150) may be provided spaced apart from each other on the upper portion of the holder base body (5100), as illustrated in FIG. 50. In the present embodiment, the first movement guide hole (5140) may guide the movement of the first sample holder part (5400), and the second movement guide hole (5150) may guide the movement of the second sample holder part (5500). In the present embodiment, slurry or the like introduced into the interior of the first movement guide hole and the second movement guide hole (5150) may be discharged to the outside of the holder base body (5100) through the first movement guide hole (5140) and the second movement guide hole (5150) by the reciprocating movement of the first movement body (5410) and the second movement body (5510). As a result, the present embodiment can prevent the slurry from sticking.

[0266] And in the present embodiment, a central wall (5160) may be provided in the inner central portion of the holder base body (5100), as illustrated in FIG. 48. In the present embodiment, an elastic member (5300) may be arranged in the central wall (5160), and the elastic member (5300) may be contracted and expanded in place without being moved by the central wall (5160).

[0267] Additionally, in the present embodiment, a body side wall groove (5170) may be provided on the side wall of the holder base body (5100), as illustrated in FIG. 46. In the present embodiment, a user can conveniently separate the holder base body (5100) from the installation location through the body side wall groove (5170).

[0268] Furthermore, in the present embodiment, a body upper surface groove (5180) may be provided on the upper surface of the holder base body (5100), as illustrated in FIG. 46. In the present embodiment, residues generated during the polishing operation, such as dross generated from the sample member (20), may be temporarily stored in the body upper surface groove (5180).

[0269] And in the present embodiment, the holder base body (5100) may be provided with a body fastening member (5190) that is detachably coupled to a groove provided in the holder plate.

[0270] In the present embodiment, a first air guide groove (5191) and a second air guide groove (5192) may be provided on the bottom surface of the holder base body (5100), as illustrated in FIG. 47. In the present embodiment, the first air guide groove (5191) may be provided in a circular shape in the central region of the bottom surface of the holder base body (5100), and the second air guide groove (5192) may have one side connected to the first air guide groove (5191) and the other side connected to a pair of air holes (5110), so that air flowing into the first air guide groove (5191) may be guided to the pair of air holes (5110).

[0271] In the present embodiment, a pair of body coupling grooves (5193) may be provided spaced apart from each other on the bottom surface of the holder base body (5100), as illustrated in FIG. 47. In the present embodiment, a first support pin (5730) illustrated in FIG. 46 may be inserted into and coupled to the pair of body coupling grooves (5193).

[0272] The sample holder unit (5200) is provided in the holder base body (5100) and is operated by air supplied through an air hole (5110) to hold a sample member (20).

[0273] In the present embodiment, the sample holder unit (5200) includes, as illustrated in FIG. 48, an elastic member (5300) disposed inside a holder base body (5100), a first sample holder part (5400) supported on one side of the elastic member (5300) and moved toward the sample member (20) by air introduced through an air hole (5110) to hold one side of the sample member (20), and a second sample holder part (5500) supported on the other side of the elastic member (5300) and moved toward the sample member (20) by air introduced through an air hole (5110) to hold the other side of the sample member (20).

[0274] The elastic members (5300) of the sample holder unit (5200) can be spaced apart in pairs with the central wall (5160) of the holder base body (5100) interposed therebetween, as shown in FIG. 48.

[0275] In this embodiment, the elastic member (5300) may be provided as a coil spring.

[0276] In this embodiment, the first movable body (5410) of the first sample holder part (5400) can be supported by one of the pair of elastic members (5300), and the second movable body (5510) of the second sample holder part (5500) can be supported by the other elastic member (5300).

[0277] In the present embodiment, the elastic member (5300) may be fixed in position on the central wall (5160) of the holder base body (5100) and may only contract and expand. Since the elastic member (5300) contracts and expands while being fixed in position, the present embodiment has the advantage of being able to stably support the first movable body (5410) and the second movable body (5510), and uniformly providing contraction and expansion forces to the first movable body (5410) and the second movable body (5510).

[0278] The first sample holder portion (5400) of the sample holder unit (5200) is supported on one side of an elastic member (5300), as illustrated in FIG. 48, and can be moved toward the sample member (20) by air supplied through the air hole (5110) and the first air space portion (5120) to hold one side of the sample member (20).

[0279] In the present embodiment, the first sample holder part (5400) includes, as illustrated in FIG. 48, a first movable body (5410) that is arranged to move in the direction of an elastic member (5300) inside the holder base body (5100) and has one side supported by the elastic member (5300), a first sample holder part (5420) that is coupled to the first movable body (5410) so as to move together with the first movable body (5410) and has the other side exposed to the outside of the holder base body (5100) to hold one side of the sample member (20), and a first holder fastening member (5430) that detachably couples the first sample holder part (5420) to the first movable body (5410).

[0280] In the present embodiment, a first coupling groove (5411) may be provided at the front of the first movable body (5410), as illustrated in FIG. 52. In the present embodiment, a first holder piece body (5422) of a first sample holder piece (5420) may be seated in the first coupling groove (5411). In addition, in the present embodiment, a lower portion of a first holder fastening member (5430) may be detachably coupled to the first coupling groove (5411). In the present embodiment, a plurality of first body sealing members (5412) may be coupled to the outer wall of the first movable body (5410), as illustrated in FIG. 52, to prevent air introduced into the first air space (5120) through the air hole (5110) from leaking in the direction of the elastic member (5300).

[0281] In this embodiment, the first coupling groove (5411) has sufficient depth so that the first holder body (5422) can be stably positioned and fixed after being inserted.

[0282] In the present embodiment, the first sample holder part (5420) includes, as illustrated in FIG. 48, a first sample holder part (5421) that is exposed to the outside of the holder base body (5100) and holds one side of the sample member (20), a first holder part body (5422) that is provided at the lower portion of the first sample holder part (5421) and detachably coupled to the first moving body (5410), and a pair of first guide flanges (5423) that are provided on both sides of the first holder part body (5421) and supported on the outer wall of the first moving body (5410).

[0283] In the present embodiment, the first sample holder part (5420) may further include a first cut support hole (5421a) that is provided by cutting one side of the first sample holder part (5421), as illustrated in FIG. 52, and into which one side of the sample member (20) is inserted and supported. In the present embodiment, the first cut support hole (5421a) may have a V shape. In the present embodiment, the first cut support hole (5421a) may be provided in the first sample holder part (5421) facing the second sample holder part (5520).

[0284] In the present embodiment, the first sample holder part (5420) may further include a first damage prevention hole (5421b) provided in the first sample holder part (5421), which is an end region of the first cut support hole (5421a), to prevent damage to the sample member (20) inserted into the first cut support hole (5421a), as illustrated in FIG. 52. In the present embodiment, the first damage prevention hole (5421b) may have a circular shape.

[0285] In the present embodiment, a pair of first guide flanges (5423) are provided on both sides of the first holder body (5421), and can be supported on the outer wall of the first moving body (5410), as illustrated in FIG. 48. As a result, in the present embodiment, the first sample holder body (5420) has the advantage of being able to hold the sample member (20) more stably without shaking.

[0286] In the present embodiment, the first holder fastening member (5430) may be coupled to the first coupling groove (5411) of the first movable body (5410) by having one end penetrate the first sample holder part (5420) so as to detachably couple the first sample holder part (5420) to the first movable body (5410). In the present embodiment, the first holder fastening member (5430) may be detachably screw-coupled to the first coupling groove (5411).

[0287] The second sample holder section (5500) of the sample holder unit (5200) is supported on the other side of the elastic member (5300), as shown in FIG. 48, and can be moved toward the sample member (20) by air supplied through the air hole (5110) and the second air space section (5130) to hold one side of the sample member (20).

[0288] In the present embodiment, the second sample holder part (5500) includes, as illustrated in FIG. 48, a second movable body (5510) that is arranged to move in the direction of an elastic member (5300) inside the holder base body (5100) and has one side supported by the elastic member (5300), a second sample holder part (5520) that is coupled to the second movable body (5510) so as to move together with the second movable body (5510) and has the other side exposed to the outside of the holder base body (5100) to hold one side of the sample member (20), and a second holder fastening member (5530) that detachably couples the second sample holder part (5520) to the second movable body (5510).

[0289] In the present embodiment, a second coupling groove (5511) may be provided at the front of the second movable body (5510), as illustrated in FIG. 52. In the present embodiment, a second holder piece body (5522) of a second sample holder piece (5520) may be seated in the second coupling groove (5511). In addition, in the present embodiment, a lower portion of a second holder fastening member (5530) may be detachably coupled to the second coupling groove (5511). In the present embodiment, a plurality of second body sealing members (5512) may be coupled to the outer wall of the second movable body (5510), as illustrated in FIG. 52, to prevent air introduced into the second air space (5130) through the air hole (5110) from leaking in the direction of the elastic member (5300).

[0290] In the present embodiment, the second sample holder part (5520) includes, as illustrated in FIG. 48, a second sample holder part (5521) that is exposed to the outside of the holder base body (5100) and holds one side of the sample member (20), a second holder part body (5522) that is provided at the lower portion of the second sample holder part (5521) and detachably coupled to the second moving body (5510), and a pair of second guide flanges (5523) that are provided on both sides of the second holder part body (5521) and supported on the outer wall of the second moving body (5510).

[0291] In the present embodiment, the second sample holder piece (5520) may further include a second cut support hole (5521a) that is provided by cutting one side of the second sample holder piece (5521), as illustrated in FIG. 52, and into which one side of the sample member (20) is inserted and supported. In the present embodiment, the second cut support hole (5521a) may have a V shape. In the present embodiment, the second cut support hole (5521a) may be provided in the second sample holder piece (5521) facing the first sample holder piece (5420).

[0292] In the present embodiment, the second sample holder part (5520) may further include a second breakage prevention hole (5521b) provided in the second sample holder part (5521), which is an end region of the second cut support hole (5521a), to prevent breakage of the sample member (20) inserted into the second cut support hole (5521a), as illustrated in FIG. 52. In the present embodiment, the second breakage prevention hole (5521b) may have a circular shape.

[0293] In the present embodiment, a pair of second guide flanges (5523) are provided on both sides of the second holder body (5521), and can be supported on the outer wall of the second moving body (5510), as illustrated in FIG. 48. As a result, in the present embodiment, the second sample holder body (5520) has the advantage of being able to hold the sample member (20) more stably without shaking.

[0294] In the present embodiment, the second holder fastening member (5530) may be coupled to the second coupling groove (5511) of the second movable body (5510) by having one end penetrate the second sample holder part (5520) so as to detachably couple the second sample holder part (5520) to the second movable body (5510). In the present embodiment, the second holder fastening member (5530) may be detachably screw-coupled to the second coupling groove (5511).

[0295] The operation of the sample holder unit (5200) is described below.

[0296] In the present embodiment, when air is supplied to the first air space (5120) and the second air space (5130) through a pair of air holes (5110), the first sample holder (5400) and the second sample holder (5500) can move closer to each other to hold the sample member (20). At this time, one edge of the sample member (20) can be inserted into the first cut support hole (5421a) and held, and the other edge can be inserted into the second cut support hole (5521a) and held. In this state, when the supply of air through the air holes (5110) is released, the contracted elastic member (5300) is compressed, and the first sample holder (5400) and the second sample holder (5500) move away from each other, thereby releasing the holding of the sample member (20). In this case, the air in the first air space (5120) and the second air space (5130) can be discharged to the air supply line (AL) through the air hole (5110).

[0297] The closing part (5600) can be connected to each end of the holder base body (5100) as shown in FIG. 48 to block the end of the holder base body (5100).

[0298] In this embodiment, the closing part (5600) includes a closing body (5610) that is connected to each end of the holder base body (5100), and a closing sealing member (5620) that is provided on the outer wall of the closing body (5610) to prevent air that has entered the first air space (5120) and the second air space (5130) from leaking out of the holder base body (5100) through the closing body (5610).

[0299] The holder plate (5700) can be provided as a detachable and attachable location for the holder base body (5100), as shown in FIG. 46.

[0300] In this embodiment, the holder plate (5700) is made of Teflon resin, which can improve the overload of the stage (1) for the decap system by reducing weight and improving friction.

[0301] In this embodiment, the holder plate (5700) is coupled to the upper part of the power transmission unit (230) (see FIG. 20) and can be rotated together with the holder base body (5100).

[0302] In this embodiment, a holder mounting groove (5710) is provided on the upper surface of the holder plate (5700), as shown in FIG. 46, and a holder base body (5100) can be detachably coupled to the holder mounting groove (5710).

[0303] In this embodiment, a plate sealing member (5720) is coupled to the holder mounting groove (5710), as shown in FIG. 46, to prevent air from leaking between the lower surface of the holder base body and the upper surface of the holder mounting groove (5710).

[0304] In the present embodiment, a pair of first support pins (5730) are provided spaced apart from each other in the holder mounting groove (5710), as shown in FIG. 46, and the pair of first support pins (5730) can be inserted into and coupled to a body coupling groove (5193) provided on the bottom surface of the holder base body (5100) as described above.

[0305] In this embodiment, the holder plate (5700) can be detachably screw-connected to the power transmission unit (230) by a plate fastening member such as a bolt or pin.

[0306] In the present embodiment, a pair of plate guide pins (5760) are spaced apart from each other on the bottom surface of the holder plate (5700), as illustrated in FIG. 47, so that the coupling position of the holder plate (5700) can be easily found. In the present embodiment, a pair of plate guide pins (5760) can be inserted and coupled into a groove provided on the top surface of the power transmission unit (230).

[0307] The plate wall (5800) can be provided perpendicular to the edge of the holder plate (5700), as illustrated in FIG. 46.

[0308] In the present embodiment, the plate wall (5800) may be provided integrally with the holder plate (5700). In this case, the plate wall (5800) may be provided with the same material as the holder plate (5700), for example, Teflon resin.

[0309] In this embodiment, a plurality of holes are provided in the plate wall (5800), so that slurry or the like in the holder plate (5700) can be discharged to the drain bath (40) through the plurality of holes.

[0310] The air speed controller (5900), as illustrated in FIG. 56, is installed in the air supply line (AL) of air supplied into the interior of the holder base body (5100) and can control the speed of air passing through the air supply line (AL).

[0311] In this embodiment, even if the air pressure passing through the solenoid valve (6000) is strong, the speed of the air is controlled as it passes through the air speed controller (5900), so that the operation of the sample holder unit (5200) can proceed smoothly. As a result, the sample member (20) can be prevented from being damaged by the instantaneous operation of the sample holder unit (5200).

[0312] In this embodiment, the air speed controller (5900) can control the reciprocating speed of the first sample holder section (5400) and the second sample holder section (5500) by controlling the flow of air flowing through the air supply line (AL).

[0313] In this embodiment, the air speed controller (5900) may include a main body coupled to an air supply line (AL), a check valve provided on the main body to control air flow in one direction while allowing the flow in the opposite direction to pass freely, and an adjustment screw provided on the main body to allow a user to finely control the air flow.

[0314] The solenoid valve (6000) is provided in the air supply line (AL), as illustrated in FIG. 56, and can automatically open and close the air flow flowing through the air supply line (AL) using an electric signal.

[0315] The regulator (6100) is installed in the air supply line (AL) and can maintain the pressure of the air supplied to the solenoid valve (6000) at a constant value.

[0316] The operation of this embodiment is described below.

[0317] First, the sample member (20) is placed on the upper surface of the holder base body (5100) so as to be positioned between the first sample holder section (5400) and the second sample holder section (5500). This operation can be performed either manually or automatically (using a robot arm).

[0318] In order to adjust the polishing position of the sample member (20) and the polishing pad (2250) coupled to the sample holding device (5000), the sample holding device (5000) can be moved in a specific direction by the Y-axis driving unit (100). At this time, the sample holding device (5000) can be moved to the polishing position by at least one of the first Y-axis driving unit (110) and the second Y-axis driving unit (120).

[0319] After the sample member (20) is placed, the polishing pad (60) of the polishing device (60) is moved to the upper part of the sample member (20) and comes into close contact with the sample member (20).

[0320] Once the polishing position of the sample member (20) is set, the sample member (20) is polished with a polishing pad (2250). At this time, the polishing pad (2250) can be raised and lowered by the Z-axis driving motor (63).

[0321] When the control unit confirms the adhesion of the polishing pad (2250), the air speed controller (5900), the solenoid valve (6000), and the regulator are controlled to supply air to the first air space (5120) and the second air space (5130) through the air hole (5110). As a result, the first sample holder unit (5400) and the second sample holder unit (5500) move toward the sample member (20) to hold the sample member (20). At this time, the elastic member (5300) may be contracted.

[0322] The control unit can detect the start of polishing through the polishing start information.

[0323] During the polishing process, the first sample holder part (5400) and the second sample holder part (5500) fix the sample member (20) with a constant air pressure through the regulator (6100), thereby preventing the sample member (20) from being damaged by the pressure of the polishing pad (2250) that is rotated under pressure by the elastic member (5300) and ensuring stable fixation.

[0324] When the control unit receives information about the end of polishing, the air pressure applied to the first sample holder unit (5400) and the second sample holder unit (5500) is removed. Thereafter, the polishing pad (2250) is raised and the cleaning solution is supplied to the sample member (20).

[0325] The control unit confirms the removal (manual or automatic) of the cleaned sample member (20), and when the sample member (20) is removed (automatically, upon receipt of a completion signal, manually, upon selection of cleaning), the slurry that has penetrated into the interior of the holder base body (5100) through the first movement guide hole (5140) and the second movement guide hole (5150) can be removed. To this end, the control unit adjusts the air pressure according to the supply of the cleaning solution, thereby reciprocating the first sample holder unit (5400) and the second sample holder unit (5500), thereby completely removing the slurry inside the holder base body (5100).

[0326] The operation of the decap system according to the present embodiment is described below.

[0327] First, in order to adjust the polishing position of the sample member (20) and polishing pad (2250) coupled to the sample holding unit (4100), the sample holding device (4000) can be moved in a specific direction by the Y-axis driving unit (100) of the stage (1) for the Y-decap system. At this time, the sample holding device (4000) can be moved to the polishing position by at least one of the first Y-axis driving unit (110) and the second Y-axis driving unit (120).

[0328] When the polishing position of the sample member (20) is set, the sample member (20) is polished with a polishing pad (2250) as shown in Fig. 58. At this time, the polishing pad (2250) can be raised and lowered by the polishing Z-axis driving motor (2323).

[0329] In this embodiment, in order to prevent uneven wear, bending, and edge over-polishing of the sample member (20), the sample holding device (4000) to which the sample member (20) is coupled is reciprocated more slowly than the second Y-axis driving unit (120) by the first Y-axis driving unit (110) and the reciprocating range is wider than that of the second Y-axis driving unit (120), thereby uniformly polishing the sample member (20). In this case, the sample member (20) can be reciprocated in the Y-axis direction by the first Y-axis driving unit (110) and rotated by the R-axis driving unit (200). In addition, the polishing pad (2250) can also be rotated in the same or different direction as the rotational direction of the sample member (20), and can be rotated at a speed faster than the rotational speed of the sample member (20). For reference, when the first Y-axis driving unit (110) is in operation, the second Y-axis driving unit (120) may not be in operation.

[0330] In this embodiment, in order to prevent a local area dishing phenomenon in the sample member (20), the sample holding device (4000) to which the sample member (20) is coupled is reciprocated faster than the first Y-axis driving unit (110) by the second Y-axis driving unit (120) and the reciprocating range is narrowed, thereby uniformly polishing the sample member (20). In this case, the sample member (20) can be reciprocated in the Y-axis direction by the second Y-axis driving unit (120) and rotated by the R-axis driving unit (200). In addition, the polishing pad (2250) can also be rotated in the same or different direction as the rotational direction of the sample member (20), and can be rotated at a speed faster than the rotational speed of the sample member (20). For reference, when the second Y-axis driving unit (120) is in operation, the first Y-axis driving unit (110) may not be in operation.

[0331] In this embodiment, the polishing pad (2250) on which the polishing work of the sample member (20) has been completed is moved to the cleaning and storage device (3000) of the polishing pad shown in FIG. 60 by the polishing X-axis driving motor (2331) and can be accommodated in the cleaning and storage device (3000) of the polishing pad. At this time, the slurry on the polishing pad (2250) can be washed away in the cleaning and storage device (3000) of the polishing pad.

[0332] In the present embodiment, the polishing pad (2250) moved to the bath body (3100) of the polishing pad cleaning and storage device (3000) can be lowered by the polishing Z-axis driving unit (2320) and immersed in the liquid stored in the bath body (3100). In addition, in the present embodiment, the polishing pad (2250) can be lowered by the polishing Z-axis driving unit (2320) and pressed against the bath protrusion (3200) to remove slurry on the polishing pad (2250). In the present embodiment, the polishing pad (2250) immersed in the bath body (3100) can be rotated clockwise or counterclockwise by the R-axis driving unit (200).

[0333] Meanwhile, the present embodiment can solve the problem that the pressure pressing the sample member (20) in the polishing device (2000) is set based on the specific position coordinates of the Z-axis stored in the recipe, but the pressure may change due to wear of the polishing pad (2250) or manufacturing processing errors of the polishing disk unit (2240). In particular, by detecting the load of the polishing Z-axis driving motor (2323) at the beginning of polishing and correcting the Z-axis coordinate to match the load stored in the recipe, the pressure applied to the sample can be kept constant at all times. This can minimize frictional force and pressure changes occurring during the polishing process, thereby improving polishing reproducibility. In addition, by adjusting the Z-axis coordinate in real time during polishing, the target endpoint of the semiconductor layer can be accurately maintained, resulting in reduced processing errors and secured uniform polishing quality. Accordingly, the reliability of the semiconductor manufacturing process can be expected to be enhanced and the uniformity of the product can be improved.

[0334] The polishing process described above in this embodiment can be viewed on a display monitor (14) coupled to the main body (11). For reference, a wheel member (13) is provided on the main body (11).

[0335] As such, the present invention is not limited to the described embodiments, and it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations should fall within the scope of the claims of the present invention.

[0336] Description of the symbol

[0337] 1: Stage for decap system

[0338] 100: Y-axis drive unit

[0339] 110: 1st Y-axis drive unit

[0340] 111: 1st Y-axis body

[0341] 112: 1st Y-axis drive motor

[0342] 113: 1st Y-axis movement body

[0343] 120: 2nd Y-axis drive unit

[0344] 121: 2nd Y-axis body

[0345] 122: 2nd Y-axis drive motor

[0346] 123: 2nd Y-axis movement body

[0347] 200: R-axis drive unit

[0348] 210: R-axis body

[0349] 211: R-axis fastening member

[0350] 220: R-axis drive motor

[0351] 230: Power transmission unit

[0352] 10: System body

[0353] 11: Main body

[0354] 12: Body base plate

[0355] 13: Wheel member

[0356] 14: Display Monitor

[0357] 20: Absence of sample

[0358] 1000: Slurry Collector

[0359] 1100: Collector Base Body

[0360] 1110: First body

[0361] 1111: Collector coupling hole

[0362] 1120: Second body

[0363] 1121: Body joining hole

[0364] 1130: Collector coupling member

[0365] 1200: Collector Body

[0366] 1210: Third Body

[0367] 1211: Collector Combination

[0368] 1212: Collector cutout hole

[0369] 1213: Body space

[0370] 1220: 4th body

[0371] 1221: 1st collector straight section

[0372] 1222: Second collector straight section

[0373] 1223: Collector curve

[0374] 1230: Elastic member

[0375] A: Rotation direction of the holder plate

[0376] B: Direction of movement of rotating slurry on holder plate

[0377] C: Change in direction of slurry movement by slurry collector

[0378] 2000: Polishing device for decap system

[0379] 2100: Polishing body

[0380] 2110: Bottom of the main body

[0381] 2120: Front wall of the main body

[0382] 2130: Body side wall

[0383] 2140: Main body ceiling

[0384] 2150: Drive frame

[0385] 2200: Polishing Unit

[0386] 2210: Motor support frame

[0387] 2220: Polishing drive motor

[0388] 2230: Motor connection flange

[0389] 2231: Horizontal adjustment bolt

[0390] 2240: Polishing disc section

[0391] 2241: 1st polishing disc

[0392] 2241a: First disc flange

[0393] 2241b: Spacer retaining lug

[0394] 2242: Second polishing disc

[0395] 2242a: Second disc flange

[0396] 2242b: Disc alignment protrusion

[0397] 2243: Clamp section

[0398] 2243a: First clamp body

[0399] 2243b: Second clamp body

[0400] 2243c: Clamp fastening member

[0401] 2243d: Clamp fixed axis

[0402] 2250: Polishing pad

[0403] 2260: Spacer absence

[0404] 2300: Polishing drive unit

[0405] 2310: X-axis movement body

[0406] 2320: Polishing Z-axis drive unit

[0407] 2321: X-axis connection frame

[0408] 2322: Polishing Z-axis drive motor

[0409] 2323: Z-axis drive screw shaft

[0410] 2324: Z-axis lifting block

[0411] 2325: Z-axis support

[0412] 2330: Polishing X-axis drive unit

[0413] 2331: Polishing X-axis drive motor

[0414] 2331a: X-axis drive pulley

[0415] 2332: X-axis driven pulley

[0416] 2333: X-axis drive screw shaft

[0417] 2334: X-axis support

[0418] 2335: X-axis support chain

[0419] 2400: Nozzle section

[0420] 2410: Nozzle body

[0421] 2420: Slurry supply unit

[0422] 2430: Detergent supply absence

[0423] 2440: Air supply failure

[0424] 2450: Slurry pump

[0425] 2500: Level Measuring Instrument

[0426] 2510: Measuring instrument body

[0427] 2520: First adjusting protrusion

[0428] 2530: Second adjusting protrusion

[0429] 2540: Third adjusting protrusion

[0430] PC: Polishing cover

[0431] 3000: Cleaning and storage device for polishing pads for decap systems

[0432] 3100: Bath body

[0433] 3110: Supply hole

[0434] 3120: Drain hole

[0435] 3200: Bass protrusion

[0436] 4000: Sample holding device for decap system

[0437] 4100: Sample holding section

[0438] 4110: Holding Base Body

[0439] 4111: Guide pin joining hole

[0440] 4112: Adsorption part joining hole

[0441] 4113: Support joint groove

[0442] 4114: Top surface groove

[0443] 4115: Side groove

[0444] 4120: Sample adsorption unit

[0445] 4121: Holder suction body

[0446] 4121a: Adsorption unit air passage

[0447] 4121b: First ceiling groove

[0448] 4121c: Second ceiling groove

[0449] 4122: First sealing member

[0450] 4123: Second sealing member

[0451] 4130: Sample support

[0452] 4131: Sample support body

[0453] 4132: Sample fixing member

[0454] 4200: Holder Plate

[0455] 4210: Holder mounting groove

[0456] 4220: Plate sealing member

[0457] 4230: First support pin

[0458] 4240: Phage Home

[0459] 4250: Plate fastening member

[0460] 4260: Plate guide pin

[0461] 4270: Holder Spacer

[0462] 4280: Plate Cover

[0463] 4300: Plate wall

[0464] RJ: Rotary Joint

[0465] 5000: Sample holding device for decap system

[0466] 5100: Holder base body

[0467] 5110: Air hole

[0468] 5120: 1st air space

[0469] 5130: Second air space

[0470] 5140: 1st moving guide hole

[0471] 5150: 2nd moving guide hole

[0472] 5160: Central wall

[0473] 5170: Body side wall groove

[0474] 5180: Body top surface groove

[0475] 5190: Body fastening member

[0476] 5191: 1st Air Guide Home

[0477] 5192: 2nd Air Guide Home

[0478] 5193: Body joining groove

[0479] 5200: Sample Holder Unit

[0480] 5300: Elastic member

[0481] 5400: First sample holder section

[0482] 5410: First moving body

[0483] 5411: First combination home

[0484] 5412: First body sealing member

[0485] 5420: First sample holder section

[0486] 5421: First sample holder

[0487] 5421a: First incision support hole

[0488] 5421b: First breakage prevention hole

[0489] 5422: 1st holder body

[0490] 5423: First guide flange

[0491] 5430: First holder fastening member

[0492] 5500: Second sample holder section

[0493] 5510: Second moving body

[0494] 5511: Second combination home

[0495] 5512: Second body sealing member

[0496] 5520: Second sample holder section

[0497] 5521: Second sample holder

[0498] 5521a: Second incision support hole

[0499] 5521b: Second breakage prevention hole

[0500] 5522: Second holder body

[0501] 5523: Second guide flange

[0502] 5530: Second holder fastening member

[0503] 5600: Closing

[0504] 5610: Finished body

[0505] 5620: Finish sealing member

[0506] 5700: Holder Plate

[0507] 5710: Holder mounting groove

[0508] 5720: Plate sealing member

[0509] 5730: First support pin

[0510] 5740: Phage Home

[0511] 5750: Plate fastening member

[0512] 5760: Plate guide pin

[0513] 5800: Plate wall

[0514] 5900: Air Speed ​​Controller

[0515] 6000: Solenoid valve

[0516] 6100: Regulator

[0517] AL: Air supply line

[0518] Embodiments of the present invention can improve the precision, efficiency, and quality of the decap process. In particular, they can provide a new CMP polishing control technology by reducing dishing and edge over-polishing and implementing double motion control of the sample stage.

Claims

1. A Y-axis drive unit that drives a sample holding device coupled to the system body and having a sample member coupled thereto in the Y-axis direction; and It includes an R-axis driving unit coupled to the Y-axis driving unit and rotating the sample holding device in the R-axis direction, The above Y-axis driving unit is a decap system that moves the sample holding device in the Y-axis direction at different speeds.

2. In claim 1, a collector base body coupled to the polishing area of ​​the sample member; and A decap system further comprising a slurry collector having a collector body coupled to the collector base body and guiding slurry moving to the edge of the polishing area during polishing of the sample member to the area of ​​the sample member.

3. In claim 1, A polishing body positioned close to the sample member; a polishing unit arranged on top of the sample member to polish the sample member; and A decap system further comprising a polishing device for a decap system, wherein one side is coupled to the polishing body and the other side is coupled to the polishing unit, and a polishing drive unit is provided to move the polishing unit in the X-axis direction, which is the left-right direction of the sample member, and in the Z-axis direction, which is the up-down direction of the sample member.

4. In claim 1, A decap system further comprising a cleaning and storage device for a polishing pad, the system comprising a bath body disposed in a polishing area where the sample member is polished, the interior of the bath body being filled with liquid, and a polishing pad being placed inside the bath body filled with the liquid to prevent solidification of slurry on the polishing pad.

5. In claim 1, A sample holding portion is included to which a sample member is detachably coupled, The above sample holding unit is, A holding base body on which the sample member is mounted; A sample adsorption unit coupled to the holding base body and adsorbing the sample member from the lower portion of the sample member; and A decap system further comprising a sample holding device for the decap system, the sample support member being coupled to the holding base body and supporting the side wall of the sample member.

6. In claim 1, A holder base body on which a sample member to be polished is mounted; and It includes a sample holder unit that is arranged to be moved to the holder base body and holds a sample member to be polished, The above holder base body is provided with an air hole through which air flows in and out. The above sample holder unit, A decap system further comprising a sample holding device for a decap system, the decap system comprising an elastic member disposed inside the holder base body, a first sample holder part supported on one side of the elastic member and moved in the direction of the sample member by air introduced through the air hole to hold the one side of the sample member, and a second sample holder part supported on the other side of the elastic member and moved in the direction of the sample member by air introduced through the air hole to hold the other side of the sample member.

7. In claim 1, In a polishing device for a decap system for polishing the above sample member, the pressure for pressing the sample member is set based on a specific position coordinate in the Z-axis direction stored in the recipe, A decap system capable of improving polishing reproducibility by maintaining a constant pressure applied to the sample member by detecting the load of the polishing device for the decap system at the beginning of polishing and correcting the Z-axis coordinate to match the load stored in the recipe.

Images