Chill water distribution unit, cabinet, and cabinet server
By integrating the flow channel in the liquid cooling distribution unit and setting the liquid pump on the base plate, the problems of stainless steel pipes taking up large space and being inconvenient to disassemble and repair are solved, and high stability and efficient cooling of the liquid cooling system are achieved.
Patent Information
- Application Number
- PCT/CN2025/070153
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-22
- Filing Date
- 2025-01-02
- Publication Date
- 2025-09-25
AI Technical Summary
The stainless steel pipes in the liquid cooling distribution unit have complex connections and occupy a large space inside the cabinet, resulting in high reliability risks for the liquid cooling system in high-reliability environments and inconvenience in component disassembly and maintenance.
The flow channel is integrated into the first substrate to reduce the use of stainless steel pipes. The first liquid pump is set on the substrate, and the heat exchanger can be on the substrate or on the side. Through the more integrated flow channel and device layout, efficient backup and convenient disassembly and maintenance of the device can be achieved.
It improves the stability and cooling effect of the liquid cooling system, saves space, simplifies the disassembly and maintenance process of the device, and reduces the risk of liquid leakage.
Smart Images

Figure CN2025070153_25092025_PF_FP_ABST
Abstract
Description
Liquid cooling distribution units, cabinets and cabinet servers
[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on March 22, 2024, with application number 202410345604.3 and application name “Liquid Cooling Distribution Unit, Cabinet and Cabinet Server”, the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of liquid cooling technology, and in particular to a liquid cooling distribution unit, a cabinet, and a cabinet server. Background Art
[0003] Each liquid-cooled cabinet server is typically equipped with an independent chiller distribution unit (CDU) to cool the server. For example, the CDU provides cooling for the cold plate, which in turn cools the electronic components in the server, thus forming a relatively independent liquid cooling system within each cabinet server.
[0004] The liquid cooling distribution unit usually includes a heat exchanger, a liquid pump, an expansion tank and other devices arranged in a cabinet (for example, the cabinet of a cabinet server). In the related art, the above-mentioned devices are connected by stainless steel pipes. Due to device assembly problems, the pipes connecting the above-mentioned devices are relatively complicated and will occupy a large space inside the cabinet, so that there is not enough space inside the cabinet for backup of the devices in the liquid cooling distribution unit. In an environment where high cooling continuity is required, the liquid cooling system has reliability risks. Summary of the Invention
[0005] The present application provides a liquid cooling distribution unit, a cabinet including the liquid cooling distribution unit, and a cabinet server including the cabinet, which reduces the use of stainless steel pipes, saves space inside the cabinet, enables more devices in the liquid cooling distribution unit to be backed up, and improves the stability of the liquid cooling system operation.
[0006] To achieve the above objectives, this application adopts the following technical solutions:
[0007] In a first aspect of the present application, a liquid-cooling distribution unit is provided, which includes a first substrate and a heat exchanger, a first liquid pump is provided on the first substrate, and a flow channel connected to the first liquid pump is provided in the first substrate; the heat exchanger is provided on the first substrate, or the heat exchanger is provided on the side of the first substrate, and a first heat exchange channel and a second heat exchange channel for heat exchange are provided in the heat exchanger, and the first heat exchange channel is connected to the flow channel.
[0008] The first liquid pump can drive the liquid (for example, coolant) to flow in the flow channel and the first heat exchange channel, and the liquid flowing into the first heat exchange channel can exchange heat with the liquid in the second heat exchange channel. The present application integrates the flow channel into the first substrate, reducing the use of stainless steel pipes. The first liquid pump is arranged on the first substrate, which also makes the integration of the liquid cooling distribution unit higher and reduces the space occupied. In this way, more devices in the liquid cooling distribution unit can be backed up, improving the stability of the liquid cooling system after the liquid cooling distribution unit is installed, and making the cooling effect better. In addition, the first liquid pump is integrated on the first substrate. When the first liquid pump needs to be replaced or disassembled, the entire first substrate can be removed, making the disassembly process more convenient. When the first substrate is removed, the liquid in the first liquid pump will enter the flow channel, reducing the possibility of the liquid in the first substrate flowing to the outside world (for example, a data center). The staff can repair the first substrate and the devices thereon nearby, and will not have to go away and then repair because of the fear of a large amount of liquid overflowing, making the maintenance of the liquid cooling distribution unit more convenient.
[0009] In an optional embodiment, the heat exchanger is disposed on the first substrate, the flow channel includes a first flow channel and a second flow channel connected through a first liquid pump, and the first heat exchange channel is connected to the first liquid pump through the first flow channel.
[0010] Placing the heat exchanger on the first substrate increases the integration of the liquid cooling distribution unit and further reduces the use of stainless steel pipes. The liquid cooling distribution unit reduces its size through device and flow channel integration. When a backup liquid cooling distribution unit is needed, the first substrate and multiple components on the first substrate can be backed up together. This means setting up multiple liquid cooling distribution units (multiple first substrates, each equipped with a first liquid pump, heat exchanger, etc.). For example, two liquid cooling distribution units can be set up, one in use and the other as a backup, thereby improving the stability of the liquid cooling system.
[0011] In an optional embodiment, multiple interfaces are provided on the first substrate, two of which are respectively connected to the first heat exchange channel and the second flow channel, and the other two interfaces are both connected to the second heat exchange channel. The flow channel connecting the first heat exchange channel and the corresponding interface, and the flow channel connecting the second heat exchange channel and the corresponding two interfaces are both provided in the first substrate.
[0012] Once installed, the liquid cooling distribution unit connects to multiple pipes. The pipes connected to the first baseplate can be connected to corresponding interfaces. After entering the first baseplate, the liquid in the pipes flows through the flow channels within the first baseplate and then into various components. The flow channels connecting multiple components to the corresponding interfaces are all located within the first baseplate, further reducing the integration of the flow channels within the first baseplate and the use of stainless steel pipes, which in turn further reduces the size of the liquid cooling distribution unit.
[0013] In an optional embodiment, the first substrate extends along a first direction, the first direction is perpendicular to a thickness direction of the first substrate, and the multiple interfaces are arranged at the same end of the first substrate in the first direction.
[0014] Multiple interfaces are located at the same end of the first baseplate along its length. When installing a liquid cooling distribution unit in a device (e.g., a cabinet server), the end of the first baseplate with the interfaces can be plugged into the corresponding pipes within the device, facilitating installation of the unit. Furthermore, when the liquid cooling distribution units are backed up as a whole, multiple units can be arranged side by side along the width of the device, saving installation space within the device and facilitating the layout of the units.
[0015] In an optional embodiment, quick connectors are provided on each of the multiple interfaces.
[0016] The interface equipped with a quick connector facilitates the assembly and disassembly of the pipes. When the first baseplate needs to be removed, the quick connector can be disconnected, separating the first baseplate from the multiple pipes connected to it, making it easier for the operator to remove the first baseplate and the components thereon (e.g., the heat exchanger, the first liquid pump, etc.). In addition, the first liquid pump and the heat exchanger are both integrated on the first baseplate. When the first baseplate is removed, the liquid in the first liquid pump will flow into the first and second flow channels, and the liquid in the heat exchanger will also flow into the corresponding flow channels (all of the above flow channels are provided within the first baseplate), reducing the possibility of liquid spillage.
[0017] In an optional embodiment, the heat exchanger and the first liquid pump are located on the same side of the first substrate in its thickness direction.
[0018] The first liquid pump and heat exchanger are both located on the same side of the first baseplate. For example, after the liquid-cooling distribution unit is installed, the first liquid pump and heat exchanger are both located above the first baseplate. The first baseplate can serve as a base for multiple components on it, facilitating the stable placement of the liquid-cooling distribution unit. Multiple flow channels are integrated into the first baseplate, meaning they are located on the same side as the heat exchanger, first liquid pump, and other components, facilitating component installation.
[0019] In an optional embodiment, the liquid cooling distribution unit further includes a second substrate, the heat exchanger is arranged on the side of the first substrate or the second substrate, a second liquid pump is provided on the second substrate, and the second liquid pump is connected to the first heat exchange channel.
[0020] One of the first and second substrates is in use, while the other is in standby. For example, when the first substrate is in use, the first liquid pump drives liquid (e.g., coolant) to flow through the flow channel and the first heat exchange channel, while the second substrate is in standby. If the first substrate or a component on the first substrate is damaged, the first substrate and the component on it can be repaired. During this repair, the second substrate and the second liquid pump are used. When the second substrate is in use, the second liquid pump drives liquid to flow within the second substrate and the first heat exchange channel. The alternating operation of the first and second liquid pumps allows the liquid cooling distribution unit to operate continuously, improving the operational stability of the liquid cooling distribution unit.
[0021] In an optional embodiment, the first substrate and the second substrate are arranged side by side, and the heat exchanger extends along the distribution direction of the first substrate and the second substrate.
[0022] The first substrate and the second substrate are arranged side by side, which is beneficial to the arrangement of the first substrate and the second substrate, and the extension direction of the heat exchanger is parallel to the distribution direction of the first substrate and the second substrate, so that the first substrate and the second substrate are both arranged opposite the heat exchanger, which facilitates the connection of the first substrate and the second substrate to the heat exchanger respectively.
[0023] In an optional embodiment, two first interfaces are provided on the side of the first substrate facing the heat exchanger, the flow channel includes a first flow channel and a second flow channel connected through a first liquid pump, the first flow channel and the second flow channel are each connected to a first interface, and two second interfaces are provided on the side of the second substrate facing the heat exchanger, the two second interfaces are respectively connected to the second liquid pump through different flow channels provided in the second substrate, and each first interface and each second interface are provided with a quick connector.
[0024] When it is necessary to install the first substrate, the end of the first substrate provided with the first interface is directed toward the heat exchanger, and the first substrate can be quickly connected to the heat exchanger by connecting the quick connector. Similarly, when it is necessary to install the second substrate, the end of the second substrate provided with the second interface is directed toward the heat exchanger, and the second substrate can be connected to the heat exchanger by connecting the quick connector. When it is necessary to disassemble the first substrate or the second substrate, the quick connector is released, and the first substrate or the second substrate is pulled out toward the side away from the heat exchanger. In addition, the flow channels connecting the first liquid pump and the corresponding first interface are both provided in the first substrate, and the flow channels connecting the second liquid pump and the corresponding second interface are both provided in the second substrate, so that the integration of the flow channels in the first substrate and the second substrate is higher, the use of stainless steel pipes is further reduced, and the volume of the liquid cooling distribution unit is further reduced, saving installation space.
[0025] In an optional embodiment, a second liquid pump is provided on the surface of the first substrate facing away from the first liquid pump, the second liquid pump is connected to the first heat exchange channel, and a flow channel connecting the second liquid pump and the first heat exchange channel is provided in the first substrate.
[0026] A first liquid pump and a second liquid pump are simultaneously installed on the first substrate. One of the first and second liquid pumps is in use, while the other is in standby. For example, when the first liquid pump is in use, it drives liquid through the flow channel and the first heat exchange channel, while the second liquid pump is in standby. If the first liquid pump fails, the second liquid pump is used to drive liquid through the corresponding flow channel and the first heat exchange channel within the first substrate. The first and second liquid pumps operate alternately, allowing the liquid cooling distribution unit to operate continuously.
[0027] In an optional embodiment, the first liquid pump is fixedly connected to the first substrate by multiple bolts. A boss is provided on the first substrate, the first liquid pump is provided on the boss, multiple bolts pass through the boss, and a chamber connecting the flow channel and the first liquid pump is provided in the boss.
[0028] The first liquid pump is secured to the first baseplate via bolts. The bolts pass through the first liquid pump and thread into the first baseplate. The provision of a boss increases the local thickness of the bolt connection, allowing the bolts to pass through the first liquid pump and boss before threading into the first baseplate, further stabilizing the connection between the first liquid pump and the first baseplate. Furthermore, the chamber connecting the first liquid pump and the flow channel is located within the boss, further enhancing the integration of the liquid cooling distribution unit's flow channels and facilitating liquid flow between the first liquid pump and the flow channel.
[0029] In an optional embodiment, other devices are further provided on the first substrate, the other devices are connected to the flow channel, and the flow channel connecting the other devices and the flow channel is provided in the first substrate. The other devices include one of a fluid replenishing tank, an expansion tank, and a sensor.
[0030] The connections between components may have gaps, and liquid may leak during flow. Therefore, a refill tank and a refill pump can be installed on the first substrate. The refill tank stores spare liquid. If the liquid leaks, the refill pump can replenish the spare liquid in the refill tank into the flow channel. In addition, an expansion tank and sensors (hydraulic sensors, temperature sensors, temperature and pressure sensors, etc.) can also be installed on the first substrate. After the liquid cooling distribution unit is installed in the liquid cooling system, if there is a blockage somewhere in the system, the hydraulic pressure will increase, and some liquid will be pressed into the expansion tank, thereby reducing the hydraulic pressure in the system. When a leak occurs somewhere in the system, the hydraulic pressure will decrease, and the liquid in the expansion tank will be pressed into the system to adjust the hydraulic pressure in the system.
[0031] According to a second aspect of the present application, a cabinet is provided. The cabinet includes a cabinet body and the above-mentioned liquid cooling distribution unit. A receiving cavity is provided in the cabinet body, and the liquid cooling distribution unit is provided in the receiving cavity.
[0032] The use of the liquid distribution unit of the present application in the cabinet reduces the use of stainless steel pipes, makes the liquid cooling distribution unit more integrated, and saves space inside the cabinet. In this way, more devices in the liquid cooling distribution unit can be backed up, which improves the stability of the operation of the liquid distribution unit, makes the cooling effect of the cabinet better, and is conducive to the normal operation of the liquid cooling system inside the cabinet. In addition, the first liquid pump is integrated on the first substrate. When the first liquid pump needs to be replaced or disassembled, the entire first substrate can be removed, making the disassembly process more convenient. When the first substrate is removed, the liquid in the first liquid pump will enter the flow channel, reducing the possibility of the liquid flowing to the outside world and affecting the cabinet. In addition, the cabinet provided by the present application includes the above-mentioned liquid cooling distribution unit. Therefore, the cabinet provided by the present application and the liquid cooling distribution unit of the above-mentioned technical solution can solve the same technical problems and have the same technical effects, which will not be repeated here.
[0033] In an optional embodiment, the heat exchanger is arranged on a first substrate, a plurality of interfaces are provided on the first substrate, an inspection port communicating with the accommodating cavity is provided on the front of the cabinet, and the plurality of interfaces are arranged on a side of the first substrate away from the inspection port.
[0034] When the first substrate needs to be removed from the accommodating cavity, it can be removed from the inspection port on the front of the cabinet. Since each pipe is detachably connected to the corresponding interface, the first substrate can be quickly separated from the multiple pipes by disassembly, making it easier for the operator to remove the first substrate and the components thereon (for example, the heat exchanger, the first liquid pump, etc.). In addition, the first liquid pump and the heat exchanger are both integrated on the first substrate. When the first substrate is removed, the liquid in the first liquid pump and the heat exchanger will flow into the first substrate, reducing the possibility of the liquid flowing to the outside. The staff can inspect the first substrate and the components thereon near the cabinet without having to move away from the cabinet for inspection due to concerns about large amounts of liquid spilling, making the inspection of the liquid cooling distribution unit more convenient.
[0035] In an optional embodiment, the liquid cooling distribution unit also includes a second substrate, the first substrate and the second substrate are arranged side by side in the width direction of the cabinet, a maintenance port connected to the accommodating cavity is provided on the front of the cabinet, and the heat exchanger is arranged on the side of the first substrate and the second substrate away from the maintenance port.
[0036] Both the first and second baseplates are located closer to the maintenance access than the heat exchanger. When one baseplate (the first or second) needs to be replaced or repaired, it can be removed from the front of the cabinet, making maintenance of the liquid cooling distribution unit more convenient. To install the first or second baseplate, simply point the end of the first baseplate with the first interface or the end of the second baseplate with the second interface toward the heat exchanger for quick insertion.
[0037] A third aspect of the present application provides a cabinet server, which includes a server, a liquid cooling plate for cooling the server, and the above-mentioned cabinet. The server is installed in the cabinet, and a cooling channel for flowing coolant is provided in the liquid cooling plate. The cooling channel, the first heat exchange channel, and the flow channel are connected, and the second heat exchange channel is used to communicate with a cold source outside the cabinet.
[0038] The coolant (e.g., water) in the liquid cooling plate cools the servers. After cooling the servers, the coolant reaches a higher temperature. Driven by a first liquid pump, the coolant flows through the first heat exchange channel. Simultaneously, a cooling source external to the cabinet delivers a cooling medium (e.g., water) to the second heat exchange channel. The liquid in the second heat exchange channel (the cooling medium from the external cooling source) exchanges heat with the liquid in the first heat exchange channel (the coolant in the liquid cooling plate), cooling the higher-temperature coolant to a lower-temperature coolant. Driven by the first liquid pump, the lower-temperature coolant flows back into the liquid cooling plate, continuing to cool the servers, forming a liquid cooling cycle.
[0039] When the coolant flows, it will pass through the flow channel. The flow channel is integrated into the first substrate, which reduces the use of stainless steel pipes. The first liquid pump is set on the first substrate, which also makes the integration of the liquid cooling distribution unit higher and saves space inside the cabinet. In this way, more devices in the liquid cooling distribution unit can be backed up, which improves the stability of the liquid cooling system operation in the cabinet server, makes the cooling effect better, and is conducive to the normal operation of the server. In addition, the first liquid pump is integrated on the first substrate. When the first liquid pump needs to be replaced or disassembled, the entire first substrate can be removed, making the disassembly process more convenient. When the first substrate is removed, the liquid in the first liquid pump will enter the flow channel, reducing the possibility of the liquid flowing to the outside world and affecting the normal operation of the cabinet server. In addition, the cabinet server provided in this application includes the above-mentioned liquid cooling distribution unit. Therefore, the cabinet server provided in this application and the liquid cooling distribution unit of the above-mentioned technical solution can solve the same technical problems and have the same technical effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0040] FIG1 is a schematic structural diagram of a cabinet server provided in an embodiment of the present application;
[0041] FIG2 is a schematic diagram of the structure of a server provided in an embodiment of the present application;
[0042] FIG3 is a schematic structural diagram of a liquid cooling distribution unit provided in an embodiment of the present application;
[0043] FIG4 is a schematic diagram of a flow path of a liquid cooling distribution unit provided in an embodiment of the present application;
[0044] FIG5 is a schematic structural diagram of an interface of a liquid cooling distribution unit provided in an embodiment of the present application;
[0045] FIG6 is a schematic structural diagram of another cabinet server provided in an embodiment of the present application;
[0046] FIG7 is a schematic diagram of pipeline connections of another cabinet server provided in an embodiment of the present application;
[0047] FIG8 is a schematic structural diagram of another liquid cooling distribution unit provided in an embodiment of the present application;
[0048] FIG9 is a schematic diagram of a flow path of another liquid cooling distribution unit provided in an embodiment of the present application;
[0049] FIG10 is a schematic structural diagram of another cabinet server provided in an embodiment of the present application.
[0050] Reference numerals: 100 - cabinet server; 110 - cabinet; 1100 - cabinet body; 1101 - installation cavity; 1102 - accommodation cavity; 1103 - access port; 120 - server; 1201 - housing; 1202 - circuit board; 1203 - electronic components; 130 - liquid cooling plate; 1301 - cooling channel; 1302 - cooling liquid inlet; 1303 - cooling liquid outlet; 140 - liquid cooling distribution unit; 1 - heat exchanger; 11 - first heat exchange channel; 12 - second heat exchange channel; 2 - first substrate; 21 - first flow channel; 22 - second flow channel; 23 - third flow channel; 24 - fourth flow channel; 25 - fifth flow channel; 26 - eighth flow channel; 27 - ninth flow channel; 28 - tenth flow channel; 29 - interface; 291 - first interface; 292 - second interface; 201 - first mounting port; 202 - second mounting port; 31 - first liquid pump; 32 - third liquid pump; 33 - fluid replenishing tank; 34 - expansion tank; 35 - sensor; 36 - boss; 4-Pipeline; 41-First Pipe; 411-First Main Pipe; 412-First Branch Pipe; 42-Second Pipe; 421-Second Main Pipe; 422-Second Branch Pipe; 43-Third Pipe; 431-Third Main Pipe; 432-Third Branch Pipe; 44-Fourth Pipe; 441-Fourth Main Pipe; 442-Fourth Branch Pipe; 45-Fifth Pipe; 451-Fifth Main Pipe; 452-Fifth Branch Pipe; 46-Sixth Pipe; 461-Sixth Main Pipe; 462-Sixth Branch Pipe; 47-Seventh Pipe; 48-Eighth Pipe; 49-Ninth Pipe; 5-Second Base Plate; 51-Sixth Flow Channel; 52-Seventh Flow Channel; 53-Second Liquid Pump; 6-Quick Connector; 200-Cold Source; 210-Liquid Supply Channel; 220-Liquid Return Channel. DETAILED DESCRIPTION
[0051] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.
[0052] In the present application, unless otherwise expressly specified and limited, the directions or positional relationships indicated by terms such as "upper", "lower", "front", and "back" may be defined, including but not limited to, the directions relative to the schematic placement of components in the accompanying drawings. These directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the placement of components in the accompanying drawings, and shall not be understood as limitations on the present application.
[0053] In this application, the terms "first," "second," etc., are used solely for descriptive purposes to distinguish one element from another and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.
[0054] In this application, unless otherwise clearly defined or specified, “multiple” means two or more.
[0055] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, when describing pipelines or channels, the "connected" and "connected" used in this application have the meaning of conduction. The specific meaning needs to be understood in conjunction with the context.
[0056] Furthermore, in this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0057] An embodiment of the present application provides a cabinet server 100, with reference to FIG1 , which exemplarily shows the structure of the cabinet server 100. The exemplary cabinet server 100 includes a cabinet 110 and a server 120. The cabinet 110 can be any structure capable of storing the server 120. The server 120 is a type of computer, but runs faster and has a higher load than an ordinary computer. The server 120 provides computing or application services to other clients (such as PCs, smart phones, and other terminals) in the network. The server 120 (for example, the server 120 marked with shadows in FIG1 ) is installed in the cabinet 110.
[0058] In addition, the cabinet server 100 may further include a liquid cooling plate 130. FIG2 exemplarily illustrates the structure of the liquid cooling plate 130. The liquid cooling plate 130 contacts the server 120 and is used to cool the server 120. In one example, the liquid cooling plate 130 may be disposed within the housing 1201 of the server 120 and may contact electronic components 1203 (e.g., chips) on the circuit board 1202 of the server 120. In other examples, the liquid cooling plate 130 may be disposed outside the server 120, contacting the housing 1201 of the server 120.
[0059] To achieve cooling, the liquid cooling plate 130 is provided with a cooling channel 1301 for the flow of coolant. Coolant flows within cooling channel 1301. Cooling channel 1301 can be a channel disposed within the liquid cooling plate 130. Cooling channel 1301 can be an S-shaped channel, a serpentine channel, or an irregularly shaped channel, and this application does not impose specific limitations on this. Furthermore, referring to FIG2 , to allow coolant to flow into or out of the liquid cooling plate 130, the liquid cooling plate 130 is provided with a coolant inlet 1302 and a coolant outlet 1303 that communicate with cooling channel 1301.
[0060] The present application provides a cabinet 110. Referring to FIG. 1 , the exemplary cabinet 110 includes a cabinet body 1100 and a chill water distribution unit (CDU) 140. The chill water distribution unit 140 is disposed within the cabinet body 1100. The cabinet body 1100 includes a mounting cavity 1101 for accommodating a server 120 and a receiving cavity 1102 for accommodating the chill water distribution unit 140. The receiving cavity 1102 can be located below the mounting cavity 1101, for example, at the bottom of the cabinet body 1100. That is, the chill water distribution unit 140 is disposed at the bottom of the cabinet body 1100.
[0061] The present application provides a liquid cooling distribution unit 140 , and with reference to FIG3 , FIG3 exemplarily shows a liquid cooling distribution unit 140 . The liquid cooling distribution unit 140 includes a plurality of components, including a heat exchanger 1 and a first substrate 2 .
[0062] FIG4 exemplarily illustrates a flow path of a liquid-cooling distribution unit 140. Referring to FIG4 , the heat exchanger 1 includes a first heat exchange channel 11 and a second heat exchange channel 12 for heat exchange. The broken line adjacent to the number "11" in FIG4 represents the first heat exchange channel, and the broken line adjacent to the number "12" in FIG4 represents the second heat exchange channel. In the heat exchanger 1, the liquid flowing through the first heat exchange channel 11 can exchange heat with the liquid flowing through the second heat exchange channel 12. The shapes and paths of the first heat exchange channel 11 and the second heat exchange channel 12 can be configured as required. For example, the first heat exchange channel 11 and the second heat exchange channel 12 can both be serpentine channels, and this application does not impose any specific restrictions on this.
[0063] The cooling system in the cabinet server 100 includes a first circulation loop and a second circulation loop.
[0064] First heat exchange channel 11 is in communication with cooling channel 1301. A first circulation loop includes first heat exchange channel 11 and cooling channel 1301. For example, referring to Figures 2 and 4, the outlet of first heat exchange channel 11 is in communication with coolant inlet 1302 (e.g., via pipe 4), and coolant outlet 1303 is in communication with the inlet of first heat exchange channel 11 (e.g., via pipe 4). Coolant (e.g., water) flows between first heat exchange channel 11 and cooling channel 1301, that is, the coolant can flow along the first circulation loop.
[0065] The second heat exchange channel 12 is used to communicate with the cold source 200 outside the cabinet 1100 to form a second circulation loop. For example, referring to Figures 1 and 4, the cold source 200 outside the cabinet 1100 includes a liquid supply channel 210 and a liquid return channel 220. The inlet of the second heat exchange channel 12 is connected to the liquid supply channel 210 (for example, via pipe 4), and the outlet of the second heat exchange channel 12 is connected to the liquid return channel 220 (for example, via pipe 4). The cooling medium (for example, water) transported by the cold source 200 can flow from the liquid supply channel 210 to the second heat exchange channel 12, and then from the second heat exchange channel 12 to the liquid return channel 220. In other words, the cooling medium can flow along the second circulation loop.
[0066] The coolant in the liquid cooling plate 130 cools the server 120. After cooling the server 120, the coolant reaches a higher temperature. The coolant flows along a first circulation loop and through the first heat exchange channel 11. Simultaneously, a cold source 200 outside the cabinet 1100 causes the cooling medium to flow along a second circulation loop and into the second heat exchange channel 12. The cooling medium in the second heat exchange channel 12 exchanges heat with the coolant in the first heat exchange channel 11, cooling the higher-temperature coolant to a lower temperature. The lower-temperature coolant then flows back into the liquid cooling plate 130 and continues to cool the server 120, completing a liquid cooling cycle.
[0067] 3 and 4 , a first liquid pump 31 is provided on the first substrate 2 and is fixedly connected to the first substrate 2. A flow channel is provided within the first substrate 2, wherein the flow channel may include a first flow channel 21 and a second flow channel 22 connected via the first liquid pump 31. For example, the inlet of the first liquid pump 31 is connected to the first flow channel 21, and the outlet of the first liquid pump 31 is connected to the second flow channel 22. The line below the number "21" in FIG. 4 indicates the first flow channel, and the line below the number "22" in FIG. 4 indicates the second flow channel.
[0068] The first circulation loop includes a first flow channel 21 and a second flow channel 22. The first liquid pump 31 is used to drive the coolant along the first circulation loop. For example, the coolant flowing out of the first heat exchange channel 11 will flow through the first flow channel 21, the first liquid pump 31, and the second flow channel 22 in sequence, and then flow back into the cooling channel 1301. In other examples, the flow channel can be any flow channel within the first substrate 2 that is connected to the first liquid pump 31.
[0069] The present application integrates the flow channel into the first substrate 2, reducing the use of stainless steel pipes between devices (used to connect two devices), which can save the internal space of the cabinet 1100 (using a large number of stainless steel pipes to connect devices will occupy a larger space. For example, in order to ensure that the stainless steel pipes are not broken, the bending radius of the stainless steel pipes is larger, which will occupy a larger space).
[0070] In addition, setting the first liquid pump 31 on the first substrate 2 can also make the liquid cooling distribution unit 140 more integrated. In this way, more devices in the liquid cooling distribution unit 140 can be backed up, thereby improving the stability of the liquid cooling system operation, achieving better liquid cooling effect, and facilitating the normal operation of the server 120.
[0071] In addition, the first liquid pump 31 is integrated on the first substrate 2. When the first liquid pump 31 needs to be replaced or disassembled, the entire first substrate 2 can be removed. When the first substrate 2 is removed, the first liquid pump 31 will be taken out, making the disassembly process more convenient.
[0072] When the first substrate 2 is removed, the liquid in the first liquid pump 31 will flow into the flow channel (for example, the first flow channel 21 and the second flow channel 22), reducing the possibility of the liquid (coolant) flowing to the outside (for example, the data center where the cabinet server 100 is placed). If the liquid in the first liquid pump 31 flows out, there is a possibility of affecting the operation of the cabinet server 100 or the data center. In the related art, for safety reasons, the first liquid pump 31 will be removed and repaired at a distance from the cabinet server 100, for example, outside the data center. However, with the solution of the present application, the liquid in the first liquid pump 31 will flow into the flow channel, thus reducing the possibility of liquid leakage, and maintenance personnel can repair the first liquid pump 31 near the cabinet server 100.
[0073] In some examples, referring to FIG3 , the first liquid pump 31 is fixedly connected to the first substrate 2 via multiple bolts, which pass through the first liquid pump 31 and are threadedly connected to the first substrate 2. A boss 36 is provided on the first substrate 2, and the first liquid pump 31 is mounted on the boss 36. The boss 36 increases the local thickness of the bolt connection location. Multiple bolts sequentially pass through the first liquid pump 31 and the boss 36 before being threadedly connected to the first substrate 2, thereby providing a more stable connection between the first liquid pump 31 and the first substrate 2.
[0074] Furthermore, a chamber (not shown in the drawings) connecting the flow channel and the first liquid pump 31 may be provided within the boss 36. For example, referring to Figures 3 and 4 , the chamber within the boss 36 includes a first chamber and a second chamber. The inlet of the first liquid pump 31 communicates with the first flow channel 21 through the first chamber, and the outlet of the first liquid pump 31 communicates with the second flow channel 22 through the second chamber. The provision of the chamber connecting the first liquid pump 31 and the flow channel within the boss 36 increases the integration of the flow channel of the liquid-cooling distribution unit 140 and facilitates the flow of liquid between the first liquid pump 31 and the flow channel.
[0075] To further improve the integration of the liquid-cooling distribution unit 140, in one embodiment, referring to Figures 3 and 4, the heat exchanger 1 can be disposed on the first substrate 2 (fixed on the first substrate 2). For example, the heat exchanger 1 and the first liquid pump 31 are both disposed on the same side of the first substrate 2, that is, the heat exchanger 1 and the first liquid pump 31 are both fixedly connected to the same surface of the first substrate 2, and the heat exchanger 1 is located to the side of the first liquid pump 31. A third flow channel 23 (a flow channel within the first substrate 2) can be disposed within the first substrate 2. The third flow channel 23 is connected to the first flow channel 21 via the first heat exchange channel 11. That is, one of the inlet and outlet of the first heat exchange channel 11 is connected to the first flow channel 21, and the other is connected to the third flow channel 23.
[0076] For example, the inlet of the first heat exchange channel 11 is connected to the third flow channel 23, and the outlet of the first heat exchange channel 11 is connected to the first flow channel 21. The first circulation loop includes the third flow channel 23, that is, the coolant flows through the third flow channel 23 when flowing along the first circulation loop.
[0077] 3 and 4 , a fourth flow channel 24 and a fifth flow channel 25 (both flow channels within the first substrate 2) may also be provided within the first substrate 2. The fourth flow channel 24 and the fifth flow channel 25 are connected via the second heat exchange channel 12. That is, one of the inlet and outlet of the second heat exchange channel 12 is connected to the fourth flow channel 24, and the other is connected to the fifth flow channel 25. The line below the number "24" in FIG. 4 indicates the fourth flow channel, and the line below the number "25" in FIG. 4 indicates the second flow channel.
[0078] For example, the inlet of the second heat exchange channel 12 is connected to the fourth flow channel 24, and the outlet of the second heat exchange channel 12 is connected to the fifth flow channel 25. When the cooling medium delivered by the cold source 200 flows along the second circulation loop, it flows through the fourth flow channel 24 and the fifth flow channel 25.
[0079] By integrating multiple flow channels (for example, the first flow channel 21, the second flow channel 22, the third flow channel 23, the fourth flow channel 24 and the fifth flow channel 25) in the first substrate 2, the integration of the flow channels on the first substrate 2 is higher. Through high integration, the use of stainless steel pipes is further reduced, and the volume of the liquid cooling distribution unit 140 is further reduced, saving space inside the cabinet 1100.
[0080] The liquid cooling distribution unit 140 has been reduced in size through device integration and flow channel integration. The space saved within the cabinet 1100 can be used for device backup. When a backup of the liquid cooling distribution unit 140 is required, the first substrate 2 and multiple devices thereon (e.g., the first liquid pump 31 and the heat exchanger 1, etc.) can be backed up in a unified manner. That is, multiple liquid cooling distribution units 140 (multiple first substrates 2, each with a first liquid pump 31 and a heat exchanger 1) can be provided. For example, two liquid cooling distribution units 140 can be provided, one in use and the other as a backup, thereby improving the stability of the liquid cooling system.
[0081] In the example where the heat exchanger 1 is disposed on the first substrate 2, there are various ways to connect the heat exchanger 1 and the first substrate 2. In one example provided herein, referring to FIG5 , which exemplarily illustrates a schematic diagram of the connection position between the heat exchanger 1 and the first substrate 2, the heat exchanger 1 can be mounted on the first substrate 2 by mating a mounting head and a mounting port, and communicate with the corresponding flow channel.
[0082] For example, referring to Figures 4 and 5, two first mounting ports 201 are provided on the first substrate 2, and the first flow channel 21 and the third flow channel 23 are each connected to a first mounting port 201. The heat exchanger 1 is provided with two first mounting heads (not shown in the drawings) that are connected to the first heat exchange channel 11. The two first mounting heads are both arranged toward the first substrate 2 and are each connected to a first mounting port 201. For example, each first mounting head is plugged into a corresponding first mounting port 201. In one example, the liquid flowing into the third flow channel 23 flows into the first heat exchange channel 11 through one set of the first mounting heads and the first mounting ports 201, and then flows into the first flow channel 21 through the other set of the first mounting heads and the first mounting ports 201.
[0083] 4 and 5 , two second mounting ports 202 are provided on the first substrate 2, and the fourth flow channel 24 and the fifth flow channel 25 are each connected to a second mounting port 202. The heat exchanger 1 is provided with two second mounting heads (not shown in the drawings) that are connected to the second heat exchange channel 12. Both second mounting heads are disposed toward the first substrate 2 and are each connected to a second mounting port 202. For example, each second mounting head is plugged into a corresponding second mounting port 202. In one example, liquid flowing through the fourth flow channel 24 flows through one set of the second mounting heads and the second mounting port 202 into the second heat exchange channel 12, and then flows through another set of the second mounting heads and the second mounting port 202 into the fifth flow channel 25.
[0084] Similarly, there may be multiple ways to connect the first liquid pump 31 to the first substrate 2. In one example provided in the present application, the first liquid pump 31 may also be installed on the first substrate 2 by means of a mounting head and a mounting port. For example, referring to FIG4 , two third mounting ports (not shown in the accompanying drawings) are provided on the first substrate 2, and the two third mounting ports are respectively connected to the first flow channel 21 and the second flow channel 22. A third mounting head (not shown in the accompanying drawings) is provided at the inlet and outlet of the first liquid pump 31, and each of the two third mounting heads is connected to a third mounting port. For example, each third mounting head is plugged into the corresponding third mounting port.
[0085] In addition, referring to Figures 3 and 4, other devices are also provided on the first substrate 2, and the other devices are connected to the flow channel. In the example where the flow channel includes the first flow channel 21 and the second flow channel 22, the other devices are connected to one of the first flow channel 21 or the second flow channel 22, and the flow channel connecting the other devices and the flow channel is provided in the first substrate 2. The other devices include one of the fluid replenishing tank 33, the expansion tank 34, and the sensor 35 (hydraulic sensor, temperature sensor, temperature and pressure sensor, etc.).
[0086] For example, since the connections between components may have gaps, the coolant may leak as it flows along the first circulation loop, causing the coolant to leak. Therefore, referring to Figures 3 and 4, a third liquid pump 32 and a liquid replenishing tank 33 may be further provided on the first substrate 2. The liquid replenishing tank 33 may store spare coolant.
[0087] In the above example, an eighth flow channel 26 and a ninth flow channel 27 connected by a third liquid pump 32 are provided in the first substrate 2. For example, the inlet of the third liquid pump 32 is connected to the eighth flow channel 26, and the outlet of the third liquid pump 32 is connected to the ninth flow channel 27. The line close to the number "26" in FIG4 refers to the eighth flow channel, and the line to the left of the number "27" in FIG4 refers to the ninth flow channel. The eighth flow channel 26 is connected to the liquid replenishing tank 33, and the ninth flow channel 27 is connected to the flow channel. FIG4 exemplarily shows the situation where the ninth flow channel 27 is connected to the first flow channel 21. A one-way valve can be provided in the ninth flow channel 27. When necessary, the third liquid pump 32 can send the liquid in the liquid replenishing tank 33 (for example, spare coolant) into the first circulation loop.
[0088] There are various ways to connect the third liquid pump 32 to the first substrate 2. In one example provided herein, with reference to FIG4 , the third liquid pump 32 can be mounted on the first substrate 2 by means of a mounting head and a mounting port. For example, the first substrate 2 is provided with two fourth mounting ports (not shown in the drawings), which are connected to the eighth flow channel 26 and the ninth flow channel 27, respectively. The inlet and outlet of the third liquid pump 32 are each provided with a fourth mounting head (not shown in the drawings), and the two fourth mounting heads are each connected to a fourth mounting port. For example, each fourth mounting head is plugged into a corresponding fourth mounting port.
[0089] There are also various ways to connect the liquid replenishing tank 33 to the first substrate 2. In one example provided herein, referring to FIG4 , the liquid replenishing tank 33 can be mounted on the first substrate 2 by means of a mounting head and a mounting port. For example, the first substrate 2 is provided with a fifth mounting port (not shown in the drawings) that communicates with the eighth flow channel 26, and a fifth mounting head (not shown in the drawings) is provided at the outlet of the liquid replenishing tank 33. The fifth mounting head is connected to the fifth mounting port, for example, the fifth mounting head is plugged into the fifth mounting port.
[0090] For another example, referring to Figures 3 and 4 , an expansion tank 34 may be further provided on the first substrate 2, and a tenth flow channel 28 may be provided within the first substrate 2. The line to the left of the number "28" in Figure 4 indicates the tenth flow channel. The expansion tank 34 communicates with the flow channel via the tenth flow channel 28. Figure 4 exemplarily illustrates the communication between the tenth flow channel 28 and the first flow channel 21. The expansion tank 34 is used to regulate the hydraulic pressure of the first circulation loop.
[0091] For example, if there is a blockage somewhere in the first circulation loop, the hydraulic pressure of the first circulation loop will increase, and some of the coolant in the first circulation loop will be pressed into the expansion tank 34, thereby reducing the hydraulic pressure in the first circulation loop. If there is a leak somewhere in the first circulation loop, the hydraulic pressure of the first circulation loop will decrease, and the coolant in the expansion tank 34 will be pressed into the first circulation loop.
[0092] There are also various ways to connect the expansion tank 34 to the first substrate 2. In one example provided herein, referring to Figures 3 and 4, the fluid replenishment tank 33 can be mounted on the first substrate 2 by means of a mounting head and a mounting port. For example, the first substrate 2 is provided with a sixth port (not shown in the drawings) that communicates with the tenth flow channel 28, and the expansion tank 34 is provided with a sixth mounting head (not shown in the drawings), which is connected to the sixth port, for example, by being plugged into the sixth port.
[0093] In the example where both the first liquid pump 31 and the heat exchanger 1 are disposed on the first base plate 2, referring to FIG4, to facilitate simultaneous connection of the first base plate 2 with the liquid cooling plate 130 and the cold source 200, the cabinet server 100 further includes a plurality of pipes 4, wherein the plurality of pipes 4 may include a third pipe 43, a fourth pipe 44, a fifth pipe 45, and a sixth pipe 46. The second flow channel 22, the third flow channel 23, the fourth flow channel 24, and the fifth flow channel 25 are each connected to a pipe 4. For example, the third pipe 43 is connected to the second flow channel 22, the fourth pipe 44 is connected to the third flow channel 23, the fifth pipe 45 is connected to the fourth flow channel 24, and the sixth pipe 46 is connected to the fifth pipe 45.
[0094] 4 , the two pipes 4 respectively connecting the second flow channel 22 and the third flow channel 23 are both connected to the cooling channel 1301, that is, the third pipe 43 and the fourth pipe 44 are both connected to the cooling channel 1301. For example, referring back to FIG2 , the third pipe 43 is connected to the coolant inlet 1302, and the fourth pipe 44 is connected to the coolant outlet 1303. Referring to FIG4 , the two pipes 4 respectively connecting the fourth flow channel 24 and the fifth flow channel 25 are both connected to the cold source 200, that is, the fifth pipe 45 and the sixth pipe 46 are both connected to the cold source 200. For example, referring back to FIG1 , the fifth pipe 45 is connected to the liquid supply channel 210, and the sixth pipe 46 is connected to the liquid return channel 220.
[0095] The server 120 is relatively far from the liquid cooling distribution unit 140. Pipe 4 connects the first base plate 2 to the liquid cooling plate 130, which contacts the server 120. This allows the first circulation loop to pass through two pipes 4 (third pipe 43 and fourth pipe 44), which connect the second flow channel 22 and the third flow channel 23, respectively. For example, the coolant in the liquid cooling plate 130 flows through the fourth pipe 44 into the third flow channel 23, then flows through the first heat exchange channel 11, the first flow channel 21, and the second flow channel 22 before returning to the liquid cooling plate 130 through the third pipe 43.
[0096] Similarly, the first base plate 2 is connected to the cold source 200 outside the cabinet 1100 via the pipe 4, so that the second circulation loop passes through two pipes 4 (the fifth pipe 45 and the sixth pipe 46) that respectively connect the fourth flow channel 24 and the fifth flow channel 25. For example, the cooling medium from the cold source 200 flows into the fourth flow channel 24 through the pipe 4 connected to the fourth flow channel 24, then flows through the second heat exchange channel 12 and the fifth flow channel 25, and then flows back through the sixth pipe 46 connected to the fifth flow channel 25.
[0097] To facilitate connection of the multiple pipes 4 to the first substrate 2, as shown in FIG5 , the first substrate 2 is provided with multiple interfaces 29. FIG5 exemplarily illustrates the structure of the interfaces 29. Referring to FIG4 and FIG5 , two interfaces 29 respectively connect the first heat exchange channel 11 (e.g., through the third channel 23) and the second channel 22, while the other two interfaces 29 each connect to the second heat exchange channel 12 (e.g., through the fourth channel 24 and the fifth channel 25, respectively). The channels connecting the first heat exchange channel 11 with the corresponding interfaces 29 (e.g., the third channel 23) and the channels connecting the second heat exchange channel 12 with the corresponding two interfaces 29 (e.g., the fourth channel 24 and the fifth channel 25) are both provided within the first substrate 2. Referring to FIG4 and FIG5 , the second channel 22, the third channel 23, the fourth channel 24, and the fifth channel 25 each connect to a corresponding interface 29.
[0098] Referring to Figures 4 and 5 , the first substrate 2 extends along a first direction perpendicular to the thickness direction of the first substrate 2. Multiple interfaces 29 are provided at the same end of the first substrate 2 in the first direction. When it is necessary to install a liquid cooling distribution unit 140 in the cabinet server 100, the end of the first substrate 2 provided with the multiple interfaces 29 can be plugged into the corresponding pipe 4 to facilitate installation of the liquid cooling distribution unit 140. Furthermore, when the liquid cooling distribution unit 140 is backed up as a whole, multiple liquid cooling distribution units 140 can be arranged side by side along a second direction, with the first, second, and thickness directions perpendicular to each other. For example, the second direction can be the width direction of the first substrate 2. This saves installation space within the accommodating cavity 1102 and facilitates the arrangement of the liquid cooling distribution units 140.
[0099] To facilitate installation of the first base plate 2, referring to Figures 4 and 5, quick connectors 6 are provided on each of the interfaces 29. Each interface 29 is detachably connected to the end of the corresponding pipe 4 via the quick connector 6. For example, each interface 29 is plugged into the corresponding pipe 4 via the quick connector 6. When the first base plate 2 needs to be separated from the multiple pipes 4, the first base plate 2 can be pulled out of the multiple pipes 4.
[0100] The quick connector 6 is a tool-free connector that allows for connection and disconnection. The quick connector 6 of this application can be a liquid connector or a gas-liquid connector. Furthermore, the quick connector 6 of this application can be any connector capable of achieving the aforementioned functions. For example, the quick connector 6 can be a tie rod connector, a grid card connector, a threaded connector, and so on, and this application does not impose any specific restrictions on this. In other examples, conventional pipe connectors can also be provided on multiple interfaces 29.
[0101] In some examples, multiple quick connectors 6 can be arranged side by side, while in other examples, multiple quick connectors 6 can be staggered to reduce the possibility of interference between the multiple quick connectors 6. In addition, to facilitate connection with the pipe 4, the first substrate 2 is provided with one or more protrusions (e.g., bumps), and some interfaces 29 are provided on the protrusions. The multiple interfaces 29 are staggered to facilitate connection with different pipes 4 with different height differences.
[0102] In addition, referring back to FIG1 , the front of the cabinet 1100 is provided with an inspection port 1103 that communicates with the accommodating cavity 1102. Referring to FIG4 and FIG5 (the arrow 1103 in FIG4 indicates the orientation of the inspection port), each interface 29 is provided on the side of the first substrate 2 facing away from the inspection port 1103. The front of the cabinet 1100 is the side of the cabinet 1100 that generally faces personnel. For example, the cabinet 1100 is provided with a door (not shown in the drawings) for opening or closing the installation cavity 1101. Opening the door facilitates maintenance or disassembly of the server 120. In this case, the side of the cabinet 1100 on which the door is provided is the front of the cabinet 1100. Multiple pipes 4 are provided near the back of the cabinet 1100, and multiple interfaces 29 face the back of the cabinet 1100. In some examples, cables electrically connected to the cabinet server 100 may also extend from the back of the cabinet 1100.
[0103] Multiple pipes 4 connected to the first substrate 2 are respectively connected to the corresponding interfaces 29. When the first substrate 2 needs to be removed from the accommodating cavity 1102, the first substrate 2 can be removed from the inspection port 1103 on the front of the cabinet 1100. Since the pipes 4 are detachably connected to the corresponding interfaces 29, the first substrate 2 can be quickly separated from the multiple pipes 4 by disassembly, which facilitates the operator to remove the first substrate 2 and the devices thereon (for example, the heat exchanger 1, the first liquid pump 31, the liquid replenishing tank 33, the expansion tank 34, etc.).
[0104] In addition, the first liquid pump 31 and the heat exchanger 1 are both integrated on the first substrate 2. When the first substrate 2 is removed, the liquid in the first liquid pump 31 will flow into the flow channel, for example, into the first flow channel 21 and the second flow channel 22, and the liquid in the heat exchanger 1 will also flow into the flow channel in the first substrate 2, for example, into the first flow channel 21, the third flow channel 23, the fourth flow channel 24 and the fifth flow channel 25, thereby reducing the possibility of liquid flowing to the outside. The staff can inspect the first substrate 2 and the devices thereon near the cabinet 1100 without having to go away from the cabinet 1100 for inspection due to concerns about large amounts of liquid overflowing, making the inspection of the liquid cooling distribution unit 140 more convenient.
[0105] In some examples, the back of the cabinet 1100 may also be provided with an opening for maintenance.
[0106] In some examples, multiple liquid-cooling distribution units 140 may be provided within the accommodating cavity 1102. For example, referring to FIG. 6 , FIG. 6 exemplarily illustrates a structure in which two liquid-cooling distribution units 140 are provided within the accommodating cavity 1102, with the two liquid-cooling distribution units 140 distributed along the second direction. Each liquid-cooling distribution unit 140 includes a first substrate 2 , on which components such as the heat exchanger 1 , the first liquid pump 31 , the third liquid pump 32 , the liquid replenishing tank 33 , and the expansion tank 34 may be provided.
[0107] Referring to Figure 7, Figure 7 exemplarily shows the positional relationship of the two liquid-cooling distribution units 140. The two liquid-cooling distribution units 140 are arranged side by side along the second direction, and the multiple interfaces 29 on each first substrate 2 (refer to Figure 5) are all arranged on the side away from the inspection port 1103 (the arrow 1103 in Figure 7 indicates the orientation of the inspection port).
[0108] In the example where two liquid-cooling distribution units 140 are disposed in the accommodating cavity 1102 , the pipeline 4 may be connected in the form of a main pipe and branch pipes.
[0109] For example, with reference to FIG7 , the third pipe 43 includes a third main pipe 431 and two third branches 432. One end of the third main pipe 431 is connected to the cooling channel 1301, and the other end is connected to the two third branches 432. The two third branches 432 are respectively connected to the two second flow channels 22 (with auxiliary reference to FIG4 ). The fourth pipe 44 includes a fourth main pipe 441 and two fourth branches 442. One end of the fourth main pipe 441 is connected to the cooling channel 1301, and the other end is connected to the two fourth branches 442. The two fourth branches 442 are respectively connected to the two third flow channels 23 (with auxiliary reference to FIG4 ). The fifth pipe 45 includes a fifth main pipe 451 and two fifth branches 452. One end of the fifth main pipe 451 is connected to the cold source 200, and the other end is connected to the two fifth branches 452. The two fifth branches 452 are respectively connected to the two fourth flow channels 24 (with auxiliary reference to FIG4 ). The sixth pipe 46 includes a sixth main pipe 461 and two sixth branch pipes 462. One end of the sixth main pipe 461 is connected to the cold source 200, and the other end is connected to the two sixth branch pipes 462. The two sixth branch pipes 462 are respectively connected to the two fifth flow channels 25 (see Figure 4 for auxiliary reference).
[0110] In another embodiment, referring to FIG8 , another liquid-cooling distribution unit 140 is exemplarily shown. The liquid-cooling distribution unit 140 further includes a second substrate 5. In this example, both the first substrate 2 and the second substrate 5 are disposed within the accommodating cavity 1102, and the heat exchanger 1 is not disposed on the first substrate 2, nor on the second substrate 5.
[0111] In one example, referring to FIG8 , the first substrate 2 and the second substrate 5 are arranged side by side along the second direction, which facilitates the arrangement of the first substrate 2 and the second substrate 5. The heat exchanger 1 extends along the distribution direction of the first substrate 2 and the second substrate 5, so that the first substrate 2 and the second substrate 5 are both arranged directly opposite the heat exchanger 1, facilitating the connection of the first substrate 2 and the second substrate 5 to the heat exchanger 1. In other examples, the heat exchanger 1 can also be arranged to the side of either the first substrate 2 or the second substrate 5.
[0112] Among them, a second liquid pump 53 is provided on the second substrate 5. Referring to Figure 9, Figure 9 exemplarily shows the flow path of this type of liquid cooling distribution unit 140. A sixth flow channel 51 and a seventh flow channel 52 connected by the second liquid pump 53 are provided in the second substrate 5. Among them, the line above the number "51" in Figure 9 refers to the sixth flow channel, and the line to the right of the number "52" in Figure 8 refers to the seventh flow channel.
[0113] In the above embodiment, the cabinet server 100 also includes a third circulation loop, which includes the first heat exchange channel 11, the cooling channel 1301, the sixth flow channel 51, and the seventh flow channel 52. The second liquid pump 53 is used to drive the coolant along the third circulation loop. In other words, both the first and third circulation loops include the liquid cooling plate 130 and the first heat exchange channel 11, but they follow different paths: the first circulation loop passes through the first base plate 2, while the third circulation loop passes through the second base plate 5.
[0114] The first and second substrates 2 and 5 are provided simultaneously, allowing one to be used while the other remains in reserve. For example, when the first substrate 2 is in use, the first liquid pump 31 drives the coolant along the first circulation loop. If the first substrate 2 or a component on it is damaged, the second substrate 5 can be used. When the second substrate 5 is in use, the second liquid pump 53 on the second substrate 5 drives the coolant along the third circulation loop, allowing the liquid cooling distribution unit 140 to operate continuously and improving the stability of the liquid cooling system.
[0115] In the above example, referring to Figure 9, the cabinet server 100 includes multiple pipes 4, and the multiple pipes 4 include a first pipe 41 and a second pipe 42, wherein the first pipe 41 includes a first main pipe 411 and multiple first branch pipes 412 (Figure 9 shows the case of two first branch pipes 412), one end of the first main pipe 411 is connected to the first heat exchange channel 11, and the other end is connected to the multiple first branch pipes 412, and the first flow channel 21 and the sixth flow channel 51 are each connected to a first branch pipe 412.
[0116] 9 , the second pipe 42 includes a second main pipe 421 and a plurality of second branch pipes 422 ( FIG. 9 shows a case where two second branch pipes 422 are shown). One end of the second main pipe 421 is connected to the coolant inlet 1302 of the cooling channel 1301 , and the other end is connected to the plurality of second branch pipes 422 . The second flow channel 22 and the seventh flow channel 52 are each connected to a second branch pipe 422 .
[0117] When the first substrate 2 is in use, the coolant passes through the first branch pipe 412 connected to the first flow channel 21 and the second branch pipe 422 connected to the second flow channel 22. When the second substrate 5 is in use, the coolant passes through the first branch pipe 412 connected to the sixth flow channel 51 and the second branch pipe 422 connected to the seventh flow channel 52.
[0118] In addition, the multiple pipes 4 also include a seventh pipe 47, an eighth pipe 48 and a ninth pipe 49, wherein the seventh pipe 47 connects the first heat exchange channel 11 and the cooling channel 1301 (connected to the coolant outlet 1303), the eighth pipe 48 connects the second heat exchange channel 12 and the liquid supply channel 210, and the ninth pipe 49 connects the second heat exchange channel 12 and the liquid return channel 220.
[0119] That is, the first circulation loop includes the cooling channel 1301, the seventh pipe 47, the first heat exchange channel 11, the first main pipe 411, the first branch pipe 412 connected to the first flow channel 21, the first flow channel 21, the second flow channel 22, the second branch pipe 422 connected to the second flow channel 22, and the second main pipe 421. The third circulation loop includes the cooling channel 1301, the seventh pipe 47, the first heat exchange channel 11, the first main pipe 411, the first branch pipe 412 connected to the sixth flow channel 51, the sixth flow channel 51, the seventh flow channel 52, the second branch pipe 422 connected to the seventh flow channel 52, and the second main pipe 421.
[0120] In order to facilitate the communication between the first substrate 2 and the second substrate 5 and the corresponding pipes 4 respectively, referring to Figures 8 and 9, two first interfaces 291 are provided on the side of the first substrate 2 facing the heat exchanger 1, and the first flow channel 21 and the second flow channel 22 are each connected to one first interface 291. Two second interfaces 292 are provided on the side of the second substrate 5 facing the heat exchanger 1. The two second interfaces 292 are respectively connected to the second liquid pump 53 through different flow channels (the sixth flow channel 51 and the seventh flow channel 52) provided in the second substrate 5. A quick connector 6 is provided on each first interface 291 and each second interface 292.
[0121] The pipe 4 connected to the first substrate 2 is detachably connected to the corresponding first interface 291 on the first substrate 2 through a quick connector 6. For example, one of the first branches 412 is detachably connected to the first interface 291 connected to the first flow channel 21 through a quick connector 6, and one of the second branches 422 is detachably connected to the first interface 291 connected to the second flow channel 22 through a quick connector 6.
[0122] The pipe 4 connected to the second substrate 5 is detachably connected to the corresponding second interface 292 on the second substrate 5 through a quick connector 6. For example, another first branch pipe 412 is detachably connected to the second interface 292 connected to the sixth flow channel 51 through a quick connector 6, and another second branch pipe 422 is detachably connected to the second interface 292 connected to the seventh flow channel 52 through a quick connector 6.
[0123] When the first base plate 2 needs to be installed, the end of the first base plate 2 provided with the first interface 291 is directed toward the heat exchanger 1, and the first base plate 2 and the heat exchanger 1 are quickly connected by the quick connector 6. Similarly, when the second base plate 5 needs to be installed, the end of the second base plate 5 provided with the second interface 292 is directed toward the heat exchanger 1, and the second base plate 5 and the heat exchanger 1 are connected by the quick connector 6.
[0124] To remove the first baseplate 2 or the second baseplate 5, simply disconnect the quick connector 6 and remove the first baseplate 2 or the second baseplate 5 toward the side facing away from the heat exchanger 1. Furthermore, the flow passages connecting the first liquid pump 31 and the corresponding first interface 291 are both located within the first baseplate 2, and the flow passages connecting the second liquid pump 53 and the corresponding second interface 292 are both located within the second baseplate 5. This further reduces the use of stainless steel pipes and the size of the liquid cooling distribution unit 140 by increasing the integration of the flow passages within the first and second baseplates 2 and 5.
[0125] The quick connector 6 is a connector that can be connected or disconnected without tools. In other examples, an ordinary pipe connector can be provided on each first interface 291 and each second interface 292 .
[0126] To facilitate removal of the first and second base plates 2, 5, they are arranged side by side in the width direction of the cabinet 1100. The width direction of the cabinet 1100 is the horizontal direction when facing the front of the cabinet 1100. For example, the width direction of the cabinet 1100 is parallel to the second direction. The heat exchanger 1 is arranged on the side of the first or second base plate 2 or 5 facing away from the inspection port 1103 (arrow 1103 in FIG. 9 indicates the orientation of the inspection port). In other words, the heat exchanger 1 is arranged near the back of the cabinet 1100.
[0127] It should be noted that the first substrate 2 and the second substrate 5 are both closer to the inspection port 1103 than the heat exchanger 1. When the first substrate 2 or the second substrate 5 needs to be replaced, the substrate (first substrate 2 or second substrate 5) to be replaced can be taken out from the front of the cabinet 1100, making the inspection of the liquid cooling distribution unit 140 more convenient.
[0128] In some examples, the second substrate 5 may also be provided with components such as a fluid replenishment tank 33 and an expansion tank 34, or the second substrate 5 and the components thereon may have the same structure as the first substrate 2 and the components thereon. Furthermore, the components on the second substrate 5 may also be connected to the second substrate 5 via the cooperation of mounting heads and mounting ports. This method is similar to the connection method for the components on the first substrate 2, and therefore will not be further described in this application.
[0129] In another embodiment, referring to Figure 10, Figure 10 exemplarily shows the structure of another cabinet server 100, the first substrate 2 can be placed vertically in the accommodating cavity 1102, the thickness direction of the first substrate 2 is parallel to the width direction of the cabinet 1100, and the second liquid pump 53 is arranged on the surface of the first substrate 2 facing away from the first liquid pump 31, that is, the first liquid pump 31 and the second liquid pump 53 are located on both sides of the first substrate 2, for example, the first liquid pump 31 and the second liquid pump 53 are located on different sides of the first substrate 2 in the thickness direction, the second liquid pump 53 is connected to the first heat exchange channel 11, and the flow channel connecting the second liquid pump 53 and the first heat exchange channel 11 is arranged in the first substrate 2.
[0130] In the above embodiment, one of the first liquid pump 31 and the second liquid pump 53 is in use, while the other is in standby. For example, when the first liquid pump 31 is in use, it drives the liquid through the flow channel and the first heat exchange channel 11 (that is, flows in the first circulation loop), while the second liquid pump 53 is in standby. If the first liquid pump 31 fails, the second liquid pump 53 is used to drive the liquid to circulate through the corresponding flow channels within the first substrate 2, the first heat exchange channel 11, and the cooling channel 1301. The alternating operation of the first liquid pump 31 and the second liquid pump 53 allows the liquid cooling distribution unit 140 to operate continuously.
[0131] In other embodiments, each liquid-cooling distribution unit 140 includes a heat exchanger 1 and a first base plate 2 , and the heat exchanger 1 is disposed on the side of the first base plate 2 .
[0132] In some examples, referring back to Figure 1 , in addition to the server 120 of the present application, other servers are also installed within the cabinet 1100, with multiple servers arranged vertically. Furthermore, each of these other servers is also in contact with a liquid cooling plate. The liquid cooling distribution unit 140 of the present application can achieve cooling circulation between multiple liquid cooling plates by providing a main pipe and branch pipes.
[0133] In the present application, the cold source 200 outside the cabinet 1100 may be an external structure for providing a cooling medium.
[0134] In the present application, the flow channels (e.g., the first flow channel 21, the second flow channel 22, the third flow channel 23, ...) are channels for liquid flow. The flow channels in the drawings are replaced by line segments only for ease of understanding and are not a limitation on the structure and shape of the flow channels.
[0135] In this application, the arrows on the flow channel and pipe 4 exemplarily indicate the flow direction of the internal liquid. This should be understood as an example of a flow direction and not as a limitation on the flow direction of the liquid in this application. In other examples, all flow directions can be set in the opposite direction to the flow direction shown in the drawings. For example, in the example shown in Figure 3, the first liquid pump 31 is located downstream of the heat exchanger 1. In other examples, the first liquid pump 31 can be located upstream of the heat exchanger 1.
[0136] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. A liquid cooling distribution unit, characterized in that: comprising a first substrate and a heat exchanger, A first liquid pump is provided on the first substrate, and a flow channel connected to the first liquid pump is provided in the first substrate; The heat exchanger is disposed on the first substrate, or on the side of the first substrate. A first heat exchange channel and a second heat exchange channel for heat exchange are disposed in the heat exchanger, and the first heat exchange channel is communicated with the flow channel.
2. The liquid cooling distribution unit according to claim 1, characterized in that: The heat exchanger is disposed on the first substrate. The flow channel includes a first flow channel and a second flow channel connected through the first liquid pump. The first heat exchange channel is connected to the first liquid pump through the first flow channel.
3. The liquid cooling distribution unit according to claim 2, characterized in that: The first substrate is provided with a plurality of interfaces, two of which are connected to the first heat exchange channel and the second flow channel respectively, and the other two interfaces are both connected to the second heat exchange channel. The flow channel connecting the first heat exchange channel and the corresponding interface, and the flow channel connecting the second heat exchange channel and the two corresponding interfaces are both provided in the first substrate.
4. The liquid cooling distribution unit according to claim 3, characterized in that: The first substrate extends along a first direction, which is perpendicular to a thickness direction of the first substrate. The multiple interfaces are arranged at a same end of the first substrate in the first direction.
5. The liquid cooling distribution unit according to claim 3 or 4, characterized in that: The multiple interfaces are all provided with quick connectors.
6. The liquid cooling distribution unit according to any one of claims 3 to 5, characterized in that: The heat exchanger and the first liquid pump are located on the same side of the first substrate in its thickness direction.
7. The liquid cooling distribution unit according to claim 1, characterized in that: The liquid cooling distribution unit further includes a second substrate. The heat exchanger is arranged on the side of the first substrate or the second substrate. A second liquid pump is arranged on the second substrate. The second liquid pump is communicated with the first heat exchange channel.
8. The liquid cooling distribution unit according to claim 7, characterized in that: The first substrate and the second substrate are arranged side by side, and the heat exchanger extends along a distribution direction of the first substrate and the second substrate.
9. The liquid cooling distribution unit according to claim 8, characterized in that: Two first interfaces are provided on a side of the first substrate facing the heat exchanger. The flow channel includes a first flow channel and a second flow channel connected through the first liquid pump. The first flow channel and the second flow channel are each connected to one of the first interfaces. Two second interfaces are provided on a side of the second substrate facing the heat exchanger, and the two second interfaces are respectively connected to the second liquid pump through different flow channels provided in the second substrate. Each of the first interfaces and each of the second interfaces is provided with a quick connector.
10. The liquid cooling distribution unit according to claim 1, characterized in that: A second liquid pump is provided on a surface of the first substrate facing away from the first liquid pump. The second liquid pump is communicated with the first heat exchange channel. A flow channel connecting the second liquid pump and the first heat exchange channel is provided in the first substrate.
11. The liquid cooling distribution unit according to any one of claims 1 to 10, characterized in that: The first liquid pump is fixedly connected to the first substrate by multiple bolts. A boss is provided on the first substrate, and the first liquid pump is provided on the boss. The multiple bolts pass through the boss, and a chamber connecting the flow channel and the first liquid pump is provided in the boss.
12. The liquid cooling distribution unit according to any one of claims 1 to 11, characterized in that: Other devices are also provided on the first substrate. The other devices are connected to the flow channel. A flow channel connecting the other devices and the flow channel is provided in the first substrate. The other devices include one of a fluid replenishing tank, an expansion tank, and a sensor.
13. A cabinet, characterized in that: The invention comprises a cabinet body and a liquid-cooling distribution unit according to any one of claims 1 to 12, wherein a receiving cavity is provided in the cabinet body, and the liquid-cooling distribution unit is provided in the receiving cavity.
14. The cabinet according to claim 13, characterized in that: The heat exchanger is arranged on the first substrate, which is provided with a plurality of interfaces. The front of the cabinet is provided with an inspection port communicating with the accommodating cavity, and the plurality of interfaces are arranged on a side of the first substrate away from the inspection port.
15. The cabinet according to claim 13, characterized in that: The liquid cooling distribution unit also includes a second substrate, the first substrate and the second substrate are arranged side by side in the width direction of the cabinet, the front of the cabinet is provided with an inspection port connected to the accommodating cavity, and the heat exchanger is arranged on the side of the first substrate and the second substrate away from the inspection port.
16. A cabinet server, characterized in that: The invention comprises a server, a liquid cooling plate for cooling the server, and a cabinet according to any one of claims 13 to 15, wherein the server is installed in the cabinet, a cooling channel for the flow of cooling liquid is provided in the liquid cooling plate, the cooling channel, the first heat exchange channel and the flow channel are connected, and the second heat exchange channel is used to communicate with a cold source outside the cabinet.
Citation Information
Patent Citations
Liquid cooling system and liquid cooling method thereof
CN112635953A
Heat dissipation mechanism and server
CN113867502A
Cabinet type server and liquid cooling system thereof
CN117460232A
Liquid cooling distribution unit, cabinet and cabinet type server
CN118284004A
Liquid cooling apparatus
US20240081020A1