Laser processing control method and system, electronic device, and medium

Abstract

A laser processing control method and system, an electronic device, and a medium. The method comprises: upon detecting that a galvanometer has swung to a target position, transmitting a first level signal to a preset gate circuit module of a main control board of a laser, wherein the preset gate circuit module is configured to output a second level signal upon receiving the first level signal and a laser emission enable signal output by the main control board; and transmitting the second level signal to the laser to control the laser to turn on or off. The method achieves rapid on / off switching of the laser and improves laser processing performance.

Description

Laser processing control method, system, electronic equipment and medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 18, 2024, with application number 202410307010.3. The entire contents of the above application are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of laser processing technology, and in particular to a laser processing control method, system, electronic equipment and medium. Background Art

[0003] Laser cleaning has the advantages of being green, environmentally friendly, safe and efficient, so it is widely used in aviation, aerospace, shipbuilding, power batteries, molds, cultural relics cleaning and other fields. SUMMARY OF THE INVENTION

[0004] However, when using lasers for cleaning and other processing, the laser's on and off response time is often long, making it impossible to quickly switch the light on and off, resulting in poor laser processing results.

[0005] The present application provides a laser processing control method, which includes:

[0006] Obtaining processing parameters for laser processing to be performed;

[0007] Based on the processing parameters, the galvanometer motor inside the laser processing head is controlled to drive the galvanometer to swing to the target position;

[0008] When the galvanometer is detected to have swung to the target position, a first level signal is sent to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head. The preset gate circuit module is configured to output a second level signal upon receiving the first level signal and the laser light-emitting enable signal output by the main control board;

[0009] The second level signal is sent to the laser to control the laser to turn on or off.

[0010] The present application also provides a laser processing control system, which includes:

[0011] An acquisition module, used for acquiring processing parameters to be processed by laser processing;

[0012] A control module is used to control the galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to the target position;

[0013] A sending module, configured to send a first level signal to a preset gate circuit module of a main control board of a laser corresponding to the laser processing head when detecting that the galvanometer has swung to a target position, wherein the preset gate circuit module is configured to output a second level signal upon receiving the first level signal and a laser light-emitting enable signal output by the main control board;

[0014] The sending module is further used to send the second level signal to the laser to control the laser to turn on or off.

[0015] The present application also provides an electronic device, the electronic device comprising:

[0016] one or more processors;

[0017] Memory; and

[0018] One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the laser processing control method.

[0019] The present application also provides a computer-readable storage medium on which a computer program is stored. The computer program is loaded by a processor to execute the steps in the laser processing control method. Beneficial effects

[0020] The present application provides a laser processing control method, system, electronic device and medium. The laser processing control method includes: obtaining the processing parameters of the laser processing to be performed; based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when the galvanometer is detected to swing to the target position, sending a first level signal to the preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; sending the second level signal to the laser to control the laser to turn on or off. The present application sends a first level signal to the preset gate circuit module when the galvanometer swings to the target position, so as to use the preset gate circuit module to directly output the corresponding second level signal, thereby controlling the laser to turn on or off, thereby realizing rapid switching of the laser light and improving the laser processing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a flow chart of a laser processing control method provided in some possible implementations of the present application;

[0022] FIG2 is a schematic structural diagram of a laser processing control system provided in some possible implementations of the present application;

[0023] FIG3 is a schematic diagram of a swing trajectory of a galvanometer provided in some possible implementations of the present application;

[0024] FIG4 is another structural diagram of a laser processing control system provided in some possible implementations of the present application;

[0025] FIG5 is a schematic structural diagram of an electronic device provided in some possible implementations of the present application.

[0026] Description of reference numerals:

[0027] 20. Main control board; 21. Preset gate circuit module; 22. Laser; 23. Laser processing control terminal; 24. Slave control board; 25. Detection unit. Modes for Carrying Out the Invention

[0028] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0029] Some possible implementations of the present application provide a laser processing control method, a laser processing control system, an electronic device, and a medium, which are described in detail below.

[0030] First, the laser processing control methods provided in some possible implementations of the present application are introduced.

[0031] In some possible implementations of the present application, the laser processing control method uses a laser processing control system as an execution entity. For the sake of simplicity and ease of description, this execution entity will be omitted later.

[0032] Please refer to FIG1 and FIG2. FIG1 is a flow chart of a laser processing control method provided in some possible implementations of the present application. The laser processing control method includes:

[0033] 101. Obtain processing parameters for laser processing to be performed.

[0034] In some possible implementations of the present application, laser processing is performed by a complete machine including a laser processing head and a laser 22. The laser processing may be laser cleaning, laser welding, laser cutting and other laser processing. The laser 22 may specifically be a pulsed laser, a continuous laser, a semiconductor laser, or a composite laser that combines at least two of pulsed, continuous, and semiconductor. The processing parameters for the laser processing to be performed are used to indicate how to control the parameters of the laser 22 and / or the laser processing head for processing. The processing parameters may include laser parameters such as laser power, laser frequency, and laser type, and may also include parameters such as the swing speed of the galvanometer motor inside the laser processing head and the laser width, as well as information such as the lens type and galvanometer motor type used. It can be understood that by setting the processing parameters, the corresponding laser processing can be controlled.

[0035] In some possible implementations of the present application, the laser processing control system is compatible with different lens types, different galvanometer motor types, different laser types, etc. Examples are as follows:

[0036] Taking the compatibility of different lens types as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the laser lens type selected by the operator from a preset laser processing control terminal 23 (e.g., a host computer, touch screen, etc.), wherein the focal lengths of different laser lens types generally differ; determining the target galvanometer motor parameters associated with the selected laser lens type from a plurality of preset galvanometer motor parameters, wherein the values ​​of different target galvanometer motor parameters generally differ; displaying the target galvanometer motor parameters on the laser processing control terminal 23 for the operator to adjust based on actual needs, thereby obtaining the adjusted target galvanometer motor parameters, which are included in the processing parameters. The laser processing control system is pre-set with multiple different sets of galvanometer motor parameters, each of which is adapted to different laser lens types. This allows the galvanometer motor parameters to be automatically adjusted according to lenses of different focal lengths, thereby achieving compatibility with different lens types and making the setting of processing parameters more convenient and quick.

[0037] Taking the compatibility of different galvanometer motor types as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the galvanometer motor type selected by the operator from the preset laser processing control terminal 23; determining the maximum galvanometer motor swing frequency corresponding to the selected galvanometer motor type, wherein the maximum galvanometer motor swing frequencies of different galvanometer motor types generally differ; obtaining the target galvanometer motor frequency set by the operator at the laser processing control terminal 23; and, when the target galvanometer motor frequency is greater than the maximum galvanometer motor swing frequency, using the maximum galvanometer motor swing frequency as the adjusted target galvanometer motor frequency to prevent the galvanometer motor from operating beyond its maximum swing frequency (i.e., overclocking), thereby preventing overclocking from affecting the galvanometer motor's service life and improving the galvanometer motor's operational stability. The processing parameters include the adjusted target galvanometer motor frequency.

[0038] Taking the compatibility of different laser types as an example, obtaining the processing parameters for laser processing may include: obtaining the laser type selected by the operator in the preset laser processing control terminal 23, wherein the laser type is, for example, a MOPA laser, a Q-switched laser, etc.; determining a set of laser parameter items associated with the selected laser type, wherein a set of laser parameter items may include multiple different laser parameters, and different sets of laser parameter items are not exactly the same. For example, a set of laser parameter items associated with a MOPA laser may include a laser parameter of pulse width, while a set of laser parameter items associated with a Q-switched laser does not include a laser parameter of pulse width; displaying a set of laser parameter items associated with the selected laser type in the preset laser processing control terminal 23, so that the operator can adjust the values ​​of each laser parameter in the set of laser parameter items based on needs, thereby realizing the setting of laser parameters. It can be seen that based on the different laser types, a corresponding set of laser parameter items can be automatically displayed to be compatible with different laser types.

[0039] In some possible implementations of this application, the laser processing control system may also provide a laser width calibration function. Specifically, because the actual width of the galvanometer motor may not be equal to the set expected width due to long-term operation or consistency, the laser width calibration function can be used to correct the actual width. The laser width calibration function can use full-width calibration or proportional coefficient calibration, as detailed below.

[0040] Taking full-width calibration as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the laser width value selected by the operator in the preset laser processing control terminal 23, where the selected laser width value is the set expected width value; and obtaining the corrected width value associated with the selected laser width value from multiple preset width values, where the processing parameters may include the corrected width value. In this way, when controlling the laser processing based on the processing parameters, control is specifically performed according to the corrected width value.

[0041] A plurality of amplitude values ​​and their associated corrected amplitude values ​​are pre-stored, from which the corrected amplitude value associated with the selected laser amplitude value can be selected. The corrected amplitude value associated with each amplitude value can be obtained based on a linear correlation between a plurality of preset amplitude values ​​and the actual amplitude value (the corrected amplitude value associated with each amplitude value is the actual amplitude value linearly correlated with the corresponding preset amplitude value). Specifically, the linear correlation relationship can be obtained by the following steps: dividing the full width (e.g., 0%-100%) of the laser processing control into multiple width segments, for example, each 10% of the width is considered as a width segment; for each width segment, pre-testing the actual width values ​​corresponding to the width values ​​at the endpoints of the width segment, for example, pre-testing the actual width values ​​corresponding to the width values ​​at the two endpoints of 30% and 40% in the width segment 30%-40%; based on the actual width values ​​corresponding to the width values ​​at the endpoints of the width segment, generating a linear correlation curve between the preset width values ​​and the actual width values ​​in the width segment, the linear correlation curve including the width values ​​at the endpoints of the width segment and their corresponding actual width values ​​(the linear correlation curve is a linear correlation relationship, and each width segment corresponds to a linear correlation curve). Taking values ​​in the linear correlation curve at preset intervals (e.g., 1% of the width) to obtain multiple preset width values, the actual width value corresponding to each preset width value in the corresponding linear correlation curve is the actual width value linearly correlated with the preset width value. It can be seen that this full-format calibration method can perform format correction more conveniently and quickly.

[0042] Taking scale factor calibration as an example, obtaining the processing parameters for the laser processing to be performed may include: obtaining the laser amplitude value selected by the operator from the preset laser processing control terminal 23; and obtaining the amplitude correction coefficient associated with the selected laser amplitude value. The processing parameters include the selected laser amplitude value and the amplitude correction coefficient. Thus, when controlling the laser processing based on the selected laser amplitude value, the amplitude correction coefficient can be used to adjust the amplitude of the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head. For example, the amplitude correction coefficient can be used as an amplification factor to proportionally amplify the amplitude of the galvanometer motor drive signal generated based on the selected laser amplitude value.

[0043] The amplitude correction coefficient associated with the selected laser amplitude value can be determined through preliminary testing. Specifically, the actual amplitude value corresponding to the selected laser amplitude value can be pre-tested, and the ratio of the selected laser amplitude value to the actual amplitude value can be used as the amplitude correction coefficient associated with the selected laser amplitude value. In some possible implementations of the present application, in order to more accurately adjust the galvanometer motor drive signal, the amplitude correction coefficient can be amplified by a preset multiple and then applied to the proportional amplification of the galvanometer motor drive signal, thereby making the light output amplitude correction of the laser processing head more accurate.

[0044] 102. Based on the processing parameters, the galvanometer motor inside the laser processing head is controlled to drive the galvanometer to swing so that the galvanometer swings to the target position.

[0045] In some possible implementations of the present application, the target position may be a position where the laser 22 needs to be controlled to be turned on or off. The target position may be specifically determined based on the processing requirements of the laser 22 on the workpiece, which is not limited here.

[0046] 103. When it is detected that the galvanometer has swung to the target position, a first level signal is sent to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head. The preset gate circuit module is used to output a second level signal when it receives the first level signal and the laser light enable signal output by the main control board.

[0047] 104. Send the second level signal to the laser to control the laser to turn on or off.

[0048] In some possible implementations of the present application, as shown in FIG2 , the laser 22 is connected to a main control board 20. The main control board 20 is used to communicate and interact with the control end of the laser 22, control the light output of the laser 22, communicate with the slave control board 24, etc. The main control board 20 can be set in an electrical control box or an electrical cabinet. The preset laser processing control end 23 is mainly used to set laser parameters such as laser power, laser frequency, laser type, the swing speed of the galvanometer motor in the laser 22, and parameters such as laser width, the type of lens used, the type of galvanometer motor, etc. It can also be used to read fault data of the laser processing control system and set related fault alarm thresholds. The slave control board 24 is used to control the galvanometer motor and detect whether there is any abnormality inside the laser processing head. The slave control board 24 and at least one detection unit 25 for detecting whether there is any abnormality inside the laser processing head can be set inside the laser processing head.

[0049] As shown in FIG2 , the main control board 20 is provided with a preset gate circuit module 21. The preset gate circuit module 21 may include at least one of an AND gate, an OR gate, a NOT gate, a NAND gate, a NOR gate, an AND-NOR gate, and an XOR gate. As long as the preset gate circuit module 21 receives a first level signal and a laser light enable signal output by the main control board 20, it can output a second level signal. The second level signal is used to control the laser 22 to turn on or off. For example, the second level signal can be a low level signal. The laser 22 will automatically turn off when receiving the low level signal. The laser light enable signal is the enable signal originally sent by the main control board 20 and is used to control the light emission of the laser 22. The laser light enable signal can be, for example, a high level signal.

[0050] In some possible implementations of the present application, the preset gate circuit module 21 can be an AND gate circuit module. When all inputs of the AND gate circuit module are high, the output is high, and when at least one input is not high, the output is low. In the scheme of sending the second level signal to the laser 22 to control the laser 22 to turn on, the first level signal is a high level signal, and the laser light enable signal is a high level signal, which can make the second level signal a high level signal, thereby controlling the laser 22 to turn on. In the scheme of sending the second level signal to the laser 22 to control the laser 22 to turn off, the first level signal is a low level signal, and the laser light enable signal is a high level signal, which can make the second level signal a low level signal, thereby controlling the laser 22 to turn off. It should be noted that the preset gate circuit module 21 can also be a combination of at least two of an AND gate, an OR gate, a NOT gate, a NAND gate, a NOR gate, an AND-NOR gate, and an XOR gate, so that the function of the preset gate circuit module 21 is realized by multiple gate circuits.

[0051] In some possible implementations of the present application, examples are provided for describing how to determine the target position. Specifically, after obtaining the processing parameters for the laser processing to be performed, the following may also be included: determining the oscillation trajectory of the galvanometer based on the processing parameters, where the oscillation trajectory may be, for example, as shown in FIG3 ; obtaining a trajectory segment in which the laser amplitude overlaps within the oscillation trajectory, for example, where the trajectory segment with the later trajectory movement order is selected from the two overlapping trajectory segments on the right (or left) side of FIG3 ; and determining the trajectory start point and trajectory end point within the trajectory segment. In this case, in a scheme where a second level signal is sent to the laser 22 to control the laser 22 to be turned off, the target position may be the trajectory start point, so as to control the laser 22 to be turned off at the target position. In a scheme where a second level signal is sent to the laser 22 to control the laser 22 to be turned on, the target position may be the trajectory end point, so as to control the laser 22 to be turned on at the target position. It can be seen that some possible implementation methods of the present application avoid excessive laser burning caused by repeated laser processing of the same position (for example, the two ends of the laser processing width). After combining the second level signal output by the preset gate circuit module 21, the laser 22 can be quickly switched on and off to avoid this problem more accurately, and the process effect of laser processing such as laser cleaning can be significantly improved.

[0052] In some possible implementations of the present application, the main control board 20 may also utilize a detection unit 25 to read in real time the water flow rate of a water cooling circuit of the entire machine, including the laser 22 and / or the laser processing head. The water cooling circuit is used to cool the laser 22 and / or the laser processing head. If the water flow rate of the water cooling circuit is less than a preset flow rate, it indicates that the water cooling circuit is poorly heat dissipating the laser 22 and / or the laser processing head, which may damage the laser 22 and / or the laser processing head. In this case, an alarm message may be output and the laser 22 may be shut down to protect the laser 22 and / or the laser processing head.

[0053] In some possible implementations of the present application, the slave control board 24 is used not only to control the galvanometer motor but also to detect whether any abnormal conditions occur inside the laser processing head. Abnormal conditions inside the laser processing head generally include lens abnormalities, motor abnormalities, humidity abnormalities, etc. inside the laser processing head. Among them, the lens can be, for example, at least one of the reflective lens, collimating lens, focusing lens, and lower protective lens inside the laser processing head. Examples of lens abnormalities include lens detachment, lens burnout, and burn spots on the lens. The motor generally refers to a driving motor used to drive the lens to swing. Examples of motor abnormalities include abnormal lens deflection driven by the motor, abnormal temperature of the motor's structural parts, etc. Humidity abnormalities generally refer to abnormal humidity inside the cavity of the laser processing head.

[0054] In some possible implementations of the present application, abnormal conditions within the laser processing head can be detected by corresponding detection units 25, such as those shown in Figure 2. The detection units 25 may include, for example, at least one of a scattered light detection unit, a lens temperature detection unit, a structural component temperature detection unit, a laser processing head cavity internal humidity detection unit, and a motor fault signal detection unit, thereby providing multi-dimensional monitoring of the interior of the laser processing head and improving internal safety. When an abnormal condition is detected by at least one detection unit 25, it can be determined that an abnormal condition has occurred within the laser processing head. If no abnormal condition is detected by any of the detection units 25, it is determined that no abnormal condition has occurred within the laser processing head. In addition, if an abnormal situation occurs inside the laser processing head, a third level signal can be sent to the preset gate circuit module 21 of the main control board 20. The preset gate circuit module 21 is used to output a fourth level signal when receiving the third level signal and the laser light enable signal output by the main control board 20, and send the fourth level signal to the laser 22 to control the laser 22 to shut down, so that the laser 22 is shut down in a shorter time, more quickly and timely, reducing the risk of damage to the laser 22, preventing damage to the processed workpiece, and enhancing laser safety protection.

[0055] Taking the example of the detection unit 25 including a scattered light detection unit, detecting whether an abnormality has occurred within the laser processing head may include: utilizing the scattered light detection unit within the laser processing head to collect scattered light information within the laser processing head, where the scattered light information may be, for example, a scattered light voltage value; based on the scattered light information, determining whether a lens within the laser processing head has fallen off or burned out, for example, when the scattered light voltage value is greater than a preset voltage value, determining that the lens within the laser processing head has fallen off; and when the scattered light voltage value is less than or equal to the preset voltage value, determining that the lens within the laser processing head has not fallen off; and if it is determined that the lens has fallen off or burned out, determining that an abnormality has occurred within the laser processing head. The scattered light detection unit may be disposed near the lens, and / or disposed toward the lens, so that when the lens falls off or burns out and the laser irradiates other locations within the laser processing head, generating scattered light, changes in the scattered light can be promptly collected.

[0056] Taking the detection unit 25 as an example, including a structural component temperature detection unit, detecting whether an abnormality has occurred within the laser processing head may include: utilizing the structural component temperature detection unit within the laser processing head to collect the structural component temperature of the drive motor of the reflective lens within the laser processing head. The structural component temperature detection unit may include a contact or non-contact temperature sensor. The contact temperature sensor may be disposed on the structural component of the drive motor, while the non-contact temperature sensor may be disposed toward the structural component of the drive motor. Based on the structural component temperature, determining whether the structural component temperature of the drive motor is abnormal is determined. For example, if the structural component temperature is greater than a first temperature threshold, the structural component temperature of the drive motor is determined to be abnormal; if the structural component temperature is less than or equal to the first temperature threshold, the structural component temperature of the drive motor is determined to be normal. If the structural component temperature of the drive motor is determined to be abnormal, determining that an abnormality has occurred within the laser processing head is determined. It is understood that an abnormal structural component temperature of the drive motor can easily lead to damage to the drive motor or the workpiece being processed, and therefore, it is necessary to monitor the structural component temperature of the drive motor.

[0057] Taking the detection unit 25 including a lens temperature detection unit as an example, detecting whether an abnormality has occurred within the laser processing head may include: utilizing the lens temperature detection unit within the laser processing head to collect the lens temperature of a reflective lens within the laser processing head. The lens temperature detection unit may include a non-contact temperature sensor, which may be positioned toward the reflective lens; determining whether the lens temperature is abnormal. For example, if the lens temperature is greater than a second temperature threshold, the lens temperature is determined to be abnormal, indicating a possible burn point on the lens; and if the lens temperature is less than or equal to the second temperature threshold, the lens temperature is determined to be normal. If the lens temperature is determined to be abnormal, determining that an abnormality has occurred within the laser processing head. It is understood that an abnormal lens temperature can easily lead to burns in the lens or damage to the workpiece being processed, thus requiring monitoring of the lens temperature.

[0058] Taking the example of the detection unit 25 including a laser processing head cavity internal humidity detection unit, detecting whether an abnormality has occurred within the laser processing head may include: using the laser processing head cavity internal humidity detection unit to collect the laser processing head cavity internal humidity; determining whether the cavity internal humidity is abnormal, for example, when the cavity internal humidity is greater than a preset humidity, determining that the cavity internal humidity is abnormal; when the cavity internal humidity is less than or equal to the preset humidity, determining that the cavity internal humidity is not abnormal; if the cavity internal humidity is determined to be abnormal, determining that an abnormality has occurred within the laser processing head. It is understood that when the cavity internal humidity is abnormal, it is usually due to an abnormal sealing of the cavity, causing moisture in the water circulation used to cool the laser processing head to enter the cavity, so it is necessary to monitor the cavity internal humidity.

[0059] Taking the detection unit 25 including a motor fault signal detection unit as an example, detecting whether an abnormality occurs inside the laser processing head can include: using the motor fault signal detection unit to detect whether the driving motor triggers a motor fault signal; if the driving motor triggers a motor fault signal, determining that the motor drives the lens to deflect abnormally, and determining that an abnormality occurs inside the laser processing head.

[0060] In some possible implementations of the present application, as shown in FIG2 , the slave control board 24 and the master control board 20 may also be connected via a controller area network (CAN) bus or a serial port such as RS-485. After detecting whether an abnormality occurs inside the laser processing head, the following may be included: if an abnormality occurs inside the laser processing head, the slave control board 24 generates an abnormal data signal, which is serial data and carries various operating parameters (such as data collected by each detection unit 25) when the abnormality occurs inside the laser processing head; and outputs the abnormal data signal to the master control board 20 via the controller area network bus or serial port. In this way, the master control board 20 can analyze the abnormal data signal and display the various operating parameters in the analysis results on the preset laser processing control terminal 23, so as to facilitate fault alarm and facilitate viewing and understanding by relevant operators.

[0061] The laser processing control method provided by some possible implementations of the present application sends a first level signal to a preset gate circuit module 21 when the galvanometer swings to the target position, so that the preset gate circuit module 21 directly outputs a corresponding second level signal, thereby controlling the laser 22 to turn on or off. In this process, there is no need for the main control board 20 to parse the data signal and control the laser 22 to turn on or off according to the analysis result, so that the time taken to turn on or off the laser 22 is shortened, thereby realizing rapid switching light of the laser 22 and improving the laser processing effect.

[0062] In order to better implement the laser processing control method in some possible implementations of the present application, based on the laser processing control method, some possible implementations of the present application further provide a laser processing control system. As shown in FIG4 , the laser processing control system 400 includes:

[0063] An acquisition module 401 is used to acquire processing parameters for laser processing to be performed;

[0064] The control module 402 is used to control the galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to the target position;

[0065] The sending module 403 is used to send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head when detecting that the galvanometer has swung to the target position. The preset gate circuit module is used to output a second level signal upon receiving the first level signal and the laser light enable signal output by the main control board;

[0066] The sending module 403 is further configured to send the second level signal to the laser to control the laser to turn on or off.

[0067] The laser processing control system provided in some possible implementations of the present application sends a first level signal to a preset gate circuit module when the galvanometer swings to a target position, and uses the preset gate circuit module to directly output a corresponding second level signal, thereby controlling the laser to turn on or off, thereby achieving rapid switching of the laser light and improving the laser processing effect.

[0068] In some possible implementations of the present application, the acquisition module 401 is further configured to:

[0069] Determine the oscillation trajectory of the galvanometer based on the processing parameters;

[0070] In the swinging trajectory, a trajectory segment with overlapping laser amplitudes is obtained;

[0071] Determine the trajectory start point and the trajectory end point in the trajectory segment;

[0072] In the scheme of sending the second level signal to the laser to control the laser to be turned off, the target position is the starting point of the trajectory; in the scheme of sending the second level signal to the laser to control the laser to be turned on, the target position is the end point of the trajectory.

[0073] In some possible implementations of the present application, the acquisition module 401 is further configured to:

[0074] In a preset laser processing control terminal, a selected laser lens type is obtained, wherein different laser lens types have different lens focal lengths;

[0075] Determine target galvanometer motor parameters associated with the selected laser lens type among a plurality of preset galvanometer motor parameters;

[0076] The target galvanometer motor parameters are displayed on the laser processing control end for adjustment, and the adjusted target galvanometer motor parameters are obtained. The processing parameters include the adjusted target galvanometer motor parameters.

[0077] In some possible implementations of the present application, the acquisition module 401 is further configured to:

[0078] In the preset laser processing control terminal, obtain the selected galvanometer motor type;

[0079] Determine the maximum oscillation frequency of the galvanometer motor corresponding to the selected galvanometer motor type;

[0080] Get the target galvanometer motor frequency set by the laser processing control end;

[0081] When the target galvanometer motor frequency is greater than the maximum swing frequency of the galvanometer motor, the maximum swing frequency of the galvanometer motor is used as the adjusted target galvanometer motor frequency, and the machining process parameters include the adjusted target galvanometer motor frequency.

[0082] In some possible implementations of the present application, the acquisition module 401 is further configured to:

[0083] In the preset laser processing control terminal, the selected laser width value is obtained;

[0084] Among the preset multiple amplitude values, a corrected amplitude value associated with the selected laser amplitude value is obtained, the processing parameters include the corrected amplitude value, and the association between the selected laser amplitude value and the corrected amplitude value is obtained based on the linear correlation between the multiple preset amplitude values ​​and the actual amplitude value.

[0085] In some possible implementations of the present application, the acquisition module 401 is further configured to:

[0086] In the preset laser processing control terminal, the selected laser width value is obtained;

[0087] Obtain an amplitude correction coefficient associated with the selected laser amplitude value. The processing parameters include the selected laser amplitude value and the amplitude correction coefficient. The amplitude correction coefficient is used to adjust the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head.

[0088] In addition to introducing the laser processing control method and the laser processing control system, some possible implementations of the present application further provide an electronic device that integrates any of the laser processing control systems provided in the present application. The electronic device includes:

[0089] one or more processors;

[0090] Memory; and

[0091] One or more application programs, wherein the one or more application programs are stored in the memory and configured to execute, by the processor, any step in any possible implementation manner of the laser processing control method.

[0092] Some possible implementations of the present application also provide an electronic device that integrates any of the laser processing control systems provided in the present application. As shown in FIG5 , it shows a schematic diagram of the structure of the electronic device involved in the present application, specifically:

[0093] The electronic device may include components such as a processor 501 with one or more processing cores, a storage unit 502 with one or more computer-readable storage media, a power supply 503, and an input unit 504. Those skilled in the art will appreciate that the electronic device structure shown in FIG5 does not limit the electronic device and may include more or fewer components than shown, or combine certain components, or arrange the components differently.

[0094] The processor 501 is the control center of the electronic device. It connects all parts of the electronic device using various interfaces and circuits. By running or executing software programs and / or modules stored in the storage unit 502 and accessing data stored in the storage unit 502, it performs various functions of the electronic device and processes data, thereby providing overall monitoring of the electronic device. Optionally, the processor 501 may include one or more processing cores. Alternatively, the processor 501 may integrate an application processor and a modem processor, with the application processor primarily handling the operating system, user interface, and application programs, while the modem processor primarily handles wireless communications. It is understood that the modem processor may not be integrated into the processor 501.

[0095] The storage unit 502 can be used to store software programs and modules. The processor 501 executes various functional applications and data processing by running the software programs and modules stored in the storage unit 502. The storage unit 502 may primarily include a program storage area and a data storage area. The program storage area may store an operating system and at least one application required for a function (such as sound playback or image playback); the data storage area may store data generated based on the use of the electronic device. Furthermore, the storage unit 502 may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state memory device. Accordingly, the storage unit 502 may also include a memory controller to provide the processor 501 with access to the storage unit 502.

[0096] The electronic device also includes a power supply 503 for supplying power to various components. Optionally, the power supply 503 can be logically connected to the processor 501 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The power supply 503 can also include one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, a power status indicator, and other arbitrary components.

[0097] The electronic device may further include an input unit 504, which may be used to receive input digital or character information and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.

[0098] Although not shown, the electronic device may further include a display unit, etc., which will not be described in detail here. Specifically, in some possible implementations of the present application, the processor 501 in the electronic device will load the executable files corresponding to the processes of one or more application programs into the storage unit 502 according to the following instructions, and the processor 501 will run the application programs stored in the storage unit 502 to implement various functions, such as:

[0099] Obtain processing parameters for the laser processing to be performed; based on the processing parameters, control the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when it is detected that the galvanometer swings to the target position, send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; send the second level signal to the laser to control the laser to be turned on or off.

[0100] To this end, some possible implementations of the present application provide a computer-readable storage medium, which can be either non-volatile or volatile. The computer-readable storage medium may include: read-only memory (ROM), random access memory (RAM), a magnetic disk, or an optical disk. The computer-readable storage medium stores multiple instructions that can be loaded by a processor to execute the steps of any of the laser processing control methods provided herein. For example, the instructions may execute the following steps:

[0101] Obtain processing parameters for the laser processing to be performed; based on the processing parameters, control the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to the target position; when it is detected that the galvanometer swings to the target position, send a first level signal to a preset gate circuit module of the main control board of the laser corresponding to the laser processing head, the preset gate circuit module is used to output a second level signal when receiving the first level signal and the laser light enable signal output by the main control board; send the second level signal to the laser to control the laser to be turned on or off.

Claims

1. A laser processing control method, comprising: Obtaining processing parameters for laser processing to be performed; Based on the processing parameters, controlling the galvanometer motor inside the laser processing head to drive the galvanometer to swing, so that the galvanometer swings to a target position; When it is detected that the galvanometer mirror swings to the target position, a first level signal is sent to a preset gate circuit module (21) of a main control board (20) of a laser (22) corresponding to the laser processing head, and the preset gate circuit module (21) is configured to output a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board (20); as well as The second level signal is sent to the laser (22) to control the laser (22) to turn on or off.

2. The laser processing control method according to claim 1, further comprising: after obtaining the processing parameters of the laser processing to be performed; Determining a swing trajectory of the galvanometer based on the processing parameters; In the oscillating trajectory, obtaining a trajectory segment where the laser amplitudes overlap; as well as Determining a trajectory start point and a trajectory end point in the trajectory segment; Wherein, in a scheme in which the second level signal is sent to the laser (22) to control the laser (22) to be turned off, the target position is the starting point of the trajectory; and in a scheme in which the second level signal is sent to the laser (22) to control the laser (22) to be turned on, the target position is the end point of the trajectory.

3. The laser processing control method according to claim 1, wherein: The step of obtaining the processing parameters for the laser processing to be performed includes: In a preset laser processing control terminal (23), a selected laser lens type is obtained, wherein different laser lens types have different lens focal lengths; Determining target galvanometer motor parameters associated with the selected laser lens type among a plurality of preset galvanometer motor parameters; and The target galvanometer motor parameters are displayed on the laser processing control end (23) for adjustment, and the adjusted target galvanometer motor parameters are obtained. The processing parameters include the adjusted target galvanometer motor parameters.

4. The laser processing control method according to claim 1, wherein: The step of obtaining the processing parameters for the laser processing to be performed includes: In the preset laser processing control terminal (23), the selected galvanometer motor type is obtained; Determining a maximum oscillation frequency of a galvanometer motor corresponding to the selected galvanometer motor type; Obtaining the target galvanometer motor frequency set by the laser processing control terminal (23); and When the target galvanometer motor frequency is greater than the maximum oscillation frequency of the galvanometer motor, the maximum oscillation frequency of the galvanometer motor is used as the adjusted target galvanometer motor frequency, and the processing parameters include the adjusted target galvanometer motor frequency.

5. The laser processing control method according to claim 1, wherein: The step of obtaining the processing parameters for the laser processing to be performed includes: In a preset laser processing control terminal (23), a selected laser amplitude value is obtained; and Among the preset multiple amplitude values, a corrected amplitude value associated with the selected laser amplitude value is obtained, the processing parameters include the corrected amplitude value, and the association between the selected laser amplitude value and the corrected amplitude value is obtained based on the linear correlation between multiple preset amplitude values ​​and the actual amplitude value.

6. The laser processing control method according to claim 1, wherein: The step of obtaining the processing parameters for the laser processing to be performed includes: In a preset laser processing control terminal (23), a selected laser amplitude value is obtained; and Obtain an amplitude correction coefficient associated with the selected laser amplitude value, wherein the processing parameters include the selected laser amplitude value and the amplitude correction coefficient, and the amplitude correction coefficient is configured to adjust the galvanometer motor drive signal generated based on the selected laser amplitude value, thereby adjusting the light output amplitude of the laser processing head.

7. The laser processing control method according to any one of claims 1 to 6, wherein: The preset gate circuit module (21) is an AND gate circuit module, In a scheme of sending the second level signal to the laser (22) to control the laser (22) to turn on, the first level signal is a high level signal, the laser light emission enable signal is a high level signal, and the second level signal is a high level signal; as well as In a scheme of sending the second level signal to the laser (22) to control the laser (22) to be turned off, the first level signal is a low level signal, the laser light emission enable signal is a high level signal, and the second level signal is a low level signal.

8. A laser processing control system, comprising: An acquisition module is configured to acquire processing parameters for laser processing to be performed; a control module configured to control a galvanometer motor inside the laser processing head to drive the galvanometer to swing based on the processing parameters, so that the galvanometer swings to a target position; A sending module is configured to send a first level signal to a preset gate circuit module (21) of a main control board (20) of a laser (22) corresponding to the laser processing head when detecting that the galvanometer has swung to the target position, wherein the preset gate circuit module (21) is configured to output a second level signal when receiving the first level signal and a laser light-emitting enable signal output by the main control board (20); as well as The sending module is further configured to send the second level signal to the laser (22) to control the laser (22) to turn on or off.

9. An electronic device, comprising: one or more processors; Memory; as well as One or more application programs, wherein the one or more application programs are stored in the memory and configured to be executed by the processor to implement the laser processing control method according to any one of claims 1 to 7. 10 . A computer-readable storage medium having a computer program stored thereon, wherein the computer program is loaded by a processor to execute the steps in the laser processing control method according to claim 1 .

Images