Thermal management device and energy storage apparatus

Abstract

The present application provides a thermal management device and an energy storage apparatus. The thermal management device comprises a cabinet body and a heat exchange assembly, the heat exchange assembly being contained in the cabinet body and used for exchanging heat with a heat exchange medium. The heat exchange assembly comprises a condenser and a heat exchanger which are connected to each other. The condenser is arranged along a side wall of the cabinet body and forms an enclosure space at the side facing away from the side wall, the heat exchanger being arranged in the enclosure space.

Description

Heat management device and energy storage device

[0001] Cross-reference to Related Applications

[0002] This application claims priority to Chinese Patent Application No. 202420705292.8, filed on April 8, 2024, entitled “Heat management device and energy storage device,” the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of batteries, and in particular relates to a heat management device and an energy storage device. BACKGROUND

[0004] With the popularization and application of new energy such as solar energy and wind energy, energy storage technology has also developed. Batteries gradually become the mainstream product of energy storage because of their high energy density, long service life, high rated voltage, high power bearing capacity, low self-discharge rate, light weight, green environmental protection, and no water consumption in production, etc.

[0005] In order to ensure the use performance and reliability of the battery, the heat management device needs to be configured to keep the working temperature of the battery within a reasonable range. However, the current heat management device has a complex structure and low space utilization, and cannot balance high heat management efficiency and small size, which seriously affects the economic benefit of the energy storage device. Therefore, how to improve the heat management efficiency of the heat management device while considering the small size of the heat management device is a problem to be solved in the battery technology.

[0006] SUMMARY

[0007] In view of the above problems, the present application provides a heat management device and an energy storage device, which can improve the heat management efficiency of the heat management device while considering the small size of the heat management device.

[0008] In a first aspect, the embodiments of the present application provide a heat management device, which comprises a cabinet and a heat exchange assembly. The heat exchange assembly is accommodated in the cabinet and is used for heat exchange with a heat exchange medium. The heat exchange assembly comprises a condenser and a heat exchanger connected with each other. The condenser is arranged along the side wall of the cabinet and forms a surrounding space on the side away from the side wall. The heat exchanger is arranged in the surrounding space.

[0009] Thus, the condenser in the embodiment of the present application is arranged along the side wall of the cabinet, when the heat management efficiency requirement of the heat management device increases, the condenser can be expanded along the side wall of the cabinet to increase the structural size, and the heat exchanger is arranged in the surrounding space formed on the side of the condenser away from the side wall, so that the heat exchanger does not block the expansion of the condenser along the side wall. Thus, the cooling efficiency of the condenser can be improved without changing the volume of the heat management device, and the heat management efficiency of the heat management device can be improved while the volume of the heat management device is miniaturized.

[0010] In addition, the heat exchanger is arranged in the surrounding space formed on the side of the condenser away from the side wall, when the heat exchanger and the condenser need to be maintained, only a maintenance opening needs to be formed on the side wall of the cabinet on the side of the heat exchanger away from the condenser, so that the maintenance work can be performed, without the need to form maintenance openings on multiple side walls of the cabinet, thereby effectively improving the maintenance convenience of the heat management device.

[0011] In some embodiments of the first aspect, the side wall includes a first wall and two second walls, the two second walls are oppositely arranged along a first direction, and the first wall connects the two second walls. The condenser includes a first part and at least one second part connected with each other, the first part is located between the heat exchanger and the first wall, and the second part is located between the heat exchanger and at least one of the two second walls.

[0012] The above technical solution can further increase the structural size of the condenser by arranging the condenser as a segmented first part and a second part, and can differentially design the first part and the second part according to the actual application environment, thereby improving the design flexibility of the heat management device.

[0013] In some embodiments of the first aspect, the side wall further includes a third wall, the third wall is oppositely arranged with the first wall along a second direction, the third wall connects the two second walls, and the first direction intersects with the second direction. The heat management device further includes a fan, and the fan is arranged on the third wall.

[0014] The above technical solution releases the heat in the heat management device to the external surrounding environment by arranging the fan, thereby reducing the temperature in the heat management device and improving the heat management efficiency of the heat management device. In addition, most of the heat released to the outside of the condenser is concentrated in the surrounding space formed on the side of the condenser away from the side wall, and the fan is arranged on the third wall, so that the fan is opposite to the surrounding space formed on the side of the condenser away from the side wall. This layout space can optimize the internal air flow and heat transfer, thereby improving the heat release efficiency in the heat management device.

[0015] In some embodiments of the first aspect, the third wall is movably arranged relative to the second wall.

[0016] The technical solution makes the heat management device capable of adjusting the layout configuration inside the cabinet body or maintaining the heat exchange assembly according to heat management requirements or maintenance requirements without disassembling the entire heat management device, greatly simplifies the adjustment and maintenance process, and thus effectively improves the use convenience of the heat management device.

[0017] In some embodiments of the first aspect, the number of fans is multiple, and the multiple fans are arranged at intervals along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0018] By setting the number of fans to multiple, the heat release efficiency inside the heat management device can be further improved.

[0019] In some embodiments of the first aspect, the heat management device further comprises a heat dissipation assembly, the heat dissipation assembly being configured to dissipate heat from the heat exchange medium, and the heat dissipation assembly being arranged between the fan and the condenser.

[0020] The technical solution introduces the heat dissipation assembly, which can flexibly use the heat dissipation assembly and / or the heat exchange assembly to cool the heat exchange medium according to different environmental requirements, effectively improving the use flexibility of the heat management device.

[0021] In some embodiments of the first aspect, the heat management device further comprises a distribution component, the heat exchange assembly and the heat dissipation assembly being connected in parallel to the distribution component, and the distribution component being configured to receive the heat exchange medium after heat management of the heat management object and output the heat exchange medium to the heat exchange assembly and / or the heat dissipation assembly.

[0022] The technical solution sets the distribution component, which can accurately regulate the flow size of the heat exchange medium distributed to the heat exchange assembly or the heat dissipation assembly, thereby effectively improving the use accuracy of the heat management device.

[0023] In some embodiments of the first aspect, the first wall, the two second walls and the third wall together enclose a first accommodation space. The heat management device further comprises an electrical assembly, the electrical assembly and the heat exchange assembly being located in the first accommodation space, and the electrical assembly being arranged in the surrounding space.

[0024] In the technical solution, the structure size of the condenser can be further expanded, thereby further improving the cooling efficiency of the condenser without changing the volume of the heat management device, thereby further improving the heat management efficiency of the heat management device. In addition, the electrical assembly is arranged in the surrounding space formed on the side of the condenser away from the side wall, and only a maintenance opening needs to be formed on the side wall of the cabinet body away from the condenser, so that the heat exchanger, the condenser and the electrical assembly located inside the cabinet body can be maintained, without the need to form maintenance openings on multiple side walls of the cabinet body, thereby effectively improving the maintenance convenience of the heat management device.

[0025] In some embodiments of the first aspect, the cabinet further comprises a second accommodation space, the second accommodation space is arranged along a third direction with the first accommodation space, and the first direction, the second direction and the third direction are perpendicular to each other. The heat management device further comprises a pipeline assembly, the pipeline assembly is arranged in the second accommodation space, and the pipeline assembly is used to connect the heat exchange assembly and the heat management object.

[0026] The second accommodation space is arranged on the cabinet to accommodate the pipeline assembly with complex structure, which is beneficial to simplify the structural complexity and arrangement difficulty of the heat management device, thereby improving the maintenance convenience of the heat management device.

[0027] In some embodiments of the first aspect, the heat exchange assembly further comprises a compressor, the compressor is connected between the heat exchanger and the condenser and located upstream of the condenser, and the compressor is arranged in the surrounding space.

[0028] The above technical solution introduces the compressor, which can effectively improve the cooling efficiency of the condenser, thereby further improving the heat management efficiency of the heat management device. In addition, the compressor is arranged in the surrounding space formed on the side of the condenser away from the side wall, and only a maintenance opening needs to be arranged on the side wall of the cabinet away from the condenser, so that the heat exchanger, the condenser and the compressor and other structures inside the cabinet can be maintained, without the need to arrange maintenance openings on multiple side walls of the cabinet, thereby effectively improving the maintenance convenience of the heat management device.

[0029] In some embodiments of the first aspect, the heat exchange assembly further comprises a liquid storage component, the liquid storage component is connected between the condenser and the heat exchanger and located downstream of the condenser, and the liquid storage component is arranged in the surrounding space.

[0030] The above technical solution introduces the liquid storage component, which can store cooling working medium, thereby improving the storage amount of cooling working medium in the entire heat exchange assembly, and further improving the cooling efficiency of the condenser. In addition, the liquid storage component is arranged in the surrounding space formed on the side of the condenser away from the side wall, and only a maintenance opening needs to be arranged on the side wall of the cabinet away from the condenser, so that the heat exchanger, the condenser and the liquid storage component and other structures inside the cabinet can be maintained, without the need to arrange maintenance openings on multiple side walls of the cabinet, thereby effectively improving the maintenance convenience of the heat management device.

[0031] In some embodiments of the first aspect, the heat management device further comprises a heating assembly, the heating assembly is used to heat the heat exchange medium.

[0032] The above technical solution introduces the heating assembly, which can heat or cool the heat exchange medium according to different environmental requirements, thereby effectively improving the applicability of the heat management device.

[0033] In a second aspect, the present application provides an energy storage device, comprising a battery and the heat management device according to any one of the embodiments of the first aspect, wherein the battery comprises a heat exchange channel, and the heat management device is in communication with the heat exchange channel.

[0034] The above description is merely a summary of the technical solutions of the present application. In order to enable a more clear understanding of the technical means of the present application, the embodiments can be implemented according to the contents of the description, and in order to enable the above and other purposes, characteristics and advantages of the present application to be more apparent and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0035] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The accompanying drawings are included to provide a better understanding of the preferred embodiments, and are not to be considered as limiting of the present application. Moreover, in the drawings, like reference numerals refer to similar components throughout the several views. In the drawings:

[0036] Fig. 1 is a schematic diagram of a loop connection of an energy storage device according to some embodiments of the present application;

[0037] Fig. 2 is a schematic diagram of a side view structural block diagram of a heat management device according to some embodiments of the present application;

[0038] Fig. 3 is a schematic diagram of a front view structural block diagram of a heat management device according to some embodiments of the present application;

[0039] Fig. 4 is a schematic diagram of a top view structural block diagram of a heat management device according to some embodiments of the present application;

[0040] Fig. 5 is a schematic diagram of a top view structural block diagram of another heat management device according to some embodiments of the present application;

[0041] Fig. 6 is a schematic diagram of a top view structural block diagram of the heat management device shown in Fig. 5, with the third wall in an open state.

[0042] Reference signs in the detailed description of the embodiments are as follows:

[0043] 100, a piece to be heat managed;

[0044] 10, a cabinet body; 11, a first wall; 12, a second wall; 13, a third wall; 14, a first accommodating space; 15, a second accommodating space; 20, a heat exchange assembly; 21, a condenser; 211, a first part; 212, a second part; 22, a heat exchanger; 23, a compressor; 24, a liquid storage component; 25, an expansion valve; 30, a fan; 40, a heat dissipation assembly; 50, a distribution component; 60, an electrical assembly; 70, a pipeline assembly; 80, a heating assembly;

[0045] X, a first direction; Y, a second direction; Z, a third direction. DETAILED DESCRIPTION

[0046] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0047] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion. The terms "first", "second" and the like in the specification and claims of the present application and the above description of drawings are used to distinguish different objects, and are not intended to describe a particular order or primary and secondary relationship.

[0048] In the present application, the phrase "embodiments" means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily all refer to the same embodiments, nor are they necessarily mutually exclusive or alternative embodiments to each other.

[0049] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection", "attach" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium; can be internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] In the present application, the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three kinds of relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0051] In the embodiments of the present application, the same reference signs represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, and the overall thickness, length, width and other dimensions of the integrated device are only exemplary and should not constitute any limitation on the present application.

[0052] The "multiple" appearing in the present application refers to two or more (including two).

[0053] The term "parallel" in the present application not only includes the case of absolute parallel, but also includes the case of approximate parallel as generally recognized in engineering; at the same time, "perpendicular" also not only includes the case of absolute perpendicular, but also includes the case of approximate perpendicular as generally recognized in engineering.

[0054] With the popularization and application of new energy such as solar energy and wind energy, energy storage technology has also developed, and batteries gradually become the mainstream product of energy storage because of the advantages of high energy density, long service life, high rated voltage, high power bearing capacity, low self-discharge rate, light weight, green environmental protection, and basically no water consumption in production.

[0055] In order to ensure the use performance and reliability of the battery, the energy storage equipment needs to be configured with a heat management device to keep the working temperature of the battery within a reasonable range. However, the current heat management device has a complex structure layout and low space utilization, and cannot balance high heat management efficiency and small size, which seriously affects the economic benefit of the energy storage equipment.

[0056] Based on the above considerations, the embodiments of the present application provide a heat management device, which comprises a cabinet body and a heat exchange assembly. The heat exchange assembly is accommodated in the cabinet body and is used for heat exchange with a heat exchange medium. The heat exchange assembly comprises a condenser and a heat exchanger connected with each other. The condenser is arranged along the side wall of the cabinet body and forms an enclosed space on the side away from the side wall. The heat exchanger is arranged in the enclosed space.

[0057] The main function of the condenser is to cool and condense the gaseous cooling medium into liquid state, and release heat to the surrounding environment or a specific medium through this process. It can be understood that the larger the structure size of the condenser, the better the condensation efficiency, thereby improving the heat management efficiency of the heat management device. At the same time, the larger the structure size of the condenser, the more likely to cause the increase of the volume of the heat management device.

[0058] Thus, the condenser in the embodiment of the present application is arranged along the side wall of the cabinet, when the heat management efficiency requirement of the heat management device increases, the condenser can be expanded along the side wall of the cabinet to increase the structural size, and the heat exchanger is arranged in the surrounding space formed on the side of the condenser away from the side wall, so that the heat exchanger does not block the expansion of the condenser along the side wall. Thus, the cooling efficiency of the condenser can be improved without changing the volume of the heat management device, and the heat management efficiency of the heat management device can be improved while the volume of the heat management device is miniaturized.

[0059] In addition, the heat exchanger is arranged in the surrounding space formed on the side of the condenser away from the side wall, when the heat exchanger and the condenser need to be maintained, only a maintenance opening needs to be formed on the side wall of the cabinet on the side of the heat exchanger away from the condenser, so that the maintenance work can be performed, and the maintenance opening does not need to be formed on multiple side walls of the cabinet, so that the maintenance convenience of the heat management device can be effectively improved.

[0060] FIG. 1 is a schematic diagram of a loop connection of an energy storage device according to some embodiments of the present application, FIG. 2 is a schematic diagram of a side view structural block diagram of a heat management device according to some embodiments of the present application, FIG. 3 is a schematic diagram of a front view structural block diagram of a heat management device according to some embodiments of the present application, FIG. 4 is a schematic diagram of a top view structural block diagram of a heat management device according to some embodiments of the present application, FIG. 5 is a schematic diagram of a top view structural block diagram of another heat management device according to some embodiments of the present application, and FIG. 6 is a schematic diagram of a top view structural block diagram of the heat management device shown in FIG. 5 when a third wall is in an open state.

[0061] Referring to FIGS. 1 to 6, the present application provides a heat management device, which includes a cabinet 10 and a heat exchange assembly 20. The heat exchange assembly 20 is accommodated in the cabinet 10 and is used to exchange heat with a heat exchange medium. The heat exchange assembly 20 includes a condenser 21 and a heat exchanger 22 connected with each other. The condenser 21 is arranged along the side wall of the cabinet 10 and forms a surrounding space on the side away from the side wall. The heat exchanger 22 is arranged in the surrounding space.

[0062] The heat management in the embodiment of the present application refers to cooling or heating a to-be-heated management member 100 by a heat exchange medium. The heat exchange medium can be but is not limited to a liquid or a gas, and the to-be-heated management member 100 can be but is not limited to a battery or a capacitor. In order to facilitate the description of the embodiment of the present application, the heat exchange medium is taken as a liquid and the to-be-heated management member 100 is taken as a battery in the following description.

[0063] The cabinet 10 is a component for forming an internal environment of a thermal management device. The formed internal environment can be used to accommodate the heat exchange assembly 20 and other components. Optionally, the cabinet 10 can be made of, but not limited to, metal or non-metal materials. For example, the metal material can be copper, aluminum, stainless steel, etc.; the non-metal material can be polyethylene, polypropylene, or polyvinyl chloride, etc.

[0064] The heat exchange assembly 20 is used for heat exchange with the heat exchange medium after the battery is thermally managed. For example, the low-temperature heat exchange medium enters the battery to cool the battery, the heat of the battery is taken out by the heat exchange medium, the temperature of the heat exchange medium flowing out of the battery is increased, forming a high-temperature heat exchange medium, and the high-temperature heat exchange medium enters the heat exchange assembly 20 for heat exchange. The cooling medium, such as refrigerant, is arranged in the heat exchange assembly 20, and the heat exchange medium and the cooling medium are heat exchanged in the heat exchanger 22 of the heat exchange assembly 20, the temperature of the heat exchange medium is reduced, forming a low-temperature heat exchange medium, and the low-temperature heat exchange medium flows out of the heat exchange assembly 20 and enters the battery again to cool the battery, and the cycle is repeated. Before the heat exchange between the cooling medium and the heat exchange medium, the cooling medium is a low-temperature liquid working medium, and after the heat exchange between the heat exchange medium and the cooling medium in the heat exchanger 22 of the heat exchange assembly 20, the low-temperature liquid working medium absorbs heat and evaporates to form a high-temperature gaseous working medium, which enters the condenser 21 to be condensed and cooled. The heat in the high-temperature gaseous working medium is released to the outside of the condenser 21 to form a low-temperature liquid working medium, which enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and the cycle is repeated.

[0065] The heat exchanger 22 can be, but is not limited to, a plate heat exchanger, a tube heat exchanger, or a micro-channel heat exchanger, etc. Optionally, the heat exchanger 22 is a plate heat exchanger. The plate heat exchanger is a kind of heat exchanger formed by pressing thin metal plates into heat exchange plates with a certain corrugated shape, and then stacking and fastening with clamps and bolts. Thin rectangular channels are formed between various plates, and heat exchange is carried out through half plates. The working fluid flows through the narrow and winding channels formed between the two plates. The cold and hot fluids pass through the flow channels in turn, and a partition plate separates the fluids and exchanges heat through the plate.

[0066] The main function of the condenser 21 is to cool and condense the gaseous cooling medium into a liquid state, and release heat to the surrounding environment or a specific medium through this process. The condenser 21 can be, but is not limited to, an air condenser or a water condenser, etc. Optionally, the condenser 21 is an air condenser, which uses air as a medium to reduce the temperature of the cooling medium through natural convection or forced convection (for example, through a fan).

[0067] It can be understood that the larger the structure size of the condenser 21 is, the better the condensing efficiency is, so as to improve the heat management efficiency of the heat management device. Meanwhile, the larger the structure size of the condenser 21 is, the more likely to cause the increase of the volume of the heat management device.

[0068] In this way, the condenser 21 in the embodiment of the present application is arranged along the side wall of the cabinet 10, when the heat management efficiency requirement of the heat management device increases, the condenser 21 can be expanded along the side wall of the cabinet 10 to increase the structure size, and the heat exchanger 22 is arranged in the surrounding space formed by the condenser 21 on the side away from the side wall, so that the heat exchanger 22 does not block the expansion of the condenser 21 along the side wall. Thus, the cooling efficiency of the condenser 21 can be improved without changing the volume of the heat management device, so that the heat management efficiency of the heat management device can be improved while the miniaturization of the heat management device is taken into account.

[0069] In addition, the heat exchanger 22 is arranged in the surrounding space formed by the condenser 21 on the side away from the side wall, when the heat exchanger 22 and the condenser 21 need to be maintained, only a maintenance opening needs to be arranged on the side wall of the cabinet 10 on the side of the heat exchanger 22 away from the condenser 21, so that the maintenance work can be implemented, without the need to arrange maintenance openings on multiple side walls of the cabinet 10, so that the maintenance convenience of the heat management device can be effectively improved.

[0070] In some embodiments, the side wall includes a first wall 11 and two second walls 12, the two second walls 12 are arranged opposite to each other along the first direction X, and the first wall 11 connects the two second walls 12. The condenser 21 includes a first part 211 and at least one second part 212 connected to each other, the first part 211 is located between the heat exchanger 22 and the first wall 11, and the second part 212 is located between the heat exchanger 22 and at least one of the two second walls 12.

[0071] For example, the second wall 12 can be detachably connected to the first wall 11, or can be integrally arranged on the first wall 11. The second wall 12 can be directly connected to the first wall 11, or can be limited on the first wall 11 by other components. For example, the connection mode of the second wall 12 and the first wall 11 can be, but is not limited to, bolt connection, welding, riveting or clamping.

[0072] Optionally, the condenser 21 can include one second part 212, or can include two second parts 212.

[0073] For example, in the case where the condenser 21 includes one second part 212, the second part 212 is arranged along one of the two second walls 12 and located between the heat exchanger 22 and the second wall 12, and the second part 212 is connected to one side of the first part 211 along the first direction X, so that the entire condenser 21 forms a structure similar to "L".

[0074] As another example, in the case that the condenser 21 comprises two second portions 212, the two second portions 212 are respectively arranged along the two second walls 12, one of the two second portions 212 is located between the heat exchanger 22 and one of the two second walls 12, and the other of the two second portions 212 is located between the heat exchanger 22 and the other of the two second walls 12, and the two second portions 212 are respectively connected to the two sides of the first portion 211 along the first direction X, so that the entire condenser 21 forms a structure similar to a "U" shape.

[0075] Optionally, the specific structure of the first portion 211 and the second portion 212 can also be designed differently according to the needs of the actual application environment. For example, the second portion 212 can be designed as multiple miniaturized units, which have higher layout flexibility to further optimize the space utilization of the condenser 21.

[0076] The second portion 212 can be detachably connected to the first portion 211, or can be integrally provided on the first portion 211. The second portion 212 can be directly connected to the first portion 211, or can be limited on the first portion 211 by other components. As an example, the connection mode of the second portion 212 and the first portion 211 can be, but is not limited to, bolt connection, welding, riveting or clamping, etc.

[0077] Optionally, the connection mode of the first portion 211 and the second portion 212 can also be adjusted according to actual needs, for example, using detachable connection or flexible interface to facilitate maintenance and upgrading.

[0078] The above technical solutions can further improve the structural size of the condenser 21 by arranging the condenser 21 as a segmented first portion 211 and a second portion 212, and can design the first portion 211 and the second portion 212 differently according to the needs of the actual application environment, which is beneficial to improve the design flexibility of the heat management device.

[0079] In some embodiments, the side wall further comprises a third wall 13, the third wall 13 is arranged opposite to the first wall 11 along a second direction Y, the third wall 13 connects the two second walls 12, and the first direction X intersects the second direction Y. The heat management device further comprises a fan 30, and the fan 30 is arranged on the third wall 13.

[0080] Exemplarily, the second wall 12 can be detachably connected to the third wall 13, or can be integrally provided on the third wall 13. The second wall 12 can be directly connected to the third wall 13, or can be limited on the third wall 13 by other components. As an example, the connection mode of the second wall 12 and the third wall 13 can be, but is not limited to, bolt connection, welding, riveting or clamping, etc.

[0081] The fan 30 is configured to form forced convection to release heat inside the heat management device to the external environment. Exemplarily, after the heat exchange between the heat exchange medium and the cooling working medium in the heat exchanger 22 of the heat exchange assembly 20, the low-temperature liquid working medium absorbs heat and evaporates to form high-temperature gaseous working medium, which enters the condenser 21 to be condensed and cooled, and the heat in the high-temperature gaseous working medium is released to the outside of the condenser 21 to form low-temperature liquid working medium. The fan 30 releases the heat to the surrounding environment outside the heat management device.

[0082] It can be understood that the heat released to the outside of the condenser 21 will cause the temperature inside the heat management device to rise, and the higher the temperature inside the heat management device, the lower the overall heat exchange efficiency of the heat exchange assembly 20, thereby reducing the heat management efficiency of the heat management device.

[0083] Therefore, the above technical solution releases the heat inside the heat management device to the external environment by setting the fan 30, reduces the temperature inside the heat management device, and thereby improves the heat management efficiency of the heat management device. In addition, the heat released to the outside of the condenser 21 is mostly concentrated in the surrounding space formed on the side of the condenser 21 away from the side wall, and the fan 30 is arranged on the third wall 13, so that the fan 30 is opposite to the surrounding space formed on the side of the condenser 21 away from the side wall. This layout can optimize the internal air flow and heat transfer, thereby improving the heat release efficiency inside the heat management device.

[0084] In some embodiments, the third wall 13 is movably arranged relative to the second wall 12.

[0085] Exemplarily, the third wall 13 is movably arranged relative to the second wall 12, which means that the third wall 13 can move or adjust relative to the fixed second wall 12. The third wall 13 includes an open state and a closed state. When the third wall 13 is in the open state, the heat exchange assembly 20 and other structures inside the cabinet 10 can be exposed to the external environment. When the third wall 13 is in the closed state, the heat exchange assembly 20 and other structures inside the cabinet 10 can be closed.

[0086] This design can provide additional flexibility for the heat management device, so that the layout configuration inside the cabinet 10 can be adjusted or the heat exchange assembly 20 can be maintained without disassembling the entire heat management device according to the heat management requirements or maintenance needs.

[0087] Optionally, the specific activity mechanism of the third wall 13 can be, but is not limited to, sliding, rotating or folding, etc., which can be selected according to different application scenarios and specific needs. Among them, the sliding design is easy to operate and occupies small space, the rotating design can provide more flexible adjustment angle, and the folding design can maximize space saving when needed.

[0088] The above technical solution enables the heat management device to adjust the layout configuration inside the cabinet 10 or maintain the heat exchange assembly 20 according to the heat management needs or maintenance needs without disassembling the entire heat management device, greatly simplifying the adjustment and maintenance process, thereby effectively improving the use convenience of the heat management device.

[0089] In some embodiments, the number of fans 30 is multiple, and the multiple fans 30 are arranged at intervals along the third direction Z, and the first direction X, the second direction Y and the third direction Z are orthogonal to each other.

[0090] Exemplarily, the number of fans 30 can be one, two, three or more, which can be selected according to the actual application environment. Optionally, the number of fans 30 is three.

[0091] By setting the number of fans 30 to multiple, the heat release efficiency inside the heat management device can be further improved.

[0092] In some embodiments, the outlet area of the fan 30 is between 700cm 2 -2500cm 2 .

[0093] Exemplarily, the outlet area of the fan 30 can be 700cm 2 , 800cm 2 , 900cm 2 , 1000cm 2 , 1200cm 2 , 1400cm 2 , 1600cm 2 , 1800cm 2 , 2000cm 2 , 2100cm 2 , 2200cm 2 , 2300cm 2 , 2400cm 2 , 2500cm 2 , etc.

[0094] It can be understood that the smaller the outlet area of the fan 30 is, the greater the rotating speed required to achieve the air volume requirement is, the higher the overall noise is, and the lower the cost of the fan 30 with the smaller outlet area is; the greater the outlet area of the fan 30 is, the smaller the rotating speed required to achieve the air volume requirement is, the lower the overall noise is, and the higher the cost of the fan 30 with the greater outlet area is.

[0095] Therefore, by using the fan 30 with the outlet area within the above range, the above technical solution can reduce the noise during the operation of the heat management device, while taking into account the lower cost and improving the economic benefit of the heat management device.

[0096] Further, the outlet area of the fan 30 is between 1500 cm 2 and 2500 cm 2 , which can further reduce the noise during the operation of the heat management device.

[0097] For example, the outlet area of the fan 30 can be 1500 cm 2 , 1600 cm 2 , 1700 cm 2 , 1800 cm 2 , 1900 cm 2 , 2000 cm 2 , 2100 cm 2 , 2200 cm 2 , 2300 cm 2 , 2400 cm 2 , 2500 cm 2 , etc.

[0098] In some embodiments, the heat management device further comprises a heat dissipation assembly 40 for dissipating heat of the heat exchange medium, and the heat dissipation assembly 40 is arranged between the fan 30 and the condenser 21.

[0099] The heat dissipation assembly 40 is used to dissipate heat of the heat exchange medium after the heat management of the battery. For example, the low-temperature heat exchange medium enters the battery to cool the battery, the heat of the battery is carried out by the heat exchange medium, the temperature of the heat exchange medium flowing out of the battery is increased to form high-temperature heat exchange medium, and the high-temperature heat exchange medium enters the heat dissipation assembly 40 to dissipate heat, the temperature of the heat exchange medium is reduced to form low-temperature heat exchange medium, and the low-temperature heat exchange medium flows out of the heat exchange assembly 20 and enters the battery again to cool the battery, and so on. The heat dissipation assembly 40 is provided with a containing space for containing the heat exchange medium, the high-temperature heat exchange medium enters the containing space of the heat dissipation assembly 40, and the heat of the high-temperature heat exchange medium in the heat dissipation assembly 40 is released to the external environment by forced convection of the fan 30 to reduce the temperature of the heat exchange medium.

[0100] Optionally, the heat dissipation assembly 40 can be, but is not limited to, a box structure, a tank structure, or a tube sheet structure. As an example, the heat dissipation assembly 40 adopts a tube sheet structure, which enhances heat transfer by adding fins on the tube body. The tube body can be made of a steel tube, a stainless steel tube, a copper tube, etc., and the fins can be made of a steel strip, a copper strip, an aluminum strip, a stainless steel strip, etc.

[0101] In some examples, the heat dissipation assembly 40 and the heat exchange assembly 20 cooperate with each other, and the heat dissipation assembly 40 or the heat exchange assembly 20 is used to cool the heat exchange medium according to different environmental requirements.

[0102] As an example, when the environmental temperature is lower than a first threshold value, the cooling requirement of the heat exchange medium is also relatively low, and the heat dissipation assembly 40 is used to cool the heat exchange medium. When the environmental temperature is higher than the first threshold value, the cooling requirement of the heat exchange medium is also relatively high, and the heat exchange assembly 20 is used to cool the heat exchange medium. The first threshold value can be, but is not limited to, 15℃, 20℃, or 25℃, etc., and can be selected according to the actual application environment.

[0103] It can be understood that the heat exchange assembly 20 cools the heat exchange medium by using a cooling working medium to exchange heat with the heat exchange medium, which has a high cooling efficiency. However, the circulation process of the cooling working medium is relatively complex, and the power consumption is also relatively high. The heat dissipation assembly 40 cools the heat exchange medium by forced convection of the fan 30, which has a low cooling efficiency. However, the structure and heat exchange process are relatively simple, and the power consumption is also relatively low.

[0104] Therefore, the heat dissipation assembly 40 or the heat exchange assembly 20 is used to cool the heat exchange medium according to different environmental requirements, which is beneficial to reduce the power consumption of the overall heat management device.

[0105] In other examples, the heat dissipation assembly 40 works together with the heat exchange assembly 20 as an auxiliary way to cool the heat exchange medium, thereby improving the heat management efficiency of the heat management device.

[0106] The above technical solutions introduce the heat dissipation assembly 40, which can flexibly use the heat dissipation assembly 40 and / or the heat exchange assembly 20 to cool the heat exchange medium according to different environmental requirements, thereby effectively improving the use flexibility of the heat management device.

[0107] In some embodiments, the heat management device further includes a distribution component 50, and the heat exchange assembly 20 and the heat dissipation assembly 40 are connected in parallel to the distribution component 50. The distribution component 50 is used to receive the heat exchange medium after the heat management of the heat management component 100, and output the heat exchange medium to the heat exchange assembly 20 and / or the heat dissipation assembly 40.

[0108] Exemplarily, the distribution component 50 has a distribution function, and the distribution component 50 comprises a distribution end and a collection end. The collection end is configured to receive the heat exchange medium after the heat management of the heat management component 100, and the distribution end is configured to distribute and output the heat exchange medium received by the collection end to the heat exchange assembly 20 and / or the heat dissipation assembly 40.

[0109] For example, in the case that the heat dissipation assembly 40 and the heat exchange assembly 20 cooperate with each other, and the heat dissipation assembly 40 or the heat exchange assembly 20 is used to cool the heat exchange medium according to different environmental requirements, when the environmental temperature is lower than the first threshold value, the distribution component 50 is used to output the heat exchange medium after the heat management of the heat management component 100 to the heat dissipation assembly 40; and when the environmental temperature is higher than the first threshold value, the distribution component 50 is used to output the heat exchange medium after the heat management of the heat management component 100 to the heat exchange assembly 20.

[0110] The above technical solution can accurately control the flow size of the heat exchange medium distributed and output to the heat exchange assembly 20 or the heat dissipation assembly 40 by arranging the distribution component 50, thereby effectively improving the use accuracy of the heat management device.

[0111] In some embodiments, the heat management device further comprises a control component connected to the distribution component 50. The control component can acquire the environmental temperature and control the distribution function of the distribution component 50 according to the environmental temperature, thereby improving the automation degree of the heat management device and improving the use convenience.

[0112] In some embodiments, the first wall 11, the two second walls 12 and the third wall 13 jointly form the first containing space 14. The heat management device further comprises an electrical assembly 60, and the electrical assembly 60 and the heat exchange assembly 20 are located in the first containing space 14. The electrical assembly 60 is arranged in the surrounding space.

[0113] The electrical assembly 60 is used to control and adjust the operation of the entire heat management device, and the electrical assembly 60 comprises but is not limited to a controller, a communicator and related sensors and the like. Since the electrical assembly 60 itself has a certain structural size, the first containing space 14 needs to be arranged to be relatively large, so as to realize that the electrical assembly 60 and the heat exchange assembly 20 are arranged in the first containing space 14. Moreover, the electrical assembly 60 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall, so that the electrical assembly 60 will not block the expansion of the condenser 21 along the side wall.

[0114] In this way, with the increase of the first containing space 14, the structural size of the condenser 21 can be further expanded, so that the cooling efficiency of the condenser 21 can be further improved without changing the volume of the heat management device, thereby further improving the heat management efficiency of the heat management device.

[0115] In addition, the electrical component 60 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall, and only a maintenance opening needs to be formed on the side wall of the cabinet 10 away from the condenser 21, so that the heat exchanger 22, the condenser 21, and the electrical component 60 and other structures inside the cabinet 10 can be maintained without the need to form maintenance openings on multiple side walls of the cabinet 10, thereby effectively improving the maintenance convenience of the heat management device.

[0116] In some embodiments, the cabinet 10 further includes a second accommodation space 15 arranged along a third direction Z with the first accommodation space 14, and the first direction X, the second direction Y, and the third direction Z are all perpendicular to each other. The heat management device further includes a pipeline assembly 70 arranged in the second accommodation space 15, and the pipeline assembly 70 is used to connect the heat exchange assembly 20 and the heat management object 100.

[0117] Exemplarily, the main function of the management assembly is to realize the pipeline communication between the heat exchange assembly 20 and the heat management object 100, so that the heat exchange medium can flow smoothly between the heat management object 100 and the heat exchange assembly 20. It should be noted that the pipeline assembly 70 includes but is not limited to pipe fittings, pump bodies, valve structures, connecting pieces, and the like, and the structure is relatively complex.

[0118] In this way, the second accommodation space 15 is arranged on the cabinet 10 to accommodate the relatively complex pipeline assembly 70, which is beneficial to simplify the overall structural complexity and setting difficulty of the heat management device, thereby improving the maintenance convenience of the heat management device.

[0119] In some optional embodiments, the heat management device further includes a heat dissipation assembly 40, and the pipeline assembly 70 is further used to connect the heat dissipation assembly 40 and the heat management object 100.

[0120] In some optional embodiments, the heat management device further includes a distribution component 50 arranged on the pipeline assembly 70 and located in the second accommodation space 15.

[0121] In some embodiments, the heat exchange assembly 20 further includes a compressor 23 connected between the heat exchanger 22 and the condenser 21 and located upstream of the condenser 21, and the compressor 23 is arranged in the surrounding space.

[0122] The compressor 23 is used to compress the low-pressure gas into high-pressure gas. Exemplarily, the cooling working medium is low-temperature liquid working medium before heat exchange with the heat exchange medium. After the heat exchange between the heat exchange medium and the cooling working medium in the heat exchanger 22 of the heat exchange assembly 20, the low-temperature liquid working medium absorbs heat and evaporates to form high-temperature low-pressure gaseous working medium. The high-temperature low-pressure gaseous working medium enters the compressor 23 to be compressed to form high-temperature high-pressure gaseous working medium. The high-temperature high-pressure gaseous working medium enters the condenser 21 to be condensed and cooled. The heat in the high-temperature high-pressure gaseous working medium is released to the outside of the condenser 21 to form low-temperature liquid working medium. The low-temperature liquid working medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and the cycle is repeated.

[0123] The above technical solution introduces the compressor 23, which can effectively improve the cooling efficiency of the condenser 21, thereby further improving the heat management efficiency of the heat management device. In addition, the compressor 23 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall. Only a maintenance opening needs to be formed on the side wall of the cabinet 10 away from the condenser 21, so that the heat exchanger 22, the condenser 21, the compressor 23 and other structures located inside the cabinet 10 can be maintained without the need to form maintenance openings on multiple side walls of the cabinet 10, thereby effectively improving the maintenance convenience of the heat management device.

[0124] In some embodiments, the heat exchange assembly 20 further comprises a liquid storage component 24 connected between the condenser 21 and the heat exchanger 22 and located downstream of the condenser 21. The liquid storage component 24 is arranged in the surrounding space.

[0125] The liquid storage component 24 is used to store the low-temperature liquid working medium condensed by the condenser 21. Exemplarily, the cooling working medium is low-temperature liquid working medium before heat exchange with the heat exchange medium. After the heat exchange between the heat exchange medium and the cooling working medium in the heat exchanger 22 of the heat exchange assembly 20, the low-temperature liquid working medium absorbs heat and evaporates to form high-temperature low-pressure gaseous working medium. The high-temperature low-pressure gaseous working medium enters the compressor 23 to be compressed to form high-temperature high-pressure gaseous working medium. The high-temperature high-pressure gaseous working medium enters the condenser 21 to be condensed and cooled. The heat in the high-temperature high-pressure gaseous working medium is released to the outside of the condenser 21 to form low-temperature liquid working medium. The low-temperature liquid working medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, and the cycle is repeated.

[0126] The technical scheme above introduces the liquid storage component 24, which can store the cooling working medium, thereby facilitating to increase the storage amount of the cooling working medium in the whole heat exchange assembly 20, and further facilitating to further improve the cooling efficiency of the condenser 21. In addition, the liquid storage component 24 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall, and only a maintenance opening needs to be formed on the side wall of the cabinet 10 away from the condenser 21, so that the heat exchanger 22, the condenser 21 and the liquid storage component 24 and other structures inside the cabinet 10 can be maintained, without the need of forming maintenance openings on multiple side walls of the cabinet 10, thereby effectively improving the maintenance convenience of the thermal management device.

[0127] In some optional embodiments, the heat exchange assembly 20 further comprises an expansion valve 25 connected between the condenser 21 and the heat exchanger 22 and located downstream of the condenser 21, the expansion valve 25 is used to convert the high-pressure liquid working medium into low-pressure liquid working medium, and the expansion valve 25 is arranged in the surrounding space.

[0128] Exemplarily, the cooling working medium is low-temperature liquid working medium before heat exchange with the heat exchange medium, after heat exchange between the heat exchange medium and the cooling working medium in the heat exchanger 22 of the heat exchange assembly 20, the low-temperature liquid working medium absorbs heat and evaporates to form high-temperature low-pressure gaseous working medium, the high-temperature low-pressure gaseous working medium enters the compressor 23 for compression to form high-temperature high-pressure gaseous working medium, the high-temperature high-pressure gaseous working medium enters the condenser 21 for condensation and cooling, the heat in the high-temperature high-pressure gaseous working medium is released to the outside of the condenser 21 to form low-temperature high-pressure liquid working medium, the low-temperature high-pressure liquid working medium enters the expansion valve 25 for expansion to form low-temperature low-pressure liquid working medium, and the low-temperature low-pressure liquid working medium enters the heat exchanger 22 again to exchange heat with the heat exchange medium, to form a cycle.

[0129] In some embodiments, the thermal management device further comprises a heating assembly 80 for heating the heat exchange medium.

[0130] Exemplarily, when the temperature of the battery is too low, the battery needs to be heated to work normally. In this case, the heating assembly 80 is used to heat the heat exchange medium, and the heated heat exchange medium enters the battery to heat the battery, so that the battery is in a temperature range in which it can work normally.

[0131] Optionally, the number of the heating assembly 80 can be one or more, which can be selected according to the actual application environment.

[0132] The technical scheme above introduces the heating assembly 80, which can be used to heat or cool the heat exchange medium according to different environmental requirements, thereby effectively improving the applicability of the thermal management device.

[0133] In some optional embodiments, the heat management device further comprises a pipeline assembly 70, and the heating assembly 80 and the pipeline assembly 70 are arranged in the second accommodating space 15.

[0134] The embodiments of the present application further provide a heat management device, which comprises a battery and the heat management device provided by any one of the preceding embodiments, the battery comprises a heat exchange channel, the heat management device is communicated with the heat exchange channel, the heat management device is capable of outputting the heat exchange medium into the heat exchange channel and receiving the heat exchange medium flowing out of the heat exchange channel.

[0135] In order to better understand the heat management device provided by the embodiments of the present application, based on the same inventive concept, the embodiments of the heat management device in actual application are provided for description.

[0136] The embodiments of the present application provide a heat management device, which comprises a cabinet 10, a heat exchange assembly 20, a plurality of fans 30, a heat dissipation assembly 40, an electrical assembly 60, a pipeline assembly 70 and a heating assembly 80.

[0137] The heat exchange assembly 20 is accommodated in the cabinet 10 and is used for heat exchange with a heat exchange medium, the heat exchange assembly 20 comprises a condenser 21, a heat exchanger 22, a compressor 23 and a liquid storage component 24, the condenser 21 is arranged along a side wall of the cabinet 10 and forms an enclosed space on a side away from the side wall, the compressor 23 is connected between the heat exchanger 22 and the condenser 21 and is located upstream of the condenser 21, the liquid storage component 24 is connected between the condenser 21 and the heat exchanger 22 and is located downstream of the condenser 21, and the heat exchanger 22, the compressor 23 and the liquid storage component 24 are all arranged in the enclosed space.

[0138] The side wall comprises a first wall 11, two second walls 12 and a third wall 13, the two second walls 12 are oppositely arranged along a first direction X, the first wall 11 connects the two second walls 12, the third wall 13 is oppositely arranged with the first wall 11 along a second direction Y, the third wall 13 connects the two second walls 12, the third wall 13 is movably arranged relative to the second wall 12, the plurality of fans 30 are arranged on the third wall 13 and are spaced apart along a third direction Z, and the first direction X, the second direction Y and the third direction Z are intersected two by two.

[0139] The condenser 21 comprises a first part 211 and at least one second part 212 connected with each other, the first part 211 is located between the heat exchanger 22 and the first wall 11, and the second part 212 is located between the heat exchanger 22 and at least one of the two second walls 12.

[0140] The cabinet 10 comprises a first accommodating space 14 and a second accommodating space 15, the first wall 11, the two second walls 12 and the third wall 13 jointly enclose the first accommodating space 14, and the second accommodating space 15 is arranged along the third direction Z relative to the first accommodating space 14.

[0141] The heat dissipation assembly 40 is configured to dissipate heat from the heat exchange medium, and is arranged between the fan 30 and the condenser 21. The electrical assembly 60 and the heat exchange assembly 20 are both arranged in the first accommodating space 14, and the electrical assembly 60 is arranged in the surrounding space. The pipeline assembly 70 is arranged in the second accommodating space 15, and is configured to connect the heat exchange assembly 20 and the heat management object 100. The heating assembly 80 is configured to heat the heat exchange medium.

[0142] The condenser 21 in the embodiment of the present application is arranged along the side wall of the cabinet 10, and when the heat management efficiency requirement of the heat management device increases, the condenser 21 can be expanded along the side wall of the cabinet 10 to increase the structural size, and the heat exchanger 22 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall, so that the heat exchanger 22, the compressor 23 and the liquid storage component 24 do not block the expansion of the condenser 21 along the side wall. Thus, the cooling efficiency of the condenser 21 can be improved without changing the volume of the heat management device, and the heat management efficiency of the heat management device can be improved while the volume of the heat management device is miniaturized.

[0143] In addition, the heat exchanger 22 is arranged in the surrounding space formed on the side of the condenser 21 away from the side wall, and when the heat exchanger 22, the compressor 23, the liquid storage component 24 and the condenser 21 need to be maintained, only a maintenance opening needs to be formed on the side wall of the cabinet 10 away from the condenser 21, so that the heat exchanger 22, the compressor 23, the liquid storage component 24 and the condenser 21 can be maintained without the need to form maintenance openings on multiple side walls of the cabinet 10, thereby effectively improving the maintenance convenience of the heat management device.

[0144] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0145] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the description of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A thermal management device, comprising: Cabinet; A heat exchange assembly is housed in the cabinet and is used to exchange heat with a heat exchange medium. The heat exchange assembly includes a connected condenser and a heat exchanger. The condenser is arranged along the side wall of the cabinet and forms an enclosed space on the side facing away from the side wall. The heat exchangers are all arranged in the enclosed space.

2. The thermal management device according to claim 1, wherein: The side wall includes a first wall and two second walls, the two second walls are arranged opposite to each other along a first direction, and the first wall connects the two second walls; The condenser includes a first portion and at least one second portion connected thereto, the first portion being located between the heat exchanger and the first wall, and the second portion being located between the heat exchanger and at least one of the two second walls.

3. The thermal management device according to claim 2, wherein: The side wall further includes a third wall, the third wall is arranged opposite to the first wall along the second direction, the third wall connects two second walls, and the first direction intersects the second direction; The thermal management device further includes a fan, and the fan is disposed on the third wall.

4. The thermal management device according to claim 3, wherein: The third wall is movably arranged relative to the second wall.

5. The thermal management device according to claim 3, wherein: There are multiple fans, and the multiple fans are arranged at intervals along the third direction. The first direction, the second direction and the third direction intersect with each other.

6. The thermal management device according to claim 3, wherein: The thermal management device further includes a heat dissipation component, which is used to dissipate heat from the heat exchange medium. The heat dissipation component is disposed between the fan and the condenser.

7. The thermal management device according to claim 6, wherein: The thermal management device further includes a distribution component, to which the heat exchange component and the heat dissipation component are connected in parallel. The distribution component is used to receive the heat exchange medium after heat management of the heat management component and output the heat exchange medium to the heat exchange component and / or the heat dissipation component.

8. The thermal management device according to claim 3, wherein: The first wall, the two second walls and the third wall together enclose a first accommodating space; The thermal management device further includes an electrical component. The electrical component and the heat exchange component are both located in the first accommodating space, and the electrical component is disposed in the enclosed space.

9. The thermal management device according to claim 8, wherein: The cabinet further includes a second accommodating space, wherein the second accommodating space and the first accommodating space are arranged along a third direction, and the first direction, the second direction and the third direction intersect with each other; The thermal management device further includes a pipeline assembly, which is disposed in the second accommodating space and is used to connect the heat exchange assembly and the component to be heat-managed.

10. The thermal management device according to any one of claims 1 to 9, wherein: The heat exchange assembly further includes a compressor connected between the heat exchanger and the condenser and located upstream of the condenser. The compressor is disposed in the enclosed space.

11. The thermal management device according to any one of claims 1 to 10, wherein: The heat exchange assembly further includes a liquid storage component connected between the condenser and the heat exchanger and located downstream of the condenser. The liquid storage component is disposed in the enclosed space.

12. The thermal management device according to any one of claims 1 to 11, wherein: The thermal management device further includes a heating component, which is used to heat the heat exchange medium.

13. An energy storage device comprising: The thermal management device according to any one of claims 1 to 12; The battery comprises a heat exchange channel, and the thermal management device is connected to the heat exchange channel.

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