Application material wiping apparatus and process of implementing the same

Abstract

An application material wiping apparatus may remove application material from an applicator head subsequent to the applicator head applying application material to one or more components. The application material wiping head may include an application material wiping head assembly coupled with an actuator. The actuator may move the application material wiping head assembly into a base unit, where a heating element heats the application material wiping head assembly. The actuator may subsequently move the application material wiping head assembly out of the base unit and place the application material wiping head assembly in position to engage the applicator head and remove residual application material from the applicator head. The applicator head may be actuated in multiple directions. In this regard, the residual application material may be removed from multiple surfaces of the applicator head.

Description

APPLICATION MATERIAL WIPING APPARATUS AND PROCESS OF IMPLEMENTING THE SAMECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of Chinese Patent Application No. 202410340637.9 filed on March 22, 2024, which is hereby incorporated by reference in its entirety for all purposes as if fully set forth herein.TECHNICAL FIELD

[0002] The disclosure is directed to a device and process for cleaning a material applicator head, such as a nozzle head. In particular, the disclosure is directed to cleaning application material, such as glue, from the material applicator head. In aspects, the disclosure is directed to a device and process for wiping application material, such as glue, from the material applicator head. In aspects, the disclosure is directed to a device and process for using an application material wiping head assembly to wipe away residual application material from the material applicator head, such as a nozzle tip of a nozzle head.BACKGROUND

[0003] Typically, nozzle heads provide a glue (e.g., adhesive) to various components that need to be coated with glue. Some nozzle heads are designed to uniformly provide the glue onto components to ensure the components have a durable construction, and subsequent reliable operation and high-performance of the associated assembled product. For example, in some instances, assembly of electric vehicle (EV) batteries require electrical components, such as electrode sheets, to be uniformly covered with glue.

[0004] In this regard, nozzle heads should remain generally clean and free from residual glue accumulation. However, during or after one or more glue applications, residual glue tends to accumulate on the nozzle head. Current approaches include manually wiping off the residual glue, which is not conducive to automated glue applications, thus increasing manufacturing times and cost.

[0005] Accordingly, there is a need for improvements in devices and processes for cleaning residual application material from material application heads.SUMMARY OF THE DISCLOSURE

[0006] In one aspect, an application material wiping apparatus includes an application material wiping head assembly configured to remove application material from an applicator head. The application material wiping apparatus in addition includes a base unit having a first heating element configured to heat the application material wiping head assembly from a first temperature to a second temperature greater than the first temperature. The apparatus moreover includes an actuator, where in response to the application material wiping head assembly reaching at least the second temperature, the actuator is configured to move the application material wiping head assembly from a heating position to a cleaning position different from the heating position.

[0007] In one aspect, an application material wiping apparatus includes an application material wiping head assembly configured to remove application material from an applicator head, the application material wiping head assembly having: a first structure, a second structure, and a cleaning component positioned between the first structure and the second structure. The application material wiping apparatus in addition includes an actuator configured to: move the application material wiping head assembly into a base unit to heat the cleaning component, and move the application material wiping head assembly out of the base unit such that the cleaning component is in position to contact the applicator head.

[0008] In one aspect, a method includes moving, by an actuator, an application material wiping head assembly into a base unit. The method in addition includes heating, by a heating element within the base unit, the application material wiping head assembly. The method moreover includes moving, by the actuator, the heated application material wiping head assembly out of the base unit. The method also includes receiving, by the heated application material wiping head assembly, the applicator head.

[0009] There has thus been outlined, rather broadly, certain aspects of the disclosure in order that the detailed description thereof herein may be better understood, and in order that the present contribution to the art may be betterappreciated. There are, of course, additional aspects of the disclosure that will be described below and which will form the subject matter of the claims appended hereto.

[0010] In this respect, before explaining at least one aspect of the disclosure in detail, it is to be understood that the disclosure is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description or illustrated in the drawings. The disclosure is capable of aspects in addition to those described and of being practiced and carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein, as well as the abstract, are for the purpose of description and should not be regarded as limiting.

[0011] As such, those skilled in the art will appreciate that the conception upon which this disclosure is based may readily be utilized as a basis for the designing of other structures, methods and systems for carrying out the several purposes of the disclosure. It is important, therefore, that the claims be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 illustrates a perspective view of an application material wiping apparatus according to aspects of the disclosure.

[0013] Figure 2 illustrates an exploded view of components of the application material wiping head assembly of the application material wiping apparatus according to Figure 1.

[0014] Figure 3 illustrates a perspective view of the application material wiping apparatus together with an applicator head that is capable of being cleaned by the application material wiping apparatus according to Figure 1 .

[0015] Figure 4 illustrates a front view of the application material wiping apparatus showing the applicator head moving toward the application material wiping head assembly in one direction according to aspects of the disclosure.

[0016] Figure 5 illustrates a front view of the application material wiping apparatus showing the applicator head moving in multiple directions relative to the application material wiping head assembly according to aspects of the disclosure.

[0017] Figure 6 illustrates a front view of the application material wiping apparatus showing the applicator head moving in different directions relative to the application material wiping head assembly according to aspects of the disclosure.

[0018] Figure 7 illustrates a perspective view of the application material wiping apparatus showing components returning to their respective original positions according to aspects of the disclosure.

[0019] Figure 8 illustrates various exemplary steps of operation of the application material wiping apparatus according to aspects of the disclosure.

[0020] Figure 9 illustrates a block diagram of an application material wiping apparatus according to aspects of the disclosure.

[0021] Figure 10 illustrates an example of a process for implementing an application material wiping apparatus according to aspects of the disclosure.DETAILED DESCRIPTION

[0022] The disclosure will now be described with reference to the drawing figures, in which like reference numerals refer to like parts throughout.

[0023] Aspects of the disclosure may include a device and process for removing application material from an applicator head that may be implemented in conjunction with and / or implemented in an automated application material dispensing system for applications such as EV batteries, wherein the application equipment integrated into a high-speed automated production line uses a slit applicator head to apply coating material evenly and seamlessly onto a substrate , as non-limiting examples. Moreover, the disclosed device and process are configured for automated application material applications, including high line speed applications of application material to components.

[0024] In this regard, an application material wiping apparatus may replace manual removal processes for removing application material, in particular, accumulated application material on an applicator head that is formed during a material applicationprocess. The application material wiping apparatus may be integrated with automated application material dispensing systems and remove application material from an applicator head after an application material application to a component. In other aspects, the application material wiping apparatus may be implemented separately from the automated application material dispensing systems. Moreover, the application material wiping apparatus may remove residual application material from a nozzle tip, dispensing tip, and / or the like of the applicator head.

[0025] Further, the disclosed device and process are configured to remove application material remaining on components of the application material wiping apparatus. In this regard, the application material wiping apparatus may include an application material wiping head assembly coupled to an actuator. Subsequent to the application material wiping head assembly removing application material from the applicator head, at least some residual application material may remain on the application material wiping head assembly. However, the actuator may drive the application material wiping head assembly through a cleaning curtain. In this regard, the cleaning curtain may engage the application material wiping head assembly and remove residual application material from the application material wiping head assembly. Moreover, the application material wiping apparatus may further include a reservoir configured and used to capture the residual application material removed by the cleaning curtain.

[0026] Application material wiping apparatuses shown and / or described herein may offer several advantages. For example, an application material wiping apparatus described herein may provide a compact assembly that may be integrated with an automated application material wiping apparatus. Moreover, an application material wiping apparatus described herein may also provide automated application material removal capabilities, leading to lower overall manufacturing costs and manufacturing time. Further, an application material wiping apparatus described herein may not require the use of single-use or otherwise disposable materials (e.g., paper, tape, and / or the like), which may further increase reliability and economic efficiency. On the contrary, the application material wiping apparatus may be self-cleaning. In this regard, theapplication material wiping apparatus may be configured so as to have reduced maintenance, care, upkeep, and / or the like.

[0027] Figure 1 illustrates a perspective view of an application material wiping apparatus 100 according to aspects of the disclosure. The application material wiping apparatus 100 may be used to remove application material from an applicator head (not shown in Figure 1 ) after an application (or applications) of application material to one or more components. In aspects, the application material may be a glue, an adhesive, a hot melt glue, a hot melt adhesive and / or the like.

[0028] In one or more implementations, the application material wiping apparatus 100 may be integrated with an automated application material dispensing system. In this regard, the application material wiping apparatus 100 may provide an inline automated solution for removal of unwanted application material. For example, the application material wiping apparatus 100 may provide for automated application material removal of application material from an applicator head. In other aspects, the application material wiping apparatus 100 may be implemented separately from the automated application material dispensing systems.

[0029] The application material wiping apparatus 100 may include an application material wiping head assembly 102 configured and designed to engage an applicator head to remove residual application material from the applicator head. The application material wiping apparatus 100 may further include a base unit 104. As shown, the application material wiping head assembly 102 may be positioned, or at least substantially positioned, in the base unit 104 when the application material wiping head assembly 102 is not in operation.

[0030] The base unit 104 may include a base unit heating element 160 (representative of one or more heating elements). The base unit heating element 160 may be configured and designed to heat the application material wiping head assembly 102 when the application material wiping head assembly 102 is positioned in the base unit 104. In one or more implementations, the base unit heating element 160 may be implemented as a resistive heating device, an electric heater, a radiative heating element, and / or the like.

[0031] In order to ensure the base unit heating element 160 heats the application material wiping head assembly 102 to a threshold temperature (e.g., setpoint temperature, predetermined temperature) and / or appropriate heating temperature range, the base unit 104 may include a base unit temperature sensor 180 configured and designed to monitor the temperature within the base unit 104, wherein the above-mentioned threshold temperature is mainly determined by a temperature characteristics of the application material; the the threshold temperature should be higher than the melting temperature of the application material; and in practical applications, the threshold temperature range that can be set is, for example, 5~10°C higher than the melting temperature of the application material. In this regard, the base unit temperature sensor 180 may monitor the temperature while the base unit heating element 160 is in operation and heats the application material wiping head assembly 102. In one or more implementations, the base unit temperature sensor 180 takes the form of a thermistor, a thermocouple, a solid-state temperature sensor, and / or the like. Further, the base unit temperature sensor 180 may generate a signal indicative of the temperature of the base unit 104 and provide the signal to the base unit heating element 160 for controlling operation of the base unit heating element 160.

[0032] The application material wiping apparatus 100 may further include an actuator 110 coupled with the application material wiping head assembly 102. The actuator 110 may be configured to move, or drive, the application material wiping head assembly 102 out of the base unit 104, as well as move the application material wiping head assembly 102 back into the base unit 104. As shown in Figure 1 , the actuator 110 may place the application material wiping head assembly 102 in an initial position, an inoperative position, a heating position, or first position. In one or more implementations, the actuator 110 takes the form of a linear actuator, an electric actuator, a pneumatic actuator, a rotary actuator, a hydraulic actuator, a screw actuator, and / or the like. Additionally and / or alternatively, the actuator 110 may include one or more motors, gears, clutches, drive mechanisms, position sensors, and / or the like.

[0033] The application material wiping apparatus 100 may further include a chamber 112 configured and designed to receive an applicator head. In this regard, the chamber 112 may include an opening 114 to receive the applicator head. The chamber 112 may include a chamber heating element 162 (representative of one or more heating elements), which may take the form of any device previously described for the base unit heating element 160. The chamber heating element 162 may be configured and designed to heat an applicator head positioned in the opening 114 of the chamber 112. Also, the chamber 112 may further include a chamber temperature sensor 182 designed to monitor the temperature within the chamber 112. In this regard, the chamber temperature sensor 182 may monitor the temperature while the chamber heating element 162 is in operation and heats the applicator head. The chamber temperature sensor 182 may take the form of any device previously described for the base unit temperature sensor 180.

[0034] Figure 2 illustrates an exploded view of components of the application material wiping head assembly 102 of the application material wiping apparatus 100 according to aspects of the disclosure. The application material wiping head assembly 102 may include a first structure 184, a second structure 186, and a cleaning component 116. In aspects, the cleaning component 116 may be a cleaning surface, a cleaning knife, a cleaning lip, and / or the like. When assembled, the cleaning component 116 may be positioned between and protrude from the first structure 184 and the second structure 186. As a non-limiting example, the cleaning component 116 may be formed from rubber. However, the cleaning component 116 may be formed from other soft materials, compliant materials, polymer-based materials and / or the like.

[0035] During operation, the application material wiping head assembly 102 may be positioned out of the base unit 104 via the actuator 110. Moreover, the application material wiping head assembly 102, including the cleaning component 116, may engage an applicator head (not shown in Figure 2) in order to remove residual application material from the applicator head. Subsequently, the actuator 110 may return the application material wiping head assembly 102 into the base unit 104. Forexample, the actuator 110 may position the application material wiping head assembly 102 in an opening 118 of the base unit 104.

[0036] The application material wiping apparatus 100 may further include a cleaning curtain 120 configured and designed to engage the application material wiping head assembly 102 while the application material wiping head assembly 102 moves into and / or out of the opening 118 of the base unit 104. As a result of the movement of the application material wiping head assembly 102 relative to the cleaning curtain 120, the application material wiping head assembly 102 may rub against, or otherwise engage, the cleaning curtain 120, thereby removing residual application material from the application material wiping head assembly 102. As shown, the cleaning curtain 120 may surround a perimeter of the application material wiping head assembly 102. In this regard, when the application material wiping head assembly 102 is assembled, the application material wiping head assembly 102 may include a five-sided structure and the cleaning curtain 120 may surround each of the five sides. In order to engage the application material wiping head assembly 102, the cleaning curtain 120 may include an opening 122 with an area that is less than an area (e.g., cross-sectional area) of the application material wiping head assembly 102. In this regard, the application material wiping head assembly 102 may form an interference fit with the cleaning curtain 120, thus ensuring contact between the application material wiping head assembly 102 and the cleaning curtain 120 when the application material wiping head assembly 102 passes through the opening 122 of the cleaning curtain 120. In one or more implementations, the cleaning curtain 120 may be formed from rubber. However, the cleaning curtain 120 may be formed from other soft materials, compliant materials, polymer-based materials and / or the like.

[0037] In order to secure the cleaning curtain 120, the application material wiping apparatus 100 may further include a retainer plate 124. Further, the retainer plate 124 may secure the cleaning curtain 120 to a surface 126 of the base unit 104. In one or more implementations, the retainer plate 124 takes the form of a metal plate. Also, the retainer plate 124 may include an opening 128. The area of the opening 122 of the cleaning curtain 120 may be smaller than the area of the opening 128 of the retainerplate 124. In this regard, the retainer plate 124 may secure the cleaning curtain 120 to the surface 126 of the base unit 104 while not impeding the cleaning curtain 120 from engaging the application material wiping head assembly 102. In aspects, mechanical fasteners may fasten the retainer plate 124 to the base unit 104 with the cleaning curtain 120 therebetween.

[0038] Figure 3 illustrates a perspective view of an applicator head 130 that is capable of being cleaned by the application material wiping apparatus 100 according to aspects of the disclosure. In aspects, the applicator head 130 may be implemented by a nozzle head, a slot coating applicator, a metering slot coating applicator, a band coat dispenser, a band coat applicator, a glue applicator, an adhesive applicator, a hot melt glue applicator, a hot melt adhesive applicator, and / or the like. The applicator head 130 may be configured to deliver very precise and consistent coating performance.

[0039] Although not expressly shown, the applicator head 130 may be connected to one or more actuators, or one or more motors, as non-limiting examples. In this regard, the applicator head 130 may be moved in multiple directions. When removed from the opening 114 of the chamber 112, the applicator head 130 may apply application material to components (not shown in Figure 3). For example, the applicator head 130 may apply application material to electrical components of an EV battery. Prior to removing the applicator head 130 from the opening 114, the chamber heating element 162 of the chamber 112 may heat the applicator head 130, thus heating any accumulated application material on the applicator head 130. In this regard, the chamber temperature sensor 182 may monitor the temperature in the chamber 112 while the applicator head 130 is heated. When the chamber heating element 162 increases the temperature of the chamber 112 from a first temperature (e.g., a temperature below a threshold temperature as determined by the chamber temperature sensor 182) to a second temperature (e.g., a temperature at or above a threshold temperature as determined by the chamber temperature sensor 182), the applicator head 130 may be moved out of the opening 114 of the chamber 112 and in a direction toward the application material wiping head assembly 102.

[0040] Subsequent to applying the application material, it may be desirable to clean the applicator head 130 by removing residual application material from the applicator head 130. In this regard, the application material wiping head assembly 102 may be used. In order to clean the applicator head 130, the actuator 110 moves the application material wiping head assembly 102 out of the base unit 104. As shown, the application material wiping head assembly 102 may be moved by the actuator 110 along the X-axis (in Cartesian coordinates). As shown in Figure 3, the actuator 110 may place the application material wiping head assembly 102 in an operative position, a subsequent position, a cleaning position and / or a second position. Prior to removing the application material wiping head assembly 102 from the base unit 104, the base unit heating element 160 of the base unit 104 may heat the application material wiping head assembly 102 to facilitate removing the residual application material from the applicator head 130. When the temperature of the base unit 104 increases from a first temperature (e.g., a temperature below a threshold temperature as determined by the base unit temperature sensor 180) to a second temperature (e.g., a temperature at or above a threshold temperature as determined by the base unit temperature sensor 180), the application material wiping head assembly 102 may be moved out of the base unit 104. It should be noted that the respective threshold temperatures for the application material wiping head assembly 102 and the applicator head 130 may be the same threshold temperature. Alternatively, however, the respective threshold temperatures for the application material wiping head assembly 102 and the applicator head 130 may be different threshold temperatures. Also, the applicator head 130 may be moved in a direction toward the application material wiping head assembly 102. For example, the applicator head 130 may be moved along the Y-axis and / or the Z-axis. In this regard, the application material wiping head assembly 102 and the applicator head 130 may move perpendicular with respect to each other.

[0041] Figures 4, 5, and 6 illustrate exemplary movement of the applicator head 130. Based on the movement of the applicator head 130 relative to the application material wiping head assembly 102, the application material wiping head assembly 102 may remove residual application material from the applicator head 130. In otheraspects, the application material wiping head assembly 102 may alternatively move while the applicator head 130 remains stationary. In other aspects, the application material wiping head assembly 102 may additionally move while the applicator head 130 moves.

[0042] Figure 4 illustrates a front view of the application material wiping apparatus 100 showing the applicator head 130 moving toward the application material wiping head assembly 102 in one direction according to aspects of the disclosure. As shown, the applicator head 130 may move in a direction of an arrow 132 (e.g., along the Y-axis). In this regard, the respective movements of the application material wiping head assembly 102 (shown in Figure 3) and the applicator head 130 may be perpendicular with respect to each other. Accordingly, the applicator head 130 may move perpendicular to the application material wiping head assembly 102, and vice versa.

[0043] Figure 5 illustrates a front view of the application material wiping apparatus 100 showing the applicator head 130 moving in multiple directions relative to the application material wiping head assembly 102 according to aspects of the disclosure. In order to engage the application material wiping head assembly 102, the applicator head 130 may move along the Y-axis and Z-axis, including simultaneous Y- and Z-axis movement. For example, the applicator head 130 may move along the arrow 132 (e.g., along the Y-axis) and a two-sided arrow 134 (e.g., along both directions of the Z-axis). In this regard, the applicator head 130 may contact the application material wiping head assembly 102, including the cleaning component 116.

[0044] Moreover, the applicator head 130 may include a nozzle tip 136, representing a dispensing tip of the applicator head 130. Based on the multi-directional movement of the applicator head 130, the nozzle tip 136 (in addition to other portions of the applicator head 130) may contact the cleaning component 116, this may allow the cleaning component 116 to remove residual application material from the nozzle tip 136.

[0045] Further, the first structure 184 and the second structure 186 may include a surface 190 and a surface 191 , respectively. As shown in Figure 5, each of the surface 190 and the surface 191 may take the form of a diagonal surface and / or inclinedsurface. The residual application material (represented by an arrow 138) may flow along the surface 190 of the first structure 184 and into a reservoir 1 2 of the application material wiping apparatus 100. Likewise, the residual application material may flow along the surface 191 of the second structure 186 and into the reservoir 142 of the application material wiping apparatus 100.

[0046] Figure 6 illustrates a front view of the application material wiping apparatus 100 showing the applicator head 130 moving in different directions relative to the application material wiping head assembly 102 according to aspects of the disclosure. As shown, the applicator head 130 may also move along the arrow 143 (e.g., along the Y-axis) and the two-sided arrow 134. In this regard, the applicator head 130, including the nozzle tip 136, may contact the application material wiping head assembly 102, including the cleaning component 116. As a result, the application material wiping head assembly 102 may remove residual application material from multiple regions, surfaces, or portions of the applicator head 130. Also, the residual application material (represented by an arrow 144) may flow along the surface 191 of the second structure 186 and into the reservoir 142.

[0047] Figure 7 illustrates a perspective view of the application material wiping apparatus 100 showing components returning to their respective original positions according to aspects of the disclosure. As shown, the application material wiping head assembly 102 may return to the base unit 104 in response to operation of the actuator 110, and the applicator head 130 may return to the chamber 112. In this regard, the application material wiping head assembly 102 and the applicator head 130 may again be heated by the base unit heating element 160 and the chamber heating element 162, respectively, in preparation for additional cleaning.

[0048] The actuator 110 may move the application material wiping head assembly 102 into the base unit 104. Moreover, while moving into the base unit 104, the application material wiping head assembly 102 may engage the cleaning curtain 120. Based on the relative dimensions of the application material wiping head assembly 102 and the cleaning curtain 120 (e.g., forming an interference fit), the cleaning curtain 120 may engage the application material wiping head assembly 102 during movement ofapplication material wiping head assembly 102 and remove residual application material from the application material wiping head assembly 102, and the reservoir 142 may receive the removed residual application material.

[0049] Figure 8 illustrates various exemplary steps of operation of the application material wiping apparatus 100 according to aspects of the disclosure.

[0050] Step 1: this may be an initial state of the application material wiping apparatus 100 during a wiping procedure. In this regard, the application material wiping head assembly 102 may be heating up prior to wiping off residual glue from the applicator head 130.

[0051] Step 2: in this stage, the actuator 110 may position the application material wiping head assembly 102 out of the base unit 104.

[0052] Step 3: in this stage, the applicator head 130 may move to a side of the application material wiping head assembly 102 to begin to wipe off additional glue that has accumulated at a bottom the applicator head 130.

[0053] Step 4: in this stage, the applicator head 130 may move vertically toward to the cleaning component 116 to ensure the cleaning component 116 is pressing onto a bottom flat plane of the applicator head 130.

[0054] Step 5: in this stage, the applicator head 130 may slowly move toward another side of the application material wiping head assembly 102 while the cleaning component 116 is wiping the bottom flat plane of the applicator head 130.

[0055] Step 6: in this stage, the applicator head 130 may move across the application material wiping head assembly 102 and the cleaning component 116 may fully brush the bottom plane of the applicator head 130.

[0056] Step 7: in this stage, the applicator head 130 may thereafter be arranged in an upright top position in the chamber 112.

[0057] Step 8: in this stage, since residual glue has been removed away from a tip of the applicator head 130, the applicator head 130 may move down and into the chamber 112 with a purpose of remaining at a temperature. Additionally, the applicator head 130 may be preparing for a next working cycle.

[0058] Step 9: in this stage, the applicator head 130 has been inserted into the chamber 112 and the application material wiping head assembly 102 may be pulled back into the base unit 104. During the process of this backward action, the cleaning curtain 120 wipes off the glue from the cleaning component 116 of the application material wiping head assembly 102 as well other exterior surfaces of the application material wiping head assembly 102 so as to maintain the application material wiping head assembly 102 as clean as possible so as to allow the application material wiping apparatus 100 and / or the application material wiping head assembly 102 to work more efficiently.

[0059] Figure 9 illustrates a block diagram of an application material wiping apparatus 100 according to aspects of the disclosure. The application material wiping apparatus 100 may include a controller 150 used to control various functions of the application material wiping apparatus 100. In particular, the controller 150 may control operation of the actuator 110. Additionally, the controller 150 may control operation of the base unit heating element 160 in response to the base unit temperature sensor 180. Moreover, the controller 150 may control operation of the chamber heating element 162 in response to the chamber temperature sensor 182. Further, the controller 150 may implement the cleaning process 200 as described in relation to Figure 10. As nonlimiting examples, the controller 150 may include a programmable controller, a logic controller, or a combination thereof. The controller 150 may include one or more processors 152. The one or more processors 152 may include processing circuitry (e.g., central processing unit), one or more microcontrollers, an application-specific integrated circuit, or a combination thereof.

[0060] The controller 150 may further include memory 154. The memory 154 may include one or more memory circuits. In aspects, the memory 154 may store a program for implementation of the cleaning process 200 described below in relation to Figure 10. In one or more implementations, the memory 154 may include random access memory (RAM), read-only memory (ROM), or a combination thereof. During operation of the application material wiping apparatus 100, the controller 150, including the one or more processors 152, may execute instructions stored on the memory 154. For example, thecontroller 150, including the one or more processors 152, may execute instructions stored on the memory 154 to operate the actuator 110, thereby moving the application material wiping head assembly 102 (shown in Figure 1 ). Alternatively, or in combination, the controller 150, including the one or more processors 152, may execute instructions stored on the memory 154 to read the base unit temperature sensor 180 and the chamber temperature sensor 182 and operate the base unit heating element 160 and the chamber heating element 162 based on the reading of the base unit temperature sensor 180 and the chamber temperature sensor 182.

[0061] Figure 10 illustrates an example of a cleaning process 200 for implementing an application material wiping apparatus according to aspects of the disclosure. Application material wiping apparatuses shown and / or described herein may be used in part to conduct one or more steps of the cleaning process 200. For explanatory purposes, the cleaning process 200 shown in Figure 10 is primarily described herein with reference to the application material wiping apparatus 100 (shown in Figure 1 ). However, the cleaning process 200 shown in Figure 10 is not limited to the application material wiping apparatus 100, and one or more blocks (or operations) of the cleaning process 200 may be performed by one or more other components of other suitable apparatuses, devices, or systems. Further for explanatory purposes, some of the blocks of the cleaning process 200 are described herein as occurring in serial, or linearly. However, multiple blocks of the cleaning process 200 may occur in parallel. In addition, the blocks of the cleaning process 200 need not be performed in the order shown and / or one or more blocks of the cleaning process 200 need not be performed and / or can be replaced by other operations.

[0062] At block 202, an actuator moves an application material wiping head assembly into a base unit. As non-limiting examples, the actuator may take the form of a pneumatic actuator, a rotary actuator, a hydraulic actuator, or a screw actuator. In aspects, the actuator may be the actuator 110 described herein.

[0063] At block 204, a heating element within the base unit heats the application material wiping head assembly. The heating element may heat the application material wiping head assembly to at least a predetermined temperature and / or predeterminedtemperature range. By heating the application material wiping head assembly with the heating element, the application material wiping head assembly may readily remove residual application material from an applicator head.

[0064] At block 206, the actuator moves the heated application material wiping head assembly out of the base unit. The actuator may position the application material wiping head assembly in a manner that the applicator head may engage the application material wiping head assembly.

[0065] At block 208, the heated application material wiping head assembly receives the applicator head. The applicator head may be moved horizontally (e.g., back and forth) and / or vertically (e.g., up and down) relative to the application material wiping head assembly. As a result, the applicator head may engage the application material wiping head assembly, and the application material wiping head assembly may wipe the residual application material from the applicator head, including a nozzle tip of the applicator head.

[0066] Aspects of the disclosure may implement the application material wiping apparatus 100 and / or the applicator head 130 in conjunction with a coating machine. In aspects, the coating machine may be for coating an EV battery anode and cathode electrode. Additionally, multiple kinds of the applicator heads 130 may be used. The multiple kinds of the applicator heads 130 have different specifications in terms of, for example, applicator head width, coating layer thickness, etc.

[0067] Aspects of the disclosure may implement the application material wiping apparatus 100 and / or the applicator head 130 in conjunction with a slitting machine for EV battery anode and cathode electrode manufacturing. Moreover, the applicator head 130 may be configured for high line speed application of adhesive material to the EV battery anode and cathode electrode. Additionally, multiple kinds of the applicator heads 130 may be used. The multiple kinds of the applicator heads 130 have different specifications in terms of, for example, applicator head width, coating layer thickness, etc.

[0068] In aspects, the electrode sheet may be an electrode coil sheet, an electrode aluminum foil sheet, an EV electrode aluminum foil sheet, a thin aluminum sheet, an anode electrode, a cathode electrode, an electrode substrate, an EV battery component, and / or the like. In aspects, the application material may be a glue, an adhesive, a hot melt glue, a hot melt adhesive and / or the like.

[0069] In aspects, the applicator head 130 may be configured to apply the application material on the electrode sheet. In particular, the applicator head 130 may be configured to apply the application material on two edges of the electrode sheet and / or the applicator head 130 may be configured to apply the application material on two opposite sides of the electrode sheet.

[0070] The following are a number of nonlimiting EXAMPLES of aspects of the disclosure.

[0071] One EXAMPLE: an application material wiping apparatus includes an application material wiping head assembly configured to remove application material from an applicator head. The application material wiping apparatus in addition includes a base unit comprising a first heating element configured to heat the application material wiping head assembly from a first temperature to a second temperature greater than the first temperature. The apparatus moreover includes an actuator, where in response to the application material wiping head assembly reaching at least the second temperature, the actuator is configured to move the application material wiping head assembly from a heating position to a cleaning position different from the heating position.

[0072] The above-noted EXAMPLE may further include any one or a combination of more than one of the following EXAMPLES: The application material wiping apparatus of the above-noted EXAMPLE where in the cleaning position, the application material wiping head assembly is configured to remove the application material from the applicator head. The application material wiping apparatus of the above-noted EXAMPLE includes a cleaning curtain configured to remove the application material removed from the applicator head by the application material wiping head assembly. The application material wiping apparatus of the above-noted EXAMPLE includes acleaning curtain, where in response to the actuator moving the application material wiping head assembly from the cleaning position to the heating position, the cleaning curtain is configured to remove the application material removed from the applicator head by the application material wiping head assembly. The application material wiping apparatus of the above-noted EXAMPLE includes a retainer plate that couples the cleaning curtain with the base unit. The application material wiping apparatus of the above-noted EXAMPLE where the retainer plate at least partially covers the cleaning curtain. The application material wiping apparatus of the above-noted EXAMPLE where the cleaning curtain comprises rubber. The application material wiping apparatus of the above-noted EXAMPLE where the cleaning curtain comprises a polymer-based material. The application material wiping apparatus of the above-noted EXAMPLE where the base unit comprises a reservoir configured to receive the application material removed by the cleaning curtain. The application material wiping apparatus of the above-noted EXAMPLE where the base unit comprises a reservoir configured to receive the application material from the application material wiping head assembly. The application material wiping apparatus of the above-noted EXAMPLE where the application material wiping head assembly comprises a cleaning lip configured to contact a nozzle tip of the applicator head. The application material wiping apparatus of the above-noted EXAMPLE includes a chamber configured to receive the applicator head. The application material wiping apparatus of the above-noted EXAMPLE includes a chamber configured to receive the applicator head, the chamber comprising a second heating element configured to heat the applicator head. The slitting machine of the above-noted EXAMPLE includes the applicator head. The slitting machine of the abovenoted EXAMPLE where multiple kinds of the applicator heads are used. The coating machine of the above-noted EXAMPLE includes the applicator head. The coating machine of the above-noted EXAMPLE where multiple kinds of the applicator heads are used.

[0073] One EXAMPLE: an application material wiping apparatus includes an application material wiping head assembly configured to remove application material from an applicator head, the application material wiping head assembly comprising: afirst structure, a second structure, and a cleaning component positioned between the first structure and the second structure. The application material wiping apparatus in addition includes an actuator configured to: move the application material wiping head assembly into a base unit to heat the cleaning component, and move the application material wiping head assembly out of the base unit such that the cleaning component is in position to contact the applicator head.

[0074] The above-noted EXAMPLE may further include any one or a combination of more than one of the following EXAMPLES: The application material wiping apparatus of the above-noted EXAMPLE where: the first structure comprises a first inclined surface, the second structure comprises a second inclined surface, and in response to the cleaning component contacting the applicator head, the cleaning component removes the application material from the applicator head, and at least one of the first inclined surface or the second inclined surface receive the removed application material. The application material wiping apparatus of the above-noted EXAMPLE includes a reservoir configured to receive the removed application material from the first inclined surface and / or the second inclined surface. The application material wiping apparatus of the above-noted EXAMPLE where: the first structure comprises a first diagonal surface, the second structure comprises a second diagonal surface, and in response to the cleaning component contacting the applicator head, the cleaning component removes the application material from the applicator head, and at least one of the first diagonal surface or the second diagonal surface receive the removed application material. The application material wiping apparatus of the abovenoted EXAMPLE includes a reservoir configured to receive the removed application material from the first diagonal surface and / or the second diagonal surface. The application material wiping apparatus of the above-noted EXAMPLE where the actuator is further configured to cause the application material wiping head assembly to contact a cleaning curtain to remove the application material from the application material wiping head assembly. The application material wiping apparatus of the above-noted EXAMPLE includes a retainer plate configured to couple the cleaning curtain with the base unit. The application material wiping apparatus of the above-noted EXAMPLEwhere the base unit comprises a heating element configured to heat the cleaning component. The application material wiping apparatus of the above-noted EXAMPLE where the base unit comprises a heating element configured to heat the cleaning component to a temperature that causes the application material to flow. The slitting machine of the above-noted EXAMPLE includes the applicator head. The slitting machine of the above-noted EXAMPLE where multiple kinds of the applicator heads are used. The coating machine of the above-noted EXAMPLE includes the applicator head. The coating machine of the above-noted EXAMPLE where multiple kinds of the applicator heads are used.

[0075] One EXAMPLE: a method includes moving, by an actuator, an application material wiping head assembly into a base unit. The method in addition includes heating, by a heating element within the base unit, the application material wiping head assembly. The method moreover includes moving, by the actuator, the heated application material wiping head assembly out of the base unit. The method also includes receiving, by the heated application material wiping head assembly, the applicator head.

[0076] The above-noted EXAMPLE may further include any one or a combination of more than one of the following EXAMPLES: The method of the above-noted EXAMPLE where receiving, by the heated application material wiping head assembly, the applicator head comprises: receiving the applicator head in a first direction, and receiving the applicator head in a second direction opposite the first direction. The method of the above-noted EXAMPLE where receiving, by the heated application material wiping head assembly, the applicator head comprises receiving, by a cleaning component of the heated application material wiping head assembly, a nozzle tip of the applicator head. The method of the above-noted EXAMPLE includes, removing, by a cleaning curtain coupled with the base unit, the application material received from the applicator head by the heated application material wiping head assembly. The method of the above-noted EXAMPLE where: the moving, by the actuator, the application material wiping head assembly comprises moving the application material wiping head assembly along a first direction, and the receiving, by the heated application materialwiping head assembly, the applicator head comprises moving the applicator head along a second direction perpendicular to the first direction.

[0077] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0078] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or extending "onto" another element, it can be directly on or extend directly onto another element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or extending "directly onto" another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being "over" or extending "over" another element, it can be directly over or extend directly over another element or intervening elements may also be present. In contrast, when an element is referred to as being "directly over" or extending "directly over" another element, there are no intervening elements present. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to another element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0079] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0080] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including" when used herein specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0081] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0082] It should also be noted that the software implementations of the disclosure as described herein are optionally stored on a tangible storage medium, such as: a magnetic medium such as a disk or tape; a magneto-optical or optical medium such as a disk; or a solid state medium such as a memory card or other package that houses one or more read-only (non-volatile) memories, random access memories, or other rewritable (volatile) memories. A digital file attachment to email or other self-contained information archive or set of archives is considered a distribution medium equivalent to a tangible storage medium. Accordingly, the disclosure is considered to include a tangible storage medium or distribution medium, as listed herein and including art- recognized equivalents and successor media, in which the software implementations herein are stored.

[0083] Additionally, the various aspects of the disclosure may be implemented in a non-generic computer implementation. Moreover, the various aspects of the disclosure set forth herein improve the functioning of the system as is apparent from the disclosure hereof. Furthermore, the various aspects of the disclosure involve computer hardware that it specifically programmed to solve the complex problem addressed bythe disclosure. Accordingly, the various aspects of the disclosure improve the functioning of the system overall in its specific implementation to perform the process set forth by the disclosure and as defined by the claims.

[0084] Aspects of the disclosure may be implemented in any type of computing devices, such as, e.g., a desktop computer, personal computer, a laptop / mobile computer, a personal data assistant (PDA), a mobile phone, a tablet computer, cloud computing device, and the like, with wired / wireless communications capabilities via the communication channels.

[0085] An artificial intelligence and / or machine learning may utilize any number of approaches including one or more of cybernetics and brain simulation, symbolic, cognitive simulation, logic-based, anti-logic, knowledge-based, sub-symbolic, embodied intelligence, computational intelligence and soft computing, machine learning and statistics, and the like.

[0086] The many features and advantages of the disclosure are apparent from the detailed specification, and, thus, it is intended by the appended claims to cover all such features and advantages of the disclosure which fall within the true spirit and scope of the disclosure. Further, since numerous modifications and variations will readily occur to those skilled in the art, it is not desired to limit the disclosure to the exact construction and operation illustrated and described, and, accordingly, all suitable modifications and equivalents may be resorted to that fall within the scope of the disclosure.

Claims

CLAIMS:1 . An application material wiping apparatus, comprising: an application material wiping head assembly configured to remove application material from an applicator head; a base unit comprising a first heating element configured to heat the application material wiping head assembly from a first temperature to a second temperature greater than the first temperature; and an actuator, wherein in response to the application material wiping head assembly reaching at least the second temperature, the actuator is configured to move the application material wiping head assembly from a heating position to a cleaning position different from the heating position.

2. The application material wiping apparatus of claim 1 , wherein in the cleaning position, the application material wiping head assembly is configured to remove the application material from the applicator head.

3. The application material wiping apparatus of claim 1 , further comprising a cleaning curtain configured to remove the application material removed from the applicator head by the application material wiping head assembly.

4. The application material wiping apparatus of claim 1 , further comprising a cleaning curtain, wherein in response to the actuator moving the application material wiping head assembly from the cleaning position to the heating position, the cleaning curtain is configured to remove the application material removed from the applicator head by the application material wiping head assembly.

5. The application material wiping apparatus of claim 4, further comprising a retainer plate that couples the cleaning curtain with the base unit.

6. The application material wiping apparatus of claim 5, wherein the retainer plate is configured to at least partially cover the cleaning curtain.

7. The application material wiping apparatus of claim 4, wherein the cleaning curtain comprises rubber.

8. The application material wiping apparatus of claim 4, wherein the cleaning curtain comprises a polymer-based material.

9. The application material wiping apparatus of claim 4, wherein the base unit comprises a reservoir configured to receive the application material removed by the cleaning curtain.

10. The application material wiping apparatus of claim 4, wherein the base unit comprises a reservoir configured to receive the application material from the application material wiping head assembly.11 . The application material wiping apparatus of claim 1 , wherein the application material wiping head assembly comprises a cleaning lip configured to contact a nozzle tip of the applicator head.

12. The application material wiping apparatus of claim 1 , wherein the application material wiping head assembly comprises a cleaning component configured to contact the applicator head.

13. The application material wiping apparatus of claim 1 , further comprising a chamber configured to receive the applicator head.

14. The application material wiping apparatus of claim 1 , further comprising a chamber configured to receive the applicator head, the chamber comprising a second heating element configured to heat the applicator head.

15. The application material wiping apparatus of claim 1 , wherein the applicator head comprises a nozzle head, a slot coating applicator, a metering slot coating applicator, a band coat dispenser, a band coat applicator, a glue applicator, an adhesive applicator, a hot melt glue applicator, and / or a hot melt adhesive applicator.

16. The application material wiping apparatus of claim 1 , wherein the application material comprises a glue, an adhesive, a hot melt glue, and / or a hot melt adhesive.

17. The application material wiping apparatus of claim 1 , wherein the actuator comprises a linear actuator, an electric actuator, a pneumatic actuator, a rotary actuator, a hydraulic actuator, a screw actuator, one or more motors, gears, clutches, drive mechanisms, and / or position sensors.

18. The application material wiping apparatus of claim 12, wherein the cleaning component comprises a cleaning surface, a cleaning knife, and / or a cleaning lip.

19. The application material wiping apparatus of claim 12, wherein the cleaning component is formed from rubber and / or a polymer-based material.

20. A slitting machine comprising the application material wiping apparatus of claim 1 and further comprising the applicator head.21 . The slitting machine of claim 20, wherein multiple kinds of the applicator heads are used.

22. A coating machine comprising the application material wiping apparatus of claim 1 and further comprising the applicator head.

23. The coating machine of claim 22, wherein multiple kinds of the applicator heads are used.

24. An application material wiping apparatus, comprising: an application material wiping head assembly configured to remove application material from an applicator head, the application material wiping head assembly comprising: a first structure, a second structure, and a cleaning component positioned between the first structure and the second structure; and an actuator configured to: move the application material wiping head assembly into a base unit to heat the cleaning component, and move the application material wiping head assembly out of the base unit such that the cleaning component is in position to contact the applicator head.

25. The application material wiping apparatus of claim 24, wherein: the first structure comprises a first inclined surface, the second structure comprises a second inclined surface, and in response to the cleaning component contacting the applicator head, the cleaning component removes the application material from the applicator head, and at least one of the first inclined surface or the second inclined surface receive the removed application material.

26. The application material wiping apparatus of claim 25, further comprising a reservoir configured to receive the removed application material from the first inclined surface and / or the second inclined surface.

27. The application material wiping apparatus of claim 24, wherein: the first structure comprises a first diagonal surface, the second structure comprises a second diagonal surface, and in response to the cleaning component contacting the applicator head, the cleaning component removes the application material from the applicator head, and at least one of the first diagonal surface or the second diagonal surface receive the removed application material.

28. The application material wiping apparatus of claim 27, further comprising a reservoir configured to receive the removed application material from the first diagonal surface and / or the second diagonal surface.

29. The application material wiping apparatus of claim 24, wherein the actuator is further configured to cause the application material wiping head assembly to contact a cleaning curtain to remove the application material from the application material wiping head assembly.

30. The application material wiping apparatus of claim 29, further comprising a retainer plate configured to couple the cleaning curtain with the base unit.31 . The application material wiping apparatus of claim 24, wherein the base unit comprises a heating element configured to heat the cleaning component.

32. The application material wiping apparatus of claim 24, wherein the base unit comprises a heating element configured to heat the cleaning component to a temperature that causes the application material to flow.

33. A slitting machine comprising the application material wiping apparatus of claim 24 and further comprising the applicator head.

34. The slitting machine of claim 33, wherein multiple kinds of the applicator heads are used.

35. The application material wiping apparatus of claim 24, wherein the applicator head comprises a nozzle head, a slot coating applicator, a metering slot coating applicator, a band coat dispenser, a band coat applicator, a glue applicator, an adhesive applicator, a hot melt glue applicator, and / or a hot melt adhesive applicator.

36. The application material wiping apparatus of claim 24, wherein the application material comprises a glue, an adhesive, a hot melt glue, and / or a hot melt adhesive.

37. The application material wiping apparatus of claim 24, wherein the actuator comprises a linear actuator, an electric actuator, a pneumatic actuator, a rotary actuator, a hydraulic actuator, a screw actuator, one or more motors, gears, clutches, drive mechanisms, and / or position sensors.

38. The application material wiping apparatus of claim 24, wherein the cleaning component comprises a cleaning surface, a cleaning knife, and / or a cleaning lip.

39. The application material wiping apparatus of claim 24, wherein the cleaning component is formed from rubber and / or a polymer-based material.

40. A coating machine comprising the application material wiping apparatus of claim 24 and further comprising the applicator head.41 . The coating machine of claim 40, wherein multiple kinds of the applicator heads are used.

42. A method for cleaning an applicator head, the method comprising: moving, by an actuator, an application material wiping head assembly into a base unit; heating, by a heating element within the base unit, the application material wiping head assembly; moving, by the actuator, the heated application material wiping head assembly out of the base unit; and receiving, by the heated application material wiping head assembly, the applicator head.

43. The method of claim 42, wherein receiving, by the heated application material wiping head assembly, the applicator head comprises: receiving the applicator head in a first direction, and receiving the applicator head in a second direction opposite the first direction.

44. The method of claim 42, wherein receiving, by the heated application material wiping head assembly, the applicator head comprises receiving, by a cleaning component of the heated application material wiping head assembly, a nozzle tip of the applicator head.

45. The method of claim 42, further comprising, removing, by a cleaning curtain coupled with the base unit, the application material received from the applicator head by the heated application material wiping head assembly.

46. The method of claim 42, wherein:the moving, by the actuator, the application material wiping head assembly comprises moving the application material wiping head assembly along a first direction, and the receiving, by the heated application material wiping head assembly, the applicator head comprises moving the applicator head along a second direction perpendicular to the first direction.

47. The method of claim 42, wherein the applicator head comprises a nozzle head, a slot coating applicator, a metering slot coating applicator, a band coat dispenser, a band coat applicator, a glue applicator, an adhesive applicator, a hot melt glue applicator, and / or a hot melt adhesive applicator.

48. The method of claim 42, wherein the application material comprises a glue, an adhesive, a hot melt glue, and / or a hot melt adhesive.

49. The method of claim 42, wherein the actuator comprises a linear actuator, an electric actuator, a pneumatic actuator, a rotary actuator, a hydraulic actuator, a screw actuator, one or more motors, gears, clutches, drive mechanisms, and / or position sensors.

50. The method of claim 44, wherein the cleaning component comprises a cleaning surface, a cleaning knife, and / or a cleaning lip.51 . The method of claim 44, wherein the cleaning component is formed from rubber and / or a polymer-based material.

Images