Resin composition, molded body, adhesive sheet, and decorative film

Abstract

The present invention provides a resin composition capable of exhibiting good adherability to both an organic material and an inorganic material while ensuring transparency. The resin composition of the present invention includes a silane-modified thermoplastic resin and a thermoplastic resin modified by a modifying agent other than a silane compound. Where the total of the content of the silane-modified thermoplastic resin and the content of the thermoplastic resin modified by a modifying agent other than a silane compound is 100 mass%, the content of the silane-modified thermoplastic resin is preferably 30-95 mass%.

Description

Resin composition, molded body, adhesive sheet and decorative film

[0001] The present invention relates to a resin composition, a molded article, an adhesive sheet, and a decorative film.

[0002] Conventionally, as a resin composition having excellent transparency and strong adhesion to glass or metal, a resin composition containing a modified hydrogenated block copolymer obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer obtained by hydrogenating a block copolymer consisting of a polymer block mainly composed of repeating units derived from an aromatic vinyl compound and a polymer block mainly composed of repeating units derived from a linear conjugated diene compound (see, for example, Patent Document 1).

[0003] International Publication No. 2012 / 043708

[0004] However, although the resin compositions containing the conventional modified hydrogenated block copolymers have excellent adhesion to inorganic materials such as glass and metals, they cannot exhibit sufficient adhesion to organic materials unless they are subjected to a surface treatment such as a corona treatment, etc. Therefore, there is room for improvement in the adhesion of the conventional resin compositions to organic materials.

[0005] Therefore, an object of the present invention is to provide a resin composition that can exhibit good adhesion to both organic and inorganic materials while ensuring transparency, and a molded article using the resin composition.

[0006] The present inventors have conducted extensive research to solve the above problems, and have found that a resin composition containing a silane-modified thermoplastic resin and a thermoplastic resin modified with a modifier other than a silane compound has excellent transparency and can exhibit good adhesion to both organic and inorganic materials, thereby completing the present invention.

[0007] That is, the present invention aims to advantageously solve the above-mentioned problems, and [1] the resin composition of the present invention is characterized by containing a silane-modified thermoplastic resin and a thermoplastic resin modified with a modifier other than a silane compound.

[0008] Here, [2] the resin composition of the present invention is preferably the resin composition according to the above [1], in which the content of the silane-modified thermoplastic resin is 30% by mass or more and 95% by mass or less, where the total of the content of the silane-modified thermoplastic resin and the content of the thermoplastic resin modified with a modifier other than the silane compound is 100% by mass.

[0009] [3] The resin composition of the present invention is preferably the resin composition according to the above [1] or [2], wherein the modifying agent is at least one selected from the group consisting of carboxylic acid anhydrides, carboxylic acids, dicarboxylic acids, amines, and imines.

[0010] Furthermore, [4] the resin composition of the present invention is preferably the resin composition according to any one of the above [1] to [3], wherein the thermoplastic resin contains at least one of an olefin-based resin and a styrene-based resin.

[0011] [5] The resin composition of the present invention is preferably the resin composition according to any one of [1] to [4], wherein the thermoplastic resin is at least one selected from the group consisting of polyethylene, polypropylene, a styrene-ethylene-propylene block copolymer, a styrene-ethylene-propylene-styrene block copolymer, a styrene-ethylene-ethylene-propylene-styrene block copolymer, and a styrene-ethylene-butylene-styrene block copolymer.

[0012] Furthermore, [6] the resin composition of the present invention is preferably the resin composition according to any one of the above [1] to [5], wherein the silane-modified thermoplastic resin is a block copolymer comprising at least two polymer blocks [A] each mainly composed of a structural unit derived from an aromatic vinyl compound and at least one polymer block [B] mainly composed of a structural unit derived from a linear conjugated diene compound, wherein 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound have been hydrogenated, and alkoxysilyl groups have been introduced into the hydrogenated block copolymer.

[0013] [7] The resin composition of the present invention is preferably the resin composition according to any one of the above [1] to [5], wherein the silane-modified thermoplastic resin is a block copolymer comprising at least two polymer blocks [A] each mainly composed of a structural unit derived from an aromatic vinyl compound and at least one polymer block [B] mainly composed of a structural unit derived from a linear conjugated diene compound, wherein 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound and the carbon-carbon unsaturated bonds of the aromatic ring derived from the aromatic vinyl compound have been hydrogenated, and alkoxysilyl groups have been introduced into the hydrogenated block copolymer.

[0014] Furthermore, [8] the resin composition of the present invention is preferably the resin composition according to any one of the above [1] to [5], wherein the silane-modified thermoplastic resin comprises at least two polymer blocks [A] mainly composed of structural units derived from an aromatic vinyl compound and at least one polymer block [B] mainly composed of structural units derived from a linear conjugated diene compound, wherein the mass fraction of the structural units derived from the aromatic vinyl compound in the entire block copolymer is defined as wA and the mass fraction of the structural units derived from the linear conjugated diene compound in the entire block copolymer is defined as wB, and the ratio of wA to wB (wA:wB) is 20:80 to 70:30. In this block copolymer, alkoxysilyl groups have been introduced into a hydrogenated block copolymer in which 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound and the carbon-carbon unsaturated bonds of the aromatic rings derived from the aromatic vinyl compound have been hydrogenated.

[0015] [9] The resin composition of the present invention is preferably the resin composition according to any one of the above [1] to [8], further containing a liquid resin.

[0016] The resin composition according to any one of the above items [1] to [9] can be suitably used for sealing electronic components or as a hot melt adhesive.

[0017] The molded article of the present invention is characterized by being obtained by molding the resin composition according to any one of the above [1] to [9].

[0018] The adhesive sheet of the present invention is characterized by using the above-mentioned molded article of the present invention.

[0019] Furthermore, the decorative film of the present invention is characterized by using the above-mentioned molded article of the present invention.

[0020] According to the present invention, it is possible to provide a resin composition that can exhibit good adhesion to both organic and inorganic materials while ensuring transparency, and a molded article such as an adhesive sheet or a decorative film that uses the resin composition.

[0021] The present invention will be described in detail below. The components disclosed in this embodiment, as well as the preferred embodiments, numerical ranges, and thresholds defining these numerical ranges, shown for each component, can be independently combined with each other in any manner. The resin composition of the present invention can be used as an electronic component sealant or a hot melt adhesive without any particular limitations. The adhesive of the present invention can also be used to form various molded articles such as adhesive sheets and decorative films.

[0022] (Resin Composition) The resin composition of the present invention contains a silane-modified thermoplastic resin and a thermoplastic resin modified with a modifier other than a silane compound, and may optionally further contain other components such as a solvent, additives, etc. As described above, if the resin composition contains a silane-modified thermoplastic resin and a thermoplastic resin modified with a modifier other than a silane compound, it can ensure transparency and exhibit good adhesion to both organic and inorganic materials without surface treatment such as corona treatment.

[0023] In the present invention, the term "thermoplastic resin" refers to a polymer compound that softens when heated, and includes thermoplastic elastomers and rubbers.

[0024] <Silane-Modified Thermoplastic Resin> As the silane-modified thermoplastic resin, a thermoplastic resin modified with a silane compound can be used. Specifically, the silane-modified thermoplastic resin is not particularly limited, and a resin obtained by reacting a thermoplastic resin with an ethylenically unsaturated silane compound in the presence of a peroxide (silane modification) and introducing an alkoxysilyl group into the thermoplastic resin can be used. The alkoxysilyl group introduced is preferably a methoxysilyl group or an ethoxysilyl group, and more preferably a methoxysilyl group. Here, the alkoxysilyl group may be directly bonded to the thermoplastic resin or may be bonded via a divalent organic group such as an alkylene group or an alkyleneoxycarbonylalkylene group.

[0025] [Ethylenically Unsaturated Silane Compound] Here, the ethylenically unsaturated silane compound that can be used for silane modification is not particularly limited as long as it can react with a thermoplastic resin (e.g., graft polymerization) to introduce an alkoxysilyl group into the thermoplastic resin. Examples of such ethylenically unsaturated silane compounds include vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-acryloxypropyltrimethoxysilane. Among these, vinyltrimethoxysilane and vinyltriethoxysilane are preferred, and vinyltrimethoxysilane is more preferred. These compounds may be used alone or in combination of two or more in any ratio.

[0026] The amount of the ethylenically unsaturated silane compound used is not particularly limited, and is usually 0.1 parts by mass or more, preferably 0.2 parts by mass or more, and more preferably 0.3 parts by mass or more, per 100 parts by mass of the thermoplastic resin to be modified with the silane compound, and is usually 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 3 parts by mass or less.

[0027] [Peroxide] The peroxide used for silane modification is not particularly limited, and examples thereof include organic peroxides such as t-butylcumyl peroxide, dicumyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di-(t-butylperoxy)hexane, di-t-butyl peroxide, di-(2-t-butylperoxyisopropyl)benzene, etc. These may be used alone or in combination of two or more in any ratio.

[0028] The amount of peroxide used is not particularly limited, and is usually 0.05 parts by mass or more, preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, and usually 2 parts by mass or less, preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, per 100 parts by mass of the thermoplastic resin to be modified with the silane compound.

[0029] [Thermoplastic Resin] The thermoplastic resin to be modified with the silane compound is not particularly limited, and for example, a thermoplastic elastomer having a hard segment portion and a soft segment portion can be used. Specific examples of the thermoplastic resin include polystyrene-based resins, polyolefin-based resins, polyvinyl chloride-based resins, polyurethane-based resins, polyester-based resins, polyamide-based resins, polybutadiene-based resins, and hydrogenated versions of these. The above thermoplastic resins may be used alone or in combination of two or more.

[0030] Among these, from the viewpoint of improving the transparency of the resin composition and the adhesion to inorganic materials, the thermoplastic resin modified with a silane compound is preferably a hydrogenated block copolymer obtained by hydrogenating a block copolymer consisting of at least two polymer blocks [A] mainly composed of structural units derived from an aromatic vinyl compound and at least one polymer block [B] mainly composed of structural units derived from a chain conjugated diene compound. That is, the silane-modified thermoplastic resin is preferably the above-mentioned hydrogenated block copolymer in which an alkoxysilyl group has been introduced. The compositions of the multiple polymer blocks [A] in the block copolymer may be the same or different. Furthermore, when the block copolymer has multiple polymer blocks [B], the compositions of the multiple polymer blocks [B] may be the same or different.

[0031] Here, examples of aromatic vinyl compounds capable of forming structural units derived from aromatic vinyl compounds include styrene and its derivatives, specifically styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2,4-diisopropylstyrene, 2,4-dimethylstyrene, 4-t-butylstyrene, 5-t-butyl-2-methylstyrene, 4-monochlorostyrene, dichlorostyrene, 4-monofluorostyrene, and 4-phenylstyrene. Among these, those that do not contain a polar group in order to reduce hygroscopicity, specifically styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2,4-diisopropylstyrene, 2,4-dimethylstyrene, 4-t-butylstyrene, 5-t-butyl-2-methylstyrene, and 4-phenylstyrene, are preferred, with styrene being particularly preferred due to its ease of industrial availability. These may be used alone, or two or more may be used in combination in any ratio.

[0032] The chain conjugated diene compound capable of forming a structural unit derived from the chain conjugated diene compound is not particularly limited, but in order to reduce hygroscopicity, one not containing a polar group is preferred, and specific examples thereof include 1,3-butadiene, isoprene (2-methyl-1,3-butadiene), 2,3-dimethyl-1,3-butadiene, and 1,3-pentadiene. Of these, 1,3-butadiene and isoprene are particularly preferred because of their ease of industrial availability. These may be used alone or in combination of two or more types in any ratio.

[0033] The content of the structural units derived from an aromatic vinyl compound in the polymer block [A] is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 100% by mass, when the total amount of all repeating units in the polymer block [A] is taken as 100% by mass. When the content of the structural units derived from an aromatic vinyl compound in the polymer block [A] is equal to or more than the above-mentioned lower limit, the heat resistance of the polymer block [A] can be maintained.

[0034] The polymer block [A] may contain structural units other than structural units derived from aromatic vinyl compounds, and such other structural units may be structural units derived from linear conjugated diene compounds. Examples of compounds (monomers) capable of forming such other structural units include linear olefins such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-eicosene, 4-methyl-1-pentene, and 4,6-dimethyl-1-heptene; and cyclic olefins such as vinylcyclohexane.

[0035] The content of the structural units derived from a chain conjugated diene compound in the polymer block [B] is preferably 60% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and particularly preferably 100% by mass, when the total amount of all repeating units in the polymer block [B] is taken as 100% by mass. When the content of the structural units derived from a chain conjugated diene compound in the polymer block [B] is 60% by mass or more, the glass transition temperature (Tg) derived from the polymer block [B] in the copolymer can be made to be appropriately high.

[0036] The polymer block [B] may contain a structural unit other than the structural unit derived from a chain conjugated diene compound, and such other structural unit may be a structural unit derived from an aromatic vinyl compound, or may be formed from the chain olefin or cyclic olefin described above with respect to the polymer block [A].

[0037] The number of polymer blocks [A] in the block copolymer is usually 5 or less, preferably 4 or less, more preferably 3 or less, and particularly preferably 2. The number of polymer blocks [B] in the block copolymer is usually 4 or less, preferably 3 or less, more preferably 2 or less, and particularly preferably 1.

[0038] The block copolymer preferably has at least one structure in which the polymer block [A] is bonded to both ends of the polymer block [B] (i.e., a structure in which the blocks are arranged in the order A-B-A). Examples of such a block copolymer include a triblock copolymer (A-B-A) in which the polymer block [A] is bonded to both ends of the polymer block [B], and a pentablock copolymer (A-B-A-B-A) in which the polymer block [B] is bonded to both ends of the polymer block [A] and further a polymer block [A] is bonded to the other end of each of the two polymer blocks [B], with a triblock copolymer (A-B-A) being the most preferred.

[0039] Furthermore, when the mass fraction of all structural units derived from aromatic vinyl compounds in the block copolymer as a whole is defined as wA, and the mass fraction of all structural units derived from linear conjugated diene compounds in the block copolymer as a whole is defined as wB, the ratio of wA to wB (wA:wB) is preferably 20:80 to 70:30, more preferably 25:75 to 60:40, and particularly preferably 40:60 to 60:40. If wA is too high, the impact resistance at low temperatures of the hydrogenated copolymer obtained from the copolymer may be reduced. On the other hand, if wA is too low, the rigidity of the hydrogenated copolymer obtained from the copolymer may be reduced. The "ratio of wA to wB (wA:wB)" can be calculated from the amounts of aromatic vinyl compounds, linear conjugated diene compounds, and other compounds used in the polymerization of the block copolymer during the process of producing the block copolymer, and the polymerization conversion rate at the end of polymerization of each block of the block copolymer measured using gas chromatography (GC).

[0040] The hydrogenation method and reaction form of the block copolymer are not particularly limited, and may be carried out according to a known method. The hydrogenated block copolymer obtained by hydrogenating the block copolymer may be a polymer in which only the carbon-carbon unsaturated bonds in the main chain and side chain derived from the linear conjugated diene compound of the block copolymer have been selectively hydrogenated, or a polymer in which the carbon-carbon unsaturated bonds in the main chain and side chain derived from the linear conjugated diene compound of the block copolymer and the carbon-carbon unsaturated bonds in the aromatic ring derived from the aromatic vinyl compound have been hydrogenated, or a mixture thereof.

[0041] When selectively hydrogenating only the carbon-carbon unsaturated bonds in the main chain and side chain of a block copolymer derived from a linear conjugated diene compound, the hydrogenated block copolymer preferably has a hydrogenation rate of 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound, more preferably 95% or more, even more preferably 97% or more, and particularly preferably 99% or more. When selectively hydrogenating only the carbon-carbon unsaturated bonds in the main chain and side chain of a block copolymer derived from a linear conjugated diene compound, the hydrogenated block copolymer has a hydrogenation rate of 10% or less of the carbon-carbon unsaturated bonds in the aromatic ring derived from the aromatic vinyl compound, preferably 5% or less, and more preferably 3% or less.

[0042] Furthermore, when the carbon-carbon unsaturated bonds in the main chain and side chain of the block copolymer derived from the linear conjugated diene compound and the carbon-carbon unsaturated bonds in the aromatic ring derived from the aromatic vinyl compound are hydrogenated, the hydrogenation rate of all carbon-carbon unsaturated bonds (carbon-carbon unsaturated bonds derived from the linear conjugated diene compound and carbon-carbon unsaturated bonds in the aromatic ring derived from the aromatic vinyl compound) is preferably 90% or more, more preferably 95% or more, and even more preferably 99% or more.

[0043] In the present invention, the hydrogenation rate of the carbon-carbon unsaturated bond derived from the chain conjugated diene compound and the hydrogenation rate of the carbon-carbon unsaturated bond of the aromatic ring derived from the aromatic vinyl compound in the hydrogenated block copolymer can be determined, for example, by the following methods: １ It can be determined by measuring H-NMR.

[0044] Furthermore, examples of methods for selectively hydrogenating the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound of the block copolymer include known hydrogenation methods such as those described in JP 2015-78090 A. Furthermore, examples of methods for hydrogenating the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound of the block copolymer and the carbon-carbon unsaturated bonds of the aromatic ring derived from the aromatic vinyl compound include methods such as those described in WO 2011 / 096389 and WO 2012 / 043708.

[0045] After the hydrogenation reaction is completed, the hydrogenation catalyst, or the hydrogenation catalyst and the polymerization catalyst, are removed from the reaction solution, and then the solvent is removed from the resulting solution to recover the hydrogenated copolymer.

[0046] [Physical Properties of Silane-Modified Thermoplastic Resin] The silane-modified thermoplastic resin described above is not particularly limited, and preferably has a weight-average molecular weight (Mw) of 7,000 or more, more preferably 10,000 or more, even more preferably 12,000 or more, particularly preferably 35,000 or more, and preferably 190,000 or less, more preferably 150,000 or less, even more preferably 100,000 or less, particularly preferably 55,000 or less. If the weight-average molecular weight of the silane-modified thermoplastic resin is within the above range, a resin composition that exhibits both heat resistance and moldability can be obtained. In the present invention, the "weight-average molecular weight" can be determined as a standard polystyrene equivalent value by gel permeation chromatography (GPC).

[0047] The content of the silane-modified thermoplastic resin is preferably 30% by mass or more, more preferably 50% by mass or more, and even more preferably 75% by mass or more, and preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 85% by mass or less, where the total of the content of the silane-modified thermoplastic resin and the content of the thermoplastic resin modified with a modifier other than a silane compound is 100% by mass. If the content of the silane-modified thermoplastic resin is equal to or greater than the lower limit, adhesion to inorganic materials can be further improved, and the transparency of the resin composition can be further improved. If the content of the silane-modified thermoplastic resin is equal to or less than the upper limit, adhesion to organic materials can be further improved.

[0048] <Thermoplastic resin modified with a modifier other than a silane compound> The thermoplastic resin modified with a modifier other than a silane compound is not particularly limited, and a resin obtained by reacting a thermoplastic resin with a modifier other than a silane compound and introducing a functional group derived from the modifier into the thermoplastic resin can be used.

[0049] [Modifiers Other Than Silane Compounds] The modifiers other than silane compounds are not particularly limited, and examples thereof include at least one selected from the group consisting of carboxylic acid anhydrides such as maleic anhydride and itaconic anhydride; carboxylic acids (monocarboxylic acids) such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; amines such as 1-hexylamine, 1-heptylamine, and 1-octylamine; and imines such as hexamethyleneimine. Use of these modifiers can improve the adhesion of the resin composition to organic materials.

[0050] Among these, from the viewpoint of enhancing the adhesiveness of the resin composition to organic materials, maleic acid or maleic anhydride is preferred as the modifier other than the silane compound.

[0051] The amount of the modifier used is not particularly limited, and is usually 0.1 parts by mass or more, preferably 0.2 parts by mass or more, more preferably 0.3 parts by mass or more, and usually 10 parts by mass or less, preferably 5 parts by mass or less, more preferably 3 parts by mass or less, per 100 parts by mass of the thermoplastic resin modified with the modifier other than the silane compound. When the amount of the modifier used is within the above range, the adhesion of the resin composition to organic materials can be further improved.

[0052] [Thermoplastic Resin] The thermoplastic resin to be modified with a modifier other than a silane compound is not particularly limited, and for example, a thermoplastic elastomer having a hard segment portion and a soft segment portion can be used. Specifically, for example, the thermoplastic resin can be at least one of an olefin-based resin and a styrene-based resin. By using at least one of an olefin-based resin and a styrene-based resin, it is possible to suppress a decrease in the transparency of the resin composition while increasing the adhesion to both organic and inorganic materials.

[0053] Here, the olefin resin is not particularly limited, but examples thereof include polyethylene and polypropylene.

[0054] Furthermore, the styrene-based resin is not particularly limited, and examples thereof include a styrene-ethylene-propylene block copolymer, a styrene-ethylene-propylene-styrene block copolymer, a styrene-ethylene-ethylene-propylene-styrene block copolymer, and a styrene-ethylene-butylene-styrene block copolymer.

[0055] Among the above, polypropylene is preferred as the thermoplastic resin to be modified with a modifier other than a silane compound from the viewpoint of further improving the transparency and adhesiveness of the resin composition. The above thermoplastic resins may be used alone or in combination of two or more.

[0056] The thermoplastic resin modified with a modifier other than a silane compound is not particularly limited, and can be produced, for example, by the method described in Japanese Patent Application Laid-Open No. 07-018018.

[0057] <Other Components> The other components are not particularly limited, and may contain solvents and additives depending on the intended use of the resin composition.

[0058] Among these, the resin composition preferably contains a liquid resin. Here, the liquid resin is not particularly limited as long as it is a resin that is liquid at room temperature and normal pressure, and hydrogenated polybutene, liquid paraffin, liquid polybutadiene, liquid polyisoprene, etc. can be used. These may be used alone or in combination of two or more types in any ratio.

[0059] The amount of liquid resin contained in the resin composition is not particularly limited, but is preferably 20 parts by mass or more and 50 parts by mass or less per 100 parts by mass of the total of the silane-modified thermoplastic resin and the thermoplastic resin modified with a modifier other than a silane compound.

[0060] <Preparation of Resin Composition> The resin composition can be prepared by mixing a silane-modified thermoplastic resin, a thermoplastic resin modified with a modifier other than a silane compound, and other optional components. Here, the mixing is not particularly limited and can be performed using a known mixing method such as melt-kneading.

[0061] <Uses of Resin Composition> The resin composition of the present invention is a transparent material that can exhibit good adhesion to both organic and inorganic materials, and can therefore be suitably used, for example, as an electronic component sealant, a hot melt adhesive, and the like.

[0062] (Molded Article) The molded article of the present invention is obtained by molding the resin composition of the present invention. Here, the molding of the resin composition can be performed using a known molding method such as press molding, extrusion molding, injection molding, or blow molding.

[0063] The molded article of the present invention can be used as an adhesive sheet, a decorative film, etc., without any particular limitation.

[0064] The present invention will be described in more detail below with reference to examples, but the scope of the present invention is not limited to these examples. In the following examples and comparative examples, various measurements and evaluations were carried out by the following methods.

[0065] <Hydrogenation rate> １ H-NMR measurement (measurement solvent: CDCl ３ ) was performed, and the proportion of unsaturated bonds that disappeared among all unsaturated bonds present in the copolymer was calculated to derive the softening point. <Adhesion> Peel strength was measured against polymethyl methacrylate (PMMA), polycarbonate (PC), and polyethylene terephthalate (PET). <Transparency> Light transmittance and haze at a wavelength of 400 nm were measured. <Heat Resistance> The resin composition was pressed at 230°C using a heat press (Tester Sangyo Co., Ltd., SA-302) to produce a sheet with a thickness of 500 μm. The sheet was measured using a thermomechanical analyzer (Hitachi High-Tech Science Corporation, TMA7100) at a heating rate of 5°C / min and a load of 20 mN, and the temperature at which the length changed by 5% was defined as the softening point.

[0066] Example 1 Preparation of Silane-Modified Thermoplastic Resin 550 parts of dehydrated cyclohexane, 25 parts of dehydrated styrene, and 0.475 parts of n-butyl ether were placed in a nitrogen-purged reactor equipped with a stirrer. While stirring at 60°C, 0.90 parts of n-butyllithium (15% n-hexane solution) was added to initiate polymerization. The polymerization reaction was carried out at 65°C for 60 minutes. Gas chromatography showed that the polymerization conversion at this point was 99.9%. Next, 50.0 parts of dehydrated isoprene was added, and stirring was continued for 40 minutes. The polymerization conversion at this point was 99.6%. Subsequently, 25.0 parts of dehydrated styrene was added, and the reaction was carried out for 60 minutes. The polymerization conversion at this point was nearly 100%. At this point, 2.0 parts of methanol was added to terminate the reaction. The resulting solution of block copolymer [C1] was an SIS (styrene block-isoprene block-styrene block) triblock copolymer. The solution of block copolymer [C1] was transferred to a pressure-resistant reactor equipped with a stirrer, and 4 parts of a silica-alumina-supported nickel catalyst (product name: T-8400RL, manufactured by Clariant Catalysts Co., Ltd., nickel content 33%) as a hydrogenation catalyst and 100 parts of dehydrated cyclohexane were added and mixed. The inside of the reactor was purged with hydrogen gas at room temperature, and the temperature was raised to 180°C while pressurizing to a gauge pressure of 2 MPa. When the internal temperature of the pressure-resistant reactor reached 180°C, hydrogen was not supplied for 60 minutes, and the temperature was maintained constant at 180°C. After 60 minutes, the hydrogen pressure was increased to 4.5 MPa, and the hydrogenation reaction was carried out for 6 hours (hydrogenation rate: 99.9%). After completion of the hydrogenation reaction, the reaction solution was filtered to remove the hydrogenation catalyst, and then 2.0 parts of a xylene solution containing 0.1 parts of pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] (product name "AO60", manufactured by ADEKA Corporation), a phenolic antioxidant, was added and dissolved in the resulting solution. Next, cyclohexane, xylene, and other volatile components were removed from the solution using a cylindrical concentrating dryer (product name "CONTROL", manufactured by Hitachi, Ltd.) at a temperature of 260°C and a pressure of 0.001 MPa or less.The molten polymer was extruded through a die into a strand, cooled, and then cut using a pelletizer to obtain 94 parts of pellets consisting of a hydrogenated block copolymer [D1]. To 100 parts of the resulting hydrogenated block copolymer [D1] pellets, 2.0 parts of vinyltrimethoxysilane and 0.2 parts of 2,5-dimethyl-2,5-di(t-butylperoxy)hexane (product name "Perhexa (registered trademark) 25B", manufactured by NOF Corporation) were added. This mixture was kneaded using a twin-screw extruder (product name "TEM37B", manufactured by Toshiba Machine Co., Ltd.) at a resin temperature of 200°C and a residence time of 60 to 70 seconds. The resulting kneaded product was extruded into a strand, air-cooled, and then cut using a pelletizer to obtain 97 parts of pellets of a modified hydrogenated block copolymer [E1] having alkoxysilyl groups. [Preparation of thermoplastic resin modified with a modifier other than a silane compound] <Maleic acid-modified polypropylene> Maleic acid-modified polypropylene (maleic acid-modified PP) was obtained by the method described in JP-A-07-018018. [Preparation of resin composition] A resin composition was obtained by mixing the above components in the ratios shown in Table 1. Various evaluations were then carried out on the obtained resin composition. The results are shown in Table 1.

[0067] (Example 2) The preparation of a silane-modified thermoplastic resin, a thermoplastic resin modified with a modifier other than a silane compound, and a resin composition were carried out in the same manner as in Example 1, except that the amount of modified hydrogenated block copolymer [E1] was changed to 80 parts and the amount of maleic acid-modified polypropylene was changed to 20 parts during the preparation of the resin composition. Various evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0068] (Example 3) The preparation of a silane-modified thermoplastic resin, a thermoplastic resin modified with a modifier other than a silane compound, and a resin composition were carried out in the same manner as in Example 1, except that the amount of modified hydrogenated block copolymer [E1] was changed to 60 parts and the amount of maleic acid-modified polypropylene was changed to 40 parts during the preparation of the resin composition. Various evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0069] Comparative Example 1 Without using a thermoplastic resin modified with a modifier other than a silane compound, pellets of the modified hydrogenated block copolymer [E1] having alkoxysilyl groups were subjected to various evaluations in the same manner as in Example 1. The results are shown in Table 1.

[0070]

[0071] According to the present invention, it is possible to provide a resin composition that can exhibit good adhesion to both organic and inorganic materials while ensuring transparency, and a molded article such as an adhesive sheet or a decorative film that uses the resin composition.

Claims

1. A resin composition comprising a silane-modified thermoplastic resin and a thermoplastic resin modified with a modifier other than a silane compound.

2. A resin composition according to claim 1, wherein the content of the silane-modified thermoplastic resin is 30% by mass or more and 95% by mass or less, where the sum of the content of the silane-modified thermoplastic resin and the content of the thermoplastic resin modified with a modifier other than the silane compound is 100% by mass.

3. The resin composition according to claim 1, wherein the modifying agent is at least one selected from the group consisting of carboxylic acid anhydrides, carboxylic acids, dicarboxylic acids, amines, and imines.

4. The resin composition according to claim 1, wherein the thermoplastic resin comprises at least one of an olefin-based resin and a styrene-based resin.

5. The resin composition according to claim 1, wherein the thermoplastic resin is at least one selected from the group consisting of polyethylene, polypropylene, styrene-ethylene-propylene block copolymer, styrene-ethylene-propylene-styrene block copolymer, styrene-ethylene-ethylene-propylene-styrene block copolymer, and styrene-ethylene-butylene-styrene block copolymer.

6. The resin composition according to claim 1, wherein the silane-modified thermoplastic resin is a block copolymer comprising at least two polymer blocks [A] each having a structural unit derived from an aromatic vinyl compound as a main component and at least one polymer block [B] each having a structural unit derived from a linear conjugated diene compound as a main component, wherein 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound have been hydrogenated, and alkoxysilyl groups have been introduced into the hydrogenated block copolymer.

7. The resin composition according to claim 1, wherein the silane-modified thermoplastic resin is a block copolymer comprising at least two polymer blocks [A] primarily composed of structural units derived from an aromatic vinyl compound and at least one polymer block [B] primarily composed of structural units derived from a linear conjugated diene compound, wherein 90% or more of the carbon-carbon unsaturated bonds derived from the linear conjugated diene compound and the carbon-carbon unsaturated bonds of the aromatic ring derived from the aromatic vinyl compound have been hydrogenated, and alkoxysilyl groups have been introduced into the hydrogenated block copolymer.

8. The resin composition according to claim 1, wherein the silane-modified thermoplastic resin comprises at least two polymer blocks [A] primarily composed of structural units derived from an aromatic vinyl compound and at least one polymer block [B] primarily composed of structural units derived from a chain-like conjugated diene compound, wherein the ratio of wA to wB (wA:wB) of the block copolymer is 20:80 to 70:30, where wA is the mass fraction of the structural units derived from the aromatic vinyl compound in the entire block copolymer and wB is the mass fraction of the structural units derived from the chain-like conjugated diene compound in the entire block copolymer, and alkoxysilyl groups are introduced into the hydrogenated block copolymer in which 90% or more of the carbon-carbon unsaturated bonds derived from the chain-like conjugated diene compound and the carbon-carbon unsaturated bonds of the aromatic rings derived from the aromatic vinyl compound are hydrogenated.

9. The resin composition according to claim 1, further comprising a liquid resin.

10. The resin composition according to any one of claims 1 to 9, which is used for sealing electronic components.

11. The resin composition according to any one of claims 1 to 9, which is used for a hot melt adhesive.

12. A molded article obtained by molding the resin composition according to any one of claims 1 to 9.

13. An adhesive sheet using the molded article according to claim 12.

14. A decorative film using the molded article according to claim 12.

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