Light emitting device and display device

Abstract

The present invention improves the mechanical strength of a light emitting device. This light emitting device has a pixel array part, a recess part, and a second protective film. The pixel array part is composed of a plurality of pixels that each comprise a light emitting element which is formed on the surface of a substrate, a first protective film which is formed into a shape that covers the light emitting element, and a color filter which is superposed on the first protective film. The recess part is configured to have a shape that extends along an end part of the substrate formed in the first protective film in a peripheral region which is positioned between an end part of the pixel array part and the end part of the substrate, and in which the first protective film is spread and disposed. The second protective film is configured to be in contact with the first protective film at least at the bottom part of the recess part and to have a shape that covers the color filter. The recess part is configured to have the depth that is smaller than the thickness of the second protective film in the peripheral region and the width that is larger than the thickness of the first protective film in the peripheral region.

Description

Light-emitting device and display device

[0001] The present disclosure relates to a light-emitting device and a display device.

[0002] In recent years, devices including optical elements made of organic materials have been used. For example, a light-emitting device has been proposed in which optical elements (organic devices) such as organic light-emitting layers or organic photoelectric conversion layers and color filters are protected by multiple protective films. Another proposed organic device includes a first sealing layer shaped to cover a pixel region in which multiple pixels having an organic compound layer are arranged, and a second sealing layer shaped to cover a region of a color filter stacked on the first sealing layer (see, for example, Patent Document 1). In this organic device, the first sealing layer and the second sealing layer are in contact with each other in a peripheral region located outside the pixel region. These first and second sealing layers correspond to the protective films described above.

[0003] JP 2018-073760 A

[0004] However, the above-described conventional techniques have a problem in that the adhesion strength between the first and second sealing layers in the peripheral region is reduced. In particular, in the above-described organic device, when organic residues adhere to the surface of the first sealing layer in a process after the formation of the first sealing layer, such as a color filter formation process, the adhesion strength between the first and second sealing layers is significantly reduced. This results in a problem in that the mechanical strength of the organic device is reduced.

[0005] Therefore, the present disclosure proposes a light-emitting device with improved mechanical strength and a display device using the light-emitting device.

[0006] The light-emitting device according to the present disclosure comprises a pixel array section constituted by a plurality of pixels each including a light-emitting element formed on the surface of a substrate, a first protective film configured to cover the light-emitting element, and a color filter stacked on the first protective film; a recess formed in the first protective film in a peripheral region between the edge of the pixel array section and the edge of the substrate, where the first protective film is extended and disposed, the recess having a shape that follows the edge of the substrate; and a second protective film that contacts the first protective film at least at the bottom of the recess and is configured to cover the color filter, the recess having a depth smaller than the thickness of the second protective film in the peripheral region and a width larger than the thickness of the first protective film in the peripheral region.

[0007] FIG. 1 is a diagram illustrating a configuration example of a light-emitting device according to a first embodiment of the present disclosure. FIG. 2 is a cross-sectional view illustrating a configuration example of a light-emitting device according to the first embodiment of the present disclosure. FIG. 3 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the first embodiment of the present disclosure. FIG. 4 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the first embodiment of the present disclosure. FIG. 5 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the first embodiment of the present disclosure. FIG. 6 is a cross-sectional view illustrating another configuration example of a light-emitting device according to the first embodiment of the present disclosure. FIG. 7 is a diagram illustrating an example of a configuration example of a light-emitting device according to the second embodiment of the present disclosure. FIG. 8 is a diagram illustrating another configuration example of a light-emitting device according to the second embodiment of the present disclosure. FIG. 9 is a diagram illustrating an example of a configuration example of a light-emitting device according to the third embodiment of the present disclosure. FIG. 10 is a diagram illustrating an example of a configuration example of a light-emitting device according to a fourth embodiment of the present disclosure. FIG. 11 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the fourth embodiment of the present disclosure. FIG. 12 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the fourth embodiment of the present disclosure. FIG. 13 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the fourth embodiment of the present disclosure. FIG. 14 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the fourth embodiment of the present disclosure. FIG. 15 is a diagram illustrating an example of a manufacturing method of a light-emitting device according to the fourth embodiment of the present disclosure. FIG. 1 is a cross-sectional view showing a configuration example of a light-emitting device according to a fifth embodiment of the present disclosure. FIG. 2 is a view showing another configuration example of a light-emitting device according to the fifth embodiment of the present disclosure. FIG. 3 is a cross-sectional view showing another configuration example of a light-emitting device according to the fifth embodiment of the present disclosure. FIG. 4 is a view showing a configuration example of a light-emitting device according to a sixth embodiment of the present disclosure. FIG. 5 is a view showing a configuration example of a light-emitting device according to the sixth embodiment of the present disclosure. FIG. 6 is a view showing a configuration example of a light-emitting device according to the sixth embodiment of the present disclosure. FIG. 7 is a view showing a configuration example of a protruding region according to the sixth embodiment of the present disclosure. FIG. 8 is a view showing another configuration example of a protruding region according to the sixth embodiment of the present disclosure. FIG. 9 is a cross-sectional view showing a configuration example of a light-emitting device according to a seventh embodiment of the present disclosure. FIG. 10 is a cross-sectional view showing a configuration example of a light-emitting device according to the seventh embodiment of the present disclosure. FIG. 11 is a view showing another configuration example of a light-emitting device according to the seventh embodiment of the present disclosure.13 is a diagram showing another configuration example of a light emitting device according to a seventh embodiment of the present disclosure. FIG. 14 is a diagram showing another configuration example of a light emitting device according to a seventh embodiment of the present disclosure. FIG. 15 is a diagram showing an example of a display device to which the technology according to the present disclosure can be applied.

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order. Note that in the following embodiments, the same components will be assigned the same reference numerals to avoid redundant description. 1. First embodiment 2. Second embodiment 3. Third embodiment 4. Fourth embodiment 5. Fifth embodiment 6. Sixth embodiment 7. Seventh embodiment 8. Example of application to a display device

[0009] (1. First Embodiment) [Configuration of Light-Emitting Device] Fig. 1 is a diagram showing a configuration example of a light-emitting device according to a first embodiment of the present disclosure. The figure is a plan view showing a configuration example of a light-emitting device 1. The light-emitting device 1 displays an image based on an input image signal, for example.

[0010] The light emitting device 1 of Fig. 1 includes a substrate 100 on which a pixel array section 10 is arranged. As shown in Fig. 1, the pixel array section 10 is configured by arranging a plurality of pixels 20 in a two-dimensional matrix. Light emitting elements 110, which will be described later, are arranged in the pixels 20. Furthermore, transistors and the like that drive the light emitting elements 110 are further arranged in the pixels 20. Note that, in the pixel array section 10, signal lines that transmit control signals for the pixels 20 are wired in an XY matrix. Furthermore, a light shielding section 30 is arranged around the plurality of pixels 20.

[0011] Furthermore, a peripheral region 40 corresponding to the margin of the substrate 100 is disposed outside the pixel array unit 10. This peripheral region 40 is a region between the edge of the pixel array unit 10 and the edge of the substrate 100. Furthermore, a recess 170 is formed in a first protective film 120 (described later) in the peripheral region 40. The rectangular region enclosed by a dashed line in FIG. 1 indicates the position of the recess 170.

[0012] 1, a plurality of pads 109 are arranged on the underside of the substrate 100. The pads 109 are electrodes for transmitting control signals and the like. The pads 109 are connected to an external device via, for example, an anisotropic conductive film (ACF).

[0013] [Cross-sectional configuration of light-emitting device] Fig. 2 is a cross-sectional view showing an example configuration of a light-emitting device according to the first embodiment of the present disclosure. The figure is a schematic cross-sectional view showing an example configuration of a light-emitting device 1. The light-emitting device 1 includes a substrate 100, a light-emitting element 110, a first protective film 120, a lower planarization film 130, a color filter 140, an upper planarization film 150, and a second protective film 160. The portion from the light-emitting element 110 to the color filter 140 constitutes a pixel 20.

[0014] The substrate 100 is a semiconductor substrate on which the light-emitting elements 110 are disposed. The light-emitting elements 110 in FIG. 2 are composed of an upper electrode 114, an organic light-emitting layer 112, and a lower electrode 111. The upper electrode 114 is disposed in common to the light-emitting elements 110 of a plurality of pixels 20. This upper electrode 114 can be composed of a transparent electrode such as ITO (Indium Tin Oxide). The lower electrode 111 is disposed for each pixel 20. This lower electrode 111 can be composed of a metal such as aluminum (Al). The organic light-emitting layer 112 can be composed of a known organic light-emitting material.

[0015] By passing a current between the upper electrode 114 and the lower electrode 111, the organic light-emitting layer 112 between the upper electrode 114 and the lower electrode 111 emits light. A drive transistor (not shown) formed on the substrate 100 is connected to the lower electrode 111. In this manner, the pixel array section 10 constitutes an active matrix display panel. The upper electrode 114 is connected to an electrode 119 formed on the upper surface of the substrate 100 near an end of the pixel array section 10.

[0016] An insulating film 113 is disposed between the pixels 20. An insulating film 115 is disposed on the upper electrode 114.

[0017] The first protective film 120 is laminated on the substrate 100 to protect the light emitting element 110. The first protective film 120 is configured in a shape that covers the area where the light emitting element 110 and the upper electrode 114 are disposed. The first protective film 120 can be made of, for example, an inorganic material. Specifically, the first protective film 120 can be made of silicon nitride (SiN), silicon oxide (SiO ２ ) and aluminum oxide (Al ２ O ３ The first protective film 120 can be formed by CVD (Chemical Vapor Deposition).

[0018] The lower planarization film 130 is used to planarize the surface of the first protective film 120. The lower planarization film 130 is made of a transparent material. For example, the organic resin material that constitutes the color filter 140 can be used as the transparent material.

[0019] The color filters 140 are stacked on the lower planarization film 130 and transmit light of a predetermined wavelength. Color filters 140 that transmit red light, green light, and blue light can be disposed in the pixel 20 of FIG. 2. That is, color filters 140 corresponding to red light, green light, and blue light are disposed in the pixel 20 of FIG. 2, respectively. Letters attached to the color filters 140 in FIG. 2 indicate the type of color filter 140. "R," "G," and "B" indicate color filters 140 that transmit red light, green light, and blue light, respectively. The color filters 140 can be made of organic materials.

[0020] A light-shielding portion 30 is disposed on the periphery of the plurality of pixels 20. For example, a structure in which a plurality of color filters 140 corresponding to light of different wavelengths are stacked can be applied to this light-shielding portion 30. The light-shielding portion 30 in Fig. 2 shows an example in which a color filter corresponding to red light and a color filter corresponding to blue light are stacked in order.

[0021] The upper planarization film 150 is used to planarize the surface of the color filter 140. The upper planarization film 150 is made of a transparent material. For example, the organic resin material that constitutes the color filter 140 can be used as the transparent material. The upper planarization film 150 is configured in a shape that covers the pixel array section 10. The upper planarization film 150 in FIG. 2 shows an example in which the upper planarization film 150 is configured in a shape that also covers the light-shielding section 30.

[0022] The second protective film 160 is a protective film configured to cover the peripheral region 40 and the upper planarizing film 150. The second protective film 160 can be made of, for example, an inorganic material. Specifically, the second protective film 160 can be made of silicon nitride (SiN), silicon oxide (SiO ２ ) and aluminum oxide (Al ２ O ３ ) The second protective film 160 can be formed by CVD.

[0023] As described above, the peripheral region 40 is the region between the edge of the pixel array unit 10 and the edge of the substrate 100. In FIG. 2 , the region outside the upper planarization film 150 is the peripheral region 40. The first protective film 120 and the second protective film 160 of the pixel array unit 10 are extended and disposed in the peripheral region 40. The light-emitting device 1 in FIG. 2 is configured so that the first protective film 120 and the second protective film 160 are in contact with each other in this peripheral region 40.

[0024] As described above, a recess 170 is formed in the first protective film 120 in the peripheral region 40. The recess 170 in FIG. 2 shows an example formed by a notch formed at the end of the first protective film 120. This recess 170 is formed to a depth such that a region of the first protective film 120 remains at the bottom. Therefore, the first protective film 120 and the second protective film 160 are in contact at the bottom of the recess 170. As shown in FIG. 2 , when the depth of the recess 170 is d and the thickness of the first protective film 120 is t1, the following relationship holds: d<t1 (Equation 1).

[0025] As will be described later, in the manufacturing process of the light-emitting device 1, the color filter 140 is formed after the first protective film 120 is formed. Therefore, residues of organic materials such as the color filter 140 adhere to the surface of the first protective film 120. If the second protective film 160 is formed in this state, the adhesion between the first protective film 120 and the second protective film 160 will be reduced due to the influence of the residues of the organic material. Therefore, by forming a recess 170 in the first protective film 120 after the formation of the color filter 140, the residues of the organic material in this region can be removed. Since the first protective film 120 and the second protective film 160 are configured to be in contact with each other at the bottom of this recess 170, the adhesion between the first protective film 120 and the second protective film 160 can be improved.

[0026] Furthermore, the recess 170 is configured to have a depth smaller than the thickness of the second protective film 160 in the peripheral region 40 and a width larger than the thickness of the first protective film 120 in the peripheral region 40. If the width of the recess 170 is L and the thickness of the second protective film 160 is t2, then the following relationships are obtained: d<t2 ...Equation 2 L>t1 ...Equation 3

[0027] By making the depth of the recess 170 smaller than the thickness of the second protective film 160, it is possible to improve the adhesion to the step portion of the recess 170 and prevent breakage of the second protective film 160. Furthermore, by making the width of the recess 170 larger than the thickness of the first protective film 120, it is possible to improve the adhesion between the first protective film 120 and the second protective film 160. This is because the bonding surface becomes wider.

[0028] Specifically, if the thickness of the first protective film 120 and the second protective film 160 is 5 μm each, the depth and width of the recess 170 can be set to 1 μm and 6 μm, respectively.

[0029] [Method of Manufacturing Light-Emitting Device] Figures 3A to 3E are diagrams showing an example of a method of manufacturing a light-emitting device according to the first embodiment of the present disclosure. These Figures 3A to 3E are diagrams showing an example of a manufacturing process of a light-emitting device 1. First, a pixel array section 10 is formed on a substrate 100 (Figure 3A). Next, a first protective film 120 is formed on the surface of the substrate 100 (Figure 3B). This can be performed by, for example, CVD. Next, a lower planarization film 130, a color filter 140, and an upper planarization film 150 are formed in this order (Figure 3C).

[0030] Next, a recess 170 is formed in the first protective film 120 (FIG. 3D). This can be done, for example, by placing a resist having an opening in the area where the recess 170 is to be formed, and etching (etching back) the first protective film 120. Note that this resist can also be a film in which the upper planarizing film 150 is extended to the peripheral region 40. Next, a second protective film 160 is formed (FIG. 3E). This can be done, for example, by CVD. The light emitting device 1 can be manufactured by the above steps.

[0031] [Another Configuration of Light-Emitting Device] Fig. 4 is a cross-sectional view showing another configuration example of the light-emitting device according to the first embodiment of the present disclosure. The same figure is a cross-sectional view showing another configuration example of the light-emitting device 1. The light-emitting device 1 in the same figure has a recess 171 instead of the recess 170. This recess 171 is formed by a notch having a tapered bottom. The above-mentioned formulas 1 to 3 also hold for the recess 171.

[0032] It should be noted that the configuration of the light emitting device 1 of the present disclosure is not limited to this example. For example, the recess 170 or the like may be formed in a part of the peripheral region 40 of the substrate 100. For example, the recess 170 may be formed in a shape that follows the longitudinal side of the substrate 100 in FIG. 1 .

[0033] As described above, in the light emitting device 1 according to the first embodiment of the present disclosure, the recess 170 is formed in the first protective film 120 in the peripheral region 40. This can improve the adhesion between the first protective film 120 and the second protective film 160, and can improve the mechanical strength of the light emitting device 1.

[0034] (2. Second Embodiment) The light emitting device 1 of the first embodiment described above includes the notch-shaped recess 170. In contrast, the light emitting device 1 of the second embodiment of the present disclosure differs from the first embodiment described above in that it includes a groove-shaped recess.

[0035] [Configuration of Light-Emitting Device] Fig. 5 is a diagram showing a configuration example of a light-emitting device according to a second embodiment of the present disclosure. Similar to Fig. 2, this figure shows a configuration example of the light-emitting device 1. The light-emitting device 1 in Fig. 5 differs from the light-emitting device 1 in Fig. 2 in that it includes a recess 172 instead of the recess 170.

[0036] As described above, the recess 172 is configured in a groove shape. The above-described formulas 1 to 3 also hold true for this recess 172.

[0037] [Configuration of Light-Emitting Device] Fig. 6 is a diagram showing another configuration example of a light-emitting device according to a second embodiment of the present disclosure. Similar to Fig. 5, this figure is a cross-sectional view showing a configuration example of the light-emitting device 1. The light-emitting device 1 in this figure shows an example in which multiple recesses (recesses 172 and 173) are provided. By providing multiple recesses, the adhesion between the first protective film 120 and the second protective film 160 can be further improved.

[0038] 7 is a diagram showing another configuration example of a light emitting device according to the second embodiment of the present disclosure. Similar to FIG. 5, this figure is a cross-sectional view showing the configuration example of the light emitting device 1. The light emitting device 1 in this figure shows an example in which a recess 170 and a recess 172 are provided.

[0039] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0040] In this way, the light emitting device 1 according to the second embodiment of the present disclosure can improve the adhesion between the first protective film 120 and the second protective film 160 due to the groove-shaped recesses (recesses 171, etc.).

[0041] (3. Third Embodiment) In the light-emitting device 1 of the first embodiment described above, the first protective film 120 and the second protective film 160 are in contact with each other in the region other than the recess 170 in the peripheral region 40. In contrast, the light-emitting device 1 of the third embodiment of the present disclosure differs from the first embodiment described above in that a film of an organic material is disposed between the first protective film 120 and the second protective film 160 in the region other than the recess 170 in the peripheral region 40.

[0042] [Configuration of Light-Emitting Device] Fig. 8 is a diagram showing a configuration example of a light-emitting device according to a third embodiment of the present disclosure. Similar to Fig. 2, Fig. 8 is a cross-sectional view showing a configuration example of a light-emitting device 1. The light-emitting device 1 in Fig. 8 differs from the light-emitting device 1 in Fig. 2 in that it further includes a groove-shaped recess 172 and a film 181 made of an organic material. Furthermore, the light-emitting device 1 in Fig. 8 has a lens 180 arranged for each pixel 20.

[0043] The lens 180 condenses light from the pixel 20. The lens 180 can be made of an organic material such as acrylic resin.

[0044] The organic material film 181 is a film disposed between the first protective film 120 and the second protective film 160 in the peripheral region 40. An opening 182 is disposed in the organic material film 181 at a portion overlapping with the recess. In FIG. 8 , the opening 182 is disposed at a portion overlapping with the recess 170 and the recess 172. The organic material film 181 can be made of the same material as the lens 180.

[0045] The recesses 170 and 172 in Fig. 8 can be formed by utilizing the film 181 of an organic material. Specifically, when forming the lens 180, a material film of the lens 180 is also disposed in the peripheral region 40. The portion of this material film in the peripheral region 40 becomes the film 181 of the organic material. Next, when this material film is processed to form the lens 180, an opening 182 is formed in the film 181 of the organic material. Next, the film 181 of the organic material is used as a mask to etch the first protective film 120, thereby forming the recesses 170 and 172.

[0046] By disposing the film 181 of the organic material, it is possible to further improve the adhesion between the first protective film 120 and the second protective film 160. This is because the surface area of ​​the peripheral region 40 including the recessed portion 170 and the like is increased.

[0047] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0048] In this way, in the light-emitting device 1 according to the third embodiment of the present disclosure, the organic material film 181 is disposed between the first protective film 120 and the second protective film 160. This can further improve the adhesion between the first protective film 120 and the second protective film 160.

[0049] (4. Fourth Embodiment) In the light-emitting device 1 of the first embodiment described above, the recess 170 is formed in the peripheral region 40. In contrast, the light-emitting device 1 of the fourth embodiment of the present disclosure differs from the first embodiment described above in that it further includes a second recess formed in a region including the pixel array section 10.

[0050] [Configuration of Light-Emitting Device] Fig. 9 is a diagram showing a configuration example of a light-emitting device according to a fourth embodiment of the present disclosure. Similar to Fig. 2, this figure is a cross-sectional view showing a configuration example of the light-emitting device 1. The light-emitting device 1 in this figure differs from the light-emitting device 1 in Fig. 2 in that a color filter 140 and the like are arranged in a recess formed in the region of the pixel array section 10.

[0051] A recess 170 and a recess 179 are arranged in the first protective film 120 in FIG. 9 . This recess 179 is a recess formed in the first protective film 120 in a region adjacent to the pixel array section 10. The lower planarization film 130, the color filter 140, and the upper planarization film 150 in FIG. 9 are arranged at the bottom of the recess 179. The recess 179 in FIG. 9 represents an example in which it is configured to have the same depth as the recess 170. By arranging the recess 170 and the recess 179, it is possible to further improve the adhesion between the first protective film 120 and the second protective film 160. The recess 179 is an example of a "second recess" in the present disclosure.

[0052] 10A-10E are diagrams illustrating an example of a manufacturing method for a light-emitting device according to the fourth embodiment of the present disclosure. These diagrams illustrate an example of a manufacturing process for a light-emitting device 1. First, a pixel array section 10 is formed on a substrate 100, and a first protective film 120 is disposed thereon (FIG. 10A). Next, a resist 301 is disposed on the surface of the first protective film 120. In this resist 301, openings 302 and 303 are disposed in regions where the recesses 170 and 179 will be formed, respectively (FIG. 10B). Next, the first protective film 120 is etched using the resist 301 as a mask, forming the recesses 170 and 179 (FIG. 10C).

[0053] Next, the resist 301 is removed. Next, the lower planarization film 130, the color filter 140, and the upper planarization film 150 are formed in this order (FIG. 10D). Next, the second protective film 160 is disposed (FIG. 10E). Through the above steps, the light emitting device 1 can be manufactured.

[0054] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0055] In this way, the light emitting device 1 according to the fourth embodiment of the present disclosure is provided with the recess 170 and the recess 179 , thereby making it possible to improve the adhesion between the first protective film 120 and the second protective film 160 .

[0056] (5. Fifth Embodiment) In the light emitting device 1 of the first embodiment described above, the recess 170 is formed in the peripheral region 40. In contrast, the light emitting device 1 of the fifth embodiment of the present disclosure differs from the first embodiment described above in that the recess is divided into a plurality of regions.

[0057] [Configuration of Light-Emitting Device] Fig. 11 is a diagram showing a configuration example of a light-emitting device according to a fifth embodiment of the present disclosure. Similar to Fig. 1, this diagram shows a configuration example of a light-emitting device 1. Note that in this diagram, the pixels 20 and the like are omitted. The light-emitting device 1 in Fig. 1 differs from the light-emitting device 1 in Fig. 1 in that a recess 174 is arranged instead of the recess 170.

[0058] The recess 174 is a recess divided into a plurality of regions. A dividing portion 175 is disposed in the recess 174, dividing the recess in the longitudinal direction. The dotted line region in FIG. 11 represents the recess 174. Note that the recess 174 in FIG. 11 represents an example in which the recess 174 is formed by a plurality of recesses 176 divided by the dividing portions 175. Also, the recess 174 in FIG. 11 represents an example in which the recess 174 is divided by a plurality of dividing portions 175. Also, the recess 174 in FIG. 11 represents an example in which the recess 174 is formed in a groove shape.

[0059] [Cross-Sectional Configuration of Light-Emitting Device] Figures 12A and 12B are cross-sectional views showing an example configuration of a light-emitting device according to a fifth embodiment of the present disclosure. Similar to Figure 1, Figures 12A and 12B are schematic cross-sectional views showing an example configuration of a light-emitting device 1. Figure 12A shows a cross-section taken along line a-a' in Figure 11. Figure 12B shows a cross-section taken along line b-b' in Figure 11. At the dividing portion 175, the recess is interrupted. The wall surfaces of the recesses 176 adjacent to the dividing portion 175 increase the contact area between the first protective film 120 and the second protective film 160, thereby improving the adhesion between the first protective film 120 and the second protective film 160. In this case, it is preferable that the width of the dividing portion 175 (i.e., the distance between the recesses 176) is shorter than the width of the recesses 176. This is because the contact area between the first protective film 120 and the second protective film 160 can be increased.

[0060] [Another Configuration of Light-Emitting Device] Fig. 13 is a diagram showing another configuration example of a light-emitting device according to the fifth embodiment of the present disclosure. Similar to Fig. 11, this figure shows a configuration example of a light-emitting device 1. The light-emitting device 1 in this figure differs from the light-emitting device 1 in Fig. 11 in that a plurality of recesses 174 are arranged. This figure shows an example in which three recesses 174 are arranged.

[0061] A dividing portion 175 is disposed in each of the plurality of recesses 174. It is preferable that the dividing portions 175 of adjacent recesses 174 are configured so that they do not overlap in a side view of the light emitting device 1. The dividing portions 175 serve as paths through which moisture can enter from the outside, but by arranging the plurality of dividing portions 175 in positions where they do not overlap in a side view, the paths through which moisture can enter can be extended. The dashed arrows in Figure 13 represent examples of paths through which moisture can enter.

[0062] 14 is a cross-sectional view showing another configuration example of the light emitting device according to the fifth embodiment of the present disclosure, taken along line cc' in FIG.

[0063] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0064] In this way, the light-emitting device 1 of the fifth embodiment of the present disclosure is provided with a recess 174, which is a recess divided into multiple regions, thereby improving the adhesion between the first protective film 120 and the second protective film 160.

[0065] (6. Sixth Embodiment) The light emitting device 1 of the first embodiment described above has a recess 170 formed in the peripheral region 40. In contrast, the light emitting device 1 of the sixth embodiment of the present disclosure differs from the first embodiment described above in that an uneven structure is formed at the bottom of the recess.

[0066] [Configuration of Light-Emitting Device] Figures 15A-15C are diagrams showing an example configuration of a light-emitting device according to a sixth embodiment of the present disclosure. Figure 15A is a plan view showing an example configuration of a light-emitting device 1. Note that Figure 15A shows the peripheral region 40 of the light-emitting device 1. As described above, a recess is arranged in the peripheral region 40. The light-emitting device 1 in Figure 15A shows an example in which a recess 172 is arranged. A plurality of protruding regions 177 are arranged at the bottom of this recess 172. The protruding regions 177 are island-shaped regions separated by recesses 178 formed at the bottom of the recess 172.

[0067] It is preferable that the plurality of protruding regions 177 are configured to overlap each other in a side view of the light emitting device 1, because this allows the path for moisture to penetrate to be extended.

[0068] FIG. 15B is a schematic cross-sectional view showing an example of the configuration of the light-emitting device 1. FIG. 15B shows a cross section taken along line dd' in FIG. 15A. Note that the second protective film 160 is omitted from FIG. 15B. The protruding region 177 can be formed by selectively etching the bottom of the recess 172. Note that "d" in FIG. 15B represents the depth of the recess 172 before the protruding region 177 is formed.

[0069] 15C is a diagram illustrating the light emitting device 1 of FIG. 15B to which a second protective film 160 has been added. As shown in the figure, the second protective film 160 is configured to be in contact with the first protective film 120 at the bottom of the recess 178. The multiple protruding regions 177 can increase the contact area between the first protective film 120 and the second protective film 160, thereby improving the adhesion between the first protective film 120 and the second protective film 160.

[0070] 16A is a diagram showing an example of the configuration of a protruding region according to a sixth embodiment of the present disclosure. The figure shows an example of the configuration of a protruding region 177. The left side of the figure shows a protruding region 177 configured in a cylindrical shape. The left side of the figure also shows a protruding region 177 configured in a rectangular parallelepiped shape. Because defects are likely to occur in the corners of the rectangular parallelepiped-shaped protruding region 177, a cylindrical protruding region 177 is more advantageous.

[0071] 16B is a diagram showing another configuration example of a protruding region according to the sixth embodiment of the present disclosure. The figure shows a configuration example of a protruding region 177. The protruding region 177 in the figure shows a protruding region 177 configured in the shape of an elliptical cylinder.

[0072] The configuration of the light emitting device 1 according to the sixth embodiment of the present disclosure is not limited to this example. For example, a protruding region 177 may be formed in the recess 170 or the like.

[0073] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0074] In this way, the light emitting device 1 of the sixth embodiment of the present disclosure can improve the adhesion between the first protective film 120 and the second protective film 160 by forming multiple protruding regions 177 at the bottom of the recess 172, etc.

[0075] (7. Seventh Embodiment) The light emitting device 1 of the first embodiment described above has the recess 170 formed in the peripheral region 40. In contrast, the light emitting device 1 of the seventh embodiment of the present disclosure differs from the first embodiment described above in that it includes a water absorbing layer that captures moisture from the outside.

[0076] [Cross-Sectional Configuration of Light-Emitting Device] Figures 17A and 17B are cross-sectional views showing an example configuration of a light-emitting device according to a seventh embodiment of the present disclosure. Similar to Figure 2, Figures 17A and 17B are schematic cross-sectional views showing an example configuration of a light-emitting device 1. The light-emitting device 1 of Figure 17A differs from the light-emitting device 1 of Figure 2 in that a water-absorbing layer 190 that captures moisture from the outside is provided. The water-absorbing layer 190 is provided in the first protective film 120. Specifically, the water-absorbing layer 190 can be provided as an inner layer of the first protective film 120. The water-absorbing layer 190 can also be configured to have an end portion extending into the peripheral region 40. The water-absorbing layer 190 can also be configured to have an end surface 199 that contacts the second protective film 160 in the recess 170. As a result, the water-absorbing layer 190 is covered by the first protective film 120 and the second protective film 160. The water absorption layer 190 is an example of the "first water absorption layer" of the present disclosure.

[0077] The water absorption layer 190 may be made of, for example, silicon oxide, zinc oxide, magnesium oxide, or an aluminum-based organic / inorganic material. The water absorption layer 190 may also be made of, for example, an amorphous oxide (e.g., IZO, Hf-IGZO, etc.). As described above, the first protective film 120 may be made of silicon nitride (SiN).

[0078] The water absorption layer 190 and first protective film 120 in Fig. 17A can be formed as follows. First, a SiN film, which is the material film for the first protective film 120, is formed by CVD or the like. Next, a material film for the water absorption layer 190 is formed, and unnecessary portions near the edge surface of the substrate 100 are removed by etching. This makes it possible to form the water absorption layer 190 whose edges are separated from the edges of the light emitting device 1. Next, a SiN film is stacked to form the first protective film 120.

[0079] The light emitting device 1 in Fig. 17B represents an example in which the end surface 199 is configured to reach the wall surface of the recess 170. The water absorption layer 190 in this figure is manufactured by a method different from that of the water absorption layer 190 in Fig. 17A.

[0080] The water absorption layer 190 and first protective film 120 in Fig. 17B can be formed as follows. First, a SiN film, which is the material of the first protective film 120, is formed. Next, a material film for the water absorption layer 190 is formed. Next, SiN films are stacked to form the first protective film 120. Thereafter, when the recess 170 is formed, the end portions of the material film for the water absorption layer 190 are removed.

[0081] 17A and 17B, even if moisture penetrates through the contact area between the first protective film 120 and the second protective film 160, the moisture can be captured by the water absorption layer 190. This makes it possible to prevent the diffusion of the penetrated moisture and to prevent deterioration of the light emitting device 1. The water absorption layer 190 can also be disposed only on the outer periphery of the light emitting device 1.

[0082] [Another Configuration of Light-Emitting Device] Fig. 18 is a diagram showing another configuration example of a light-emitting device according to the seventh embodiment of the present disclosure. Similar to Fig. 17A, this figure shows a configuration example of a light-emitting device 1. The light-emitting device 1 of Fig. 18 differs from the light-emitting device 1 of Fig. 17A in that a water-absorbing layer 191 is disposed instead of the water-absorbing layer 190. The water-absorbing layer 191 is a water-absorbing layer disposed in the second protective film 160. This water-absorbing layer 191 can be disposed adjacent to the second protective film 160. Specifically, the water-absorbing layer 191 can be disposed between the color filter 140 and the second protective film 160.

[0083] The water absorption layer 191 can be configured in a shape such that the end surface 198 contacts the second protective film 160 in the recess 170. In this way, the water absorption layer 191 is covered with the first protective film 120 and the second protective film 160. The water absorption layer 191 is an example of the "second water absorption layer" of the present disclosure.

[0084] The water absorption layer 191 can be formed as follows: First, the color filter 140 is formed, and then the recesses 170 are formed in the first protective film 120. Next, a material film for the water absorption layer 191 is formed, and unnecessary portions near the edge surfaces of the substrate 100 are removed by etching. Next, the second protective film 160 is formed.

[0085] 18 , the water absorption layer 191 can also trap moisture that has entered through the contact portion between the first protective film 120 and the second protective film 160. This can prevent deterioration of the light emitting device 1. The water absorption layer 191 can also be disposed only on the outer periphery of the light emitting device 1.

[0086] 19A and 19B are diagrams showing another example of the configuration of the light emitting device according to the seventh embodiment of the present disclosure. Similar to FIGS. 17A and 17B, FIGS. 19A and 19B are diagrams showing an example of the configuration of the light emitting device 1. The light emitting device 1 in FIGS. 19A and 19B differs from the light emitting device 1 in FIGS. 17A and 17B in that it further includes a water absorbing layer 191.

[0087] Fig. 19A shows an example in which a water absorption layer 191 is further arranged in the light emitting device 1 of Fig. 17A. Also, Fig. 19B shows an example in which a water absorption layer 191 is further arranged in the light emitting device 1 of Fig. 17B.

[0088] The configuration of the light emitting device 1 other than that described above is the same as the configuration of the light emitting device 1 in the first embodiment of the present disclosure, and therefore description thereof will be omitted.

[0089] In this way, the light emitting device 1 according to the seventh embodiment of the present disclosure is provided with the water absorbing layer 190 and the water absorbing layer 191, thereby making it possible to prevent deterioration of the light emitting device 1.

[0090] (8. Application Examples to Display Devices) The light emitting device 1 of the first embodiment can be applied to a variety of devices. A display device to which the light emitting device 1 of the present disclosure is applied will be described.

[0091] 20 is a diagram showing an example of a display device to which the technology according to the present disclosure can be applied. The diagram shows the external appearance of a smartphone 400, which is an example of a display device. The smartphone 400 has a display unit 401 that displays various information and an operation unit 403 that includes buttons and the like for accepting operation inputs by a user. The light-emitting device 1 can be applied to this display unit 401.

[0092] The configuration of the first embodiment of the present disclosure can be applied to other embodiments, specifically, the recess 171 in Fig. 4 can be applied to the second embodiment of the present disclosure.

[0093] The configuration of the third embodiment of the present disclosure can be applied to other embodiments. Specifically, the organic member film 181 in Fig. 8 can be applied to the second and fourth to seventh embodiments of the present disclosure.

[0094] The configuration of the fourth embodiment of the present disclosure can be applied to the other embodiments, specifically, the recess 179 in Fig. 9 can be applied to the second to seventh embodiments of the present disclosure.

[0095] The configuration of the fifth embodiment of the present disclosure can be applied to the other embodiments, specifically, the recess 174 in Fig. 11 can be applied to the second to fourth, sixth, and seventh embodiments of the present disclosure.

[0096] The configuration of the sixth embodiment of the present disclosure can be applied to other embodiments. Specifically, the protruding region 177 in Fig. 15A can be applied to the second to fifth and seventh embodiments of the present disclosure.

[0097] The configuration of the seventh embodiment of the present disclosure can be applied to the other embodiments. Specifically, the water absorption layer 190 in Fig. 17A and the water absorption layer 191 in Fig. 18 can be applied to the second to sixth embodiments of the present disclosure.

[0098] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0099] The present technology can also be configured as follows. (1) A light-emitting device including: a pixel array section configured with a plurality of pixels including light-emitting elements formed on a surface of a substrate, a first protective film configured to cover the light-emitting elements, and color filters stacked on the first protective film; a recess shaped to follow the edge of the substrate and formed in the first protective film in a peripheral region between an edge of the pixel array section and an edge of the substrate, where the first protective film is extended and disposed; and a second protective film contacting the first protective film at least at a bottom of the recess and configured to cover the color filter, wherein the recess has a depth smaller than a thickness of the second protective film in the peripheral region and a width larger than a thickness of the first protective film in the peripheral region. (2) The light-emitting device according to (1), wherein the recess is configured by a notch formed in an edge of the first protective film. (3) The light-emitting device according to (2), wherein the recess has a tapered bottom. (4) The light-emitting device according to (1), wherein the recess is configured in a groove shape. (5) The light-emitting device according to (4), which has a plurality of the recesses. (6) The light-emitting device according to any one of (1) to (5), further including a film of an organic material disposed between the first protective film and the second protective film in the peripheral region, with an opening disposed in a portion overlapping the recess. (7) The light-emitting device according to (6), further including a lens disposed by being stacked on the color filter, the film of the organic material being made of the same material as the lens. (8) The light-emitting device according to any one of (1) to (7), wherein the recess is formed after the color filter is disposed. (9) The light-emitting device according to any one of (1) to (5), further including a second recess formed in a region of the first protective film adjacent to the pixel array section, the color filter being disposed in the second recess. (10) The light-emitting device according to (1), wherein the recess has a dividing portion dividing the recess in the length direction. (11) The light emitting device according to (10), wherein the recessed portion includes a plurality of the dividing portions. (12) The light emitting device according to (10) or (11), wherein the recessed portion includes a plurality of the dividing portions.(13) The light-emitting device according to (12), wherein the plurality of recesses are configured so that the dividing portions do not overlap in side view. (14) The light-emitting device according to (1), wherein the first protective film has a plurality of protruding regions which are island-shaped regions separated by recesses formed in the bottoms of the recesses, and the second protective film is configured so as to contact the first protective film at the bottoms of the recesses. (15) The light-emitting device according to (14), wherein the protruding region is configured in a cylindrical shape. (16) The light-emitting device according to (14), wherein the protruding region is configured in a rectangular parallelepiped shape. (17) The light-emitting device according to any one of (14) to (16), wherein the plurality of protruding regions are configured so as to overlap in side view. (18) The light-emitting device according to (1), further comprising a first water-absorbing layer disposed on the first protective film. (19) The light-emitting device according to (18), wherein the first water-absorbing layer is disposed as an inner layer of the first protective film. (20) The light-emitting device according to (18) or (19), wherein the first water-absorbing layer is configured in a shape such that an end surface of the first water-absorbing layer contacts the second protective film in the recess. (21) The light-emitting device according to (1), further comprising a second water-absorbing layer disposed on the second protective film. (22) The light-emitting device according to (21), wherein the second water-absorbing layer is disposed between the second protective film and the color filter. (23) The light-emitting device according to (21) or (22), wherein the second water-absorbing layer is configured in a shape such that an end surface of the second water-absorbing layer contacts the second protective film in the recess.(24) A display device having a light-emitting device comprising: a pixel array section constituted by a plurality of pixels each including a light-emitting element formed on a surface of a substrate, a first protective film constituted in a shape covering the light-emitting element, and a color filter laminated on the first protective film; a recess formed in the first protective film in a peripheral region between an end of the pixel array section and an end of the substrate, the peripheral region being an area where the first protective film is extended and disposed, the recess having a shape that follows the edge of the substrate; and a second protective film that is in contact with the first protective film at least at the bottom of the recess and is constituted in a shape that covers the color filter, wherein the recess has a depth smaller than the thickness of the second protective film in the peripheral region and a width larger than the thickness of the first protective film in the peripheral region.

[0100] REFERENCE SIGNS LIST 1 Light emitting device 10 Pixel array section 20 Pixel 40 Peripheral region 100 Substrate 110 Light emitting element 120 First protective film 140 Color filter 160 Second protective film 170 to 174, 176, 178, 179 Recessed portion 177 Protruding region 180 Lens 181 Film of organic material 182 Opening 190, 191 Water absorption layer 400 Smartphone 401 Display section

Claims

1. A light emitting device comprising: a pixel array section composed of a plurality of pixels each including a light emitting element formed on the surface of a substrate, a first protective film configured to cover the light emitting element, and a color filter laminated on the first protective film; a recessed section shaped to follow the edge of the substrate and formed in the first protective film in a peripheral region between the edge of the pixel array section and the edge of the substrate, where the first protective film is extended; and a second protective film that contacts the first protective film at least at the bottom of the recessed section and is configured to cover the color filter, wherein the recessed section has a depth smaller than the thickness of the second protective film in the peripheral region and a width greater than the thickness of the first protective film in the peripheral region.

2. The light emitting device according to claim 1, wherein the recess is constituted by a notch formed in an edge of the first protective film.

3. The light emitting device according to claim 2, wherein the recess has a tapered bottom.

4. The light emitting device according to claim 1, wherein the recess is configured in a groove shape.

5. The light emitting device according to claim 4, which has a plurality of said recesses.

6. The light emitting device according to claim 1, further comprising a film of an organic material disposed between the first protective film and the second protective film in the peripheral region, the film having an opening disposed in a portion overlapping the recess.

7. The light emitting device according to claim 6, further comprising a lens disposed by being laminated on the color filter, wherein the film of the organic material is made of the same material as the lens.

8. The light emitting device according to claim 1, wherein the recess is formed after the color filter is disposed.

9. The light emitting device according to claim 1, further comprising a second recess formed in a region of the first protective film adjacent to the pixel array section, and the color filter is disposed in the second recess.

10. The light emitting device according to claim 1, wherein the recess has a dividing portion that divides the recess in the length direction.

11. The light emitting device according to claim 10, wherein the recessed portion comprises a plurality of the dividing portions.

12. The light emitting device according to claim 10, which has a plurality of recesses each having a dividing portion.

13. The light emitting device according to claim 12, wherein the plurality of recesses are configured so that the dividing portions do not overlap each other in a side view.

14. The light-emitting device described in claim 1, wherein the first protective film has a plurality of protruding regions which are island-like regions separated by recesses formed in the bottom of the recess, and the second protective film is configured in a shape that contacts the first protective film at the bottom of the recess formed in the bottom of the recess.

15. The light emitting device according to claim 14, wherein the protruding region is configured in a cylindrical shape.

16. The light emitting device according to claim 14, wherein the protruding region is configured in the shape of a rectangular parallelepiped.

17. The light emitting device according to claim 14, wherein the plurality of protruding regions are configured to overlap each other in a side view.

18. The light emitting device according to claim 1, further comprising a first water absorbing layer disposed on the first protective film.

19. The light emitting device according to claim 18, wherein the first water absorbing layer is disposed as an inner layer of the first protective film.

20. The light emitting device according to claim 18, wherein the first water absorbing layer is configured in a shape such that an end surface of the first water absorbing layer contacts the second protective film in the recess.

21. The light emitting device according to claim 1, further comprising a second water absorbing layer disposed on the second protective film.

22. The light emitting device according to claim 21, wherein the second water absorbing layer is disposed between the second protective film and the color filter.

23. The light emitting device according to claim 21, wherein the second water absorbing layer is configured in a shape such that an end surface of the second water absorbing layer contacts the second protective film in the recess.

24. A display device having a light-emitting device comprising: a pixel array section composed of a plurality of pixels each including a light-emitting element formed on the surface of a substrate, a first protective film configured to cover the light-emitting element, and a color filter laminated on the first protective film; a recess shaped to follow the edge of the substrate formed in the first protective film in a peripheral region between the edge of the pixel array section and the edge of the substrate, where the first protective film is extended and disposed; and a second protective film that contacts the first protective film at least at the bottom of the recess and is configured to cover the color filter, wherein the recess has a depth smaller than the thickness of the second protective film in the peripheral region and a width greater than the thickness of the first protective film in the peripheral region.

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