Production method for disk-shaped substrate and production device for disk-shaped substrate

Abstract

According to the present invention, a production method for a disk-shaped substrate includes a first step for supplying a fluid to a suction surface of a suction part that is to suction one surface of a disk-shaped substrate during a period in which the disk-shaped substrate is not being suctioned and removing foreign matter that has adhered to the suction surface, a second step for sucking up the foreign matter removed from the suction surface while the fluid supply of the first step is being performed, a third step for suctioning the one surface of the disk-shaped substrate onto the suction surface to which the fluid has been supplied, and a fourth step for performing at least one process selected from among a cutting process, a grinding process, and a polishing process on the disk-shaped substrate that has been suctioned onto the suction surface.

Description

Disk-shaped substrate manufacturing method and disk-shaped substrate manufacturing device

[0001] The present disclosure relates to a method and an apparatus for manufacturing a disk-shaped substrate.

[0002] As a method for manufacturing a disk-shaped substrate, Japanese Patent Application Laid-Open Nos. 2023-032363 and 2020-107384 disclose a method for manufacturing a magnetic disk substrate, which includes a cutting step of cutting a disk blank.

[0003] When cutting a disk-shaped substrate, one side of the disk-shaped substrate may be held by suction before the other side is cut. In this case, a method can be considered in which a fluid is supplied to the suction surface of the suction part that suctions the disk-shaped substrate to prevent foreign matter from adhering to the suction surface, thereby removing the foreign matter that has adhered to the suction surface. Here, if the foreign matter removed from the suction surface becomes suspended in the air, for example, there is a risk that it may re-adhere to the disk-shaped substrate, etc. If the foreign matter re-adheres to the disk-shaped substrate, the foreign matter may become trapped between the disk-shaped substrate and the suction surface, causing a concave defect in the disk-shaped substrate. Examples of foreign matter include chips and small pieces generated by cutting the disk-shaped substrate.

[0004] Therefore, an object of the present disclosure is to provide a method and an apparatus for manufacturing a disk-shaped substrate that prevent foreign matter removed from the suction surface of the suction part from re-adhering to the disk-shaped substrate.

[0005] The present disclosure includes the following aspects: <1> A method for manufacturing a disk-shaped substrate, comprising: a first step of supplying a fluid to an adsorption surface of an adsorption unit that adsorbs one side of a disk-shaped substrate while the disk-shaped substrate is not being adsorbed, thereby removing foreign matter adhering to the adsorption surface; a second step of suctioning the foreign matter removed from the adsorption surface while the supply of the fluid is being carried out in the first step; a third step of adsorbing one side of the disk-shaped substrate to the adsorption surface to which the fluid has been supplied; and a fourth step of performing at least one process selected from the group consisting of cutting, grinding, and polishing on the disk-shaped substrate adsorbed to the adsorption surface. <2> The method for manufacturing a disk-shaped substrate according to <1>, wherein a supply unit that supplies the fluid is provided in a holder that holds the disk-shaped substrate and transfers the disk-shaped substrate to the adsorption surface, and a suction unit that suctions the foreign matter removed from the adsorption surface is provided in the holder. <3> The method for manufacturing a disk-shaped substrate according to <2>, wherein the supply unit and the suction unit move together with the holder, and the supply unit supplies the fluid to the suction surface and the suction unit sucks up the removed foreign matter before the disk-shaped substrate is transferred to the suction surface. <4> The method for manufacturing a disk-shaped substrate according to <2> or <3>, wherein, in a state in which the holder holds the disk-shaped substrate with the one surface facing the suction surface, the supply unit supplies the fluid to the suction surface and the suction unit sucks up the removed foreign matter. <5> The method for manufacturing a disk-shaped substrate according to any one of <1> to <4>, wherein, while the suction surface is rotating, the fluid is supplied to the suction surface during a period in which the disk-shaped substrate is not being suctioned, and foreign matter adhering to the suction surface is removed. <6> The method for manufacturing a disk-shaped substrate according to any one of <1> to <5>, wherein in the first step, the fluid is intermittently supplied to the suction surface during a period when the disk-shaped substrate is not being suctioned, and foreign matter adhering to the suction surface is removed. <7> The method for manufacturing a disk-shaped substrate according to <6>, wherein the supply interval for intermittently supplying the fluid is in the range of 0.05 seconds or more and 1 second or less.<8> A disk-shaped substrate manufacturing apparatus comprising: a processing device including an adsorption unit that adsorbs one surface of a disk-shaped substrate, and a processing unit that performs at least one process selected from the group consisting of a cutting process, a grinding process, and a polishing process on the disk-shaped substrate adsorbed to the adsorption unit; a foreign matter removal device that includes a supply unit that supplies a fluid to the adsorption surface of the adsorption unit and supplies the fluid to the adsorption surface during a period when the disk-shaped substrate is not adsorbed, thereby removing foreign matter adhering to the adsorption surface; and a foreign matter suction device that sucks foreign matter removed from the adsorption surface when the foreign matter removal device supplies the fluid. <9> The disk-shaped substrate manufacturing apparatus according to <8>, wherein the supply unit is provided in a holding unit that holds the disk-shaped substrate and transfers the disk-shaped substrate to the adsorption unit. <10> The disk-shaped substrate manufacturing apparatus according to <8> or <9>, wherein the foreign matter removal device intermittently supplies the fluid during a period when the disk-shaped substrate is not adsorbed, thereby removing foreign matter adhering to the adsorption surface. <11> The method for manufacturing a disk-shaped substrate according to <10>, wherein the fluid is intermittently supplied at intervals of 0.05 seconds or more and 1 second or less.

[0006] According to the present disclosure, it is possible to provide a method for manufacturing a disk-shaped substrate and an apparatus for manufacturing a disk-shaped substrate that prevent foreign matter removed from the suction surface of the suction part from re-adhering to the disk-shaped substrate.

[0007] Fig. 1 is a perspective view showing a manufacturing apparatus according to an embodiment of the present disclosure; Fig. 2 is a perspective view showing a state in which an arm is positioned at a receiving position in the manufacturing apparatus according to an embodiment of the present disclosure; Fig. 3 is a perspective view showing a state in which an arm is positioned at a delivery position in the manufacturing apparatus according to an embodiment of the present disclosure; Fig. 4 is a perspective view showing a state in which cutting is performed on a disk-shaped substrate in the manufacturing apparatus according to an embodiment of the present disclosure; Fig. 5 is a perspective view showing a state in which foreign matter is removed in the manufacturing apparatus according to an embodiment of the present disclosure.

[0008] Embodiments of the present disclosure will be described below. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of the components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between each component, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in the present disclosure, the number of each component of the present disclosure is not limited to one, and multiple components may be present. Note that in the following description of the drawings, similar parts are designated by similar symbols.

[0009] <Manufacturing Apparatus 90> As an example of a disk-shaped substrate manufacturing apparatus according to the present disclosure, a manufacturing apparatus 90 will be described with reference to the drawings. Note that the disk-shaped substrate manufacturing apparatus according to the present disclosure is not limited to the manufacturing apparatus 90. As shown in FIG. 4, the manufacturing apparatus 90 is an apparatus that manufactures a disk-shaped substrate 200 from an unprocessed disk-shaped substrate 100. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by processing the disk-shaped substrate 100. As shown in FIG. 1, the manufacturing apparatus 90 includes a foreign matter removal device 50, a cutting device 60, and a foreign matter suction device 30. Below, the disk-shaped substrate 100, each part of the manufacturing apparatus 90, and modified examples of the manufacturing apparatus 90 will be described.

[0010] <Disc-shaped substrate 100> The disc-shaped substrate 100 is a substrate formed in a disc shape, as shown in Fig. 4. Specifically, the disc-shaped substrate 100 is formed in an annular shape having an inner circumference 100A and an outer circumference 100B in a plan view. Note that the plan view here refers to the case where the disc-shaped substrate 100 is viewed from one side in the thickness direction of the disc-shaped substrate 100. The disc-shaped substrate 100 is a substrate before being cut by the cutting device 60.

[0011] Furthermore, the disk-shaped substrate 100 is formed in a plate shape having one surface 100J and the other surface 100K. Hereinafter, the one surface 100J will be referred to as the first surface 100J. Hereinafter, the other surface 100K will be referred to as the second surface 100K. Note that the boundary portion between the first surface 100J and the inner periphery 100A of the disk-shaped substrate 100 may be regarded as part of the first surface 100J. The boundary portion between the first surface 100J and the outer periphery 100B of the disk-shaped substrate 100 may be regarded as part of the first surface 100J. The boundary portion between the second surface 100K and the inner periphery 100A of the disk-shaped substrate 100 may be regarded as part of the second surface 100K. The boundary portion between the second surface 100K and the outer periphery 100B of the disk-shaped substrate 100 may be regarded as part of the second surface 100K. Note that the aforementioned boundary portion may also be referred to as a ridge portion.

[0012] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. The disk-shaped substrate 100 may be a substrate made of a metal material such as aluminum or an aluminum alloy substrate, or glass. The metal material may have a surface treatment such as plating. In this case, the surface to be subjected to cutting or other processing may be a plating layer. Aluminum substrates are advantageous in that they are easy to process and can reduce manufacturing costs. In this disclosure, aluminum substrate is a general term that includes aluminum alloy substrates as well as aluminum substrates.

[0013] On the other hand, a glass reinforced layer may be formed on the surface of the glass substrate. In this case, the target surface for cutting or the like may be the glass reinforced layer. Formation of a glass reinforced layer is not essential for the glass substrate. The present disclosure can also be applied to cases where cutting or the like is performed on the surface of a pure glass substrate on which no glass reinforced layer is formed. Glass substrates are superior to aluminum substrates in strength, surface flatness, heat resistance, etc., making it easier to achieve miniaturization and high density of disc-shaped substrates. Note that although the disc-shaped substrate 100 is for use in a magnetic recording medium, the present disclosure is not limited thereto, and various disc-shaped substrates can be used whose uses, materials, types, etc. are not limited to those described above.

[0014] <Cutting Device 60> The cutting device 60 is a device that performs cutting processing on the disk-shaped substrate 100. Specifically, as shown in FIG. 1 , the cutting device 60 has, for example, an adsorption unit 70, a cutting unit 64, and a holding unit 68.

[0015] The suction unit 70 has a function of suctioning the first surface 100J of the disk-shaped substrate 100. Specifically, as shown in FIG. 1 , the suction unit 70 has, for example, an adsorption body 72, a support 74, and a rotation mechanism 76.

[0016] The adsorption body 72 is formed in a cylindrical shape. The adsorption body 72 has an adsorption surface 71 that is formed in a circular shape when viewed in the axial direction of the adsorption body 72. The adsorption body 72 is formed with a suction port 73 that opens at the adsorption surface 71. The suction port 73 is formed in, for example, a circular ring shape when viewed in the axial direction of the adsorption body 72. The adsorption unit 70 adsorbs the first surface 100J of the disk-shaped substrate 100 to the adsorption surface 71 by sucking air through the suction port 73.

[0017] The support 74 supports the adsorber 72 rotatably around an axis along the axial direction of the adsorber 72. The rotation mechanism 76 rotates the adsorber 72 around this axis. In the adsorption unit 70, with the disk-shaped substrate 100 adsorbed to the adsorption surface 71, the rotation mechanism 76 rotates the adsorber 72, thereby rotating the disk-shaped substrate 100.

[0018] The cutting unit 64 is an example of a processing unit and has the function of cutting the disk-shaped substrate 100. The cutting unit 64 cuts the second surface 100K of the disk-shaped substrate 100 by bringing a cutting blade into contact with the rotating disk-shaped substrate 100 while it is adsorbed to the adsorption surface 71. The cutting unit 64 may, for example, cut the second surface 100K and the boundary portion between the second surface 100K and the outer periphery 100B of the disk-shaped substrate 100. The cutting unit 64 may also, for example, cut the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B of the disk-shaped substrate 100. Note that when cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted and the cutting is performed with the second surface 100K adsorbed to the adsorption surface 71. The cutting target to be cut by the cutting unit 64 may be, for example, only the outer periphery 100B, or in addition to or instead of the outer periphery 100B, the first surface 100J, the second surface 100K, or both of these surfaces. The cutting target may be any portion of the disk-shaped substrate 100 other than the portion adsorbed by the adsorption unit 70.

[0019] The holding unit 68 has a function of holding the disk-shaped substrate 100 and transferring the disk-shaped substrate 100 to the suction surface 71. Specifically, the holding unit 68 has, for example, a shaft 80, an arm 81, a moving mechanism 83, and a holding mechanism 84. The shaft 80 is formed in a cylindrical shape with a hollow interior. The shaft 80 is supported by a support (not shown) so as to be movable in the axial direction and rotatable.

[0020] One end 81A of the arm 81 is attached to one end 80A of the shaft 80 in the axial direction, and the arm 81 rotates integrally with the shaft 80. The arm 81 extends radially outward from one end 80A of the shaft 80. A first hole 81D, through which the nozzle 56 of the foreign matter removal device 50 is passed, is formed in one end 81A of the arm 81. Furthermore, a second hole 81E, through which the nozzle 56 is passed, is formed in an intermediate portion 81C of the arm 81. The intermediate portion 81C of the arm 81 is the portion between one end 81A and the other end 81B of the arm 81.

[0021] The holding mechanism 84 is a mechanism that holds the disk-shaped substrate 100. The holding mechanism 84 is provided at the other end 81B of the arm 81, and rotates integrally with the arm 81. Specifically, the holding mechanism 84 has, for example, a plurality of claws arranged along the circumferential direction of the inner periphery 100A of the disk-shaped substrate 100, and holds the disk-shaped substrate 100 by pressing the claws against the inner periphery 100A.

[0022] The moving mechanism 83 is a mechanism that, for example, rotates the arm 81 around the axis of the shaft portion 80 and moves the arm 81 along the axial direction of the shaft portion 80. Specifically, the moving mechanism 83 rotates the arm 81 between the opposing position and the receiving position. Furthermore, the moving mechanism 83 moves the arm 81 in the axial direction of the shaft portion 80 between the opposing position and the delivery position.

[0023] The opposing position is the position shown in Fig. 1. The receiving position is the position shown in Fig. 2. The delivery position is the position shown in Fig. 3. The opposing position is a position where the disk-shaped substrate 100 held by the arm 81 faces the suction surface 71 while being spaced apart from the suction surface 71. The receiving position is a position where the arm 81 receives the disk-shaped substrate 100, and where the disk-shaped substrate 100 held by the arm 81 does not face the suction surface 71. The receiving position is set, for example, at a position where the arm 81 is rotated 180 degrees from the opposing position. The delivery position is a position where the arm 81 delivers the disk-shaped substrate 100 to the suction unit 70. At the delivery position, for example, the disk-shaped substrate 100 held by the arm 81 comes into contact with the suction surface 71.

[0024] <Cutting Process by Cutting Device 60> In the cutting device 60, the cutting process of the disk-shaped substrate 100 is performed, for example, as follows. That is, in the cutting device 60, first, at the receiving position, the holding mechanism 84 provided on the arm 81 holds the disk-shaped substrate 100, and the arm 81 receives the disk-shaped substrate 100. At this time, the disk-shaped substrate 100 is held by the holding mechanism 84 with the second surface 100K facing the arm 81.

[0025] Next, the arm 81 that has received the disk-shaped substrate 100 is rotated from the receiving position to the opposing position by the movement mechanism 83. Next, the arm 81 is moved from the opposing position to the delivery position by the movement mechanism 83. Next, the suction unit 70 sucks air through the suction port 73, thereby suctioning the first surface 100J of the disk-shaped substrate 100 to the suction surface 71. At this time, the holding mechanism 84 releases the hold of the disk-shaped substrate 100.

[0026] 4, the rotation mechanism 76 rotates the adsorber 72 around an axis along the axial direction of the adsorber 72, while the cutting unit 64 brings the cutting blade into contact with the disk-shaped substrate 100. This cuts the disk-shaped substrate 100. The cutting is performed on, for example, the second surface 100K of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the outer periphery 100B.

[0027] When cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted using an inversion mechanism (not shown), and cutting is performed with the second surface 100K adsorbed to the adsorption surface 71.

[0028] <Modifications of Cutting Device 60> The suction unit 70 in the cutting device 60 is not limited to the configuration described above. The suction unit of the present disclosure may be one that suctions the disk-shaped substrate by means other than suction, for example. Therefore, the suction unit of the present disclosure may be one that suctions one side of the disk-shaped substrate. The cutting unit 64 in the cutting device 60 is not limited to the configuration described above. The cutting unit of the present disclosure may be one that cuts the disk-shaped substrate that has been sucked onto the suction unit. The holding unit 68 in the cutting device 60 is not limited to the configuration described above. As the holding unit of the present disclosure, for example, the arm of the holding unit may move linearly instead of rotating, and various holding units can be used.

[0029] In this embodiment, a cutting device 60 is used as an example of a processing device of the present disclosure, but this is not limiting. An example of a processing device of the present disclosure may be, for example, a device that performs at least one of physical polishing and chemical polishing on a disk-shaped substrate 100. An example of a processing device of the present disclosure may be a device that performs at least one process selected from the group consisting of a cutting process, a grinding process, and a polishing process. Note that the cutting process, the grinding process, and the polishing process are processes that may generate foreign matter during processing. Examples of foreign matter generated in the cutting process, the grinding process, and the polishing process include chips, small particles, etc., generated from the disk-shaped substrate 100 during processing of the disk-shaped substrate 100, or processing agents such as abrasives.

[0030] <Foreign matter removal device 50> The foreign matter removal device 50 is a device that supplies air to the suction surface 71 of the suction unit 70 while the disk-shaped substrate 100 is not being suctioned, and removes foreign matter adhering to the suction surface 71.

[0031] 5, the foreign matter removal device 50 has a supply unit 52 that supplies air to the suction surface 71. The supply unit 52 intermittently supplies air to the suction surface 71 during a period when the disk-shaped substrate 100 is not being suctioned, thereby removing foreign matter adhering to the suction surface 71. Specifically, as shown in FIG. 5, the supply unit 52 has a supply source 53, a supply pipe 54, an on-off valve 55, and a nozzle 56.

[0032] The supply source 53 supplies air to the supply pipe 54. As the supply source 53, for example, a compressor that generates compressed air and supplies the compressed air to the supply pipe 54 can be used. The supply pipe 54 is a pipe that supplies air from the supply source 53 to the nozzle 56.

[0033] The nozzle 56 is provided on the arm 81 of the holding unit 68 of the cutting device 60, and supplies air from the supply pipe 54 toward the suction surface 71. Specifically, the nozzle 56 is connected to the supply pipe 54 inside the shaft 80, and passes through a first hole 81D and a second hole 81E of the arm 81. The on-off valve 55 is a valve that opens and closes the flow path of the supply pipe 54. The on-off valve 55 opens and closes the flow path, thereby intermittently supplying air from the nozzle 56 to the suction surface 71. Note that the on-off valve 55 may also open and close the flow path of the nozzle 56.

[0034] The supply unit 52 may be, for example, a pulse air blower that controls the opening and closing of an on-off valve 55 using a pulse signal. The air supply period by the supply unit 52 can be set according to the processing time of the entire processing step from the viewpoint of removing foreign matter, and is appropriately set, for example, from 0.1 seconds or more, 0.5 seconds or more, or 1 second or more, but not exceeding 2 seconds. This supply period is the period during which the supply unit 52 supplies air in one supply operation. The supply interval in the intermittent air supply varies depending on the length of the supply period, but is appropriately set from the viewpoint of removing foreign matter from the range of, for example, 0.05 seconds or more, 0.1 seconds or more, or 0.2 seconds or more, but not exceeding 1 second. Note that the supply interval is the interval from the start of air supply to the start of the next air supply in the intermittent air supply. The air discharge pressure from the nozzle 56 is set, from the viewpoint of removing foreign matter, to, for example, 0.05 MPa or more, 0.1 MPa or more, 0.2 MPa or more, or 0.5 MPa or more. There is no particular upper limit to the air discharge pressure, but it can be set to, for example, 2 MPa or less.

[0035] As described above, in the supply unit 52 , the nozzle 56 is provided on the arm 81 of the holding unit 68 of the cutting device 60 , and air can be supplied to the suction surface 71 from the arm 81 side.

[0036] <Modifications of the Foreign Matter Removal Device 50> In the foreign matter removal device 50, air is supplied to the suction surface 71, but this is not limited thereto. The foreign matter removal device of the present disclosure may also supply, for example, a gas such as nitrogen or a liquid such as water. The supply unit of the foreign matter removal device of the present disclosure may be an injector, a sprayer, a supply head, or the like. The supply unit may also be a supply unit that supplies a fluid through a tube, an opening, a slit, or the like, and various supply units can be used. The foreign matter removal device of the present disclosure may supply a fluid that can be supplied to the suction surface. In addition, in the foreign matter removal device 50, the supply unit 52 is provided in the holding unit 68 of the cutting device 60, but this is not limited thereto. In the foreign matter removal device of the present disclosure, the supply unit may be provided, for example, in the main body of the cutting device. In the foreign matter removal device of the present disclosure, the supply unit can be installed in various locations. Furthermore, in the foreign matter removal device 50, the supply unit 52 intermittently supplies air to the suction surface 71 during the period when the disk-shaped substrate 100 is not being suctioned, but this is not limited thereto. The supply unit of the present disclosure may, for example, supply air continuously. Specifically, the supply unit of the present disclosure may, for example, supply air at a constant rate from the start to the end of the period when the disk-shaped substrate 100 is not being suctioned.

[0037] <Foreign Matter Suction Device 30> The foreign matter suction device 30 is a device that suctions foreign matter removed from the suction surface 71 by the foreign matter removal device 50. In this embodiment, the foreign matter suction device 30 performs suction of foreign matter when the foreign matter removal device 50 supplies air. As shown in FIG. 1 , the foreign matter suction device 30 includes, for example, a suction unit 32 and a drive unit 36. The suction unit 32 includes a tip 34 having a suction port 33 and a suction tube 35. One end of the suction tube 35 is connected to the tip 34. At this end, the interior of the suction tube 35 communicates with the suction port 33. The other end of the suction tube 35 is connected to the drive unit 36. At this end, the interior of the suction tube 35 communicates with the drive unit 36. The suction unit 32 is provided on an arm 81 of the holder 68 of the cutting device 60. Specifically, for example, the suction tube 35 of the suction unit 32 is arranged from one end 81A to the other end 81B of the arm 81 on the side of the arm 81 opposite to the holding mechanism 84 .

[0038] The drive unit 36 ​​is a drive source that sucks air from the suction unit 32. Examples of the drive unit 36 ​​include a suction pump, a suction fan, and an ejector. In the foreign matter suction device 30, the drive unit 36 ​​creates a negative pressure inside the suction tube 35 of the suction unit 32, and foreign matter removed from the suction surface 71 is sucked through the suction port 33. In this embodiment, for example, the drive unit 36 ​​of the foreign matter suction device 30 is driven to suck foreign matter while the supply unit 52 of the foreign matter removal device 50 supplies air. That is, in this embodiment, there is a period in which foreign matter removal and foreign matter suction are performed simultaneously. The timing at which foreign matter suction begins may be the same as or different from the timing at which foreign matter removal begins. For example, foreign matter suction may begin after foreign matter removal begins. Furthermore, the timing at which foreign matter suction ends may be the same as or different from the timing at which foreign matter removal ends. For example, foreign matter suction may end after foreign matter removal ends.

[0039] <Modifications of Foreign Body Suction Device 30> In the foreign body suction device 30, the suction unit 32 is provided in the holding unit 68 of the cutting device 60, but this is not limited to this. In the foreign body suction device of the present disclosure, the suction unit may be provided, for example, in the device body of the cutting device. In the foreign body suction device of the present disclosure, the suction unit can be installed in various locations.

[0040] <Modification of Manufacturing Apparatus 90> In the manufacturing apparatus 90, the cutting apparatus 60 cuts the disk-shaped substrate 100 as described above, thereby manufacturing the disk-shaped substrate 200. Note that in the present disclosure, the manufacturing apparatus 90 may include, for example, one or more other devices necessary for manufacturing the disk-shaped substrate 200. Examples of the other devices include a grinding device that grinds the disk-shaped substrate 100, a polishing device that polishes the disk-shaped substrate 100, a cleaning device that cleans the disk-shaped substrate 100, a drying device that dries the disk-shaped substrate 100, a transport device that transports the disk-shaped substrates 100, 200, and a storage rack that stores the disk-shaped substrates 100, 200.

[0041] <Method for Manufacturing Disk-Shaped Substrate 200> The manufacturing method of this embodiment is a method for manufacturing the disk-shaped substrate 200. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by processing the disk-shaped substrate 100. In this embodiment, the method for manufacturing the disk-shaped substrate 200 includes removing foreign matter adhering to the suction surface 71 of the suction unit 70 that suctions the first surface 100J of the disk-shaped substrate 100, then suctioning the disk-shaped substrate 100 to the suction unit 70, and then performing a cutting process. In the present disclosure, the method for manufacturing the disk-shaped substrate 200 may be configured to include one or more other commonly known processes required for manufacturing the disk-shaped substrate 200, depending on the type of the disk-shaped substrate 200.

[0042] For example, in the case of an aluminum substrate, the manufacturing method of the disk-shaped substrate 200 includes the following steps: Blank substrate preparation step: An aluminum alloy ingot is rolled to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less, and the obtained aluminum alloy plate material is punched into a disk shape to prepare an aluminum substrate of the desired dimensions. Cutting step: The prepared aluminum alloy substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding step: Both main surfaces of the aluminum alloy substrate are ground using a grinding wheel to reduce surface roughness, waviness, etc. of the aluminum alloy substrate after cutting. Plating step: The surface of the ground substrate is plated with NiP or the like to impart surface hardness and suppress surface defects. Polishing step: Both main surfaces of the aluminum alloy substrate on which the plating film has been formed are polished.

[0043] In the case of a glass substrate, the manufacturing method of the disk-shaped substrate 200 includes, for example, the following steps: Blank substrate preparation step: A glass blank, which will be the material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces, is produced by press molding, and a circular hole is formed in the center of the produced glass blank to form an annular shape. Next, shape processing is performed to obtain a glass substrate having a chamfered surface. The inner and outer peripheral edge surfaces of the shaped glass substrate are ground and polished. Grinding step: The main surfaces of the glass substrate after edge polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished using a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment.

[0044] The manufacturing method according to this embodiment will be described in detail below. The manufacturing method according to this embodiment includes a foreign matter removal step, a foreign matter suction step, an adsorption step, and a cutting step. In the manufacturing method according to this embodiment, the foreign matter removal step, the adsorption step, and the cutting step are performed in this order. The manufacturing method according to this embodiment can be performed, for example, by using the manufacturing apparatus 90 described above. The foreign matter removal step, the foreign matter suction step, the adsorption step, and the cutting step are each an example of the first step, the second step, the third step, and the fourth step, respectively.

[0045] 5, in the foreign matter removal step, air is supplied to the suction surface 71 of the suction unit 70 while the disk-shaped substrate 100 is not being suctioned, thereby removing foreign matter adhering to the suction surface 71. In the foreign matter suction step, the foreign matter removed from the suction surface 71 is sucked while the air is being supplied in the foreign matter removal step. This makes it difficult for the foreign matter removed from the suction surface 71 to float in the air, and prevents it from re-adhering to the disk-shaped substrate 100, etc.

[0046] In the present embodiment, the supply unit 52 for supplying air may be provided in the holding unit 68 that holds the disk-shaped substrate 100 and transfers the disk-shaped substrate 100 to the suction surface 71. In this case, in the foreign matter removal step, air is supplied to the suction surface 71 from the supply unit 52 provided in the holding unit 68 that transfers the disk-shaped substrate 100 to the suction surface 71. In the present embodiment, a suction unit 32 may also be provided in the holding unit 68. In this case, in the foreign matter suction step, the suction unit 32 provided in the holding unit 68 with the suction unit 32 suctions the foreign matter removed from the suction surface 71. This allows the foreign matter to be sucked in the vicinity of a location where the foreign matter is likely to float. As a result, the foreign matter removed from the suction surface 71 is less likely to float in the air and is prevented from reattaching to the disk-shaped substrate 100 and the holding unit 68. According to this manufacturing method, when the disk-shaped substrate 100 is transferred from the holder 68 to the suction surface 71, foreign matter can be removed from the suction surface 71 and the removed foreign matter can be sucked. Specifically, according to this manufacturing method, for example, the foreign matter can be removed and the removed foreign matter can be sucked immediately before the disk-shaped substrate 100 is transferred.

[0047] In this embodiment, the supply unit 52 and the suction unit 32 may move together with the holding unit 68, and before the disk-shaped substrate 100 is transferred to the suction surface 71, the supply unit 52 may supply air to the suction surface 71, and the suction unit 32 may suck up the removed foreign matter. According to this manufacturing method, the supply unit 52 and the suction unit 32 move together with the holding unit 68, so that air can be supplied to a wide area of ​​the suction surface 71 and the removed foreign matter can be sucked up over a wide area. As a result, foreign matter is prevented from remaining on the suction surface 71 and from reattaching to it. In this case, the supply unit 52 may supply air to the suction surface 71 while the suction unit 32 may suck up the removed foreign matter while the holding unit 68 is moved in the direction in which the supply unit 52 and the suction unit 32 move along the suction surface 71. At this time, the arm 81 may be rotated forward and backward to reciprocate the tips of the nozzle 56 and the suction unit 32 along the suction surface 71.

[0048] Furthermore, in this embodiment, while the holder 68 is holding the disk-shaped substrate 100 with the first surface 100J facing the suction surface 71, the supply unit 52 may supply air to the suction surface 71 and the suction unit 32 may suck up the removed foreign matter. This allows the disk-shaped substrate 100 to be sucked onto the suction surface 71 without changing the orientation of the disk-shaped substrate 100 after the supply of air and the suction of foreign matter have been performed, thereby improving work efficiency.

[0049] In this embodiment, air may be supplied from the supply unit 52 to the suction surface 71 while the rotation mechanism 76 rotates the suction surface 71. According to this manufacturing method, air is supplied to the suction surface 71 while the suction surface 71 is rotating, so that air can be supplied over a wide area of ​​the suction surface 71. As a result, foreign matter is prevented from remaining on the suction surface 71. In the foreign matter removal step of this embodiment, air is supplied to the suction surface 71, for example, after the arm 81 has rotated to the facing position and before it moves to the delivery position.

[0050] In the foreign matter removal process, air may be intermittently supplied to the suction surface 71 of the suction unit 70 during a period when the disk-shaped substrate 100 is not being suctioned. This causes variations in the amount of air supplied compared to supplying a constant amount of air from the start to the end of the period, making it easier for foreign matter adhering to the suction surface 71 to peel off from the suction surface 71. As a result, foreign matter is prevented from remaining on the suction surface 71. Furthermore, according to this embodiment, because foreign matter is easily peeled off from the suction surface 71, it is possible to prevent foreign matter from remaining on the suction surface 71 without extending the air supply period. As a result, the yield of the manufactured disk-shaped substrates 200 is improved.

[0051] In the suction step, the first surface 100J of the disk-shaped substrate 100 is suctioned onto the suction surface 71 to which air is supplied. Specifically, the suction unit 70 sucks air through the suction port 73, thereby suctioning the first surface 100J of the disk-shaped substrate 100 onto the suction surface 71.

[0052] In the cutting step, the disk-shaped substrate 100 adsorbed to the adsorption surface 71 is cut. Specifically, as shown in Fig. 4, the rotation mechanism 76 rotates the adsorption body 72 around an axis along the axial direction of the adsorption body 72, while the cutting unit 64 brings the cutting blade into contact with the disk-shaped substrate 100, thereby cutting the disk-shaped substrate 100. The cutting is performed on, for example, the second surface 100K of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the outer periphery 100B.

[0053] When cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted by an inversion mechanism (not shown), and cutting is performed with the second surface 100K adsorbed to the adsorption surface 71. In the manufacturing method, before the foreign matter removal step is performed, a manufacturing apparatus 90 including a foreign matter removal device 50 and a cutting device 60 is prepared.

[0054] <Modification of Manufacturing Method> In the manufacturing method of this embodiment, air is supplied to the suction surface 71 from the supply unit 52 provided in the holding unit 68 that transfers the disk-shaped substrate 100 to the suction surface 71, but this is not limited to this. In the manufacturing method of the present disclosure, air may be supplied to the suction surface from a supply unit provided in a location other than the holding unit, such as the main body of the cutting device. In the manufacturing method of the present disclosure, air can be supplied from various locations.

[0055] In the manufacturing method of the present embodiment, air is supplied from the supply unit 52 to the suction surface 71 while the holding unit 68 is moved in the movement direction in which the supply unit 52 moves along the suction surface 71, but this is not limited to this. In the manufacturing method of the present disclosure, for example, air may be supplied from the supply unit to the suction surface while the holding unit is stopped.

[0056] In the manufacturing method of the present embodiment, air is supplied from the supply unit 52 to the suction surface 71 while the rotation mechanism 76 rotates the suction surface 71, but this is not limiting. For example, in the manufacturing method of the present disclosure, air may be supplied from the supply unit to the suction surface while the suction surface is stopped.

[0057] In the manufacturing method of the present embodiment, air is supplied to the suction surface 71, for example, after the arm 81 rotates to the facing position and before it moves to the delivery position, but this is not limitative. In the manufacturing method of the present disclosure, air can be supplied to the suction surface 71 at various times.

[0058] Furthermore, although the manufacturing method of this embodiment includes a foreign matter removal step as one step in manufacturing the disk-shaped substrate 200, this is not limiting. The foreign matter removal step may be performed independently as a foreign matter removal method, independent of the manufacturing method of this embodiment.

[0059] In this embodiment, the manufacturing apparatus 10 has been described as an apparatus including a cutting apparatus as a processing apparatus, but the present invention is not limited thereto, and the manufacturing apparatus 10 may be an apparatus including a grinding apparatus or an apparatus including a polishing apparatus. In this embodiment, the method for manufacturing a disk-shaped substrate involves removing foreign matter during the cutting process, but the present invention is not limited thereto, and the foreign matter removal process may be performed during any one of the cutting process, grinding process, and polishing process, or during two selected from these processes, or during all three of these processes.

[0060] The present disclosure will be specifically described below using examples, but the scope of the present disclosure is not limited to these examples.

[0061] (Production of Aluminum Alloy Substrate) An aluminum alloy plate equivalent to A5086 (Mg: 4 mass%, Mn: 0.5 mass%, Fe: 0.3 mass%, Cr: 0.2 mass%, Si: 0.2 mass%, Zn: 0.2 mass%, balance Al) was used. This plate was produced by rolling an aluminum alloy ingot obtained by semi-continuous casting.

[0062] Next, the 1.2 mm thick plate material was punched into a doughnut-shaped disk to obtain an aluminum alloy substrate having a diameter of 97 mm and a center hole, which was then annealed for 1 hour at 380° C. Thereafter, the aluminum alloy substrate was subjected to the above-described foreign matter removal step, adsorption step, and cutting step to obtain an aluminum alloy substrate having a diameter of 95 mm and a thickness of 0.8 mm.

[0063] In each example and comparative example, the foreign matter removal process was performed by changing the air supply operation, the number of discharges per supply operation, and the discharge pressure, as shown in Table 1 below. The conditions for the air supply operation and the number of discharges per supply operation were the same for each example and comparative example. In each example and comparative example, the manufacturing method including the foreign matter removal process, the adsorption process, and the cutting process was performed by changing whether or not the foreign matter suction process was performed. In each example and comparative example, the processes other than the foreign matter removal process and the foreign matter suction process were performed under the same conditions.

[0064] [Comparative Examples 1 and 2] In Comparative Examples 1 and 2, the air discharge pressure from the nozzle was set to 0.1 MPa or 0.2 MPa, respectively, as shown in Table 1, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at 0.1-second intervals. Therefore, in Comparative Examples 1 and 2, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10. In Comparative Examples 1 and 2, the manufacturing method according to this embodiment, including the foreign matter removal step, suction step, and cutting step, was performed without performing the foreign matter suction step. That is, in Comparative Examples 1 and 2, the manufacturing method was performed with the drive unit 36 ​​of the foreign matter suction device 30 stopped.

[0065] [Examples 1 and 2] In Examples 1 and 2, the air discharge pressure from the nozzle was set to 0.1 MPa or 0.2 MPa, respectively, as shown in Table 1, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at 0.1-second intervals. In Examples 1 and 2, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10. In Examples 1 and 2, the manufacturing method according to this embodiment, including the foreign matter removal step, foreign matter suction step, suction step, and cutting step, was performed. That is, in Examples 1 and 2, the foreign matter suction step was performed in which foreign matter removed from the suction surface 71 was sucked while air was being supplied in the foreign matter removal step.

[0066]

[0067] For the following Reference Examples and Reference Comparative Examples, the manufacturing method according to this embodiment was also carried out, as shown in Table 2. In each Reference Example and Reference Comparative Example, the foreign matter removal process was carried out by changing the air supply operation, the number of discharges per supply operation, and the discharge pressure. In each Reference Example and Reference Comparative Example, the manufacturing method according to this embodiment, including the foreign matter removal process, the adsorption process, and the cutting process, was carried out without carrying out the foreign matter suction process. In each Reference Example and Reference Comparative Example, the processes other than the foreign matter removal process were carried out under the same conditions.

[0068] [Reference Comparative Examples 1, 2, and 3] In Reference Comparative Examples 1, 2, and 3, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was continuously supplied for one second to the suction surface 71 of the suction part 70. Therefore, in Reference Comparative Examples 1, 2, and 3, the air supply period in one supply operation was one second, and air was discharged from the nozzle once in one supply operation.

[0069] [Reference Comparative Examples 4 and 5] In Reference Comparative Examples 4 and 5, the air discharge pressure from the nozzle was set to 0.1 MPa or 0.5 MPa, respectively, as shown in Table 2, and air was supplied to the suction surface 71 of the suction part 70 continuously for two seconds. Therefore, in Reference Comparative Examples 4 and 5, the air supply period in one supply operation was two seconds, and air was discharged from the nozzle once in one supply operation.

[0070] [Reference Examples 1, 2, and 3] In Reference Examples 1, 2, and 3, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at intervals of 0.05 seconds. In Reference Examples 1, 2, and 3, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 20.

[0071] [Reference Examples 4, 5, and 6] In Reference Examples 4, 5, and 6, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at 0.1 second intervals. In Reference Examples 4, 5, and 6, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10.

[0072]

[0073] (Evaluation of pit defects) The entire surfaces of the aluminum alloy substrates obtained in Examples 1 and 2, Comparative Examples 1 and 2, Reference Examples 1 to 6, and Reference Comparative Examples 1 to 5 were observed with an optical inspection machine (OSA7100 manufactured by KLA Tencor Corporation), and the number of pit defects on the entire surface of the substrate was counted. Evaluation of pit defects was performed on both surfaces of 50 aluminum alloy substrates (100 surfaces in total) for each Reference Comparative Example and Reference Example.

[0074] (Evaluation of Processing Time) When the processing time in the foreign matter removal step did not exceed a predetermined reference time, it was evaluated as "no extension." When the processing time in the foreign matter removal step exceeded a predetermined reference time, the number of seconds N by which the processing time exceeded the predetermined reference time was evaluated as "N-second extension."

[0075] As shown in Table 1, no pit defects were generated in Examples 1 and 2, whereas pit defects were generated in Comparative Examples 1 and 2.

[0076] As shown in Table 2, in Reference Examples 1 to 6, the number of pit defects was one or less. Furthermore, in Reference Examples 1 to 6, the processing time was not extended and the processing efficiency was also good. In Reference Comparative Examples 1 to 5, the number of pit defects was two or more. Furthermore, in Reference Comparative Examples 4 and 5, the processing time in the foreign matter removal step exceeded the predetermined reference time of one second.

[0077] The disclosures of Japanese Patent Application No. 2024-048654, filed on March 25, 2024, and Japanese Patent Application No. 2024-193629, filed on November 5, 2024, are incorporated herein by reference in their entirety. All documents, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A method for manufacturing a disk-shaped substrate, comprising: a first step of supplying a fluid to an adsorption surface of an adsorption unit that adsorbs one side of a disk-shaped substrate while the disk-shaped substrate is not being adsorbed, and removing foreign matter adhering to the adsorption surface; a second step of sucking the foreign matter removed from the adsorption surface while continuing to supply the fluid in the first step; a third step of adsorbing one side of the disk-shaped substrate to the adsorption surface to which the fluid has been supplied; and a fourth step of performing at least one process selected from the group consisting of cutting, grinding, and polishing on the disk-shaped substrate adsorbed on the adsorption surface.

2. The method for manufacturing a disk-shaped substrate according to claim 1, wherein a supply unit for supplying the fluid is provided in a holding unit that holds the disk-shaped substrate and transfers the disk-shaped substrate to the suction surface, and a suction unit that sucks up foreign matter removed from the suction surface is provided in the holding unit.

3. The method for manufacturing a disk-shaped substrate according to claim 2, wherein the supply unit and the suction unit move together with the holding unit, and the supply unit supplies the fluid to the suction surface before the disk-shaped substrate is transferred to the suction surface, and the suction unit sucks up the removed foreign matter.

4. A method for manufacturing a disk-shaped substrate as described in claim 2, wherein, while the holding unit holds the disk-shaped substrate with one surface facing the suction surface, the supply unit supplies the fluid to the suction surface and the suction unit sucks up the removed foreign matter.

5. A method for manufacturing a disk-shaped substrate according to claim 1, wherein the fluid is supplied to the suction surface while the suction surface is rotating and during a period when the disk-shaped substrate is not being suctioned, thereby removing foreign matter adhering to the suction surface.

6. The method for manufacturing a disk-shaped substrate according to claim 1, wherein in the first step, the fluid is intermittently supplied to the suction surface during a period when the disk-shaped substrate is not being suctioned, thereby removing foreign matter adhering to the suction surface.

7. The method for manufacturing a disk-shaped substrate according to claim 6, wherein the fluid is intermittently supplied at intervals of 0.05 seconds or more and 1 second or less.

8. A manufacturing device for a disk-shaped substrate, comprising: a processing device including an adsorption unit that adsorbs one surface of a disk-shaped substrate, and a processing unit that performs at least one process selected from the group consisting of cutting, grinding, and polishing on the disk-shaped substrate adsorbed to the adsorption unit; a foreign matter removal device including a supply unit that supplies a fluid to the adsorption surface of the adsorption unit, and supplies the fluid to the adsorption surface while the disk-shaped substrate is not adsorbed, thereby removing foreign matter adhering to the adsorption surface; and a foreign matter suction device that sucks in foreign matter removed from the adsorption surface when the foreign matter removal device supplies the fluid.

9. The disk-shaped substrate manufacturing apparatus according to claim 8, wherein the supply unit is provided in a holding unit that holds the disk-shaped substrate and transfers the disk-shaped substrate to the suction unit.

10. The disk-shaped substrate manufacturing apparatus according to claim 8, wherein the foreign matter removal device intermittently supplies the fluid during a period when the disk-shaped substrate is not being attracted to the attraction surface, thereby removing foreign matter adhering to the attraction surface.

11. The disk-shaped substrate manufacturing apparatus according to claim 10, wherein the fluid is intermittently supplied at intervals of 0.05 seconds or more and 1 second or less.

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