Light source module and vehicle lamp

Abstract

This light source module comprises: a socket housing that has a resin-molded part formed from a conductive resin and a heat dissipation plate at least a portion of which is embedded in the resin-molded part; a substrate on which a light source is mounted and which is attached to the socket housing; and a power feeder that has a terminal holding part formed from an insulating resin material and a plurality of connection terminals held in the terminal holding part and including a ground terminal, wherein the outer surface of the terminal holding part has two surfaces for protrusion, from which both ends of the connection terminal respectively protrude, and a peripheral surface located between the two surfaces for protrusion. In the connection terminal, a portion that protrudes from one of the surfaces for protrusion is provided as a pattern connection part, a portion that protrudes from the other of the surfaces for protrusion is provided as a connector connection part, and a portion between the pattern connection part and the connector connection part is provided as an intermediate part. At least a portion of the intermediate part is exposed on the peripheral surface and brought into contact with the resin-molded part.

Description

Light source module and vehicle lighting fixture

[0001] The present invention relates to a light source module having a substrate on which a light source is mounted and a socket housing to which the substrate is attached, and to a vehicle lamp including the light source module.

[0002] 2. Description of the Related Art Some vehicle lamps are configured to include a light source module that is detachably attached to a lamp housing, and light is emitted from a light source in the light source module.

[0003] Such a light source module is provided with a light-emitting element that functions as a light source and a substrate on which a circuit pattern for supplying current to at least the light-emitting element is formed, and the substrate is attached to and arranged in a socket housing (see, for example, Patent Document 1).

[0004] JP 2018-181783 A

[0005] In the light source module described above, it is necessary to ensure stable operation of various electronic components mounted on the substrate. In particular, in recent years, many electronic components have been mounted to enhance the functionality of light source modules, and semiconductor elements such as integrated circuits (ICs) and field effect transistors (FETs), which are likely to be noise sources or susceptible to noise, are often mounted as electronic components.

[0006] Therefore, in the light source module described above, it is necessary to improve noise resistance in order to ensure stable driving conditions of various electronic components.

[0007] Furthermore, it is desirable for the light source module to have improved noise resistance without increasing manufacturing costs through a simple configuration.

[0008] Therefore, an object of the light source module and vehicle lamp according to the present invention is to improve noise resistance performance by using a simple configuration without increasing manufacturing costs.

[0009] The light source module of the present invention comprises a socket housing having a resin molded portion formed from a conductive resin and a heat sink at least a portion of which is embedded in the resin molded portion, a substrate on which a light source is mounted and attached to the socket housing, and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion, including a ground terminal, wherein the outer surface of the terminal holding portion has two protruding surfaces from which both ends of the connection terminals protrude, and a peripheral surface positioned between the two protruding surfaces, and the connection terminal has a portion protruding from one of the protruding surfaces as a pattern connection portion and a portion protruding from the other protruding surface as a connector connection portion, and a portion between the pattern connection portion and the connector connection portion as an intermediate portion, and at least a portion of the intermediate portion is exposed to the peripheral surface and is in contact with the resin molded portion.

[0010] As a result, the intermediate portion exposed on the peripheral surface of the terminal holding portion is electrically connected to the heat sink via the resin molded portion made of conductive resin.

[0011] The vehicle lamp according to the present invention is a vehicle lamp equipped with a light source module, the light source module comprising: a socket housing having a resin molded portion formed from a conductive resin and a heat sink at least a portion of which is embedded in the resin molded portion; a substrate on which a light source is mounted and attached to the socket housing; and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion, including a ground terminal; the outer surface of the terminal holding portion has two protruding surfaces from which both end portions of the connection terminals protrude, and a peripheral surface located between the two protruding surfaces, the portion of the connection terminal protruding from one of the protruding surfaces being provided as a pattern connection portion, and the portion protruding from the other protruding surface being provided as a connector connection portion, and the portion between the pattern connection portion and the connector connection portion being provided as an intermediate portion, at least a portion of the intermediate portion being exposed to the peripheral surface and in contact with the resin molded portion.

[0012] As a result, in the light source module, the intermediate portion exposed on the peripheral surface of the terminal holding portion is electrically connected to the heat sink via the resin molded portion formed of conductive resin.

[0013] Another light source module according to the present invention comprises a socket housing having a board mounting portion, an insulating board mounted on the board mounting portion, and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion and including a ground terminal, the connection terminals being connected to the board, wherein at least one surface of the board in the thickness direction is formed as a pattern forming surface, a light source and electronic components are mounted on the circuit pattern formed on the pattern forming surface on one surface of the board in the thickness direction, and a ground portion is provided on the other surface of the board in the thickness direction and electrically connected to the ground terminal, and the area of ​​the ground portion is more than half the area of ​​the board.

[0014] As a result, the ground portion, which is positioned on the side of the board opposite to the surface on which the light source and electronic components are mounted and which occupies an area of ​​at least half the area of ​​the board, is electrically connected to the ground terminal.

[0015] Another vehicle lamp according to the present invention is a vehicle lamp equipped with a light source module, comprising: a socket housing having a board mounting portion; an insulating board mounted on the board mounting portion; a terminal holding portion formed from an insulating resin material; and a power supply body having a plurality of connection terminals held by the terminal holding portion and including a ground terminal, the connection terminals being connected to the board, wherein at least one surface of the board in the thickness direction is formed as a pattern forming surface, a light source and electronic components are mounted on a circuit pattern formed on the pattern forming surface on one surface of the board in the thickness direction, and a ground portion located on the other surface of the board in the thickness direction and electrically connected to the ground terminal is provided, and the area of ​​the ground portion is at least half the area of ​​the board.

[0016] As a result, in the light source module, a ground section, which is located on the opposite side of the board from the side on which the light source and electronic components are mounted and which is formed over an area of ​​more than half the area of ​​the board, is electrically connected to the ground terminal.

[0017] According to the present invention, the intermediate portion exposed on the peripheral surface of the terminal holding portion is electrically connected to the heat sink via a resin molded portion formed from conductive resin, thereby enabling improved noise resistance performance to be achieved without increasing manufacturing costs through a simple configuration.

[0018] 17 shows a first embodiment of the present invention together with FIGS. 2 to 7, and is a side view of a vehicle lamp shown partially in cross section. FIG. 18 shows a perspective view of a light source module. FIG. 19 shows a cross-sectional view of the light source module. FIG. 20 shows a perspective view of a power feeder. FIG. 21 shows a plan view partially in cross section showing a state in which the power feeder is connected to a terminal land. FIG. 22 shows a perspective view of a substrate. FIG. 23 shows a perspective view of an example of a power feeder whose intermediate portion is exposed on the second surface of the resin molding portion. FIG. 19 shows a second embodiment of the present invention together with FIGS. 17 to 18, and is a perspective view of a light source module. FIG. 23 shows a cross-sectional view of the light source module. FIG. 24 shows a perspective view of a substrate. FIG. 25 shows a perspective view of the back surface of the substrate. FIG. 26 shows a plan view partially in cross section showing a state in which the power feeder is joined to a terminal land. FIG. 27 shows a perspective view of an example in which a ground terminal is connected to a ground pattern by a conductive portion formed on the outer periphery of the substrate. FIG. 28 shows an example in which a metal plate is provided as a ground portion together with FIGS. 15 to 17, and is an exploded perspective view of the substrate and the metal plate. FIG. 29 shows a plan view partially in cross section showing a state in which the power feeder is joined to a terminal land. FIG. 29 shows a perspective view of an example of a ground terminal provided with a connection protrusion. 10 is a perspective view showing a state in which a connection protrusion of the ground terminal is in contact with a metal plate. FIG.

[0019] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0020] In the following description, the direction of light emitted from the vehicle lamp is defined as the forward direction, and the horizontal direction perpendicular to the direction of light emitted from the vehicle lamp is defined as the left-right direction, and the directions of front, back, up, down, left and right are indicated. Note that the directions of front, back, up, down, left and right shown below are for the convenience of explanation, and the present invention is not limited to these directions in terms of implementation.

[0021] <General Configuration of Vehicle Lamp> First, the general configuration of a vehicle lamp will be described (see FIG. 1).

[0022] The vehicle lamp 1 comprises a lamp housing 2 having a recessed portion that opens forward, and a cover 3 that closes the front opening 2a of the lamp housing 2 (see FIG. 1). The lamp housing 2 and the cover 3 form a lamp outer casing 4, and the internal space of the lamp outer casing 4 forms a lamp chamber 5.

[0023] The rear end of the lamp housing 2 is provided with a substantially cylindrical unit mounting portion 6 that penetrates from front to rear, and the space inside the unit mounting portion 6 is formed as a mounting hole 6a. A plurality of engaging portions 7 that protrude inward are provided on the inner peripheral surface of the unit mounting portion 6 at intervals in the circumferential direction.

[0024] The vehicle lamp 1 includes a lamp outer casing 4 formed by a lamp housing 2 and a cover 3 , as well as a light source module 8 that is detachable from a unit mounting portion 6 of the lamp housing 2 .

[0025] First Embodiment A light source module 8 according to a first embodiment will be described below (see FIGS. 2 to 7).

[0026] The light source module 8 has, for example, a stop lamp function, a tail lamp function, or both functions. However, the scope of application of the present invention is not limited to light source modules having the stop lamp or tail lamp function and vehicle lamps equipped with such light source modules.

[0027] The light source module 8 includes a socket housing 9, a power supply 10, and a substrate 11 (see FIGS. 2 and 3).

[0028] The socket housing 9 is formed, for example, by integrally molding the resin molded portion 12 and the heat sink 13. For integral molding, for example, so-called insert molding is used, in which a molten resin (resin material) is filled into a mold cavity while a metal material is held in the cavity, and a molded product is formed integrally from the metal material and the resin material. In the socket housing 9, the metal material corresponds to the heat sink 13, and the resin material corresponds to the resin molded portion 12.

[0029] The resin molded portion 12 has excellent thermal conductivity and is formed of, for example, a conductive resin containing carbon, etc. The resin molded portion 12 has a disk-shaped base surface portion 14 facing the front-rear direction, a protrusion portion 15 protruding forward from the center of the base surface portion 14, a plurality of first heat dissipation fins 16 protruding rearward from the base surface portion 14, a plurality of second heat dissipation fins 17 protruding rearward from the base surface portion 14, and a connector connecting portion 18 protruding rearward from the base surface portion 14.

[0030] The protrusion 15 has a board mounting portion 19 formed in a circular shape and a plurality of engaging protrusions 20 protruding from the outer peripheral surface of the board mounting portion 19 .

[0031] A mounting recess 19a that opens forward is formed in the board mounting portion 19. The mounting recess 19a is formed in a substantially rectangular shape and is slightly larger than the outer shape of the board 11. The engaging protrusions 20 are provided at the front end of the board mounting portion 19 and spaced apart in the circumferential direction.

[0032] The first heat dissipation fins 16 are arranged, for example, at equal intervals in the left-right direction and protrude from a portion of the base surface portion 14 other than both left and right ends, for example, from the upper half portion.

[0033] The second heat dissipation fins 17 are positioned on both sides of the first heat dissipation fins 16 in the left-right direction, and protrude from both left and right ends of the base surface portion 14. The thickness of the second heat dissipation fins 17 in the left-right direction is greater than the thickness of the first heat dissipation fins 16 in the left-right direction.

[0034] The connector connection portion 18 is formed in a cylindrical shape with its axial direction extending in the front-rear direction, and is positioned below the first heat dissipation fin 16 .

[0035] The heat sink 13 functions as a heat sink and is made of a plate-like metal material such as aluminum, which has high thermal conductivity, formed into a predetermined shape. The resin molded portion 12 is also made of a resin material with excellent thermal conductivity, so it functions as a heat sink together with the heat sink 13.

[0036] The heat sink 13 is made up of a first heat radiating portion 13a, a pair of second heat radiating portions 13b, a pair of third heat radiating portions 13c, and a pair of fourth heat radiating portions 13d (see FIG. 3).

[0037] The first heat dissipation portion 13a and the third heat dissipation portion 13c are each formed in a generally rectangular shape facing the front-rear direction, while the second heat dissipation portion 13b and the fourth heat dissipation portion 13d are each formed in a generally rectangular shape facing the left-right direction. The front end of the second heat dissipation portion 13b is continuous with both left and right ends of the first heat dissipation portion 13a. The inner end of the third heat dissipation portion 13c is continuous with the rear end of the second heat dissipation portion 13b, and the outer end of the third heat dissipation portion 13c is continuous with the front end of the fourth heat dissipation portion 13d. Therefore, the second heat dissipation portion 13b is formed by being bent in a direction perpendicular to the first heat dissipation portion 13a, the third heat dissipation portion 13c is formed by being bent in a direction perpendicular to the second heat dissipation portion 13b, and the fourth heat dissipation portion 13d is formed by being bent in a direction perpendicular to the third heat dissipation portion 13c.

[0038] The heat sink 13 has a first heat dissipation portion 13a positioned in a recess 19a of the board mounting portion 19 in the resin molded portion 12 and exposed to the resin molded portion 12. The heat sink 13 has a second heat dissipation portion 13b positioned inside the board mounting portion 19, a third heat dissipation portion 13c positioned inside the base surface portion 14, and a fourth heat dissipation portion 13d positioned inside the second heat dissipation fins 17.

[0039] The resin molded portion 12 has an insertion arrangement hole 12a formed at a position extending from the board mounting portion 19 to the base surface portion 14, and the insertion arrangement hole 12a is connected to the arrangement recess 19a and the inside of the connector connecting portion 18 (see Figure 2).

[0040] The power supply 10 has a terminal holder 21 made of an insulating resin material and a plurality of, for example, two, connection terminals 22 held by the terminal holder 21 (see FIGS. 2 and 4). In the power supply 10, both ends of the connection terminal 22 protrude forward and backward from the terminal holder 21 (see FIGS. 4 and 5).

[0041] The terminal holder 21 is formed in a flat shape that extends in the front-rear direction and is thin in thickness from top to bottom. The outer surfaces of the terminal holder 21 are formed as protruding surfaces 23 on both the front and rear sides, from which the connection terminals 22 protrude, and the surface between the protruding surfaces 23 is formed as a peripheral surface 24.

[0042] The peripheral surface 24 has two first surfaces 24a in the thickness direction (vertical direction) and two surfaces between the first surfaces 24a that are formed as second surfaces 24b. The terminal holding portion 21 is formed in a flat shape with thin thicknesses at the top and bottom, so the area of ​​the first surface 24a is larger than the area of ​​the second surface 24b.

[0043] The terminal holding portion 21 has a notched recess 21a formed on one first surface 24a side, the notched recess 21a being open upward and to the side.

[0044] The connection terminals 22 are made of a metal material and are positioned apart from each other on the left and right sides along the first surface 24a. Each connection terminal 22 is composed of a pattern connection portion 25, a connector connection portion 26, and an intermediate portion 27.

[0045] The pattern connection portion 25 is provided as a linear portion protruding forward from one of the protruding surfaces 23, the connector connection portion 26 is provided as a linear portion protruding backward from the other protruding surface 23, and the intermediate portion 27 is the portion between the pattern connection portion 25 and the connector connection portion 26.

[0046] The intermediate portion 27 is composed of a first straight portion 28 connected to the pattern connection portion 25, a second straight portion 29 connected to the connector connection portion 26, and a retaining portion 30 whose width in both directions is wider than that of the first straight portion 28 and the second straight portion 29.

[0047] The first linear portion 28 and the second linear portion 29 are formed in a straight line extending in the front-rear direction, and the retaining portion 30 is formed in a rectangular shape and is located between the first linear portion 28 and the second linear portion 29. The first linear portion 28 and the second linear portion 29 are respectively connected to diagonal portions 30a, 30b of the retaining portion 30. Specifically, the rear end of the first linear portion 28 is connected to the front portion 30a on the outside of the retaining portion 30 in the left-right direction, and the second linear portion 29 is connected to the rear portion 30b on the inside of the retaining portion 30 in the left-right direction.

[0048] The connection terminals 22 are provided with retaining portions 30 to prevent them from falling off from the terminal holding portion 21 .

[0049] One of the two connection terminals 22 is provided as a power terminal 22D for supplying power, and the other is provided as a ground terminal 22G for grounding (earthing). The upper surface of the intermediate portion 27 of the ground terminal 22G is exposed on the first surface 24a of the terminal holding portion 21. Note that the intermediate portion 27 of the ground terminal 22G may be partially exposed on the first surface 24a, and it is desirable that at least the upper surface of the retaining portion 30 is exposed on the first surface 24a. Furthermore, the intermediate portion 27 of the ground terminal 22G may be partially exposed in the thickness direction and protrude from the first surface 24a.

[0050] As described above, the connection terminal 22 is composed of the linear pattern connection portion 25, the connector connection portion 26, the first linear portion 28, the second linear portion 29, and the rectangular retaining portion 30, so that there are no bent portions, and strength can be improved.

[0051] As long as the shape of the connection terminal 22 ensures sufficient strength as a whole, the shape of the retaining portion 30 is not limited to a rectangular shape, and the intermediate portion 27 may be formed in a bent shape.

[0052] In the power supply body 10, the terminal holding portion 21 and the connection terminal 22 are integrally formed by, for example, insert molding. The portion of the power supply body 10 other than the pattern connection portion 25 and the connector connection portion 26 is inserted into the insertion and arrangement hole 12a formed in the resin molded portion 12, with the pattern connection portion 25 positioned in the arrangement recess 19a and the connector connection portion 26 positioned inside the connector coupling portion 18 (see FIG. 2).

[0053] The power supply unit 10 is placed in a mold cavity with the terminal holding portion 21 and the connection terminal 22 integrally formed by, for example, insert molding, and the cavity is filled with molten resin to form the resin molded portion 12, and the power supply unit 10 is integrally formed with the socket housing 9 by, for example, insert molding. Therefore, the intermediate portion 27 of the ground terminal 22G is in contact with the resin molded portion 12 of the socket housing 9.

[0054] Furthermore, when a portion of the intermediate portion 27 of the ground terminal 22G is exposed on the first surface 24a, only the portion of the intermediate portion 27 exposed on the first surface 24a is in contact with the resin molded portion 12 of the socket housing 9.

[0055] The substrate 11 is formed in a generally rectangular shape facing the front-rear direction (see FIGS. 2, 3, and 6). The substrate 11 is, for example, a ceramic substrate. However, the substrate 11 may also be a glass epoxy substrate.

[0056] Glass-epoxy substrates are made by impregnating epoxy resin with glass fibers, and have excellent insulation resistance and heat resistance, as well as a small coefficient of thermal expansion. On the other hand, ceramic substrates are made of alumina as their base material, and have excellent heat dissipation and insulation properties, as well as a small coefficient of thermal expansion.

[0057] The light source module 8 is configured to emit light with high brightness, and tends to generate a large amount of heat when the light is emitted. Therefore, it is preferable to use a ceramic substrate with excellent heat dissipation properties in the light source module 8. By using a ceramic substrate with excellent heat dissipation properties in the light source module 8, it is possible to sufficiently suppress temperature increases due to heat generated by the light source and electronic components described below when light is emitted, and it is possible to ensure good operating conditions of the light source and electronic components.

[0058] One surface (front surface) of the substrate 11 in the thickness direction is formed as a pattern forming surface 11a (see FIGS. 5 and 6).

[0059] A circuit pattern (not shown) is formed on the pattern forming surface 11a of the substrate 11, and for example, a plurality of light sources 31 and various electronic components 32 are mounted on the circuit pattern (see FIG. 6).

[0060] The light source 31 is mounted in the center of the substrate 11, and a light emitting diode (LED) is used as the light source 31. The number and functions of the light sources 31 mounted on the substrate 11 can be set arbitrarily depending on the type of vehicle lamp 1, the required brightness, etc.

[0061] The electronic components 32 include, for example, a semiconductor element 32X in addition to a capacitor or a resistor, and are mounted around the light source 31 on the substrate 11. The semiconductor element 32X is, for example, an integrated circuit (IC) or a field effect transistor (FET).

[0062] A plurality of terminal insertion holes 33, for example, two, are formed spaced apart on the left and right sides in the substrate 11. Two terminal lands 34, for example, having an annular shape, are formed on the pattern forming surface 11a of the substrate 11. The terminal lands 34 are formed on the opening edges of the terminal insertion holes 33 and are connected to the circuit pattern.

[0063] A frame 35 is formed on the pattern forming surface 11a of the substrate 11 between the light source 31 and the electronic component 32. The frame 35 is formed, for example, in a substantially annular shape from a resin material and is disposed in a position surrounding the light source 31. The interior of the frame 35 is filled with a sealing resin (not shown), and the light source 31 is sealed by the sealing resin. A lens 36 is disposed in a continuous state on the sealing resin. The lens 36 is formed in a hemispherical shape that is convex forward.

[0064] The light source module 8 may not be provided with the lens 36. In this case, for example, the front end of the sealing resin may be formed into a concave or convex shape, so that a part of the sealing resin functions as the lens 36.

[0065] The pattern connection portion 25 of the connection terminal 22 of the power supply 10 is inserted into the terminal insertion hole 33 from the rear, and the pattern connection portion 25 is joined to the terminal land 34 with solder 50 (see FIGS. 2 and 5). With the pattern connection portion 25 of the connection terminal 22 joined to the terminal land 34, the middle portion 27 of the ground terminal 22G is electrically connected to the heat sink 13 via the resin molded portion 12.

[0066] At this time, as described above, the connector connection portion 26 of the connection terminal 22 is positioned inside the connector connecting portion 18, and by connecting a connector (not shown) for supplying power to the connector connecting portion 18, the connector is connected to the connector connecting portion 26, making it possible to supply power to the light source 31, etc.

[0067] The rear surface of the substrate 11 is bonded to the front surface of the first heat dissipation portion 13a of the heat dissipation plate 13 with a thermally conductive adhesive (see FIG. 3).

[0068] In the light source module 8 configured as described above, an annular gasket 37 is attached to the protrusion 15 of the socket housing 9 in an externally fitted manner. The gasket 37 is made of a resin material or a rubber material. With the gasket 37 attached, the protrusion 15 of the light source module 8 is inserted into the unit mounting portion 6 of the lamp housing 2 from the rear side and rotated circumferentially so that the engaging protrusions 20 engage with the engaging portions 7 from the front side (see FIG. 1 ). At this time, the engaging portions 7 are sandwiched between the engaging protrusions 20 and the gasket 37, and the light source module 8 is attached to the lamp housing 2. With the light source module 8 attached to the lamp housing 2, the unit mounting portion 6 is closed by the gasket 37, preventing foreign matter such as moisture from entering the lamp chamber 5 from the outside via the unit mounting portion 6.

[0069] Conversely, when the light source module 8 is rotated in the opposite circumferential direction, the engagement of the engaging protrusion 20 with the engaging portion 7 is released, and the light source module 8 can be removed from the lamp housing 2 by pulling out the protrusion 15 from the unit mounting portion 6.

[0070] With the light source module 8 attached to the lamp housing 2, when a current is supplied from the power supply circuit via the connection terminal 22 to the circuit pattern formed on the substrate 11, light is emitted from the light source 31.

[0071] Light emitted from the light source 31 is transmitted through the sealing resin and the lens 36, and is then irradiated to the outside through the cover 3. At this time, the direction of light irradiation is controlled by the lens 36, and the light is irradiated to the outside in a predetermined direction.

[0072] When light is emitted from the light source 31, heat is generated in the light source 31 and the electronic components 32 mounted on the substrate 11, and the generated heat is transferred to the first heat dissipation portion 13a via the substrate 11, and then to the heat dissipation plate 13 and the molded resin portion 12. The heat transferred to the heat dissipation plate 13 and the molded resin portion 12 is mainly dissipated to the outside from the first heat dissipation fins 16 and the second heat dissipation fins 17. Therefore, good operating conditions of the light source 31 and the electronic components 32 are ensured.

[0073] If noise is applied when the light source 31 and electronic components 32 are driven, the noise may affect the driving of the light source 31 and electronic components 32. However, in the light source module 8, the intermediate portion 27 of the ground terminal 22G is electrically connected to the heat sink 13 via the resin molded portion 12. Therefore, the ground terminal 22G has the same potential as the heat sink 13, and the influence of the noise is suppressed by the heat sink 13.

[0074] As described above, in the light source module 8 and the vehicle lamp 1 equipped with the light source module 8, at least a portion of the intermediate portion 27 of the ground terminal 22G is exposed to the peripheral surface 24 of the terminal holding portion 21 and is in contact with the resin molded portion 12.

[0075] As a result, the intermediate portion 27 exposed on the peripheral surface 24 of the terminal holding portion 21 is electrically connected to the heat sink 13 via the resin molded portion 12 formed from conductive resin, so that the heat sink 13 located directly below the substrate 11 is electrically connected to ground, improving the impedance characteristics against noise of the circuit of the substrate 11. Therefore, the noise resistance performance can be improved with a simple configuration without increasing manufacturing costs.

[0076] Furthermore, by using a ceramic substrate as the substrate 11, the thermal expansion coefficient of the substrate 11 becomes smaller and the heat dissipation properties become higher, thereby ensuring high reliability in the mounting of the light source 31 and the electronic components 32 and improving noise resistance performance while ensuring a stable operating state of the light source 31 and the electronic components 32.

[0077] In addition, in the light source module 8, a glass epoxy substrate may be used as the substrate 11. In this case, since the glass epoxy substrate is inexpensive, it is possible to reduce the manufacturing cost of the substrate 11, thereby achieving further reductions in manufacturing costs and improving noise resistance performance.

[0078] Furthermore, the intermediate portion 27 of the ground terminal 22G is exposed on the first surface 24a of the peripheral surface 24.

[0079] Therefore, the intermediate portion 27 is exposed on the first surface 24a, which has an increased area, and this allows for greater freedom in designing the shape and size of the intermediate portion 27. In particular, by increasing the area of ​​the intermediate portion 27, it becomes possible to make it easier for the intermediate portion 27 to come into contact with the resin molded portion 12, thereby improving reliability in terms of noise resistance.

[0080] Furthermore, by exposing the anti-slip portion 30 of the intermediate portion 27 to the first surface 24a, the area of ​​the intermediate portion 27 exposed to the first surface 24a becomes larger, making it easier to come into contact with the resin molded portion 12, thereby preventing the ground terminal 22G from falling off from the terminal holding portion 21 and improving reliability in terms of noise resistance performance.

[0081] In the light source module 8, the intermediate portion 27 may be exposed on the second surface 24b of the terminal holder 21 (see FIG. 7). In this case, the dimension of the terminal holder 21 in the width direction (left-right direction) is reduced, and therefore the power feeder 10 can be made smaller in the width direction.

[0082] Second Embodiment Next, a light source module 8A according to a second embodiment will be described (see FIGS. 1 and 8 to 17).

[0083] The light source module 8A is detachably attached to the unit attachment portion 6 of the lamp housing 2 in place of the light source module 8 (see FIG. 1). The light source module 8A has, for example, the functions of a stop lamp or a tail lamp, or both. However, the scope of application of the present invention is not limited to light source modules having the functions of a stop lamp or a tail lamp and vehicle lamps equipped with such light source modules.

[0084] The light source module 8A has a socket housing 9, a power supply body 60, and a substrate 61 (see FIGS. 8 and 9).

[0085] The power supply body 60 has a terminal holding portion 71 formed from an insulating resin material and a plurality of, for example, two, connection terminals 72 held by the terminal holding portion 71. In the power supply body 60, both ends of the connection terminal 72 protrude forward and backward from the terminal holding portion 71, respectively.

[0086] The terminal holding portion 71 extends in the front-rear direction and is formed in a flat shape with a thin top-to-bottom thickness. The connection terminals 72 are formed of a metal material and are positioned spaced apart on the left and right. Both front and rear ends of the connection terminals 72 protrude from the terminal holding portion 71, with the portion protruding forward from the terminal holding portion 71 serving as a pattern connection portion 72a and the portion protruding rearward from the terminal holding portion 71 serving as a connector connection portion 72b.

[0087] One of the two connection terminals 72 is provided as a power terminal 72D for supplying power, and the other is provided as a ground terminal 72G for grounding (earthing).

[0088] The power supply body 60 has a terminal holding portion 71 and a connection terminal 72 integrally formed by, for example, insert molding. The portion of the power supply body 60 other than the pattern connection portion 72a and the connector connection portion 72b is inserted into an insertion arrangement hole 12a formed in the resin molded portion 12, with the pattern connection portion 72a positioned in the arrangement recess 19a and the connector connection portion 72b positioned inside the connector coupling portion 18.

[0089] The power supply body 60 is placed in a cavity of a mold with the terminal holding portion 71 and the connection terminal 72 integrally formed by, for example, insert molding, and the cavity is filled with molten resin to form the resin molded portion 12, and the power supply body 60 is integrally formed with the socket housing 9 by, for example, insert molding.

[0090] The substrate 61 is formed in a generally rectangular shape facing the front-rear direction (see FIGS. 8 to 11). For example, a ceramic substrate is used as the substrate 61. However, a glass epoxy substrate may also be used as the substrate 61.

[0091] Glass-epoxy substrates are made by impregnating epoxy resin with glass fibers, and have excellent insulation resistance and heat resistance, as well as a small coefficient of thermal expansion. On the other hand, ceramic substrates are made of alumina as their base material, and have excellent heat dissipation and insulation properties, as well as a small coefficient of thermal expansion.

[0092] The light source module 8A is configured to emit light with high brightness, and the amount of heat generated during light emission is likely to be large. Therefore, it is preferable to use a ceramic substrate with excellent heat dissipation properties in the light source module 8A. By using a ceramic substrate with excellent heat dissipation properties in the light source module 8A, it is possible to sufficiently suppress temperature increases due to heat generated by the light source and electronic components described below during light emission, and to ensure good operating conditions for the light source and electronic components.

[0093] One surface (front surface) of the substrate 61 in the thickness direction is formed as a first pattern forming surface 61a, and the other surface (rear surface) in the thickness direction is formed as a second pattern forming surface 61b (see Figures 10 and 11).

[0094] A circuit pattern (not shown) is formed on the first pattern forming surface 61a of the substrate 61, and for example, a plurality of light sources 73 and various electronic components 74 are mounted on the circuit pattern.

[0095] The light source 73 is mounted in the center of the substrate 61, and a light emitting diode (LED) is used as the light source 73. The number and functions of the light sources 73 mounted on the substrate 61 can be set arbitrarily depending on the type of vehicle lamp 1, the required brightness, etc.

[0096] The electronic components 74 include, for example, a semiconductor element 74X in addition to a capacitor or a resistor, and are mounted around the light source 73 on the substrate 61. The semiconductor element 74X is, for example, an integrated circuit (IC) or a field effect transistor (FET).

[0097] Terminal insertion holes 75 and through holes 76 are formed spaced apart on the left and right sides of the substrate 61. Two annular terminal lands 77 are formed on the first pattern forming surface 61a of the substrate 61. The terminal lands 77 are formed on the opening edges of the terminal insertion holes 75 and the through holes 76, respectively.

[0098] A frame 78 is formed on the first pattern forming surface 61a of the substrate 61 between the light source 73 and the electronic component 74. The frame 78 is formed, for example, in a substantially annular shape from a resin material and is disposed in a position surrounding the light source 73. The interior of the frame 78 is filled with a sealing resin (not shown), and the light source 73 is sealed by the sealing resin. A lens 79 is disposed in a bonded state on the sealing resin. The lens 79 is formed in a hemispherical shape that is convex forward.

[0099] The light source module 8A may not be provided with the lens 79. In this case, for example, the front end side of the sealing resin may be formed into a concave or convex shape, so that a part of the sealing resin functions as the lens 79.

[0100] A ground pattern 80 that functions as a ground section is formed on the second pattern forming surface 61b of the substrate 61 (see FIG. 11). The ground pattern 80 is formed on more than half the area of ​​the second pattern forming surface 61b, i.e., more than half the area of ​​the substrate 61, and is a portion known as a solid ground. The ground pattern 80 is connected to terminal lands 77 by through holes 76. A portion of the ground pattern 80 is formed directly behind the semiconductor element 74X.

[0101] The pattern connection portion 72a of the connection terminal 72 in the power feeder 60 is inserted from the rear into the terminal insertion hole 75 and the through hole 76, respectively, and the pattern connection portion 72a is joined to the terminal land 77 with solder 50 (see FIG. 12 ). By joining the pattern connection portion 72a of the connection terminal 72 to the terminal land 77, the ground terminal 72G is electrically connected to the ground pattern 80 via the terminal land 77 and the through hole 76.

[0102] At this time, as described above, the connector connection portion 72b of the connection terminal 72 is positioned inside the connector connecting portion 18, and when a connector (not shown) for supplying power is connected to the connector connecting portion 18, the connector is connected to the connector connecting portion 72b, making it possible to supply power to the light source 73, etc.

[0103] The rear surface of the substrate 61 is bonded to the surface of the first heat dissipation portion 13a of the heat dissipation plate 13 with a thermally conductive adhesive (not shown) (see FIG. 9).

[0104] In the light source module 8A configured as described above, an annular gasket 37 is attached to the protrusion 15 of the socket housing 9 in an externally fitted manner. The gasket 37 is made of a resin material or a rubber material. With the gasket 37 attached, the protrusion 15 of the light source module 8A is inserted into the unit mounting portion 6 of the lamp housing 2 from the rear side and rotated circumferentially so that the engaging protrusions 20 engage with the engaging portions 7 from the front side (see FIG. 1 ). At this time, the engaging portions 7 are sandwiched between the engaging protrusions 20 and the gasket 37, and the light source module 8A is attached to the lamp housing 2. With the light source module 8A attached to the lamp housing 2, the unit mounting portion 6 is closed by the gasket 37, preventing foreign matter such as moisture from entering the lamp chamber 5 from the outside via the unit mounting portion 6.

[0105] Conversely, when the light source module 8A is rotated in the opposite circumferential direction to the above, the engagement of the engaging protrusion 20 with the engaging portion 7 is released, and the light source module 8A can be removed from the lamp housing 2 by pulling out the protrusion 15 from the unit mounting portion 6.

[0106] With the light source module 8A attached to the lamp housing 2, when a current is supplied from the power supply circuit via the connection terminal 72 to the circuit pattern formed on the substrate 61, light is emitted from the light source 73.

[0107] Light emitted from the light source 73 is transmitted through the sealing resin and the lens 79, and is then irradiated to the outside through the cover 3. At this time, the direction of light irradiation is controlled by the lens 79, and the light is irradiated to the outside in a predetermined direction.

[0108] When light is emitted from the light source 73, heat is generated in the light source 73 and electronic components 74 mounted on the substrate 61, and the generated heat is transferred to the first heat dissipation portion 13a via the substrate 61, and then to the heat dissipation plate 13 and the resin molded portion 12. The heat transferred to the heat dissipation plate 13 and the resin molded portion 12 is mainly dissipated to the outside from the first heat dissipation fins 16 and the second heat dissipation fins 17. Therefore, good operating conditions of the light source 73 and the electronic components 74 are ensured.

[0109] If noise is applied when the light source 73 or electronic component 74 is driven, the noise may affect the driving of the light source 73 or electronic component 74. However, in the light source module 8A, a ground pattern 80 is formed over more than half the area of ​​the second pattern forming surface 61b of the substrate 61, and the ground terminal 72G is electrically connected to the ground pattern 80. Therefore, the ground terminal 72G has the same potential as the ground pattern 80, and the influence of noise is suppressed by the ground pattern 80.

[0110] The substrate 61 is attached with the ground pattern 80 disposed on the first heat dissipation portion 13a of the heat sink 13, but an insulating coating such as resist is applied to the ground pattern 80 to prevent electrical conduction between the ground pattern 80 and the heat sink 13. The substrate 61 may also be adhered to the heat sink 13 with an adhesive that is non-conductive and thermally conductive. In this case, although electrical conduction between the ground pattern 80 and the heat sink 13 is not established, heat is transferred from the substrate 61 to the heat sink 13, making it possible to sufficiently suppress temperature rise due to heat generated by the light source 73 and electronic components 74 when light is emitted.

[0111] Alternatively, the ground pattern 80 may not be coated with an insulating film such as a resist, and the substrate 61 may be bonded to the heat sink 13 with a conductive adhesive. In this case, the ground pattern 80 is electrically connected to the heat sink 13, which can improve noise resistance.

[0112] As described above, in the configuration in which the ground pattern 80 is formed as the ground portion, the ground terminal 72G is electrically connected to the ground pattern 80, and the area of ​​the ground pattern 80 is more than half the area of ​​the substrate 61.

[0113] Therefore, the ground pattern 80, which is located on the opposite side of the first pattern forming surface 61a and has an area of ​​more than half the area of ​​the substrate 61, is electrically connected to the ground terminal 72G, and therefore the simple configuration enables improved noise resistance performance without increasing manufacturing costs.

[0114] Furthermore, a through hole 76 through which the ground terminal 72 G is inserted is formed in the substrate 61 , and the ground pattern 80 is connected to the ground pattern 80 via the through hole 76 .

[0115] Therefore, since the ground pattern 80 is connected to the ground terminal 72G via the through hole 76 through which the ground terminal 72G is inserted, the ground pattern 80 can be easily connected to the ground terminal 72G.

[0116] Furthermore, a semiconductor element 74X is mounted on the first pattern forming surface 61a, and a part of a ground pattern 80 is formed on the second pattern forming surface 61b at a position directly behind the semiconductor element 74X.

[0117] Therefore, since the ground pattern 80 is located directly behind the semiconductor element 74X, which is likely to be a source of noise and is susceptible to the effects of noise, noise resistance can be effectively improved.

[0118] In the light source module 8A, the ground terminal 72G may be connected to the ground pattern 80 without using the through-hole 76 (see FIG. 13 ). In this case, for example, a semicircular arc-shaped notch is formed on the outer periphery of the substrate 61, and a conductive portion 81 is formed by plating copper or the like on the peripheral surface forming the notch, and the ground pattern 80 is connected to the terminal land 77 by the conductive portion 81.

[0119] Therefore, even with this configuration, the ground pattern 80 formed on more than half the area of ​​the second pattern forming surface 61b is electrically connected to the ground terminal 72G, and therefore, the simple configuration can improve noise resistance performance without increasing manufacturing costs.

[0120] The above describes an example in which a ground pattern 80 is formed as the ground portion, but in the vehicle lamp 1, a metal plate may be provided as the ground portion instead of the ground pattern 80 as follows (see Figures 14 to 17).

[0121] The configuration in which a metal plate is provided as the ground portion differs from the example in which ground pattern 80 is formed as the ground portion only in that substrate 61A is used instead of substrate 61 and that a metal plate is provided in contact with substrate 61A. Therefore, for the configuration in which a metal plate is provided as the ground portion, only the parts that differ from the example in which ground pattern 80 is formed as the ground portion will be described in detail, and the other parts will be denoted by the same reference numerals as those used in the example in which ground pattern 80 is formed as the ground portion, and description thereof will be omitted.

[0122] The board 61A differs from the board 61 in that only one surface in the thickness direction is formed as a pattern forming surface. The ground pattern 80 is not formed on the board 61A, and one surface in the thickness direction of the board 61A (the front surface) is formed as a pattern forming surface 61c (see FIGS. 14 and 15). The other surface in the thickness direction of the board 61A (the rear surface) is formed as a flat non-forming surface 61d on which no circuit pattern is formed.

[0123] A metal plate 82, which functions as a ground portion, is disposed in the recessed arrangement portion 19a of the board mounting portion 19 of the socket housing 9. The area of ​​the metal plate 82 is set to be at least half the area of ​​the board 61A, and for example, the size is set to be approximately the same as the size of the board 61A. The metal plate 82 is formed of a material that is conductive and has high heat dissipation properties, such as copper or aluminum. It is desirable that a portion of the metal plate 82 be positioned directly behind the semiconductor element 74X.

[0124] The metal plate 82 is formed with a first insertion hole 83 and a second insertion hole 84. When the metal plate 82 is placed in the placement recess 19a, one surface 82a in the thickness direction of the metal plate 82 is in surface contact with the non-forming surface 61d of the substrate 61A, and the other surface 82b in the thickness direction is in surface contact with the surface of the first heat dissipation portion 13a of the heat dissipation plate 13, with the exception of a portion.

[0125] Furthermore, one surface 82a of the metal plate 82 may be adhered to the non-forming surface 61d with a thermally conductive adhesive, and the other surface 82b may be adhered to the first heat dissipation portion 13a with a thermally conductive but non-electrically conductive adhesive.

[0126] The pattern connection portion 72a of the power terminal 72D of the power supply body 60 is inserted from the rear into the first insertion hole 83 of the metal plate 82 and the terminal insertion hole 75 of the substrate 61A, and the pattern connection portion 72a is joined to the terminal land 77 by solder 50.

[0127] The pattern connection portion 72a of the ground terminal 72G of the power feeder 60 is inserted from the rear into the second insertion hole 84 of the metal plate 82 and the through hole 76 of the substrate 61A, and the pattern connection portion 72a is joined to the terminal land 77 with solder 50. By joining the pattern connection portion 72a of the ground terminal 72G to the terminal land 77, the ground terminal 72G is electrically connected to the metal plate 82 via the terminal land 77 and the through hole 76.

[0128] Note that the size and shape of the second insertion hole 84 may be the same as the size and shape of the ground terminal 72G in the metal plate 82. With this configuration, when the ground terminal 72G is inserted through the second insertion hole 84, the outer peripheral surface of the ground terminal 72G contacts the peripheral surface that defines the second insertion hole 84, so that the electrical connection of the ground terminal 72G to the metal plate 82 can be reliably established when the ground terminal 72G is inserted through the second insertion hole 84.

[0129] Furthermore, the first insertion hole 83 and the second insertion hole 84 may be substantially the same size, or the first insertion hole 83 may be larger than the second insertion hole 84. By making the first insertion hole 83 larger than the second insertion hole 84, it becomes difficult for the power supply terminal 72D to come into contact with the metal plate 82 when the power supply terminal 72D is inserted into the first insertion hole 83. Furthermore, instead of the metal plate 82, a metal plate formed with the second insertion hole 84 and a notch through which the power supply terminal 72D is inserted may be used. By configuring the power supply terminal 72D to be inserted into the notch, it becomes even more difficult for the power supply terminal 72D to come into contact with the metal plate 82.

[0130] When light is emitted from the light source 73, heat is generated in the light source 73 and electronic components 74 mounted on the substrate 61A, and the generated heat is transferred to the first heat dissipation portion 13a via the substrate 61A and the metal plate 82, and then to the heat dissipation plate 13 and the molded resin portion 12. The heat transferred to the heat dissipation plate 13 and the molded resin portion 12 is mainly released to the outside from the first heat dissipation fins 16 and the second heat dissipation fins 17. Therefore, good operating conditions of the light source 73 and the electronic components 74 are ensured.

[0131] If noise is applied when the light source 73 or electronic component 74 is driven, the noise may affect the driving of the light source 73 or electronic component 74. However, a metal plate 82 having an area of ​​at least half of the board 61A is provided, and a ground terminal 72G is electrically connected to the metal plate 82. Therefore, the ground terminal 72G has the same potential as the metal plate 82, and the metal plate 82 suppresses the effects of noise.

[0132] The metal plate 82 may be bonded to the heat sink 13 with a conductive adhesive. In this case, the metal plate 82 is electrically connected to the heat sink 13, which can further improve noise resistance.

[0133] The above shows an example of a ground terminal 72G formed in a straight line, but the ground terminal 72G may also be provided with a connection protrusion 72p that protrudes in a direction perpendicular to the linearly extending portion (see Figures 16 and 17).

[0134] By providing the connection protrusion 72p on the ground terminal 72G, when the ground terminal 72G is inserted into the second insertion hole 84, the connection protrusion 72p can be brought into surface contact with the other surface 82b of the metal plate 82, thereby ensuring reliable electrical connection of the ground terminal 72G to the metal plate 82 when the ground terminal 72G is inserted into the second insertion hole 84.

[0135] As described above, in the configuration in which the metal plate 82 is provided as the ground portion, the area of ​​the metal plate 82 is set to be half or more of the area of ​​the substrate 61A, and the ground terminal 72G is electrically connected to the metal plate 82.

[0136] Therefore, since the metal plate 82, which is formed over an area of ​​more than half the area of ​​the substrate 61A, is electrically connected to the ground terminal 72G, the simple configuration can improve noise resistance without increasing manufacturing costs.

[0137] In particular, the use of a single metal plate 82 improves noise resistance, making it possible to reduce manufacturing costs while improving noise resistance.

[0138] Furthermore, since heat is transferred from the substrate 61A to the metal plate 82, the transferred heat can be transferred evenly to the metal plate 82, thereby further improving the heat dissipation performance.

[0139] Furthermore, in the light source module 8A, it is possible to use existing structures and existing assembly equipment as structures other than the metal plate 82, thereby improving noise resistance and heat dissipation performance without increasing manufacturing costs.

[0140] As described above, in the light source module 8A and the vehicle lamp 1 equipped with the light source module 8A, a ground portion (ground pattern 80 or metal plate 82) is provided that is positioned on the other surface side in the thickness direction of the substrate 61, 61A and is electrically connected to the ground terminal 72G, and the area of ​​the ground portion is set to be more than half the area of ​​the substrate 61, 61A.

[0141] Therefore, since the ground portion formed over more than half the area of ​​the substrates 61 and 61A is electrically connected to the ground terminal 72G, the noise resistance performance can be improved without increasing manufacturing costs due to the simple configuration.

[0142] Furthermore, by using ceramic substrates as the substrates 61 and 61A, the thermal expansion coefficient of the substrates 61 and 61A is reduced and the heat dissipation properties are improved, thereby ensuring high reliability in the mounting of the light source 73 and electronic components 74, and improving noise resistance performance while ensuring a stable operating state of the light source 73.

[0143] In addition, in the light source module 8A, glass epoxy substrates may be used as the substrates 61 and 61A. In this case, since glass epoxy substrates are inexpensive, it is possible to reduce the manufacturing costs of the substrates 61 and 61A, thereby achieving further reductions in manufacturing costs and improving noise resistance performance.

[0144] REFERENCE SIGNS LIST 1 Vehicle lamp 8 Light source module 9 Socket housing 10 Power supply body 11 Substrate 12 Resin molded portion 13 Heat sink 21 Terminal holding portion 22 Connection terminal 22D Power supply terminal 22G Ground terminal 23 Projected surface 24 Peripheral surface 24a First surface 24b Second surface 25 Pattern connection portion 26 Connector connection portion 27 Intermediate portion 28 First straight portion 29 Second straight portion 31 Light source 8A Light source module 61 Power supply body 61 Substrate 61a First pattern formation surface 61b Second pattern formation surface 71 Terminal holding portion 72 Connection terminal 72D Power supply terminal 72G Ground terminal 72a Pattern connection portion 72b Connector connection portion 73 Light source 74 Electronic component 74X Semiconductor element 76 Through hole 80 Ground pattern 61A: Substrate 61c: Pattern-formed surface 61d: Non-formed surface 82: Metal plate 82a: One surface 82b: Other surface 83: First through-hole 84: Second through-hole 72p: Connection protrusion

Claims

1. A light source module comprising: a socket housing having a resin molded portion formed from a conductive resin and a heat sink at least a portion of which is embedded in the resin molded portion; a substrate on which a light source is mounted and attached to the socket housing; and a power supply having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion, including a ground terminal, wherein the outer surface of the terminal holding portion has two protruding surfaces from which both ends of the connection terminals protrude, and a peripheral surface located between the two protruding surfaces, wherein the portion of the connection terminal protruding from one of the protruding surfaces is provided as a pattern connection portion, and the portion protruding from the other protruding surface is provided as a connector connection portion, and the portion between the pattern connection portion and the connector connection portion is provided as an intermediate portion, and at least a portion of the intermediate portion is exposed to the peripheral surface and is in a state of contact with the resin molded portion.

2. The light source module according to claim 1, wherein the substrate is a ceramic substrate.

3. A light source module according to claim 1 or claim 2, wherein the peripheral surface is composed of two first surfaces positioned in the direction in which the connection terminals are arranged and two second surfaces positioned between the two first surfaces and having an area smaller than that of the first surfaces, and the intermediate portion is exposed to the first surfaces.

4. A light source module as set forth in claim 3, wherein the intermediate portion is composed of a first straight portion continuing to the pattern connection portion, a second straight portion continuing to the connector connection portion, and a retaining portion that is wider than the first straight portion and the second straight portion, and at least the retaining portion of the intermediate portion is exposed on the first surface.

5. A vehicle lamp including a light source module, the light source module comprising: a socket housing having a resin molded portion formed from a conductive resin and a heat sink at least a portion of which is embedded in the resin molded portion; a substrate on which a light source is mounted and attached to the socket housing; and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion, including a ground terminal, wherein the outer surface of the terminal holding portion has two protruding surfaces from which both end portions of the connection terminals protrude, and a circumferential surface located between the two protruding surfaces, the portion of the connection terminal protruding from one of the protruding surfaces being provided as a pattern connection portion, and the portion protruding from the other protruding surface being provided as a connector connection portion, and the portion between the pattern connection portion and the connector connection portion being provided as an intermediate portion, at least a portion of the intermediate portion being exposed to the circumferential surface and in contact with the resin molded portion.

6. A light source module comprising: a socket housing having a board mounting portion; an insulating board mounted on the board mounting portion; and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion and including a ground terminal, the connection terminals being connected to the board, wherein at least one surface in the thickness direction of the board is formed as a pattern forming surface, a light source and electronic components are mounted on a circuit pattern formed on the pattern forming surface on one surface in the thickness direction of the board, and a ground portion located on the other surface in the thickness direction of the board and electrically connected to the ground terminal is provided, and the area of ​​the ground portion is at least half the area of ​​the board.

7. A light source module as described in claim 6, wherein one surface of the substrate in the thickness direction is formed as a first pattern forming surface and the other surface in the thickness direction is formed as a second pattern forming surface, the light source and the electronic components are mounted on the circuit pattern formed on the first pattern forming surface, and a ground pattern is formed on the second pattern forming surface as the ground section.

8. The light source module according to claim 6, wherein only one surface of the substrate in the thickness direction is formed as the pattern forming surface, and a metal plate that is a separate member from the substrate is provided as the ground portion.

9. A light source module according to claim 6, claim 7 or claim 8, wherein a ceramic substrate is used as the substrate.

10. The light source module according to claim 7, wherein a through hole is formed in the substrate, through which the ground terminal is inserted, and the ground pattern is connected to the ground terminal via the through hole.

11. A light source module as described in claim 7, wherein a semiconductor element is mounted as the electronic component on the first pattern forming surface, and a part of the ground pattern is formed on the second pattern forming surface at a position directly behind the semiconductor element.

12. A vehicle lamp having a light source module, the light source module comprising: a socket housing having a board mounting portion; an insulating board mounted on the board mounting portion; and a power supply body having a terminal holding portion formed from an insulating resin material and a plurality of connection terminals held by the terminal holding portion and including a ground terminal, the connection terminals being connected to the board, at least one surface in the thickness direction of the board formed as a pattern forming surface, a light source and electronic components are mounted on a circuit pattern formed on the pattern forming surface on one surface in the thickness direction of the board, and a ground portion located on the other surface in the thickness direction of the board and electrically connected to the ground terminal, the area of ​​the ground portion being at least half the area of ​​the board.

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