Gaseous-substance pyrolysis apparatus and gaseous-substance pyrolysis apparatus stack

Abstract

[Problem] To provide a gaseous-substance pyrolysis apparatus and a gaseous-substance pyrolysis apparatus stack that have high heat transfer efficiency, high temperature controllability in a catalyst layer, low pressure loss, a small size, and a low heat capacity. [Solution] A gaseous-substance pyrolysis apparatus 100 comprises: a heat transfer substrate structure 10; a spray catalyst carrier 12 formed on one main surface of the heat transfer substrate structure 10; a catalyst material 14 supported by the spray catalyst carrier 12, the catalyst material 14 breaking down at least some of a gaseous substance using heat energy from the heat transfer substrate structure 10; and a casing 16 covering the heat transfer substrate structure 10, the spray catalyst carrier 12, and the catalyst material 14, the casing 16 forming a space through which the gaseous substance passes. Additionally, this gaseous-substance pyrolysis apparatus stack is formed by stacking a plurality of layers of the aforementioned gaseous substance pyrolysis apparatus 100.

Description

Gaseous substance thermal decomposition device and gaseous substance thermal decomposition device stack

[0001] The present invention relates to a gaseous substance pyrolysis device and a gaseous substance pyrolysis device stack.

[0002] In recent years, ammonia, which does not emit carbon dioxide when burned, has attracted attention as an alternative fuel to coal and natural gas. However, using ammonia as a fuel requires the use of a hydrocarbon fuel other than ammonia for ignition, resulting in insufficient carbon dioxide emissions. Therefore, a new approach has been proposed: catalytically decomposing at least a portion of the ammonia to generate hydrogen, which can then be used as an ignition source. However, the thermal decomposition of ammonia is a strongly endothermic reaction, making stable heat supply to the catalyst a challenge. Industrial hydrogen production involves steam reforming of methanol, which is then catalytically decomposed to generate hydrogen. However, this decomposition reaction is also strongly endothermic, making stable heat supply to the catalyst a similar challenge. While catalytic decomposition of gaseous substances is widely used in a variety of fields, controlling the heat transfer to the catalyst layer and catalyst temperature is crucial when a strongly endothermic reaction occurs.

[0003] As an example of thermal decomposition of ammonia, for example, Non-Patent Document 1 discloses an example of an ammonia decomposer for fuel cell vehicles. However, in this conventional example, the heater is separated from the catalyst layer, resulting in low heat transfer, causing a large temperature distribution in the catalyst layer, and the catalyst pellets are densely packed, resulting in a large pressure loss of ammonia. Furthermore, the large overall volume results in a large heat capacity, which makes it take a long time to start up the system.

[0004] Ono, Souta, Shimizu, Yuki, and Saika, Takashi, "Development of an Ammonia Decomposer for Fuel Cell Vehicles," 30th Annual Conference of the Japan Institute of Energy, pp. 88-89 (2021)

[0005] An object of the present invention is to provide a gaseous substance thermal decomposition device and a gaseous substance thermal decomposition device stack that have high heat transfer efficiency, high temperature controllability of the catalyst layer, low pressure loss, and are small in size and heat capacity.

[0006] In order to achieve the above object, the present invention includes the following embodiments. [1] A gaseous material thermal decomposition device comprising: a heat-transfer substrate structure; a sprayed catalyst carrier formed on one main surface of the heat-transfer substrate structure; a catalytic material supported on the sprayed catalyst carrier and configured to decompose at least a portion of a gaseous material by thermal energy from the heat-transfer substrate structure; and a housing covering the heat-transfer substrate structure, the sprayed catalyst carrier, and the catalytic material and forming a space through which the gaseous material passes. [2] The gaseous material thermal decomposition device according to [1], wherein the heat-transfer substrate structure comprises a heat-transfer substrate, an insulating layer formed on a main surface of the heat-transfer substrate facing the sprayed catalyst carrier or on a main surface opposite to the sprayed catalyst carrier, and a heater layer embedded in the insulating layer. [3] The gaseous material thermal decomposition device according to [2], wherein the insulating layer and the heater layer are both sprayed layers. [4] The gaseous substance thermal decomposition apparatus according to any one of [1] to [3], wherein the heat transfer substrate structure has a heat transfer substrate and a heating medium flow path formed inside the heat transfer substrate. [5] The gaseous substance thermal decomposition apparatus according to any one of [1] to [3], wherein the catalytic material is ruthenium (Ru) metal, nickel (Ni) metal, or an alloy containing either of these as a main component. [6] The gaseous substance thermal decomposition apparatus according to any one of [1] to [3], wherein the cross section of the heat transfer substrate structure is corrugated. [7] The specific surface area of ​​the sprayed catalyst carrier is 10 m ２ / g or more. [8] The gaseous substance pyrolysis device according to any one of [1] to [3], wherein a heat exchanger is provided on the outside of the housing to perform heat exchange between the gaseous substance before passing through the space within the housing and the gaseous substance after passing through the space within the housing. [9] The gaseous substance pyrolysis device according to any one of [1] to [3], wherein the gaseous substance is ammonia or methanol.

[10] A gaseous substance pyrolysis device stack comprising a plurality of gaseous substance pyrolysis devices according to any one of [1] to [3] stacked together.

[0007] According to the present invention, it is possible to realize a gaseous substance thermal decomposition device and a gaseous substance thermal decomposition device stack that have high heat transfer efficiency, high temperature controllability of the catalyst layer, low pressure loss, and are small in size and heat capacity.

[0008] Fig. 1 is a cross-sectional view of a configuration example of a gaseous substance pyrolysis device according to an embodiment; Fig. 2 is a cross-sectional view of a configuration example of a heat transfer substrate structure according to an embodiment; Fig. 3 is a diagram showing an example of a gaseous substance pyrolysis device stack according to an embodiment; Fig. 4 is a diagram showing a modified example of a gaseous substance pyrolysis device according to an embodiment; Fig. 5 is a diagram showing a modified example of a gaseous substance pyrolysis device stack according to an embodiment.

[0009] Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[0010] 1(a) and (b) show an example of the configuration of a gaseous substance pyrolysis apparatus according to an embodiment. Fig. 1(a) is a cross-sectional view, and Fig. 1(b) shows an example of connection with a heat exchanger. In Fig. 1(a), the gaseous substance pyrolysis apparatus 100 includes a heat transfer substrate structure 10, a sprayed catalyst support 12, a catalyst material 14, and a housing 16.

[0011] The heat transfer substrate structure 10 supplies thermal energy for decomposing the gaseous substance to the gaseous substance thermal decomposition device 100 by an appropriate method. The gaseous substance refers to a substance in a state such as gas, steam, mist, aerosol, etc. The method of supplying thermal energy will be described later.

[0012] The sprayed catalyst carrier 12 is a porous film formed by a thermal spraying method on one of the main surfaces of the heat transfer substrate structure 10. Here, the thermal spraying method is a technique in which the material of the sprayed catalyst carrier 12 is melted at a high temperature and sprayed onto the surface of a material to form a film. In this embodiment, suspension spraying, in which a film is formed by supplying a liquid in which powder particles are suspended to a spraying flame, is particularly suitable. Suspension spraying makes it possible to spray using fine particles with a diameter of less than 5 μm, which are generally difficult to transport pneumatically, and the specific surface area of ​​the sprayed catalyst carrier 12 can be made high. Specifically, the specific surface area of ​​the sprayed catalyst carrier 12 formed by general atmospheric pressure plasma spraying using powder of a size that can be transported pneumatically is 0.1 to 1 m. ２ / g, whereas in the case of suspension spraying, the specific surface area of ​​the sprayed catalyst carrier 12 is 10 m ２ / g, and can be greater than 100m ２ / g, and can be greater than 200m２ The specific surface area here refers to a value measured by the BET method.

[0013] The material of the sprayed catalyst carrier 12 can be an oxide with high heat resistance, such as alumina or zeolite.

[0014] The catalytic material 14 is impregnated and supported on the sprayed catalyst support 12 by a wet process, and generates hydrogen by decomposing at least a portion of the gaseous substance using thermal energy from the heat transfer substrate structure 10. Examples of wet processes include evaporation to dryness, pore filling, incipient wetness, spraying, and adsorption. The catalytic material 14 is not limited as long as it can decompose gaseous substances such as ammonia and methanol to generate hydrogen when heated to approximately 300°C to 600°C. Examples of suitable catalytic materials include ruthenium (Ru) metal, nickel (Ni) metal, and alloys containing either of these metals as a main component. The shape of the catalytic material 14 is not limited, but particles with a diameter of less than 100 nm are advantageous for maintaining high activity when supported on the sprayed catalyst support 12.

[0015] The housing 16 covers the heat transfer substrate structure 10, the sprayed catalyst carrier 12, and the catalyst material 14, accommodating them therein, while also forming a space through which gaseous substances pass. In the example of FIG. 1( a), the heat transfer substrate structure 10, the sprayed catalyst carrier 12, and the catalyst material 14 are formed on the upper and lower wall surfaces 18 of the housing 16 in the drawing. The heat transfer substrate structure 10, the sprayed catalyst carrier 12, and the catalyst material 14 may also be formed on only one of the upper and lower wall surfaces 18 of the housing 16 in the drawing. Here, the minimum value of the height of the space formed in the housing 16, i.e., the distance H between the opposing surfaces of the upper and lower sprayed catalyst carriers 12 in the drawing, is 1 to 20 mm. The maximum value of the height h of the sprayed catalyst carrier 12 is 10 to 500 μm. This results in a wider space through which gaseous substances pass, compared to conventional catalyst layers filled with pellets, thereby reducing pressure loss. In addition, when the heat transfer substrate structure 10, the sprayed catalyst carrier 12, and the catalyst material 14 are formed on only one of the wall surfaces 18 of the housing 16, the above distance H is the minimum value of the distance between the surface of the sprayed catalyst carrier 12 and the opposite wall surface 18.

[0016] The housing 16 is provided with an inlet 20 for supplying a gaseous substance and an outlet 22 for discharging the gaseous substance. The gaseous substance is supplied from the inlet 20 and enters the interior of the housing 16, and while passing through the space, at least a portion of the gaseous substance is decomposed by the catalytic material 14 supported on the thermal spray catalyst carrier 12, and is discharged to the outside from the outlet 22. In this case, it is preferable to pass the gaseous substance (raw material gas) supplied from the inlet 20 and the gaseous material (exhaust gas) after decomposition discharged from the exhaust port 22 through an appropriate heat exchanger, and heat the raw material gas with the exhaust gas, thereby improving the efficiency of use of the thermal energy supplied from the heat transfer substrate structure 10.

[0017] 1( b ) shows an example of a connection between a heat exchanger 40 installed outside the housing 16 and the inlet port 20 and exhaust port 22. A raw material gas (gaseous substance before passing through the space within the housing 16) supplied from an appropriate source enters the heat exchanger 40 through a heated gas inlet Ri of the heat exchanger 40, is heated by heat exchange with exhaust gas in the heat exchanger 40, is discharged through a heated gas outlet Ro, and is supplied to the housing 16 through the inlet 20. In addition, exhaust gas discharged from the exhaust port 22 of the housing 16 (gaseous substance after passing through the space within the housing 16) enters the heat exchanger 40 through a heating gas inlet Hi, heats the raw material gas by heat exchange in the heat exchanger 40, and is then discharged through a heating gas outlet Ho.

[0018] Furthermore, in order to use the gaseous substance pyrolysis devices 100 in a stacked configuration, the heat transfer substrate structure 10 may be formed with an inlet port 21 and an outlet port 23 for allowing the raw material gas and exhaust gas to flow between the heat transfer substrate structure 10 and the gaseous substance pyrolysis device 100 disposed below. In this case, the inlet port 20 and the inlet port 21, and the outlet port 22 and the outlet port 23 are formed so that their positions coincide with each other when the gaseous substance pyrolysis devices 100 are stacked.

[0019] 2( a), (b), (c), and (d) show cross-sectional views of exemplary configurations of the heat transfer substrate structure 10. In the example of FIG. 2( a), the heat transfer substrate structure 10 includes a heat transfer substrate 24, an insulating layer 26, and a heater layer 28, and the insulating layer 26 is formed on one main surface of the heat transfer substrate 24. In this case, one main surface of the heat transfer substrate 24 is the main surface facing the sprayed catalyst carrier 12 formed on one main surface of the heat transfer substrate structure 10, and the insulating layer 26 is disposed between the heat transfer substrate 24 and the sprayed catalyst carrier 12. The heater layer 28 is embedded in the insulating layer 26, and the insulating layer 26 also serves as a protective layer for the heater layer 28. With this configuration, heat generated by the heater layer 28 is transferred directly to the sprayed catalyst carrier 12 and the catalyst material 14 supported thereon by conductive heat transfer.

[0020] Any heat-resistant material with high thermal conductivity can be used for the heat transfer substrate 24, but metal materials such as stainless steel are suitable for use. The thickness of the heat transfer substrate 24 is, for example, 0.1 to 0.5 mm.

[0021] The insulating layer 26 can be made of oxide ceramics such as alumina, and can be formed by, for example, a thermal spraying method. When the insulating layer 26 is a thermal sprayed layer, the thickness can be set to 50 to 500 μm, and the distance between the heat transfer substrate 24 and the thermal sprayed catalyst carrier 12 can be reduced, resulting in higher heat transfer efficiency and a shorter rise time for the catalytic properties.

[0022] The material of the heater layer 28 is not particularly limited as long as it generates heat resistance when energized. Examples include a metal element selected from molybdenum, tungsten, tantalum, chromium, titanium, aluminum, silicon, nickel, niobium, iron, copper, silver, and platinum; an alloy containing one or more of these metal elements; a conductive compound containing one or more of these metal elements; or a mixture containing these. The heater layer 28 can be formed, for example, by a thermal spraying method, and nickel-containing conductive compounds such as nickel alloys are particularly suitable as materials. When the heater layer 28 is a thermal sprayed layer, its thickness can be set to 20 to 200 μm. This allows the distance between the heat transfer substrate 24 and the thermal sprayed catalyst carrier 12 to be reduced, thereby further increasing heat transfer efficiency and shortening the rise time of the catalytic properties.

[0023] Another advantage of forming the insulating layer 26 and the heater layer 28 by thermal spraying is improved compatibility between these layers and between the layers and the spray-coated catalyst carrier 12 formed thereon. Specifically, thermal spraying makes it possible to easily embed the heater layer 28 between the insulating layers 26, and also improves adhesion between the insulating layer 26 and the heater layer 28, and between the insulating layer 26 and the spray-coated catalyst carrier 12. Thermal spraying also allows for easy deposition on a deformed substrate, so it has the advantage that each layer can be easily deposited to conform to the shape of the substrate, even on a substrate with a complex shape, such as that shown in FIG. 2(d) described below.

[0024] 2(b) also includes a heat transfer substrate 24, an insulating layer 26, and a heater layer 28. However, unlike the example of FIG. 2(a), the insulating layer 26 is formed on the other main surface of the heat transfer substrate 24. In this case, the other main surface of the heat transfer substrate 24 is the main surface opposite to the sprayed catalyst carrier 12 formed on one main surface of the heat transfer substrate structure 10. The heater layer 28 is embedded in the insulating layer 26, and the insulating layer 26 also serves as a protective layer for the heater layer 28. With this configuration, heat generated by the heater layer 28 is transferred directly to the sprayed catalyst carrier 12 and the catalyst material 14 supported thereon by conductive heat transfer.

[0025] 2(c), the heat transfer substrate structure 10 is configured to include a heat transfer substrate 24 and a heating medium flow path 30, with the heating medium flow path 30 formed inside the heat transfer substrate 24. The heating medium flow path 30 is formed as a through-hole that penetrates the heat transfer substrate 24, and allows a heating medium supplied from an appropriate supply source to flow through it. With this configuration, the heat supplied from the heating medium flow path 30 when the heating medium flows through the heating medium flow path 30 is transferred directly to the sprayed catalyst carrier 12 and the catalyst material 14 supported thereon by conductive heat transfer.

[0026] 2( a) and 2(b) and the heating medium flow path 30 shown in Fig. 2(c) can also be used together. That is, a configuration may be adopted in which a certain region of the thermal sprayed catalyst carrier 12 and the catalytic material 14 supported thereon is heated by the heater layer 28, and another region is heated by the heating medium flow path 30, or a configuration may be adopted in which the heater layer 28 and the heating medium flow path 30 are selectively used depending on the elapsed time since the start of operation of the gaseous substance thermal decomposition device 100. With such a configuration, for example, the heater layer 28 is used for operation during a cold start, and when a combustion device or a chemical reaction device that operates using exhaust gas from this device reaches a high temperature, the exhaust gas from those devices can be directed to the heating medium flow path 30, thereby reducing power consumption and achieving energy savings.

[0027] The example in Figure 2(d) is an example in which the heat transfer substrate structure 10 shown in Figure 2(a) is configured so that its cross section has a corrugated shape. This allows vortices to be formed in the flow of gaseous material passing through the space above the sprayed catalyst carrier 12 in the heat transfer substrate structure 10, increasing heat transfer and mass transfer with the catalyst material 14 and improving the efficiency of thermal decomposition of the gaseous material.

[0028] In the example of Figure 2(d), the heat transfer substrate structure 10 shown in Figure 2(a) was used, but the heat transfer substrate structure 10 shown in Figure 2(c) can also be formed into a wavy shape in the same way.

[0029] As described above, in the heat transfer substrate structure 10 according to the embodiment, the heat generated by the heater layer 28 or the heat supplied from the heating medium flow path 30 is transferred directly to the sprayed catalyst carrier 12 and the catalyst material 14 carried thereon by conductive heat transfer, so that the sprayed catalyst carrier 12 and the catalyst material 14 can be heated with high heat transfer efficiency. In addition, the temperatures of the sprayed catalyst carrier 12 and the catalyst material 14 can be controlled with high precision.

[0030] 3(a) and (b) show examples of a gaseous substance pyrolysis device stack 102. In FIGS. 3(a) and (b), the gaseous substance pyrolysis device stack 102 is configured by stacking a plurality of gaseous substance pyrolysis devices 100. In the example of FIGS. 3(a) and (b), four layers of the gaseous substance pyrolysis devices 100 are stacked, but this is not intended to be limited to four layers, and any number of layers may be stacked. Each gaseous substance pyrolysis device 100 is supplied with raw material gas through the intake ports 20 and 21 shown in FIG. 1(a), and exhaust gas is discharged through the exhaust ports 22 and 23.

[0031] The gaseous substance thermal decomposition device stack 102 is preferably provided with a heat exchanger 104 for exchanging heat between the raw material gas and the exhaust gas and heating the raw material gas with the thermal energy of the exhaust gas. This heat exchanger 104 corresponds to the heat exchanger 40 shown in Fig. 1(b). As the heat exchanger 104, for example, a plate-type heat exchanger can be used.

[0032] 3(a), the heat transfer substrate structure 10 shown in FIG. 2(a) is used, and electrodes 32 for supplying power to the heater layer 28 are provided on the side of each of the gaseous substance pyrolysis devices 100 constituting the gaseous substance pyrolysis device stack 102. Power is supplied to each electrode 32 from a heating power source 34.

[0033] 3(b), the heat transfer substrate structure 10 shown in Fig. 2(c) is used, and a pipe 31a for supplying a heating medium to the heating medium flow path 30 and a pipe 31b for discharging the heating medium as exhaust gas are provided on the side of each of the gaseous substance thermal decomposition devices 100 constituting the gaseous substance thermal decomposition device stack 102. The heating medium is not limited to a gaseous substance, and may be a liquid.

[0034] In addition, in the case of the gaseous substance pyrolysis device stack 102, the wall surface 18 shown in Figure 1(a) can be substituted by the main surface of the heat transfer substrate 24 shown in Figure 2(a) opposite the insulating layer 26, the main surface of the insulating layer 26 shown in Figure 2(b) opposite the heat transfer substrate 24, or the main surface of the heat transfer substrate 24 shown in Figure 2(c) opposite the sprayed catalyst carrier 12.

[0035] 4(a), (b), and (c) show modified examples of the gaseous material pyrolysis device 100. In this modified example, the gaseous material pyrolysis device 100 is constructed by overlapping (shell-fitting) a member I shown in FIG. 4(a) and a member II shown in FIG. 4(b) with the surfaces shown in the figures facing each other. Here, members I and II correspond to the housing 16 in the embodiment shown in FIG. 1(a). Although, for example, a glass cup-shaped container is suitable as members I and II, any container may be used as long as a space that serves as a flow path, as described below, is formed inside the container by the above-mentioned shell-fitting.

[0036] 4(a) and 4(b), the intake port 20 (21) and the exhaust port 22 (23) are formed at both ends of the members I and II, but this is not intended to be limiting and they may be formed at any appropriate position on the members I and II. In addition, the members I and II are formed with a peripheral wall 36 that rises in a direction perpendicular to the plane of the drawing around the entire periphery of the members I and II.

[0037] The intake ports 20 (21), exhaust ports 22 (23), and peripheral walls 36 described above are formed so that they are in the same position when members I and II are mated. As a result, when members I and II are mated and the peripheral walls 36 are bonded together by brazing or the like, a space is formed inside to form a flow path from the intake port 20 (21) to the exhaust port 22 (23). Note that the peripheral wall 36 may be formed on only one of the members I and II. In this case, members I and II are mated together, and the peripheral wall 36 is bonded to the surface of the other member on which it is not formed (the inner surface of the space to be formed), thereby forming a space for the flow path.

[0038] Here, the sprayed catalyst carrier 12 is formed by a spraying method on one of the members I and II shown in FIGS. 4( a) and 4(b), for example, on the inner surface of member II (the inner surface of the flow path formed when member II is mated with member I, which is the wall surface 18 of the casing 16 shown in FIG. 1(a)), and the catalyst layer 38 is formed by impregnating and supporting the catalyst material 14 on this by a wet process. The modified example shown in FIGS. 4(a) and 4(b) is a configuration in which the sprayed catalyst carrier 12 and the catalyst material 14 are formed on only one of the upper and lower wall surfaces 18 of the casing 16 in the embodiment shown in FIG. 1(a). It is also possible to form the sprayed catalyst carrier 12 on the inner surfaces of both members I and II, and support the catalyst material 14 on this to form the catalyst layer 38.

[0039] 4(c) shows the outer surface of member II (the outer surface of the flow path formed when it is mated with member I). An insulating layer 26 and a heater layer 28 embedded therein are formed on this outer surface by a thermal spraying method, thereby constituting the heat transfer substrate structure 10. This configuration corresponds to the configuration of FIG. 2(b). Note that a commercially available heater may be used as the heater layer 28, and the heat transfer substrate structure 10 may be formed by attaching this to the outer surface.

[0040] When the sprayed catalyst carrier 12 is also formed on the inner surface of the member I and the catalyst material 14 is carried on this, the heat transfer substrate structure 10 is also formed on the outer surface of the member I.

[0041] 5 shows a modified example of a gaseous substance pyrolysis device stack 102, which is constructed by stacking multiple (four layers in the example of FIG. 5) gaseous substance pyrolysis devices 100 formed by joining together members I and II shown in FIG. 4(a) and (b). In the example of FIG. 5, the insulating layer 26 and the heater layer 28 embedded therein are omitted.

[0042] In Figure 5, each gaseous substance pyrolysis device 100 constituting the gaseous substance pyrolysis device stack 102 is supplied with raw material gas through the intake ports 20 and 21 shown in Figure 1 (a), and exhaust gas is discharged through the exhaust ports 22 and 23.

[0043] In the gaseous substance thermal decomposition device 100 and the gaseous substance thermal decomposition device stack 102 described above, the heat transfer substrate structure 10, the sprayed catalyst carrier 12, and the catalyst material 14 are integrally housed or provided in the housing 16, which allows the device to be made compact. This reduces the heat capacity of the device, making it easier to start up the device.

[0044] 10 Heat transfer substrate structure, 12 Thermal spray catalyst carrier, 14 Catalyst material, 16 Housing, 18 Wall surface, 20 Air intake port, 21 Air intake port, 22 Exhaust port, 23 Exhaust port, 24 Heat transfer substrate, 26 Insulating layer, 28 Heater layer, 30 Heating medium flow path, 31a, 31b Piping, 32 Electrode, 34 Heating power source, 36 Surrounding wall, 38 Catalyst layer, 40 Heat exchanger, 100 Gaseous substance thermal decomposition device, 102 Gaseous substance thermal decomposition device stack, 104 Heat exchanger.

Claims

1. A gaseous substance thermal decomposition device comprising: a heat transfer substrate structure; a sprayed catalyst carrier formed on one main surface of the heat transfer substrate structure; a catalyst material supported on the sprayed catalyst carrier and configured to decompose at least a portion of a gaseous substance using thermal energy from the heat transfer substrate structure; and a housing that covers the heat transfer substrate structure, the sprayed catalyst carrier, and the catalyst material and forms a space through which the gaseous substance passes.

2. A gaseous substance thermal decomposition device as described in claim 1, wherein the heat transfer substrate structure comprises a heat transfer substrate, an insulating layer formed on the main surface of the heat transfer substrate facing the sprayed catalyst carrier or on the main surface opposite the sprayed catalyst carrier, and a heater layer embedded in the insulating layer.

3. The gaseous substance thermal decomposition device according to claim 2, wherein the insulating layer and the heater layer are both sprayed layers.

4. A gaseous substance thermal decomposition device according to any one of claims 1 to 3, wherein the heat transfer substrate structure comprises a heat transfer substrate and a heating medium flow path formed inside the heat transfer substrate.

5. A gaseous substance thermal decomposition apparatus according to any one of claims 1 to 3, wherein the catalytic material is ruthenium (Ru) metal, nickel (Ni) metal, or an alloy containing either of these as a main component.

6. A gaseous substance thermal decomposition device according to any one of claims 1 to 3, wherein the cross section of the heat transfer substrate structure is wavy.

7. The specific surface area of ​​the sprayed catalyst carrier is 10 m ２ The gaseous substance thermal decomposition apparatus according to any one of claims 1 to 3, wherein the SiO2 content is greater than 1 / g.

8. A gaseous material pyrolysis device as described in any one of claims 1 to 3, wherein a heat exchanger is provided on the outside of the housing to perform heat exchange between the gaseous material before it passes through the space within the housing and the gaseous material after it has passed through the space within the housing.

9. A gaseous substance thermal decomposition apparatus according to any one of claims 1 to 3, wherein the gaseous substance is ammonia or methanol.

10. A gaseous substance thermal decomposition device stack comprising a plurality of gaseous substance thermal decomposition devices according to any one of claims 1 to 3 stacked together.

Images