Optical module, signal conversion method, and storage medium

Abstract

Disclosed in the present application are an optical module, a signal conversion method and a storage medium, which are applied to the field of optical communication, and used for signal conversion. The optical module provided by the present application comprises: an Ethernet port, which is used for receiving external electric signal data and externally outputting processed output electric signal data; an optical engine platform, which is used for performing signal processing and conversion on the external electric signal data to obtain output optical signal data after conversion, then receiving external optical signal data, performing signal processing and conversion on the external optical signal data to obtain output optical signal data or second electric signal data after conversion, and outputting the output optical signal data or the second electric signal data; a micro-control processor, which is used for controlling the Ethernet port and the optical engine platform for regulating transmission and parameters of the electric signal and the optical signal in the optical module; and a printed circuit board, which is used for bearing the Ethernet port, the optical engine platform and the micro-control processor.

Description

Optical module, signal conversion method and storage medium TECHNICAL FIELD

[0001] The present application relates to the field of communication, and in particular to an optical module, a signal conversion method and a storage medium. BACKGROUND

[0002] With the global popularity of data centers and telecommunication equipment, and the development of Internet of Things technology, the demand for high-capacity optical transmission technology in the field of communication is increasing. The core component of optical communication products is an optical module, which generally refers to an integrated module for optical-electrical signal conversion, and can convert optical signals into electrical signals or convert electrical signals into optical signals. Although the traditional technology increases the transmission capacity of optical signal transmission through wavelength division multiplexing (WDM) technology, it also increases the size and power consumption of the devices used for optical signal transmission. SUMMARY

[0003] The embodiments of the present application provide an optical module, a signal conversion method and a storage medium to solve the problem of excessive size and high power consumption of the traditional optical module due to the increase in transmission capacity.

[0004] To solve the above technical problems, the first technical solution adopted by the embodiments of the present application is to provide an optical module, comprising: an electrical network port for receiving external electrical signal data and outputting processed output electrical signal data to the outside; an optical engine platform for receiving the external electrical signal data, performing signal processing and conversion on the external electrical signal data to obtain converted output optical signal data; receiving external optical signal data, performing signal processing and conversion on the external optical signal data to obtain converted output optical signal data or second electrical signal data, and outputting the output optical signal data or the second electrical signal data; a micro control processor for controlling the electrical network port and the optical engine platform to regulate the transmission and parameters of electrical signals and optical signals in the optical module; a printed circuit board for carrying the electrical network port, the optical engine platform and the micro control processor.

[0005] Optionally, the light engine platform comprises: a first driver configured to receive the external electrical signal data and perform signal amplification processing on the external electrical signal data to obtain first electrical signal data after amplification processing; a second driver configured to receive the second electrical signal data and perform clock and data recovery processing on the second electrical signal data to obtain the output electrical signal data; a silicon light engine configured to receive the first optical signal data and convert the first optical signal data into the output optical signal data, receive the external optical signal data and convert the external optical signal data into third electrical signal data; a transimpedance amplifier configured to receive the third electrical signal data and perform amplification processing on the third electrical signal data to obtain fourth electrical signal data, output the fourth electrical signal data to the silicon light engine, or set the fourth electrical signal data as the second electrical signal data; and a sub-substrate configured to carry the first driver, the second driver, the transimpedance amplifier, and the silicon light engine.

[0006] Optionally, the silicon light engine comprises: a light receiving unit configured to receive the external optical signal data, convert the external optical signal data into the third electrical signal data, and output the third electrical signal data to the transimpedance amplifier; a light emitting unit configured to receive the first optical signal data or the fourth electrical signal data, convert the first optical signal data or the fourth electrical signal data into the output optical signal data; a directly modulated laser configured to receive the first electrical signal data, convert the first electrical signal into the first optical signal data, and output the first optical signal data; and an arrayed waveguide grating configured to receive the first optical signal data and convert the first optical signal data of a single optical signal into second optical signal data of a plurality of optical signals.

[0007] Optionally, the light receiving unit comprises: an optical splitter configured to convert the external optical signal data of a single optical signal into third optical signal data of a plurality of optical signals, and output the third optical signal data through a waveguide; and a photodetection chip configured to receive the third optical signal data through the waveguide, and convert the optical signal data into the third electrical signal data.

[0008] Optionally, the light emitting unit comprises: a laser chip configured to convert the received fourth electrical signal data into fourth optical signal data of a plurality of optical signals, and output the fourth optical signal data through a waveguide; and an optical combiner configured to convert the fourth optical signal data received through the waveguide, or the second optical signal data received through the waveguide, into the output optical signal data of a single optical signal.

[0009] To solve the above technical problems, the first technical solution adopted by the embodiments of the present application is to provide a signal conversion method based on the optical module, comprising: receiving external electrical signal data through the power grid port and sending the external electrical signal data to the first driver; obtaining a first signal parameter from the micro control processor and controlling the first driver to convert the external electrical signal into the first electrical signal data according to the first signal parameter; transmitting the first electrical signal data to the silicon optical engine through the gold wire in the printed circuit board and controlling the silicon optical engine to convert the first electrical signal data into the output optical signal data.

[0010] Optionally, the signal conversion method further comprises: receiving external optical signal data through the optical engine platform, converting the external optical signal data into the second electrical signal data, and sending the second electrical signal data to the second driver; obtaining a second signal parameter from the micro control processor and controlling the second driver to convert the second electrical signal data into the output electrical signal data according to the second signal parameter.

[0011] Optionally, the silicon optical engine further comprises a direct modulation laser and an arrayed waveguide grating, and the step of controlling the silicon optical engine to convert the first electrical signal data into the output optical signal data comprises: receiving the first electrical signal data through the direct modulation laser and converting the first electrical signal data into the first optical signal data according to a preset signal parameter; sending the first optical signal data to the arrayed waveguide grating through the waveguide and controlling the arrayed waveguide grating to convert the first optical signal data of a single optical signal into the second optical signal data of a multi-channel optical signal; and sending the second optical signal data to the optical combiner of the silicon optical engine and controlling the silicon optical engine to convert the second optical signal data into the output optical signal.

[0012] Optionally, the optical engine platform further comprises a transimpedance amplifier, and the step of converting the external optical signal data into the second electrical signal data comprises: receiving the external optical signal data through the silicon optical engine and controlling the optical splitter of the silicon optical engine to convert the external optical signal data of a single optical signal into the third optical signal data of a multi-channel optical signal; controlling the laser chip of the silicon optical engine to convert the third optical signal data into the third electrical signal data and sending the third electrical signal data to the transimpedance amplifier; and controlling the transimpedance amplifier to amplify the third electrical signal to obtain the fourth electrical signal data and setting the fourth electrical signal data as the second electrical signal data.

[0013] To solve the above technical problems, a third technical solution adopted by the embodiments of the present application is to provide a non-volatile computer readable storage medium storing computer executable instructions, when the computer executable instructions are executed by an electronic device, the electronic device executes the method as described above.

[0014] Different from the related art, the embodiments of the present application provide an optical module, a signal conversion method and a non-volatile computer readable storage medium, by means of flip welding process, the light detection chip and the laser chip are integrated into the silicon optical engine, the 2.5D packaging technology is used to further package the silicon optical engine to obtain the optical engine platform, and then the optical engine platform is integrated into the optical module, which not only can simultaneously realize converting the external electrical signal into the optical signal of the preset parameter, converting the external optical signal into the electrical signal or the optical signal of the preset parameter, but also reduces the volume and the power consumption of the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0016] Fig. 1 is a structural schematic diagram of an optical module in an embodiment of the present application;

[0017] Fig. 2 is a structural schematic diagram of an optical engine platform in an embodiment of the present application;

[0018] Fig. 3 is a structural schematic diagram of a silicon optical engine in an embodiment of the present application;

[0019] Fig. 4 is a flow chart of a signal conversion method in an embodiment of the present application. DETAILED DESCRIPTION

[0020] The technical solutions of the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0021] In the following, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings of the embodiments of the present application, so that those skilled in the art can better understand the solutions of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0022] Moreover, the terms "comprising", "containing", or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article, or apparatus that comprises a list of elements not only includes those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0023] In the description of the embodiments of the present application, the words "example" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design solution described as "example" or "for example" in the embodiments of the present application is not to be construed as being more preferred than another embodiment or design solution. The use of the words "example" or "for example" is intended to present clearly relative concepts in a clear manner.

[0024] Fig. 1 is a structural schematic diagram of an optical module 10 according to an embodiment of the present application. It is to be noted that the optical module 10 provided by the present application is not limited to the structure shown in Fig. 1 if there is substantially the same result. The optical module 10 comprises a power grid port 11, a micro-control processor 12, an optical engine platform 13, and a printed circuit board 14. The power grid port 11 is configured to receive external electrical signal data and output processed output electrical signal data to the outside; the optical engine platform 13 is configured to receive the first electrical signal data, perform signal processing and conversion on the first electrical signal data to obtain converted output optical signal data; receive external optical signal data, perform signal processing and conversion on the external optical signal data to obtain converted output optical signal data or second electrical signal data, and output the output optical signal data or the second electrical signal data; the micro-control processor 12 is configured to control the power grid port 11 and the optical engine platform 13 to regulate transmission and parameters of electrical signals and optical signals in the optical module 10; and the printed circuit board 14 is configured to carry the power grid port 11, the optical engine platform 13, and the micro-control processor 12.

[0025] The Ethernet port is a physical interface on network communication devices such as computers, servers, routers, network cards, and optical modules, used to connect to Ethernet. It usually uses an RJ45 interface to connect to a network cable for data transmission and communication. Ethernet is a widely used LAN technology that uses cables or wireless networks to connect computers, servers, routers, and other devices, allowing devices to transmit and share data. In Ethernet, devices are connected to Ethernet through the Ethernet port and communicate through the Ethernet protocol. It should be specially noted that the Ethernet port not only supports adaptive transmission speed (adapt to the speed of other devices in the network), but also works in full duplex or half duplex mode. In full duplex mode, the Ethernet port can send and receive data simultaneously, while in half duplex mode, the Ethernet port can only send or receive data.

[0026] FIG. 2 is a schematic diagram of the light engine platform 13 according to an embodiment of the present application. It should be noted that the light engine platform 13 provided by the present application is not limited to the structure shown in FIG. 2 if there is substantially the same result. The light module 13 includes a first driver 131, a silicon light engine 132, a second driver 133, a transimpedance amplifier 134, and a sub-substrate 135. The first driver 131 is configured to receive the external electrical signal data and perform signal amplification processing on the external electrical signal data to obtain first electrical signal data after amplification processing; the silicon light engine 132 is configured to receive the first optical signal data and convert the first optical signal data into output optical signal data; receive the external optical signal data and convert the external optical signal data into third electrical signal data; the second driver 133 is configured to receive the second electrical signal data and perform clock and data recovery processing on the second electrical signal data to obtain the output electrical signal data; the transimpedance amplifier 134 is configured to receive the third electrical signal data and perform amplification processing on the third electrical signal data to obtain fourth electrical signal data, and output the fourth electrical signal data to the silicon light engine 132, or set the fourth electrical signal data as the second electrical signal data; and the sub-substrate 135 is configured to carry the first driver 131, the second driver 133, the transimpedance amplifier 134, and the silicon light engine 132.

[0027] Further, the silicon light engine platform 132 includes a directly modulated laser 1323 and an arrayed waveguide grating 1324. The directly modulated laser 1323 is configured to receive the first electrical signal data, convert the first electrical signal data into first optical signal data, and output the first optical signal data; and the arrayed waveguide grating 1324 is configured to receive the first optical signal data and convert the first optical signal data of a single optical signal into second optical signal data of multiple optical signals.

[0028] Preferably, the second driver 14 can be a clock and data recovery (CDR), because the optical signal may be subject to various noise and interference during transmission, resulting in distortion or drift of the clock and data information, so it is necessary to use a clock and data recovery to recover and stabilize the signal. The clock and data recovery can recover the original signal by sampling and comparing the clock and data information in the optical signal, and keep it stable. The algorithm and technology used by the clock and data recovery can be optimized and adjusted according to different types of optical signals and transmission distances to improve the accuracy and stability of the recovery, ensuring the quality and reliability of the optical signal, so as to realize high-speed, long-distance optical communication transmission.

[0029] It should be noted that the optical engine platform 13 adopts 2.5D packaging technology. 2.5D packaging technology is a chip packaging technology used to manufacture high-performance integrated circuits (IC) and system packaging, which is a technology between traditional 2D packaging and 3D packaging. In 2.5D packaging technology, multiple chips (such as processors, memories, graphics processors, etc.) are assembled together to form an integrated system chip (SiP), and these chips are usually stacked together and connected through a silicon interposer. The silicon interposer is a high-density interposer that can provide high-speed, low-latency data transmission channels between multiple chips. Compared with traditional 2D packaging, 2.5D packaging technology has higher performance and smaller packaging size, which can provide higher bandwidth and lower latency, while also reducing signal transmission interference and power consumption. Compared with 3D packaging, 2.5D packaging technology is easier to implement, more cost-effective, and can use standard manufacturing processes and equipment.

[0030] Among them, the aforementioned optical engine platform 13 also provides high scalability for optical modules of different rates. Specifically, the silicon optical engine is replaced according to the needs of optical communication to realize optical modules with transmission rates of 100G, or 200G, or 400G, or 800G, or even higher rates. The prior art needs to change the existing optical module design, change various optical devices of the existing optical module, and spend a lot of manpower, material resources, and time cost, etc. to achieve the aforementioned functions.

[0031] Among them, the direct modulation laser (DML) 1323 is a semiconductor laser, which works by injecting current into semiconductor material to generate laser light. By changing the intensity and frequency of the injected current, the output intensity and frequency of the laser can be changed. Because the direct modulation laser does not need an external modulator, it not only has the advantages of simplicity, compactness and cost-effectiveness, but also can realize high-speed data transmission.

[0032] The transimpedance amplifier (TIA) 134 converts the weak current generated by the photodiode into a voltage signal that can be used by other circuits. The basic principle is to convert the current generated by the photodiode into a voltage signal proportional to it. When light shines on the photodiode, photons will excite electrons and generate current. The TIA converts the current into an output voltage signal.

[0033] The array waveguide grating (AWG) 1324 is composed of a series of parallel waveguide devices and gratings, which can realize efficient light wave guidance and separation. Each waveguide device represents a channel, and the grating is an optical element used for separating and combining signals. When multiple light signals of different wavelengths pass through the AWG, different wavelengths of light signals will interfere in the grating, so that each wavelength of light signal is separated to different output ports.

[0034] Figure 3 is a structural schematic diagram of the silicon optical engine 132 of the embodiment of the present application. It should be noted that the silicon optical engine 132 provided by the present application is not limited to the structure shown in Figure 3 if there is substantially the same result. The silicon optical engine 132 includes a light receiving unit 1321 and a light emitting unit 1322. The light receiving unit 1321 is used to receive the external optical signal data, convert the external optical signal data into the third electrical signal data, and output the third electrical signal data to the transimpedance amplifier 133; the light emitting unit 1322 is used to receive the first optical signal data or the fourth electrical signal data, and convert the first optical signal data or the fourth electrical signal data into the output optical signal data.

[0035] Further, as shown in Figure 3, the light receiving unit 1321 includes an optical splitter 13211 and an optical detection chip 13212. The optical splitter 13211 is used to convert the external optical signal data of a single optical signal into third optical signal data of multiple optical signals, and output the third optical signal data through a waveguide 13213; the optical detection chip 13212 is used to receive the third optical signal data through the waveguide, and convert the optical signal data into the third electrical signal data.

[0036] Further, as shown in FIG. 3, the light emitting unit includes a laser chip 13222 and a light combiner 13221. The laser chip 13222 is configured to convert the received fourth electrical signal data into fourth optical signal data of a plurality of light signals, and output the fourth optical signal data through a waveguide; and the light combiner 13221 is configured to convert the fourth optical signal data received through the waveguide or the second optical signal data received through the waveguide into the output optical signal data of a single light signal.

[0037] In the embodiment, the light detection chip 13212 and the laser chip 13222 are arranged on the sub-substrate by a flip-chip process. The contacts of the light detection chip 13212 and the laser chip 13222 are connected to the electronic traces in the sub-substrate.

[0038] The flip-chip process is a microelectronic chip packaging technology, mainly used for connecting and packaging chips and substrates. This technology usually uses high-precision automated equipment to perform the connection. First, the electrical connection between the flip-chip and the substrate is direct, which can achieve higher density and smaller pitch compared to traditional cable connection, thereby improving the integration and performance of the chip. Second, since the electrical connection between the flip-chip and the substrate is direct, the signal transmission path is shorter, thereby reducing signal transmission delay and loss and improving signal transmission speed and accuracy. Third, since the electrical connection between the flip-chip and the substrate is direct, the contact area of the connection is larger and the connection is more reliable, which is not easily affected by mechanical vibration and temperature changes, thereby improving the reliability and stability of the entire optical transceiver device. Fourth, since the electrical connection between the flip-chip and the substrate is direct, no additional cable connection is needed, thereby achieving a smaller chip packaging volume, which is suitable for various miniaturized devices and systems. In summary, the flip-chip coupling structure of the light receiving chip obtained by applying the flip-chip process has the advantages of high efficiency, high precision, high density, and low cost.

[0039] The optical module provided by the embodiment of the present application integrates the light detection chip and the laser chip into the silicon optical engine through the flip-chip process, further packages the silicon optical engine into an optical engine platform using a 2.5D packaging technology, and integrates the optical engine platform into the optical module. This not only can simultaneously convert external electrical signals into optical signals of preset parameters, convert external optical signals into electrical signals or optical signals of preset parameters, but also reduces the volume and power consumption of the optical module.

[0040] In another embodiment, based on the above-mentioned optical module 10, a signal conversion method is provided, as shown in FIG. 4, including:

[0041] S21, receiving external electrical signal data through the power grid interface and sending the external electrical signal data to the first driver.

[0042] S22, obtaining first signal parameters from the micro control processor and controlling the first driver to convert the external electrical signal into the first electrical signal data according to the first signal parameters.

[0043] S23, transmitting the first electrical signal data to the silicon light engine through the gold wire in the printed circuit board and controlling the silicon light engine to convert the first electrical signal data into the output optical signal data.

[0044] Specifically, the silicon light engine further comprises a direct modulation laser and an arrayed waveguide grating, and the step of controlling the silicon light engine to convert the first electrical signal data into the output optical signal data comprises the following steps: first, receiving the first electrical signal data through the direct modulation laser and converting the first electrical signal data into the first optical signal data according to preset signal parameters. Then, sending the first optical signal data to the arrayed waveguide grating through the waveguide and controlling the arrayed waveguide grating to convert the first optical signal data of a single optical signal into the second optical signal data of multiple optical signals. Finally, sending the second optical signal data to the optical combiner of the silicon light engine and controlling the silicon light engine to convert the second optical signal data into the output optical signal.

[0045] Through the steps between S21 to S23, the external electrical signal data received by the optical module 10 can be converted into the output optical signal data outputted externally.

[0046] Further, based on the optical module 10, the signal conversion method further comprises:

[0047] S24, receiving external optical signal data through the light engine platform, converting the external optical signal data into the second electrical signal data, and sending the second electrical signal data to the second driver.

[0048] Specifically, the light engine platform further comprises a transimpedance amplifier, and the step of converting the external optical signal data into the second electrical signal data comprises the following steps: first, receiving the external optical signal data through the silicon light engine and controlling the optical splitter of the silicon light engine to convert the external optical signal data of a single optical signal into the third optical signal data of multiple optical signals. Then, controlling the laser chip of the silicon light engine to convert the third optical signal data into the third electrical signal data and sending the third electrical signal data to the transimpedance amplifier. Finally, controlling the transimpedance amplifier to amplify the third electrical signal to obtain the fourth electrical signal data, and setting the fourth electrical signal data as the second electrical signal data.

[0049] S25, obtaining a second signal parameter from the micro-control processor, and controlling the second driver to convert the second electrical signal data into the output electrical signal data according to the second signal parameter.

[0050] Through the steps between S24 and S25, the external optical signal data received by the optical module 10 can be converted into the output electrical signal data.

[0051] Further, based on the optical module 10, after the step of converting the external optical signal data received by the optical engine platform into the second electrical signal data, the signal conversion method further comprises:

[0052] S26, controlling the optical engine platform to convert the second electrical signal data into the output optical signal data.

[0053] Specifically, the silicon optical engine further comprises a light emitting unit, after the step of controlling the transimpedance amplifier to amplify the third electrical signal to obtain the fourth electrical signal data, the fourth electrical signal data is sent to the light emitting unit, and the light emitting unit is controlled to convert the fourth electrical signal data into the output optical signal data.

[0054] More specifically, the light emitting unit comprises a laser chip and an optical combiner, and the step of controlling the light emitting unit to convert the fourth electrical signal data into the output optical signal data comprises: first, converting the received fourth electrical signal data into the fourth optical signal data of multiple optical signals through the laser chip, and outputting the fourth optical signal data through a waveguide. Then, the optical combiner is controlled to receive the fourth optical signal data through a waveguide, and convert the fourth optical signal data into the output optical signal data of single optical signal.

[0055] Through the step S26, the external optical signal data received by the optical module 10 can be converted into the output optical signal data.

[0056] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0057] The meaning of "first" and "second" in the above modules / units is only to distinguish different modules / units, and is not used to limit which module / unit has higher priority or other limiting meanings. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or modules does not have to be limited to the clearly listed steps or modules, but can include other steps or modules not clearly listed or inherent to these processes, methods, products or devices. The division of modules in this application is only a logical division, and other division methods can be used in actual application.

[0058] The embodiment of the present application provides a non-volatile computer readable storage medium, the non-volatile computer readable storage medium stores computer executable instructions, the computer executable instructions are executed by one or more processors, for example, a microcontroller processor 12 in FIG. 1, so that the above one or more processors can execute the cloud desktop system power-off protection method in any method embodiment.

[0059] The embodiment of the present application provides a computer program product, the computer program product comprises a computer program stored on a non-volatile computer readable storage medium, the computer program comprises program instructions, when the program instructions are executed by the electronic device, the electronic device can execute the cloud desktop system power-off protection method in any method embodiment.

[0060] The device embodiments described above are only schematic, wherein the units illustrated as separate components can or can not be physically separate, and the components illustrated as units can or can not be physical units, that is, they can be located in one place, or distributed on multiple network units. Part or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0061] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be realized by means of software plus a general hardware platform, and of course, can also be realized by hardware. Those skilled in the art can understand that all or part of the processes in the above embodiment methods can be completed by a computer program instructing related hardware, and the program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above embodiment methods. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM) or a random access memory (RAM), etc.

[0062] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, but not to limit them; under the idea of the present application, the technical features in the above examples or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for simplicity; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include: The power grid port is used to receive external electrical signal data and output processed output electrical signal data to the outside; The optical engine platform is configured to receive the external electrical signal data, perform signal processing and conversion on the external electrical signal data, and obtain converted output optical signal data; receive external optical signal data, perform signal processing and conversion on the external optical signal data, and obtain converted output optical signal data or second electrical signal data, and output the output optical signal data or the second electrical signal data; A microcontroller, configured to control the power grid port and the optical engine platform, and regulate the transmission and parameters of the electrical and optical signals in the optical module; A printed circuit board is used to carry the power grid port, the optical engine platform and the microcontroller processor.

2. The optical module according to claim 1, wherein The optical engine platform includes: a first driver, configured to receive the external electrical signal data and perform signal amplification processing on the external electrical signal data to obtain amplified first electrical signal data; a second driver, configured to receive the second electrical signal data and perform clock and data recovery processing on the second electrical signal data to obtain the output electrical signal data; A silicon photonic engine, configured to receive the first optical signal data and convert the first optical signal data into the output optical signal data; receive the external optical signal data and convert the external optical signal data into a third electrical signal data; a transimpedance amplifier, configured to receive the third electrical signal data, amplify the third electrical signal data to obtain fourth electrical signal data, output the fourth electrical signal data to the silicon photonic engine, or set the fourth electrical signal data to the second electrical signal data; A sub-base is used to carry the first driver, the second driver, the transimpedance amplifier and the silicon photonic engine.

3. The optical module according to claim 2, wherein: The silicon photonic engine comprises: an optical receiving unit, configured to receive the external optical signal data, convert the external optical signal data into the third electrical signal data, and output the third electrical signal data to the transimpedance amplifier; an optical transmitting unit, configured to receive the first optical signal data or the fourth electrical signal data, and convert the first optical signal data or the fourth electrical signal data into the output optical signal data; a directly modulated laser, configured to receive the first electrical signal data, convert the first electrical signal into first optical signal data, and output the first optical signal data; The arrayed waveguide grating is used to receive the first optical signal data and convert the first optical signal data of a single optical signal into second optical signal data of multiple optical signals.

4. The optical module according to claim 3, wherein: The light receiving unit includes: an optical splitter, configured to convert the external optical signal data of a single optical signal into third optical signal data of multiple optical signals, and output the third optical signal data through a waveguide; The optical detection chip is configured to receive the third optical signal data through a waveguide and convert the optical signal data into the third electrical signal data.

5. The optical module according to claim 3, wherein: The light emitting unit includes: a laser chip, configured to convert the received fourth electrical signal data into fourth optical signal data of a multi-path optical signal, and output the fourth optical signal data through a waveguide; The optical combiner is configured to convert the fourth optical signal data received through the waveguide or the second optical signal data received through the waveguide into the output optical signal data of a single optical signal.

6. A signal conversion method based on the optical module according to any one of claims 1 to 5, characterized in that: include: receiving external electrical signal data through the power grid port, and sending the external electrical signal data to the first driver; Acquire a first signal parameter from the microcontroller, and control the first driver to convert the external electrical signal into the first electrical signal data according to the first signal parameter; The first electrical signal data is transmitted to the silicon optical engine through the gold wire in the printed circuit board, and the silicon optical engine is controlled to convert the first electrical signal data into the output optical signal data.

7. The signal conversion method according to claim 6, characterized in that: The method further comprises: receiving external optical signal data through the optical engine platform, converting the external optical signal data into the second electrical signal data, and sending the second electrical signal data to the second driver; A second signal parameter is obtained from the microcontroller, and the second driver is controlled to convert the second electrical signal data into the output electrical signal data according to the second signal parameter.

8. The signal conversion method according to claim 6, wherein: The silicon photonic engine further includes a directly modulated laser and an arrayed waveguide grating, and the step of controlling the silicon photonic engine to convert the first electrical signal data into the output optical signal data includes: receiving the first electrical signal data through the directly modulated laser, and converting the first electrical signal data into the first optical signal data according to preset signal parameters; Sending the first optical signal data to the arrayed waveguide grating through a waveguide, and controlling the arrayed waveguide grating to convert the first optical signal data of a single optical signal into the second optical signal data of multiple optical signals; The second optical signal data is sent to the optical combiner of the silicon optical engine, and the silicon optical engine is controlled to convert the second optical signal into the output optical signal.

9. The signal conversion method according to claim 8, characterized in that: The optical engine platform further includes a transimpedance amplifier, and the step of converting the external optical signal data into the second electrical signal data includes: receiving the external optical signal data through the silicon optical engine, and controlling the optical splitter of the silicon optical engine to convert the external optical signal data of a single optical signal into the third optical signal data of a multi-channel optical signal; Controlling the laser chip of the silicon photonic engine to convert the third optical signal data into the third electrical signal data, and sending the third electrical signal data to the transimpedance amplifier; The transimpedance amplifier is controlled to amplify the third electrical signal to obtain fourth electrical signal data, and the fourth electrical signal data is set as the second electrical signal data.

10. A non-volatile computer-readable storage medium, characterized in that: The non-volatile computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are executed by an electronic device, the electronic device executes the method according to any one of claims 6 to 9.

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