Detection device and detection method

Abstract

Provided is a technology that makes it possible to detect the resistance of a contact portion of a seal member of a plating device.　A detection device 1 comprises a plate member 60 that is held by a holder during resistance detection that detects the resistance of a contact portion 51 of a seal member 50 and has a prescribed surface 61 that is opposite the contact portion when the plate member is being held by the holder during the resistance detection, a first electrode 70 that is provided to the prescribed surface of the plate member and contacts the contact portion during the resistance detection, a second electrode 71 that is provided to the prescribed surface of the plate member and contacts a different portion of the contact portion from the portion that the first electrode contacts during the resistance detection, and a resistance detector 80 that is electrically connected to the first electrode and the second electrode and detects the resistance of the contact portion by detecting the resistance between the first electrode and the second electrode during the resistance detection.

Description

Detection device and detection method

[0001] The present invention relates to a detection device and a detection method.

[0002] Conventionally, plating devices for plating substrates have been known (see, for example, Patent Documents 1 and 2). Specifically, such plating devices include a plating tank in which an anode is disposed, a holder configured to hold the substrate as a cathode so that the surface to be plated of the substrate faces the anode during plating processing in which plating is performed on the substrate, and a seal member having a contact portion configured to come into contact with the surface to be plated of the substrate during plating processing.

[0003] Patent No. 6975650 Patent No. 7194305

[0004] In the plating apparatus described above, a conductive coating containing plating components may be formed on the sealing member, particularly around the contact area. In this case, there is a risk that the plating components may precipitate on the conductive coating. Therefore, there is a need for a technology that can detect the resistance of the sealing member in order to determine whether a conductive coating has been formed.

[0005] The present invention has been made in view of the above, and one of its objects is to provide a technique capable of detecting the resistance of a sealing member of a plating apparatus.

[0006] (Aspect 1) In order to achieve the above object, a detection device according to one aspect of the present invention is a detection device for detecting the resistance of a sealing member of a plating device, the plating device comprising: a plating tank in which an anode is disposed; a holder configured to hold a substrate as a cathode such that a surface to be plated of the substrate faces the anode during a plating process in which plating is performed on the substrate; and the sealing member having a contact portion configured to come into contact with the surface to be plated of the substrate during the plating process, the detection device being configured to be held by the holder instead of the substrate during resistance detection to detect the resistance of the contact portion, and The device comprises: a plate member having a predetermined surface that faces the contact portion when held in the holder during resistance detection; a first electrode that is arranged on the predetermined surface of the plate member and configured to contact the contact portion during resistance detection; a second electrode that is arranged on the predetermined surface of the plate member and configured to contact a portion of the contact portion that is different from the portion that the first electrode contacts during resistance detection; and a resistance detector that is electrically connected to the first electrode and the second electrode and configured to detect the resistance of the contact portion by detecting the resistance between the first electrode and the second electrode during resistance detection.

[0007] According to this aspect, the resistance detector can detect the resistance of the contact portion of the seal member where the first electrode and the second electrode come into contact.

[0008] (Aspect 2) In the above aspect 1, the contact portion of the sealing member may be configured in a ring shape, the first electrode may have a first ring-shaped portion, the second electrode may have a second ring-shaped portion, and the second ring-shaped portion may be positioned radially closer to the center of the first ring-shaped portion than the first ring-shaped portion and may have a diameter smaller than the diameter of the first ring-shaped portion.

[0009] According to this aspect, the resistance of the annular contact portion of the seal member can be detected effectively.

[0010] (Aspect 3) In Aspect 2, a groove configured in an annular shape may be provided on the predetermined surface of the plate member, and the groove may be configured so that the contact portion fits into the groove when the resistance is detected.

[0011] (Aspect 4) In Aspect 3 above, the first electrode may have a plurality of first branch electrodes extending from the first annular portion toward the second annular portion, the second electrode may have a plurality of second branch electrodes extending from the second annular portion toward the first annular portion, the plurality of first branch electrodes having portions arranged in the grooves, and the plurality of second branch electrodes may have portions arranged in the grooves.

[0012] According to this aspect, the contact area between the contact portion of the seal member and the electrode can be easily increased, thereby making it possible to effectively detect the resistance of the contact portion of the seal member.

[0013] (Aspect 5) In any one of Aspects 1 to 4 above, the plate member may be held by the holder during the plating process so that the predetermined surface contacts the back surface of the substrate opposite the surface to be plated.

[0014] (Aspect 6) In order to achieve the above object, a detection method according to one aspect of the present invention is a detection method using a detection device according to any one of Aspects 1 to 5 above, and includes: while the plate member is held by the holder, bringing the first electrode into contact with the contact portion of the seal member and bringing the second electrode into contact with a portion of the contact portion of the seal member that is different from the portion with which the first electrode makes contact; and detecting the resistance between the first electrode and the second electrode using the resistance detector to detect the resistance of the contact portion of the seal member.

[0015] According to this aspect, the resistance of the contact portion of the seal member can be detected.

[0016] 5A is a perspective view showing the overall configuration of a plating apparatus according to an embodiment; FIG. 5B is a schematic plan view showing the overall configuration of a plating apparatus according to an embodiment; FIG. 5C is a schematic view showing a state in which a substrate according to an embodiment is immersed in a plating solution; FIG. 5A is an enlarged cross-sectional view schematically showing a portion (portion A1 in FIG. 3) of a substrate holder according to an embodiment; FIG. 5B is a schematic plan view of a sealing member according to an embodiment; FIG. 5C is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive coating; FIG. 5D is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive coating; FIG. 5E is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive coating; FIG. 5F is a schematic view for explaining a detection device according to an embodiment; FIG. 5G is a schematic view for explaining a detection device according to an embodiment; FIG. 5H is a schematic view showing a state in which a plate member according to an embodiment is held by a substrate holder; FIG. 5I is an example of a flowchart for explaining a detection method according to an embodiment; FIG. 5I is a schematic bottom view of a plate member of a detection device according to a first modification; FIG. 5I is a schematic view showing an enlarged view of a portion of a first electrode and a second electrode according to a first modification; FIG. 5I is a schematic enlarged cross-sectional view showing a peripheral configuration of a groove in a plate member according to a first modification; 10 is a schematic diagram for explaining a detection device according to Modification 2. FIG. 11 is a schematic diagram for explaining a detection device according to Modification 2. FIG.

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are diagrammatically illustrated to facilitate understanding of the characteristics of the components, and the dimensional ratios of the components may not be the same as those in reality. In addition, some of the drawings show an X-Y-Z Cartesian coordinate system for reference. In these Cartesian coordinate systems, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0018] (Embodiment 1) Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 of this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0019] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the load port 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrates via a temporary stage (not shown).

[0020] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are optional. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air within a pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid within the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid within the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are optional.

[0021] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 applies plating to the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0022] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are optional. The transport device 700 is a device for transporting substrates between multiple modules within the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0023] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette in the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, and the like of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0024] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 platings the substrate.

[0025] The transfer device 700 transfers the substrate after plating to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate after cleaning to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0026] It should be noted that the configuration of the plating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations shown in FIGS.

[0027] Next, a description will be given of the plating module 400. Since the multiple plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, only one plating module 400 will be described.

[0028] FIG. 3 is a schematic diagram of the configuration of a plating module 400 of a plating apparatus 1000 according to this embodiment. FIG. 4 is a schematic diagram showing a substrate Wf immersed in a plating solution Ps. The plating apparatus 1000 according to this embodiment is, for example, a cup-type plating apparatus. The plating module 400 of the plating apparatus 1000 mainly includes a plating tank 10, an overflow tank 15, a substrate holder 20, a rotation mechanism 30, a tilting mechanism 35, and an elevation mechanism 36. Note that in FIG. 3, a cross section of part of the configuration of the plating module 400 (such as the plating tank 10, the overflow tank 15, and the substrate holder 20) is shown schematically.

[0029] The plating tank 10 according to this embodiment is a bottomed container having an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a, with the upper portion of the outer peripheral wall 10b being open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape, for example.

[0030] A plating solution Ps is stored inside the plating tank 10. The plating tank 10 is provided with a supply port (not shown) for supplying the plating solution Ps to the plating tank 10. The plating solution Ps may be any solution containing ions of the metal elements that constitute the plating film, and specific examples thereof are not particularly limited. However, the plating solution Ps according to this embodiment, for example, contains tin (Sn) ions and further contains silver (Ag) ions. That is, the plating process performed in this embodiment is, for example, a "tin-silver plating process." However, the specific components of the plating solution Ps are not limited thereto and may be appropriately determined depending on the type of plating film.

[0031] An anode 11 is disposed inside the plating solution Ps in the plating tank 10. The specific type of the anode 11 is not particularly limited, and a soluble anode or an insoluble anode can be used. In this embodiment, an insoluble anode is used as the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like can be used.

[0032] The overflow tank 15 is a bottomed container disposed in a radially outer region of the plating tank 10. The overflow tank 15 is a tank provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The overflow tank 15 is provided with a discharge port (not shown) for discharging the plating solution Ps from the overflow tank 15. The plating solution Ps discharged from the discharge port is then temporarily stored in a reservoir tank (not shown) and then supplied again to the plating tank 10 from a supply port.

[0033] A porous ion resistor 12 may be disposed above the anode 11 inside the plating tank 10. The ion resistor 12 is configured as a porous plate member having a plurality of holes (pores). The plating solution Ps below the ion resistor 12 can pass through the ion resistor 12 and flow above the ion resistor 12. The ion resistor 12 is a member provided to homogenize the electric field formed between the anode 11 and the substrate Wf. In this way, the plating apparatus 1000 includes the ion resistor 12, which makes it easy to homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0034] The substrate holder 20 is configured to hold the substrate Wf so that the surface to be plated Wfa of the substrate Wf faces the anode 11 during "plating processing" in which plating is performed on the substrate Wf as a cathode. In this embodiment, the substrate Wf is positioned above the anode 11. Note that the substrate holder 20 according to this embodiment holds a plate member 60 of the detection device 1 (described later) instead of the substrate Wf during "resistance detection" (described later). The substrate holder 20 according to this embodiment is an example of a "holder".

[0035] The specific configuration of the substrate holder 20 is not particularly limited as long as it can hold the substrate Wf, and any known substrate holder can be used. As an example, the substrate holder 20 according to this embodiment includes a first holding member 21 and a second holding member 22. As an example, the second holding member 22 is connected to the first holding member 21.

[0036] The first holding member 21 is configured to hold the back surface Wfb of the substrate Wf (the surface opposite to the surface Wfa to be plated). Specifically, the first holding member 21 according to this embodiment holds the back surface Wfb of the substrate Wf, for example, via a back plate 23 and a pressing member 24, which will be described later. The second holding member 22 is configured to hold the outer peripheral edge of the surface Wfa to be plated of the substrate Wf via a seal member 50, which will be described later. The substrate holder 20 holds the substrate Wf so that the substrate Wf is sandwiched between the first holding member 21 and the second holding member 22.

[0037] The second holding member 22 also has the function of holding (supporting) the seal member 50 (described later) from below. This second holding member 22 is a member that is generally referred to as a "seal ring holder (SRH)." The first holding member 21 according to this embodiment has a disk shape. The second holding member 22 according to this embodiment has an annular shape.

[0038] 3, the plating module 400 of the plating apparatus 1000 may further include a back plate 23 and a pressing member 24. The back plate 23 is configured by a plate member arranged to contact the back surface Wfb of the substrate Wf. The back plate 23 is provided mainly for applying pressure to the substrate Wf.

[0039] The pressing member 24 is a member that is disposed between the back plate 23 and the first holding member 21 of the substrate holder 20 and that presses the back plate 23 toward the substrate Wf (downward). The number of pressing members 24 that are disposed is not particularly limited, but as an example, a plurality of pressing members 24 according to this embodiment are disposed. Specifically, a plurality of pressing members 24 according to this embodiment are disposed in the circumferential direction of the substrate holder 20.

[0040] The specific configuration of the pressing member 24 is not particularly limited, and known techniques can be applied. Specific examples of the pressing member 24 include an air cylinder or an air bag that expands and contracts using air. Alternatively, a spring or the like can be used as the pressing member 24. When an air cylinder or an air bag is used as the pressing member 24, the plating module 400 may include a compressor (not shown) outside the plating tank 10 for supplying air to the pressing member 24.

[0041] The plating module 400 includes the pressing member 24 and the back plate 23, so that the substrate Wf can be brought into effective contact with the sealing member 50 described below. Note that the plating module 400 may also be configured without the back plate 23 or the pressing member 24.

[0042] The substrate holder 20 is connected to a rotation shaft 31 of a rotation mechanism 30. The rotation mechanism 30 is a mechanism for rotating the substrate holder 20. As the rotation mechanism 30, a known mechanism such as a motor can be used.

[0043] The tilting mechanism 35 is a mechanism for tilting the rotation mechanism 30 and the substrate holder 20. A known tilting mechanism such as a piston cylinder can be used as the tilting mechanism 35. The lifting mechanism 36 is supported by a support shaft 37 extending in the vertical direction. The lifting mechanism 36 is a mechanism for raising and lowering the substrate holder 20, the rotation mechanism 30, and the tilting mechanism 35 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 36.

[0044] 4 , when plating the plating-target surface Wfa of the substrate Wf, the lifting mechanism 36 moves the substrate holder 20 downward to immerse the substrate Wf in the plating solution Ps in the plating tank 10. The rotation mechanism 30 rotates the substrate holder 20. When immersing the substrate Wf in the plating solution Ps, the tilting mechanism 35 may tilt the substrate holder 20 as necessary. After the substrate Wf is immersed in the plating solution Ps, electricity flows between the anode 11 and the substrate Wf by an electric current applying device (not shown). As a result, a plating film is formed on the plating-target surface Wfa of the substrate Wf.

[0045] The operation of the plating module 400 is controlled by a control module 800. The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the controlled units of the plating module 400 by operating the processor 801 based on commands from a program stored in the storage device 802.

[0046] 5A is an enlarged cross-sectional view schematically illustrating a portion (portion A1 in FIG. 3) of the substrate holder 20. The plating module 400 of the plating apparatus 1000 according to this embodiment includes a contact member 40. The contact member 40 is a member that contacts the outer periphery of the plating surface Wfa of the substrate Wf to supply electricity to the substrate Wf. As an example, the contact member 40 according to this embodiment is disposed on the second holding member 22 of the substrate holder 20. A plurality of contact members 40 may be disposed in the circumferential direction of the substrate holder 20. Note that the specific configuration of the contact member 40 is similar to that of a known contact member, such as that disclosed in Patent Document 2, and therefore further detailed description will be omitted.

[0047] The plating module 400 also includes a seal member 50. Fig. 5(B) is a schematic plan view of the seal member 50. With reference to Figs. 5(A) and 5(B), the seal member 50 according to this embodiment is provided mainly to prevent the plating solution Ps from contacting the contact member 40 when the substrate Wf is immersed in the plating solution Ps. Specifically, the seal member 50 according to this embodiment is, as an example, disposed on the second holding member 22 of the substrate holder 20.

[0048] The seal member 50 according to this embodiment has a main body portion 52 and a contact portion 51. The main body portion 52 according to this embodiment is configured in an annular shape, for example.

[0049] The contact portion 51 is configured to come into contact with the plating surface Wfa of the substrate Wf during plating processing. Specifically, the contact portion 51 according to the present embodiment is configured, for example, to protrude upward from an edge portion (inner peripheral edge portion) located on the radial center side of the main body portion 52 as a starting point.

[0050] The contact portion 51 according to this embodiment is configured in an annular shape (i.e., has an annular shape). That is, the contact portion 51 according to this embodiment is configured by an annular protrusion. However, this is just one example of the configuration of the contact portion 51, and the specific configuration of the contact portion 51 is not limited to this.

[0051] The material of the seal member 50 is not particularly limited, but the seal member 50 according to this embodiment is made of a non-conductive material.

[0052] The configuration of the seal member 50 is similar to that of a known seal member such as that disclosed in Patent Document 2, and therefore further detailed description will be omitted. Furthermore, as illustrated in Fig. 5(A), the plating module 400 may include an inner ring 55 as a member for effectively holding the seal member 50 to the second holding member 22.

[0053] Here, a conductive coating 90 may be formed around the contact portion 51 of the sealing member 50. As an example, a metal component (for example, Sn(divalent)) contained in the plating solution Ps may be oxidized, resulting in the deposition of conductive metal ions (for example, Sn(tetravalent)) and / or conductive amorphous oxides (for example, amorphous oxides of Sn (SnOx(OH)y)) as the conductive coating 90 around the contact portion 51. When such a conductive coating 90 is formed, the conductive coating 90 functions as a power supply path for the plating current, which may result in the deposition of plating components (for example, Sn or Ag) on ​​the conductive coating 90.

[0054] 6, 7, and 8 are schematic cross-sectional views illustrating an example of a formation pattern of the conductive coating 90. For example, as illustrated in Fig. 6, if a defect (Df) or the like occurs in a part of the contact portion 51 of the sealing member 50, the conductive coating 90 may be formed starting from the defect (Df) in the contact portion 51. Then, a plating component may be precipitated on the conductive coating 90, resulting in the formation of a precipitated portion 91.

[0055] 7, a plating film 92 may be formed in the vicinity of the contact point between the contact portion 51 of the seal member 50 and the substrate Wf. In this case, too, there is a risk that the plating film 92 may cause the formation of a conductive film 90.

[0056] As shown in FIG. 8, the conductive coating 90 may be further formed on the seal member 50 from the contact portion 51 to the inner ring 55 side.

[0057] As described above, when the conductive coating 90 is formed around the contact portion 51 of the sealing member 50 and plating components are deposited on this conductive coating 90, the plating components that should be formed on the substrate Wf are taken up by the deposition on the conductive coating 90, which may result in a deterioration in the uniformity of the thickness of the plating film formed on the substrate Wf. To address this problem, the plating module 400 of the plating apparatus 1000 according to this embodiment is equipped with a detection device 1, which will be described below.

[0058] First, when a conductive coating 90 is formed around the contact portion 51 of the seal member 50, the resistance around the contact portion 51 decreases. Therefore, by detecting the resistance of the contact portion 51 of the seal member 50, the formation of the conductive coating 90 can be detected. Therefore, the detection device 1 according to this embodiment detects the resistance of the contact portion 51 of the seal member 50 by having the configuration described below.

[0059] 9 and 10 are schematic diagrams for explaining the detection device 1 according to this embodiment. Specifically, Fig. 9 is a schematic bottom view of the detection device 1 viewed from below, and Fig. 10 is a schematic front view of the detection device 1 viewed from the front. Fig. 11 is a schematic diagram showing a state in which a plate member 60 (described later) is held by a substrate holder 20.

[0060] 9 and 10, the detection device 1 according to this embodiment mainly includes a plate member 60, a first electrode 70, a second electrode 71, and a resistance detector 80.

[0061] The plate member 60 is configured to be held by the substrate holder 20 in place of the substrate Wf when the resistance of the contact portion 51 of the seal member 50 is detected (see FIG. 11).

[0062] Specifically, during resistance detection, the plate member 60 according to this embodiment is held by the substrate holder 20 and is also subjected to pressure from the back plate 23 and the pressing member 24. If the plating apparatus 1000 does not include the back plate 23 and the pressing member 24, the plate member 60 is held by the substrate holder 20 such that the surface of the plate member 60 opposite to a predetermined surface 61 (described later) (i.e., the back surface (upper surface)) contacts the first holding member 21 of the substrate holder 20. Furthermore, during "plating processing," the plate member 60 according to this embodiment is not held by the substrate holder 20, but is stored, for example, in a predetermined storage location in the plating apparatus 1000.

[0063] 9 and 10 , the plate member 60 has a predetermined surface 61 that faces the contact portion 51 of the seal member 50 when held by the substrate holder 20. Specifically, the "predetermined surface 61" according to this embodiment is configured by the lower surface of the plate member 60.

[0064] 9 exemplifies the "region Rg" on the predetermined surface 61 of the plate member 60 that faces the contact portion 51 of the seal member 50. In other words, the width of this region Rg (the radial length of the plate member 60) corresponds to the width of the contact portion 51.

[0065] The first electrode 70 is disposed on a predetermined surface 61 of the plate member 60. The first electrode 70 is configured to come into contact with a predetermined portion (first portion) of the contact portion 51 of the seal member 50 during resistance detection (see FIG. 10 ). Specifically, the shape, arrangement position, etc. of the first electrode 70 are set so that the first electrode 70 comes into contact with the predetermined portion of the contact portion 51 when the plate member 60 is held by the substrate holder 20 during resistance detection.

[0066] The second electrode 71 is disposed on a predetermined surface 61 of the plate member 60. The second electrode 71 is configured to come into contact with a portion (second portion) of the contact portion 51 of the seal member 50 that is different from the portion (first portion) that the first electrode 70 comes into contact with during resistance detection (see FIG. 10 ). Specifically, the shape, arrangement position, etc. of the second electrode 71 are set so that the second electrode 71 comes into contact with the predetermined portion (second portion) of the contact portion 51 when the plate member 60 is held by the substrate holder 20 during resistance detection.

[0067] The first electrode 70 and the second electrode 71 are electrodes for detecting the resistance of the contact portion 51 of the seal member 50. Therefore, the first electrode 70 and the second electrode 71 are electrically insulated from each other (i.e., insulation between the pair of electrodes is ensured). Specifically, the first electrode 70 and the second electrode 71 according to this embodiment are configured not to contact each other (i.e., a gap is provided between the first electrode 70 and the second electrode 71).

[0068] The specific material of the plate member 60 is not particularly limited, and various materials such as ceramics, metal, etc. can be used. When the plate member 60 is made of a conductive material, it is preferable to take measures such as covering the locations on the plate member 60 where the first electrode 70 and the second electrode 71 are located with an insulating material in order to prevent the first electrode 70 and the second electrode 71 arranged on the plate member 60 from being electrically connected to each other via the plate member 60.

[0069] Furthermore, the specific configuration (shape) of the first electrode 70 and the second electrode 71 is not particularly limited, and they may be configured in an annular shape or a non-annular shape.

[0070] 9 , the first electrode 70 according to this embodiment, for example, has a first annular portion 72 configured in an annular shape. Similarly, the second electrode 71 according to this embodiment, for example, has a second annular portion 73 configured in an annular shape. Specifically, in this embodiment, the first electrode 70 is entirely formed by the first annular portion 72, and the second electrode 71 is also entirely formed by the second annular portion 73.

[0071] The second annular portion 73 according to this embodiment is disposed closer to the center of the first annular portion 72 in the radial direction of the first annular portion 72. The diameter of the second annular portion 73 (specifically, the diameter D2) is smaller than the diameter of the first annular portion 72 (specifically, the diameter D1). Note that, unless otherwise specified, the "diameter of the annular portion" means the "diameter of the outer peripheral edge of the annular portion."

[0072] As illustrated in FIG. 10 , the first annular portion 72 is configured to contact the contact portion 51 of the sealing member 50 when resistance is detected, and the second annular portion 73 is configured to contact a portion (second portion) of the contact portion 51 that is different from the portion (first portion) that the first annular portion 72 contacts.

[0073] Specifically, the diameter (D1) of the first annular portion 72 and the diameter (D2) of the second annular portion 73 according to this embodiment are set so that, during resistance detection, the first annular portion 72 and the second annular portion 73 are entirely in contact with the annular contact portion 51 of the seal member 50. More specifically, the diameter (D1) of the first annular portion 72 and the diameter (D2) of the second annular portion 73 according to this embodiment are smaller than the diameter (d1) of the outer circumferential edge of the contact portion 51 and larger than the diameter (d2) of the inner circumferential edge of the contact portion 51 (see FIG. 5B described above for d1 and d2).

[0074] 9 and 10 , the resistance detector 80 is electrically connected to the first electrode 70 and the second electrode 71. Specifically, the resistance detector 80 is connected to the first electrode 70 via a first wiring 74, and is connected to the second electrode 71 via a second wiring 75.

[0075] The resistance detector 80 is configured to detect the resistance between the first electrode 70 and the second electrode 71 during resistance detection, thereby detecting the resistance of the contact portion 51 of the seal member 50. Specifically, the resistance detector 80 according to this embodiment is configured by a so-called resistance sensor. As an example, the resistance detector 80 according to this embodiment is electrically connected to a control module 800. As an example, the operation of the resistance detector 80 according to this embodiment is controlled by the control module 800.

[0076] Although the specific location of the resistance detector 80 is not particularly limited, the resistance detector 80 according to the present embodiment is, for example, disposed on the plate member 60. Specifically, the resistance detector 80 according to the present embodiment is, for example, disposed on a predetermined surface 61 (lower surface) of the plate member 60.

[0077] As an example, the first wiring 74 according to this embodiment is arranged so that a portion thereof penetrates the plate member 60, a portion thereof is arranged on the back surface (specifically, the upper surface 62) opposite the predetermined surface 61 of the plate member 60, and a portion thereof is arranged on the predetermined surface 61 of the plate member 60. Furthermore, the second wiring 75 according to this embodiment is arranged entirely on the predetermined surface 61 of the plate member 60. However, this is merely one example of an arrangement mode of the first wiring 74 and the second wiring 75, and the specific arrangement mode of the first wiring 74 and the second wiring 75 is not limited to this.

[0078] Fig. 12 is an example of a flowchart for explaining the "detection method" according to this embodiment. Specifically, the flowchart of Fig. 12 is executed during the "resistance detection" described above. Note that when the flowchart of Fig. 12 is executed, the substrate holder 20 is positioned above the plating tank 10, and therefore the substrate holder 20 is not immersed in the plating solution Ps.

[0079] First, the plate member 60 is held by the substrate holder 20, and the electrodes (the first electrode 70 and the second electrode 71) are brought into contact with the contact portion 51 of the seal member 50 (step S10).

[0080] Specifically, in this embodiment, the first electrode 70 (specifically, the first annular portion 72) is brought into contact with the sealing member 50, and the second electrode 71 (specifically, the second annular portion 73) is brought into contact with a location on the contact portion 51 of the sealing member 50 that is different from the first annular portion 72.

[0081] Next, the resistance detector 80 detects the resistance (Ω) between the first electrode 70 and the second electrode 71, thereby detecting the resistance of the contact portion 51 (step S20). Specifically, the resistance detector 80 detects the resistance between the contact portion of the first electrode 70 and the contact portion of the second electrode 71 at the contact portion 51 by detecting the resistance between the first electrode 70 and the second electrode 71. The resistance detected by the resistance detector 80 is transmitted to, for example, the control module 800.

[0082] Based on the resistance detected in step S20, the control module 800 may determine whether or not the conductive coating 90 has been formed around the contact portion 51 (step S30). Specifically, the control module 800 may determine that the conductive coating 90 has been formed around the contact portion 51 if the resistance detected in step S20 is equal to or less than a preset reference value (Ω), and may determine that the conductive coating 90 has not been formed if the detected resistance is greater than the reference value.

[0083] Alternatively, instead of the control module 800, the user may acquire the resistance detected by the resistance detector 80 and determine whether or not a conductive coating 90 has formed around the contact portion 51 based on this acquired resistance (step S30).

[0084] According to the present embodiment as described above, the resistance of the seal member 50, specifically the resistance of the contact portion 51, can be detected.

[0085] As a result, according to this embodiment, it is possible to determine whether or not a conductive coating 90 has been formed around the contact portion 51 based on this detected resistance (i.e., it is possible to detect the formation of the conductive coating 90).

[0086] In particular, according to this embodiment, the resistance of the contact portion 51 of the seal member 50 can be detected without disassembling the substrate holder 20 or removing the seal member 50 from the substrate holder 20, so that the resistance of the contact portion 51 can be easily detected.

[0087] Furthermore, according to this embodiment, the first electrode 70 has a first annular portion 72, and the second electrode 71 has a second annular portion 73, and these first annular portion 72 and second annular portion 73 are in contact with the annular contact portion 51 of the sealing member 50, so that the resistance of the annular contact portion 51 can be effectively detected.

[0088] (Variation 1) Next, Variation 1 of the embodiment will be described. Fig. 13(A) is a schematic bottom view of the plate member 60 of the detection device 1 according to this variation. Note that the first electrode 70, the second electrode 71, the resistance detector 80, and the like are omitted from Fig. 13(A). Fig. 13(B) is a schematic enlarged view of a portion of the first electrode 70 and the second electrode 71 according to this variation. Specifically, Fig. 13(B) is a schematic enlarged view of a portion similar to the portion "A2" in Fig. 9 described above. Fig. 14 is a schematic enlarged cross-sectional view showing the configuration around the groove 63 in the plate member 60. Specifically, Fig. 14 is a schematic enlarged view of a cross section near A4 in Fig. 13(B).

[0089] 13A and 14, the plate member 60 according to this modification differs from the plate member 60 according to the previously described embodiment in that it has an annular groove 63 in the predetermined surface 61. The groove 63 according to this modification is provided in a region Rg that faces the contact portion 51 of the seal member 50 in the predetermined surface 61 (i.e., the region in the predetermined surface 61 that comes into contact with the contact portion 51).

[0090] 14 , the groove 63 according to this modification is configured so that the contact portion 51 fits into the groove 63 during resistance detection. The groove width Gw of the groove 63 according to this modification is the same as the radial width of the contact portion 51 (which is the same as the width of the region Rg). However, as long as the contact portion 51 can fit into the groove 63, the configuration of the groove 63 is not limited to this; for example, the groove width Gw of the groove 63 may be larger than the width of the contact portion 51.

[0091] Furthermore, as illustrated in Figure 14, if the region near the tip of the contact portion 51 has a shape (a mountain-shaped cross-sectional shape) in which the cross-sectional area becomes smaller toward the tip, the groove 63 may also have a shape (a valley-shaped cross-sectional shape) that follows the shape of the region near the tip of the contact portion 51.

[0092] 13B , the first electrode 70 according to this modification has a plurality of first branch electrodes 76 extending from the first annular portion 72 toward the second annular portion 73. The second electrode 71 according to this modification has a plurality of second branch electrodes 77 extending from the second annular portion 73 toward the first annular portion 72.

[0093] The plurality of first branch electrodes 76 according to this modification are arranged in the circumferential direction of the first annular portion 72. The plurality of second branch electrodes 77 according to this modification are arranged in the circumferential direction of the second annular portion 73. The first branch electrodes 76 and the second branch electrodes 77 are arranged alternately. That is, the plurality of first branch electrodes 76 and second branch electrodes 77 are arranged so that the second branch electrode 77 is disposed between two adjacent first branch electrodes 76 (or so that the first branch electrode 76 is disposed between two adjacent second branch electrodes 77).

[0094] In this modified example, the plurality of first branch electrodes 76 and the plurality of second branch electrodes 77 come into contact with the contact portion 51 of the seal member 50 during resistance detection.

[0095] 13B and 14 , the plurality of first branch electrodes 76 may have portions disposed in the grooves 63. Similarly, the plurality of second branch electrodes 77 may also have portions disposed in the grooves 63.

[0096] This configuration makes it easy to increase the contact area between the contact portion 51 of the seal member 50 and the first branch electrode 76 and the second branch electrode 77 arranged in the groove 63. That is, it makes it easy to increase the contact area between the contact portion 51 of the seal member 50 and the electrodes. This makes it possible to effectively detect the resistance of the contact portion 51 of the seal member 50.

[0097] (Variation 2) Next, Variation 2 of the embodiment will be described. Figures 15 and 16 are schematic diagrams for explaining a detection device 1 according to this variation. Specifically, Figure 15 schematically illustrates a state in which the plate member 60 of the detection device 1 according to this variation is held by the substrate holder 20 during a plating process. Figure 16 schematically illustrates a state in which the detection device 1 measures the resistance of the contact portion 51 of the seal member 50 during resistance measurement. Note that the second holding member 22 of the substrate holder 20 is not shown in Figure 16.

[0098] 15, the plate member 60 according to this modification is held by the substrate holder 20 so that a predetermined surface 61 of the plate member 60 contacts the back surface Wfb of the substrate Wf, which is on the opposite side to the surface Wfa to be plated, during plating processing. Other configurations of the plate member 60 according to this modification are the same as those of the above-described embodiment.

[0099] That is, the plate member 60 according to this modification functions as the back plate 23 described above during the plating process. Therefore, the plating apparatus 1000 according to this modification does not include a separate back plate 23 in addition to the plate member 60.

[0100] On the other hand, during resistance measurement, the plate member 60 according to this modification is held by the substrate holder 20, as in the previously described embodiment, and the electrodes (first electrode 70 and second electrode 71) arranged on the plate member 60 are brought into contact with the contact portions 51 of the seal member 50 (see FIG. 16 ). Furthermore, the plating apparatus 1000 according to the modification includes the pressing member 24, as in the previously described embodiment, and therefore the plate member 60 is subjected to pressure from the pressing member 24, thereby effectively bringing the electrodes into contact with the contact portions 51 of the seal member 50.

[0101] In addition, when the plating apparatus 1000 does not have a pressing member 24, the plate member 60 is held on the substrate holder 20 so that the back surface (top surface) opposite the specified surface 61 of the plate member 60 contacts the first holding member 21 of the substrate holder 20.

[0102] The resistance detector 80 according to this modification is preferably disposed in a location that is not immersed in the plating solution Ps during plating (for example, a location outside the plating tank 10 in the plating apparatus 1000 and outside the substrate holder 20). In this case, a rotary connector 78 disposed on the rotation shaft 31 of the substrate holder 20 may be disposed in the middle of the wiring (first wiring 74, second wiring 75) that electrically connects the resistance detector 80 to the electrodes (first electrode 70, second electrode 71).

[0103] This modification also has the same effects as the above-described embodiment.

[0104] The detection device 1 according to the first modification may have the configuration according to this modification.

[0105] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various further modifications and changes are possible within the scope of the present invention as defined in the claims.

[0106] REFERENCE SIGNS LIST 1 Detector 10 Plating tank 11 Anode 20 Substrate holder ("holder") 50 Sealing member 51 Contact portion 60 Plate member 61 Predetermined surface 63 Groove 70 First electrode 71 Second electrode 72 First annular portion 73 Second annular portion 76 First branch electrode 77 Second branch electrode 80 Resistance detector 1000: Plating device Ps Plating solution Rg Region Wf Substrate Wfa Surface to be plated Wfb Back surface

Claims

1. A detection device for detecting the resistance of a sealing member of a plating apparatus, the plating apparatus comprising: a plating tank in which an anode is placed; a holder configured to hold a substrate as a cathode so that the surface to be plated of the substrate faces the anode during a plating process in which plating is applied to the substrate; and the sealing member having a contact portion configured to come into contact with the surface to be plated of the substrate during the plating process. The detection device comprises: a plate member configured to be held by the holder in place of the substrate during resistance detection to detect the resistance of the contact portion, and having a predetermined surface that faces the contact portion when held by the holder during resistance detection; a first electrode arranged on the predetermined surface of the plate member and configured to come into contact with the contact portion during resistance detection; a second electrode arranged on the predetermined surface of the plate member and configured to come into contact with a portion of the contact portion that is different from the portion that the first electrode comes into contact with during resistance detection; and a resistance detector electrically connected to the first electrode and the second electrode and configured to detect the resistance of the contact portion by detecting the resistance between the first electrode and the second electrode during resistance detection.

2. The detection device described in claim 1, wherein the contact portion of the sealing member is configured in a ring shape, the first electrode has a first ring-shaped portion, the second electrode has a second ring-shaped portion, and the second ring-shaped portion is positioned closer to the center of the first ring-shaped portion in the radial direction of the first ring-shaped portion and has a diameter smaller than the diameter of the first ring-shaped portion.

3. The detection device according to claim 2, wherein a groove having an annular shape is provided on the predetermined surface of the plate member, and the groove is configured so that the contact portion fits into the groove when the resistance is detected.

4. A detection device as described in claim 3, wherein the first electrode has a plurality of first branch electrodes extending from the first annular portion toward the second annular portion, the second electrode has a plurality of second branch electrodes extending from the second annular portion toward the first annular portion, the plurality of first branch electrodes having portions disposed in the grooves, and the plurality of second branch electrodes having portions disposed in the grooves.

5. The detection device according to claim 1, wherein the plate member is held by the holder so that the specified surface contacts the back surface of the substrate opposite the surface to be plated during the plating process.

6. A detection method using the detection device described in claim 1, comprising: while the plate member is held by the holder, bringing the first electrode into contact with the contact portion of the seal member and bringing the second electrode into contact with a portion of the contact portion of the seal member different from the portion with which the first electrode makes contact; and detecting the resistance of the contact portion of the seal member by having the resistance detector detect the resistance between the first electrode and the second electrode.

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