Multi-camera assembly

Abstract

The present invention provides a multi-camera assembly comprising: a case bottom; a first substrate installed on one side of the case bottom; a second substrate installed on the other side of the case bottom; and a heat sink coupled to dissipate heat from the second substrate, wherein the first substrate and the second substrate are connected to each other by means of a board-to-board connector.

Description

Multi-camera assembly

[0001] The present invention relates to a multi-camera assembly, and more particularly, to a multi-camera assembly capable of increasing assembly efficiency and expandability by improving an assembly structure.

[0002] Typically, surveillance cameras designed to monitor a specific area typically feature multiple camera modules capable of pan / tilt / zoom movements, enabling them to cover a wide area with a small number of devices and track objects with specific movements. In particular, dome cameras, among other types of surveillance cameras, are increasingly being used due to their circular symmetry around their central axis, facilitating pan / tilt / zoom movements and enabling miniaturization.

[0003] These surveillance cameras have a dome cover that is designed to cover a plurality of cameras with a transparent optical exterior component, and have a configuration that prevents fogging or condensation on the dome cover by sending air to the inner surface of the dome cover by a fan mounted on the inside of the dome cover. Specifically, a conventional dome camera has a plurality of blower fans, and a plurality of intake ports and exhaust ports installed in the vicinity of a plurality of camera modules arranged in the circumferential direction of the housing.

[0004] A blower fan may be used to remove moisture generated by the temperature difference between the inside and outside of the camera device, or may be used to cool camera modules or circuit boards that may overheat depending on the installation / use environment.

[0005] The dome cover is configured to include a transparent panel that transmits reflected light from the subject to allow it to enter the camera module, and a transmissive panel that transmits infrared rays irradiated from the lighting module. Since the transparent panel and the transmissive panel of this dome cover are formed of different materials and shapes, they are manufactured as separate components and then assembled and mounted on the housing.

[0006] However, conventional surveillance cameras have significantly reduced assembly efficiency due to the process of connecting separate connectors connected by wires, and have limitations in meeting customer needs for expandability due to limited slots.

[0007] The present invention is intended to solve such problems, and more specifically, to provide a multi-camera assembly capable of increasing assembly and expandability by improving the assembly structure.

[0008] The objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

[0009] In order to achieve the above object, the present invention provides a multi-camera assembly comprising: a case bottom; a first substrate installed on one side of the case bottom; a second substrate installed on the other side of the case bottom; and a heat sink coupled to dissipate heat from the second substrate; wherein the first substrate and the second substrate are connected to each other by a board-to-board connector.

[0010] The second substrate may include an expansion slot capable of additionally mounting at least one or more of a graphics card or a memory card.

[0011] The case bottom may have a through hole formed between the first substrate and the second substrate through which a board-to-board connector can pass.

[0012] The above heat sink may include at least one guide boss protruding toward the second substrate from one side, and a plurality of heat dissipation fins protruding in parallel along a set interval from the other side.

[0013] The above guide boss can set an assembly position on the case bottom by penetrating the second substrate and the case bottom.

[0014] The above guide boss can be inserted so as to penetrate the first substrate after penetrating the case bottom.

[0015] In a state where the heat sink is coupled to the case bottom, the guide boss may be formed so that the area penetrating the case bottom has a larger cross-sectional area than the area penetrating the first substrate.

[0016] The second substrate is coupled to one side of the heat sink and can be simultaneously removed when the heat sink is separated from the case bottom.

[0017] The above multi-camera assembly may further include a protective cover interposed between the second substrate and the case bottom and fixed on the second substrate.

[0018] The above protective cover may include a shielding member extending from both longitudinal ends of the second substrate toward the heat sink.

[0019] Specific details of other embodiments are included in the detailed description and drawings.

[0020] According to a multi-camera assembly according to an embodiment of the present invention,

[0021] First, the SoC chip or memory card can be additionally installed through the expansion slot on the second board according to the needs of the customer.

[0022] Second, during the process of removing and installing the second board, it is possible to easily connect the first board and the second board through a board-to-board connector.

[0023] Third, since the alignment of the second substrate is performed simultaneously during the heat sink mounting process, it has the effect of increasing the ease of assembly.

[0024] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0025] The above summary, as well as the detailed description of preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the present invention, preferred embodiments are depicted in the drawings. However, it should be understood that the present application is not limited to the precise arrangements and means illustrated.

[0026] FIG. 1 is a front view illustrating a multi-camera assembly according to an embodiment of the present invention.

[0027] FIG. 2 is a perspective view illustrating an exploded view of the upper area of ​​the multi-camera assembly shown in FIG. 1.

[0028] FIG. 3 is a cross-sectional view showing the II' section of the multi-camera assembly shown in FIG. 2.

[0029] Fig. 4 is a cross-sectional view showing the II-II' section of the multi-camera assembly shown in Fig. 2.

[0030] Figure 5 is a reference drawing showing the heat sink of the multi-camera assembly shown in Figure 2 in a disassembled state.

[0031] FIG. 6 is a reference drawing showing a state in which the first substrate and the second substrate of the multi-camera assembly shown in FIG. 4 are connected.

[0032] FIG. 7 is a reference drawing showing the first substrate and the second substrate of the multi-camera assembly shown in FIG. 6 separated.

[0033] FIG. 8 is a reference drawing illustrating a second substrate of the multi-camera assembly shown in FIG. 6.

[0034] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described in detail below together with the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

[0035] The present invention can have various modifications and embodiments, and specific embodiments are illustrated and described in the drawings.

[0036] However, this is not intended to limit the present invention to a specific embodiment, but should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention.

[0037] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms.

[0038] The above terms are used solely to distinguish one component from another.

[0039] For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component.

[0040] The term and / or includes any combination of a plurality of related described items or any one of a plurality of related described items.

[0041] When it is said that a component is "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but there may also be other components in between.

[0042] On the other hand, when it is said that a component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0043] The terminology used in this application is for the purpose of describing specific embodiments only and is not intended to limit the present invention.

[0044] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0045] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0046] Hereinafter, embodiments will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or corresponding components are given the same reference numbers, and redundant descriptions thereof will be omitted.

[0047] FIG. 1 is a front view illustrating a multi-camera assembly according to an embodiment of the present invention, FIG. 2 is a perspective view illustrating an exploded upper area of ​​the multi-camera assembly illustrated in FIG. 1, FIG. 3 is a cross-sectional view illustrating a section II' of the multi-camera assembly illustrated in FIG. 2, and FIG. 4 is a cross-sectional view illustrating a section II-II' of the multi-camera assembly illustrated in FIG. 2.

[0048] Referring to FIGS. 1 to 4, a multi-camera assembly (100) according to an embodiment of the present invention may include a case bottom (110), a first substrate (120), a second substrate (130), and a heat sink (140).

[0049] First, a dome cover (111) may be coupled to one side of the case bottom (110). Although not shown in the drawing, a camera module (not shown) may be installed inside the dome cover (111). A first substrate (120) may be installed inside a frame bottom (112) on one side of the case bottom (110) where the camera module is installed. The first substrate (120) may be fixed to the bottom surface of the case bottom (110).

[0050] Additionally, the case bottom (110) may be coupled to a mount (150) that is fixed on the installation surface while the other side is placed on the installation surface. FIG. 2 illustrates the case bottom (110) removed from the installation surface. A heat sink (140) may be provided on the other side of the case bottom (110).

[0051] A second substrate (130) may be coupled to the heat sink (140). The second substrate (130) may be positioned between the heat sink (140) and the upper surface of the other side of the case bottom (110). Therefore, when the heat sink (140) is removed from the case bottom (110), the second substrate (130) may be separated together with the heat sink (140).

[0052] The heat sink (140) may include at least one guide boss (141) protruding on one side and a heat dissipation fin (142) protruding on the other side.

[0053] The guide boss (141) can set an assembly position on the case bottom (110) by penetrating the second substrate (130) and the case bottom (110). In this embodiment, an example in which two guide bosses (141) are provided will be described. In other words, in the process of mounting the heat sink (140) on the case bottom (110), the mounting position of the heat sink (140) can be set by inserting two guide bosses (141) so as to penetrate the case bottom (110), and at this time, the installation position of the second substrate (130) coupled to the heat sink (140) can also be set on the case bottom (110) at the same time.

[0054] Additionally, the guide boss (141) can be inserted so as to penetrate the first substrate (120) after penetrating the case bottom (110). That is, the installation positions of the first substrate (120) and the second substrate (130) can be set to be constant through the mounting of the heat sink (140).

[0055] In a state where the heat sink (140) is coupled to the case bottom (110), the guide boss (141) includes a first region (A1) penetrating the case bottom (110) and a second region (A2) penetrating the first substrate (120). At this time, the cross-sectional area of ​​the first region (A1) may be formed larger than the cross-sectional area of ​​the second region (A2). Since the guide boss (141) is formed in a cylindrical shape with one cross-section being circular, the diameter of the first region (A1) of the guide boss (141) may be formed larger than the diameter of the second region (A2). Of course, a tapered structure (A3) having an inclined surface shape in which the cross-sectional area or diameter between the first region (A1) and the second region (A2) is constantly changed may be formed so that smooth assembly can be performed along the coupling direction between the first region (A1) and the second region (A2). Additionally, a tapered structure can also be applied to the tip of the second area (A2).

[0056] A protective cover (160) may be further provided between the second substrate (130) and the other upper surface of the case bottom (110). The protective cover (160) may be coupled to the second substrate (130) or the heat sink (140) so as to surround the second substrate (130). The protective cover (160) may include a shielding member (161) that extends from both longitudinal ends of the second substrate (130) toward the heat sink (140) while covering the lower surface of the second substrate (130).

[0057] The shielding member (161) can be positioned so as to face each other at both ends of the protective cover (160). The protective cover (160) can provide a function of preventing the second substrate (130) from being damaged by a user while in a separated state, and also preventing the second substrate (130) from being damaged by an external force such as static electricity.

[0058] In addition, the second substrate (130) may include an expansion slot (131) that can additionally mount a SoC (System on Chip) chip or a memory card according to the needs of the user. For example, the SoC chip may connect hardware blocks necessary for running an application that can implement functions such as setting a certain area as a restricted area in the area captured by the camera module, or storing information on objects entering or exiting a set area, or may add a software driver that controls the operation.

[0059] FIG. 5 is a reference drawing illustrating a heat sink of the multi-camera assembly illustrated in FIG. 2 in a separated state, FIG. 6 is a reference drawing illustrating a state in which the first substrate and the second substrate of the multi-camera assembly illustrated in FIG. 4 are connected, and FIG. 7 is a reference drawing illustrating the first substrate and the second substrate of the multi-camera assembly illustrated in FIG. 6 in a separated state.

[0060] Referring to FIGS. 5 to 7, the second substrate (130) can be separated from the first substrate (120) in the process of separating the heat sink (140) from the case bottom (110).

[0061] Here, the protective cover (160) bonded to the second substrate (130) is shown in a removed state.

[0062] At this time, the first substrate (120) and the second substrate (130) can be connected to each other through a board-to-board (B2B) connector (170).

[0063] The board-to-board connector (170) may include a female connector (171) provided on one of the first substrate (120) and the second substrate (130), and a male connector (172) provided on the other of the first substrate (120) and the second substrate (130). Therefore, the board-to-board connector (170) may be assembled by forcibly inserting the female connector (171) and the male connector (172) into each other. In the present embodiment, as an example, a female connector (171) is provided on the first substrate (120), and a male connector (172) is provided on the second substrate (130).

[0064] Since the first substrate (120) and the second substrate (130) are intuitively connected to each other using the board-to-board connector (170), the process of connecting separate connectors connected with conventional wires is no longer necessary, thereby increasing the ease of assembly and also improving noise problems that may occur during data transmission.

[0065] Of course, the connection position of the first substrate (120) and the second substrate (130) can be set simultaneously while aligning the position where the guide boss (141) of the above-described heat sink (140) is installed on the case bottom (110).

[0066] The case bottom (110) may have a through hole (see FIG. 4, 113) formed between the first substrate (120) and the second substrate (130) through which a board-to-board connector (170) can pass.

[0067] FIG. 8 is a reference drawing illustrating a second substrate (130) of the multi-camera assembly (100) shown in FIG. 6.

[0068] Figure 8 illustrates the upper surface of the second substrate (130) facing the heat sink (140).

[0069] An expansion slot (131) for additionally mounting a SoC chip slot and a memory card may be provided on the upper surface of the second substrate (130). Accordingly, the multi-camera assembly (100) can increase expandability and compatibility.

[0070] For example, in FIG. 8, the expansion slot (131) may include a first expansion slot (132) in which one additional SoC chip can be mounted, and a second expansion slot (133) in which two additional memory cards can be mounted, and the number of expansion slots (131) is not limited thereto.

[0071] Additionally, the multi-camera assembly (100) may be shipped with the first expansion slot (132) and the second expansion slot (133) of the second substrate (130) empty.

[0072] Therefore, according to the multi-camera assembly according to the embodiment of the present invention, an SoC chip or a memory card can be additionally mounted on the second substrate through an expansion slot according to the needs of the customer, and in the process of removing and mounting the second substrate, the connection between the first substrate and the second substrate can be easily made through a board-to-board connector, and since the alignment of the second substrate is performed simultaneously during the process of mounting the heat sink, there is an effect of increasing the ease of assembly.

[0073] While specific embodiments have been illustrated and described above to illustrate the technical concepts of the present invention, the present invention is not limited to the configuration and operation of the specific embodiments described above, and various modifications may be implemented without departing from the scope of the present invention. Therefore, such modifications should be considered within the scope of the present invention, and the scope of the present invention should be determined by the claims set forth below.

Claims

1. Case bottom; A first substrate installed on one side of the case bottom; A second substrate installed on the other side of the case bottom; A heat sink coupled to the second substrate to dissipate heat; A multi-camera assembly in which the first substrate and the second substrate are connected to each other by a board-to-board connector.

2. In paragraph 1, The above second substrate, A multi-camera assembly comprising an expansion slot capable of additionally mounting at least one or more graphics cards or memory cards.

3. In paragraph 1, The above case bottom is, A multi-camera assembly in which a through hole is formed between the first substrate and the second substrate through which a board-to-board connector can pass.

4. In paragraph 1, The above heat sink, At least one guide boss protruding toward the second substrate from one side, A multi-camera assembly comprising a plurality of heat dissipation fins protruding in parallel along a set interval from the other side.

5. In paragraph 4, The above guide boss is, A multi-camera assembly that penetrates the case bottom while penetrating the second substrate and sets an assembly position on the case bottom.

6. In paragraph 5, The above guide boss is, A multi-camera assembly that is inserted so as to penetrate the first substrate after penetrating the case bottom.

7. In paragraph 6, With the heatsink attached to the bottom of the case, The above guide boss is, A multi-camera assembly in which the area penetrating the case bottom has a larger cross-sectional area than the area penetrating the first substrate.

8. In paragraph 4, A multi-camera assembly wherein the second substrate is coupled to one side of the heat sink and is simultaneously removed when the heat sink is separated from the case bottom.

9. In paragraph 1, A multi-camera assembly further comprising a protective cover interposed between the second substrate and the case bottom and fixed on the second substrate.

10. In paragraph 9, The above protective cover, A multi-camera assembly comprising a shielding member extending from both longitudinal ends of the second substrate toward the heat sink.

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