Liquid cooling radiator and power module
By designing a multi-opening flow path and an isolation plate structure in the liquid-cooled radiator, the problem of large flow pressure drop of the cooling medium is solved, and more efficient cooling performance and heat dissipation effect are achieved.
Patent Information
- Application Number
- PCT/CN2025/082649
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-22
- Filing Date
- 2025-03-14
- Publication Date
- 2025-09-25
AI Technical Summary
The cooling medium in the existing liquid cooling radiator flows in one direction, which increases the flow channel length, increases the pressure drop, and reduces the cooling performance.
A liquid-cooled radiator is designed. Multiple openings are provided on a cover plate to allow the cooling medium to flow in opposite directions, shortening the flow path. Isolation plates are provided between the cover plates to provide support and optimize the flow channel structure.
The flow pressure drop of the cooling medium is reduced, the cooling performance and heat dissipation efficiency are improved, and the uniformity of flow distribution and the cooling effect are enhanced.
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Figure CN2025082649_25092025_PF_FP_ABST
Abstract
Description
Liquid cooling radiator and power module
[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 22, 2024, with application number 202410339738.4, and priority to the Chinese patent application entitled “A Liquid Cooling Radiator and Power Module”, all contents of which are incorporated by reference into this application. Technical Field
[0002] The present application relates to the field of heat exchange technology, and in particular to a liquid cooling radiator and a power module. Background Art
[0003] Liquid-cooled heat sinks are commonly used for power devices in power supply equipment in data centers, charging equipment or motor controllers in electric vehicles, and inverters or optimizers in photovoltaic systems. With the rapid development of industries like energy and photovoltaics, the power of power equipment continues to increase, placing new demands on the cooling performance of existing liquid-cooled heat sinks.
[0004] In existing liquid-cooled radiators, the flow direction of the cooling medium is usually unidirectional, which increases the length of the flow channel, increases the pressure drop of the cooling medium in the flow channel, and thus reduces the cooling performance of the liquid-cooled radiator. Summary of the Invention
[0005] The present application provides a liquid-cooled radiator and a power module to reduce the pressure drop of the liquid-cooled radiator and improve the cooling performance of the liquid-cooled radiator.
[0006] In a first aspect, the present application provides a liquid-cooled radiator, which includes a plurality of first heat dissipation teeth, a first cover plate, a side plate and a bottom plate. The first cover plate and the bottom plate are stacked along a first direction, and the bottom plate, the side plate and the first cover plate are arranged to form a first cavity. The plurality of first heat dissipation teeth are arranged on the surface of the bottom plate facing the first cover plate, and the surface of the bottom plate away from the first cover plate is used to contact the power module to dissipate heat from the power module. The first cover plate includes a first opening, a second opening and a third opening arranged in sequence along a second direction. The first opening, the second opening and the third opening respectively pass through the first cover plate along the first direction, and the first direction and the second direction are perpendicular. The second opening is used for the cooling medium to flow into the first cavity, and the first opening and the third opening are used for the cooling medium to flow out of the first cavity, or the first opening and the third opening are used for the cooling medium to flow into the first cavity, and the second opening is used for the cooling medium to flow out of the first cavity.
[0007] It should be understood that in existing liquid-cooled radiators, the inlet and outlet of the cooling medium are usually set on both sides of the cavity, and the cooling medium can only flow in one direction in the cavity, which makes the flow path of the cooling medium longer, resulting in increased pressure drop and reduced cooling performance.
[0008] In an embodiment of the present application, a first opening, a second opening, and a third opening are sequentially provided on the first cover plate of the liquid-cooled radiator in the same direction, that is, the second opening is located between the first opening and the third opening. The cooling medium can flow into the first cavity through the second opening in the middle and flow out from the first opening and the third opening, or flow into the first cavity through the first opening and the third opening and flow out from the second opening. This shortens the distance between the inlet and outlet, and the cooling medium in the first cavity can flow in opposite directions to achieve a heat exchange cycle, reducing the flow path of the cooling medium, thereby reducing the pressure drop, and improving the heat dissipation efficiency. In addition, the cooling medium entering the first cavity from the first cover plate can impact the heat dissipation teeth on the bottom plate along the first direction, thereby helping to improve the cooling performance.
[0009] In combination with the first aspect, in certain implementations of the first aspect, the liquid-cooled radiator also includes a second cover plate, the second cover plate and the first cover plate are stacked along the first direction, the second cover plate is located on the side of the first cover plate away from the base plate, and the second cover plate, the side plate and the first cover plate are surrounded to form a second cavity, a third cavity is provided in the second cavity, the third cavity is connected to the first cavity through the second opening, the third cavity includes a fourth opening, the fourth opening passes through the side plate or the second cover plate, and the fourth opening is used for the cooling medium to flow into or out of the third cavity, the second cavity includes a fifth opening, the fifth opening passes through the side plate or the second cover plate, and the fifth opening is used for the cooling medium to flow into or out of the second cavity.
[0010] In an embodiment of the present application, a second cover plate is arranged above the first cover plate, thereby forming an upper cavity between the second cover plate, the side plate and the first cover plate, wherein a third cavity connected to the lower cavity is arranged in the upper cavity, and the cooling medium can directly enter the lower cavity from the outside through the opening on the third cavity, and return to the upper cavity through the first opening and the second opening for further cooling, thereby improving the cooling effect.
[0011] In some embodiments, the first opening and the third opening on the first cover plate can be formed by enclosing the groove on the first cover plate and the side plate, thereby reducing the difficulty of processing and assembling the first cover plate and improving the adaptability of the first cover plate and the side plate.
[0012] In combination with the first aspect, in certain implementations of the first aspect, the third cavity is formed by at least the first cover plate, the isolation plate, and the second cover plate.
[0013] In an embodiment of the present application, an isolation plate is provided between the first cover plate and the second cover plate to form a first flow channel. The isolation plate can provide support for the first cover plate, thereby preventing the first cover plate from warping toward the upper cavity, thereby reducing the diversion at the top of the heat dissipation teeth and increasing the flow between the heat dissipation teeth in the lower cavity.
[0014] In combination with the first aspect, in certain implementations of the first aspect, the absolute value of the difference between the distance between the second opening and the first opening and the distance between the second opening and the third opening does not exceed the first threshold, and the absolute value of the difference between the distance between the fifth opening and the first opening and the distance between the fifth opening and the third opening does not exceed the second threshold.
[0015] In the embodiment of the present application, by limiting the distance between the second opening and the fifth opening between the first opening and the third opening, the distance between the inlet and different outlets of the cooling medium can be balanced, thereby making the flow distribution in the liquid-cooled radiator more balanced and improving the cooling effect.
[0016] It should be understood that the first threshold and the second threshold can be set according to factors such as experimental data, working conditions, equipment size, etc. This application does not limit the determination method and specific numerical setting of the first threshold and the second threshold.
[0017] In some embodiments, the fourth opening and the fifth opening are provided on the second cover plate. Thus, by designing the fourth opening and the fifth opening on the second cover plate of the liquid cooling radiator, it is possible to facilitate connection of the liquid cooling radiator with external pipes, thereby reducing the difficulty of installing the liquid cooling radiator.
[0018] In combination with the first aspect, in certain implementations of the first aspect, a length of the first opening, the second opening, or the third opening in a third direction is greater than a length in the second direction, and the third direction is perpendicular to the first direction and the second direction.
[0019] In an embodiment of the present application, by making the length of the first opening, the second opening or the third opening in the third direction greater than the length of the cooling medium in the flow direction of the lower cavity, the cooling medium can be distributed more evenly in the third direction when entering the lower cavity, thereby reducing the diversion of the cooling medium in the third direction, which in turn helps to improve the cooling performance.
[0020] In conjunction with the first aspect, in certain implementations of the first aspect, the plurality of first heat dissipating teeth include a plurality of second heat dissipating teeth and a plurality of third heat dissipating teeth, the fluid resistance of the second heat dissipating teeth is less than the fluid resistance of the third heat dissipating teeth, and when the second opening is used for cooling medium to flow into the first cavity, the plurality of second heat dissipating teeth are closer to the second opening than the plurality of third heat dissipating teeth. When the first opening and the third opening are used for cooling medium to flow into the first cavity, the plurality of second heat dissipating teeth are closer to the first opening and the third opening than the plurality of third heat dissipating teeth.
[0021] In an embodiment of the present application, by arranging a second heat dissipation tooth with smaller fluid resistance near the cooling medium inlet, the pressure drop of the cooling medium in the lower cavity can be better reduced, and the heat dissipation capacity of the nearby second heat dissipation tooth can be improved due to the impact of the cooling medium along the first direction below the inlet, thereby balancing the cooling performance and pressure drop of the cooling medium in the lower cavity, thereby improving the cooling effect.
[0022] Fluid resistance refers to the resistance experienced by an object in a fluid (liquid or gas) when it is in relative motion with the fluid. In this implementation, the fluid resistance of the second heat dissipation tooth refers to the resistance experienced by the cooling medium when the second heat dissipation tooth is in relative motion with the cooling medium. The fluid resistance of the third heat dissipation tooth refers to the resistance experienced by the cooling medium when the third heat dissipation tooth is in relative motion with the cooling medium.
[0023] In combination with the first aspect, in certain implementations of the first aspect, the power module includes a first power module and a second power module, the first cover plate is provided with a sixth opening, the sixth opening and the second opening are arranged along a third direction, there is a gap between the sixth opening and the second opening, the projection of the first power module in the second direction at least partially overlaps with the projection of the second opening in the second direction, and the projection of the second power module in the second direction at least partially overlaps with the projection of the sixth opening in the second direction.
[0024] In an embodiment of the present application, by providing a gap between the sixth opening and the second opening arranged along the third direction, the position where the cooling medium enters the lower cavity can be accurately controlled, so that when the cooling medium flows along the second direction, it flows more to the two sides of the sixth opening and the second opening, that is, the area where the power module is set, thereby helping to improve the cooling performance.
[0025] In combination with the first aspect, in certain implementations of the first aspect, the first cover plate includes a seventh opening and an eighth opening, the seventh opening and the first opening are arranged along a third direction, there is a gap between the seventh opening and the first opening, the eighth opening and the third opening are arranged along the third direction, there is a gap between the eighth opening and the third opening, and the seventh opening, the sixth opening and the eighth opening are arranged in sequence along the second direction.
[0026] In the embodiment of the present application, by further providing a seventh opening and an eighth opening on both sides of the sixth opening along the second direction, the cooling medium from the sixth opening can be guided accordingly, thereby enhancing the circulation efficiency and improving the cooling capacity.
[0027] In combination with the first aspect, in certain implementations of the first aspect, the power of the first power module is greater than that of the second power module, and along the first direction, the projected area of the sixth opening is greater than the projected area of the second opening, the projected area of the fifth opening is greater than the projected area of the first opening, and the projected area of the sixth opening is greater than the projected area of the third opening.
[0028] In an embodiment of the present application, changing the size of the opening can control the flow distribution of the cooling medium in the third direction. By making the openings on both sides of the power module with higher power larger, more cooling medium can pass through, so that the cooling medium flows more to the sides of the larger opening, thereby improving the cooling capacity of the high-power power modules on both sides of the larger opening, which helps to meet the cooling needs of different areas.
[0029] In combination with the first aspect, in certain implementations of the first aspect, a fourth cavity is provided in the second cavity, the fourth cavity is connected to the first cavity through a ninth opening, the ninth opening and the second opening are arranged along the second direction, and there is a gap between the ninth opening and the second opening.
[0030] In the embodiment of the present application, by providing other cavities in the upper cavity of the liquid-cooled radiator that are connected to the lower cavity, the control capability of the cooling medium can be improved, thereby improving the cooling uniformity in the second direction.
[0031] In combination with the first aspect, in some implementations of the first aspect, the first cover plate includes a tenth opening, and the tenth opening is disposed between the second opening and the ninth opening on the first cover plate.
[0032] In the embodiment of the present application, by setting an opening between the second opening and the ninth opening, the cooling medium flowing out of the lower cavity can be returned to the upper cavity through the opening, thereby enhancing the circulation capacity between the upper and lower cavities and further improving the heat dissipation performance.
[0033] In combination with the first aspect, in certain implementations of the first aspect, a first partition is provided in the first cavity, and at least a partial projection of the first partition along the first direction coincides with a projection of the tenth opening.
[0034] In an embodiment of the present application, by setting a partition on the floor below the seventh opening, the cooling medium in the lower cavity can be guided into the upper cavity through the partition when flowing toward the tenth opening, thereby enhancing the circulation capacity between the upper and lower cavities and further improving the heat dissipation performance.
[0035] In combination with the first aspect, in certain implementations of the first aspect, the liquid-cooling radiator includes a plurality of fourth heat dissipation teeth, and the plurality of fourth heat dissipation teeth are arranged on a surface of the first cover plate facing the second cover plate.
[0036] In the embodiment of the present application, by arranging a plurality of heat dissipation teeth in the upper cavity, the cooling medium in the upper cavity can be further dissipated, thereby improving the heat dissipation capacity of the liquid cooling radiator.
[0037] In combination with the first aspect, in some implementations of the first aspect, the plurality of fourth heat dissipation teeth are integrally formed with at least some of the plurality of first heat dissipation teeth.
[0038] In an embodiment of the present application, by integrally forming the heat dissipation teeth of the upper layer and at least part of the heat dissipation teeth of the lower layer, the heat of at least part of the heat dissipation teeth in the lower cavity can be transferred upward to the heat dissipation teeth in the upper cavity, which is beneficial for the upper cavity to assist the lower cavity in cooling, thereby improving the cooling efficiency of the liquid-cooled radiator.
[0039] In the second aspect, the present application provides a power module, which includes a power module and the above-mentioned first aspect and any possible liquid-cooled radiator in the first aspect, and the surface of the base plate away from the first cover plate contacts the power module to dissipate heat from the power module.
[0040] On the third aspect, the present application provides a power supply system, which includes a power supply, a load and the power module of the second aspect mentioned above. The power supply is connected to the input end of the power module, and the electrical equipment is connected to the output end of the power module. The power module is used to convert the direct current output of the power supply into alternating current and transmit the alternating current to the load.
[0041] In a fourth aspect, the present application provides a vehicle, which includes a vehicle body and the power module of the second aspect described above, wherein the power module is mounted on the vehicle body.
[0042] In a fifth aspect, the present application provides a photovoltaic system, which includes a photovoltaic component and a power module according to the second aspect above. The photovoltaic component is electrically connected to the power module, and the direct current generated by the photovoltaic component is converted into alternating current through the power module. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] FIG1 is a schematic structural diagram of a power supply system provided in an embodiment of the present application.
[0044] FIG2 is a schematic structural diagram of a vehicle provided in an embodiment of the present application.
[0045] FIG3 is a schematic structural diagram of a photovoltaic system provided in an embodiment of the present application.
[0046] FIG4 is a schematic structural diagram of a power module provided in an embodiment of the present application.
[0047] FIG5 is a schematic structural diagram of a liquid cooling radiator provided in an embodiment of the present application.
[0048] FIG6 is a schematic structural diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0049] FIG7 is a schematic structural diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0050] FIG8 is another schematic diagram of the liquid cooling radiator shown in FIG6 .
[0051] FIG. 9 is another schematic diagram of the liquid cooling radiator shown in FIG. 6 .
[0052] FIG10 is a cross-sectional schematic diagram of a liquid cooling radiator provided in an embodiment of the present application.
[0053] FIG11 is a schematic structural diagram of the liquid cooling radiator shown in FIG10 .
[0054] FIG12 is a cross-sectional schematic diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0055] FIG13 is a cross-sectional schematic diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0056] FIG14 is a schematic top projection diagram of a liquid cooling radiator provided in an embodiment of the present application.
[0057] FIG15 is a schematic top view projection diagram of another liquid cooling radiator provided in an embodiment of the present application.
[0058] FIG16 is a schematic structural diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0059] FIG17 is a cross-sectional schematic diagram of another liquid-cooled radiator provided in an embodiment of the present application.
[0060] FIG18 is a cross-sectional schematic diagram of another liquid-cooled radiator provided in an embodiment of the present application. DETAILED DESCRIPTION
[0061] The technical solution in this application will be described below with reference to the accompanying drawings.
[0062] In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships can exist, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.
[0063] The terms "first", "second", "third", "fourth" and the like in this application (if any) are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in a sequence other than those illustrated or described herein. The size of the sequence number of each process below does not mean the order of execution, and the order of execution of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. For example, in the embodiment of the present application, words such as "110", "210", "220" are only marks made for the convenience of description, and are not intended to limit the device.
[0064] References to "some embodiments" and the like in this specification mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in some embodiments" and the like that appear in different places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0065] Unless otherwise defined, technical terms or scientific data used in this application should have the common meanings understood by persons having ordinary skills in the technical field to which this application belongs.
[0066] In order to make the technical problems solved by this application, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of this application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.
[0067] It should also be understood that the various implementation methods described in this specification can be implemented individually or in combination, and the embodiments of the present application are not limited to this.
[0068] In the embodiments of this application, the same reference numerals represent the same component or part. In the embodiments of this application, for multiple identical parts, only one of the parts may be labeled with a reference numeral in the drawings as an example. The same reference numerals apply to other identical parts or components. In addition, the sizes and dimensions of the parts shown in the drawings are for illustrative purposes only.
[0069] Parallel: The parallel defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, allowing for situations where absolute parallelism is not achieved due to factors such as assembly tolerance, design tolerance, and the influence of structural flatness.
[0070] Vertical: The vertical defined in this application is not limited to an absolute vertical intersection relationship (angle of 90 degrees). It allows for non-absolute vertical intersection relationships caused by factors such as assembly tolerance, design tolerance, and structural flatness. It allows for errors in a small angle range. For example, the assembly error range of 80 to 100 degrees can be understood as a vertical relationship.
[0071] In addition, in this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the structure.
[0072] The power module is the main heat-generating component in power equipment. If the equipment temperature cannot be reduced in time, the power module is prone to damage due to overheating. Therefore, the power module is usually equipped with a liquid-cooled radiator to form a power module to dissipate heat and improve its operating reliability. At present, the liquid-cooled radiator of the power module generally adopts the cooling medium to dissipate heat. The liquid-cooled radiator is provided with a flow channel inside so that the cooling medium can circulate inside the flow channel to remove the heat generated by the power module. However, in existing liquid-cooled radiators, the flow direction of the cooling medium is usually unidirectional, which increases the length of the flow channel, increases the pressure drop of the cooling medium in the flow channel, and thus reduces the heat dissipation efficiency of the liquid-cooled radiator.
[0073] The present application provides a liquid-cooled radiator that can be used in a power module to dissipate heat from the power module. The power module containing the liquid-cooled radiator of the present application can be used in photovoltaic systems and vehicle power systems.
[0074] Please refer to Figure 1, which is a schematic diagram of the structure of a power supply system 1 provided in an embodiment of the present application. In one possible implementation, the power supply system 1 includes a power module 4, a power supply 11, and a load 12. The power supply 11 is connected to the input end of the power module 4, and the load 12 is connected to the output end of the power module 4. The power module 4 is used to convert the direct current output by the power supply 11 into alternating current and transmit the alternating current to the load 12. Among them, the power module 4 is a semiconductor device that converts the voltage, current, frequency, etc. of the direct current output by the power supply 11, and is the core device of the power conversion of the power supply system 1. For example, the power supply system 1 can be used as the core device of the motor control unit of an electric vehicle to convert direct current into alternating current, converting direct current into the alternating current required for vehicle operation.
[0075] Please refer to Figure 2, which is a schematic structural diagram of a vehicle 2 provided in an embodiment of the present application. In one possible implementation, the vehicle 2 includes a vehicle body 20 and a power supply system 1 as described above, and the power supply system 1 is installed on the vehicle body 20. The power supply system 1 provides a power source for the vehicle 2. The vehicle 2 includes an electric vehicle / electric vehicle (EV), a pure electric vehicle / battery electric vehicle (PEV / BEV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), a new energy vehicle, etc. In some embodiments, the vehicle 2 includes a passenger car, various special operation vehicles with specific functions, such as engineering rescue vehicles, water trucks, sewage suction trucks, cement mixers, crane trucks, medical vehicles, etc. In this embodiment, the vehicle 22 is a car, the power supply 11 is a power battery in the vehicle 2, and the load 12 is an electric motor in the vehicle 2, which can drive the wheels 21 to rotate. The vehicle 2 may have three wheels 21 or more than three wheels, which is not limited in this application.
[0076] In some embodiments, power system 1 includes an inverter (not shown), which is equipped with a power module 4 and a control circuit (not shown). In other words, power module 4 is mounted on the vehicle body. The control circuit is electrically connected to power module 4 and can control the performance parameters of the AC power output by power module 4 to the electric motor, such as voltage, current, frequency, etc., according to the needs of vehicle 2.
[0077] Referring to FIG. 3 , the power module 4 of the present application can also be used in a photovoltaic system 3 . FIG. 3 is a schematic structural diagram of a photovoltaic system 3 provided in one embodiment of the present application. In one possible implementation, the photovoltaic system 3 includes a photovoltaic module 30 and a power module 4 . The photovoltaic module 30 is electrically connected to the power module 4 . The direct current generated by the photovoltaic module 30 is converted into alternating current by the power module 4 . The alternating current output by the power module 4 is transmitted to a power-consuming device 12 , such as a base station or a data center.
[0078] The photovoltaic assembly 30 includes at least one photovoltaic panel 300, which is connected to the power module 4. In one embodiment, the photovoltaic assembly 30 includes multiple photovoltaic panels 300 connected in series. Through the series connection, the DC power from the multiple photovoltaic panels 300 is aggregated and connected to the power module 4 via a connector. In some embodiments, the photovoltaic system 3 includes an inverter (not shown), which is equipped with a power module 4 and a control circuit (not shown). The control circuit is electrically connected to the power module 4 and can control the performance parameters of the AC power output by the power module 4, such as voltage, current, frequency, etc., according to the needs of the load 12.
[0079] Please refer to Figure 4, which is a schematic diagram of the structure of a power module 4 provided in an embodiment of the present application. In one possible implementation, the power module 4 includes a power module 42 and a liquid-cooling radiator 5. The power module 42 and the liquid-cooling radiator 5 are stacked along a first direction Z. The liquid-cooling radiator 5 can be disposed outside the power module 42 or be a part of the power module 42, and can be used to dissipate heat from the power module 42.
[0080] In another possible implementation, to reduce the thermal resistance between the liquid-cooled heat sink and the device to be cooled, a thermal interface material can be placed between the liquid-cooled heat sink 5 and the device to be cooled. This thermal interface material includes thermal pads, thermal ceramics, thermal gels, thermal grease, and phase change interface materials. Providing a thermal interface material between the power module 42 and the liquid-cooled heat sink 5 further improves the speed and efficiency of heat conduction, thereby further facilitating heat dissipation from the power device.
[0081] Among them, the power module 42 may include power devices, such as power modules. The power devices are power electronic devices that can realize power conversion functions, including but not limited to giant transistors (GTR), metal-oxide-semiconductor field-effect transistors (MOSFET), insulated gate bipolar transistors (IGBT), gate turn-off thyristors (GTO), temperature sensors or other suitable devices. The power module 42 is frequently switched between on and off states in the working state. Frequent state switching will cause the power module 4 to generate a large amount of heat, and the high temperature will cause the power module 42 in the power module 4 to reduce the conversion efficiency or even be damaged. As the core component of the power supply system 1, the reduction in the conversion efficiency of the power module 4 and the damage of the power module 4 will have a serious impact on the entire power supply system 1. In order to reduce the temperature of the power module 4 in operation, a liquid cooling radiator 5 is usually installed in the power module 4 , and a cooling medium is passed through the liquid cooling radiator 5 to exchange heat with the heat-generating power devices in the power module 42 .
[0082] It should be understood that in the embodiment of the present application, the device to be dissipated heat includes a power module of a motor controller, or a power module of a converter in an energy storage system, or a power module of an optimizer or inverter in a photovoltaic system, or a heat-generating device such as a capacitor, inductor, resistor or transformer in an electric power device. Accordingly, the liquid-cooled radiator 5 provided in the embodiment of the present application can be applied to the powertrain or motor controller of an electric vehicle, as well as to the converter in an energy storage system, the optimizer or inverter in a photovoltaic system or other electric power equipment. For ease of explanation, the embodiment of the present application takes the device to be dissipated heat as a power module as an example for explanation. Among them, the power module 42 may include multiple power modules, each power module includes multiple power tubes, and the multiple power tubes in each power module constitute a bridge arm circuit.
[0083] The liquid cooling radiator 5 of the present application is described in detail below.
[0084] The liquid-cooled radiator provided in the present application includes a plurality of first heat dissipation teeth, a first cover plate, a side plate and a bottom plate. The first cover plate and the bottom plate are stacked along the first direction. The bottom plate, the side plate and the first cover plate are arranged to form a first cavity. The plurality of first heat dissipation teeth are arranged on the surface of the bottom plate facing the first cover plate, and the surface of the bottom plate away from the first cover plate is used to contact the power module to dissipate heat from the power module. The first cover plate includes a first opening, a second opening and a third opening arranged in sequence along the second direction. The first opening, the second opening and the third opening respectively pass through the first cover plate along the first direction, and the first direction and the second direction are perpendicular. The second opening is used for the cooling medium to flow into the first cavity, and the first opening and the third opening are used for the cooling medium to flow out of the first cavity, or the first opening and the third opening are used for the cooling medium to flow into the first cavity, and the second opening is used for the cooling medium to flow out of the first cavity.
[0085] FIG5 is a schematic structural diagram of a liquid cooling radiator provided in an embodiment of the present application.
[0086] As shown in Figure 5 , the liquid-cooled radiator is comprised of a cover plate 503, side plates, and a bottom plate 502. The side plates include side plates 511, 512, 513, and 514. The cover plate 503 and bottom plate 502 are arranged relative to each other along a first direction Z, the side plates 511 and 512 are arranged relative to each other along a second direction X, and the side plates 513 and 514 are arranged relative to each other along a third direction Y. The cover plate 503, side plates, and bottom plate 502 enclose a cavity 522.
[0087] It should be understood that the first direction Z is the stacking direction of the cover plate 503 and the bottom plate 502. Alternatively, the first direction Z can be understood as the thickness direction of the cover plate 503 or the bottom plate 502.
[0088] In the embodiments of the present application, the first direction Z, the second direction X, and the third direction Y form a certain angle with each other. For example, the first direction Z and the second direction X may be perpendicular to each other, the first direction Z and the third direction Y may be perpendicular to each other, and the second direction X and the third direction Y may be perpendicular to each other, with the angle being 90°. For ease of description, relative positions in the first direction Z are described below using "upper" and "lower," and the directional relationship among the first direction Z, the second direction X, and the third direction Y is described as being perpendicular to each other.
[0089] In the embodiment of the present application, the cover plate 503 includes an opening 5031 , an opening 530 , and an opening 5032 sequentially arranged along the second direction X. The opening 5031 , the opening 530 , and the opening 5032 penetrate the cover plate 503 along the first direction Z respectively.
[0090] It should be understood that the present application does not limit the shape of the openings. For example, the shapes of the openings 5031 , 530 , and 5032 may be circular, rectangular, or the like.
[0091] The base plate 502 includes an upper surface and a lower surface that are opposite to each other along a first direction Z. A plurality of heat dissipation teeth 541 and one end of the heat dissipation teeth 542 are disposed on the surface of the base plate 502 facing the cover plate 503, that is, on the upper surface. The heat dissipation teeth 541 and the heat dissipation teeth 542 are located within the cavity 522. The surface of the base plate 502 away from the cover plate 503, that is, on the lower surface, is used for fixed connection with the power module 42, as shown in FIG4 , to dissipate heat from the power module 42. The heat generated by the power module 42 is transferred to the lower surface of the base plate 502 by heat conduction, and then transferred to the plurality of heat dissipation teeth 541 and the heat dissipation teeth 542 through the upper surface of the base plate 502. In one embodiment, the lower surface of the base plate 502 is soldered to the power module 42, and the base plate 502 is made of a thermally conductive material, which helps to reduce the thermal resistance of the liquid-cooled radiator 5.
[0092] As shown in Figure 5, arrows are used to schematically indicate the possible flow paths of the cooling medium in the liquid-cooled radiator. When the liquid-cooled radiator is connected to the cooling system (not shown) through openings 5031, 530, and 5032, the cooling medium provided by the cooling system can enter the cavity 522 through opening 530. The cooling medium in the cavity 522 can flow toward the openings 5031 and 5032 in the direction of the side plates 511 and 512 respectively along the second direction X. After heat exchange through the bottom plate 502, the plurality of heat dissipation teeth 541, and the heat dissipation teeth 542, the cooling medium leaves the liquid-cooled radiator through openings 5031 and 5032 respectively, removing the heat, thereby reducing the temperature of the power module 42 and achieving temperature control.
[0093] Compared to placing the inlet and outlet on either side of a liquid-cooled radiator, the present invention places the outlet on either side of the inlet, shortening the distance between them. This allows the cooling medium within cavity 522 to flow in opposite directions, thereby achieving a heat exchange cycle. This reduces the cooling medium's flow path, thereby reducing pressure drop and achieving higher heat dissipation efficiency. Furthermore, the cooling medium entering cavity 522 from the upper cover plate 503 can impact the heat dissipation teeth on the bottom plate 502 along the first direction Z, thereby helping to improve cooling performance.
[0094] In another possible embodiment, the cooling medium provided by the cooling system may enter the cavity 522 through the openings 5031 and 5032 and leave the liquid cooling radiator through the opening 530 , thereby achieving the same effect.
[0095] Figure 6 is a schematic diagram of the structure of a liquid cooling radiator provided in an embodiment of the present application. Figure 8 is another schematic diagram of the liquid cooling radiator shown in Figure 6 perpendicular to the third direction Y.
[0096] As shown in Figures 6 and 8, the liquid-cooled radiator is composed of a cover plate 501, a side plate 511, a side plate 512, a side plate 513, a side plate 514 and a bottom plate 502. The cover plate 501 and the bottom plate 502 are arranged relative to each other along a first direction Z, the side plate 511 and the side plate 512 are arranged relative to each other along a second direction X, and the side plate 513 and the side plate 514 are arranged relative to each other along a third direction Y.
[0097] In some embodiments, two ends of the side panels 511 , 512 , 513 , and 514 along the first direction Z are sealedly connected to the cover plate 501 and the bottom plate 502 , respectively.
[0098] Optionally, the side panels 511 , 512 , 513 , 514 , the cover panel 501 and the bottom panel 502 are sealed and connected by welding.
[0099] In the embodiment of the present application, the cover plate 501 , the cover plate 503 and the bottom plate 502 are stacked along the first direction Z. The cover plate 503 , the side plates and the bottom plate 502 enclose a cavity 522 , and the cover plate 503 , the side plates and the cover plate 501 enclose a cavity 521 .
[0100] Specifically, cavity 521 includes cavity 523. As shown in FIG6 , cavity 523 is formed by the cover plate 503, isolation plate 504, cover plate 501, and side plate 513. Isolation plate 504 is positioned between the upper surface of cover plate 503 and the lower surface of cover plate 501. Isolation plate 504 may include two plates perpendicular to the second direction X and one plate perpendicular to the third direction Y.
[0101] It should be understood that the height of the above-mentioned isolation plate 504 can be equal to the height of the cavity 521. In this way, the isolation plate 504 can isolate the cavity 521 and the cavity 523, and the isolation wall can provide support for the cover plate 503, thereby preventing the cover plate 503 from warping toward the cavity 521, thereby reducing the diversion at the top of the heat dissipation teeth in the cavity 522, increasing the flow between the heat dissipation teeth, and improving the cooling effect.
[0102] In the embodiment of the present application, the cover plate 503 includes an opening 5031, an opening 530, and an opening 5032 sequentially arranged along the second direction X. The openings 5031, 530, and 5032 respectively penetrate the cover plate 503 along the first direction Z. The cavity 523 communicates with the cavity 522 through the opening 530, and the cavity 522 communicates with the cavity 521 through the openings 5031 and 5032.
[0103] In the embodiment of the present application, openings 5031 and 5032 are formed by the grooves on the cover plate 503 and the side panels. Specifically, the grooves on the cover plate 503 and the side panels 511 form opening 5031, and the grooves on the cover plate 503 and the side panels 512 form opening 5032. Thus, the grooves on the cover plate 503 and the side panels form openings 5031 and 5032, which can reduce the difficulty of processing and assembling the cover plate 503 and improve the compatibility of the cover plate 503 with the side panels.
[0104] In some embodiments, the isolation plate 504 and the cover plate 503 are an integrally formed structure, or the isolation plate 504 and the cover plate 503 are connected by welding.
[0105] Optionally, the side plate, the cover plate 501 , the cover plate 503 or the isolation plate 504 include one or more metal materials such as copper and aluminum or non-metal materials such as plastic.
[0106] In the embodiment of the present application, cavity 523 includes an opening 5111, and cavity 521 includes an opening 5112. As shown in FIG6 , opening 5111 can be provided on the side plate 513 or cover plate 501 that encloses cavity 523, and opening 5112 can be provided on the side plate or cover plate 501 that encloses cavity 521. Openings 5111 and 5112 can be used for the flow of cooling medium in or out, respectively.
[0107] In some embodiments, the opening 5111 and the opening 5112 may be disposed on the same side of the liquid cooling radiator. For example, the opening 5111 and the opening 5112 are disposed on the cover plate 501 .
[0108] In this way, by designing the inlet and outlet of the cooling medium on the same side of the liquid-cooled radiator, it is easy to connect the liquid-cooled radiator with the external pipeline, thereby reducing the difficulty of installing the liquid-cooled radiator.
[0109] FIG7 is a schematic diagram of the structure of another liquid cooling radiator provided in an embodiment of the present application. This embodiment of the present application only describes the differences between FIG7 and FIG6.
[0110] As shown in FIG7 , the opening 5111 is provided on the cover plate 501, and the opening 5112 can be provided on the side plates 513 and 514. The isolation plate 504 can include two plates perpendicular to the second direction X. Specifically, the side plates 513, 514, the cover plate 501, the isolation plate 504, and the cover plate 503 enclose a cavity 523.
[0111] As shown in Figures 6 and 8, arrows are used to schematically indicate the possible flow paths of the cooling medium in the liquid-cooled radiator. When the liquid-cooled radiator is connected to the cooling system (not shown) through the opening 5111 and the opening 5112, the cooling medium provided by the cooling system can enter the cavity 523 from the opening 5111 and enter the cavity 522 through the opening 530. The cooling medium in the cavity 522 can flow toward the opening 5031 and the opening 5032 in the direction of the side plate 511 and the side plate 512 respectively along the second direction X. After heat exchange through the bottom plate 502, the multiple heat dissipation teeth 541 and the heat dissipation teeth 542, the cooling medium enters the cavity 521 from the opening 5031 and the opening 5032 respectively and converges to the opening 5112 to leave the liquid-cooled radiator to take away the heat, thereby reducing the temperature of the power module 42 and achieving temperature control.
[0112] In this way, by arranging the cover plate 501 above the cover plate 503 and forming a cavity 521 between the cover plate 501 and the cover plate 503, a structure of upper and lower cavities is formed, wherein the cavity 523 in the cavity 521 can connect the opening 530 on the cover plate 503 and the opening 5111 on the shell. Therefore, the cooling medium can directly enter the lower cavity 522 from the outside through the cavity 523, and return to the upper cavity 521 through the openings 5031 and 5032 for further cooling, thereby improving the cooling effect.
[0113] In this embodiment, the cooling medium can be any liquid, for example, non-conductive pure water or silicone oil, mineral oil, etc. Those skilled in the art can select the type of cooling medium according to actual needs, and this application does not impose any restrictions on this.
[0114] In this embodiment, cavity 522 includes a plurality of heat dissipation teeth 541 and 542. These teeth 541 and 542 increase the contact area with the cooling medium and enhance the turbulence of the cooling medium, thereby improving the surface heat transfer coefficient. The distance between any two adjacent heat dissipation teeth can be set based on cooling requirements, operating environment, or experimental data, for example, to 1 mm.
[0115] In the embodiment of the present application, the fluid resistance of the heat dissipation teeth 541 is smaller than the fluid resistance of the heat dissipation teeth 542. When the opening 530 is used for the cooling medium to flow into the cavity 522, the heat dissipation teeth 541 are closer to the opening 530 than the heat dissipation teeth 542.
[0116] It should be understood that fluid resistance refers to the resistance of an object to the fluid (liquid or gas) when it is in relative motion with the fluid. In this implementation, the fluid resistance of the heat dissipation tooth 541 refers to the resistance of the heat dissipation tooth 541 to the cooling medium when the heat dissipation tooth 541 is in relative motion with the cooling medium. The fluid resistance of the heat dissipation tooth 542 refers to the resistance of the cooling medium when the heat dissipation tooth 542 is in relative motion with the cooling medium. Among them, heat dissipation teeth with large fluid resistance usually have a larger heat transfer coefficient (HTC), and heat dissipation teeth with large fluid resistance will also lead to a decrease in the coolant flow rate in the liquid-cooled radiator, thereby increasing the pressure drop of the cooling medium.
[0117] As shown in FIG. 8 , the absolute value of the difference between the distance between the opening 530 and the opening 5031 and the distance between the opening 530 and the opening 5032 does not exceed the first threshold.
[0118] It should be understood that the distance between the opening 530 and the opening 5031 may be the distance from the center of the opening 530 to the center of the opening 5031 , or the minimum distance from the edge of the opening 530 to the edge of the opening 5031 .
[0119] For example, the first threshold value may be set to 10 centimeters. For example, when the distance between opening 530 and opening 5031 is 20 centimeters, the distance between opening 530 and opening 5032 may be 25 centimeters, that is, the absolute value of the difference between the distance between opening 530 and opening 5031 and the distance between opening 530 and opening 5032 is 5 centimeters.
[0120] In this way, by limiting the distance between the opening 530 and the opening 5031 and the opening 5032, the distances between the inlet and different outlets of the cooling medium can be balanced, thereby making the flow distribution in the liquid cooling radiator more balanced, thereby improving the cooling effect.
[0121] Optionally, the absolute value of the difference between the distance between the opening 530 and the opening 5031 and the distance between the opening 530 and the opening 5032 can be 0, that is, the distance between the opening 530 and the opening 5031 and the distance between the opening 530 and the opening 5032 along the second direction X are equal, and at this time, the opening 530 is set at the midpoint between the opening 5031 and the opening 5032.
[0122] In some embodiments, the absolute value of the difference between the distance between the opening 5111 and the opening 5031 and the distance between the opening 5111 and the opening 5032 does not exceed the second threshold.
[0123] It should be understood that the first threshold and the second threshold can be set according to factors such as experimental data, working conditions, equipment size, etc. This application does not limit the determination method and specific numerical setting of the first threshold and the second threshold.
[0124] FIG. 9 is another schematic diagram of the liquid cooling radiator shown in FIG. 6 .
[0125] As shown in FIG. 9 , FIG. 9 exemplarily shows the arrangement of the plurality of heat dissipation teeth 541 and the heat dissipation teeth 542 provided in the lower cavity 522 in FIG. 6 .
[0126] In this embodiment, the heat dissipation teeth 541 are closer to the opening 530 than the heat dissipation teeth 542, that is, the opening 530 is located above the area where the multiple heat dissipation teeth 541 are located. The cooling medium entering the cavity 522 from the cavity 523 will first pass through the gaps between the heat dissipation teeth 541 along the first direction Z to contact and impact the heat dissipation teeth 541, and then flow along the second direction X through the gaps between the heat dissipation teeth 541 and the gaps between the heat dissipation teeth 542 to the side plate 511 and the side plate 512 respectively.
[0127] In this way, by arranging heat dissipation teeth 541 with smaller fluid resistance near the cooling medium inlet of the cavity 522, the heat dissipation teeth 541 produce less obstruction to the cooling medium and the collision between the two is less, and the flow of the cooling medium between the heat dissipation teeth 541 is smoother than that between the heat dissipation teeth 542, thereby reducing the pressure drop of the cooling medium in the lower cavity 522. Moreover, when the cooling medium enters the lower cavity 522 from the upper cavity 523, the heat dissipation capacity of the heat dissipation teeth 541 can be improved due to the impact of the cooling medium along the first direction Z, thereby balancing the cooling performance and pressure drop of the heat dissipation teeth in the cavity 522, thereby improving the cooling effect.
[0128] In some embodiments, the heat dissipation teeth 541 and the heat dissipation teeth 542 have different end surface shapes and / or projected areas along the first direction Z.
[0129] For example, as shown in FIG7 , when the projected areas of heat dissipation teeth 541 and 542 are equal, the end surface of heat dissipation tooth 541 is in the shape of a teardrop, wherein the width of the teardrop gradually decreases from the leading edge to the trailing edge, and the end surface of heat dissipation tooth 542 is in the shape of a rectangle. It should be understood that the present application does not limit the shape of the heat dissipation tooth end surface. For example, the shape of the heat dissipation tooth end surface can be circular, triangular prism, olive, ellipsoidal, hourglass, dumbbell, or irregular.
[0130] Optionally, the heat dissipation teeth 541 and the heat dissipation teeth 542 may have different shapes. For example, the heat dissipation teeth 541 may be cone-shaped, and the heat dissipation teeth 542 may be cube-shaped.
[0131] Optionally, the spacing, volume, number, and arrangement of the heat dissipation teeth can be adjusted so that the fluid resistance of the heat dissipation teeth 541 is smaller than the fluid resistance of the heat dissipation teeth 542. This application does not limit this. For example, the spacing between the heat dissipation teeth 541 can be larger than the spacing between the heat dissipation teeth 542.
[0132] In some embodiments, the heat dissipation teeth 541 and the heat dissipation teeth 542 may be arranged in the same manner, that is, the fluid resistance of the heat dissipation teeth 541 and the heat dissipation teeth 542 is the same, which is not limited in this application.
[0133] In some embodiments, the liquid cooling radiator includes a plurality of heat dissipation teeth 543 disposed in the cavity 521 , and the plurality of heat dissipation teeth 543 are disposed on the surface of the cover plate 503 facing the cover plate 501 , that is, the upper surface of the cover plate 503 .
[0134] In this way, by arranging a plurality of heat dissipation teeth 543 in the upper cavity 521 , the cooling medium in the upper cavity 521 can be further dissipated, thereby improving the heat dissipation capacity of the liquid cooling radiator.
[0135] In some embodiments, the multiple heat dissipation teeth in the cavity 522 and the base plate 502 are an integrally formed structure, and the multiple heat dissipation teeth in the cavity 521 and the cover plate 503 are an integrally formed structure; or the multiple heat dissipation teeth in the cavity 522, the multiple heat dissipation teeth in the cavity 521 and the cover plate 503 are an integrally formed structure.
[0136] In some embodiments, the heat dissipation teeth 543 and at least a portion of the heat dissipation teeth 542 are integrally formed.
[0137] In this way, by integrally forming the heat dissipation teeth of the upper layer and at least part of the heat dissipation teeth of the lower layer, the heat of at least part of the heat dissipation teeth in the lower layer cavity can be transferred upward to the heat dissipation teeth in the upper layer cavity, which is beneficial for the upper layer cavity to assist the lower layer cavity in cooling, thereby improving the cooling efficiency of the liquid-cooled radiator.
[0138] Optionally, the heat dissipation tooth 543 and the heat dissipation tooth 542 are the same heat dissipation tooth.
[0139] Optionally, the distribution density of the heat dissipation teeth 543 in the cavity 521 is smaller than the distribution density of the heat dissipation teeth 542 in the cavity 522 , or the number of the heat dissipation teeth 543 is smaller than the number of the heat dissipation teeth 542 .
[0140] In some embodiments, the length of the opening 530 , the opening 5031 , or the opening 5032 in the third direction Y is greater than the length in the second direction X.
[0141] Thus, by providing the longer opening 530 in the third direction Y, after the cooling medium flows into the cavity 523, it can enter the cavity 522 evenly in the third direction Y through the opening 530 and flow toward the side plate 511 and the side plate 512, thereby helping to maintain a balanced flow rate at various cross sections within the cavity 522 perpendicular to the second direction X. The longer openings 5031 and 5032 in the third direction Y can maintain a balanced flow rate of the cooling medium entering the cavity 521 from the cavity 522 at various cross sections perpendicular to the second direction X, increase the area through which the cooling medium flows, and thereby improve the uniformity of heat dissipation from the power module.
[0142] Optionally, the length of the first groove and the second groove on the cover plate 503 along the third direction Y is equal to the length of the cover plate 503 along the third direction Y, that is, the length of the cover plate 503 along the second direction X is smaller than the length of the inside of the shell along the second direction X, wherein the first edge of the cover plate 503 perpendicular to the second direction X is surrounded by the side panels 511, 513, and 514 to form an opening 5031, and the second edge of the cover plate 503 perpendicular to the second direction X is surrounded by the side panels 512, 513, and 514 to form an opening 5032.
[0143] In this way, the difficulty of processing the cover plate 503 can be further reduced, and the lengths of the openings 5031 and 5032 along the third direction Y can be maximized.
[0144] Optionally, the opening 530 is disposed at a middle position of the cover plate 503 along the second direction X.
[0145] It should be understood that the above description of the heat dissipation process in which opening 5111 and opening 5112 serve as the inlet and outlet of the cooling medium, respectively, is described in conjunction with the arrow directions illustrated in Figures 6, 8, and 9. In the embodiment of the present application, opening 5112 can serve as the inlet of the cooling medium, and opening 5111 can serve as the outlet of the cooling medium, as will be described below in conjunction with Figures 10 and 11. This embodiment of the present application will only describe the differences between Figures 10 and 11 and Figures 8 and 9.
[0146] Figure 10 is a schematic cross-sectional view of a liquid-cooled radiator provided in an embodiment of the present application, taken perpendicular to a third direction Y. Figure 11 is a schematic structural view of the liquid-cooled radiator shown in Figure 10 . Figure 11 exemplarily illustrates the arrangement of the plurality of heat dissipation teeth 541 and 542 disposed within the lower cavity 522 in Figure 10 .
[0147] As shown in Figures 10 and 11, multiple heat dissipation teeth 541 and one end of the heat dissipation teeth 542 are arranged on the upper surface of the base plate 502. When the openings 5031 and openings 5032 are used for the cooling medium to flow into the cavity 522, the multiple heat dissipation teeth 541 are closer to the openings 5031 and openings 5032 than the multiple heat dissipation teeth 542. That is, the opening 5031 is located above the area where the heat dissipation teeth 541 are located on the side close to the side plate 511, and the opening 5032 is located above the area where the heat dissipation teeth 541 are located on the side close to the side plate 512.
[0148] When the liquid-cooled radiator is connected to the cooling system (not shown) through the opening 5111 and the opening 5112, and the opening 5112 is the entrance, the cooling medium provided by the cooling system can enter the cavity 521 from the opening 5112, and enter the cavity 522 through the openings 5031 and the openings 5032. The cooling medium entering the cavity 522 from the openings 5031 and the openings 5032 will first contact and impact the heat dissipation teeth 541 along the first direction Z through the gaps between the heat dissipation teeth 541, and then pass through the gaps between the heat dissipation teeth 541 and the gaps between the heat dissipation teeth 542 in turn along the second direction X to exchange heat, flow from the direction of the side plate 511 and the side plate 512 to the opening 530, and converge into the cavity 523, leaving the liquid-cooled radiator from the opening 5111 to take away the heat, thereby reducing the temperature of the power module 42 and achieving temperature control.
[0149] In some embodiments, the heat dissipation fins 541 may be provided within the projection range below the opening 530 , the opening 5031 , and the opening 5032 , thereby avoiding the need to distinguish between entrances and exits and facilitating installation.
[0150] FIG12 is a schematic cross-sectional view of another liquid cooling radiator provided in an embodiment of the present application, taken perpendicularly to a third direction Y. The present embodiment of the present application only describes the differences between FIG12 and FIG8 .
[0151] In the embodiment of the present application, the opening 530 can be located at any position between the opening 5031 and the opening 5032 in the second direction X. For example, the opening 530 can be located between the opening 5031 and the opening 5032 on the side close to the side plate 512 along the second direction X. In this way, by adjusting the position of the isolation plate 504 and the opening 530 in the second direction X of the cover plate 503, the position of the isolation plate 504 and the opening 530 can be set in an area on the side with higher heat generation according to heat dissipation requirements, which can meet the different heat dissipation requirements of the power module along the second direction X on the liquid-cooled radiator base plate 502, thereby improving the heat dissipation uniformity of the power module.
[0152] FIG13 is a schematic cross-sectional view of another liquid cooling radiator provided in an embodiment of the present application, taken perpendicular to a third direction Y. The present embodiment of the present application only describes the differences between FIG13 and FIG8 .
[0153] As shown in Figure 13, cavity 521 includes cavity 523 and cavity 524. Cavity 523 is enclosed by at least isolation plate 504, while cavity 524 is enclosed by at least isolation plate 505. Isolation plate 505 is disposed on the upper surface of cover plate 503 and, in the second direction X, is located between opening 5031 and opening 5032. A gap exists between isolation plate 504 and isolation plate 505. Cavity 524 communicates with cavity 522 via opening 550, and opening 550 and opening 530 are aligned along the second direction X.
[0154] In this way, by providing other cavities in the upper cavity of the liquid-cooled radiator that are connected to the lower cavity, the control capability of the cooling medium can be improved, thereby improving the cooling uniformity in the second direction X.
[0155] In some embodiments, the cavity 524 may include an opening 5111 , and the opening 5111 is disposed on the cover 501 and / or the side panel of the housing.
[0156] In some embodiments, the cover plate 503 includes an opening 5033 , and the opening 5033 is disposed between the opening 550 and the opening 530 on the cover plate 503 , or between the isolation plate 504 and the isolation plate 505 .
[0157] In this way, by setting the opening 5033, the cooling medium entering the cavity 522 from the cavity 523 and the cavity 524 can enter the upper cavity 521 from the opening 530 and the opening 550 along the two sides of the second direction X respectively. As shown in Figure 11, the cooling medium entering the cavity 522 from the cavity 523 can enter the upper cavity 521 through the opening 5031 and the opening 5033, and the cooling medium entering the cavity 522 from the cavity 524 can enter the upper cavity 521 through the opening 5032 and the opening 5033, thereby increasing the flow rate of the heat dissipation tooth gap between the opening 530 and the opening 550 in the second direction X in the cavity 522, thereby enhancing the circulation capacity between the upper and lower cavities and improving the heat dissipation performance.
[0158] Optionally, the length of the opening 5033 in the third direction Y is greater than the length in the second direction X.
[0159] In some embodiments, the liquid cooling radiator includes a partition 515 , which is disposed on the upper surface of the bottom plate 502 , and at least a partial projection of the partition 515 along the first direction Z coincides with a projection of the opening 5033 .
[0160] In this way, the cooling medium entering the lower cavity 522 from the openings 530 and 550 can be guided into the upper cavity 521 through the partition 515 when flowing toward the opening 5033, thereby enhancing the circulation capacity between the upper and lower cavities and further improving the heat dissipation performance.
[0161] Optionally, the partition 515 may extend along the third direction Y to the side panels 513 and 514 .
[0162] Optionally, the height of the partition 515 may be equal to the height of the cavity 522 .
[0163] FIG14 is a schematic top projection diagram of a liquid cooling radiator provided in an embodiment of the present application.
[0164] The structure of the liquid-cooled radiator shown in FIG14 can be referred to the description of the previous embodiment and will not be repeated here. Unlike the previous embodiment, the cover plate 503 in FIG14 is provided with an opening 531 and an opening 532. The openings 531 and 532 are arranged along the third direction Y, and there is a gap between the openings 531 and 532.
[0165] In the embodiment of the present application, the power module 42 shown in Figure 4 includes multiple power modules 421 and power modules 422, wherein the projection of the power module 421 in the second direction X coincides with the projection of the opening 531 in the second direction X, and the projection of the power module 422 in the second direction X coincides with the projection of the opening 532 in the second direction X.
[0166] Optionally, a partial projection of the power module 421 in the second direction X may not overlap with a projection of the opening 531 in the second direction X.
[0167] In this way, the range of the cooling medium in the cavity 523 entering the cavity 522 in the third direction Y can be limited by the opening 531 and the opening 532 respectively, thereby increasing the flow rate on both sides of the opening 531 and the opening 532 (that is, the area where multiple power modules are set), thereby improving the cooling efficiency of multiple power modules 421 and power modules 422.
[0168] Optionally, the cover plate 503 may further include an opening 5033 and an opening 5034, wherein the opening 5033 and the opening 5031 are arranged along the third direction Y, with a gap between the opening 5033 and the opening 5031. The opening 5034 and the opening 5032 are arranged along the third direction Y, with a gap between the opening 5034 and the opening 5032. The opening 5031, the opening 531, and the opening 5032 are arranged in sequence along the second direction X, and the opening 5033, the opening 532, and the opening 5034 are arranged in sequence along the second direction X.
[0169] In this way, by providing corresponding cooling medium outflow openings on both sides of the opening 531 and the opening 532 , the cooling medium from the inflow opening 531 and the opening 532 can be guided accordingly, thereby enhancing the circulation efficiency and improving the cooling capacity.
[0170] FIG15 is a schematic top view projection diagram of another liquid cooling radiator provided in an embodiment of the present application. The following only describes the differences between FIG15 and FIG14 .
[0171] As shown in FIG. 15 , along the first direction Z, the projected area of the opening 531 is larger than that of the opening 532 , the projected area of the opening 5031 is larger than that of the opening 5033 , and the projected area of the opening 5032 is larger than that of the opening 5034 .
[0172] In the embodiment of the present application, the power module 42 shown in FIG4 includes multiple power modules 423 and a power module 424, wherein the power of the power module 423 is greater than that of the power module 424. The projection of the power module 423 in the second direction X coincides with the projection of the opening 531 in the second direction X, and the projection of the power module 424 in the second direction X coincides with the projection of the opening 532 in the second direction X.
[0173] By changing the size of the opening, the flow distribution of the cooling medium in the third direction can be controlled, so that the openings on both sides of the power module with higher power are larger, and more cooling medium can pass through, thereby controlling the flow distribution of the cooling medium in the third direction Y, so that the cooling medium flows more to both sides of the larger opening 531, thereby improving the cooling capacity of the high-power power modules 423 on both sides of the larger opening, which helps to meet the cooling needs of different areas.
[0174] FIG16 is a schematic diagram of the structure of another liquid cooling radiator provided in an embodiment of the present application. The following only describes the differences between FIG16 and FIG6.
[0175] As shown in FIG. 16 , the cover plate 503 includes an opening 531 , an opening 532 , an opening 5031 , and an opening 5032 , wherein the opening 531 and the opening 532 are arranged along the third direction Y, and there is a gap between the opening 531 and the opening 532 .
[0176] Specifically, cavity 521 includes cavity 523 and cavity 524. As shown in FIG16 , cavity 523 includes opening 5111, cavity 524 includes opening 5113, and cavity 521 includes opening 5112. Openings 5111 and 5113 can be used for the flow of cooling medium in or out, while opening 5112 can be used for the flow of cooling medium in or out. It should be understood that opening 5113 and opening 5111 can have the same function.
[0177] In some embodiments, the opening 5111 , the opening 5112 , and the opening 5113 may be simultaneously provided on the cover plate 501 .
[0178] As shown in FIG16 , arrows are used to schematically indicate the possible flow paths of the cooling medium in the liquid-cooled radiator. When the liquid-cooled radiator is connected to the cooling system (not shown) through openings 5111, 5112, and 5113, the cooling medium provided by the cooling system can enter the cavity 523 and the cavity 525 from openings 5111 and 5113, respectively, and enter the cavity 522 through openings 531 and 532. The cooling medium in the cavity 522 can flow toward the openings 5031 and 5032 in the direction of the side plates 511 and 512, respectively, along the second direction X. After heat exchange through the bottom plate 502, the plurality of heat dissipation teeth 541, and the heat dissipation teeth 542, the cooling medium enters the cavity 521 from openings 5031 and 5032, respectively, and converges to the opening 5112 to leave the liquid-cooled radiator to take away the heat, thereby reducing the temperature of the power module 42 and achieving temperature control.
[0179] It should be understood that the flow direction of the cooling medium may be opposite to the direction indicated by the arrow.
[0180] FIG17 is a schematic diagram of the structure of another liquid cooling radiator provided in an embodiment of the present application. The following only describes the differences between FIG17 and FIG6 .
[0181] As shown in FIG. 17 , a cavity 523 is provided in the cavity 521 , that is, the cavity 523 may be formed by enclosing the isolation plate 504 and the cover plate 503 .
[0182] Cover plate 503 includes openings 530, 5031, and 5032. Cavity 521 includes cavity 523, which includes opening 5111. Cavity 521 includes opening 5112. Openings 5111 and 5112 can be used for cooling medium to flow in or out. Openings 5111 and 5112 are provided on cover plate 501.
[0183] Specifically, the cavity 523 is formed by enclosing the isolation plate 504 , the cover plate 501 and the cover plate 503 .
[0184] FIG18 is a schematic cross-sectional view perpendicular to a third direction Y of another liquid-cooled radiator provided in an embodiment of the present application.
[0185] The structures of the housing as shown in FIG18 and the cover plate 503 and the plurality of heat dissipation teeth in the housing can all refer to the description in the aforementioned embodiments, such as the embodiment shown in FIG8 , and will not be repeated here.
[0186] Different from the above-mentioned embodiment, a cavity 523 is provided in the cavity 521 in FIG. 18 , that is, the cavity 523 can be formed by enclosing the isolation plate 504 and the cover plate 503 .
[0187] The above describes in detail the liquid-cooled radiator, power module, power system, vehicle, and photovoltaic system provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is intended only to help understand the method and core concept of the present application. In the several embodiments provided in this application, it should be understood that the disclosed liquid-cooled radiator, power module, power system, vehicle, and photovoltaic system can be implemented in other ways.
[0188] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.
Claims
1. A liquid cooling radiator, characterized in that: The device comprises a plurality of first heat dissipation teeth, a first cover plate, a side plate, and a bottom plate, wherein the first cover plate and the bottom plate are stacked along a first direction, and the bottom plate, the side plate, and the first cover plate enclose a first cavity. The plurality of first heat dissipation teeth are arranged on a surface of the bottom plate facing the first cover plate, and a surface of the bottom plate away from the first cover plate is used to contact the power module to dissipate heat from the power module. The first cover plate includes a first opening, a second opening, and a third opening sequentially arranged along a second direction, the first opening, the second opening, and the third opening respectively pass through the first cover plate along the first direction, and the first direction is perpendicular to the second direction; The second opening is used for the cooling medium to flow into the first cavity, and the first opening and the third opening are used for the cooling medium to flow out of the first cavity; or The first opening and the third opening are used for cooling medium to flow into the first cavity, and the second opening is used for the cooling medium to flow out of the first cavity.
2. The liquid cooling radiator according to claim 1, characterized in that: The liquid cooling radiator further includes a second cover plate, the second cover plate and the first cover plate are stacked along the first direction, the second cover plate is located on a side of the first cover plate away from the bottom plate, the second cover plate, the side plate and the first cover plate are surrounded to form a second cavity, a third cavity is provided in the second cavity, and the third cavity is connected to the first cavity through the second opening. The third cavity includes a fourth opening, the fourth opening passes through the side plate or the second cover plate, and the fourth opening is used for the cooling medium to flow into or out of the third cavity. The second cavity includes a fifth opening, which passes through the side plate or the second cover plate. The fifth opening is used for the cooling medium to flow into or out of the second cavity.
3. The liquid cooling radiator according to claim 2, characterized in that: The third cavity is formed by at least the first cover plate, the isolation plate and the second cover plate.
4. The liquid cooling radiator according to claim 2 or 3, characterized in that: The absolute value of the difference between the distance between the second opening and the first opening and the distance between the second opening and the third opening does not exceed a first threshold, and the absolute value of the difference between the distance between the fifth opening and the first opening and the distance between the fifth opening and the third opening does not exceed a second threshold.
5. The liquid cooling radiator according to any one of claims 1 to 4, characterized in that: A length of the first opening, the second opening, or the third opening in a third direction is greater than a length in the second direction, and the third direction is perpendicular to the first direction and the second direction.
6. The liquid cooling radiator according to any one of claims 1 to 5, characterized in that: The plurality of first heat dissipation teeth include a plurality of second heat dissipation teeth and a plurality of third heat dissipation teeth, the fluid resistance of the second heat dissipation teeth is smaller than the fluid resistance of the third heat dissipation teeth, When the second opening is used for the cooling medium to flow into the first cavity, the plurality of second heat dissipation teeth are closer to the second opening than the plurality of third heat dissipation teeth; When the first opening and the third opening are used for the cooling medium to flow into the first cavity, the second heat dissipation teeth are closer to the first opening and the third opening than the third heat dissipation teeth.
7. The liquid cooling radiator according to claim 5, characterized in that: The power module includes a first power module and a second power module. The first cover is provided with a sixth opening. The sixth opening and the second opening are arranged along the third direction. There is a gap between the sixth opening and the second opening. The projection of the first power module in the second direction at least partially overlaps with the projection of the second opening in the second direction, and the projection of the second power module in the second direction at least partially overlaps with the projection of the sixth opening in the second direction.
8. The liquid cooling radiator according to claim 7, characterized in that: The first cover plate includes a seventh opening and an eighth opening, the seventh opening and the first opening are arranged along the third direction, there is a gap between the seventh opening and the first opening, the eighth opening and the third opening are arranged along the third direction, there is a gap between the eighth opening and the third opening, and the seventh opening, the sixth opening and the eighth opening are arranged in sequence along the second direction.
9. The liquid cooling radiator according to claim 8, characterized in that: The power of the first power module is greater than that of the second power module. Along the first direction, the projection area of the sixth opening is greater than the projection area of the second opening, the projection area of the fifth opening is greater than the projection area of the first opening, and the projection area of the sixth opening is greater than the projection area of the third opening.
10. The liquid cooling radiator according to claim 2, characterized in that: A fourth cavity is disposed in the second cavity. The fourth cavity is connected to the first cavity through a ninth opening. The ninth opening and the second opening are arranged along the second direction, and there is a gap between the ninth opening and the second opening.
11. The liquid cooling radiator according to claim 10, characterized in that: The first cover plate includes a tenth opening, and the tenth opening is disposed between the second opening and the ninth opening on the first cover plate.
12. The liquid cooling radiator according to claim 11, characterized in that: A first partition is disposed in the first cavity, and at least a partial projection of the first partition along the first direction coincides with a projection of the tenth opening.
13. The liquid cooling radiator according to any one of claims 2 to 12, characterized in that: The liquid-cooling radiator includes a plurality of fourth heat dissipation teeth, and the plurality of fourth heat dissipation teeth are arranged on a surface of the first cover plate facing the second cover plate.
14. The liquid cooling radiator according to claim 13, characterized in that: The plurality of fourth heat dissipation teeth are integrally formed with at least some of the heat dissipation teeth of the plurality of first heat dissipation teeth.
15. A power module, characterized in that: The liquid-cooled radiator comprises a power module and any one of claims 1 to 14, wherein the surface of the base plate away from the first cover plate contacts the power module to dissipate heat for the power module.
Citation Information
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