Light-emitting device

Abstract

Provided is a light-emitting device on which a plurality of light-emitting elements connected in series are mounted at high density. The light-emitting device has: a first support body; a plurality of light-emitting elements; and a plurality of second support bodies which each support at least one light-emitting element among the plurality of light-emitting elements and are disposed on the first support body in a state of being aligned in a first direction. In regions at both ends in a second direction intersecting with the first direction when viewed from the top, each of the plurality of second support bodies has provided, in a region at one end, a first wiring layer for connecting to a first electrode of the corresponding light-emitting element, and has provided, in a region at the other end, a second wiring layer for connecting to a second electrode of the corresponding light-emitting element. The first wiring layer has: a first connection region connected to the first electrode of the corresponding light-emitting element; and a first end region not connected to the light-emitting element and closer to said one end than the first connection region. The second wiring layer has: a second connection region connected to the second electrode of the corresponding light-emitting element; and a second end region not connected to the light-emitting element and closer to the other end than the second connection region. Between the second support bodies adjacent to each other in the first direction among the plurality of the second support bodies, the positions of the first end regions and the positions of the second end regions are reversed in the second direction.

Description

Light-emitting device

[0001] The present disclosure relates to a light emitting device.

[0002] For example, Patent Document 1 discloses an LED light source module in which a plurality of submounts, each having a plurality of LED (Light Emitting Diode) chips arranged in a line, are arranged on a long substrate.

[0003] Japanese Patent Application Laid-Open No. 2006-269078

[0004] An object of an embodiment of the present disclosure is to provide a light emitting device in which a plurality of light emitting elements connected in series are mounted at high density.

[0005] A light emitting device according to an embodiment of the present disclosure includes a first support, a plurality of light emitting elements, and a plurality of second supports, each supporting one or more of the plurality of light emitting elements and arranged on the first support in a first direction, wherein, in a top view, each of the plurality of second supports is provided with a first wiring layer connected to a first electrode of the light emitting element in the region at one end in a second direction intersecting with the first direction, and a second wiring layer connected to a second electrode of the light emitting element in the region at the other end, The second wiring layer has a first connection region which is a region connected to an electrode, and a first end region which is a region to which the light-emitting element is not connected and which is closer to the one end than the first connection region, and the second wiring layer has a second connection region which is a region to which the light-emitting element is connected and a second end region which is a region to which the light-emitting element is not connected and which is closer to the other end than the second connection region, and between the plurality of second supports adjacent to each other in the first direction, the positions of the first end region and the second end region are reversed in the second direction.

[0006] According to the embodiments of the present disclosure, it is possible to provide a light emitting device in which a plurality of light emitting elements connected in series are mounted at high density.

[0007] 1 is a schematic top view showing the overall configuration of the light emitting device according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. FIG. 3 is a schematic perspective view showing a second support and a light emitting element included in the light emitting device according to the first embodiment. FIG. 4 is a schematic perspective view illustrating a first end region and a second end region of the second support included in the light emitting device according to the first embodiment. FIG. 5 is a schematic perspective view illustrating a connection by wiring between second supports adjacent in a first direction. FIG. 6 is a schematic perspective view showing a first example of a light emitting module according to the second embodiment. FIG. 7 is a schematic perspective view showing a second example of a light emitting module according to the second embodiment. FIG. 8 is a schematic perspective view showing positions of a first mark and a second mark in a light emitting section of a light emitting device according to a third embodiment. FIG. 9 is a schematic top view showing a first example of wiring in a light emitting device according to the third embodiment. FIG. 10 is a schematic perspective view showing a second example of wiring in a light emitting device according to the third embodiment. FIG. 11 is a schematic perspective view showing a second example of wiring in a light emitting device according to the third embodiment. FIG. 12 is a schematic top view showing a first example of a light emitting module according to a fourth embodiment. FIG. 13 is a schematic perspective view showing a first example of a light emitting module according to the fourth embodiment. FIG. 10 is a schematic top view showing a second example of the light emitting module according to the fourth embodiment. FIG. 11 is a schematic perspective view showing the second example of the light emitting module according to the fourth embodiment. FIG. 12 is a first view explaining the operation of the light emitting module according to the fourth embodiment. FIG. 13 is a second view explaining the operation of the light emitting module according to the fourth embodiment. FIG. 14 is a schematic top view showing a first example of the light emitting module according to the fifth embodiment. FIG. 15 is a schematic top view showing a second example of the light emitting module according to the fifth embodiment. FIG. 16 is a schematic top view showing a third example of the light emitting module according to the fifth embodiment. FIG. 17 is a schematic top view showing a fourth example of the light emitting module according to the fifth embodiment.

[0008] Light-emitting devices according to embodiments of the present disclosure will be described in detail with reference to the drawings. However, the embodiments shown below are merely illustrative of light-emitting devices that embody the technical concepts of the present embodiments and are not limited thereto. Furthermore, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of components described in the embodiments are not intended to limit the scope of the present disclosure to those specific embodiments, and are merely illustrative examples. The size, positional relationship, etc. of components shown in each drawing may be exaggerated for clarity. In the following description, identical names and symbols indicate identical or similar components, and detailed descriptions will be omitted as appropriate. An end view showing only the cut surface may be used as a cross-sectional view.

[0009] In the drawings shown below, directions may be indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular directions. The X-direction along the X-axis and the Y-direction along the Y-axis indicate directions along the light-emitting surface of the light-emitting element provided in the light-emitting device according to the embodiment. The Z-direction along the Z-axis indicates a direction perpendicular to the light-emitting surface. In other words, the light-emitting surface of the light-emitting element is parallel to the XY plane, and the Z-axis is perpendicular to the XY plane. The X-direction corresponds to the second direction. The Y-direction corresponds to the first direction. In this specification, the X-direction is referred to as the second direction X, and the Y-direction is referred to as the first direction Y.

[0010] The direction in which the arrow points in the X direction is denoted as the +X side, and the side opposite the +X side is denoted as the -X side. The direction in which the arrow points in the Y direction is denoted as the +Y side, and the side opposite the +Y side is denoted as the -Y side. The direction in which the arrow points in the Z direction is denoted as the +Z side, and the side opposite the +Z side is denoted as the -Z side. As an example, the light-emitting element provided in the light-emitting device according to the embodiment emits light in the +Z side. Furthermore, the term "top view" in the embodiments refers to viewing an object from the light-emitting surface side of the light-emitting device according to the embodiment. Note that in this specification, in addition to portions that can be directly viewed from above, portions that cannot be directly viewed from above may also be described as being seen through the light. However, these do not limit the orientation of the light-emitting device according to the embodiment during use, and the orientation of the light-emitting device according to the embodiment is arbitrary.

[0011] In this specification, the surface of an object when viewed from the +Z side is referred to as the "top surface," and the surface of an object when viewed from the -Z side is referred to as the "bottom surface." Viewing an object from the +Z side is referred to as a top view. In the following embodiments, "along the X-axis, Y-axis, and Z-axis" includes the object having a tilt within a range of ±10 degrees relative to these axes. Furthermore, in this embodiment, "orthogonal" may include an error within ±10 degrees from 90 degrees. "Placing" is not limited to direct contact, but also includes indirect placement, for example via another member.

[0012] In this specification or claims, when there are multiple elements of a certain type and they are to be expressed separately, the elements may be distinguished by prefixing them with "first," "second," etc. Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not coincide between the specification and the claims.

[0013] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked with "first" and "third" are recited in the claims, or if the elements marked with "first" and the elements not marked with a specific ordinal number are recited in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for ease of reading. In this case, the elements marked with "first" and "second" in the claims refer to the elements marked with "first" and "third" in this specification or the elements not marked with a specific ordinal number, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0014] [First Embodiment] <Configuration of Light-Emitting Device According to First Embodiment> The configuration of the light-emitting device according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a schematic top view showing an example of the overall configuration of a light-emitting device 100 according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. FIG. 3 is a schematic perspective view showing an example of a second support 2 and a light-emitting element 3 included in the light-emitting device 100 according to the first embodiment. FIG. 4 is a schematic perspective view illustrating an example of a first end region 272 and a second end region 282 of the second support 2 included in the light-emitting device 100 according to the first embodiment. FIG. 5 is a schematic perspective view illustrating an example of a connection between adjacent second supports 2 in the first direction via wiring 25.

[0015] 3 and 4 show a light-emitting section 150 included in the light-emitting device 100. The light-emitting section 150 in FIGS. 3 and 4 includes one second support 2 and two light-emitting elements 3 arranged on the one second support 2. FIG. 5 also shows light-emitting sections 150-1 and 150-2 included in the light-emitting device 100. The light-emitting section 150-1 includes a second support 2-1 of the multiple second supports 2 and two light-emitting elements 3 arranged on the second support 2-1. The light-emitting section 150-2 includes a second support 2-2 of the multiple second supports 2 and two light-emitting elements 3 arranged on the second support 2-2.

[0016] (Overall Configuration) As shown in FIGS. 1 and 2 , the light-emitting device 100 includes a first support 1, a plurality of light-emitting elements 3, and a plurality of second supports 2 arranged on the first support 1 in the first direction Y, each supporting at least one of the plurality of light-emitting elements 3. In the example shown in FIGS. 1 and 2 , the plurality of second supports 2 includes four second supports 2. The plurality of light-emitting elements 3 includes two light-emitting elements 3 on each of the four second supports 2. Therefore, the plurality of light-emitting elements 3 includes eight light-emitting elements 3. The light-emitting device 100 shown in FIGS. 1 and 2 also includes a frame 4 bonded to the first support 1 and surrounding the plurality of second supports 2 in a top view, a translucent member 5 disposed on the plurality of light-emitting elements 3, and a bonding member 6 bonding the first support 1 and the second support 2. The first support 1 and the frame 4 are disposed on the +Z side of a support substrate 7. The light emitting device 100 uses the light emitting surface 31 of each of the plurality of light emitting elements 3 as a main light emitting surface, and emits light upward.

[0017] 3 , in this embodiment, in a top view, each of the multiple second supports 2 has a first wiring layer 27 connected to the first electrode 321-1 of the light-emitting element 3 in one end region in a second direction X intersecting the first direction Y. Furthermore, a second wiring layer 28 connected to the second electrode 322-2 of the light-emitting element 3 is provided in the other end region of the end regions. The first wiring layer 27 has a first connection region 271 that is connected to the first electrode 321-1 of the light-emitting element 3, and a first end region 272 that is not connected to the light-emitting element 3 and is closer to one end than the first connection region 271. The second wiring layer 28 has a second connection region 281 that is connected to the second electrode 322-2 of the light-emitting element 3, and a second end region 282 that is not connected to the light-emitting element 3 and is closer to the other end than the second connection region 281. Among the plurality of second supports 2, between the second supports 2 adjacent to each other in the first direction Y, the positions of the first end regions 272 and the second end regions 282 are reversed in the second direction X.

[0018] In the example shown in FIG. 3 , the first connection region 271 and the second connection region 281 are disposed on the upper surface 21 of the second support 2 and are regions hidden (located) on the −Z side of the light-emitting element 3. The first end region 272 is disposed on the upper surface 21 of the second support 2 and is located outside the first connection region 271 in a top view. The second end region 282 is disposed on the upper surface 21 of the second support 2 and is located outside the second connection region 281 in a top view. However, it is sufficient that at least a portion of the first end region 272 is located outside the first connection region 271 in a top view. It is sufficient that at least a portion of the second end region 282 is located outside the second connection region 281. Furthermore, the word "connected" in the first connection region 271 and the second connection region 281 means that they are in contact and connected.

[0019] The fact that the positions of the first end region 272 and the second end region 282 are reversed in the second direction X will be explained from another perspective. In the example shown in FIG. 1 , the multiple second supports 2 include second support 2-1, second support 2-2, second support 2-3, and second support 2-4. In each of the multiple light-emitting units 150, the first electrode 321-1 to which the first end region 272 is connected is an anode electrode, and the second electrode 322-2 to which the second end region 282 is connected is a cathode electrode. In the second support 2-1, the first end region 272 is located on the −X side, and the second end region 282 is located on the +X side. In the second support 2-2, the first end region 272 is located on the +X side, and the second end region 282 is located on the −X side. In the second support 2-3, the first end region 272 is located on the −X side, and the second end region 282 is located on the +X side. In the second support 2-4, the first end region 272 is located on the +X side, and the second end region 282 is located on the −X side.

[0020] 1, between the second supports 2-1 and 2-2 adjacent to each other in the first direction Y, the positions of the first end region 272 and the second end region 282 are reversed in the second direction X. Furthermore, between the second supports 2-2 and 2-3 adjacent to each other in the first direction Y, the positions of the first end region 272 and the second end region 282 are reversed in the second direction X. Furthermore, between the second supports 2-3 and 2-4 adjacent to each other in the first direction Y, the positions of the first end region 272 and the second end region 282 are reversed in the second direction X.

[0021] Here, for example, if the first end region 272 and the second end region 282 are arranged between second supports 2 adjacent to each other in the first direction Y without being reversed in the second direction X, it is necessary to arrange wiring so as to cross between the second supports 2 aligned in the first direction Y. As a result, it is not possible to arrange multiple second supports 2 aligned in the first direction Y at short intervals, and high-density mounting may not be possible.

[0022] In this embodiment, by reversing the positions of the first end region 272 and the second end region 282 in the second direction X between second supports 2 adjacent to each other in the first direction Y, the positions corresponding to the cathode electrode and the positions corresponding to the anode electrode are reversed in the second direction X. This makes it possible to shorten the distance between second supports 2 adjacent to each other in the first direction Y when connecting a plurality of light-emitting elements 3 electrically in series, and to mount a plurality of light-emitting elements 3 at high density in the first direction Y. As described above, in this embodiment, it is possible to provide a light-emitting device 100 in which a plurality of light-emitting elements 3 connected in series are mounted at high density.

[0023] Furthermore, in this embodiment, by mounting multiple light-emitting elements 3 at a high density, the light-emitting device 100 can be made smaller and the optical density of the light emitted from the light-emitting device 100 can be increased. By increasing the optical density, a larger amount of light can be irradiated per unit area on the irradiation surface irradiated with the light emitted from the light-emitting device 100. Furthermore, in this embodiment, since multiple light-emitting elements 3 are connected in series, a common power supply can be used to supply current to each of the multiple light-emitting elements 3. This simplifies the configuration of the power supply that supplies current to the light-emitting device 100, reduces the effect of differences in applied voltage between the multiple light-emitting elements 3, and reduces variations in the amount of light emitted between the multiple light-emitting elements 3.

[0024] In the light-emitting device 100, the light-emitting elements 3 arranged on each of the second supports 2 are electrically connected in series by connecting the plurality of second supports 2 in series via wiring 25. Furthermore, the light-emitting device 100 is not limited to a configuration in which the first electrode 321-1 is an anode electrode and the second electrode 322-2 is a cathode electrode, and the first electrode 321-1 may be a cathode electrode and the second electrode 322-2 an anode electrode.

[0025] 3, the one or more light-emitting elements 3 are composed of a first light-emitting element 3-1 and a second light-emitting element 3-2. The first light-emitting element 3-1 includes a first electrode 321-1 and a second electrode 322-1 located on the side of the first light-emitting element 3-1 facing the second support 2. The first electrode 321-1 is electrically connected to the first wiring layer 27. The second electrode 322-1 is electrically connected to the third wiring layer 29. The second light-emitting element 3-2 includes a first electrode 321-2 and a second electrode 322-2 located on the side of the second light-emitting element 3-2 facing the second support 2. The first electrode 321-2 is electrically connected to the third wiring layer 29. The second electrode 322-2 is electrically connected to the second wiring layer 28.

[0026] The first electrode 321-1 is connected to the first wiring layer 27, the second electrode 322-1 and the first electrode 321-2 are connected to the third wiring layer 29, and the second electrode 322-2 is connected to the second wiring layer 28. This allows the multiple light-emitting elements 3 to be densely mounted in the second direction X using multiple second supports 2, each supporting the first light-emitting elements 3-1 and the second light-emitting elements 3-2 aligned in the second direction X. Furthermore, by arranging multiple supports in the first direction Y, each supporting the first light-emitting elements 3-1 and the second light-emitting elements 3-2 aligned in the second direction X, the multiple light-emitting elements 3 can be arranged in two axial directions. Therefore, compared to when the multiple light-emitting elements 3 are aligned in a uniaxial direction, the multiple light-emitting elements 3 can be densely mounted on the first support 1. Note that the one or more light-emitting elements 3 are not limited to two light-emitting elements 3, the first light-emitting element 3-1 and the second light-emitting element 3-2, but may be two or more light-emitting elements 3 including the first light-emitting element 3-1 and the second light-emitting element 3-2.

[0027] In the light emitting device 100, each of the multiple second supports 2 has the same size and material. By making the sizes and materials of the multiple second supports the same, it is possible to standardize components. The size and material being the same means that they are the same to the extent that they allow for the components to be standardized. This reduces the cost of the light emitting device 100 and makes it easier to mount the multiple second supports 2.

[0028] 4, the second support 2 has a first mark 26-1 for positioning at least one of the light-emitting element 3 and the second support 2 provided in a central region 272-2 in the first direction Y of the first end region 272. Furthermore, a second mark 26-2 for positioning at least one of the light-emitting element 3 and the second support 2 provided in a central region 282-2 in the first direction Y of the second end region 282. The first mark 26-1 consists of one circle, and the second mark 26-2 consists of two circles. However, the first mark 26-1 and the second mark 26-2 are not limited to circles and may be figures of any shape.

[0029] The second mark 26-2, which is made up of two circles, is aligned in the second direction X. By configuring the second mark 26-2 with two circles, the wiring 25 can be placed between the two circles, which has the effect of making the second mark 26-2 less likely to be hidden by the wiring 25. Furthermore, the first mark 26-1 and the second mark 26-2 make it possible to distinguish between the anode and the cathode.

[0030] 1 , the plurality of second supports 2 are connected to each other by arranging wiring 25 that connects adjacent second supports 2 in the first direction Y in the first end region 272 and the second end region 282 of each of the plurality of second supports 2. Examples of the wiring 25 include linear wires and ribbon-like wires.

[0031] On the other hand, when at least one of the light-emitting element 3 and the second support 2 is arranged in the light-emitting device 100, a positioning mark is used. As a method of arranging the wiring 25, for example, the following (1) and (2) are conceivable. (1) The wiring 25 is arranged in one region 272-1 of both end regions of the first end region 272 and one region 282-1 of both end regions of the second end region 282. (2) When viewed from above, the wiring 25 is arranged in the other region 272-3 of both end regions of the first end region 272 and the other region 282-3 of both end regions of the second end region 282.

[0032] 1, the second mark 26-2, which is made up of two circles, is aligned in the second direction X. By configuring the second mark 26-2 with two circles, the wiring 25 can be placed between the two circles, which has the effect of making the second mark 26-2 less likely to be hidden by the wiring 25. Furthermore, the first mark 26-1 and the second mark 26-2 can distinguish between the anode and the cathode.

[0033] 4 and 5, one region 272-1 and the other region 272-3 are regions to which the wiring 25 is connected. The central region 272-2 is a region sandwiched between the one region 272-1 and the other region 272-3. The central region 282-2 is a region sandwiched between the one region 282-1 and the other region 282-3.

[0034] In order to arrange the positioning marks in accordance with the arrangement methods (1) and (2) above so as not to interfere with the arrangement of the wiring 25, in the above (1), the marks need to be arranged in a position that avoids one region 272-1 of both end regions of the first end region 272 and one region 282-1 of both end regions of the second end region 282, and in the above (2), the marks need to be arranged in a position that avoids the other region 272-3 of both end regions of the first end region 272 and the other region 282-3 of both end regions of the second end region 282. In this case, if the regions in which the marks are arranged in the first end region 272 and the second end region 282 are made different depending on whether the regions in which the marks are arranged are provided in the first end region 272 and the second end region 282 in accordance with the above (1) or the regions in which the marks are arranged in the first end region 272 and the second end region 282 in accordance with the above (2), the process of arranging the marks on the second support 2 in the manufacturing process of the light-emitting device becomes time-consuming, which may increase the cost of the light-emitting device.

[0035] As shown in FIG. 4 , in the light-emitting unit 150, the first mark 26-1 is arranged in a central region 272-2 of the first end region 272 of the second support 2, and the second mark 26-2 is arranged in a central region 282-2 of the second end region 282. By arranging the first mark 26-1 in the central region 272-2, space can be secured on both sides of the central region 272-2 in the first direction Y, so that the arrangement of the wiring 25 is not hindered. Similarly, by arranging the second mark 26-2 in the central region 282-2, space can be secured on both sides of the central region 272-2 in the first direction Y, so that the arrangement of the wiring 25 is not hindered. As described above, whether the above arrangement method (1) or (2) is used, the arrangement of the wiring 25 can be unhindered. Furthermore, since there is no need to arrange the first mark 26-1 and the second mark 26-2 in different areas in accordance with the arrangement methods (1) and (2) above, the labor involved in the manufacturing process can be reduced, and the cost of the light-emitting device 100 can be reduced.

[0036] In a light-emitting device 100 in which the positions of the first electrode 321-1 and the second electrode 322-2 are reversed in the second direction X between adjacent second supports 2 in the first direction Y, the above (1) is true for one second support 2-1, and the above (2) is true for the other adjacent second support 2-2.

[0037] As shown in FIG. 5 , in this embodiment, the light emitting device 100 has a plurality of wirings 25 including a first wiring 25-1 and a second wiring 25-2. Of the adjacent second supports 2-1 and 2-2, the first wiring 25-1 is joined to a first end region 272 of one of the second supports 2-1. The second wiring 25-2 is joined to the first end region 272 of the other of the second supports 2-2. The plurality of wirings 25 further includes a third wiring 25-3. Of the adjacent second supports 2-1 and 2-2, the third wiring 25-3 is joined to a second end region 282 of one of the second supports 2-1. The first wiring 25-1 is joined to the second end region 282 of the other of the second supports 2-2. Such wiring allows for high-density packaging.

[0038] In the example shown in FIG. 5 , the light-emitting section 150 has a plurality of wirings 25 including a first wiring 25-1 and a second wiring 25-2. In the first end region 272 of one of the adjacent second supports 2-1 and 2-2, the first wiring 25-1 is bonded to one region 272-1 of both end regions of the first end region 272. In the first end region 272 of the other second support 2-2, the second wiring 25-2 is bonded to the other region 272-3 of both end regions of the first end region 272. With this configuration, when connecting a plurality of second supports 2 in series, the wiring 25 connecting adjacent second supports 2 in the first direction Y can be shortened, allowing a plurality of light-emitting elements 3 to be densely mounted in the first direction Y. Therefore, a light-emitting device 100 can be provided in which a plurality of light-emitting elements 3 connected in series are densely mounted.

[0039] In the example shown in FIG. 5 , the multiple wirings 25 further include a third wiring 25-3. In the second end region 282 of one of the adjacent second supports 2-1 and 2-2, the third wiring 25-3 is joined to one region 282-1 of both end regions of the second end region 282. Furthermore, in the second end region 282 of the other second support 2-2, the first wiring 25-1 is joined to the other region 282-3 of both end regions of the second end region 282. With this configuration, when multiple second supports 2 are connected in series, the wiring 25 connecting adjacent second supports 2 in the first direction Y can be shortened, allowing multiple light-emitting elements 3 to be densely mounted in the first direction Y. Therefore, it is possible to provide a light-emitting device 100 in which multiple light-emitting elements 3 connected in series are densely mounted.

[0040] In the example shown in FIGS. 1 and 2 , the first support 1 is a conductive heat dissipation member. For example, if the first support 1 is conductive, wiring 25 for supplying current to the plurality of light-emitting elements 3 cannot be patterned on the first support 1, which may complicate the configuration for supplying current to each of the plurality of light-emitting elements 3. In contrast, by reversing the positions of the first end region 272 and the second end region 282 in the second direction X between second supports 2 adjacent to each other in the first direction Y, the plurality of second supports 2 can be connected by wiring 25 without patterning the wiring 25 on the first support 1. This simplifies the configuration for supplying current to each of the plurality of light-emitting elements 3, even when the first support 1 is conductive. Furthermore, using a conductive heat dissipation member for the first support 1 allows the use of a material with high heat dissipation properties, such as copper, for the first support 1, thereby improving the heat dissipation efficiency of the light-emitting device 100.

[0041] In the light-emitting device 100 shown in FIGS. 1 and 2 , the first support 1 includes a mounting surface 11, and the width W1y of the mounting surface 11 in the first direction Y is larger than the width W1x of the mounting surface 11 in the second direction X, which is perpendicular to the first direction Y. Each of the multiple second supports 2 has a width W2y in the first direction Y smaller than its width W2x in the second direction X. Furthermore, in the top view, the minimum rectangle 20 that encompasses all of the multiple second supports 2 has a width W4y in the first direction Y larger than its width W4x in the second direction X. In the example shown in FIG. 1 , the minimum rectangle 20 is represented by a dashed line. However, for ease of understanding, the dashed line is depicted slightly larger than the minimum rectangle 20. Furthermore, because the width W2x of the second support 2 and the width W4x of the minimum rectangle 20 are equal in the second direction X, the widths W2x and W4x are both indicated by symbols.

[0042] In the light emitting device 100, by arranging a plurality of second supports 2 on the mounting surface 11 so that the plurality of second supports 2 are aligned in the first direction Y, the length of the second support 2 in the first direction Y is shorter than when using one second support 2 having a length similar to that of the first support 1. This reduces warping of the first support 1 and reduces the deterioration in heat dissipation caused by a portion of the second support 2 not contacting the first support 1 due to the warping of the first support 1. By reducing the deterioration in heat dissipation, the light emitting device 100 can suppress a temperature rise in the light emitting device 100 having a plurality of light emitting elements 3.

[0043] In the light emitting device 100, a plurality of second supports 2 are arranged in a first direction Y, on each of which a plurality of light emitting elements 3 are arranged in a second direction X. As a result, in this embodiment, the plurality of light emitting elements 3 can be arranged on the mounting surface 11 in two axial directions, the first direction Y and the second direction X.

[0044] In the light emitting device 100, the number of second supports 2 arranged in the first direction Y is greater than the number of light emitting elements 3 arranged in the second direction X on the second supports 2. This makes it possible to ensure space in the light emitting device 100 for providing first end regions 272 and second end regions 282 on the second supports 2 in the second direction X. By ensuring space for providing the first end regions 272 and second end regions 282, this space can be used, for example, as a region for arranging wiring for supplying current to the light emitting elements 3.

[0045] In the light-emitting device 100, the frame 4 is mainly made of a material different from the main material of the first support 1. For example, the frame 4 can be mainly made of a ceramic material, and the first support 1 can be mainly made of a metal material such as copper. Here, the main material refers to the material that accounts for the largest proportion of the mass or volume of the target formation. Note that when the target formation is formed from a single material, that material is the main material. In other words, when a material is the main material, it includes the possibility that the proportion of that material can be 100%.

[0046] Because ceramic materials have a smaller coefficient of linear expansion than metal materials, the difference in the coefficient of linear expansion between the frame body 4 and the first support 1 makes it easier for warping to occur in the first support 1. In contrast, in the light-emitting device 100, the length of the second support 2 in the first direction Y is shorter than when a second support 2 having approximately the same length as the first support 1 is used, and therefore warping of the first support 1 can be reduced. As a result, in the light-emitting device 100, a decrease in heat dissipation caused by a part of the second support 2 not coming into contact with the first support 1 due to warping of the first support 1 is reduced, and a temperature rise in the light-emitting device 100 can be suppressed.

[0047] The main material of the frame body 4 is not limited to a ceramic material. Moreover, the main material of the first support body 1 is not limited to a metal material such as copper. Furthermore, the linear expansion coefficient of the frame body 4 is not limited to being smaller than that of the first support body 1. Even if the linear expansion coefficient of the frame body 4 is larger than that of the first support body 1, the effect of suppressing the temperature rise of the light emitting device 100 can be obtained.

[0048] In the light-emitting device 100, the first support 1 has a higher thermal conductivity than the second support 2. For example, if the first support 1 is primarily made of a metal material such as copper and the second support 2 is primarily made of a ceramic material, the first support 1 will have a higher thermal conductivity than the second support 2. This makes it easier for heat generated by the light emission of the light-emitting element 3 arranged on the second support 2 to be discharged to the outside of the light-emitting device 100 through the first support 1, compared to when the thermal conductivity of the first support 1 is the same as or lower than that of the second support 2. By discharging heat to the outside, the light-emitting device 100 can suppress temperature increases.

[0049] The light-emitting element 3 is, for example, a light-emitting diode (LED). In the light-emitting device 100, in a configuration in which a plurality of light-emitting diodes are used as the plurality of light-emitting elements 3, the plurality of light-emitting elements 3 connected in series can be densely mounted. Furthermore, by using a material with high heat dissipation properties, such as copper, for the first support 1, it is possible to suppress a temperature rise in the light-emitting device 100 having light-emitting diodes.

[0050] The light-emitting diodes constituting the light-emitting elements 3 emit ultraviolet light. In the light-emitting device 100, in a configuration in which the light-emitting elements 3 are each made up of a plurality of light-emitting diodes that emit ultraviolet light, the plurality of light-emitting elements 3 connected in series can be densely mounted. Furthermore, light-emitting diodes that emit ultraviolet light tend to have insufficient light-emitting efficiency compared to light-emitting diodes that emit visible light, and tend to be prone to temperature increases during operation. However, by using a material with high heat dissipation properties, such as copper, for the first support 1, the temperature increase of the light-emitting diodes can be suppressed. Furthermore, the light-emitting elements 3 may be, for example, vertical-cavity surface-emitting lasers (VCSELs).

[0051] In the example shown in FIGS. 1 and 2 , the number of second supports 2 aligned in the first direction Y is four, and the number of light-emitting elements 3 aligned in the second direction X is two. Therefore, the number of second supports 2 aligned in the first direction Y is two more than the number of light-emitting elements 3 aligned in the second direction X. This allows the light-emitting device 100 to secure space for providing the first end regions 272 and the second end regions 282 on the second supports 2 in the second direction X. By securing the space for providing the first end regions 272 and the second end regions 282, the space can be used, for example, as a region for arranging wiring 25 for supplying current to the light-emitting elements 3. Note that the light-emitting device 100 can still achieve the above-described effect of securing space for providing the first end regions 272 and the second end regions 282 even when the number of second supports 2 aligned in the first direction Y is one or more more than the number of light-emitting elements 3 aligned in the second direction X.

[0052] Each component of the light emitting device 100 will be described in detail below.

[0053] (First Support 1) As shown in Figures 1 and 2, the first support 1 is a member surrounded by the frame 4 and disposed at the bottom of the frame 4. The first support 1 is bonded to the frame 4. The mounting surface 11 is located below the upper surface 41 of the frame 4 and above the lower surface 42 of the frame 4. The mounting surface 11 is the upper surface of the first support 1. When viewed from above, the mounting surface 11 has a rectangular shape having short and long sides. The short sides of the mounting surface 11 are the sides of the mounting surface 11 extending in the first direction Y. The long sides of the mounting surface 11 are the sides of the mounting surface 11 extending in the second direction X. It is preferable that the width W1y be 150% or more and 300% or less of the width W1x. However, the width W1y does not necessarily have to be longer than the width W1x, and may be shorter than the width W1x.

[0054] The first support 1 has a mounting surface 11 and is formed mainly from a metal or a composite containing a metal, such as copper.

[0055] (Second Support 2) As shown in FIG. 2 , the second support 2 is disposed on the mounting surface 11 of the first support 1. The light-emitting element 3 and the first support 1 are electrically insulated by the second support 2. In the light-emitting device 100, the bonding area between the lower surface 22 of the second support 2 and the mounting surface 11 of the first support 1 is 50% or more of the area of ​​the lower surface 22 of the second support 2. In the light-emitting device 100, the distance dy between adjacent second supports 2 in the first direction Y in FIG. 1 is preferably 50 μm or more and 500 μm or less. In addition, the distance dy between adjacent second supports 2 in the first direction Y is preferably 3.33% or more and 30% of the width W2y of the second support 2 in the first direction Y, which allows multiple light-emitting elements 3 to be mounted at high density in the first direction Y.

[0056] The second support 2 has an upper surface 21, a lower surface 22, and at least one of a plurality of side surfaces 23. As shown in Fig. 1 , the upper surface 21 has a rectangular shape when viewed from above. The upper surface 21 has short sides and long sides. The short sides of the upper surface 21 are sides of the upper surface 21 that extend in the first direction Y. The long sides of the upper surface 21 are sides of the upper surface 21 that extend in the second direction X.

[0057] The second support 2 is configured in the shape of a rectangular parallelepiped. The distance between the upper surface 21 and the lower surface 22 of the second support 2 is smaller than the distance between the other two opposing surfaces. This distance between the upper surface 21 and the lower surface 22 is called the thickness of the second support 2. However, the shape of the second support 2 is not limited to a rectangular parallelepiped.

[0058] A placement area 24 is provided on the top surface 21. Other components are placed in the placement area 24. The placement area 24 ensures a space in which the other components are placed. The shape of the placement area 24 corresponds to the shape of the component to be placed there.

[0059] It is preferable that the long sides of the upper surfaces 21 of the plurality of second supports 2 arranged side by side in the first direction Y are parallel to each other. Here, the "parallel" allows for a difference of ±3 degrees. By arranging the plurality of second supports 2 so that the long sides of the upper surfaces 21 are parallel to each other, the plurality of second supports 2 can be arranged at high density.

[0060] The width W2y of the second support 2 in the first direction Y is preferably 500 μm or more and 1500 μm or less. The width W2x of the second support 2 in the second direction X is preferably 1000 μm or more and 3000 μm or less. The width W2x is preferably 150% or more and 300% or less of the width W2y. However, the width W2x does not necessarily have to be longer than the width W2y, and may be shorter than the width W2y. The thickness of the second support 2 is preferably 150 μm or more and 1000 μm or less.

[0061] The second support 2 has a main body 50, a first wiring layer 27, a second wiring layer 28, and a third wiring layer 29. The main body 50 may be made of, for example, silicon nitride, aluminum nitride, or silicon carbide.

[0062] (Light-emitting element 3) The light-emitting element 3 is disposed on the upper surface 21 of the second support 2. The light-emitting element 3 uses each of the light-emitting surfaces 31 as a main light-emitting surface and emits light upward. A light-emitting diode can be used as the light-emitting element 3. The light-emitting element 3 can also emit ultraviolet light. The peak wavelength of the ultraviolet light emitted by the light-emitting element 3 is, for example, not less than 200 nm and not more than 410 nm.

[0063] The number of light-emitting elements 3 included in the light-emitting device 100 is not limited to eight and can be changed as appropriate depending on the intended use of the light-emitting device 100. The number of light-emitting elements 3 arranged on one second support 2 can also be changed as appropriate. In Figures 1 and 3, width W3y is the width of the light-emitting element 3 in the first direction Y. Width W3x is the width of the light-emitting element 3 in the second direction X.

[0064] 1, the frame 4 is a frame member formed primarily of ceramics and having a wiring pattern 46. Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. However, the primary material of the frame 4 is not limited to ceramics.

[0065] The frame 4 has an upper surface 41, a lower surface 42, and at least one outer surface 43. When viewed from above, the outer edge of the frame 4 is rectangular. This rectangle may have long and short sides. In the frame 4, the long side of the rectangle is oriented in the same direction as the first direction Y, and the short side is oriented in the same direction as the second direction X.

[0066] As shown in FIG. 2 , a through-hole 40 is formed in the frame body 4. The through-hole 40 is a hole that penetrates downward from an upper surface 41 to a lower surface 42. A recess is defined by the through-hole 40 in the frame body 4. This recess is surrounded by the upper surface 41 when viewed from above. The frame body 4 is not limited to having the through-hole 40, and may have a recessed shape that is recessed from the upper surface 41 downward below the upper surface 41. In this case, the first support 1 is disposed on the bottom surface of the recessed shape.

[0067] The inner edge of the upper surface 41 defines the outer edge of the recess. When viewed from above, the outer edge of the recess has a rectangular shape. This rectangle can have long and short sides. In the frame 4, the long side of this rectangle is in the same direction as the first direction Y, and the short side is in the same direction as the second direction X. Note that the outer edge of this recess does not have to be rectangular.

[0068] The frame body 4 has at least one inner side surface 44. The at least one inner side surface 44 is located above the mounting surface 11. The at least one inner side surface 44 intersects with the upper surface 41. The at least one inner side surface 44 is included in the multiple surfaces that define the recess of the frame body 4. The at least one inner side surface 44 is arranged perpendicular to the mounting surface 11. Here, the perpendicularity allows for a difference of ±3 degrees. Note that the inner side surface 44 does not have to be perpendicular to the mounting surface 11.

[0069] The frame 4 has at least one step portion 45. The step portion 45 has an upper surface and an inner surface that intersects with the upper surface and extends downward from the upper surface. The upper surface of the step portion 45 intersects with the inner surface 44. The step portion 45 is formed along part or all of the inner surface 44 in a top view. The at least one step portion 45 is formed inside the upper surface 41 in a top view. The at least one step portion 45 is formed inside at least one inner surface 44 in a top view.

[0070] The frame 4 may have a plurality of step portions 45. The plurality of step portions 45 includes a step portion 45 formed along the inner surface 44 in a top view. The plurality of step portions 45 includes a step portion 45 formed along the entire inner surface 44 in a top view.

[0071] 1 , at least one wiring pattern 46 is provided on the upper surface of the step portion 45. The wiring pattern 46 is electrically connected to other wiring patterns via wiring passing through the inside of at least one of the first support 1 and the frame body 4. The other wiring patterns are provided on the lower surface of at least one of the first support 1 and the frame body 4. The wiring pattern 46 may be electrically connected to wiring patterns provided on the upper surface 41 or the outer surface 43.

[0072] In the frame body 4, the location where the wiring pattern 46 is provided is not limited to the step portion 45. It can be said that the frame body 4 has a wiring portion provided for electrical connection, and in the frame body 4 shown in Figures 1 and 2, the step portion 45 also serves as the wiring portion.

[0073] (Light-transmitting member 5) The light-transmitting member 5 has a lower surface and an upper surface, and is configured in the shape of a rectangular parallelepiped flat plate. However, it does not have to be a rectangular parallelepiped. The light-transmitting member 5 has light-transmitting properties that allow light to pass through. Here, light-transmitting means that the transmittance for light is 80% or more. However, it is not necessary for the transmittance for light of all wavelengths to be 80% or more. Since the light-emitting device 100 emits ultraviolet light, the transmittance for at least ultraviolet light is 80% or more. The light-transmitting member 5 may have a non-light-transmitting region (a region that does not have light-transmitting properties) in part.

[0074] The light-transmitting member 5 is formed using glass as a main material. The main material forming the light-transmitting member 5 is a material having high light transmittance. The light-transmitting member 5 is not limited to glass, and may be formed using sapphire as a main material, for example.

[0075] 2, the bonding member 6 is disposed between the second support 2 and the first support 1. The bonding member 6 is a member that bonds the second support 2 and the first support 1. The bonding member 6 can be made of Au paste or the like.

[0076] (Supporting Substrate 7) The supporting substrate 7 is a plate-shaped member that supports the light emitting device 100. The supporting substrate 7 is made of, for example, copper as its main material.

[0077] [Second embodiment] A light-emitting module according to a second embodiment will be described with reference to Figures 6 and 7. Note that the same names and symbols as those in the embodiments of the present disclosure already described indicate the same or similar components or configurations, and detailed descriptions thereof will be omitted as appropriate. This also applies to the embodiments described below.

[0078] Fig. 6 is a schematic perspective view showing a first example of a light emitting module 200 according to the second embodiment. Fig. 7 is a schematic perspective view showing a second example of a light emitting module 200 according to the second embodiment.

[0079] The light-emitting module 200 includes a plurality of light-emitting devices 100 and a support substrate 7 that supports each of the light-emitting devices 100. The support substrate 7 is a plate-shaped member that supports the light-emitting devices 100. The support substrate 7 is made primarily of copper, for example. The light-emitting module 200 emits light emitted from each of the light-emitting devices 100 upward.

[0080] In a first example shown in Fig. 6, the light-emitting module 200 has six light-emitting devices 100. The six light-emitting devices 100 are arranged in a matrix, with two light-emitting devices 100 aligned in the first direction Y and three light-emitting devices 100 aligned in the second direction X. In a second example shown in Fig. 7, the light-emitting module 200 has twelve light-emitting devices 100. The twelve light-emitting devices 100 are arranged in a matrix, with three light-emitting devices 100 aligned in the first direction Y and four light-emitting devices 100 aligned in the second direction X.

[0081] The light emitting module 200 can emit a large amount of light by combining light from the plurality of light emitting devices 100. The number of light emitting devices 100 included in the light emitting module 200 is not limited to six or twelve, and can be changed as appropriate depending on the intended use of the light emitting module 200. Furthermore, the number of the plurality of light emitting devices 100 arranged in each of the first direction Y and the second direction X in the light emitting module 200 can also be changed as appropriate depending on the intended use of the light emitting module 200. Furthermore, the arrangement of the plurality of light emitting devices 100 is not limited to a matrix arrangement, and may be arranged in other patterns such as concentric circles, radial patterns, or a triangular lattice pattern.

[0082] [Third Embodiment] A light emitting device according to a third embodiment will now be described. This embodiment differs from the light emitting device 100 according to the first embodiment mainly in the positions of the first mark 26-1 and the second mark 26-2 in the light emitting section of the light emitting device, and in the regions where the wiring connecting the plurality of second supports 2 to each other is joined to the first end region 272 and the second end region 282 of the second support 2. Each of these will be described below.

[0083] (Positions of the first mark 26-1 and the second mark 26-2) The positions of the first mark 26-1 and the second mark 26-2 in this embodiment will be described with reference to Fig. 8. Fig. 8 is a schematic perspective view showing the positions of the first mark 26-1 and the second mark 26-2 in the light-emitting section 150a of the light-emitting device according to the third embodiment.

[0084] The light emitting device according to the third embodiment has a plurality of light emitting sections 150a each having the same configuration. For convenience, the following description will be given by taking one of the plurality of light emitting sections 150a as a representative.

[0085] In this embodiment, each of the plurality of second supports 2 is provided with at least one first mark 26-1 for positioning at least one of the light-emitting element 3 and the second support 2 in at least one of the two end regions of the first end region 272 in the first direction Y. Furthermore, at least one second mark 26-2 for positioning at least one of the light-emitting element 3 and the second support 2 is provided in at least one of the two end regions of the second end region 282 in the first direction Y.

[0086] 8, one first mark 26-1 consisting of one circle is provided in each of one region 272-1 and the other region 272-3 of the first end region 272 of the second support 2. Also, one second mark 26-2 consisting of two circles is provided in each of one region 282-1 and the other region 282-3 of the second end region 282 of the second support 2.

[0087] As described above, in this embodiment, the first mark 26-1 is provided in at least one of the end regions in the first direction Y of the first end region 272, and the second mark 26-2 is provided in at least one of the end regions in the first direction Y of the second end region 282. This eliminates the need to place the first mark 26-1 and the second mark 26-2 in the central region sandwiched between the end regions in each of the first end region 272 and the second end region 282. As a result, the second support 2 is easier to hold when held by air suction or the like during the manufacturing process of the light-emitting device, for example.

[0088] In the first example, the first mark 26-1 is provided in each of the end regions of the first end region 272 in the first direction Y, and the second mark 26-2 is provided in each of the end regions of the second end region 282 in the first direction Y. By providing the first mark 26-1 or the second mark 26-2 in all four regions of the second support 2, including the end regions of the first end region 272 and the end regions of the second end region 282, it is possible to draw four reference lines for alignment. The reference lines are, for example, imaginary parallel lines or imaginary diagonal lines connecting the first marks 26-1 or the second marks 26-2. Drawing four reference lines makes it easier to align the light-emitting element 3 or the second support 2, and also improves the accuracy of the alignment. Furthermore, even if the first mark 26-1 or the second mark 26-2 in one of the end regions is dirty or hidden by wiring and cannot be detected, alignment can be performed using the first mark 26-1 or the second mark 26-2 in the other of the end regions, thereby improving the robustness of the alignment.

[0089] 9 to 12, the regions where the wiring 25 in the light-emitting device according to this embodiment is bonded to the first end region 272 and the second end region 282 of the second support 2 will be described. FIG. 9 is a schematic top view showing a first example of the wiring 25 in the light-emitting device 100a according to this embodiment. FIG. 10 is a schematic perspective view showing the first example of the wiring 25 in the light-emitting device 100a. FIG. 11 is a schematic top view showing a second example of the wiring 25 in the light-emitting device 100a. FIG. 12 is a schematic perspective view showing the second example of the wiring 25 in the light-emitting device 100a.

[0090] As shown in FIGS. 9 to 12 , in this embodiment, the light emitting device 100a has a plurality of wirings 25 including a first wiring 25-1 and a second wiring 25-2. Of the adjacent second supports 2-1 and 2-2, the first wiring 25-1 is joined to a second end region 282 of one of the second supports 2-1. The second wiring 25-2 is joined to a second end region 282 of the other of the second supports 2-2. The plurality of wirings 25 further includes a third wiring 25-3. Of the adjacent second supports 2-1 and 2-2, the third wiring 25-3 is joined to a first end region 272 of one of the second supports 2-1. The first wiring 25-1 is joined to the first end region 272 of the other of the second supports 2-2. Such wiring enables high-density packaging.

[0091] Furthermore, in the light emitting device 100a of this embodiment, of the adjacent second supports 2-1 and 2-2, a first wiring 25-1 is joined to a central region 282-2 in the first direction Y in the second end region 282 of one of the second supports 2-1. A second wiring 25-2 is joined to a central region 282-2 in the first direction Y in the second end region 282 of the other second support 2-2. Furthermore, of the adjacent second supports 2-1 and 2-2, a third wiring 25-3 is joined to a central region 272-2 in the first direction Y in the first end region 272 of one of the second supports 2-1 and 2-2. A first wiring 25-1 is joined to a central region 272-2 in the first direction Y in the first end region 272 of the other second support 2-2. With such wiring, the wiring 25 is joined to a central region where there is no mark, thereby suppressing bonding defects and improving reliability.

[0092] 9 to 12, one region 272-1 and the other region 272-3 are regions where the first mark 26-1 and the second mark 26-2 are provided, respectively. The central region 272-2 is a region sandwiched between one region 272-1 and the other region 272-3. The central region 282-2 is a region sandwiched between one region 282-1 and the other region 282-3.

[0093] 9 and 10, the first wiring 25-1 is joined to one region 282-1 in a central region 282-2 in the second end region 282 of one second support 2-1. The first wiring 25-1 is joined to one region 272-1 in a central region 272-2 in the first end region 272 of the other second support 2-2. The second wiring 25-2 is joined to one region 282-1 in the central region 282-2 in the second end region 282 of the other second support 2-2. The third wiring 25-3 is joined to one region 272-1 in the central region 272-2 in the first end region 272 of one second support 2-1.

[0094] 11 and 12, the first wiring 25-1 is joined to one region 282-1 in a central region 282-2 in the second end region 282 of one second support 2-1. The first wiring 25-1 is joined to the other region 272-3 in a central region 272-2 in the first end region 272 of the other second support 2-2. The second wiring 25-2 is joined to one region 282-1 in the central region 282-2 in the second end region 282 of the other second support 2-2. The third wiring 25-3 is joined to the other region 272-3 in the central region 272-2 in the first end region 272 of one second support 2-1.

[0095] In the first and second examples, the wiring 25 can be connected to the first end region 272 and the second end region 282 while avoiding the probe contact regions PT shown by the dot patterns in FIGS. 9 to 12 . This reduces connection defects of the wiring 25 and improves reliability. The probe contact regions PT are regions where a probe card can come into contact with the first end region 272 and the second end region 282 when inspecting the connection status of the wiring 25 to the first end region 272 and the second end region 282. Furthermore, in the first example, by aligning the positions at which the probe card makes contact on the second support 2, components can be standardized. This reduces costs and makes the process of mounting multiple second supports 2 easier.

[0096] In this embodiment, the form of the region where the wiring 25 is bonded is not limited to the first and second examples. For example, the wiring 25 may be bonded as in the third to sixth examples shown below.

[0097] As a third example, the first wiring 25-1 may be bonded to the side of one region 272-1 in the central region 272-2 in the first end region 272 of one second support 2-1. The first wiring 25-1 may also be bonded to the side of one region 282-1 in the central region 282-2 in the second end region 282 of the other second support 2-2. The second wiring 25-2 may be bonded to the side of the other region 282-3 in the central region 272-2 in the first end region 272 of the other second support 2-2. The third wiring 25-3 may be bonded to the side of the other region 282-3 in the central region 282-2 in the second end region 282 of one second support 2-1.

[0098] As a fourth example, the first wiring 25-1 may be joined to the region 272-3 side of one second support 2-1 in the central region 272-2 in the first end region 272 of the other second support 2-1. The first wiring 25-1 may also be joined to the region 282-1 side of the central region 282-2 in the second end region 282 of the other second support 2-2. The second wiring 25-2 may also be joined to the region 272-1 side of the central region 272-2 in the first end region 272 of the other second support 2-2. The third wiring 25-3 may also be joined to the region 282-3 side of the other second support 2-1 in the central region 282-2 in the second end region 282 of the one second support 2-1.

[0099] As a fifth example, the first wiring 25-1 may be joined to the side of one region 282-1 in the central region 282-2 in the second end region 282 of one second support 2-1. The first wiring 25-1 may also be joined to the side of one region 272-1 in the central region 272-2 in the first end region 272 of the other second support 2-2. The second wiring 25-2 may be joined to the side of the other region 282-3 in the central region 282-2 in the second end region 282 of the other second support 2-2. The third wiring 25-3 may be joined to the side of the other region 272-3 in the central region 272-2 in the first end region 272 of one second support 2-1.

[0100] As a sixth example, the first wiring 25-1 may be joined to the side of one region 282-1 in the central region 282-2 in the second end region 282 of one second support 2-1. Furthermore, the first wiring 25-1 may be joined to the side of the other region 272-3 in the central region 272-2 in the first end region 272 of the other second support 2-2. The second wiring 25-2 may be joined to the side of the other region 282-3 in the central region 282-2 in the second end region 282 of the other second support 2-2. The third wiring 25-3 may be joined to the side of the one region 272-1 in the central region 272-2 in the first end region 272 of one second support 2-1.

[0101] In the third and sixth examples, the wiring 25 can be connected to the first end region 272 and the second end region 282, avoiding the probe contact region PT. This reduces connection defects of the wiring 25 and improves reliability.

[0102] [Fourth Embodiment] <Configuration of Light-Emitting Module According to Fourth Embodiment> A light-emitting module according to a fourth embodiment will be described with reference to Figs. 13 to 16, 17A, and 17B. Fig. 13 is a schematic top view showing a first example of a light-emitting module 200a according to this embodiment. Fig. 14 is a schematic perspective view showing the first example of the light-emitting module 200a. Fig. 16 is a schematic top view showing a second example of the light-emitting module 200a. Fig. 17 is a schematic perspective view showing the second example of the light-emitting module 200a. Fig. 17A is a first diagram illustrating the operation of the light-emitting module 200a. Fig. 17B is a second diagram illustrating the operation of the light-emitting module 200a.

[0103] The light emitting module 200 a according to this embodiment differs from the light emitting module 200 according to the second embodiment mainly in that at least one substrate through-hole 101 penetrating the support substrate 7 is provided in the support substrate 7 .

[0104] As shown in Figures 13 to 16, in the light-emitting module 200a, substrate through holes 101 are provided from the upper surface 7a to the lower surface 7b of the support substrate 7. The substrate through holes 101 are provided in an area of ​​the support substrate 7 where multiple light-emitting devices 100 are not supported, around the light-emitting devices 100 supported by the support substrate 7. In this embodiment, the substrate through holes 101 are provided at least near the center of the support substrate 7 when viewed from above. Note that, while it is essential that one substrate through hole 101 is provided near the center of the support substrate 7, the number and locations of the substrate through holes 101 provided in the support substrate 7 can be appropriately determined depending on the intended use of the light-emitting module 200a, etc. In addition, in Figures 13 to 16, the arrangement space 100X indicated by the dashed line is a space in which no light-emitting device 100 is arranged in the example shown in Figures 13 to 16, and represents a space in which an additional light-emitting device 100 can be arranged.

[0105] 13 to 16 , the light-emitting module 200a includes a thermistor 102 that detects the temperature of the support substrate 7, and a connector 103 that electrically connects the light-emitting module 200a to an instrument or device other than the support substrate 7. The support substrate 7 can be configured to electrically connect the connector 103 and the light-emitting device 100.

[0106] The support substrate 7 has a substantially rectangular outer shape with some of the corners removed when viewed from above. A rectangle is a shape that includes four sides and four corners. The term "substantially rectangular" refers to shapes that include not only a rectangle but also a shape with some of the corners removed or a shape with rounded corners. However, the outer shape of the support substrate 7 when viewed from above is not limited to a substantially rectangular shape, and may be a substantially circular shape, a substantially elliptical shape, a substantially polygonal shape, or the like. The support substrate 7 includes wiring on the surface or inside the support substrate 7.

[0107] The thermistor 102 and the connector 103 are disposed on the upper surface 7a of the support substrate 7. Each of the light-emitting devices 100 and the thermistor 102 included in the light-emitting module 200a disposed on the support substrate 7 is electrically connected to equipment or devices other than the support substrate 7 via wiring contained on the surface or inside the support substrate 7 and the connector 103. The number of light-emitting devices 100a, thermistors 102, and connectors 103, or the positions at which they are disposed on the support substrate 7, can be determined appropriately depending on the intended use of the light-emitting module 200a, etc.

[0108] In a first example shown in Figures 13 and 14, 18 light-emitting devices 100, one thermistor 102, and one connector 103 are arranged on the upper surface 7a of the support substrate 7. Furthermore, nine substrate through-holes 101 are provided in the support substrate 7. The 18 light-emitting devices 100 are arranged around one substrate through-hole 101 provided near the center of the support substrate 7. A connector 103 is provided at the end of the support substrate 7 on the -Y side. In a top view, a thermistor 102 is arranged between the connector 103 and the 18 light-emitting devices 100. In a top view, two substrate through-holes 101 are provided between the connector 103 and the 18 light-emitting devices 100, and two substrate through-holes 101 are provided at the end of the support substrate 7 on the +Y side. In addition, two substrate through-holes 101 are provided between three light-emitting devices 100 arranged near the end of the support substrate 7 on the -X side, and two substrate through-holes 101 are provided between three light-emitting devices 100 arranged near the end of the support substrate 7 on the +X side.

[0109] 14 , the shortest distance d between the substrate through-hole 101 and the light emitting device 100 is smaller than the shortest width W of the light emitting device 100. The distance P between the light emitting devices 100 is smaller than the diameter φ of the substrate through-hole 101. The diameter φ of the substrate through-hole 101 is, for example, 2.8 mm. The relationship between the shortest distance d and the shortest width W, and the relationship between the distance P and the diameter φ may be similar in the second example shown below.

[0110] In the first example, the support substrate 7 can be more stably fixed to the fixed member of the support substrate 7 by the substrate through-holes 101 other than the substrate through-hole 101 located in the center of the support substrate 7 when viewed from above. Also, warping at the end of the support substrate 7 can be reduced. Furthermore, the support substrate 7 and the fixed member can be brought closer together, improving heat dissipation.

[0111] 15 and 16 , twelve light emitting devices 100, one thermistor 102, and a connector 103 including a first connector 103-1 and a second connector 103-2 are arranged on the upper surface 7a of a support substrate 7. Also, one substrate through-hole 101 is provided in the support substrate 7. The twelve light emitting devices 100 are arranged around the substrate through-hole 101 provided near the center of the support substrate 7. The connectors 103 including the first connector 103-1 and the second connector 103-2 are arranged side by side in the second direction X at the end of the support substrate 7 on the −Y side. The thermistor 102 is arranged near the substrate through-hole 101 provided near the center of the support substrate 7.

[0112] In the second example, the support substrate 7 can be fixed to the fixed member using one substrate through-hole 101, which provides the effect of reducing costs.

[0113] <Effects of Light-Emitting Module 200a> As described above, in this embodiment, at least one substrate through-hole 101 penetrating the support substrate 7 is provided in the support substrate 7. This makes it possible, for example, to provide the substrate through-hole 101 in a portion of the support substrate 7 that is prone to high temperatures, without providing the light-emitting device 100 in that portion. By providing the substrate through-hole 101 in the portion that is prone to high temperatures, heat from the support substrate 7 is dissipated through the substrate through-hole 101, thereby improving the heat dissipation properties of the support substrate 7.

[0114] As shown in Fig. 17A, there are cases where the support substrate 7 is warped. In this case, by fixing the support substrate 7 to the fixed member 300 using screw members 310 arranged to pass through the substrate through holes 101, it is possible to reduce the warping of the support substrate 7 and fix the support substrate 7 to the fixed member 300, as shown in Fig. 17B. Furthermore, by reducing the warping of the support substrate 7, it is possible to achieve desired light distribution characteristics.

[0115] By fixing the support substrate 7 to the fixed member 300 using the screw members 310 arranged to pass through the board through holes 101, heat from the support substrate 7 is dissipated through the board through holes 101 and the screw members 310 arranged in the board through holes 101. This improves the heat dissipation of the support substrate 7. Furthermore, since the contact area between the support substrate 7 and the fixed member 300 is increased, heat from the support substrate 7 is more easily transferred to the fixed member 300, improving the heat dissipation of the support substrate 7 and the light-emitting module. Furthermore, when disposing thermal grease between the support substrate 7 and the fixed member 300, fixing the support substrate 7 to the fixed member 300 using the screw members 310 arranged to pass through the board through holes 101 reduces uneven distribution of the thermal grease between the support substrate 7 and the fixed member 300. This allows the thermal grease to be distributed thinly or approximately uniformly between the support substrate 7 and the fixed member 300, improving the heat dissipation of the support substrate 7 and the light-emitting module.

[0116] 14 , the shortest distance d between the substrate through-hole 101 and the light emitting device 100 is smaller than the shortest width W of the light emitting device 100. This allows multiple light emitting devices 100 to be arranged at high density on the support substrate 7. Furthermore, in the example shown in FIG. 14 , the distance P between the light emitting devices 100 is smaller than the diameter φ of the substrate through-hole 101. This allows multiple light emitting devices 100 to be arranged at high density on the support substrate 7.

[0117] Fifth Embodiment Next, a light-emitting module according to a fifth embodiment will be described with reference to Fig. 18A, Fig. 18B, Fig. 18C, and Fig. 18D. Fig. 18A is a schematic top view showing a first example of a light-emitting module 200b according to the fifth embodiment. Fig. 18B is a schematic top view showing a second example of the light-emitting module 200b. Fig. 18C is a schematic top view showing a third example of the light-emitting module 200b. Fig. 18D is a schematic top view showing a fourth example of the light-emitting module 200b.

[0118] The light-emitting module 200b according to the fifth embodiment differs from the light-emitting module 200 according to the second embodiment in that it includes a plurality of support substrates 7-1, each having a plurality of light-emitting devices 100 and a plurality of connectors 103. Each support substrate 7-1 has an upper surface 7a, a lower surface 7b opposite to the upper surface 7a, and a plurality of substrate through-holes 101.

[0119] In a first example shown in Fig. 18A, the light-emitting module 200b is configured to include two support substrates 7-1. In a second example shown in Fig. 18B, the light-emitting module 200b is configured to include four support substrates 7-1. In a third example shown in Fig. 18C, the light-emitting module 200b is configured to include twelve support substrates 7-1. In a fourth example shown in Fig. 18D, the light-emitting module 200b is configured to include twelve support substrates 7-1.

[0120] In the light-emitting module 200b according to the fifth embodiment, the support substrate 7 can be fixed to a fixing member of the support substrate 7 by using the substrate through-holes 101 located in the support substrate 7 when viewed from above. In addition, warping of the support substrate 7 can be reduced. By reducing the warping of the support substrate 7, it is possible to achieve desired light distribution characteristics. Furthermore, since the support substrate 7 and the fixing member can be brought closer together, heat dissipation is improved.

[0121] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0122] All ordinal numbers, quantitative numbers, and other figures used in the description of the embodiments are provided as examples to specifically explain the technology of the present disclosure, and the present disclosure is not limited to the illustrated figures. Furthermore, the connection relationships between components are provided as examples to specifically explain the technology of the present disclosure, and do not limit the connection relationships that realize the functions of the present disclosure.

[0123] In the second, fourth, and fifth embodiments, the plurality of light emitting devices 100 included in the light emitting module may all be connected in series or all be connected in parallel. Also, a combination of series connection and parallel connection may be used. For example, among the plurality of light emitting devices 100 included in the light emitting module 200b, a number of light emitting devices 100 connected in series may be connected in b sets in parallel, a number of light emitting devices 100 connected in series may be connected in d sets in parallel, and a number of light emitting devices 100 connected in series may be connected in f sets in parallel.

[0124] The number of light emitting devices 100 included in each of the light emitting modules 200, 200a, and 200b is not limited to that in the above embodiment and may be changed as appropriate. Furthermore, a plurality of light emitting modules including at least one of the light emitting modules 200, 200a, and 200b may be arranged.

[0125] In the light-emitting modules of the fourth embodiment and the fifth embodiment, each of which has a connector 103, the support substrate 7-1 can be configured so that the connector 103 and the light-emitting device 100 are electrically connected.

[0126] The light emitting device of the present disclosure can suppress temperature rise in a light emitting device having multiple light emitting elements, and therefore can be suitably used in applications where ultraviolet light is irradiated onto an object, such as curing, exposure, sterilization, photocatalysis, agriculture, etc. However, the light emitting device of the present disclosure is not limited to these applications.

[0127] The aspects of the present disclosure are as follows, for example: <Item 1> A display device comprising: a first support, a plurality of light-emitting elements, and a plurality of second supports each supporting one or more light-emitting elements among the plurality of light-emitting elements and arranged on the first support in a first direction, wherein, in a top view, each of the plurality of second supports is provided with a first wiring layer connected to a first electrode of the light-emitting element in the region at one end in a second direction intersecting with the first direction, and a second wiring layer connected to a second electrode of the light-emitting element in the region at the other end, and the first wiring layer is provided with a first wiring layer that is connected to the first electrode of the light-emitting element in the region at the other end. a connection region and a first end region, which is a region to which the light-emitting element is not connected and is closer to the one end than the first connection region; the second wiring layer has a second connection region, which is a region to which the light-emitting element is connected, and a second end region, which is a region to which the light-emitting element is not connected and is closer to the other end than the second connection region; and between the second supports adjacent in the first direction, the positions of the first end region and the second end region are reversed in the second direction. <Item 2> The light-emitting device according to <Item 1>, wherein the one or more light-emitting elements are composed of two or more light-emitting elements including a first light-emitting element and a second light-emitting element, the first electrode of the first light-emitting element is connected to the first wiring layer, and the second electrode of the second light-emitting element is connected to the second wiring layer. <Item 3> The light-emitting device according to <Item 1> or <Item 2>, wherein each of the plurality of second supports is uniform in size and material. <Item 4> The light emitting device according to any one of <Item 1> to <Item 3>, wherein each of the plurality of second supports has at least one first mark for positioning the light emitting element and at least one of the second supports in the first end region, and at least one second mark for positioning the light emitting element and at least one of the second supports in the second end region.<Item 5> The light-emitting device according to <Item 4>, having a plurality of wirings including a first wiring and a second wiring, wherein, of adjacent second supports, the first wiring is joined to the first end region of one of the second supports and the second wiring is joined to the first end region of the other of the second supports, or the first wiring is joined to the second end region of one of the second supports and the second wiring is joined to the second end region of the other of the second supports. <Item 6> The light-emitting device according to <Item 5>, wherein the plurality of wirings further include a third wiring, wherein, of adjacent second supports, the third wiring is joined to the second end region of one of the second supports and the first wiring is joined to the second end region of the other of the second supports, or the third wiring is joined to the first end region of one of the second supports and the first wiring is joined to the first end region of the other of the second supports. <Item 7> The light emitting device according to <Item 4> or <Item 5>, wherein each of the plurality of second supports is provided with at least one first mark for positioning at least one of the light emitting elements and the second supports in at least one of both end regions of the first end region in the first direction, and at least one second mark for positioning at least one of the light emitting elements and the second supports in at least one of both end regions of the second end region in the first direction. <Item 8> The light emitting device according to <Item 7>, wherein the first mark is provided in each of both end regions of the first end region in the first direction, and the second mark is provided in each of both end regions of the second end region in the first direction. <Item 9> The light-emitting device according to <Item 7> or <Item 8>, which has a plurality of wirings including a first wiring and a second wiring, and of adjacent second supports, the first wiring is joined to the second end region of one of the second supports in a central region in the first direction, and the second wiring is joined to the second end region of the other of the second supports in a central region in the first direction.<Item 10> The light-emitting device according to <Item 9>, wherein the plurality of wirings further include a third wiring, and the third wiring is joined to the first end region of one of the second supports, in a central region in the first direction, of adjacent second supports, and the first wiring is joined to the first end region of the other second support, in a central region in the first direction. <Item 11> The light-emitting device according to any one of <Item 1> to <Item 9>, wherein the first support is a heat dissipation member having electrical conductivity. <Item 12> The light-emitting device according to any one of <Item 1> to <Item 11>, wherein the light-emitting element is a light-emitting diode. <Item 13> The light-emitting device according to <Item 12>, wherein the light-emitting element emits ultraviolet light.

[0128] This application claims priority based on Japanese Patent Application No. 2024-058046 filed with the Japan Patent Office on March 29, 2024, Japanese Patent Application No. 2024-167880 filed with the Japan Patent Office on September 26, 2024, and Japanese Patent Application No. 2025-023865 filed with the Japan Patent Office on February 18, 2025, and includes the entire contents of these Japanese patent applications.

[0129] 1 First support 11 Mounting surface 2, 2-1, 2-2, 2-3, 2-4 Second support 20 Minimum rectangle 21 Upper surface 22 Lower surface 23 Side surface 24 Placement area 25 Wiring 25-1 First wiring 25-2 Second wiring 25-3 Third wiring 26-1 First mark 26-2 Second mark 27 First wiring layer 271 First connection area 272 First end area 272-1 One area 272-2 Central area 272-3 The other area 28 Second wiring layer 281 Second connection area 282 Second end area 282-1 One area 282-2 Central area 282-3 The other area 29 Third wiring layer 3 Light-emitting element 3-1 First light-emitting element 3-2 Second light-emitting element 31 Light-emitting surface 321-1 First electrode 322-1 Second electrode 321-2 First electrode 322-2 Second electrode 4 Frame body 41 Upper surface 42 Lower surface 43 Outer surface 44 Inner surface 45 Step portion 46 Wiring pattern 50 Main body 5 Light-transmitting member 6 Joining member 7, 7-1 Support substrate 7a Upper surface 7b Lower surface 71 First layer 72 Second layer 73 Third layer 100 Light-emitting device 100X Arrangeable space 101 Substrate through-hole 102 Thermistor 103 Connector 103-1 First connector 103-2 Second connector 150 Light-emitting unit 200, 200a, 200b Light-emitting module 300 Fixed member 310 Screw member d Shortest distance dy Distance between adjacent second supports in the first direction P Distance PT Probe contact area X Second direction Y First direction W Shortest width W1x Width of the mounting surface in the second direction W1y Width of the mounting surface in the first direction W2x Width of the second support in the second direction W2y Width of the second support in the first direction W3x Width of the light-emitting element in the second direction W3y Width of the light-emitting element in the first direction W4y Width of the smallest rectangle in the first direction W4x Width of the smallest rectangle in the second direction φ Diameter

Claims

1. A device comprising: a first support; a plurality of light-emitting elements; and a plurality of second supports each supporting one or more light-emitting elements among the plurality of light-emitting elements and arranged side by side in a first direction on the first support, wherein, in a top view, each of the plurality of second supports has, in regions at both ends in a second direction intersecting the first direction, a first wiring layer connected to a first electrode of the light-emitting element in the region at one end, and a second wiring layer connected to a second electrode of the light-emitting element in the region at the other end, wherein the first wiring layer has a first connection region which is a region connected to the first electrode of the light-emitting element, and a first end region which is a region to which the light-emitting element is not connected and is closer to the one end than the first connection region, and the second wiring layer has a second connection region which is a region connected to the second electrode of the light-emitting element, and a second end region which is a region to which the light-emitting element is not connected and is closer to the other end than the second connection region, A light emitting device, wherein, among the plurality of second supports, between the second supports adjacent to each other in the first direction, the positions of the first end regions and the second end regions are reversed in the second direction.

2. The light-emitting device according to claim 1, wherein the one or more light-emitting elements are composed of two or more light-emitting elements including a first light-emitting element and a second light-emitting element, and the first electrode of the first light-emitting element is connected to the first wiring layer, and the second electrode of the second light-emitting element is connected to the second wiring layer.

3. The light emitting device according to claim 1 or 2, wherein the plurality of second supports are uniform in size and material.

4. A light emitting device as described in any one of claims 1 to 3, wherein each of the plurality of second supports is provided in the first end region with at least one first mark for positioning at least one of the light emitting element and the second support, and is provided in the second end region with at least one second mark for positioning at least one of the light emitting element and the second support.

5. A light-emitting device as described in claim 4, having a plurality of wirings including a first wiring and a second wiring, wherein, of adjacent second supports, the first wiring is joined to the first end region of one of the second supports and the second wiring is joined to the first end region of the other of the second supports, or the first wiring is joined to the second end region of one of the second supports and the second wiring is joined to the second end region of the other of the second supports.

6. The light-emitting device described in claim 5, wherein the plurality of wirings further include a third wiring, and wherein, of adjacent second supports, the third wiring is joined to the second end region of one of the second supports and the first wiring is joined to the second end region of the other of the second supports, or the third wiring is joined to the first end region of one of the second supports and the first wiring is joined to the first end region of the other of the second supports.

7. A light-emitting device as described in claim 4 or claim 5, wherein each of the plurality of second supports is provided with at least one first mark for positioning the light-emitting element and at least one of the second supports in at least one of the two end regions of the first end region in the first direction, and at least one second mark for positioning the light-emitting element and at least one of the second supports in at least one of the two end regions of the second end region in the first direction.

8. A light emitting device as described in claim 7, wherein the first mark is provided in each of the two end regions of the first end region in the first direction, and the second mark is provided in each of the two end regions of the second end region in the first direction.

9. A light-emitting device according to claim 7 or claim 8, having a plurality of wirings including a first wiring and a second wiring, wherein of the adjacent second supports, the first wiring is joined to the second end region of one of the second supports in a central region in the first direction, and the second wiring is joined to the second end region of the other of the second supports in a central region in the first direction.

10. The light-emitting device described in claim 9, wherein the plurality of wirings further include a third wiring, and the third wiring is joined to the first end region of one of the second supports, in a central region in the first direction, of the first end region of the other of the second supports, and the first wiring is joined to the first end region of the other of the second supports, in a central region in the first direction.

11. The light emitting device according to any one of claims 1 to 9, wherein the first support is a heat dissipation member having electrical conductivity.

12. The light emitting device according to any one of claims 1 to 11, wherein the light emitting element is a light emitting diode.

13. The light emitting device according to claim 12, wherein the light emitting element emits ultraviolet light.

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