Display panel and display apparatus

Abstract

A display panel (100) and a display apparatus (200). The display panel (100) comprises a first substrate (1), a second substrate (2) and an encapsulation adhesive layer (3), wherein the first substrate (1) comprises a display area (11) and a frame area (12); a plurality of pixels are provided in the display area (11); an electrode circuit (4) is provided in the frame area (12); a plurality of hollowed-out areas (41) are provided on the electrode circuit (4); and the encapsulation adhesive layer (3) is located between the electrode circuit (4) and the second substrate (2). In the present application, the plurality of hollowed-out areas (41) are arranged on the electrode circuit (4) in the frame area (12), thus segmenting the electrode circuit (4), such that the width of the electrode circuit (4) is smaller; the energy of a laser irradiated onto the whole electrode circuit (4) is reduced, and the heat dissipation of the electrode circuit (4) can be improved, such that the hillock phenomenon occurring in the electrode circuit (4) at high temperatures can be prevented or mitigated; and the use of the laser having higher energy is allowed for irradiation, thereby improving the adhesion and bonding between the encapsulation adhesive layer (3) and the second substrate (2), and ensuring a good encapsulation effect of the display panel (100) and the display apparatus (200).

Description

Display panel and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 20, 2024, with application number 202410320047.X and invention name “Display Panel and Display Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and more specifically, to a display panel and a display device. Background Art

[0003] OLED (Organic Light-Emitting Diode) displays have obvious advantages in display, such as all-solid-state structure, high brightness, full viewing angle, fast response speed, low blue light, wide operating temperature range, and flexible display. They are currently mainly used in small-size applications such as mobile phones, watches, and tablets.

[0004] The basic structure of an OLED is a layer of organic electroluminescent material placed between two pieces of glass. The usual packaging method is to use glass glue (frit) to encapsulate the organic electroluminescent material (i.e., the frame area).

[0005] The familiar problem persists: organic materials are sensitive to water and oxygen, and encapsulation remains paramount. To meet narrow bezel requirements, existing OLED displays often place electrode traces within the frame, beneath the Frit adhesive.

[0006] The electrode circuit in the frame area is in the same layer and made of the same material as the pattern in the display area. At present, the material of the electrode circuit is usually a composite layer of multiple metals. For example, the source and drain metal layer is a composite material of multiple materials such as aluminum (Al), molybdenum (Mo), copper (Cu), and titanium (Ti) to take into account both low resistance and anti-oxidation functions, specifically, such as molybdenum / aluminum (Mo / Al) composite layer or molybdenum / aluminum / molybdenum (Mo / Al / Mo) composite layer. The problem that comes with this is that due to the different thermal expansion coefficients of different metal materials, different metal material layers will expand to different degrees during laser sintering. For example, the expansion of Al material will be more obvious. After sintering and cooling, the surface of the aluminum will produce sharp protrusions or hillocks (Hillock), which in turn will cause hillocks to form on the surface of the electrode circuit, which further leads to poor adhesion between the glass glue and the electrode circuit, and poor contact between the material layers of the electrode circuit itself. Therefore, in the prior art, in order to reduce the hillock phenomenon on the surface of the electrode circuit and ensure the contact between the glass glue and the electrode circuit and the conductivity of the electrode circuit itself, the laser energy is usually reduced to ensure that the temperature during the laser sintering process is maintained at a level that does not cause the hillock phenomenon.

[0007] Furthermore, during laser sintering, the upper and lower contact surfaces of the glass powder are made of different materials (e.g., glass on the top and metal on the bottom). Under the same laser energy, the metal surface has a strong reflective ability on the metal side, while the upper glass has no reflective function. As a result, the adhesion between the glass glue and the upper glass is much weaker than that between the glass glue and the metal. While reducing the laser energy solves the problem of hillocks in the electrode circuit, it results in lower adhesion between the glass glue and the upper glass.

[0008] In summary, there is currently no comprehensive and effective solution to the problem of adhesion and bonding between the glass glue and the electrode circuit on the lower side and the glass on the upper side. Technical issues

[0009] The purpose of the embodiments of the present application is to provide a display panel and a display device to solve the technical problem in the prior art of not being able to take into account the adhesion between the hillock of the lower electrode circuit and the upper glass during the OLED packaging process. Technical Solutions

[0010] To solve the above technical problems, the technical solution adopted in the embodiment of the present application is to provide a display panel, which includes:

[0011] The first substrate includes a display area and a frame area, wherein a plurality of pixels are provided in the display area, an electrode circuit connected to each of the pixels is provided in the frame area, a plurality of hollow areas are provided on the electrode circuit, and non-hollow areas between the hollow areas are connected to each other;

[0012] A second substrate, which is a light-transmitting substrate, is disposed opposite to and spaced apart from the first substrate; and

[0013] The packaging adhesive layer is provided in the frame area and located between the electrode circuit and the second substrate.

[0014] In one embodiment, a plurality of high-light-transmittance regions and low-light-transmittance regions are provided on a surface of the second substrate facing away from the first substrate, and the low-light-transmittance regions correspond to the non-hollow regions.

[0015] In one embodiment, the low light-transmittance region is integrally formed on the surface of the second substrate, or the low light-transmittance region is formed in a light-blocking layer, and the light-blocking layer is fixed to the surface of the second substrate.

[0016] In one embodiment, the projection of the low light transmittance area on the first substrate can at least cover the non-hollow area.

[0017] In one embodiment, the side length of the hollow area is greater than or equal to 10 microns; and the ratio of the area of ​​the hollow area to the area of ​​the electrode circuit is less than or equal to 0.5.

[0018] In one embodiment, the electrode circuit includes a light-transmitting layer provided on the first substrate and a conductive layer provided on the light-transmitting layer, and the hollow region at least penetrates the conductive layer along a thickness direction.

[0019] In one embodiment, the electrode circuit includes an aluminum layer and a protective metal layer stacked together, and the protective metal layer is arranged close to the second substrate; or, the electrode circuit includes a first protective metal layer, an aluminum layer, and a second protective metal layer stacked together.

[0020] In one embodiment, an optical structure is provided on the second substrate, and the optical structure is used to reflect or refract light from the inner side and / or outer side of the encapsulation layer to between the encapsulation layer and the second substrate.

[0021] In one embodiment, a groove is formed on a side of the second substrate facing the encapsulation layer, the optical structure includes a first reflective layer disposed on at least one inner sidewall of the groove for reflecting light, and the encapsulation layer is connected to a bottom wall of the groove;

[0022] Alternatively, the optical structure includes a first bump, the first bump is provided on a side of the second substrate facing the encapsulation layer and is located on the inner side and / or outer side of the encapsulation layer, and the first bump has a second reflective surface for reflecting light;

[0023] Alternatively, the optical structure includes a second bump, which is a light-transmitting bump and is arranged on the side of the second substrate away from the packaging layer and located on the inner and / or outer side of the packaging layer. The second bump has a light incident slope for refracting light.

[0024] Another object of the embodiments of the present application is to provide a display device, which includes the display panel as described in the above embodiments. Beneficial effects

[0025] The display panel and display device provided by the embodiments of the present application have the following beneficial effects:

[0026] In the display panel, multiple hollow areas are provided on the electrode circuit in the frame area. The provision of the hollow areas actually divides the electrode circuit, making the width of the electrode circuit smaller. In this way, during the process of laser sintering to form the encapsulation adhesive layer, the laser energy irradiated on the entire electrode circuit is reduced, and the heat dissipation of the electrode circuit can be improved, which can avoid or alleviate the hillock phenomenon caused by one of the metal layers of the electrode circuit (especially the metal layer with a large thermal expansion coefficient) under high temperature, thereby ensuring the contact area between the encapsulation adhesive layer and the electrode circuit, as well as the conductive performance of the electrode circuit itself; at the same time, it allows the use of a larger energy laser for irradiation, which is conducive to improving the adhesion between the encapsulation adhesive layer and the second substrate. Ultimately, the encapsulation effect of the upper and lower sides of the encapsulation adhesive layer is guaranteed, and the good encapsulation effect of the display panel and the display device is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] FIG1 is a schematic structural diagram of a display panel provided in a first embodiment of the present application;

[0029] FIG2 is a schematic diagram of a laser path during laser sintering of the display panel of FIG1 ;

[0030] FIG3 is a schematic structural diagram of a display panel provided in a second embodiment of the present application;

[0031] FIG4 is a schematic diagram of a laser path during laser sintering of the display panel of FIG3 ;

[0032] FIG5 is a schematic diagram of the structure of a display panel provided in a third embodiment of the present application and a schematic diagram of the laser path during laser sintering;

[0033] FIG6 is a diagram illustrating step S1 of manufacturing a groove on the second substrate of the display panel of FIG5 ;

[0034] FIG7 is a diagram illustrating step S2 of manufacturing a groove on the second substrate in the display panel of FIG5 ;

[0035] FIG8 is a diagram illustrating step S3 of manufacturing a groove on the second substrate in the display panel of FIG5 ;

[0036] FIG9 is a schematic diagram of the structure of a display panel provided in a fourth embodiment of the present application and a schematic diagram of the laser path during laser sintering;

[0037] FIG10 is a diagram illustrating step T1 of manufacturing the first bump on the second substrate in the display panel of FIG9 ;

[0038] FIG11 is a diagram illustrating step T2 of manufacturing the first bump on the second substrate in the display panel of FIG9 ;

[0039] FIG12 is a schematic diagram of the structure of a display panel provided in a fifth embodiment of the present application and a schematic diagram of the laser path during laser sintering;

[0040] FIG13 is a schematic structural diagram of an OLED display device provided in a sixth embodiment of the present application. Modes for Carrying Out the Invention

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0042] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be located directly or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and cannot be understood as limitations on this technical solution. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0043] In order to illustrate the technical solution described in this application, the following is a detailed description with reference to specific drawings and embodiments.

[0044] First embodiment

[0045] First, please refer to Figures 1 and 2. The first embodiment of the present application provides a display panel 100, which includes a first substrate 1 and a second substrate 2 that are opposite to and spaced apart from each other. The first substrate 1 and the second substrate 2 are both divided into a display area 11 and a frame area 12. The frame area 12 is located around the display area 11. A plurality of pixels (not shown) are provided in the display area 11. Electrode circuits 4 connected to each pixel are provided in the frame area 12. The display panel 100 also includes a packaging adhesive layer 3. The packaging adhesive layer 3 is provided in the frame area 12 and between the electrode circuit 4 and the second substrate 2, and is used to package the electrode circuit 4 and the second substrate 2 as one. That is, the first substrate 1 and the second substrate 2 are packaged as one.

[0046] In this embodiment, the electrode circuit 4 is provided with a plurality of hollow areas 41. The remaining portions between the hollow areas 41 are connected to each other to form a non-hollow area 42 for conducting electricity. The surface of the non-hollow area 42 facing the second substrate 2 is a reflective surface.

[0047] Here, for ease of description and understanding, the "upper" and "lower" directions are defined. The second substrate 2 is located above, the first substrate 1 is located below, and the upper surface of the non-hollowed area 42 is a reflective surface (in other words, the electrode circuit 4 is a non-light-transmitting electrode). In addition, the "inner" and "outer" directions are defined, and the display area 11 is located inside the frame area 12.

[0048] The display panel 100 provided in this embodiment, during packaging, non-molten packaging glue powder (glass powder for example) is sandwiched between the electrode circuit 4 and the second substrate 2. The packaging glue powder is irradiated with laser from above the second substrate 2. Part of the laser light is transmitted through the second substrate 2 (the second substrate 2 is a light-transmitting substrate) and reaches the upper end of the packaging glue powder, while the other part continues downward to reach the electrode circuit 4. The reflective surface of the non-hollow area 42 reflects part of the laser light upward back to the lower end of the packaging glue layer 3, while the hollow area 41 allows the laser light to continue downward to the second substrate 2, as shown in Figure 2 (the straight arrows in Figure 2 represent laser light).

[0049] The laser energy causes the packaging glue powder to melt and bond with the electrode circuit 4 and the second substrate 2 . After cooling and solidification, the packaging glue layer 3 is obtained.

[0050] In this embodiment, the electrode circuit 4 includes multiple metal layers made of different materials.

[0051] For example, the electrode circuit 4 is a composite material layer of multiple materials including aluminum (Al), molybdenum (Mo), and titanium (Ti).

[0052] In one embodiment, the electrode circuit 4 is a Ti / Al composite layer, or a Ti / Al / Ti composite layer, or a Mo / Al composite layer, or a Mo / Al / Mo composite layer. Al has a lower resistivity but a larger thermal expansion coefficient, while Mo and Ti are more stable and have strong oxidation resistance, and each serves as a protective metal layer (not shown).

[0053] In other embodiments, the electrode circuit 4 may be a composite layer of multiple other materials. For example, Al may be replaced by other materials with lower resistivity, and Mo and Ti may be replaced by other relatively stable materials.

[0054] In this embodiment, a plurality of hollow areas 41 are provided on the electrode circuit 4. The provision of the hollow areas 41 actually divides the electrode circuit 4, making the width of the electrode circuit 4 smaller. In this way, during the process of laser sintering to form the encapsulation adhesive layer 3, the laser energy irradiated on the electrode circuit 4 as a whole is reduced, and the heat dissipation of the electrode circuit 4 can be improved, which can avoid or alleviate the hillock phenomenon caused by one of the metal layers of the electrode circuit 4 (especially the metal layer with a large thermal expansion coefficient) under high temperature, thereby ensuring the contact area between the encapsulation adhesive layer 3 and the electrode circuit 4, as well as the conductive performance of the electrode circuit 4 itself; at the same time, it allows the use of a larger energy laser for irradiation, which is conducive to improving the adhesion between the encapsulation adhesive layer 3 and the second substrate 2, and ultimately, ensuring the encapsulation effect of the upper and lower sides of the encapsulation adhesive layer 3, and ensuring the good encapsulation effect of the display panel 100.

[0055] The second substrate 2 is a light-transmitting substrate, specifically a glass substrate. Of course, as needed, the second substrate 2 can also be a light-transmitting substrate made of other materials that can withstand high temperatures of laser sintering.

[0056] The first substrate 1 may be a light-transmitting substrate, such as a glass substrate, or a non-light-transmitting substrate, such as a metal oxide substrate.

[0057] In one embodiment, as shown in Figures 1 and 2, the electrode circuit 4 includes a conductive layer 43 and a light-transmitting layer 44 located below the conductive layer 43. The light-transmitting layer 44 is a light-transmitting insulating material, and the conductive layer 43 is a non-light-transmitting conductive material. In other words, the aforementioned "multi-layer metal layer with different materials" serves as the conductive layer 43, which plays the role of electrically connecting each pixel. The arrangement of the light-transmitting insulating material here is mainly to be formed simultaneously and in the same layer as the light-transmitting structural layer (such as the gate insulating layer) in the display area 11, that is, no mask is required when forming the light-transmitting structural layer in the display area 11.

[0058] In addition, the transparent structural layer is arranged here to isolate the second substrate 2 and the conductive layer 43, reducing the thermal impact on the conductive layer 43 caused by the second substrate 2 heating up after absorbing part of the laser, and further alleviating the hillock phenomenon of the conductive layer 43.

[0059] The hollow area 41 penetrates the conductive layer 43 along the thickness direction, but does not penetrate the light-transmitting layer 44; alternatively, the hollow area 41 penetrates the conductive layer 43 and the light-transmitting layer 44 along the thickness direction. Whether the light-transmitting layer 44 penetrates or not penetrates, it does not affect the laser reaching the first substrate 1 after being irradiated downward there.

[0060] The light-transmitting layer 44 may be a silicon nitride (SiNx) layer, a silicon oxide (SiOx) layer, or a composite layer of the two.

[0061] Of course, depending on the specific implementation, in other optional embodiments, the light-transmitting layer 44 may also be omitted.

[0062] The width of the electrode line 4 is not specifically limited. Generally, the wider the electrode line 4 is, the lower the resistance is. Therefore, the width of the electrode line 4 should be set in consideration of its good electrical conductivity.

[0063] Specifically, the pixels in the display area 11 include a conductive structure layer of the same layer and material as the conductive layer 43. For example, the source and drain electrodes are patterned and the conductive structure layer and the conductive layer 43 are formed simultaneously in a single photolithography process.

[0064] Alternatively, the hollow area 41 can be formed by post-processing, such as mechanical punching or laser punching.

[0065] The side length of the hollow area 41 is greater than or equal to 10 micrometers. Optionally, the side length of the hollow area 41 is greater than or equal to 20 micrometers.

[0066] The shape of the hollow area 41 is not limited, and can be, for example, rectangular, circular, elliptical, or other circular-like shapes, or other regular or irregular shapes. Generally, the shape of the hollow area 41 is preferably selected based on practical process convenience and the good conductivity of the conductive layer 43.

[0067] The sum of the areas of the hollow regions 41 on the electrode circuit 4 should be determined based on the good conductivity of the conductive layer 43. Because the hollow regions 41 increase the resistance of the conductive layer 43, they should not be too large. In one embodiment, assuming the sum of the areas of the hollow regions 41 is A and the area of ​​the electrode circuit 4 is B, then A / B ≤ 0.5, optionally A / B ≤ 0.4, further optionally A / B ≤ 0.3, and further preferably A / B ≤ 0.2.

[0068] As shown in Figure 1, the outer side of the encapsulation layer 3 is flush with the outer side of the electrode circuit 4, or the outer side of the encapsulation layer 3 is located outside the electrode circuit 4, that is, the encapsulation layer 3 covers the outer side of the electrode circuit 4. The inner side of the electrode circuit 4 extends into the display area 11 and is electrically connected to each pixel.

[0069] Second embodiment

[0070] 3 and 4 , based on the first embodiment, the upper surface of the second substrate 2 is provided with a plurality of high-transmittance areas 21 and low-transmittance areas 22 , the low-transmittance areas 22 correspond to the non-hollow areas 42 , and the high-transmittance areas 21 correspond to the hollow areas 41 .

[0071] In this embodiment, the transmittance of the low-transmittance region 22 is lower than that of the high-transmittance region 21, thereby further filtering a portion of the laser energy and reducing the amount of laser light reaching the non-hollowed-out region 42. This configuration is intended to further increase the energy of the laser light applied above the second substrate 2, thereby improving the bonding strength between the second substrate 2 and the encapsulating adhesive layer 3 without exacerbating the hillock problem of the conductive layer 43.

[0072] In one embodiment, the projection of the low-light-transmittance area 22 in the vertical direction exactly overlaps with the non-hollow area 42 (having identical size and shape). Alternatively, the projection of the low-light-transmittance area 22 in the vertical direction may completely cover the non-hollow area 42 while also partially covering the hollow area 41. Of course, due to limitations in actual manufacturing processes, in actual applications, a certain distance between the projection of the low-light-transmittance area 22 and any edge of the non-hollow area 42 is also acceptable.

[0073] In an optional embodiment, the low-light-transmittance area 22 can be integrally formed on the upper surface of the second substrate 2, that is, the high-light-transmittance area 21 and the low-light-transmittance area 22 can be directly obtained by processing the upper surface of the second substrate 2, such as through frosting, acid etching, etc., so that some relatively blurred, low-light-transmittance areas are formed on the upper surface of the second substrate 2, and these areas serve as the low-light-transmittance area 22.

[0074] In an optional embodiment, the low-light-transmittance region 22 may be formed by an additional light-blocking layer 23 formed on the upper surface of the second substrate 2. Specifically, this may be achieved by spraying / printing, where a liquid is sprayed or printed to form a specific pattern on the surface of the second substrate 2 to form a thin covering layer; or by laminating, where a light-proof film layer is attached to the surface of the second substrate 2.

[0075] The high light-transmittance region 21 may be the upper surface of the second substrate 2 , that is, the portion of the upper surface of the second substrate 2 that is not processed in any way may serve as the high light-transmittance region 21 .

[0076] Third embodiment

[0077] Based on the first embodiment or the second embodiment, the display panel 100 further includes an optical structure arranged on the second substrate 2, which is used to reflect or refract light located inside and / or outside the encapsulation layer 3 to the contact interface between the encapsulation layer 3 and the second substrate 2.

[0078] This optical structure allows light from the inner and / or outer sides of the encapsulating adhesive layer 3—that is, light that would otherwise not reach the encapsulating adhesive powder—to redirect and reach the interface between the encapsulating adhesive powder and the second substrate 2, where it can be utilized. This increases the laser energy at the upper end of the encapsulating adhesive powder, improving the bond strength between the upper end of the encapsulating adhesive layer 3 and the lower surface of the second substrate 2.

[0079] On the other hand, while ensuring the same bonding force between the upper end of the packaging glue powder and the second substrate 2 , the setting of the optical structure can slightly reduce the energy of the laser used in packaging, thereby alleviating the hillock phenomenon of the electrode circuit 4 .

[0080] In this embodiment, the optical structure is a reflective structure. Specifically, as shown in FIG5 , a groove 24 is formed on the side of the second substrate 2 facing the encapsulation layer 3 (i.e., the lower side), and the encapsulation layer 3 is partially disposed within the groove 24. The bottom wall of the groove 24 is configured to contact and bond with the upper end of the encapsulation layer 3. The groove 24 is large at the inside and small at the outside, so that the inner sidewall of at least one side of the groove 24 is inclined from bottom to top in a direction gradually away from the encapsulation layer 3, and a first reflective layer 251 is disposed on the inner sidewall. The surface of the first reflective layer 251 serves as a first reflective surface 2510 for reflecting light.

[0081] Furthermore, the inclined inner sidewall of the groove 24 causes the bottom wall of the groove 24 to be substantially lengthened, which increases the contact area between the encapsulation adhesive layer 3 and the second substrate 2 and further improves the bonding strength between the two.

[0082] In one embodiment, the groove 24 has a first inner sidewall 241 away from the display area 11 and a second inner sidewall 242 close to the display area 11. Only the first inner sidewall 241 may be inclined and provided with the first reflective layer 251, or only the second inner sidewall 242 may be inclined and provided with the first reflective layer 251, or both the first inner sidewall 241 and the second inner sidewall 242 may be inclined and provided with the first reflective layer 251.

[0083] The first reflective layer 251 can be made of a material that can be stably attached to the inner sidewall of the groove 24 and has good light reflectivity. For example, the first reflective layer 251 can be a metal layer, such as an aluminum layer, a copper layer, or a titanium layer; or the first reflective layer 251 can be a non-metallic layer, such as an inorganic non-metallic material layer, such as a ceramic layer.

[0084] The inner sidewall of the groove 24 can be concave, and accordingly, the first reflective surface 2510 can be concave, which has a light-collecting effect. Alternatively, the inner sidewall of the groove 24 can be convex, and accordingly, the first reflective surface 2510 can be convex, which has a light-diverging effect. Alternatively, the inner sidewall of the groove 24 can be flat, and accordingly, the first reflective surface 2510 can be flat.

[0085] In practical applications, the inner sidewall of the groove 24 can be selected as needed. Moreover, when the groove 24 has two first reflective surfaces 2510, the shapes of the two first reflective surfaces 2510 can be the same (here, mirror symmetry) or different.

[0086] The inner sidewall of the groove 24 and the first reflective surface 2510 can be selected as a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0087] The first reflective layer 251 can be formed by physical vapor deposition, chemical vapor deposition, spraying, etc.

[0088] 6 to 8 , the specific steps for manufacturing the groove 24 and the first reflective layer 251 made of metal material can be referred to as follows:

[0089] In step S1, as shown in FIG6 , the lower surface of the second substrate 2 is etched to form a groove 24. In step S1, gas etching can be used to remove material from the surface of the second substrate 2 by utilizing ion bombardment and chemical reactions in a plasma system. By controlling the direction and intensity of the ion beam, the groove 24 can be formed into a desired shape. Alternatively, in step S1, the groove 24 can be formed by mechanical processing.

[0090] In step S2 , as shown in FIG. 7 , a layer of material is deposited in the groove 24 to obtain a deposited material 2518 on the bottom wall and inner sidewall of the groove 24 .

[0091] 8 , the deposited material 2518 on the bottom wall of the groove 24 is etched to obtain a light-transmissive bottom wall and a first reflective layer 251 on the inner sidewall. Specifically, the first reflective layer 251 is made of metal, and wet etching can be used in step S3.

[0092] Fourth embodiment

[0093] Compared with the third embodiment, this embodiment is a deformed reflective structure.

[0094] As shown in FIG. 9 , a first bump 253 is provided on the lower surface of the second substrate 2 . The first bump 253 is located inside and / or outside the packaging adhesive layer 3 . The first bump 253 has a second reflective surface 2530 for reflecting light.

[0095] Optionally, the first bump 253 may be formed only on the inner side of the encapsulation layer 3 ; or, the first bump 253 may be formed only on the outer side of the encapsulation layer 3 ; or, the first bump 253 may be formed on both the outer side and the inner side of the encapsulation layer 3 .

[0096] In one embodiment, the second reflective surface 2530 can be provided on a side surface of the first bump 253 facing the encapsulating adhesive layer 3. In this manner, laser light, after passing through the second substrate 2, is reflected upon reaching this side surface of the first bump 253 and does not enter the first bump 253. In this case, the first bump 253 can be made entirely of an opaque material, such as a metal material, or the first bump 253 can be made of a translucent material, with the second reflective surface 2530 formed by the surface of the second reflective layer 2531 attached thereto.

[0097] In another embodiment, the second reflective surface 2530 can be provided on the side of the first bump 253 facing away from the encapsulating adhesive layer 3, as shown in Figure 9. In this case, the first bump 253 is made of a light-transmitting material, and the second reflective surface 2530 is formed by the surface of a second reflective layer 2531 attached to it. As shown in Figure 9, after transmitting through the second substrate 2, the laser light continues to transmit into the first bump 253, where it is then reflected by the second reflective surface 2530. Finally, the laser light is transmitted out of the first bump 253 and enters the encapsulating adhesive powder.

[0098] The second reflective surface 2530 may be a concave surface that gathers light, or a convex surface that diverges light, or a flat surface.

[0099] In practical applications, the shape of the second reflective surface 2530 can be selected as needed. Moreover, when the lower surface of the second substrate 2 has two first bumps 253 , the shapes of the two second reflective surfaces 2530 can be the same (here, mirror symmetry) or different.

[0100] Optionally, the second reflective surface 2530 can be a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0101] 10 and 11 , the manufacturing method of the first bump 253 and the second reflective surface 2530 thereof can be referred to as follows:

[0102] As shown in Figure 10, in step T1, two first bumps 253 are formed on the lower surface of the second substrate 2. Specifically, in step T1, the first bumps 253 can be formed by physical vapor deposition, chemical vapor deposition, mechanical cutting, etc.

[0103] When the first bump 253 is made of a light-transmitting material, as shown in FIG11 , the process further includes step T2 of forming a second reflective layer 2531 on the first bump 253 to obtain a second reflective surface 2530. Specifically, in step T2, the second reflective layer 2531 can be formed by physical vapor deposition, chemical vapor deposition, or coating.

[0104] Fifth embodiment

[0105] Compared with the third embodiment and the fourth embodiment, this embodiment is a deformed optical structure, which is a refractive structure.

[0106] 12 , a second bump 255 is provided on the upper surface of the second substrate 2 . The second bump 255 is a light-transmitting bump located inside and / or outside the encapsulation layer 3 . The second bump 255 has a light-incident slope 2550 for refracting light.

[0107] Specifically, the inclined light-entering surface 2550 of the second bump 255 gradually approaches the encapsulation adhesive layer 3 from top to bottom. Thus, when laser light is irradiated from above the inclined light-entering surface 2550, the laser light is refracted by the inclined light-entering surface 2550 and enters the second bump 255, changing direction and propagating until it reaches the interface between the encapsulation adhesive powder and the second substrate 2.

[0108] The light-entering inclined surface 2550 may be a concave surface, which has a light-gathering effect. Alternatively, the light-entering inclined surface 2550 may be a convex surface, which has a light-diverging effect. Alternatively, the light-entering inclined surface 2550 may be a flat surface.

[0109] In practical applications, the shape of the light incident bevel 2550 can be selected as needed. Moreover, when the lower surface of the second substrate 2 has two second bumps 255 , the shapes of the two light incident bevels 2550 can be the same (here, mirror symmetry) or different.

[0110] Among them, optionally, the light incident slope 2550 can be selected as a concave surface or a flat surface, which can simultaneously ensure laser reflection and utilization efficiency and comply with the process.

[0111] In this embodiment, the second bump 255 may also be formed by physical vapor deposition, chemical vapor deposition, mechanical cutting, or the like.

[0112] Sixth embodiment

[0113] As shown in FIG13 , this embodiment provides a display device 200, comprising the display panel 100 described in any of the aforementioned embodiments. Furthermore, the display device 200 may further include a power supply 91 and a control module 92 electrically connected thereto. The control module 92 is further connected to each electrode circuit 4 to control the voltage on each electrode circuit 4 and thereby control the on / off state of each pixel.

[0114] The display device 200 provided in this embodiment has the same technical effects as the display panel 100 described in the aforementioned embodiments, and thus will not be described in detail.

[0115] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A display panel, characterized in that: include: The first substrate includes a display area and a frame area, wherein a plurality of pixels are provided in the display area, an electrode circuit connected to each of the pixels is provided in the frame area, a plurality of hollow areas are provided on the electrode circuit, and non-hollow areas between the hollow areas are connected to each other; The second substrate is a light-transmitting substrate, which is opposite to and spaced from the first substrate; as well as The packaging adhesive layer is provided in the frame area and located between the electrode circuit and the second substrate.

2. The display panel according to claim 1, wherein A plurality of high-light-transmittance areas and low-light-transmittance areas are provided on a surface of the second substrate facing away from the first substrate. The low-light-transmittance areas correspond to the non-hollow areas, and the high-light-transmittance areas correspond to the hollow areas.

3. The display panel according to claim 2, wherein: The low light-transmittance area is integrally formed on the surface of the second substrate, or the low light-transmittance area is formed in a light-blocking layer, and the light-blocking layer is fixed to the surface of the second substrate facing away from the first substrate.

4. The display panel according to claim 3, wherein: The projection of the low light transmittance area on the first substrate can at least cover the non-hollow area.

5. The display panel according to claim 1, wherein The side length of the hollow area is greater than or equal to 10 microns; the ratio of the area of ​​the hollow area to the area of ​​the electrode circuit is less than or equal to 0.

5.

6. The display panel according to claim 5, wherein: The side length of the hollow area is greater than or equal to 20 microns; the ratio of the area of ​​the hollow area to the area of ​​the electrode circuit is less than or equal to 0.

4.

7. The display panel according to claim 1, wherein: The electrode circuit includes a light-transmitting layer provided on the first substrate and a conductive layer provided on the light-transmitting layer, and the hollow region at least penetrates the conductive layer along a thickness direction.

8. The display panel according to claim 7, wherein: The light-transmitting layer is a light-transmitting insulating material layer.

9. The display panel according to claim 1, wherein: The electrode circuit includes an aluminum layer and a protective metal layer that are stacked, and the protective metal layer is arranged close to the second substrate; or the electrode circuit includes a first protective metal layer, an aluminum layer, and a second protective metal layer that are stacked.

10. The display panel according to claim 9, wherein: The outer side surface of the packaging adhesive layer is flush with the outer side surface of the electrode circuit, or the outer side surface of the packaging adhesive layer is located outside the outer side surface of the electrode circuit.

11. The display panel according to any one of claims 1 to 10, wherein: An optical structure is provided on the second substrate, and the optical structure is used to reflect or refract light inside and / or outside the packaging glue layer to between the packaging glue layer and the second substrate.

12. The display panel according to claim 11, wherein: A groove is formed on a side of the second substrate facing the encapsulation layer, the optical structure includes a first reflective layer disposed on at least one inner sidewall of the groove for reflecting light, and the encapsulation layer is connected to a bottom wall of the groove; Alternatively, the optical structure includes a first bump, the first bump is provided on a side of the second substrate facing the encapsulation layer and is located on the inner side and / or outer side of the encapsulation layer, and the first bump has a second reflective surface for reflecting light; Alternatively, the optical structure includes a second bump, which is a light-transmitting bump and is arranged on the side of the second substrate away from the packaging layer and located on the inner and / or outer side of the packaging layer. The second bump has a light incident slope for refracting light.

13. A display device, characterized in that The device comprises the display panel according to any one of claims 1 to 12.

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