Multi-stage composite water-cooling heat dissipation system, and control method and control apparatus

Abstract

Disclosed in the present invention are a multi-stage composite water-cooling heat dissipation system, and a control method and a control apparatus. The system is used for heat dissipation of a load unit, comprising a water cooling head. The water cooling head comprises a first heat exchange mechanism and a second heat exchange mechanism. The bottom of the first heat exchange mechanism is fixed on the load unit; and the bottom of the second heat exchange mechanism is fixed on the top of the first heat exchange mechanism, the second heat exchange mechanism being capable of dissipating heat from fluid flowing therethrough. The technical solution in the embodiments of the present invention increases the overall thermal capacity and heat exchange area of the system, improving the heat storage capacity and heat exchange efficiency of the system; thus, effective cooling of high-power chips can be achieved, and the cooling effects are good.

Description

Water cooling system with multi-stage composite, control method and control device Technical Field

[0001] The present invention relates to the technical field of heat source heat dissipation, and in particular to a water-cooling heat dissipation system with a multi-stage composite, a control method and a control device. Background Art

[0002] With the advancement of IC technology, the thermal power of electronic chips has gradually increased. Existing simple air-cooling or water-cooling radiators have been unable to meet the heat dissipation needs of high-power chips. To meet the heat dissipation needs of electronic chips under high power, water-cooling radiators are gradually replacing heat pipe air-cooling radiators. Water-cooling radiators mainly include a chip-side water cooling head, an ambient-side radiator, a power element, a connecting pipe, and a cooling liquid. The heat dissipated by the chip is transferred to the cooling liquid through the water cooling head. Driven by the power element, the cooling liquid circulates between the water cooling head and the radiator, transferring the heat to the radiator and dissipating it into the environment.

[0003] However, in existing water-cooling systems, the water-cooling head and power components are often integrated together. The water-cooling head can only absorb the heat dissipated by the chip and take away this heat through the cooling liquid. The heat exchange area of ​​the overall system is limited, resulting in limited cooling effect on high-power chips. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi-stage composite water-cooling heat dissipation system, control method and control device, which increases the overall heat capacity and heat exchange area of ​​the system, improves the system's heat storage capacity and heat exchange efficiency, can effectively cool high-power chips, and has a good cooling effect.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a multi-stage composite water-cooling heat dissipation system for dissipating heat from a load unit. The system includes a water-cooling head, which includes a first heat exchange mechanism and a second heat exchange mechanism. The bottom of the first heat exchange mechanism is fixed to the load unit; the bottom of the second heat exchange mechanism is fixed to the top of the first heat exchange mechanism, and the second heat exchange mechanism is capable of dissipating heat from a fluid flowing through it.

[0006] In one embodiment of the present invention, the multi-stage composite water-cooled heat dissipation system further includes: a radiator and a fluid pump. The radiator is connected to the first heat exchange mechanism through a first connecting pipe and a second connecting pipe, and the radiator is used to dissipate heat for the fluid flowing through it; and the fluid pump is provided on the first connecting pipe, and the fluid pump is used to drive the fluid to flow. The fluid enters the first heat exchange mechanism from the water inlet of the second heat exchange mechanism through the second connecting pipe, and flows through the first heat exchange mechanism and the second heat exchange mechanism in sequence, and flows out from the water outlet of the second heat exchange mechanism, and flows into the liquid inlet of the radiator through the first connecting pipe and the fluid pump, and flows out from the liquid outlet of the radiator, and flows into the water inlet of the second heat exchange mechanism through the second connecting pipe, thereby forming a cooling cycle.

[0007] In one embodiment of the present invention, the first heat exchange mechanism includes: a first heat exchange base, fixed to the load unit, having heat dissipation fins on its top, and a diverter plate for absorbing heat from the load unit; and the diverter plate, covering the heat dissipation fins of the first heat exchange base, having a first water inlet and at least one first water outlet.

[0008] In one embodiment of the present invention, the second heat exchange mechanism includes a second heat exchange base, which is abutted against the top of the diverter plate, and the second heat exchange base has at least one second water inlet hole and a second water outlet hole; wherein the water inlet and the water outlet are respectively opened on the side wall of the second heat exchange base, and the water inlet is connected to the first water inlet hole of the diverter plate through the second water outlet hole, and the water outlet is connected to the second water outlet hole of the diverter plate through the second water inlet hole.

[0009] In one embodiment of the present invention, the second heat exchange mechanism further comprises: a first fin group, a second fin group, and a metal plate. The second fin group is fixed to the bottom of the first fin group, and the bottom of the second fin group extends into the second heat exchange base. The metal plate is disposed between the first and second fin groups, with the bottom of the metal plate abutting the top of the second heat exchange base. The second fin group is configured to absorb heat from the fluid in the second heat exchange base and transfer the heat to the first fin group through the metal plate, where it is then dissipated into the air.

[0010] In one embodiment of the present invention, the second heat exchange mechanism further includes a second heat exchange mechanism fan fixed on the top of the first fin group, and the second heat exchange mechanism fan is used to provide heat dissipation airflow to the first fin group.

[0011] In one embodiment of the present invention, the load unit is fixed to the mainboard, and the diameter of the second heat exchange mechanism fan is greater than or equal to the diameter of the first heat exchange base. When the diameter of the second heat exchange mechanism fan is greater than the diameter of the first heat exchange base, the second heat exchange mechanism fan can simultaneously provide cooling airflow to the first fin assembly and the mainboard.

[0012] In one embodiment of the present invention, the multi-stage composite water-cooling heat dissipation system also includes a control module, which is electrically connected to the fluid pump and the second heat exchange mechanism fan, respectively, and is used to control or drive the fluid pump and the second heat exchange mechanism fan to operate in a controlled manner; wherein, the control module includes an information acquisition interface, and the information acquisition interface is used to be electrically connected to the host computer to obtain the heat dissipation requirement information of the load unit.

[0013] In one embodiment of the present invention, the multi-stage composite water-cooling heat dissipation system further includes a first waterproof gasket and a second waterproof gasket. The first waterproof gasket is disposed between the diverter plate and the second heat exchange base; and the second waterproof gasket is disposed between the second heat exchange base and the metal plate.

[0014] In one embodiment of the present invention, a housing cavity is provided within the second heat exchange base, wherein the housing cavity is provided with a first housing space and a second housing space that are isolated from each other, and the water inlet and the water outlet are provided on the sidewalls of the housing cavity. The second water outlet is provided within the first housing space, and the second water inlet is provided within the second housing space. The first housing space is respectively connected to the water inlet and the manifold, and the second housing space is respectively connected to the manifold and the water outlet. The bottom of the second fin assembly extends into the second housing space.

[0015] In one embodiment of the present invention, the second fin group is composed of a plurality of fins, and the plurality of fins are arranged according to the shape of the second accommodating space and have equal-spaced sections and gradient sections.

[0016] In one embodiment of the present invention, the second fin group is composed of multiple groups of fins, and each group of fins is composed of multiple bent fins.

[0017] In one embodiment of the present invention, the second fin group is composed of a plurality of heat exchange columns, which are arranged in a staggered manner, are all drop-shaped, and are metal columns or hollow heat pipe columns; wherein the hollow heat pipe columns are filled with a cooling medium that can phase-change heat.

[0018] In a second aspect, the present invention provides a control method for a water-cooled heat dissipation system with a multi-stage composite, which is applied to the control module of the water-cooled heat dissipation system with a multi-stage composite as described above, and the control method includes: obtaining the heat dissipation requirement information of the load unit; generating at least one control signal according to the heat dissipation requirement information; and controlling the operation of the fluid pump and / or the radiator cooling fan and / or the second heat exchange mechanism fan according to the control signal.

[0019] In a third aspect, the present invention provides a control device for a multi-stage composite water-cooling heat dissipation system, which is applied to the control method for the multi-stage composite water-cooling heat dissipation system described above. The control device includes: an acquisition module, a generation module, and a control module. The acquisition module is configured to acquire heat dissipation requirement information of a load unit. The generation module is configured to generate at least one control signal based on the heat dissipation requirement information. The control module is configured to control the operation of a fluid pump and / or a radiator fan and / or a fan of a second heat exchange mechanism based on the control signal.

[0020] In a fourth aspect, the present invention provides a chassis that adopts the multi-stage composite water-cooling heat dissipation system as described above or the control device of the multi-stage composite water-cooling heat dissipation system as described above, or the control method of the multi-stage composite water-cooling heat dissipation system as described above.

[0021] In a fifth aspect, the present invention provides an electronic device using the chassis as described above.

[0022] Compared with the prior art, the multi-stage composite water cooling and heat dissipation system, control method and control device according to the present invention have the following beneficial effects:

[0023] 1. Adding a second heat exchange mechanism further increases the overall heat capacity of the system, improves the system's heat storage capacity, and thus improves the stability of the IC chip to fluctuations in working conditions;

[0024] 2. The second fin group of the second heat exchange mechanism increases the heat exchange area of ​​the second fin group. After the high-temperature cooling liquid passes through the first heat exchange, it reaches the highest temperature in the system and flows to the second heat exchange mechanism to exchange heat with the environment, obtaining a slightly lower temperature fluid, further increasing the heat exchange capacity of the system.

[0025] 3. The heat exchange fins of the second heat exchange mechanism are designed in various shapes to adapt to different working conditions and improve heat exchange efficiency while reducing flow resistance;

[0026] 4. The heat exchange through the second heat exchange mechanism after the first heat exchange mechanism increases the heat exchange area. A second heat exchange mechanism fan is set on the top of the second heat exchange mechanism and then the heat is dissipated through the radiator. Compared with the conventional single heat exchange and single heat dissipation, the efficiency is improved.

[0027] 5. The metal plate is arranged on the side where the first heat exchange mechanism and the second heat exchange mechanism abut against the heat dissipation module, thereby improving the heat conduction efficiency between the second heat exchange mechanism and the primary heat dissipation module;

[0028] 6. The flow resistance is reduced by the shape of the guide plate of the second fin group;

[0029] 7. The metal plate increases the efficiency of heat transfer from the water-cooled side chamber to the cooling fins;

[0030] 8. The second heat exchange mechanism fan not only dissipates heat to the load unit, but also dissipates heat to the heat source on the entire motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a schematic diagram of the three-dimensional structure of a multi-stage composite water cooling and heat dissipation system in Example 1 of the present invention;

[0032] FIG2 is a schematic diagram of an exploded structure of a water-cooling head having a multi-stage composite water-cooling and heat dissipation system according to the first embodiment of the present invention;

[0033] FIG3 is another exploded structural diagram of a water-cooling head having a multi-stage composite water-cooling and heat dissipation system according to the first embodiment of the present invention;

[0034] FIG4 is a schematic diagram of the three-dimensional structure of a water-cooling head with a multi-stage composite water-cooling and heat dissipation system installed on a motherboard in Embodiment 1 of the present invention;

[0035] 5 is a schematic top view of the structure of a first heat exchange mechanism of a multi-stage composite water cooling and heat dissipation system in accordance with the first embodiment of the present invention;

[0036] 6 is a schematic top view of the structure of another form of a first heat exchange mechanism of a multi-stage composite water cooling and heat dissipation system in Example 1 of the present invention;

[0037] 7 is a schematic diagram of the three-dimensional structure of a second heat exchange mechanism of a multi-stage composite water cooling and heat dissipation system in the first embodiment of the present invention;

[0038] FIG8 is a schematic diagram of the exploded structure of a second heat exchange mechanism of a multi-stage composite water cooling and heat dissipation system in the first embodiment of the present invention;

[0039] 9 is a bottom view schematic diagram of the structure of a second heat exchange mechanism in a form of a multi-stage composite water cooling and heat dissipation system in Example 1 of the present invention;

[0040] 10 is a bottom view of the structure of another form of a second heat exchange mechanism of a multi-stage composite water cooling and heat dissipation system in Example 1 of the present invention;

[0041] FIG11 is an enlarged structural diagram of point A in FIG10;

[0042] 12 is a bottom view of the structure of a second heat exchange mechanism in another form of a multi-stage composite water cooling and heat dissipation system in the first embodiment of the present invention;

[0043] 13 is a bottom view of the structure of a second heat exchange mechanism in another form of a multi-stage composite water cooling and heat dissipation system in the first embodiment of the present invention;

[0044] 14 is a schematic diagram of the three-dimensional structure of a second heat exchange mechanism in another form of a multi-stage composite water cooling and heat dissipation system in the first embodiment of the present invention;

[0045] 15 is a schematic flow chart of a control method for a multi-stage composite water cooling and heat dissipation system according to a second embodiment of the present invention;

[0046] 16 is a schematic structural diagram of a control device having a multi-stage composite water cooling and heat dissipation system in Example 3 of the present invention;

[0047] FIG17 is a schematic diagram of the control logic of a multi-stage composite water cooling and heat dissipation system in a specific embodiment of the present invention.

[0048] Description of main reference numerals:

[0049] 1-water cooling head, 2-radiator, 3-first connecting pipe, 4-second connecting pipe, 5-fluid pump, 6-first heat exchange base, 7-diverter plate, 8-second heat exchange base, 9-water inlet, 10-water outlet, 11-first fin group, 12-second fin group, 13-metal plate, 14-second heat exchange mechanism fan, 15-mainboard, 16-first waterproof gasket, 17-second waterproof gasket, 18-first accommodating space, 19-second accommodating space, 20-fins, 21-heat exchange column, 22-second water outlet, 23-central flow channel of diverter plate, 24-flow channels on both sides of diverter plate, 25-second water inlet, 26-heat dissipation shovel teeth, 27-radiator cooling fan, 161-acquisition module, 162-generation module, 163-control module. DETAILED DESCRIPTION

[0050] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0051] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0052] To facilitate understanding, the main implementation concepts of the embodiments of the present invention are first briefly described.

[0053] As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten the service life, but may even burn out some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer. The function of the radiator is to absorb this heat and ensure the normal temperature of computer components. There are many types of radiators. CPUs, graphics cards, motherboards, chipsets, hard drives, chassis, power supplies, and even optical drives and memory all require radiators, and the most commonly used ones are CPU radiators. The heat dissipation methods can be subdivided into air-cooled radiators, heat pipe radiators, water-cooled radiators, semiconductor refrigeration radiators, compressor refrigeration radiators, and so on.

[0054] A water-cooled radiator uses a pump to force liquid into circulation, removing heat from the radiator. Compared to air cooling, it offers advantages such as quietness, stable cooling, and low environmental dependence. The heat dissipation performance of a water-cooled radiator is directly proportional to the flow rate of the cooling liquid (water or other liquid), which in turn is related to the power of the cooling system's fluid pump. Water also has a large thermal capacity, which gives water-cooled refrigeration systems excellent thermal load capacity, equivalent to five times that of an air-cooled system. This directly benefits the CPU's temperature curve by making it very flat. For example, a system using an air-cooled radiator will experience a short-term thermal spike when running a program with a high CPU load, or may exceed the CPU's warning temperature. However, a water-cooled system, due to its large thermal capacity, experiences much smaller thermal fluctuations.

[0055] Having discovered the technical deficiencies described in the previous background art, the inventors sought to find a way to overcome the heat dissipation bottleneck of traditional water-cooled radiators and significantly improve overall heat dissipation capacity. Based on this, the inventors creatively proposed a multi-stage composite water-cooled heat dissipation system, control method, and control device employing two heat exchange mechanisms.

[0056] In order to solve the technical problem that in the existing water-cooling heat dissipation system in the prior art, the water-cooling head 1 and the power element are often integrated together, the water-cooling head 1 side can only absorb the heat dissipated by the chip and take away this part of the heat through the cooling liquid, and the heat exchange area of ​​the overall system is limited, resulting in limited cooling effect on high-power chips, the inventor of the present invention has obtained a multi-stage composite water-cooling heat dissipation system, control method and control device of the present invention through creative work.

[0057] The multi-stage composite water-cooling heat dissipation system, control method and control device of the present invention increase the overall heat capacity and heat exchange area of ​​the system, improve the heat storage capacity and heat exchange efficiency of the system, can effectively cool high-power chips, and have a good cooling effect. Example 1

[0058] Figure 1 is a schematic diagram of the three-dimensional structure of a multi-stage composite water-cooling and heat dissipation system in accordance with Embodiment 1 of the present invention. Figure 2 is a schematic diagram of the exploded structure of a water-cooling head 1 in accordance with Embodiment 1 of the present invention. Figure 3 is another schematic diagram of the exploded structure of a water-cooling head 1 in accordance with Embodiment 1 of the present invention. Figure 4 is a schematic diagram of the three-dimensional structure of a water-cooling head 1 in accordance with Embodiment 1 of the present invention mounted on a motherboard 15. As shown in Figures 1 to 4, Embodiment 1 provides a multi-stage composite water-cooling and heat dissipation system for dissipating heat from a load unit. The system includes a water-cooling head 1, a radiator 2, and a fluid pump 5. The water-cooling head 1 includes a first heat exchange mechanism and a second heat exchange mechanism. The bottom of the first heat exchange mechanism is fixed on the load unit; the bottom of the second heat exchange mechanism is fixed on the top of the first heat exchange mechanism, and the second heat exchange mechanism can dissipate heat for the fluid flowing through it; the radiator 2 is connected to the first heat exchange mechanism through the first connecting pipe 3 and the second connecting pipe 4, and the radiator 2 is used to dissipate heat for the fluid flowing through it; the fluid pump 5 is arranged on the first connecting pipe 3, and the fluid pump 5 is used to drive the flow of the fluid. The fluid enters the first heat exchange mechanism from the water inlet 9 of the first heat exchange mechanism through the second connecting pipe 4, and flows through the first heat exchange mechanism and the second heat exchange mechanism in sequence, and flows out from the water outlet 10 of the first heat exchange mechanism, and flows into the liquid inlet of the radiator 2 through the first connecting pipe 3 and the fluid pump 5, and flows out from the liquid outlet of the radiator 2, and flows into the water inlet 9 of the first heat exchange mechanism through the second connecting pipe 4, thereby forming a cooling cycle.

[0059] Specifically, the upper surface of the first heat exchange base 6 has heat dissipation shovel teeth 26, and there are micro-water channels between the heat dissipation shovel teeth 26 for the coolant to fully exchange heat here. The diverter plate 7 covers the heat dissipation shovel teeth to guide the flow of the coolant; wherein, the fluid pump 5 is arranged on the first connecting pipe 3, but the present invention is not limited to this. The fluid pump 5 can also be arranged on the second connecting pipe 4, or integrated with the radiator 2.

[0060] In this embodiment, the first heat exchange mechanism includes a first heat exchange base 6 and a diverter plate 7. The first heat exchange base 6 is fixed to the load unit and has heat dissipation fins 26 on its top. The first heat exchange base 6 is used to absorb heat from the load unit. The diverter plate 7 covers the heat dissipation fins 26 of the first heat exchange base 6 and has a first water inlet and at least one first water outlet.

[0061] In this embodiment, the second heat exchange mechanism includes a second heat exchange base 8, which is abutted against the top of the diverter plate 7, and the second heat exchange base 8 has at least one second water inlet hole 25 and a second water outlet hole 22; wherein, the water inlet 9 and the water outlet 10 are respectively opened on the side wall of the second heat exchange base 8, and the water inlet 9 is connected to the first water inlet hole of the diverter plate 7 through the second water outlet hole 22, and the water outlet 10 is connected to the second water outlet hole of the diverter plate 7 through the second water inlet hole 25.

[0062] In this embodiment, the second heat exchange mechanism further comprises: a first fin group 11, a second fin group 12, and a metal plate 13. The second fin group 12 is fixed to the bottom of the first fin group 11, and the bottom of the second fin group 12 extends into the second heat exchange base 8. The metal plate 13 is disposed between the first fin group 11 and the second fin group 12, and the bottom of the metal plate 13 abuts the top of the second heat exchange base 8. The second fin group 12 is configured to absorb heat from the fluid in the second heat exchange base 8 and transfer the heat to the first fin group 11 through the metal plate 13, and dissipate it into the air.

[0063] Specifically, the metal plate 13 can be, for example, an intermediate heat-conducting metal plate. Heat is transferred from the second fin group 12 to the heat-conducting metal plate and then to the first fin group 11, ultimately dissipating into the air and being carried away by the second heat exchange mechanism fan 14. The metal plate 13 can also be, for example, a heat spreader, which can further enhance heat transfer, reduce the thermal resistance between the second fin group 12 and the first fin group 11, and enhance heat exchange. To facilitate processing and forming, as shown in Figure 8, the metal plate 13 can be processed separately from the first fin group 11 and the second fin group 12, and then assembled together to form the metal plate 13. The connection method of the metal plate 13, the first fin group 11 and the second fin group 12 can be, for example: welding or screw fixing followed by abutment, the first fin group 11 and the second fin group 12 are protrudingly provided with a plurality of matching screw holes compared to the metal plate 13, and the metal plate 13 is fastened and abutted between the lower surface of the first fin group 11 and the upper surface of the second fin group 12. By connecting in the above manner, the contact thermal resistance between the heat transfer surfaces can be reduced.

[0064] Specifically, the first fin group 11, the metal plate 13 and the second fin group 12 can also be integrally formed, for example, the upper surface of the metal plate 13 extends axially to the first fin group 11, and the lower surface of the metal plate 13 extends axially to the second fin group 12, and the processing method can use a skiving machine to process the upper and lower surfaces of the metal plate 13 to form heat sinks.

[0065] In this embodiment, the second heat exchange mechanism further includes a second heat exchange mechanism fan 14 fixed on the top of the first fin group 11 , and the second heat exchange mechanism fan 14 is used to provide heat dissipation airflow to the first fin group 11 .

[0066] Specifically, the multi-stage composite water-cooling heat dissipation system of the present invention includes: a radiator 2, a first connecting pipe 3, a second connecting pipe 4, a water-cooling head 1, and a fluid pump 5. The fluid pump 5 is used to circulate the liquid. The radiator 2 has multiple sets of manifolds that dissipate heat into the air through the radiator cooling fan 27 on the radiator 2. The second fin group 12 is used to absorb heat from the fluid in the second heat exchange base 8 and transfer the heat to the first fin group 11 through the metal plate 13 to dissipate it into the air. The second heat exchange mechanism fan 14 accelerates heat dissipation by providing heat dissipation airflow to the first fin group 11.

[0067] In this embodiment, the load unit is fixed to the mainboard 15, and the diameter of the second heat exchange mechanism fan 14 is greater than or equal to the diameter of the first heat exchange base 6. When the diameter of the second heat exchange mechanism fan 14 is greater than the diameter of the first heat exchange base 6, the second heat exchange mechanism fan 14 can simultaneously provide heat dissipation airflow to the first fin group 11 and the mainboard 15.

[0068] Specifically, since the diameter of the fan 14 of the second heat exchange mechanism is greater than or equal to the diameter of the first heat exchange base 6, part of the wind from the fan 14 of the second heat exchange mechanism blows onto the first fin group 11, and the other part of the wind can be directly blown onto the mainboard 15, taking away the heat and hot air from the second heat exchange mechanism, while dissipating the heat from a part of the heating elements on the mainboard 15 to reduce the surface temperature of the mainboard 15, thereby improving the heat dissipation of the overall system, as shown in Figure 4, where the arrow indicates the direction of wind flow.

[0069] In this embodiment, the multi-stage composite water-cooling heat dissipation system further includes a control module electrically connected to the fluid pump 5, the second heat exchange mechanism fan 14, and the radiator cooling fan 27 of the radiator, respectively, for controlling or driving the fluid pump 5 and the second heat exchange mechanism fan 14 to operate in a controlled manner. The control module includes an information acquisition interface electrically connected to a host computer to obtain the heat dissipation requirement information of the load unit.

[0070] Specifically, during actual use of the host computer system, the heat generation of heat-generating components such as chips does not operate at a constant heat flow. Instead, the heat generation varies according to user usage, and this change is irregular. Therefore, to ensure system reliability, the cooling system needs to maintain a stable maximum output capacity for a long time, that is, all power components maintain the highest speed state. This situation will cause three problems:

[0071] 1. The system noise is always at the maximum level, causing trouble to users;

[0072] 2. Maintaining the highest speed for a long time, the heat generated by the fluid pump and fan circuits of the cooling system always remains at the maximum heat state. Long-term heat accumulation reduces the service life of the fluid pump and fan;

[0073] 3. The cooling fluid pump and fan use the computer's own power system. Maintaining maximum output all the time means that the cooling system uses maximum power consumption for a long time, resulting in serious power consumption.

[0074] However, the IC chip itself only maintains very low or medium power consumption most of the time. In order to reduce operating noise and power consumption as well as the heat generation of the cooling system itself, the cooling system's power components, such as the fluid pump and fan, need to be controlled according to the chip's heat generation.

[0075] At the same time, due to the irregular changes in IC chip power consumption, the use of simple linear control may lead to control hysteresis (the chip temperature rises first, and the power element increases its output according to the increased temperature). This will cause two problems:

[0076] 1. The increase in power system output is slower than the increase in chip temperature. Under high load conditions, the power system may not increase its speed until the chip temperature has exceeded the safe temperature for a certain period of time, reducing the safety of system operation.

[0077] 2. Control volatility: Under certain operating conditions, the temperature may rise, which will increase the output, causing the temperature to drop, and then reduce the output. This fluctuation phenomenon will occur in the output of the power component and the chip temperature, and in severe cases, control divergence may occur (temperature and control fluctuations change more and more over time).

[0078] The system mainly has three power components: the radiator cooling fan 27 (the main cooling power), the fluid pump 5 (the water system circulation power), and the second heat exchange mechanism fan 14 of the composite heat exchange cold head (an auxiliary cooling power that can directly blow the motherboard to remove a certain amount of heat from the motherboard).

[0079] As shown in FIG17 , the main control logic of the present invention is as follows:

[0080] 1. After the system is powered on, the cold row cooling fan 27, the fluid pump 5, and the second heat exchange mechanism fan 14 are all started and maintained at a certain rotational speed to ensure that the system has a certain heat dissipation capacity.

[0081] 2. Obtain the chip load heat dissipation requirement information through the information acquisition interface: In this example, the real-time core temperature t1 of the load is obtained.

[0082] 3. Set the cold head temperature t1 = t_set in the generation module. When t1 < t_set, the cold row cooling fan 27, the fluid pump 5, and the second heat exchange mechanism fan 14 are started and maintained at the initial rotational speed A0.

[0083] 4. Perform temperature judgment and calculate the control equation in real time in the generation module, and transfer the control information to the start module. The fan and the fluid pump are controlled in real time through the drive module to reach the required rotational speed: When t1 > t_set, first perform PID control on the fluid pump 5. The rotational speed of the fluid pump is as follows according to the control equation (1):

[0084] (1)

[0085] Where, is the maximum rotational speed, A is the real-time rotational speed of the fluid pump, j is the j-th moment, and t_set is the safety set temperature; and P, I, D are control coefficients, which need to be calibrated according to actual experience and experimental data.

[0086] 5. When the water temperature still exceeds the set temperature t_set when the fluid pump 5 reaches the maximum rotational speed, increase the rotational speed output of the cold row cooling fan 27. The cold row cooling fan 27 is controlled according to the control equation (1) to reduce the cold head temperature to the safety temperature. When the cold head temperature is lower than (t_set - 5)°C for a long time (maintained for x minutes), exit the control of the cold row cooling fan 27 and continue to use the fluid pump 5 for control until the next temperature exceeds the standard.

[0087] 6. If the cold row cooling fan 27 reaches the maximum rotational speed and still cannot reduce the temperature to the set temperature (t_set - 5)°C, then the second heat exchange mechanism fan 14 enters the control mode and is controlled according to the control equation (1) until the cold head temperature reaches the safety temperature. If the cold head temperature is lower than (t_set - 5)°C for a long time (maintained for x minutes), exit the control of the second heat exchange mechanism fan 14 and continue to use the fluid pump 5 - cold row cooling fan for control until the next temperature exceeds the standard.

[0088] Among them, parameters such as P, I, D for the fluid pump 5, the cold row cooling fan 27, and the second heat dissipation mechanism fan 14 should be calibrated according to experiments and empirical formulas respectively, rather than taking the same values.

[0089] In this embodiment, the multi-stage composite water-cooling heat dissipation system further includes a first waterproof gasket 16 and a second waterproof gasket 17. The first waterproof gasket 16 is disposed between the diverter plate 7 and the second heat exchange base 8, and the second waterproof gasket 17 is disposed between the second heat exchange base 8 and the metal plate 13.

[0090] In this embodiment, a housing cavity is provided within the second heat exchange base 8. The housing cavity is provided with a first housing space 18 and a second housing space 19, which are isolated from each other. The water inlet 9 and the water outlet 10 are provided on the sidewalls of the housing cavity. The second water outlet 22 is provided within the first housing space, and the second water inlet 25 is provided within the second housing space. The first housing space 18 is respectively connected to the water inlet 9 and the diverter plate 7, and the second housing space 19 is respectively connected to the diverter plate 7 and the water outlet 10. The bottom of the second fin assembly 12 extends into the second housing space 19.

[0091] In this embodiment, the second fin group 12 is composed of a plurality of fins 20 . The plurality of fins 20 are arranged according to the shape of the second accommodating space 19 and have equal-spaced sections and gradient sections.

[0092] Specifically, as shown in Figures 7 to 9, this type of second fin assembly 12 primarily serves to guide flow and enhance heat exchange. After the cold liquid enters the second accommodating space 19, it changes from vertical flow to horizontal flow, generating numerous vortexes and separations, potentially leading to some backflow, which reduces the overall heat exchange effect. Therefore, the multiple fins 20 at the bottom of the second fin assembly 12 can be used to rectify the incoming flow, making it more uniform and eliminating backflow. Furthermore, at the inlet (at the second water inlet 25), equally spaced sections and gradually increasing sections are provided between the multiple fins 20 to reduce water flow resistance. Equally spaced sections and gradually increasing sections are symmetrically provided on the second fin assembly exiting on the right side of the central axis.

[0093] In this embodiment, the second fin group 12 is composed of multiple groups of fins 20 , and each group of fins 20 is composed of multiple bent fins 20 .

[0094] Specifically, as shown in FIG. 10 and FIG. 11 , this type of second fin group 12 divides the overall heat dissipating fins 20 into multiple groups along the flow channel, and each group is formed by turning, thereby reducing the processing difficulty of the heat dissipating fins 20 .

[0095] In this embodiment, the second fin assembly 12 is composed of a plurality of heat exchange columns 21, which are arranged in a staggered manner. The heat exchange columns 21 are all teardrop-shaped and are metal columns or hollow heat pipe columns. The hollow heat pipe columns are filled with a cooling medium capable of phase-conversion heat transfer.

[0096] Specifically, as shown in Figure 12, this type of second fin group 12 has multiple heat exchange columns 21. The heat exchange columns 21 can be circular or teardrop-shaped along the incoming flow. The heat exchange columns 21 should be staggered to break up the vortex of the incoming flow, thereby enhancing heat exchange. However, this method may produce backflow on the overall flow, causing a certain amount of momentum loss and increasing water resistance. In addition, the heat exchange columns 21 can not only be simple metal columns, but also hollow heat pipes. The heat pipes are filled with a cooling medium that can phase-change heat to enhance heat exchange. In practical applications, the multi-stage composite water-cooling system of the present invention incorporates secondary heat exchange (a second heat exchange mechanism) in the water-cooling head 1, further reducing the outlet water temperature of the water-cooling head 1, achieving auxiliary heat exchange, and further increasing the overall heat exchange capacity of the system. The specific implementation scheme is as follows: The water-cooling head 1 is primarily divided into two upper and lower heat exchange channels (a first heat exchange mechanism and a second heat exchange mechanism). The first heat exchange mechanism absorbs heat generated by the chip (load unit), while the second heat exchange mechanism primarily serves as an auxiliary heat exchange mechanism, dissipating some of the heat and assisting in the heat dissipation of the radiator 2. As shown in Figures 2 and 5, arrows indicate the coolant flow path: water inlet 9 - first accommodating space 18 - central flow channel 23 of the manifold - first heat exchange base 6 - flow channels 24 on both sides of the manifold - second accommodating space 19 - water outlet 10. The primary heat exchange mechanism comprises the second heat exchange base 8, manifold 7, and first heat exchange base 6. The coolant absorbs heat from the first heat exchange base 6 in the manifold 7. The first heat exchange base 6 is positioned against the chip below, transferring heat dissipated during chip operation to the cooler cooling liquid through the fins 20 on the first heat exchange base 6. The cooling water absorbs the heat, raising its temperature and entering the second accommodating space 19 of the second heat exchange base 8 through the flow channels 24 on both sides of the manifold 7. The secondary heat exchange comprises the second heat exchange base 8 and a second heat exchange mechanism, wherein the second heat exchange mechanism has a second fin group 12 below. The high-temperature cooling liquid flows through the second fin group 12 and transfers heat to the first fin group 11 through the second fin group 12. The heat is ultimately released into the environment through the cooling air generated by the fan 14 of the second heat exchange mechanism. After dissipating a certain amount of heat, the cooling water returns to the radiator 2 through the water outlet 10, ultimately dissipating the remaining heat into the environment. As shown in FIG5 , regarding the flow direction of the cold liquid in the second heat exchange base 8, a second water outlet 22 is defined within the first accommodating space 18. The second water outlet 22 is connected to the water inlet 9 and the central flow channel 23 of the manifold 7, respectively. Furthermore, a second water inlet 25 is defined within the second accommodating space 19. The second water inlet 25 is connected to the flow channels 24 on both sides of the manifold 7 and the water outlet 10, respectively. This connects the manifold 7 with the first accommodating space 18 and the second accommodating space 19. The second accommodating space 19 is deepened to reduce the flow rate of the cold liquid, thereby increasing the heat exchange time and improving the heat transfer coefficient under the flow rate.In addition, as shown in FIG. 6, there may be two second water inlet holes 25 in the second accommodation space 19 of the second heat exchange base 8, that is, the two second water inlet holes 25 can communicate with one water outlet 10. The structure of the second fin group 12 corresponding to FIG. 6 is shown in FIGS. 13 and 14. The fins 20 at the bottom of the second fin group 12 should also be modified to the form with the minimum water resistance along the direction of cold liquid flow. Embodiment 2

[0097] FIG. 15 is a schematic flowchart of a control method for a water-cooled heat dissipation system with multi-stage compounding in Embodiment 2 of the present invention; as shown in FIG. 15, Embodiment 2 provides a control method for a water-cooled heat dissipation system with multi-stage compounding, which is applied to the control module of the water-cooled heat dissipation system with multi-stage compounding as described above. The control method includes:

[0098] Step S100, obtaining the heat dissipation requirement information of the load unit.

[0099] Specifically, the control module is electrically connected to the upper computer, and the control module obtains the heat dissipation requirement information of the load unit through the upper computer. The heat dissipation requirement information may be, for example, the real-time core temperature t1 of the load unit.

[0100] Step S200, generating at least one control signal according to the heat dissipation requirement information.

[0101] Step S300, controlling the operation of the fluid pump 5 and / or the cold row heat dissipation fan 27 and / or the second heat exchange mechanism fan 14 according to the control signal.

[0102] Specifically, after the system is powered on, the cold row heat dissipation fan 27, the fluid pump 5 and the second heat exchange mechanism fan 14 are all started and maintained at a certain speed to ensure that the system has a certain amount of heat dissipation; and in the control module, the cold head temperature t1 = t_set is set. When t1 < t_set, a first control signal is generated, so that the control module controls the cold row heat dissipation fan 27, the fluid pump 5 and the second heat exchange mechanism fan 14 to start and maintain at the initial speed A0 according to the first control signal. Temperature judgment is performed in the control module and the control equation is calculated in real time, and the fan and the fluid pump are controlled in real time by the control module to reach the required speed: when t1 > t_set, a second control signal is generated. First, the fluid pump 5 is subjected to PID control through the second control signal. The rotational speed of the fluid pump is as shown in Equation (1):

[0103] (1)

[0104] Where is the maximum speed, A is the real-time rotational speed of the fluid pump, j is the jth moment, t_set is the safety set temperature; and P, I, D are control coefficients, which need to be calibrated according to actual experience and experimental data.

[0105] When the fluid pump 5 reaches the maximum speed and the water temperature still exceeds the set temperature t_set, a third control signal is generated. The third control signal is used to increase the speed output of the radiator cooling fan 27. The radiator cooling fan 27 is controlled according to the control equation (1) to reduce the cold head temperature to a safe temperature. When the cold head temperature is lower than (t_set-5)°C for a long time (maintained for x minutes), a fourth control signal is generated. The control of the radiator cooling fan 27 is exited through the fourth control signal, and the fluid pump 5 is continued to be used for control until the temperature exceeds the standard next time. If the radiator cooling fan 27 reaches the maximum speed and still cannot reduce the temperature to the set temperature (t_set-5)°C, a fifth control signal is generated, and the second heat exchange mechanism fan 14 enters the control mode through the fifth control signal, and is controlled by the control equation (1) until the cold head temperature reaches a safe temperature. If the cold head temperature is lower than (t_set-5)°C for a long time (maintained for x minutes), a sixth control signal is generated, and the control of the second heat exchange mechanism fan 14 is exited through the sixth control signal, and the fluid pump 5-radiator cooling fan is continued to be used for control until the temperature exceeds the standard next time; wherein, the parameters such as P, I, and D for the fluid pump 5, the radiator cooling fan 27, and the second heat exchange mechanism fan 14 should be calibrated separately according to experiments and empirical formulas, rather than taking the same values.

[0106] Based on the above analysis, it can be seen that the control module obtains the heat dissipation requirements of the load unit through the upper computer. The control module can generate different control signals according to the heat dissipation requirements, so that the fluid pump 5 and / or the radiator cooling fan 27 and / or the second heat exchange mechanism fan 14 can be adjusted accordingly, thereby effectively improving the total heat dissipation capacity, having a good energy-saving effect, and can meet the heat source heat dissipation requirements and solve problems such as control lag and high noise. Example 3

[0107] Figure 16 is a structural diagram of a control device for a water-cooling and heat dissipation system with a multi-stage composite in Example 3 of the present invention. As shown in Figure 16, Example 3 provides a control device for a water-cooling and heat dissipation system with a multi-stage composite, which is applied to the control method for a water-cooling and heat dissipation system with a multi-stage composite as described above, and the control device includes: an acquisition module 161, a generation module 162, and a control module 163. The acquisition module 161 is used to obtain the heat dissipation requirement information of the load unit. The generation module 162 is used to generate at least one control signal based on the heat dissipation requirement information. And the control drive module 163 is used to control the operation of the fluid pump and / or the radiator cooling fan and / or the second heat exchange mechanism fan according to the control signal.

[0108] The various variations and specific examples of the control method for a water-cooling and heat dissipation system with a multi-stage composite provided in Example 2 are also applicable to the control device for a water-cooling and heat dissipation system with a multi-stage composite provided in this embodiment. Through the above detailed description of the control method for a water-cooling and heat dissipation system with a multi-stage composite, those skilled in the art can clearly understand the implementation method of the control device for a water-cooling and heat dissipation system with a multi-stage composite in this embodiment, so for the sake of brevity of the specification, it will not be described in detail here. Example 4

[0109] Embodiment 4 provides a chassis that adopts the multi-stage composite water-cooling heat dissipation system as described above, or the control device of the multi-stage composite water-cooling heat dissipation system as described above, or the control method of the multi-stage composite water-cooling heat dissipation system as described above. Example 5

[0110] Embodiment 5 provides an electronic device, which adopts the chassis described above.

[0111] In summary, the multi-stage composite water cooling system, control method, and control device of the present invention have the following beneficial effects:

[0112] 1. Adding a second heat exchange mechanism further increases the overall heat capacity of the system, improves the system's heat storage capacity, and thus improves the stability of the IC chip to fluctuations in working conditions;

[0113] 2. The second fin group of the second heat exchange mechanism adds fins 20 to increase the heat exchange area of ​​the second fin group. After the high-temperature cooling liquid passes through the first heat exchange, it is at the highest temperature in the system. It flows to the second heat exchange mechanism and exchanges heat with the environment to obtain a fluid with a slightly lower temperature, further increasing the heat exchange capacity of the system.

[0114] 3. The heat exchange fins of the second heat exchange mechanism are designed in more than 20 shapes to adapt to different working conditions and improve heat exchange efficiency while reducing flow resistance;

[0115] 4. The heat exchange through the second heat exchange mechanism after the first heat exchange mechanism increases the heat exchange area. The second heat exchange mechanism fan 14 is set on the top of the second heat exchange mechanism and then the heat is dissipated through the radiator 2. Compared with the conventional single heat exchange and single heat dissipation, the efficiency is improved.

[0116] 5. The metal plate 13 is arranged on the side where the first heat exchange mechanism and the second heat exchange mechanism abut against the heat dissipation module, thereby improving the heat conduction efficiency between the second heat exchange mechanism and the primary heat dissipation module;

[0117] 6. The flow resistance is reduced by the shape of the guide plate of the second fin group;

[0118] 7. The metal plate 13 increases the efficiency of heat transfer from the water-cooled chamber to the heat dissipation fins 20;

[0119] 8. The second heat exchange mechanism fan 14 not only dissipates heat to the load unit, but also dissipates heat to the heat source on the entire mainboard 15 .

[0120] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise forms disclosed, and it is apparent that many variations and modifications are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the invention and their practical application, thereby enabling those skilled in the art to realize and utilize a variety of exemplary embodiments of the invention and various options and modifications. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A multi-stage composite water cooling system for cooling a load unit, characterized in that: The system includes a water cooling head, and the water cooling head includes: a first heat exchanging mechanism, wherein a bottom portion of the first heat exchanging mechanism is fixed on the load unit; and The second heat exchange mechanism has a bottom portion fixed on the top portion of the first heat exchange mechanism, and the second heat exchange mechanism can dissipate heat for the fluid flowing through the second heat exchange mechanism.

2. The multi-stage composite water cooling system according to claim 1, characterized in that: The first heat exchange mechanism includes: a first heat exchange base, fixed on the load unit, the top of the first heat exchange base having heat dissipation shovel teeth, and the first heat exchange base is used to absorb heat from the load unit; and The diverter plate is covered on the heat dissipation shovel teeth of the first heat exchange base, and the diverter plate has a first water inlet hole and at least one first water outlet hole.

3. The multi-stage composite water cooling system according to claim 2, characterized in that: The second heat exchange mechanism includes: a second heat exchange base, abutting against the top of the diverter plate, and having at least a second water inlet and a second water outlet; Wherein, the water inlet and the water outlet are respectively opened on the side wall of the second heat exchange base, and the water inlet is connected to the first water inlet hole of the diverter plate through the second water outlet hole, and the water outlet is connected to the second water outlet hole of the diverter plate through the second water inlet hole.

4. The multi-stage composite water cooling and heat dissipation system according to claim 3, characterized in that: The second heat exchange mechanism further includes: First fin group; a second fin group fixed to the bottom of the first fin group, and the bottom of the second fin group extends into the second heat exchange base; and a metal plate, disposed between the first fin group and the second fin group, with the bottom of the metal plate abutting against the top of the second heat exchange base; The second fin group is used to absorb the heat of the fluid in the second heat exchange base, and transfer the heat to the first fin group through the metal plate and dissipate the heat into the air.

5. The multi-stage composite water cooling and heat dissipation system according to claim 4, characterized in that: The second heat exchange mechanism further includes a second heat exchange mechanism fan fixed on the top of the first fin group, and the second heat exchange mechanism fan is used to provide heat dissipation airflow to the first fin group.

6. The multi-stage composite water cooling system according to claim 5, wherein the load unit is fixed on the mainboard, The diameter of the fan of the second heat exchange mechanism is greater than or equal to the diameter of the first heat exchange base; Wherein, when the diameter of the second heat exchange mechanism fan is larger than the diameter of the first heat exchange base, the second heat exchange mechanism fan can provide heat dissipation airflow to the first fin group and the mainboard at the same time.

7. The multi-stage composite water cooling and heat dissipation system according to claim 4, characterized in that: Also includes: a cold row, the cold row being connected to the first heat exchange mechanism through a first connecting pipe and a second connecting pipe, and the cold row being used to dissipate heat for the fluid flowing through the cold row; as well as a fluid pump, disposed on the first connecting pipe, and configured to drive the fluid to flow; Among them, the fluid enters the first heat exchange mechanism from the water inlet of the second heat exchange mechanism through the second connecting pipe, and flows through the first heat exchange mechanism and the second heat exchange mechanism in sequence, and flows out from the water outlet of the second heat exchange mechanism, and flows into the liquid inlet of the radiator through the first connecting pipe and the fluid pump, and flows out from the liquid outlet of the radiator, and flows into the water inlet of the second heat exchange mechanism through the second connecting pipe, thereby forming a cooling cycle.

8. The multi-stage composite water cooling and heat dissipation system according to claim 7, characterized in that: It also includes a control module, which is electrically connected to the fluid pump, the second heat exchange mechanism fan and the radiator cooling fan of the radiator, and is used to control or drive the fluid pump, the second heat exchange mechanism fan and the radiator cooling fan to operate in a controlled manner; The control module includes an information acquisition interface, which is used to be electrically connected to a host computer and to obtain the heat dissipation requirement information of the load unit.

9. The multi-stage composite water cooling and heat dissipation system according to claim 5, characterized in that: Also includes: a first waterproof gasket, disposed between the diverter plate and the second heat exchange base; as well as The second waterproof gasket is arranged between the second heat exchange base and the metal plate.

10. The multi-stage water cooling and heat dissipation system according to claim 5, wherein: The second heat exchange base is provided with a receiving cavity, the receiving cavity is provided with a first receiving space and a second receiving space isolated from each other, and the water inlet and the water outlet are opened on the side wall of the receiving cavity; Wherein, the second water outlet is provided in the first accommodating space, and the second water inlet is provided in the second accommodating space; Wherein, the first accommodating space is respectively communicated with the water inlet and the diverter plate, and the second accommodating space is respectively communicated with the diverter plate and the water outlet; Wherein, the bottom of the second fin group extends into the second accommodating space.

11. The multi-stage composite water cooling and heat dissipation system according to claim 10, wherein: The second fin group consists of a plurality of fins, which are arranged according to the shape of the second accommodating space and have equal-spaced sections and gradient sections.

12. The multi-stage water cooling and heat dissipation system according to claim 10, wherein: The second fin group consists of multiple groups of fins, and each group of fins consists of multiple bent fins.

13. The multi-stage composite water cooling and heat dissipation system according to claim 10, wherein: The second fin group is composed of a plurality of heat exchange columns, the plurality of heat exchange columns are arranged in a staggered manner, the heat exchange columns are all in a water drop shape, and the heat exchange columns are metal columns or hollow heat pipe columns; The hollow heat pipe column is filled with a cooling medium that can transfer heat through phase change.

14. A control method for a multi-stage composite water cooling and heat dissipation system, applied to the control module of the multi-stage composite water cooling and heat dissipation system according to any one of claims 1 to 13, characterized in that: The control method includes: Obtaining heat dissipation requirement information of the load unit; generating at least one control signal according to the heat dissipation requirement information; According to the control signal, the operation of the fluid pump and / or the radiator fan and / or the fan of the second heat exchange mechanism is controlled.

15. A control device for a multi-stage composite water cooling and heat dissipation system, applied to the control method for a multi-stage composite water cooling and heat dissipation system as claimed in claim 14, characterized in that: The control device comprises: An acquisition module is used to obtain heat dissipation requirement information of the load unit; a generating module, configured to generate at least one control signal according to the heat dissipation requirement information; and The control module is used to control the operation of the fluid pump and / or the radiator fan and / or the second heat exchange mechanism fan according to the control signal.

16. A chassis, characterized in that: A water-cooling and heat dissipation system with a multi-stage composite as described in any one of claims 1 to 13 or a control device for a water-cooling and heat dissipation system with a multi-stage composite as described in claim 15, or a control method for a water-cooling and heat dissipation system with a multi-stage composite as described in claim 14 is used.

17. An electronic device, characterized in that: A chassis as claimed in claim 16 is used.

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