Substrate processing system and magnetically levitated vacuum transfer unit

Abstract

Provided is a technique for increasing the degree of freedom of device layout. This substrate processing system comprises a load port, a plurality of magnetically levitated vacuum transfer units, a substrate processing system, a plurality of substrate processing modules, and a load lock module. The load port is disposed at a first height. The plurality of magnetically levitated vacuum transfer units are disposed at a second height and are coupled together in the horizontal direction. Each substrate processing module is connected to one of the plurality of magnetically levitated vacuum transfer units. The load lock module is configured to be able to switch the inside thereof to an atmospheric environment or a vacuum environment, transfers a substrate between the load lock module and a substrate storage container on the load port under the atmospheric environment, transfers the substrate in the vertical direction, and transfers the substrate between the load lock module and one of the plurality of magnetically levitated vacuum transfer units in the vacuum environment.

Description

Substrate processing system and magnetic levitation vacuum transfer unit

[0001] SUMMARY Exemplary embodiments of the present disclosure relate to a substrate processing system and a magnetic levitation vacuum transfer unit.

[0002] Japanese Patent Application Laid-Open Nos. 2003-129999 and 2004-129999 disclose a magnetic levitation type transfer device that transfers a substrate between a vacuum transfer chamber and a processing chamber of a substrate processing system.

[0003] JP 2022-133867 A U.S. Patent Application Publication No. 2023 / 85667

[0004] The present disclosure provides a technique for increasing the degree of freedom in device layout.

[0005] In one exemplary embodiment of the present disclosure, there is provided a substrate processing system including: a load port disposed at a first height; a plurality of magnetic levitation vacuum transfer units disposed at a second height and connected horizontally; a plurality of substrate processing modules, each connected to one of the plurality of magnetic levitation vacuum transfer units; and a load lock module configured to switch its interior between an atmospheric environment and a vacuum environment, the load lock module configured to transfer at least one substrate between the load lock module and a substrate container on the load port in the atmospheric environment, and to transfer at least one substrate in the vertical direction, and to transfer at least one substrate between the load lock module and one of the plurality of magnetic levitation vacuum transfer units in the vacuum environment.

[0006] According to one exemplary embodiment of the present disclosure, it is possible to provide a technique that increases the degree of freedom in device layout.

[0007] FIG. 1 is a diagram for explaining an example of a substrate processing system 1. FIG. 2 is a diagram for explaining an example of a substrate processing system 1. FIG. 3 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 4 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 5 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 6 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 7 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 8 is a diagram for explaining an example of a transfer operation of the substrate processing system 1. FIG. 9 is a diagram for explaining an example of an apparatus layout of the substrate processing system 1. FIG. 10 is a diagram for explaining another example of an apparatus layout of the substrate processing system 1. FIG. 11 is a diagram for explaining another example of an apparatus layout of the substrate processing system 1. FIG. 12 is a diagram for explaining an example of an apparatus layout of the substrate processing system 1. FIG. 13 is a diagram for explaining an example of an apparatus layout of the substrate processing system 1. FIG. 14 is a diagram for explaining an example of an arrangement of horizontal guide rails. 1A and 1B are diagrams for explaining an example of the arrangement of horizontal guide rails, and FIG. 1C are diagrams for explaining an example of the arrangement of horizontal guide rails.

[0008] Hereinafter, each embodiment of the present disclosure will be described.

[0009] In one exemplary embodiment, there is provided a substrate processing system comprising: a load port disposed at a first height; a plurality of magnetic levitation vacuum transfer units disposed at a second height and connected horizontally; a plurality of substrate processing modules, each connected to one of the plurality of magnetic levitation vacuum transfer units; and a load lock module configured to have an interior switchable between an atmospheric environment and a vacuum environment, the load lock module configured to transfer at least one substrate between the load lock module and a substrate container on the load port in the atmospheric environment, and to transfer at least one substrate vertically, and to transfer at least one substrate between the load lock module and one of the plurality of magnetic levitation vacuum transfer units in the vacuum environment.

[0010] In one exemplary embodiment, the first height is the same as the second height.

[0011] In one exemplary embodiment, the first height is greater than the second height.

[0012] In one exemplary embodiment, the load port and any of the plurality of magnetic levitation vacuum transport units are connected to the same side of the load lock module.

[0013] In one exemplary embodiment, each of the plurality of magnetically levitated vacuum transport units includes a horizontal planar motor extending horizontally, and the substrate processing system further includes a horizontal transport robot configured to move horizontally while magnetically levitating on the horizontal motor to transport substrates between the load lock module and the plurality of substrate processing modules.

[0014] In one exemplary embodiment, the substrate processing system further includes a vertical transfer robot disposed within the load lock module and configured to transfer a stack of substrates between the load lock module and a substrate container on the load port, and to transfer the stack of substrates vertically.

[0015] In one exemplary embodiment, the load lock module includes a vertical planar motor extending in the vertical direction, and the vertical transfer robot is configured to move in the vertical direction while being magnetically levitated on the vertical planar motor.

[0016] In one exemplary embodiment, the plurality of magnetic levitation vacuum transport units include a plurality of first magnetic levitation vacuum transport units connected along a first direction, each of the plurality of first magnetic levitation vacuum transport units having a first side extending along the first direction and a second side extending along the first direction and opposite the first side.

[0017] In one exemplary embodiment, the plurality of substrate processing modules includes a plurality of first substrate processing modules, each of which is connected to a first side or a second side of one of the plurality of first magnetic levitation vacuum transport units.

[0018] In one exemplary embodiment, the plurality of substrate processing modules includes a plurality of first substrate processing modules arranged along a first direction, and each of the plurality of first substrate processing modules is connected to a first side of one of the plurality of first magnetic levitation vacuum transport units.

[0019] In one exemplary embodiment, the plurality of substrate processing modules includes a plurality of second substrate processing modules arranged along a first direction, and each of the plurality of second substrate processing modules is connected to a second side of one of the plurality of first magnetic levitation vacuum transport units.

[0020] In one exemplary embodiment, the plurality of magnetic levitation vacuum transport units include a plurality of second magnetic levitation vacuum transport units connected along a second direction perpendicular to the first direction, and each of the plurality of second magnetic levitation vacuum transport units has a third side extending along the second direction and a fourth side extending along the second direction and opposite the third side.

[0021] In one exemplary embodiment, the plurality of substrate processing modules includes a plurality of second substrate processing modules, each of which is connected to a third side or a fourth side of any of the plurality of second magnetic levitation vacuum transport units.

[0022] In one exemplary embodiment, the system includes a plurality of magnetic levitation vacuum transport units connected horizontally, the plurality of magnetic levitation vacuum transport units including a plurality of first magnetic levitation vacuum transport units connected in a first direction, each of the plurality of first magnetic levitation vacuum transport units having a first side extending along the first direction and a second side extending along the first direction and opposite the first side; and a plurality of first substrate processing modules, each of the plurality of first substrate processing modules connected to the first side or the second side of any of the plurality of first magnetic levitation vacuum transport units.

[0023] In one exemplary embodiment, the plurality of magnetic levitation vacuum transport units further include a plurality of second magnetic levitation vacuum transport units connected in a second direction perpendicular to the first direction, each of the plurality of second magnetic levitation vacuum transport units having a third side extending along the second direction and a fourth side extending along the second direction opposite the third side, and the substrate processing system further includes a plurality of second substrate processing modules, each of the plurality of second substrate processing modules being connected to the third side or the fourth side of any of the plurality of second magnetic levitation vacuum transport units.

[0024] In one exemplary embodiment, a magnetic levitation vacuum transport unit is provided, the magnetic levitation vacuum transport unit having a first side extending along a first direction, a second side extending along the first direction and opposite the first side, a third side extending along a second direction perpendicular to the first direction, and a fourth side extending along the second direction and opposite the third side, wherein at least two of the first side, second side, third side, and fourth side are configured to be connectable with other magnetic levitation vacuum transport units, respectively, and the remaining one or more of the first side, second side, third side, and fourth side are configured to be connectable with a substrate processing module or a load lock module.

[0025] In one exemplary embodiment, two of the first side, second side, third side, and fourth side are configured to be connectable to other magnetic levitation vacuum transport units, and the remaining two of the first side, second side, third side, and fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

[0026] In one exemplary embodiment, the first and second sides are configured to be connectable to other magnetic levitation vacuum transport units, respectively, and the third and fourth sides are configured to be connectable to substrate processing modules or load lock modules, respectively.

[0027] In one exemplary embodiment, the first side and the third side are configured to be connectable to other magnetic levitation vacuum transport units, respectively, and the second side and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

[0028] In one exemplary embodiment, the first side, the second side, and the third side are configured to be connectable to other magnetic levitation vacuum transport units, respectively, and the fourth side is configured to be connectable to a substrate processing module or a load lock module.

[0029] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same or similar elements are designated by the same reference numerals, and redundant explanations will be omitted. Unless otherwise specified, the positional relationships, such as up, down, left, and right, will be described based on the positional relationships shown in the drawings. The dimensional ratios in the drawings do not represent actual ratios, and the actual ratios are not limited to the ratios shown in the drawings.

[0030] 1 and 2 are diagrams for explaining an example of a substrate processing system 1 according to one embodiment. Fig. 1 is a schematic perspective view of the substrate processing system 1. Fig. 2 is a schematic front view of the substrate processing system 1 (viewed in the direction of arrow A in Fig. 1). In Fig. 2, for convenience, internal components of some devices are illustrated in a transparent manner.

[0031] 1 and 2, the substrate processing system 1 includes a load port (LP) 10, a load lock module (LLM) 20, a vacuum transfer unit 30, and a substrate processing module 40. The vacuum transfer unit 30 and the substrate processing module 40 are also referred to as a vacuum transfer module (VTM) and a process module (PM), respectively.

[0032] The substrate processing system 1 is controlled by a control unit CU (see FIG. 2 ). The control unit CU has a memory, a processor, and an input / output interface. Data such as recipes, programs, etc. are stored in the memory. The memory is, for example, a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD). The processor executes a program read from the memory to control each component of the substrate processing system 1 via the input / output interface based on data such as recipes stored in the memory. The processor is, for example, a central processing unit (CPU) or a digital signal processor (DSP).

[0033] The load port 10 has a mounting surface 10a. A container C is placed on the mounting surface 10a. The container C may be configured to accommodate a stack ST of multiple (e.g., 25) substrates W. The container C may be, for example, a FOUP (Front-Opening Unified Pod). The container C is transported by a container transport mechanism such as an OHT (Overhead Hoist Transport) and placed on the load port 10. The container C is an example of a "substrate storage container" in this disclosure.

[0034] The load lock module 20 includes an internal pressure variable chamber 20a having a substantially rectangular parallelepiped housing. The internal pressure variable chamber 20a is configured to be switchable between vacuum and atmospheric pressure. The internal pressure variable chamber 20a may include an exhaust device and a gas supply device. For example, the control unit CU controls the exhaust device to exhaust air from the internal pressure variable chamber 20a and switch the internal atmosphere from atmospheric to vacuum. Furthermore, for example, the control unit CU controls the gas supply device to supply, for example, clean air into the internal pressure variable chamber 20a and switch the internal atmosphere from vacuum to atmospheric.

[0035] The internal pressure variable chamber 20a is connected to a container C disposed on the load port 10 via a gate valve GV1 provided on a side surface 20s1 of the housing. The internal pressure variable chamber 20a is also connected to a vacuum transfer unit 30 via a gate valve GV2. In the example shown in FIG. 2 , the gate valve GV2 is provided on the same side surface 20s1 as the gate valve GV1. In the example shown in FIG. 2 , the gate valve GV2 is provided vertically (in the z-direction) below the gate valve GV1. In the example shown in FIG. 2 , the load port 10 and the vacuum transfer unit 30 are disposed on the side surface 20s1 of the load lock module 20. In one embodiment, the vacuum transfer unit 30 is disposed on the side surface 20s1 of the load lock module 20, and the load port 10 is disposed on the side surface 20s2 of the load lock module 20 opposite the side surface 20s1. The bottom surface of the load port 10 is disposed at a first height (h1) from the ground surface of the substrate processing system 1. The vacuum transfer unit 30 is disposed vertically below the load port 10. The bottom surface of the vacuum transfer unit 30 is disposed at a second height (h2) from the ground surface of the substrate processing system 1. In one embodiment, the first height (h1) is different from the second height (h2). In the example shown in FIG. 2 , the first height (h1) is higher than the second height (h2) (h2h1). In one embodiment, the first height (h1) is the same as the second height (h2) (h2=h1).<h1>

[0036] A vertical transfer robot 22 is disposed inside the internal pressure variable chamber 20a of the load lock module 20. The vertical transfer robot 22 includes an arm 22a. The arm 22a is configured to be able to rotate, extend, and move up and down freely. The arm 22a has a plurality of end effectors 22b. Each end effector 22b is configured to be able to place a substrate W in the stack ST thereon.

[0037] The vertical transfer robot 22 is configured to move up and down in the vertical direction while being magnetically levitated on the vertical planar motor 24. The vertical planar motor 24 is disposed extending in the vertical direction of the load lock module 20. The vertical planar motor 24 may be provided, for example, on the side surface 20s2 opposite to the side surface 20s1. The vertical planar motor 24 is configured by an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the up and down movement of the vertical transfer robot 22.

[0038] The vertical transfer robot 22 transfers the substrate W based on operation instructions output by the control unit CU. For example, the vertical transfer robot 22 transfers at least one substrate W between the load lock module 20 and a container C on the load port 10 in an atmospheric environment. Also, for example, the vertical transfer robot 22 holds at least one substrate W with an arm 22 a and transfers the substrate W up and down vertically within the load lock module 20. In one embodiment, the vertical transfer robot 22 may collectively transfer a stack ST of multiple substrates W using multiple end effectors 22 b of the arm 22 a. In one embodiment, multiple vertical transfer robots 22 may be provided.

[0039] The vacuum transfer unit 30 includes a vacuum chamber 30a having a substantially rectangular parallelepiped housing. The vacuum chamber 30a is connected to the load lock module 20 via the gate valve GV2. The vacuum chamber 30a is also connected to the substrate processing module 40 via the gate valve GV3.

[0040] A magnetically levitated horizontal transfer robot 32 is disposed within the vacuum chamber 30a of the vacuum transfer unit 30. In one embodiment, the horizontal transfer robot 32 includes an arm 32a. The arm 32a is configured to be able to rotate, extend, and move up and down freely. The arm 32a includes one or more end effectors 32b. The end effector 32b is configured to be able to place one substrate W thereon.

[0041] The horizontal transfer robot 32 is configured to move in the horizontal direction (x and y directions) while being magnetically levitated on a horizontal planar motor 34. The horizontal planar motor 34 is disposed on the bottom surface of the vacuum transfer unit 30, extending in the horizontal direction. The horizontal planar motor 34 is configured with an array of multiple coils. Each coil generates a magnetic field when supplied with current. The control unit CU individually controls the value of the current passed through each coil, thereby controlling the horizontal movement of the horizontal transfer robot 32.

[0042] The horizontal transfer robot 32 transfers the substrate W based on an operation instruction output by the control unit CU. For example, the horizontal transfer robot 32 transfers at least one substrate W between the load lock module 20 and the vacuum transfer unit 30 in a vacuum environment. Also, for example, the horizontal transfer robot 32 transfers the substrate W between the vacuum transfer unit 30 and the substrate processing module 40 in a vacuum environment. In one embodiment, a plurality of horizontal transfer robots 32 may be provided. The vacuum transfer unit 30 is an example of a "magnetic levitation vacuum transfer unit" in this disclosure.

[0043] The substrate processing module 40 includes a processing chamber 40a. The processing chamber 40a is configured to be depressurized to a predetermined vacuum atmosphere and to perform a desired process (etching process, film formation process, cleaning process, ashing process, etc.) on a substrate W therein. The processing chamber 40a is disposed adjacent to the vacuum transfer unit 30. The processing chamber 40a may have a stage 40b on which the substrate W is placed. The operation of each part for processing in the processing chamber 40a may be controlled by a control unit CU. For example, after the substrate W is placed on the stage 40b of the processing chamber 40a, the control unit CU may depressurize the interior, introduce a processing gas, apply RF power to generate plasma, and perform an etching process on the substrate W using the plasma.

[0044] 3A to 3F are diagrams illustrating an example of a transfer operation of the substrate processing system 1. Here, as an example of the transfer operation, an operation of transferring a substrate W accommodated in a container C on the load port 10 to a processing chamber 40a of a substrate processing module 40 will be described. This operation may be realized by the control unit CU controlling each part of the substrate processing system 1. At the start of the operation, the gate valves GV1, GV2, and GV3 are closed, and the internal pressure variable chamber 20a of the load lock module 20 is in an atmospheric atmosphere. Furthermore, the vacuum chamber 30a of the vacuum transfer unit 30 and the processing chamber 40a of the substrate processing module 40 are in a vacuum atmosphere.

[0045] 3A, the vertical transfer robot 22 is raised to a first transfer height (h3) corresponding to the position of the load port 10. Then, the gate valve GV1 and the lid of the container C are opened, and the arm 22a of the vertical transfer robot 22 is inserted into the container C. Then, each substrate W in the stack ST in the container C is placed on each of the multiple end effectors 22b.

[0046] 3B , the arm 22 a of the vertical transfer robot 22 holding the stack ST is returned to the internal pressure variable chamber 20 a of the load lock module 20, and the gate valve GV1 is closed. As a result, all of the substrates W (stack ST) in the container C are transferred collectively into the internal pressure variable chamber 20 a of the load lock module 20.

[0047] 3C , the vertical transfer robot 22, while holding the stack ST, is lowered vertically to a second transfer height (h4) corresponding to the position of the vacuum transfer unit 30. When the vertical transfer robot 22 is lowered, the air in the internal pressure variable chamber 20a may be discharged by an exhaust device, thereby switching the internal pressure variable chamber 20a from an atmospheric atmosphere to a vacuum atmosphere. Note that the switch from an atmospheric atmosphere to a vacuum atmosphere may be performed before or after the vertical transfer robot 22 is lowered.

[0048] 3D, the gate valve GV2 is opened. The horizontal transfer robot 32 moves horizontally to the vicinity of the gate valve GV2, and the end effector 32b is inserted into the internal pressure variable chamber 20a. One of the substrates W in the stack ST is then placed on the end effector 32b.

[0049] 3E, the end effector 32b of the horizontal transfer robot 32, while holding the substrate W, is returned to the vacuum chamber 30a of the vacuum transfer unit 30, and the gate valve GV2 is closed. As a result, one substrate W in the stack ST is transferred into the vacuum chamber 30a.

[0050] 3F, the gate valve GV3 is opened, and the horizontal transfer robot 32 moves horizontally to the vicinity of the gate valve GV3. Then, the end effector 32b holding the substrate W is inserted into the processing chamber 40a of the substrate processing module 40. As a result, the substrate W is placed on the stage 40b of the processing chamber 40a. The substrate W may be placed on, for example, a plurality of pins configured to be movable up and down in the vertical direction from the stage 40b.

[0051] In this manner, the substrate W contained in the container C placed on the load port 10 is transported to the processing chamber 40a of the substrate processing module 40. Note that the substrate W processed in the processing chamber 40a of the substrate processing module 40 may be transported to the container C on the load port 10 by reversing the above procedure.

[0052] <Example of Equipment Layout of Substrate Processing System 1> Figure 4 is a diagram that schematically illustrates the equipment layout of the substrate processing system 1. Figure 4 illustrates the equipment layout when the substrate processing system 1 is viewed in plan (xy plane). In Figure 4, "LLM", "VTM", and "PM" respectively represent the housings of the "load lock module 20", "vacuum transfer unit 30", and "substrate processing module 40" (the same applies hereinafter in the present specification and drawings, and they may be expressed with numbers such as "LLM1", "VTM1", and "PM1").

[0053] 4, the substrate processing system 1 has LLM, VTM, and PM blocks arranged side by side in the y direction. Although not shown in FIG. 4, the blocks are connected to each other via gate valves GV2 and GV3 (hereinafter collectively referred to as "gate valves") in an openable and closable manner, as shown in FIG.

[0054] In one embodiment, the substrate processing system 1 may be configured by connecting one or more LLM, VTM, and PM blocks in the horizontal direction (x and y directions). The position of the gate valve in each block may be changed as appropriate to match the equipment layout of each LLM, VTM, and PM block. Furthermore, when the substrate processing system 1 includes multiple VTMs, the VTMs may be connected to each other in the horizontal direction (x and y directions) via openings. In one embodiment, the horizontal transfer robot 32 may be magnetically levitated on the horizontal planar motor 34 of each VTM and move horizontally across the VTMs via the openings.

[0055] As described above, the layout of the LLM, VTM, and PM can be freely changed in the substrate processing system 1. Note that a plurality of vertical transfer robots 22 and horizontal transfer robots 32 may be provided depending on the layout of the apparatus. This can prevent the rate of substrate transfer in the LLM or VTM from becoming a limitation, thereby preventing a decrease in transfer efficiency.

[0056] 5A to 12, other examples of the layout of the equipment in the substrate processing system 1 will be described below. However, the layout of the equipment in the substrate processing system 1 is not limited to these.

[0057] 5A and 5B , the substrate processing system 1 includes one LLM, two VTMs (VTM1 and VTM2), and three PMs (PM1, PM2, and PM3). In this example, the two VTMs are coupled along the x direction (first direction). VTM1 is connected to PM1 on one side (first side) extending along the x direction, and is connected to the LLM on the other side (second side) opposite to the first side. VTM2 is connected to PM2 on one side (first side) extending along the x direction, and is connected to PM3 on the other side (second side).

[0058] 6A and 6B, the substrate processing system 1 includes one LLM, three VTMs (VTM1 to VTM3), and five PMs (PM1 to PM5). In this example, the three VTMs are coupled along the x direction (first direction). VTM1 is connected to PM1 on one side (first side) extending along the x direction, and is connected to the LLM on the other side (second side) opposite the first side. VTM2 is connected to PM2 on one side (first side) extending along the x direction, and is connected to PM3 on the other side (second side). VTM3 is connected to PM4 on one side (first side) extending along the x direction, and is connected to PM5 on the other side (second side).

[0059] 7, the substrate processing system 1 includes three LLMs (LLM1 to LLM3), three VTMs (VTM1 to VTM3), and three PMs (PM1 to PM3). In this example, the three VTMs are coupled along the x direction (first direction). VTM1 is connected to PM1 at one side (first side) extending along the x direction, and connected to LLM1 at the other side (second side) opposite the first side. VTM2 is connected to PM2 at one side (first side) extending along the x direction, and connected to LLM2 at the other side (second side). VTM3 is connected to PM3 at one side (first side) extending along the x direction, and connected to LLM3 at the other side (second side).

[0060] For example, in the example shown in FIG. 8 , the substrate processing system 1 includes one LLM, three VTMs (VTM1 to VTM3), and six PMs (PM1 to PM6). In this example, the three VTMs are connected along the y direction (second direction). VTM1 is connected to PM1 at one side (third side) extending along the y direction and connected to PM4 at the other side (fourth side) opposite the one side. VTM1 is also connected to VTM2 at one side (first side) extending along the x direction (first direction) and connected to the LLM at the other side (second side) opposite the one side. VTM2 is connected to PM2 at one side (third side) extending along the y direction and connected to PM5 at the other side (fourth side). VTM3 is connected to PM3 at one side (third side) extending along the y direction, and is connected to PM6 at the other side (fourth side).

[0061] 9 , the substrate processing system 1 includes two LLMs (LLM1 and LLM2), three VTMs (VTM1 to VTM3), and four PMs (PM1 to PM4). In this example, the three VTMs are coupled along the x direction (first direction). VTM1 is connected to PM1 at one side (first side) extending along the x direction, and connected to LLM1 at the other side (second side) opposite the first side. VTM2 is connected to PM2 at one side (first side) extending along the x direction, and connected to PM4 at the other side (second side). VTM3 is connected to PM3 at one side (first side) extending along the x direction, and connected to LLM2 at the other side (second side).

[0062] For example, in the example shown in FIG. 10 , the substrate processing system 1 includes a plurality of LLMs, a plurality of VTMs, and a plurality of PMs. In this example, the VTMs are connected in a serpentine line extending from one end to the other along the x and y directions. The VTMs include a first VTM ("G1" in FIG. 10 ) connected in the x direction (first direction) and a second VTM ("G2" in FIG. 10 ) connected in the y direction (second direction). In this example, the central VTM ("G3" in FIG. 10 ) of the first VTM is connected to other VTMs on two sides extending along the y direction, connected to a PM on one side extending along the x direction, and not connected to anything on the other side. This forms a space BS between adjacent PMs. The space BS can be used as a maintenance space for the PMs.

[0063] For example, in the example shown in FIG. 11 , the substrate processing system 1 includes a plurality of LLMs, a plurality of VTMs, and a plurality of PMs. In this example, the plurality of VTMs are connected in a substantially H-shape. The plurality of VTMs includes a first VTM ("G1" in FIG. 11 ) connected in the x direction (first direction) and a second VTM ("G2" in FIG. 11 ) connected in the y direction (second direction). In this example, the central VTM ("G4" in FIG. 11 ) of the first VTMs is connected to other VTMs on two side surfaces extending along the y direction and is not connected to anything on two side surfaces extending along the x direction. This forms a space BS between adjacent PMs. The space BS can be used as a maintenance space for the PMs.

[0064] In one embodiment, one or more of the plurality of LLMs included in the substrate processing system 1 may have a housing of a different size than the other LLMs. Similarly, one or more of the plurality of VTMs may have a housing of a different size than the other VTMs. Similarly, one or more of the plurality of PMs may have a housing of a different size than the other PMs.

[0065] For example, in the example shown in FIG. 12 , the substrate processing system 1 includes two LLMs (LLM1 and LLM2) of the same size, four VTMs (VTM1 to VTM4) with partially different widths (x-direction dimensions), and six PMs (PM1 to PM6) with partially different widths. In this example, the housings of LLM1, LLM2, VTM1, VTM4, PM1, and PM4 each have a width W1. The housings of VTM2, PM2, and PM5 each have a width W2 that is smaller than W1. The housings of VTM3, PM3, and PM6 each have a width W3 that is larger than W1. In one example, the number of stages included in the processing chambers of PM3 and PM6 may be greater than the number of stages included in the processing chambers of the remaining PMs (PM1, PM2, PM4, and PM5). For example, the processing chambers of PM3 and PM6 may each have two or more stages.

[0066] In one embodiment, instead of being magnetically levitated on the vertical planar motor 24, the vertical transfer robot 22 may be configured to be movable up and down in the vertical direction along a guide rail (hereinafter, this guide rail may also be referred to as a "vertical guide rail"). The vertical transfer robot 22 may be configured to be able to move along the vertical guide rail and also to be able to rotate, extend, and move up and down freely. The vertical guide rail may be provided inside the LLM. For example, the vertical guide rail may be arranged extending vertically on the inner wall surface of the side of the LLM housing. When multiple vertical transfer robots 22 are provided, one or more vertical guardrails may be provided inside the housing of one LLM.

[0067] In one embodiment, instead of being magnetically levitated on the horizontal planar motor 34, the horizontal transfer robot 32 may be configured to be movable horizontally along a guide rail (hereinafter, this guide rail may also be referred to as a "horizontal guide rail"). The horizontal transfer robot 32 may be configured to be able to move along the horizontal guide rail and to be able to rotate, extend, and move up and down freely. The horizontal guide rail may be provided inside the VTM. For example, the horizontal guide rail may be arranged extending horizontally on the inner wall surface of the bottom of the VTM housing. When multiple horizontal transfer robots 32 are provided, one or more horizontal guardrails may be provided inside the housing of one VTM.

[0068] When the substrate processing system 1 includes multiple VTMs, the VTMs may be connected to one another in the horizontal direction (x and y directions) via openings. In one embodiment, the horizontal transfer robot 32 may move horizontally between the VTMs via the openings along the horizontal guide rails of each VTM. In this case, the openings have a size that allows the horizontal transfer robot 32 to pass through. The horizontal guide rails may be installed after the VTMs are connected, or may be installed in each VTM in advance. Hereinafter, examples of horizontal guide rail arrangements will be described with reference to FIGS. 13 to 15.

[0069] Fig. 13 shows an example of the arrangement of horizontal guide rails and a horizontal transfer robot in the equipment layout shown in Fig. 5B. As shown in Fig. 13, the horizontal guide rail GL is formed by connecting the horizontal guide rails of VTM1 and VTM2 to each other. The horizontal guide rail GL is arranged to extend in the x direction. The horizontal transfer robot 32 may be configured to move in the x direction along the horizontal guide rail GL between VTM1 and VTM2.

[0070] Fig. 14 shows an example of the arrangement of horizontal guide rails and a horizontal transfer robot in the equipment layout shown in Fig. 8B. As shown in Fig. 14, the horizontal guide rail GL is formed by connecting the horizontal guide rails VTM1, VTM2, and VTM3 to each other. The horizontal guide rail GL is arranged to extend in the y direction. The horizontal transfer robot 32 may be configured to move in the y direction along the horizontal guide rail GL between VTM1, VTM2, and VTM3.

[0071] FIG. 15 shows an example of the arrangement of horizontal guide rails and horizontal transport robots in the equipment layout shown in FIG. 10. As shown in FIG. 15, the horizontal guide rail GL is formed by connecting the horizontal guide rails of multiple VTMs. The horizontal guide rail GL is connected so as to extend in a line from one end to the other, snaking along the x and y directions. The horizontal guide rail GL has multiple corners C1 to C5. As shown in FIG. 15, the multiple corners C1 to C5 may be bent at right angles. In another example, at least one of the multiple corners may be bent in an arc.

[0072] 15 , the substrate processing system 1 includes a plurality of horizontal transfer robots 32 (32A to 32E). In one embodiment, at least one of the plurality of horizontal transfer robots 32 may be configured to move in both the x and y directions along a horizontal guide rail GL. In this case, the corner of the horizontal guide rail GL through which the horizontal transfer robot 32 passes may be a corner that bends in an arc. This may facilitate movement of the horizontal transfer robot 32 from the x direction to the y direction (or from the y direction to the x direction). In one embodiment, at least one of the plurality of horizontal transfer robots 32 may be configured to move only in the x direction or only in the y direction along the horizontal guide rail GL. In this case, the corner of the horizontal guide rail GL through which the horizontal transfer robot 32 reaches may be a corner that bends at a right angle.

[0073] According to one embodiment, it is possible to provide a technique that increases the degree of freedom in device layout.

[0074] Embodiments of the present disclosure further include the following aspects.

[0075] [Supplementary Note 1] A substrate processing system comprising: a load port arranged at a first height; a plurality of magnetic levitation vacuum transfer units arranged at a second height and connected horizontally; a plurality of substrate processing modules, each connected to one of the plurality of magnetic levitation vacuum transfer units; and a load lock module configured to switch its interior between an atmospheric environment and a vacuum environment, the load lock module configured to: transfer at least one substrate between the load lock module and a substrate container on the load port in an atmospheric environment; transfer at least one substrate in a vertical direction; and transfer at least one substrate between the load lock module and one of the plurality of magnetic levitation vacuum transfer units in a vacuum environment.

[0076] [Supplementary Note 2] The substrate processing system according to Supplementary Note 1, wherein the first height is the same as the second height.

[0077] [Supplementary Note 3] The substrate processing system according to Supplementary Note 1, wherein the first height is greater than the second height.

[0078] [Supplementary Note 4] The substrate processing system according to any one of Supplementary Note 1 to Supplementary Note 3, wherein the load port and any one of the plurality of magnetic levitation vacuum transfer units are connected to the same side of the load lock module.

[0079] [Supplementary Note 5] The substrate processing system described in any one of Supplementary Note 1 to Supplementary Note 4, wherein each of the plurality of magnetic levitation vacuum transport units includes a horizontal planar motor extending horizontally, and the substrate processing system further includes a horizontal transport robot, which is configured to move horizontally while being magnetically levitated on the horizontal motor to transport substrates between the load lock module and the plurality of substrate processing modules.

[0080] [Supplementary Note 6] The substrate processing system according to any one of Supplementary Note 1 to Supplementary Note 5, further comprising a vertical transfer robot disposed within the load lock module, configured to transfer a stack of substrates between the load lock module and the substrate container on the load port, and to transfer the stack of substrates in a vertical direction.

[0081] [Supplementary Note 7] The substrate processing system according to Supplementary Note 6, wherein the load lock module includes a vertical planar motor extending in a vertical direction, and the vertical transfer robot is configured to move in the vertical direction while being magnetically levitated on the vertical planar motor.

[0082] [Supplementary Note 8] A substrate processing system as described in any one of Supplementary Note 1 to Supplementary Note 7, wherein the plurality of magnetic levitation vacuum transport units include a plurality of first magnetic levitation vacuum transport units connected along a first direction, and each of the plurality of first magnetic levitation vacuum transport units has a first side extending along the first direction and a second side extending along the first direction and opposite to the first side.

[0083] [Appendix 9] The substrate processing system described in Appendix 8, wherein the plurality of substrate processing modules include a plurality of first substrate processing modules, and each of the plurality of first substrate processing modules is connected to the first side or the second side of any of the plurality of first magnetic levitation vacuum transfer units.

[0084] [Supplementary Note 10] The substrate processing system described in Supplementary Note 8 or Supplementary Note 9, wherein the plurality of substrate processing modules includes a plurality of first substrate processing modules arranged along a first direction, and each of the plurality of first substrate processing modules is connected to the first side of any of the plurality of first magnetic levitation vacuum transfer units.

[0085] [Appendix 11] The substrate processing system described in any one of Appendices 8 to 10, wherein the plurality of substrate processing modules includes a plurality of second substrate processing modules arranged along a first direction, and each of the plurality of second substrate processing modules is connected to the second side of one of the plurality of first magnetic levitation vacuum transfer units.

[0086] [Supplementary Note 12] The substrate processing system described in any one of Supplementary Note 8 to Supplementary Note 11, wherein the plurality of magnetic levitation vacuum transport units include a plurality of second magnetic levitation vacuum transport units connected along a second direction perpendicular to the first direction, and each of the plurality of second magnetic levitation vacuum transport units has a third side extending along the second direction and a fourth side extending along the second direction and opposite to the third side.

[0087] [Appendix 13] The substrate processing system described in Appendix 12, wherein the plurality of substrate processing modules include a plurality of second substrate processing modules, and each of the plurality of second substrate processing modules is connected to the third side or the fourth side of any of the plurality of second magnetic levitation vacuum transfer units.

[0088] [Supplementary Note 14] A substrate processing system comprising: a plurality of magnetic levitation vacuum transfer units connected in a horizontal direction, the plurality of magnetic levitation vacuum transfer units including a plurality of first magnetic levitation vacuum transfer units connected in a first direction, each of the plurality of first magnetic levitation vacuum transfer units having a first side extending along the first direction and a second side extending along the first direction and opposite to the first side; and a plurality of first substrate processing modules, each of the plurality of first substrate processing modules connected to the first side or the second side of any of the plurality of first magnetic levitation vacuum transfer units.

[0089] [Supplementary Note 15] The substrate processing system described in Supplementary Note 14, wherein the plurality of magnetic levitation vacuum transfer units further include a plurality of second magnetic levitation vacuum transfer units connected in a second direction perpendicular to the first direction, and each of the plurality of second magnetic levitation vacuum transfer units has a third side extending along the second direction and a fourth side extending along the second direction opposite the third side, and the substrate processing system further includes a plurality of second substrate processing modules, and each of the plurality of second substrate processing modules is connected to the third side or the fourth side of any of the plurality of second magnetic levitation vacuum transfer units.

[0090] [Supplementary Note 16] A magnetic levitation vacuum transfer unit comprising: a first side extending along a first direction; a second side extending along the first direction and opposite the first side; a third side extending along a second direction perpendicular to the first direction; and a fourth side extending along the second direction and opposite the third side, wherein at least two of the first side, the second side, the third side, and the fourth side are configured to be connectable to other magnetic levitation vacuum transfer units, and the remaining one or more of the first side, the second side, the third side, and the fourth side are configured to be connectable to a substrate processing module or a load lock module.

[0091] [Appendix 17] A magnetic levitation vacuum transfer unit as described in Appendix 16, wherein two of the first side, the second side, the third side, and the fourth side are configured to be connectable to other magnetic levitation vacuum transfer units, and the remaining two of the first side, the second side, the third side, and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

[0092] [Appendix 18] A magnetic levitation vacuum transfer unit as described in Appendix 15, wherein the first side and the second side are configured to be connectable to other magnetic levitation vacuum transfer units, and the third side and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

[0093] [Appendix 19] A magnetic levitation vacuum transfer unit as described in Appendix 15, wherein the first side and the third side are configured to be connectable to other magnetic levitation vacuum transfer units, and the second side and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

[0094] [Appendix 20] The magnetic levitation vacuum transfer unit described in Appendix 16, wherein the first side, the second side, and the third side are configured to be connectable to other magnetic levitation vacuum transfer units, and the fourth side is configured to be connectable to a substrate processing module or a load lock module.

[0095] [Supplementary Note 21] A substrate processing system comprising: a plurality of vacuum transfer units connected in a horizontal direction, the plurality of vacuum transfer units including a plurality of first vacuum transfer units connected in a first direction, each of the plurality of first vacuum transfer units having a first side extending along the first direction and a second side extending along the first direction and opposite to the first side; and a plurality of first substrate processing modules, each of the plurality of first substrate processing modules connected to the first side or the second side of any of the plurality of first vacuum transfer units.

[0096] [Supplementary Note 22] The substrate processing system described in Supplementary Note 21, wherein the plurality of vacuum transfer units further include a plurality of second vacuum transfer units connected in a second direction perpendicular to the first direction, and each of the plurality of second vacuum transfer units has a third side extending along the second direction and a fourth side extending along the second direction and opposite the third side, and the substrate processing system further includes a plurality of second substrate processing modules, and each of the plurality of second substrate processing modules is connected to the third side or the fourth side of any of the plurality of second vacuum transfer units.

[0097] The above embodiments are described for the purpose of explanation and are not intended to limit the scope of the present disclosure. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present disclosure. For example, some components in one embodiment can be added to other embodiments. Also, some components in one embodiment can be replaced with corresponding components in other embodiments.

[0098] 10: Load port, 20: Load lock module, 22: Vertical transfer robot, 24: Vertical planar motor, 30: Vacuum transfer unit, 32: Horizontal transfer robot, 34: Horizontal planar motor, 40: Substrate processing module, C: Container, CU: Control unit

Claims

1. A substrate processing system comprising: a load port located at a first height; a plurality of magnetically levitated vacuum transfer units located at a second height and connected horizontally; a plurality of substrate processing modules, each connected to one of the plurality of magnetically levitated vacuum transfer units; and a load lock module configured to switch its interior between an atmospheric environment and a vacuum environment, the load lock module configured to: transfer at least one substrate between the load lock module and a substrate container on the load port in an atmospheric environment; transfer at least one substrate in a vertical direction; and transfer at least one substrate between the load lock module and one of the plurality of magnetically levitated vacuum transfer units in a vacuum environment.

2. The substrate processing system of claim 1, wherein the first height is greater than the second height.

3. The substrate processing system of claim 1, wherein the first height is the same as the second height.

4. The substrate processing system according to claim 2, wherein the load port and any one of the plurality of magnetic levitation vacuum transport units are connected to the same side of the load lock module.

5. The substrate processing system of claim 1, wherein each of the plurality of magnetically levitated vacuum transport units comprises a horizontal planar motor extending horizontally, and the substrate processing system further comprises a horizontal transport robot configured to move horizontally while magnetically levitated on the horizontal motor to transport substrates between the load lock module and the plurality of substrate processing modules.

6. The substrate processing system of claim 5, further comprising a vertical transfer robot disposed within the load lock module and configured to transfer a stack of substrates between the load lock module and the substrate container on the load port, and to transfer the stack of substrates in a vertical direction.

7. The substrate processing system according to claim 6, wherein the load lock module includes a vertical planar motor extending in a vertical direction, and the vertical transfer robot is configured to move in the vertical direction while being magnetically levitated on the vertical planar motor.

8. A substrate processing system as described in any one of claims 1 to 7, wherein the plurality of magnetic levitation vacuum transport units include a plurality of first magnetic levitation vacuum transport units connected along a first direction, each of the plurality of first magnetic levitation vacuum transport units having a first side extending along the first direction and a second side extending along the first direction and opposite the first side.

9. The substrate processing system of claim 8, wherein the plurality of substrate processing modules includes a plurality of first substrate processing modules, each of the plurality of first substrate processing modules being connected to the first side or the second side of one of the plurality of first magnetic levitation vacuum transfer units.

10. The substrate processing system of claim 8, wherein the plurality of substrate processing modules includes a plurality of first substrate processing modules arranged along a first direction, and each of the plurality of first substrate processing modules is connected to the first side of one of the plurality of first magnetic levitation vacuum transport units.

11. The substrate processing system of claim 10, wherein the plurality of substrate processing modules includes a plurality of second substrate processing modules arranged along a first direction, and each of the plurality of second substrate processing modules is connected to the second side of one of the plurality of first magnetic levitation vacuum transfer units.

12. The substrate processing system of claim 9, wherein the plurality of magnetic levitation vacuum transport units include a plurality of second magnetic levitation vacuum transport units connected along a second direction perpendicular to the first direction, and each of the plurality of second magnetic levitation vacuum transport units has a third side extending along the second direction and a fourth side extending along the second direction and opposite the third side.

13. The substrate processing system of claim 12, wherein the plurality of substrate processing modules includes a plurality of second substrate processing modules, each of the plurality of second substrate processing modules being connected to the third side or the fourth side of one of the plurality of second magnetic levitation vacuum transfer units.

14. A substrate processing system comprising: a plurality of magnetically levitated vacuum transfer units connected in a horizontal direction, the plurality of magnetically levitated vacuum transfer units including a plurality of first magnetically levitated vacuum transfer units connected in a first direction, each of the plurality of first magnetically levitated vacuum transfer units having a first side extending along the first direction and a second side extending along the first direction opposite the first side; and a plurality of first substrate processing modules, each of the plurality of first substrate processing modules connected to the first side or the second side of any of the plurality of first magnetically levitated vacuum transfer units.

15. The substrate processing system of claim 14, wherein the plurality of magnetic levitation vacuum transport units further include a plurality of second magnetic levitation vacuum transport units connected in a second direction perpendicular to the first direction, each of the plurality of second magnetic levitation vacuum transport units having a third side extending along the second direction and a fourth side extending along the second direction opposite the third side, and the substrate processing system further includes a plurality of second substrate processing modules, each of the plurality of second substrate processing modules being connected to the third side or the fourth side of any of the plurality of second magnetic levitation vacuum transport units.

16. A magnetic levitation vacuum transfer unit comprising: a first side extending along a first direction; a second side extending along the first direction and opposite the first side; a third side extending along a second direction perpendicular to the first direction; and a fourth side extending along the second direction and opposite the third side, wherein at least two of the first side, the second side, the third side, and the fourth side are configured to be connectable with other magnetic levitation vacuum transfer units, and the remaining one or more of the first side, the second side, the third side, and the fourth side are configured to be connectable with a substrate processing module or a load lock module.

17. A magnetic levitation vacuum transport unit as described in claim 16, wherein two of the first side, the second side, the third side, and the fourth side are configured to be connectable to other magnetic levitation vacuum transport units, and the remaining two of the first side, the second side, the third side, and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

18. A magnetic levitation vacuum transport unit as described in claim 16, wherein the first side and the second side are configured to be connectable to other magnetic levitation vacuum transport units, respectively, and the third side and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

19. A magnetic levitation vacuum transport unit as described in claim 16, wherein the first side and the third side are configured to be connectable to other magnetic levitation vacuum transport units, respectively, and the second side and the fourth side are configured to be connectable to a substrate processing module or a load lock module, respectively.

20. A magnetic levitation vacuum transport unit as described in claim 16, wherein the first side, the second side, and the third side are each configured to be connectable with other magnetic levitation vacuum transport units, and the fourth side is configured to be connectable with a substrate processing module or a load lock module.

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