Sensor device

Abstract

A sensor device (1) is provided with: a shunt resistor (12); a both-end voltage detection circuit (13) for detecting the voltage between both ends of the shunt resistor (12); a first substrate (11) provided with the both-end voltage detection circuit (13); a first connector (14) that is provided on the first substrate (11) and is for outputting a signal based on a detection result by the both-end voltage detection circuit (13); a magnetic sensor (23) for detecting magnetism generated due to a current flowing through the shunt resistor (12); and an insulating structure (40). The insulating structure (40) is provided between the magnetic sensor (23) and a first circuit board (10) formed from the shunt resistor (12), the both-end voltage detection circuit (13), the first substrate (11), and the first connector (14).

Description

Sensor Device

[0001] The present disclosure relates to a sensor device.

[0002] Patent Documents 1 to 4 disclose techniques that combine a current sensor using a shunt resistor and a current sensor using a Hall sensor.

[0003] Japanese Patent Application Laid-Open No. 2009-281773 Japanese Patent Application Laid-Open No. 2015-210272 Special Publication No. 2021-502554 Special Publication No. 2023-513369

[0004] In this type of technology, it is necessary to insulate the current path on the shunt resistor side, which includes a configuration for outputting a signal indicating the voltage across the shunt resistor, from the magnetic sensor side, such as a Hall sensor. However, Patent Documents 1 to 4 do not describe a structure for achieving this insulation.

[0005] The present disclosure aims to provide a technique capable of improving the insulation performance between the current path on the shunt resistor side and the magnetic sensor.

[0006] The sensor device of the present disclosure comprises: a shunt resistor; a voltage detection circuit for detecting a voltage across the shunt resistor; a first substrate on which the voltage detection circuit is provided; a first connector provided on the first substrate for outputting a signal based on the detection result by the voltage detection circuit; a magnetic sensor for detecting a magnetism generated due to a current flowing through the shunt resistor; and an insulating structure, wherein the insulating structure is provided between the magnetic sensor and a first circuit board constituted by the shunt resistor, the voltage detection circuit, the first substrate, and the first connector.

[0007] The technology according to the present disclosure can improve the insulation performance between the current path on the shunt resistor side and the magnetic sensor.

[0008] Fig. 1 is a perspective view of a sensor device according to a first embodiment, Fig. 2 is an exploded perspective view of the sensor device according to the first embodiment, and Fig. 3 is a configuration diagram of the sensor device according to the first embodiment.

[0009] [Description of Embodiments of the Present Disclosure] In the following, embodiments of the present disclosure are listed and exemplified.

[0010] [1] A sensor device comprising: a shunt resistor; a voltage detection circuit for detecting a voltage across the shunt resistor; a first substrate on which the voltage detection circuit is provided; a first connector provided on the first substrate for outputting a signal based on a detection result by the voltage detection circuit; a magnetic sensor for detecting a magnetism generated due to a current flowing through the shunt resistor; and an insulating structure, wherein the insulating structure is provided between the magnetic sensor and a first circuit board constituted by the shunt resistor, the voltage detection circuit, the first substrate, and the first connector.

[0011] The first circuit board configures a current path on the shunt resistor side, detecting the voltage across the shunt resistor and outputting a signal based on the detection result from the first connector. An insulating structure is provided between the first circuit board and the magnetic sensor. In other words, with the sensor device described above, the insulating structure can improve the insulation performance between the current path on the shunt resistor side and the magnetic sensor.

[0012] [2] The sensor device described in [1] comprises: a second substrate on which the magnetic sensor is provided; and a second connector provided on the second substrate for outputting a signal based on the detection result of the magnetic sensor, wherein the insulating structure is provided between the first circuit board and a second circuit board constituted by the magnetic sensor, the second substrate, and the second connector.

[0013] The second circuit board forms a current path on the magnetic sensor side, in which a magnetic sensor detects a magnetism corresponding to the current flowing through the shunt resistor and outputs a signal based on the detection result from the magnetic sensor from the second connector. An insulating structure is provided between the second circuit board and the first circuit board. Therefore, the insulating structure can improve the insulation performance between the current path on the shunt resistor side and the current path on the magnetic sensor side.

[0014] [3] The sensor device according to [2], comprising: a voltage sensor; a third board on which the voltage sensor is provided; a third connector provided on the third board and outputting a signal indicating the detection result by the voltage sensor; and the insulating structure provided between a third circuit board constituted by the voltage sensor, the third board, and the third connector and the first circuit board and the second circuit board.

[0015] The third circuit board forms a current path on the voltage sensor side, and outputs a signal based on the detection result of the voltage sensor from the third connector. An insulating structure is provided between the third circuit board and the first and second circuit boards. Therefore, the insulating structure can improve the insulation performance between the current path on the shunt resistor side, the current path on the magnetic sensor side, and the current path on the voltage sensor side.

[0016] [4] The sensor device described in [3], wherein the insulating structure has a plate portion provided between the first circuit board and the second circuit board and the third circuit board, and a partition portion protruding from one side of the plate portion and provided between the second circuit board and the third circuit board.

[0017] According to the above sensor device, the insulating structure can improve the insulation performance between the current path on the shunt resistor side, the current path on the magnetic sensor side, and the current path on the voltage sensor side, while preventing the plate portion from becoming larger in the thickness direction.

[0018] [Details of the embodiment of the present disclosure] 1. First embodiment 1-1. Configuration of sensor device 1 The sensor device 1 of the first embodiment will be described with reference to Figures 1 to 3. The sensor device 1 is mounted on, for example, a vehicle. The sensor device 1 includes a first circuit board 10, a second circuit board 20, a third circuit board 30, and an insulating structure 40.

[0019] The first circuit board 10 is composed of a first substrate 11 , a shunt resistor 12 , a voltage detection circuit 13 , a first connector 14 , and a first conductive path 15 .

[0020] The first substrate 11 is an insulating substrate. The first substrate 11 is plate-shaped. The first substrate 11 is provided with a shunt resistor 12, a voltage detection circuit 13, a first connector 14, and a first conductive path 15. The first conductive path 15 is, for example, a wiring pattern.

[0021] 1 and 2, the shunt resistor 12 is configured as a resistive portion of the shunt bus bar 16. The shunt bus bar 16 has a pair of conductive portions 16A, 16B and the shunt resistor 12. The shunt resistor 12 is provided between the pair of conductive portions 16A, 16B.

[0022] The end-to-end voltage detection circuit 13 is a circuit that detects the voltage across the shunt resistor 12. The end-to-end voltage detection circuit 13 includes branch portions 13A and 13B that branch off from both sides of the shunt resistor 12. The branch portions 13A and 13B are connected to the first substrate 11. In other words, the shunt resistor 12 is installed on the first substrate 11 via the branch portions 13A and 13B. The end-to-end voltage detection circuit 13 includes, for example, a differential amplifier circuit, and outputs a signal based on the potential difference between the branch portions 13A and 13B. A signal based on the detection result by the end-to-end voltage detection circuit 13 is transmitted to the first connector 14 via the first conductive path 15.

[0023] A mating connector (not shown) is connected to the first connector 14. The first connector 14 outputs a signal based on the voltage across the shunt resistor 12 via the mating connector. The signal based on the voltage across the shunt resistor 12 is, for example, a signal indicating the voltage across the shunt resistor 12. The first connector 14 outputs the signal based on the voltage across the shunt resistor 12 to the ECU 50. The ECU 50 is an electronic control unit.

[0024] The second circuit board 20 is composed of a second substrate 21 , a magnetic sensor 23 , a second connector 24 , and a second conductive path 25 .

[0025] The second substrate 21 is an insulating substrate. The second substrate 21 has a plate shape. The second substrate 21 is provided with a magnetic sensor 23, a second connector 24, and a second conductive path 25. The second conductive path 25 is, for example, a wiring pattern.

[0026] The magnetic sensor 23 is a sensor that detects a magnetism generated due to a current flowing through the shunt resistor 12. The magnetic sensor 23 includes, for example, a Hall element. A signal based on the detection result by the magnetic sensor 23 is transmitted to the second connector 24 via the second conductive path 25.

[0027] A mating connector (not shown) is connected to the second connector 24. The second connector 24 outputs a signal based on the detection result by the magnetic sensor 23 via the mating connector. The signal based on the detection result by the magnetic sensor 23 is, for example, a signal indicating the detection result by the magnetic sensor 23. The second connector 24 outputs the signal based on the detection result by the magnetic sensor 23 to the ECU 50.

[0028] The third circuit board 30 is composed of a third substrate 31 , a voltage sensor 33 , a third connector 34 , and a third conductive path 35 .

[0029] The third substrate 31 is an insulating substrate. The third substrate 31 has a plate shape. The third substrate 31 is provided with a voltage sensor 33, a third connector 34, and a third conductive path 35. The third conductive path 35 is, for example, a wiring pattern.

[0030] There is no particular limitation on the detection target of the voltage sensor 33. For example, the voltage sensor 33 may detect the voltage of a battery mounted on the vehicle. A signal based on the detection result by the voltage sensor 33 is transmitted to the third connector 34 via the third conductive path 35.

[0031] A mating connector (not shown) is connected to the third connector 34. The third connector 34 outputs a signal based on the detection result by the voltage sensor 33 via the mating connector. The signal based on the detection result by the voltage sensor 33 is, for example, a signal indicating the detection result by the voltage sensor 33. The third connector 34 outputs the signal based on the detection result by the voltage sensor 33 to the ECU 50.

[0032] The insulating structure 40 has a plate portion 41. The plate portion 41 has insulating properties. The second circuit board 20 and the third circuit board 30 are provided on one side in the thickness direction of the plate portion 41, and the first circuit board 10 is provided on the other side. In other words, the plate portion 41 is provided between the first circuit board 10 and the second circuit board 20 and the third circuit board 30.

[0033] The insulating structure 40 has a partition wall 42. The partition wall 42 has insulating properties. The partition wall 42 protrudes from one surface of the plate portion 41 in the thickness direction and is provided between the second circuit board 20 and the third circuit board 30.

[0034] The plate portion 41 has a first recess 43 into which the first circuit board 10 fits. The plate portion 41 has a second recess 44 into which the second circuit board 20 fits. The partition portion 42 is disposed at the boundary between the first recess 43 and the second recess 44, and constitutes a part of the first recess 43 and also a part of the second recess 44.

[0035] 1-2. Effects The first circuit board 10 configures a current path on the shunt resistor 12 side, detecting the voltage across the shunt resistor 12 and outputting a signal based on the detection result from the first connector 14. An insulating structure 40 is provided between the first circuit board 10 and the magnetic sensor 23. In other words, according to the sensor device 1, the insulating structure 40 can improve the insulation performance between the current path on the shunt resistor 12 side and the magnetic sensor 23.

[0036] The second circuit board 20 configures a current path on the magnetic sensor 23 side, in which the magnetic sensor 23 detects a magnetism corresponding to the current flowing through the shunt resistor 12 and outputs a signal based on the detection result by the magnetic sensor 23 from the second connector 24. An insulating structure 40 is provided between the second circuit board 20 and the first circuit board 10. Therefore, the insulating structure 40 can improve the insulation performance between the current path on the shunt resistor 12 side and the current path on the magnetic sensor 23 side.

[0037] The third circuit board 30 constitutes a current path on the voltage sensor 33 side, which outputs a signal based on the detection result by the voltage sensor 33 from the third connector 34. An insulating structure 40 is provided between the third circuit board 30 and the first and second circuit boards 10 and 20. Therefore, the insulating structure 40 can improve the insulation performance between the current path on the shunt resistor 12 side, the current path on the magnetic sensor 23 side, and the current path on the voltage sensor 33 side.

[0038] The insulating structure 40 has a plate portion 41 provided between the first circuit board 10 and the second and third circuit boards 20 and 30, and a partition portion 42 protruding from one surface of the plate portion 41 and provided between the second circuit board 20 and the third circuit board 30. With this configuration, the insulating structure 40 can improve the insulation performance between the current path on the shunt resistor 12 side, the current path on the magnetic sensor 23 side, and the current path on the voltage sensor 33 side, while preventing the plate portion 41 from becoming larger in the thickness direction.

[0039] <Other Embodiments> The present disclosure is not limited to the embodiments described above and in the drawings. For example, any combination of features of the above-described or below-described embodiments is possible within a range that does not contradict. Furthermore, any feature of the above-described or below-described embodiments may be omitted unless explicitly stated as essential. Furthermore, the above-described embodiments may be modified as follows.

[0040] The magnetic sensor 23 may not be disposed on the second substrate 21 .

[0041] The shunt resistor does not have to be a shunt bus bar.

[0042] It should be noted that the embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is not limited to the embodiments disclosed herein, and is intended to include all modifications within the scope indicated by the claims or within the scope equivalent to the claims.

[0043] REFERENCE SIGNS LIST 1 sensor device 10 first circuit board 11 first board 12 shunt resistor 13 both-end voltage detection circuit 13A branch portion 13B branch portion 14 first connector 15 first conductive path 16 shunt bus bar 16A conductive portion 16B conductive portion 20 second circuit board 21 second board 23 magnetic sensor 24 second connector 25 second conductive path 30 third circuit board 31 third board 33 voltage sensor 34 third connector 35 third conductive path 40 insulating structure 41 plate portion 42 partition portion 43 first recess 44 second recess 50 ECU

Claims

1. A sensor device comprising: a shunt resistor; a voltage detection circuit for detecting a voltage across the shunt resistor; a first substrate on which the voltage detection circuit is provided; a first connector provided on the first substrate for outputting a signal based on the detection result by the voltage detection circuit; a magnetic sensor for detecting a magnetism generated due to a current flowing through the shunt resistor; and an insulating structure, wherein the insulating structure is provided between the magnetic sensor and a first circuit board constituted by the shunt resistor, the voltage detection circuit, the first substrate, and the first connector.

2. A sensor device as described in claim 1, comprising: a second substrate on which the magnetic sensor is provided; and a second connector provided on the second substrate for outputting a signal based on the detection result of the magnetic sensor, wherein the insulating structure is provided between the first circuit board and a second circuit board constituted by the magnetic sensor, the second substrate, and the second connector.

3. A sensor device as described in claim 2, comprising: a voltage sensor; a third board on which the voltage sensor is provided; a third connector provided on the third board and outputting a signal indicating the detection result by the voltage sensor; and the insulating structure provided between a third circuit board constituted by the voltage sensor, the third board, and the third connector, and the first circuit board and the second circuit board.

4. The sensor device described in claim 3, wherein the insulating structure has a plate portion provided between the first circuit board and the second and third circuit boards, and a partition portion protruding from one side of the plate portion and provided between the second circuit board and the third circuit board.

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